Support for circuit board with temperature-variable electrical component

Abstract

The present invention is entitled a support for a circuit board having a temperature-variable electrical component. The present disclosure provides a temperature-variable support including a temperature-variable electrical component. The support also includes a support body that supports the temperature-variable electrical component and is configured to support the circuit board separated by a distance from another component of the electronic assembly. The support body is configured to be attached to the circuit board and protrude away from the circuit board, with a first end proximate the circuit board and a second end spaced apart from the circuit board. The support also includes an electrical connector supported proximate the first end. The electrical connector is configured to be electrically connected within the circuit board to provide an electrical input to the temperature-variable electrical component to selectively change its temperature.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of Indian Provisional Patent Application No. 202011009058, filed on March 3, 2020, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The present disclosure generally relates to rack support structures for supporting one or more components in an electronic assembly, such as a printed circuit board (PCB), and more particularly to rack support structures having temperature variable electrical elements for heating and / or cooling regions of the electronic assembly. Background Art

[0004] Many electronic assemblies include at least one printed circuit board (PCB) having electrical devices (e.g., integrated circuits, capacitors, resistors, inductors, discrete semiconductors) mounted thereon. The assembly may also include a base or housing that supports and encloses the PCB. Furthermore, the assembly may include one or more brackets that support the PCB within the base, maintain a desired spacing between the PCB and the base, and so on. These electronic assemblies may be located in control systems, such as telecommunications control systems, vehicle control systems (e.g., engines of aircraft, spacecraft, or ground-based vehicles), and the like.

[0005] The electrical devices within these electronic assemblies can be temperature sensitive. Therefore, the operation of one or more devices within the assembly can be affected by the ambient temperature. There may be situations where it is desirable for a device to operate in extreme temperatures (extremely hot or cold). Devices can also be exposed to extreme temperature variations that can adversely affect operation.

[0006] Electrical devices rated for extreme temperature conditions can be incorporated into assemblies; however, the incorporation of these devices is generally more expensive. Additionally, temperature-controlled systems have been proposed to provide desired temperature conditions for temperature-sensitive electrical devices. However, these systems can be inefficient to manufacture, occupy significant space within the assembly, add undesirable weight, and / or are expensive.

[0007] Therefore, it is desirable to provide an effective, efficient, compact, and lightweight temperature control device that can be incorporated into an electronic assembly. It is also desirable to provide a temperature control device that improves manufacturing efficiency and reduces costs. Other desirable features and characteristics of the present disclosure will become apparent from the following detailed description and the appended claims, taken in conjunction with the accompanying drawings and this background. Summary of the Invention

[0008] In one embodiment, a temperature-variable support for supporting a circuit board in an electronic assembly is disclosed. The circuit board supports an electrical device. The support includes a temperature-variable electrical element that selectively changes temperature based on an electrical input applied thereto. The support also includes a support body that supports the temperature-variable electrical element and is configured to support the circuit board a distance away from another component of the electronic assembly. The support body has a first end and a second end. The support body is configured to be attached to the circuit board and protrude away from the circuit board, wherein the first end is proximate to the circuit board and the second end is spaced apart from the circuit board. The support also includes an electrical connector that is supported proximate to the first end and electrically coupled to the temperature-variable electrical element. The electrical connector is configured to electrically connect within the circuit board to provide an electrical input to the temperature-variable electrical element for selectively changing its temperature and selectively adjusting temperature conditions near the electrical device.

[0009] In another embodiment, an electronic assembly is disclosed. The electronic assembly includes a printed circuit board that supports electrical traces of an electrical device and a power circuit. The electronic assembly also includes a bracket having a support body, a temperature-variable electrical element, and an electrical connector. The temperature-variable electrical element selectively changes temperature based on an electrical input applied to it via the power circuit. The support body supports the temperature-variable electrical element. The support body holds the printed circuit board a distance away from another component of the electronic assembly. The support body has a first end and a second end. The support body is attached to the circuit board and protrudes away from the circuit board, wherein the first end is proximate to the circuit board and the second end is spaced apart from the circuit board. In addition, an electrical connector is supported proximate to the first end and electrically coupled to the temperature-variable electrical element. In addition, the electrical connector is electrically connected to the electrical traces of the printed circuit board to provide electrical input to the temperature-variable electrical element for selectively changing its temperature and selectively adjusting temperature conditions in an area of ​​the electronic device area near the electrical device.

[0010] In another embodiment, a method for operating an electronic assembly is disclosed. The electronic assembly includes a printed circuit board and a bracket that holds the printed circuit board a distance from another component of the electronic assembly. The method includes detecting, with a sensor, a temperature near an electrical device carried on a printed circuit board of the electronic assembly. The printed circuit board supports electrical traces of a power supply circuit. The method also includes receiving, by a processor of a control system, an input corresponding to the detected temperature. Furthermore, the method includes generating, by the processor, a command based on the received input, to provide an electrical input to a temperature-variable electrical element of the bracket via the electrical traces, for selectively changing the temperature of the bracket and selectively adjusting temperature conditions in an area near the electrical device. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The present disclosure will now be described with reference to the following drawings, wherein like numerals represent like elements, and wherein:

[0012] Figure 1 is a schematic diagram of an electronic assembly according to an exemplary embodiment of the present disclosure;

[0013] Figure 2 is a perspective view of a temperature-variable bracket according to an exemplary embodiment of the present disclosure;

[0014] Figure 3 yes Figure 2 An exploded perspective view of a bracket;

[0015] Figure 4 yes Figure 2 Top view of the bracket;

[0016] Figure 5 Is installed in Figure 1 Electronic components within Figure 2 A side cross-sectional view of the bracket;

[0017] Figure 6 is a flow chart illustrating a method of operating a stent according to an exemplary embodiment;

[0018] Figure 7 is a data flow diagram illustrating a method of operating a stent according to an exemplary embodiment;

[0019] Figure 8 is a perspective view of a temperature variable bracket according to an additional embodiment of the present disclosure; and

[0020] Figure 9 yes Figure 6 An exploded perspective view of the bracket and other components of the electronic assembly. DETAILED DESCRIPTION

[0021] The following detailed description is merely exemplary in nature and is not intended to limit the disclosure or the application and uses of the disclosure. Furthermore, there is no intention to be bound by any theory presented in the preceding background or the following detailed description.

[0022] The present disclosure relates to a temperature-variable support (i.e., a support structure, a support assembly, etc.) for supporting a circuit board within an electronic assembly. The support can support the circuit board and an electrical device mounted thereon at a distance from another component in the electronic assembly (e.g., at a distance from another circuit board, from a housing, a casing, or other base member, etc.).

[0023] The bracket can include and / or incorporate various features of a temperature control system. More specifically, the bracket can include one or more temperature-variable elements (e.g., heating elements, thermoelectric devices, etc.) that can be controlled to selectively change the temperature of an area near an electronic component. For example, the temperature-variable element can be a heating element that is selectively heated to heat a circuit board, an electrical device mounted thereon, and / or ambient air near the electrical device.

[0024] The temperature variable bracket can be compactly and conveniently arranged within an electronic assembly. The temperature variable component of the bracket can be electrically connected and incorporated into a power circuit of one or more circuit boards within the assembly. In other words, one or more electrical connectors of the bracket can be electrically connected to leads, through-holes, traces, etc. supported by the circuit board to incorporate the bracket into the power circuit. Therefore, due to the bracket of the present disclosure, the assembly can be more compact and manufacturing efficiency can be improved. In addition, the bracket can be conveniently and effectively positioned near the temperature-sensitive electrical devices of the electronic assembly to maintain its functionality in various environments. The bracket of the present disclosure also facilitates the repair and / or modification of some electronic assemblies, as will be discussed.

[0025] See first Figure 1 , schematically illustrating an electronics assembly 105. The electronics assembly 105 may be configured to control any suitable system, such as a vehicle system, a telecommunications system, a radar system, or other systems. In the case of a vehicle system, the electronics assembly 105 may be included in an aircraft system (e.g., an avionics system, a vehicle telecommunications system, a radar system, etc.). The electronics assembly 105 may include various features suitable for use in extreme temperature conditions.

[0026] A Cartesian coordinate system is shown for reference purposes and includes a first axis 101 and an orthogonal second axis 109. Figure 1 , the first axis 101 is oriented horizontally and the second axis 109 is oriented vertically; however, it should be understood that this orientation is for reference only and does not necessarily correlate to the direction of gravity.

[0027] In some embodiments, the electronic assembly 105 can include one or more printed circuit boards 104 and a chassis 107. As shown in the illustrated embodiment, there can be a plurality of printed circuit boards 104, including a first circuit board 200 (shown in detail) enclosed within the chassis 107, and a second circuit board 132, a third circuit board 133, and a fourth circuit board 134. The plurality of circuit boards 104 can be positioned along the first axis 101 and can be stacked and arranged along the second axis 109, with the first circuit board 200 disposed between the second circuit board 132 and the third circuit board 133.

[0028] The base 107 can be hollow and box-shaped. The base 107 can mechanically support the circuit board 104. In addition, in some embodiments, the base 107 can include insulating materials that limit heat transfer (into or out of) the components 105 to help maintain a controlled temperature environment therein.

[0029] It should be understood that the assembly 105 can be configured to support any number of circuit boards 104. Additionally, it should be understood that the circuit boards 104 can be arranged in other ways within the electronic assembly 105 without departing from the scope of the present disclosure.

[0030] The first circuit board 200 (and / or the other circuit boards 104) may include a substantially flat and plate-shaped substrate 131. The substrate 131 may be made of an electrically insulating material. The circuit board 200 may also include one or more electrical devices 182, such as integrated circuits, resistors, capacitors, etc., carried on the substrate 131. In addition, the circuit board 200 may include electrical traces, traces, pads, terminals, through-holes, or other wiring 138. The wiring 138 may include one or more elongated traces made of conductive material etched into the substrate 131. Sections of the wiring 138 may electrically connect corresponding electrical devices in the electrical devices 182 within a particular circuit of the electronic component 105. In addition, as Figure 5 As shown, segments of wiring 138 may extend through electronic components 105 (eg, between circuit boards 104 ) for establishing electrical connections to power sources, input devices, output devices, hardware, external memory devices such as a subscriber identity module (SIM) card, and the like.

[0031] Additionally, the electronic assembly 105 may include one or more brackets 102. As shown, there may be multiple brackets 102 arranged around the electronic assembly 105. As shown, the brackets 102 may mechanically support the circuit boards 104 and structurally maintain the circuit boards 104 at a distance from each other, from the base 107, and / or from other components of the electronic assembly 105. By way of example, a first printed circuit board 200 may be supported by multiple brackets, including multiple (e.g., four) first brackets 142 arranged at respective corners of the circuit board 200. The first brackets 142 may be cylindrical and elongated and may support the first circuit board 200 at a distance 140 from the second circuit board 132 along the second axis 109. In some embodiments, the other circuit boards 132, 133, and 134 may also be supported by corresponding first brackets 142. It should be understood that the electronic assembly 105 may include any number of first brackets 142 without departing from the scope of this disclosure, and the brackets may be arranged in a variety of ways.

[0032] The bracket 102 may also include one or more (e.g., five) temperature-variable brackets 202. Similar to the first bracket 142, the temperature-variable bracket 202 may mechanically support the circuit board 104 and structurally maintain the circuit board 104 at a certain distance from each other, from the base 107, and / or from other components of the electronic assembly 105. In addition, the bracket 202 may include electronic components that selectively adjust the temperature of the bracket 202. These electronic components may be electrically connected to a power source via the wiring 138. In some embodiments, the bracket 202 may be electrically connected to a segment (e.g., an electrical trace) of the wiring 138 carried on the circuit board 200. Thus, the bracket 202 may support the circuit board 200 and conveniently connect the wiring 138 included thereon.

[0033] By way of example, a first printed circuit board 200 may be supported by five temperature-variable supports 202. The temperature-variable supports 202 may be arranged in a rectangular formation near the edge of the circuit board 200 in a predetermined region 201. One or more temperature-sensitive electrical devices 203 may be mounted within the region 201 and carried on the circuit board 200. In some embodiments, the temperature-sensitive electrical devices 203 are SIM cards and / or associated SIM card devices. The temperature-variable supports 202 may selectively heat and / or cool the region 201 to provide the necessary temperature conditions for the operation of the devices 203.

[0034] In some embodiments, the circuit board 200 may also include a heat transfer barrier member 204. The heat transfer barrier member 204 may be made of an insulating material (e.g., a glass fiber reinforced epoxy laminate, such as FR4) and may be etched or otherwise laminated on the substrate 131 of the circuit board 200. The barrier member 204 may also be disposed in a groove in the substrate 131. In some embodiments, the heat transfer barrier member 204 may be arranged as an elongated, strip-like thermal barrier layer 205 that extends continuously from one edge and returns to subdivide the region 201 and separate it from an adjacent region 209 of the circuit board 200. Additionally, the thermal barrier layer 205 may extend across the substrate 131 and may at least partially surround one or more temperature variable supports 202. As Figure 1 As shown, the thermal barrier layer 205 can cooperate with the edge of the circuit board 200 to surround the temperature variable bracket 202 and the temperature sensitive electrical device 203 in the region 201 of the circuit board 200. Therefore, the temperature variable bracket 202 can selectively adjust the temperature conditions in the region 201 (heating or cooling the region 201), and the thermal barrier layer 205 can insulate the region 201 to maintain the region at the adjusted temperature condition.

[0035] Now see Figures 2 to 5, exemplary embodiments of the temperature variable bracket 202 will be discussed in greater detail. Generally, the bracket 202 can be elongated, extending along a longitudinal axis 251 between a first end 252 and a second end 254. In some embodiments, the axis 251 can be oriented parallel to the second axis 109 ( Figure 1 ). The stent 202 can be cylindrical, centered about the axis 251, with a width that remains constant between the first end 252 and the second end 254. In some embodiments, the stent 202 can have a rounded (eg, circular) cross-section taken perpendicular to the axis 251.

[0036] The bracket 202 may generally include a support body 212. The support body 212 may include one or more rigid and strong structures that resist vibration, gravity, inertia, and / or other forces to hold the circuit board 200 and keep the circuit board 200 separated from the second circuit board 132 ( Figure 1 ). Thus, the support body 212 can be elongated along the longitudinal axis 251 and can define a cylindrical profile of the stent 202 between the first end 252 and the second end 254. The support body 212 can also define the outer surface 207 of the stent 202 and can be at least partially hollow so as to define the inner surface 211 of the stent 202.

[0037] In some embodiments, the support body 212 may include an inner support 214. Figure 3 As shown, the inner support 214 can be hollow and cylindrical with a rounded (e.g., circular) cross-section. The inner support 214 can be made of a rigid material. The inner support 214 can also define a majority of the inner surface 211 of the bracket 202.

[0038] The support body 212 may also include a cover 216 that defines a majority of the outer surface 207 of the support 202. The cover 216 may include a radial support cover 218, a first end cap 220, and a second end cap 222, each of which may be made of a rigid material. The radial support cover 218 may be cylindrical and hollow, with a rounded (e.g., circular) cross-section. The first end cap 220 and the second end cap 222 may be annular and disc-shaped. The first end cap 220 may be fixedly attached to the radial support cover 218 and may cover the open end of the radial support cover 218 at a first end 252 of the support 202. The second end cap 222 may be fixedly attached to the radial support cover 218 and may cover the other open end of the radial support cover 218 at a second end 254. The end caps 220 and 222 may be fixedly attached to the radial support cover 218 via welded attachments, adhesives, fasteners, or other attachments. Furthermore, the inner support 214 can be received within the cover 216. More specifically, the inner support 214 can extend between, abut, and / or be attached to the first and second end caps 220 and 222. The inner support 214 and the cover 216 can both be coaxial about an axis 251 so as to define a radial space 215 ( Figure 5 ).

[0039] The support body 212 can be made of one or more materials that provide desired heat transfer properties. One or more regions can be thermally conductive (e.g., made of a metallic material) to facilitate heat transfer. One or more other regions can be thermally resistive (e.g., made of a ceramic material) to inhibit such heat transfer.

[0040] The support 202 may also include at least one temperature-variable electrical element 210. The temperature-variable electrical element 210 may be configured to selectively change temperature (heat or cool) based on an electrical input applied thereto. As shown and as will be discussed in detail as an example, the temperature-variable electrical element 210 may be an electric heating element that selectively heats the support 202. However, it should be understood that the element 210 may be of any suitable type. Specifically, it should be understood that the element 210 may be an electric cooling element (e.g., a thermoelectric device that relies on the thermoelectric effect to cool the support 202) without departing from the scope of the present disclosure.

[0041] In some embodiments, element 210 may include filament 213. In embodiments where element 210 is a resistive heating element, filament 213 may be made of a resistive material. Fiber 213 may extend between a first end 252 and a second end 254 of stent 202. In other words, filament 213 may extend from first end 252 to second end 254 at least once. In addition, as shown in the figure, filament 213 may extend from first end 252 to second end 254 and back at least once. As shown in the figure, filament 213 may include a helical portion 217 that extends helically around axis 251. Fiber 213 may also include a first longitudinal segment 219 and a second longitudinal segment 221 that extend along axis 251. In some embodiments, first longitudinal segment 219 and / or second longitudinal segment 221 may be substantially straight and linear, and in some embodiments, parallel to axis 251. First longitudinal segment 219 may extend longitudinally from one end (top) of helical portion 217 and may terminate at first terminal 223 of element 213. The filament 213 may include a radial segment 228 that extends radially from one side of the axis 251 to the other side from the other end (the bottom end) of the helical portion 217. In some embodiments, the radial segment 228 may intersect the axis 251. The second longitudinal segment 221 may extend longitudinally from the radial segment 228 and may terminate at the second terminal 225. In some embodiments, the longitudinal segments 219 and 221 may extend from the helical portion 217 in the same direction (i.e., from the second end 254 toward the first end 252). Thus, as shown in the illustrated embodiment, the filament 213 may extend from the first terminal 223 along the first longitudinal segment 219, along the helical portion 217, turn in a radial direction and extend along the radial segment 228, and return longitudinally toward the first end 252, extend along the second longitudinal segment 221, and terminate at the second terminal 225.

[0042] As previously mentioned, the temperature variable electrical element 210 can be configured differently without departing from the scope of the present disclosure. For example, the electrical element 210 can be a thermoelectric device that cools the support 202. In these embodiments, the element 210 can be thermally connected to a heat sink for cooling purposes.

[0043] The filaments 213 can be received and supported by the support body 212. For example, Figure 5As shown, filament 213 may be disposed within space 215 between inner support 214 and cover 216. In some embodiments, helical portion 217 may be wound around inner support 214 and may receive the inner support. Radial segment 228 may extend along the bottom end of inner support 214. Additionally, radial stent cover 218 may receive filament 213 and inner support 214 so as to cover the outer radial portion of filament 213. A first end cap 220 may be fixedly attached to radial stent cover 218 to cover temperature variable element 210 and one open end of inner support 214. A second end cap 222 may be fixedly attached to radial stent cover 218 to cover the other open end, radial segment 228, and inner support 214. Thus, radial stent cover 218, along with first and second top caps 220 and 222, may cooperatively define outer surface 207 of stent 202 and also cooperatively cover and protect temperature variable electrical element 210. These components support the electrical components 210 while also securely holding the circuit board 200 within the assembly 105. Additionally, the cover 218, the first header 220, and / or the second header 222 may provide desired heat transfer characteristics.

[0044] In other embodiments, the temperature-variable electrical element 210 can be embedded in one or more components of the support body 212. For example, the support body 212 can be molded around the element 210, thereby covering and defining the outer surface 207 of the support 202. The temperature-variable electrical element 210 can also be supported and attached to the support body 212 in other ways without departing from the scope of the present disclosure.

[0045] In addition, if Figure 4 and Figure 5As shown, the bracket 202 may include multiple electrical connectors 256. There may be a first connector 257 and a second connector 258. The connectors 257 and 258 may be made of a conductive material (such as a beryllium / copper alloy). The connectors 257 and 258 may have different shapes, such as a flat crescent shape. In some embodiments, the connectors 257 and 258 may be located near the first end 252 of the bracket 202. In other embodiments, one connector 257 and 258 may be located near the first end 252, and another connector 257 and 258 may be located near the second end 254. As shown, the connectors 257 and 258 may be carried on (e.g., stacked on) the first end cap 220. The connectors 257 and 258 may be low-profile, lying substantially flat and flat against the surrounding area of ​​the first end cap 220. In other embodiments, the first connector 257 and / or the second connector 258 may be located on the second end cap 222. In other embodiments, the first connector 257 and / or the second connector 258 can be disposed on the radial stent cover 218. For example, one or both can be disposed on the cover 218 near the first end 252 of the stent 202. Other variations are also within the scope of the present disclosure. The location of the connectors 257, 258 can facilitate electrical connection of the stent 202 to an external circuit (e.g., a power supply circuit).

[0046] Connectors 257 and 258 can be electrically connected to temperature-variable electrical element 210. First connector 257 can be electrically connected to first terminal 223, and second connector 258 can be electrically connected to second terminal 225. In some embodiments, terminals 223 and 225 can extend through corresponding holes formed in first end cap 220 to electrically connect to the underside surfaces of electrical connectors 257 and 258. In other embodiments, connectors 257 and 258 can extend through the thickness of first end cap 220 rather than through holes to electrically connect to terminals 223 and 225. Thus, connectors 257 and 258 can define external electrical terminals of bracket 202.

[0047] In addition, if Figure 5 As shown, the bracket 202 can be mechanically attached to the first circuit board 200 and support the first circuit board at a distance 140 from the second circuit board 132. In some embodiments, the support body 212 can include surface features for engaging the fastener 262, such as threads 260, undercut surfaces, etc. As shown, the inner support 214 can include threads 260 on its inner diameter surface. The fastener 262 can be, for example, Figure 5The bolt is shown extending through the first circuit board 200 and being received within the bracket 202 to be threadedly attached to the threads 260. Thus, the support body 212 is attached to the circuit board 200 and protrudes away from the circuit board 200, with the first end 252 proximate the circuit board 200 and the second end 254 spaced apart from the circuit board 200. The bracket 202 can be held separate from the second circuit board 132; however, the second end 254 can abut the second circuit board 132, such that the bracket 202 resists the compressive force and holds the first and second circuit boards 200, 132 separated by the distance 140.

[0048] In addition, the electrical connectors 257, 258 can be electrically connected to the wiring 138 ( Figure 5 For example, the first circuit board 200 may include a first electrical trace 271 and a second electrical trace 272. The traces 271 and 272 may be conductive lines etched into a surface opposite the electrical connectors 257 and 258. The mechanical mounting of the bracket 202 may facilitate electrically connecting the connectors 257 and 258 to the traces 271 and 272, respectively.

[0049] Traces 271, 272 may also be connected to a control system 280 in one or more circuits. Control system 280 may have various configurations, each of which falls within the scope of the present disclosure. Generally speaking, control system 280 may control the delivery of power to temperature-variable electrical element 210 of support 202. Control system 280 may have many different configurations, all of which fall within the scope of the present disclosure. The following discussion will provide examples of control system 280, including examples that are relatively simple, compact, efficient, and energy-efficient in design.

[0050] The control system 280 may include at least one processor 284 that includes and / or is electrically connected to a computer memory device 286. The processor 284 and the memory device 286 may include one or more modules for processing information and for outputting commands (e.g., control commands for controlling the temperature of the rack 202). As used herein, the term "module" refers to any hardware, software, firmware, electronic control component, processing logic, and / or processor device, alone or in any combination, including but not limited to: an application specific integrated circuit (ASIC), an electronic circuit, a processor (shared, dedicated, or grouped) and memory that executes one or more software or firmware programs, combinational logic circuits, and / or other suitable components that provide the functionality.

[0051] Regarding the control system 280, embodiments may be described herein in terms of functional and / or logical block components and various processing steps. It should be understood that such block components can be implemented by any number of hardware, software, and / or firmware components configured to perform the specified functions. For example, embodiments of the present disclosure may employ various integrated circuit components, such as memory elements, digital signal processing elements, logic elements, lookup tables, etc., which can perform multiple functions under the control of one or more microprocessors or other control devices. In addition, those skilled in the art will appreciate that embodiments of the present disclosure can be practiced in conjunction with any number of systems included in the electronic assembly 105. In practice, the control system 280 can control the temperature of the bracket 202 and other systems that control the electronic assembly 105.

[0052] For the sake of brevity, conventional techniques related to signal processing, data transmission, signaling transmission, control and other functional aspects of the system (as well as the various operating components of the system) are not described in detail herein. In addition, the connecting lines shown in the various figures included herein are intended to represent exemplary functional relationships and / or physical connections between the various elements. It should be noted that many alternative or additional functional relationships or physical connections may exist in the embodiments of the present disclosure.

[0053] In addition to the processor 284 and the memory device 286, the control system 280 may also include a switch 288 and one or more sensors 290. The switch 288 may have an on position in which power flows to the temperature-variable electrical element 210 and an off position in which power flow to the element 210 is interrupted. The one or more sensors 290 may include one or more thermometers that detect "temperature conditions" of the electrical device 203 within the area 201 near the electronic assembly 105. The term "temperature conditions" broadly refers to one or more temperatures in and / or around the area 201, the ambient temperature outside the electronic assembly 105, a temperature profile across the board 200, or other temperatures detected by the sensor 290.

[0054] Figure 6 and Figure 7A method 300 for operating the electronic assembly 105 and the bracket 202 according to an exemplary embodiment is shown. At 302 of the method 300, the sensor 290 may detect a temperature condition ("actual t") and provide a data input corresponding to the detected temperature condition to the processor 284. The processor 284 may then generate a control command that causes the switch 288 to change between its on and off positions based on the temperature data input. In some embodiments, at 304 of the method 300, the processor 284 accesses the memory device 286 and compares the detected temperature to one or more predetermined thresholds (e.g., a minimum temperature threshold "Tmin" and / or a maximum temperature threshold "Tmax") stored on the memory device 286. If the processor 284 determines that the detected temperature is below the minimum temperature threshold or that the detected temperature is above the maximum temperature threshold (a positive answer to 304), then at 306, the processor 284 may command the switch 288 to close, thereby providing an electrical input to the temperature-variable electrical element 210 and changing its temperature. The method 300 may loop back to 302, and so on. Once the detected temperature is within the predetermined range (between Tmin and Tmax), processor 284 may command switch 288 to open at 308. Method 300 may continue to 310, where it is determined whether the system is to be powered down. If the answer is no, method 300 may loop back to 302, and so on. If the system is to be powered down, method 300 may terminate.

[0055] In an embodiment where the temperature-variable electrical element 210 is a resistive heating element that provides heat, the sensor 290 can detect the actual temperature (at 302), and the processor 284 can determine (at 304) that the temperature is below the minimum temperature, Tmin. Therefore, at 306, the switch 288 can be turned on, thereby supplying power to heat the filament 213. This heat is transferred from the support body 212 to the circuit board 200, to the electrical device 182, and / or to the ambient air near the electrical device 182. The blocking member 204 can insulate and retain this heat in the region 201. Once the actual temperature t is above the minimum temperature Tmin, the switch 288 can be opened. This process can be repeated as needed until the system is powered off (310 gives a positive answer).

[0056] Thus, the rack 202 can selectively heat the region 201 and the electrical device 182 therein. The rack 202 can quickly and efficiently adjust the temperature. In some embodiments, the rack 202 can adjust the region 201 from -55°C to -20°C in eight minutes. It should be understood that the system can also be customized in other ways to achieve the desired heating and / or cooling performance while also providing a stable mechanical support within the electronic assembly 105.

[0057] Figure 8and Figure 9 An additional embodiment of a stent 1202 is shown. Stent 1202 may include one or more features of stent 202 described above. Figures 1 to 7 The corresponding parts in the Figure 8 and Figure 9 , where corresponding reference numerals are incremented by 1000. As will be discussed, the bracket 1202 can include removably attached individual parts or components. In some embodiments, multiple parts / components can be equipped with corresponding temperature-variable electrical components. Additionally, these parts / components can be attached to existing bracket structures, for example, for retrofitting existing circuit board configurations.

[0058] As shown, the bracket 1202 may include a first portion 1298 and a second portion 1299 that are removably attached. In some embodiments, the portions 1298, 1299 may be arcuate (arched) and curved about the axis 1251. The portions 1298, 1299 may be joined together along opposing edges by fasteners, adhesives, etc., and the portions 1298, 1299 may define the portions described above with respect to the embodiment of the present invention. Figure 2 The bracket 202 is in the shape of a hollow cylinder.

[0059] Both parts 1298 and 1299 may include supporting bodies 1212a and 1212b with ribbed cores 1297a and 1297b and arched outer sheaths 1296a and 1296b. In some embodiments, both parts 1298 and 1299 may include corresponding temperature-variable electrical elements 1210a and 1210b. Filaments 1213a and 1213b may extend axially from one end of the cores 1297a and 1297b to the other end and back. Filaments 1213a and 1213b may extend between the ribs of the cores 1297a and 1297b. Portions 1298 , 1299 may also include corresponding electrical connectors 1256a , 1256b that are flat and carried on the sheaths 1296a , 1296b for electrically connecting the corresponding filaments 1213a , 1213b to the traces 1271a , 1271b , 1272a , 1272b of the circuit board 1200 .

[0060] In some embodiments, portions 1298, 1299 may be attached together to wrap around an existing support structure 1295 of the circuit board. Additionally, traces 1271a, 1271b, 1272a, 1272b may be part of a jumper circuit that is retroactively added to the circuit board 1200. Thus, Figure 8 and Figure 9 The support 1202 can be used to retrofit an existing support structure 1295 of a circuit board 1200 to allow it to be temperature-variable.

[0061] Thus, the brackets 202, 1202 of the present disclosure can provide a stable support for the circuit board 200, 1200. Furthermore, the brackets 202, 1202 can effectively and efficiently provide heating and / or cooling. This ensures that the electrical device 182 will function as intended. Furthermore, in some embodiments, the brackets 202, 1202 of the present disclosure allow for the use of less expensive electrical devices 182 (those rated for less extreme temperatures) in the electronic assembly 105. The brackets 202, 1202 also facilitate installation and electrical connections. Furthermore, the brackets 202, 1202 can be relatively compact for added benefits.

[0062] Although at least one exemplary embodiment has been presented in the foregoing detailed description, it should be understood that there are a large number of variations. It should also be understood that one exemplary embodiment or multiple exemplary embodiments are merely examples and are not intended to limit the scope, applicability, or configuration of the present disclosure in any way. On the contrary, the foregoing detailed description will provide a convenient roadmap for implementing the exemplary embodiments of the present disclosure to those skilled in the art. It should be understood that various changes may be made to the functions and arrangements of the elements described in the exemplary embodiments without departing from the scope of the present disclosure as set forth in the appended claims.

Claims

1. A temperature-variable support for supporting a circuit board in an electronic assembly, wherein the circuit board supports an electrical device, the support comprising: a temperature-variable electrical element that selectively changes temperature based on an electrical input applied thereto; a support body supporting the temperature variable electrical element and configured to support the circuit board at a distance from another component of the electronic assembly, the support body having a first end and a second end, the support body configured to be attached to the circuit board and protrude away from the circuit board, wherein the first end is proximate to the circuit board and the second end is spaced apart from the circuit board; and an electrical connector supported proximate the first end and electrically coupled to the temperature-variable electrical element, the electrical connector being configured to electrically connect within the circuit of the circuit board to provide the electrical input to the temperature-variable electrical element to selectively change the temperature of the temperature-variable electrical element and selectively adjust temperature conditions near the electrical device.

2. The bracket according to claim 1, wherein the temperature variable electrical element is a resistive heating element; wherein the support body is elongated having a longitudinal axis extending between the first end and the second end; and in: The resistive heating element includes a filament that extends continuously between the first end and the second end and returns at least once; The resistive heating element extends helically at least partially about the longitudinal axis; and The resistive heating element includes a substantially straight linear section extending between the first end and the second end.

3. The bracket of claim 1 , wherein the electrical connector is a first electrical connector and the bracket further comprises a second electrical connector, both the first electrical connector and the second electrical connector being supported proximate to the first end and configured to electrically connect the temperature variable electrical element within the circuit.

4. The stent according to claim 1, wherein the support body comprises an inner support and an outer cover, a space defined between the inner support and the outer cover; and wherein the temperature variable electrical element is disposed in the space between the inner support and the outer cover.

5. The stent of claim 4, wherein the outer cover comprises a radial cover, a first cap at the first end, and a second cap at the second end; and The first top cover supports the electrical connector.

6. The stent of claim 1 , wherein the support body comprises a first portion and a second portion attached together about a longitudinal axis; and wherein the first portion includes the temperature variable electrical element as a first temperature variable electrical element; and The second portion includes a second temperature-variable electrical element that selectively changes temperature.

7. An electronic assembly comprising: a printed circuit board supporting electrical traces for the electrical devices and power circuitry; a bracket, the bracket comprising a supporting body, a temperature-variable electrical element, and an electrical connector; the temperature variable electrical element selectively changing temperature based on electrical input applied thereto via the power circuit; the support body supporting the temperature-variable electrical component, the support body holding the printed circuit board a distance away from another component of the electronic assembly, the support body having a first end and a second end, the support body being attached to the circuit board and protruding away from the circuit board, wherein the first end is proximate to the circuit board and the second end is spaced apart from the circuit board; and The electrical connector is supported proximate the first end and electrically coupled to the temperature-variable electrical element, the electrical connector being electrically connected to the electrical traces of the printed circuit board to provide the electrical input to the temperature-variable electrical element, thereby selectively changing the temperature of the temperature-variable electrical element and selectively adjusting temperature conditions in an area of ​​the electronic device region near the electrical apparatus.

8. The electronic assembly of claim 7, further comprising a control system having a processor and a temperature sensor, said temperature sensor detecting said temperature condition near said electrical device; and The processor is configured to receive an input corresponding to the detected temperature condition and, based on the received input, generate a command for providing the electrical input to the temperature variable electrical element to selectively change a temperature of the temperature variable electrical element.

9. The electronic assembly of claim 7 , wherein the printed circuit board supports a thermal barrier layer that separates the area near the electrical device from adjacent areas, the thermal barrier layer being insulating to limit heat transfer between the area near the electrical device and the adjacent areas; and Optionally, the bracket is one of a plurality of brackets, each bracket comprising a corresponding temperature variable electrical element, a corresponding support body and a corresponding electrical connector, wherein the thermal barrier layer extends across the printed circuit board and at least partially surrounds the plurality of brackets in the area near the electrical device.

10. The electronic component of claim 7, wherein the electrical connector is a first electrical connector and the electronic component further comprises a second electrical connector, both the first electrical connector and the second electrical connector being supported proximate to the first end, the first electrical connector being connected to the electrical trace of the power circuit, and the second electrical connector being connected to another electrical trace of the power circuit.

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