High-security electronic delay electric energy-excited micro-detonator

Abstract

The high - security electronic delay electric - energy - excited micro - detonator of the present invention belongs to the technical field of electronic delay electric - energy - excited micro - detonators; the technical problem to be solved is: to provide an improvement in the hardware structure of the high - security electronic delay electric - energy - excited micro - detonator; it includes a detonator body, a first - stage metal shell, a second - stage metal shell, a plastic card sleeve, a plastic lock sleeve, a leg wire, a first - stage charge, and a second - stage charge; inside the detonator body, an energy - storage capacitor, a circuit board, a sealing plug, electrode wires, and a plasma igniter are encapsulated in plastic. The sealing plug is arranged inside the first - stage metal tube, so that the firing surface of the plasma igniter and the surface of the first - stage charge are tightly attached without a gap; the first - stage metal tube shell is arranged inside the second - stage metal tube shell, so that the bottom of the blind hole of the first - stage metal tube shell and the surface of the second - stage charge are tightly attached without a gap; the second - stage metal tube shell is hermetically connected to the sealing plug through the plastic card sleeve by pressing; the present invention is applied to blasting.

Description

Technical Field

[0001] The high - security electronic delay electric - energy - excited micro - detonator of the present invention belongs to the technical field of electronic delay electric - energy - excited micro - detonators. Background Technique

[0002] In existing domestic and foreign blasting projects, the detonators used must be installed with "detonator tubes, electric detonators or digital electronic detonators with initiating explosive charge structures", and the main explosive in the detonator is detonated through the detonator with an initiating explosive charge structure. Moreover, the amount of main explosive loaded in existing detonators varies from 150 grams to 500 grams in different types. Due to the ignition elements (resistance - wire ignition heads) and charge structures in detonator tubes, electric detonators or digital electronic detonators with initiating explosive charge structures, the "combustion - to - detonation" mechanism is adopted (ignition head ignition → flame ignites initiating explosive → initiating explosive burns and turns into detonation → initial detonation wave enters the booster explosive → booster explosive enhances the output of detonation wave), so that the detonator is filled with initiating explosives with extremely high mechanical sensitivity (such as nickel hydrazine nitrate or dinitro - diazophenol).

[0003] The detonator filled with an initiating explosive charge structure is a high - risk product and is extremely prone to explosion accidents during daily production, transportation, storage, and blasting engineering operations. In addition, traditional segmented - delay electric detonators and detonator - tube delay detonators have two types: second - delay and millisecond - delay, and the ignition head ignites the fire - transmitting agent in a section of the delay body. The delay body is generally a lead column with a medicine core, and the delay time depends on the medicine ratio and burning rate of the medicine core and the length of the delay body.

[0004] Therefore, the high - security electronic delay electric - energy - excited micro - detonator proposed by the present invention integrates an electronic delay circuit, an electric - energy energy - storage excitation circuit, and the main explosive to form an integrated - structure electronic delay electric - energy - excited micro - detonator. Summary of the Invention

[0005] In order to overcome the deficiencies in the prior art, the technical problem to be solved by the present invention is: to solve the technical problem of the unsafe factor that detonators must be installed on - site in blasting engineering and the problem that the detonator cannot be miniaturized. A hardware - structure improvement of a high - security, non - detonator - installed, directly integrated electronic delay circuit, electric - energy energy - storage excitation circuit, and booster - explosive charge structure to form an integrated micro - detonator is provided.

[0006] To solve the above - mentioned technical problem, the technical solution adopted by the present invention is: the high - security electronic delay electric - energy - excited micro - detonator includes a detonator body, a first - stage metal shell, a second - stage metal shell, a plastic card sleeve, a plastic lock sleeve, leg wires, a first - stage charge, and a second - stage charge;

[0007] Inside the detonator body, there are a storage capacitor, a circuit board, a sealing plug, electrode wires, and a plasma igniter encapsulated. The storage capacitor is connected to one end of the circuit board, the other end of the circuit board is connected to the plasma igniter through the electrode wires, and the plasma igniter is installed inside the end face of the sealing plug.

[0008] The sealing plug is arranged inside the first-stage metal tube, so that the ignition surface of the plasma igniter is closely attached to the surface of the first-stage charge without gaps.

[0009] The first-stage metal tube shell is arranged inside the second-stage metal tube shell, so that the bottom of the blind hole of the first-stage metal tube shell is closely attached to the surface of the second-stage charge without gaps.

[0010] The second-stage metal tube shell is hermetically connected with the sealing plug by being crimped with a plastic ferrule.

[0011] The plastic lock sleeve is arranged outside the plastic ferrule.

[0012] It also includes a third-stage charge and a third-stage plastic outer shell, and the third-stage charge is loaded inside the third-stage plastic outer shell.

[0013] It also includes a soft plastic package, emulsion explosive, and a sealed bayonet cable. The soft plastic package is arranged outside the detonator to form a detonator with a soft plastic package. The emulsion explosive is loaded inside the soft plastic package, so that the bottom of the plastic ferrule is closely attached to the surface of the emulsion explosive without gaps. The sealed bayonet cable is arranged at the bayonet of the detonator body.

[0014] The total charge of the first-stage charge and the second-stage charge ≤ 3 g. The first-stage charge specifically uses powdered TNT, RDX, or a mixed high explosive of TNT and RDX. The second-stage charge specifically uses powdered TNT, RDX, or a mixed high explosive.

[0015] The charge of the third-stage charge ≤ 100 g. The third-stage charge specifically uses powdered TNT, RDX, a mixed high explosive, or emulsion explosive.

[0016] The plasma igniter DHJ is made by using a vacuum sputtering metal coating process on a thin insulating board or a printed circuit board process, to etch metal bridge foil lines and metallized holes A and B connecting the metal bridge foils, or metallized A and metallized B electrode wire welding ends in a metal foil film. There are small metal foil protrusions in the center areas at both ends of the metal bridge foil, and there is a bridge foil line between the small metal foil protrusions. The resistance value of the bridge foil line ≤ 0.1 mΩ.

[0017] On the circuit board, there is a simulation electronic delay circuit and an electric energy storage excitation circuit, or a digital electronic delay circuit and an electric energy storage excitation circuit welded.

[0018] The circuit structures of the analog electronic delay circuit and the electric energy storage excitation circuit are as follows: It includes a voltage stabilizing circuit, a firing signal input optocoupler trigger circuit, an analog electronic delay circuit, and an electric energy storage excitation circuit; the voltage stabilizing circuit includes a bridge ZD, a triode T1, a voltage stabilizing diode W1, a resistor R1, and a transient suppression diode VTS; the firing signal input optocoupler trigger circuit includes an optocoupler IC2, a triode T2, a diode D1, a diac DIAC, a capacitor C1, and resistors R2 - R4; the analog electronic delay circuit includes a time base circuit IC1, a delay resistor-capacitor RtCt, and resistors R5 - R6; the electric energy storage excitation circuit includes triodes TE1 - TE2, a field effect transistor NM, resistors RE1 - RE5, a high-voltage capacitor Cg, and a plasma igniter DHJ; the circuits of the analog electronic delay circuit and the electric energy storage excitation circuit also include a three-wire high-voltage terminal A, a high-voltage terminal B, and a firing terminal FB.

[0019] In the analog electronic delay circuit, the time base circuit IC1 uses a 555 time base circuit or a comparator; the analog electronic delay circuit 300 is a resistor-capacitor type RC analog electronic delay circuit.

[0020] In the firing signal input optocoupler trigger circuit, the optocoupler IC2 uses a triode output type optocoupler or a thyristor output type optocoupler.

[0021] The input end of the optocoupler IC2 is through an optical isolation FB firing voltage signal input circuit composed of a diode D1, a resistor R2, a capacitor C1, and a diac DIAC.

[0022] The triodes TE1 - TE2, the field effect transistor NM, the resistors RE1 - RE5, the high-voltage capacitor Cg, and the plasma igniter DHJ form an electric energy excitation circuit.

[0023] The supply voltage range between the three-wire high-voltage terminal A and the high-voltage terminal B is 50V ≤ VAB ≤ 200V, and the positive voltage VFB of the firing signal received by the firing terminal FB ≤ 200V.

[0024] The circuit structures of the digital electronic delay circuit and the electric energy storage excitation circuit are as follows: It includes a microprocessor U1, triodes T1 - T5, triodes TE1 - TE2, a field effect transistor NM, a diode D1, a voltage stabilizing diode W1, a transient suppression diode VTS, a bridge ZD, resistors R1 - R8, resistors RE1 - RE4, capacitors C1 - C2, a high-voltage capacitor Cg, a plasma igniter DHJ, a terminal A, and a terminal B.

[0025] The terminal A and the terminal B are respectively connected to the two-wire legs of the digital detonator.

[0026] The two-wire bus of the digital detonator provides jump-type power supply with high voltage 50V ≤ VAB ≤ 200V and low voltage ≤ 36V, and a two-wire leg wire bus shared for digital communication;

[0027] The microprocessor U1 uses an 8-bit low-power 51 series microprocessor or an 8-bit microprocessor of other series;

[0028] The electric energy storage excitation circuit is composed of triodes TE1 - TE2, field effect transistor NM, resistors RE1 - RE4, high-voltage capacitor Cg, and plasma igniter DHJ; The triodes T1, T5, and the triode TE2 are specifically selected from bipolar transistors or MOSFET field effect transistors.

[0029] The beneficial effects of the present invention compared with the prior art are as follows: The high-safety electronic delay electric energy excitation micro-detonator provided by the present invention integrates an electronic delay circuit, an electric energy storage excitation circuit and main explosive to form an integrated electronic delay electric energy excitation micro-detonator, and the charge amount in the micro-detonator can be selected from 1.5 grams to 100 grams; The first-stage charge in the micro-detonator is TNT and RDX (cyclonite) high explosives, the second-stage charge is TNT and RDX or a mixed high explosive, and the third-stage charge can be TNT explosive, mixed explosive, or emulsion explosive; The setting of the delay section of the analog electronic delay circuit can be from instantaneous 0 seconds, delay 1ms ± 1%, 5ms ± 1%, 10ms ± 1%, 15ms ± 1%, 20ms ± 1%, 25ms ± 1%, ……, seconds ± 1%, minutes ± 1%, for the delay period setting; A digital electronic delay circuit can also be used, and the delay time can be programmed and set arbitrarily from 1ms to the second level. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The present invention will be further described below with reference to the drawings:

[0031] Figure 1 It is a structural diagram of the high-safety electronic delay electric energy excitation micro-detonator of the present invention with a charge amount less than 3 grams;

[0032] Figure 2 It is a structural diagram of the high-safety electronic delay electric energy excitation micro-detonator of the present invention with a charge amount less than 100 grams;

[0033] Figure 3 It is a structural diagram of the soft plastic packaging of the high-safety electronic delay electric energy excitation micro-detonator of the present invention;

[0034] Figure 4 It is a schematic diagram of the analog electronic delay circuit and the electric energy storage excitation circuit of Embodiment 1 of the present invention;

[0035] Figure 5Schematic diagram of the digital electronic delay circuit and the electric energy storage excitation circuit in Embodiment 2 of the present invention;

[0036] Figure 6 Schematic diagram of the structure of the plasma igniter of the present invention and the curve of the discharge plasma shock wave;

[0037] In the figure: 10 is the detonator body, 20 is the first-stage metal shell, 30 is the second-stage metal shell, 40 is the plastic bushing, 50 is the plastic lock sleeve, 60 is the leg wire, 70 is the first-stage charge, 80 is the second-stage charge, 90 is the third-stage charge, 100 is the third-stage plastic shell, 110 is the soft plastic package, 120 is the emulsion explosive, 130 is the sealed buckle cable, 101 is the energy storage capacitor, 102 is the circuit board, 103 is the head plug, 104 is the electrode wire, 105 is the plasma igniter, 100 is the voltage stabilizing circuit, 200 is the trigger circuit of the blasting signal input optocoupler, 300 is the analog electronic delay circuit, and 400 is the electric energy storage excitation circuit. Detailed implementation manners

[0038] As Figures 1 to 6 shown, the high-safety electronic delay electric energy-excited micro-detonator provided by the present invention: First, it adopts a plasma igniter based on the "plasma shock wave to detonation" mechanism; second, it invents a three-wire analog electronic delay circuit and an electric energy storage excitation circuit, or adopts a two-wire digital electronic delay circuit and an electric energy storage excitation circuit; third, it uses a plastic encapsulation process to integrate the invented electronic delay circuit and the electric energy storage excitation circuit into the micro-detonator.

[0039] According to the above three technical solutions, the high - security electronic delay electric - energy - excited micro - detonator of the present invention includes a detonator body 10, an energy - storage capacitor 101, a circuit board 102, a sealing plug 103, electrode wires 104, a plasma igniter 105, a first - stage metal shell 20, a second - stage metal shell 30, a plastic bushing 40, a plastic lock sleeve 50, leg wires 60, a third - stage plastic shell 100, a first - stage charge 70, a second - stage charge 80, and a third - stage charge 90. The energy - storage capacitor 101, the circuit board 102, the sealing plug 103, the electrode wires 104, and the plasma igniter 105 are encapsulated inside the detonator body 10. The first - stage charge 70 can be TNT, RDX (cyclonite), or a mixed high - explosive of TNT and RDX. The second - stage charge 80 can be RDX (cyclonite), or a mixed high - explosive of TNT and RDX. The third - stage charge 90 can be TNT explosive, a mixed explosive, or an emulsion explosive. The plasma igniter 105 is fabricated by using a vacuum sputtering metal - coating process on a thin insulating board or a printed circuit board process, and a metal bridge foil with a micron - order dimension and metallized holes A and B connecting the metal bridge foils, or metallized A and metallized B electrode - wire welding ends are etched in the metal foil film. There are small metal - foil protrusions in the central regions at both ends of the metal bridge foil, and there is a micron - order bridge - foil wire between the small metal - foil protrusions, and the resistance value of the bridge - foil wire ≤0.1 mΩ. A simulation electronic - delay circuit and an electric - energy - storage excitation circuit, or a digital electronic - delay circuit and an electric - energy - storage excitation circuit are welded on the circuit board 102.

[0040] As Figure 1 shown, the structural diagram of the high - security electronic delay electric - energy - excited micro - detonator of the present invention with a charge amount less than 3 g includes a detonator body 10, an energy - storage capacitor 101, a circuit board 102, a sealing plug 103, electrode wires 104, a plasma igniter 105, a first - stage metal shell 20, a second - stage metal shell 30, a plastic bushing 40, a plastic lock sleeve 50, leg wires 60, a first - stage charge 70, and a second - stage charge 80. The total charge amount of the first - stage charge 70 and the second - stage charge 80 ≤3 g, and the high - explosive filled can be TNT, RDX (cyclonite), or a mixed high - explosive of TNT and RDX. Figure 1 The difference between the structural diagram of the high - security electronic delay electric - energy - excited micro - detonator with a charge amount less than 3 g shown in Figure 2 and the structural diagram of the high - security electronic delay electric - energy - excited micro - detonator with a charge amount less than 100 g shown in

[0041] As Figure 2As shown in the figure, the structural diagram of the high-security electronic delay electric energy-excited micro-detonator of the present invention has a charge amount of less than 100 grams, and it includes a detonator body 10, an energy storage capacitor 101, a circuit board 102, a sealing plug 103, electrode wires 104, a plasma igniter 105, a first-stage metal tube shell 20, a second-stage metal tube shell 30, a plastic bushing 40, a plastic lock sleeve 50, a leg wire 60, a third-stage plastic outer shell 100, a first-stage charge 70, a second-stage charge 80, and a third-stage charge 90; the detonator body 10 is made by an injection molding process to plasticize and seal the energy storage capacitor 101, the circuit board 102, the sealing plug 103, the electrode wires 104, and the plasma igniter 105 into an integrated structure of the detonator body 10; the total charge amount of the first-stage charge 70 and the second-stage charge 80 is ≤ 3 g, and the loaded high explosive can be TNT, RDX (cyclonite), or a mixed high explosive of TNT and RDX; the first-stage charge 70 is filled in the first-stage metal tube 20; the second-stage charge 80 is filled in the second-stage metal tube 30; the total charge amount of the third-stage charge 90 is ≤ 100 g, and the loaded high explosive can be TNT explosive, mixed explosive, or emulsion explosive, and the third-stage charge 90 is filled in the third-stage plastic outer shell 100.

[0042] The plasma igniter 105 is made by a vacuum sputtering metal coating process on a thin insulating board or by a printed circuit board process to etch metal bridge foils and metallized holes A and B connecting the metal bridge foils, or metallized A and metallized B electrode wire welding ends in the metal foil film; there are small metal foil protrusions in the center areas at both ends of the metal bridge foil, and there are bridge foil wires in the micron order between the small metal foil protrusions, and the resistance value of the bridge foil wire is ≤ 0.1 mΩ; the two electrode wires 104 are respectively welded to the metallized holes A and B, and the other ends of the two electrode wires 104 are welded to the circuit on the circuit board 102; an analog electronic delay circuit and an electric energy storage excitation circuit, or a digital electronic delay circuit and an electric energy storage excitation circuit are welded on the circuit board 102.

[0043] The plasma igniter 105 is installed in the end face cavity of the sealing plug 103; the sealing plug 103 is inserted into the open end of the first-stage metal tube 20, so that the ignition surface of the plasma igniter 105 and the surface of the first-stage charge 70 are tightly attached without gaps; the sealing plug 103, the plasma igniter 105, the first-stage charge 70, and the first-stage metal tube shell 20 are inserted into the open end of the second-stage metal tube shell 30 together, so that the bottom of the blind hole of the first-stage metal tube shell 20 and the surface of the second-stage charge 80 are tightly attached without gaps; the second-stage metal tube shell 30 is hermetically connected to the sealing plug 103 by pressing through the plastic bushing 40.

[0044] As Figure 3 shown, it is the structural diagram of the soft plastic packaging of the high-security electronic delay electric energy-excited micro-detonator of the present invention.Figure 3 and Figure 2 The difference between the structure diagram of the high-security electronic delay electric energy-excited miniature detonator shown in Figure 3 and Figure 2 with a charge amount less than 100 grams is that the soft plastic package 110 replaces the third-stage plastic shell 100, the emulsion explosive 120 replaces the third-stage charge 90, and the sealed bayonet cable 130 is adopted to form the soft plastic package structure of the high-security electronic delay electric energy-excited miniature detonator of the present invention.

[0045] As Figure 4 shown, it is the schematic diagram of the analog electronic delay circuit and the electric energy energy storage excitation circuit in Embodiment 1 of the present invention, including a voltage stabilization circuit 100, a firing signal input optocoupler trigger circuit 200, an analog electronic delay circuit 300, and an electric energy energy storage excitation circuit 400; the voltage stabilization circuit 100 includes a bridge ZD, a triode T1, a voltage stabilizing diode W1, a resistor R1, and a transient suppression diode VTS; the firing signal input optocoupler trigger circuit 200 includes an optocoupler IC2, a triode T2, a diode D1, a diac DIAC, a capacitor C1, and resistors R2-R4; the analog electronic delay circuit 300 includes a time base circuit IC1, a delay resistor-capacitor RtCt, and resistors R5-R6; the electric energy energy storage excitation circuit 400 includes triodes TE1-TE2, a field effect transistor NM, resistors RE1-RE5, a high-voltage capacitor Cg, and a plasma igniter DHJ; the circuits of the analog electronic delay circuit and the electric energy energy storage excitation circuit further include a three-wire high-voltage terminal A, a high-voltage terminal B, and a firing terminal FB; the shown high-voltage terminal A, high-voltage terminal B, and firing terminal FB are external three-wire leg wire terminals; the access voltage between the shown high-voltage terminal A and high-voltage terminal B is ≤200V, and the positive voltage connected to the firing terminal FB is ≤200V.

[0046] In the voltage stabilization circuit 100, the triode T1, the voltage stabilizing diode W1 (select 12V), and the resistor R1 form a low-voltage voltage stabilization circuit with VCC = 12V; the base of the triode T1 is connected to the negative pole of the voltage stabilizing diode W1, the positive pole of the voltage stabilizing diode W1 is connected to the negative pole 4 of the bridge ZD to ground, the collector of the triode T1 is connected to the 2-foot high voltage HV of the bridge ZD, a resistor R1 is connected between the collector and the base of the triode T1, and the emitter output of the triode T1 is the positive pole VCC of the regulated power supply; the 1-foot and 3-foot of the bridge ZD are connected to the A-foot wire terminal and the B-foot wire terminal, and the 2-foot and 4-foot of the bridge ZD are connected to the voltage stabilization circuit.

[0047] In the blasting signal input optocoupler trigger circuit 200 described above, pin 1 of optocoupler IC2 is connected to one end of resistor R2 and one end of capacitor C1. The other end of resistor R2 is connected to the FB terminal of the blasting electrode wire through diode D1. The other end of capacitor C1 is connected to pin 4 of bridge ZD, and pin 4 of bridge ZD is grounded. Pin 2 of optocoupler IC2 is connected to one end of bidirectional trigger diode DIAC, and the other end is grounded. Pin 3 of optocoupler IC2 is connected to the base of triode T2 through resistor R4. A resistor R3 is connected between the base and emitter of triode T2. The emitter of triode T2 outputs power supply VCC, and pin 4 of optocoupler IC2 is grounded. The 3-4 pins at the output end of optocoupler IC2, triode T2, and resistors R3-R4 form a switching circuit for the output voltage of regulated power supply VCC. When the light-emitting diode at the input end of optocoupler IC2 does not emit light, there is no VCC voltage output at the collector of triode T2. On the contrary, when the light-emitting diode at the input end of optocoupler IC2 emits light, there is a VCC voltage output at the collector of triode T2.

[0048] In the analog electronic delay circuit 300 described above, a time-base circuit IC1, delay resistor-capacitor RtCt, and resistors R5-R6 form an electronic delay trigger circuit. Pin 4 and pin 8 of the time-base circuit IC1 are connected to the collector of triode T2. Pin 1 is grounded. Pins 6 and 2 are connected together to the midpoint of the series connection of delay resistor-capacitor RtCt. The other end of capacitor Ct is connected to the collector of triode T2. The other end of resistor Rt is grounded. The output pin 3 of the time-base circuit IC1 is connected to resistor R5, and R5 and R6 are connected in series to ground.

[0049] In the electric energy storage excitation circuit 400 described above, triodes TE1-TE2, field-effect transistor NM, resistors RE1-RE5, high-voltage capacitor Cg, and plasma igniter DHJ form an electric energy storage excitation circuit (high-voltage drive discharge circuit). The high voltage VH output from pin 2 of bridge ZD is connected to the positive electrode of high-voltage capacitor Cg, terminal A of plasma igniter DHJ, and one end of resistors RE2-RE3 through current-limiting resistor R1. The other end of resistor RE2 is connected in series with resistor RE1 to the collector of triode TE1. The emitter of triode TE1 is grounded, and the base is connected to the midpoint of the series connection of resistors R6 and R7. The other end of resistor RE3 is connected to the emitter of triode TE2. The base of triode TE2 is connected to the midpoint of the series connection of resistors RE1-RE2. The collector of triode TE2 is connected to the gate G of field-effect transistor NM and grounded through resistor RE4. The D pole of field-effect transistor NM is connected to terminal B of plasma igniter DHJ. The S pole of field-effect transistor NM is grounded, and the negative electrode of high-voltage capacitor Cg is grounded.

[0050] The working principle of the analog electronic delay circuit and the electric energy storage excitation circuit in Embodiment 1 is as follows. When the A-foot wire terminal, B-foot wire terminal, and FB firing electrode foot wire terminal in the circuit are correspondingly connected to the three-wire system foot wire 60, and the three-wire system foot wire 60 is then correspondingly connected to the three-wire system detonator through the three-wire system bus, when the detonator provides a voltage of 50V ≤ VAB ≤ 200V for the A-foot wire terminal and B-foot wire terminal, the voltage stabilizing circuit in the circuit works and outputs a VCC voltage, and the high-voltage capacitor Cg is charged through the current-limiting resistor RE5. At this time, when the firing electrode foot wire FB in the circuit does not receive a high-voltage trigger signal, the light-emitting diode in the optocoupler IC2 does not emit light, the triode T2 is in a cut-off state and there is no VCC voltage output. At this time, the delay trigger circuit composed of the time-base circuit IC1, the delay resistor capacitor RtCt, and the resistors R5 - R6 does not work, the 3rd pin of the time-base circuit IC1 is at a low level, and the high-voltage drive discharge circuit also does not work. When the firing electrode foot wire FB in the circuit receives a high-voltage trigger signal, the high voltage passes through the diode D1, the resistor R2, and the filter capacitor C1, and through the input terminals 1 and 2 of the optocoupler IC2 and the bidirectional trigger diode DIAC, causing the light-emitting diode to emit light. At this time, the output terminals 4 and 3 of the optocoupler IC2 are conducted, and the switching circuit for outputting the voltage of the regulated power supply VCC composed of the triode T2 and the resistors R3 - R4 is turned on. At the moment when the delay trigger circuit is powered on, the 6th and 2nd pins of the time-base circuit IC1 are instantaneously powered on to a high potential ≥ 2 / 3VCC, and the 3rd pin of the time-base circuit IC1 maintains a low level. As the capacitor Ct is charged through the resistor Rt, the voltages of the 6th and 2nd pins of the time-base circuit IC1 gradually decrease. When the voltage drops to ≤ 1 / 3VCC, the 3rd pin of the time-base circuit IC1 jumps to a high level to drive the high-voltage drive discharge circuit composed of the triodes TE1 - TE2, the field-effect transistor NM, the resistors RE1 - RE5, the high-voltage capacitor Cg, and the plasma igniter DHJ, causing the D and S poles of the high-voltage field-effect transistor NM to be instantaneously conducted. At this time, the electric energy stored in the high-voltage capacitor Cg is discharged through the plasma igniter DHJ (105) in the loop of the D and S poles of the high-voltage field-effect transistor NM, causing the bridge foil in the center of the plasma igniter DHJ (105) to instantaneously explode electrically to form a plasma shock wave to excite the explosion of the first-stage charge 70 in the micro-detonator to form a detonation wave, and then detonate the second-stage charge 80 and the third-stage charge 90 to output a strong detonation wave.

[0051] The triodes T1 and TE1 are NPN-type high-voltage-resistant triodes with Vcb ≥ 200V, and the triode TE2 is a PNP-type high-voltage-resistant triode with Veb ≥ 200V; the high-voltage field-effect transistor NM is an N-type field-effect transistor with a low internal resistance, high power, and high voltage resistance Vds ≥ 200V; the regulated voltage of the regulated diode W1 is 12V; the breakdown voltage of the transient suppression diode VTS is selected as 200V, and its main function is to prevent high-voltage static pulses; the optocoupler IC2 can be a triode output type optocoupler or a thyristor output type optocoupler.

[0052] The segmented delay time value Td = 1.1 * Rt * Ct. Different resistance and capacitance parameters Rt and Ct can be set with reference to the delay time table of each segment of the national millisecond delay detonator. The setting of the parameters is based on the delay time table of each segment of the millisecond delay detonator, as shown in Table 1 below:

[0053]

[0054] Table 1 Delay time table of each segment of the millisecond delay detonator.

[0055] The segments in Table 1 refer to the time period from when the FB firing terminal of the three-wire electronic delay circuit and the electrical energy storage excitation circuit has a high-voltage trigger signal to when the plasma igniter DHJ generates an electro-explosion to form a plasma shock wave; the segment 1 with a delay of zero is an instantaneous plasma shock wave excitation circuit, the segment 2 with a delay of 25 ms is a three-wire analog electronic delay (2 segments) plasma shock wave excitation circuit, the segment 3 with a delay of 50 ms is a three-wire analog electronic delay (3 segments) plasma shock wave excitation circuit, and so on to make three-wire analog electronic delay circuits and electrical energy storage excitation circuit boards 102 of different segments.

[0056] As Figure 5 shown, it is the schematic diagram of the digital electronic delay circuit and the electrical energy storage excitation circuit in Embodiment 2 of the present invention, including a microprocessor U1, triodes T1 - T5, triodes TE1 - TE2, a field effect transistor NM, a diode D1, a voltage regulator tube W1, a transient suppression diode VTS, a bridge ZD, resistors R1 - R8, resistors RE1 - RE4, capacitors C1 - C2, a high-voltage capacitor Cg, a plasma igniter DHJ, a leg wire terminal A, and a leg wire terminal B; the leg wire terminal A and the leg wire terminal B are two-wire leg wires for connecting an external digital detonator; the digital detonator provides a two-wire leg wire bus with a high voltage of 50V ≤ VAB ≤ 200V, a low voltage of ≤ 36V for jump-type power supply and digital communication sharing; the transient suppression diode VTS is for preventing strong electrostatic interference between the leg wire terminal A and the leg wire terminal B.

[0057] The working principle of the digital electronic delay circuit and the electrical energy storage excitation circuit in Embodiment 2 is as follows: When the external digital detonator provides a high voltage of 50V ≤ VAB ≤ 200V, a low voltage of VAB ≤ 36V for jump-type power supply, and a two-wire leg wire bus for digital communication sharing, it is connected to the leg wire A terminal and the leg wire B terminal in the digital electronic delay circuit and the electrical energy storage excitation circuit.

[0058] When the external digital detonator provides a voltage of VAB ≤ 36V, the digital detonator acts as the host and communicates with the digital electronic delay circuit and the electrical energy storage and excitation circuit of the high-security electronic delay and electrical energy excitation micro-detonator of the present invention. The host uses voltage modulation Vt to communicate digitally with the slave, and the slave uses current modulation It to communicate digitally with the host. The host manages the slave through digital communication via a two-wire leg wire, and the digital detonator sets the delay time for the slave and issues a detonation command. When the A terminal and B terminal of the leg wire in the slave circuit are connected to the voltage of VAB ≤ 36V supplied by the digital detonator, a voltage of VAB ≤ 36V is output at the 2nd and 4th pins of the bridge ZD. After passing through the voltage stabilization circuit composed of triodes T1 - T2, diode D1, voltage regulator diode W1, resistors R1 - R2, and capacitor C1, a 3.6V voltage is output to supply the VCC pin 2 and GND pin 4 of the microprocessor U1. C2 is a filter capacitor. When the host outputs a voltage modulation Vt signal to communicate digitally with the slave, a voltage modulation signal is received at the RXD pin 5 of the microprocessor U1 at the midpoint of the series connection of resistors R4 and R5. When the digital signal output from the TXD pin 6 of the slave is converted into a current modulation It signal through resistors R6, triode T3, and resistor R3 and communicates digitally with the host via the A terminal of the leg wire, the B terminal of the leg wire, and the two-wire leg wire. The 7th pin P3.2 and the 8th pin P3.3 of the microprocessor U1 are respectively the charging control of the high-voltage capacitor Cg and the output control of the firing signal. When the firing signal output at the 8th pin P3.3 of the microprocessor U1 is at a high level, it drives the electrical energy storage and excitation circuit composed of triodes TE1 - TE2, resistors RE1 - RE4, field effect transistor NM, plasma igniter DHJ, and high-voltage capacitor Cg, causing the bridge foil at the center of the plasma igniter DHJ to instantaneously explode electrically to form a plasma shock wave to excite the explosion of the first-stage charge 70 in the micro-detonator to form a detonation wave, and then detonate the second-stage charge 80 and the third-stage charge 90.

[0059] When the external digital detonator provides a high voltage of 50V ≤ VAB ≤ 200V, the high voltage of 50V ≤ VAB ≤ 200V provided by the host passes through the two-wire leg wire through the A terminal and B terminal of the leg wire, passes through the 2nd and 4th pins of the bridge ZD, the current-limiting resistor R8, triodes T5 - T4, and resistor R7 to form a high-voltage charging control circuit, and is controlled by the high level output from the 7th pin P3.2 of the microprocessor U1.

[0060] The host manages the slave through digital communication via a two-wire leg wire, and the digital detonator sets the delay time for the slave and issues a detonation command, which is completed by the internal software program of the microprocessor U1. The microprocessor U1 uses a low-power 51 series microprocessor or an 8-bit microprocessor of other series.

[0061] As Figure 6As shown in the figure, it is a schematic diagram of the structure of the plasma igniter of the present invention and the curve of the discharge plasma shock wave. The plasma igniter DHJ is made by vacuum sputtering metal coating process on a thin insulating plate or by printed circuit board process, and a metal bridge foil with a micron order and metallized holes A and B connecting the metal bridge foils, or the welding ends of metallized A and metallized B electrode wires are etched in the metal foil film; there are small metal foil protrusions in the central areas at both ends of the metal bridge foil, and there is a bridge foil wire between the small metal foil protrusions, and the resistance value of the bridge foil wire ≤ 0.1 mΩ, and the time of the instantaneously generated gaseous plasma shock wave ≤ 10 us.

[0062] Regarding the specific structure of the present invention, it should be noted that the connection relationships between the various component modules adopted by the present invention are determined and achievable. Except for the special descriptions in the embodiments, the specific connection relationships can bring corresponding technical effects, and on the premise of not relying on the execution of corresponding software programs, the technical problems proposed by the present invention are solved. The models and connection methods of the components, modules, and specific components in the present invention, except for the specific descriptions, all belong to the prior art such as publicly available patents, publicly available journal papers, or common general knowledge that those skilled in the art can obtain before the application date, and there is no need to elaborate. Therefore, the technical solution provided in this case is clear, complete, and achievable, and the corresponding physical product can be reproduced or obtained according to this technical means.

[0063] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. High-security electronic delay electric energy-excited micro-detonator, characterized in that: It includes a detonator body (10), a first-stage metal shell (20), a second-stage metal shell (30), a plastic sleeve (40), a plastic lock sleeve (50), a leg wire (60), a first-stage charge (70), and a second-stage charge (80); Inside the detonator body (10), an energy storage capacitor (101), a circuit board (102), a sealing plug (103), an electrode wire (104), and a plasma igniter (105) are encapsulated in plastic. The energy storage capacitor (101) is connected to one end of the circuit board (102), and the other end of the circuit board (102) is connected to the plasma igniter (105) through the electrode wire (104). The plasma igniter (105) is installed inside the end face of the sealing plug (103); The sealing plug (103) is arranged inside the first-stage metal shell (20) so that the firing surface of the plasma igniter (105) is in seamless contact with the surface of the first-stage charge (70); The first-stage metal shell (20) is arranged inside the second-stage metal shell (30) so that the bottom of the blind hole of the first-stage metal shell (20) is in seamless contact with the surface of the second-stage charge (80); The second-stage metal shell (30) is hermetically connected to the sealing plug (103) by pressing with the plastic sleeve (40); The plastic lock sleeve (50) is arranged outside the plastic sleeve (40); A simulated electronic delay circuit and an electric energy storage excitation circuit are welded on the circuit board (102); The circuit structure of the simulated electronic delay circuit and the electric energy storage excitation circuit: includes a voltage stabilization circuit, a firing signal input optocoupler trigger circuit (200), a simulated electronic delay circuit (300), and an electric energy storage excitation circuit (400); The voltage stabilization circuit includes a bridge ZD, a triode T1, a voltage stabilizing diode W1, a resistor R1, and a transient suppression diode VTS; the base of the triode T1 is connected to the negative pole of the voltage stabilizing diode W1, the positive pole of the voltage stabilizing diode W1 is connected to the negative pole 4 of the bridge ZD to ground, the collector of the triode T1 is connected to the 2-foot high voltage HV of the bridge ZD, a resistor R1 is connected between the collector and the base of the triode T1, and the emitter output of the triode T1 is the positive pole VCC of the regulated power supply; the 1-foot and 3-foot of the bridge ZD are connected to the high voltage terminal A and the high voltage terminal B, and the transient suppression diode VTS is connected between the 2-foot and 4-foot of the bridge ZD; The blasting signal input optocoupler trigger circuit (200) includes an optocoupler IC2, a triode T2, a diode D1, a diac DIAC, a capacitor C1, and resistors R2 - R4; Pin 1 of the optocoupler IC2 is connected to one end of the resistor R2 and one end of the capacitor C1. The other end of the resistor R2 is connected to the blasting connection terminal FB through the diode D1. The other end of the capacitor C1 is connected to pin 4 of the bridge ZD, and pin 4 of the bridge ZD is grounded. Pin 2 of the optocoupler IC2 is connected to one end of the diac DIAC, and the other end of the diac DIAC is grounded; Pin 3 of the optocoupler IC2 is connected to the base of the triode T2 through the resistor R4. A resistor R3 is connected between the base and the emitter of the triode T2. The emitter of the triode T2 outputs the power supply VCC, and pin 4 of the optocoupler IC2 is grounded; The analog electronic delay circuit (300) includes a time - base circuit IC1, a delay resistor - capacitor RtCt, and resistors R5 - R6; Pin 4 and pin 8 of the time - base circuit IC1 are connected to the collector of the triode T2. Pin 1 of the time - base circuit IC1 is grounded. Pins 6 and 2 of the time - base circuit IC1 are connected to the mid - point of the series connection of the delay resistor - capacitor RtCt. The other end of the capacitor Ct is connected to the collector of the triode T2. The other end of the resistor Rt is grounded. The output pin 3 of the time - base circuit IC1 is connected to the resistor R5, and R5 and R6 are connected in series and grounded; The electric energy storage and excitation circuit (400) includes triodes TE1 - TE2, a field - effect transistor NM, resistors RE1 - RE5, a high - voltage capacitor Cg, and a plasma igniter (105); The high - voltage HV output from pin 2 of the bridge ZD is connected to the positive electrode of the high - voltage capacitor Cg, terminal A of the plasma igniter (105), and one end of the resistors RE2 - RE3 through the resistor R1; The other end of the resistor RE2 is connected in series with the resistor RE1 and then connected to the collector of the triode TE1. The emitter of the triode TE1 is grounded. The base of the triode TE1 is connected to the mid - point of the series connection of the resistors R6 and R5; The other end of the resistor RE3 is connected to the emitter of the triode TE2. The base of the triode TE2 is connected to the mid - point of the series connection of the resistors RE1 - RE2. The collector of the triode TE2 is connected to the gate G of the field - effect transistor NM and grounded through the resistor RE4; The D - pole of the field - effect transistor NM is connected to terminal B of the plasma igniter (105). The S - pole of the field - effect transistor NM is grounded, and the negative electrode of the high - voltage capacitor Cg is grounded; The analog electronic delay circuit and the electric energy storage and excitation circuit include a three - wire high - voltage connection terminal A, a high - voltage connection terminal B, and a blasting connection terminal FB; The input end of the optocoupler IC2 forms an optical isolation FB blasting voltage signal input circuit through the diode D1, the resistor R2, the capacitor C1, the diac DIAC, or a zener diode.

2. The high-security electronic delay electric energy-excited micro-detonator according to claim 1, wherein: It also includes a third - stage charge (90) and a third - stage plastic shell (100), and the third - stage charge (90) is loaded inside the third - stage plastic shell (100).

3. The high-security electronic delay electric energy-excited micro-detonator according to claim 1, characterized in that: It also includes a soft plastic package (110), emulsion explosive (120), and a sealed bayonet cable (130). The soft plastic package (110) is arranged outside the detonator to form a detonator with a soft plastic package. The emulsion explosive (120) is loaded inside the soft plastic package (110), so that the bottom of the plastic bushing (40) is closely attached to the surface of the emulsion explosive (120) without gaps. The sealed bayonet cable (130) is arranged at the bayonet of the detonator body (10).

4. The high-security electronic delay electric energy-excited micro-detonator according to any one of claims 1-3, characterized in that: The total charge amount of the first-stage charge (70) and the second-stage charge (80) is ≤ 3 g. The first-stage charge (70) specifically uses powdered TNT, RDX, or a mixed high explosive of TNT and RDX. The second-stage charge (80) specifically uses powdered TNT, RDX, or a mixed high explosive of TNT and RDX.

5. The high-security electronic delay electric energy-excited micro-detonator according to claim 2, characterized in that: The charge amount of the third-stage charge (90) is ≤ 100 g. The third-stage charge (90) specifically uses powdered TNT, RDX, a mixed high explosive, or emulsion explosive.

6. The high-security electronic delay electric energy-excited micro-detonator according to any one of claims 1-3, characterized in that: The plasma igniter (105) is manufactured by using a vacuum sputtering metal coating process on a thin insulating board or a printed circuit board process to etch metal bridge foil lines and metallized holes A and B connecting the metal bridge foils, or the welded ends of metallized A and metallized B electrode wires in a metal foil film. There are small metal foil protrusions in the central areas at both ends of the metal bridge foil. There is a bridge foil line between the small metal foil protrusions, and the resistance value of the bridge foil line is ≤ 0.1 mΩ.

7. The high-security electronic delay electric energy-excited miniature detonator according to claim 1, characterized in that: The time-base circuit IC1 in the analog electronic delay circuit (300) uses a 555 time-base circuit or a comparator circuit. The analog electronic delay circuit (300) is a resistive-capacitive RC analog electronic delay circuit. In the firing signal input optocoupler trigger circuit (200), the optocoupler IC2 uses a transistor output type optocoupler or a thyristor output type optocoupler.

8. The highly secure electronic delay electric energy-excited miniature detonator according to claim 7, characterized in that: The supply voltage range between the high-voltage terminal A and the high-voltage terminal B is 50V ≤ VAB ≤ 200V, and the positive voltage VFB of the firing signal received by the firing terminal FB ≤ 200V.

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