Electronic device package and display device including the same

Abstract

An electronic device package is disclosed that includes a substrate including a center region and first and second side regions at opposite sides of the center region; a first component located in the first or second side region, the first component having a first height above a surface of the substrate; a second component located in the center region, the second component having a second height above the surface of the substrate that is lower than the first height; a reinforcing member located in the center region and superposed with the second component, and having a third height above the surface of the substrate that is lower than the first height and higher than the second height; and a package member covering the first and second components.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2020-0031528, filed on March 13, 2020, with the Korean Intellectual Property Office, and Korean Patent Application No. 10-2020-0177408, filed on December 17, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to an electronic device package and a display device including the electronic device package. Background Technology

[0003] Electronic devices such as mobile phones, tablets, and multimedia players include display devices for displaying images. Display devices typically include a display panel that operates as a screen for displaying images. The display panel receives signals for driving the display panel via a flexible printed circuit film connected to a pad. The driving unit that generates the signals for driving the display panel can be implemented as an integrated circuit chip. The integrated circuit chip can be mounted on the flexible printed circuit film or the display panel.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore the information discussed in this background section does not necessarily constitute prior art. Summary of the Invention

[0005] Integrated circuits and related components can be manufactured in a single package (i.e., an electronic device package). Due to limitations in the design, electronic device packages can be manufactured with relatively large aspect ratios, which degrades their bending properties. When bending properties degrade, electronic device packages may be relatively susceptible to damage or breakage during handling.

[0006] Electronic device packages can be mounted on flexible printed circuit films. When the electronic device package is positioned close to the pads on the flexible printed circuit film, the utilization of internal space of the electronic device can be increased, and the quality of signals output from the electronic device package and transmitted to the display panel can be improved.

[0007] Some embodiments may include an electronic device package capable of improving bending characteristics and impact resistance, and a display device including the electronic device package.

[0008] Additionally, some embodiments may include a relatively improved electronic device package and a display device including the improved electronic device package.

[0009] A display device according to some embodiments includes: a substrate including a central region and a first side region and a second side region located on opposite sides of the central region; a first component located in the first side region or the second side region, the first component having a first height above a surface of the substrate; a second component located in the central region, the second component having a second height above a surface of the substrate that is lower than the first height; a reinforcing member located in the central region and stacked with the second component, the reinforcing member having a third height above a surface of the substrate that is lower than the first height and higher than the second height; and an encapsulation member covering the first component and the second component.

[0010] According to some embodiments, the reinforcing member can be covered by the encapsulating member.

[0011] According to some embodiments, the substrate may include a grounding pad, and a reinforcing member may be connected to the grounding pad.

[0012] According to some embodiments, the reinforcing member may cover the upper surface of the second component and surround at least a portion of the side surface of the second component.

[0013] According to some embodiments, the reinforcing member may have a shape in which the metal plate is bent.

[0014] According to some embodiments, the encapsulation member may have a fourth height at a first portion covering the first component and a fifth height at a second portion covering the second component, and the fourth height may be the same as the fifth height.

[0015] According to some embodiments, the reinforcing member may have a modulus of 100 GPa or greater.

[0016] According to some embodiments, the reinforcing member may include stainless steel.

[0017] A display device according to some embodiments includes: a display panel; a flexible printed circuit film disposed on the display panel; and an electronic device package disposed on the flexible printed circuit film. The electronic device package includes: a substrate including a central region and a first side region and a second side region located on opposite sides of the central region; a first component located in the first side region or the second side region, the first component having a first height above a surface of the substrate; a second component located in the central region, the second component having a second height above a surface of the substrate that is lower than the first height; a reinforcing member located in the central region and stacked with the second component, the reinforcing member having a third height above a surface of the substrate, the third height being lower than the first height and higher than the second height; and an encapsulation member covering the first component and the second component.

[0018] A display device according to some embodiments includes: a display panel including a first pad; a flexible printed circuit film including a second pad bonded to the first pad; and an electronic device package located on the flexible printed circuit film. The electronic device package includes a first portion having a first height and a second portion having a second height lower than the first height, and the second portion being closer to the second pad than the first portion.

[0019] According to some embodiments, an electronic device package may include a substrate and a first component and a second component located on the substrate. The first component may be positioned at a first portion, the second component may be positioned at a second portion, and the height of the second component may be lower than the height of the first component.

[0020] According to some embodiments, the second component may have a height of 0.2 millimeters (mm) or less.

[0021] According to some embodiments, the electronic device package may further include a packaging member covering the first component and the second component, and the height of the packaging member in the second part may be lower than the height of the packaging member in the first part.

[0022] According to some embodiments, the electronic device package may also include a shielding layer covering the package member.

[0023] According to some embodiments, the electronic device package may further include a third portion located between the first portion and the second portion, and as the third portion moves from the first portion to the second portion, the third portion may gradually change from a first height to a second height.

[0024] According to some embodiments, the upper surface of the third part may be an inclined surface relative to the plane of the substrate.

[0025] According to some embodiments, the electronic device package may further include a third portion having a third height between the first portion and the second portion, and the third height may be lower than the first height and higher than the second height.

[0026] A display device according to some embodiments includes: a display panel including a first pad; a flexible printed circuit film including a second pad bonded to the first pad; and an electronic device package located on the flexible printed circuit film. The electronic device package includes a first portion and a second portion having a first height, the second portion having a first end having the first height and a second end having a second height lower than the first height, and the second portion being closer to the second pad than the first portion.

[0027] According to some embodiments, an electronic device package may include a substrate and a first component and a second component positioned on the substrate. The first component may be positioned in a first portion, the second component may be positioned in a second portion, and the height of the second component may be lower than the height of the first component.

[0028] According to some embodiments, the second component may have a height of 0.2 mm or less.

[0029] According to some embodiments, the electronic device package may further include a packaging member covering the first component and the second component, and the height of the packaging member may gradually decrease from the first end to the second end.

[0030] According to some embodiments, the electronic device package may also include a shielding layer covering the package member.

[0031] According to some embodiments, as the second part moves from the first end to the second end, the second part can gradually change from a first height to a second height.

[0032] According to some embodiments, the upper surface of the second part may be an inclined surface relative to the plane of the substrate.

[0033] An electronic component assembly according to some embodiments includes: a flexible printed circuit film including a pad portion; and an electronic device package located on the flexible printed circuit film. The electronic device package includes a first portion having a first height and a second portion having a second height lower than the first height, and the second portion is closer to the pad portion than the first portion.

[0034] According to some embodiments, an electronic device package may include a substrate and a first component and a second component positioned on the substrate. The first component may be positioned in a first portion, the second component may be positioned in a second portion, and the height of the second component may be lower than the height of the first component.

[0035] According to some embodiments, the electronic device package may further include a packaging member covering the first component and the second component, and the height of the packaging member in the second part may be lower than the height of the packaging member in the first part.

[0036] According to some embodiments, the electronic device package may also include a third part between the first part and the second part, and as the third part moves from the first part to the second part, the third part may gradually change from a first height to a second height.

[0037] According to some embodiments, the electronic device package may further include a third portion having a third height between the first portion and the second portion, and the third height may be lower than the first height and higher than the second height.

[0038] According to some embodiments, it is possible to provide an electronic device package that can improve bending characteristics and impact resistance, as well as a display device including the electronic device package.

[0039] According to some embodiments, the electronic device package can be positioned closer to the pad, thereby reducing the size of the flexible printed circuit film and increasing the utilization of the internal space of the electronic device. It can also improve the quality of signals output from the electronic device package and transmitted to the display panel. Furthermore, it can reduce the manufacturing cost of the flexible printed circuit film. Attached Figure Description

[0040] Figure 1 A schematic top plan view of a display device according to some embodiments is shown.

[0041] Figure 2 A schematic cross-sectional view of an electronic device package according to some embodiments is shown.

[0042] Figure 3A and Figure 3B The diagrams shown illustrate the bending characteristics of electronic device packages according to some embodiments.

[0043] Figures 4 to 6 A method for manufacturing an electronic device package according to some embodiments is shown.

[0044] Figure 7 A schematic cross-sectional view of an electronic device package according to some embodiments is shown.

[0045] Figure 8 A schematic top plan view of a display device according to some embodiments is shown.

[0046] Figure 9 A schematic perspective view of an electronic device package according to some embodiments is shown.

[0047] Figure 10 The following is illustrated according to some embodiments. Figure 9 A cross-sectional view of an electronic device package taken along line B-B'.

[0048] Figure 11 The following are examples of methods for manufacturing, according to some embodiments. Figure 9 The image shows a cross-sectional view of the mold for an electronic device package.

[0049] Figure 12 , Figure 13 , Figure 14 , Figure 15 and Figure 16 A cross-sectional view of an electronic device package according to some embodiments is shown.

[0050] Figure 17 The process of bonding a flexible printed circuit film with electronic component packages mounted on it to a display panel is illustrated schematically according to a comparative example.

[0051] Figure 18 The illustration schematically depicts a process for bonding a flexible printed circuit film with electronic component packages mounted on it to a display panel, according to some embodiments.

[0052] Figure 19 The illustration schematically depicts a process for bonding a flexible printed circuit film with electronic component packages mounted on it to a display panel, according to some embodiments.

[0053] Figure 20 A schematic cross-sectional view of a stacked structure of display panels according to some embodiments is shown. Detailed Implementation

[0054] Further details of some embodiments of the inventive concept will be described more fully below with reference to the accompanying drawings, in which embodiments are illustrated.

[0055] Furthermore, for better understanding and ease of description, the dimensions and thicknesses of the constituent elements shown in the accompanying drawings are provided arbitrarily.

[0056] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element may be directly on said other element, or there may be intermediate elements present. Conversely, when an element is referred to as being "directly on" another element, there are no intermediate elements present.

[0057] Furthermore, unless explicitly stated otherwise, the word “including” and its variations shall be understood to mean that the stated element is included, but not that any other element is excluded.

[0058] Additionally, in the specification, “connection” means that two or more components are not only directly connected, but also indirectly connected, physically connected, and electrically connected through other components, or may be referred to by different names depending on their location or function, but may include each of the components that are substantially integrated with each other.

[0059] In the accompanying drawings, the symbols x, y, and z are used to indicate directions, wherein the symbol x indicates a first direction, y indicates a second direction perpendicular to the first direction, and z indicates a third direction perpendicular to the first and second directions.

[0060] Figure 1 A schematic top plan view of a display device according to some embodiments is shown.

[0061] Reference Figure 1The display device includes a display panel 10. The display panel 10 includes a display area DA for displaying images and a non-display area NA located around the display area DA (e.g., in the periphery of the display area DA or outside the area occupied by the display area DA). The display area DA may correspond to a screen. Means and / or signal lines for generating and / or transmitting various signals applied to the display area DA may be located in the non-display area NA.

[0062] Multiple pixels PX are arranged in a matrix or array (e.g., multiple rows and columns) within the display area DA of the display panel 10. Signal lines, such as data lines and gate lines, may also be located within the display area DA. Gate lines may extend substantially in a first direction x (e.g., row direction), and data lines may extend substantially in a second direction y (e.g., column direction). Gate lines and data lines may be connected to each pixel PX to receive gate signals (also called scan signals) and data voltages (also called data signals) from the signal lines. Drive voltage lines for transmitting drive voltages to the pixels PX may be located within the display area DA, and initialization voltage lines for transmitting initialization voltages to the pixels PX may be located. Drive voltage lines may extend approximately in the second direction y, and initialization voltage lines may extend approximately in the first direction x.

[0063] The display panel 10 may include a touch sensor layer, in which touch electrodes for sensing user contact or non-contact touch are arranged. The touch electrodes may be located in the display area DA.

[0064] The pad (or "solder pad") portion PP1 can be positioned in the non-display area NA of the display panel 10. The pad portion PP1 may include a pad as a connection terminal for receiving signals from the outside of the display panel 10.

[0065] The display device may include a flexible printed circuit film 20 having a first end bonded to a pad PP1 of a display panel 10. The flexible printed circuit film 20 may include a body 21, a neck 22, and a tail 23. A pad PP2 bonded to the pad PP1 of the display panel 10 may be located within the body 21, and the pad of the pad PP2 is electrically connected to the pad of the pad PP1. An electronic device package 30 may be mounted within the body 21. The size of the flexible printed circuit film 20 can be reduced by encapsulating components that can be dispersed within the flexible printed circuit film 20 into the electronic device package 30. The neck 22 connects the body 21 and the tail 23, and a connector CT for connecting to an electronic device (e.g., a mobile phone) including the display device may be positioned on the tail 23. The flexible printed circuit film 20 may receive signals such as image data via the connector CT and may receive electrical voltages such as drive voltage or common voltage.

[0066] With pad PP2 connected to pad PP1, the flexible printed circuit film 20 can be bent simultaneously around the edge of the display panel 10, allowing most of the flexible printed circuit film 20 to be positioned on the rear surface of the display panel 10. As the dimensions of the body 21 and neck 22 decrease, the utilization rate of the internal space of the electronic device can be increased. That is, the shape or arrangement margin and design freedom of other components located inside the electronic device can be increased. The neck 22 can be sized by internal wiring, and the body 21 can be sized according to the shape and position of components such as the electronic device package 30.

[0067] The driving unit that generates and / or processes various signals for driving the display panel 10 may be located in the non-display area NA or on the flexible printed circuit film 20. The driving unit may include a data driver for applying data voltages to data lines, a gate driver for applying gate signals to gate lines, and a signal controller for controlling the data driver and the gate driver.

[0068] A gate driver can be integrated as a driving circuit in the non-display area NA of the display panel 10. The driving circuit can be positioned to extend in a second direction y on the opposite side of the display area DA. The driving circuit may include a shift register comprising independently connected stages. Each of the stages can generate a gate signal to output the gate signal to a gate line.

[0069] The data driver and signal controller can be configured as integrated circuits and can be included in the electronic device package 30. The electronic device package 30 can be positioned on the body 21 of the flexible printed circuit film 20. The electronic device package 30 can be located in the non-display area NA of the display panel 10 (e.g., between the display area DA and the pad PP1). The electronic device package 30 can generally have a substantially cuboid shape. The electronic device package 30 can have an aspect ratio of about 2 or greater, about 3 or greater, or about 4 or greater.

[0070] Figure 2 A schematic cross-sectional view of an electronic device package according to some embodiments is shown, and Figure 3A and Figure 3B The diagrams shown illustrate the bending characteristics of electronic device packages according to some embodiments. Figure 2 Can be along Figure 1 The cross-sectional view of the electronic device package 30, which is cut by line A-A', corresponds to the view in the figure.

[0071] Reference Figure 2An electronic device package 30 is shown that can be positioned on the body 21 of a flexible printed circuit film 20. The electronic device package 30 can be a system-in-package (SiP). The electronic device package 30 includes a first side portion 310, a center portion 330, and a second side portion 320 in a first direction x. The first side portion 310 and the second side portion 320 can be referred to as the periphery. In the illustrated state, based on the center portion 330, the first side portion 310 is positioned at the left side portion, and the second side portion 320 is positioned at the right side portion. The electronic device package 30 can be mounted on the flexible printed circuit film 20 such that the electronic device package 30 and the flexible printed circuit film 20 can be configured as an electronic component assembly.

[0072] The electronic device package 30 includes a substrate 31 and components 32a and 32b, such as integrated circuits, capacitors, resistors, and inductors, located on the substrate 31. The electronic device package 30 includes a packaging member 33 covering the components 32a and 32b. The electronic device package 30 includes connection terminals 34 positioned on the lower surface of the substrate 31. The electronic device package 30 includes a reinforcing member 35 positioned in a central portion 330. The reinforcing member 35 may be covered by the packaging member 33.

[0073] The substrate 31 may be a printed circuit board or a wiring board. The substrate 31 may include a ground wire GND.

[0074] Components 32a and 32b are circuit elements constituting the electronic device package 30, such as integrated circuits, capacitors, resistors, and inductors. The number of components 32a and 32b can vary depending on the design and can be about 10 or more, for example, about 30 to about 60. Components 32a and 32b can have various heights, and to avoid complexity, four components 32a and 32b are shown and described. However, embodiments are not limited to the number and height / size of components shown in the figures, and some embodiments may include additional components of different heights or fewer components.

[0075] The electronic device package 30 may include a first component 32a having a relatively high first height h1 and a second component 32b having a relatively low second height h2. The first component 32a may have a height greater than a predetermined height (e.g., a set or pre-determined height), and the second component 32b may have a height equal to or less than a predetermined height (e.g., a set or pre-determined height). For example, the first component 32a may have a first height h1 up to about 0.6 mm and higher than about 0.2 mm, and the second component 32b may have a second height h2 up to about 0.2 mm. The second height h2 may be less than about half the first height h1.

[0076] The first component 32a may be located in a first side 310 or a second side 320 of the electronic device package 30. The second component 32b may be located in the center 330 of the electronic device package 30. Two first components 32a and two second components 32b are shown, but among all components located on the substrate 31 in the electronic device package 30, components with relatively high height may be located in the first side 310 or the second side 320, and components with relatively low height may be located in the center 330. The second component 32b may also be located in the first side 310 and / or the second side 320, but the first component 32a may not be located in the center 330. The first component 32a may be primarily a large-capacity capacitor, a high-value resistor, or an integrated circuit, and the second component 32b may be primarily a small-capacity capacitor or a low-value resistor. Electrodes connected to the pads of the substrate 31 may be located on opposite sides of the first component 32a and the second component 32b. The opposite portion is shown as being higher than the middle portion, but they can be the same height, and the middle portion can be higher. The shapes of the first component 32a and the second component 32b shown are merely examples, and the electronic device package 30 may include the first component 32a and the second component 32b having various shapes.

[0077] The first side portion 310 includes a first end of the electronic device package 30 in the first direction x, the second side portion 320 includes a second end of the electronic device package 30 in the first direction x, and the center portion 330 includes a center portion of the electronic device package 30 in the first direction x. The first side portion 310 and the second side portion 320 are positioned adjacent to the opposite side of the center portion 330. The length of the center portion 330 in the first direction x can be in the range of about 20% to about 60% of the total length of the electronic device package 30 (the total length corresponding to the length of the long side). The first side portion 310 and the second side portion 320 can be symmetrical with respect to the center portion 330, but they can be asymmetrical. That is, the lengths of the first side portion 310 and the second side portion 320 in the first direction x can be approximately the same or can be different. The substrate 31 includes a first side region corresponding to the first side portion 310, a second side region corresponding to the second side portion 320, and a center region corresponding to the center portion 330.

[0078] The encapsulation member 33, covering all components 32a and 32b positioned on the substrate 31, can be formed to have substantially the same height h0. That is, the encapsulation member 33 can be formed such that its upper surface is flat and substantially parallel to the plane of the substrate 31, while covering the component 32a with the highest height, regardless of the heights of components 32a and 32b. Therefore, the height h0 of the encapsulation member 33 can be substantially the same as the heights of the first side 310, the second side 320, and the center portion 330. The second component 32b, with a lower height, is located in the center portion 330, so the gap g2 between the second component 32b in the center portion 330 and the upper surface of the encapsulation member 33 is larger than the gap g1 between the first component 32a in the first side 310 or the second side 320 and the upper surface of the encapsulation member 33. Throughout the specification, unless otherwise stated, height refers to the height from the surface of the substrate 31.

[0079] The reinforcing member 35 is located in the central portion 330 to increase the rigidity of the electronic device package 30. Typically, when an external force is applied to the electronic device package 30, the bending moment is greatest near the center of the package. Therefore, when an external force or impact is applied to the electronic device package 30, cracks may be relatively more likely to occur in the central portion 330, and the central portion 330 is relatively more susceptible to bending forces. The reinforcing member 35 can be located in the central portion 330 to improve the overall bending strength of the electronic device package 30 and prevent damage or breakage of the package 30 even when a large force or impact is applied.

[0080] The connection terminal 34 can be a solder ball or a bump. The electronic device package 30 can be connected to the corresponding connection terminal of the flexible printed circuit film 20 via the connection terminal 34.

[0081] The reinforcing member 35 can be positioned to cover the second component 32b and overlap it in the center portion 330. Because the gap g2 between the second component 32b and the upper surface of the encapsulation member 33 is relatively large (e.g., relatively large compared to the gap g1 between the first component 32a and the upper surface of the encapsulation member 33), sufficient space for the arrangement of the reinforcing member 35 can be obtained between the second component 32b and the upper surface of the encapsulation member 33, and it is not necessary to increase the height h0 of the encapsulation member 33 to arrange the reinforcing member 35 on top of the second component 32b. The height of the reinforcing member 35 can be between a first height h1 and a second height h2, that is, it can be lower than the height of the first component 32a and higher than the height of the second component 32b. Therefore, it is possible to increase the rigidity, bending characteristics, and impact resistance of the electronic device package 30 without increasing the height or thickness of the electronic device package 30 or changing the size or appearance of the electronic device package 30. According to some embodiments, the reinforcing member 35 can have a height equal to the height of the first component 32a. However, since the height of the reinforcing member 35 can be lower than the upper surface of the encapsulation member (or encapsulation material) 33 used to cover the first component 32a, the reinforcing member 35 can avoid increasing the total height of the electronic device package 30.

[0082] The reinforcing member 35 may have a relatively high modulus (or elastic modulus), for example, about 100 GPa or greater, to increase the rigidity of the electronic device package 30. The reinforcing member 35 may be made of metal or a metal alloy such as stainless steel (also known as SUS) or Ivar. The reinforcing member 35 may be a metal sheet, or may have a bent metal sheet (referred to as a metal can), such as a shielding housing. The reinforcing member 35 may cover the upper surface of the second component 32b and surround at least a portion of the side surface of the second component 32b. The reinforcing member 35 may be connected to a grounding pad Pg on the substrate 31 to connect to the ground wire GND of the substrate 31. Therefore, according to some embodiments, the reinforcing member 35 can be used as a shielding member to protect the second component 32b from electromagnetic interference. The reinforcing member 35 may be made of ceramic materials or polymers such as polyimide or polyethylene terephthalate.

[0083] Reference Figure 3A and Figure 3BThe data on the left side of each figure shows the results of a bending test on a typical electronic device package without the reinforcing member 35, while the data on the right side shows the results of a bending test on an electronic device package 30 including a reinforcing member 35 formed of 0.1 mm thick stainless steel, as described in the above embodiment. The electronic device package of the comparative example and the electronic device package 30 of this example differ only in the presence or absence of the reinforcing member 35, and are identical in appearance and size. It can be seen that by arranging the reinforcing member 35 in the center of the electronic device package 30, the bending force is increased by approximately 13% under compressive load and by approximately 6% under tensile load.

[0084] Figures 4 to 6 A method for manufacturing an electronic device package according to some embodiments is shown. Figures 4 to 6 It shows the manufacturing process as follows Figure 2 An example of an electronic device package 30 is shown.

[0085] Reference Figure 4 The base 31 includes a first side region 311, a second side region 312, and a central region 313 located between the first side region 311 and the second side region 312. A pad Pa for mounting a first component 32a with a higher height is located in the first side region 311 and the second side region 312, and a pad Pb for mounting a second component 32b with a lower height is located in the central region 313. A pad Pc for mounting a reinforcing member 35 may be located at the edge of the central region 313. At least one of the pads Pc may be connected to the ground wire GND. Although the second side region 312 is shown as wider than the first side region 311, the areas of the two side regions 311 and 312 may be substantially the same, or the first side region 311 may be wider.

[0086] Reference Figure 5 The first component 32a is positioned on the corresponding pad Pa of the first side region 311 and the second side region 312, and the second component 32b is positioned on the corresponding pad Pb of the central region 313.

[0087] Reference Figure 6 A reinforcing member 35, in the form of a metal can, is formed such that its side is positioned on the pad Pc while covering the second component 32b. A reflow process can be performed to bond and attach the first component 32a, the second component 32b, and the reinforcing member 35 to the corresponding pads Pa, Pb, and Pc on the substrate 31. The encapsulation member 33 can then be formed by arranging components 32a and 32b and the reinforcing member 35 bonded to the substrate 31 thereto and adding a sealant (such as an epoxy molding compound) to a mold for curing. The reinforcing member 35 may have gaps in at least its sides to allow sealant to fill or penetrate into the space between the reinforcing member 35 and the second component 32b.

[0088] In this way, it is possible to manufacture an electronic device package 30 in which the reinforcing member 35 is located in the central portion 330 without increasing the thickness of the electronic device package 30. Therefore, the rigidity of the electronic device package 30 can be increased without interfering with the design and arrangement of devices located inside the electronic device. The second component 32b, which may include an integrated circuit, is covered by the grounded reinforcing member 35 and is therefore protected from electromagnetic interference.

[0089] The following description will focus on some embodiments that differ from the embodiments described above.

[0090] Figure 7 A schematic cross-sectional view of an electronic device package according to some embodiments is shown.

[0091] Reference Figure 7 The electronic device package 30 may further include a shielding layer 37. The shielding layer 37 may cover the surface of the package member 33 and the exposed (i.e., uncovered) side surfaces of the substrate 31. The shielding layer 37 may include at least one metal layer. The shielding layer 37 may be connected to the ground line GND of the substrate 31. The shielding layer 37 may protect components 32a and 32b inside the electronic device package 30 from electromagnetic interference. The shielding layer 37 may be formed by sputtering. The second component 32b may be double shielded by the shielding layer 37 and the reinforcing member 35.

[0092] Figure 8 A schematic top plan view of a display device according to some embodiments is shown.

[0093] Because it has already been referenced Figure 1 The overall structure of the display device has been described in detail, so it will be briefly described here.

[0094] The display device includes a display panel 10, which includes a display area DA and a non-display area NA. Pixels PX are located in the display area DA, which corresponds to the screen. A pad PP1 can be positioned in the non-display area NA. A pad PP2, which may include a flexible printed circuit film 20 comprising a body 21, a neck 22, and a tail 23, can be bonded to the pad PP1. The display panel 10 may include a touch sensor layer comprising touch electrodes for sensing touch, and the touch electrodes can be positioned in the display area DA.

[0095] The driving unit, which may include a gate driver, a data driver, and a signal controller, may be located in the non-display area NA or on the flexible printed circuit film 20. The gate driver may be integrated as a driving circuit in the non-display area NA. The data driver and signal controller may be configured as integrated circuits and may be included in an electronics package 30. The electronics package 30 may be positioned on the body 21 of the flexible printed circuit film 20. According to some embodiments, two electronics packages 30 are positioned, one of which may be used to drive the pixels PX of the display panel 10, and the other may be used to drive the touch electrodes of the touch sensor layer. The electronics package 30 may be positioned in the non-display area NA (e.g., positioned between the display area NA and the pad PP1).

[0096] Figure 9 A schematic perspective view of an electronic device package according to some embodiments is shown, and Figure 10 The following is illustrated according to some embodiments. Figure 9 A cross-sectional view of an electronic device package taken along line B-B'. Figure 11 It shows the manufacturing process. Figure 9 The image shows a cross-sectional view of the mold for an electronic device package.

[0097] Figure 9 and Figure 10 They respectively show the location at Figure 8 The electronic device package 30 is mounted on the body 21 of the flexible printed circuit film 20. The electronic device package 30 can be a system-in-package (SiP).

[0098] The electronic device package 30 may include a substrate 31 and components 32a and 32b (such as integrated circuits, capacitors, resistors, and inductors) located on the substrate 31. The number of components 32a and 32b may vary depending on the design and may be about 10 or more, for example, about 30 to about 60. The substrate 31 may be a printed circuit board or a wiring board. The electronic device package 30 may include a package member 33 covering the components 32a and 32b. The electronic device package 30 may include connection terminals 34 positioned on the lower surface of the substrate 31. The connection terminals 34 may be solder balls or bumps. The electronic device package 30 may be connected to corresponding connection terminals of the flexible printed circuit film 20 via the connection terminals 34. The electronic device package 30 may be mounted on the flexible printed circuit film 20 such that the electronic device package 30 and the flexible printed circuit film 20 can be configured as an electronic component assembly.

[0099] Components 32a and 32b constituting the electronic device package 30 can have various heights, but to avoid complexity, only two components 32a and 32b described herein are shown. The electronic device package 30 may include a relatively tall first component 32a and a relatively low second component 32b. For example, the first component 32a may be taller than about 0.2 mm and may have a height of up to about 0.6 mm, and the second component 32b may have a height of up to about 0.2 mm. When the electronic device package 30 is divided into two parts, the first component 32a may be positioned on a first side of the electronic device package 30, and the second component 32b may be positioned on a second side of the electronic device package 30. The first component 32a may primarily be a large-capacity capacitor, a high-value resistor, or an integrated circuit, and the second component 32b may primarily be a small-capacity capacitor or a low-value resistor. Electrodes connected to pads on the substrate 31 may be positioned on opposite sides of the first component 32a and the second component 32b. Opposite portions are shown as being taller than intermediate portions, but may be the same height, and the intermediate portions may be taller. The shapes of the first component 32a and the second component 32b shown are merely examples, and the electronic device package 30 may include the first component 32a and the second component 32b having various shapes.

[0100] The height of the electronic device package 30, corresponding to the distance between the lower surface of the connecting terminal 34 and the upper surface of the package member 33, can be determined by the highest component 32a among components 32a and 32b. Typically, the package member 33 of the electronic device package 30 can be formed with a flat or planar top surface and a substantially rectangular cross-section, while covering the highest component 32a, regardless of the heights of components 32a and 32b. Therefore, the heights of the electronic device packages 30 can be substantially the same regardless of their position. Conversely, the illustrated electronic device package 30 includes a first portion 30a and a second portion 30b with different heights. The first portion 30a of the electronic device package 30 has a first height h1, and the second portion 30b has a second height h2 that is lower than the first height h1. The electronic device package 30 can typically have a staircase-like shape.

[0101] The electronic device package 30 can be mounted on the flexible printed circuit film 20, such that the second part 30b is positioned closer to the pad PP2 than the first part 30a.

[0102] The first part 30a corresponds to the area where the first component 32a is located, and the second part 30b corresponds to the area where the second part 32b is located. The encapsulation member 33 is not formed with upper surfaces of the same height, but rather with a height difference between the first part 30a and the second part 30b. The thicknesses of the encapsulation member 33 positioned on the first component 32a and the encapsulation member 33 positioned on the second component 32b can be similar or substantially the same. A first component 32a and a second component 32b are shown, but among all components positioned on the substrate 31 in the electronic device package 30, a component with a height greater than a predetermined height (e.g., a set or predetermined height) can be positioned in the first part 30a, and a component with a height less than or equal to a predetermined height (e.g., a set or predetermined height) can be positioned in the second part 30b.

[0103] Reference Figure 11 An electronic device package 30 comprising a first part 30a and a second part 30b with different heights h1 and h2 can be manufactured using a mold MD with different heights depending on its position. For example, when manufacturing the electronic device package 30, components 32a and 32b can be positioned on a substrate 31 to be bonded to each other by reflow soldering, and then a package member 33 can be formed. The substrate 31 to which components 32a and 32b are bonded is located in a mold MD having an inner region with a first height h1 and an inner region with a second height h2 to form the package member 33. In this case, the first component 32a is located in the inner region with the first height h1, and the second component 32b is located in the inner region with the second height h2. Subsequently, a sealant (such as an epoxy molding compound) is added to the gate G of the mold MD and cured to form the package member 33. As a result, an electronic device package 30 having a first part 30a and a second part 30b with a second height h2 can be manufactured.

[0104] The following description will focus on some embodiments that differ from the embodiments described above.

[0105] Figure 12 , Figure 13 , Figure 14 , Figure 15 and Figure 16 A cross-sectional view of an electronic device package according to some embodiments is shown.

[0106] Reference Figure 12The electronic device package 30 may further include a shielding layer 37. The shielding layer 37 may cover the surface of the package member 33 and the exposed side surfaces of the substrate 31. The shielding layer 37 may include at least one metal layer. The shielding layer 37 may protect the components 32a and 32b inside the electronic device package 30 from electromagnetic interference. The shielding layer 37 may be formed by sputtering. The thickness t1 of the portion of the shielding layer 37 located on the side surface of the portion between the first portion 30a and the second portion 30b (i.e., the first portion 30a adjacent to the second portion 30b) may be smaller than the thickness of the portion of the shielding layer 37 located on the upper surface of the package member 33, and may be the same as or nearly the same as the thickness of the portion of the shielding layer 37 located on the side surface of the package member 33.

[0107] Reference Figure 13 The electronic device package 30 includes a third portion 30c between a first portion 30a having a first height h1 and a second portion 30b having a second height h2. In the third portion 30c, the portion adjacent to the first portion 30a has the first height h1, and the portion adjacent to the second portion 30b has the second height h2. In the third portion 30c, the thickness of the first portion 30a and the second portion 30b does not change abruptly, but gradually changes from the first height h1 to the second height h2. A second component 32b with a lower height can be primarily positioned in the third portion 30c. In the third portion 30c, the second component 32b can be positioned in the region adjacent to the second portion 30b, and a component with a height lower than the first component 32a and higher than the second component 32b can be positioned in the region adjacent to the first portion 30a. (The last sentence appears to be incomplete and possibly refers to a different package.) Figure 12 In the described embodiment, the surface between the first part 30a and the second part 30b is approximately perpendicular to the plane of the substrate 31. (The last sentence appears to be incomplete and possibly refers to a different embodiment.) Figure 13 In the described embodiment, the upper surface of the third portion 30c is an inclined surface relative to the plane of the substrate 31. The electronic device package 30 can be mounted on the flexible printed circuit film 20 such that the second portion 30b is positioned more adjacent to the pad portion PP2 compared to the first portion 30a.

[0108] Reference Figure 14 , showing that Figure 13 The electronic device package 30 shown also includes an embodiment of a shielding layer 37. The shielding layer 37 may cover the surface of the package member 33 and the side surface of the substrate 31. The shielding layer 37 may be a metal layer formed by sputtering. The thickness t2 of the portion of the shielding layer 37 positioned in the third portion 30c may be greater than the thickness of the portion of the shielding layer 37 positioned on the side surface of the package member 33, and may be equal to or approximately equal to the thickness of the portions of the shielding layer 37 positioned in the first portion 30a and the second portion 30b. Therefore, the shielding layer 37 may be greater than the thickness of the portion of the shielding layer 37 positioned relative to the side surface of the package member 33. Figure 12The shielding layer 37 of the described embodiment is thick and can enable it to be protected from electromagnetic interference.

[0109] Reference Figure 15 The electronic device package 30 includes a first portion 30a having a first height h1, a second portion 30b having a second height h2, and a third portion 30c having a third height h3 between the first portion 30a and the second portion 30b. The third height h3 is lower than the first height h1 and higher than the second height h2. In the third portion 30c, a third component 32c having a height lower than the height of the first component 32a and higher than the height of the second component 32b can be positioned. For example, the third component 32c can have a height greater than about 0.2 mm and less than about 0.4 mm. As described above, the electronic device package 30 can include three portions 30a, 30b, and 30c with different heights, and can include three or more portions. The electronic device package 30 can also include a shielding layer that at least covers the surface of the package member 33 and the side surface of the substrate 31. In the electronic device package 30, the second portion 30b, having the lowest height, can be mounted on the flexible printed circuit film 20 adjacent to the pad portion PP2.

[0110] Reference Figure 16 The electronic device package 30 includes a first portion 30a having a first height h1 and a second portion 30b having a variable height. In the second portion 30b, its first end adjacent to the first portion 30a has the first height h1, and its second end (the second end corresponding to the side portion of the electronic device package 30) has a second height h2. The upper surface of the first portion 30a is substantially parallel to the plane of the substrate 31, but the upper surface of the second portion 30b may be an inclined surface relative to the plane of the substrate 31.

[0111] A first component 32a with a higher height can be primarily positioned within a first portion 30a, and a second component 32b with a lower height can be primarily positioned within a second portion 30b. Components that are lower than the first component 32a and higher than the second component 32b can be positioned within the second portion 30b in a region adjacent to the first portion 30a. The electronic device package 30 may also include a shielding layer that at least covers the surface of the package member 33 and the side surfaces of the substrate 31. In the electronic device package 30, the second portion 30b can be mounted on the flexible printed circuit film 20 adjacent to the pad portion PP2.

[0112] Figure 17 The process of bonding a flexible printed circuit film 20, on which electronic component packages 30 are mounted, to a display panel 10, according to a comparative example, is illustrated schematically. Figure 18 and Figure 19The process of bonding a flexible printed circuit film 20 on which an electronic device package 30 is mounted to a display panel 10 is illustrated schematically according to an example.

[0113] Reference Figure 17 An electronic device package 30, having a substantially cuboid shape, is mounted on a flexible printed circuit film 20, the cuboid shape having a completely constant first height h1. An anisotropic conductive film can be located between a pad PP1 of the display panel 10 and a pad PP2 of the flexible printed circuit film 20, and the pads PP1 and PP2 can then be bonded using a bonding machine to electrically connect the pads P1 of the pads PP1 and P2 of the pads PP2. A hot-pressing process can be performed on the compression area of ​​the flexible printed circuit film 20 (the compression area corresponding to the pad PP2) using the bonding head BH of the bonding machine during bonding. In this case, a buffer member BF formed of an elastic material such as rubber can be used to prevent the flexible printed circuit film 20 from being damaged by the bonding head BH. The buffer member BF can be located between the bonding head BH and the flexible printed circuit film 20 so that the bonding head BH does not directly contact the flexible printed circuit film 20 and can protect the flexible printed circuit film 20 from the influence of the bonding head BH.

[0114] The electronic device package 30 needs to be positioned at at least a minimum distance dr from the pad PP2 to avoid interference between the buffer member BF and the electronic device package 30 during the bonding process. That is, the bonding process can be performed without issue only when the distance between the pad PP2 and the electronic device package 30 is the minimum distance dr or greater. The minimum distance dr used to avoid interference between the buffer member BF and the electronic device package 30 may be affected by the angle α of the buffer member BF and the height h1 of the electronic device package 30; however, the angle α of the buffer member BF can be used as a factor affecting process quality, which may be difficult to change.

[0115] Reference Figure 18 This shows that Figure 10 The process shown illustrates the bonding of the flexible printed circuit film 20, on which the electronic device package 30 is mounted, to the display panel 10. In the electronic device package 30, the second portion 30b, having a second height h2, is positioned closer to the pad portion PP2 than the first portion 30a, having a first height h1. Therefore, even when the electronic device package 30 is positioned closer to the pad portion PP2 than the first portion 30a, which has a first height h1... Figure 17 In the comparative example, when the electronic device package 30 is close to the pad PP2, interference with the buffer member BF can also be avoided. That is, the minimum distance d1 between the pad PP2 and the electronic device package 30 can be reduced compared to the minimum distance dr in the comparative example. The difference between the minimum distance dr and the minimum distance d1 can be similar to or substantially the same as the width of the second part 30b.

[0116] In this way, the size of the main body 21 of the flexible printed circuit film 20 can be reduced, and the utilization rate of the internal space of the electronic device can be increased by arranging the electronic device package 30 closer to the pad PP2. Furthermore, because the length of the wiring connecting the pad PP2 and the electronic device package 30 can be reduced, the quality of the signal output from the electronic device package 30 and transmitted to the display panel 10 can be improved. Additionally, because the area of ​​the main body 21 of the flexible printed circuit film 20 is reduced, the manufacturing cost of the flexible printed circuit film 20 can be lowered.

[0117] Reference Figure 19 This shows that Figure 16 The process shown describes the bonding of the flexible printed circuit film 20, on which the electronic device package 30 is mounted, to the display panel 10. In the electronic device package 30, a second portion 30b, having a height between a first height h1 and a second height h2 and an inclined surface, is positioned closer to the pad portion PP2 than the first portion 30a, which has a first height h1. Therefore, even when the electronic device package 30 is positioned closer to the pad portion PP2 than the first portion 30a, the process is still possible. Figure 17 In the comparative example, when the electronic device package 30 is close to the pad PP2, interference with the buffer member BF can also be avoided. That is, the minimum distance d2 between the pad PP2 and the electronic device package 30 can be reduced compared to the minimum distance dr in the comparative example. The difference between the minimum distance dr and the minimum distance d2 can be similar to or substantially the same as the width of the second part 30b. The angle of the inclined surface of the second part 30b relative to the plane of the flexible printed circuit film 20 can be the same as or substantially equal to the angle α of the buffer member BF relative to the flexible printed circuit film 20.

[0118] At the same time, even if it is installed on it Figure 13 The flexible printed circuit film 20 of the electronic device package 30 shown herein, or on which is mounted a flexible printed circuit film 20 or thereon. Figure 15 When the flexible printed circuit film 20 of the electronic device package 30 shown is bonded to the display panel 10, the minimum distance between the pad PP2 and the electronic device package 30 can also be reduced compared to the minimum distance dr in the comparative example.

[0119] Based on the display area DA reference Figure 20 A more detailed description may be included of the construction of the display panel 10 in a display device according to some embodiments.

[0120] Figure 20 A schematic cross-sectional view of a stacked structure of display panels according to some embodiments is shown. Figure 20 The cross-section shown can correspond to an approximate pixel region.

[0121] The display panel 10 basically includes a substrate SB, a transistor TR formed on the substrate SB, and light-emitting diodes (LEDs) connected to the transistor TR.

[0122] The substrate SB can be made of an insulating material such as glass or plastic. When the substrate SB is a plastic substrate, it may include a barrier layer to prevent moisture, oxygen, etc., from penetrating from the outside.

[0123] The buffer layer BL can be located on the substrate SB. The buffer layer BL can include inorganic insulating materials such as silicon oxide and silicon nitride.

[0124] The semiconductor layer AL of the transistor TR may be located on the buffer layer BL, and the first insulating layer IN1 may be located on the semiconductor layer AL. The semiconductor layer AL may include source and drain regions and channel regions between these regions. The semiconductor layer AL may include semiconductor materials such as polycrystalline silicon, oxide semiconductors, and amorphous silicon.

[0125] The first conductor of the first electrode C1, which may include the gate electrode GE of the transistor TR, the gate line GL, and the capacitor CS, may be located on the first insulating layer IN1.

[0126] The second insulating layer IN2 may be located on the first conductor. A second conductor, including the second electrode C2 of a capacitor CS, may be located on the second insulating layer IN2. The first and / or second conductors may include metals such as molybdenum (Mo), copper (Cu), aluminum (Al), silver (Ag), chromium (Cr), tantalum (Ta), titanium (Ti), or alloys thereof.

[0127] The third insulating layer IN3 may be located on the second insulating layer IN2 and the second conductor. The first insulating layer IN1, the second insulating layer IN2 and / or the third insulating layer IN3 may include inorganic insulating materials.

[0128] A third conductor, including the source electrode SE and drain electrode DE of transistor TR, data line DL, etc., can be positioned on the third insulating layer IN3. The source electrode SE and drain electrode DE can be connected to the source and drain regions of semiconductor layer AL through openings in insulating layers IN1, IN2, and IN3, respectively.

[0129] The fourth insulating layer IN4 may be located on the third conductor. A fourth conductor, which may include a drive voltage line DVL, may be positioned on the fourth insulating layer IN4. The third and / or fourth conductors are made of a metal or metal alloy such as aluminum (Al), copper (Cu), silver (Ag), molybdenum (Mo), chromium (Cr), gold (Au), platinum (Pt), palladium (Pd), tantalum (Ta), tungsten (W), titanium (Ti), or nickel (Ni).

[0130] The fifth insulating layer IN5 may be located on the fourth conductor. The fourth insulating layer IN4 and / or the fifth insulating layer IN5 may include organic insulating material.

[0131] The first electrode E1 of the light-emitting diode (LED) is located on the fifth insulating layer IN5. The first electrode E1 can be referred to as the pixel electrode. The first electrode E1 can be connected to the drain electrode DE or the source electrode SE through openings in the insulating layers IN4 and IN5 to receive signals used to control the brightness of the LED. The transistor TR connected to the first electrode E1 can be a driving transistor or a transistor electrically connected to the driving transistor.

[0132] A sixth insulating layer IN6 may be located on top of a fifth insulating layer IN5. The sixth insulating layer IN6 may be referred to as a pixel defining layer and may have an opening superimposed on the first electrode E1. An emitting member EM, including an emitting layer, may be positioned above the first electrode E1 within the opening of the sixth insulating layer IN6, and a second electrode E2 may be positioned on the emitting member EM. The second electrode E2 may be referred to as a common electrode.

[0133] The first electrode E1, the emitting component EM, and the second electrode E2 can constitute a light-emitting diode (LED), which can be an organic light-emitting diode. The first electrode E1 and the second electrode E2 can be used as the anode and cathode of the LED, respectively.

[0134] The encapsulation layer EC can be located on the second electrode E2. The encapsulation layer EC can encapsulate the light-emitting diode (LED) to prevent moisture or oxygen from penetrating from the outside. The encapsulation layer EC can be a thin-film encapsulation layer comprising one or more inorganic material layers and one or more organic material layers.

[0135] The touch sensor layer, including the touch electrode TE, can be located on the encapsulation layer EC. The touch electrode TE can have a grid shape with openings that overlap with the light-emitting diode (LED). A buffer layer can be located between the encapsulation layer EC and the touch sensor layer. A seventh insulating layer IN7 covering the touch electrode TE can be located on the touch sensor layer.

[0136] The location and arrangement of the above devices can be changed in various ways according to the design.

[0137] While the inventive concept has been described in conjunction with what is now considered to be practical embodiments, it will be understood that the inventive concept is not limited to the disclosed embodiments, but rather is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims and their equivalents.

Claims

1. An electronic device package, the electronic device package comprising: The base includes a central region and a first side region and a second side region located on opposite sides of the central region; A first component is located in the first side region or the second side region, and the first component has a first height above the surface of the substrate; A second component, located in the central region, has a second height above the surface of the substrate that is lower than the first height; A reinforcing member, located in the central region and stacked with the second component, has a third height above the surface of the substrate, the third height being lower than the first height and higher than the second height; as well as An encapsulation component that covers the first component and the second component.

2. The electronic device package according to claim 1, wherein, The reinforcing member is covered by the encapsulating member.

3. The electronic device package according to claim 2, wherein, The base includes a grounding pad, and the reinforcing member is connected to the grounding pad.

4. The electronic device package according to claim 1, wherein, The reinforcing member covers the upper surface of the second component and surrounds at least a portion of the side surface of the second component.

5. The electronic device package according to claim 4, wherein, The reinforcing member has a shape in which the metal plate is bent.

6. The electronic device package according to claim 1, wherein, The encapsulation member has a fourth height at a first portion covering the first component and a fifth height at a second portion covering the second component, wherein the fourth height and the fifth height are the same.

7. The electronic device package according to claim 1, wherein, The reinforcing member has a modulus of 100 GPa or greater.

8. The electronic device package according to claim 7, wherein, The reinforcing member is made of stainless steel.

9. A display device, the display device comprising: Display panel; A flexible printed circuit film is located on the display panel; as well as Electronic device packages are located on the flexible printed circuit film. The electronic device package includes: The base includes a central region and a first side region and a second side region located on opposite sides of the central region; A first component is located in the first side region or the second side region, and the first component has a first height above the surface of the substrate; A second component, located in the central region, has a second height above the surface of the substrate that is lower than the first height; A reinforcing member, located in the central region and stacked with the second component, having a third height above the surface of the substrate, the third height being lower than the first height and higher than the second height; and An encapsulation component that covers the first component and the second component.

10. The display device according to claim 9, wherein, The reinforcing member is covered by the encapsulating member.

11. The display device according to claim 10, wherein, The base includes a grounding pad, and the reinforcing member is connected to the grounding pad.

12. The display device according to claim 9, wherein, The reinforcing member covers the upper surface of the second component and surrounds at least a portion of the side surface of the second component.

13. A display device, the display device comprising: Display panel, including a first pad; A flexible printed circuit film, including a second pad portion bonded to the first pad portion; as well as Electronic device packages are located on the flexible printed circuit film. The electronic device package includes a first portion having a first height and a second portion having a second height lower than the first height, wherein the second portion is closer to the second pad portion than the first portion. The electronic device package includes a substrate and a first component and a second component located on the substrate, wherein the first component is located at the first part, the second component is located at the second part, and the height of the second component is lower than the height of the first component.

14. The display device according to claim 13, wherein, The second component has a height of 0.2 mm or less.

15. The display device according to claim 14, wherein, The electronic device package further includes a packaging member covering the first component and the second component, and The height of the encapsulation member in the second part is lower than the height of the encapsulation member in the first part.

16. The display device according to claim 15, wherein, The electronic device package also includes a shielding layer covering the package component.

17. The display device according to claim 13, wherein, The electronic device package further includes a third portion between the first portion and the second portion, and As the third part moves from the first part to the second part, the third part gradually changes from the first height to the second height.

18. The display device according to claim 17, wherein, The upper surface of the third part is an inclined surface relative to the plane of the base.

19. The display device according to claim 13, wherein, The electronic device package further includes a third portion, which has a third height between the first portion and the second portion, and The third height is lower than the first height and higher than the second height.

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