Heat dissipation device

Abstract

A heat dissipation device is disclosed, which can be applied to electronic devices to absorb the heat generated by the electronic devices. The invention mainly involves filling the heat dissipation device with a thermally conductive fluid, which is a mixture of two immiscible liquids. When the thermally conductive fluid comes into contact with the heat source of the electronic device, the thermally conductive fluid will continuously generate a phase change cycle to quickly dissipate heat from the electronic device. The phase change cycle can accelerate the circulation of the thermally conductive fluid, thereby accelerating the heat dissipation effect of the heat dissipation device on the electronic device and achieving an excellent heat dissipation effect.

Description

Technical Field

[0001] A heat dissipation device, more particularly a heat dissipation device that utilizes the phase change of mixing two immiscible solutions to dissipate heat from an electronic device. Background Technology

[0002] Electronic devices, such as mobile phones, are indispensable in people's lives. To facilitate portability and use, these devices are becoming increasingly thinner, lighter, and more versatile. However, due to the increased density and frequency of electronic components, prolonged use can lead to localized overheating. The chips in these devices are typically the primary heat source during operation. Heat dissipation is crucial not only to lower the chip's temperature to ensure normal operation within the required temperature range but also to prevent localized overheating of the casing, which could negatively impact the user experience. Current heat dissipation methods primarily utilize simple openings, heat conduction, heat convection, or heat pipes. However, these methods are insufficient to handle the heat generated by today's high-performance chips and cannot effectively dissipate heat in thin and light electronic devices. This results in overheating problems, as heat cannot be evenly distributed, reducing the device's internal heat dissipation efficiency and leading to issues such as reduced clock speeds, slow performance, or even crashes. Therefore, effectively dissipating heat in increasingly thinner and more sophisticated electronic devices remains a critical challenge. Summary of the Invention

[0003] In view of the above problems, based on years of experience in related industries, the inventor has researched and improved the structure and operating principle of the heat dissipation device. Therefore, the main objective of this invention is to provide a heat dissipation device that uses a mixture of two immiscible liquids as a heat-conducting fluid to dissipate heat from electronic devices through a phase change generated by the heat-conducting fluid.

[0004] To achieve the above objectives, the heat dissipation device of the present invention mainly consists of a thin first sheet and a second sheet. After the two sheets are assembled, an accommodating space is formed inside, and a heat-conducting fluid is filled in the accommodating space. The heat-conducting fluid is a mixture of two immiscible liquids. When the heat dissipation device is close to the heat source of the electronic device, the heat-conducting fluid will gradually undergo a phase change, and the phase change will drive the heat-conducting fluid to circulate rapidly and continuously, so as to dissipate heat from the electronic device through the phase change.

[0005] The present invention provides a heat dissipation device, which can be disposed on a heat source of an electronic device, comprising:

[0006] The first piece of the body;

[0007] A second piece is joined to the periphery of the first piece, and after the joining is completed, an accommodating space is formed between the first piece and the second piece;

[0008] A thermally conductive fluid is filled within the accommodating space. The thermally conductive fluid is a mixture of a first fluid and a second fluid, wherein the first fluid and the second fluid are immiscible liquids.

[0009] After absorbing the heat source, the heat-conducting fluid can undergo a phase change. The first fluid and the second fluid can flow and push against each other through the phase change, so as to dissipate the heat generated by the heat source through heat conduction.

[0010] Furthermore, the periphery of the first piece and the second piece are bonded together by ultrasonic welding or bonding.

[0011] Furthermore, the specific gravity or density of the first fluid is greater than that of the second fluid.

[0012] Furthermore, the first fluid is a mixture of an alcoholic liquid and water.

[0013] Furthermore, the second fluid is a fluorinated liquid.

[0014] Furthermore, the heat-conducting fluid occupies 50% to 95% of the volume of the accommodating space.

[0015] Furthermore, the accommodating space is formed with multiple protrusions.

[0016] Furthermore, the accommodating space is formed with multiple radially arranged ribs.

[0017] Furthermore, a first retaining wall and a second retaining wall are formed within the accommodating space.

[0018] Furthermore, a flow guide is formed within the accommodating space, and the flow guide is formed with a first outlet and a second outlet. The first outlet and the second outlet can be used to form a thermal circulation path for the heat-conducting fluid after the phase change reaction.

[0019] Furthermore, the first outlet gradually narrows from bottom to top, while the second outlet gradually narrows from top to bottom.

[0020] To provide a clear understanding of the purpose, technical features, and effects of this invention, the following description is provided in conjunction with the accompanying drawings. Please refer to the drawings for further information. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the architecture of the present invention (I);

[0022] Figure 2 This is a schematic diagram of the architecture of the present invention (II);

[0023] Figure 3 This is a schematic diagram (one) illustrating an embodiment of the present invention;

[0024] Figure 4 This is a schematic diagram (II) illustrating an embodiment of the present invention;

[0025] Figure 5 This is a schematic diagram (iii) illustrating an embodiment of the present invention.

[0026] Figure 6 This is another embodiment (a) of the present invention;

[0027] Figure 7 This is a schematic diagram illustrating the implementation of Example (I);

[0028] Figure 8 This is a temperature distribution diagram for Example (I).

[0029] Figure 9 This is another embodiment (II) of the present invention;

[0030] Figure 10 This is a schematic diagram illustrating the implementation of Example (II);

[0031] Figure 11 This is a temperature distribution diagram for Example (II);

[0032] Figure 12 This is another embodiment (iii) of the present invention;

[0033] Figure 13 This is a schematic diagram illustrating the implementation of Example (III);

[0034] Figure 14 This is a temperature distribution diagram for Example (III);

[0035] Figure 15 This is another embodiment (four) of the present invention;

[0036] Figure 16 This is a schematic diagram of the implementation of Example (IV).

[0037] Explanation of reference numerals in the attached figures

[0038] 10. Heat dissipation device

[0039] 101 First Piece

[0040] 102 Second piece

[0041] 104 Thermal Conductive Fluid

[0042] 1041 First Fluid

[0043] 1042 Second Fluid

[0044] 1042A Second Fluid

[0045] 103 Storage space

[0046] 1031 First temperature change region

[0047] 1032 Second temperature change region

[0048] 105 bumps

[0049] 106 First Retaining Wall

[0050] 107 Second Retaining Wall

[0051] 108 protruding ribs

[0052] 109 Airflow Guide

[0053] 1091 First Exit

[0054] 1092 Second Exit

[0055] 11 Electronic devices

[0056] Direction A Direction B

[0057] H. Heat source. Detailed Implementation

[0058] Please see Figure 1 The figure shows a schematic diagram of the structure of the present invention (I). The heat dissipation device 10 shown in the figure mainly consists of a first plate 101 and a second plate 102. The first plate 101 and the second plate 102 are made of thin metal materials, such as copper or aluminum, which have good ductility. The peripheries of the first plate 101 and the second plate 102 are bonded together by means such as ultrasonic welding or bonding, so that the peripheries of the first plate 101 and the second plate 102 can fit tightly together. Please refer to the accompanying documentation. Figure 2 The figure shows a schematic diagram of the architecture of the present invention (II). Figure 1The first sheet 101 and the second sheet 102, after assembly, form a receiving space 103, which is filled with a heat-conducting fluid 104. The heat-conducting fluid 104 occupies 50% to 95% of the volume of the receiving space 103, preferably 50%. The heat-conducting fluid 104 is a mixture of two immiscible fluids, a first fluid 1041 and a second fluid 1042, which have different specific gravities and densities. The first fluid 1041 may be, for example, composed of... The heat-conducting fluid 1044 is formed by mixing an alcoholic liquid with water, such as ethylene glycol. The first fluid 1041 is a mixture of ethylene glycol and water in a 1:1 ratio. The second fluid 1042 can be, for example, a fluorinated liquid, such as FC-72. After mixing, as shown in the figure, the heavier second fluid 1042 sinks below the first fluid 1041 under normal conditions, resulting in two overlapping liquid layers in the heat-conducting fluid 104. The first fluid 1041 and the second fluid 1042 have different boiling points. When the proportion of low-boiling-point liquid in the heat-conducting fluid 104 is 50% or higher, the boiling effect can be advanced to the boiling temperature of the low-boiling-point, highly volatile liquid. When the proportion of low-boiling-point liquid in the heat-conducting fluid 104 is 5-50%, the boiling reaction of the high-boiling-point liquid can be advanced, while simultaneously improving the heat flux performance in the convection effect of the low-boiling-point liquid.

[0059] Please see Figure 3 The figure shows a schematic diagram of an embodiment of the present invention (I), please refer to it in conjunction with the following. Figure 1 In practice, the heat dissipation device 10 can be pre-placed close to the heat source H of an electronic device 11, so that the heat-conducting fluid 104 inside the heat dissipation device 10 is close to the heat source H. When the electronic device 11 generates the heat source H due to operation, the first plate 101 and the second plate 102 of the heat dissipation device 10 will conduct the heat energy of the heat source H. As the temperature of the heat source H gradually increases, the heat source H will heat the heat-conducting fluid 104 in the accommodating space 103, causing the heat-conducting fluid 104 to undergo a further phase change reaction. As shown in the figure, the heat source H corresponds to the second fluid 1042 of the heat-conducting fluid 104, and the accommodating space 103... The space 103 forms a first temperature change region 1031 and a second temperature change region 1032 due to changes in heat conduction. Under normal conditions, the first temperature change region 1031 is adjacent to the heat source H, therefore its temperature is higher than that of the second temperature change region 1032. After contacting the heat source H, the first temperature change region 1031, through heat conduction, allows the second fluid 1042 of the heat-conducting fluid 104 to absorb the heat energy from the heat source H and undergo a phase change reaction, transforming the second fluid 1042 from a liquid state to a gaseous state, 1042A. (See also...) Figure 4The figure shows a schematic diagram of the second embodiment of the present invention. Through the principle of natural convection, the gaseous second fluid 1042A is pushed upwards by the first fluid 1041, allowing the gaseous second fluid 1042A to be rapidly conducted into the second temperature change region 1032. Please refer to the accompanying documentation. Figure 5 The figure shows a schematic diagram of an embodiment of the present invention (III). Since the temperature of the second temperature change region 1032 is relatively lower than that of the first temperature change region 1031, the second fluid 1042A will undergo a phase change reaction due to the temperature change after rising to the second temperature change region 1032. The gaseous second fluid 1042A will condense again into a liquid second fluid 1042 at the top of the heat dissipation device 10. The condensed liquid second fluid 1042 will fall back into the first fluid 1041. Since the density and specific gravity of the liquid second fluid 1042 are greater than those of the first fluid 1041, the liquid second fluid 1042 will pass through the first fluid 1041 layer and merge into the second fluid 1042 layer, and absorb the heat source H again. This cycle repeats (the cycle path is the phase change cycle path shown in the figure) for heat conduction. As described above, after the second fluid 1042 undergoes a phase change, the gaseous second fluid 1042A will rise further to the top of the accommodating space 103. Due to the volume loss of the second fluid 1042 after vaporization, the first fluid 1041 will be forced to flow downward to fill the volume area lost by the vaporization and dissipation of the second fluid 1042. However, after the second fluid 1042 condenses into a liquid, because its specific gravity is greater than that of the first fluid 1041, when the liquid second fluid 1042 flows downward through the first fluid 1041 layer and returns to the second fluid 1042 layer, since the second fluid 1042 layer has already filled the first fluid 1041, when the second fluid 1042 returns to its original position, it can force the first fluid 1041 to flow upward, so that the first fluid 1041 has the effect of flowing downward without being affected by gravity. Please refer to the following for further information. Figure 1 During the circulation of the heat-conducting fluid 104, the heat-conducting fluid 104 continuously dissipates heat energy to the outside of the first plate 101 and the second plate 102 of the heat dissipation device 10, thereby rapidly reducing the temperature of the heat source H. The present invention can be customized for different types of electronic devices, and the overall appearance can be molded into a thin shape to provide better heat dissipation effect.

[0060] Please see Figure 6 The figure shows another embodiment (one) of the present invention, please refer to it in conjunction with the following. Figure 1 The present invention may further include a plurality of protrusions 105 formed within the accommodating space 103. These protrusions 105 may be pre-formed onto the inner surface of the first sheet 101 or the second sheet 102 by dispensing adhesive. Please refer to the accompanying documentation for further details. Figure 7The figure shows a schematic diagram of embodiment (I). When the second fluid 1042 is heated and changes from a liquid state to a gaseous state, the second fluid 1042A rises and gradually condenses and adheres to each protrusion 105, and then gradually forms a liquid and falls down. The distribution of each protrusion 105 can effectively increase the circulation efficiency of the heat-conducting fluid 104 in undergoing phase change. The heat source distribution diagram of the actual operation of embodiment (I) is as follows. Figure 8 As shown in the figure, the temperature distribution diagram of embodiment (1) can be seen from the figure. It can be seen that the distribution of each protrusion 105 can effectively accelerate the efficiency of the phase change cycle of the heat-conducting fluid 104 and effectively and quickly dissipate heat from the electronic device.

[0061] Please see Figure 9 The figure shows another embodiment (II) of the present invention. As shown in the figure, the heat dissipation device 10 has a first baffle 106 and a second baffle 107 formed within its accommodating space 103. The first baffle 106 and the second baffle 107 can be formed, for example, by pre-forming the outer contours of the first baffle 106 and the second baffle 107 with a colloid, and then filling the accommodating space 103 outside the first baffle 106 and the second baffle 107 with a first fluid 1041 and a second fluid 1042. Please refer to the accompanying documentation. Figure 10 The figure shows a schematic diagram of embodiment (II). When the second fluid 1042 changes from a liquid state to a gaseous state and rises, it gradually condenses and adheres to the inner wall surfaces of the first baffle wall 106 and the second baffle wall 107, and then gradually forms a liquid and falls down. The formation of the first baffle wall 106 and the second baffle wall 107 can effectively increase the circulation efficiency of the heat-conducting fluid 104 in undergoing phase change. The heat source distribution diagram of the actual operation of embodiment (II) is as follows. Figure 11 As shown in the figure, the temperature distribution diagram of embodiment (II) shows that the formation of the first baffle 106 and the second baffle 107 can effectively accelerate the efficiency of the phase change cycle of the heat-conducting fluid 104 and effectively and quickly dissipate heat from the electronic device.

[0062] Please see Figure 12 The figure shows another embodiment (iii) of the present invention. As shown in the figure, the heat dissipation device 10 has a plurality of radially arranged ribs 108 formed within its accommodating space 103. The plurality of ribs 108 can be formed, for example, by pre-molding a colloid, while the heat-conducting fluid 104 further fills the accommodating space 103. Please refer to the accompanying references. Figure 13The figure shows a schematic diagram of embodiment (III). When the heat-conducting fluid 104 undergoes a phase change cycle, the second fluid 1042, which changes from a liquid state to a gaseous state, rises and gradually condenses, adhering to the outer surface of each rib 108 before gradually forming liquid and falling down. The formation of each rib 108 effectively increases the cycle efficiency of the heat-conducting fluid 104 in undergoing a phase change. The actual heat source distribution diagram of embodiment (III) is as follows. Figure 14 As shown in the figure, the temperature distribution diagram of embodiment (3) shows that the molding of each rib 108 can effectively accelerate the efficiency of the phase change cycle of the heat-conducting fluid 104 and effectively and quickly dissipate heat from the electronic device.

[0063] Please see Figure 15 The figure shows another embodiment (fourth) of the present invention. The heat dissipation device 10 shown in the figure has a flow guide 109 within the accommodating space 103. The flow guide 109 can be in the form of a baffle wall, and the flow guide 109 is respectively formed with a first outlet 1091 and a second outlet 1092. As shown in the figure, the first outlet 1091 gradually narrows from bottom to top, while the second outlet gradually narrows from top to bottom. The accommodating space 103 is filled with a heat-conducting fluid 104. Please refer to the accompanying reference. Figure 16 The figure shows a schematic diagram of the implementation of Example (IV). Figure 15 As described above, after the second fluid 1042 of the heat-conducting fluid 104 absorbs the heat energy of the heat source H, it undergoes a phase change reaction, causing the second fluid 1042 to vaporize. Referring to the figure, after the second fluid 1042 vaporizes, due to the flow resistance characteristics and the fact that the first outlet 1091 and the second outlet 1092 are gradually narrowed upwards and downwards respectively, the vaporized second fluid 1042 will only pass through the first outlet 1091 (as shown by arrow A), and the first fluid 1041, in order to fill the dissipated second fluid 1042, will only flow in through the second outlet 1092 (as shown by arrow B). Through the formation of the guide section 109, the heat-conducting fluid 104 can reabsorb the heat source H and generate a heat circulation path.

[0064] As described above, the heat dissipation device of the present invention mainly consists of a thin first sheet and a second sheet. After the two sheets are assembled, an accommodating space is formed inside, and a heat-conducting fluid is filled in the accommodating space. The heat-conducting fluid is a mixture of two immiscible liquids. When the heat dissipation device is close to the heat source of the electronic device, the heat-conducting fluid will gradually undergo a phase change, and the phase change will drive the heat-conducting fluid to circulate continuously, so as to dissipate heat from the electronic device through the phase change of the heat-conducting fluid. Accordingly, after implementation, the present invention can indeed achieve the purpose of providing a heat dissipation device that uses a mixture of two immiscible liquids as a heat-conducting fluid to dissipate heat from the electronic device through the phase change generated by the heat-conducting fluid.

[0065] However, the above description is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention; any equivalent changes and modifications made by those skilled in the art without departing from the spirit and scope of the present invention should be covered within the patent scope of the present invention.

Claims

1. A heat dissipation device, which can be disposed on a heat source of an electronic device, comprising: The first piece of the body; A second piece is joined to the periphery of the first piece, and after the joining is completed, an accommodating space is formed between the first piece and the second piece; A thermally conductive fluid is filled in the accommodating space. The thermally conductive fluid is a mixture of a first fluid and a second fluid, and the first fluid and the second fluid are immiscible liquids. as well as After absorbing the heat source, the heat-conducting fluid can undergo a phase change. The first fluid and the second fluid can flow and push against each other through the phase change, so as to dissipate the heat generated by the heat source through heat conduction. Its features are, A flow guide is formed within the accommodating space, and the flow guide is formed with a first outlet and a second outlet. The first outlet and the second outlet can be used to form a thermal circulation path for the heat-conducting fluid after the phase change reaction. Multiple protrusions are formed within the accommodating space. These protrusions can be pre-formed onto the inner surface of the first or second sheet using a dispensing molding method. The distribution of these protrusions effectively increases the circulation efficiency of the heat-conducting fluid in undergoing phase change.

2. The heat dissipation device as described in claim 1, characterized in that, The first piece and the periphery of the second piece are bonded together by ultrasonic welding or bonding.

3. The heat dissipation device as described in claim 1, characterized in that, The specific gravity or density of the second fluid is greater than that of the first fluid.

4. The heat dissipation device as described in claim 1, characterized in that, The first fluid is a mixture of an alcoholic liquid and water.

5. The heat dissipation device as described in claim 4, characterized in that, The second fluid is a fluorinated liquid.

6. The heat dissipation device as described in claim 1, characterized in that, The heat-conducting fluid occupies 50% to 95% of the volume of the accommodating space.

7. The heat dissipation device as described in claim 1, characterized in that, The first outlet gradually narrows from bottom to top, while the second outlet gradually narrows from top to bottom.

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