Electronic packaging and its supporting structure and manufacturing method

Abstract

An electronic package and its supporting structure and manufacturing method. The supporting structure includes a protective layer formed on a metal part with multiple conductive columns, and the protective layer exposes the end faces of the conductive columns to allow conductors to be formed on the end faces of the conductive columns to avoid damage to the protective layer.

Description

Technical Field

[0001] The present invention relates to a packaging structure and a manufacturing process, and in particular to an electronic packaging component and a supporting structure and a manufacturing method thereof. Background Art

[0002] With the rapid development of portable electronic products in recent years, various related products are gradually developing towards high density, high performance, lightness, thinness, shortness and smallness. Among them, various types of semiconductor packaging structures used in these portable electronic products are also constantly innovating to meet the requirements of lightness, thinness, shortness and high density.

[0003] Figures 1A to 1D It is a cross-sectional schematic diagram of a conventional method for manufacturing a semiconductor package 1 .

[0004] like Figure 1A As shown, a lead frame 15 is provided, which includes a support plate 152 , and a plurality of conductive posts 150 and a bonding pad 151 spaced apart from each other on the support plate 152 .

[0005] like Figure 1B As shown, a protective layer 19 such as a copper-containing agent is formed on the lead frame 15 , and then a solder material 13 is formed on the end surface of the conductive column 150 via a flux 17 such as a rosin-containing flux.

[0006] like Figure 1C As shown, an electronic component is bonded to the conductive pillars 150, so that the electronic component is stacked on the lead frame 15. The electronic component includes a substrate structure 10 and a first semiconductor chip 11 and a second semiconductor chip 12 disposed on the substrate structure 10. In addition, the first semiconductor chip 11 can be bonded to the bonding pad 151 via a film 18. In addition, the conductive pillars 150 can be bonded to the substrate structure 10 via the solder material 13. In addition, the electronic component can also include a coating layer 14 for coating the second semiconductor chip 12.

[0007] like Figure 1D As shown, a packaging layer 16 is formed between the substrate structure 10 and the lead frame 15 (the support plate 152), so that the packaging layer 16 covers the first semiconductor chip 11, the solder material 13, and the conductive pillars 150. Afterwards, the support plate 152 is removed, so that the end surfaces of the conductive pillars 150 and the bonding pads 151 are exposed outside the packaging layer 16.

[0008] However, in the conventional method of manufacturing the semiconductor package 1, the flux 17 becomes liquid during the high-temperature process, causing it to penetrate into the protective layer 19 along the side of the conductive pillar 150, thereby damaging the protective layer 19. Therefore, when the solder material 13 is reflowed, the side of the lead frame 15 and the conductive pillar 150 is no longer covered with the protective layer 19, causing the solder material 13 to easily overflow and cause tin channeling. Figure 1B As shown, the solder material 13 is subsequently electrically connected to the first semiconductor chip 11, causing a short circuit problem.

[0009] Therefore, how to overcome the above-mentioned problems of the prior art has become a difficult problem that needs to be overcome urgently in the industry. Summary of the Invention

[0010] In view of the above-mentioned various defects of the prior art, the present invention provides an electronic package and its supporting structure and manufacturing method, which can avoid damage to the protective layer.

[0011] The support structure of the present invention includes: a metal piece having a plurality of conductive columns; a protective layer formed on the metal piece and exposing the end faces of the conductive columns; and a conductor formed on the end faces of the conductive columns.

[0012] In the aforementioned supporting structure, the conductor comprises solder material.

[0013] The present invention also provides a support structure, comprising: a metal piece having a plurality of conductive columns; a stopper formed on the end surface of the conductive column; and a protective layer formed on the metal piece and the stopper.

[0014] In the aforementioned supporting structure, the stopper contains ink.

[0015] In the two aforementioned supporting structures, the metal component is a copper frame.

[0016] In the two aforementioned support structures, the protective layer is a metal layer, for example, the metal layer comprises aluminum, stainless steel, iron, nickel or chromium.

[0017] The present invention also provides a method for manufacturing a support structure, including: providing a metal part having multiple conductive pillars; forming a stopper on the end surface of the conductive pillar; forming a protective layer on the metal part and the stopper; removing the stopper and the protective layer thereon to expose the end surface of the conductive pillar; and forming a conductor on the end surface of the conductive pillar.

[0018] In the aforementioned manufacturing method, the stopper contains ink.

[0019] The present invention further provides a method for manufacturing a support structure, comprising: providing a metal member having a plurality of conductive pillars; forming a protective layer on the metal member; removing a portion of the protective layer to expose the end surfaces of the conductive pillars; and forming a conductor on the end surfaces of the conductive pillars.

[0020] In the aforementioned manufacturing method, a portion of the protective layer is removed by grinding or polishing.

[0021] In the two aforementioned manufacturing methods, the metal component is a copper frame.

[0022] In the two aforementioned methods, the protective layer is a metal layer. For example, the metal layer is formed by sputtering. Alternatively, the metal layer comprises aluminum, stainless steel, iron, nickel, or chromium.

[0023] In the two aforementioned manufacturing methods, the conductor comprises solder material.

[0024] The present invention further provides an electronic package comprising: the aforementioned support structure; and an electronic component bonded to the conductive posts of the support structure, such that the electronic component is stacked on the metal member. Alternatively, a method for manufacturing an electronic package is provided, comprising: providing the aforementioned support structure; and bonding an electronic component to the conductive posts of the support structure, such that the electronic component is stacked on the metal member.

[0025] In the aforementioned electronic package and its manufacturing method, the electronic assembly includes at least one electronic component.

[0026] From the above, it can be seen that in the electronic package and its support structure and manufacturing method of the present invention, a stopper or a protective layer is mainly used to cover the end face of the conductive column to subsequently expose the end face of the conductive column. Therefore, compared with the prior art, the support structure of the present invention can stop the solder material of the conductor from overflowing through the protective layer during the subsequent reflow of the conductor, thereby avoiding tin crosstalk and further avoiding the problem of short circuit between the conductor and the first electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figures 1A to 1D It is a cross-sectional schematic diagram of a conventional method for manufacturing a semiconductor package.

[0028] Figure 1B ' is a schematic diagram of solder material overflow occurring in a conventional semiconductor package manufacturing method.

[0029] Figures 2A to 2C It is a cross-sectional schematic diagram of the method for manufacturing the support structure of the present invention.

[0030] Figures 2D to 2E It is a cross-sectional schematic diagram of the method for manufacturing the electronic package of the present invention.

[0031] Figures 3A to 3B for Figure 2BA cross-sectional schematic diagram of another method of manufacturing the present invention.

[0032] Description of Reference Numerals

[0033] 1 semiconductor package 10 substrate structure

[0034] 11 first semiconductor chip 12 second semiconductor chip

[0035] 13 Solder material 14,24 Covering layer

[0036] 15 lead frame 150,250 conductive column

[0037] 151,251 Bonding pad 152,252 Support plate

[0038] 16,26 Encapsulation layer 17,230 Flux

[0039] 18 Film 19,29 Protective layer

[0040] 2 Electronics enclosure 2', 2" support structure

[0041] 2a Electronic component 20 Carrying structure

[0042] 20a first side 20b second side

[0043] 200 circuit layer 21 first electronic component

[0044] 210, 220 Conductive bump 22 Second electronic component

[0045] 23 Conductors 25 Metal parts

[0046] 250a, 250b end face 250c side face

[0047] 26a first surface 26b second surface

[0048] 27 Stopper 28 Bonding layer DETAILED DESCRIPTION

[0049] The following describes the embodiments of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0050] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for understanding and reading by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment in size should still fall within the scope of the technical content disclosed by the present invention without affecting the efficacy and purpose that can be achieved by the present invention. At the same time, terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0051] Figures 2A to 2E Schematic cross-sectional view of a method for manufacturing an electronic package 2 using the support structure 2 ′, 2 ″ of the present invention.

[0052] like Figure 2A As shown, a support structure 2 ″ including a metal member 25 is provided, and the metal member 25 includes a support plate 252 , a plurality of conductive pillars 250 separately disposed on the support plate 252 , and at least one bonding pad 251 .

[0053] In this embodiment, the metal member 25 is a lead frame, so the support plate 252, the conductive pillars 250 and the bonding pads 251 can be integrally formed. For example, the metal member 25 is formed by removing material from a copper plate by etching, laser or other methods.

[0054] Furthermore, a stopper 27 is formed on the end surface 250a of the conductive pillar 250, and a protective layer 29 is formed on the metal member 25 and the stopper 27. For example, the stopper 27 is ink, and the protective layer 29 is a metal layer with solder-resistant properties. Specifically, the stopper 27 is formed by coating, and the protective layer 29 is formed by sputtering aluminum, stainless steel, iron, nickel, chromium, or other metal material with solder-resistant properties.

[0055] like Figure 2B As shown, the stopper 27 and the protective layer 29 thereon are removed to expose the end surface 250 a of the conductive pillar 250 .

[0056] like Figure 2C As shown, a conductor 23 is formed on the end surface 250 a of the conductive pillar 250 to form another supporting structure 2 ′.

[0057] In this embodiment, the conductor 23 is a solder material or other conductive materials suitable for bonding, and is formed on the end surface 250 a of the conductive pillar 250 via a flux 230 containing rosin, for example.

[0058] In addition, except for the end surface 250a of the conductive column 250, the surface of the metal member 25 is formed with the protective layer 29, so the stopper 27 can be omitted in other processes. Figures 3A to 3B As shown, the metal member 25 is directly covered with the protective layer 29, and then the protective layer 29 on the end surface 250a of the conductive column 250 is removed by grinding or polishing to present the following Figure 2B or Figure 3B The state shown is for configuring the conductor 23.

[0059] like Figure 2D As shown, an electronic component 2 a is coupled to the conductive pillar 250 of the support structure 2 ′, so that the electronic component 2 a is stacked on the metal member 25 .

[0060] In this embodiment, the electronic assembly 2 a includes a supporting structure 20 and a first electronic component 21 and a second electronic component 22 disposed on the supporting structure 20 .

[0061] The carrier structure 20 has a first side 20a and a second side 20b that are opposite to each other. In this embodiment, the carrier structure 20 is a substrate having a core layer and a circuit structure, or a coreless circuit structure having multiple circuit layers 200, such as fan-out redistribution layers (RDLs). It should be understood that the carrier structure 20 may also be other carrier units capable of supporting electronic components such as chips, such as a lead frame, and is not limited to the above.

[0062] The first electronic component 21 is disposed on the first side 20a of the supporting structure 20. In this embodiment, the first electronic component 21 is an active component, a passive component, or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor. For example, the first electronic component 21 is disposed on the circuit layer 200 in a flip-chip manner via a plurality of conductive bumps 210 such as solder material and electrically connected to the circuit layer 200; alternatively, the first electronic component 21 can be electrically connected to the circuit layer 200 in a wire bonding manner via a plurality of welding wires (not shown). However, the method for electrically connecting the first electronic component 21 to the supporting structure 20 is not limited to the above.

[0063] The second electronic component 22 is disposed on the second side 20b of the supporting structure 20. In this embodiment, the second electronic component 22 is an active component, a passive component, or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, and an inductor. For example, the second electronic component 22 is disposed on the circuit layer 200 in a flip-chip manner via a plurality of conductive bumps 220 such as solder material; or, the second electronic component 22 can be electrically connected to the circuit layer 200 in a wire bonding manner via a plurality of welding wires (not shown); or, the second electronic component 22 can directly contact the circuit layer 200. However, the manner in which the second electronic component 22 is electrically connected to the supporting structure 20 is not limited to the above.

[0064] In addition, the first electronic component 21 can be bonded to the bonding pad 251 via a bonding layer 28 , wherein the bonding layer 28 is, for example, a film, epoxy, or thermal interface material (TIM).

[0065] In addition, the conductive pillars 250 are bonded to the circuit layer 200 on the first side 20 a of the supporting structure 20 via the conductor 23 .

[0066] In addition, the electronic assembly 2a may further include a coating layer 24 formed on the second side 20b of the supporting structure 20 to cover the second electronic component 22. For example, the coating layer 24 may be formed of, but is not limited to, polyimide (PI), dry film, epoxy, or a molding compound.

[0067] like Figure 2E As shown, a packaging layer 26 is formed between the first side 20a of the supporting structure 20 and the metal member 25 (the support plate 252), so that the packaging layer 26 covers the first electronic component 21, the protective layer 29, the conductor 23, and the conductive posts 250. Thereafter, the support plate 252 is removed, exposing the other end surfaces 250b of the conductive posts 250 and the bonding pads 251 (and even the protective layer 29) to the packaging layer 26, thereby forming the electronic package 2 of the present invention.

[0068] In this embodiment, the packaging layer 26 has a first surface 26a and a second surface 26b relative to each other, so that the packaging layer 26 is combined with the first side 20a of the supporting structure 20 with its second surface 26b, and the conductive pillars 250 and the bonding pads 251 are embedded in the first surface 26a of the packaging layer 26, and the other end surfaces 250b of the conductive pillars 250 and the bonding pads 251 are exposed from the first surface 26a of the packaging layer 26 (for example, the other end surfaces 250b of the conductive pillars 250 and the surfaces of the bonding pads 251 are flush with the first surface 26a of the packaging layer 26), so that bumps such as solder balls (not shown) are formed on the exposed surfaces (such as the end surfaces 250b) of the conductive pillars 250, so as to be connected to electronic devices such as circuit boards.

[0069] In addition, the material forming the packaging layer 26 is polyimide (PI), dry film, epoxy resin or packaging material. Therefore, the material of the packaging layer 26 and the material of the covering layer 24 can be the same or different.

[0070] Therefore, in the manufacturing method of the electronic package 2 of the present invention, the support structure 2', 2" is made to cover the end surface 250a of the conductive column 250 with a stopper 27 or a protective layer 29, so that the end surface 250 of the conductive column 250 can be exposed later, so that when the conductor 23 is reflowed, the metal part 25 and the side surface 250c of the conductive column 250 still retain the protective layer 29. Therefore, compared with the prior art, when the electronic package 2 of the present invention is reflowed, the protective layer 29 can stop the solder material of the conductor 23 from overflowing, thereby avoiding the tin crosstalk phenomenon, and further avoiding the problem of short circuit between the conductor 23 and the first electronic component 21 (or the conductive bump 210).

[0071] The present invention further provides a support structure 2 ′, 2 ″, comprising: a metal member 25 , a protective layer 29 and a conductor 23 (or a stopper 27 ).

[0072] The metal member 25 has a plurality of conductive pillars 250 .

[0073] The protection layer 29 is formed on the metal member 25 and exposes the end surface 250 a of the conductive pillar 250 .

[0074] The conductive body 23 (or the stopper 27 ) is formed on the end surface 250 a of the conductive pillar 250 .

[0075] In one embodiment, the protection layer 29 is further formed on the stopper 27 .

[0076] In one embodiment, the conductor 23 includes solder material.

[0077] In one embodiment, the stopper 27 includes ink.

[0078] In one embodiment, the metal member 25 is a copper frame.

[0079] In one embodiment, the protection layer 29 is a metal layer, such as aluminum, stainless steel, iron, nickel, or chromium.

[0080] The present invention further provides an electronic package 2 comprising: the aforementioned support structure 2 ′ and at least one electronic component 2 a.

[0081] The electronic component 2 a is coupled to the conductive post 250 of the support structure 2 ′ via the conductor 23 , so that the electronic component 2 a is stacked on the metal member 25 .

[0082] In one embodiment, the electronic assembly 2 a includes a first electronic component 21 and / or a second electronic component 22 .

[0083] In summary, the electronic package and its supporting structure and manufacturing method of the present invention utilize a stopper or protective layer covering the end surface of the conductive post, thereby subsequently exposing the end surface of the conductive post. Therefore, during subsequent reflow soldering of the conductive post, the protective layer on the metal component and the side surface of the conductive post can prevent solder material from overflowing from the conductive post, thereby preventing solder cross-contamination and, in turn, preventing a short circuit between the conductive post and the first electronic component. Therefore, the support structure and manufacturing method of the present invention can enhance the reliability of the electronic package.

[0084] The above embodiments are intended only to illustrate the principles and effects of the present invention and are not intended to limit the present invention. Any skilled artisan may modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be as set forth in the appended claims.

Claims

1. A support structure, characterized in that: include: a metal member having a plurality of conductive posts; a protective layer formed on the metal member and exposing the end surface of the conductive column, wherein the protective layer is a metal layer having solder resistance; and The conductor is formed on the end surface of the conductive column.

2. The support structure according to claim 1, characterized in that The electrical conductor includes a solder material.

3. A support structure, characterized in that: include: a metal member having a plurality of conductive posts; a stopper formed on an end surface of the conductive post; as well as The protection layer is formed on the metal piece and the stopper, and the protection layer is a metal layer with solder resistance.

4. The support structure according to claim 3, characterized in that The stopper body contains ink.

5. The support structure according to claim 1 or 3, characterized in that: The metal part is a copper frame.

6. The support structure according to claim 1 or 3, characterized in that: The metal layer comprises aluminum, stainless steel, iron, nickel or chromium.

7. A method for manufacturing a support structure, characterized in that: include: Providing a metal member having a plurality of conductive posts; forming a stopper on the end surfaces of the plurality of conductive pillars; forming a protective layer on the metal member and the stopper, wherein the protective layer is a metal layer having solder resistance; removing the stopper and the protective layer thereon to expose the end surface of the conductive pillar; and A conductor is formed on the end surface of the conductive column.

8. The method for manufacturing a supporting structure according to claim 7, wherein: The stopper body contains ink.

9. A method for manufacturing a support structure, characterized in that: include: Providing a metal member having a plurality of conductive posts; forming a protective layer on the metal member, wherein the protective layer is a metal layer having solder resistance; removing a portion of the protective layer to expose the end surface of the conductive pillar; and A conductor is formed on the end surface of the conductive column.

10. The method for manufacturing a supporting structure according to claim 9, wherein: A portion of the protective layer is removed by grinding or polishing.

11. The method for manufacturing a support structure according to claim 7 or 9, characterized in that: The metal part is a copper frame.

12. The method for manufacturing a support structure according to claim 9, wherein: The metal layer is formed by sputtering.

13. The method for manufacturing a supporting structure according to claim 9, wherein: The metal layer comprises aluminum, stainless steel, iron, nickel or chromium.

14. The method for manufacturing a supporting structure according to claim 7 or 9, characterized in that: The electrical conductor includes a solder material.

15. An electronic package, characterized in that: include: The support structure according to any one of claims 1 to 6; as well as The electronic component is combined with the conductive pillar of the supporting structure so that the electronic component is stacked on the metal piece.

16. The electronic package according to claim 15, wherein: The electronic assembly includes at least one electronic component.

17. A method for manufacturing an electronic package, characterized in that: include: Providing a support structure according to any one of claims 1 to 6; as well as An electronic component is combined with the conductive pillar of the supporting structure so that the electronic component is stacked on the metal piece.

18. The method for manufacturing an electronic package according to claim 17, wherein: The electronic assembly includes at least one electronic component.

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