Motor drive device
By designing the connecting substrate in the motor drive device and avoiding the use of wires or cables, the problem of difficult substrate connections in the prior art is solved, and the effect of automatic assembly and noise reduction is achieved.
Patent Information
- Application Number
- CN201980092904.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-02-25
- Filing Date
- 2019-07-11
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2039-07-11
AI Technical Summary
The existing motor drive devices are difficult to achieve automated assembly on the substrate connection structure, and the wires or cables may generate noise signals.
By designing a motor drive device including a lower case, an upper case and a central case, the electrical connection between the main substrates is achieved by using the connecting substrate, avoiding the use of wires or cables.
Automatic assembly is achieved and internal noise is reduced, while improving space efficiency by optimizing substrate configuration.
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Figure CN113474985B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a motor driving device with an improved structure. Background Art
[0002] Generally, a motor driving device refers to a device that controls the speed of a motor with high efficiency by changing the voltage and frequency of electric power supplied from an external power source and supplying the power to the motor.
[0003] Such a conventional motor drive device is described in Korean Utility Model Publication No. 20-2011-009729 (Invention Title: Semiconductor Module for Electric Power).
[0004] This prior art motor driving device is described as follows.
[0005] Generally, in a conventional motor drive device, a housing body and a cover form an overall appearance, and a circuit unit is accommodated in an internal space formed by the housing body and the cover.
[0006] In this circuit unit, multiple main circuit substrates, such as a power board, a filter board, a control board and / or a cover plate, are configured. In order to connect electrical signals to each other, the multiple circuit substrates are electrically connected to each other through wires or conductors such as clamp structures, or are connected to each other through cables composed of wires and connectors.
[0007] However, the substrate connection structure according to the prior art has a problem that it is difficult to realize automated assembly, and the wires or cables act like antennas and may generate noise signals inside the motor drive device.
[0008] In addition, in the conventional motor drive device, when an inner housing is included between the housing body and the cover, there is a problem that one of the substrates must be arranged on the lower side of the inner housing in order to be connected to the other substrate arranged on the housing body. In such a substrate arrangement structure, since the two substrates are completely opposite to each other, noise may be generated.
[0009] If the substrate is disposed on the upper side of the inner case in order to reduce such noise, a wire or cable for connecting to another substrate disposed on the outer casing body will be arranged long, which may complicate the internal structure and increase the noise generation. Summary of the invention
[0010] Problem that the invention aims to solve
[0011] In order to understand the above problems, an object of the present invention is to provide a motor drive device, which can automate the assembly process and reduce the generation of internal noise by improving the internal structure of the motor drive device.
[0012] Means used to solve problems
[0013] In order to achieve the above-mentioned purpose, the present invention provides a motor drive device, which includes: a lower shell, which has a accommodating space formed inside and is open on the upper side; an upper shell, which closes the open surface in the lower shell to form an internal space; a central shell, which is arranged on the lower shell to separate the internal space formed by the lower shell and the upper shell; a first substrate, which is arranged on the lower shell and includes a first connector; a second substrate, which is arranged on the central shell and includes a second connector; and a connecting substrate, which is arranged on the internal space and includes a first connecting connector electrically connected to the first connector and a second connecting connector electrically connected to the second connector to transmit electrical signals between the substrates.
[0014] In addition, the first substrate and the second substrate may be arranged in parallel to the bottom surface of the lower case, and the connection substrate may be arranged perpendicular to the bottom surface of the lower case.
[0015] In addition, the second substrate may be disposed on an upper side of the central housing.
[0016] In addition, the first connector can be configured on the upper side of the first substrate, the second connector can be configured on the lower side of the second substrate, and a recessed portion capable of configuring the connecting substrate on one side can be formed in the central shell, so that the connecting substrate is configured between the upper side of the first substrate and the lower side of the second substrate.
[0017] In addition, a third substrate may be included between the lower shell and the central shell. The third substrate is fastened to a support column configured on the lower shell and includes a third connector. The connecting substrate may also include a third connecting connector electrically connected to the third connector to transmit electrical signals between the substrates.
[0018] In addition, the first substrate, the second substrate, and the third substrate may be arranged parallel to the bottom surface of the lower housing, and the connection substrate may be arranged perpendicular to the bottom surface of the lower housing.
[0019] In addition, the first connector may be disposed on the upper side surface of the first substrate, the second connector may be disposed on the lower side surface of the second substrate, a protruding portion protruding to one side may be formed in the third substrate, the third connector may be disposed on the upper side surface of the protruding portion, a recessed portion capable of disposing the connection substrate on one side may be formed in the central housing, such that the connection substrate is disposed between the upper side surface of the first substrate and the lower side surface of the second substrate, the connection substrate is formed in a "C" shape opening downward, the first connection connector is disposed in at least one of the two end portions, the third connection connector is disposed on the recessed surface, and the second connection connector is disposed on the upper side surface.
[0020] In addition, the connection substrate may be fastened to the central housing.
[0021] Effects of the Invention
[0022] The present invention realizes mutual electrical connection between main substrates by using a connection substrate, without using wires or cables, can achieve automatic assembly, and can reduce internal noise at the same time.
[0023] In addition, the present invention can ensure space efficiency inside the motor drive device by changing the shape of the intermediate substrate and / or the central housing, such that the connection substrate can be disposed between the lowermost substrate and the uppermost substrate. Description of the Drawings
[0024] Figure 1 is a perspective view of a motor drive device according to an embodiment of the present invention.
[0025] Figure 2 is to Figure 1 the exploded perspective view in which the upper housing and the lower housing are separated.
[0026] Figure 3 is Figure 2 the exploded perspective view of the central housing and the substrate portion shown.
[0027] Description of Reference Numerals
[0028] 100: Motor drive device 110: Lower housing
[0029] 111: Heat dissipation portion 112: Cooling fan
[0030] 113: Support pillar 120: Upper housing
[0031] 121: Slit 130: Central housing
[0032] 140: Substrate portion 141: First substrate
[0033] 141a: first connector 142: second substrate
[0034] 142a: second connector 143: third substrate
[0035] 143a: third connector 143b: protrusion
[0036] 144: connection substrate 144a: first connection connector
[0037] 144b: Second connection connector 144c: Third connection connector DETAILED DESCRIPTION
[0038] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0039] Unless otherwise defined, all terms in this specification have the same general meaning as those understood by ordinary technicians in the field. When a term used in this specification conflicts with the general meaning of the term, the definition used in this specification shall prevail.
[0040] It should be noted that the invention described below is only used to illustrate the embodiments of the present invention, and is not used to limit the claims of the present invention. In addition, the same reference numerals used throughout the specification represent the same components.
[0041] Figure 1 is a perspective view of a motor drive device according to an embodiment of the present invention, Figure 2 Yes Figure 1 An exploded perspective view showing the upper shell and the lower shell separated from each other, Figure 3 yes Figure 2 An exploded perspective view of the central housing and base plate portion is shown.
[0042] Reference Figures 1 to 3 The motor driving device 100 according to the embodiment of the present invention may generally include a lower housing 110 , an upper housing 120 , a central housing 130 , and a substrate portion 140 .
[0043] The lower housing 110 is a housing having an accommodation space formed therein and an open upper side, and the heat dissipation unit 111 or the cooling fan 112 may be disposed in the lower housing 110. Here, the lower housing 110 may also be integrally formed with the heat dissipation unit 111 described later by injection molding.
[0044] The heat dissipation unit 111 is a device for absorbing heat from a substrate unit 140 to be described later and dissipating the heat to the outside, and may also be called a heat sink.
[0045] The cooling fan 112 is used to supply external air to the heat dissipation portion 111 and the substrate portion 140 for cooling, and at least one cooling fan 112 may be disposed in the lower housing 110 .
[0046] The upper housing 120 may close the open surface of the lower housing 110 to form an inner space of the motor driving device 100 according to the embodiment of the present invention. A plurality of slits 121 for heat dissipation may be formed on at least one side surface of the upper housing 120 .
[0047] The central housing 130 may be disposed at the lower housing 110 to partition an inner space formed by the lower housing 110 and the upper housing 120 .
[0048] The central housing 130 may be fastened to the lower housing 110 to be disposed in an inner space formed by the lower housing 110 and the upper housing 120 , or may be disposed between the upper housing 120 and the lower housing 110 to form an external appearance.
[0049] The substrate portion 140 may include at least two substrates differentiated according to functions, for example, may include a first substrate 141 , a second substrate 142 , and a connection substrate 144 .
[0050] Each base plate constituting such a base plate portion 140 may be fixed to the lower housing 110 or the central housing 130 by bolt fastening and / or hook fastening, or the like.
[0051] The first substrate 141 is disposed on the lower housing 110 and may include a first connector 141 a . The first substrate 141 may be, for example, a power substrate.
[0052] Here, the power substrate may have a function of generating a variable voltage and a variable frequency for driving a motor using a power semiconductor device, a DC-link smoothing function for smoothing an input voltage, and a function of detecting a DC-link voltage and an inverter output current.
[0053] Insulated gate bipolar transistors (IGBT), power relays, gate driver ICs, Hall current converters, DC reactors, and snubber capacitors can be mounted on such a power substrate as main components.
[0054] The second substrate 142 is disposed on the central housing 130 and may include a second connector 142 a . The second substrate 142 may be a filter substrate, for example.
[0055] Here, the filter substrate may have a filtering function to reduce noise components generated in the inverter so that the noise does not flow into the system.
[0056] In this filter substrate, EMC chokes, X-capacitors, Y-capacitors, transformers can be installed as main components.
[0057] The connecting substrate 144 is arranged in the internal space formed by the lower shell 110 and the upper shell 120, and may include a first connecting connector 144a electrically connected to the first connector 141a and a second connecting connector 144b electrically connected to the second connector 142a to transmit electrical signals between the substrates.
[0058] In order to effectively utilize the internal space, the first substrate 141 and the second substrate 142 may be arranged parallel to the bottom surface of the lower housing 110 , and the connection substrate 144 may be arranged perpendicular to the bottom surface of the lower housing 110 .
[0059] The advantage of this connecting substrate 144 is that the second substrate 142 can be arranged on the upper side of the central housing 130, and in this structure, automatic assembly with the first substrate 141 can be achieved, and there will be no noise problem.
[0060] In addition, in order to further improve space efficiency, the connection substrate 144 may be disposed in a space where the first substrate 141 and the second substrate 142 are opposite to each other.
[0061] Specifically, the first connector 141a is configured on the upper side of the first substrate 141, the second connector 142a is configured on the lower side of the second substrate 142, and a recessed portion 131 capable of configuring the connecting substrate 144 may be formed on one side of the central shell 130, so that the connecting substrate 144 is configured between the upper side of the first substrate 141 and the lower side of the second substrate 142.
[0062] In the technical concept of the present invention, when a substrate is added, the internal space utilization, the possibility of automatic assembly, the productivity and the noise reduction effects are more significant.
[0063] For example, the present invention may further include a third substrate 143 , in which case the structural features of the above-mentioned connection substrate 144 may also be included.
[0064] The third substrate 143 is disposed between the lower housing 110 and the central housing 130, fastened to the support posts 113 disposed on the lower housing 110, and may include a third connector 143a. That is, the third substrate 143 may be disposed between the first substrate 141 and the second substrate 142.
[0065] Here, the third substrate 143 may be a control substrate and may have a controller function of generating a signal (PWM) for controlling a motor using an operation command, a speed command, and voltage and current information.
[0066] In such a control substrate, a micro control unit (MCU) may be installed as a main component.
[0067] The connection substrate 144 is disposed in the internal space formed by the lower housing 110 and the upper housing 120. The connection substrate 144 may further include a third connection connector 144c electrically connected to the third connector 143a to transmit electrical signals between substrates.
[0068] To effectively utilize the internal space, the first substrate 141, the second substrate 142, and the third substrate 143 may be arranged parallel to the bottom surface of the lower housing 110, and the connection substrate 144 may be arranged perpendicular to the bottom surface of the lower housing 110.
[0069] In addition, to further improve the space efficiency, the connection substrate 144 may be disposed in the space where the first substrate 141 faces the second substrate 142.
[0070] Specifically, the first connector 141a is disposed on the upper side surface of the first substrate 141, the second connector 142a is disposed on the lower side surface of the second substrate 142. A protruding portion 143b protruding to one side is formed in the third substrate 143, and the third connector 143a is disposed on the upper side surface of the protruding portion 143b. A recessed portion 131 capable of disposing the connection substrate 144 on one side may be formed in the central housing 130, such that the connection substrate 144 is disposed between the upper side surface of the first substrate 141 and the lower side surface of the second substrate 142.
[0071] In addition, the connection substrate 144 may be formed in a "C" shape with a downward opening. The first connection connector 144a may be disposed in at least one of the two end portions facing downward, the third connection connector 144c may be disposed on the recessed surface, and the second connection connector 144b may be disposed on the upper side surface.
[0072] In addition, the connection substrate 144 may be firmly configured by being fastened to the central housing 130 , thereby ensuring the reliability of electrical connection between the substrates.
[0073] In short, the present invention can utilize the connecting substrate 144 to achieve electrical connection between the main substrates without wires or cables, thereby enabling automatic assembly while reducing internal noise, and can change the shape of the intermediate substrate and / or the central shell 130 so that the connecting substrate 144 can be configured between the lowermost substrate and the uppermost substrate, thereby ensuring the space efficiency inside the motor drive device 100.
[0074] It is obvious to those skilled in the art that various changes and modifications can be made without departing from the technical concept of the present invention, and the technical scope of the present invention is not limited to the contents disclosed in the embodiments, but should be determined by the scope of the claims and their equivalents.
[0075] Industrial Applicability
[0076] The present invention can provide a motor drive device whose assembly process can be automated and internal noise generation can be reduced by improving the internal structure, and therefore has industrial applicability.
Claims
1. A motor drive device, wherein: Comprising: A lower housing, which forms an accommodation space inside and has an open upper side, and is provided with a heat dissipation part; An upper housing, which closes the open surface of the lower housing to form an internal space; A central housing, which is arranged in the lower housing to divide the internal space formed by the lower housing and the upper housing; A first substrate, as a power supply substrate, which is arranged in the lower housing and includes a first connector; A second substrate, which is arranged in the central housing and includes a second connector; and A connection substrate, which is arranged in the internal space and includes a first connection connector electrically connected to the first connector and a second connection connector electrically connected to the second connector, so as to transmit electrical signals between the substrates.
2. The motor drive device according to claim 1, wherein, The first substrate and the second substrate are arranged parallel to the bottom surface of the lower housing, and the connection substrate is arranged perpendicular to the bottom surface of the lower housing.
3. The motor drive device according to claim 2, wherein, The second substrate is arranged on the upper side surface of the central housing.
4. The motor drive device according to claim 3, wherein, The first connector is arranged on the upper side surface of the first substrate, The second connector is arranged on the lower side surface of the second substrate, The central housing is formed with a recess capable of arranging the connection substrate on one side, so that the connection substrate is arranged between the upper side surface of the first substrate and the lower side surface of the second substrate.
5. The motor drive device according to claim 1, wherein, A third substrate is further included between the lower housing and the central housing, the third substrate is fastened to a support column arranged in the lower housing and includes a third connector, The connection substrate further includes a third connection connector electrically connected to the third connector, so as to transmit electrical signals between the substrates.
6. The motor drive device according to claim 5, wherein, The first substrate, the second substrate and the third substrate are arranged parallel to the bottom surface of the lower housing, and the connection substrate is arranged perpendicular to the bottom surface of the lower housing.
7. The motor drive device according to claim 6, wherein, The first connector is arranged on the upper side surface of the first substrate, The second connector is arranged on the lower side surface of the second substrate, The third substrate is formed with a protruding part protruding to one side, the third connector is arranged on the upper side surface of the protruding part, The central housing is formed with a recess capable of arranging the connection substrate on one side, so that the connection substrate is arranged between the upper side surface of the first substrate and the lower side surface of the second substrate, The connection substrate is formed in a "C" shape with a downward opening, the first connection connector is arranged at at least one of the two ends of the connection substrate, the third connection connector is arranged on the recessed surface of the connection substrate, and the second connection connector is arranged on the upper side surface of the connection substrate.
8. The motor drive device according to any one of claims 1 to 7, wherein, The connection substrate is fastened to the central housing.
Citation Information
Patent Citations
Power semiconductor module
KR2020110009729U
System for controlling generating set
CN106105014A