Method and apparatus for setting alignment marks

Abstract

The present invention provides a method of setting an alignment mark and a processing apparatus that automatically adjusts the range of a designated mark to set an alignment mark. The method of setting an alignment mark has the following steps: a photographing step of photographing one or more marks formed on the front side of a wafer; an information acquisition step of acquiring information on the respective circumscribed rectangles of the one or more marks photographed; a frame line adjustment step of moving the center of the circumscribed rectangle of one or more marks as a whole to the center of a quadrangular frame line, and automatically adjusting the position and size of the frame line with respect to the circumscribed rectangle in such a manner that the circumscribed rectangle is accommodated within the frame line and the interval between the circumscribed rectangle and the frame line is adjusted to a predetermined distance, according to whether one or more marks have been designated; and a registration step of registering the region inside the frame line whose size has been adjusted, which contains one or more marks, as an alignment mark in the processing apparatus.

Description

Technical Field

[0001] The present invention relates to a method for setting an alignment mark in a processing apparatus for processing a wafer having multiple marks formed on its front side, wherein an area containing one or more marks specified by an operator is set as an alignment mark, and to a processing apparatus capable of setting such an area as an alignment mark. Background Technology

[0002] A wafer in which devices such as ICs are formed in areas divided by multiple predetermined dividing lines arranged in a grid pattern on the front side is ground to a specified thickness on the back side and then processed by a processing apparatus along the predetermined dividing lines to be divided into multiple device chips.

[0003] As a processing apparatus for machining wafers along predetermined dividing lines, a cutting apparatus is used, for example. The cutting apparatus has a chuck stage for attracting and holding the wafer. The chuck stage is capable of rotating about a predetermined rotation axis. A camera and a cutting unit containing cutting tools are arranged above the chuck stage.

[0004] Before cutting the wafer using a cutting device, an alignment process is performed to position the cutting tool on the extension line of a predetermined dividing line (for example, see Patent Document 1). In the alignment process, while the back side of the wafer is held in place by a chuck stage, a mark of a predetermined shape formed on the front side of the wafer is photographed, and this mark is set in the cutting device as an alignment mark (teaching process).

[0005] Then, pattern matching in the image is used to determine alignment marks of the same shape present in the two separated locations. The chuck stage is then rotated by a predetermined angle using the coordinates of these alignment marks, thereby adjusting the wafer orientation so that the predetermined dicing line is parallel to the X-axis of the cutting device.

[0006] Thus, in the alignment process, a teaching process is performed first. In the teaching process, with the image of the front side of the wafer captured by the camera displayed on the display device, the operator searches for alignment marks and decides which mark to use as the alignment mark.

[0007] During the teaching process, a frame consisting of a crosshair and a square surrounding the crosshair is displayed in the center of the image. The operator uses operation keys to adjust the position of the frame in the X-axis and Y-axis directions, and to zoom in / out on the size of the frame.

[0008] Then, with the marker used as an alignment mark housed inside the frame line, the marker and the area surrounding it enclosed by the frame line are registered as alignment marks. However, since the position and size of the frame line are usually adjusted manually by the operator by feel, the size of the frame line may differ each time an alignment mark is set, or each time a different operator sets an alignment mark.

[0009] Patent Document 1: Japanese Patent Application Publication No. 7-106405

[0010] If the size of the frame varies with each setting, even if markers of the same shape are set as alignment markers, there may be cases where the range of the markers set as alignment markers differs, or the area of ​​the region surrounding the marker differs. That is, although the same shape of markers is used as the object, it is possible to set alignment markers of different shapes and sizes. Summary of the Invention

[0011] The present invention was made in view of the above-mentioned problems, and its purpose is to automatically adjust the range for a specified mark to set the alignment mark.

[0012] According to one aspect of the present invention, a method for setting alignment marks is provided. In a processing apparatus for processing a wafer on which multiple marks are formed on the front side, an area containing one or more marks specified by an operator is set as alignment marks. The method is characterized by comprising the following steps: an imaging step in which an imaging unit images the one or more marks formed on the wafer; an information acquisition step in which information is acquired regarding the circumscribed rectangles constituting each of the one or more marks as imaged in the imaging step; and a frame adjustment step after the information acquisition step. Based on the case where one or more of the one or more marks have been specified, the center of the circumscribed rectangle of the one or more marks as a whole is moved toward the center of the frame line of the quadrilateral to be set as an alignment mark in the processing device. The position and size of the frame line relative to the circumscribed rectangle are automatically adjusted in such a way that the circumscribed rectangle is contained within the frame line and the distance between the circumscribed rectangle and the frame line is adjusted to a predetermined distance. The registration step involves registering the area containing the one or more marks inside the frame line whose size has been adjusted as an alignment mark in the processing device.

[0013] According to another aspect of the present invention, a processing apparatus is provided that, when processing a wafer on which multiple marks are formed on the front side, sets an area containing one or more marks specified by an operator as alignment marks, characterized in that the processing apparatus comprises: a chuck stage for attracting and holding the wafer; an imaging unit having an imaging element disposed above the chuck stage and for imaging the wafer attracted and held on the chuck stage; a display device for displaying the image acquired by the imaging unit; a control unit having a processor for controlling the operation of the chuck stage, the imaging unit, and the display device; and an input device for inputting operator instructions to the control unit, the control unit comprising: an information acquisition unit. The device acquires information about the circumscribed rectangles of each of the one or more marks captured by the imaging unit; a frame adjustment unit moves the center of the circumscribed rectangle of the one or more marks towards the center of the frame line of the quadrilateral to be set as an alignment mark in the processing device, based on the case where one or more marks are specified by the input device, and automatically adjusts the position and size of the frame line relative to the circumscribed rectangle in such a way that the circumscribed rectangle is contained within the frame line and the distance between the circumscribed rectangle and the frame line is adjusted to a predetermined distance; and an alignment mark registration unit registers the area containing the one or more marks inside the frame line whose size has been adjusted as alignment marks.

[0014] In one embodiment of the alignment mark setting method of the present invention, firstly, information about the circumscribed rectangles constituting one or more marks is acquired for one or more marks captured in an image (information acquisition step). Then, after the information acquisition step, the operator designates one or more marks from the one or more marks.

[0015] As specified by the operator, the center of the outer rectangle of one or more marks is moved toward the center of the quadrilateral's frame. The position and size of the frame relative to the outer rectangle are automatically adjusted in such a way that the outer rectangle is contained within the frame and the distance between the outer rectangle and the frame is adjusted to a predetermined distance (frame adjustment step).

[0016] Then, the area containing one or more marks inside the adjusted frame line is registered in the processing device as alignment marks (registration step). Therefore, instead of relying on the operator's sense of touch, the alignment marks can be automatically set within a specified range according to the shape and size of the marks. Attached Figure Description

[0017] Figure 1 It is a three-dimensional diagram of the cutting device.

[0018] Figure 2 It is a top view of a chip, etc.

[0019] Figure 3 This is a magnified view of the front side of the chip.

[0020] Figure 4 This is a diagram illustrating the structure of the control unit.

[0021] Figure 5 This is a diagram illustrating an example of labeling processing.

[0022] Figure 6 This is an example of a screen displaying the bounding rectangles of various markers.

[0023] Figure 7 This is a diagram illustrating a scenario where an operator specifies a marker.

[0024] Figure 8 (A) is a diagram showing the frame lines after their position and size have been adjusted. Figure 8 (B) is a diagram showing the alignment marks.

[0025] Figure 9 This is a flowchart of the method for setting alignment marks.

[0026] Figure 10 (A) is a diagram illustrating a scenario where the operator specifies an arbitrary location surrounded by multiple markers. Figure 10 (B) is a diagram showing the frame lines after the frame line adjustment steps.

[0027] Figure 11 (A) is a diagram showing an operator touching the display area near the lower right corner of the mark with their finger. Figure 11 (B) is a diagram showing the frame lines after the frame line adjustment steps.

[0028] Label Explanation

[0029] 2: Cutting device; 4: Base; 6: Cover; 6a: Front surface; 8: Cutting unit; 10: Camera unit; 12: Chuck stage; 12a: Holding surface; 14: Touch panel; 16: Control unit; 16a: Information acquisition unit; 16b: Frame adjustment unit; 16c: Alignment mark registration unit; 11: Wafer; 11a: Front side; 11b: Back side; 13: Segmentation predetermined line; 15: Device; 17, 17a, 17b, 17c, 17d: Mark; 19: Adhesive tape; 21: Frame; 23: Wafer unit; 25, 25a, 25b, 25c, 25d, 35: Circumscribed rectangle; 27: Frame; 29: Alignment mark; 31: Area; 33: Rectangle. Detailed Implementation

[0030] An embodiment of one aspect of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a three-dimensional view of the cutting device (machining device) 2. Figure 1 The X-axis (machining feed direction), Y-axis (indexing feed direction), and Z-axis (vertical and height directions) shown in the figure are perpendicular to each other.

[0031] In addition, Figure 1 In this design, functional blocks represent a portion of the constituent elements. The cutting device 2 has a base 4 that supports each component. A cover 6 is provided above the base 4 to cover it. A defined space is formed inside the cover 6.

[0032] A cutting unit (processing unit) 8 for cutting (processing) the wafer 11 is arranged in the specified space. The cutting unit 8 is movable in the Y-axis direction and the Z-axis direction by a Y-axis and Z-axis direction moving mechanism (not shown).

[0033] For example, the Y-axis and Z-axis moving mechanisms include: a ball screw type Y-axis moving mechanism (not shown) that moves the Y-axis moving plate (not shown) along the Y-axis direction; and a ball screw type Z-axis moving mechanism (not shown) that is provided on the Y-axis moving plate and moves the cutting unit 8 along the Z-axis direction.

[0034] The cutting unit 8 has a prism-shaped spindle housing arranged approximately parallel to the Y-axis in its length direction. A portion of a cylindrical spindle (not shown) is rotatably housed within the spindle housing.

[0035] A rotational drive source, such as an electric motor (not shown), is provided at one end of the spindle, and a cutting tool with a circular cutting edge is mounted at the other end of the spindle. A portion of a camera unit (image capturing unit) 10 is fixed to one side of the spindle housing in the X-axis direction.

[0036] The camera unit includes: a light source such as an LED (not shown); an optical system including a condenser lens (not shown); and imaging elements such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0037] Below the cutting unit 8 is a chuck stage 12 for attracting and holding the wafer 11. The chuck stage 12 has a generally disc-shaped frame made of metal. A recess formed by a disc-shaped space is formed on the frame.

[0038] One end of the suction path (not shown) is exposed on the bottom surface of the recess, and a suction source (not shown) such as a vacuum pump or ejector is connected to the other end of the suction path. A disc-shaped perforated plate is fixed in the recess.

[0039] When the suction source is activated, a negative pressure is generated on the upper surface (holding surface 12a) of the perforated plate through the suction path. A rotary drive source such as an electric motor (not shown) is connected below the chuck table 12.

[0040] A rotary drive source causes the chuck table 12 to rotate about a predetermined rotation axis that is approximately parallel to the Z-axis direction. Below the rotary drive source is a ball screw-type X-axis movement mechanism (not shown) for moving the chuck table 12 and the rotary drive source along the X-axis direction.

[0041] A disc-shaped wafer 11 or the like is placed on the holding surface 12a of the chuck stage 12. Figure 2 This is a top view of chip 11, etc. Chip 11 is formed, for example, from a semiconductor such as silicon. However, there are no limitations on the material, shape, structure, size, etc. of chip 11.

[0042] The front side 11a of the wafer 11 is divided into multiple regions by predefined dividing lines (spacers) 13 arranged in a grid pattern. Devices 15 such as ICs (Integrated Circuits) and LSIs (Large-Scale Integrations) are formed in each region. Furthermore, there are no restrictions on the type, number, shape, structure, size, or arrangement of the devices 15.

[0043] Near the predetermined dividing line 13, a plurality of marks 17 with a prescribed shape are formed (see reference). Figure 3 Mark 17 is used as alignment mark 29 (see reference). Figure 8 (B)) The alignment mark 29 serves as a reference for aligning the wafer 11.

[0044] Mark 17 is formed, for example, by removing a portion of the outermost surface of a circuit layer formed on the active region constituting a semiconductor element using etching or the like. If the front side 11a is photographed using camera unit 10, an image of mark 17 is obtained. Figure 3 This is a magnified view of the front side 11a of the chip 11.

[0045] exist Figure 3 The image shows two devices 15 arranged separated by a predetermined dividing line 13. Figure 3 Near the dividing line 13 of the device 15 shown, there are approximately L-shaped markings 17a, approximately circular markings 17b, approximately square markings 17c, and approximately cross-shaped markings 17d.

[0046] like Figure 2 As shown, an adhesive tape (cutting tape) 19 is attached to the back side 11b of the wafer 11 before cutting. The tape consists of a circular substrate layer and a resin adhesive layer (paste layer) disposed on one side of the substrate layer. The substrate layer is formed of resin.

[0047] The wafer 11 is attached to the center of the adhesive tape 19, and a metal ring-shaped frame 21 is attached to the outer periphery of the adhesive tape 19. Thus, a wafer unit 23 is formed in which the wafer 11 is supported by the frame 21 with the help of the adhesive tape 19.

[0048] like Figure 1 As shown, a touch panel 14 is provided on the front surface 6a of the cover 6 of the cutting device 2. The touch panel 14 is, for example, a touch panel type liquid crystal display, which also serves as an input device for the operator to input instructions to the control unit 16 (described later) and a display device for displaying images acquired by the camera unit 10 and various processing conditions, etc.

[0049] Alternatively, a monitor or display device that only functions as a display device can be used instead of the touch panel 14. However, in this case, a user interface such as a keyboard, mouse, trackball, or joystick can be used as an input device.

[0050] The cutting device 2 is equipped with a control unit 16 for controlling the actions of each component. The control unit 16 controls, for example, the actions of the cutting unit 8, the camera unit 10, the chuck table 12, the touch panel 14, the X-axis moving mechanism, and the Y-axis and Z-axis moving mechanisms.

[0051] The control unit 16 may be composed of, for example, a computer, which includes: a processing device such as a processor (Central Processing Unit); a main storage device such as DRAM (Dynamic Random Access Memory); and auxiliary storage devices such as flash memory, hard disk drives, and solid-state drives.

[0052] The auxiliary storage device stores software containing a prescribed program. The function of the control unit 16 is achieved by operating the processing device and the like according to the software. Figure 4 This is a diagram illustrating the structure of the control unit 16.

[0053] like Figure 4 As shown, the control unit 16 has functional blocks that perform various processing on images captured by the camera unit 10. One of the functional blocks is the information acquisition unit 16a, which performs known labeling processing on a binarized image containing one or more labels 17.

[0054] For example, the information acquisition unit 16a assigns label number 1 to each pixel located on and inside the boundary line of the mark 17a, and assigns label number 0 to each pixel located outside the boundary line of the mark 17a. In this way, the information acquisition unit 16a acquires information about the coordinates and label numbers corresponding to each pixel.

[0055] Figure 5 This diagram illustrates an example of the marking process for one mark 17a. Figure 5 In this diagram, for convenience, one pixel is represented by a circle. Figure 5 The example shown is that the mark 17a is composed of 29 × 29 pixels in the horizontal and vertical directions, but the number of pixels constituting the mark 17a is not limited to this example.

[0056] The information acquisition unit 16a determines the positions of the vertical and horizontal ends of each pixel with label number 1. Specifically, the information acquisition unit 16a determines the upper end position Y. U and the lower position Y D and the left end position X L and the right end position X R .

[0057] exist Figure 5 For ease of explanation, the diagram shows (X, Y, label number) obtained by adding label numbers to the coordinates. Additionally, in... Figure 5 In the image, several coordinates (X, Y, Z) located at the top are representatively shown. U Y U Two of them are shown. Similarly, the two coordinates (X, Y, Z) at the bottom are shown representatively. D Y D ), the two coordinates located on the left (X) L Y L ) and the two coordinates located on the right (X) R Y R ).

[0058] Information acquisition unit 16a determines the center coordinates (X) of the longitudinal and transverse centers of one or more markers 17. C Y C For example, the information acquisition unit 16a determines the information based on the upper position Y. U and the lower position Y D The average value is used to calculate the longitudinal center position Y. C According to the left end position X L and the right end position X R The average value is used to calculate the lateral center position X. C .

[0059] Upper position YU The lower position Y D Left end position X L Right end position X R and center coordinates (X) C Y C ) becomes the circumscribed rectangle 25 constituting mark 17 (refer to Figure 6 The information is as follows. In addition, in this embodiment, for ease of understanding, an example of the external rectangle 25 being displayed on the screen of the touch panel 14 is described, but the external rectangle 25 may not necessarily be displayed on the screen.

[0060] like Figure 6 As shown, a quadrilateral frame line 27, consisting of a crosshair and a square outer frame surrounding the crosshair, is displayed in the center of the shooting area of ​​the camera unit 10. Frame line adjustment part 16b (see reference) Figure 4 The position and size of the frame line 27 relative to the outer rectangle 25 are automatically adjusted so that the outer rectangle 25 is contained within the frame line 27.

[0061] Specifically, the frame adjustment unit 16b first activates the X-axis moving mechanism and the Y-axis and Z-axis moving mechanism, according to the center coordinates (X, Z) of the outer rectangle 25 of a mark 17. C Y C The camera unit 10 moves its shooting area by moving towards the center of the frame line 27 (i.e., the intersection of the cross lines).

[0062] Next, the frame line adjustment unit 16b adjusts the relative size of the frame line 27 with respect to the circumscribed rectangle 25 in such a way that the distance between the frame line 27 and the circumscribed rectangle 25 located within the frame line 27 is a predetermined distance.

[0063] For example, the spacing between the frame line 27 and the circumscribed rectangle 25 can be adjusted to a distance corresponding to 10 pixels, but this spacing is not limited to a distance corresponding to 10 pixels and can be set to any distance. The resized frame line 27 is then displayed on the touch panel 14 for confirmation.

[0064] The control unit 16 has an alignment mark registration section 16c (see reference). Figure 4 The alignment mark registration unit 16c designates the adjusted frame line 27 and the area inside the frame line 27 containing one or more marks 17 as alignment marks 29 (see reference). Figure 8 (B) is registered in the designated storage area of ​​the control unit 16. Thus, the alignment mark 29 is set in the cutting device 2.

[0065] In this embodiment, the control unit 16 automatically adjusts the position and size of the frame line 27 according to the mark 17. Therefore, the alignment mark 29 can be automatically set within a specified range based on the shape and size of the mark 17, without relying on the operator's sense of touch.

[0066] Next, refer to Figures 4 to 9 The method for setting the alignment mark 29 in the first embodiment (i.e., the method for performing the teaching process) will be described. In the first embodiment, one mark 17 is registered as the alignment mark 29. Figure 9 This is a flowchart of the method for setting alignment mark 29.

[0067] First, the back side 11b of the wafer 11 is held by the holding surface 12a across the adhesive tape 19. Then, the operator observes the front side 11a using the camera unit 10 and photographs one or more marks 17 that may be used as alignment marks 29 (photographing step S10) (see reference). Figure 4 ).

[0068] Next, the information acquisition unit 16a acquires information about the circumscribed rectangles 25 of each of the more than one marker 17 captured in the shooting step S10 (i.e., Figure 5 The upper position Y U The lower position Y D Left end position X L Right end position X R and center coordinates (X) C Y C (Information acquisition step S20).

[0069] Figure 6 This diagram shows an example of a screen displaying the circumscribed rectangle 25 with each of the markings 17. Figure 6 The diagram shows the outer rectangle 25a marked 17a, the outer rectangle 25b marked 17b, the outer rectangle 25c marked 17c, and the outer rectangle 25d marked 17d.

[0070] In the first embodiment, after the information acquisition step S20, the operator touches the display area of ​​a mark 17 with a finger, thereby specifying a mark 17 by means of the touch panel 14. Figure 7 This diagram illustrates a scenario where the operator specifies a mark 17a. Additionally, in... Figure 7 In this text, for convenience, pictographs are used to represent the operator's fingers and hands.

[0071] As indicated by the designated mark 17a, the frame adjustment unit 16b moves the shooting area in such a way that the center of the circumscribed rectangle 25a moves toward the center of the frame line 27. Figure 7(The dashed arrow). Then, the frame line adjustment part 16b adjusts the size of the frame line 27 in such a way that the interval between the circumscribed rectangle 25a and the frame line 27 is a predetermined distance (frame line adjustment step S30).

[0072] Figure 8 (A) is a diagram showing the frame 27, which has been repositioned and resized. Figure 8 In (A), for ease of explanation, a pattern is marked on mark 17a to indicate the range of mark 17a, but the pattern is not displayed in the actual picture.

[0073] After the frame line adjustment step S30, the alignment mark registration unit 16c registers the frame line 27 whose size has been adjusted and the area containing the mark 17a inside the frame line 27 as alignment mark 29 in the designated storage area of ​​the control unit 16 (registration step S40).

[0074] Figure 8 Figure (B) shows the alignment mark 29 set in the cutting device 2 after steps S10 to S40. Additionally, in Figure 8 In (B), for the purpose of making the outer periphery of the alignment mark 29 clear, the part corresponding to the square of the frame line 27 is indicated by a dashed line, but the dashed line is not shown in the actual alignment mark 29.

[0075] In this embodiment, the position and size of the frame line 27 are automatically adjusted according to the mark 17a. Therefore, the alignment mark 29 can be automatically set within a specified range based on the shape and size of the mark 17a, without relying on the operator's feel.

[0076] Next, the second embodiment will be described. In the second embodiment, the area containing a plurality of marks 17 is set as alignment marks 29 using the cutting device 2. First, marks 17a, 17b, 17c, and 17d that may be used as alignment marks 29 are photographed (photographing step S10).

[0077] Next, the information acquisition unit 16a acquires the upper position Y of each of the markers 17a, 17b, 17c, and 17d. U The lower position Y D Left end position X L Right end position X R and center coordinates (X) C Y C (Information acquisition step S20). That is, acquire the information of the outer rectangles 25 that constitute the four markers 17.

[0078] In the second embodiment, after the information acquisition step S20, the operator touches the display area corresponding to any area surrounded by the marks 17a, 17b, 17c and 17d with a finger. Figure 10 (A) is a diagram showing a case where the operator specifies an arbitrary area 31 surrounded by multiple markers 17.

[0079] The information acquisition unit 16a of the second embodiment determines, based on the operator's designation, all the marks 17 that are at least a portion of the area within a rectangle 33 of a predetermined size centered on region 31, and determines that the operator has designated all the marks 17.

[0080] exist Figure 10 In the example shown in (A), a portion of each of the four marks 17a, 17b, 17c and 17d is located within rectangle 33, so the information acquisition unit 16a determines that the operator has specified the four marks 17a, 17b, 17c and 17d.

[0081] When multiple markers 17 are specified, the information acquisition unit 16a acquires information about the outer rectangle 35 that is integrally bounded to the multiple markers 17. For example, the information acquisition unit 16a acquires information about the outer rectangle 35 that is integrally bounded to the four markers 17 from the information about the outer rectangle 25 that is integrally bound to the four markers 17.

[0082] exist Figure 10 In example (A), the information acquisition unit 16a determines the position Y of the upper end of the marker 17a or 17b. U The lower position Y of mark 17d D The left end position X of mark 17b L And the right-hand position X marked 17a or 17d R Get the top position Y of the circumscribed rectangle 35 U The lower position Y D Left end position X L and the right-hand position X R Information.

[0083] Additionally, the information acquisition unit 16a determines the position of the upper end Y of the circumscribed rectangle 35. U and the lower position Y D The average value is used to calculate the longitudinal center position Y of the circumscribed rectangle 35. C Based on the left end position X of the circumscribed rectangle 35 L and the right end position X R The average value is used to calculate the horizontal center position X of the circumscribed rectangle 35. C Therefore, the center coordinates (X, Y) of the circumscribed rectangle 35 are obtained. C Y C ).

[0084] Then, based on the four marked 17, the frame line adjustment unit 16b moves the shooting area in such a way that the center of the circumscribed rectangle 35 moves toward the center of the frame line 27. Furthermore, the size of the frame line 27 is adjusted so that the circumscribed rectangle 35 is housed within the frame line 27 and the distance between the circumscribed rectangle 35 and the frame line 27 is a predetermined distance (frame line adjustment step S30).

[0085] Figure 10 (B) is a diagram showing the frame line 27 after frame line adjustment step S30. After frame line adjustment step S30, the alignment mark registration unit 16c registers the frame line 27 whose size has been adjusted and the area inside the frame line 27 containing marks 17a, 17b, 17c and 17d as alignment marks 29 (registration step S40).

[0086] In this embodiment, the size of the frame line 27 is automatically adjusted based on the shape, size, and configuration of the four markers 17. Therefore, the alignment markers 29 can be automatically set within a specified range based on the shape, size, and configuration of the multiple markers 17, without relying on the operator's sense of touch.

[0087] Next, the third embodiment will be described. In the third embodiment, the shooting step S10 and the information acquisition step S20 are performed in the same way as in the second embodiment. However, in the third embodiment, the operator touches the display area near the corner of one mark 17 with a finger so that there is only one mark 17 within the rectangle 33.

[0088] Figure 11 Figure (A) shows a scenario where the operator touches the display area near the lower right corner of mark 17d with their finger. In this way, the operator only specifies a portion of mark 17d located within a rectangle 33 centered on the area 31 to the lower right of mark 17d.

[0089] According to the operator's instructions, the shooting area is moved from the center of the circumscribed rectangle 25d to the center of the frame line 27, and the size of the frame line 27 is adjusted so that the distance between the circumscribed rectangle 25d and the frame line 27 is a predetermined distance (frame line adjustment step S30).

[0090] Figure 11 (B) is a diagram showing the frame line 27 after frame line adjustment step S30. In this embodiment, the mark 17d can be selected by specifying the vicinity of the display area of ​​the mark 17d in a rectangle 33 that includes a portion of the mark 17d. In addition, the alignment mark 29 can be automatically set within a specified range according to the shape and size of the selected mark 17d.

[0091] Furthermore, the structure and method of the above embodiments can be appropriately modified and implemented as long as they do not depart from the scope of the present invention. The mark 17 can be formed on the device 15 as in the above embodiments, or it can be formed on the dividing predetermined line 13. In addition, the mark 17 is not limited to a geometric shape and can also be text, numbers, etc.

[0092] Furthermore, in the above embodiment, the example of the cutting device 2 was described as a processing apparatus, but the processing apparatus could also be a laser processing apparatus (not shown) that uses a laser beam to process the wafer 11. In the laser processing apparatus, a laser processing unit is provided instead of the cutting unit 8. The laser processing unit includes a laser oscillator for generating a pulsed laser beam, a focusing lens for focusing the laser beam, and the like.

[0093] The laser beam can also have a wavelength that can penetrate the wafer 11. In this case, the focusing point of the pulsed laser beam is positioned inside the wafer 11, and the wafer 11 is processed by multiphoton absorption (so-called stealth dicing). The laser beam can also have a wavelength that is absorbed by the wafer 11. In this case, the wafer 11 is ablated using a pulsed laser beam.

Claims

1. A method for setting alignment marks, wherein in a processing apparatus for processing a wafer on its front side having multiple marks formed thereon, a region containing one or more marks specified by an operator is set as alignment marks, characterized in that, The method for setting the alignment mark has the following steps: The imaging step involves the imaging unit capturing images of one or more marks formed on the chip. The information acquisition step involves acquiring information about the circumscribed rectangles of each of the one or more markers captured by the shooting step. In the frame adjustment step, after the information acquisition step, based on the case where one or more of the one or more marks have been specified, the center of the outer rectangle of the entire set of the one or more marks is moved toward the center of the frame line of the quadrilateral to be set in the processing device for aligning the marks. The position and size of the frame line relative to the outer rectangle are automatically adjusted in such a way that the outer rectangle is contained within the frame line and the distance between the outer rectangle and the frame line is adjusted to a predetermined distance; and In the registration step, the area containing one or more marks inside the frame line, whose size has been adjusted, is registered in the processing device as an alignment mark.

2. A processing apparatus capable of setting an area containing one or more marks specified by an operator as alignment marks when processing a wafer with multiple marks formed on its front side, characterized in that, The processing device has the following features: A chuck stage that attracts and holds the wafer; The imaging unit has an imaging element, which is disposed above the chuck stage and performs imaging on the wafer that is attracted and held on the chuck stage; A display device that displays images captured by the imaging unit; A control unit, having a processor, controls the operation of the chuck stage, the imaging unit, and the display device; and An input device that inputs operator instructions to the control unit. The control unit includes: The information acquisition unit acquires information about the circumscribed rectangles of each of the one or more marks that are captured by the shooting unit. The frame line adjustment unit, depending on whether one or more of the marks are specified by the input device, moves the center of the outer rectangle of the entire mark or the marks toward the center of the frame line of the quadrilateral used to align the marks in the processing device, and automatically adjusts the position and size of the frame line relative to the outer rectangle in such a way that the outer rectangle is housed within the frame line and the distance between the outer rectangle and the frame line is adjusted to a predetermined distance; as well as The alignment mark registration unit registers the area containing one or more marks inside the frame line, whose size has been adjusted, as alignment marks.

Images