A spacing adjustable conveyor device for through-hole reflow soldering

Abstract

The invention discloses a spacing-adjustable conveying device for through-hole reflow soldering, which belongs to a conveying device, comprising a fixed frame, two groups of symmetrically arranged conveyor belts, two mutually parallel negative pressure tracks and a pneumatic clamping mechanism, wherein the two groups of conveyor belts are arranged on the fixed frame, the negative pressure track is fixedly connected to the fixed frame, and the negative pressure track is located on one side of the conveyor belt; when a slider is clamped into the negative pressure track, the telescopic rod is driven by air pressure to extend until the clamping claw clamps the PCB board on the guide plate, and enters the welding processing area under the transportation of the conveyor belt; after the slider leaves the negative pressure track, the return spring drives the telescopic rod to retract, and the clamping claw is released from the PCB board, thereby realizing material dropping; the telescopic rod automatically adapts to the position of the PCB board, thereby being able to clamp PCB boards of different lengths and specifications, having strong versatility, and no need to stop the machine for adjustment when replacing and processing PCB boards of different specifications, thereby saving working hours.

Description

Technical Field

[0001] The invention relates to a conveying device, and in particular to a spacing-adjustable conveying device for through-hole reflow soldering. Background Art

[0002] Reflow soldering is a process in which air or nitrogen is heated to a sufficiently high temperature and then blown toward a circuit board with components already attached, so that the solder on both sides of the components melts and then bonds to the mainboard. Reflow soldering is widely used for soldering of SMD components and through-hole soldering of plug-in components.

[0003] Chinese patent (CN201821164339.5) discloses a conveying device for a reflow soldering machine with adjustable spacing, which belongs to the field of reflow soldering technology and solves the technical problem that the existing reflow soldering machine can only operate one type of PCB board. The key points of its technical solution are that it includes a machine body with an input end and an output end, a conveying track is arranged in the machine body, a PCB board is mounted on the conveying track, a conveying frame body is arranged in the machine body, the conveying frame body includes a first conveying frame and a second conveying frame facing each other, the first conveying frame is fixedly connected to the machine body, the conveying track includes a first conveying chain rotatably connected to the first conveying frame and a second conveying chain rotatably connected to the second conveying frame, and an adjusting screw is also rotatably connected to the machine body, the adjusting screw is perpendicular to the conveying direction of the conveying track, and the two ends of the adjusting screw are respectively rotatably connected to the machine body and the first conveying frame, and are threadedly connected to the second conveying frame.

[0004] At present, when reflow soldering is performed on circuit boards of different specifications, the conveying device in the reflow soldering machine needs to be adjusted. The existing conveying devices all perform overall spacing adjustment, which will require the width of the circuit boards being reflow soldered to remain consistent. Then, when replacing circuit boards of different specifications for reflow soldering, the spacing of the conveying device can only be adjusted after all the previous batch of circuit boards of the light strip are taken out from the conveying device, which will increase the processing time of the light strip and waste necessary working hours. Summary of the invention

[0005] The purpose of the present invention is to propose a conveyor with adjustable spacing for through-hole reflow soldering in order to solve the problem that the conveyor can only adjust the overall width and all circuit boards in the conveyor need to be taken out before the spacing of the conveyor can be adjusted, resulting in long downtime and waiting time and waste of working hours.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a spacing adjustable conveying device for through-hole reflow soldering, which comprises a fixed frame, two groups of symmetrically arranged conveyor belts, two mutually parallel negative pressure tracks and a pneumatic clamping mechanism, the two groups of conveyor belts are arranged on the fixed frame, the negative pressure track is fixedly connected to the fixed frame, and the negative pressure track is located on one side of the conveyor belt, multiple groups of pneumatic clamping mechanisms are fixedly connected to the conveyor belt, and one end of the pneumatic clamping mechanism is slidably connected in the negative pressure track;

[0007] The pneumatic clamping mechanism includes a telescopic rod, a slider and a clamping claw. The telescopic rod is fixedly connected to the conveyor belt, the slider is arranged at one end of the telescopic rod, the slider is clamped in the negative pressure track, the clamping claw is fixedly connected to the other end of the telescopic rod, and an airway is opened on the slider, and the airway communicates the interior of the negative pressure track and the interior of the telescopic rod.

[0008] As a further description of the above technical solution:

[0009] The cross section of the negative pressure track is concave, and the cross section of the slider is T-shaped.

[0010] As a further description of the above technical solution:

[0011] A sealing strip is arranged on the negative pressure track, and the sealing strip abuts against the side wall of the sliding block.

[0012] As a further description of the above technical solution:

[0013] Both ends of the negative pressure track are hinged with sealing plates, and the sealing plates are located inside the negative pressure track.

[0014] As a further description of the above technical solution:

[0015] A return spring is connected between the clamping jaw and the sliding block.

[0016] As a further description of the above technical solution:

[0017] The clamping jaw is C-shaped.

[0018] As a further description of the above technical solution:

[0019] A material guide plate is arranged on the fixed frame, the material guide plate is located between the two groups of the conveyor belts, and the material guide plate is located at the end of the conveyor belts.

[0020] As a further description of the above technical solution:

[0021] The clamping jaw is provided with a flat pressing mechanism, which includes a flat pressing plate and an adjusting bolt. The flat pressing plate is located inside the clamping jaw, the adjusting bolt passes through the clamping jaw and is connected to the flat pressing plate, and the adjusting bolt is threadedly connected to the clamping jaw.

[0022] As a further description of the above technical solution:

[0023] The negative pressure track is connected with a plurality of air pressure holes.

[0024] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0025] 1. In the present invention, when the slider is inserted into the negative pressure track, the telescopic rod is driven by air pressure to extend until the clamping claw clamps the PCB board on the guide plate, and enters the welding processing area under the transportation of the conveyor belt. After the slider leaves the negative pressure track, the return spring drives the telescopic rod to retract, and the clamping claw is released from the PCB board, thereby realizing material dropping. The telescopic rod automatically adapts to the position of the PCB board, so that PCB boards of different lengths and specifications can be clamped. It has strong versatility and does not need to stop for adjustment when changing and processing PCB boards of different specifications, saving work time.

[0026] 2. In the present invention, the width of the clamping jaws can be adjusted by turning the adjusting bolt, thereby adapting to PCB boards of different thicknesses, and having strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 The figure is a schematic diagram of the overall structure of a spacing-adjustable conveying device for through-hole reflow soldering.

[0028] Figure 2 for Figure 1 A partial enlarged view of part A.

[0029] Figure 3 The present invention is a schematic diagram of the structure of a negative pressure track in a spacing-adjustable conveying device for through-hole reflow soldering.

[0030] Figure 4 The present invention is a schematic diagram of the structure of a pneumatic clamping mechanism in a spacing-adjustable conveying device for through-hole reflow soldering.

[0031] Legend:

[0032] 1. Fixed frame; 2. Conveyor belt; 3. Negative pressure track; 4. Pneumatic clamping mechanism; 41. Telescopic rod; 42. Slider; 43. Clamping claw; 5. Air duct; 6. Sealing strip; 7. Sealing plate; 8. Return spring; 9. Guide plate; 10. Flat pressing mechanism; 101. Flat pressing plate; 102. Adjusting bolt; 11. Air pressure hole. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] See also Figure 1-4 The present invention provides a technical solution: a spacing adjustable conveying device for through-hole reflow soldering, comprising a fixed frame 1, two groups of symmetrically arranged conveyor belts 2, two mutually parallel negative pressure rails 3 and a pneumatic clamping mechanism 4, wherein the two groups of conveyor belts 2 are arranged on the fixed frame 1, the negative pressure rail 3 is fixedly connected to the fixed frame 1, and the negative pressure rail 3 is located on one side of the conveyor belt 2, multiple groups of pneumatic clamping mechanisms 4 are fixedly connected to the conveyor belt 2, and one end of the pneumatic clamping mechanism 4 is slidably connected to the negative pressure rail 3;

[0035] The pneumatic clamping mechanism 4 includes a telescopic rod 41, a slider 42 and a clamping claw 43, wherein the telescopic rod 41 is fixedly connected to the conveyor belt 2, the slider 42 is arranged at one end of the telescopic rod 41, the slider 42 is clamped in the negative pressure track 3, the clamping claw 43 is fixedly connected to the other end of the telescopic rod 41, and an airway 5 is opened on the slider 42, and the airway 5 communicates the interior of the negative pressure track 3 and the interior of the telescopic rod 41;

[0036] The cross section of the negative pressure track 3 is concave, and the cross section of the slider 42 is T-shaped, which ensures a stable connection between the slider 42 and the negative pressure track 3 and facilitates the slider 42 to slide smoothly along the negative pressure track 3;

[0037] The negative pressure track 3 is provided with a sealing strip 6, which abuts against the side wall of the slider 42 to ensure the sealing between the slider 42 and the negative pressure track 3, so that the airflow in the negative pressure track 3 acts stably on the telescopic rod 41, which is conducive to the clamping claw 43 to clamp the PCB board stably;

[0038] Both ends of the negative pressure track 3 are hinged with sealing plates 7, and the sealing plates 7 are located inside the negative pressure track 3, so that the slider 42 pushes the sealing plates 7 to rotate and smoothly enter and exit when entering and exiting. At other times, the sealing plates 7 block both ends of the negative pressure track 3 under the action of the airflow in the negative pressure track 3 to ensure the airtightness in the negative pressure track 3;

[0039] A return spring 8 is connected between the clamping jaw 43 and the slider 42. After the slider 42 leaves the negative pressure track 3, the telescopic rod 41 loses the air pressure effect in the negative pressure track 3, and the return spring 8 drives the telescopic rod 41 to retract, so that the clamping jaw 43 is separated from the PCB board;

[0040] The clamping jaw 43 is C-shaped;

[0041] The fixing frame 1 is provided with a guide plate 9, which is located between the two groups of conveyor belts 2 and at the end of the conveyor belt 2. When the PCB board is on the guide plate 9, the slider 42 is just inserted into the negative pressure track 3, and the telescopic rod 41 is extended under the action of air pressure, so that the clamping claw 43 clamps the PCB board, thereby bringing the PCB board into the processing area along the conveyor belt 2;

[0042] The clamping jaw 43 is provided with a flat pressing mechanism 10, and the flat pressing mechanism 10 includes a flat pressing plate 101 and an adjusting bolt 102. The flat pressing plate 101 is located in the clamping jaw 43, and the adjusting bolt 102 passes through the clamping jaw 43 and is connected to the flat pressing plate 101. The adjusting bolt 102 is screwed with the clamping jaw 43. The flat pressing plate 101 can be driven to slide in the clamping jaw 43 by screwing the adjusting bolt 102, so as to adapt to PCB boards of different thicknesses, and the versatility is strong.

[0043] The negative pressure track 3 is connected with a plurality of air pressure holes 11, and the plurality of air pressure holes 11 are distributed on the negative pressure track 3, so that the negative pressure track 3 is divided into a plurality of air pressure chambers, so that the slider 42 can obtain the same pressure when it moves to different places in the negative pressure track 3, so that the airflow in the negative pressure track 3 stably acts on the telescopic rod 41, which is conducive to the clamping claw 43 to clamp the PCB board steadily.

[0044] Working principle: First, connect the multiple air pressure holes 11 on the negative pressure track 3 to the external air pressure equipment, so that the negative pressure track 3 is divided into multiple air pressure chambers. At this time, the sealing plates 7 at both ends of the negative pressure track 3 are in a closed state, and the PCB board is placed on the guide plate 9. Secondly, the operation of the conveyor belt 2 drives the telescopic rod 41 to follow the linkage. When the slider 42 is inserted into the negative pressure track 3, the telescopic rod 41 is driven by air pressure to extend until the clamping claw 43 clamps the PCB board on the guide plate 9. Under the transportation of the conveyor belt 2, the slider 42 slides in the negative pressure track 3, and the PCB board enters the welding processing area. Then, after the slider 42 leaves the negative pressure track 3, the return spring 8 drives the telescopic rod 41 to retract, and the clamping claw 43 is released from the PCB board, thereby realizing material dropping. Finally, when processing PCB boards of different thicknesses, the adjusting bolt 102 can be turned to drive the flat pressing plate 101 to slide in the clamping claw 43, thereby adapting to PCB boards of different thicknesses, with strong versatility.

[0045] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A spacing adjustable conveyor device for through-hole reflow soldering, characterized in that: It comprises a fixed frame (1), two groups of symmetrically arranged conveyor belts (2), two mutually parallel negative pressure rails (3) and a pneumatic clamping mechanism (4), wherein the two groups of conveyor belts (2) are arranged on the fixed frame (1), the negative pressure rails (3) are fixedly connected to the fixed frame (1), and the negative pressure rails (3) are located on one side of the conveyor belts (2), and a plurality of groups of pneumatic clamping mechanisms (4) are fixedly connected to the conveyor belts (2), and one end of the pneumatic clamping mechanism (4) is slidably connected to the negative pressure rails (3); The pneumatic clamping mechanism (4) comprises a telescopic rod (41), a slider (42) and a clamping claw (43); the telescopic rod (41) is fixedly connected to the conveyor belt (2); the slider (42) is arranged at one end of the telescopic rod (41); the slider (42) is clamped in the negative pressure track (3); the clamping claw (43) is fixedly connected to the other end of the telescopic rod (41); an air passage (5) is provided on the slider (42); and the air passage (5) communicates the interior of the negative pressure track (3) and the interior of the telescopic rod (41).

2. The pitch-adjustable conveying device for through-hole reflow soldering according to claim 1, characterized in that: The cross section of the negative pressure track (3) is concave, and the cross section of the slider (42) is T-shaped.

3. The pitch-adjustable conveying device for through-hole reflow soldering according to claim 1, characterized in that: A sealing strip (6) is provided on the negative pressure track (3), and the sealing strip (6) abuts against the side wall of the sliding block (42).

4. The adjustable spacing conveying device for through-hole reflow soldering according to claim 1, characterized in that: Both ends of the negative pressure track (3) are hinged with sealing plates (7), and the sealing plates (7) are located inside the negative pressure track (3).

5. The pitch-adjustable conveying device for through-hole reflow soldering according to claim 1, characterized in that: A return spring (8) is connected between the clamping jaw (43) and the sliding block (42).

6. The pitch-adjustable conveying device for through-hole reflow soldering according to claim 1, characterized in that: The clamping jaw (43) is C-shaped.

7. The pitch-adjustable conveying device for through-hole reflow soldering according to claim 1, characterized in that: A material guide plate (9) is provided on the fixed frame (1), and the material guide plate (9) is located between the two groups of conveyor belts (2), and the material guide plate (9) is located at the end of the conveyor belt (2).

8. The pitch-adjustable conveying device for through-hole reflow soldering according to claim 1, characterized in that: The clamping jaw (43) is provided with a flat pressing mechanism (10), and the flat pressing mechanism (10) comprises a flat pressing plate (101) and an adjusting bolt (102). The flat pressing plate (101) is located inside the clamping jaw (43), and the adjusting bolt (102) passes through the clamping jaw (43) and is connected to the flat pressing plate (101). The adjusting bolt (102) is threadedly connected to the clamping jaw (43).

9. The pitch-adjustable conveying device for through-hole reflow soldering according to claim 1, characterized in that: The negative pressure track (3) is connected to a plurality of air pressure holes (11).

Images