Multi-core cable with connector

Abstract

A multi-core cable with a connector has a multi-core cable and a connector. The connector has a substrate that has a first surface, a second surface, and a third surface that connects the first surface and the second surface and serves as the tip in the connector insertion direction. The substrate has: a first pad group including a plurality of first pads that are provided on the first surface and are connected to the central conductors of the wires of the multi-core cable; a second pad group including a plurality of second pads that are provided on the first surface, are arranged side by side in a first direction parallel to the third surface, and are connected to the first pads; a first ground layer that is provided between the first surface and the second surface and extends in a second direction parallel to the first surface and perpendicular to the first direction; and a conductive member that is provided on the side away from the first pad group with respect to the second pad group in the second direction and is connected to the first ground layer. The conductive member is located on the side closer to the first surface than the first ground layer in a third direction perpendicular to the first surface.

Description

Technical Field

[0001] The present disclosure relates to a multi-core cable with a connector.

[0002] This application claims priority based on Japanese Application No. 2020-021343 filed on February 12, 2020, and incorporates by reference the entire disclosure of the Japanese application. Background Art

[0003] As a multi-core cable with a connector for transmission between electronic devices, a multi-core cable with a connector that can be connected to an electronic device regardless of the up and down of the connector has been disclosed (Patent Document 1).

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2017-69152 Summary of the Invention

[0007] Solution to the Problem

[0008] The multi-core cable with a connector of the present disclosure includes: a multi-core cable including a plurality of electric wires; and a connector connected to one end of the multi-core cable. The connector has a substrate having a first surface, a second surface opposite to the first surface, and a third surface that is the top surface in the connector insertion direction and connects the first surface and the second surface. The substrate has: a first pad group including a plurality of first pads disposed on the first surface and connected to the center conductors of the electric wires; a second pad group including a plurality of second pads disposed on the first surface and arranged side by side in a first direction parallel to the third surface when the first surface is viewed from above and connected to the first pads; a first ground layer disposed between the first surface and the second surface and extending in a second direction parallel to the first surface and perpendicular to the first direction; and a conductive member disposed on a side away from the first pad group with respect to the second pad group in the second direction and connected to the first ground layer, the conductive member being located on the first surface side of the first ground layer in a third direction perpendicular to the first surface. Brief Description of the Drawings

[0009] Figure 1 It is a perspective view showing the configuration of a multi-core cable with a connector according to an embodiment.

[0010] Figure 2 It is a diagram showing an example of pads provided on a first substrate and connector pads.

[0011] Figure 3It is a cross-sectional view showing an example of the cross-sectional structure of the first substrate.

[0012] Figure 4 It is a diagram showing an example of pads provided on the second substrate and connector pads.

[0013] Figure 5 It is a cross-sectional view showing an example of the cross-sectional structure of the second substrate.

[0014] Figure 6 It is a cross-sectional view showing a modified example of the cross-sectional structure of the first substrate. Detailed implementation mode

[0015] [Problems to be solved by the present disclosure]

[0016] According to the multi-core cable described in Patent Document 1, although the desired purpose can be achieved, when the frequency of the transmitted signal becomes high, reflection may occur.

[0017] An object of the present disclosure is to provide a multi-core cable with a connector that can reduce signal reflection.

[0018] [Effects of the present disclosure]

[0019] According to the present disclosure, signal reflection can be reduced.

[0020] The following describes the implementation methods.

[0021] [Description of the implementation mode of the present disclosure]

[0022] [1] A multi-core cable with a connector according to one aspect of the present disclosure includes: a multi-core cable including a plurality of electric wires; and a connector connected to one end of the multi-core cable. The connector has a substrate having a first surface, a second surface opposite to the first surface, and a third surface that is the tip in the connector insertion direction and connects the first surface and the second surface. The substrate has: a first pad group including a plurality of first pads provided on the first surface and connected to the center conductors of the electric wires; a second pad group including a plurality of second pads provided on the first surface and arranged side by side in a first direction parallel to the third surface when the first surface is viewed from above, and connected to the first pads; a first ground layer provided between the first surface and the second surface and extending in a second direction parallel to the first surface and perpendicular to the first direction; and a conductive member provided on the side of the second pad group away from the first pad group in the second direction and connected to the first ground layer. The conductive member is located on the side closer to the first surface than the first ground layer in a third direction perpendicular to the first surface.

[0023] The conductive member is disposed on a side away from the first pad group with respect to the second pad group in the second direction, is connected to the first ground layer, and is located on the first surface side of the first ground layer in the third direction. Further, a connector pin that is connected to the second pad group and for signal transmission is disposed above the conductive member. Therefore, even when the frequency of the signal transmitted via the connector pin is high, for example, even when the frequency is around 20 GHz, it is possible to suppress the mismatch of the differential impedance at the connection portion between the connector pin and the second pad group, and thus suppress the reflection of the signal near the connection portion.

[0024] 〔2〕In 〔1〕, it may be that the conductive member has: a second ground layer that is located on the first surface side of the first ground layer in the third direction; and a conduction path that connects the first ground layer and the second ground layer. It is easy to make the conductive member located on the first surface side of the first ground layer.

[0025] 〔3〕In 〔1〕 or 〔2〕, it may be that a part of the conductive member is exposed on the first surface. It is easy to suppress the mismatch of the differential impedance.

[0026] 〔4〕In 〔1〕 to 〔3〕, it may be that the conductive member has a third pad for grounding, and the third pad is disposed on the first surface on a side away from the first pad group with respect to the second pad group in the second direction. It is easy to shorten the distance between the connector pin and the conductive member through the third pad.

[0027] 〔5〕In 〔4〕, it may be that the third pad includes a portion arranged side by side with the plurality of second pads in the first direction. It is easy to keep the potential of the third pad at ground.

[0028] 〔6〕In 〔4〕 or 〔5〕, it may be that the thickness of the third pad is equal to the thickness of the plurality of second pads. It is easy to form the third pad simultaneously with the second pad group.

[0029] 〔7〕In 〔4〕 to 〔6〕, it may be that the dimension of the third pad in the second direction is 0.5 mm or more and 2.0 mm or less. It is possible to control the size of the substrate and suppress reflection appropriately.

[0030] 〔8〕In 〔1〕 to 〔7〕, it may be that the first pad and the second pad are pads for signal transmission. It is possible to suppress the reflection of the signal transmitted via the first pad and the second pad.

[0031] 〔9〕In 〔1〕 to 〔8〕, it may be that the multi-core cable includes a ground conductor, and the substrate has a fourth pad that is disposed on the first surface and is connected to the first ground layer and the ground conductor. It is possible to easily connect the first ground layer and the ground conductor.

[0032] 〔10〕In [9], it is possible that the electric wire is a coaxial electric wire including an insulating layer formed on the outer periphery of the center conductor and an outer conductor formed on the outer periphery of the insulating layer, and the ground conductor is the outer conductor. The outer conductor of the coaxial electric wire can be used as the ground conductor.

[0033] 〔11〕In [1] to

[10] , it is possible that the substrate includes a plurality of wirings respectively connected to any one of the plurality of first pads, and the plurality of wirings are connected to any one of the plurality of second pads. The first pad and the second pad can be easily connected.

[0034] 〔12〕A multi-core cable with a connector according to another aspect of the present disclosure includes: a multi-core cable including a plurality of coaxial electric wires; and a connector connected to one end of the multi-core cable. The coaxial electric wire includes: a center conductor; an insulating layer formed on the outer periphery of the center conductor; and an outer conductor formed on the outer periphery of the insulating layer. The connector has a substrate having a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface and serving as the top surface in the connector insertion direction. The substrate has: a first pad group including a plurality of first pads provided on the first surface and connected to the center conductor; a second pad group including a plurality of second pads provided on the first surface separately from the first pads, arranged side by side in a first direction parallel to the third surface when the first surface is viewed from above, and connected to the first pads inside the substrate; a ground layer provided between the first surface and the second surface and extending in a second direction parallel to the first surface and perpendicular to the first direction; a third pad provided on the first surface on a side away from the first pad group with respect to the second pad group in the second direction and connected to the ground layer; and a fourth pad provided on the first surface and connected to the ground layer and the outer conductor.

[0035] The third pad is provided on the first surface on a side away from the first pad group with respect to the second pad group in the second direction, connected to the ground layer. And a connector pin connected to the second pad group and for signal transmission is provided above the third pad. Therefore, even when the frequency of the signal transmitted via the connector pin is high, for example, even when the frequency is about 20 GHz, it is possible to suppress the mismatch of the differential impedance at the connection portion between the connector pin and the second pad group, thereby suppressing the reflection of the signal near the connection portion.

[0036] [Details of the embodiments of the present disclosure]

[0037] Hereinafter, embodiments of the present disclosure will be described in detail, but the present embodiments are not limited thereto. It should be noted that in this specification and the drawings, components having substantially the same functional configuration are denoted by the same reference numerals, and thus redundant descriptions are sometimes omitted.

[0038] 〔Configuration of Multi-Core Cable〕

[0039] First, the configuration of the multi-core cable with connectors according to the embodiment will be described. Figure 1 It is a perspective view showing the configuration of the multi-core cable with connectors according to the embodiment.

[0040] The multi-core cable 1 with connectors according to the present embodiment can be used, for example, as a cable for connecting electronic devices (not shown) to each other. It should be noted that Figure 1 U, D, F, B, R, L shown, etc. represent directions in the multi-core cable 1 with connectors. U is the upper side, D is the lower side, F is the front side, B is the rear side, R is the right side, and L is the left side. The RL direction is an example of the first direction, the FB direction is an example of the second direction, and the UD direction is an example of the third direction.

[0041] As shown in Figure 1 the multi-core cable 1 with connectors has a multi-core cable 2, a first connector 3, and a second connector 4. The first connector 3 is assembled to the end portion on the front F side of the multi-core cable 2. The second connector 4 is assembled to the end portion on the rear B side of the multi-core cable 2.

[0042] The multi-core cable 1 with connectors has a connector plug 5 for connecting to a socket (not shown) of an electronic device in front F of the first connector 3 and behind B of the second connector 4. As the housing of the connector plug 5, a substantially long cylindrical metal shell 5a is provided. Inside the metal shell 5a, a pin holding plate 5b is accommodated. The pin holding plate 5b is a member for holding contact pins 5c that connect to a socket (not shown) of an electronic device. The contact pins 5c are held by the pin holding plate 5b in an arrangement such that they can be connected to the socket of the electronic device even when the orientations of the left L, right R, upper U, and lower D of the first connector 3 and the second connector 4 are reversed.

[0043] The first connector 3 includes inside thereof a first substrate 11 to which a multi-core cable 2 is connected. The first substrate 11 has a first surface 11A, a second surface 11B, and a third surface 11C. In this example, the first surface 11A is the upper U-side surface of the first substrate 11, the second surface 11B is the lower D-side surface of the first substrate 11, and the third surface 11C is the front F-side surface of the first substrate 11. The first substrate 11 has: a first circuit 12; a pad group 40f connected to an end portion on the rear B-side of the first circuit 12; and a connector pad group 60f connected to an end portion on the front F-side of the first circuit 12. The pad group 40f and the connector pad group 60f are provided on the first surface 11A and the second surface 11B of the first substrate 11. For example, the thickness of the first substrate 11 is 0.5 mm to 1.0 mm. The first substrate 11 is formed in a substantially flat plate shape.

[0044] The second connector 4 includes inside thereof a second substrate 13 to which a multi-core cable 2 is connected. The second substrate 13 has a first surface 13A, a second surface 13B, and a third surface 13C. In this example, the first surface 13A is the upper U-side surface of the second substrate 13, the second surface 13B is the lower D-side surface of the second substrate 13, and the third surface 13C is the rear B-side surface of the second substrate 13. The second substrate 13 has: a second circuit 14; a pad group 40b connected to an end portion on the front F-side of the second circuit 14; and a connector pad group 60b connected to an end portion on the rear B-side of the second circuit 14. The pad group 40b and the connector pad group 60b are provided on the first surface 13A and the second surface 13B of the second substrate 13. For example, the thickness of the second substrate 13 is 0.5 mm to 1.0 mm. The second substrate 13 is formed in a substantially flat plate shape.

[0045] The multi-core cable 2 includes a plurality of, for example, four coaxial wire pairs as high-speed signal lines and a plurality of, for example, seven wires. For example, each coaxial wire pair is composed of two wires in a pair and is used for transmitting high-speed differential signals. The coaxial wires constituting the coaxial wire pair sequentially have a center conductor, an insulating layer, an outer conductor, and an outer sheath from the center to the outside. The wires are composed of insulated wires having a center conductor and an outer sheath. The outer conductor is an example of a ground conductor and includes a shield wire and a shielding layer. Signals can be easily transmitted at high speed through the coaxial wires.

[0046] Next, the pads included in the pad group 40f and the connector pads included in the connector pad group 60f will be described. Figure 2 is a diagram showing an example of the pads and the connector pads provided on the first substrate 11. In Figure 2 is shown the upper surface (first surface 11A) of the first substrate 11 as viewed from the upper U-side of the multi-core cable 1 with a connector. The pads and the connector pads provided on the lower surface (second surface 11B) of the first substrate 11 are shown in a perspective view of the first substrate 11.

[0047] The pad group 40f has a first-side pad group 40Af provided on the first side 11A and a second-side pad group 40Bf provided on the second side 11B. The first-side pad group 40Af has pads 41, 42, 43, 44, 45, 46, 47, 48, 49, and 50. The second-side pad group 40Bf has pads 51, 52, 53, 54, 55, 56, 57, 58, and 59.

[0048] As Figure 2 shown, on the first side 11A, pad 46 is provided to the left L of pad 45, and between pad 45 and pad 46, pads 47, 48, 49, and 50 are provided in sequence from the right R toward the left L. On the first side 11A, pads 41 and 42 are provided in front F of pad 45, and pads 43 and 44 are provided in front F of pad 46. On the first side 11A, a connection pad 74 connecting pads 45 and 46 is provided behind B of pads 47 to 50. The connection pad 74 may be included in the first-side pad group 40Af.

[0049] As Figure 2 shown, on the second side 11B, pad 56 is provided to the left L of pad 55, and between pad 55 and pad 56, pads 57, 58, and 59 are provided in sequence from the right R toward the left L. On the second side 11B, pads 51 and 52 are provided in front F of pad 55, and pads 53 and 54 are provided in front F of pad 56. On the second side 11B, a connection pad 76 connecting pads 55 and 56 is provided behind B of pads 57 to 59. The connection pad 76 may be included in the second-side pad group 40Bf.

[0050] The first-side pad group 40Af and the second-side pad group 40Bf are connected to the front F side end of the multi-core cable 2.

[0051] The center conductors of each of one coaxial wire pair included in the multi-core cable 2 are connected to pads 41 and 42 on the first side 11A. The outer conductors of each of this coaxial wire pair are connected to pad 45. The center conductors of each of another coaxial wire pair are connected to pads 43 and 44 on the first side 11A. The outer conductors of each of this coaxial wire pair are connected to pad 46. The center conductors of each of another coaxial wire pair are connected to pads 51 and 52 on the second side 11B. The outer conductors of each of this coaxial wire pair are connected to pad 55. The center conductors of each of another coaxial wire pair are connected to pads 53 and 54 on the second side 11B. The outer conductors of each of this coaxial wire pair are connected to pad 56.

[0052] One of the seven wires included in the multi-core cable 2 is connected to the pad 47 on the first surface 11A. Another wire is connected to the pad 48 on the first surface 11A. Another wire is connected to the pad 49 on the first surface 11A. Another wire is connected to the pad 50 on the first surface 11A. Another wire is connected to the pad 57 on the second surface 11B. Another wire is connected to the pad 58 on the second surface 11B. Another wire is connected to the pad 59 on the second surface 11B.

[0053] The pads 41 to 44 and 47 to 50 are an example of the first pads, and the pads 41 to 44 and the pads 47 to 50 are included in the first pad group 71Af. The pads 45 and 46 are an example of the fourth pads. The pads 51 to 54 and 57 to 59 are an example of the first pads, and the pads 51 to 54 and the pads 57 to 59 are included in the first pad group 71Bf. The pads 55 and 56 are an example of the fourth pads.

[0054] The connector pad group 60f has a first surface side connector pad group 60Af provided on the first surface 11A and a second surface side connector pad group 60Bf provided on the second surface 11B. The first surface side connector pad group 60Af has connector pads A1, A2, A3, A4, A5, A6, A7, A8, A9, A10, A11, and A12. The connector pads A1 to A12 of the first surface side connector pad group 60Af are arranged in a row in order from the left L to the right R of the first surface 11A. That is, the connector pads A1 to A12 are arranged side by side in the RL direction parallel to the third surface 11C when the first surface 11A is viewed from above. The second surface side connector pad group 60Bf has connector pads B1, B2, B3, B4, B5, B6, B7, B8, B9, B10, B11, and B12. The connector pads B1 to B12 of the second surface side connector pad group 60Bf are arranged in a row in order from the right R to the left L of the second surface 11B. That is, the connector pads B1 to B12 are arranged side by side in the RL direction parallel to the third surface 11C when the second surface 11B is viewed from above. On the first surface 11A, a connection pad 73 connecting the connector pads A1 and A12 is provided in front F of the connector pads A2 to A11. On the second surface 11B, a connection pad 75 connecting the connector pads B1 and B12 is provided in front F of the connector pads B2 to B11. The connection pad 73 may be included in the first surface side connector pad group 60Af. The connection pad 75 may be included in the second surface side connector pad group 60Bf.

[0055] The connector pads A1 and A12 are ground terminals (GND) for grounding. The connector pads A2 and A3 are terminals (TX1+, TX1−) for high-speed signal transmission. The connector pads A4 and A9 are terminals (VBUS) for bus power supply. The connector pad A5 is a Configuration Channel terminal (CC). The connector pads A6 and A7 are terminals (D+, D−) for data signals. The connector pad A8 is a Sideband Use terminal (SBU1). The connector pads A10 and A11 are terminals (RX2+, RX2−) for high-speed signal reception.

[0056] The connector pads B1 and B12 are ground terminals (GND) for grounding. The connector pads B2 and B3 are terminals (TX2+, TX2−) for high-speed signal transmission. The connector pads B4 and B9 are terminals (VBUS) for bus power supply. The connector pad B5 is a terminal (VCONN) for connecting power. The connector pad B8 is a Sideband Use terminal (SBU2). The connector pads B10 and B11 are terminals (RX1+, RX1−) for high-speed signal reception.

[0057] The connector pads A2 to A11 are an example of the second pads, and the connector pads A2 to A11 are included in the second pad group 72Af. The connection pad 73 is an example of the third pad, and the connector pads A1 and A12 are part of the third pad. The connector pads B2 to B11 are an example of the second pads, and the connector pads B2 to B11 are included in the second pad group 72Bf. The connection pad 75 is an example of the third pad, and the connector pads B1 and B12 are part of the third pad.

[0058] The first-side pad group 40Af and the second-side pad group 40Bf are connected to the first-side connector pad group 60Af and the second-side connector pad group 60Bf of the first substrate 11 through the first circuit 12.

[0059] Here, an example of the cross-sectional structure of the first substrate 11 will be described. Figure 3 It is a cross-sectional view showing an example of the cross-sectional structure of the first substrate 11. Figure 3 Corresponds to Figure 2 a cross-sectional view along the line III-III in

[0060] As Figure 3As shown, the first substrate 11 includes five insulating layers 111, 112, 113, 114, and 115 stacked on top of each other. The insulating layer 112 is disposed above the insulating layer 111, the insulating layer 113 is disposed above the insulating layer 112, the insulating layer 114 is disposed above the insulating layer 113, and the insulating layer 115 is disposed above the insulating layer 114. The first substrate 11 further includes: a wiring layer 121 on the lower surface 111B of the insulating layer 111, a wiring layer 122 on the lower surface 112B of the insulating layer 112, a wiring layer 123 on the lower surface 113B of the insulating layer 113, a wiring layer 124 on the upper surface 113A of the insulating layer 113, a wiring layer 125 on the upper surface 114A of the insulating layer 114, and a wiring layer 126 on the upper surface 115A of the insulating layer 115. The upper surface 115A of the insulating layer 115 is the first surface 11A of the first substrate 11, and the lower surface 111B of the insulating layer 111 is the second surface 11B of the first substrate 11. For example, epoxy glass or fluororesin can be used as the material of the insulating layers 111 to 115. The thickness of each of the insulating layers 111 to 115 is, for example, 50 μm or more and 300 μm or less. The material of the wiring layers 121 to 126 can be, for example, copper (Cu). The thickness of each of the wiring layers 121 to 126 is, for example, 10 μm or more and 100 μm or less.

[0061] The wiring layer 126 includes a first-side pad group 40Af and a first-side connector pad group 60Af. The wiring layer 125 includes a plurality of wirings 125A, a ground layer 125B, and a ground layer 125C. Each of the plurality of wirings 125A is connected to any one of the pads 41 to 44 and the pads 47 to 50. Each of the plurality of wirings 125A is connected to any one of the connector pads A2 to A11. The ground layer 125B is disposed below the connector pad A1, below the connector pad A12, and below the connection pad 73. The ground layer 125C is disposed below the pad 45, below the pad 46, and below the connection pad 74. In the insulating layer 115, there are provided: a conductive via 81 that connects one of the wirings 125A to one of the pads 41 to 44 and the pads 47 to 50; and a conductive via 82 that connects one of the wirings 125A to one of the connector pads A2 to A11. In the insulating layer 115, there is provided a conductive via 83 that connects the connector pad A1, the connector pad A12, and the connection pad 73 to the ground layer 125B. In the insulating layer 115, there is provided a conductive via 84 that connects the pad 45, the pad 46, and the connection pad 74 to the ground layer 125C.

[0062] The wiring layer 124 includes a ground layer 124A extending in the FB direction. In the insulating layer 114, there are provided: a conductive via 85 that connects the ground layer 124A to the ground layer 125B; and a conductive via 86 that connects the ground layer 124A to the ground layer 125C.

[0063] The connector pad A1, the connector pad A12, and the connection pad 73 and the conductive via 83 can be integrally formed. The pads 45, 46, and the connection pad 74 and the conductive via 84 can be integrally formed. Each of the connector pads A2 to A11 can be integrally formed with one conductive via 82. Each of the pads 41 to 44 and the pads 47 to 50 can be integrally formed with one conductive via 81. The ground layer 125B and the conductive via 85 can be integrally formed. The ground layer 125C and the conductive via 86 can be integrally formed.

[0064] The wiring layer 124 is an example of a first ground layer. The ground layer 125B is an example of a second ground layer. The conductive via 85 is an example of a conduction path. The connection pad 73, the conductive via 83, the ground layer 125B, and the conductive via 85 are included in the conductive member 131.

[0065] The wiring layer 121 includes a second-side pad group 40Bf and a second-side connector pad group 60Bf. The wiring layer 122 includes a plurality of wirings 122A, a ground layer 122B, and a ground layer 122C. The plurality of wirings 122A are respectively connected to any one of the pads 51 to 54 and the pads 57 to 59. The plurality of wirings 122A are respectively connected to any one of the connector pads B2 to B11. The ground layer 122B is provided above U of the connector pad B1, above U of the connector pad B12, and above U of the connection pad 75. The ground layer 122C is provided above U of the pad 55, above U of the pad 56, and above U of the connection pad 76. In the insulating layer 111, there are provided: a conductive via 91 that connects the wiring 122A to one of the pads 51 to 54 and the pads 57 to 59; and a conductive via 92 that connects the wiring 122A to one of the connector pads B2 to B11. In the insulating layer 111, there is provided a conductive via 93 that connects the connector pad B1, the connector pad B12, and the connection pad 75 to the ground layer 122B. In the insulating layer 111, there is provided a conductive via 94 that connects the pad 55, the pad 56, and the connection pad 76 to the ground layer 122C.

[0066] The wiring layer 123 includes a ground layer 123A extending in the FB direction. In the insulating layer 112, there are provided: a conductive via 95 that connects the ground layer 123A to the ground layer 122B; and a conductive via 96 that connects the ground layer 123A to the ground layer 122C.

[0067] The connector pad B1, the connector pad B12, and the connection pad 75 and the conductive via 93 can be integrally formed. The pad 55, the pad 56, and the connection pad 76 and the conductive via 94 can be integrally formed. Each of the connector pads B2 to B11 can be integrally formed with a conductive via 92, and each of the pads 51 to 54 and the pads 57 to 59 can be integrally formed with a conductive via 91. The ground layer 122B and the conductive via 95 can be integrally formed, and the ground layer 122C and the conductive via 96 can be integrally formed.

[0068] The wiring layer 123 is an example of a first ground layer, the ground layer 122B is an example of a second ground layer, and the conductive via 95 is an example of a conduction path. The connection pad 75, the conductive via 93, the ground layer 122B, and the conductive via 95 are included in the conductive member 132.

[0069] In Figure 3 In the example shown, the wiring 125A is connected to the connector pad A11 and the pad 41, and the wiring 122A is connected to the connector pad B2 and the pad 51. In this example, the wiring connecting the pads and the connector pads is provided only in the wiring layers 122 and 125, but the wiring can also pass through other wiring layers. In addition, it is also possible that the pads on the first surface 11A are connected to the connector pads on the second surface 11B, or that the pads on the second surface 11B are connected to the connector pads on the first surface 11A.

[0070] As Figure 3As shown, connector pins 31 provided on the connector plug 5 are respectively connected to connector pads A1 to A12 and connector pads B1 to B12. The connector pins 31 are configured to extend in the FB direction. Therefore, the connector pins 31 cross the connection pads 73 when viewed from above U, or cross the connection pads 75 when viewed from below D. The central conductors 33 of the coaxial wires 32 of the multi-core cable 2 are connected to pads 41 to 44 and pads 51 to 54. The outer conductors 34 of the coaxial wires 32 are connected to pads 45, 46, 55, and 56. That is, pads 41 to 44 and 51 to 54 are pads for signal transmission, and pads 45, 46, 55, and 56 are pads for grounding. Pads 41 to 44 and 51 to 54 are connected to any one of the connector pads A2, A3, A10, A11, B2, B3, B10, B11 that are terminals for high-speed signal transmission (TX1+, TX1−, TX2+, TX2−) or terminals for high-speed signal reception (RX2+, RX2−, RX1+, RX1−). For example, pad 41 is connected to connector pad A11, pad 42 is connected to connector pad A10, pad 43 is connected to connector pad A3, and pad 44 is connected to connector pad A2. For example, pad 51 is connected to connector pad B2, pad 52 is connected to connector pad B3, pad 53 is connected to connector pad B10, and pad 54 is connected to connector pad B11.

[0071] Next, the pads included in the pad group 40b and the connector pads included in the connector pad group 60b will be described. Figure 4 is a diagram showing an example of the pads provided on the second substrate 13 and the connector pads. In Figure 4 the upper surface (first surface 13A) of the second substrate 13 as viewed from the upper U side of the multi-core cable 1 with a connector is shown. The pads and connector pads provided on the lower surface (second surface 13B) of the second substrate 13 are shown in a perspective view of the second substrate 13.

[0072] The pad group 40b has a first-side pad group 40Ab provided on the first surface 13A and a second-side pad group 40Bb provided on the second surface 13B. The first-side pad group 40Ab has pads 41 to 50 in the same manner as the first-side pad group 40Af. The second-side pad group 40Bb has pads 51 to 59 in the same manner as the second-side pad group 40Bf.

[0073] As Figure 4As shown, on the first surface 13A, a pad 46 is provided to the right R of the pad 45. Between the pad 45 and the pad 46, pads 47, 48, 49, and 50 are provided in sequence from the left L towards the right R. On the first surface 13A, pads 41 and 42 are provided behind B the pad 45, and pads 43 and 44 are provided behind B the pad 46. On the first surface 13A, a connection pad 74 connecting to the pads 45 and 46 is provided in front F of the pads 47 - 50. The connection pad 74 may be included in the first - surface - side pad group 40Ab.

[0074] As Figure 4 As shown, on the second surface 13B, a pad 56 is provided to the right R of the pad 55. Between the pad 55 and the pad 56, pads 57, 58, and 59 are provided in sequence from the left L towards the right R. On the second surface 13B, pads 51 and 52 are provided behind B the pad 55, and pads 53 and 54 are provided behind B the pad 56. On the second surface 13B, a connection pad 76 connecting to the pads 55 and 56 is provided in front F of the pads 57 - 59. The connection pad 76 may be included in the second - surface - side pad group 40Bb.

[0075] The first - surface - side pad group 40Ab and the second - surface - side pad group 40Bb are connected to the end portion on the rear B side of the multi - core cable 2.

[0076] Each center conductor of one coaxial wire pair among the four coaxial wire pairs included in the multi - core cable 2 is connected to the pads 41 and 42 on the first surface 13A. Each outer conductor of this coaxial wire pair is connected to the pad 45. Each center conductor of another coaxial wire pair is connected to the pads 43 and 44 on the first surface 13A. Each outer conductor of this coaxial wire pair is connected to the pad 46. Each center conductor of another coaxial wire pair is connected to the pads 51 and 52 on the second surface 13B. Each outer conductor of this coaxial wire pair is connected to the pad 55. Each center conductor of another coaxial wire pair is connected to the pads 53 and 54 on the second surface 13B. Each outer conductor of this coaxial wire pair is connected to the pad 56.

[0077] One wire among the seven wires included in the multi - core cable 2 is connected to the pad 47 on the first surface 13A. Another wire is connected to the pad 48 on the first surface 13A. Another wire is connected to the pad 49 on the first surface 13A. Another wire is connected to the pad 50 on the first surface 13A. Another wire is connected to the pad 57 on the second surface 13B. Another wire is connected to the pad 58 on the second surface 13B. Another wire is connected to the pad 59 on the second surface 13B.

[0078] The pads 41 to 44 and 47 to 50 are an example of the first pads, and the pads 41 to 44 and the pads 47 to 50 are included in the first pad group 71Ab. The pads 45 and 46 are an example of the fourth pads. The pads 51 to 54 and 57 to 59 are an example of the first pads, and the pads 51 to 54 and the pads 57 to 59 are included in the first pad group 71Bb. The pads 55 and 56 are an example of the fourth pads.

[0079] The connector pad group 60b has a first-side connector pad group 60Ab provided on the first surface 13A and a second-side connector pad group 60Bb provided on the second surface 13B. The first-side connector pad group 60Ab has connector pads A1 to A12 in the same manner as the first-side connector pad group 60Af. The connector pads A1 to A12 of the first-side connector pad group 60Ab are arranged in a row in order from the right R to the left L of the first surface 13A. That is, the connector pads A1 to A12 are arranged side by side in the RL direction parallel to the third surface 13C when the first surface 13A is viewed from above. The second-side connector pad group 60Bb has connector pads B1 to B12 in the same manner as the second-side connector pad group 60Bf. The connector pads B1 to B12 of the second-side connector pad group 60Bb are arranged in a row in order from the left L to the right R of the second surface 13B. That is, the connector pads B1 to B12 are arranged side by side in the RL direction parallel to the third surface 13C when the second surface 13B is viewed from above. On the first surface 13A, a connection pad 73 connecting the connector pads A1 and A12 is provided behind B with respect to the connector pads A2 to A11. On the second surface 13B, a connection pad 75 connecting the connector pads B1 and B12 is provided behind B with respect to the connector pads B2 to B11. The connection pad 73 may be included in the first-side connector pad group 60Ab. The connection pad 75 may be included in the second-side connector pad group 60Bb.

[0080] The connector pads A1 and A12 are ground terminals (GND) for grounding. The connector pads A2 and A3 are terminals (TX1+, TX1−) for high-speed signal transmission. The connector pads A4 and A9 are terminals (VBUS) for bus power supply. The connector pad A5 is a configuration channel terminal (CC). The connector pads A6 and A7 are terminals (D+, D−) for data signals. The connector pad A8 is a sideband terminal (SBU1). The connector pads A10 and A11 are terminals (RX2+, RX2−) for high-speed signal reception.

[0081] The connector pads B1 and B12 are ground terminals (GND) for grounding. The connector pads B2 and B3 are terminals for high-speed signal transmission (TX2+, TX2-). The connector pads B4 and B9 are terminals for bus power supply (VBUS). The connector pad B5 is a terminal for connecting power supply (VCONN). The connector pad B8 is a terminal for sideband (SBU2). The connector pads B10 and B11 are terminals for high-speed signal reception (RX1+, RX1-).

[0082] The connector pads A2 to A11 are an example of the second pads, and the connector pads A2 to A11 are included in the second pad group 72Ab. The connection pad 73 is an example of the third pad, and the connector pads A1 and A12 are part of the third pad. The connector pads B2 to B11 are an example of the second pads, and the connector pads B2 to B11 are included in the second pad group 72Bb. The connection pad 75 is an example of the third pad, and the connector pads B1 and B12 are part of the third pad.

[0083] The first-side pad group 40Ab and the second-side pad group 40Bb are connected to the first-side connector pad group 60Ab and the second-side connector pad group 60Bb of the second substrate 13 through the second circuit 14.

[0084] Here, an example of the cross-sectional structure of the second substrate 13 will be described. Figure 5 It is a cross-sectional view showing an example of the cross-sectional structure of the second substrate 13. Figure 5 Corresponds to the cross-sectional view along Figure 4 the V-V line in

[0085] As Figure 5 shown, the second substrate 13, like the first substrate 11, includes five insulating layers 111 to 115 stacked on each other. The second substrate 13 also, like the first substrate 11, includes wiring layers 121 to 125. The upper surface 115A of the insulating layer 115 is the first surface 13A of the second substrate 13, and the lower surface 111B of the insulating layer 111 is the second surface 13B of the second substrate 13.

[0086] The wiring layer 126 includes the first-side pad group 40Ab and the first-side connector pad group 60Ab. Similar to the first substrate 11, the wiring layer 125 includes multiple wirings 125A, a ground layer 125B, and a ground layer 125C. Similar to the first substrate 11, conductive vias 81 to 84 are provided in the insulating layer 115. Similar to the first substrate 11, the wiring layer 124 includes a ground layer 124A extending in the FB direction. Similar to the first substrate 11, conductive vias 85 and 86 are provided in the insulating layer 114.

[0087] The wiring layer 121 includes a second-side pad group 40Bb and a second-side connector pad group 60Bb. Similarly to the first substrate 11, the wiring layer 122 includes a plurality of wirings 122A, a ground layer 122B, and a ground layer 122C. Similarly to the first substrate 11, conductive vias 91 to 94 are provided in the insulating layer 111. Similarly to the first substrate 11, the wiring layer 123 includes a ground layer 123A extending in the FB direction. Similarly to the first substrate 11, conductive vias 95 and 96 are provided in the insulating layer 112.

[0088] In Figure 5 In the example shown, the wiring 125A is connected to the connector pad A2 and the pad 44, and the wiring 122A is connected to the connector pad B11 and the pad 54. In this example, the wirings connecting the pads to the connector pads are provided only in the wiring layers 122 and 125, but the wirings may also pass through other wiring layers. In addition, the pads on the first surface 13A may be connected to the connector pads on the second surface 13B, or the pads on the second surface 13B may be connected to the connector pads on the first surface 13A.

[0089] As Figure 5 shown, connector pins 31 provided on the connector plug 5 are connected to the connector pads A1 to A12 and the connector pads B1 to B12, respectively. The connector pins 31 are configured to extend in the FB direction. Therefore, the connector pins 31 cross the connection pads 73 when viewed from above U, or cross the connection pads 75 when viewed from below D. The center conductor 33 of the coaxial wire 32 of the multi-core cable 2 is connected to the pads 41 to 44 and the pads 51 to 54. The outer conductor 34 of the coaxial wire 32 is connected to the pads 45, 46, 55, and 56. That is, the pads 41 to 44 and 51 to 54 are signal transmission pads, and the pads 45, 46, 55, and 56 are ground pads. The pads 41 to 44 and 51 to 54 are connected to any one of the connector pads A2, A3, A10, A11, B2, B3, B10, B11 that are terminals for high-speed signal transmission (TX1+, TX1−, TX2+, TX2−) or terminals for high-speed signal reception (RX2+, RX2−, RX1+, RX1−). For example, the pad 41 is connected to the connector pad A11, the pad 42 is connected to the connector pad A10, the pad 43 is connected to the connector pad A3, and the pad 44 is connected to the connector pad A2. For example, the pad 51 is connected to the connector pad B2, the pad 52 is connected to the connector pad B3, the pad 53 is connected to the connector pad B10, and the pad 54 is connected to the connector pad B11.

[0090] Thus, on the first substrate 11, a conductive member 131 including a connection pad 73, a conductive via 83, a ground layer 125B, and a conductive via 85 is connected to the ground layer 124A. The conductive member 131 is disposed on a side away from the first pad group 71Af with respect to the second pad group 72Af in the FB direction. The conductive member 131 is located on the first surface 11A side of the ground layer 124A in the UD direction. Further, a connector pin 31 for signal transmission is disposed above the conductive member 131 and is connected to the second pad group 72Af. Therefore, even when the frequency of the signal transmitted via the connector pin 31 is high, for example, even when the frequency is around 20 GHz, it is possible to suppress the mismatch of the differential impedance at the connection portion between the connector pin 31 and the second pad group 72Af, thereby suppressing the reflection of the signal near the connection portion.

[0091] Since the conductive member 131 includes the conductive via 85 and the ground layer 125B, it is easy to position the conductive member 131 on the first surface 11A side of the ground layer 124A. Further, since the conductive member 131 includes the connection pad 73, it is easy to shorten the distance between the connector pin 31 and the conductive member 131, and thus it is easy to further suppress the reflection.

[0092] The connection pad 73 is connected to connector pads A1 and A12 which are ground terminals (GND) for grounding, and the connector pads A1 and A12 function as a part of the third pads. Therefore, it is easy to keep the potential of the connection pad 73 at ground.

[0093] The connection pad 73 and the connector pads A2 to A11 are included in the wiring layer 126, and the thickness of the connection pad 73 is equal to the thickness of the connector pads A2 to A11. Therefore, it is easy to form the connection pad 73 simultaneously with the connector pads A2 to A11.

[0094] The size of the connection pad 73 in the FB direction is preferably 0.5 mm or more and 2.0 mm or less. If the size is less than 0.5 mm, the effect of suppressing the reflection may be reduced. Further, if the size exceeds 2.0 mm, the size of the first substrate 11 may become too large. The size of the connection pad 73 in the FB direction is more preferably 0.7 mm or more and 1.5 mm or less.

[0095] The pads 45 and 46 are provided on the first substrate 11, so that the ground layer 124A can be easily connected to the external conductor 34. [[ID=-16]]

[0096] ]The wiring 125A is provided on the first substrate 11, so that the pads 41 to 44 and the pads 47 to 50 can be easily connected to the connector pads A2 to A11. [[ID=-20]]<s

[0097] These effects are related to the structure on the first surface 11A side of the first substrate 11, but the same effects can also be obtained on the second surface 11B side. In addition, the same effects can be obtained on the second substrate 13 as well.

[0098] The conductive member 131 may not be exposed, but it is preferably exposed on the first surface 11A. Similarly, the conductive member 132 may not be exposed on the second surface 11B, but it is preferably exposed. This is to easily suppress the mismatch of differential impedance.

[0099] It should be noted that if the conductive member 131 is located closer to the first surface 11A than the ground layer 124A in the UD direction, the connection pad 73 may not be provided. In addition, if the conductive member 132 is located closer to the second surface 11B than the ground layer 123A in the UD direction, the connection pad 75 may not be provided. Figure 6 It is a cross-sectional view showing a modified example of the cross-sectional structure of the first substrate 11.

[0100] For example, in the first substrate 11, as Figure 6 shown, the connection pads 73 and 75 and the conductive vias 83 and 93 may not be provided. Even in this case, the conductive member 131 is located closer to the first surface 11A than the ground layer 124A in the UD direction, and the conductive member 132 is located closer to the second surface 11B than the ground layer 123A in the UD direction. Therefore, the mismatch of differential impedance can be suppressed, thereby suppressing the reflection of signals near this connection portion. The same applies to the second substrate 13.

[0101] The number of insulating layers and wiring layers included in the first substrate 11 and the second substrate 13 is not limited. For example, in the first substrate 11 and the second substrate 13, there may be seven insulating layers and eight wiring layers, or there may be three insulating layers and four wiring layers.

[0102] The above has described the embodiments in detail, but it is not limited to specific embodiments, and various modifications and changes can be made within the scope described in the claims. For example, it is not limited to a multi-core cable with a connector that conforms to a specific specification, and it can also be applied to various multi-core cables with connectors.

[0103] Description of Reference Numerals

[0104] 1: Multi-core cable with a connector

[0105] 2: Multi-core cable

[0106] 3: First connector

[0107] 4: Second connector

[0108] 5: Connector plug

[0109] 5a: Metal shell

[0110] 5b: Pin Retaining Board

[0111] 5c: Contact Pin

[0112] 11: First Substrate

[0113] 11A, 13A: First Side

[0114] 11B, 13B: Second Side

[0115] 11C, 13C: Third Side

[0116] 12: First Circuit

[0117] 13: Second Substrate

[0118] 14: Second Circuit

[0119] 31: Connector Pin

[0120] 32: Coaxial Cable

[0121] 33: Center Conductor

[0122] 34: Outer Conductor

[0123] 40f, 40b: Pad Group

[0124] 40Af, 40Ab: First Side Pad Group

[0125] 40Bf, 40Bb: Second Side Pad Group

[0126] 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59: Pad

[0127] 60b, 60f: Connector Pad Group

[0128] 60Af, 60Ab: First Side Connector Pad Group

[0129] 60Bf, 60Bb: Second Side Connector Pad Group

[0130] 71Af, 71Ab, 71Bf, 71Bb: First Pad Group

[0131] 72Af, 72Ab, 72Bf, 72Bb: Second Pad Group

[0132] 73, 74, 75, 76: Link Pad

[0133] 81, 82, 83, 84, 85, 86, 91, 92, 93, 94, 95, 96: Conductive Via

[0134] 111, 112, 113, 114, 115: Insulating layer

[0135] 111B, 112B, 113B: Lower surface

[0136] 113A, 114A, 115A: Upper surface

[0137] 121, 122, 123, 124, 125, 126: Wiring layer

[0138] 122A, 125A: Wiring

[0139] 122B, 122C, 123A, 124A, 125B, 125C: Ground layer

[0140] 131, 132: Conductive parts

[0141] A1, A2, A3, A4, A5, A6, A7, A8, A9, A10, A11, A12, B1, B2, B3, B4, B5, B6, B7, B8, B9, B10, B11, B12: Connector pads.

Claims

1. A multi-core cable with a connector, comprising: A multi-core cable including a plurality of wires; and A connector connected to one end of the multi-core cable, The connector has a substrate, the substrate has a first surface, a second surface on the side opposite to the first surface, and a third surface that is the top surface in the connector insertion direction and connects the first surface and the second surface, The substrate has: A first pad group including a plurality of first pads, the plurality of first pads are provided on the first surface and are connected to the central conductors of the wires; A second pad group including a plurality of second pads, the plurality of second pads are provided on the first surface and are arranged side by side in a first direction parallel to the third surface when observing the first surface from above, and are connected to the first pads; A first ground layer provided between the first surface and the second surface and extending in a second direction parallel to the first surface and perpendicular to the first direction; And A conductive member provided on the side away from the first pad group with respect to the second pad group in the second direction and connected to the first ground layer, The conductive member is located on the side closer to the first surface than the first ground layer in a third direction perpendicular to the first surface.

2. The multi-core cable with a connector according to claim 1, wherein The conductive member has: A second ground layer located on the side closer to the first surface than the first ground layer in the third direction; And A conduction path connecting the first ground layer and the second ground layer.

3. The multi-core cable with a connector according to claim 1 or 2, wherein A part of the conductive member is exposed on the first surface.

4. The multi-core cable with a connector according to claim 1 or 2, wherein The conductive member has a third pad for grounding, and the third pad is provided on the first surface on the side away from the first pad group with respect to the second pad group in the second direction.

5. The multi-core cable with a connector according to claim 4, wherein The third pad includes a part arranged side by side with the plurality of second pads in the first direction.

6. The multi-core cable with a connector according to claim 4, wherein The thickness of the third pad is equal to the thickness of the plurality of second pads.

7. The multi-core cable with a connector according to claim 4, wherein The size of the third pad in the second direction is 0.5 mm or more and 2.0 mm or less.

8. The multi-core cable with a connector according to claim 1 or 2, wherein The first pad and the second pad are pads for signal transmission.

9. The multi-core cable with a connector according to claim 1 or 2, wherein The multi-core cable includes a ground conductor, The substrate has a fourth pad, and the fourth pad is provided on the first surface and is connected to the first ground layer and the ground conductor.

10. The multi-core cable with a connector according to claim 9, wherein The wire is a coaxial wire including an insulating layer formed on the outer periphery of the central conductor and an outer conductor formed on the outer periphery of the insulating layer, The ground conductor is the outer conductor.

11. The multi-core cable with a connector according to claim 1 or 2, wherein the substrate includes a plurality of wirings respectively connected to any one of the plurality of first pads, and the plurality of wirings are connected to any one of the plurality of second pads.

12. A multi-core cable with a connector, comprising: Multi-core cable, including multiple coaxial wires; and a connector connected to one end of the multi-core cable, wherein the coaxial wire includes: a center conductor; an insulating layer formed on the outer periphery of the center conductor; and an outer conductor formed on the outer periphery of the insulating layer, the connector has a substrate having a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface and serving as the tip surface in the connector insertion direction, the substrate has; a first pad group including a plurality of first pads disposed on the first surface and connected to the center conductor; a second pad group including a plurality of second pads separated from the first pads and disposed on the first surface, arranged side by side in a first direction parallel to the third surface when observing the first surface from above, and connected to the first pads inside the substrate; a ground layer disposed between the first surface and the second surface and extending in a second direction parallel to the first surface and perpendicular to the first direction; a third pad disposed on the first surface on a side away from the first pad group with respect to the second pad group in the second direction and connected to the ground layer; and a fourth pad disposed on the first surface and connected to the ground layer and the outer conductor.

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