Memory devices and solid state drive devices and data centers

Abstract

A storage device includes a substrate, at least one secure element, a housing, and a coupling structure. The at least one secure element is mounted on the substrate. The housing surrounds the substrate and the at least one secure element. The coupling structure integrally couples the at least one secure element and the housing. When at least a portion of the housing is removed, the at least one secure element is destroyed while maintaining a connection between the at least one secure element and the housing through the coupling structure, and access to secure data stored in the at least one secure element is prevented.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefits to Korean Patent Application No. 10-2020-0048453, filed on April 22, 2020, with the Korean Intellectual Property Office (KIPO), the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] Exemplary embodiments generally relate to a semiconductor integrated circuit, and more specifically, to a storage device and a solid-state drive (SSD) device having a structure for removing secure data, and a data center including the storage device. Background Technology

[0004] Hard disk drive (HDD) devices are typically used as data storage for electronic devices. However, recently, solid-state drive (SSD) devices, including non-volatile memory devices such as flash memory, are replacing HDD devices as data storage for electronic devices.

[0005] SSDs are used instead of HDDs because they do not contain mechanical components such as electric motors and generate virtually no heat or noise. Furthermore, SSDs offer fast access speeds, high density, and high stability.

[0006] Recently, with industrial advancements, secure data storage and management have become crucial, and applications to enhance security are being developed in various sectors such as defense, finance, and / or accounting. SSD devices offer low power consumption and high speed; however, security issues such as data leakage in the event of loss or theft may exist. Therefore, various security-related solutions and / or technologies have been proposed to prevent data leakage.

[0007] Traditionally, when the housing is removed, the components inside the module can be seen and hacked. To prevent external intrusion, the presence of intrusion can be checked by making the device leave traces of intrusion on the outside of the housing, but there is no underlying component destruction and removal technology. Summary of the Invention

[0008] At least one exemplary embodiment of this disclosure provides a storage device and a solid-state drive (SSD) device having a structure that enables the efficient removal of secure data in the event of theft, loss, and / or disposal.

[0009] At least one exemplary embodiment of this disclosure provides a data center including a storage device and / or an SSD device.

[0010] According to an exemplary embodiment, a storage device includes a substrate, at least one security element, a housing, and a coupling structure. The security element is mounted on the substrate. The housing surrounds the substrate and the security element. The coupling structure integrally couples the security element and the housing. When at least a portion of the housing is removed, the security element is destroyed, while the connection between the security element and the housing is maintained by the coupling structure, and access to secure data stored in the security element is prevented.

[0011] According to an exemplary embodiment, a storage device includes a substrate, at least one security element, a housing, and a coupling structure. The security element is mounted on the substrate. The housing surrounds the substrate and the security element. The coupling structure integrally couples the security element and the housing. When at least a portion of the housing is removed, the security element is separated from and removed from the substrate, while the connection between the security element and the housing is maintained by the coupling structure, and access to secure data stored in the security element is prevented.

[0012] According to an exemplary embodiment, a solid-state drive (SSD) device includes a substrate, a plurality of non-volatile memories, at least one secure memory, a controller, a housing, and a coupling structure. The plurality of non-volatile memories are mounted on the substrate and store normal data. The secure memory is mounted on the substrate and stores secure data. The controller is mounted on the substrate and controls the operation of the plurality of non-volatile memories and the secure memory. The housing surrounds the substrate, the plurality of non-volatile memories, the secure memory, and the controller. The coupling structure integrally couples the secure memory and the housing. When at least a portion of the housing is removed, the secure memory is destroyed or separated from the substrate and removed, while the connection between the secure memory and the housing is maintained by the coupling structure, and access to the secure data stored in the secure memory is prevented.

[0013] According to an exemplary embodiment, the data center includes at least one application server and at least one storage server. The application server receives data write requests or data read requests. The storage server includes a storage device that stores write data corresponding to a data write request or outputs read data corresponding to a data read request. The storage device includes a substrate, at least one security element, a housing, and a coupling structure. The security element is mounted on the substrate. The housing surrounds the substrate and the security element. The coupling structure integrally couples the security element and the housing. When at least a portion of the housing is removed, the security element is destroyed or separated from the substrate and removed, while the connection between the security element and the housing is maintained by the coupling structure, and access to the secure data stored in the security element is prevented.

[0014] In storage devices, SSD devices, and data centers according to exemplary embodiments, a coupling structure is provided that integrally couples a security element and a housing. When at least a portion of the housing is removed, access to secure data is prevented or blocked by destroying, removing, or taking out the security element. Therefore, in the event of the storage device being stolen, lost, or discarded, secure data can be effectively eliminated through the physical operation of the coupling structure. For example, in the case of a lost or stolen modular storage device, leakage of secure data can be prevented through these functions according to exemplary embodiments. Furthermore, when a user wants to discard or cease using the storage device, the termination of use of the storage device can be confirmed through these functions according to exemplary embodiments. Attached Figure Description

[0015] Figure 1 This is a perspective view of a storage device according to an exemplary embodiment.

[0016] Figure 2 yes Figure 1 An exploded perspective view of the storage device.

[0017] Figure 3 , Figure 4A , Figure 4B and Figure 5 Is included Figure 1 A cross-sectional view of an embodiment of the coupling structure in a storage device.

[0018] Figure 6A , Figure 6B and Figure 6C Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure in a storage device.

[0019] Figure 7 , Figure 8A , Figure 8B and Figure 9 Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure in a storage device.

[0020] Figure 10 and Figure 11 Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure in a storage device.

[0021] Figure 12 , Figure 13 , Figure 14 and Figure 15 Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure in a storage device.

[0022] Figure 16 and Figure 17Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure in a storage device.

[0023] Figure 18 and Figure 19 Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure in a storage device.

[0024] Figure 20 , Figure 21A , Figure 21B and Figure 22 Is included Figure 1 A cross-sectional view of an embodiment of the coupling structure and connection between the security element and the substrate in a storage device.

[0025] Figure 23 and Figure 24 Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure and connection between the security element and the substrate in a storage device.

[0026] Figure 25 and Figure 26 Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure and connection between the security element and the substrate in a storage device.

[0027] Figure 27 This is a block diagram of a data center including storage devices according to an exemplary embodiment.

[0028] Figure 28 and Figure 29 Is included Figure 27 A block diagram of an embodiment of a storage device in a data center.

[0029] Figure 30 Is included Figure 28 or Figure 29 A block diagram of an embodiment of the memory in a storage device. Detailed Implementation

[0030] Various exemplary embodiments will be described more fully with reference to the accompanying drawings, in which embodiments are illustrated. However, this disclosure may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Throughout this application, the same reference numerals may denote the same elements.

[0031] Figure 1 This is a perspective view of a storage device according to an exemplary embodiment. Figure 2 yes Figure 1 An exploded perspective view of the storage device.

[0032] Reference Figure 1 and Figure 2 According to an embodiment, the storage device 10 includes a substrate 100, a plurality of electronic components 210, 220, 230, and 240 mounted or arranged on the substrate 100, a housing 400 surrounding the substrate 100 and the electronic components 210, 220, 230, and 240, and a coupling structure 300. Furthermore, the storage device 10 may also include a support covering the electronic components 210, 220, 230, and 240, and heat dissipation pads thermally connected to the electronic components 210, 220, 230, and 240.

[0033] In some exemplary embodiments, storage device 10 is a solid-state drive (SSD) device. For example, storage device 10 may be an SSD device used in data centers, servers, etc., which collects various data and provides various services, or it may be a portable SSD device that replaces a hard disk drive (HDD) device in a personal computer (PC), laptop computer, etc.

[0034] In the following description, exemplary embodiments will be based on the example that storage device 10 is an SSD device. However, exemplary embodiments are not limited thereto, and storage device 10 may be one of Universal Flash Storage (UFS), Multimedia Card (MMC), Embedded Multimedia Card (eMMC), Secure Digital (SD) Card, MicroSD Card, Memory Stick, Chip Card, Universal Serial Bus (USB) Card, Smart Card, or Compact Flash (CF) Card, etc.

[0035] The substrate 100 may be a single-layer or multi-layer circuit substrate and has upper and lower surfaces opposite each other. For example, the substrate 100 may be a printed circuit board (PCB). A PCB includes wiring and vias connected to the wiring. The wiring includes printed circuit patterns that interconnect electronic components.

[0036] In this embodiment, substrate 100 extends in a first direction (or longitudinal direction) and a second direction (or transverse direction). Substrate 100 has a rectangular or square shape. Substrate 100 has first and second sides facing each other. A connector 110 with connection terminals for connection to an external host device is provided on the first side of substrate 100. Storage device 10 can be attached to or detached from external host device via connector 110. Therefore, storage device 10 can be electrically connected to external host device via connector 110.

[0037] In one embodiment, a plurality of electronic components 210, 220, 230, and 240 are mounted on a substrate 100 along a first direction. The plurality of electronic components 210, 220, 230, and 240 include a controller 210, a plurality of non-volatile memories 220, a buffer memory 230, and a security element 240.

[0038] In an embodiment, the controller 210 is arranged or located adjacent to the connector 110 on the upper surface of the substrate 100. A plurality of non-volatile memories 220 are arranged or located adjacent to a second side of the upper surface of the substrate 100 opposite the connector 110. For example, as... Figure 2 As shown, two non-volatile memories 220 are arranged on the upper surface of the substrate 100. Additionally, non-volatile memories may be additionally arranged on the lower surface of the substrate 100. A buffer memory 230 and a safety element 240 are arranged or located adjacent to the controller 210 on the upper surface of the substrate 100.

[0039] In this embodiment, the controller 210 controls the overall operation of the storage device 10, including the operation of multiple non-volatile memories 220, buffer memories 230, and security elements 240, and communicates with the host device using a host interface. For example, the signals communicated between the controller 210 and the host device may include commands, addresses, data, etc. The controller 210 analyzes and processes the signals received from the host device and controls the operation of the multiple non-volatile memories 220 based on the received commands, addresses, and data.

[0040] In some exemplary embodiments, the host interface includes a block-accessible interface, which includes at least one of, for example, a Universal Serial Bus (USB), a Small Computer System Interface (SCSI) bus, a Peripheral Component Interconnect (PCI) High Speed ​​bus, an Advanced Technology Attachment (ATA) bus, a Serial ATA (SATA) bus, a Parallel ATA (PATA) bus, a Serial Attached SCSI (SAS) bus, or a Non-Volatile Memory High Speed ​​(NVMe) bus.

[0041] In this embodiment, multiple non-volatile memories 220 are storage media of the storage device 10 and are connected to the controller 210 via at least one channel. For example, the multiple non-volatile memories 220 store normal data such as metadata, various user data, etc.

[0042] In some exemplary embodiments, each of the plurality of non-volatile memories 220 includes NAND flash memory. In other exemplary embodiments, each of the plurality of non-volatile memories 220 includes one of phase-change random access memory (PRAM), resistive random access memory (RRAM), nanofloating gate memory (NFGM), polymer random access memory (PoRAM), magnetic random access memory (MRAM), and ferroelectric random access memory (FRAM).

[0043] In this embodiment, the buffer memory 230 stores instructions or data executed or processed by the controller 210, and can temporarily store data stored or to be stored in the plurality of non-volatile memories 220. Furthermore, the buffer memory 230 can be used to drive software or firmware for managing the plurality of non-volatile memories 220. Additionally, the buffer memory 230 can be used to store metadata received from the host device or to store cached data.

[0044] In some exemplary embodiments, the buffer memory 230 includes volatile memory, such as dynamic random access memory (DRAM) or static random access memory (SRAM). In other exemplary embodiments, the buffer memory 230 includes at least one non-volatile memory.

[0045] In this embodiment, the secure element 240 is a secure memory or any security device. The secure element 240 processes or stores secure data such as keys, sensitive data, and sensitive codes. For example, the secure element 240 resists tampering attacks such as microprobing, software attacks, eavesdropping, and fault injection attacks. The secure element 240 may be referred to as security software, a security component, or a security module.

[0046] In an embodiment, the storage device 10 also includes a power management integrated circuit (PMIC) that controls the power transmitted to a plurality of electronic components 210, 220, 230 and 240 as well as to passive components such as capacitors.

[0047] In one embodiment, the substrate 100 and a plurality of electronic components 210, 220, 230, 240 are fixed to the housing 400, such that the substrate 100 and the plurality of electronic components 210, 220, 230, 240 are fixedly located within the housing 400. For example, the housing 400 includes a lower housing 400b on which the substrate 100 is mounted, and an upper housing 400a coupled to the lower housing 400b to cover the substrate 100 and the plurality of electronic components 210, 220, 230, and 240. However, the exemplary embodiments are not limited thereto, and in other embodiments, the upper housing 400a and the lower housing 400b are integrally formed.

[0048] In some exemplary embodiments, the housing 400 includes at least one of a variety of materials such as metal, plastic (such as polymer), film, or epoxy coating material.

[0049] In this embodiment, the coupling structure 300 is a physical structure that integrally couples the safety element 240 and the housing 400. For example, as Figure 2As shown, when the safety element 240 is disposed on the upper surface of the substrate 100, the coupling structure 300 is formed on the upper housing 400a. However, the exemplary embodiment is not limited thereto; when the safety element 240 is disposed on the lower surface of the substrate 100, the coupling structure 300 is formed on the lower housing 400b.

[0050] In some exemplary embodiments, the coupling structure 300 improves or enhances the security performance of the storage device 10 and can destroy the security element 240. For example, as will be seen with reference to Figures 3 to 19 As described, when at least a portion of the housing 400 is removed or damaged, the safety element 240 can be destroyed, even though the coupling structure 300 maintains the connection between the safety element 240 and the housing 400. Destruction of the safety element 240 means that the safety element 240 is completely or permanently physically damaged, and thus prevents access to the safety data in the safety element 240.

[0051] In other exemplary embodiments, the coupling structure 300 improves or enhances the security performance of the storage device 10, and the security element 240 can be electrically disconnected and removed. For example, as will be seen with reference to Figures 20 to 26 As described, when at least a portion of the housing 400 is removed, the safety element 240 can be electrically disconnected and removed from the substrate 100, even though the coupling structure 300 maintains the connection between the safety element 240 and the housing 400. After the safety element 240 is disconnected and removed, it is essentially impossible to access the security data stored in the safety element 240 using the storage device 10. However, unlike the aforementioned destruction of the safety element 240, the safety element 240 is not completely or permanently physically damaged due to its disconnection and removal. Access to the security data stored in the safety element 240 is restored when the safety element 240 is re-electrically connected to the substrate 100 after it has been disconnected and removed from the substrate 100.

[0052] According to an exemplary embodiment, in the event that the storage device 10 is stolen, lost, or discarded, the physical operation OS of the coupling structure 300 can effectively eliminate security data, and thus prevent the leakage of security data.

[0053] although Figure 2 The embodiments shown depict coupling structure 300 directly coupled to or integrally formed with housing 400, such as upper housing 400a. However, the exemplary embodiments are not limited thereto, and in other exemplary embodiments, coupling structure 300 may be modified. (Refer to...) Figures 3 to 26 Various embodiments of the coupling structure 300 are described.

[0054] In the following description, exemplary embodiments will be illustrated by an example in which a safety element 240 is arranged on the upper surface of a substrate 100 and a coupling structure 300 is formed in an upper housing 400a.

[0055] Figure 3 , Figure 4A , Figure 4B and Figure 5 Is included Figure 1 A cross-sectional view of an embodiment of the coupling structure in a storage device.

[0056] Figure 3 An embodiment is shown in which the safety element 241 and the upper housing 401a are integrally coupled or combined via the coupling structure 310. Figure 4A The upper housing 401a is shown before coupling with safety element 241. Figure 4B The safety element 241 is shown prior to its coupling with the upper housing 401a. Figure 5 The diagram illustrates the removal or separation of the upper housing 401a after the safety element 241 and the upper housing 401a have been integrally coupled via the coupling structure 310.

[0057] Reference Figure 3 , Figure 4A , Figure 4B and Figure 5 In this embodiment, the substrate 100 is mounted and secured to the lower housing 401b. Although Figure 3 The illustration shows the substrate 100 in direct contact with the lower housing 401b, but this is for illustrative purposes only. In actual implementation, the substrate 100 and the lower housing 401b may be spaced apart from each other, and at least one space may be formed between the substrate 100 and the lower housing 401b.

[0058] In one embodiment, the safety element 241 is mounted on the substrate 100 via conductive bumps 250, such as solder bumps. The safety element 241 and the upper housing 401a are integrally coupled via a coupling structure 310. The safety element 241 and the upper housing 401a are spaced apart from each other via the coupling structure 310, and at least one space is formed between the safety element 241 and the upper housing 401a.

[0059] In an embodiment, the coupling structure 310 includes a first coupling member 310a and a second coupling member 310b. The first coupling member 310a extends downward from the lower surface of the upper housing 401a and includes a first protrusion 311a and a first coupling portion 313a formed on a first surface (such as a first side surface) of the safety element 241. The second coupling member 310b extends downward from the lower surface of the upper housing 401a and includes a second protrusion 311b facing the first protrusion 311a and a second coupling portion 313b formed on a second surface (such as a second side surface) of the safety element 241 opposite to the first surface. The first protrusion 311a and the second protrusion 311b are formed of the same material as the upper housing 401a and are integrally formed with the upper housing 401a.

[0060] In an embodiment, the safety element 241 and the upper housing 401a are integrally coupled by inserting the first protrusion 311a into the first coupling portion 313a and by inserting the second protrusion 311b into the second coupling portion 313b. For example, each of the first protrusion 311a and the second protrusion 311b has a hook-like structure, and each of the first coupling portion 313a and the second coupling portion 313b has a groove structure corresponding to the shape of each of the first protrusion 311a and the second protrusion 311b.

[0061] In some exemplary embodiments, the shapes of the first protrusion 311a and the second protrusion 311b, as well as the first coupling portion 313a and the second coupling portion 313b, are implemented such that the safety element 241 and the upper housing 401a are initially easily coupled, and the connection between the safety element 241 and the upper housing 401a is maintained when the upper housing 401a is removed. For example, in a cross-sectional view, each of the first protrusion 311a and the second protrusion 311b has a first side and an inclined second side, the first side being adjacent to and relatively close to the upper housing 401a and substantially parallel to the upper housing 401a, and the inclined second side extending from the end of the first side in a direction away from the upper housing 401a to the corresponding first coupling member 310a and the second coupling member 310b. Each of the first coupling portion 313a and the second coupling portion 313b may have a shape corresponding to each of the first protrusion 311a and the second protrusion 311b.

[0062] In some exemplary embodiments, the first protrusion 311a and the second protrusion 311b, as well as the first coupling portion 313a and the second coupling portion 313b, have the aforementioned shape, and the connection between the safety element 241 and the upper housing 401a can be maintained even if the upper housing 401a is removed. For example, when... Figure 5When the upper housing 401a is removed or separated, the safety element 241 is destroyed by separating it from the substrate 100, while maintaining the connection between the safety element 241 and the upper housing 401a. For example, the coupling force between the first protrusion 311a and the second protrusion 311b, as well as the first coupling portion 313a and the second coupling portion 313b, is stronger than the coupling force between the conductive bump 250 and the safety element 241 and the substrate 100.

[0063] In some exemplary embodiments, when the safety element 241 is separated from the substrate 100, the safety element 241 is destroyed both externally and internally. For example, in some embodiments, as will be referred to... Figure 30 As described, the security element 241 includes a memory cell array for storing data and peripheral circuitry for driving the memory cell array. Internal damage to the security element 241 means either damage to the memory cell array or disruption of the connection between the memory cell array and the peripheral circuitry. Therefore, access to the security element 241 using external devices is prevented.

[0064] Figure 6A , Figure 6B and Figure 6C Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure in a storage device.

[0065] Reference Figure 6A ,Apart from Figure 6A In addition to the two safety elements 241 and 242, the embodiments include Figure 6A Implementation examples and Figure 3 The implementation examples are basically the same.

[0066] In this embodiment, the two safety elements 241 and 242 and the upper housing 402a are integrally coupled through two coupling structures. The first coupling structure includes a first coupling member 310a and a second coupling member 310b that integrally couple the first safety element 241 and the upper housing 402a, and the second coupling structure includes a third coupling member 310c and a fourth coupling member 310d that integrally couple the second safety element 242 and the upper housing 402a. Figure 6A Each of the safety elements 241 and 242 in the system is connected to Figure 3 The safety element 241 is basically the same as that in the previous one. Figure 6A Each of the couplings 310a and 310c in the middle is with Figure 3 The first coupling element 310a in the middle is basically the same as that in the middle. Figure 6A Each of the couplings 310b and 310d in the middle is with Figure 3 The second coupling element 310b is basically the same.

[0067] In the embodiments, similar to the reference Figure 5 As described, when the upper housing 402a is removed or separated, safety elements 241 and 242 are destroyed by separating them from the substrate 100 while maintaining the connection between them and the upper housing 402a. Furthermore, safety elements 241 and 242 are destroyed internally.

[0068] In an embodiment, when three or more safety elements are included in the storage device, the storage device includes the same number of coupling structures as the safety elements.

[0069] Reference Figure 6B and Figure 6C In this embodiment, the safety element 242b and the upper housing 402b are integrally coupled via a coupling structure 315. The coupling structure 315 includes a first coupling member 315a and a second coupling member 315b. The first coupling member 315a extends downward from the lower surface of the upper housing 402b and includes a first protrusion, and the second coupling member 315b extends downward from the lower surface of the upper housing 402b and includes a second protrusion facing the first protrusion. Figure 6B The first and second protrusions in the middle and Figure 4A The first protrusion 311a and the second protrusion 311b are similar.

[0070] and Figure 3 , Figure 4A , Figure 4B and Figure 5 The examples are different, in Figure 6B and Figure 6C In this embodiment, no first coupling portion or second coupling portion corresponding to the first protrusion and the second protrusion is formed on the safety element 242b. Instead, the first protrusion and the second protrusion are in direct contact with the lower surface of the safety element 242b on which the conductive bumps 250 are arranged, and therefore, the safety element 242b and the upper housing 402b are integrally coupled. Therefore, exemplary embodiments can be incorporated without changing the structure of the safety element 242b.

[0071] For example, in an embodiment, when such Figure 6C When the upper housing 402b is removed or separated, the safety element 242b is destroyed even though the coupling structure maintains the connection between the safety element 242b and the upper housing 402b, by separating the safety element 242b from the substrate 100. Furthermore, the safety element 242b is destroyed internally.

[0072] Figure 7 , Figure 8A , Figure 8B and Figure 9 Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure in a storage device. (The details regarding the coupling structure will be omitted.) Figure 3 , Figure 4A , Figure 4B and Figure 5 The given description is repetitive.

[0073] Figure 7 An embodiment is shown in which the safety element 243 and the upper housing 403a are integrally coupled via a coupling structure 320. Figure 8A The upper housing 403a is shown before coupling with safety element 243. Figure 8B The safety element 243 is shown prior to its coupling with the upper housing 403a. Figure 9 The diagram shows that after the safety element 243 and the upper housing 403a are integrally coupled through the coupling structure 320, the upper housing 403a is removed or separated.

[0074] Reference Figure 7 , Figure 8A , Figure 8B and Figure 9 In this embodiment, the substrate 100 is mounted and fixed on the lower housing 403b. The safety element 243 is mounted on the substrate 100 via conductive bumps 250. The safety element 243 and the upper housing 403a are integrally coupled through a coupling structure 320.

[0075] In one embodiment, the coupling structure 320 extends downward from the lower surface of the upper housing 403a and includes a first protrusion 321 and a first coupling portion 323 formed on a first side (such as a first side surface) of the safety element 243. Figure 3 The coupling structure 310, which includes two protrusions 311a and 311b and two coupling portions 313a and 313b, is different. Figure 7 The coupling structure 320 includes a protrusion 321 and a coupling portion 323. The first protrusion 321 is formed of the same material as the coupling structure 320 and the upper housing 403a, and is integrally formed with the coupling structure 320 and the upper housing 403a. The safety element 243 and the upper housing 403a are integrally coupled by inserting the first protrusion 321 into the first coupling portion 323.

[0076] In some exemplary embodiments, the shapes of the first protrusion 321 and the first coupling portion 323 are implemented such that the safety element 243 and the upper housing 403a are initially easily coupled, and the connection between the safety element 243 and the upper housing 403a can be maintained when the upper housing 403a is removed. For example, in a cross-sectional view, with Figure 3The protrusions 311a and 311b are different. The first protrusion 321 has a first side and an inclined second side. The first side is relatively far from the upper housing 403a and is substantially parallel to the upper housing 403a. The inclined second side is closer to the upper housing 403a than the first side and extends from the end of the first side toward the upper housing 403a. The first coupling portion 323 has a shape corresponding to the first protrusion 321.

[0077] In this embodiment, because the first protrusion 321 and the first coupling portion 323 have the aforementioned shapes, when the upper housing 403a is removed, the safety element 243 is easily destroyed while maintaining the connection between the safety element 243 and the upper housing 403a. For example, when the upper housing 403a is removed or separated, such as Figure 9 As shown, by separating the safety element 243 from the substrate 100 based on the lever principle, the safety element 243 is destroyed, while the connection between the safety element 243 and the upper housing 403a is maintained. For example, the coupling force between the first protrusion 321 and the first coupling portion 323 between the safety element 243 and the upper housing 403a is stronger than the coupling force between the conductive bump 250 and the safety element 243 and the substrate 100.

[0078] In some exemplary embodiments, when the safety element 243 is separated from the substrate 100, the safety element 243 is internally destroyed, and thus prevents access to the safety element 243 by external means.

[0079] Figure 10 and Figure 11 Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure in a storage device. (The details regarding the coupling structure will be omitted.) Figure 3 , Figure 4A , Figure 4B and Figure 5 The given description is repetitive.

[0080] Figure 10 An embodiment is shown in which the safety element 245 and the upper housing 405a are integrally coupled via a coupling structure 330. Figure 11 This illustrates the removal or separation of the upper housing 405a after the safety element 245 and the upper housing 405a have been integrally coupled via the coupling structure 330.

[0081] Reference Figure 10 and Figure 11 In this embodiment, the substrate 100 is mounted and fixed on the lower housing 405b. The safety element 245 is mounted on the substrate 100 via conductive bumps 250. The safety element 245 and the upper housing 405a are integrally coupled through a coupling structure 330.

[0082] In an embodiment, the coupling structure 330 includes an adhesive layer disposed between the safety element 245 and the upper housing 405a. For example, the adhesive layer may be one of an adhesive tape or a bonding product having a liquid or solid state. The coupling structure 330 is a separate structure formed separately from and attached to the upper housing 405a, and is formed of a material different from that of the upper housing 405a.

[0083] In one embodiment, the safety element 245 is attached to the upper housing 405a by a coupling structure 330, such as an adhesive layer, and the safety element 245 and the upper housing 405a are integrally coupled. For example, when assembling the storage device, an adhesive layer may be formed on the upper housing 405a to engage the safety element 245, or an adhesive layer may be formed on the safety element 245 to engage the upper housing 405a. In another example, adhesive layers may be formed on both the upper housing 405a and the safety element 245 to engage each other, and the coupling structure 330 may include two adhesive layers.

[0084] In the embodiment, when as Figure 11 When the upper housing 405a is removed or separated, the safety element 245 is destroyed by separating it from the substrate 100, while the adhesive layer keeps the safety element 245 attached to the upper housing 405a. For example, the coupling force of the adhesive layer between the safety element 245 and the upper housing 405a is stronger than the coupling force of the conductive bump 250 between the safety element 245 and the substrate 100.

[0085] In some exemplary embodiments, when the safety element 245 is separated from the substrate 100, the safety element 245 is destroyed internally, thus preventing access to the safety element 245 using an external device.

[0086] Figure 12 , Figure 13 , Figure 14 and Figure 15 Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure in a storage device. (The details regarding the coupling structure will be omitted.) Figure 3 , Figure 4A , Figure 4B , Figure 5 , Figure 10 and Figure 11 The given description is repetitive.

[0087] Reference Figure 12 and Figure 13 ,Apart from Figure 12 and Figure 13 In addition to the coupling structures 330a and 330b having an adhesive layer 331 and a heat dissipation layer 333, the embodiments include Figure 12 and 13 Implementation examples and Figure 10The implementation examples are basically the same.

[0088] exist Figure 12 In one embodiment, the heat dissipation layer 333 is inserted between the safety element 245 and the adhesive layer 331. Figure 13 In this embodiment, the heat dissipation layer 333 is inserted between the upper housing 405a and the adhesive layer 331. By adding the heat dissipation layer 333, heat dissipation from the safety element 245 is improved or enhanced.

[0089] Reference Figure 14 and Figure 15 ,Apart from Figure 14 and Figure 15 In addition to coupling structures 330c and 330d, which have an adhesive layer 331 and an electrostatic discharge (ESD) protection layer 335, Figure 14 and Figure 15 Implementation examples and Figure 10 The implementation examples are basically the same.

[0090] exist Figure 14 In one embodiment, the ESD protection layer 335 is inserted between the safety element 245 and the adhesive layer 331. Figure 15 In this embodiment, the ESD protection layer 335 is inserted between the upper housing 405a and the adhesive layer 331. For example, the ESD protection layer 335 includes a conductive strip. By adding the ESD protection layer 335, the electrical characteristics of the safety element 245 are improved or enhanced.

[0091] In some exemplary embodiments, the coupling structure includes all of the adhesive layer 331, the heat dissipation layer 333, and the ESD protection layer 335.

[0092] In some embodiments, when adhesive layers are formed on both the upper housing 405a and the safety element 245 to bond them together, a heat dissipation layer 333 or an ESD protection layer 335 is inserted between the two adhesive layers.

[0093] Although Figure 12 , Figure 13 , Figure 14 and Figure 15 The dimensions of the heat dissipation layer 333 and the ESD protection layer 335 are shown to be substantially the same as those of the adhesive layer 331, but the exemplary embodiments are not limited thereto. For example, in some embodiments, the dimensions of the heat dissipation layer 333 and the ESD protection layer 335 are smaller than the dimensions of the adhesive layer 331. In other embodiments, the heat dissipation layer 333 and the ESD protection layer 335 each include at least one thermal pad and at least one ESD pad.

[0094] Figure 16 and Figure 17 Is included Figure 1A cross-sectional view of another embodiment of the coupling structure in a storage device. (The details regarding the coupling structure will be omitted.) Figure 3 , Figure 4A , Figure 4B and Figure 5 The given description is repetitive.

[0095] Figure 16 An embodiment is shown in which the safety element 247 and the upper housing 407a are integrally coupled via a coupling structure 340. Figure 17 The diagram shows the removal or separation of the upper housing 407a after the safety element 247 and the upper housing 407a have been integrally coupled via the coupling structure 340.

[0096] Reference Figure 16 and Figure 17 In this embodiment, the substrate 100 is mounted and fixed on the lower housing 407b. The safety element 247 is mounted on the substrate 100 via conductive bumps 250. The safety element 247 and the upper housing 407a are integrally coupled through a coupling structure 340.

[0097] In one embodiment, the coupling structure 340 includes electrical material disposed between the safety element 247 and the upper housing 407a. For example, the electrical material is a flexible printed circuit board (FPCB) 343 electrically connected to the safety element 247 and an FPCB connector 341 formed in the upper housing 407a, wherein the flexible printed circuit board (FPCB) 343 is connected to the FPCB connector 341. The coupling structure 340 is formed separately from and attached to the upper housing 407a, and is formed of a material different from that of the upper housing 407a. Because the coupling structure 340 includes electrical material forming the electrical connection, the electrical performance of the safety element 247 is improved or enhanced.

[0098] In one embodiment, the safety element 247 is connected to the upper housing 407a via a coupling structure 340, and the safety element 247 and the upper housing 407a are integrally coupled. For example, the upper housing 407a includes an FPCB connector 341, and the safety element 247 includes an FPCB 343. When assembling the storage device, the FPCB 343 is inserted into the FPCB connector 341 to engage the safety element 247 with the upper housing 407a.

[0099] For example, in an embodiment, when the upper housing 407a is removed or separated, such as Figure 17 As shown, the safety element 247 is substantially destroyed by damaging at least a portion of the FPCB 343. However, the exemplary embodiments are not limited thereto, and in other embodiments, at least a portion of the FPCB connector 341 is damaged, or the safety element 247 is separated from the substrate 100, while maintaining the connection between the FPCB connector 341 and the FPCB 343.

[0100] In some exemplary embodiments, when at least a portion of the FPCB 343 is damaged, the safety element 247 is internally destroyed, and thus access to the safety element 247 using an external device is prevented.

[0101] Figure 18 and Figure 19 Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure in a storage device. (The details regarding the coupling structure will be omitted.) Figure 3 , Figure 4A , Figure 4B and Figure 5 The given description is repetitive.

[0102] Figure 18 An embodiment is shown in which the safety element 249 and the upper housing 409a are integrally coupled via a coupling structure 350. Figure 18 The diagram shows the removal or separation of the upper housing 409a after the safety element 249 and the upper housing 409a have been integrally coupled via the coupling structure 350.

[0103] Reference Figure 18 and Figure 19 In this embodiment, the substrate 100 is mounted and fixed on the lower housing 409b. The safety element 249 is mounted on the substrate 100 via conductive bumps 250. The safety element 249 and the upper housing 409a are integrally coupled through a coupling structure 350.

[0104] In an embodiment, the coupling structure 350 includes electrical material disposed between the safety element 249 and the upper housing 409a. For example, the electrical material includes at least one conductor 351 or conductor 353. For example, conductors 351 and 353 include at least one metal. The coupling structure 350 is separately formed from and attached to the upper housing 409a, and includes a material different from that of the upper housing 409a. Because the coupling structure 350 includes electrical material forming an electrical connection, the electrical performance of the safety element 249 is improved or enhanced.

[0105] In one embodiment, the safety element 249 is connected to the upper housing 409a by a coupling structure 350 (i.e., by wires 351 and 353), and the safety element 249 and the upper housing 409a are integrally coupled.

[0106] In an embodiment, such as Figure 19As shown, when the upper housing 409a is removed or detached, the safety element 249 is destroyed by separating it from the substrate 100, while the safety element 249 remains connected to the upper housing 409a via wires 351 and 353. For example, the coupling force between the safety element 249 and the upper housing 409a by wires 351 and 353 is stronger than the coupling force between the conductive bump 250 and the safety element 249 and the substrate 100.

[0107] In some exemplary embodiments, when the safety element 249 is separated from the substrate 100, the safety element 249 is internally destroyed, thus preventing access to the safety element 249 by external devices.

[0108] In some exemplary embodiments, as referenced Figure 6A As described, when two or more safety elements are included in the storage device, the storage device includes the same number of coupling structures as the safety elements.

[0109] In some exemplary embodiments, when two or more safety elements are included in the storage device, they can be combined with reference to Figures 3 to 19 The described two or more embodiments implement the storage device.

[0110] Figure 20 , Figure 21A , Figure 21B and Figure 22 Is included Figure 1 A cross-sectional view of an embodiment of the coupling structure and connection between the security element and the substrate in a storage device. (The details regarding the coupling structure and connection between the security element and the substrate in the storage device will be omitted.) Figure 3 , Figure 4A , Figure 4B and Figure 5 The given description is repetitive.

[0111] Figure 20 An embodiment is shown in which the safety element 1241 and the upper housing 401a are integrally coupled via a coupling structure 310 and the safety element 1241 and the substrate 1100 are electrically connected. Figure 21A The safety element 1241 is shown prior to its electrical connection to the substrate 1100, and Figure 21B The substrate 1100 is shown before it is electrically connected to the safety element 1241. Figure 22 This illustrates that after the safety element 1241 and the substrate 1100 have been electrically connected, the safety element 1241 and the substrate 1100 are electrically disconnected or separated.

[0112] Reference Figure 20 , Figure 21A , Figure 21B and Figure 22According to the embodiment, the upper housing 401a, the lower housing 401b, the coupling structure 310, and the coupling members 310a and 310b are respectively connected to... Figure 3 , Figure 4A and Figure 4B The upper housing 401a, lower housing 401b, coupling structure 310, and coupling elements 310a and 310b are substantially the same. In some exemplary embodiments, the coupling structure 310 is referred to as Figure 6B The described coupling structure 315 is replaced.

[0113] In an embodiment, a plurality of electrical coupling portions 1110 are formed on a substrate 1100, and a plurality of electrical protrusions 1242 are formed in a safety element 1241. For example, the plurality of electrical coupling portions 1110 include a plurality of conductive holes, and the plurality of electrical protrusions 1242 include a plurality of lead frames formed on the lower surface of the safety element 1241. Figure 3 The examples are different, in Figure 3 In the example, the safety element 241 and the substrate 100 are electrically connected via conductive bumps 250. Figure 20 In the example, the safety element 1241 and the substrate 1100 are electrically connected to each other by inserting multiple electrical protrusions 1242 into multiple electrical coupling portions 1110.

[0114] In an embodiment, such as Figure 5 For example, even if the upper housing 401a is removed, the connection between the safety element 1241 and the upper housing 401a is maintained. For example, as... Figure 22 As shown, when the upper housing 401a is removed or separated, the safety element 1241 separates from and is removed from the substrate 1100, while maintaining the connection between the safety element 1241 and the upper housing 401a. For example, the coupling force between the first protrusion 311a and the second protrusion 311b, as well as the first coupling portion 313a and the second coupling portion 313b, between the safety element 1241 and the upper housing 401a can be stronger than the coupling force between the plurality of electrical coupling portions 1110 and the plurality of electrical protrusions 1242 between the safety element 1241 and the substrate 1100.

[0115] In an embodiment, as described above, after the security element 1241 is detached and removed, access to the security data stored in the security element 1241 is prevented using a storage device. However, with Figure 5 Unlike other examples, when the security element 1241 is detached and removed, the security element 1241 is not destroyed. For example, after the security element 1241 is detached and removed from the substrate 1100, the security element 1241 can be electrically reconnected to the substrate 1100, and then access to the security data stored in the security element 1241 is restored.

[0116] Figure 23 and Figure 24 Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure and connection between the security element and the substrate in a storage device. (The details regarding the coupling structure and connection will be omitted.) Figure 10 , Figure 11 , Figure 20 , Figure 21A , Figure 21B and Figure 22 The given description is repetitive.

[0117] Figure 23 An embodiment is shown in which the safety element 1245 and the upper housing 405a are integrally coupled via a coupling structure 330, and the safety element 1245 and the substrate 1100 are electrically connected. Figure 24 This illustrates that after the safety element 1245 and the substrate 1100 have been electrically connected, the safety element 1245 and the substrate 1100 are electrically disconnected or separated.

[0118] Reference Figure 23 and Figure 24 In the embodiment, the upper housing 405a, the lower housing 405b, and the coupling structure 330 are respectively connected to... Figure 10 The upper housing 405a, lower housing 405b, and coupling structure 330 are basically the same. Safety element 1245 and... Figure 10 The safety element 245 is basically the same as that in the previous one, except that the safety element 1245 also includes multiple electrical protrusions 1242. The substrate 1100, multiple electrical coupling portions 1110 and multiple electrical protrusions 1242 are respectively with Figure 20 , Figure 21A and Figure 21B The substrate 1100, multiple electrical coupling portions 1110 and multiple electrical protrusions 1242 are basically the same.

[0119] For example, in an embodiment, such as Figure 24 As shown, when the upper housing 405a is removed or detached, the safety element 1245 separates from and is removed from the substrate 1100, while the safety element 1245 remains attached to the upper housing 405a by an adhesive layer. For example, the coupling force of the adhesive layer between the safety element 1245 and the upper housing 405a is stronger than the coupling force between the plurality of electrical coupling portions 1110 and the plurality of electrical protrusions 1242 and the substrate 1100. However, when the safety element 1245 is detached and removed, the safety element 1245 is not damaged, and after the safety element 1245 is re-electrically connected to the substrate 1100, access to the security data stored in the safety element 1245 is restored.

[0120] In some exemplary embodiments, the coupling structure 330 also includes Figure 12 and Figure 13 Heat dissipation layer 333, or Figure 14 and Figure 15 The ESD protection layer is 335.

[0121] Figure 25 and Figure 26 Is included Figure 1 A cross-sectional view of another embodiment of the coupling structure and connection between the security element and the substrate in a storage device. (The details regarding the coupling structure and connection will be omitted.) Figure 18 , Figure 19 , Figure 20 , Figure 21A , Figure 21B and Figure 22 The given description is repetitive.

[0122] Figure 25 An embodiment is shown in which the safety element 1249 and the upper housing 409a are integrally coupled via a coupling structure 350, and the safety element 1249 and the substrate 1100 are electrically connected. Figure 26 This illustrates that after the safety element 1249 and the substrate 1100 have been electrically connected, the safety element 1249 and the substrate 1100 are electrically disconnected or separated.

[0123] Reference Figure 25 and Figure 26 In the embodiment, the upper housing 409a, the lower housing 409b, and the coupling structure 350 with wires 351 and 353 are respectively connected to... Figure 18 The upper housing 409a, lower housing 409b, and coupling structure 350 with wires 351 and 353 are basically the same. Safety element 1249 and... Figure 18 The safety element 249 is basically the same as that in the previous one, except that the safety element 1249 also includes multiple electrical protrusions 1242. The substrate 1100, multiple electrical coupling portions 1110 and multiple electrical protrusions 1242 are respectively with Figure 20 , Figure 21A and Figure 21B The substrate 1100, multiple electrical coupling portions 1110 and multiple electrical protrusions 1242 are basically the same.

[0124] In an embodiment, such as Figure 26 As shown, when the upper housing 409a is removed or detached, the safety element 1249 is detached from and removed from the substrate 1100, while the safety element 1249 remains connected to the upper housing 409a via wires 351 and 353. For example, the coupling force between the safety element 1249 and the upper housing 409a via wires 351 and 353 is stronger than the coupling force between the multiple electrical coupling portions 1110 and the multiple electrical protrusions 1242 via the safety element 1249 and the substrate 1100. However, when the safety element 1249 is detached and removed, the safety element 1249 is not damaged, and after the safety element 1249 is reconnected to the substrate 1100, access to the security data stored in the safety element 1249 is restored.

[0125] In some exemplary embodiments, when two or more safety elements are included in the storage device, the storage device includes the same number of coupling structures as the safety elements.

[0126] In some exemplary embodiments, when two or more safety elements are included in the storage device, the storage device can be combined with reference to Figures 20 to 26 Two or more of the described embodiments are used to implement this. In some exemplary embodiments, when two or more security elements are included in the storage device, the storage device can be implemented by combining references. Figures 3 to 19 One or more of the described embodiments and references Figures 20 to 26 One or more of the described embodiments are implemented.

[0127] Figure 27 This is a block diagram of a data center including storage devices according to an exemplary embodiment.

[0128] Reference Figure 27 In this embodiment, data center 3000 is a facility that collects various types of data and provides various services, and may be referred to as a data storage center. Data center 3000 is a system for operating search engines and databases, and may be a computing system used by organizations such as banks or government agencies. Data center 3000 includes application servers 3100 to 3100n and storage servers 3200 to 3200m. The number of application servers 3100 to 3100n and the number of storage servers 3200 to 3200m may vary according to exemplary embodiments, and the number of application servers 3100 to 3100n and the number of storage servers 3200 to 3200m may differ from each other.

[0129] In an embodiment, application server 3100 includes at least one processor 3110 and at least one memory 3120, and storage server 3200 includes at least one processor 3210 and at least one memory 3220. The operation of storage server 3200 is described as an example. Processor 3210 controls the overall operation of storage server 3200 and accesses memory 3220 to execute instructions or data loaded in memory 3220. Memory 3220 includes at least one of dual data rate (DDR) synchronous dynamic random access memory (SDRAM), high bandwidth memory (HBM), hybrid memory cube (HMC), dual in-line memory module (DIMM), Optane DIMM, and non-volatile DIMM (NVDIMM). The number of processors 3210 and the number of memories 3220 included in storage server 3200 may vary according to exemplary embodiments. In some exemplary embodiments, processors 3210 and memories 3220 form a processor-memory pair. In some exemplary embodiments, the number of processors 3210 and the number of memories 3220 may differ from each other. Processor 3210 may include a single-core processor or a multi-core processor. The above description of storage server 3200 also applies to application server 3100. Application server 3100 includes at least one storage device 3150, and storage server 3200 includes at least one storage device 3250. In some exemplary embodiments, application server 3100 does not include storage device 3150. The number of storage devices 3250 included in storage server 3200 may vary depending on exemplary embodiments.

[0130] In this embodiment, application servers 3100 to 3100n and storage servers 3200 to 3200m communicate with each other via network 3300. Network 3300 can be implemented using Fibre Channel (FC) or Ethernet. FC is a medium for relatively high-speed data transmission and uses optical switches to provide high performance and / or high availability. Depending on the access scheme of network 3300, storage servers 3200 to 3200m can be file storage, block storage, or object storage.

[0131] In some exemplary embodiments, network 3300 is a storage-only network or a network dedicated to storage, such as a Storage Area Network (SAN). For example, the SAN is an FC-SAN implemented using an FC network and according to the FC protocol (FCP). As another example, the SAN is an IP-SAN implemented using a Transmission Control Protocol / Internet Protocol (TCP / IP) network and according to the iSCSI (SCSI over TCP / IP or Internet SCSI) protocol. In other exemplary embodiments, network 3300 is a general or ordinary network such as a TCP / IP network. For example, network 3300 may be implemented according to at least one protocol, such as Ethernet FC (FCoE), Network Attached Storage (NAS), or Fabric-on-Mechanical Non-Volatile Memory High Speed ​​(NVMe) (NVMe-oF), etc.

[0132] In the following description, exemplary embodiments will be based on application server 3100 and storage server 3200. The description of application server 3100 applies to other application servers 3100n, and the description of storage server 3200 applies to other storage servers 3200m.

[0133] In this embodiment, application server 3100 stores data requested by a user or client via network 3300 into one of storage servers 3200 to 3200m. Furthermore, application server 3100 retrieves data requested by a user or client from one of storage servers 3200 to 3200m via network 3300. For example, application server 3100 is implemented as a web server or a database management system (DBMS).

[0134] In an embodiment, application server 3100 accesses memory 3120n or storage device 3150n in another application server 3100n via network 3300, or accesses memory 3220 to 3220m or storage device 3250 to 3250m in storage servers 3200 to 3200m via network 3300. Therefore, application server 3100 performs various operations on data stored in application servers 3100 to 3100n or storage servers 3200 to 3200m. For example, application server 3100 executes commands to move or copy data between application servers 3100 to 3100n or storage servers 3200 to 3200m. Data is transmitted directly from storage devices 3250 to 3250m of storage servers 3200 to 3200m to storage devices 3120 to 3120n of application servers 3100 to 3100n, or via storage devices 3220 to 3220m of storage servers 3200 to 3200m to storage devices 3120 to 3120n of application servers 3100 to 3100n. For example, data transmitted over network 3300 may be encrypted for security or privacy purposes.

[0135] In an embodiment, in storage server 3200, interface 3254 provides a physical connection between processor 3210 and controller 3251, or a physical connection between network interface card (NIC) 3240 and controller 3251. For example, interface (I / F) 3254 is implemented based on a Direct Attached Storage (DAS) scheme, wherein storage device 3250 is directly connected to a dedicated cable. As another example, interface 3254 is implemented based on at least one of various interface schemes, such as Advanced Technology Attachment (ATA), Serial ATA (SATA), External SATA (e-SATA), Small Computer System Interface (SCSI), Serial Attached SCSI (SAS), Peripheral Component Interconnect (PCI), PCI High Speed ​​(PCIe), NVMe, IEEE 1394, Universal Serial Bus (USB), Secure Digital (SD) card interface, Multimedia Card (MMC) interface, Embedded MMC (eMMC) interface, Universal Flash Storage (UFS) interface, Embedded UFS (eUFS) interface, or Compact Flash (CF) card interface, etc.

[0136] In one embodiment, the storage server 3200 further includes a switch 3230 and a NIC 3240. The switch 3230, under the control of the processor 3210, selectively connects the processor 3210 to the storage device 3250, or selectively connects the NIC 3240 to the storage device 3250. Similarly, the application server 3100 also includes a switch 3130 and a NIC 3140.

[0137] In some exemplary embodiments, NIC 3240 may include a network interface card or network adapter, etc. NIC 3240 can be connected to network 3300 via a wired interface, wireless interface, Bluetooth interface, or optical interface, etc. NIC 3240 also includes internal memory, a digital signal processor (DSP), a host bus interface, etc., and is connected to processor 3210 or switch 3230 via the host bus interface. The host bus interface may be implemented as one of the above examples of interface 3254. In some exemplary embodiments, NIC 3240 is integrated with at least one of processor 3210, switch 3230, and storage device 3250.

[0138] In embodiments, within storage servers 3200 to 3200m or application servers 3100 to 3100n, the processor sends commands to storage devices 3150 to 3150n and 3250 to 3250m, or memories 3120 to 3120n and 3220 to 3220m, to program or read data. For example, the data is error-corrected data from an error-correcting code (ECC) engine. For example, the data has been processed via Data Bus Inversion (DBI) or Data Masking (DM) and includes Cyclic Redundancy Check (CRC) information. For example, the data is encrypted for security or privacy.

[0139] In this embodiment, memory devices 3150 to 3150m and 3250 to 3250m send control signals and command / address signals to NAND flash memory devices 3252 to 3252m in response to a read command received from the processor. When data is read from NAND flash memory devices 3252 to 3252m, a read enable (RE) signal is input as a data output control signal and used to output data to the DQ bus. A data strobe signal (DQS) is generated using the RE signal. Command and address signals are latched in a page buffer based on the rising or falling edge of the write enable (WE) signal.

[0140] In an embodiment, controller (CTRL) 3251 controls the overall operation of storage device 3250. In some exemplary embodiments, controller 3251 includes static random access memory (SRAM). Controller 3251 writes data to NAND flash memory device 3252 in response to a write command, or reads data from NAND flash memory device 3252 in response to a read command. For example, write commands or read commands may be received from processor 3210 in storage server 3200, processor 3210m in other storage servers 3200m, or processors 3110 to 3110n in application servers 3100 to 3100n. DRAM 3253 temporarily stores data to be written to or read from NAND flash memory device 3252. Additionally, DRAM 3253 stores metadata. Metadata is generated by controller 3251 to manage user data or NAND flash memory device 3252. Storage device 3250 includes a security element (SE) 3255 for security or privacy.

[0141] Each of storage devices 3150 to 3150m and storage devices 3250 to 3250m can be according to reference Figures 1 to 26 Storage device of an exemplary embodiment described herein.

[0142] Figure 28 and Figure 29 yes Figure 27 A block diagram of an embodiment of a storage device in a data center.

[0143] Reference Figure 28 In an embodiment, the storage device 1000a includes a connector (CN) 1002, a storage controller 1010, a plurality of non-volatile memories (NVMs) 1020a, 1020b and 1020c, a buffer memory 1030 and a security memory 1040.

[0144] In the embodiment, connector 1002, memory controller 1010, multiple non-volatile memories 1020a, 1020b and 1020c, buffer memory 1030 and security memory 1040 respectively correspond to Figure 2 The connector 110, controller 210, multiple non-volatile memories 220, buffer memory 230 and safety element 240 are included.

[0145] exist Figure 28 In this embodiment, the security memory 1040 is a separate chip, independent of the memory controller 1010 and the plurality of non-volatile memories 1020a, 1020b, and 1020c. In this embodiment, reference is made to... Figures 3 to 26One or more of the coupling structures described herein can be used to couple the security memory 1040 to the housing as a whole.

[0146] Reference Figure 29 In an embodiment, the storage device 1000b includes a connector 1002, a storage controller 1010b, a plurality of non-volatile memories 1020a, 1020b, and 1020c, a buffer memory 1030, and a secure memory 1040. The storage device 1000b is connected to... Figure 28 The storage device 1000a is substantially the same, except that the security storage 1040 is arranged or included in the storage controller 1010b.

[0147] exist Figure 29 In one embodiment, the secure memory 1040 is integrated with the memory controller 1010b to form a single chip. In this embodiment, reference is made to... Figures 3 to 26 One or more of the coupling structures described herein can be used to couple the memory controller 1010b, including the security memory 1040, to the housing as a whole.

[0148] In another embodiment, the secure memory 1040 is integrated with one of a plurality of non-volatile memories 1020a, 1020b, and 1020c to form a single chip. In this embodiment, reference is made to... Figures 3 to 26 One or more of the coupling structures described herein can be used to combine a non-volatile memory, including the security memory 1040, with the housing as a whole.

[0149] Figure 30 yes Figure 28 or Figure 29 A block diagram of an embodiment of the memory in a storage device.

[0150] Reference Figure 30 In this embodiment, the memory 500 includes a memory cell array 510, an address decoder 520, a page buffer circuit 530, a data input / output (I / O) circuit 540, a voltage generator 550, and a control circuit 560. The memory 500 may be... Figure 28 and 29 One of the multiple non-volatile memories 1020a, 1020b and 1020c in it, or it may be Figure 28 and 29 The secure storage 1040 in the memory.

[0151] In this embodiment, the memory cell array 510 includes multiple memory cells for storing data. Control circuitry 560 controls the operation of memory 500 based on command CMD and address ADDR. Address decoder 520 is connected to memory cell array 510 via multiple string select lines SSL, multiple word lines WL, and multiple ground select lines GSL. Voltage generator 550 generates voltages VS and VER required for the operation of memory 500 based on an externally received power supply voltage PWR and control signal CON received from control circuitry 560. Address decoder 520 generates signals sent to memory cell array via string select lines SSL, multiple word lines WL, and multiple ground select lines GSL according to voltage VS and row select signal R_ADDR received from control circuitry 560. Page buffer circuitry 530 is connected to memory cell array 510 via multiple bit lines BL and receives page buffer control signal PBC from control circuitry 560. The data I / O circuit 540 receives the column address signal C_ADDR from the control circuit 560, connects to the page buffer circuit 530 via the data line DL, and receives write data DAT or outputs read data DAT.

[0152] In an embodiment, if memory 500 is secure memory 1040, then as referred to Figures 3 to 19 As stated, when the housing is removed or separated, the memory 500 can be damaged from the outside by separating the memory 500 from the substrate. Furthermore, the memory 500 can be damaged internally. For example, the structure of the memory cell array 510 can be damaged, at least one circuit outside the memory cell array 510 can be damaged, or the connection between the memory cell array 510 and other circuits can be damaged.

[0153] Embodiments of the present invention can be incorporated into various electronic devices or systems, including storage devices or SSD devices. For example, embodiments of the present invention can be incorporated into systems such as personal computers (PCs), server computers, data centers, workstations, mobile phones, smartphones, tablet computers, laptop computers, personal digital assistants (PDAs), portable multimedia players (PMPs), digital cameras, portable game consoles, music players, camcorders, video players, navigation devices, wearable devices, Internet of Things (IoT) devices, Internet of Everything (IoE) devices, e-book readers, virtual reality (VR) devices, augmented reality (AR) devices, robotic devices, or drones.

[0154] The foregoing is a description of exemplary embodiments and should not be construed as limiting them. Although some exemplary embodiments have been described, those skilled in the art will readily understand that many modifications can be made to the exemplary embodiments without substantially departing from the novel teachings of the exemplary embodiments. Therefore, all such modifications are intended to be included within the scope of the exemplary embodiments defined in the claims. Accordingly, it should be understood that the foregoing is a description of various exemplary embodiments and should not be construed as limiting to the specific exemplary embodiments disclosed, and modifications to the disclosed exemplary embodiments, as well as other exemplary embodiments, are intended to be included within the scope of the appended claims.

Claims

1. A storage device, comprising: substrate; At least one safety element is mounted on the substrate; A housing surrounding the substrate and the at least one safety element; as well as A coupling structure that integrally couples the at least one safety element to the housing. When at least a portion of the housing is removed, the at least one safety element is destroyed, while the connection between the at least one safety element and the housing is maintained by the coupling structure, wherein access to security data stored in the at least one safety element is prevented.

2. The storage device as claimed in claim 1, wherein, The coupling structure includes: A first coupling portion is disposed on a first surface of the at least one safety element; and The first protrusion is arranged within the housing. Specifically, by inserting the first protrusion into the first coupling portion, the at least one safety element and the housing are integrally coupled.

3. The storage device as claimed in claim 2, wherein, When at least a portion of the housing is removed, the at least one safety element is destroyed by separating it from the substrate, while the first protrusion remains inserted into the first coupling portion.

4. The storage device as claimed in claim 2, wherein, The housing includes: Lower housing, the substrate mounted on the lower housing; and An upper housing, coupled to the lower housing and covering the substrate and the at least one safety element. The first protrusion is arranged in the upper housing.

5. The storage device as claimed in claim 3, wherein, The coupling force between the first coupling portion and the first protrusion is stronger than the coupling force between the at least one safety element and the housing.

6. The storage device as claimed in claim 3, wherein, The at least one safety element is separated from the substrate, and the at least one safety element is internally destroyed, preventing access to the at least one safety element using an external device.

7. The storage device as claimed in claim 2, wherein, The coupling structure further includes: A second coupling portion is formed on the second surface of the at least one safety element; and The second protrusion is formed within the shell. Specifically, the at least one safety element and the housing are coupled together by inserting the second protrusion into the second coupling portion.

8. The storage device as claimed in claim 1, wherein, The coupling structure includes: The first protrusion is formed within the shell. The at least one safety element and the housing are integrally coupled through the first protrusion.

9. The storage device as claimed in claim 1, wherein, The coupling structure includes: An adhesive layer is disposed between the at least one safety element and the housing. The at least one safety element and the housing are integrally coupled by attaching the at least one safety element to the housing by the adhesive layer.

10. The storage device of claim 9, wherein, When at least a portion of the housing is removed, the at least one safety element is destroyed by separating it from the substrate, while the at least one safety element remains attached to the housing by the adhesive layer.

11. The storage device of claim 10, wherein, The adhesive layer has a stronger coupling force between the at least one safety element and the housing than the coupling force between the at least one safety element and the substrate.

12. The storage device of claim 9, wherein, The coupling structure further includes: A heat dissipation layer is inserted between the at least one safety element and the adhesive layer or between the housing and the adhesive layer.

13. The storage device as claimed in claim 9, wherein, The coupling structure further includes: An electrostatic discharge protection layer is inserted between the at least one safety element and the adhesive layer, or between the housing and the adhesive layer.

14. The storage device as claimed in claim 1, wherein, The coupling structure includes: Electrical materials, which are arranged between the at least one safety element and the housing, The at least one safety element and the housing are integrally coupled by connecting the at least one safety element to the housing using the electrical material.

15. The storage device of claim 14, wherein: The electrical materials include flexible printed circuit boards, and When at least a portion of the housing is removed, the at least one safety element is compromised by damaging at least a portion of the flexible printed circuit board.

16. The storage device of claim 14, wherein: The electrical material includes at least one wire, and When at least a portion of the housing is removed, the at least one safety element is destroyed by separating it from the substrate, while the at least one safety element remains connected to the housing via the at least one wire.

17. The storage device of claim 16, wherein, The coupling force of the at least one wire between the at least one safety element and the housing is stronger than the coupling force between the at least one safety element and the substrate.

18. A storage device comprising: substrate; At least one safety element is mounted on the substrate; A housing surrounding the substrate and the at least one safety element; as well as A coupling structure that integrally couples the at least one safety element to the housing. When at least a portion of the housing is removed, the at least one safety element is separated from and removed from the substrate, while the at least one safety element and the housing remain connected through the coupling structure, wherein access to security data stored in the at least one safety element is prevented.

19. The storage device of claim 18, wherein, After the at least one security element has been separated from and removed from the substrate, access to the security data stored in the at least one security element is restored when the at least one security element is electrically connected to the substrate.

20. The storage device of claim 18, further comprising: Multiple electrical coupling portions are arranged on the substrate; as well as Multiple electrical protrusions are arranged in the at least one safety element. Specifically, the at least one safety element and the substrate are electrically connected to each other by inserting the plurality of electrical protrusions into the plurality of electrical coupling portions.

21. The storage device of claim 18, wherein, The coupling structure includes: A first coupling portion and a second coupling portion are formed on the first and second surfaces of the at least one safety element; and The first and second protrusions are arranged in the shell, and Specifically, by inserting the first protrusion and the second protrusion into the first coupling portion and the second coupling portion, the at least one safety element is integrally coupled to the housing.

22. The storage device of claim 21, wherein, When at least a portion of the housing is removed, the at least one safety element is separated from and removed from the substrate, while the first protrusion and the second protrusion remain inserted into the first coupling portion and the second coupling portion.

23. The storage device of claim 18, wherein, The coupling structure includes: An adhesive layer is disposed between the at least one safety element and the housing. The at least one safety element and the housing are integrally coupled by attaching the at least one safety element to the housing by the adhesive layer.

24. The storage device of claim 23, wherein, When at least a portion of the housing is removed, the at least one safety element is separated from and removed from the substrate, while the at least one safety element remains attached to the housing via the adhesive layer.

25. The storage device of claim 18, wherein, The coupling structure includes: Electrical materials, which are arranged between the at least one safety element and the housing, The at least one safety element and the housing are integrally coupled by connecting the at least one safety element to the housing using the electrical material.

26. The storage device of claim 25, wherein, When at least a portion of the housing is removed, the at least one safety element is separated from and removed from the substrate, while the at least one safety element remains connected to the housing via the electrical material.

27. A solid-state drive device, comprising: substrate; Multiple non-volatile memories are mounted on the substrate and store normal data; At least one secure memory is mounted on the substrate and stores secure data; A controller, mounted on the substrate, controls the operation of the plurality of non-volatile memories and the at least one secure memory; A housing surrounding the substrate, the plurality of non-volatile memories, the at least one secure memory, and the controller; as well as A coupling structure that integrally couples the at least one secure memory and the housing. When at least a portion of the housing is removed, the at least one security memory is destroyed or the at least one security memory is separated and removed from the substrate, while the coupling structure maintains a connection between the at least one security memory and the housing, and access to the security data stored in the at least one security memory is prevented.

28. The solid-state driver device of claim 27, wherein, The at least one secure memory is a separate chip, separate from the plurality of non-volatile memories and the controller.

29. The solid-state driver device of claim 27, wherein, The at least one secure memory and one of the plurality of non-volatile memories or the controller as a whole are configured as a single chip.

30. A data center, comprising: At least one application server that receives data write requests or data read requests; as well as At least one storage server includes a storage device that stores write data corresponding to the data write request or outputs read data corresponding to the data read request. The storage device includes: substrate; At least one safety element is mounted on the substrate; A housing surrounding the substrate and the at least one safety element; and A coupling structure that integrally couples the at least one safety element to the housing. When at least a portion of the housing is removed, the at least one safety element is destroyed or the at least one safety element is separated and removed from the substrate, while the coupling structure maintains a connection between the at least one safety element and the housing, and access to security data stored in the at least one safety element is prevented.

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