A matrix LED light source and a manufacturing method thereof

Abstract

The present application discloses a matrix LED light source and a manufacturing method thereof, including a substrate; an LED chip matrix disposed on the substrate and electrically connected to the substrate; the LED chip matrix includes a plurality of LED chips; a phosphor layer disposed on the upper surface of each LED chip; a white wall glue portion disposed on the substrate and around the LED chips, and the white wall glue portion is distributed with grooves between adjacent LED chips; a black wall glue portion disposed in the grooves and on the upper surface of the white wall glue portion, and the upper surface of the black wall glue portion is flush with the upper surface of the phosphor layer. In the matrix LED light source of the present application, grooves are provided in the white wall glue portion between adjacent LED chips, and black wall glue portions are provided in the grooves. When one LED light source in the matrix LED light source emits light, the light on the side will be absorbed by the black wall glue portion and will not irradiate the phosphor layer on the adjacent LED chip, thereby avoiding the adjacent LED light sources from emitting light and avoiding interference between adjacent LED light sources.

Description

Technical Field

[0001] The present application relates to the technical field of lighting, and particularly to a matrix LED light source and a manufacturing method thereof. Background Art

[0002] With the rapid development of driving autonomous technology, the requirements for automotive lights are getting higher and higher. In addition to lighting and aesthetics, the lighting safety of vehicle lights has also become one of the important conditions for vehicle lights. Each single light source in the matrix LED light source can be individually turned on and off, so the matrix LED light source can achieve variable and precise lighting of the front area.

[0003] Currently, there are three ways to form a phosphor layer above the LED chips in the matrix LED light source. One is to spray all the LED chips as a whole, and the phosphor layer is also distributed in the blank areas corresponding to adjacent LED chips. When a certain LED light source emits light, the surrounding LED light sources will also be excited to emit light, that is, there is mutual interference between adjacent LED light sources. The second is to use a steel mesh to block the area outside the LED chips and spray phosphor on the LED chip area. The phosphor glue will seep into the connection between the steel mesh and the substrate, and there will also be mutual interference between adjacent LED light sources. Moreover, the appearance of the matrix LED light source is not beautiful enough, and the cost of the steel mesh is also high. The third is to paste phosphor patches on the LED chips. The cost of the phosphor patches is high, and there is also a problem of mutual interference between adjacent LED light sources.

[0004] Therefore, how to solve the above technical problems should be the key concern of those skilled in the art. Summary of the Invention

[0005] The purpose of the present application is to provide a matrix LED light source and a manufacturing method thereof to solve the problem of mutual interference between single light sources in the matrix LED light source.

[0006] To solve the above technical problems, the present application provides a matrix LED light source, including:

[0007] A substrate;

[0008] An LED chip matrix disposed on the substrate and electrically connected to the substrate; the LED chip matrix includes a plurality of LED chips;

[0009] A phosphor layer disposed on the upper surface of each LED chip;

[0010] A white wall glue part disposed on the substrate and around the LED chips, and the white wall glue part is provided with grooves between adjacent LED chips;

[0011] A black wall adhesive part is disposed in the groove and on the upper surface of the white wall adhesive part, and the upper surface of the black wall adhesive part is flush with the upper surface of the phosphor layer.

[0012] Optionally, it further includes:

[0013] A protective layer disposed on the upper surface of the phosphor layer.

[0014] Optionally, the protective layer is a silicone layer.

[0015] Optionally, the substrate is a ceramic substrate.

[0016] Optionally, the depth of the groove is one-fourth to one-third of the thickness of the white wall adhesive part.

[0017] Optionally, the blank spacing between adjacent LED chips is less than or equal to 0.2 mm.

[0018] This application also provides a manufacturing method of a matrix LED light source, including:

[0019] Fixing and connecting a plurality of LED chips on a substrate to form an LED chip matrix;

[0020] Filling white wall adhesive in the area of the substrate except for the LED chips to form a white wall adhesive part;

[0021] Spraying phosphor on the upper surface of the LED chips and the upper surface of the white wall adhesive part to form a phosphor layer;

[0022] Removing the phosphor layer in the area other than the upper surface of the LED chips and between adjacent LED chips;

[0023] Grooving between adjacent LED chips to form a groove in the white wall adhesive part;

[0024] Filling black wall adhesive in the groove and on the upper surface of the white wall adhesive part to form a black wall adhesive part; the upper surface of the black wall adhesive is flush with the upper surface of the phosphor layer.

[0025] Optionally, after spraying phosphor on the upper surface of the LED chips and the upper surface of the white wall adhesive part to form a phosphor layer, it further includes:

[0026] Spraying a protective glue on the upper surface of the phosphor layer to form a protective layer;

[0027] Correspondingly, removing the phosphor layer in the area other than the upper surface of the LED chips and between adjacent LED chips includes:

[0028] Removing the phosphor layer and the protective layer in the area other than the upper surface of the LED chips and between adjacent LED chips.

[0029] Optionally, the step of fixedly connecting multiple LED chips to a substrate to form an LED chip matrix includes:

[0030] Bonding multiple LED chips to the substrate through die bonding glue;

[0031] Fixing and connecting multiple LED chips to the substrate through eutectic soldering technology;

[0032] Cleaning the flux.

[0033] Optionally, the step of grooving between adjacent LED chips includes:

[0034] Adopting a laser grooving method to groove between adjacent LED chips.

[0035] A matrix-type LED light source provided by the present application includes: a substrate; an LED chip matrix disposed on the substrate and electrically connected to the substrate; the LED chip matrix includes multiple LED chips; a phosphor layer disposed on the upper surface of each LED chip; a white wall glue portion disposed on the substrate and around the LED chips, the white wall glue portion is provided with grooves between adjacent LED chips; a black wall glue portion disposed in the grooves and on the upper surface of the white wall glue portion, and the upper surface of the black wall glue portion is flush with the upper surface of the phosphor layer.

[0036] It can be seen that in the matrix-type LED light source of the present application, grooves are provided in the white wall glue portion between adjacent LED chips, and black wall glue portions are provided in the grooves, that is, black wall glue portions are distributed around the LED chips. When one LED light source in the matrix-type LED light source emits light, the side light will be absorbed by the black wall glue portion and will not irradiate the phosphor layer on the adjacent LED chip, thereby avoiding the adjacent LED light sources from emitting light and avoiding mutual interference between adjacent LED light sources; moreover, in the present application, the use of phosphor patches is avoided, and there is no need to use a stencil, which reduces the manufacturing cost while avoiding the overflow of phosphor glue and improves the aesthetics.

[0037] In addition, the present application also provides a method for manufacturing a matrix-type LED light source having the above advantages. Description of the Drawings

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0039] Figure 1 A cross-sectional schematic diagram of a matrix LED light source provided by an embodiment of the present application;

[0040] Figure 2 Another cross-sectional schematic diagram of a matrix LED light source provided by an embodiment of the present application;

[0041] Figure 3 A flowchart of a manufacturing method of a matrix LED light source provided by the present application;

[0042] Figures 4 to 8 A process flowchart of a matrix LED light source provided by an embodiment of the present application;

[0043] Figure 9 A flowchart of another manufacturing method of a matrix LED light source provided by the present application. Detailed implementation manners

[0044] In order to enable those skilled in the art to better understand the solution of the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific implementation manners. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0045] Many specific details are set forth in the following description in order to provide a thorough understanding of the present invention, but the present invention may be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0046] As described in the background art section, currently in matrix LED light sources, there are three ways to form a phosphor layer above the LED chips. One is to spray all the LED chips as a whole, the second is to use a stencil to block the areas outside the LED chips and spray phosphor on the LED chip areas, and the third is to paste phosphor patches on the LED chips. No matter which way, there is a problem of mutual interference between adjacent LED light sources.

[0047] In view of this, the present application provides a matrix LED light source. Please refer to Figure 1 , Figure 1 A cross-sectional schematic diagram of a matrix LED light source provided by an embodiment of the present application, including:

[0048] Substrate 1;

[0049] An LED chip matrix disposed on the substrate 1 and electrically connected to the substrate 1; the LED chip matrix includes a plurality of LED chips 3;

[0050] A phosphor layer 4 is disposed on the upper surface of each of the LED chips 3;

[0051] A white wall glue portion 2 is disposed on the substrate 1 and around the LED chips 3, wherein the white wall glue portion 2 has grooves distributed between adjacent LED chips 3;

[0052] A black wall glue portion 5 is disposed in the groove and on the upper surface of the white wall glue portion 2 , and the upper surface of the black wall glue portion 5 is flush with the upper surface of the phosphor layer 4 .

[0053] It should be noted that the size of the LED chip matrix is ​​not limited in the present application and depends on the circumstances. For example, the LED chip matrix can be a 10×10 matrix, or a 4×20 matrix, or a 5×10 matrix, etc.

[0054] The purpose of the grooves is that the phosphor layer 4 is sprayed on the entire surface, and the phosphor layer 4 is also distributed between adjacent LED chips 3. The phosphor layer 4 formed between adjacent LED chips 3 when the phosphor is sprayed is removed by grooving, thereby forming a black wall glue portion 5 around the LED chip 3. The black wall glue portion 5 is formed by black wall glue, which is a silica gel with black colorant added, black in color, and has good light stability, thermal stability, and good adhesion.

[0055] In order to ensure that the phosphor layer 4 between the LED chips 3 is removed while ensuring the light effect of the LED light source, the depth of the groove is one quarter to one third of the thickness of the white wall glue part 2 .

[0056] When an LED light source emits light, the side light will be absorbed by the black wall glue part 5 and will not irradiate the phosphor layer 4 on the adjacent LED chip 3, thereby preventing the adjacent LED light source from emitting light. Therefore, the blank distance between adjacent LED chips 3 in the LED chip matrix of the present application can be reduced compared to the LED chip matrix in the related technology, and the blank spacing between adjacent LED chips 3 is less than or equal to 0.2 mm, so that the matrix LED light source has the characteristics of miniaturization.

[0057] When the LED chip 3 is connected to the substrate 1, the LED chip 3 can be a normal mounted LED chip 3 or a flipped LED chip 3. Preferably, the LED chip 3 is a flipped LED chip 3. When the LED chip 3 is flipped, there is no need to set leads to electrically connect the LED chip 3 to the substrate 1, thereby reducing the difficulty of setting grooves between adjacent LED chips 3 and simplifying the manufacturing process of the matrix LED light source.

[0058] It should be noted that the type of the substrate 1 in this application is not specifically limited and can be set by oneself. For example, the substrate 1 is a ceramic substrate, or a BT (Bismaleimide Triazine) board, or a metal board, etc.

[0059] Furthermore, when the substrate 1 is a ceramic substrate, the type of the substrate 1 in this application is not limited. For example, the substrate 1 is an alumina ceramic substrate or a aluminum nitride ceramic substrate.

[0060] The white wall glue part 2 has a high reflectivity, good light stability, thermal stability, and good adhesiveness. The white wall glue part 2 can be a silica gel part added with titanium dioxide, or a silica gel part added with zirconium dioxide, or a silica gel part added with zinc oxide, or a silica gel part added with barium sulfate, etc., which is not limited in this application.

[0061] In this application, a groove is provided in the white wall glue part 2 between adjacent LED chips 3 of the matrix LED light source, and a black wall glue part 5 is provided in the groove, that is, the black wall glue part 5 is distributed around the LED chip 3. When one LED light source in the matrix LED light source emits light, the side light will be absorbed by the black wall glue part 5 and will not irradiate the phosphor layer 4 on the adjacent LED chip 3, thereby avoiding the adjacent LED light sources from emitting light and avoiding interference between adjacent LED light sources; moreover, in this application, the use of fluorescent sheet patches is avoided, and a stencil is not required either, which reduces the production cost and avoids the overflow of fluorescent glue, improving the aesthetics. In addition, when using a stencil, precise alignment needs to be performed manually, and when using a fluorescent patch, precise alignment needs to be performed by equipment, while precise alignment is not required in this application.

[0062] On the basis of the above embodiments, in an embodiment of this application, please refer to Figure 2 , the matrix LED light source further includes:

[0063] A protective layer 6 provided on the upper surface of the phosphor layer 4.

[0064] Since the phosphor layer 4 is relatively thin and is easily damaged, providing the protective layer 6 can protect the phosphor layer 4 and extend the life of the matrix LED light source.

[0065] In this application, the protective layer 6 is not limited as long as it can play a protective role. Preferably, the protective layer 6 is a silica gel layer, which has stable performance, certain flexibility, and a long service life.

[0066] Please refer to Figure 3 , Figure 3 is a flowchart of a manufacturing method of a matrix LED light source provided by this application. The method includes:

[0067] Step S101: Fix and connect multiple LED chips on a substrate to form an LED chip matrix.

[0068] To reduce the manufacturing difficulty of the matrix LED light source and simplify the manufacturing process of the matrix LED light source, the step of fixing and connecting multiple LED chips on a substrate to form an LED chip matrix includes:

[0069] Step S1011: Bond multiple of the LED chips on the substrate through die bonding glue.

[0070] Step S1012: Fix and connect multiple of the LED chips to the substrate through eutectic soldering technology.

[0071] Step S1013: Clean the flux.

[0072] Among them, the die bonding glue is generally solder paste.

[0073] Taking the LED chip matrix as a 4×28 matrix as an example, the schematic diagram after die bonding of the LED chips is as Figure 4 shown, and the LED chip 3 is fixed on the substrate 1.

[0074] Step S102: Fill the area on the substrate except for the area of the LED chips with white wall glue to form a white wall glue part.

[0075] The upper surface of the white wall glue part is flush with the upper surface of the LED chips.

[0076] For this step, please refer to Figure 5 , and the white wall glue part 2 is located on the substrate 1 except for the area where the LED chip 3 is located.

[0077] Step S103: Spray phosphor on the upper surface of the LED chips and the upper surface of the white wall glue part to form a phosphor layer.

[0078] For this step, please refer to Figure 6 , and the phosphor layer 4 is sprayed on the entire surface.

[0079] Step S104: Remove the phosphor layer in the area other than the upper surface of the LED chips and the area between adjacent LED chips.

[0080] Step S105: Groove between adjacent LED chips to form a groove in the white wall glue part.

[0081] Optionally, as a specific implementation manner, the step of grooving between adjacent LED chips includes: using a laser grooving method to groove between adjacent LED chips. However, the present application does not limit this. As another specific implementation manner, a mechanical cutting method is used to groove between adjacent LED chips.

[0082] Please refer to Figure 7 the enlarged partial view after grooving shown in the figure. A groove 7 is formed in the white wall glue part between adjacent LED chips 3.

[0083] Step S106: Fill black wall glue in the groove and on the upper surface of the white wall glue part to form a black wall glue part; the upper surface of the black wall glue is flush with the upper surface of the phosphor layer.

[0084] Please refer to Figure 8 for this step. The groove and the upper surface of the white wall glue part are covered with a black wall glue part 5.

[0085] In this application, the matrix LED light source is provided with a groove in the white wall glue part between adjacent LED chips, and a black wall glue part is arranged in the groove, that is, the black wall glue part is distributed around the LED chips. When one LED light source in the matrix LED light source emits light, the light on the side will be absorbed by the black wall glue part and will not irradiate the phosphor layer on the adjacent LED chips, thereby avoiding the adjacent LED light sources from emitting light and avoiding interference between adjacent LED light sources; moreover, in this application, the use of fluorescent sheet patches is avoided, and there is no need to use a steel mesh, which reduces the production cost while avoiding the overflow of fluorescent glue and improves the aesthetics. In addition, when using a steel mesh, precise alignment needs to be carried out manually, and when using a fluorescent patch, precise alignment needs to be carried out by equipment, while precise alignment is not required in this application.

[0086] Since the phosphor layer is relatively thin and is easily damaged, in order to enhance the protection effect on the phosphor layer, please refer to Figure 9 for this step. In an embodiment of this application, the manufacturing method of the matrix LED light source includes:

[0087] Step S201: Fix and connect a plurality of LED chips on a substrate to form an LED chip matrix.

[0088] Step S202: Fill white wall glue in the area of the substrate except for the LED chips to form a white wall glue part.

[0089] Step S203: Spray phosphor on the upper surface of the LED chips and the upper surface of the white wall glue part to form a phosphor layer.

[0090] Step S204: Spray a protective glue on the upper surface of the phosphor layer to form a protective layer.

[0091] Preferably, the protective layer is a silica gel layer.

[0092] Step S205: Remove the phosphor layer and the protective layer in the area other than the upper surface of the LED chips and between adjacent LED chips.

[0093] Step S206: Grooves are formed between adjacent LED chips, and grooves are formed in the white wall glue part.

[0094] Step S207: Black wall glue is filled in the grooves and on the upper surface of the white wall glue part to form a black wall glue part; the upper surface of the black wall glue is flush with the upper surface of the phosphor layer.

[0095] To improve the production efficiency, multiple matrix LED light sources can also be manufactured simultaneously. After forming the black wall glue part, they are then sliced and cut to obtain individual matrix LED light sources. Further, after obtaining the matrix LED light sources, processes such as blanking, testing, and taping are required. For details, reference can be made to related technologies, and this application will not elaborate further.

[0096] In this specification, each embodiment is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other. For the devices disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the description is relatively simple. For related parts, reference can be made to the description in the method section.

[0097] The above has introduced in detail the matrix LED light source provided by this application and its manufacturing method. Specific examples are used in this article to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. It should be noted that for those of ordinary skill in the art, without departing from the principle of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A matrix LED light source, characterized in that, Comprising: Substrate; An LED chip matrix disposed on and electrically connected to the substrate; the LED chip matrix includes a plurality of LED chips; A phosphor layer disposed on the upper surface of each LED chip; A white wall adhesive portion disposed on the substrate and around the LED chips, and grooves are distributed between adjacent LED chips; the depth of the grooves is one-fourth to one-third of the thickness of the white wall adhesive portion; the phosphor layer is spray-coated on the entire surface, and the phosphor layer is also distributed between adjacent LED chips, and the grooves are used to remove the phosphor layer formed between adjacent LED chips when spraying the phosphor; the white wall adhesive portion is a silica gel portion added with titanium dioxide, or a silica gel portion added with zirconium dioxide, or a silica gel portion added with zinc oxide, or a silica gel portion added with barium sulfate; A black wall adhesive portion disposed in the grooves and on the upper surface of the white wall adhesive portion, and the upper surface of the black wall adhesive portion is flush with the upper surface of the phosphor layer.

2. The matrix LED light source according to claim 1, characterized in that, Further comprising: A protective layer disposed on the upper surface of the phosphor layer.

3. The matrix LED light source according to claim 2, characterized in that, The protective layer is a silica gel layer.

4. The matrix LED light source according to claim 1, characterized in that, The substrate is a ceramic substrate.

5. The matrix LED light source according to any one of claims 1 to 4, characterized in that, The blank spacing between adjacent LED chips is less than or equal to 0.2 mm.

6. A manufacturing method of a matrix LED light source, characterized in that, Comprising: Fixing and connecting a plurality of LED chips on a substrate to form an LED chip matrix; Filling the area on the substrate except for the LED chips with white wall adhesive to form a white wall adhesive portion; the white wall adhesive portion is a silica gel portion added with titanium dioxide, or a silica gel portion added with zirconium dioxide, or a silica gel portion added with zinc oxide, or a silica gel portion added with barium sulfate; Spraying phosphor on the upper surface of the LED chips and the upper surface of the white wall adhesive portion to form a phosphor layer; Removing the phosphor layer in the area other than the upper surface of the LED chips and between adjacent LED chips; Grooving between adjacent LED chips to form grooves in the white wall adhesive portion; the depth of the grooves is one-fourth to one-third of the thickness of the white wall adhesive portion; the phosphor layer is spray-coated on the entire surface, and the phosphor layer is also distributed between adjacent LED chips, and the grooves are used to remove the phosphor layer formed between adjacent LED chips when spraying the phosphor; Filling the grooves and the upper surface of the white wall adhesive portion with black wall adhesive to form a black wall adhesive portion; the upper surface of the black wall adhesive is flush with the upper surface of the phosphor layer.

7. The manufacturing method of a matrix LED light source according to claim 6, characterized in that, After spraying phosphor on the upper surface of the LED chips and the upper surface of the white wall adhesive portion to form a phosphor layer, further comprising: Spraying a protective glue on the upper surface of the phosphor layer to form a protective layer; Correspondingly, removing the phosphor layer in the area other than the upper surface of the LED chips and between adjacent LED chips includes: Removing the phosphor layer and the protective layer in the area other than the upper surface of the LED chips and between adjacent LED chips.

8. The manufacturing method of a matrix LED light source according to claim 6, characterized in that, The fixing and connecting a plurality of LED chips on a substrate to form an LED chip matrix includes: Bonding a plurality of the LED chips on the substrate through die bonding glue; Fix multiple said LED chips to the said substrate by means of eutectic soldering technology; Clean the flux.

9. The manufacturing method of a matrix LED light source according to any one of claims 6 to 8, characterized in that, The grooving between adjacent said LED chips includes: Adopt a laser grooving method to groove between adjacent said LED chips.

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