Coil structure and method for manufacturing the same, lead frame, and inductor

Abstract

The present invention provides a coil structure that can easily increase the number of windings. It is a coil structure formed by stacking n metal plates, n is a natural number greater than 2, each of the metal plates includes a spiral conductor, and a terminal column formed by arranging n+1 or more thick plate portions that are thicker than the conductor on the outside of the conductor in a predetermined direction, the two ends of the conductor of each metal plate are connected to any two adjacent thick plate portions of each metal plate, each of the metal plates is stacked, and the terminal columns of adjacent metal plates are joined to each other, the two ends of the conductor of the bottom layer are connected to the two thick plate portions on one end side of the terminal column, and the positions of the thick plate portions connected to the two ends of the conductor are moved one position toward the other end side of the terminal column each time a layer is raised, so that the conductors of each metal plate are connected in series to form a spiral coil.

Description

Technical Field

[0001] The present invention relates to a coil structure and a method for manufacturing the same, a lead frame, and an inductor. Background Art

[0002] Inductors are used in circuits for purposes such as stabilizing current and converting voltage. In recent years, the miniaturization of electronic devices such as game consoles and smartphones has accelerated, and with this, there is a demand for miniaturization of inductors mounted in such electronic devices, and surface mount inductors have been proposed.

[0003] As an inductor mounted in such an electronic device, for example, there is mentioned a structure in which a coil structure having a wound coil formed of a relatively thin metal plate is sealed with resin.

[0004] <Prior Art Literature>

[0005] <Patent Documents>

[0006] Patent Document 1: (Japanese) Patent Publication No. 2020-027820 Summary of the invention

[0007] <Problems to be Solved by the Invention>

[0008] However, in order to obtain a large induced electromotive force in a coil structure having a wound coil formed of a relatively thin metal plate, the number of windings needs to be increased, but it is difficult to increase the number of windings in a conventional structure.

[0009] The present invention has been made in view of the above-mentioned points, and an object of the present invention is to provide a coil structure having a structure in which the number of windings can be easily increased.

[0010] <Methods used to solve the problem>

[0011] The present coil structure is a coil structure formed by stacking n (n is a natural number greater than 2) metal plates, each of the above-mentioned metal plates including a spiral conductor portion, and a terminal row formed by arranging n+1 or more thick plate portions thicker than the above-mentioned conductor portion in a prescribed direction on the outer side of the above-mentioned conductor portion, both ends of the above-mentioned conductor portion of each of the above-mentioned metal plates are connected to any two adjacent above-mentioned thick plate portions of each of the above-mentioned metal plates, each of the above-mentioned metal plates is stacked, and the above-mentioned terminal rows of adjacent above-mentioned metal plates are joined to each other, and both ends of the above-mentioned conductor portion of the bottom layer are connected to two above-mentioned thick plate portions on one end side of the above-mentioned terminal row, and with each ascending layer, the position of the above-mentioned thick plate portions connected to both ends of the above-mentioned conductor portion is respectively moved one position toward the other end side of the above-mentioned terminal row, so that the above-mentioned conductor portions of each of the above-mentioned metal plates are connected in series to form a spiral coil.

[0012] <Effects of the Invention>

[0013] According to the disclosed technology, it is possible to provide a coil structure having a structure in which the number of windings can be easily increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a top view which shows the coil structure of 1st Embodiment by example.

[0015] Figure 2 yes Figure 1 (a) A stereoscopic view of a product area.

[0016] Figure 3 This is a plan view (part 1) showing an example of the vicinity of a product region of each metal plate before lamination.

[0017] Figure 4 This is a plan view (part 2) showing an example of the vicinity of the product region of each metal plate before lamination.

[0018] Figure 5 This is a plan view (part 3) showing an example of the vicinity of the product region of each metal plate before lamination.

[0019] Figure 6 It is a cross-sectional view taken along the line AA to the line GG of the first metal plate 10 .

[0020] Figure 7 The coil structure 1 is along Figure 3 (a) is a cross-sectional view of the line AA and line BB.

[0021] Figure 8 The coil structure 1 is along Figure 3 (a) is a cross-sectional view taken along line CC and line DD.

[0022] Fig. 9 The coil structure 1 is along Figure 3 (a) is a cross-sectional view taken along line EE and line FF.

[0023] Fig.10 The coil structure 1 is along Figure 3 (a) is a cross-sectional view of line GG.

[0024] Fig.11 This is a diagram (part 1) illustrating the manufacturing process of the coil structure according to the first embodiment.

[0025] Fig.12 This is a diagram (part 2) illustrating an example of the manufacturing process of the coil structure according to the first embodiment.

[0026] Fig.13 It is a diagram showing an example of the manufacturing process of the inductor according to the first embodiment.

[0027] Fig.14 It is a perspective view showing an example of the inductor according to the first embodiment.

[0028] Fig.15 This is a cross-sectional view for explaining the method of mounting the inductor according to the first embodiment.

[0029] Fig.16 This is a cross-sectional view showing a coil structure according to Modification 1 of the first embodiment.

[0030] Fig.17 This is a cross-sectional view showing an example of an inductor according to Modification 1 of the first embodiment.

[0031] Fig.18 The diagram exemplifies the process of manufacturing the coil structure according to Modification 1 of the first embodiment.

[0032] Fig.19 This is a perspective view showing an example of an inductor according to Modification 1 of the first embodiment.

[0033] Fig. 20 This is a cross-sectional view for explaining a method of mounting an inductor according to Modification 1 of the first embodiment.

[0034] Description of reference numerals:

[0035] 1.3 Coil structure

[0036] 1A, 1B External connection terminals

[0037] 2.4 Inductor

[0038] 10 First Metal Plate

[0039] 11, 21, 31, 41, 51, 61 Lead wire

[0040] 12, 22, 32, 42, 52, 62 terminal rows

[0041] 13, 23, 33, 43, 53, 63 Connection

[0042] 14, 24, 34, 44, 54, 64 Reinforcement

[0043] 20 Second Metal Plate

[0044] 30 Third metal plate

[0045] 40 Fourth Metal Plate

[0046] 50 Fifth Metal Plate

[0047] 60 Sixth Metal Plate

[0048] 70, 71 Sealing resin

[0049] 80 Insulation film

[0050] 111, 211, 311, 411, 511, 611 starting point

[0051] 112, 212, 312, 412, 512, 612 End

[0052] 121, 621 Terminals

[0053] 122, 222 1 ,222 2 ,322 1 ,322 2 ,422 1 ,422 2 ,522 1 ,522 2 、622 Connection

[0054] 123 1 to 123 5 , 223 1 To 223 5 ,323 1 To 323 5 ,423 1 To 423 5 , 523 1 To 523 5 ,623 1 to 623 5 Support DETAILED DESCRIPTION

[0055] Hereinafter, the mode for implementing the invention will be described with reference to the drawings. In addition, in each of the drawings, the same reference numerals are given to the same components, and the substantially repeated description may be omitted.

[0056] <First Embodiment>

[0057] Figure 1 1 is a plan view showing a coil structure according to the first embodiment. Figure 1 (a) is the overall picture, Figure 1 (b) is Figure 1 (a) is an enlarged view of the vicinity of a product area M. Figure 2 yes Figure 1 (a) A stereoscopic view of a product area.

[0058] Reference Figure 1 (a) Figure 1 (b), and Figure 2The coil structure 1 is a structure in which a plurality of metal plates are stacked and the metal plates adjacent to each other are joined to each other. The plurality of metal plates may be at least two, in which case it is a two-layer structure. In this embodiment, a coil structure 1 having a six-layer structure in which a first metal plate 10, a second metal plate 20, a third metal plate 30, a fourth metal plate 40, a fifth metal plate 50, and a sixth metal plate 60 are stacked in sequence is shown as an example.

[0059] In a top view, the coil structure 1 has a plurality of product areas M arranged vertically and horizontally. Each product area M is an area where the coil structure 1 is sealed with resin as a whole and then monolithically formed into an inductor. A frame N is formed around each product area M to support each product area M from the peripheral side, and adjacent frames N are formed integrally with each other and connected to each other. Figure 1 In (a), as an example, 18 product areas M are arranged (3 rows and 6 columns), but the present invention is not limited to this.

[0060] Figure 3 to Figure 5 1 is a top view showing the vicinity of the product area of ​​each metal plate before lamination. Specifically, Figure 3 (a) is a top view of the first metal plate 10 . Figure 3 (b) is a top view of the second metal plate 20 . Figure 4 (a) is a top view of the third metal plate 30 . Figure 4 (b) is a top view of the fourth metal plate 40 . Figure 5 (a) is a top view of the fifth metal plate 50 . Figure 5 (b) is a top view of the sixth metal plate 60 .

[0061] It should be noted that the first metal plate 10, the second metal plate 20, the third metal plate 30, the fourth metal plate 40, the fifth metal plate 50, and the sixth metal plate 60 are each Figure 1 The same top view shape as (a), Figure 3 (a)~ Figure 5 (b) is an example showing the metal plates and Figure 1 (b) corresponds to the part (near a product area). Figure 3 (a)~ Figure 5 In (b), the gray part shows the thin plate part, and the pear-skin pattern part shows the thick plate part which is formed thicker than the thin plate part and protrudes downward from the thin plate part. The thin plate part and the thick plate part are formed integrally.

[0062] exist Figure 3 to Figure 5In the product area M, the product area of ​​the first metal plate 10 is set as M1, the product area of ​​the second metal plate 20 is set as M2, the product area of ​​the third metal plate 30 is set as M3, the product area of ​​the fourth metal plate 40 is set as M4, the product area of ​​the fifth metal plate 50 is set as M5, and the product area of ​​the sixth metal plate 60 is set as M6. Figure 3 to Figure 5 In the frame portion N, the frame portion of the first metal plate 10 is set to N1, the frame portion of the second metal plate 20 is set to N2, the frame portion of the third metal plate 30 is set to N3, the frame portion of the fourth metal plate 40 is set to N4, the frame portion of the fifth metal plate 50 is set to N5, and the frame portion of the sixth metal plate 60 is set to N6.

[0063] Figure 6 The first metal plate 10 is Figure 3 (a) is a cross-sectional view taken along the line AA to the line GG. Specifically, Figure 6 (a) is the first metal plate 10 along Figure 3 (a) is a cross-sectional view of the line AA. Figure 6 (b) is the first metal plate 10 along Figure 3 (a) is a cross-sectional view of line BB. Figure 6 (c) is the first metal plate 10 along Figure 3 (a) is a cross-sectional view of the CC line. Figure 6 (d) is the first metal plate 10 along Figure 3 (a) is a cross-sectional view taken along line DD. Figure 6 (e) is the first metal plate 10 along Figure 3 (a) is a cross-sectional view of line EE. Figure 6 (f) is the edge of the first metal plate 10 Figure 3 (a) is a cross-sectional view of the FF line. Figure 6 (g) is the edge of the first metal plate 10 Figure 3 (a) is a cross-sectional view of the GG line. It should be noted that Figure 6 In the figure, for convenience, the portion of the terminal array connected to the wire portion is shown with a hatching different from that of other portions (the same may also be applied to subsequent figures).

[0064] like Figure 3 (a) and Figure 6The product area M1 of the first metal plate 10 includes a wire portion 11 formed in a substantially rectangular spiral shape, and a terminal row 12 arranged in a predetermined direction outside the spiral formed by the wire portion 11. The wire portion 11 is connected to the frame portion N1 through a plurality of connection portions 13 (here, 6 as an example) extending from the inside of the product area M1 to the outside of the product area M1. The number and connection positions of the connection portions 13 can be arbitrarily determined as long as the wire portion 11 can be stably supported by the frame portion N1, and are preferably arranged near the corners of the substantially rectangular wire portion 11.

[0065] Terminal row 12 has self Figure 3 The terminal portion 121, the connecting portion 122, and the supporting portion 123 are arranged in sequence at predetermined intervals on the left side of (a). 1 to 123 5 The lead portion 11, the connection portion 13, and the frame portion N1 are thin plate portions formed with a predetermined thickness, and the terminal portion 121, the connection portion 122, and the support portion 123 are 1 to 123 5 The terminal portion 121, the connecting portion 122, and the supporting portion 123 are formed to be thicker than the lead portion 11 and have the same thickness. 1 to 123 5 The plan view shape is, for example, a square shape or a rectangular shape.

[0066] The lead portion 11, the connection portion 13, and the upper surface of the frame portion N1 (the surface on the second metal plate 20 side) are connected to the terminal portion 121, the connecting portion 122, and the supporting portion 123. 1 to 123 5 The upper surface of the second metal plate 20 is located on a substantially same plane. On the other hand, the lower surface of the lead portion 11, the connecting portion 13, and the frame portion N1 is located relative to the terminal portion 121, the connecting portion 122, and the supporting portion 123. 1 to 123 5 The lower surface of the coil structure 1 is recessed toward the second metal plate 20. When the inductor is made from the coil structure 1 and mounted on a substrate, the surface on the side opposite to the substrate is set as the lower surface, and the surface on the opposite side is set as the upper surface (the same applies below).

[0067] It should be noted that the frame portion N1 may include a first portion having the same thickness as the conductor portion 11, and a second portion having the same thickness as the thick plate portion constituting the terminal column 12. For example, as the second portion, in order to prevent the metal plate from tilting while reinforcing the frame portion N1, a reinforcing portion 14 may be provided at the four corners of the frame portion N1. In this case, the lower surface of the reinforcing portion 14 is located on substantially the same plane as the lower surface of the terminal portion 121, etc. The reinforcing portion 14 may be formed, for example, in an L-shape. In order to prevent the metal plate from tilting while reinforcing the frame portion N1, a second portion (thick plate portion) may be provided at a portion other than the corners of the frame portion N1, instead of the reinforcing portion 14, or in addition to the reinforcing portion 14.

[0068] Terminal portion 121, connecting portion 122, and supporting portion 123 1 to 123 5 The thickness is, for example, about 50 μm to 500 μm, and the thickness of the lead portion 11, the connection portion 13, and the frame portion N1 is, for example, about half that of the terminal portion 121. It should be noted that when the frame portion N1 is provided with the reinforcement portion 14, the thickness of the reinforcement portion 14 is the same as that of the terminal portion 121.

[0069] The terminal portion 121 is arranged inside the product area M1, and one side thereof extends to the outside of the product area M1 and is connected to the frame portion N1. The portion extending from the terminal portion 121 is the same thin plate portion as the connecting portion 13. The other side of the terminal portion 121 is connected to the starting point 111 of the wire portion 11. The connecting portion 122 is arranged inside the product area M1, and one side thereof extends to the outside of the product area M1 and is connected to the frame portion N1. The portion extending from the connecting portion 122 is the same thin plate portion as the connecting portion 13. The other side of the connecting portion 122 is connected to the end point 112 of the wire portion 11.

[0070] Supporting portion 123 1 to 123 5 The support portion 123 is disposed inside the product area M1, and one side thereof extends outside the product area M1 and is connected to the frame portion N1. 1 to 123 5 The extended portion is a thin plate portion similar to the connecting portion 13. The supporting portion 123 1 to 123 5 The other side of the support portion 123 is not connected to the wire portion 11. 1 to 123 5 There is no electrical conduction with the conductor portion 11. Thus, in the terminal array 12 of the first metal plate 10, the thick plate portion other than the thick plate portion (terminal portion 121 and connecting portion 122) connected to both ends of the conductor portion 11 is electrically independent from the conductor portion 11, and serves as a supporting portion for supporting the thick plate portion of the terminal array of other metal plates.

[0071] like Figure 3 As shown in (b), the second metal plate 20 is different in that the connection parts between the starting point and the end point of the wire portion and the terminal row are offset to the right by one position relative to the first metal plate 10, and its overall shape and thickness are the same as the first metal plate 10.

[0072] Specifically, the product area M2 of the second metal plate 20 includes a wire portion 21 formed in a substantially rectangular spiral shape, and a terminal row 22 arranged in a predetermined direction outside the spiral formed by the wire portion 21. The wire portion 21 is connected to the frame portion N2 through a plurality of connection portions 23 (here, six as an example) extending from the inside of the product area M2 to the outside of the product area M2. The number and connection position of the connection portions 23 can be arbitrarily determined as long as the wire portion 21 can be stably supported by the frame portion N2, and are preferably arranged near the corners of the substantially rectangular wire portion 21.

[0073] Terminal row 22 has self Figure 3 The support parts 223 are arranged in sequence at predetermined intervals on the left side of (b) 1 , connecting portion 222 1 , connecting portion 222 2 , and a support portion 223 2 To 223 5 The lead portion 21, the connection portion 23, and the frame portion N2 are formed as thin plates of a predetermined thickness. 1 , connecting portion 222 2 , and a support portion 223 1 To 223 5 The connecting portion 222 is a thick plate portion having the same thickness as the conductor portion 21. 1 , connecting portion 222 2 , and a support portion 223 1 To 223 5 The plan view shape is, for example, the terminal portion 121, the connecting portion 122, and the supporting portion 123. 1 to 123 5 The top view shape is the same.

[0074] The lead portion 21, the connection portion 23, and the upper surface of the frame portion N2 (the surface on the third metal plate 30 side) and the connecting portion 222 1 , connecting portion 222 2 , and a support portion 223 1 To 223 5 The upper surface of the third metal plate 30 is located on a substantially same plane. On the other hand, the lower surface of the lead portion 21, the connecting portion 23, and the frame portion N2 is located relative to the connecting portion 222. 1 , connecting portion 222 2, and a support portion 223 1 To 223 5 The lower surface of the third metal plate 30 is recessed toward the third metal plate 30.

[0075] It should be noted that the frame portion N2 may include a first portion having the same thickness as the lead portion 21 and a second portion having the same thickness as the thick plate portion constituting the terminal array 22. For example, as the second portion, in order to firmly bond with the adjacent metal plate and prevent the metal plate from tilting, a reinforcement portion 24 may be provided at the four corners of the frame portion N2. In this case, the lower surface of the reinforcement portion 24 is located at the joint portion 222. 1 The lower surfaces of the frame portion N2 and the like are substantially in the same plane. The reinforcing portion 24 may be formed, for example, in an L-shape. In order to prevent the metal plate from tilting while making the joint with the adjacent metal plate firm, a second portion (thick plate portion) may be provided in a portion other than the corner of the frame portion N2 in place of the reinforcing portion 24 or in addition to the reinforcing portion 24.

[0076] The thickness of the lead portion 21, the connection portion 23, and the frame portion N2 is, for example, the same as that of the lead portion 11, etc. 1 , connecting portion 222 2 , and a support portion 223 1 To 223 5 The thickness is, for example, the same as that of the terminal portion 121 and the like.

[0077] Connecting portion 222 1 and 222 2 It is arranged inside the product area M2, and one side thereof extends outside the product area M2 and is connected to the frame N2. 1 and 222 2 The extended portion is a thin plate portion similar to the connecting portion 23. 1 The other side is connected to the starting point 211 of the conductor portion 21. The connecting portion 222 2 The other side is connected to the terminal point 212 of the wire portion 21 .

[0078] Supporting portion 223 1 To 223 5 The support portion 223 is disposed inside the product area M2, and one side thereof extends outside the product area M2 and is connected to the frame portion N2. 1 To 223 5 The extended portion is a thin plate portion similar to the connecting portion 23. The supporting portion 223 1 To 223 5 The other side of the support portion 223 is not connected to the wire portion 21. 1 To 223 5Thus, in the terminal array 22 of the second metal plate 20, the thick plate portion (connection portion 222) connected to both ends of the lead portion 21 is not electrically connected. 1 and 222 2 ) is electrically independent from the lead portion 21, and serves as a supporting portion for the thick plate portion of the terminal array of other metal plates.

[0079] like Figure 4 As shown in (a), the third metal plate 30 is different in that the connection parts between the starting point and the end point of the wire portion and the terminal array are shifted to the right by one position relative to the second metal plate 20, and its overall shape and thickness are the same as the second metal plate 20.

[0080] Specifically, the product area M3 of the third metal plate 30 includes a wire portion 31 formed in a substantially rectangular spiral shape, and a terminal row 32 arranged in a predetermined direction outside the spiral formed by the wire portion 31. The wire portion 31 is connected to the frame portion N3 through a plurality of connection portions 33 (here, six as an example) extending from the inside of the product area M3 to the outside of the product area M3. The number and connection position of the connection portions 33 can be arbitrarily determined as long as the wire portion 31 can be stably supported by the frame portion N3, and are preferably arranged near the corners of the substantially rectangular wire portion 31.

[0081] The terminal row 32 has a self Figure 4 The support parts 323 are arranged in sequence at predetermined intervals on the left side of (a) 1 and 323 2 , connecting portion 322 1 , connecting portion 322 2 , and a support portion 323 3 To 323 5 The lead portion 31, the connection portion 33, and the frame portion N3 are formed as thin plates of a predetermined thickness. 1 , connecting portion 322 2 , and a support portion 323 1 To 323 5 The connecting portion 322 is a thick plate portion having the same thickness as the conductor portion 31. 1 , connecting portion 322 2 , and a support portion 323 1 To 323 5 The plan view shape is, for example, the terminal portion 121, the connecting portion 122, and the supporting portion 123. 1 to 123 5 The top view shape is the same.

[0082] The lead portion 31, the connection portion 33, and the upper surface of the frame portion N3 (the surface on the fourth metal plate 40 side) and the connecting portion 3221 , connecting portion 322 2 , and a support portion 323 1 To 323 5 The upper surface of the fourth metal plate 40 is located on a substantially same plane. On the other hand, the lower surface of the lead portion 31, the connecting portion 33, and the frame portion N3 is located relative to the connecting portion 322. 1 , connecting portion 322 2 、Supporting part 323 1 To 323 5 The lower surface is recessed toward the fourth metal plate 40.

[0083] It should be noted that the frame portion N3 may include a first portion having the same thickness as the lead portion 31 and a second portion having the same thickness as the thick plate portion constituting the terminal array 32. For example, as the second portion, in order to firmly bond with the adjacent metal plate and prevent the metal plate from tilting, a reinforcement portion 34 may be provided at the four corners of the frame portion N3. In this case, the lower surface of the reinforcement portion 34 is located at the joint portion 322. 1 The lower surfaces of the frame portion N3 and the like are substantially in the same plane. The reinforcing portion 34 is formed, for example, in an L-shape. In order to prevent the metal plate from tilting while making the joint with the adjacent metal plate firm, a second portion (thick plate portion) may be provided at a portion other than the corner of the frame portion N3 instead of the reinforcing portion 34 or in addition to the reinforcing portion 34.

[0084] The thickness of the lead portion 31, the connection portion 33, and the frame portion N3 is, for example, the same as that of the lead portion 11, etc. 1 , connecting portion 322 2 , and a support portion 323 1 To 323 5 The thickness is, for example, the same as that of the terminal portion 121 and the like.

[0085] Connecting portion 322 1 and 322 2 It is arranged inside the product area M3, and one side thereof extends outside the product area M3 and is connected to the frame N3. 1 and 322 2 The extended portion is a thin plate portion similar to the connecting portion 33. 1 The other side is connected to the starting point 311 of the conductor portion 31. The connecting portion 322 2 The other side is connected to the end point 312 of the wire portion 31 .

[0086] Supporting part 323 1 To 323 5 The support portion 323 is disposed inside the product area M3, and one side thereof extends outside the product area M3 and is connected to the frame portion N3.1 To 323 5 The extended portion is a thin plate portion similar to the connecting portion 33. The supporting portion 323 1 To 323 5 The other side of the support portion 323 is not connected to the wire portion 31. 1 To 323 5 Thus, in the terminal array 32 of the third metal plate 30, the thick plate portion (connection portion 322) connected to both ends of the lead portion 31 is not electrically connected. 1 and 322 2 ) is electrically independent from the lead portion 31, and serves as a supporting portion for the thick plate portion of the terminal array of other metal plates.

[0087] like Figure 4 As shown in (b), the fourth metal plate 40 is different in that the connection parts between the starting point and the end point of the wire portion and the terminal row are offset to the right by one position relative to the third metal plate 30, and its overall shape and thickness are the same as the third metal plate 30.

[0088] Specifically, the product area M4 of the fourth metal plate 40 includes a wire portion 41 formed in a substantially rectangular spiral shape, and a terminal row 42 arranged in a predetermined direction outside the spiral formed by the wire portion 41. The wire portion 41 is connected to the frame portion N4 through a plurality of connection portions 43 (here, six as an example) extending from the inside of the product area M4 to the outside of the product area M4. The number and connection position of the connection portions 43 can be arbitrarily determined as long as the wire portion 41 can be stably supported by the frame portion N4, and are preferably arranged near the corners of the substantially rectangular wire portion 41.

[0089] The terminal row 42 has a self Figure 4 The support parts 423 are arranged in sequence at predetermined intervals on the left side of (b) 1 To 423 3 , connecting portion 422 1 , connecting portion 422 2 、Supporting portion 423 4 and 423 5 The lead portion 41, the connection portion 43, and the frame portion N4 are formed as thin plates of a predetermined thickness. 1 , connecting portion 422 2 , and a support portion 423 1 To 423 5 The connecting portion 422 is a thick plate portion having the same thickness as the conductor portion 41. 1 , connecting portion 422 2 , and a support portion 423 1 To 423 5The plan view shape is, for example, the terminal portion 121, the connecting portion 122, and the supporting portion 123. 1 to 123 5 The top view shape is the same.

[0090] The lead portion 41, the connection portion 43, and the upper surface of the frame portion N4 (the surface on the fifth metal plate 50 side) and the connecting portion 422 1 , connecting portion 422 2 , and a support portion 423 1 To 423 5 The upper surface of the fifth metal plate 50 is located on a substantially same plane. On the other hand, the lower surface of the lead portion 41, the connecting portion 43, and the frame portion N4 is located relative to the connecting portion 422. 1 , connecting portion 422 2 、Supporting portion 423 1 To 423 5 The lower surface is recessed toward the fifth metal plate 50.

[0091] It should be noted that the frame portion N4 may include a first portion having the same thickness as the lead portion 41 and a second portion having the same thickness as the thick plate portion constituting the terminal array 42. For example, as the second portion, in order to firmly bond with the adjacent metal plate and prevent the metal plate from tilting, a reinforcement portion 44 may be provided at the four corners of the frame portion N4. In this case, the lower surface of the reinforcement portion 44 is located at the joint portion 422. 1 The lower surfaces of the frame portion N4 are substantially in the same plane. The reinforcing portion 44 is formed, for example, in an L-shape. In order to prevent the metal plate from tilting while firmly joining with the adjacent metal plate, a second portion (thick plate portion) may be provided at a portion other than the corner of the frame portion N4 instead of the reinforcing portion 44 or in addition to the reinforcing portion 44.

[0092] The thickness of the lead portion 41, the connection portion 43, and the frame portion N4 is, for example, the same as that of the lead portion 11, etc. 1 , connecting portion 422 2 , and a support portion 423 1 To 423 5 The thickness is, for example, the same as the terminal portion 121, etc.

[0093] Connecting portion 422 1 and 422 2 It is arranged inside the product area M4, and one side thereof extends outside the product area M4 and is connected to the frame N4. 1 and 422 2 The extended portion is a thin plate portion similar to the connecting portion 43. 1 The other side is connected to the starting point 411 of the conductor portion 41. The connecting portion 4222 The other side is connected to the terminal point 412 of the wire portion 41 .

[0094] Supporting portion 423 1 To 423 5 The support portion 423 is disposed inside the product area M4, and one side thereof extends outside the product area M4 and is connected to the frame portion N4. 1 To 423 5 The extended portion is a thin plate portion similar to the connecting portion 43. The supporting portion 423 1 To 423 5 The other side of the support portion 423 is not connected to the wire portion 41. 1 To 423 5 Thus, in the terminal array 42 of the fourth metal plate 40, the thick plate portion (connection portion 422) connected to both ends of the lead portion 41 is not electrically connected. 1 and 422 2 ) is electrically independent from the lead portion 41, and serves as a supporting portion for the thick plate portion of the terminal array of other metal plates.

[0095] like Figure 5 As shown in (a), the fifth metal plate 50 is different from the fourth metal plate 40 in that the connection parts between the starting point and the end point of the wire portion and the terminal row are offset to the right by one position respectively, and its overall shape and thickness are the same as the fourth metal plate 40.

[0096] Specifically, the product area M5 of the fifth metal plate 50 includes a wire portion 51 formed in a substantially rectangular spiral shape, and a terminal row 52 arranged in a predetermined direction outside the spiral formed by the wire portion 51. The wire portion 51 is connected to the frame portion N5 through a plurality of connection portions 53 (here, six as an example) extending from the inside of the product area M5 to the outside of the product area M5. The number and connection position of the connection portions 53 can be arbitrarily determined as long as the wire portion 51 can be stably supported by the frame portion N5, and are preferably arranged near the corners of the substantially rectangular wire portion 51.

[0097] The terminal row 52 has a Figure 5 The support parts 523 are arranged in sequence at predetermined intervals on the left side of (a). 1 To 523 4 , connecting portion 522 1 , connecting portion 522 2 , and a support portion 523 5 The lead portion 51, the connection portion 53, and the frame portion N5 are formed as thin plates of a predetermined thickness. 1 , connecting portion 522 2 , and a support portion 523 1To 523 5 The connecting portion 522 is a thick plate portion having the same thickness as the conductor portion 51. 1 , connecting portion 522 2 , and a support portion 523 1 To 523 5 The plan view shape is, for example, the terminal portion 121, the connecting portion 122, and the supporting portion 123. 1 to 123 5 The top view shape is the same.

[0098] The lead portion 51, the connection portion 53, and the upper surface of the frame portion N5 (the surface on the sixth metal plate 60 side) and the connecting portion 522 1 , connecting portion 522 2 , and a support portion 523 1 To 523 5 The upper surface of the sixth metal plate 60 is located on a substantially same plane. On the other hand, the lead portion 51, the connection portion 53, and the lower surface of the frame portion N5 are located relative to the connection portion 522. 1 , connecting portion 522 2 、Supporting part 523 1 To 523 5 The lower surface is recessed toward the sixth metal plate 60.

[0099] It should be noted that the frame portion N5 may include a first portion having the same thickness as the lead portion 51 and a second portion having the same thickness as the thick plate portion constituting the terminal array 52. ​​For example, as the second portion, in order to firmly bond with the adjacent metal plate and prevent the metal plate from tilting, reinforcing portions 54 may be provided at the four corners of the frame portion N5. In this case, the lower surface of the reinforcing portion 54 is located at the joint portion 522. 1 The lower surfaces of the frame portion N5 are substantially in the same plane. The reinforcing portion 54 may be formed, for example, in an L-shape. In order to prevent the metal plate from tilting while firmly joining with the adjacent metal plate, a second portion (thick plate portion) may be provided in a portion other than the corner portion of the frame portion N5 instead of the reinforcing portion 54 or in addition to the reinforcing portion 54.

[0100] The thickness of the lead portion 51, the connection portion 53, and the frame portion N5 is, for example, the same as that of the lead portion 11, etc. 1 , connecting portion 522 2 , and a support portion 523 1 To 523 5 The thickness is, for example, the same as that of the terminal portion 121 and the like.

[0101] Connecting portion 522 1 and 522 2It is arranged inside the product area M5, and one side thereof extends outside the product area M5 and is connected to the frame N5. 1 and 522 2 The extended portion is a thin plate portion similar to the connecting portion 53. 1 The other side is connected to the starting point 511 of the conductor portion 51. The connecting portion 522 2 The other side is connected to the end point 512 of the wire portion 51 .

[0102] Supporting portion 523 1 To 523 5 The support portion 523 is disposed inside the product area M5, and one side thereof extends outside the product area M5 and is connected to the frame portion N5. 1 To 523 5 The extended portion is a thin plate portion similar to the connecting portion 53. The supporting portion 523 1 To 523 5 The other side of the support portion 523 is not connected to the wire portion 51. 1 To 523 5 Thus, in the terminal array 52 of the fifth metal plate 50, the thick plate portion (connection portion 522) connected to both ends of the lead portion 51 is not electrically connected. 1 and 522 2 ) is electrically independent from the lead portion 51, and serves as a supporting portion for the thick plate portion of the terminal array of other metal plates.

[0103] like Figure 5 As shown in (b), the sixth metal plate 60 is different from the fifth metal plate 50 in that the connection parts between the starting point and the end point of the wire portion and the terminal row are offset to the right by one position respectively, and its overall shape and thickness are the same as the fifth metal plate 50.

[0104] Specifically, the product area M6 of the sixth metal plate 60 includes a wire portion 61 formed in a substantially rectangular spiral shape, and a terminal row 62 arranged in a predetermined direction outside the spiral formed by the wire portion 61. The wire portion 61 is connected to the frame portion N6 through a plurality of connecting portions 63 (here, six as an example) extending from the inside of the product area M6 to the outside of the product area M6. The number and connection position of the connecting portions 63 can be arbitrarily determined as long as the wire portion 61 can be stably supported by the frame portion N6, and are preferably arranged near the corners of the substantially rectangular wire portion 61.

[0105] The terminal row 62 has a self Figure 5 The support parts 623 are arranged in sequence at predetermined intervals on the left side of (b) 1 to 623 5, connecting portion 622, and terminal portion 621. The lead portion 61, the connecting portion 63, and the frame portion N6 are thin plate portions formed to a predetermined thickness, and the terminal portion 621, the connecting portion 622, and the supporting portion 623 are thin plate portions formed to a predetermined thickness. 1 to 623 5 The terminal portion 621, the connecting portion 622, and the supporting portion 623 are formed to be thicker than the lead portion 61 and have the same thickness. 1 to 623 5 The plan view shape is, for example, the terminal portion 121, the connecting portion 122, and the supporting portion 123. 1 to 123 5 The top view shape is the same.

[0106] The lead portion 61, the connection portion 63, and the upper surface of the frame portion N6 (the surface opposite to the fifth metal plate 50) are connected to the terminal portion 621, the connecting portion 622, and the supporting portion 623. 1 to 623 5 The upper surface of the fifth metal plate 50 (the surface on the opposite side to the fifth metal plate 50) is located on a substantially same plane. On the other hand, the lower surface of the lead portion 61, the connecting portion 63, and the frame portion N6 is located relative to the terminal portion 621, the connecting portion 622, and the supporting portion 623. 1 to 623 5 The lower surface of the fifth metal plate 50 is recessed toward the side opposite to the fifth metal plate 50.

[0107] It should be noted that the frame portion N6 may include a first portion having the same thickness as the conductor portion 61, and a second portion having the same thickness as the thick plate portion constituting the terminal column 62. For example, as the second portion, in order to prevent the metal plate from tilting while ensuring a firm connection with an adjacent metal plate, a reinforcing portion 64 may be provided at the four corners of the frame portion N6. In this case, the lower surface of the reinforcing portion 64 is located on substantially the same plane as the lower surface of the connecting portion 622, etc. The reinforcing portion 64 may be formed, for example, in an L-shape. In order to prevent the metal plate from tilting while ensuring a firm connection with an adjacent metal plate, a second portion (thick plate portion) may be provided at a portion other than the corners of the frame portion N6 in place of the reinforcing portion 64, or in addition to the reinforcing portion 64.

[0108] The thickness of the lead portion 61, the connection portion 63, and the frame portion N6 is, for example, the same as that of the lead portion 11, etc. The terminal portion 621, the connection portion 622, and the support portion 623 are 1 to 623 5 The thickness is, for example, the same as that of the terminal portion 121 and the like.

[0109] The connecting portion 622 is arranged inside the product area M6, and one side thereof extends to the outside of the product area M6 and is connected to the frame portion N6. The portion extending from the connecting portion 622 is the same thin plate portion as the connecting portion 63. The other side of the connecting portion 622 is connected to the starting point 611 of the wire portion 61. The terminal portion 621 is arranged inside the product area M6, and one side thereof extends to the outside of the product area M6 and is connected to the frame portion N6. The portion extending from the terminal portion 621 is the same thin plate portion as the connecting portion 63. The other side of the terminal portion 621 is connected to the end point 612 of the wire portion 61.

[0110] Supporting part 623 1 to 623 5 The support portion 623 is disposed inside the product area M6, and one side thereof extends outside the product area M6 and is connected to the frame portion N6. 1 to 623 5 The extended portion is a thin plate portion similar to the connecting portion 63. Support portion 623 1 to 623 5 The other side of the support portion 623 is not connected to the wire portion 61. 1 to 623 5 There is no electrical conduction with the wire portion 61. Thus, in the terminal array 62 of the sixth metal plate 60, the thick plate portion other than the thick plate portion (connecting portion 622 and terminal portion 621) connected to both ends of the wire portion 61 is electrically independent from the wire portion 61, and becomes a supporting portion for supporting the thick plate portion of the terminal array of other metal plates.

[0111] Figure 7 (a) is the edge of the coil structure 1 Figure 3 (a) is a cross-sectional view of the line AA. Figure 7 (b) is the edge of the coil structure 1 Figure 3 (a) is a cross-sectional view of line BB. Figure 8 (a) is the edge of the coil structure 1 Figure 3 (a) is a cross-sectional view of the CC line. Figure 8 (b) is the edge of the coil structure 1 Figure 3 (a) is a cross-sectional view taken along line DD. Fig. 9 (a) is the edge of the coil structure 1 Figure 3 (a) is a cross-sectional view of line EE. Fig. 9 (b) is the edge of the coil structure 1 Figure 3 (a) is a cross-sectional view of the FF line. Fig.10 The coil structure 1 is along Figure 3 (a) is a cross-sectional view of the GG line. It should be noted that Figure 7 to Figure 10 For the sake of convenience, some of the figure marks are omitted.

[0112] Apart from Figure 1 to Figure 6 In addition, refer to Figure 7 to Figure 10 In the coil structure 1, adjacent metal plates are joined to each other. Adjacent metal plates can be joined to each other by, for example, diffusion bonding. Diffusion bonding can join upper and lower metal plates without sandwiching materials with different electrical conductivity and thermal conductivity such as solder, so that the voltage loss generated at the joint can be reduced, which is preferred in this regard.

[0113] Specifically, the terminal array 22 of the second metal plate 20 is stacked on the terminal array 12 of the first metal plate 10, and the two are joined to each other. That is, the support portion 223 is stacked on the terminal portion 121. 1 , a connecting portion 222 is stacked on the connecting portion 122 1 , in the support portion 123 1 A connecting portion 222 is stacked on top 2 , in the support portion 123 2 The support portion 223 is stacked on top. 2 , in the support portion 123 3 The support portion 223 is stacked on top. 3 , in the support portion 123 4 The support portion 223 is stacked on top. 4 , in the support portion 123 5 The support portion 223 is stacked on top. 5 Furthermore, each reinforcement part 24 is joined to each reinforcement part 14 .

[0114] Thus, the connection portion 122 connected to the end point 112 of the conductor portion 11 and the connection portion 222 connected to the start point 211 of the conductor portion 21 are connected. 1 The conductors 11 and 21 are connected in series. Since the conductors 11 and 21 are thinner than the terminal arrays 12 and 22, the upper surface of the conductor 11 is not in contact with the lower surface of the conductor 21. Since any thick plate portion of the terminal array 12 is always disposed below each thick plate portion of the terminal array 22, the upper and lower metal plates can be easily joined to each other.

[0115] Similarly, the terminal array 32 of the third metal plate 30 is stacked on the terminal array 22 of the second metal plate 20, and the two are joined to each other. 1 A support portion 323 is stacked on top 1 , at the connection portion 222 1 A support portion 323 is stacked on top 2 , at the connection portion 222 2 A connecting portion 322 is stacked on top 1 , in the support portion 223 2 A connecting portion 322 is stacked on top 2, in the support portion 223 3 A support portion 323 is stacked on top 3 , in the support portion 223 4 A support portion 323 is stacked on top 4 , in the support portion 223 5 A support portion 323 is stacked on top 5 Furthermore, each reinforcement part 34 is joined to each reinforcement part 24 .

[0116] Thus, the connecting portion 222 connected to the terminal end 212 of the conductor portion 21 2 The connecting portion 322 connected to the starting point 311 of the conductor portion 31 1 The conductors 21 and 31 are connected in series. Since the conductors 21 and 31 are thinner than the terminal arrays 22 and 32, the upper surface of the conductor 21 is not in contact with the lower surface of the conductor 31. Since any thick plate portion of the terminal array 22 is always disposed below each thick plate portion of the terminal array 32, the upper and lower metal plates can be easily joined to each other.

[0117] Similarly, the terminal array 42 of the fourth metal plate 40 is stacked on the terminal array 32 of the third metal plate 30, and the two are joined to each other. 1 A support portion 423 is stacked on top 1 , in the support portion 323 2 A support portion 423 is stacked on top 2 , at the connection portion 322 1 A support portion 423 is stacked on top 3 , at the connection portion 322 2 A connecting portion 422 is stacked on top 1 , in the support portion 323 3 A connecting portion 422 is stacked on top 2 , in the support portion 323 4 A support portion 423 is stacked on top 4 , in the support portion 323 5 A support portion 423 is stacked on top 5 Furthermore, each reinforcement portion 44 is joined to each reinforcement portion 34 .

[0118] Thus, the connecting portion 322 connected to the terminal point 312 of the lead wire portion 31 2 The connecting portion 422 connected to the starting point 411 of the conductor portion 41 1The conductors 31 and 41 are connected in series. Since the conductors 31 and 41 are thinner than the terminal arrays 32 and 42, the upper surface of the conductor 31 is not in contact with the lower surface of the conductor 41. Since any thick plate portion of the terminal array 32 is always disposed below each thick plate portion of the terminal array 42, the upper and lower metal plates can be easily joined to each other.

[0119] Similarly, the terminal array 52 of the fifth metal plate 50 is stacked on the terminal array 42 of the fourth metal plate 40, and the two are joined to each other. 1 A support portion 523 is stacked thereon 1 , in the support portion 423 2 A support portion 523 is stacked thereon 2 , in the support portion 423 3 A support portion 523 is stacked thereon 3 , at the connection portion 422 1 A support portion 523 is stacked thereon 4 , at the connection portion 422 2 A connecting portion 522 is stacked on top 1 , in the support portion 423 4 A connecting portion 522 is stacked on top 2 , in the support portion 423 5 A support portion 523 is stacked thereon 5 Furthermore, each reinforcement portion 54 is joined to each reinforcement portion 44 .

[0120] Thus, the connecting portion 422 connected to the terminal 412 of the conductor portion 41 2 The connecting portion 522 connected to the starting point 511 of the conductor portion 51 1 The conductors 41 and 51 are connected in series. Since the conductors 41 and 51 are thinner than the terminal arrays 42 and 52, the upper surface of the conductor 41 is not in contact with the lower surface of the conductor 51. Since any thick plate portion of the terminal array 42 is always disposed below each thick plate portion of the terminal array 52, the upper and lower metal plates can be easily joined to each other.

[0121] Similarly, the terminal array 62 of the sixth metal plate 60 is stacked on the terminal array 52 of the fifth metal plate 50, and the two are joined to each other. 1 A support portion 623 is stacked on top 1 , in the support portion 523 2 A support portion 623 is stacked on top 2 , in the support portion 523 3 A support portion 623 is stacked on top 3 , in the support portion 5234 A support portion 623 is stacked on top 4 , at the connection portion 522 1 A support portion 623 is stacked on top 5 , at the connection portion 522 2 A connecting portion 622 is stacked on the support portion 523. 5 The terminal portion 621 is stacked thereon. In addition, each reinforcement portion 64 is joined to each reinforcement portion 54 .

[0122] Thus, the connecting portion 522 connected to the terminal point 512 of the conductor portion 51 2 The conductor 51 and the conductor 61 are connected in series by being conducted to the connecting portion 622 connected to the starting point 611 of the conductor 61. In addition, since the conductor 51 and the conductor 61 are formed to be thinner than the terminal arrays 52 and 62, the upper surface of the conductor 51 and the lower surface of the conductor 61 are not in contact. In addition, since any thick plate portion of the terminal array 52 is always arranged on the lower side of each thick plate portion of the terminal array 62, the upper and lower metal plates can be easily joined to each other.

[0123] With the above structure, in the coil structure 1, the end point 112 of the conductor 11 is connected to the starting point 211 of the conductor 21, the end point 212 of the conductor 21 is connected to the starting point 311 of the conductor 31, the end point 312 of the conductor 31 is connected to the starting point 411 of the conductor 41, the end point 412 of the conductor 41 is connected to the starting point 511 of the conductor 51, and the end point 512 of the conductor 51 is connected to the starting point 611 of the conductor 61. Thus, a spiral coil is formed from the starting point 111 of the conductor 11 to the end point 612 of the conductor 61.

[0124] Fig.11 as well as Fig.12 1 is a diagram showing an example of a manufacturing process of a coil structure according to the first embodiment. Fig.11 as well as Fig.12 is with Figure 3 (a) is a cross-sectional view corresponding to the line BB, and only one product area is shown.

[0125] First, in Fig.11 In the process shown in (a), a constant thickness and Figure 1(a) shows a plate-shaped metal 100 in a top view. The plate-shaped metal 100 is a component that eventually becomes the first metal plate 10, and is formed of, for example, an Fe-Ni alloy such as copper, a copper alloy, or a 42 alloy. The thickness of the plate-shaped metal 100 can be set to, for example, about 50 μm to 500 μm. A plurality of product areas are defined in the plate-shaped metal 100, and then, an anti-etching layer 310 is formed on the entire upper surface of the plate-shaped metal 100, and an anti-etching layer 320 is formed on the entire lower surface of the plate-shaped metal 100. The anti-etching layers 310 and 320 can be formed by, for example, laminating a photosensitive dry film resist.

[0126] Next, in Fig.11 In the step (b), the resist layer 310 is exposed and developed to form an opening 310x that selectively exposes the upper surface of the plate-shaped metal 100. In addition, the resist layer 320 is exposed and developed to form an opening 320x that selectively exposes the lower surface of the plate-shaped metal 100.

[0127] Next, in Fig.11 In the step (c), the plate-shaped metal 100 exposed in the opening 310x is half-etched from the upper surface side, and the plate-shaped metal 100 exposed in the opening 320x is half-etched from the lower surface side. Thus, the plate-shaped metal 100 is patterned to form a first metal plate 10 having a lead portion 11, a terminal array 12, etc.

[0128] It should be noted that, in the plate-like metal 100, the area where the anti-etching layer 310 and the anti-etching layer 320 overlap when viewed from above is not etched and thus has the original thickness, and this part becomes a thick plate portion. In addition, for the area where the anti-etching layer 310 and the anti-etching layer 320 are not formed when viewed from above, it is half-etched from both sides and penetrated. In addition, for the area where only the anti-etching layer 310 is formed when viewed from above, it is half-etched only from the lower surface side, becoming a thin plate portion with a thickness of about half of the original thickness. In the case where the plate-like metal 100 is copper, for example, a ferric chloride solution can be used for half etching.

[0129] Next, in Fig.12 In the process (a) shown in Fig.11 The second metal plate 20, the third metal plate 30, the fourth metal plate 40, the fifth metal plate 50, and the sixth metal plate 60 are manufactured by the same method as in FIG. 11(a) to FIG. 11(c). The top view of each metal plate is as follows: Figure 3 (b)~ Figure 5 As shown in (b), the cross-sectional shape of each metal plate is Figure 6 to Figure 10 As shown.

[0130] Next, in Fig.12In the step (b) of the embodiment, the metal plates are stacked so that the thick plate portions including the terminal arrays of the adjacent metal plates are joined to each other. Fig.12 The metal plates are stacked in the order shown in (b) to form a laminate, and the laminate is pressurized and heated in the up and down directions in a vacuum atmosphere to perform diffusion bonding. Thus, the thick plate portions of adjacent metal plates are directly bonded to each other, and the coil structure 1 is completed. During diffusion bonding, since any thick plate portion of the terminal row of the lower layer must be configured on the lower side of each thick plate portion of the terminal row except the lowest layer, the bonding of each thick plate portion can be performed at the same time. It should be noted that it is preferred to set the material of each metal plate to be the same, so that adjacent metal plates can be well bonded to each other by diffusion bonding.

[0131] The coil structure 1 is completed through the above steps. Fig.13 By performing the process, the inductor 2 can be manufactured.

[0132] exist Fig.13 In the process shown in (a), Fig.12 The coil structure 1 shown in (b) forms a sealing resin 70. As an insulating resin constituting the sealing resin 70, a thermosetting resin or a thermoplastic resin such as an epoxy resin, a polyimide resin, a phenolic resin, an acrylic resin, etc. can be used. It should be noted that the sealing resin 70 is formed in such a way that the lower surface of the terminal row 12 of the first metal plate 10 is exposed on the lower surface of the sealing resin 70. Preferably, after forming the sealing resin 7, the lower surface of the sealing resin 70 is ground or shot peened to remove the resin burrs on the lower surface of the terminal row 12. Low-pressure molding methods such as transfer molding and compression molding can be used for the formation of the sealing resin 70.

[0133] Next, in Fig.13 In the step (b) of FIG. 1 , a cutting blade or the like is used to cut the Fig.13 The structure shown in (a) is cut into individual pieces to produce the inductor 2. The inductor 2 can also be made by punching or etching. Fig.13 The structure shown in (a) is monolithic. It should be noted that the cutting line L is Figure 1 The dotted line in (b) indicates the position corresponding to the product area M. By cutting, the side surfaces of the terminal arrays 12, 22, 32, 42, 52, and 62 are exposed from one side surface of the sealing resin 70. Fig.14 (a) and Fig.14 (b) shows a surface mount inductor 2. The plan view shape of the inductor 2 is a rectangular shape such as a square shape or a rectangular shape.

[0134] The side surfaces and lower surfaces of the terminal portions 121 of the terminal array 12 exposed from the sealing resin 70 and the supporting portions 223 of the terminal array 22 1 The side surface of the terminal array 32 and the support portion 323 1 The side surface of the terminal array 42 and the support portion 423 1 The side surface of the terminal array 52 and the support portion 523 1 The side surface of the terminal array 62 and the support portion 623 1 The side surface of the terminal array 12 is formed as the external connection terminal 1A. 5 The side and bottom surfaces of the terminal array 22 and the supporting portion 223 5 The side surface of the terminal array 32 and the support portion 323 5 The side surface of the terminal array 42 and the support portion 423 5 The side surface of the terminal array 52 and the support portion 523 5 The side surfaces of the terminal portion 621 of the terminal array 62 serve as the external connection terminals 1B.

[0135] It should be noted that Fig.14 (b) is viewed from the bottom surface Fig.14 In other words, Fig.14 (b) is to make Fig.14 (a) is a diagram in which the inductor 2 is rotated 180 degrees in the horizontal direction of the paper and turned upside down. The plan view shape of the inductor 2 can be set to a substantially rectangular shape of about 3 mm×3 mm, for example. The thickness of the inductor 2 can be set to about 1.0 mm, for example.

[0136] Fig.15 is a cross-sectional view for explaining the method of mounting the inductor according to the first embodiment, Fig.15 (a) shows Fig.14 H section, Fig.15 (b) shows Fig.14 I section. Fig.15 (a) and Fig.15 In (b), the inductor 2 is mounted on the substrate 200. Specifically, a pad 210 is formed on one surface of the substrate 200, and a portion of the upper surface of the pad 210 is exposed in the opening 220x of the solder resist layer 220. The upper surface of the pad 210 exposed in the opening 220x is electrically connected to the external connection terminals 1A and 1B of the inductor 2 through the solder 230.

[0137] Thus, the coil structure 1 is a structure of 6 stacked metal plates. Each metal plate includes a spiral conductor portion and a terminal row formed by arranging 7 thick plate portions of the same thickness as the conductor portion in a predetermined direction outside the spiral formed by the conductor portion. Each metal plate is stacked, and the terminal rows of adjacent metal plates are joined to each other. In addition, the two ends of the conductor portion of each metal plate are connected to any two adjacent thick plate portions of the thick plate portions constituting the terminal row of each metal plate.

[0138] Furthermore, both ends of the conductor portion 11 at the bottom layer are connected to one end side of the terminal array 12 (at Figure 3 The terminal portion 121 and the connecting portion 122 of the two thick plate portions (the left side in (a) etc.) are connected, and the position of each thick plate portion connected to the two ends of the wire portion is moved one position toward the other end of the terminal column. With such a structure, the wire portions of each metal plate can be connected in series to form a spiral coil.

[0139] In such a structure, it is easy to increase the number of turns of the coil by increasing the number of stacked metal plates. As a result, by using the coil structure 1, a small-sized inductor 2 capable of obtaining a large induced electromotive force can be realized. That is, by sealing the coil structure 1 with the sealing resin 70 in a manner that the external connection terminals 1A and 1B are exposed, a small-sized inductor 2 capable of obtaining a large induced electromotive force can be realized.

[0140] It should be noted that the number of stacked metal plates is not limited to 6 sheets, and can be set to n sheets (n is a natural number greater than 2). In this case, each metal plate can include a spiral conductor portion, and a terminal column formed by arranging n+1 thick plate portions of the same thickness as the conductor portion on the outside of the spiral formed by the conductor portion in a prescribed direction. Alternatively, the number of thick plate portions constituting the terminal column can be set to n+1 or more. For example, when the metal plates are shared and the number of sheets is changed according to the purpose, the number of thick plate portions constituting the terminal column can be set to n+1 or more.

[0141] For example, assuming that n metal plates are stacked and the number of thick plate portions constituting the terminal array is less than n, there is a thick plate portion that is not supported from the bottom and becomes suspended when heat and pressure are applied from top and bottom to join the metal plates, making it difficult to join this part.

[0142] In contrast, in the coil structure 1, in the structure of stacking n metal plates, each metal plate is provided with a terminal row formed by arranging n+1 thick plate portions in a predetermined direction outside the spiral formed by the conductor portion. Therefore, each metal plate can be easily joined by diffusion bonding or the like.

[0143] In the coil structure 1, the six thick plate portions stacked at one end of the terminal array become the external connection terminal 1A, and the six thick plate portions stacked at the other end of the terminal array become the external connection terminal 1B. 1 ,323 1 ,423 1 , 523 1 , and 623 1 The external connection terminal 1A is formed by stacking the support portion 123. 5 On top, the support portion 223 5 ,323 5 ,423 5 , 523 5 , and the terminal portion 621 are sequentially stacked to constitute the external connection terminal 1B.

[0144] For the external connection terminal 1A, since the terminal arrays of the metal plates are stacked on one end side on the terminal portion 121 of the first metal plate 10 and are mutually conductive, the connection with the outside can be made at any layer of the external connection terminal 1A. Similarly, for the external connection terminal 1B, since the terminal arrays of the metal plates are stacked on one end side on the terminal portion 121 of the first metal plate 10 and are mutually conductive, the connection with the outside can be made at any layer of the external connection terminal 1A. 5 The other ends of the terminal arrays of the above metal plates are stacked and electrically connected to each other, so that connection to the outside can be made at any layer of the external connection terminals 1B.

[0145] In the above description, for convenience, the wire portion 11 side is set as the starting point and the wire portion 61 side is set as the end point, but the coil structure 1 is non-polar, and the current can flow from the external connection terminal 1A to the external connection terminal 1B, and can also flow from the external connection terminal 1B to the external connection terminal 1A.

[0146] It should be noted that the coil structure 1 can be shipped as a product, and the inductor 2 can also be shipped as a product. In addition, any one or more of the first metal plate 10, the second metal plate 20, the third metal plate 30, the fourth metal plate 40, the fifth metal plate 50, and the sixth metal plate 60 before lamination can be shipped as a lead frame. That is, a lead frame including a spiral wire portion, and a terminal column formed by arranging three or more thick plate portions of the same thickness as the wire portion on the outside of the spiral formed by the wire portion in a predetermined direction, and the two ends of the wire portion are connected to any two thick plate portions constituting the terminal column can be shipped.

[0147] <Modification 1 of the First Embodiment>

[0148] In the modification 1 of the first embodiment, an example is shown in which the lead portion and the like are covered with an insulating film. In the modification 1 of the first embodiment, description of the same components as those of the embodiment already described may be omitted.

[0149] Fig.16 is a cross-sectional view of a coil structure according to a first modification of the first embodiment. Figure 7 (b) corresponds to the cross section. Fig.16 The coil structure 3 is different from the coil structure 1 (see Figure 7 (b) etc.) are different.

[0150] Specifically, an insulating film 80 is formed on each surface of the wire portion 11, the connection portion 13, and the frame portion N1 of the first metal plate 10, the wire portion 21, the connection portion 23, and the frame portion N2 of the second metal plate 20, the wire portion 31, the connection portion 33, and the frame portion N3 of the third metal plate 30, the wire portion 41, the connection portion 43, and the frame portion N4 of the fourth metal plate 40, the wire portion 51, the connection portion 53, and the frame portion N5 of the fifth metal plate 50, and the wire portion 61, the connection portion 63, and the frame portion N6 of the sixth metal plate 60. In addition, an insulating film 80 is formed on each surface of the stacked body in which each part (terminal portion, connecting portion, supporting portion) of the terminal array 12, the terminal array 22, the terminal array 32, the terminal array 42, the terminal array 52, and the terminal array 62 is stacked.

[0151] As the material of the insulating film 80, an insulating resin such as an epoxy resin or a polyimide resin can be used. The thickness of the insulating film 80 can be set to, for example, about 10 μm. The insulating film 80 can be formed by, for example, an electrodeposition method. By forming the insulating film 80 by an electrodeposition method, an insulating film having a substantially uniform thickness can be formed on the surface of each metal plate.

[0152] Fig.17 FIG. 2 is a cross-sectional view showing an inductor according to a first modification example of the first embodiment. Fig.17 As shown, by using sealing resin 71 Fig.16 The coil structure 3 is sealed and cut at a predetermined position to form an inductor 4. The plan view shape of the inductor 4 is a rectangular shape such as a square or a rectangle. As the sealing resin 71, for example, an insulating resin containing a magnetic filler can be used.

[0153] As the filler of the magnetic body, for example, powder of a soft magnetic body can be used. As the powder of the soft magnetic body, for example, powder of an iron-based amorphous alloy, carbonyl iron powder, and powder of ferrite, permalloy, etc. can be cited. As the insulating resin, thermosetting resins and thermoplastic resins such as epoxy resins, polyimide resins, phenolic resins, and acrylic resins can be used. By adjusting the proportion of the filler of the magnetic body and the insulating resin, the necessary magnetic permeability and moldability can be ensured.

[0154] To make the inductor 4, for example Fig.12 After the insulating film 80 is formed on the surface of each metal plate of the structure shown in (b) by electrodeposition or the like, Fig.18 As shown in (a), the sealing resin 71 is formed by a low pressure molding method such as transfer molding or compression molding. Fig.18 As shown in (b), the coating is removed by grinding or shot peening. Fig.18 The insulating film 80 on the lower surface side of the structure shown in (a) is removed so that the lower surface of the terminal array 12 is exposed from the sealing resin 71. Fig.13 In the step (b), a cutting blade or the like is used to cut the Fig.18 The structure shown in (b) is cut into individual pieces to produce an inductor 4. Fig.19 (a) and Fig.19 (b) shows a surface mounted inductor 4. It should be noted that Fig.19 (b) is viewed from the bottom surface Fig.19 In other words, Fig.19 (b) is to make Fig.19 (a) is a diagram in which the inductor 4 is rotated 180 degrees in the horizontal direction of the paper and turned upside down. The plan view shape of the inductor 4 can be set to a substantially rectangular shape of about 3 mm×3 mm, for example. The thickness of the inductor 4 can be set to about 1.0 mm, for example.

[0155] Fig. 20 is a cross-sectional view for explaining a method of mounting an inductor according to a first modification of the first embodiment. Fig. 20 (a) shows Fig.19 H section, Fig. 20 (b) shows Fig.19 I section. Fig. 20 (a) and Fig. 20In (b), the inductor 4 is mounted on the substrate 200. Specifically, a pad 210 is formed on one surface of the substrate 200, and a portion of the upper surface of the pad 210 is exposed in the opening 220x of the solder resist layer 220. The upper surface of the pad 210 exposed in the opening 220x is electrically connected to the external connection terminals 1A and 1B of the inductor 4 through the solder 230.

[0156] Thus, in the inductor 4, the inductance of the inductor 4 can be improved by sealing the coil structure 3 with the sealing resin 71 composed of an insulating resin containing a magnetic filler. In addition, by covering the surface of each metal plate with the insulating film 80, it is possible to prevent adjacent metal plates from being electrically connected to each other via the filler.

[0157] As mentioned above, although the preferred embodiments and the like have been described in detail, the present invention is not limited to the above-mentioned embodiments and the like, and various modifications and substitutions can be made to the above-mentioned embodiments and the like without exceeding the scope described in the claims.

[0158] For example, the plan view shape of the lead portion and the frame portion of each metal plate is not limited to a substantially rectangular shape, and may be a circular shape, an elliptical shape, or other more complex shapes.

Claims

1. A coil structure, which is a coil structure formed by stacking n metal plates, n is a natural number greater than 2, Each of the metal plates includes a spiral conductor portion and a terminal row formed by arranging n+1 or more thick plate portions thicker than the conductor portion on the outer side of the conductor portion in only one direction. Both ends of the wire portion of each of the metal plates are connected to any two adjacent thick plate portions of each of the metal plates. The metal plates are stacked, and the terminal rows of adjacent metal plates are joined to each other. The two ends of the wire portion of the lowest layer are connected to the two thick plate portions at one end side of the terminal array. With each ascending layer, the positions of the thick plate portions connected to the two ends of the wire portion are respectively moved one position toward the other end side of the terminal array, so that the wire portions of each of the metal plates are connected in series to form a spiral coil.

2. The coil structure according to claim 1, wherein: The thick plate portion stacked at one end of the terminal array and the thick plate portion stacked at the other end of the terminal array serve as external connection terminals.

3. The coil structure according to claim 1 or 2, wherein: In the terminal array of each of the metal plates, the thick plate portions other than the thick plate portions connected to both ends of the wire portion are electrically independent from the wire portion and serve as support portions for supporting the thick plate portions of the terminal array of other metal plates.

4. The coil structure according to claim 1 or 2, wherein: An insulating film is provided to cover the surface of each of the metal plates.

5. The coil structure according to claim 1 or 2, wherein: The coil structure has: A plurality of product areas, which if monolithicized become inductors; and A frame portion, which supports each of the above-mentioned product areas from the peripheral side, The lead portion and the terminal array are formed in each of the product areas.

6. The coil structure according to claim 5, wherein: The frame includes: A first portion having the same thickness as the conductor portion; and The second part has the same thickness as the thick plate part constituting the terminal array.

7. An inductor, comprising: The coil structure according to any one of claims 1 to 6; and The sealing resin covers the coil structure in a manner that a portion of the terminal array is exposed.

8. The inductor according to claim 7, wherein: The sealing resin contains a magnetic filler.

9. A method for manufacturing a coil structure, which is a method for manufacturing a coil structure formed by laminating n metal plates, wherein n is a natural number greater than 2, The manufacturing method of the coil structure has the following steps: A step of patterning a plate-shaped metal to form n pieces of the metal plates, the metal plates including a spiral conductor portion and a terminal array formed by arranging n+1 or more thick plate portions thicker than the conductor portion on the outer side of the conductor portion in only one direction; and The steps of stacking the metal plates and joining the terminal rows of adjacent metal plates to each other, In the step of forming the metal plates, both ends of the wire portion of each metal plate are connected to any two adjacent thick plate portions of each metal plate. In the above-mentioned joining process, the metal plates are stacked in such a manner that the two ends of the wire portion of the lowest layer are connected to the two thick plate portions on one end side of the terminal array, and each time a layer is raised, the position of the thick plate portion connected to the two ends of the wire portion is moved one position toward the other end side of the terminal array, thereby the wire portions of each metal plate are connected in series to form a spiral coil.

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