power module

Abstract

The application provides a power module, comprising a substrate and a bonding assembly, the bonding assembly comprising a plurality of chips, a bonding component and a terminal; the plurality of chips are arranged on the substrate and electrically connected with the substrate; the bonding component is connected with the plurality of chips respectively; and the terminal is electrically connected with the bonding component. The power module provided by the application has the advantages that, during the working process of the power module, the current flows to the plurality of chips through the bonding component after passing through the terminal, the plurality of chips are connected in parallel, the current density is uniformly distributed, the heat quantity of the power device is reduced, the influence of the heat of the power module on the performance of the power module is reduced, the quality of the power module is improved, the probability of damage of the power module due to the heat is reduced, and the service life of the power device is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of power module packaging, and in particular to a power module. Background Art

[0002] At present, in related technologies, when a packaged power module is in use, the current passing through the power module will cause the power module itself to generate a certain amount of heat. If the power module itself generates too much heat, the temperature of the power module will rise sharply, thereby affecting the overall performance of the power module and even damaging the power module. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0004] To this end, the present invention provides a power module.

[0005] In view of this, the first aspect of the present invention provides a power module, including a substrate and a bonding assembly, the bonding assembly including multiple chips, bonding components and terminals; the multiple chips are arranged on the substrate and electrically connected to the substrate; the bonding components are respectively connected to the multiple chips; and the terminals are electrically connected to the bonding components.

[0006] The power module provided by the present invention includes a substrate and a bonding assembly. The bonding assembly is disposed on the substrate, which can be a substrate with relatively good heat dissipation and electrical conductivity. The bonding assembly includes multiple chips, bonding components, and terminals. When the power module is operating, current flows into the power module through the terminals, then flows through the bonding components to the multiple chips, and then flows to the substrate.

[0007] During the operation of the power module, the current passes through the terminals and then flows to multiple chips through the bonding components. The multiple chips are connected in parallel, making the current density evenly distributed, reducing the heat generated by the power device, and thus reducing the impact of the heat generated by the power module on the performance of the power module. While improving the quality of the power module, it reduces the probability of damage to the power module due to heat and extends the life of the power device.

[0008] Since the current density distribution is more uniform, the power module allows a larger current to pass through, further improving the quality of the power module.

[0009] Since the current density distribution is more uniform, the heat generated by the power module is also more uniform, which facilitates the heat dissipation of the power module and improves the heat dissipation efficiency of the power module.

[0010] The power module provided by the present invention has relatively uniform stress distribution and good reliability.

[0011] The bonding component is a metal bonding component.

[0012] The substrate is provided with mounting holes for connecting and fixing the packaging structure with other devices.

[0013] Specifically, the chip is a diode chip.

[0014] In addition, the power module in the above technical solution provided by the present invention may also have the following additional technical features:

[0015] In a technical solution of the present invention, the bonding assembly further includes a first support plate, which is arranged between the multiple chips; the bonding component is electrically connected to the first support plate; and the terminal is electrically connected to the first support plate.

[0016] In this technical solution, the first support plate is arranged on the substrate, and the bonding component is bonded through the first support plate, which increases the height of the end of the bonding component electrically connected to the terminal, thereby making the connection and installation of the bonding component more convenient.

[0017] The power module includes a substrate and a bonding assembly, which includes multiple chips, a first support plate, bonding components, and terminals. This simplifies the structure and reduces the weight of the power module, thereby reducing its overall weight and achieving lightweighting. Due to the reduced weight of the power module, the bonding locations are less likely to break or fall off when the power module is dropped or subjected to external impact, making the power module less susceptible to damage, extending its service life, and making its operation safer and more reliable.

[0018] Specifically, the first support plate is a DBC (Direct Bonded Copper) structure and / or a multi-layer structure with a conductive upper surface and an insulating middle portion.

[0019] The terminal is welded to the first supporting plate.

[0020] The two ends of the bonding component can also be directly connected to the chips that need to be connected in parallel without passing through the first supporting plate.

[0021] In one technical solution of the present invention, the first support plate includes an insulating portion and a conductive portion. The insulating portion is attached to the substrate; the conductive portion is attached to the insulating portion; the bonding component is overlapped on the conductive portion; and the terminal is connected to the conductive portion.

[0022] In this technical solution, the first support plate includes an insulating portion and a conductive portion. The insulating portion is attached to the substrate; the conductive portion is attached to the insulating portion, making the first support plate insulated in the longitudinal direction. The insulating portion insulates the conductive portion from the substrate, preventing current from flowing directly to the substrate after passing through the support plate. A bonding component is overlapped with the conductive portion; the terminal is connected to the conductive portion, making the first support plate conductive in the transverse direction. The conductive portion connects the terminal and the bonding component, so that current flowing to the terminal passes through the bonding component and chip before flowing to the substrate, thereby improving the stability of the power module during operation.

[0023] In one embodiment of the present invention, the terminal is in the form of a sheet, column, or block, and includes a fixing portion, a connecting portion, and a mounting portion. The fixing portion is attached to the conductive portion; one end of the connecting portion is connected to the fixing portion, and the other end extends away from the first support plate; the mounting portion is connected to the other end of the connecting portion and is provided with a connection hole.

[0024] In this technical solution, the terminal includes a fixed portion and a connecting portion. The fixed portion is attached to the conductive portion, increasing the contact area between the terminal and the first support plate, reducing the resistance at the connection between the terminal and the first support plate, thereby reducing the heat generated at the connection between the terminal and the first support plate, and lowering the operating temperature of the power module. One end of the connecting portion is connected to the fixed portion, and the other end extends away from the first support plate, facilitating connection between the power module and external devices.

[0025] The terminal can be in sheet shape, column shape or block shape to facilitate terminal processing.

[0026] When the terminal is in the form of a sheet, the terminal includes two fixed parts and two connecting parts. The two fixed parts are respectively attached to the conductive parts, and one end of the two connecting parts is respectively connected to the two fixed parts and is arranged in a direction perpendicular to the conductive parts. The terminal also includes a mounting part, and the two ends of the mounting part are respectively connected to the other ends of the two connecting parts. The mounting part is provided with a conductive connection hole for connecting the circuit.

[0027] The power module further includes a support block, which is arranged between the two fixing parts and abuts against the mounting part.

[0028] The bonding component is overlapped between the two fixing parts.

[0029] In a technical solution of the present invention, the multiple chips are arranged on both sides of the first support plate; or the multiple chips are arranged around the first support plate.

[0030] In this technical solution, multiple chips are arranged on both sides of the first support plate; or multiple chips are arranged around the first support plate, which facilitates the electrical connection of the chips with the conductive parts through the bonding components, making the chip layout more reasonable.

[0031] In a technical solution of the present invention, the plurality of chips are symmetrically arranged relative to the first supporting plate.

[0032] In this technical solution, multiple chips are symmetrically arranged relative to the first support plate, further improving the uniformity of the power module's current density during operation, reducing the heat generated by the power devices, and thereby minimizing the impact of heat generation on the power module's performance. This improves the quality of the power module while reducing the probability of damage due to heat generation, thereby extending the life of the power devices. This also increases the current allowed to pass through the power module, further improving the quality of the power module. Furthermore, the heat generation of the power module is more uniform, facilitating heat dissipation and improving the heat dissipation efficiency of the power module.

[0033] In a technical solution of the present invention, the power module further includes a plurality of second support plates, which are respectively arranged between the plurality of chips and the substrate, and are conductive support plates.

[0034] In one technical solution of the present invention, the bonding component is a copper sheet, an aluminum strip, or a plurality of bonding wires arranged in parallel.

[0035] In this technical solution, the bonding components are copper sheets or aluminum strips. These have low density and are therefore lightweight, reducing the overall weight of the power module. This reduced weight reduces the risk of the bonding joints breaking or falling off when the module is dropped or subjected to external impact, thus minimizing damage to the module and extending its service life, making it safer and more reliable.

[0036] In a technical solution of the present invention, two ends of the bonding component are respectively overlapped on two chips among the multiple chips and are in contact with the first support plate.

[0037] In this technical solution, the two ends of the bonding component are respectively overlapped on two chips among the multiple chips and fit with the first support plate, so that the bonding component is arranged across the first support plate, thereby making the force on the bonding component more uniform, improving the uniformity of the stress distribution of the power module, thereby improving the reliability of the power module, and further extending the life of the power module.

[0038] In a technical solution of the present invention, one end of the bonding component is overlapped on the multiple chips, and the other end is overlapped on the first supporting plate.

[0039] In this technical solution, one end of the bonding component is overlapped on multiple chips, and the other end is overlapped on the first support plate. Each bonding component corresponds to one chip, which simplifies the production process difficulty of the power module and improves the qualification rate of the power module.

[0040] In one technical solution of the present invention, there are two groups of bonding components, and the two groups of bonding components are symmetrically arranged.

[0041] In this technical solution, there are two sets of bonding assemblies, which are symmetrically arranged. This further improves the uniformity of the current density during operation of the power module, reduces the heat generated by the power device, and thus reduces the impact of heat generation on the power module performance. While improving the quality of the power module, it also reduces the probability of damage due to heat generation and extends the life of the power device. It also allows a larger current to pass through the power module, further improving the quality of the power module. It also makes the heat generation of the power module more uniform, thereby facilitating the heat dissipation of the power module and improving the heat dissipation efficiency of the power module.

[0042] Specifically, each group of bonding components includes two chips, and the two chips are respectively arranged on both sides of the first support plate.

[0043] Specifically, each group of bonding components has four chips, with two chips forming a group, for a total of two groups of chips. The two chips in each group are distributed along the length direction of the substrate, and the two groups of chips are respectively arranged on both sides of the first support plate.

[0044] Specifically, each group of bonding components has four chips, with two chips forming a group, for a total of two groups of chips. The two chips in each group are distributed along the width direction of the substrate, and the two groups of chips are respectively arranged on both sides of the first support plate.

[0045] Specifically, each group of bonding components includes four chips, and the four chips are distributed around the first support plate.

[0046] In one technical solution of the present invention, the power module further includes a shell and a filler; the shell is sleeved on the outside of the bonding assembly and connected to the substrate; and the filler is filled in the shell.

[0047] In this technical solution, a housing is placed over the bonded assembly to prevent foreign objects from coming into contact with the bonded components, further improving the stability of the power module during operation. Filler is placed within the housing to cushion external forces impacting the power module, reducing the likelihood of damage to the bonded assembly. Furthermore, the filler within the housing secures and supports the bonded components, further improving the stability of the power module during operation.

[0048] Specifically, the housing is an insulating protective shell, which is used to protect the side surfaces of the conductive terminals from abnormal contact with other conductive bodies, thereby preventing work failures.

[0049] Specifically, the filler is epoxy resin and / or other filling substances, and the epoxy resin and / or other filling substances are filled in the shell to play a role of buffering, shockproofing, insulation and heat insulation.

[0050] The shell is provided with a filling hole, and the filling hole is used to fill epoxy resin and / or other filling substances into the shell.

[0051] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0053] Figure 1 shows an exploded view of a power module according to one embodiment of the present invention;

[0054] Figure 2a shows one of the structural schematic diagrams of a power module according to one embodiment of the present invention;

[0055] Figure 2b A second structural diagram of a power module according to an embodiment of the present invention is shown;

[0056] Figure 2c A third structural diagram of a power module according to an embodiment of the present invention is shown;

[0057] Figure 2d A fourth structural diagram of a power module according to an embodiment of the present invention is shown;

[0058] Figure 3 shows a front view of a power module according to one embodiment of the present invention;

[0059] Figure 4 shows a front view of a power module according to another embodiment of the present invention;

[0060] Figure 5a Shows one of the structural schematic diagrams of a terminal according to an embodiment of the present invention;

[0061] Figure 5b A second structural diagram of a terminal according to an embodiment of the present invention is shown;

[0062] Figure 5c A third structural diagram of a terminal according to an embodiment of the present invention is shown;

[0063] Figure 6 Shows a front view of a terminal according to one embodiment of the present invention;

[0064] Figure 7 shows a top view of a terminal according to one embodiment of the present invention;

[0065] Figure 8shows one of the chip distribution schematic diagrams according to one embodiment of the present invention;

[0066] Figure 9 A second schematic diagram of chip distribution according to an embodiment of the present invention is shown;

[0067] Figure 10 A third schematic diagram of chip distribution according to an embodiment of the present invention is shown;

[0068] Figure 11 A schematic structural diagram of a bonding component according to an embodiment of the present invention is shown;

[0069] Figure 12 shows a front view of a keying component according to one embodiment of the present invention;

[0070] Figure 13 shows a schematic structural diagram of a bonding component according to another embodiment of the present invention;

[0071] Figure 14 shows a front view of a keying component according to another embodiment of the present invention;

[0072] Figure 15a FIG1 shows one of the structural schematic diagrams of a power module (including a housing) according to an embodiment of the present invention;

[0073] Figure 15b FIG2 shows a second structural schematic diagram of a power module (including a housing) according to an embodiment of the present invention;

[0074] Figure 16 shows one of the structural schematic diagrams of a housing according to an embodiment of the present invention;

[0075] Figure 17 A second structural schematic diagram of a housing according to an embodiment of the present invention is shown;

[0076] Figure 18 A schematic structural diagram of a support block according to an embodiment of the present invention is shown;

[0077] Figure 19 FIG5 shows a fifth structural diagram of a power module according to an embodiment of the present invention;

[0078] Figure 20 A fourth structural diagram of a terminal according to an embodiment of the present invention is shown;

[0079] Figure 21 FIG5 shows a fifth structural diagram of a terminal according to an embodiment of the present invention.

[0080] in, Figures 1 to 21The corresponding relationship between the reference numerals and component names is as follows:

[0081] 100 substrate, 200 bonding component, 210 chip, 220 bonding component, 230 terminal, 232 fixing portion, 234 connecting portion, 236 mounting portion, 240 first support plate, 242 insulating portion, 244 conductive portion, 250 second support plate, 300 housing, 400 support block. DETAILED DESCRIPTION

[0082] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features therein can be combined with each other.

[0083] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0084] Refer to the following Figures 1 to 21 Power modules according to some embodiments of the present invention are described.

[0085] Example 1:

[0086] like Figure 1 、 Figure 2a 、 Figure 2b 、 Figure 2c and Figure 2d As shown, the present invention provides a power module, including a substrate 100 and a bonding assembly 200, the bonding assembly 200 including a plurality of chips 210, a bonding component 220 and a terminal 230; the plurality of chips 210 are arranged on the substrate 100 and electrically connected to the substrate 100; the bonding component 220 is respectively connected to the plurality of chips 210; and the terminal 230 is electrically connected to the bonding component 220.

[0087] In this embodiment, the power module includes a substrate 100 and a bonding assembly 200. The bonding assembly 200 is disposed on the substrate 100, which can be a substrate 100 with relatively good heat dissipation and electrical conductivity. The bonding assembly 200 includes multiple chips 210, a bonding component 220, and terminals 230. When the power module is operating, current flows into the power module through the terminals 230, then flows through the bonding component 220 to the multiple chips 210, and then flows to the substrate 100.

[0088] During the operation of the power module, the current passes through the terminal 230 and then flows to the multiple chips 210 through the bonding component 220. The multiple chips 210 are connected in parallel, so that the current density is evenly distributed, the heat generated by the power device is reduced, and the impact of the heat generated by the power module on the performance of the power module is reduced. While improving the quality of the power module, the probability of the power module being damaged due to heat is reduced, thereby extending the life of the power device.

[0089] Since the current density distribution is more uniform, the power module allows a larger current to pass through, further improving the quality of the power module.

[0090] Since the current density distribution is more uniform, the heat generated by the power module is also more uniform, which facilitates the heat dissipation of the power module and improves the heat dissipation efficiency of the power module.

[0091] The power module provided by the present invention has relatively uniform stress distribution and good reliability.

[0092] The bonding component 220 is a metal bonding component 220 . Specifically, the bonding component 220 may be an aluminum component or a copper component.

[0093] The substrate 100 is provided with mounting holes for connecting and fixing the packaging structure with other devices.

[0094] Specifically, the chip 210 is a diode chip.

[0095] Example 2:

[0096] This embodiment provides a power module. In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0097] like Figure 3 and Figure 4 As shown, the bonding assembly 200 further includes a first support plate 240 , which is disposed between the plurality of chips 210 ; the bonding component 220 is electrically connected to the first support plate 240 ; and the terminal 230 is electrically connected to the first support plate 240 .

[0098] In this embodiment, the first support plate 240 is provided on the substrate 100, and the bonding component 220 is bonded through the first support plate 240, thereby raising the height of one end of the bonding component 220 electrically connected to the terminal 230, thereby making the connection and installation of the bonding component 220 more convenient.

[0099] The power module comprises a substrate 100 and a bonding assembly 200, the bonding assembly 200 comprises a plurality of chips 210, a first support plate 240, a bonding component 220 and a terminal 230, so that the structure of the power module is simpler, the weight is lighter, thereby reducing the overall weight of the power module, and the lightweight of the power module is realized. Due to the reduction of the weight of the power module, the bonding position is not easy to break and fall off when the power module falls or is impacted by external force, the power module is not easy to be damaged, the service life of the power module is prolonged, and the work of the power module is safer and more reliable.

[0100] As shown in Figure 3 and Figure 4 The power module further comprises a plurality of second support plates 250, the plurality of second support plates 250 are respectively arranged between the plurality of chips and the substrate 100, and the second support plate 250 is a conductive structure.

[0101] Specifically, the first support plate 240 is a DBC structure and / or a multilayer structure with a conductive upper surface and an insulating middle.

[0102] The terminal 230 is welded on the first support plate 240.

[0103] The two ends of the bonding component 220 can also be directly connected to the chips 210 that need to be connected in parallel without passing through the first support plate 240.

[0104] The second support plate 250 can play the roles of conducting electricity, reducing stress, cushioning and the like, thereby facilitating bonding.

[0105] Embodiment three:

[0106] The embodiment provides a power module, in addition to the technical features of the above-mentioned embodiments, the embodiment further comprises the following technical features.

[0107] As shown in Figure 3 The first support plate 240 comprises an insulating part 242 and a conductive part 244. The insulating part 242 is attached to the substrate 100; the conductive part 244 is attached to the insulating part 242; the bonding component 220 is overlapped on the conductive part 244; and the terminal 230 is connected with the conductive part 244.

[0108] In this embodiment, the first support plate 240 includes an insulating portion 242 and a conductive portion 244. The insulating portion 242 is attached to the substrate 100; the conductive portion 244 is attached to the insulating portion 242, making the first support plate 240 insulated in the longitudinal direction. Furthermore, the insulating portion 242 insulates the conductive portion 244 from the substrate 100, preventing current from flowing directly to the substrate 100 after passing through the support plate. The bonding component 220 is overlapped on the conductive portion 244; the terminal 230 is connected to the conductive portion 244, making the first support plate 240 conductive in the transverse direction. The conductive portion 244 connects the terminal 230 and the bonding component 220, so that the current flowing to the terminal 230 passes through the bonding component 220 and the chip 210 and then flows to the substrate 100, thereby improving the stability of the power module during operation.

[0109] Example 4:

[0110] This embodiment provides a power module. In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0111] like Figure 1 As shown, the terminal 230 is in the shape of a sheet, column or block and includes a fixing portion 232 and a connecting portion 234. The fixing portion 232 is attached to the conductive portion 244; one end of the connecting portion 234 is connected to the fixing portion 232 and the other end extends away from the first support plate 240.

[0112] In this embodiment, the terminal 230 includes a fixed portion 232 and a connecting portion 234. The fixed portion 232 is attached to the conductive portion 244, increasing the contact area between the terminal 230 and the first support plate 240 and reducing the resistance at the connection between the terminal 230 and the first support plate 240. This, in turn, reduces the heat generated at the connection between the terminal 230 and the first support plate 240, thereby lowering the operating temperature of the power module. One end of the connecting portion 234 is connected to the fixed portion 232, and the other end extends away from the first support plate 240, facilitating connection between the power module and external devices.

[0113] Specifically, if Figure 2a and Figure 5a As shown, the terminal 230 may be in a block shape, and the block shape may be a rectangular parallelepiped or a cube.

[0114] Specifically, if Figure 2b and Figure 5b As shown, the terminal 230 may be in a cylindrical shape.

[0115] Specifically, if Figure 2c and Figure 5c As shown, the terminal 230 may be in a sheet shape to facilitate processing of the terminal 230 .

[0116] like Figure 5c and Figure 6As shown, when the terminal 230 is in sheet form, the terminal 230 includes two fixing portions 232 and two connecting portions 234. The two fixing portions 232 are respectively attached to the conductive portion 244. One end of the two connecting portions 234 is respectively connected to the two fixing portions 232 and is arranged in a direction perpendicular to the conductive portion 244. Figures 5c to 7 As shown, the terminal 230 further includes a mounting portion 236 , both ends of the mounting portion 236 are respectively connected to the other ends of the two connecting portions 234 , and a conductive connection hole for connecting a circuit is provided on the mounting portion 236 .

[0117] The keying component 220 is overlapped between the two fixing portions 232 .

[0118] like Figure 19 As shown, when the terminal 230 is cylindrical, the terminal 230 includes two fixing portions 232, two connecting portions 234 and a mounting portion 236. The two fixing portions 232 are respectively attached to the conductive portion, and one end of the two connecting portions 234 is respectively connected to the two fixing portions 232, and as shown Figure 20 As shown, the connecting portion 234 is arranged in a direction perpendicular to the conductive portion, or as shown in FIG. Figure 21 As shown, the connecting portion 234 is provided with a certain curved shape. The mounting portion 236 of the terminal 230 is cylindrical. The two ends of the mounting portion 236 are respectively connected to the other ends of the two connecting portions 234, and the mounting portion 236 is provided with a conductive connection hole for connecting the circuit. The cylindrical terminal 230 is simple to process and easy to manufacture. According to simulation results, the cylindrical terminal 230 structure can effectively reduce the temperature of the bonding position and the chip temperature, making the bonding position less likely to fail and the chip less likely to burn out, thereby improving the reliability of the device. In addition, the reasonable setting of the current inflow position also plays a certain role in reducing inductance.

[0119] Embodiment 5:

[0120] This embodiment provides a power module. In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0121] like Figures 8 to 10 As shown, the multiple chips 210 are disposed on both sides of the first support plate 240 ; or the multiple chips 210 are disposed around the first support plate 240 .

[0122] In this embodiment, multiple chips 210 are arranged on both sides of the first support plate 240; or multiple chips 210 are arranged around the first support plate 240, so that the chips 210 are electrically connected to the conductive part 244 through the bonding component 220, making the layout of the chips 210 more reasonable.

[0123] Example 6:

[0124] This embodiment provides a power module. In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0125] like Figures 8 to 10 As shown, the plurality of chips 210 are symmetrically arranged relative to the first support plate 240 .

[0126] In this embodiment, the multiple chips 210 are symmetrically arranged relative to the first support plate 240, further improving the uniformity of the current density during operation of the power module, reducing the heat generated by the power devices, and thereby reducing the impact of heat generation on the performance of the power module. While improving the quality of the power module, the probability of damage to the power module due to heat generation is reduced, thereby extending the life of the power devices. Furthermore, the current allowed to pass through the power module is increased, further improving the quality of the power module. Furthermore, the heat generation of the power module is made more uniform, thereby facilitating heat dissipation of the power module and improving its heat dissipation efficiency.

[0127] Embodiment seven:

[0128] This embodiment provides a power module. In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0129] like Figure 2a and Figure 2b As shown, the bonding component 220 is a plurality of bonding wires arranged in parallel.

[0130] like Figure 2c As shown, the bonding component 220 is an aluminum ribbon.

[0131] like Figure 2d As shown, the bonding component 220 is a copper sheet.

[0132] In this embodiment, the bonding component 220 is a copper sheet or aluminum strip. Copper sheets and aluminum strips have low density and are therefore lightweight, thereby reducing the overall weight of the power module and achieving a lightweight design. Due to the reduced weight of the power module, the bonding locations are less likely to break or fall off when the power module is dropped or subjected to external impact, thus minimizing damage to the power module, extending its service life, and ensuring safer and more reliable operation.

[0133] Embodiment 8:

[0134] This embodiment provides a power module. In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0135] Figure 2 and Figure 4 As shown, two ends of the bonding component 220 are respectively overlapped on two chips 210 among the plurality of chips 210 and are in contact with the first support plate 240 .

[0136] In this embodiment, if Figure 11 and Figure 12 As shown, the two ends of the bonding component 220 are respectively overlapped on two chips 210 among the multiple chips 210, and are in contact with the first support plate 240, so that the bonding component 220 is arranged across the first support plate 240, thereby making the force on the bonding component 220 more uniform, improving the uniformity of the stress distribution of the power module, thereby improving the reliability of the power module, and further extending the life of the power module.

[0137] Embodiment 9:

[0138] This embodiment provides a power module. In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0139] like Figure 1 and Figure 3 As shown, one end of the bonding component 220 is overlapped on the multiple chips 210 , and the other end is overlapped on the first support plate 240 .

[0140] In this embodiment, if Figure 13 and Figure 14 As shown, one end of the bonding component 220 is overlapped on multiple chips 210, and the other end is overlapped on the first support plate 240. Each bonding component 220 corresponds to one chip 210, which simplifies the production process difficulty of the power module and improves the qualification rate of the power module.

[0141] Embodiment 10:

[0142] This embodiment provides a power module. In addition to the technical features of the above embodiments, this embodiment further includes the following technical features.

[0143] like Figure 1 As shown in FIG2 , there are two groups of bonding assemblies 200 , and the two groups of bonding assemblies 200 are symmetrically arranged.

[0144] In this embodiment, there are two sets of bonding assemblies 200, which are symmetrically arranged. This further improves the uniformity of the current density during operation of the power module, reduces the heat generated by the power device, and thus reduces the impact of heat generation on the power module performance. While improving the quality of the power module, it also reduces the probability of damage to the power module due to heat generation, extending the life of the power device. Furthermore, the current allowed to pass through the power module is increased, further improving the quality of the power module. Furthermore, the heat generation of the power module is made more uniform, thereby facilitating heat dissipation and improving the heat dissipation efficiency of the power module.

[0145] Specifically, if Figure 1As shown in FIG. 1, the number of chips 210 in each bonding assembly 200 is two, and the two chips 210 are arranged on both sides of the first support plate 240.

[0146] Specifically, as shown in FIG. 2, the number of chips 210 in each bonding assembly 200 is four, and every two chips 210 form a group, and there are two groups of chips 210, and the two chips 210 in each group are distributed along the length direction of the substrate 100, and the two groups of chips 210 are arranged on both sides of the first support plate 240. Figure 8

[0147] Specifically, as shown in FIG. 3, the number of chips 210 in each bonding assembly 200 is four, and every two chips 210 form a group, and there are two groups of chips 210, and the two chips 210 in each group are distributed along the width direction of the substrate 100, and the two groups of chips 210 are arranged on both sides of the first support plate 240. Figure 9

[0148] Specifically, as shown in FIG. 4, the number of chips 210 in each bonding assembly 200 is four, and the four chips 210 are distributed around the first support plate 240. Figure 10

[0149] Embodiment eleven:

[0150] In addition to the technical features of the above-mentioned embodiments, the present embodiment further comprises the following technical features.

[0151] As shown in FIG. 1, Figure 15a , Figure 15b , Figure 16 and Figure 17 The power module further comprises a shell 300 and a filler; the shell 300 is sleeved outside the bonding assembly 200 and connected with the substrate 100; and the filler is filled in the shell 300.

[0152] In this embodiment, the shell 300 is sleeved outside the bonding assembly 200 to prevent foreign objects from contacting the bonding component 220, thereby further improving the stability of the power module during operation. When the power module receives an external force impact, the filler filled in the shell 300 can buffer the external force to reduce the probability of damage to the bonding assembly 200 by the external force. Moreover, the filler filled in the shell 300 can also fix and support the bonding component 220, thereby further improving the stability of the power module during operation.

[0153] Specifically, the shell 300 is an insulating protective shell for protecting the side surface of the conductive terminal 230 from abnormal contact with other conductive bodies and causing operation failure.

[0154] ​​​Specifically, the filler is epoxy resin and / or other filling substances, and the epoxy resin and / or other filling substances are filled in the shell 300 to play a role in buffering, shockproofing, insulation and heat insulation.

[0155] The housing 300 is provided with a filling hole, and the filling hole is used to fill the housing 300 with epoxy resin and / or other filling substances.

[0156] The housing 300 may be an adhesive housing, a plastic housing, or a 3D printed housing.

[0157] like Figure 15b and Figure 18 As shown, the power module further includes a support block 400 . The support block 400 is disposed between the two fixing portions 232 and abuts against the mounting portion 236 .

[0158] In the claims, specification and drawings of the present invention, the term "plurality" refers to two or more. Unless otherwise expressly defined, the orientation or positional relationship indicated by the terms "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. It is only for the purpose of more conveniently describing the present invention and making the description process simpler. It is not intended to indicate or imply that the device or element referred to must have the specific orientation described, be constructed and operated in a specific orientation. Therefore, these descriptions cannot be understood as limiting the present invention. The terms "connect", "install", "fix" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection between multiple objects, or a detachable connection between multiple objects, or an integral connection; it can be a direct connection between multiple objects, or an indirect connection between multiple objects through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood based on the specific circumstances of the above data.

[0159] In the claims, specification, and drawings of the present invention, the terms "one embodiment," "some embodiments," "a specific embodiment," and the like mean that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In the claims, specification, and drawings of the present invention, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0160] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A power module, characterized in that: The invention comprises a substrate and a bonding component, wherein the bonding component comprises: a plurality of chips, wherein the plurality of chips are disposed on the substrate and electrically connected to the substrate; bonding components, each of which is connected to the plurality of chips; a terminal electrically connected to the bonding component; The bonding assembly further comprises: a first supporting plate, the first supporting plate being arranged between the plurality of chips; The bonding component is electrically connected to the first support plate; The terminal is electrically connected to the first support plate; a plurality of second support plates, each of which is disposed between the plurality of chips and the substrate, and is a conductive support plate; Two ends of the bonding component are respectively overlapped on two chips among the plurality of chips and are in contact with the first supporting plate; The key component is arranged across the first support plate; The first support plate includes an insulating portion and a conductive portion; The insulating portion is attached to the substrate; The conductive portion is attached to the insulating portion; The terminal is in sheet shape; The terminal includes two fixing parts and two connecting parts, the two fixing parts are respectively attached to the conductive part, one end of the two connecting parts is respectively connected to the two fixing parts, and is arranged in a direction perpendicular to the conductive part; The terminal further comprises a mounting portion, both ends of which are connected to the other ends of the two connecting portions respectively, and a conductive connection hole for connecting a circuit is provided on the mounting portion; The keying component is overlapped between the two fixing parts; The plurality of chips are arranged around the first supporting plate; The plurality of chips are symmetrically arranged relative to the first supporting plate.

2. The power module according to claim 1, wherein: The bonding component is overlapped on the conductive part; The terminal is connected to the conductive portion.

3. The power module according to claim 1, wherein: The bonding component is a copper sheet, an aluminum strip or a plurality of bonding wires arranged in parallel.

4. The power module according to any one of claims 1 to 3, characterized in that: The number of the bonding components is two groups, and the two groups of bonding components are symmetrically arranged.

5. The power module according to any one of claims 1 to 3, characterized in that: Also includes: A housing, the housing being sleeved on the outside of the bonding assembly and connected to the substrate; A filler is filled in the shell.

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