Radiator and electronic component package

Abstract

The present invention achieves good heat dissipation performance through a simple and space-saving shape. The heat sink of the present invention comprises: a base portion (10), one side of which is used as an electronic component contact surface (11) and the opposite side of which is used as a heat dissipation surface (12); and two heat dissipation fins (30) arranged at one end and the other end of the base portion (10) in a direction in which the heat dissipation surface (12) is continuous, and the two heat dissipation fins (30) each have: a side wall portion (31) protruding from the heat dissipation surface (12); and a top wall portion (32) protruding from the protruding end side of the side wall portion (31) toward the other heat dissipation fin (30) and ensuring an external space (S1) between the side wall portion (31), and the two top wall portions (32) are separated by ensuring an air passage (A) connecting the internal space (S2) and the external space (S1) therebetween.

Description

Technical Field

[0001] The present invention relates to a heat sink for dissipating heat from an electronic component or the like and an electronic component package. Background Art

[0002] In the past, in inventions of this type, there is a heat sink as described in Patent Document 1, for example, which includes a base, protrusions protruding upward from left and right ends of the base, a plurality of fins protruding outward from each of the protrusions, and a power transistor mounted on the base between the left and right protrusions, and the heat sink is constructed in a roughly U-shape.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Utility Model Publication No. 59-103496 (reference Figure 1 ) Summary of the invention

[0006] Technical issues to be solved by the invention

[0007] However, according to the above-mentioned prior art, the plurality of fins protrude outward from the protrusions, so the overall size in the horizontal direction becomes larger, and a wide installation space is required. In addition, the plurality of fins have to be formed into a complex shape, and there is a need for improvement in manufacturing. Therefore, it is considered to omit the plurality of fins, but this may reduce the heat dissipation performance.

[0008] Means for solving technical problems

[0009] In view of such a problem, the present invention provides a heat sink having the following structure.

[0010] A heat sink is characterized in that it comprises: a plate-shaped base portion, one side of which is used as an electronic component contact surface and the opposite side of which is used as a heat dissipation surface; and two heat sinks, which are arranged at one end side and the other end side of the base portion in a direction in which the heat dissipation surface is continuous, and the two heat sinks each have: a side wall portion, which protrudes from the heat dissipation surface; and a top wall portion, which protrudes from the protruding end side of the side wall portion toward the other heat sink and ensures an internal space between the side wall portion and the heat dissipation surface, and the two top wall portions are separated by ensuring an air passage connecting the internal space and the external space therebetween.

[0011] Effects of the Invention

[0012] Since the present invention is configured as described above, it is possible to obtain good heat dissipation performance with a simple and space-saving shape. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1It is a perspective view showing an example of the heat sink according to the present invention.

[0014] Figure 2 It means along Figure 1 A cross-sectional view taken along the line (II)-(II), Figure 2 (a) indicates the horizontal setting state, Figure 2 (b) shows a vertically set state.

[0015] Figure 3 It is a perspective view showing another example of the heat sink according to the present invention.

[0016] Figure 4 is along Figure 3 A cross-sectional view taken along the line (IV)-(IV) of FIG. Figure 4 (a) indicates the horizontal setting state, Figure 4 (b) shows a vertically set state.

[0017] Figure 5 It is a perspective view showing another example of the heat sink according to the present invention.

[0018] Figure 6 It means along Figure 5 The cross-sectional view taken along the line (VI)-(VI) of Figure 6 (a) indicates the horizontal setting state, Figure 6 (b) shows a vertically set state.

[0019] Figure 7 It is a perspective view showing another example of the heat sink according to the present invention.

[0020] Figure 8 It means along Figure 7 An enlarged cross-sectional view taken along the line (VIII)-(VIII).

[0021] Fig. 9 is along Figure 7 The cross-sectional view taken along the line (IX)-(IX) of Fig. 9 (a) indicates the horizontal setting state, Fig. 9 (b) shows a vertically set state.

[0022] Fig.10 It is a perspective view showing an example of a conventional heat sink.

[0023] Fig.11 This is a table showing comparative experimental examples of the heat sink according to the present invention and a conventional heat sink.

[0024] Fig.12 It is a perspective view showing another example of the heat sink according to the present invention.

[0025] Fig.13 It is a perspective view showing another example of the heat sink according to the present invention.

[0026] Fig.14 It means about Fig.12 and Fig.13 The table shows the experimental examples of the heat sink.

[0027] Fig.15 It is a perspective view showing another example of the heat sink according to the present invention.

[0028] Fig.16 (a) is a longitudinal sectional view showing an example of a vent hole and a flange portion, Fig.16 (b) is a longitudinal sectional view showing an example of a protrusion.

[0029] Fig.17 It is a perspective view showing another example of the heat sink according to the present invention.

[0030] Fig.18 It is a perspective view showing another example of the heat sink according to the present invention.

[0031] Fig.19 It is a perspective view showing another example of the heat sink according to the present invention.

[0032] Fig. 20 yes Fig.19 Disassembled perspective view of the radiator. DETAILED DESCRIPTION

[0033] In this embodiment, the following features are disclosed.

[0034] The first feature is that the heat sink comprises: a base portion, one side of which is used as an electronic component contact surface and the opposite side of which is used as a heat dissipation surface; and two heat sinks, which are arranged at one end side and the other end side of the base portion in a direction in which the heat dissipation surface is continuous, and each of the two heat sinks has: a side wall portion protruding from the heat dissipation surface; and a top wall portion protruding from the protruding end side of the side wall portion toward the other heat sink and ensuring an internal space between the top wall portions and the heat dissipation surface, and the two top wall portions are separated by ensuring an air passage connecting the internal space and the external space therebetween (reference Figures 1 to 20 ).

[0035] As a second feature, the vent includes a slit portion between the two top wall portions (reference Figures 1 to 9 , Figure 12-13 , Figures 14 to 20 ).

[0036] As a third feature, the vent includes a through hole portion that is in the shape of a through hole spanning the two top wall portions and has a width greater than that of the slit portion (reference Figures 1 to 9 , Fig.13 , Fig.17 ).

[0037] As a fourth feature, at least one of the two top wall portions is provided with a vent hole that penetrates the top wall portion in the thickness direction (refer to Figure 3 to Figure 6 , Fig.15 , Fig.16 (a) Fig.17 ).

[0038] As a fifth feature, a flange portion protruding toward the external space is provided on the inner edge side of the vent hole (refer to Figure 3 to Figure 6 ).

[0039] As a sixth feature, a flange portion protruding toward the internal space is provided on the inner edge side of the vent hole (refer to Fig.15 and Fig.16 (a)).

[0040] As a seventh feature, a plurality of the vent holes and the flange portions are provided on each of the top wall portions, and two adjacent flange portions are arranged with a gap therebetween (see Figure 3-4 , Fig.15 , Fig.17 ).

[0041] As an eighth feature, a plurality of the vent holes and the flange portions are provided on each of the top wall portions, and two adjacent flange portions share the wall portion located therebetween to form an integral body (see Figure 5-6 ).

[0042] As a ninth feature, at least one of the two top wall portions is provided with a plurality of protrusions protruding toward the external space side, each of the protrusions being formed into a bottomed cylindrical shape having a bottom on a side opposite to the base bottom side (reference Figure 7 to Figure 9 ).

[0043] As a tenth feature, at least one of the two top wall portions is provided with a plurality of protrusions protruding toward the inner space side, each of the protrusions being formed into a bottomed cylindrical shape having a bottom on the base side (refer to Fig.15 and Fig.16 (b)).

[0044] As an eleventh feature, a through-shaped mounting hole is provided in the base portion, and the mounting hole is provided within the range of the ventilation passage when viewed from above (refer to Fig.12 , Fig.13 , Fig.15 and Figures 17 to 20 ).

[0045] As a twelfth feature, the top wall portion of one of the two heat sinks and the top wall portion of the other heat sink are formed into a triangular shape with oblique sides arranged opposite to each other, and the air passage is ensured between the two opposing oblique sides (reference Fig.12 , Fig.13 , Fig.15 , Figures 17 to 20 )

[0046] The thirteenth feature is that a through-type ventilation portion is provided on the side wall portion (refer to Fig.18 ).

[0047] As a fourteenth feature, the heat sink is formed by using the heat sink as a first heat sink and arranging a second heat sink in the inner space of the first heat sink, wherein the second heat sink has a base portion and two heat sinks having substantially the same structure as the base portion and the two heat sinks (see Fig.19 and Fig. 20 ).

[0048] As a fifteenth feature, the electronic component is supported in contact with the electronic component contact surface (reference Figure 2 , Figure 4 , Figure 6 and Fig. 9 ).

[0049] <First embodiment>

[0050] Next, a specific embodiment having the above-mentioned features will be described in detail with reference to the accompanying drawings.

[0051] Figure 1-2 The heat sink 1 shown comprises: a plate-shaped base portion 10, one side of which serves as an electronic component contact surface 11 and the opposite side of which serves as a heat dissipation surface 12; and two heat sinks 30, which are arranged at one end and the other end of the base portion 10 in a direction in which the heat dissipation surface 12 is continuous, and the heat sink is configured to connect an external space S1 to an internal space S2 surrounded by the base portion 10 and the heat sink 30.

[0052] The heat sink 1 shown in the figure is formed by bending a sheet of sheet metal to form the base 10 and the two heat sinks 30 , 30 . However, as another example, the base 10 and the heat sinks 30 , 30 may be connected independently by welding or fitting.

[0053] The raw material of the heat sink 1 includes pure metal composed of a single metal element, alloy composed of multiple metal elements or metal elements and non-metal elements. Specific examples of the metal element include aluminum, copper, stainless steel, nickel, magnesium, etc.

[0054] Furthermore, the heat sink 1 may be formed of a single material, or may be formed of a composite material in which two or more different materials are integrally combined.

[0055] The heat sink 1 shown in the figure forms an electronic component package P (see FIG. 1 ) by making the electronic component contact surface 11 contact with the electronic component X (eg, CPU, transistor, thyristor, other semiconductor and electronic component, etc.). Figure 1 ).

[0056] The base portion 10 is formed in a rectangular flat plate shape (a square flat plate shape according to the example shown in the figure), and a surface located on one side in the thickness direction (the lower side in the figure) is formed flat as an electronic component contact surface 11 for contacting the electronic component X.

[0057] The reverse side (upper side in the figure) of the base portion 10 is formed to be flat without irregularities, but heat dissipation fins or the like in an appropriate shape may be provided as required.

[0058] Figure 1 The symbol 13 in the figure is a through-shaped mounting hole, and an appropriate number of the mounting holes (two are provided on the diagonal line according to the present embodiment) are provided on one end side and the other end side, four corner sides, etc. of the diagonal line of the base part 10. The mounting holes 13 are used to insert the threads that clamp the base part 10 to the electronic component contact surface 11, or to fit the base part 10 to the convex part on the electronic component contact surface 11 side for positioning.

[0059] Each heat sink 30 integrally comprises: a side wall portion 31, which protrudes approximately vertically upward from one side of the base portion 10; and a top wall portion 32, which protrudes from the protruding end side of the side wall portion 31 toward another heat sink 30 and is approximately parallel to the heat dissipation surface 12 and ensures an internal space S2 between the heat dissipation surface 12, and these heat sinks are formed into a roughly inverted L shape.

[0060] The two left and right top walls 32 , 32 separate the opposing protruding end portions, and an air passage A that communicates the internal space S2 with the external space S1 on the upper side is ensured between the protruding end portions.

[0061] The air passage A is formed by a slit portion 32a that separates the two top walls 32, 32 and a through-hole portion 32b (through-hole) that is in the form of a through-hole spanning the two top walls 32, 32 and has a width (inner diameter according to the example shown) larger than that of the slit portion 32a.

[0062] The slit portion 32a is provided in a strip shape extending in a direction intersecting the direction in which the two top wall portions 32, 32 are arranged. Two slit portions 32a are provided on both sides of the slit portion 32a with the through portion 32b interposed therebetween.

[0063] Furthermore, the through-hole 32b is formed into a circular through-hole shape by semicircular notches provided in one top wall portion 32 and the other top wall portion 32 (see Figure 1 ).

[0064] Furthermore, by the above structure, one end side and the other end side (according to the direction in which the two top wall portions 32 and 32 are arranged) in the direction intersecting with the direction in which the two top wall portions 32 and 32 are arranged are provided. Figure 2 (a) is the right end side and the left end side) are respectively formed into opening portions B that are roughly horizontally long and rectangular when viewed from the front.

[0065] The opening B functions as an air flow path for allowing air to flow between the external space S1 and the internal space S2.

[0066] In the figure, reference numeral 32c denotes a notch portion for allowing a tool (such as a screwdriver) to be inserted and tightened through the thread or the like inserted into the mounting hole 13 to be inserted and tightened.

[0067] Furthermore, as another example other than the example shown in the figure, the mounting hole 13 may be omitted. In this case, the heat sink 30 may be fixed to the electronic component X by a method other than screw fastening such as fitting or bonding.

[0068] The heat sink 1 of the above structure is configured to form an electronic component package by making the electronic component X, which becomes a heat source, contact and support it on its electronic component contact surface 11 (refer to Figure 2 (a) Figure 2 (b)).

[0069] Next, the characteristic functions and effects of the heat sink 1 having the above-mentioned structure will be described in detail.

[0070] like Figure 2 As shown in (a), regarding the heat sink 1, when the electronic component contact surface 11 is facing downward and in contact with the electronic component X (hereinafter referred to as a horizontal setting), an upward airflow based on the heat of the base 10 is generated in the air duct A, so that the air on both sides is attracted into the upward airflow, thereby forming a continuous air flow along the two-dot chain line F1 shown in the figure.

[0071] Specifically, the air in the external space S1 enters the internal space S2 from the openings B on both sides, and flows into the external space S1 above through the slit portions 32 a and the penetration portions 32 b .

[0072] Then, the air flowing in this way contacts the heat dissipation surface 12 of the base member 10 and the inner surface of the heat sink 30 to perform heat exchange, thereby suppressing a temperature increase of the base member 10 and the electronic component X.

[0073] And, if Figure 2As shown in (b), regarding the heat sink 1, when the electronic component contact surface 11 is directed sideways to contact the electronic component X (hereinafter referred to as a vertical setting), an upward airflow based on the heat of the base portion 10 is generated in the internal space S2, so that the air on the side of the air duct A and the air on the side of the opening portion B below are attracted into the upward airflow, thereby forming a continuous air flow along the two-dot chain line F2 shown in the figure.

[0074] Specifically, the air in the external space S1 enters the internal space S2 from the air passage A and the lower opening B, and flows into the upper external space S1 through the upper opening B.

[0075] Then, the air flowing in this way contacts the heat dissipation surface 12 of the base member 10 and the inner surface of the heat sink 30 to perform heat exchange, thereby suppressing a temperature increase of the base member 10 and the electronic component X.

[0076] Thus, according to the heat sink 1 , a space-saving and lightweight structure without fins or the like protruding to the outside can achieve good heat dissipation performance regardless of whether it is installed horizontally or vertically.

[0077] The following embodiments are obtained by partially changing the above-mentioned embodiments, so the changed parts will be mainly described in detail, and the same parts will be appropriately omitted by using the same reference numerals.

[0078] <Second embodiment>

[0079] Figure 3 The heat sink 2 shown is based on the heat sink 1 having the above structure, and is formed by providing ventilation holes 33 and flange portions 34 on each top wall portion 32 .

[0080] A plurality of ventilation holes 33 are provided so as to be aligned in a continuous direction along the surface of the top wall portion 32. A gap is ensured between adjacent ventilation holes 33.

[0081] Each vent hole 33 is formed in a polygonal shape (a regular hexagonal shape according to the example shown in the figure), and penetrates the top wall portion 32 in the thickness direction.

[0082] The flange portion 34 is provided in a cylindrical shape (a hexagonal cylindrical shape according to the example shown in the figure) protruding from the inner edge side of each ventilation hole 33 on the outer surface of the top wall portion 32 toward the external space S1.

[0083] The flanges 34 are arranged in plurality so as to correspond to the plurality of ventilation holes 33. A gap is provided between adjacent flanges 34. The gap increases the heat dissipation area of ​​the flanges 34.

[0084] According to the example shown in the figure, the protrusion amount of each flange portion 34 is set to be approximately the thickness of the top wall portion 32 .

[0085] Next, the characteristic effects of the heat sink 2 having the above-mentioned structure will be described in detail.

[0086] like Figure 4 As shown in (a) of FIG. 1 , when the radiator 2 is horizontally installed, a continuous air flow is formed along the two-dot chain line F1 shown in the figure in substantially the same manner as the radiator 1 described above.

[0087] Specifically, the air in the external space S1 enters the internal space S2 from the openings B on both sides, and flows to the external space S1 above through the slit portions 32 a , the penetration portions 32 b , and the vent holes 33 .

[0088] Moreover, the air flowing in this way contacts the heat dissipation surface 12 of the base 10, the inner surface of the heat sink 30, the vent hole 33 and the inner surface of the flange 34 to exchange heat, and also exchanges heat with the air in the external space S1 on the outer surface side of the flange 34, thereby suppressing the temperature rise of the base 10 and the electronic component X.

[0089] And, if Figure 4 As shown in (b), when the radiator 2 is vertically arranged, a continuous air flow along the two-dot chain line F2 shown in the figure is formed in substantially the same manner as the above-mentioned radiator 1.

[0090] Specifically, the air in the external space S1 enters the internal space S2 through the air passage A, the air hole 33 and the lower opening B, and flows into the upper external space S1 through the upper opening B.

[0091] Moreover, the air flowing in this way contacts the heat dissipation surface 12 of the base 10, the inner surface of the heat sink 30, the vent hole 33 and the inner surface of the flange 34 to exchange heat, and also exchanges heat with the air in the external space S1 on the outer surface side of the flange 34, thereby suppressing the temperature rise of the base 10 and the electronic component X.

[0092] Thus, according to the heat sink 2, a space-saving and lightweight structure without fins protruding to the outside can achieve good heat dissipation performance regardless of whether it is horizontally or vertically arranged. In addition, the strength of the top wall 32 can be enhanced by the vent holes 33 and the flange 34.

[0093] <Third embodiment>

[0094] Figure 5 The heat sink 3 shown is obtained by providing ventilation holes 35 and flange portions 36 on each top wall portion 32 based on the heat sink 1 having the above-mentioned structure.

[0095] A plurality of ventilation holes 35 are provided so as to be aligned in a continuous direction along the surface of the top wall portion 32 .

[0096] Each of the ventilation holes 35 is formed in a polygonal shape (a regular hexagonal shape according to the example shown in the figure), and penetrates the top wall portion 32 in the thickness direction.

[0097] The flange portion 36 is provided in a cylindrical shape (a hexagonal cylindrical shape according to the example shown in the figure) protruding from the inner edge side of each ventilation hole 35 on the outer surface of the top wall portion 32 toward the external space S1.

[0098] The flanges 36 are arranged in plurality to correspond to the plurality of ventilation holes 35 . Two adjacent flanges 36 and 36 share a wall 36a therebetween and are integrally formed. The wall 36a serves to reinforce the strength of the top wall 32 .

[0099] According to the example shown in the figure, the protrusion amount of each flange portion 36 is set to be approximately the thickness of the top wall portion 32 .

[0100] Next, the characteristic functions and effects of the heat sink 3 having the above-mentioned structure will be described in detail.

[0101] like Figure 6 As shown in (a) of FIG. 1 , when the radiator 3 is horizontally installed, a continuous air flow is formed along the two-dot chain line F1 shown in the figure in substantially the same manner as the radiator 1 described above.

[0102] Specifically, the air in the external space S1 enters the internal space S2 from the openings B on both sides, and flows to the external space S1 above through the slit portions 32 a , the penetration portions 32 b , and the vent holes 35 .

[0103] Moreover, the air flowing in this way contacts the heat dissipation surface 12 of the base 10, the inner surface of the heat sink 30, the vent hole 35 and the inner surface of the flange 36 to exchange heat, and also exchanges heat with the air in the external space S1 on the outer surface side of the flange 36, thereby suppressing the temperature rise of the base 10 and the electronic component X.

[0104] And, if Figure 6 As shown in (b), when the radiator 3 is vertically arranged, a continuous air flow along the two-dot chain line F2 shown in the figure is formed in the same manner as the above-mentioned radiator 1.

[0105] Specifically, the air in the external space S1 enters the internal space S2 through the air passage A, the air hole 35 and the lower opening B, and flows into the upper external space S1 through the upper opening B.

[0106] Moreover, the air flowing in this way contacts the heat dissipation surface 12 of the base 10, the inner surface of the heat sink 30, the vent hole 35 and the inner surface of the flange 36 to exchange heat, and also exchanges heat with the air in the external space S1 on the outer surface side of the flange 36, thereby suppressing the temperature rise of the base 10 and the electronic component X.

[0107] Thus, according to the heat sink 3, a space-saving and lightweight structure without fins protruding to the outside can achieve good heat dissipation performance regardless of whether it is horizontally or vertically arranged. In addition, the strength of the top wall 32 can be enhanced by the vent holes 35 and the flange 36.

[0108] <Fourth embodiment>

[0109] Figure 7 The heat sink 4 shown is the heat sink 1 having the above-mentioned structure, in which protrusions 37 protruding toward the external space are provided on each top wall portion 32 .

[0110] A plurality of protrusions 37 are provided so as to be aligned in a continuous direction along the surface of the top wall portion 32 .

[0111] Each protrusion 37 is formed in a bottomed cylindrical shape having a polygonal shape (a regular hexagonal shape according to the example shown in the figure) having a bottom on the side opposite to the base portion 10 side, and protrudes toward the external space S1 side (see FIG. Figure 8 ).

[0112] According to the example shown in the figure, the protrusion amount of each protrusion 37 is set to be approximately the thickness of the top wall portion 32 .

[0113] A gap is ensured between adjacent protrusions 37, 37. This gap ensures a wide heat dissipation area for each protrusion 37.

[0114] In addition, as another example other than the illustrated example, the strength of each top wall portion 32 can be further improved by integrally connecting adjacent top wall portions 37 and 37 .

[0115] Next, the characteristic functions and effects of the heat sink 4 having the above-mentioned structure will be described in detail.

[0116] like Fig. 9 As shown in (a) of FIG. 1 , when the radiator 4 is horizontally arranged, a continuous air flow is formed along the two-dot chain line F1 shown in the figure in the same manner as the above-mentioned radiator 1 .

[0117] Specifically, the air in the external space S1 enters the internal space S2 from the openings B on both sides, and flows to the external space S1 above through the air passages A such as the slits 32 a and the penetrations 32 b .

[0118] The air thus flowing contacts the heat dissipation surface 12 of the base 10, the inner surface of the heat sink 30 and the inner surface of the protrusion 37 to exchange heat, and also exchanges heat with the air in the external space S1 on the outer surface side of the protrusion 37, thereby suppressing the temperature rise of the base 10 and the electronic component X.

[0119] And, if Fig. 9 As shown in (b), when the radiator 4 is vertically arranged, a continuous air flow along the two-dot chain line F2 shown in the figure is formed in the same manner as the above-mentioned radiator 1.

[0120] Specifically, the air in the external space S1 enters the internal space S2 from the air passage A and the lower opening B, and flows into the upper external space S1 through the upper opening B.

[0121] Moreover, the air flowing in this way contacts the heat dissipation surface 12 of the base 10, the inner surface of the heat sink 30, the inner surface of the protrusion 37, etc. to exchange heat, and also exchanges heat with the air in the external space S1 on the outer surface side of the protrusion 37, thereby suppressing the temperature rise of the base 10 and the electronic component X.

[0122] Thus, according to the heat sink 4, a space-saving and lightweight structure without fins protruding to the outside can achieve good heat dissipation performance regardless of whether it is horizontally or vertically arranged. In addition, the protrusion 37 can strengthen the strength of the top wall portion 32.

[0123] <Comparison with conventional structures>

[0124] Next, the results of the comparison of the temperature rise value and weight of the base portion of the heat sinks 1 to 4 having the above-mentioned structure and the comparative example 100 having the conventional structure based on the computer analysis will be described (refer to Fig.11 ).

[0125] Heat sinks 1 to 4 and Comparative Example 100 used heat sinks having the same external dimensions (approximately 60×59×10 mm).

[0126] The comparative example 100 is a heat sink in which six heat dissipation fins 120 are provided substantially in parallel with each other at intervals on the upper surface of a rectangular base portion 110 .

[0127] like Fig.11 As shown in the table, the temperature rise values ​​of the radiators 1 to 4 are lower than those of the comparative example 100 regardless of whether they are arranged horizontally or vertically, and a significantly lower temperature rise value is obtained when the radiators are arranged vertically.

[0128] Furthermore, the weights of the heat sinks 1 to 4 are all much lower than that of the comparative example 100.

[0129] In addition, according to the heat sink 2, the ventilation holes 33 and the flange 34 are provided as a particularly preferred mode, but as another example, the flange 34 can be omitted, and in this case, the ventilation effect based on the ventilation holes 33 can also be obtained. In the same way, the flange 36 can also be omitted in the heat sink 3.

[0130] As other examples besides the above, the vent holes 33, flange 34 and protrusion 37 may be arranged simultaneously on the top wall 32 of the heat sink 1 or the vent holes 33, flange 34 and protrusion 37 may be arranged in appropriate combination.

[0131] <Fifth embodiment>

[0132] Fig.12 The heat sink 5 shown is obtained by replacing the base portion 10 with a base portion 10 ′ and replacing the top wall portion 32 of each heat sink 30 with a top wall portion 32 ′ on the heat sink 1 having the above structure.

[0133] In this heat sink 5 , the top wall portion 32 ′ of one heat sink 30 and the top wall portion 32 ′ of the other heat sink 30 are formed into a triangular shape with opposing oblique sides, and the air passage A is ensured by a slit portion 32 a ′ formed between the two opposing oblique sides.

[0134] The base portion 10 ′ is obtained by replacing the mounting hole 13 of the base portion 10 with a mounting hole 13 ′.

[0135] The mounting hole 13' is a through hole, which is provided within the range of the air passage A when viewed from above. In other words, the air passage A is located on the central axis of the mounting hole 13'.

[0136] When the heat sink 5 of the above structure is horizontally arranged relative to the electronic component (not shown), the air flow F1 is formed from the opening B toward the internal space S2 and toward the external space S1 through the slit portion 32a' in a similar manner to the heat sink 1. Figure 2 ) forms an air flow that invades the internal space S2 from one opening B and is discharged to the external space S1 from the other opening B, and the air that invades the internal space S2 from the slit portion 32a' merges into the flow (not shown).

[0137] Thus, according to the heat sink 5 of the above structure, a relatively long air passage A can be ensured by the inclined slit portion 32a', and good heat dissipation performance can be obtained by a space-saving and lightweight structure without fins protruding to the outside.

[0138] Furthermore, when the heat sink 5 is clamped and fixed to the electronic component by a clamping tool (such as a thread or a bolt) inserted through the mounting hole 13', the air passage A can be used as a space for inserting a jig (such as a screwdriver) for tightening the clamping tool.

[0139] In addition, Fig.12 In the example shown, the mounting holes 13 ′ are provided at two locations corresponding to one end side and the other end side of the air passage A (slit portion 32 a ′), but one or three or more mounting holes may be provided.

[0140] <Sixth embodiment>

[0141] Fig.13 The heat sink 6 shown is obtained by configuring the heat sink 5 having the above-described structure with the air passage A formed by the slit portion 32a' and the through portion 32b' in addition to the through portion 32b'.

[0142] The penetration portion 32 b ′ is wider than the slit portion 32 a ′ and is substantially square in a plan view, and is provided across the two top wall portions 32 ′, 32 ′.

[0143] Regarding the radiator 6 , the air flow F1 when it is horizontally installed and the air flow (not shown) when it is vertically installed are substantially the same as those of the radiators 1 and 5 described above.

[0144] Thus, according to the heat sink 6 of the above structure, the inclined slits 32a' and the through-holes 32b' can ensure the air passage A with a large flow area, and further, the space-saving and lightweight structure without fins protruding to the outside can achieve good heat dissipation performance.

[0145] Next, the results of comparing the temperature rise value, weight, etc. of the base portion of the heat sinks 5 and 6 having the above-mentioned structure by computer analysis will be described (see Fig.14 ).

[0146] The outer dimensions of the samples used in this experiment were all about 60×59×10 mm.

[0147] like Fig.14 As shown in the table, five types of samples of the heat sink 6 having different side dimensions Q of the substantially square penetration portion 32 b ′ were tested.

[0148] like Fig.14 As shown in the table, the temperature rise value when the horizontal setting increases as the size Q increases, and is the smallest when Q = 30mm, and increases as Q increases.

[0149] Furthermore, regarding the temperature rise value when the vertical installation is performed, it is confirmed that the temperature rise value increases as the dimension Q increases until Q=40 mm.

[0150] As can be seen from these structures, when used in a horizontal setting manner, the dimension Q is preferably set to 30 mm, and when used in a vertical setting manner, the dimension Q is preferably set to 40 mm.

[0151] <Seventh embodiment>

[0152] Fig.15 The heat sink 7 shown is formed by providing a vent hole 33 ′ and a flange portion 34 ′ on the top wall portion 32 ′ of the heat sink 5 having the above-mentioned structure.

[0153] A plurality of vent holes 33' are provided at predetermined intervals along the surface of each top wall portion 32'. Fig.16 As shown in (a), each vent hole 33' penetrates the top wall portion 32' in the thickness direction.

[0154] The flange portion 34 ′ protrudes from the entire circumference of the inner edge of the vent hole 33 ′ toward the internal space S2 and is configured in a substantially cylindrical shape.

[0155] When the heat sink 7 is horizontally arranged relative to the electronic component (not shown), similarly to the heat sink 2, air flows intruding from the opening B into the internal space S2 and being discharged to the external space S1 through the slit 32a', and air flows intruding from the opening B into the internal space S2 and being discharged to the external space S1 through the vent 33' are formed (see FIG. Fig.15 The two-dot dash line F1)

[0156] Furthermore, when arranged vertically, an air flow is formed in which air invades the internal space S2 from one opening portion B and is discharged to the external space S1 from another opening portion B, similarly to the above-mentioned radiator 2, and the air invading the internal space S2 from the slit portion 32a' merges into the flow, and the air invading the internal space S2 from the vent hole 33' also merges into the flow (not shown).

[0157] Thus, according to the heat sink 7 of the above structure, a space-saving and lightweight structure without fins protruding to the outside can be obtained, and a large amount of ventilation and heat dissipation area can be ensured by the inclined slit portion 32a', the vent hole 33', the flange portion 34', etc., so that good heat dissipation performance can be obtained.

[0158] In addition, in the heat sink 7 of the above structure, part or all of the vent hole 33' and the flange portion 34' can be replaced by Fig.16 The protrusion 37' shown in (b) is formed in a bottomed cylindrical shape having a bottom on the base side, and protrudes toward the internal space S2.

[0159] The heat sink including the protrusion 37 ′ can achieve a space-saving and lightweight structure without fins protruding to the outside, and can also achieve the effects of increasing the strength of the top wall 32 ′ and improving the heat dissipation performance by the protrusion 37 ′.

[0160] Furthermore, as another example, part or all of the vent holes 33 ′, flange 34 ′, or protrusion 37 ′ in the heat sink 7 may be replaced with the hexagonal vent holes 33 , flange 34 , or protrusion 37 .

[0161] <Eighth Embodiment>

[0162] Fig.17 The heat sink 8 shown is formed by providing a plurality of vent holes 33 ′ and a flange portion 34 ′ on the top wall portion 32 ′ of the heat sink 6 having the above-mentioned structure.

[0163] The vent hole 33' and the flange 34' have the same structure as the heat sink 7 (see Fig.16 (a)).

[0164] According to the heat sink 8, a large ventilation volume and heat dissipation area can be ensured by the inclined slit portion 32a', the penetration portion 32b, the vent hole 33', the flange portion 34', etc., and further, a good heat dissipation performance can be obtained by a space-saving and lightweight structure without fins protruding to the outside.

[0165] In addition, the radiator 8 can also replace the vent hole 33' and the flange 34' with a protrusion 37' (see Fig.16 (b)).

[0166] <Ninth embodiment>

[0167] Fig.18 The heat sink 9 shown is obtained by forming a plurality of ventilation portions 31 a on the side wall portion 31 of the heat sink 5 having the above-described structure.

[0168] The ventilation portions 31 a are slit-shaped through holes that are elongated in the protruding direction of the side wall portion 31 (upward in the example shown in the figure), and a plurality of ventilation portions 31 a are provided at intervals in a direction intersecting the protruding direction.

[0169] In the heat sink 9, air can flow not only through the slit portion 32a' and the opening portion B, but also through the ventilation portion 31a of each side wall portion 31, thereby achieving good heat dissipation performance by having a space-saving and lightweight structure without fins protruding to the outside.

[0170] <Tenth embodiment>

[0171] Fig.19 and Fig. 20The heat sink 50 shown is obtained by Fig.12 ) is used as the first radiator 51, and a second radiator 52 is arranged in the internal space of the first radiator 51.

[0172] The second heat sink 52 has substantially the same structure as the base portion 10 and the heat sink 30 of the heat sink 5 , has a base portion 52 a and heat sink 52 b that are approximately one size smaller, and is in contact with the base portion 10 ′ of the first heat sink 51 .

[0173] The base portion 52 a is formed in a rectangular flat plate shape that is slightly smaller than the base portion 10 ′ and is in contact with the heat dissipation surface 12 of the base portion 10 ′.

[0174] The base portion 52a is provided with mounting holes 52c communicating with the mounting holes 13' of the base portion 10'.

[0175] The heat sink 52 b is formed in a substantially inverted L-shape integrally having a side wall portion 52 b 1 and a top wall portion 52 b 2 in substantially the same manner as the heat sink 30 of the above-described heat sink 5 .

[0176] A gap c through which air can flow is ensured between the top wall portion 32 ′ of the first heat sink 51 and the top wall portion 52 b 2 of the second heat sink 52 .

[0177] In the heat sink 50 of the above structure, a flow passage for air from the opening portion B to the slit portion 32a' can be formed in the gap c and the second heat sink 52, and a wider heat dissipation area can be ensured by the two heat sinks 51 and 52. Furthermore, good heat dissipation performance can be obtained by the space-saving and lightweight structure without fins protruding to the outside.

[0178] In addition, the second heat sink 52 only needs to be integrated with the first heat sink 51 in advance by welding or the like. As another example, the second heat sink 52 may be assembled to the first heat sink 51 as necessary.

[0179] Furthermore, in the above embodiment, the base portion 52a of the second heat sink 52 is in contact with the base portion 10' of the first heat sink 51, but as another example, a gap may be provided between the base portions 52a and 10'. In this case, the side wall portion 52b1 of the second heat sink 52 may be connected to the side wall portion 31 of the first heat sink 51 by welding or the like.

[0180] Furthermore, the first heat sink 51 and the second heat sink 52 of the heat sink 50 can be similarly configured as in the heat sinks 7 to 8 described above (see Figure 15 to Figure 17 ) The through portion 32b', the vent hole 33', the flange portion 34', the protrusion 37', the vent portion 31a, etc. are appropriately arranged.

[0181] In addition, the present invention is not limited to the above-described embodiment, and can be appropriately modified within the scope of the present invention.

[0182] Explanation of symbols

[0183] 1, 2, 3, 4, 5, 6, 7, 8, 9, 50: Radiator

[0184] 10, 10': base

[0185] 11: Electronic component contact surface

[0186] 12: Heat dissipation surface

[0187] 13': Mounting hole

[0188] 30: Heat sink

[0189] 31: Side wall

[0190] 32, 32': Top wall part

[0191] 32a, 32a': Slit portion

[0192] 32b, 32b': penetration

[0193] 33, 33', 35: Ventilation holes

[0194] 34, 34', 36: flange

[0195] 37, 37': protrusion

[0196] 51: First Radiator

[0197] 52: Second radiator

[0198] 52a: Base

[0199] 52b: Heat sink

[0200] A: Airway

[0201] B: Opening

[0202] S1: External space

[0203] S2: Inner Space

Claims

1. A radiator, characterized in that: The invention comprises: a base part, one side of which is used as an electronic component contact surface and the opposite side of which is used as a heat dissipation surface; and two heat sinks, which are arranged at one end side and the other end side of the base part in a direction in which the heat dissipation surface is continuous. Each of the two heat sinks has a side wall portion protruding from the heat sink surface; and a top wall portion protruding from the protruding end side of the side wall portion toward the other heat sink and ensuring an internal space between the top wall portion and the heat sink surface. The two top walls are separated by ensuring an air passage connecting the inner space and the outer space therebetween. The air passage includes a slit portion between the two top wall portions, The air passage includes a through portion which is in the shape of a through hole spanning the two top wall portions and has a width greater than that of the slit portion.

2. The heat sink according to claim 1, characterized in that: At least one of the two top wall portions is provided with a vent hole penetrating the top wall portion in a thickness direction.

3. The heat sink according to claim 2, characterized in that: A flange portion protruding toward the external space is provided on the inner edge side of the vent hole.

4. The heat sink according to claim 2, characterized in that: A flange portion protruding toward the internal space is provided on the inner edge side of the vent hole.

5. The heat sink according to claim 3, characterized in that: A plurality of the vent holes and the flange portions are provided on each of the top wall portions, and two adjacent flange portions are arranged with a gap therebetween.

6. The heat sink according to claim 4, characterized in that: A plurality of the vent holes and the flange portions are provided on each of the top wall portions, and two adjacent flange portions are arranged with a gap therebetween.

7. The heat sink according to claim 3, characterized in that: A plurality of the vent holes and the flange portions are provided on each of the top wall portions, and two adjacent flange portions share a wall portion located therebetween to form an integral body.

8. The heat sink according to claim 4, characterized in that: A plurality of the vent holes and the flange portions are provided on each of the top wall portions, and two adjacent flange portions share a wall portion located therebetween to form an integral body.

9. The heat sink according to claim 1, characterized in that: A plurality of protrusions protruding toward the external space are provided on at least one of the two top wall portions, and each of the protrusions is formed in a bottomed cylindrical shape having a bottom on a side opposite to a base portion side.

10. The heat sink according to claim 1, characterized in that At least one of the two top wall portions is provided with a plurality of protrusions protruding toward the internal space, and each of the protrusions is formed in a bottomed cylindrical shape having a bottom on a base portion side.

11. The heat sink according to claim 1, characterized in that A through-shaped mounting hole is provided on the base. The mounting hole is arranged within the range of the air passage when viewed from above.

12. The heat sink according to claim 1, characterized in that The top wall portion of one of the two heat sinks and the top wall portion of the other heat sink are formed into a triangular shape with oblique sides facing each other, and the air passage is ensured between the two opposing oblique sides.

13. The heat sink according to claim 1, characterized in that The side wall portion is provided with a penetrating vent portion.

14. A radiator, which is obtained by using the radiator according to claim 1 as a first radiator and arranging a second radiator in the inner space of the first radiator, wherein the radiator is characterized in that: The second heat sink has a base portion and two heat sinks having the same structures as those of the base portion and the two heat sinks.

15. An electronic component package using the heat sink according to claim 1, wherein: The electronic component is supported in contact with the electronic component contact surface.

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