Substrate processing device and substrate processing method

Abstract

The present invention provides a substrate processing device and a substrate processing method. A technology is provided that can reduce the floor space occupied by the substrate processing device. For a substrate processing device including a processing module provided with a plurality of liquid processing components that respectively perform liquid processing on substrates, a substrate conveying module is provided on the left side of the processing module. The substrate conveying module includes a container loading portion for loading containers for accommodating a plurality of substrates and a first conveying mechanism for delivering substrates relative to the container. In addition, a conveying path for substrates extending left and right and a second conveying mechanism for moving on the conveying path and conveying substrates to the liquid processing components are provided in the processing module. Furthermore, a second processing component is provided in the processing module in a manner protruding forward relative to the conveying path, and a third conveying mechanism is provided for delivering the substrates relative to the second processing component.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. Background Art

[0002] Photolithography is one of the steps in the manufacturing process of semiconductor devices. In this process, a semiconductor wafer (hereinafter referred to as a wafer) serving as a substrate is coated with a resist to form a resist film, and a developer is supplied to develop the exposed resist film. For example, Patent Document 1 describes a substrate processing apparatus that performs such resist film formation and development.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-4072 Summary of the Invention

[0006] Problems to be solved by the invention

[0007] The present disclosure provides a technology capable of reducing the footprint of a substrate processing apparatus.

[0008] Solutions for solving problems

[0009] The substrate processing apparatus disclosed herein includes a processing module provided with a plurality of liquid processing assemblies for performing liquid processing on a substrate, and the substrate processing apparatus comprises:

[0010] a substrate conveying module including a container placement portion for placing a container for accommodating a plurality of the substrates and a first conveying mechanism for transferring the substrates to and from the container, the substrate conveying module being disposed on one of the left and right sides of the processing module;

[0011] The substrate conveying path extends left and right along the processing module;

[0012] a plurality of layers, each of which constitutes the processing module in such a manner that the liquid processing components are arranged in a longitudinal direction on one side of the front and rear sides relative to the conveying path, and each includes the liquid processing component;

[0013] a first processing module disposed in plurality in the longitudinal direction on the other of the front and rear sides with respect to the transport path, and processing the substrate before or after the processing by the liquid processing module;

[0014] a second transport mechanism that moves along the transport path and transports the substrate between the liquid processing module and the first processing module;

[0015] a second processing assembly disposed above a conveying area of ​​the substrate conveying module to which the substrate is conveyed by the first conveying mechanism, with a front-to-rear length longer than a left-to-right length, or disposed so as to protrude from the conveying path in one or both of the front and rear directions, and performing a process on the substrate that is different from the process performed by the first processing assembly;

[0016] a third transport mechanism for delivering the substrate to the second processing module; and

[0017] The transfer portion is provided on one side of the conveying path, on which the substrate is placed, and is used to transfer the substrate between the first conveying mechanism, the second conveying mechanism, and the third conveying mechanism.

[0018] In the above substrate processing apparatus, the second processing module may be provided so as to protrude from the transport path toward one or the other of a front and a rear portion relative to the transport path and overlap with the interface.

[0019] In the above substrate processing apparatus, the third transport mechanism may be provided on a side of the transport path opposite to a side from which the second processing module protrudes.

[0020] In the substrate processing apparatus described above, the second processing module may protrude from the transport path on one side between front and back, and the third transport mechanism may be provided on the other side between front and back with respect to the transport path.

[0021] In the substrate processing apparatus described above, the interface may include a plurality of substrate placement portions arranged in a row in the longitudinal direction and each placement receiving the substrate, and the second processing module may be provided between one substrate placement portion and another substrate placement portion.

[0022] In the substrate processing apparatus described above, a portion of the second processing module protruding from the transport path may overlap with a storage area for storing a processing liquid in a plan view, and the processing liquid may be supplied to the substrate in each of the liquid processing modules.

[0023] For the above-mentioned substrate processing device, it can also be that the transfer portion includes a plurality of substrate loading portions arranged in a longitudinal direction and respectively loading the substrates, and the third conveying mechanism includes: a protruding side conveying mechanism, which is arranged overlapping with the second processing component on the side of the second processing component protruding relative to the conveying path; and a non-protruding side conveying mechanism, which is arranged on the side opposite to the protruding side relative to the conveying path, the non-protruding side conveying mechanism conveys the substrate between the second processing component and the substrate loading portion, and the protruding side conveying mechanism conveys the substrate between each substrate loading portion.

[0024] For the above-mentioned substrate processing device, it may also be that the second processing component includes an upper second processing component and a lower second processing component arranged in the longitudinal direction, the protruding side conveying mechanism is arranged between the upper second processing component and the lower second processing component, and the non-protruding side conveying mechanism includes an upper non-protruding side conveying mechanism for handing over the substrate relative to the upper second processing component and a lower non-protruding side conveying mechanism for handing over the substrate relative to the lower second processing component.

[0025] For the above-mentioned substrate processing device, the second conveying mechanism may also include: a lower conveying mechanism, which delivers the substrate relative to the liquid processing component of the lower layer segment among the multiple layers and the first processing component at the height of the lower layer segment; and an upper conveying mechanism, which delivers the substrate relative to the liquid processing component of the upper layer segment among the multiple layers and the first processing component at the height of the upper layer segment.

[0026] For the above-mentioned substrate processing device, the lower layer segment and the upper layer segment may be respectively composed of multiple layers, and the intersection portion is respectively arranged at the height of the uppermost layer segment among the layers for conveying the substrate by the lower conveying mechanism, and the height of the lowermost layer segment among the layers for conveying the substrate by the upper conveying mechanism.

[0027] In the above substrate processing apparatus, the lower stage and the upper stage may each be composed of three stages.

[0028] In the above substrate processing apparatus, the second processing module may be an inspection module for inspecting the substrate before or after processing by the liquid processing module and the first processing module.

[0029] In the above substrate processing apparatus, the liquid processing assembly of each stage may include only one cup for surrounding the substrate to perform processing.

[0030] In the above substrate processing apparatus, the interface may have a temperature adjustment function for adjusting the temperature of the substrate before processing by the liquid processing module and the first processing module.

[0031] In the above substrate processing apparatus, the first processing module may be a thermal processing module for heating the substrate.

[0032] The substrate processing apparatus may include a plurality of first processing modules that are provided across two adjacent stages.

[0033] The substrate processing method disclosed herein is a substrate processing method using a substrate processing device, which includes a processing module provided with a plurality of liquid processing components that respectively perform liquid processing on the substrates. The substrate processing method comprises the following steps: a step of placing a container for accommodating a plurality of the substrates on a container loading portion provided on a substrate conveying module, wherein the substrate conveying module is provided on one of the left and right sides relative to the processing module; a step of transferring the substrates to the containers by using a first conveying mechanism provided on the substrate conveying module; a step of respectively processing the substrates in the plurality of liquid processing components, wherein the plurality of liquid processing components are respectively included in a layer section constituting the processing module and are arranged in a longitudinal row on one of the front and rear sides of a conveying path for the substrates extending left and right relative to the processing module; a step of processing the substrates in the first processing component before or after processing by the liquid processing component. 1. A process according to claim 1, wherein a plurality of first processing components are arranged in the longitudinal direction on the other of the front and rear sides relative to the conveying path; a process of conveying the substrate between the liquid processing component and the first processing component by using a second conveying mechanism moving on the conveying path; a process of performing a process on the substrate different from the process performed by the first processing component by using the second processing component, the second processing component being arranged above the conveying area of ​​the substrate conveying module for conveying the substrate by using the first conveying mechanism in a manner that the front-to-rear length is longer than the left-to-right length, or being arranged so as to protrude from one or the other of the front and rear sides of the conveying path; a process of handing over the substrate relative to the second processing component by using a third conveying mechanism; and a process of placing the substrate on a handover portion provided on one of the left and right sides of the conveying path in order to hand over the substrate between the first conveying mechanism, the second conveying mechanism and the third conveying mechanism.

[0034] Effects of the Invention

[0035] According to the present disclosure, it is possible to reduce the footprint of a substrate processing apparatus. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a cross-sectional plan view of a substrate processing apparatus according to one embodiment of the present disclosure.

[0037] Figure 2 It is a longitudinal sectional front view of the substrate processing apparatus.

[0038] Figure 3 It is a longitudinal sectional side view of the substrate processing apparatus.

[0039] Figure 4 It is a longitudinal sectional side view of the substrate processing apparatus.

[0040] Figure 5It is a longitudinal sectional side view showing an example of an inspection module provided in the substrate processing apparatus.

[0041] Figure 6 This is a schematic diagram of a substrate conveyance path in the substrate processing apparatus.

[0042] Figure 7 It is a longitudinal sectional side view schematically showing another example of the substrate processing apparatus.

[0043] Figure 8 It is a cross-sectional plan view of a substrate processing apparatus according to another embodiment of the present disclosure.

[0044] Figure 9 It is a longitudinal sectional side view of the substrate processing apparatus.

[0045] Figure 10 It is a longitudinal sectional side view of the substrate processing apparatus.

[0046] Figure 11 It is a cross-sectional plan view of a substrate processing apparatus according to yet another embodiment of the present disclosure.

[0047] Figure 12 It is a longitudinal sectional side view of the substrate processing apparatus.

[0048] Figure 13 This is a schematic diagram of a substrate conveyance path in the substrate processing apparatus.

[0049] Figure 14 It is a cross-sectional plan view of a substrate processing apparatus according to still another embodiment of the present disclosure. DETAILED DESCRIPTION

[0050] (First embodiment)

[0051] Reference Figure 1 Cross-sectional top view, Figure 2 The longitudinal section view of Figure 3 and Figure 4 The first embodiment of the substrate processing apparatus disclosed herein is described using a longitudinal sectional side view. The substrate processing apparatus 1 is located, for example, in a clean room of a semiconductor manufacturing facility, and performs a resist liquid coating process on wafers W as a liquid process. The substrate processing apparatus 1 is constructed by arranging a carrier module D1 and a processing module D2 in a row in the horizontal direction (left-right direction) and connecting them to each other. The bottom heights of the carrier module D1 and the processing module D2 are aligned. The carrier module D1 forms a substrate transport module.

[0052] In the following description, the carrier module D1 is viewed on the left and the processing module D2 is viewed on the right, and the arrangement direction of these modules D1 and D2 is set to the left-right direction. In addition, with respect to the front-back direction of the device, the front side when viewed with the carrier module D1 on the left is set to the front, and the back side is set to the back. In each figure, among the mutually orthogonal X-direction, Y-direction, and Z-direction, the X-direction represents the front-back direction, the Y-direction represents the left-right direction, and the Z-direction represents the height direction. In addition, Figure 3 and Figure 4 A longitudinal cross-sectional side view of the substrate processing apparatus 1 is shown, but longitudinal cross-sections taken along different left and right positions of a part of the apparatus are shown.

[0053] The carrier module D1 transports a container containing multiple wafers W using an external transport mechanism (not shown) located outside the substrate processing apparatus 1 and serves to transfer the wafers W between the container and the interior of the substrate processing apparatus 1. For example, a carrier C called a FOUP (Front Opening Unify Pod) is used as the container. The right side of the housing 11 that constitutes the carrier module D1 protrudes upward, higher than the left side, creating a step when viewed from the front. The left and right sides of the housing 11 thus constructed are designated as a lower portion 12 and a higher portion 13, respectively.

[0054] The lower portion 12 serves as a container placement area for placing carriers C. Four carrier stages 14 are arranged on its upper surface at intervals in the front-to-back direction. Carriers C are placed on these carrier stages 14 to transport wafers W into and out of the substrate processing apparatus 1. A higher portion 13 is formed in the housing 11, and a transfer port 15 for wafers W is opened on the left sidewall at a position corresponding to the carrier stages 14. This transfer port 15 is opened and closed by an opening and closing mechanism 16.

[0055] Inside the housing 11, the upper portion 13 is provided with a first conveying mechanism 17 for transferring wafers W between the carrier C on the carrier stage 14 and the processing module D2. This first conveying mechanism 17 includes a movable body 171 that is movable in the front-to-back direction (X direction), rotatable about a vertical axis, and capable of being raised and lowered; and a holding body 172 that allows the movable body 171 to move forward and backward and holds the wafers W.

[0056] A fan filter unit (FFU) 18 is provided above the conveying area 10 of the first conveying mechanism 17 in the high body 13. The fan filter unit 18 is configured to suck the air around the substrate processing device 1 through a suction path not shown in the figure, purify the air through a filter and supply it downward, thereby forming a downward airflow (downflow). The above-mentioned filter constituting the fan filter unit 18 is arranged across the entire moving area of ​​the first conveying mechanism 17 in the carrier module D1 when viewed from above, and a downward airflow is formed in the entire moving area. For example, the air that forms the downward airflow is removed from the exhaust port not shown in the figure at the bottom of the shell 11. In addition, a downflow is also formed in various parts such as the conveying path of the processing module D2, but the illustration of the mechanism that forms the downflow is omitted.

[0057] Next, the processing module D2 is described. The processing module D2 is composed of a square housing 21, and a conveying path 20 for wafers W extending left and right is provided in the center in the front-back direction when viewed from above. The conveying path 20 is an area where the wafers W are conveyed by the second conveying mechanism described later. Figure 1 As shown, the housing 21 of the process module D2 is formed to extend from the left end to the right end in the left-right direction.

[0058] The processing module D2 is provided with a liquid processing unit, namely a resist coating unit 3, which supplies a resist liquid as a processing liquid (i.e., coats the resist) to the wafer W to form a resist film. In this example, the resist coating unit 3 is provided in front of the conveying path 20 and faces the conveying path 20. Figure 2 and Figure 3 As shown, the process module D2 is constructed by stacking a plurality of layers, each of which includes a resist coating assembly 3 .

[0059] In this example, the processing module D2 has six layers E1 to E6, and each layer E1 to E6 is provided with a resist coating unit 3. Figure 2 As shown, when the process module D2 is viewed from the front, the resist coating units 3 are arranged in a row in the vertical direction, and the left and right upper positions of the resist coating units 3 are aligned. Figure 1 It is a cross-sectional top view showing the layer section E6 of the process module D2, but for the carrier module D1, a cross-sectional top view of the lower position of the fan filter unit 18 is shown.

[0060] The resist coating module 3 includes a partition wall 31 that partitions the module from the area adjacent to the transport path 20 and the liquid processing module. A transport port (not shown) for the wafer W is formed on the partition wall 31 facing the transport path 20. Figure 1 and Figure 2As schematically shown, the resist coating unit 3 includes only one cup 32 for surrounding the wafer W and processing it. A rotary chuck 33 is provided in the cup 32 for sucking and holding the back side of the wafer W and rotating it. In addition, the resist coating unit 3 includes a nozzle 34 for spraying resist liquid onto the surface of the wafer W. The nozzle 34 is configured to move on the wafer W in the cup 32 by a moving mechanism 35. Figure 1 The cup 32 is shown as being movable between the standby positions outside thereof.

[0061] Moreover, if Figure 1 As shown, behind the conveying path 20 of the processing module D2, a plurality of, for example, three, first processing components, namely, heat treatment components 4 are arranged left and right in a manner facing the conveying path 20. Figure 3 As shown, in this example, the heat treatment assemblies 4 are arranged in each of the sections E1 to E6. Therefore, when viewing process module D2 from the rear, the heat treatment assemblies 4 are arranged in multiple layers, for example, six layers, in the longitudinal direction. Thus, in process module D2, for example, the heat treatment assemblies 4 are arranged in three rows along the left and right sides, and the left and right upper positions of the heat treatment assemblies 4 that constitute the same row within these three rows are aligned.

[0062] The heat treatment module 4 in this example is a module for performing a heat treatment (PAB: Pre-applied bake, pre-bake) on the wafer W after the resist film is formed. In the heat treatment module 4, the wafer W with the resist film formed thereon is heated to remove the solvent in the resist film. Figure 1 As schematically shown, for example, the heat treatment module 4 includes a hot plate 42 for heating the wafer W and a cooling plate 43 for adjusting the temperature of the wafer W. The hot plate 42 and the cooling plate 43 are arranged in a front-to-back arrangement with the cooling plate 43 facing the conveyance path 20. The cooling plate 43 is configured to convey the wafer W between a second conveyance mechanism described later and the hot plate 42.

[0063] A second conveyor mechanism 5 is provided in the processing module D2. This second conveyor mechanism 5 moves along the conveyance path 20 to convey wafers W between the resist coating module 3 and the thermal treatment module 4. The second conveyor mechanism 5 in this example includes a lower conveyor mechanism 51 and an upper conveyor mechanism 52. The lower conveyor mechanism 51 is configured to convey wafers W to the resist coating module 3 and the thermal treatment module 4 in the lower section. Furthermore, the upper conveyor mechanism 52 is configured to convey wafers W to the resist coating module 3 and the thermal treatment module 4 in the upper section. The lower and upper sections are each composed of a plurality of sections. In this example, the lower section consists of three sections E1 to E3, and the upper section consists of three sections E4 to E6.

[0064] like Figure 1 and Figure 3As shown, the second conveying mechanism 5 (the lower conveying mechanism 51 and the upper conveying mechanism 52) includes two holding bodies 53 that respectively hold the wafer W, and a movable body 54 that independently moves the holding bodies 53 forward and backward. Furthermore, the movable body 54 is configured so that it can rotate about a vertical axis using a rotating portion 55, and the rotating portion 55 can be raised and lowered using a lifting portion 56, and the lifting portion 56 can be moved in the left-right direction (Y direction) using a moving mechanism 57. For example, the holding bodies 53, the movable body 54, the rotating portion 55, and the lifting portion 56 are provided on the conveying path 20, and the moving mechanism 57 is disposed below the thermal treatment module 4. Furthermore, the first conveying mechanism 17 of the carrier module D1 described above is configured similarly to the second conveying mechanism 5, except that the moving direction of the moving mechanism 57 is different.

[0065] Furthermore, the processing module D2 is provided with a second processing module and a third conveying mechanism for transferring wafers W to and from the second processing module. The second processing module is a module that performs a process on the wafers W that is different from the process performed by the first processing module (heat treatment module 4). In this example, the second processing module is an inspection module 6 for inspecting the wafers W before processing by the resist coating module 3 and after processing by the heat treatment module 4. The inspection module for inspecting the wafers W before processing by the resist coating module 3 is referred to as the pre-processing inspection module 61 (WIS1), and the inspection module for inspecting the wafers W after processing by the heat treatment module 4 is referred to as the post-processing inspection module 62 (WIS2).

[0066] These pre-processing inspection components 61 and post-processing inspection components 62 are arranged in a manner protruding forward from the conveying path 20 in the processing module D2, for example. In this example, these inspection components 6 (61, 62) are stacked up and down at the height position of the layer E6 in the area adjacent to the carrier module D1 on the conveying path 20. The pre-processing inspection components 61 and the post-processing inspection components 62 have a longitudinal shell 63 that is rectangular in shape when viewed from above, as described later, and the long side direction of the shell 63 is arranged along the front-to-back direction (X direction) of the processing module D2. In addition, the pre-processing inspection components 61 and the post-processing inspection components 62 are arranged in a manner such that the front surface of the shell 63 protrudes from the front of the conveying path 20 to form a protruding portion (protrusion) 60, and the back surface of the shell 63 faces the area behind the conveying path. The protrusion 60 is located in a position parallel to the cup 32, for example, the front end of the protrusion 60 is located slightly forward of the center of the cup 32.

[0067] In processing module D2, in order to transport wafers W to inspection module 6 (61, 62), third transport mechanism 7 is provided, for example, on the side of transport path 20 opposite to the side from which inspection module 6 (61, 62) protrudes. In this example, inspection module 6 (61, 62) protrudes forward from transport path 20, so third transport mechanism 7 is positioned behind transport path 20 in an area adjacent to carrier module D1. Thus, third transport mechanism 7 and thermal treatment module 4 are arranged in sequence behind transport path 20, starting from carrier module D1.

[0068] like Figure 1 and Figure 4 As shown, the third transport mechanism 7 is constructed similarly to the second transport mechanism 5 except that the moving mechanism 57 is not provided. Specifically, the two holding bodies 71 each holding the wafer W are movable forward and backward by a movable body 72, the movable body 72 is movable by a rotating portion 73, and the rotating portion 73 is movable upward and downward by a lifting portion 74.

[0069] Reference Figure 5 The inspection assembly 6 (pre-processing inspection assembly 61 and post-processing inspection assembly 62) is described. The inspection assembly 6 has a flat housing 63 that is rectangular in shape when viewed from above. If the long side direction of the housing 63 is set as the front-to-back direction, a wafer W conveying port 631 is formed on the rear side wall of the housing 63 at a position corresponding to the third conveying mechanism 7. A loading portion 64 for holding the wafer W horizontally is provided in the housing 63. The loading portion 64 is configured to be placed in the housing 63 at a position corresponding to the third conveying mechanism 7. Figure 5 The mounting portion 64 is movable between a standby position indicated by a solid line and a movement completion position indicated by a dashed line by a moving mechanism 641. The standby position is where wafers W are transferred to and from the third transport mechanism 7. The mounting portion 64 moves in the longitudinal direction of the housing 63 (i.e., the front-to-back direction).

[0070] Inside the housing 63 , above the path of movement of the wafer W by the placement unit 64 , there are provided a horizontally long half mirror 65 extending in the short side direction of the housing 63 and an illuminator 66 for irradiating light downward via the half mirror 65 . Figure 5 Reference numeral 67 denotes a camera. Light is irradiated from the illumination 66 toward the illumination area below the half mirror 65. The half mirror 65 reflects the reflected light from the object in the illumination area and enters the camera 67. In this manner, the camera 67 is configured to capture an image of an object in the capture area below the half mirror 65.

[0071] In the inspection component 6, while the loading portion 64 that receives the wafer W at the standby position moves toward the movement completion position, the camera 67 is intermittently photographed to capture the entire surface of the wafer W and obtain image data. The image data is sent from the camera 67 to the control unit 100 described later, and the control unit 100 inspects the surface of the wafer W based on the image data. In addition, the loading portion 64 that has moved to the movement completion position moves to the standby position in order to receive the wafer W relative to the third conveying mechanism 7. The wafer W at the above-mentioned movement completion position is located in front of the wafer W that is moved on the conveying path 20 by the second conveying mechanism 5. In other words, the processing component protrudes from the conveying path 20 to one or the other of the front and rear of the conveying path 20, and the moving area of ​​the processing component including the wafer W protrudes forward or backward relative to the conveying path 20.

[0072] The inspection assembly 6 and the third conveying mechanism 7 are arranged in a positional relationship such that the inspection assembly 6 can convey the wafer W to the placement unit 64 located in the standby position by the third conveying mechanism 7. Therefore, in the processing module D2, in the absence of any constraints such as walls, the back side (rear side wall) of the housing 63 of the inspection assembly 6 can be located behind the conveying path 20, and the back side of the housing 63 can also be located forward of the rear end of the conveying path 20.

[0073] On the left side of the transport path 20 of the processing module D2, in a plan view, the area adjacent to the carrier module D1 is provided as an area 80 where the interface 8 is located. The interface 8 is used to place wafers W and to transfer wafers W between the first transport mechanism 17, the second transport mechanism 5 (the lower transport mechanism 51 and the upper transport mechanism 52), and the third transport mechanism 7. In this example, the interface 8 includes a plurality of substrate placement sections arranged in a longitudinal direction and each of which places wafers W, such as Figure 2 and Figure 4 As shown, the interface 8 is provided below the inspection assembly 6 (61, 62).

[0074] like Figure 4 As shown, for example, the delivery portion 8 is disposed at the height of the segments E2 to E5. However, the delivery portion 8 may be disposed at the height of at least the uppermost segment E3 among the segments to which the wafer W is conveyed by the lower conveying mechanism 51, and the lowermost segment E4 among the segments to which the wafer W is conveyed by the upper conveying mechanism 52.

[0075] The substrate mounting unit in this example includes a mounting assembly (TRS) 81 for mounting wafers W and a temperature control assembly (SCPL) 82. Multiple mounting assemblies 81 and temperature control assemblies 82 are stacked in multiple layers. For example, a single mounting assembly 81 is configured to be able to mount multiple wafers W in the vertical direction. Furthermore, the temperature control assembly 82 has a temperature control function for adjusting the temperature of the wafers W prior to processing in the resist coating assembly 3 and the thermal treatment assembly 4.

[0076] Specifically, the mounting assembly (TRS) 81 and the temperature control assembly (SCPL) 82 are configured, for example, by placing a plate on which wafers W are mounted in multiple layers. For example, by configuring the plate's outer shape to correspond to the shape of the conveyor mechanism, or by forming grooves on the plate's surface corresponding to the shape of the conveyor mechanism, each conveyor mechanism can be raised and lowered relative to the plate's surface. Furthermore, the raising and lowering of the conveyor mechanism allows wafers W to be transferred between the conveyor mechanism and the plate.

[0077] In addition, the temperature adjustment component 82 is configured to provide a refrigerant flow path on the plate to cool the plate to the desired temperature. Moreover, the loading component 81 can also be configured as follows: a plurality of pins arranged in the horizontal direction are provided in multiple layers, the conveying mechanism is raised and lowered relative to the pins of each layer, and the wafer W is respectively loaded relative to the pins of each layer. Here, in order to distinguish between the loading component 81 and the temperature adjustment component 82 provided at the junction 8, numbers are added after TRS and SCPL respectively to indicate them. In addition, below, there are also cases where the loading component is recorded as "TRS" and the temperature adjustment component is recorded as "SCPL".

[0078] The first conveyor mechanism 17, the lower conveyor mechanism 51, and the third conveyor mechanism 7 convey wafers W to each component located at the height of the sections E2 and E3 of the interface 8. Furthermore, the first conveyor mechanism 17, the upper conveyor mechanism 52, and the third conveyor mechanism 7 convey wafers W to each component located at the height of the sections E4 and E5 of the interface 8. Therefore, the first conveyor mechanism 17, the lower conveyor mechanism 51, the upper conveyor mechanism 52, and the third conveyor mechanism 7 are each set with a movement range so that wafers W can be conveyed to the components corresponding to the interface 8.

[0079] On the other hand, the first conveyor mechanism 17 and the second conveyor mechanism 5 deliver the wafer W from the left-right direction relative to the substrate placement portion, and the third conveyor mechanism 7 delivers the wafer W from the front-back direction relative to the substrate placement portion of the delivery portion 8. Therefore, the delivery portion 8 is configured to enable the first conveyor mechanism 17, the second conveyor mechanism 5, and the third conveyor mechanism 7 to transport the wafer W.

[0080] exist Figure 4, an example of the structure of the interface 8 is shown. In this example, TRS1 and TRS3 are loading assemblies 81 for transporting wafers W from the carrier module D1 to the processing module D2, and TRS2 and TRS4 are loading assemblies 81 for transporting wafers W from the processing module D2 to the carrier module D1. For example, TRS1, TRS2, SCPL1, and SCPL2 are located at a height position where wafers W are transported by the lower conveying mechanism 51. In addition, TRS3, TRS4, ​​SCPL3, and SCPL4 are located at a height position where wafers W are transported by the upper conveying mechanism 52. In addition, in reality, more loading assemblies (TRS) 81 and temperature adjustment assemblies 82 (SCPL) are installed in the interface 8 than in the above example.

[0081] In this example, the area on the left side of the resist coating assembly 3 in front of the transport path 20 of the process module D2 is as shown in FIG. Figure 1 As shown in FIG. 2 , a storage area 22 is provided. In the storage area 22, bottles storing resist liquid to be supplied to the wafer W by each resist coating assembly 3 are arranged, and the resist liquid in the bottles is supplied to the nozzles 34 of each resist coating assembly 3 via a supply system (not shown). Figure 2 and Figure 4 As shown, in the inspection unit 6 , the protruding portion 60 that protrudes forward from the conveying path 20 overlaps with the storage area 22 in a plan view.

[0082] Furthermore, the area to the right of the resist coating assembly 3, in front of the transport path 20, serves as an additional equipment installation area 36 for the resist coating assembly 3. This additional equipment includes cables for supplying power to the assembly, exhaust ducts for exhausting the interior of the cup 32 that constitutes the assembly, a drain pipe for draining liquid from the assembly, and a supply pipe for supplying process liquid to the assembly. The cup 32 is connected to an exhaust source, such as the factory's exhaust system, via the exhaust duct to exhaust the interior of the cup 32. Furthermore, the drain pipe, serving as additional equipment, is also connected to the cup 32.

[0083] Furthermore, the area in process module D2 extending from the right side of third conveyor mechanism 7 to the rear of third conveyor mechanism 7 constitutes, for example, an additional equipment installation area 44 for heat treatment assembly 4. This additional equipment includes cables for supplying power to the assembly and exhaust ducts for exhausting air from the assembly. Furthermore, above fan filter unit 18 of carrier module D1, for example, an equipment installation area 23 is configured for various power equipment (electrical equipment).

[0084] Sections E2 to E5 of process module D2 are constructed similarly to section E6, except that a transfer unit 8 is provided in place of inspection module 6. Furthermore, section E1 is constructed similarly to section E6, except that inspection module 6 and transfer unit 8 are not provided. As already described, wafers W are transported to the components located in sections E1 to E3 using the lower conveyor mechanism 51. As already described, wafers W are transported to the components located in sections E4 to E6 using the upper conveyor mechanism 52. Furthermore, the components serving as the locations for wafers W to be placed include the TRSs, SCPLs, resist coating module 3, and thermal treatment module 4 at the transfer unit 8.

[0085] The substrate processing apparatus 1 includes a control unit 100 (see Figure 1 The control unit 100 is comprised of a computer and includes a program, memory, and a CPU. The program includes a set of steps to implement a series of operations of the substrate processing apparatus 1. Furthermore, based on the program, the control unit 100 outputs control signals to various components of the substrate processing apparatus 1 to control the operation of these components and implement the transport and processing of the wafer W described later. The program is stored on a storage medium such as an optical disk, hard disk, or DVD and is loaded into the control unit 100.

[0086] Next, an example of the transport path for wafers W in substrate processing apparatus 1 will be described, using the case where wafers W are inspected in pre-processing inspection module 61 and post-processing inspection module 62. First, a carrier C containing multiple wafers W is placed on container loading section (lower section) 12 of carrier module D1 using an external transport mechanism (not shown). Next, the wafers W in carrier C are transferred to TRS1 or TRS3 of transfer section 8 of processing module D2 using first transport mechanism 17.

[0087] The wafer W transported to TRS1 (hereinafter referred to as "wafer W1") is a wafer to be processed in the lower sections E1 to E3. On the other hand, the wafer W transported to TRS3 (hereinafter referred to as "wafer W2") is a wafer to be processed in the upper sections E4 to E6. Figure 6 .exist Figure 6 In FIG, the conveyance paths of wafers W1 and W2 are indicated by dashed-dotted arrows and double-dashed-dotted arrows, respectively. In addition, the circular frame near each arrow indicates a conveyance mechanism used for conveyance between the components indicated by the arrow.

[0088] The wafer W1 of TRS1 is transported to the pre-processing inspection assembly 61 by the third transport mechanism 7, and the surface of the wafer W1 is inspected as described above. The surface inspection at the pre-processing inspection assembly 61 refers to, for example, an inspection of the wafer W1 for scratches. Then, the inspected wafer W1 is transported from the third transport mechanism 7 to the SCPL1 of the transfer section 8 and adjusted to the desired temperature. Next, the wafer W1 is transported to any of the resist coating assemblies 3 in the layer sections E1, E2, and E3 by the lower transport mechanism 51, and liquid treatment with a resist liquid is performed. The liquid treatment with the resist liquid is performed by rotating the rotary chuck 33 on which the wafer W1 is mounted, and supplying a resist liquid as a processing liquid from the nozzle 34 to the rotation center of the wafer W1 on the rotary chuck 33. The resist liquid supplied to the approximate center of the wafer W1 spreads outward by the centrifugal force of the rotation and coats the entire surface of the wafer W1.

[0089] Thereafter, wafer W1 is transported by lower transport mechanism 51 to thermal treatment module 4, for example, in the same layer as resist coating module 3, where liquid treatment of the resist liquid is performed. Here, wafer W1 is transferred by lower transport mechanism 51 to hot plate 42 via cooling plate 43, and heated by hot plate 42 to a temperature above the temperature at which the solvent in the resist liquid evaporates. This thermal treatment volatilizes and removes the solvent contained in the resist film formed on wafer W1. After this, wafer W1 is transferred from hot plate 42 to cooling plate 43, where the temperature is adjusted.

[0090] Next, wafer W1 is transported to SCPL2 of the transfer unit 8 by the lower conveyor mechanism 51 and adjusted to the desired temperature. Thereafter, wafer W1 is transported to the post-processing inspection module 62 by the third conveyor mechanism 7, where the surface of wafer W is inspected as described above. Surface inspection at the post-processing inspection module 62, for example, involves inspecting for defects in the resist film formed on the wafer. The inspected wafer W is then transported along the path from the third conveyor mechanism 7 to the TRS2 of the transfer unit 8 and then to the first conveyor mechanism 17 of the carrier module D1, returning to, for example, the original carrier.

[0091] Meanwhile, wafer W2 of TRS3 is transported via the third transport mechanism 7 → pre-processing inspection module 61 and inspected as described above. Subsequently, the inspected wafer W2 is transported via the third transport mechanism 7 → SCPL3 → upper transport mechanism 52 → resist coating module 3 in any of sections E4, E5, and E6, where it undergoes liquid treatment with a resist solution. Subsequently, wafer W2 is transported via the upper transport mechanism 52 → thermal treatment module 4 in the same section as the resist coating module 3 → upper transport mechanism 52 → SCPL4 → third transport mechanism 7 → post-processing inspection module 62, where it undergoes inspection as described above. The inspected wafer W is then transported via the third transport mechanism 7 → TRS4 → first transport mechanism 17 → carrier C.

[0092] In addition, when only the inspection by the post-processing inspection module 62 is performed, the wafers W in the carrier C are transported in the order of the first transport mechanism 17 → TRS1, TRS3 of the transfer unit 8 → the second transport mechanism 51, 52 → SCPL1, SCPL3, and then, for example, by using Figure 6 When only the inspection by the pre-processing inspection module 61 is performed, the wafers W in the carrier C are transported by using Figure 6 The carrier is transported along the path described above until it reaches the heat treatment module 4. After the heat treatment module 4, it is transported along the path of the second transport mechanisms 51 and 52 → TRS2 and TRS4 → first transport mechanism 17 → carrier C. The transport path described here is only an example, and the transport path can be set as appropriate.

[0093] For example, although the case where wafer W is transferred to SCPLs 2 and 4 immediately before being transferred to the post-processing inspection module 62 is shown, the wafer W may be transferred to a TRS immediately before being transferred to the pre-processing inspection module 61, as in the case where wafer W is transferred to the pre-processing inspection module 61. In other words, a TRS for loading wafer W immediately before being transferred to the post-processing inspection module 62 may be provided at the transfer section 8. Furthermore, although the wafer W transferred from the carrier C is shown to be transferred to different TRSs (TRS1 and TRS3) at each transfer destination stage, it is also possible to transfer it to the same TRS.

[0094] According to the above embodiment, the substrate processing device 1 includes a carrier module D1 and a processing module D2, wherein the carrier module D1 has a first conveying mechanism 17, and the processing module D2 has a second conveying mechanism 5 and various processing components. In addition, the processing module D2 is provided with an inspection component 6 as one of the processing components and a third conveying mechanism 7 for conveying wafers W relative to the inspection component 6. The inspection component 6 is rectangular in shape when viewed from above. The inspection component 6 of such a shape is arranged to overlap with the interface 8 for transferring wafers W between the carrier module D1 and the processing module D2 on the conveying path 20, and protrudes forward from the conveying path 20 of the wafer W at the processing module D2 relative to the conveying path 20. In other words, the long side direction of the inspection component 6 is arranged to be consistent with the front-to-back direction of the processing module D2. Therefore, when the inspection component 6 of the above shape is provided, by suppressing the protrusion in the left-right direction relative to the intersection 8, the left-right growth of the substrate processing device 1 can be suppressed, and the increase in the floor space can be suppressed.

[0095] A structure that reduces the footprint of the substrate processing apparatus 1 disclosed herein allows for the installation of more semiconductor manufacturing equipment (including the substrate processing apparatus 1 and other equipment) within a clean room, thereby contributing to improved productivity in semiconductor factories. Furthermore, the external transport mechanism that transports the carrier C within the clean room moves along a predetermined path. The substrate processing apparatus 1 of this embodiment, with its reduced footprint, offers the advantage of being able to be installed even when space for the equipment along the path is limited.

[0096] The inspection unit 6 includes optical components such as a camera 67. However, to prevent these optical components from being affected by the heat of the heat treatment unit 4, they are preferably located away from the heat treatment unit 4. Arranging the inspection unit 6 so that it protrudes in the front-to-back direction from the conveyor path 20 also offers the advantage of avoiding the need to locate the inspection unit 6 adjacent to the heat treatment unit 4, thereby enabling stable and highly accurate inspections. Furthermore, in the example described above, the inspection unit 6 protrudes toward the side opposite the area where the heat treatment unit 4 is located, thus more reliably suppressing the aforementioned thermal effects, making this a preferred arrangement.

[0097] Furthermore, the substrate processing apparatus 1 includes a second conveyor mechanism 5 in the processing module D2 for transferring wafers W to processing modules other than the inspection module 6, and a third conveyor mechanism 7 for transferring wafers W to the inspection module 6. Consequently, the substrate processing apparatus 1 suppresses an increase in the conveying load of the second conveyor mechanism 5, thereby minimizing a decrease in conveying throughput. Furthermore, the inspection module 6 and the transfer interface 8 are stacked, and the third conveyor mechanism 7 transfers wafers W in a front-to-back direction relative to the transfer interface 8. Meanwhile, the first conveyor mechanism 17 and the second conveyor mechanism 5 transfer wafers W in a left-to-right direction relative to the transfer interface 8. Therefore, the third conveyor mechanism 7 does not obstruct the transfer of wafers W by the first conveyor mechanism 17 and the second conveyor mechanism 5.

[0098] Furthermore, the third conveyor mechanism 7 is located on the side of the conveyance path 20 opposite to the side from which the inspection unit 6 protrudes. Therefore, the third conveyor mechanism 7 can be raised and lowered between a height facing the transfer unit 8 and a height facing the inspection unit 6, thereby transferring wafers W therebetween. In other words, when transferring wafers W, the third conveyor mechanism 7 does not need to be equipped with a moving mechanism for forward and backward movement, as is required for the first conveyor mechanism 17. This is preferable due to its simple structure.

[0099] Furthermore, the bottle storage area 22 is preferably located on the front side of the apparatus, near the resist coating assembly 3, to shorten the piping connecting the bottles to the assembly's nozzles 34. In the substrate processing apparatus 1, the storage area 22 is positioned so as to overlap the protrusion 60 of the inspection assembly 6, utilizing the space above the storage area 22 located on the front side. This prevents an increase in the area occupied by the inspection assembly 6 and the storage area 22, more reliably minimizing the dedicated area of ​​the apparatus. Furthermore, a portion of the storage area 22 may reach the bottom of the carrier module D1.

[0100] Furthermore, while the description of conveying wafers W to the resist coating module 3 and then to the heat treatment module 4 in the same section as the section where the resist coating module 3 is located is provided, the conveyance destination is not limited to the heat treatment module 4 in the same section. Wafers W conveyed to the resist coating module 3 in sections E1-E3 can be conveyed to any heat treatment module 4 in sections E1-E3 that can be accessed by the lower conveyance mechanism 51. Wafers W conveyed to the resist coating module 3 in sections E4-E6 can be conveyed to any heat treatment module 4 in sections E4-E6 that can be accessed by the upper conveyance mechanism 52.

[0101] In addition, in the above example, the inspection component 6 is arranged above the intersection 8, but it can also be arranged below. It can also be arranged to divide the intersection 8 into upper and lower parts, as shown in the second embodiment described later, and the inspection component 6 is arranged between the divided intersections 8.

[0102] The second conveying mechanism provided in the processing module D2 is not limited to the above example, and may also be Figure 7 It is constructed as shown. This example is a structure in which a second conveying mechanism is provided in each two-layer segment. The second conveying mechanism is constructed in the same manner as the second conveying mechanism 5 (51, 52) already described, and is provided in three layers in the upper and lower parts of the conveying path 20. In this example, the respective moving areas are set in such a manner that the lower conveying mechanism 501 conveys wafers W to the components of the segments E1 and E2, the central conveying mechanism 502 conveys wafers W to the components of the segments E3 and E4, and the upper conveying mechanism 503 conveys wafers W to the components of the segments E5 and E6. In addition, the transfer portion 8 is provided at a height position at which the conveying mechanisms 501, 502, and 503 can convey wafers W.

[0103] (Second embodiment)

[0104] Next, refer to Figure 8 Cross-sectional top view, Figure 9 and Figure 10 A substrate processing apparatus 1A according to a second embodiment of the present disclosure will be described with reference to a longitudinal sectional side view of FIG. Figure 8 A cross-sectional top view of section E4 of process module D2 is shown. This substrate processing apparatus 1A differs from the first embodiment in that an inspection assembly 6 is provided between one substrate mounting portion and another substrate mounting portion constituting the interface, and the number of thermal processing assemblies 4 in the longitudinal and left-right directions is different. In this example, the inspection assemblies 6 (pre-processing inspection assembly 61 and post-processing inspection assembly 62) are also arranged to protrude forward from the conveyor path 20, and the third conveyor mechanism 7 is positioned behind the conveyor path 20. Furthermore, in this substrate processing apparatus 1A, the additional equipment installation area 44 is located only on the right side of the conveyor mechanism 7, behind the conveyor mechanism 7.

[0105] like Figure 10 As shown, the pre-processing inspection component 61 and the post-processing inspection component 62 are separately arranged at two positions with different heights in the setting area 80 of the interface 83 (equivalent to the interface 8 of the first embodiment). In this example, the pre-processing inspection component (WIS1) 61 is arranged at the height of the layer E3, and the post-processing inspection component (WIS2) 62 is arranged at the height of the layer E4. In addition, in the setting area 80, for example, a plurality of substrate mounting portions are arranged in the longitudinal direction in a manner that overlaps with the inspection components 6 (61, 62) when viewed from above. In this example, substrate mounting portions are respectively provided at the height between the inspection components 6 (61, 62), the height below the pre-processing inspection component 61, and the height above the post-processing inspection component 62, thereby forming the interface 83.

[0106] Figure 10 In the structural example of the handover section 83, a substrate loading section (TRS2, SCPL1, SCPL2) for handing over the wafer W to the lower conveying mechanism 51 is provided between the inspection components 61 and 62 at the height position of the layer E3. In addition, a substrate loading section (TRS1) for handing over the wafer W to the lower conveying mechanism 51 is provided below the pre-processing inspection component 61. Furthermore, a substrate loading section (TRS3, TRS4, ​​SCPL3, SCPL4) for handing over the wafer W to the upper conveying mechanism 52 is provided above the post-processing inspection component 62. In addition, as Figure 8 and Figure 10 As shown, the storage area 22 is provided below the protruding portion 60 protruding from the conveying path 20 in the inspection unit 6 ( 61 , 62 ), and these are arranged so as to overlap in a plan view.

[0107] In this example, if Figure 8 and Figure 9 As shown, the resist coating units 3 are also arranged one each in each of the six sections E1 to E6 of the process module D2, facing the conveyor path 20 in front of the conveyor path 20. Therefore, when viewing the process module D2 from the front, the resist coating units 3 are arranged in a row in the vertical direction, with the left and right upper positions of the resist coating units 3 aligned.

[0108] On the other hand, a plurality of, for example, two, heat treatment units 4 are arranged in a left-right manner behind the conveying path 20 so as to face the conveying path 20. Figure 9 As shown, the heat treatment components 4 are arranged in 8 layers in the vertical direction in the processing module D2. Like this, in the processing module D2, the heat treatment components 4 are arranged in two rows along the left and right sides, and are arranged in 8 layers, and the left and right upper positions of the heat treatment components 4 constituting the same row in the two rows are aligned.

[0109] To describe in more detail, of the eight layers of heat treatment modules 4, the four lower layers are located in segments E1 to E3, and the four upper layers are located in segments E4 to E6. Furthermore, as described above, a segment is a layer including the resist coating module 3, and in the substrate processing apparatus 1 described above, a single segment includes a single layer of heat treatment modules 4. In this example, the substrate processing apparatus 1A stacks the heat treatment modules 4 into eight layers, resulting in a difference between the height of the segments and the height of the layers formed by the heat treatment modules 4. Specifically, some heat treatment modules 4 are arranged across two adjacent segments.

[0110] The substrate processing apparatus 1A is the same as the substrate processing apparatus 1 except for the arrangement of the components and the like described above. Furthermore, the conveying path of the wafers W (W1, W2) of the substrate processing apparatus 1A is the same as that of the substrate processing apparatus 1. Therefore, when performing pre-processing inspection and post-processing inspection in the substrate processing apparatus 1A, the substrate processing apparatus 1A is used as the substrate processing apparatus 1. Figure 6 The wafer W is transported between the modules in the described order. Even when only either pre-processing inspection or post-processing inspection is performed in the substrate processing apparatus 1A, the wafer W is transported using the path described in the description of the substrate processing apparatus 1 as the path for performing only one of the inspections.

[0111] This substrate processing apparatus 1A also has the same effect as that of the substrate processing apparatus 1. In addition, as described above, the number of heat treatment components 4 arranged left and right in the substrate processing apparatus 1A is less than the number of heat treatment components 4 arranged left and right in the substrate processing apparatus 1. Therefore, for the substrate processing apparatus 1A, the apparatus can be constructed in a manner with a shorter left and right length and a smaller footprint. In the substrate processing apparatus 1A, the number of heat treatment components 4 arranged in the left and right directions is reduced in this way, and on the other hand, the number of layers arranged along the longitudinal direction of the heat treatment components 4 is increased. Therefore, it is possible to prevent stagnation of transportation from the resist coating component 3 to the heat treatment component 4, thereby ensuring throughput. In addition, in this embodiment, the inspection component 6 is arranged between the plurality of substrate mounting portions, but the inspection component 6 may be arranged at a position above each substrate mounting portion as in the first embodiment, or it may be arranged at a position below each substrate mounting portion.

[0112] (Third embodiment)

[0113] Next, refer to Figure 11 Cross-sectional top view and Figure 12 A third embodiment of the substrate processing apparatus disclosed herein will be described with reference to a longitudinal sectional front view of FIG. Figure 11 A cross-sectional top view of the layer E3 of the processing module D2 is shown. The substrate processing device 1B is a structural example in which the third conveying mechanism includes a rear-side conveying mechanism (protruding-side conveying mechanism) 91 and a front-side conveying mechanism (non-protruding-side conveying mechanism) 92. The rear-side conveying mechanism 91 is a conveying mechanism for conveying wafers W between the substrate mounting portions of the interface 84 (equivalent to the interface 8 of the first embodiment), and is provided on the rear side of the second processing component (inspection component 6) protruding relative to the conveying path 20. In addition, the front-side conveying mechanism 92 is a conveying mechanism for conveying wafers W between the inspection component 6 and the substrate mounting portion, and is provided on the side opposite to the side from which the inspection component 6 protrudes relative to the conveying path 20, that is, on the front side.

[0114] In this example, the inspection components 6 (61, 62) are arranged so as to protrude rearward from the conveying path 20 as described above. Furthermore, the pre-processing inspection component 61 corresponds to the second processing component on the lower side, and the post-processing inspection component 62 corresponds to the second processing component on the upper side, and they are arranged so as to be aligned in the longitudinal direction. The interface 84 is located in the installation area 80 on the left side of the conveying path 20, similarly to the first embodiment. Therefore, the rear-side conveying mechanism 91 is located behind the interface 84 on the conveying path 20, and the front-side conveying mechanism 92 is located in front of the interface 84 on the conveying path 20.

[0115] Furthermore, in this example, the front conveyance mechanism 92 includes a lower front conveyance mechanism 921 for receiving and delivering wafers W from the pre-processing inspection module 61, and an upper front conveyance mechanism 922 for receiving and delivering wafers W from the post-processing inspection module 62. These rear conveyance mechanism 91, lower front conveyance mechanism 921, and upper front conveyance mechanism 922 are configured similarly to the aforementioned third conveyance mechanism 7. The upper front conveyance mechanism 922 corresponds to the upper non-protruding conveyance mechanism, and the lower front conveyance mechanism 921 corresponds to the lower non-protruding conveyance mechanism.

[0116] In this example, if Figure 12 As shown, the pre-processing inspection assembly 61 is located at the height of section E2, and the post-processing inspection assembly 62 is located at the height of section E5. Between these pre-processing inspection assembly 61 and post-processing inspection assembly 62, substrate loading sections are arranged in multiple layers at the heights of sections E2 to E5, forming a junction 84. Furthermore, a rear-side transport mechanism 91 is located between the inspection assemblies 6 (61, 62), overlapping these inspection assemblies 6 (61, 62). This overlapping arrangement means that the protrusions 60 of the inspection assemblies 6 (61, 62) and a portion of the rear-side transport mechanism 91 overlap when viewed from above.

[0117] Furthermore, the board placement portion (TRS, SCPL) is provided in the interface portion 84 similarly to the first embodiment, but the reference numerals attached to the TRS are different from those in the first embodiment for convenience of explanation. Figure 12 This figure shows an example of the structure of the delivery unit 84. In this example, the lower front conveyance mechanism 921 conveys wafers W to the pre-processing inspection module 61 and the substrate mounting sections (SCPL1, SCPL2, TRS11, TRS12) of the lower sections E2 and E3. Furthermore, the upper front conveyance mechanism 922 conveys wafers W to the post-processing inspection module 62 and the substrate mounting sections (SCPL3, SCPL4, TRS13, TRS14) of the upper sections E4 and E5.

[0118] Furthermore, as already described, wafers W are transported between the substrate mounting sections of the interface 84 using the rear-side transport mechanism 91. Specifically, the rear-side transport mechanism 91 is configured to transport wafers W to each of the substrate mounting sections in the sections E2 to E5. In this example, similar to the second embodiment, the thermal processing modules 4 are arranged in two rows in the horizontal direction and eight vertically. The remaining configuration is the same as in the first embodiment.

[0119] Next, an example of the conveying path of the wafer W in this embodiment will be described, taking the case where the pre-processing inspection module 61 and the post-processing inspection module 62 are used to inspect the wafer W. In the description of the conveying path in this embodiment, the wafer W conveyed to the layers E1 to E3 is marked as W1, and the wafer W conveyed to the layers E4 to E6 is marked as W2. Figure 13 1 is a diagram schematically showing the conveyance of the rear conveying mechanism 91, the lower front conveying mechanism 921, and the upper front conveying mechanism 922 relative to the delivery portion 84 and the inspection unit 6 in the conveying path. Figure 6 Similarly, the conveying mechanism used is shown in the circle near the arrow. In order to avoid complication in the diagram, Figure 13 Only the transport path of the wafer W1 is shown.

[0120] The wafer W1 in the carrier C of the carrier module D1 is transported along the path of the first conveying mechanism 17 → TRS11 → lower front conveying mechanism 921 → pre-processing inspection component 61 → lower front conveying mechanism 921 → TRS12 → rear conveying mechanism 91 → SCPL1 → lower conveying mechanism 51 of the processing module D2 → any anti-etching coating component 3 in the layer sections E1, E2, and E3, and liquid treatment of the anti-etching liquid is performed.

[0121] Thereafter, wafer W1 is transported along the following path: lower transport mechanism 51 → thermal treatment module 4 on the same level as resist coating module 3 → lower transport mechanism 51 → SCPL 2 → rear transport mechanism 91 → TRS 13 → upper front transport mechanism 922 → post-processing inspection module 62, and inspected as described above. After inspection, wafer W is transported along the following path: upper front transport mechanism 922 → TRS 14 → first transport mechanism 17 → carrier C.

[0122] On the other hand, the wafer W2 in the carrier C of the carrier module D1 is transported in the same manner as the wafer W1 until it reaches TRS12 after passing through the pre-processing inspection component 61. Then, it is transported from TRS12 to SCPL3, which can be accessed by the upper conveying mechanism 52 of the layers E4 to E6, using the rear-side conveying mechanism 91. Thereafter, the wafer W2 is transported to the resist coating component 3 and the thermal treatment component 4 of the layers E4 to E6 in the same manner as the above-mentioned examples using the upper-side conveying mechanism 52, and then transported to SCPL4. Next, the wafer W2 is transported to TRS13 using the rear-side conveying mechanism 91, and then transported back to the carrier C via the post-processing inspection component 62 along the same path as the wafer W1.

[0123] Furthermore, when only inspection is performed by the pre-processing inspection module 61, wafers W1 and W2 that have completed processing and been transferred to SCPL2 and SCPL4 can be transferred to TRS 14 by, for example, the rear-side transfer mechanism 91 and returned to the carrier C. When only inspection is performed by the post-processing inspection module 62, wafers W1 and W2 that have been transferred from the carrier C to TRS 11 can be transferred to SCPL 1 and SCPL 3, respectively, by, for example, the rear-side transfer mechanism 91, and then transferred along the above-described route.

[0124] In this embodiment, in the substrate processing apparatus 1B, the inspection module 6, serving as the second processing module, is arranged to protrude rearward relative to the conveyance path 20. This, as already described, can suppress an increase in floor space. Furthermore, the front conveyor mechanism 92 conveys wafers W relative to the inspection module 6, while the rear conveyor mechanism 91 conveys wafers W relative to the substrate placement portion of the transfer unit 84. Thus, the transfer of wafers W is shared between the rear conveyor mechanism 91 and the front conveyor mechanism 92, thereby distributing the transfer load and improving transfer throughput.

[0125] Furthermore, in this example, the pre-processing inspection assembly 61 and the post-processing inspection assembly 62 are separated in the longitudinal direction, and the transport to the inspection assemblies 6 (61, 62) is shared by the lower front conveyor mechanism 921 and the upper front conveyor mechanism 922. This further distributes the transport load, thereby contributing to improved transport throughput. Furthermore, the rear conveyor mechanism 91, the lower front conveyor mechanism 921, and the upper front conveyor mechanism 922 are respectively located on the rear and front sides of the transport path 20. Therefore, even with the provision of these conveyor mechanisms, the increase in the left-right length of the substrate processing apparatus 1B is minimized.

[0126] Furthermore, as described above, the pre-processing inspection assembly 61 and the post-processing inspection assembly 62 are separated vertically, and substrate placement sections constituting the interface 84 are provided between these inspection assemblies 6 (61, 62). Furthermore, the space between the protrusions 60 protruding from the interface 84 of the inspection assemblies 6 (61, 62) is utilized as a space for movement of the rear-side transport mechanism 91, and the rear-side transport mechanism 91 is configured to transfer wafers W between the substrate placement sections at the height of sections E1 to E3 and the substrate placement sections at sections E4 to E6. By utilizing the space between the protrusions 60 of the inspection assemblies 6 (61, 62) for inter-section transport in this manner, it is possible to suppress an increase in the front-to-back width of the apparatus, thereby more reliably reducing the footprint of the apparatus.

[0127] In this example, a connection portion 84 is also provided between the inspection assemblies 6. The inspection assemblies 6 and the connection portion 84 overlap when viewed from above, thereby helping to reduce the floor space. Furthermore, because the protrusions 60 of the pre-processing inspection assembly 61 and the post-processing inspection assembly 62 overlap with a portion of the rear conveying mechanism 91 when viewed from above, an empty space is created in the front-to-back direction of the processing module D2. This space can also be effectively utilized as an additional equipment installation area 44 for the thermal treatment assembly 4, for example.

[0128] As described above, the front conveyor mechanism 92 is divided into a lower front conveyor mechanism 921 and an upper front conveyor mechanism 922, but it can also be an undivided structure. In other words, a common conveyor mechanism can be used for conveying substrates to the pre-processing inspection assembly 61, the post-processing inspection assembly 62, and a portion of the substrate loading sections in the interface 84. However, as described above, from the perspective of distributing the conveying load, it is preferable that the front conveyor mechanism 92 be divided into an upper and lower structure.

[0129] In the above-described embodiments, the inspection unit 6 is rectangular in plan view. However, a relatively large inspection unit 6 having a square shape in plan view may be configured so that a portion thereof protrudes forward or backward from the conveying path 20 .

[0130] (Fourth embodiment)

[0131] Next, use Figure 14The fourth embodiment will now be described. This embodiment is a structural example in which an inspection assembly 6 is installed in the carrier module D1. In this embodiment, the inspection assembly 6 is located above the wafer W conveyance area 10 in the carrier module D1. The inspection assembly 6 is configured to be longer from front to back than from side to side. Specifically, the inspection assembly 6 is positioned so that the longitudinal direction of its housing 63 aligns with the movement direction (X direction) of the first conveying mechanism 17 in the conveyance area 10. The entire inspection assembly 6 is housed within the housing 11 of the carrier module D1.

[0132] exist Figure 14 In the illustrated structural example, the pre-processing inspection assembly 61 and the post-processing inspection assembly 62 are located behind the carrier module D1, overlap with the conveying area 10 when viewed from above, and are located adjacent to the area on the rear side of the conveying path 20 of the processing module D2 (at the rear of the carrier module D1). Figure 14 Only the pre-processing inspection component 61 and the post-processing inspection component 62 are shown in FIG. 1 . If further details are given, the fan filter unit 18 is located above the fan filter unit 18 and is located between the fan filter unit 18 and the equipment installation area 23 (see FIG. 1 ). Figure 2 ) form a space with a height greater than that shown in the figure, and these inspection components 6 (61, 62) are stacked up and down in this space. Figure 14 It is a cross-sectional plan view showing the layer section E3 of the process module D2, but for the carrier module D1, a cross-sectional plan view of a position below the equipment installation area 23 is shown.

[0133] In addition, the third conveying mechanism 7 is arranged on the rear side of the conveying path 20 so as to be adjacent to the inspection components 6 (61, 62) when viewed from above. For example, a conveying port for wafer W is formed on the side wall of the housing 63 of the pre-processing inspection component 61 and the post-processing inspection component 62, which faces the processing module D2, and is configured to transfer wafer W from the third conveying mechanism 7 to the loading unit 64 located in the standby position. Then, the wafer W placed on the substrate loading unit (TRS, SCPL) of the delivery unit 85 is conveyed to the pre-processing inspection component 61 and the post-processing inspection component 62 by the third conveying mechanism 7, and the wafer W is inspected. The conveying path of the wafer W in the apparatus of the fourth embodiment is similar to that of the substrate processing apparatus 1 of the first embodiment, for example.

[0134] according to Figure 14 In this structure, the inspection assembly 6 is disposed above the conveyance area 10 of the first conveyance mechanism 17 of the carrier module D1 so that the length of the inspection assembly 6 is longer than the left and right sides. Therefore, when the inspection assembly 6 is disposed in a rectangular shape when viewed from above, the length of the substrate processing apparatus 1C in the left and right directions can be suppressed, thereby suppressing an increase in the floor space.

[0135] In addition, in the above configuration examples of each device, the heat treatment assembly is arranged at the rear and the liquid treatment assembly is arranged at the front, but it is also possible to reverse this and arrange the heat treatment assembly at the front and the liquid treatment assembly at the rear. In such a case where the positional relationship of the components is reversed, the orientation of the inspection assembly 6 and the like can be matched with the arrangement of the heat treatment assembly and the liquid treatment assembly.

[0136] Furthermore, it is not necessary to have both the pre-processing inspection assembly 61 and the post-processing inspection assembly 62; a configuration having either inspection assembly is sufficient. Furthermore, for example, the layout of the fourth embodiment can be combined with the layouts of other embodiments. In other words, it is also possible to configure the system as follows: as shown in the fourth embodiment, one inspection assembly 6 is located in the carrier module D1, while, as shown in the first to third embodiments, the other inspection assembly 6 is arranged to overlap with the interface and protrude forward or backward from the conveyance path 20.

[0137] Furthermore, the second conveying mechanism may or may not be shared across the various sections provided in processing module D2. If the second conveying mechanism is not shared across the various sections (i.e., multiple second conveying mechanisms are provided), there is no limit to the number of sections that a single second conveying mechanism can transport; the number of sections can be one or more. Furthermore, the number of sections that each second conveying mechanism can transport can be the same or different.

[0138] A smaller number of second conveyor mechanisms is preferred because it reduces the manufacturing cost of the apparatus. Furthermore, providing multiple second conveyor mechanisms 51 and 52, as in the structure of the substrate processing apparatus 1, reduces the transport load of the second conveyor mechanism 5, which is preferred from the perspective of achieving higher throughput. Furthermore, by configuring each second conveyor mechanism 51 and 52 to transport the same number of layers, as in the substrate processing apparatus 1, it is possible to prevent imbalance in the transport load between the second conveyor mechanisms 51 and 52, thereby achieving higher throughput, which is also preferred.

[0139] Furthermore, as described above, the sections constituting the processing module only need to include at least a liquid treatment assembly. Furthermore, the liquid treatment assembly provided in each section is not limited to the above example and may also be a structure comprising multiple cups 32 arranged in a horizontal direction. However, a structure comprising only a single cup 32 can help reduce the horizontal length of the processing module D2.

[0140] Furthermore, the number of first processing modules installed is not limited to the above example; the first processing modules may be stacked on a single level. Furthermore, if the first processing modules enable the second conveyor mechanism to convey wafers W, as described in the second and third embodiments, they may be installed at a height that spans two levels. Furthermore, if the second conveyor mechanism is responsible for conveying wafers across multiple levels, the first processing modules may not be installed on the level.

[0141] Furthermore, the number of first processing modules installed need not be the same across multiple sections; the number of first processing modules may vary in each section. In this case, the left-right placement of the first processing modules need not be the same across all sections; these placement locations may be staggered in each section depending on the number of first processing modules installed. Furthermore, the number of stacked sections comprising processing module D2 may be 4, 5, 7, or 8, and is not limited to the illustrated number.

[0142] Furthermore, the liquid processing module may be a module that performs liquid processing for forming an anti-reflective film or a liquid processing for forming a protective film, or a developing module that performs a developing process on the wafer W using a developer as a processing liquid. Furthermore, it may be a module that applies a processing liquid (chemical solution) for forming an insulating film, a module that supplies an adhesive material for bonding the wafers W, or a cleaning module that supplies a cleaning liquid to clean the wafers W. Furthermore, the protective film mentioned above refers to a film formed to protect the resist film during immersion exposure.

[0143] Furthermore, when the aforementioned developing module is provided, a heat treatment module is exemplified as the first processing module, which performs a heat treatment (PEB: Post Exposure Bake) on the wafer W prior to the developing process. In other words, within processing module D2, the wafer W may be transported in the order of heat treatment module → developing module. Therefore, the first processing module is not limited to one that processes the wafer W after the liquid processing module, and the liquid processing module is not limited to one that forms a coating film.

[0144] Furthermore, the first processing module may be configured as a hydrophobic treatment module that supplies gas to the wafer W to perform a hydrophobic treatment. For example, a hydrophobic treatment module may be provided as the first processing module, and an anti-reflective film forming module may be provided as the liquid processing module, with the modules being transported in the order of hydrophobic treatment module → anti-reflective film forming module. Therefore, the first processing module is not limited to being a module that simply heats the wafer W.

[0145] Furthermore, the second processing module is not limited to an inspection module, and may be a processing module that performs a curing process by irradiating ultraviolet light after forming a resist film on the wafer W. Figure 5 The inspection unit 6 shown does not include a camera, but is instead provided with an ultraviolet irradiation unit in the position of the half mirror 65 and the lighting 66. Furthermore, ultraviolet rays are irradiated downward from the ultraviolet irradiation unit, and the placement unit 64 holding the wafer W is moved from the standby area to the movement completion position, thereby irradiating the entire surface of the wafer W with ultraviolet rays, thereby performing a curing process.

[0146] Furthermore, in the substrate processing apparatus 1 and the like, the lower conveyance mechanism 51 and the upper conveyance mechanism 52 independently convey wafers W. That is, wafers W are conveyed independently between sections E1-E3 and sections E4-E6. Therefore, the processing performed in sections E1-E3 and E4-E6 can be differentiated. For example, different components can be arranged in the lower and upper sections, allowing resist coating and PAB to be performed in sections E1-E3 while PAB and development can be performed in sections E4-E6.

[0147] In addition, the structure of the interface 8 and the like is not limited to the above-mentioned example, and the number and layout of the placement assembly (TRS) 81 and the temperature adjustment assembly (SCPL) 82 can be appropriately selected. Therefore, in the above-mentioned conveying path, for the steps described as conveying to the TRS, it is also possible to convey to the SCPL. Conversely, for the steps described as conveying to the SCPL, it is also possible to convey to the TRS. It is also possible to insert conveying to the TRS and the SCPL in the conveying path. In addition, the storage area 22 can be arranged in a manner that does not interfere with the pre-processing inspection assembly 61 and the post-processing inspection assembly 62. Alternatively, the additional equipment installation area of ​​the liquid processing assembly and the installation area of ​​the power equipment can be arranged to overlap with the storage area 22 in the vertical direction.

[0148] The embodiments disclosed herein are to be considered in all respects as illustrative and non-restrictive. The embodiments described above may be omitted, replaced, modified, and combined in various ways without departing from the scope of the claims and the spirit thereof.

Claims

1. A substrate processing device comprising a processing module provided with a plurality of liquid processing components for performing liquid processing on a substrate, wherein the substrate processing device is characterized in that: The substrate processing device comprises: a substrate conveying module including a container placement portion for placing a container for accommodating a plurality of the substrates and a first conveying mechanism for transferring the substrates to and from the container, the substrate conveying module being disposed on one of the left and right sides of the processing module; The substrate conveying path extends left and right along the processing module; a plurality of layers, each of which constitutes the processing module in such a manner that the liquid processing components are arranged in a longitudinal direction on one side of the front and rear sides relative to the conveying path, and each includes the liquid processing component; a first processing module disposed in plurality in the longitudinal direction on the other of the front and rear sides of the transport path and processing the substrate before or after the processing by the liquid processing module; a second transport mechanism that moves along the transport path and transports the substrate between the liquid processing module and the first processing module; a second processing assembly disposed above a conveying area of ​​the substrate conveying module where the substrate is conveyed by the first conveying mechanism so as to protrude from the conveying path to one or the other of the front and rear sides, and performing a process on the substrate that is different from the process performed by the first processing assembly; a third transport mechanism for delivering the substrate to the second processing module; and a handover portion, which is provided on one side of the conveying path, for the substrate to be placed on, and for handing over the substrate between the first conveying mechanism, the second conveying mechanism, and the third conveying mechanism; The second processing unit is configured to protrude from the transport path toward one or the other of the front and rear sides of the transport path and overlap the interface. The interface portion includes a plurality of substrate placement portions arranged in a row in the longitudinal direction and respectively placing the substrates thereon. The third conveying mechanism includes: a protruding-side conveying mechanism provided on a side of the second processing module protruding relative to the conveying path so as to overlap the second processing module; and a non-protruding side conveying mechanism provided on the side opposite to the protruding side with respect to the conveying path; The non-protruding side conveying mechanism conveys the substrate between the second processing module and the substrate mounting portion. The protrusion-side transport mechanism transports the substrate between the substrate placement sections.

2. The substrate processing apparatus according to claim 1, wherein: The interface portion includes a plurality of substrate placement portions arranged in a row in the longitudinal direction and respectively placing the substrates thereon. The second processing module is provided between one substrate mounting portion and the other substrate mounting portion.

3. The substrate processing apparatus according to claim 1 or 2, wherein: A portion of the second processing module protruding from the transport path overlaps with a storage area for storing a processing liquid in a plan view, and the processing liquid is supplied to the substrate in each of the liquid processing modules.

4. The substrate processing apparatus according to claim 1, wherein: The second processing assembly includes an upper second processing assembly and a lower second processing assembly arranged in the longitudinal direction. The protruding side conveying mechanism is provided between the second processing assembly on the upper side and the second processing assembly on the lower side. The non-protruding side conveying mechanism includes an upper non-protruding side conveying mechanism for delivering the substrate to the upper second processing module and a lower non-protruding side conveying mechanism for delivering the substrate to the lower second processing module.

5. The substrate processing apparatus according to claim 1, wherein The second conveying mechanism includes: a lower conveying mechanism for delivering the substrate to the liquid processing assembly at a lower stage among the plurality of stages and the first processing assembly at the level of the lower stage; and An upper transport mechanism transfers the substrate to and from the liquid processing module at an upper stage among the plurality of stages and the first processing module at the level of the upper stage.

6. The substrate processing apparatus according to claim 5, wherein: The lower layer segment and the upper layer segment are respectively composed of multiple layer segments. The handover portion is provided at a height of an uppermost stage among stages in which the substrate is conveyed by the lower conveying mechanism and at a height of a lowermost stage among stages in which the substrate is conveyed by the upper conveying mechanism.

7. The substrate processing apparatus according to claim 6, wherein: The lower layer segment and the upper layer segment are each composed of three layers.

8. The substrate processing apparatus according to claim 1, wherein: The second processing module is an inspection module for inspecting the substrate before or after processing by the liquid processing module and the first processing module.

9. The substrate processing apparatus according to claim 1, wherein: The liquid processing assembly of each layer section is provided with only one cup for surrounding the substrate for processing.

10. The substrate processing apparatus according to claim 1, wherein The interface has a temperature adjustment function for adjusting the temperature of a substrate before processing by the liquid processing module and the first processing module.

11. The substrate processing apparatus according to claim 1, wherein: The first processing module is a thermal processing module for heating the substrate.

12. The substrate processing apparatus according to claim 1, wherein: The plurality of first processing modules include a first processing module that is arranged across two adjacent layers.

13. A substrate processing method using a substrate processing apparatus, wherein the substrate processing apparatus includes a processing module provided with a plurality of liquid processing components for performing liquid processing on the substrate, wherein the substrate processing method is characterized in that: The substrate processing method comprises the following steps: a step of placing a container for storing a plurality of substrates on a container placement portion provided in a substrate conveying module, the substrate conveying module being provided on one of the left and right sides of the processing module; a step of transferring the substrate to and from the container by using a first conveying mechanism provided in the substrate conveying module; In the step of processing the substrates by the plurality of liquid processing assemblies, the plurality of liquid processing assemblies are respectively included in a layer segment constituting the processing module and are arranged in a row in the longitudinal direction on one of the front and rear sides of a substrate conveyance path extending left and right in the processing module; a step of processing the substrate in a first processing module before or after the processing in the liquid processing module, wherein a plurality of first processing modules are provided in the longitudinal direction on the other of the front and rear sides with respect to the transport path; a step of transporting the substrate between the liquid processing module and the first processing module using a second transport mechanism that moves on the transport path; a step of performing a process on the substrate by a second processing assembly different from the process performed by the first processing assembly, the second processing assembly being arranged above a conveying area of ​​the substrate conveying module where the substrate is conveyed by the first conveying mechanism so as to protrude from the conveying path to one of the front and rear directions or the other; a step of transferring the substrate to the second processing module by using a third conveying mechanism; and a step of placing the substrate on a transfer portion provided on one of the left and right sides of the transport path in order to transfer the substrate between the first transport mechanism, the second transport mechanism, and the third transport mechanism; The second processing unit is configured to protrude from the transport path toward one or the other of the front and rear sides of the transport path and overlap the interface. The interface portion includes a plurality of substrate placement portions arranged in a row in the longitudinal direction and respectively placing the substrates thereon. The third conveying mechanism includes: a protruding-side conveying mechanism provided on a side of the second processing module protruding relative to the conveying path so as to overlap the second processing module; and a non-protruding side conveying mechanism provided on the side opposite to the protruding side with respect to the conveying path; The non-protruding side conveying mechanism conveys the substrate between the second processing module and the substrate mounting portion. The protrusion-side transport mechanism transports the substrate between the substrate placement sections.

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