A wafer automatic loading device and a loading detection method

Abstract

The present application relates to the field of automatic feeding devices, and more specifically, it relates to an automatic wafer feeding device and a feeding detection method, which includes a wafer box mounting assembly, a cover opening mechanism and a material taking mechanism arranged on a rack, the cover opening mechanism for opening the material storage box is located on one side of the wafer box mounting assembly, and the material taking mechanism for carrying wafers is located on the side of the cover opening assembly away from the wafer box mounting assembly; the feeding device also includes a calibration mechanism arranged on the material taking mechanism, the calibration mechanism includes a lifting assembly, a rotating assembly, an adsorption assembly and a detection assembly, the lifting assembly is connected to the material taking mechanism, the rotating assembly is connected to the lifting assembly, the adsorption assembly is connected to the lifting assembly that drives it to move in the vertical direction, the adsorption assembly is connected to the rotating assembly that drives it to rotate, and the detection assembly is arranged on the rack, and the detection assembly is located above the adsorption assembly. The present application has the effect of improving detection efficiency.

Description

Technical Field

[0001] The present application relates to the field of automatic loading devices, and more specifically, to an automatic wafer loading device and a loading detection method. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.

[0003] The entire manufacturing process of semiconductor devices can be divided into processes such as wafer manufacturing, wafer probe testing and chip packaging. Wafer probe testing is to perform probe testing on each crystal on the chip. The probe needle made of beryllium copper is connected to the test machine and touches the contact points on the crystal to test the electrical function of the crystal. The crystals that fail to pass the test will be marked. Then, when the chip is cut into individual crystals according to the crystal unit, the crystals with unqualified marks will be eliminated and will not be used in the next manufacturing process to reduce unnecessary manufacturing costs.

[0004] Inspection focuses on inspection accuracy and speed. In related technologies, wafers are manually loaded and unloaded, and are sent to the inspection station manually, resulting in low inspection efficiency. Summary of the invention

[0005] In order to improve detection efficiency, the present application provides an automatic wafer loading device and a loading detection method.

[0006] In a first aspect, the present application provides an automatic wafer loading device, which adopts the following technical solution:

[0007] A wafer automatic loading device, comprising a wafer box mounting assembly, a cover opening mechanism and a material taking mechanism arranged on a frame, wherein the cover opening mechanism for opening a material storage box is located on one side of the wafer box mounting assembly, and the material taking mechanism for carrying wafers is located on the side of the cover opening assembly away from the wafer box mounting assembly;

[0008] The feeding device also includes a calibration mechanism arranged on the material picking mechanism, and the calibration mechanism includes a lifting assembly, a rotating assembly, an adsorption assembly and a detection assembly. The lifting assembly is connected to the material picking mechanism, the rotating assembly is connected to the lifting assembly, the adsorption assembly is connected to the lifting assembly that drives it to move in the vertical direction, the adsorption assembly is connected to the rotating assembly that drives it to rotate, and the detection assembly is arranged on the frame, and the detection assembly is located above the adsorption assembly.

[0009] By adopting the above technical solution, the wafer is placed in a storage cassette, and the staff places the storage cassette on the wafer cassette mounting assembly, which locks the storage cassette on it. The cover-opening mechanism opens the storage cassette to an open state, and then the wafer pickup mechanism extends into the storage cassette to carry the wafer. When the wafer is carried to below the detection assembly, the lifting assembly is used to change the position of the adsorption assembly in the vertical direction to lift the wafer until it leaves the pickup mechanism. Then, the rotation assembly rotates the adsorption assembly. After the detection assembly monitors the wafer to a specified angle, it sends a signal to stop the rotation of the adsorption assembly, and lowers the wafer to make it contact with the pickup mechanism, which sends the wafer to the next detection station.

[0010] Many crystal particles are distributed on the wafer. To facilitate the detection of the wafer, a notch is set on the wafer. When the notch is aligned, the positions of the crystal particles are determined, which is convenient for later probing. A calibration mechanism is provided on the connecting frame, and when the wafer is picked up, the calibration of the wafer can be completed, further improving the detection efficiency.

[0011] After the staff places the storage cassette on the wafer cassette mounting assembly, the remaining processes are completed by various mechanisms. The automation degree is high, and the process is continuous and compact, thus reducing the workload of the staff, improving the detection efficiency, and completing the detection faster.

[0012] Preferably, the adsorption assembly includes a gas nozzle, an adsorption rod, and an adsorption seat for supporting the wafer. The adsorption rod is connected to the lifting assembly and the rotation assembly. The bottom of the adsorption seat is connected to the top of the adsorption rod. The gas nozzle is connected to the adsorption rod, and a channel communicating with the gas nozzle and the adsorption seat is provided inside the adsorption rod; the detection assembly is located above the adsorption seat.

[0013] By adopting the above technical solution, the gas nozzle is connected to a device for negative pressure (such as a vacuum generator). After the negative pressure device is started, the adsorption seat has an adsorption effect on the wafer, fixing the position of the wafer without damaging it, which is convenient for subsequent operations. At the same time, it also reduces the damage to the wafer during transportation, improves efficiency, and reduces cost losses.

[0014] Preferably, a mounting seat is provided on the frame, and the wafer cassette mounting assembly is arranged on the mounting seat. The wafer cassette mounting assembly includes a mounting plate, a retaining block, a hook, several groups of positioning posts, and several groups of clamping members. The mounting plate is arranged on the mounting seat. The hook for fixing the large wafer cassette is slidably connected to the mounting plate, and the positioning posts for fixing the large wafer cassette are fixedly connected to the mounting plate; the retaining block for mounting the small wafer cassette is fixedly connected to the mounting plate, and the clamping members for mounting the small wafer cassette are slidably connected to the mounting plate.

[0015] By adopting the above technical solution, the wafer cassette mounting assembly can be adapted to both large and small wafer cassettes at the same time. The staff can, according to the actual situation, install the storage box on the mounting plate through the corresponding components of the wafer cassette mounting assembly, thereby improving the adaptability of the detection device to wafers of different sizes and storage boxes of different specifications, being more convenient while reducing the detection cost and improving the detection efficiency.

[0016] Preferably, the lid opening mechanism includes a moving seat and a moving plate for locking the lid of the large wafer cassette. The moving seat is slidably connected to the frame in the vertical direction, and the moving plate is slidably connected to the moving seat in the horizontal direction.

[0017] By adopting the above technical solution, in order to facilitate transportation, a 12-inch wafer cassette on the market generally has a lid. Place the storage box on the mounting plate, connect the lid of the storage box to the moving plate, the moving plate locks the lid, and then change the position of the moving plate to move it away from the storage box. At this time, the lid is separated from the storage box, and then change the position of the moving seat to make it descend. The storage box is in an open state at this time, and the picking mechanism can extend into the storage box to pick up materials.

[0018] Preferably, a scanning assembly is provided on the side of the moving plate facing away from the storage box. The scanning assembly includes a first driving member, a rotating frame and a detection sensor. The first driving member is arranged on the moving seat, the rotating frame is rotatably connected to the moving plate, the rotating frame is connected to the first driving member that pushes it to rotate into or out of the storage box, and the detection sensor is arranged on the rotating frame.

[0019] By adopting the above technical solution, while the moving plate descends, the first driving member drives the bottom of the rotating frame to move away from the storage box, and the top of the rotating frame approaches the storage box, thereby driving the detection sensor to approach the storage box. When the moving plate descends, the detection sensor scans the wafers in the storage box and then feeds back other information such as the number of wafers to the staff.

[0020] Preferably, the picking mechanism includes a support frame, a lifting block, a rotating platform, a connecting frame and a plurality of picking members. The support frame is fixedly connected to the bracket, the lifting block is slidably connected to the support frame in the vertical direction, the rotating platform is fixedly connected to the lifting block, the connecting frame is connected to the rotating platform, and the picking members are slidably connected to the connecting frame in the direction of approaching or departing from the storage box; the lifting assembly is connected to the connecting frame, and the adsorption assembly passes through the connecting frame.

[0021] By adopting the above technical solution, when picking up materials is required, change the position of the lifting block in the vertical direction to move the picking members to a height similar to that of the wafer cassette, and then change the position of the picking members to extend them into the wafer cassette to pick up the wafers, and then transport the wafers to the next detection station through the rotating platform.

[0022] Preferably, an air extraction port is provided at a position of the material taking member away from the storage box, a plurality of adsorption ports are provided at the top of the material taking member and close to the storage box, and a plurality of air paths for communicating the adsorption ports with the air extraction port are arranged in the material taking member.

[0023] By adopting the above technical solution, the air extraction port is connected to a device for negative pressure. When the device for negative pressure (such as a vacuum generator) operates, the adsorption ports have the suction force for adsorbing the wafers, so that the wafers are more firmly mounted on the material taking member, and there is almost no damage to the wafers, reducing the detection cost.

[0024] Preferably, the material taking member is in a shape similar to "Y", and the adsorption assembly penetrates through the diverging part of the material taking member.

[0025] By adopting the above technical solution, the "Y"-shaped material taking member can not only stably support the wafers, but also allow the adsorption assembly to pass through, making it more convenient and fast to adjust the position of the wafers by the adsorption assembly.

[0026] Preferably, two groups of the material taking members are provided, one of the material taking members is located above the other material taking member, and there is a distance between the two material taking members in the vertical direction.

[0027] By adopting the above technical solution, the upper material taking member extends into the storage box to take out the first wafer, and then the adsorption assembly rotates the first wafer for calibration. After the calibration is completed, the lower material taking member extends into the storage box to take out the second wafer, and then the adsorption assembly rotates the second wafer for calibration of the second wafer. After the calibration of both wafers is completed, they are sent to the next detection station together. Two wafers are taken at one time, and the calibration of the wafers is completed while taking, further improving the detection efficiency.

[0028] In a second aspect, the present application provides a method for automatically loading and detecting wafers, adopting the following technical solution:

[0029] A method for automatically loading and detecting wafers includes the following steps:

[0030] Step 1): Install the storage box on the wafer box installation component, and then the laser sensors provided on the wafer box installation component and the frame emit laser to detect whether the storage box is installed in place.

[0031] Step 2): Before taking out the wafers, move the moving plate downward to make it descend, and rotate the rotating frame to drive the detection sensor to extend towards the storage box. The detection sensor scans the wafers in the storage box as it descends with the moving plate to obtain the wafer information in the storage box.

[0032] Step 3): After taking out the wafer, change the position of the picking component so that the picking component is located below the detection component. The detection component monitors the wafer located below it and feeds back its wafer number and notch position to the staff.

[0033] By adopting the above technical solution, the laser sensor is responsible for monitoring whether the storage box is installed in place, enabling the picking component to more accurately and easily extend into the storage box with a determined position, thereby improving the detection efficiency. The detection sensor detects the number of wafers in the storage box to facilitate the later arrangement of the operations of the picking component. The detection component is responsible for detecting the notch and wafer number of the wafer, ensuring that the wafers sent to the next station for detection are all in an aligned state, accelerating the detection efficiency; when there is a problem wafer, the specific wafer number can also be known for accurate recording. The detection efficiency is improved through the above various detection methods.

[0034] In summary, the present application has the following beneficial effects:

[0035] 1. After the staff places the storage box on the wafer box installation component, the remaining processes are completed by various mechanisms, with a high degree of automation and a continuous and compact process, thereby reducing the workload of the staff, improving the detection efficiency, and completing the detection faster.

[0036] 2. Many crystal granules are distributed on the wafer. To facilitate the detection of the wafer, a notch is set on the wafer. When the notch is aligned, the position of the crystal granules is also determined, facilitating later needle testing. A calibration mechanism is set on the connecting frame, and the calibration of the wafer can be completed while picking up the wafer, further improving the detection efficiency.

[0037] 3. The picking component located above extends into the storage box to take out the first wafer, and then the adsorption component rotates the first wafer for calibration. After the calibration is completed, the picking component located below extends into the storage box to take out the second wafer, and then the adsorption component rotates the second wafer to calibrate the second wafer. After the calibration of both wafers is completed, they are sent to the next station for detection together. Two wafers are picked up at one time, and the calibration of the wafers is completed while picking them up, further improving the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 is a schematic structural diagram of the small wafer box according to an embodiment of the present application.

[0039] Figure 2 is a schematic structural diagram of the large wafer box according to an embodiment of the present application.

[0040] Figure 3 is a schematic structural diagram of the overall structure according to an embodiment of the present application.

[0041] Figure 4 is a schematic structural diagram of the wafer box installation component and other parts according to an embodiment of the present application.

[0042] Figure 5 It is a partial structural schematic diagram of the material taking mechanism of the embodiment of the present application.

[0043] Figure 6 It is a structural schematic diagram of the calibration mechanism of the embodiment of the present application.

[0044] Explanation of reference numerals: 1. Storage box; 11. Small wafer box; 111. Partition groove; 112. Clamping edge; 113. Connecting cross bar; 12. Large wafer box; 121. Box body; 122. Dust-proof cover; 123. Matching positioning hole; 124. Hook slot; 2. Frame; 21. Mounting seat; 22. Laser sensor; 3. Wafer box mounting assembly; 31. Mounting plate; 32. Retaining block; 321. Retaining groove; 33. Hook; 34. Positioning column; 35. Clamping column; 4. Open cover mechanism; 41. Moving seat; 42. Moving plate; 43. Vertical plate; 44. Door opening module; 441. Bolt rod; 45. Positioning pin; 46. Suction cup; 5. Material taking mechanism; 51. Support frame; 52. Lifting block; 53. Rotating platform; 54. Connecting frame; 55. Material taking part; 551. Air extraction port; 552. Adsorption port; 56. Carrying seat; 6. Scanning assembly; 61. First driving part; 62. Rotating frame; 63. Detection sensor; 7. Calibration mechanism; 71. Lifting assembly; 711. Mounting shell; 712. Lifting plate; 713. First motor; 714. Screw rod; 72. Rotating assembly; 721. Second motor; 722. First synchronous pulley; 723. Second synchronous pulley; 724. Synchronous belt; 73. Adsorption assembly; 731. Air nozzle; 732. Adsorption rod; 733. Adsorption seat; 7331. Groove; 74. Detection assembly. Detailed implementation manners

[0045] The following further describes the present application in detail Figure 1-6 with reference to the accompanying drawings.

[0046] In this embodiment, 8-inch and 12-inch wafers are mainly used. The wafers to be detected are orderly loaded into the storage box 1 and transported through the storage box 1.

[0047] Referring to Figure 1 , the storage box 1 is a small wafer box 11 for loading 8-inch wafers. One side of the small wafer box 11 is open for wafers to enter and exit. A plurality of partition grooves 111 for separating wafers are arranged on the inner wall of the small wafer box 11. A plurality of clamping edges 112 are fixedly connected to the bottom of the small wafer box 11. In this embodiment, the number of clamping edges 112 is 2, and the two clamping edges 112 are symmetrically arranged. A connecting cross bar 113 is also fixedly connected to the bottom of the small wafer box 11. One end of the connecting cross bar 113 is fixedly connected to one of the clamping edges 112, and the other end of the connecting cross bar 113 is fixedly connected to the other clamping edge 112.

[0048] Reference Figure 2 , the storage box 1 is a large wafer box 12 for holding 12-inch wafers. The specific structure of the large wafer box 12 is as follows:

[0049] The large wafer box 12 includes a box body 121 and a dust-proof cover 122, and the box body 121 is detachably connected to the dust-proof cover 122. A plurality of partition grooves 111 (reference Figure 1 ) are provided on the inner wall of the box body 121. A plurality of mating positioning holes 123 are provided at the bottom of the box body 121 of the large wafer box 12. In this embodiment, the mating positioning holes 123 are specifically waist-shaped holes. A hook groove 124 is also formed at the bottom of the box body 121 of the large wafer box 12.

[0050] Reference Figure 3 , a wafer automatic loading device includes a wafer box mounting assembly 3, an opening mechanism 4, and a material taking mechanism 5 provided on a frame 2. The opening mechanism 4 is located on one side of the wafer box mounting assembly 3, and the material taking mechanism 5 is located on the side of the opening mechanism 4 away from the wafer box mounting assembly 3. The storage box 1 is mounted on the frame 2 through the wafer box mounting assembly 3. The opening mechanism 4 is used to open the storage box 1, and the material taking mechanism 5 is used to transport wafers.

[0051] Reference Figure 3 and Figure 4 , an installation seat 21 is provided on the frame 2, the wafer box mounting assembly 3 is provided on the installation seat 21, and the wafer box mounting assembly 3 includes a mounting plate 31, a retaining block 32, a hook 33, a plurality of groups of positioning posts 34, and a plurality of groups of clamping members. The mounting plate 31 is slidably connected to the top of the installation seat 21 through a linear guide rail.

[0052] The positioning posts 34 and the hooks 33 in the wafer box mounting assembly 3 are used to lock the large wafer box 12. The bottom of the positioning post 34 is fixedly connected to the top of the mounting plate 31, and a special-shaped hole for the hook 33 to pass through is provided on the mounting plate 31. The hook 33 moves along the direction close to or away from the material taking mechanism 5 through a rotary pressing cylinder.

[0053] Reference Figure 2 and Figure 4 , specifically, one positioning post 34 corresponds to one mating positioning hole 123, the positioning post 34 is inserted into the corresponding mating positioning hole 123, and the hook 33 is clamped in the hook groove 124. In this embodiment, specifically, the rotary pressing cylinder rotates while telescoping, driving the hook 33 to move towards the bottom of the hook groove 124 until the large wafer box 12 is clamped to the mounting plate 31. The rotary pressing cylinder can drive the hook 33 to rotate and avoid, so that the small wafer box 11 is not blocked by the hook 33 during installation.

[0054] Reference Figure 3 and Figure 4, the retaining block 32 and the clamping members in the wafer cassette mounting assembly 3 are used to lock the small wafer cassette 11. The retaining block 32 is fixedly connected to the mounting plate 31. A retaining groove 321 is formed at the top of the retaining block 32, and the retaining groove 321 penetrates through two opposite side surfaces of the retaining block 32. The retaining groove 321 is adapted to the connecting cross bar 113 (refer to Figure 1 ). A set of clamping members includes two clamping columns 35. The clamping columns 35 are slidably connected to the mounting plate 31, and the two clamping columns 35 in a set approach or move away from each other simultaneously through a double-acting cylinder.

[0055] Refer to Figure 1 and Figure 4 , when using the small wafer cassette 11, the clamping members and the retaining block 32 are used in cooperation with the small wafer cassette 11. The connecting cross bar 113 is snapped into the retaining groove 321, and then the double-acting cylinder is controlled to make the two clamping columns 35 approach each other until the side surfaces of the clamping columns 35 that approach each other are in tight contact with the side surfaces of the clamping edges 112 that face away from each other.

[0056] A plurality of laser sensors 22 are fixedly connected to the mounting seat 21 and the frame 2. The laser sensors 22 are used to monitor whether the storage box 1 is installed in place. At the same time, when a person's hand passes through and touches the storage box 1, the laser sensors 22 feedback the signal that the light is blocked to the controller, and the feeding device stops operating.

[0057] Refer to Figure 2 and Figure 3 , the cover opening mechanism 4 includes a moving seat 41 and a moving plate 42. The moving seat 41 is slidably connected to the frame 2. The moving seat 41 can slide in the vertical direction, and the sliding of the moving seat 41 can be realized by a lead screw or a cylinder. The moving plate 42 is slidably connected to the moving seat 41. The moving plate 42 moves in a direction close to or away from the storage box 1, and the movement of the moving plate 42 can be realized by a lead screw or a cylinder. The dust cover 122 of the large wafer cassette 12 abuts against the moving plate 42. A plurality of door opening modules 44 and a plurality of positioning pins 45 are arranged on the moving plate 42. Each door opening module 44 includes a rotatable latch rod 441, and one end of the latch rod 441 can extend into the dust cover 122 to unlock. In this embodiment, the number of the door opening modules 44 is 2, and the two latch rods 441 are synchronously rotated through a linkage mechanism. The positioning pins 45 can be inserted into the side surface of the dust cover 122 to position the dust cover 122. A suction cup 46 is also sleeved on the positioning pin 45, and the suction cup 46 can be attached to the dust cover 122. A negative pressure air extraction port is arranged on the positioning pin 45 to discharge air.

[0058] Refer to Figure 3, a scanning assembly 6 is provided on the side of the moving plate 42 facing away from the storage box 1. The scanning assembly 6 includes a first driving member 61, a rotating frame 62 and a detection sensor 63. The first driving member 61 is fixedly connected to the moving seat 41, and the first driving member 61 can be a cylinder or a lead screw. A vertical plate 43 is fixedly connected to the side of the moving plate 42 facing away from the storage box 1. The rotating frame 62 is rotatably connected to the vertical plate 43, and the rotating frame 62 is sleeved on the outer wall of the moving plate 42. The bottom of the rotating frame 62 is rotatably connected to the first driving member 61. The detection sensor 63 is fixedly connected to the top of the rotating frame 62, and the detection sensor 63 can extend to the storage box 1 under the rotation of the rotating frame 62 to scan the wafers.

[0059] In the initial state, there is a gap between the upper part of the rotating frame 62 and the side of the moving plate 42 facing away from the storage box 1, and there is a gap between the detection sensor 63 and the moving plate 42; the vertical plane where the bottom of the rotating frame 62 is located is closer to the storage box 1 than the vertical plane of the top of the rotating frame 62. When the moving seat 41 moves downward, the first driving member 61 rotates the rotating frame 62 to move the detection sensor 63 in the direction close to the storage box 1. The detection sensor 63 scans the wafers in the storage box 1 as the moving seat 41 moves, and then feeds back the scanned content (such as the number of wafers, etc.) to the staff.

[0060] Refer to Figure 2 and Figure 3 , when using the large wafer box 12, the large wafer box 12 is installed on the wafer box mounting assembly 3. At this time, the dust cover 122 abuts against the moving plate 42, and the moving plate 42 and the dust cover 122 are fixed together by the positioning pin 45 and the latch rod 441. Then the moving plate 42 is moved away from the storage box 1, and the dust cover 122 is separated from the box body 121. Then the moving seat 41 is moved downward. At the same time, the detection sensor 63 is rotated to a state where it can scan the wafers, which is convenient for the subsequent material taking member 55 to operate. When using the small wafer box 11 (refer to Figure 1 ), since the small wafer box 11 (refer to Figure 1 ) is open without a cover, there is no need to use the positioning pin 45 and the latch rod 441.

[0061] Refer to Figure 3, the material taking mechanism 5 includes a support frame 51, a lifting block 52, a rotating platform 53, a connecting frame 54 and a plurality of material taking members 55. The bottom of the support frame 51 is fixedly connected to the machine frame 2, and the lifting block 52 is slidably connected to the support frame 51 in the vertical direction. The lifting block 52 can be moved by a lead screw or a cylinder. A bearing seat 56 is fixedly connected to one side of the lifting block 52 close to the cover opening mechanism 4, the rotating platform 53 is fixedly connected to the bearing seat 56, and the bottom of the connecting frame 54 is fixedly connected to the top of the rotating platform 53. The rotating platform 53 is used to drive the connecting frame 54 to rotate to the next working station for detecting wafers. The material taking members 55 are slidably connected to the connecting frame 54 along the direction of approaching or departing from the storage box 1. The material taking members 55 can be moved by a lead screw, a cylinder or a linear guide rail.

[0062] Referring to Figure 5 , the material taking member 55 is in a shape similar to the letter "Y", and the forked part is used to receive the wafer. An air extraction port 551 is provided at the part of the material taking member 55 far from the storage box 1 (referring to Figure 3 ), and a plurality of adsorption ports 552 are provided at the top of the material taking member 55 and close to the storage box 1 (referring to Figure 3 ). A plurality of air paths for connecting the adsorption ports 552 and the air extraction port 551 are arranged in the material taking member 55, and the air paths are connected to each other. The air extraction port 551 is connected to a device for generating negative pressure (such as a vacuum generator).

[0063] Referring to Figure 3 and Figure 5 , when it is necessary to take out the wafer, the position of the material taking member 55 in the vertical direction is changed by moving the lifting block 52 so that the material taking member 55 and the wafer to be taken are on the same horizontal plane. At this time, the rotating platform 53 and the bearing seat 56 move synchronously in the vertical direction. Then, the position of the material taking member 55 in the horizontal direction is changed so that the material taking member 55 extends into the storage box 1 until the material taking member 55 is located below the corresponding wafer. Then, the air extraction port 551 is controlled to be in the air extraction state, so that the wafer is sucked by the adsorption ports 552. Then, the position of the material taking member 55 in the horizontal direction is changed again to make it leave the storage box 1, and the taking out of the wafer is completed.

[0064] In this embodiment, the number of the material taking members 55 is 2. One material taking member 55 is located above the other material taking member 55, and there is a spacing between the two material taking members 55 in the vertical direction. Among them, the two material taking members 55 are respectively driven by two independent driving motors, and the two material taking members 55 can respectively extend into the wafer box to collect wafers. A calibration mechanism 7 is arranged at the bottom of the connecting frame 54, and the calibration mechanism 7 is used to rotate the wafer.

[0065] Referring to Figure 6, the calibration mechanism 7 includes a lifting component 71, a rotating component 72, and an adsorption component 73. The lifting component 71 is used to drive the adsorption component 73 to move in the vertical direction, the rotating component 72 is used to drive the adsorption component 73 to rotate, and the adsorption component 73 is used to fix the position of the wafer.

[0066] The lifting component 71 includes a mounting shell 711, a lifting plate 712, a second driving member, and a screw rod 714. The mounting shell 711 is fixedly connected to the bottom of the connecting frame 54. In this embodiment, the second driving member is a first motor 713. The first motor 713 is fixedly connected to the bottom of the mounting shell 711. The bottom of the screw rod 714 is rotatably connected to the inner bottom of the mounting shell 711, and the top of the screw rod 714 is rotatably connected to the inner top of the mounting shell 711. The screw rod 714 is vertically arranged. The output shaft of the first motor 713 is connected to the bottom of the screw rod 714 through a coupling. The lifting plate 712 is sleeved and fixedly connected to the outer wall of the screw rod 714. The outer wall of the lifting plate 712 abuts against the inner wall of the mounting shell 711. The rotating component 72 is located below the lifting plate 712.

[0067] Refer to Figure 6 , the rotating component 72 includes a third driving member and a transmission member. The third driving member drives the adsorption component 73 to rotate through the transmission member. In this embodiment, the third driving member is a second motor 721. The transmission member includes a first synchronous pulley 722, a second synchronous pulley 723, and a synchronous belt 724. The first synchronous pulley 722 is connected to the output shaft of the second motor 721 through a coupling. The second synchronous pulley 723 is sleeved and fixedly connected to the adsorption component 73. The synchronous belt 724 is sleeved on the second synchronous pulley 723 and the first synchronous pulley 722.

[0068] The adsorption component 73 includes a gas nozzle 731, an adsorption rod 732, and an adsorption seat 733. The adsorption rod 732 is rotatably connected to the bottom of the mounting shell 711. The bottom of the adsorption seat 733 is fixedly connected to the top of the adsorption rod 732. The adsorption rod rotates with the rotation of the second synchronous pulley and also moves with the movement of the lifting plate. A through hole for the adsorption seat 733 to pass through is provided at the top of the mounting shell 711. The diverging part of the material taking member 55 is adapted to the adsorption seat 733. When the adsorption seat 733 moves in the vertical direction, it can pass through the diverging part of the material taking member 55 without being blocked. The gas nozzle 731 is fixedly connected to the bottom of the adsorption rod 732. The gas nozzle 731 extends out of the mounting shell 711. The gas nozzle 731 is connected to a device for negative pressure. A channel is provided inside the adsorption rod 732. The channel is communicated with the adsorption seat 733 and the gas nozzle 731. A plurality of grooves 7331 are provided at the top of the adsorption seat 733 to make the wafer more firmly adsorbed on the adsorption seat 733. The second synchronous pulley 723 is sleeved and fixedly connected to the outer wall of the adsorption rod 732.

[0069] Refer to Figure 3, the calibration mechanism 7 further includes a detection component 74. The detection component 74 is fixedly connected to the frame 2. The detection component 74 is located above the wafer picking component 55. The detection component 74 is used to detect the notch position of the wafer, whether it is neatly arranged, and identify the wafer number, etc. The detection component 74 can be a wafer probe tester.

[0070] Refer to Figure 3 and Figure 6 , when picking up the wafer, change the position of the wafer picking component 55 to make it at the same height as the corresponding wafer; the wafer picking component 55 located above is used to pick up the first wafer, and the wafer picking component 55 located below is used to pick up the second wafer. Specifically, the wafer picking component 55 located above extends into the storage box 1, starts the negative pressure device to adsorb the corresponding wafer on the wafer picking component 55, and then makes the wafer picking component 55 leave the storage box 1 until the wafer picking component 55 is located below the detection component 74. The detection component 74 monitors the position of the first wafer in real time. Then use the lifting component 71 to drive the adsorption component 73 to move upward to lift the first wafer. The first wafer is separated from the wafer picking component 55. Use the rotation component 72 to rotate the first wafer. When the detection component 74 monitors that the notch of the first wafer rotates to the specified position, send a signal to stop the rotation component 72 from operating. Then use the lifting component 71 to make the calibrated wafer move downward to the wafer picking component 55 located above, complete the picking of the first wafer, and then pick the second wafer.

[0071] When picking the second wafer, the general process is similar to that of picking the first wafer. The difference is that when monitoring the wafer number and notch of the second wafer, it is necessary to stagger the position of the wafer picking component 55 in the horizontal direction located above from the wafer picking component 55 located below so that the first detection component 74 can illuminate the second wafer. And it should be noted that when the rotation component 72 lifts the second wafer, there is a distance between the top of the second wafer and the bottom of the first wafer.

[0072] The complete process of the detection device of the present application is as follows: Select a suitable storage box 1 and install it on the mounting seat 21, and then make the cover opening mechanism 4 descend, and at the same time count the number of wafers in the storage box 1. Then use the wafer picking component 55 located above to suck the corresponding first wafer to below the detection component 74. The calibration mechanism 7 rotates the wafer according to the information of the detection component 74 so that its notch is aligned with a certain specified position. Then use the lifting component 71 to place the first wafer on the corresponding wafer picking component 55. Then use the wafer picking component 55 located below to pick the second wafer so that the two wafers are in an interleaved state, and use the calibration mechanism 7 and the detection component 74 to adjust the positions of the wafers. Then the rotating platform 53 sends the two wafers to the next detection station for operation. After the next detection station completes the operation, the detection result is transmitted to the staff through a signal, and then the wafer is sent back to the original storage box 1 through the wafer picking component 55.

[0073] The embodiment of the present application also provides a method for automatically loading and detecting wafers, including the following steps:

[0074] Step 1): Install the storage box 1 on the wafer box installation component 3, and then the laser sensor 22 emits laser to detect the position of the storage box 1.

[0075] Step 2): Before taking out the wafer, the moving plate 42 descends with the moving seat 41. At the same time, the first driving member 61 is activated to drive the rotating frame 62 to rotate until the detection sensor 63 extends to a position close to the storage box 1. The detection sensor 63 scans the wafer as the moving plate 42 descends to obtain the number of wafers in the storage box 1.

[0076] Step 3): After taking out the wafer, change the position of the picking member 55 so that the picking member 55 is located below the detection component 74. The detection component 74 monitors the wafer located below it and feeds back its wafer number and notch position to the staff.

[0077] The above are all the preferred embodiments of the present application. The protection scope of the present application is not limited by this. Therefore, all equivalent changes made according to the structure, shape, and principle of the present application should be covered within the protection scope of the present application.

Claims

1. An automatic wafer loading device, characterized in that, It comprises a wafer box mounting assembly (3), a cover opening mechanism (4) and a material taking mechanism (5) arranged on a frame (2), wherein the cover opening mechanism (4) for opening the material storage box (1) is located on one side of the wafer box mounting assembly (3), and the material taking mechanism (5) for carrying wafers is located on a side of the cover opening mechanism (4) away from the wafer box mounting assembly (3); The feeding device further comprises a calibration mechanism (7) arranged on the material taking mechanism (5), the calibration mechanism (7) comprising a lifting component (71), a rotating component (72), an adsorption component (73) and a detection component (74), the lifting component (71) being connected to the material taking mechanism (5), the rotating component (72) being connected to the lifting component (71), the adsorption component (73) being connected to the lifting component (71) driving it to move in a vertical direction, the adsorption component (73) being connected to the rotating component (72) driving it to rotate, and the detection component (74) being arranged on the frame (2), and the detection component (74) being located above the adsorption component (73); The cover opening mechanism (4) comprises a movable seat (41) and a movable plate (42) for locking the cover of the large wafer box (12), wherein the movable seat (41) is slidably connected to the frame (2) in a vertical direction, and the movable plate (42) is slidably connected to the movable seat (41) in a horizontal direction; A scanning assembly (6) is arranged on the side of the movable plate (42) facing away from the material storage box (1), and the scanning assembly (6) comprises a first driving member (61), a rotating frame (62) and a detection sensor (63), wherein the first driving member (61) is arranged on the movable seat (41), the rotating frame (62) is rotatably connected to the movable plate (42), the rotating frame (62) is connected to the first driving member (61) that drives it to rotate to extend into or out of the material storage box (1), and the detection sensor (63) is arranged on the rotating frame (62).

2. The wafer automatic loading device according to claim 1, wherein: The adsorption component (73) comprises an air nozzle (731), an adsorption rod (732) and an adsorption seat (733) for supporting a wafer; the adsorption rod (732) is connected to the lifting component (71) and the rotating component (72); the bottom of the adsorption seat (733) is connected to the top of the adsorption rod (732); the air nozzle (731) is connected to the adsorption rod (732); a channel communicating with the air nozzle (731) and the adsorption seat (733) is provided inside the adsorption rod (732); and the detection component (74) is located above the adsorption seat (733).

3. The wafer automatic loading device according to claim 1, wherein: An installation base (21) is provided on the frame (2). The wafer cassette mounting assembly (3) is disposed on the installation base (21). The wafer cassette mounting assembly (3) includes a mounting plate (31), a retaining block (32), a hook (33), a plurality of groups of positioning posts (34) and a plurality of clamping members. The mounting plate (31) is disposed on the installation base (21). The hook (33) for fixing the large wafer cassette (12) is slidably connected to the mounting plate (31). The positioning post (34) for fixing the large wafer cassette (12) is fixedly connected to the mounting plate (31). The retaining block (32) for mounting the small wafer cassette (11) is fixedly connected to the mounting plate (31). The clamping member for mounting the small wafer cassette (11) is slidably connected to the mounting plate (31).

4. The wafer automatic loading device according to claim 1, wherein: The material taking mechanism (5) includes a support frame (51), a lifting block (52), a rotating platform (53), a connecting frame (54) and a plurality of material taking members (55). The support frame (51) is fixedly connected to the bracket. The lifting block (52) is slidably connected to the support frame (51) in the vertical direction. The rotating platform (53) is fixedly connected to the lifting block (52). The connecting frame (54) is connected to the rotating platform (53). The material taking member (55) is slidably connected to the connecting frame (54) in a direction close to or away from the storage box (1). The lifting assembly (71) is connected to the connecting frame (54). The adsorption assembly (73) passes through the connecting frame (54).

5. The wafer automatic loading device according to claim 4, characterized in that: An air extraction port (551) is formed at a position of the material taking member (55) away from the storage box (1). A plurality of adsorption ports (552) are formed at the top of the material taking member (55) and close to the storage box (1). A plurality of air paths for communicating the adsorption ports (552) with the air extraction port (551) are provided in the material taking member (55).

6. The wafer automatic loading device according to claim 5, wherein: The material taking member is in a shape similar to the letter "Y", and the adsorption assembly passes through the diverging part of the material taking member.

7. The wafer automatic loading device according to any one of claims 4-6, characterized in that: Two groups of the material taking members (55) are provided. One of the material taking members (55) is located above the other material taking member (55), and there is a distance between the two material taking members (55) in the vertical direction.

8. A wafer automatic loading and detecting method, based on the wafer automatic loading device according to any one of claims 1-7, characterized in that, It includes the following steps: Step 1): Install the storage box (1) on the wafer cassette mounting assembly (3). Then, the laser sensor (22) disposed on the wafer cassette mounting assembly (3) and the frame (2) emits laser to detect whether the storage box (1) is installed in place. Step 2): Before taking out the wafer, lower the moving plate (42), and rotate the rotating frame (62) to drive the detection sensor (63) to extend towards the storage box (1). The detection sensor (63) scans the wafers in the storage box (1) as the moving plate (42) descends to obtain the wafer information in the storage box (1). Step 3): After taking out the wafer, change the position of the material taking member (55) to make the material taking member (55) located below the detection assembly (74). The detection assembly (74) monitors the wafers located below it and feeds back their wafer numbers and notch positions to the staff.

Images