Electronic device

Abstract

The present application provides an electronic device, including a housing assembly and a receiver assembly. The housing assembly includes a first housing and a second housing. The first housing defines an accommodation space for accommodating the receiver assembly. The receiver assembly includes a receiver unit, a circuit board, and a conduction member. The conduction member electrically connects the receiver unit and the circuit board. The second housing is connected to the first housing and also connects the conduction member. The present application realizes signal conduction between the receiver unit and the circuit board by means of the conduction member. Compared with the technical solution of the receiver flexible cable module in the prior art, the arrangement of the conduction member in the present application simplifies the structure of the traditional receiver flexible cable module and reduces the assembly and maintenance costs.

Description

Technical Field

[0001] The present application relates to an electronic device, and particularly to an electronic device with a receiver assembly. Background Art

[0002] At present, in a mobile device, a receiver is generally connected to a main board through a receiver flexible cable module (the receiver flexible cable module includes a flexible cable unit, an adhesive tape, a reinforcing plate, etc.), and a board-to-board connector or a spring piece. However, connecting the receiver and the main board through the receiver flexible cable module and the board-to-board connector or the spring piece has the following problems: (1) numerous parts, complex assembly and low yield; (2) high assembly and maintenance costs. Summary of the Invention

[0003] In view of this, it is necessary to provide an electronic device to solve the above problems.

[0004] The present application provides an electronic device, including a housing assembly. The housing assembly includes a first housing and a second housing. The electronic device further includes a receiver assembly. The first housing defines a receiving space for receiving the receiver assembly. The receiver assembly includes a receiver unit, a circuit board and a conducting member. The conducting member electrically connects the receiver unit and the circuit board. The second housing connects the first housing and also connects the conducting member.

[0005] Optionally, the conducting member includes a first conducting portion, a second conducting portion and a connecting portion. The first conducting portion electrically connects the receiver unit and also connects the second housing. The second conducting portion electrically connects the circuit board. The connecting portion is connected between the first conducting portion and the second conducting portion.

[0006] Optionally, the first conducting portion includes a main body portion and a plurality of extending portions. The main body portion connects the connecting portion. The plurality of extending portions extend outward from the edge of the main body portion. The plurality of extending portions are bent away from the receiver unit relative to the main body portion to form a receiving space together with the main body portion.

[0007] Optionally, the plurality of extending portions are spaced apart. A gap is formed between two adjacent extending portions and between the connecting portion and its adjacent extending portion. Part of the second housing is disposed in the receiving space and the gap to connect the first conducting portion.

[0008] Optionally, the second conducting portion connects to one end of the connecting portion away from the first conducting portion and is bent towards the connecting portion relative to the circuit board. Wherein, the connection between the connecting portion and the second conducting portion is electrically connected to the circuit board.

[0009] Optionally, a protective layer is disposed on the outer surface of the conducting member.

[0010] Optionally, the first housing includes a bottom plate and a side plate facing away from the bottom plate. The side plate protrudes from the edge of the bottom plate to form the accommodation space together with the bottom plate. The receiver unit and the circuit board are both disposed on the bottom plate.

[0011] Optionally, a receiving groove for receiving the receiver unit is provided on the bottom plate. The receiving groove includes a groove bottom plate and a groove side plate. The groove bottom plate is disposed on the bottom plate, and the groove side plate surrounds the periphery of the groove bottom plate to form the receiving groove.

[0012] Optionally, a notch matching the receiving groove is provided on one side of the circuit board, and the receiving groove is located within the notch.

[0013] Optionally, the second housing is formed by in-mold injection molding.

[0014] In this application, the signal conduction between the receiver unit and the circuit board is achieved by means of the conduction member. Compared with the technical solution of the receiver flexible cable module in the prior art, the arrangement of the conduction member in this application simplifies the structure of the traditional receiver flexible cable module and reduces the assembly and maintenance costs. In addition, through the connection between the second housing and the conduction member, the conduction member is fixed, thereby ensuring the reliability of the electrical contact between the conduction member and the receiver unit as well as the circuit board, and greatly improving the yield rate of the receiver assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic structural diagram of an electronic device according to an embodiment of this application.

[0016] Figure 2 is Figure 1 A partial structural diagram of the illustrated electronic device.

[0017] Figure 3 is Figure 2 An exploded diagram of the illustrated partial electronic device.

[0018] Figure 4 is Figure 3 An exploded diagram of the illustrated partial electronic device.

[0019] Figure 5 is Figure 1 A schematic structural diagram of the illustrated first housing.

[0020] Figure 6 is Figure 3 A side view of the illustrated conduction member.

[0021] Figure 7 is Figure 3 A schematic structural diagram of the illustrated conduction member.

[0022] Figure 8For Figure 7 Schematic structural diagram of the conduction component shown from another perspective.

[0023] Description of main component symbols

[0024] Electronic device 100

[0025] Housing assembly 10

[0026] First housing 11

[0027] Receiving space 111

[0028] Bottom plate 112

[0029] Side plate 113

[0030] Receiving groove 114

[0031] Groove bottom plate 1141

[0032] Groove side plate 1142

[0033] Second housing 12

[0034] Receiver assembly 20

[0035] Receiver unit 21

[0036] Circuit board 22

[0037] Notch 221

[0038] Conduction component 23

[0039] First conduction part 231

[0040] Main body part 2311

[0041] Extension part 2312

[0042] Gap 2313

[0043] Receiving space 2314

[0044] Second conduction part 232

[0045] Connection part 233

[0046] The following specific embodiments will further illustrate the present application in conjunction with the above drawings. Specific embodiments

[0047] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used in the description of this application herein are only for the purpose of describing specific embodiments, and are not intended to limit this application.

[0049] Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0050] Refer to Figure 1 , an electronic device 100 is disclosed in an embodiment of the present application. The electronic device 100 is not limited to mobile phones, tablet computers, etc. In this embodiment, the electronic device 100 will be taken as a mobile phone as an example for illustration. Among them, the structure of the mobile phone is not limited to Figure 1 the structure shown.

[0051] Please refer to Figure 2 and Figure 3 , the electronic device 100 includes a housing assembly 10 and a receiver assembly 20. The housing assembly 10 includes a first housing 11 and a second housing 12. The first housing 11 defines a receiving space 111 for receiving the receiver assembly 20. The receiver assembly 20 includes a receiver unit 21, a circuit board 22, and a conducting member 23. The conducting member 23 is electrically connected to the receiver unit 21 and the circuit board 22. The second housing 12 is connected to the first housing 11 and also connects the conducting member 23. In one embodiment, the second housing 12 and the conducting member 23 are electrically insulated.

[0052] The present application realizes signal conduction between the receiver unit 21 and the circuit board 22 by means of the conducting member 23. Compared with the technical solution of the receiver flexible cable module in the prior art, the arrangement of the conducting member 23 in the present application simplifies the structure of the traditional receiver flexible cable module and reduces the assembly and maintenance costs. In addition, through the connection of the second housing 12 and the conducting member 23, the conducting member 23 can be fixed, thereby ensuring the reliability of the electrical contact between the conducting member 23 and the receiver unit 21 and the circuit board 22, and greatly improving the yield rate of the receiver assembly 20.

[0053] Refer to Figure 2 and Figure 4, in this embodiment, the first housing 11 includes a bottom plate 112 and side plates 113. The side plates 113 protrude from the edge of the bottom plate 112 to form the accommodation space 111 with the bottom plate 112. Among them, the second housing 12 is connected to the side of the side plates 113 away from the bottom plate 112. The receiver unit 21 and the circuit board 22 are disposed on the bottom plate 112.

[0054] Among them, the material of the first housing 11 can be metal, plastic or a composite material of metal and plastic. The metal can be selected from one or more of steel alloy, aluminum alloy, ferroalloy, copper alloy, nickel alloy and stainless steel. The plastic can be selected from one or more of polystyrene (PS), polypropylene (PP), polyethylene (PE), polyester (PET), polyvinyl chloride (PVC), polyimide (PI), acrylonitrile-butadiene-styrene plastic (ABS), polycarbonate (PC) and polyamide (PA).

[0055] Refer Figure 4 and Figure 5 , further, a receiving groove 114 for receiving the receiver unit 21 is provided on the bottom plate 112. The receiving groove 114 includes a groove bottom plate 1141 and groove side plates 1142. In this embodiment, the groove bottom plate 1141 is a part of the bottom plate 112. In other embodiments, the groove bottom plate 1141 is formed by being recessed downward or protruding upward from a part of the bottom plate 112. Among them, the groove side plates 1142 surround the periphery of the groove bottom plate 1141 to form the receiving groove 114.

[0056] Refer Figure 5 , in this embodiment, the groove side plates 1142 are connected to some of the side plates 113 and together surround the periphery of the groove bottom plate 1141 to form the receiving groove 114. Of course, in other embodiments, the groove side plates 1142 are not connected to the side plates 113. That is, the groove side plates 1142 alone surround the periphery of the groove bottom plate 1141 and form the receiving groove 114.

[0057] Refer Figure 3 and Figure 4 , a notch 221 matching the receiving groove 114 is provided on one side of the circuit board 22. Among them, the circuit board 22 is disposed on the bottom plate 112, and the receiving groove 114 is located within the notch 221. Thus, one end of the conducting member 23 is connected to the receiver unit 21, and the other end can be lapped on the circuit board 22.

[0058] In one embodiment, electrical connection terminals (not shown in the figures) are respectively provided on the earpiece unit 21 and the circuit board 22. In this way, the conducting member 23 can be respectively connected to the electrical connection terminals on the earpiece unit 21 and the circuit board 22 to achieve signal conduction between the earpiece unit 21 and the circuit board 22. Among them, the electrical connection terminals are not limited to pads, connectors, gold fingers, etc.

[0059] Refer Figure 3 , in this embodiment, the earpiece assembly 20 includes two of the conducting members 23. In other embodiments, the number of the conducting members 23 can be adaptively adjusted according to actual needs and can be three, four, etc.

[0060] Refer Figure 3 and Figure 6 , each conducting member 23 includes a first conducting portion 231, a second conducting portion 232 and a connecting portion 233. The first conducting portion 231 is electrically connected to the earpiece unit 21, the second conducting portion 232 is connected to the circuit board 22, and the connecting portion 233 is connected between the first conducting portion 231 and the second conducting portion 232. In this embodiment, the first conducting portion 231 is disposed on the surface of the earpiece unit 21 facing away from the bottom plate 112. The second conducting portion 232 is disposed on the surface of the circuit board 22 facing away from the bottom plate 112.

[0061] Refer Figure 7 and Figure 8 , the first conducting portion 231 includes a main body portion 2311 connecting the connecting portion 233 and a plurality of extending portions 2312 connecting the main body portion 2311. In this embodiment, the main body portion 2311 is disposed on the surface of the earpiece unit 21 facing away from the bottom plate 112.

[0062] Among them, the shape of the main body portion 2311 is not limited to regular shapes such as rectangles, circles, rhombuses, etc. or other irregular shapes. The shape of the extending portion 2312 is not limited to regular shapes such as rectangles, circles, rhombuses, etc. or other irregular shapes.

[0063] Refer Figure 7 and Figure 8 , the plurality of extending portions 2312 extend outward from the edge of the main body portion 2311. Among them, the plurality of extending portions 2312 are bent away from the earpiece unit 21 relative to the main body portion 2311 and form a receiving space 2314 with the main body portion 2311. In this embodiment, the first conducting portion 231 includes three of the extending portions 2312. In other embodiments, the number of the extending portions 2312 can be set according to the size, shape, etc. of the main body portion 2311 and can be two, four, five, etc.

[0064] Reference Figure 7 and Figure 8 , the plurality of extension portions 2312 are arranged at intervals. In this way, a gap 2313 is formed between two adjacent extension portions 2312 and between the connecting portion 233 and its adjacent extension portion 2312. Wherein, part of the second housing 12 is disposed in the receiving space 2314 and the gap 2313 to fix the conducting member 23, thereby ensuring the reliability of the electrical contact between the conducting member 23, the earphone unit 21, and the circuit board 22.

[0065] Wherein, the plurality of extension portions 2312 are provided to strengthen the connection between the second housing 12 and the conducting member 23 and prevent the conducting member 23 from falling off.

[0066] In one embodiment, the second housing 12 is not limited to being formed by in-mold injection. The material of the second housing 12 is not limited to one or more of polystyrene (PS), polypropylene (PP), polyethylene (PE), polyester (PET), polyvinyl chloride (PVC), polyimide (PI), acrylonitrile-butadiene-styrene plastic (ABS), polycarbonate (PC), and polyamide (PA).

[0067] Reference Figure 3 、 Figure 6 and Figure 7 , it can be understood that since there is a height difference between the earphone unit 21 and the circuit board 22, thus, the connecting portion 233 is inclined toward the circuit board 22 relative to the plane where the main body portion 2311 is located. Wherein, the connecting portion 233 is in the shape of a flat plate.

[0068] Reference Figure 3 、 Figure 6 、 Figure 7 and Figure 8 , the second conducting portion 232 is connected to one end of the connecting portion 233 away from the first conducting portion 231 and is bent toward the connecting portion 233 relative to the circuit board 22. Wherein, the connection between the connecting portion 233 and the second conducting portion 232 is electrically connected to the circuit board 22.

[0069] In this embodiment, the conducting member 23 is integrally formed. Of course, in other embodiments, the first conducting portion 231, the second conducting portion 232, and the connecting portion 233 can be connected into the conducting member 23 by a welding process.

[0070] Furthermore, a protective layer is further provided on the outer surface of the conducting member 23. The protective layer is provided to improve the durability of the conducting member 23 and ensure the power-on effect of the earphone unit 21 and the circuit board 22. In one embodiment, the material of the protective layer is gold. The protective layer can be formed on the outer surface of the conducting member 23 by an electroplating process.

[0071] Reference Figures 2 to 8 , the assembly steps of the electronic device 100 will be briefly described below:

[0072] First, provide a first housing 11.

[0073] Secondly, place the receiver unit 21 into the receiving groove 114, and then set the circuit board 22 on the bottom plate 112. Among them, the receiving groove 114 is located at the position of the notch 221 of the circuit board 22.

[0074] Then, electrically connect the two conductive members 23 to the receiver unit 21 and the circuit board 22 respectively.

[0075] Finally, place the above assembled components into an injection mold (not shown in the figure), and then inject resin to form a second housing 12 connecting the first housing 11. Among them, the resin is injected into the receiving space 2314 and the gap 2313 together, so that the second housing 12 is connected to the first conducting portion 231, thereby realizing the fixation of the conductive member 23.

[0076] The above embodiments are only used to illustrate the technical solutions of the present application rather than to limit them. Although the present application has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present application can be modified or equivalently replaced without departing from the spirit and essence of the technical solutions of the present application.

Claims

1. An electronic device, comprising a housing assembly, the housing assembly including a first housing and a second housing, characterized in that, The electronic device further includes a receiver assembly. The first housing defines a receiving space for receiving the receiver assembly. The receiver assembly includes a receiver unit, a circuit board, and a conducting member. The conducting member electrically connects the receiver unit and the circuit board. The second housing is connected to the first housing and also connects the conducting member. Wherein, the conducting member includes a first conducting portion, a second conducting portion, and a connecting portion. The connecting portion is connected between the first conducting portion and the second conducting portion. The first conducting portion includes a main body portion and a plurality of extending portions. The main body portion electrically connects the receiver unit. The plurality of extending portions extend outward from the edge of the main body portion. The plurality of extending portions are bent away from the receiver unit relative to the main body portion and are connected to the second housing. The second conducting portion is connected to one end of the connecting portion away from the first conducting portion and is bent toward the connecting portion relative to the circuit board. The connection between the connecting portion and the second conducting portion is electrically connected to the circuit board. The plurality of extending portions are spaced apart, and gaps are formed between adjacent two extending portions and between the connecting portion and its adjacent extending portion.

2. The electronic device according to claim 1, wherein The plurality of extending portions and the main body portion form a receiving space, and a part of the second housing is disposed in the receiving space and the gaps to connect the first conducting portion.

3. The electronic device according to any one of claims 1 to 2, characterized in that A protective layer is disposed on the outer surface of the conducting member.

4. The electronic device according to any one of claims 1 to 2, characterized in that, The first housing includes a bottom plate and a side plate opposite to the bottom plate. The side plate protrudes from the edge of the bottom plate to form the receiving space together with the bottom plate. The receiver unit and the circuit board are both disposed on the bottom plate.

5. The electronic device according to claim 4, wherein A receiving groove for receiving the receiver unit is provided on the bottom plate. The receiving groove includes a groove bottom plate and a groove side plate. The groove bottom plate is disposed on the bottom plate, and the groove side plate surrounds the periphery of the groove bottom plate to form the receiving groove.

6. The electronic device according to claim 5, wherein A notch matching with the receiving groove is provided on one side of the circuit board, and the receiving groove is located within the notch.

7. The electronic device according to any one of claims 1 to 2, characterized in that The second housing is formed by in-mold injection.

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