Test arrangement, automated test equipment, and method for testing a device under test including an antenna

By using conductor probes in the reactance near field area for wireless testing, the mechanical complexity and high cost of antenna arrays in integrated circuits are solved, and efficient and accurate antenna array testing is achieved, suitable for automated testing equipment.

CN113661396BActive Publication Date: 2025-07-11ADVANTEST CORP
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Patent Information

Application Number
CN201980095245.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2019-08-28
Publication Date
2025-07-11
Estimated Expiration
2039-08-28

AI Technical Summary

Technical Problem

When testing embedded antenna arrays in integrated circuits, prior art has high mechanical complexity, high cost and difficulty in integrating into large-scale production tests, and traditional measurement methods cannot effectively test the independent performance of each antenna element.

Method used

Using wireless testing methods in the near-field area of reactance, a probe composed of two conductors is used to guide the signal to or from the feed point of the antenna element through the transmission line to avoid mechanical interference and achieve accurate measurement of the antenna array.

Benefits of technology

It realizes efficient and accurate testing of antenna arrays in integrated circuits, reduces testing costs, and can independently measure each antenna element in the near-field area of reactance, which is suitable for automated testing equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

One embodiment according to the present invention is a test arrangement for testing a DUT including an antenna. The test arrangement includes a DUT position and a probe, the probe including two conductors. The test arrangement is configured to position the probe near the DUT position such that when the DUT is placed in the DUT position (e.g., in a DUT socket) or in a region where the DUT is contacted by the probe, the probe is in the reactive near-field region of the antenna element of the DUT.
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Description

Technical Field

[0001] The present invention relates to a test arrangement for testing a device under test including an antenna. Other embodiments according to the present invention relate to an automated test equipment having a single or multiple sites for testing a device under test including an antenna. Other embodiments according to the present invention relate to a method for testing a device under test including an antenna. Embodiments according to the present invention relate to a system and method for over-the-air electronic testing of an integrated circuit having an embedded antenna array. Background Art

[0002] With the continuous push for integration, miniaturization, and wireless connectivity, a new generation of devices for wireless applications (such as 5G or WiGig) is being developed, which includes communication antennas in an integrated circuit wafer or package instead of being separate as in previous generations. These antennas are typically implemented as array antennas with multiple elements.

[0003] Wireless mobile or nomadic communication at millimeter-wave frequencies ensures gigabit-per-second data rates per user. Therefore, both the WLAN-based and / or cellular 5G standards envision user access at frequencies such as up to 28 GHz, 39 GHz, 60 GHz, or higher. To achieve relevant link distances, despite the high free-space attenuation at millimeter-wave frequencies, for example, highly directive antennas can be employed at both ends of the link, on the base station side and on the user device side. To support mobility and / or flexibility, for example, electronic beam steering using, for example, the phased array principle can be employed on the user device side.

[0004] The millimeter-wave spectrum provides frequency bandwidth resources, for example, for high-throughput or high-data-rate wireless transmissions. Therefore, for example, 5G wireless communication as well as, for example, advanced WiFi systems envision the use of millimeter waves. According to Friis transmission equation

[0005]

[0006] where

[0007] ·P rec and P t are the received power and the transmitted power,

[0008] ·G rec and G t are the antenna gains,

[0009] ·r is the distance,

[0010] ·and λ0 represents the wavelength of the signal in air,

[0011] The high free-space loss or high attenuation per unit distance at millimeter-wave frequencies can be compensated for by, for example, high-gain antennas at one or both ends of a wireless link. High-gain antennas have a narrow beamwidth. For mobile or nomadic applications, for example, the beam direction of the antenna can be adjusted appropriately and pointed at the opposite end of the link. This includes adjusting the polarization.

[0012] For compactness, low cost, and low loss between transceiver electronics and the air interface, packaged integrated antenna array modules are favored, which include one or several multi-transceiver integrated circuits together with a multi-layer planar antenna array. The form factor of the antenna array plays an important role, so a two-dimensional planar array with a beam preferably having dual linear polarization perpendicular to the array can be used together with a beam from a linear array having end-fire, preferably lateral radiation.

[0013] For example, most applications rely on electronic beam steering and / or beam switching and do not rely on mechanical means to change the beam direction but are achieved by using an antenna array. Although not strictly required, many antenna arrays still place the radiating elements of the array close to each other to, for example, avoid radiation in unwanted directions or constructive interference of the corresponding contributions of the radiators of the array. For a planar array, the typical distance or center-to-center distance between the elements of the array is, for example, about 0.6 times the wavelength λ0 (which is the free-space wavelength).

[0014] Thus, a general antenna array consists of a plurality of radiator elements on a plane, each radiator element allowing radiation in two orthogonal, isolated polarizations in a direction perpendicular to the plane and in a spatial sector centered on that vertical axis. The array is periodic in two directions in the plane with a period of 0.6×λ0.

[0015] The standard operation of such an antenna array, for example, involves predictable constructive interference of all the radiation contributions from the array elements in a given spatial direction. This requires a well-defined (preferably for both polarizations including transmit and / or receive electronics) operation of each radiator element in terms of amplitude and phase.

[0016] Rather complex integrated circuits can combine, for example, up to 32 transceiver channels and / or built-in self-test functions on a chip. The complete radiation module combines one or several integrated transceiver chips and a multi-layer board with signal distribution and an antenna array, showing significant packaging complexity and thus requiring testing during production. In addition, for example, a user device can include several radiation modules at different, spatially separated locations of the device, and it can operate in a multi-beam or MIMO mode. This particularly involves testing the full capabilities of such a user device in an over-the-air (OTA) test.

[0017] In the past, antennas were not included in the device under test (DUT), and these devices were tested using standard radio frequency (RF) measurement techniques through electrical connections. A wireless DUT with an integrated antenna array in a wafer or package can be tested in its mission mode through a reciprocal antenna or antenna array, which measures the wireless signals from the DUT and / or can also provide an excitation signal to the DUT. In other words, a DUT with an integrated antenna array can be tested not only in the transmit mode of the DUT but also, or in some cases required to be, in the receive mode of the DUT. An automated test equipment (ATE) or system for testing these types of devices requires a method and probes and / or antennas to wirelessly receive and excite the DUT, also known as over-the-air (OTA) testing. The standard measure for measuring a DUT using an integrated antenna array is to use a standard off-the-shelf antenna, such as a horn antenna, in a far-field measurement region on a properly shielded measurement enclosure (which indicates far from the DUT).

[0018] The operation of the array can be tested by measuring the surrounding space at a certain well-defined distance using a probe in order to use spherical coordinates θ and plotting the radiation intensity in all spatial directions for measuring transmission (while measuring reception is similar). This concept is typically implemented in an anechoic measurement chamber with spherical scanning capabilities.

[0019] In addition to the mechanical complexity of precision spherical scanning, the distance between the array and the probe antenna can be quite large, and the measurement may be carried out in the far-field region of the array antenna. The minimum distance for the far field is approximately 2×D 2 / λ0, where D represents the maximum size of the antenna array, typically the diagonal length of the array aperture. In medium- to high-gain millimeter-wave arrays, this far-field distance can be several meters.

[0020] Adapting traditional anechoic chamber measures for far-field measurements becomes a very expensive investment due to the large number of antenna probes connected to test transceivers that need to be installed in the anechoic chamber. This measure is also not practical for production testing due to the excessive measurement time for each device.

[0021] Although this measure is very suitable for laboratory-type measurement setups, it may not be integrable into a standard test cell for high-volume testing of integrated circuits due to the required size. In addition, by working in the far-field region with a single antenna, it measures the DUT antenna array as a single beam, which means that all antenna elements are radiating and their signals are combined into a single beam, rather than each individual element on the DUT antenna array separately. If the probing antenna is brought close to each individual antenna element of the antenna array on the DUT, the measuring or probing antenna itself will interfere with the DUT antenna array elements and invalidate the measurement.

[0022] Alternatively, the probe can preferably perform a spherical scan around the antenna array at a short distance in the so-called radiative near field. These measurement data including amplitude and / or phase can be mathematically transformed into the far field by using Fourier transform. To some extent, these data can also be transformed towards the antenna array until the local field distribution across the radiation aperture is obtained or approximately obtained. Then, the individual faulty antenna array radiator elements can be located.

[0023] Returning to traditional near-field measurements, i.e., electrically characterizing large radiative structures by probing them in their radiative near field and then performing a mathematical transformation, is not helpful because the measurement time of the DUT may become longer, for example, because all spatial directions need to be scanned.

[0024] For production testing or for calibration of a complete radiative module, it may be sufficient to characterize the path of the air interface from a given transceiver of the radiative module to the connected radiator elements. Assuming that a test mode of the radiative module supports sequential testing of all transceivers, such a test can be carried out using a single probe antenna placed in front of the array antenna (at a small distance from it or in the radiative near field of the antenna array, but still in the far field of a single radiative element of the array).

[0025] In other words, the operation of probing a single antenna array radiator in terms of amplitude and phase in a single spatial direction together with the associated transmit or receive chain. If this works as required, it is assumed that the radiative properties in all other directions (including coupling with other array elements) also work. The latter assumption is based on design, simulation, or prior measurements of known good devices. An example of such a measure is when the probe antenna is placed in front of the array. The elements of the array are selected one by one. The distance between the antenna array and the probe antenna is such that the probe antenna is in the radiative near field of the array antenna but in the far field of a single radiative array element. A non-reflective and / or absorptive housing allows for a compact setup.

[0026] Although the concept is simple, there are several drawbacks. First, as a sequential concept, it may be more time-consuming than more parallelized measures. Second, depending on the geometry of the setup, the probe antenna "sees" the individual radiative elements of the large antenna array in the compact setup at different angles, so the absolute measurement is quite complex and thus only the comparison with a known good device seems to be simple. Third, the coupling from the "on" radiator element to other radiator elements may be superimposed on the measured response in a rather complex way (such as through free space but not in the far field and / or through board surface waves and / or through transceiver mismatch) and may not be reliably quantifiable.

[0027] In view of this situation, there is a need for a concept that improves the trade-off between the complexity, accuracy, and cost of testing a DUT that includes antenna elements. Summary of the Invention

[0028] According to one aspect of the present invention, it has been found that it is advantageous to test a DUT wirelessly in a very close range within the so-called reactive near-field electromagnetic operating range. This not only avoids the integration and / or mechanical problems of solutions that work in the far-field electromagnetic operating range (where the measurement antenna needs to be far from the DUT), but also allows the measurement of each individual antenna element on the DUT antenna array.

[0029] According to one embodiment of the present invention, there is a test arrangement for testing a DUT that includes an antenna. The test arrangement includes a DUT position and a probe, and the probe includes two conductors. The test arrangement is configured to position the probe near the DUT position such that when the DUT is placed in the DUT position (e.g., in a DUT socket) or in an area where the DUT is contacted by the probe, the probe is in the reactive near-field region of the DUT's antenna element.

[0030] The test arrangement or the measurement probe of the test arrangement allows wirelessly and / or over-the-air (OTA) and / or electronically testing a DUT with an integrated antenna array in a very close range in the so-called reactive near-field operation mode. The test arrangement and / or the probe of the test arrangement can be placed very close to the DUT, for example, in the DUT position of an ATE. The test arrangement can be easily integrated on the current automated test units for electronically testing a large number of integrated circuits.

[0031] In a preferred embodiment, the probe of the test arrangement is configured to receive signals transmitted by the DUT via the DUT's antenna. The probe of the test arrangement is also configured to transmit signals to be received by the DUT using the DUT's antenna. For example, the test arrangement is configured to test a DUT that includes an antenna that can be used to transmit and / or receive signals.

[0032] According to another embodiment, the probe includes two parallel conductors within a tolerance of ±10° or within a tolerance of ±20°, such as parallel wires. For example, the parallel conductors of the probe have the same inclination angle with respect to the plane of the antenna and are exposed to the same interfering or non-interfering signals.

[0033] In a preferred embodiment, the two conductors of the probe form a transmission line. For example, a transmission line is a structured design for conducting alternating current of radio frequency signals and taking into account their volatility. Therefore, waves can be guided to the feed point via the transmission line, thereby allowing the evaluation of signals radiated by the antenna elements of the DUT.

[0034] According to another embodiment, the two conductors of the probe form a single transmission line at the antenna-side end, at the open end, or at the shorted end. For example, disturbing and / or non-disturbing electromagnetic interference tends to affect the two conductors of the probe in the same manner.

[0035] Furthermore, the transmission line can guide the wave excited by the antenna of the DUT to the feed point, or can guide the wave from the feed point to the DUT to excite the antenna of the DUT.

[0036] In a preferred embodiment, the two conductors of the probe form a transverse electromagnetic (TEM) transmission line or a quasi-TEM transmission line, for example at the antenna-side end, for example at the open end or at the shorted end.

[0037] For example, the wave propagates in a transverse electric and magnetic mode, which means that both the electric field and the magnetic field are perpendicular to the propagation direction. The TEM line can be bent and twisted without generating excessive negative effects or unwanted currents therein.

[0038] According to another embodiment, the two conductors of the probe form a symmetric or substantially symmetric transmission line (e.g., a parallel or coplanar strip line) at the antenna-side end, for example, and smoothly transition to a microstrip line at the feed-side end. The microstrip transmission line is highly compatible with current circuit construction techniques.

[0039] According to other embodiments, the two conductors of the probe form parallel strip lines at the antenna-side end, for example, and smoothly transition to a coaxial line at the feed-side end. The coaxial line ensures a simple connection between the two conductors of the test arrangement probe and the feed structure or other parts of the test arrangement and / or an automated test equipment (ATE) including the test arrangement.

[0040] According to other embodiments, by using one or more balun circuits and / or 180° hybrid circuits, the balanced currents of the two conductors of the probe are combined or matched to be converted to an unbalanced line, such as a microstrip line or a strip line. The balun circuit converts between a balanced signal and an unbalanced signal and helps connect the probe antenna to the feed line (e.g., a coaxial line).

[0041] According to one embodiment, the two conductors of the probe are separated by a dielectric spacer. The dielectric spacer between the two conductors improves the lifetime and stability of the two conductors of the probe and prevents physical contact between the probe and the antenna array element.

[0042] According to other embodiments, the test arrangement is configured to position the probe such that the two conductors of the probe are electrically separated or isolated from the antenna of the DUT. The electrical separation between the two conductors and the DUT antenna ensures that the probe does not contact the antenna, and the probe of the test arrangement tests the transmission signal of the antenna of the DUT.

[0043] According to other embodiments, the probe and the antenna of the DUT are separated by a dielectric spacer or by a defined air gap. The dielectric spacer or the defined air gap between the antenna and the probe increases the lifetime of the probe and ensures a fixed distance between the antenna and the probe and prevents physical contact between the probe and the antenna array elements.

[0044] In a preferred embodiment, the test arrangement is configured to position the probe in the vicinity of and / or in the reactive near field of the antenna of the DUT, where the distance between the probe and the antenna of the DUT is less than 0.1×λ0, where λ0 is the free space wavelength of the signal to be measured. Positioning the probe in the vicinity of and / or in the reactive near field of the DUT antenna allows the antenna elements of the antenna array of the DUT to be probed such that only the probed radiator element will couple significantly to the probe and not its neighbors.

[0045] According to other embodiments, the two conductors of the probe are lines on a printed circuit board, where the feed circuit system is optionally also on the printed circuit board by using printed circuit board technology. Printing the two conductors and / or the probe and / or the feed circuit system on the circuit board allows for fast and / or cost-effective production of the two conductors and / or the probe and / or the feed circuit system.

[0046] According to a further embodiment, the two conductors of the probe are needle-shaped pins. The needle-shaped pins have less impact on the transmitted signal of the DUT antenna, for example less than the probe, where the two conductors are lines on a printed circuit board.

[0047] According to another embodiment, the two conductors of the probe are separate, end-open, non-connected conductors, which indicates a small physical spacing between the conductors: the pitch. The small physical spacing between the two conductors allows the electric field of the DUT antenna to be measured, where a balun circuit or a 180° hybrid circuit can be used to combine the signals of the conductors.

[0048] According to other embodiments, the two end-open conductors are configured to probe the electric field of the patch antenna and / or slot antenna of the DUT.

[0049] In a preferred embodiment, the two end-open conductors of the probe are arranged such that the direction from the first open end to the second open end is parallel (within a tolerance of ±10° or ±20°) to the average direction of the electric field in the region between the first open end and the second open end of the antenna element. Positioning the probe such that the direction from the first open end to the second open end is substantially parallel to the average electric field vector maximizes the received signal transmitted by the antenna of the DUT and / or minimizes the impact of the probe on the signal transmitted by the DUT antenna.

[0050] According to another embodiment, the conductors with open ends at the two ends of the probe are arranged such that the direction of the first conductor in the region of the first open end (which represents along the main extension) is perpendicular to the average direction of the electric field of the antenna of the DUT within a tolerance of ±10° or within a tolerance of ±20°. Additionally, the direction of the second conductor in the region of the second open end (which represents along the main extension) is perpendicular to the average direction of the electric field of the antenna of the DUT within a tolerance of ±10° or within a tolerance of ±20°. Positioning the probe in such a way that the directions of the first and second conductors (which represent along the main extension) are perpendicular to the average direction of the electric field of the antenna of the DUT maximizes the received signal transmitted by the antenna of the DUT and / or minimizes the influence of the first and / or second conductor on the transmitted signal of the antenna of the DUT.

[0051] In a preferred embodiment, the test arrangement is configured to position the conductors with open ends at the two ends of the probe near the first radiation edge of the patch antenna of the DUT or near the first radiation slot or slot portion of the slot antenna of the DUT. Positioning the probe near the radiation edge of the patch antenna or near the radiation slot or slot portion of the slot antenna results in a stronger received signal.

[0052] According to other embodiments, the test arrangement includes a second probe having first and second conductors. The two conductors of the second probe are separate, end - open, non - connected conductors. Additionally, the test arrangement is configured to position the two conductors of the second probe near the second radiation edge of the patch antenna of the DUT or near the second radiation slot or slot portion of the slot antenna of the DUT. The second radiation edge of the patch antenna is opposite to the first radiation edge of the same patch antenna, and / or the second radiation slot or slot portion of the slot antenna is opposite to the first radiation slot or slot portion of the same slot antenna of the DUT. Probing the patch antenna and / or the slot antenna near the opposite radiation edges and / or near the opposite radiation slots or slot portions improves the measurement accuracy and / or reduces the measurement uncertainty. Moreover, a pair of probes tests one polarization of the patch and / or slot antenna of the DUT.

[0053] According to other embodiments, the test arrangement is configured to combine the signal of the first probe with the signal of the second probe. The balanced currents on the probes can be combined into an unbalanced current by using a so - called balun or 180 - degree hybrid circuit. A pair of probes tests one polarization of the patch and / or slot antenna of the DUT.

[0054] In a preferred embodiment, the arrangement includes a third probe and a fourth probe. Both the third and fourth probes include a first and a second conductor, wherein the two conductors of the third probe and the two conductors of the fourth probe are separate, end - open, non - connected conductors. The two conductors of the third probe are positioned near the third radiation edge of the patch antenna or near the third radiation slot or slot portion of the slot antenna. The third probe is perpendicular to the first radiation edge of the patch antenna of the DUT or the first radiation slot or slot portion of the slot antenna within a tolerance of ±10° or ±20°. The two conductors of the fourth probe are positioned near the fourth radiation edge of the patch antenna of the DUT and / or near the fourth radiation slot or slot portion of the slot antenna of the DUT. The position of the fourth probe is opposite to the third radiation edge of the patch antenna or opposite to the third radiation slot or slot portion of the slot antenna of the DUT. Using two pairs of probes where the line defined by the first pair of probes is perpendicular to the line defined by the second pair of probes allows for the measurement of the polarization of the signal in two perpendicular directions.

[0055] According to another embodiment, the test arrangement is configured to combine the signals of the first probe, the second probe, the third probe, and the fourth probe, for example, using appropriate adjustments of the phase and signal amplitude. Combining the signals of all four probes provides a more complete reproduction of the signal transmitted by the DUT antenna, for example, in terms of polarization.

[0056] According to a further embodiment, the two conductors of the probe are connected to a conductive strip at their ends, forming a closed loop at their short - circuited ends. Short - circuiting the ends of the probe allows for the probing of the magnetic field of the DUT antenna.

[0057] According to another embodiment, the test arrangement is configured to position two conductors connected to form a loop in the vicinity of or in the reactive near - field region of the dipole antenna of the DUT. Positioning the probe with the closed loop in the reactive near - field of the dipole antenna of the DUT increases the intensity of the signal to be measured transmitted by the DUT antenna.

[0058] According to other embodiments, the test arrangement is configured to position two conductors connected to form a loop near the center or the feed point of the dipole antenna of the DUT. Positioning the probe with the closed loop near the center of the dipole antenna provides a higher signal intensity of the signal to be measured transmitted by the DUT antenna.

[0059] According to other embodiments, the test arrangement is configured to position two conductors connected to form a loop in the electrical symmetry plane of the dipole antenna of the DUT. Positioning the probe with the closed loop in the electrical symmetry plane of the dipole antenna provides a higher signal intensity of the signal to be measured transmitted by the DUT antenna.

[0060] In a preferred embodiment, the test arrangement is configured to position two conductors that are connected to form a loop to detect the magnetic field of the dipole antenna of the DUT through their shorted ends. Shorting the ends of the two conductors of the probe allows the measurement of the magnetic field of the dipole antenna.

[0061] According to other embodiments, the orientation of the closed loop or the shorted ends of the two conductors of the probe is defined by a plane. This plane is defined by the two-conductor line and its shorted ends and is perpendicular to the direction of the average magnetic field of the dipole antenna near the shorted ends of the two-conductor line within a tolerance of ±10° or ±20°. Positioning the probe such that the area spanned by the two-conductor line is perpendicular to the average direction of the magnetic field of the DUT antenna maximizes the received signal transmitted by the DUT antenna and / or minimizes the influence of the probe on the DUT antenna.

[0062] According to other embodiments, the direction of the two-conductor line away from its shorted ends lies within a tolerance of ±10° or within a tolerance of ±20° in the plane approximately formed by the magnetic field loop of the dipole antenna near the shorted ends of the two-conductor line. It is advantageous to position the probe such that the two-conductor line is approximately in the plane formed by the magnetic field loop of the dipole antenna of the DUT. This positioning maximizes the received signal transmitted by the DUT antenna and / or minimizes the influence of the probe on the transmitted signal of the DUT antenna.

[0063] In another embodiment, the probe is integrated into the DUT socket. Integrating the probe into the DUT socket results in a more compact test arrangement with a smaller size. In addition, it also allows the measurement of antennas on both sides of the DUT.

[0064] In a preferred embodiment, the probe is integrated into a probe head that includes one or more contacts for making electrical contact with the DUT, which can be, for example, a wafer, a diced circuit, or a packaged device. Integrating the probe into a probe head that includes other probes or contacts allows the probing and / or testing of the DUT in parallel with other test arrangements and / or test methods.

[0065] According to other embodiments, the test arrangement includes absorbers, for example, to avoid unwanted reflections and / or couplings. For example, the absorbers can be placed between the two conductors and the feed structure of the probe and / or on other metal parts of the probe head and / or the DUT socket.

[0066] Another embodiment includes a method for characterizing and / or calibrating a probe and its feed network for subsequent measurement of a DUT at a signal frequency using the test arrangement, wherein at the antenna location of the DUT in a previous measurement, the DUT is replaced by a conductive plane surface or a conductive plane surface with a thin dielectric overlay. This allows measurement of the reflection of a signal incident on the feed side of the probe and its feed network. Measuring the reflection of a signal incident on the feed side of the probe and its feed network allows correction of the signal transmitted by the antenna of the DUT and measured by the above test arrangement.

[0067] Another embodiment includes an automatic test equipment (ATE) having single-site or multi-site test capabilities, including the above test arrangement and a DUT placed in the DUT position of the test arrangement.

[0068] In a preferred embodiment, the antenna of the DUT includes a planar antenna and / or a patch antenna and / or a slot antenna and / or a dipole antenna at high frequency and / or microwave frequency and / or millimeter wave frequency. The ATE is configured to test and / or probe the antenna of the DUT.

[0069] In another embodiment, the DUT includes a plurality of antennas. The ATE is capable of testing and / or probing, for example, an antenna array.

[0070] In another embodiment, the test arrangement includes one or more probes for each antenna. This indicates that, for example, when the DUT includes an array antenna, each antenna element can be probed and / or tested by one or more probes for each antenna.

[0071] Corresponding methods are created according to other embodiments of the present invention.

[0072] However, it should be noted that these methods are based on the same considerations as the corresponding devices. In addition, for the functions and details described herein with respect to the devices, whether individually or in combination, these methods can be supplemented by any feature. BRIEF DESCRIPTION OF THE DRAWINGS

[0073] Embodiments according to the present application will subsequently be described with reference to the drawings, wherein:

[0074] Figure 1 A schematic representation showing an embodiment of a test arrangement having a DUT position and a probe, the probe including two conductors;

[0075] Figure 2 A picture showing a commercially available example of an array antenna used in a DUT;

[0076] Figure 3 A schematic example showing an antenna array used in a DUT;

[0077] Figure 4 Shows a schematic representation of the DUT to be tested in the test arrangement to be described Figure 1 in;

[0078] Figure 5 Shows a schematic representation of a conventional measurement measure for an array antenna for testing the DUT;

[0079] Figure 6 Shows a schematic representation of a measurement measure for an array antenna for testing the DUT;

[0080] Figure 7 Shows a schematic representation of another conventional measure for an array antenna for testing the DUT;

[0081] Figure 8 Shows an embodiment of an automated test equipment (ATE) including the test arrangement described Figure 1 in;

[0082] Figure 9 Shows the initial simulation of the ATE;

[0083] Figure 10 Shows a diagram with simulation measurement results obtained from the ATE with the simulation described Figure 9 in;

[0084] Figure 11 Shows Figure 1 the schematic probe design strategy of the test arrangement described

[0085] Figure 12 Shows a schematic design example of the ATE following the design strategy described Figure 11 in;

[0086] Figure 13 Shows a schematic embodiment of a test arrangement with two probe pairs and an antenna array;

[0087] Figure 14 Shows a schematic embodiment of multiple test arrangements with two probe pairs and an antenna array;

[0088] Figure 15a Shows a top view of an exemplary simulation setup with a dual-polarized patch antenna array and one parallel strip line probe;

[0089] Figure 15b Shows a side view of an exemplary simulation setup with a dual-polarized patch antenna array and one parallel strip line probe;

[0090] Figure 15c Shows a top view of an exemplary simulation setup with a dual-polarized patch antenna array and four parallel strip line probes;

[0091] Figure 15d Side view showing an exemplary simulation setup with a dual-polarized patch antenna array and four parallel strip-line probes;

[0092] Figure 16a Top view showing an exemplary simulation setup with a periodic 2D dual-polarized patch antenna array and parallel strip-line probes;

[0093] Figure 16b Side view showing an exemplary simulation setup with a periodic 2D dual-polarized patch antenna array and parallel strip-line probes;

[0094] Figure 17 Schematic illustration of a test arrangement and a patch antenna array, where two parallel strip probes smoothly transition to a coaxial line;

[0095] Figure 18a Top view showing an exemplary simulation setup with a dual-polarized patch antenna array and parallel strip-line probes transitioning to a coaxial line;

[0096] Figure 18b Side view showing an exemplary simulation setup with a dual-polarized patch antenna array, parallel strip-line probes transitioning to a coaxial line, and an absorption layer;

[0097] Figure 19 Schematic illustration of a test arrangement and a patch antenna array, where two parallel strip probes smoothly transition to a microstrip line;

[0098] Figure 20a Top view showing an exemplary simulation setup with a dual-polarized patch antenna array and parallel strip-line probes transitioning to a microstrip line;

[0099] Figure 20b Side view showing an exemplary simulation setup with a dual-polarized patch antenna array and parallel strip-line probes transitioning to a microstrip line;

[0100] Figure 21 Schematic example of a 180-degree hybrid circuit in a strip-line circuit;

[0101] Figure 22 Schematic illustration of a test arrangement and a dielectric resonator antenna;

[0102] Figure 23 Schematic illustration of a test arrangement with a closed-loop probe end and a dipole antenna array;

[0103] Figure 24a Top view showing an exemplary simulation setup for testing a dipole radiator with shorted parallel strip H-field probes;

[0104] Figure 24b Side view showing an exemplary simulation setup for testing a dipole radiator with a shorted parallel strip H-field probe;

[0105] Figure 24c E-field magnitude plot showing an exemplary simulation setup for testing a dipole radiator with a shorted parallel strip H-field probe;

[0106] Figure 25a Picture showing a patch antenna array;

[0107] Figure 25b Showing with Figure 25a Picture of an experimental measurement setup of the patch antenna array shown;

[0108] Figure 26a Diagram showing the results of the experiment described in Figure 25;

[0109] Figure 26b Magnified diagram showing the results of the experiment described in Figure 25;

[0110] Figure 27a Picture showing a measurement setup of a proof-of-concept with an antenna array;

[0111] Figure 27b Showing Figure 27a Diagram of the results of the experiment described in;

[0112] Figure 27c Showing an illustration in which the port numbers of the diagram described in Figure 27b are described. Detailed Description

[0113] Various creative embodiments and aspects will be described below. In addition, other embodiments will be defined by the appended claims.

[0114] It should be noted that any embodiment defined by the claims can be supplemented by any details, features, and functions described herein. In addition, the embodiments described herein can be used alone and can optionally be supplemented by any details, features, and functions included in the claims.

[0115] Furthermore, it should be noted that the various aspects described herein can be used alone or in combination. Therefore, details can be added to each of the various aspects without adding details to another of the aspects. It should also be noted that the present disclosure explicitly or implicitly describes features that can be used in a test arrangement or an automated test equipment (ATE). Therefore, any feature described herein can be used in the context of a test arrangement or in the context of an automated test equipment.

[0116] In addition, the method-related features and functions disclosed herein can also be used in devices configured to perform such functions. Further, any features and functions regarding the devices disclosed herein can also be used in the corresponding methods. In other words, the methods disclosed herein can be supplemented by any features and functions described regarding the devices.

[0117] The present invention will be more fully understood from the detailed description given below and the accompanying drawings of the embodiments of the invention. However, the present invention should not be considered limited to the specific embodiments described, but is for explanation and understanding only.

[0118] According to Figure 1 Example of

[0119] Figure 1 A schematic representation of an embodiment of a test arrangement 100 for testing a device under test (DUT) 110 including an antenna 120 is shown. The test arrangement 100 includes a DUT position 130 and a probe 140. The probe 140 also includes two conductors 143 and 146. The test arrangement 100 is configured to position the probe 140 near the DUT position 130 such that when the DUT 110 is placed at the DUT position 130, the probe 140 is in the reactive near-field region of the antenna 120 or antenna element of the DUT 110.

[0120] The DUT position 130 of the test arrangement 100 is configured to hold the DUT 110 and / or feed the DUT 110, for example, while the two conductors 143 and 146 of the probe 140 are in the reactive near-field region of the antenna 120 of the DUT 110 to test the DUT 110.

[0121] An adapter or probe 140 is proposed that allows wireless "over-the-air" (OTA) electronic testing of a DUT 110 having an embedded antenna 120 or antenna array, where the measurement probe 140 is positioned very close to the DUT 110 operating in the so-called near-field region, indicating very close to the DUT 110. The probe 140 is designed not to significantly interfere with the DUT antenna 120 or antenna array elements despite being positioned very close to them.

[0122] The probe 140 is, for example, a high-frequency line formed by two very close parallel needles 143 and 146 placed above a local radiation point, which indicates above the DUT antenna 120 or above a DUT antenna array element. Preferably, there is no current or electrical contact between the probe 140 and the DUT antenna 120 or the DUT antenna array element, which indicates that there is some physical spacing between them, and it is considered that mechanical contact may optionally be allowed. In some cases, the probe 140 will pick up signals from the radiation point, from the antenna element 120, without significantly disturbing it. In other cases, a test signal is fed to the probe 140, and the DUT antenna 120 picks up the signal from the radiation probe 140.

[0123] There are various possible ways to implement the probe 140 or the adapter, and it will depend on the specific requirements of the device under test 110 and the limitations of the measurement instrument and the mechanical requirements of the test unit.

[0124] According to Figure 2 antenna array

[0125] Figure 2 Pictures showing some commercially available examples of the antenna array 220. The antenna array 220 includes a plurality of antenna elements 250.

[0126] The arrangement of the antenna elements 250 of the antenna array 220 is generally periodic in two directions in a plane, with a typical periodicity between 0.5×λ0 and 0.6×λ0. These array antennas 220 are built into the DUT and can be measured or characterized by the above-described test arrangement.

[0127] Figure 1 The test arrangement 100 is capable of measuring individual antenna elements 250 of the array antenna 220 separately.

[0128] According to Figure 3 antenna array

[0129] Figure 3 Shows Figure 2 A schematic example of an antenna array 320 similar to 220. This antenna array includes a plurality of antenna elements 350. Figure 3 Shows a combination of an antenna array 320 having four antenna elements 350 arranged in a 2×2 layout and an electronic circuit ("RFIC") attached to connect to this antenna array. It also shows a dipole antenna array, such as Figure 23 The dipole antenna array 2310 (or 2450) having four dipole antenna radiator elements 2320 (or 2440) described in (or Figure 24).

[0130] The arrangement of the antenna elements 350 of the antenna array 320 is typically periodic in two directions in a plane, with a typical period between 0.5×λ0 and 0.6×λ0. The antenna array 320 is built into the DUT and can be measured or characterized by the above-described test arrangement.

[0131] Figure 1 The test arrangement 100 can test the antenna elements 350 of the antenna array 320 individually.

[0132] According to Figure 4 the DUT

[0133] Figure 4 shows the DUT 400 to be tested in the Figure 1 test arrangement 100. The DUT includes a wafer 410 coupled to a package 440. The package 440 also includes an antenna array 420, which is similar to the Figure 2 antenna array 220 or the Figure 3 antenna array 320. The antenna array includes a plurality of antenna elements 450 coupled to the wafer 410.

[0134] In some cases, Figure 1 the test arrangement 100 is configured to test the signals transmitted by the antenna elements 450 of the antenna array 420, which are included in the package 440 and fed by the wafer 410.

[0135] In some cases, Figure 1 the test arrangement 100 is configured to feed a test signal to the probe, and the antenna of the DUT picks up the signal from the radiating probe. A wireless DUT having an integrated antenna array in the wafer or package can only be tested in its mission mode by a reciprocal antenna or antenna array that measures the wireless signals from the device under test and also provides an excitation signal to the DUT. An automated test system for testing these types of devices requires a method and probe or antenna to wirelessly receive and excite the DUT, also known as over-the-air (OTA) testing.

[0136] To test the DUT antenna array and antenna in its wireless transmission mode, a probe such as Figure 1 the probe 140 in FIG. or the probe 2430 in FIG. 24 can detect or receive the wirelessly transmitted signal. Additionally, the DUT can (or in some cases must) be connected to an automated test system (ATE). The connection of the DUT to the ATE is typically provided by a current or electrical contact with the DUT metal contact pads or metal contact balls (such as the Figure 4 balls shown in FIG.). This test concept is denoted as "OTA".

[0137] To test the DUT antenna array and antenna in its wireless reception mode, a probe such as Figure 1A probe such as probe 140 in or probe 2430 in FIG. 24 can wirelessly send a small-amplitude signal to the DUT. Additionally, the DUT can (or in some cases must) be connected to an automated test system (ATE). The connection between the DUT and the ATE is typically provided by an electrical current or electrical contact with the DUT metal contact pads or metal contact balls (such as Figure 4 the balls shown). This testing concept is denoted as "OTA".

[0138] This testing can be achieved through the test arrangements and concepts described herein.

[0139] According to Figure 5 the traditional measurement measures

[0140] Figure 5 FIG. 500 shows a conventional measurement measure. The measurement measure 500 includes an ATE 510 and a measurement antenna 530 connected to the ATE 510. The ATE 510 also includes a measurement system 570, a test fixture 550, and a DUT 540. The DUT 540 is located in the test fixture 550 and is electrically connected to the measurement system 570. The DUT 540 also includes a DUT antenna array 520.

[0141] The measurement system 570 of the ATE 510 sends an electrical signal 560 to the DUT antenna array 520 of the DUT 540. The DUT antenna array 520 sends a signal 580 according to the electrical signal 560 of the measurement system 570. The transmitted signal 580 of the DUT antenna array 520 is received by the measurement antenna 530. The measurement signal of the measurement antenna 530 is sent to the measurement system 570 of the ATE 510 and analyzed by it to test the DUT antenna array 520. This also works in the opposite direction: to test the receiving function of the DUT, the measurement antenna 530 sends a signal, which is received by the DUT antenna array 520.

[0142] The standard measure for measuring a DUT using an integrated antenna array is to use a standard off-the-shelf antenna, such as a horn antenna, in a properly shielded measurement enclosure in a far-field measurement region far from the DUT. While this measure is suitable for laboratory-type measurement setups, it may not be possible to integrate it into a standard test cell for high-volume testing of integrated circuits of the required size.

[0143] Furthermore, by operating in the far-field region with a single antenna, it measures the DUT antenna array as a single beam, indicating that all antenna elements are radiating and combining into a single beam, rather than each element on the DUT antenna array. However, if the DUT supports a test mode, the elements forming the DUT antenna array can be tested individually, which sequentially selects the antenna elements of the DUT antenna array one by one in time. This measure significantly increases the test time and may not be a viable option in high-volume production testing. If the measurement antenna is brought close to each individual antenna array element on the DUT, the measurement antenna itself will interfere with the DUT antenna array elements and invalidate the measurement.

[0144] Figure 1 The test arrangement 100 provides an improved OTA test scheme for electronically testing a DUT with an embedded antenna array. The measurement probes of this test arrangement individually test the antenna elements of the antenna array without interfering with their signals by operating in the so-called reactive near-field region of the DUT.

[0145] According to Figure 6 measurement measures

[0146] Figure 6 An exemplary measurement measure 600 for testing an antenna array 610 including antenna elements 620 is shown. The measurement measure 600 includes the antenna array 610 and a connector structure 630 in the so-called radiating near-field measurement region of the antenna array. The connector structure 630 can depict a signal distribution network that connects a new probe to a standard RF connector (such as the rectangular waveguide flange or coaxial connector shown).

[0147] The radiation 640 of the antenna elements 620 of the conventional / commercial array 610 is sampled / detected / tested by inventive and differentiating means, as it is the novel probe array described in the present invention. These probes are in turn connected / converted to the connector 630 (coaxial or rectangular waveguide as shown) by well-known expensive but simple techniques such as wires, hybrid circuits, distributors / combiners, and switches, and ultimately reach a standard measurement RF device.

[0148] The interference of the signals 640 of the antenna elements 620 of the antenna array 610 is scanned spherically around the array or antenna array 610 in the so-called radiating near-field. These measurement data (such as amplitude and phase) can be mathematically transformed to the far-field using Fourier transform.

[0149] To some extent, these data can also be transformed towards the antenna array 610 until a local field distribution across the radiating aperture is roughly obtained. Then, single-phase antenna radiator elements can be located. However, the cost, size, and scan time of the spherical scanning system hinder the use of such a device for production testing of the antenna array 610.

[0150] Figure 1 The test arrangement 100 provides an improved OTA test scenario for electronically testing a DUT with an embedded antenna array. The measurement probes of the test arrangement individually test the antenna elements of the antenna array by operating in the so-called near-field region of the DUT without disturbing their signals.

[0151] According to Figure 7 traditional measures

[0152] Figure 7 FIG. shows a conventional measure 700 for testing the array antenna 710 of a DUT. The conventional measure 700 includes an array antenna 710 (which includes antenna elements 720), a probe antenna 730, and an absorber 740. The probe antenna 730 is positioned in the radiative near-field of the array antenna 710. The absorber 740 is placed around the measurement area to reduce unwanted reflections and couplings.

[0153] The probe antenna 730 sends a probing signal 750 to the antenna element 720 of the antenna array 710. The probing signal 750 is received by the antenna element 720. The probing signal 750 is used to individually test the array antenna elements, which means testing the antenna elements 720 one by one. The reflection 760 of the probing signal 750 is absorbed by the absorber 740.

[0154] Figure 7 FIG. shows an embodiment of the conventional measure 700, in which the probe antennas in the far-field distance are connected one by one in sequence to each array radiator. In other words, the operation of a single antenna array radiator 720 together with the associated transmit or receive chain is probed with the probing signal 750 in a single spatial direction and with a single amplitude and phase. If the antenna array element 720 works or functions as required, it is assumed that the radiation properties in all other directions (including the coupling with other array elements) will also work or function. The latter assumption is based on design and / or simulation or prior measurements of known good devices. An example of this measure is when the probe antenna is placed in front of the array. The elements of the array are selected one by one. The distance between the antenna array and the probe is chosen such that the probe is in the radiative near-field of the array but in the far-field of a single radiative array element. A non-reflective and / or absorptive enclosure allows for a compact setup. This also works in the opposite direction: to test the transmit function of the DUT, the probe antenna 730 receives the signal transmitted by the DUT antenna 720.

[0155] The disadvantages of this measure are:

[0156] · First, for the transmit and / or receive modes, only one radiator element can be tested at a time, or actually only one polarization of a single element of the array antenna can be tested.

[0157] · Secondly, for components placed at different positions in the array, the "good" state of the measured radiating elements is different. This is because the relative positions of the array elements with respect to the probe antenna are changing.

[0158] The measurement of the "known good device" must provide "good" characteristics for each radiator element.

[0159] In contrast, Figure 1 arrangement 100 provides an improved OTA test scheme for electronically testing a DUT with an embedded antenna array. The measurement probe of this test arrangement individually tests the antenna elements of the antenna array by operating in the so-called reactive near-field region of the DUT without disturbing (or not significantly disturbing) their signals.

[0160] According to Figure 8 Automated test equipment

[0161] Figure 8 shows an embodiment of an automated test equipment (ATE) 800, which includes a test arrangement 850 similar to Figure 1 test arrangement 100 and a DUT 860. The test arrangement 850 includes a measurement probe 810 and a test fixture 820 or DUT position. The DUT 860 is located in the test fixture 820 and is electrically coupled to the test arrangement 850. The DUT 860 includes a DUT antenna array 870, which is capable of transmitting a wireless signal 890 according to the electrical signal 880 of the test arrangement 850. The antenna elements of the DUT antenna array 870 are probed by the probe antenna 810, and the probe antenna 810 is positioned in such a way that it is between the DUT 860 and the probe antenna 810 at the test fixture 820.

[0162] The test arrangement 850 in the ATE 800, which is similar to the above test arrangement, sends an electrical signal 880 to the DUT antenna array 870 of the DUT 860. The DUT antenna array 870 sends a signal 890, which is received by the probe antenna 810 of the test arrangement 850. The received signal is used to test the DUT 860.

[0163] Because Figure 1 the probe of test arrangement 100 can be placed very close to the DUT, it can be easily integrated into an automated test unit or in a DUT position that can be used to electronically test a large number of integrated circuits.

[0164] According to Figure 9 initial simulation

[0165] Figure 9 shows an initial simulation (or simplified simulation structure) of an ATE 900, which includes a test arrangement similar to Figure 1The test setup 100 is similar to the test setup 910 and the DUT 920. The DUT 920 also includes an array antenna 970 having antenna elements 930a - 930c. The test setup 910 includes a feed structure 940 and two conductor pairs or probe antennas 950a, 950b.

[0166] Figure 9 Illustrates the concept or initial simulation of the ATE 900. The DUT antenna array elements 930a - 930c of the antenna array 970 of the DUT 920 transmit signals 960. The test setup 910 is configured to measure the signal 960 of the DUT antenna array element 930a. The signal 960 of the element 930a is received by the probe antennas 950a, 950b and is forwarded to the feed structure 940.

[0167] The following lists other important aspects of the simulation of the TEM line multi - wire probe 950 of the test setup 910:

[0168] · The patch array is dense, which indicates that the distance between the antenna elements 930 is, for example, only slightly greater than λ0 / 2;

[0169] · The probes use TEM lines 950a, 950b, i.e., two wires, to pick up a certain electric field in the near - field region of the antenna element 930a;

[0170] · Adjacent elements or adjacent antenna elements 930b, 930c are not coupled;

[0171] · The simulation (or setup) can be improved by adding absorbers;

[0172] · The distance between the antenna element 930a and the conductor wire pair 950a, 950b of the probe is less than λ0 / 10, which indicates that the probe is in the reactive near - field region of the antenna element 930a;

[0173] · Four wire pairs can be (optionally) used for a dual - polarized patch antenna element or slot loop;

[0174] · The spacing of the wires is feasible, but the balun and the fan - out of the connectors seem more difficult or problematic and can still be achieved with reasonable effort;

[0175] · The first simulation shows a small detuning, and the coupling of the adjacent patches 930b, 930c is approximately 15 dB less than that of the probed patch 930a.

[0176] Simulation Figure 1 of the behavior of the test setup 100 in operation, which indicates that in an OTA test, a single embedded antenna array element 930a provides useful insights and / or aspects regarding the test setup and / or the measurement probes of the test setup. According toFigure 9 The test arrangement 900 can optionally be supplemented individually and in combination with any of the features, functions, and details described herein with respect to the device.

[0177] According to Figure 10 the results of the simulation

[0178] Figure 10 Shows the results of simulation measurements using the Figure 9 simulation test arrangement shown. The results show that the signal from the DUT antenna array element 930a is measured by the needle-to-probe 950a, 950b with reasonable intensity, the needle-to-probe 950a, 950b has a little interference on the DUT antenna array element 930a, and there is only a very small coupling from another antenna array element to the needle-to-probe.

[0179] Simulation Figure 1 The behavior of the test arrangement 100 in operation, which shows that in the OTA test, a single embedded antenna array element 930a provides useful insights and / or aspects regarding the test arrangement and / or the measurement probes of the test arrangement. The simulation results show very little detuning, and the next adjacent patch coupling is approximately 15 dB less than that of the probed patch. Even in this example simulation, the physical size of the cross-section of the needle-to-probe 950a, 950b is deliberately chosen to be large and bulky (see Figure 9 ), the detuning of the probed patch is still very small (as shown in Figure 10 ), and the coupling to the next unprobed adjacent part is still very small (as shown in Figure 10 ). More advanced and complex actual implementations will easily revert to finer metal needles forming the needle-to-probe, thus further reducing the detuning and the coupling to the next adjacent part.

[0180] According to Figure 11 probe design strategy

[0181] Figure 11 Shows a probe design strategy 1100 for a test arrangement, for example, a test arrangement similar to the Figure 1 test arrangement 100. The probe design strategy 1100 assumes an antenna array 1110 including an antenna array element 1115. The array antenna 1110 is separated from the probe tip 1120 by a gap. The gap between the array antenna 1110 and the probe tip 1120 can be, for example, a mechanical stop. The probe tip 1120 is on the antenna side of the probe. The probe 1130 is based on a TEM line needle. Absorbing material 1140 is used between the probe tip 1120 and the feed side of the probe 1130 to reduce reflections back to the radiator or other antenna array elements 1115. On the feed side of the probe 1130, a conversion circuit system is used to apply the signal conversion to a waveguide or a circuit board transmission line. The fan-out circuit is then based on the waveguide or the circuit board transmission line.

[0182] The following lists important aspects of the probe considered in the design strategy. These are high-level descriptions of the requirements for how the probe / adapter measures are implemented, some or all of which may be met by embodiments:

[0183] · The probe (or probe tip) is placed in the reactive near field of the radiator or antenna array element 1115;

[0184] · The probe is placed in a mechanically reproducible manner;

[0185] · The probe does not (or at least does not significantly) affect the feed impedance of the radiator or antenna array element 1115;

[0186] · The probe does not (or at least does not significantly) affect other radiators or other antenna elements 1115;

[0187] · The probe is decoupled (or at least significantly decoupled) from other probes, and other radiators or antenna elements are not coupled to the probe;

[0188] · The setup can be calibrated in terms of transmission, phase, and amplitude, as well as coupling. The setup can be calibrated end-to-end, or by reflection from a large metal plate, or by reflection of the transmission line of the probe from the end-opening needle, where any physical material is removed within a certain distance from the probe end.

[0189] By using useful insights and / or aspects measured by simulation, define a probe design strategy for the probe in the test arrangement 100 of Figure 1 Following these instructions leads to, for example, a better signal-to-noise ratio or a cheaper test method.

[0190] According to Figure 12 Design example

[0191] Figure 12 An embodiment showing a design example of the ATE 1200. The ATE 1200 includes Figure 1The test arrangement 100 is similar to and coupled to the test arrangement 1230 of the DUT 1220. The test arrangement 1230 includes two probe pairs 1270a, 1270b and the DUT location 1210. The first probe pair 1270a is coupled to the first balun 1275a, and the second probe pair 1270b is coupled to the second balun 1275b. The first balun 1275a is coupled to the first feed structure 1280a, and the second balun 1275b is connected to the second feed structure 1280b. The test arrangement also includes an absorbing material 1290 placed between the antenna array 1260 and the baluns 1275a, 1275b. The test arrangement 1230 also includes a dielectric spacer 1295 between the ends of the two needle-to-probe pairs 1270a, 1270b and the DUT 1220 placed at the DUT location 1210. The DUT 1220 includes, for example, a package 1240 and a wafer 1250. The package 1240 also includes an antenna array 1260, which includes two (or more) antenna elements connected to the wafer 1250.

[0192] The antenna elements in the antenna array 1260 of the DUT 1220 are fed through the wafer 1250. The signals transmitted by the antenna array 1260 are received by the two probe pairs 1270a, 1270b. The corresponding baluns 1275a, 1275b are used to combine the balanced currents of the probe pairs 1270a, 1270b to convert to the corresponding unbalanced feeders 1280a, 1280b.

[0193] Figure 12 Shows a possible implementation or embodiment of the ATE 1200 or measurement setup, where only two needle-to-antenna or probe pairs 1270a, 1270b are used to measure or test the DUT 1220 with a two-element antenna array 1260. Important aspects of the probe design that can be optionally implemented individually or in combination in the embodiment are as follows:

[0194] · The antenna array of the DUT 1220 is a multi-layer WiGig patch antenna with a frequency, for example, between 57 and 64 GHz;

[0195] · The two needle-to-probe pairs 1270a, 1270b are two-wire transmission lines, which are needle-shaped near-field probes located above the radiation slot. In other words, each of the needle-to-probe pairs 1270a, 1270b forms a two-wire transmission line with an open end in the reactive near-field of the DUT antenna;

[0196] · The probe pairs are fed by a rat-race balun or a 180° hybrid circuit;

[0197] · All and / or several probes and possible circuitry are placed on a single PCB;

[0198] · The dielectric spacer 1295 or distance holder is made of or uses plastic and / or foam;

[0199] · Optionally, an absorber 1290 is added to prevent resonance and coupling.

[0200] This design example can be operated such that the signal wirelessly transmitted by the DUT is detected and subsequently accessible at the feeders 1280a, 1280b (testing in the DUT transmission mode). Alternatively, it can be operated such that the signal injected into the feeders 1280a, 1280b is wirelessly transmitted by the probe to the DUT (testing in the DUT reception mode).

[0201] If the DUT 1220 has integrated antenna arrays 1260 on both the top and bottom sides of the package 1240, two sets of probe adapters or paired probes 1270 can be used, one set for the top side and the other for the bottom side. This measure allows it to be integrated into all different ATE test unit configurations for integrated circuit testing.

[0202] As an example, for instance, package-level testing of single or multiple sites is performed using probes and / or adapters integrated on the DUT socket. Or as another example, wafer-level probing of single or multiple sites is performed using probes and / or adapters integrated on the probe head. Additionally, the proposed measures can also be used for non-ATE applications.

[0203] Following Figure 11 the design strategy discussed in Figure 1 results in an ATE design example for OTA testing of embedded antenna array elements. The ATE design example includes a test arrangement similar to the 100 in

[0204] According to Figure 13 the embodiment of

[0205] Figure 13 Shown is a test arrangement 1300 similar to the test arrangement 100 in Figure 1 and a patch antenna array 1310. The patch antenna array 1310 includes patch antenna array elements or patch radiators 1320.

[0206] The test arrangement 1300 includes two needle-to-probe pairs 1330a, 1330b which are positioned near the radiating edge of the patch radiator 1320b. The two needle-to-probe pairs 1330a, 1330b are parallel strip-line probes. The two needle-to-probe pairs are connected to the feed structure 1340 via three baluns and / or dividers 1350a - 1350c. There is a layer of absorber 1360 between the patch antenna array 1310 and the divider and / or balun 1350a - 1350c. Additionally, Figure 13 shows the direction of the electric field 1390, where the vertical components are substantially opposite on opposite sides of the patch radiator 1320b, and where the horizontal components at the electric field have the same direction between the two conductors of the first probe pair 1330a and the two conductors of the second probe pair 1330b.

[0207] The patch radiator 1320 of the patch antenna array 1310 transmits a signal 1380 which is received by the two probe pairs 1330a, 1330b of the test arrangement 1300. The baluns and dividers 1350 are used to combine the balanced currents of the conductors of the probe pairs 1330 for conversion to the unbalanced feeder line 1340.

[0208] Figure 13 Shows a conceptual diagram of the antenna array 1310 made up of three patch radiators 1320a - 1320c, where the centered patch 1320b radiates and is probed via two end-opened balanced twin-lead transmission lines 1330a, 1330b. Most of the radiated energy enters the absorber 1360. Signal combining circuitry such as baluns and dividers 1350 can be placed on a board above the absorber 1360.

[0209] Figure 13 Describes or presents the concept of using a pair of parallel strip probes and three hybrid combiners to test at least one polarization of the patch radiator 1320, for phase-corrected signal distribution from a feed connector (e.g., in the case where the parallel strip probes excite the DUT antenna) or for corrected signal combining (e.g., in the case where the parallel strip probes receive signals transmitted from the DUT antenna). The absorber 1360 is mainly used to avoid reflections from the circuit board carrying the hybrid combiner circuitry.

[0210] In other words, the conceptual diagram of the linear array of patch radiators is shown in Figure 13is shown in cross - section. The center - fed radiator 1320b sends a wavefront 1380 in the upward direction. The patch has two radiating edges that act like slot radiators. In some cases, the electric field at the radiating edges of the patch is as shown by the arrows in the figure. A balanced two - wire transmission line (such as 1320a or 1320b) points towards the radiating edges of the patch. The open ends of the lines pick up a small part of the electromagnetic field and guide this small part of the electromagnetic field in the upward direction (towards the feed) in the form of a guided wave. There is a certain distance maintained between the open ends of the lines and the patch metal. Since the sensing transmission line is at least approximately perpendicular to the patch plane, the electromagnetic field of the radiated wave is perpendicular to the line in the far - field and is thus not disturbed by the line. The radiated field will be absorbed by a lossy absorbing material, which can be depicted as a pyramidal absorber in the figure for clarity. However, in the near - field of the patch and near the radiating edges, there will be interference and interaction, but quantitative studies show that their effects are negligible. The strength of the coupling between the patch radiator and the probe depends on the geometry of the scenario, mainly on the spacing between the two conductors of the line and the distance between the open end of the line and the radiating edge of the patch. Above the absorber, the balanced two - wire line can be connected to a balun, a splitter, and additional circuitry, such as switches, as needed.

[0211] Figure 13 is shown Figure 1 An embodiment of a test arrangement 100. Depending on the test objectives, multiple needle - to - element or needle - to - probe pairs 1330 can be placed at each DUT antenna array element 1320, or a smaller number but positioned at critical measurement points can be used. Then, high - frequency circuit techniques are used to combine the conductors of the needle - to - probe pairs and interconnect them to a measuring instrument, for example, using high - performance coaxial connectors.

[0212] According to Figure 14 the embodiment of

[0213] Figure 14 is shown associated with Figure 1 Embodiments of multiple test arrangements 1410a - 1410c similar to the test arrangement 100 and an antenna array 1420 including antenna array elements 1430. The test arrangements 1410a - 1410c extend into the reactive near - field of the antenna array elements 1430 of the antenna array 1420 and include two parallel needle - to - probe pairs 1440. The needle - to - probe pairs 1440 are coupled to a feed structure 1450.

[0214] The weakly coupled, non-contact, paired probes 1440 penetrate the reactive near-field of the antenna array elements or radiators 1430. The antenna elements 1430 of the antenna array 1420 transmit signals 1460. A small portion of the radiated energy 1460 is sent to the probe connector or feed structure 1450, which includes signal combining circuitry to convert the signal from a balanced line to an unbalanced line. Most of the radiated energy (1460) is absorbed by the absorber 1470, which is placed between the antenna array 1430 and the feed structure 1450. The coupling between the paired probes 1440 is very weak, such that the feed impedance of the antenna array radiator 1430 is not (or is insignificantly) affected.

[0215] In this new approach, a transmission line-based structure is used to probe the radiating elements of an antenna array in its reactive near-field (which means very close to the antenna array), such that only the radiating element being probed (and not its neighbors) will couple to the probe. Thus, adjacent elements can be tested using additional probes in parallel with the first element. When some or all of the features may be present in an embodiment, the probe should incorporate several features:

[0216] · A defined (repeatable) and calibratable coupling (amplitude and phase) from the radiator element to the probe,

[0217] · The feed impedance of the radiating element being probed should not (or should be insignificantly) affected by the probe,

[0218] · Adjacent radiating elements should not (or should be insignificantly) coupled to the probe,

[0219] · The feed impedance of adjacent radiating elements should not be affected by the probe.

[0220] The implementation of this concept benefits from the signal strength close to the radiating element, allowing for a significant but repeatable and calibratable attenuation between the radiating element and the probe input. This approach is contrary to any wireless link design, where maximum possible transmission between the two ends of the wireless link is desirable, as is the case in traditional antenna radiation testing in an anechoic chamber test system. Figure 14 The idea of the proposed concept depicting a linear array of three patch radiators, where the patch radiates from two slots at opposite ends of the patch, and thus can be tested using two combined probes. All three patches can be probed simultaneously. The absorber helps reduce unwanted reflections and coupling.

[0221] In other words, Figure 1 the concept of the described test arrangement 100 can be extended to multiple probes, testing both sides or more sides of a dual-polarized patch, and / or testing several radiator elements simultaneously. Depending on the test objectives, multiple needle pairs can be placed at each DUT antenna array element, or a smaller number of needle pairs can be used but positioned at critical measurement points.

[0222] Exemplary simulation settings according to Figure 15

[0223] Figure 15 shows an exemplary simulation setup 1500 with a dual-polarized patch antenna array 1550, which includes dual-polarized antenna elements 1540 and one or more parallel strip-line probes 1530.

[0224] Figure 15a The dual-polarized patch antenna array 1550 with a single parallel strip probe 1530 is shown as viewed from above. Figure 15b The dual-polarized patch antenna array 1550 with a single parallel strip probe 1530 is shown as a cross-sectional view. Figure 15c The dual-polarized patch antenna array 1550 with four parallel strip probes 1530 for testing two antenna elements is shown as viewed from above. Figure 15d The dual-polarized patch antenna array 1550 with four parallel strip probes 1530 for testing two antenna elements is shown as a cross-section.

[0225] The positioning of one or more probes of the test arrangement 100 is simulated in Figure 15. Figure 15 shows an exemplary simulation setup 1500 for testing a patch radiator 1540 using one or more parallel strip probes. According to the results, the coupling from the radiator feed connector to the probe port is approximately -19 dB, while the maximum coupling from any other radiator feed is approximately 9 dB less. Figure 1

[0226] Exemplary simulation settings according to Figure 16

[0227] Figure 16 shows an exemplary simulation setup 1600 with a periodic 2D dual-polarized patch antenna array 1610, which includes dual-polarized antenna elements 1620 and parallel strip-line probes 1630. Figure 16 shows all the dimensional data related to the free-space wavelength λ0. The λ0 used in the 6 GHz prototype is 50 mm.

[0228] Figure 16a A top view of the periodic 2D dual-polarized patch antenna array 1610 with a single parallel strip-line probe 1630 is shown. The period of the patch antenna array 1610 or the center-to-center distance between two antenna elements 1620 is 0.5×λ0.

[0229] Figure 16bA side view of a periodic 2D dual-polarized patch antenna array 1610 with a single parallel strip-line probe 1630 is shown. The single parallel strip-line probe 1630 includes two conductor strips with a strip width of 0.02×λ0 and a gap of 0.02×λ0 between them (e.g., with a tolerance of ±50%). The single parallel strip-line probe 1630 is placed at a distance of 0.01×λ0 from the antenna array 1610 (e.g., with a tolerance of ±50%). The following are the layers of the periodic 2D dual-polarized patch antenna array 1610 starting from the probe side:

[0230] 1) A square copper patch with dimensions of 0.24λ0×0.24λ0

[0231] 2) A patch dielectric layer with a thickness of 0.24×λ0 (or 0.03×λ0)

[0232] 3) A patch copper ground layer

[0233] 4) A feed circuit dielectric layer.

[0234] The patch copper feed line shown in FIG. 16 feeds the square copper patch.

[0235] FIG. 16 shows the measured values (dimension data) of a test arrangement 100 similar for a 6 GHz prototype antenna array Figure 1 of 100. The dimensions are given relative to the free space wavelength λ0, thus allowing for an easy scale change of the antenna array with other frequencies. However, in some embodiments, a deviation from the given dimensions up to twice (or even more) may be allowed.

[0236] According to Figure 17 the embodiment of

[0237] Figure 17 A test arrangement 1700 similar to Figure 1 the test arrangement 100 and an embodiment of a patch antenna array 1710 are shown. The patch antenna array 1710 includes patch antenna array elements or patch radiators 1720a - 1720c. The test arrangement 1700 includes two parallel strip probes 1730a, 1730b which are positioned near the radiation edges of the patch radiator 1720b. The two parallel strip probes 1730a, 1730b smoothly transition to coaxial cables. The two parallel strip probes 1730a, 1730b are connected to a feed structure 1740 through a splitter 1750. Physically between the patch antenna array 1710 and the splitter 1750 is a layer of absorber 1760, where the coaxial cables are fed through the absorber. Additionally, Figure 17Shows the directions of the electric fields 1790 that are substantially opposite on the opposite sides of the patch radiator 1720, and the horizontal components of the electric fields have the same direction between the two conductors of the first parallel strip probe 1730a and the two conductors of the second parallel strip probe 1730b.

[0238] The patch radiator 1720b of the patch antenna array 1710 transmits a signal 1780, which is received by the two parallel strip probes 1730a, 1730b that smoothly convert to a coaxial cable of the test arrangement 1700. A distributor 1750 is used to combine the balanced currents of the conductors of the parallel strip probes 1730 to convert to an unbalanced feeder 1740.

[0239] This design example can be operated such that the signal wirelessly transmitted by the DUT is detected and then accessible at the feeder 1740 (test in the DUT transmission mode). Alternatively, it can be operated such that the signal injected into the feeder 1740 is wirelessly transmitted by the probe to the DUT antenna 1720b (test in the DUT reception mode).

[0240] Figure 17 The concept of testing the patch radiator 1720 by using a pair of parallel strip probes 1730 that smoothly convert to a coaxial cable by using a single 180-degree hybrid circuit or the required distributor 1750 is proposed. For example, the first strip of the parallel strips smoothly converts into the outer shield of the coaxial cable, while the second strip of the parallel strips forms the inner conductor of the coaxial cable. For example, the outer shield of the coaxial cable opens more and more in the direction from the feeding structure towards the open end of the probe.

[0241] At least one polarization of the patch radiator 1720 is tested by using a pair of parallel strip probes 1730 that smoothly convert to a coaxial cable. Therefore, the balun property is part of the probe tip. Therefore, only one hybrid combiner or distributor 1750 is required for signal distribution from the feed connector 1740. There may be significant in-phase or unbalanced currents along the probe tip, so in some cases, an absorber 1760 is also needed to reduce the possible monopole radiation from the probe tip. In addition, in some cases, an absorber 1760 is also needed to avoid reflections from the circuit board carrying the hybrid combination circuit system.

[0242] Figure 17 Shows Figure 1 An embodiment of a test arrangement 100 that uses different types of probes (parallel strip probes) that convert to a coaxial cable. The new probe has a simple connection from the coaxial cable to the feeding structure by using only one distributor.

[0243] Exemplary simulation settings according to Figure 18

[0244] FIG. 18 shows an exemplary simulation setup 1800 with a dual-polarized patch antenna array 1850, which includes dual-polarized antenna elements 1840 and parallel strip line probes 1830 that transition to a coaxial line.

[0245] Figure 18a Perspective view of the dual-polarized patch antenna array 1850 with a single parallel strip line probe 1830 that transitions to a coaxial line. Figure 18b Side view of the dual-polarized patch antenna array 1850 with a single parallel strip line probe 1830 that transitions to a coaxial line and an absorber layer 1860.

[0246] FIG. 18 shows an exemplary simulation setup for testing a patch radiator with a dual-polarized patch antenna array and parallel strip probes that smoothly transition to a coaxial line. In some cases, an absorbing material is required to suppress resonances on the outer conductor of the coaxial line, which otherwise can cause monopole-like radiation and strong coupling with adjacent radiator elements.

[0247] Simulated in FIG. 18 is the Figure 1 positioning of the parallel strip probes that smoothly transition to a coaxial line in the test arrangement 100. FIG. 18 shows an exemplary simulation setup 1800 for testing a patch radiator 1840 with parallel strip probes that smoothly transition to a coaxial line. According to the results, the coupling from the radiator feed connector to the probe port is approximately -19 dB, while the maximum coupling from any other radiator feed is more than 10 dB less.

[0248] According to Figure 19 embodiment

[0249] Figure 19 Shows a test arrangement 1900 similar to Figure 1 the test arrangement 100 and a patch antenna array 1910. The patch antenna array 1910 includes patch antenna array elements or patch radiators 1920a - 1920c. The test arrangement 1900 includes two parallel strip probes 1930a, 1930b that are positioned near the radiation edge of the patch radiator 1920b. The two parallel strip probes 1930a, 1930b smoothly transition to microstrip lines. The two parallel strip probes 1930a, 1930b are connected to a feed structure 1940 through a splitter 1950. There is an absorber layer 1960 between the patch antenna array 1910 and the splitter 1950.

[0250] Furthermore, Figure 19 shows the directions of the electric fields 1990 that are substantially opposite on the opposite sides of the patch radiator 1920, and the horizontal components of the electric fields have the same direction between the two conductors of the first parallel strip probe 1930a and the two conductors of the second parallel strip probe 1930b.

[0251] The patch radiator 1920 of the patch antenna array 1910 transmits a signal 1980, which is received by two parallel strip probes 1930a, 1930b of the test arrangement 1900 that are smoothly transitioned to a microstrip line. The balun current of the conductors of the parallel strip probes 1930a, 1930b is combined using a divider 1950 to be transitioned to an unbalanced feeder line 1940.

[0252] Figure 19 The concept of testing the patch radiator 1920b by using a single 180-degree hybrid circuit or the divider 1950 required for signal combination with a pair of parallel strip probes 1930a, 1930b that are smoothly transitioned to a microstrip line is proposed. At least one polarization of the patch radiator 1920b is tested by using a pair of parallel strip probes 1930 that are smoothly transitioned to a microstrip line. Thus, the balun property is part of the probe tip. Therefore, only one hybrid combiner or divider 1950 is required for the signal distribution from the feed connector 1940. There is in-phase or unbalanced current along the probe tip. Therefore, in some cases, an absorber 1960 is also required to reduce the possible monopole radiation from the probe tip. Additionally, in some cases, an absorber 1960 is also required to avoid reflections from the circuit board carrying the hybrid combiner circuit system.

[0253] Figure 19 An embodiment of a test arrangement 100 using different types of probes (parallel strip probes) transitioned to a microstrip line is shown. Figure 1 The novel probe is compatible with current circuit construction techniques.

[0254] Exemplary simulation settings according to Figure 20

[0255] FIG. 20 shows an exemplary simulation setup 2000 having a dual-polarization patch antenna array 2050, which includes dual-polarization antenna elements 2040 and parallel strip line probes 2030 transitioned to a microstrip line.

[0256] Figure 20a A top view of a dual-polarization patch antenna array 2050 having a single parallel strip line probe 2030 transitioned to a microstrip line is shown. Figure 20b A side view of a dual-polarization patch antenna array 2050 having a single parallel strip line probe 2030 transitioned to a microstrip line is shown.

[0257] For example, the ground conductor of the microstrip probe continuously narrows towards the tip of the parallel strip probe. The center conductor of the microstrip line continuously loosens (solve) from the ground conductor towards the parallel strip probe in the transverse direction. Therefore, since the expansion part where the center conductor extends is slightly deviated (e.g., 5 to 20 degrees) from the direction in which the narrowed ground conductor extends, the overlapping part of the ground conductor and the center conductor (e.g., in the projection perpendicular to the surface of the circuit board carrying the microstrip line) is stably deviated. Towards the tip of the parallel strip probe, the ground conductor and the center conductor have been converted into independent and non-overlapping conductors.

[0258] Figure 20 shows an exemplary simulation setup for testing a patch radiator with a parallel strip probe that smoothly transitions to a microstrip line. The positioning of the parallel strip probe that smoothly transitions to the microstrip line of the test arrangement 100 is simulated in Figure 20. Figure 20 shows an exemplary simulation setup 2000 for testing a patch radiator 2040 with a parallel strip probe that smoothly transitions to a microstrip line. According to the results, the coupling from the radiator feed connector to the probe port is approximately -20 dB, while the maximum coupling from any other radiator feed is approximately 8 dB less. Figure 1

[0259] According to Figure 21 balun or hybrid circuit

[0260] Figure 21 An example of a 180-degree hybrid circuit in a stripline circuit is shown, which covers an area smaller than that of a crossed dipole or a dual-polarized patch.

[0261] In some cases, the distribution circuit must include a distributor and / or a balun for each polarization of each antenna radiator element. The concept of integrating a balun into a probe (such as in Figure 17 or Figure 19 ) requires two distributors and / or baluns in the area of each dual-polarized radiator antenna element. This is achieved in a single stripline circuit layer, as shown in Figure 21 . For a probe system such as shown in Figure 13 , it would be much more complex to install six distributors and / or baluns in the area of each dual-polarized radiator element. In some cases, the trace from the feed connector (such as, for example, a waveguide or coaxial connector) to the antenna radiator port through a switch should be done on a separate stripline or microstrip layer. Therefore, in some cases, a multilayer circuit with at least three dielectric layers (four conductor layers) should be considered.

[0262] By using one or more balun circuits and / or 180° hybrid circuits to combine Figure 1The balanced current on the probe of the test arrangement 100 is converted to an unbalanced line, such as a microstrip line or a stripline. The balun circuit converts between balanced and unbalanced signals and helps interface the probe antenna with a feed line (e.g., a coaxial cable).

[0263] According to Figure 22 the embodiment of

[0264] Figure 22 shows a test arrangement 2200 similar to the test arrangement 100 of Figure 1 and an embodiment of a dielectric resonator antenna 2210. The dielectric resonator antenna 2210 includes a dielectric resonator 2213 and a microstrip feed 2216. The microstrip feed 2216 includes a ground plane 2222 having an opening 2224, an antenna feed line 2226, and a substrate 2228. The ground plane 2222 is separated from the antenna feed line 2226 by the substrate 2228. The dielectric resonator 2213 is positioned on the ground plane 2222 such that the opening 2224 of the ground plane 2222 is positioned between the center of the dielectric resonator 2213 and the substrate 2228 and also between the center of the dielectric resonator 2213 and the antenna feed line 2226. The test arrangement 2200 includes a balanced parallel strip probe 2230 that is positioned near the dielectric resonator 2213 and on the center line of the dielectric resonator 2213. The two conductors of the parallel strip probe 2230 are connected to a feed structure 2240 through a splitter or balun 2250.

[0265] There is a layer of absorber 2260 between the dielectric resonator antenna 2210 and the balun or splitter 2250. Additionally, Figure 22 shows the direction of the electric field 2290.

[0266] The dielectric resonator antenna 2210 transmits a signal 2280 that is received by the parallel strip probe 2230 of the test arrangement 2200. The balanced current of the conductors of the parallel strip probe 2230 is combined using the splitter 2250 to be converted to an unbalanced feed line 2240.

[0267] Figure 22 shows an embodiment of the test arrangement 100 for different types of antennas, for the dielectric resonator antenna 2213 Figure 1 This type of antenna can be tested using the present invention as the other types of antennas described above.

[0268] According to Figure 23 the embodiment of

[0269] Figure 23 shows a test arrangement similar to Figure 1A test arrangement 100 similar to the test arrangement 2300 and an embodiment of a dipole antenna array 2310. The dipole antenna array 2310 includes dipole antenna array elements 2320a - 2320c. The test arrangement 2300 includes parallel strip probes 2330, where the two conductors of the probes 2330 are connected to a conductive strip 2335 at their ends to form a closed loop. The closed loop of the parallel strip probes is positioned near the dipole antenna element 2320b, near the symmetry plane of the dipole antenna element 2320. The parallel strip probe with the closed loop 2330 is connected to a feed structure 2340 through a balun or a splitter 2350. There is a layer of absorber 2360 between the dipole antenna array 2310 and the splitter 2350. Additionally, Figure 23 shows the direction of the electric field 2390 between the ground plane and the opposite ends of the dipole antenna element 2320.

[0270] The dipole antenna element 2320b of the dipole antenna array 2310 transmits a signal 2380. The magnetic field generated in the dipole near - field region passes through the closed loop formed by the parallel strip probes 2330 and the conductive strip 2335 and induces a signal that is directed to the feed 2340. A balun or a splitter 2350 is used to combine the currents of the conductors of the parallel strip probes 2330 for conversion to an unbalanced feeder line 2340.

[0271] In other words, Figure 23 shows an embodiment of the proposed concept for testing dipole antenna array elements 2320 using short - circuited parallel strip probes 2330 that are mainly used for sensing magnetic fields. A single 180 - degree hybrid circuit 2350 is used to combine signals. Figure 23 shows a variant of the proposed concept that can be applied to planar antennas without a ground plane in order to use a dipole - type structure for (end - fire) radiation in the direction of the plate plane. Here, a probe with a conductive short - circuit or strip 2335 can be used for weak detection of the magnetic field in the central symmetry plane of the dipole - type antenna array element 2330.

[0272] Figure 23 shows a conceptual diagram of an antenna array 2310 made of three on - board dipole radiators 2320a - 2320c, where the central dipole radiates and is detected by the short - circuit ends 2335 of a balanced twin - lead transmission line 2330. Most of the radiated energy 2380 enters the absorber 2360. A signal - combining circuit such as a balun 2350 can be placed on the board behind the absorber 2360. It can be as Figure 23A linear array of top-fed dipole antennas 2320a - 2320c is detected as shown in the conceptual diagram. Here, the two-wire balanced transmission line 2330 of the probe is placed in the electrically symmetric plane of the dipole antenna. Thus, the dipole is not affected by the metal structure entering its reactive near-field region. A part of the strong magnetic field around the central part of the dipole antenna 2320 is coupled to the two-wire transmission line 2330 through its shorted end 2335. Similarly, the coupling from adjacent dipole radiators is very small. Therefore, several probes can be placed in parallel and each dipole can be detected separately.

[0273] The test arrangement 100 of Figure 1 can be modified by shorting the ends of two conductors to detect the magnetic field of the antenna element. Figure 23 illustrates the basic idea of sensing the magnetic field using a dipole antenna and a shorted parallel strip-line probe. According to measurements and / or simulations, the coupling from the radiator feed connector to the probe port is approximately -19 dB, while the coupling from an adjacent dipole is approximately 15 dB smaller.

[0274] Exemplary simulation settings according to Figure 24

[0275] Figure 24 shows an exemplary simulation setup 2400 for testing the dipole radiator 2440a of a dipole antenna array 2450 with a shorted parallel strip H-field probe 2430. Figure 24a shows a geometric view of the antenna array 2450 and the shorted parallel strip probe 2430. The antenna array 2450 includes three dipole antennas 2440a - 2440c. The shorted parallel strip probe 2430 is positioned in the so-called near-field region of the dipole antenna element and along the main extension perpendicular to the plane of the antenna array 2450. Figure 24b shows a side view of the same simulation setup 2400. Here, the orthogonal orientation of the antenna array 2450 and the probe 2430 is indicated. Figure 24c shows an E-field amplitude plot of the simulation setup 2400 when feeding and detecting the topmost dipole, showing some coupling with adjacent dipoles, some coupling with the probe, and mostly radiation unaffected by the probe.

[0276] The test arrangement 100 of Figure 1 can be modified by shorting the ends of two conductors to detect the magnetic field of the antenna element. Figure 24 shows an exemplary simulation setup with a dipole antenna array and a shorted parallel strip probe 2430 for sensing the magnetic field. The dipole antenna array includes three dipole radiators 2440. The coupling from the radiator feed connector to the probe port is approximately -19 dB, while the coupling from an adjacent dipole is approximately 15 dB smaller.

[0277] Experimental test of the probe according to Figure 25

[0278] Figure 25 shows a proof-of-concept experimental test. Figure 25a Shows a dual-linear polarization patch antenna array 2550 with four dual-polarization radiators 2540 and eight feed lines 2520 designed to operate at 5.85 GHz.

[0279] Figure 25a Shows an array of four dual-linear polarization patch antennas 2540 with direct feeders 2520 passing through the ground plane. The antenna design is standard, using 60 mil RO4003 dielectric (ε rel = 3.55) material, and the spacing or center-to-center distance of the antenna array elements is 25 mm, or 0.49 times the wavelength. The measured results of the eight antenna feeders show some variations due to manufacturing tolerances, such as, for example, a center frequency variation of ±0.1%. The patch impedance bandwidth at -10 dB is approximately 2.1%. Figure 25b Shows an experimental measurement setup with antenna array 2550 and a 4-probe system 2580, where the 4-probe system 2580 features dual-band probes tapered to microstrip lines.

[0280] The experimental setup 2500 with frequency scaling was designed and measured to verify the following key aspects or advantages of the proposed technique:

[0281] · Defined coupling from the radiating element to the probe. The coupling amplitude is approximately -20 dB;

[0282] · The probe does not (or does not significantly) affect the feed impedance of the radiating element being probed. A sensitive (i.e., narrowband) patch antenna is used;

[0283] · Adjacent radiating elements do not (or do not significantly) couple to the probe. The measured coupling should be significantly less than the coupling from the element being probed.

[0284] A patch antenna array with four dual-polarization radiators (which has eight feeders) is shown in Figure 25. Also shown in the figure is an example laboratory measurement setup with an antenna array and a 4-probe system featuring dual-band probes tapered to microstrip.

[0285] Figure 1 An experimental implementation of the test arrangement 100 of Figure 25b is shown to measure the simulated results. The DUT used in the experiment is as Figure 25a shown. The results of the experiment are discussed in Figure 26.

[0286] Results of the experimental test of the probe according to Figure 26

[0287] Figure 26 shows the results of the experiment described in Figure 25. The magnitude of the input feed reflection coefficient of the eight feeders of the four dual-mode patch antennas is presented in the illustration.Figure 26a and Figure 26b shows the same view, but Figure 26b is enlarged to emphasize the difference between the two detected feeds.

[0288] Figure 1 The experimental results of an embodiment of the test arrangement 100 of are shown in FIG. 26, which shows the magnitude of the input feed reflection coefficient of 8 feeds of four dual-mode patches. As shown in FIG. 25, two feeds are detected, and the detuning of the antenna feed impedance resonance is approximately 0.3% - 0.4%, while the -10 dB bandwidth of the patch radiator is greater than 2%.

[0289] When an antenna array with 4 dual-polarized patch antennas provides 8 feed ports (numbered 1...8), one probe pair is attached to the feed port of patch 1, and the other probe pair is attached to the feed port of patch 3 (as Figure 25b shown). The magnitude of the input reflection coefficient of the 8 feed ports (denoted as S11 in Figure 26a , Figure 26b ) is very small at the antenna operating frequency of approximately 5.85 GHz (see Figure 26a ). The magnified view of this measurement shows ( Figure 26b ) six almost identical measurement results related to the undetected patches and polarized feed ports (showing small variations due to manufacturing inaccuracies). It also shows two measurement results labeled "detected elements", which are the magnitudes of the input reflection coefficients of the two patches / polarizations to which the probes are attached (as shown in the experimental setup in Figure 25b ). The feed port numbers in the legend of the chart are detailed in FIG. 26.

[0290] Experimental test of the probe with the results according to Figure 27

[0291] Figure 27a shows an antenna array 2950, where an antenna element 2940 is detected using a pair of dual-strip probes 2930. The concept of testing a patch antenna array 2950 using balanced twin-lead probes 2930 is implemented to verify the concept at a frequency of 5.85 GHz. Narrowband patch antennas are selected because they are highly sensitive to interference in their reactive near field.

[0292] Figure 27a shows a pair of twin-lead balanced transmission line probes 2930, testing a specific polarization of the patch antenna array element 2940. Two cage baluns 2910 and a in-phase combiner are part of the probe board 2970.

[0293] Figure 27aA measurement setup is shown where a patch antenna element is probed in one polarization using a pair of twin-lead transmission lines. Note that the probe structure is deliberately made bulky, in particular the width and spacing of the metal strips of the twin-lead lines and the thickness of their supporting dielectric substrate, such that scaling to higher frequencies and / or smaller sizes (such as for example to 60 GHz) is directly feasible. By applying the probe to the patch antenna, the impedance bandwidth shifts to lower frequencies by less than 0.3% (i.e., a small amount), well within the bandwidth of the given antenna.

[0294] The results of this experimental verification are shown in Figure 27b Illustration 2920 of

[0295] The measurement results are presented in Figure 27b Illustration 2920 of. Illustration 2920 shows the measured transmission amplitudes from all eight antenna feeds to the probe connector. The measured coupling from the antenna feed to the probe is approximately -18 dB, which includes a few dB of line loss. The measured coupling from the unprobed feeds to the probe is approximately 9 dB less for collinear (see No. 3) and parallel (see No. 7) polarized adjacent patches and much less for all other radiators.

[0296] In Figure 27c Illustration 2960 of, the port numbers are shown. For example, S213 represents the transmission from antenna port 3 to the probe, while the probe is mounted on the polarization of antenna 1. S211 is the probed transmission. The frequency of interest is 5.85 GHz, indicated by a single S11 curve.

[0297] Figure 27a Shows Figure 1 the experimental setup of test arrangement 100, which is an antenna array probing an element via a pair of dual-strip probes. This picture is for illustration only and shows the probe above the antenna element with feed line number 7.

[0298] Figure 27b Shows the measured coupling. The antenna array elements are numbered as indicated in the Figure 27c illustration.

[0299] Figure 27b Shows Figure 1Results of an experimental implementation of the test setup 100. Diagram 2920 shows the measured transmission amplitudes from each of the eight antenna connectors to the probe connector. For port numbering, refer to the inset 2960 in the figure. The detected antenna-to-probe transmission is -18 dB, which includes an approximate simulated transmission loss of 1.5 dB for the probe circuit (including balun and combiner). Thus, the coupling is quite strong, and a weaker coupling (e.g., a slightly larger distance between the probe and the patch) would also reduce antenna detuning. The "unwanted" coupling from the other seven antenna feeds is much smaller, with the next adjacent one for co-linear and parallel polarization having the strongest coupling, approximately -27 dB. Simulations show that the unwanted coupling is reduced by adding absorbent material. Due to the vibration issues of this setup, this was not carried out or tested in the experiment. Simulations with all the probe lines in place (which indicates 16 two-wire lines for four dual-polarization patch antennas) show an increase in the coupling between the array elements, from an approximate worst-case of -17 dB in the array without probes to an approximate worst-case of -15 dB in the array with all 16 probe lines, but the level of unwanted coupling from the antenna ports to the probes on adjacent elements does not increase.

[0300] Conclusion

[0301] Means for probing a millimeter-wave planar antenna array in a fast manner with low technical effort are disclosed. According to one aspect and other embodiments and aspects, the main innovation is the non-contact probing of the array antenna radiator in its reactive near field. A very small, and thus negligible, perturbation of the radiator by the probe is achieved. This indicates that the probe does not detune the antenna feed impedance and that the connected transceiver can operate as expected under standard operating conditions. This also indicates that the test setup is compact since there is no need to comply with far-field radiation distance limitations. The weak but well-defined signal transmission between the radiator and the probe can be used as a test feature for both amplitude and phase. The concept can be easily applied to planar as well as multi-layer patch or slot radiators. Different probe shapes are discussed, such as coplanar strips, microstrips, coaxial, etc. In a similar manner, magnetic probes can be used to test dipole antennas, such as those required for radiation mainly directed towards the circuit board plane.

[0302] Compared to any other known test method operating in the far field or radiative near field of the antenna array under test, the proposed test means can be parallelized and may be more efficient in terms of time and cost, and is also physically more compact.

[0303] In other words, the present invention proposes a test concept for millimeter-wave antennas and antenna arrays using probes inserted into the reactive near-field of radiating elements. The interference in the reactive near-field of the antenna causes the antenna to be detuned in terms of radiation characteristics and feed impedance. Note that testing an antenna whose feed impedance is detuned by the probe is completely useless because the strong standing waves in the feed network can have unpredictable effects on the behavior of the passive and active parts of the entire radiation module. The present invention proposes several techniques dedicated to certain typical types of radiator elements: where the interference in the feed impedance of the antenna radiator caused by inserting the probe into the reactive near-field is negligible. As a result, each radiator of the entire radiation module or each polarization of the radiator can be individually probed in parallel with another probe in terms of amplitude and / or phase, while testing adjacent elements. The latter allows testing of unwanted coupling effects and / or allows for increased measurement speed through parallelism.

[0304] A variant of the new measure can be derived from known techniques of chip-to-waveguide coupling and board-to-waveguide coupling. Among them, a waveguide (e.g., a rectangular or dielectric waveguide) is connected to an on-chip or on-board excitation structure. In the absence of an attached waveguide, this excitation structure can act as an antenna radiator, although it may be a poorly performing and detuned antenna radiator. In the case of an attached waveguide, there is a minimum radiation, which is considered an unwanted "radiation loss" and a maximum transmission to the waveguide. For the special case of a short waveguide horn antenna mounted on a board, the detuning of the radiator, the radiation to free space, and the coupling to the probing dielectric rod waveguide between these two cases can be minimized. Therefore, single-element probing becomes possible in this special scenario. The techniques proposed in the present invention solve the problem of avoiding the detuning of the antenna radiator caused by the probe. This measure has two main aspects that can be used individually or in combination:

[0305] · The coupling between the antenna and the probe located in its reactive near-field is small. It is on the order of -20 dB, different from the above-mentioned waveguide coupling measure for full transmission. Therefore, if it is in the transmitting state or mode, most of the energy of the radiator will still be radiated; the receiving case or mode is reciprocal.

[0306] · The probe and its connected metal transmission line are placed in the electrically symmetric plane of the radiator, or near a plane where the electric field has a vector component mainly perpendicular to this plane. Then the metal transmission line of the probe will not or will not interfere too much with the radiation of the antenna.

[0307] · The metal transmission line connected to the end of the probe is preferably a TEM line (or quasi-TEM line, such as a microstrip line) with a small cross-section. This structure results in a minimum (unwanted) coupling from the radiation of adjacent antenna elements of the antenna array to the probe (i.e., to the signal carried along the probe transmission line). It also minimizes the interference of the radiation fields (and thus the feed impedance) of adjacent antenna elements of the antenna array.

[0308] Next, the new probe concept is described for two types of antennas:

[0309] · Planar ground-backed slot antennas, which include patch antennas, back cavity slots, etc., and

[0310] · Planar in-grounded planar dipole antennas, which include Yagi-Uda antennas on a board.

[0311] Returning to the electromagnetic fields of the radiator, general examples of these structures are discussed. Measurements are provided for an antenna array of four dual-polarized patch antennas operating at 5.85 GHz and probed with different near-field probes, thus demonstrating the rationale of the overall concept.

[0312] A test concept for millimeter-wave antennas and arrays using metal probes inserted into the reactive near-field of a single radiating element is proposed. Several probe techniques are disclosed in which the perturbation of the antenna radiator feed impedance (commonly encountered due to inserting a metal probe into the reactive near-field of the radiator) can be neglected.

[0313] The proposed test concept for in-air testing of millimeter-wave antenna arrays allows for the individual and parallel probing of array elements and their polarizations. Fairly simple metal probes can be employed to test planar antennas such as patches or dipoles. The use of weak coupling and symmetry allows the probes to penetrate into the reactive near-field of the radiator without perturbing them. A proof-of-concept experiment at 5.85 GHz demonstrated the effectiveness of this measure, paving the way for upgrades in frequency and complexity. The proposed measure makes a valuable contribution to the production testing of highly integrated wireless millimeter-wave modules. Simulations and experiments showed stable feed impedance and a transmission magnitude of approximately -20 dB from the antenna feed to the probe ports. At the same probe ports, the unwanted coupling from adjacent radiator elements was at least 10 dB smaller. For example, this technique is applied to patch antennas and planar dipole antennas. The advantages of the proposed concept for the production testing of millimeter-wave transceiver integrated antenna array modules are discussed.

[0314] The main aspects of the test system are the absorber, calibration, distribution circuit, and switch.

[0315] Absorbers are sometimes required in a "real" test system. Most of the simulations and all of the measurements presented in this report do not use absorbers. The use of absorbers may improve system performance in terms of further reducing unwanted coupling, especially adjacent coupling with the probe. An absorber material layer can be added to the mechanical setup. For millimeter waves, soft polymer layers filled with lossy dielectrics are available. Commercial examples are "SB1007" and "SB1011" from ARCTechnologies, Inc. in Amesbury, Massachusetts, USA. Typical available layer thicknesses are 0.508 mm and 1.016 mm.

[0316] The calibrated transmission amplitude and phase through the test system, as well as the equality of all paths, can be obtained by attaching the test setup to a "short" (i.e., a metal plate) that may be at different defined distances and measuring the respective reflection coefficients.

[0317] The main problem with traditional 1:N switches ("SPNT") is low transmission or insertion loss. This requires compensation for the switch reactance and perfect impedance matching. Standing wave effects must be avoided as they reduce the frequency bandwidth and cause transmission variations over frequency. For the proposed probe test concept, a certain well-defined attenuation can be deliberately added to each switch branch to reduce standing waves and associated degradation effects.

Claims

1. A test arrangement (100, 850, 910, 1230, 1300, 1410a - 1410c, 1700, 1900, 2200, 2300) for testing a device under test DUT (110, 400, 540, 860, 920, 1220), the DUT including an antenna array, the antenna array including a plurality of antenna elements, wherein the test arrangement includes a test fixture (550, 820, 1210) and probes (140, 730, 810, 950a, 950b, 1130, 1270a, 1270b, 1330a, 1330b, 1440, 1530, 1630, 1730a, 1730b, 1830, 1930a, 1930b, 2030, 2230, 2330, 2430, 2580, 2930); wherein the probes include two conductors (143, 146); wherein the test arrangement is configured to position the probes in the vicinity of the test fixture, such that when the DUT is placed in the test fixture, the probes are in the reactive near - field region of the plurality of antenna elements (250, 350, 450, 620, 720, 930a - 930c, 1115, 1320a - 1320c, 1430, 1540, 1620, 1720a - 1720c, 1840, 1920a - 1920c, 2040, 2210, 2320a - 2320c, 2440a - 2440c, 2540, 2940) of the DUT, and wherein the probes are configured to individually test the antenna elements among the plurality of antenna elements to test the DUT.

2. The test arrangement according to claim 1, wherein the probes are configured to receive signals transmitted by the DUT via the antenna array of the DUT; or are configured to transmit signals to be received by the DUT using the antenna array of the DUT.

3. The test arrangement according to claim 1 or 2, wherein the probes include two parallel conductors within a tolerance of + / - 10 degrees or within a tolerance of + / - 20 degrees.

4. The test arrangement according to claim 3, wherein the two conductors of the probes form a transmission line.

5. The test arrangement according to claim 4, wherein the two conductors of the probes form a symmetric transmission line at the antenna - side end.

6. The test arrangement according to claim 3, wherein the two conductors of the probes form a TEM transmission line or a quasi - TEM transmission line.

7. The test arrangement according to claim 1, wherein the two conductors of the probes form a substantially symmetric transmission line that converts to a microstrip line.

8. The test arrangement according to claim 1, wherein the two conductors of the probes form a parallel strip line that converts to a coaxial line.

9. The test arrangement according to claim 1, wherein a balun circuit or a 180-degree hybrid circuit is used to combine the balanced currents of the two conductors of the probe to convert to an unbalanced line (1280a, 1280b, 1340, 1450, 1740, 1940, 2240, 2340).

10. The test arrangement according to claim 1, wherein the two conductors of the probe are separated by a dielectric spacer.

11. The test arrangement according to claim 1, wherein the test arrangement is configured to position the probe such that the two conductors of the probe are electrically separated from the antenna array of the DUT.

12. The test arrangement according to claim 1, wherein the probe and the antenna array of the DUT are separated by a dielectric spacer or by a defined air gap.

13. The test arrangement according to claim 1, wherein the test arrangement is configured to position the probe near and / or in the reactive near-field of the antenna array of the DUT, wherein the distance between the probe and the antenna array of the DUT is less than 0.1 λ, where λ is the free space wavelength of the signal to be measured.

14. The test arrangement according to claim 1, wherein the two conductors of the probe are lines on a printed circuit board (2970).

15. The test arrangement according to claim 1, wherein the two conductors of the probe are needle-shaped pins.

16. The test arrangement according to claim 14 or 15, wherein the two conductors of the probe are separate, end-open, non-connected conductors.

17. The test arrangement according to claim 16, wherein the two end-open conductors are configured to detect the electric field of the patch antenna array and / or the slot antenna array of the DUT.

18. The test arrangement according to claim 16, wherein the two end-open conductors of the probe are arranged such that the direction from the first open end to the second open end is within a tolerance of + / - 10 degrees or + / - 20 degrees parallel to the average direction of the electric field of the antenna array in the region between the first open end and the second open end.

19. The test arrangement according to claim 18, wherein the two end-open conductors of the probe are arranged such that the direction of the first conductor of the two conductors in the region of the first open end is perpendicular to the direction of the electric field of the antenna array of the DUT within a tolerance of + / - 10 degrees or within a tolerance of + / - 20 degrees, and the direction of the second conductor of the two conductors in the region of the second open end is perpendicular to the direction of the electric field of the antenna array of the DUT within a tolerance of + / - 10 degrees or within a tolerance of + / - 20 degrees.

20. The test arrangement according to claim 16, wherein the test arrangement is configured to position the two end-open conductors of the probe near the first radiation edge of the patch antenna array of the DUT or near the first radiation slot or slot portion of the slot antenna array of the DUT.

21. The test arrangement according to claim 17, wherein The probe is a first probe, and the test arrangement includes a second probe, wherein the second probe includes a first conductor and a second conductor, and the two conductors of the second probe are separate, end-open, non-connected conductors, wherein the test arrangement is configured to position the two conductors of the second probe at: near the second radiating edge of the patch antenna array of the DUT, the second radiating edge of the patch antenna array of the DUT being opposite to the first radiating edge of the patch antenna array of the DUT, or near the second radiating slot or slot portion of the slot antenna array of the DUT, the second radiating slot or slot portion of the slot antenna array of the DUT being opposite to the first radiating slot or slot portion of the slot antenna array of the DUT.

22. The test arrangement according to claim 21, wherein the test arrangement is configured to combine the signals of the first probe and the second probe.

23. The test arrangement according to claim 21, wherein the arrangement includes a third probe and a fourth probe, wherein the third probe includes a first conductor and a second conductor, the two conductors of the third probe being separate, end-open, non-connected conductors, wherein the test arrangement is configured to position the two conductors of the third probe at: near the third radiating edge of the patch antenna array of the DUT, the third radiating edge of the patch antenna array of the DUT being perpendicular to the first radiating edge of the patch antenna array of the DUT within a tolerance of + / - 10 degrees or + / - 20 degrees, or near the third radiating slot or slot portion of the slot antenna array of the DUT, the third radiating slot or slot portion of the slot antenna array of the DUT being perpendicular to the first radiating slot or slot portion of the slot antenna array of the DUT within a tolerance of + / - 10 degrees or + / - 20 degrees, wherein the fourth probe includes a first conductor and a second conductor, the two conductors of the fourth probe being separate, end-open, non-connected conductors, wherein the test arrangement is configured to position the two conductors of the fourth probe at: near the fourth radiating edge of the patch antenna array of the DUT, the fourth radiating edge of the patch antenna array of the DUT being opposite to the third radiating edge of the patch antenna array of the DUT, or near the fourth radiating slot or slot portion of the slot antenna array of the DUT, the fourth radiating slot or slot portion of the slot antenna array of the DUT being opposite to the third radiating slot or slot portion of the slot antenna array of the DUT.

24. The test arrangement according to claim 23, wherein the test arrangement is configured to combine the signals of the first probe, the second probe, the third probe, and the fourth probe.

25. The test arrangement according to claim 1, wherein the two conductors of the probe are connected to a conductive strip (2335) at their ends to form a closed loop, i.e., a shorted end.

26. The test arrangement according to claim 25, wherein the test arrangement is configured to position the two conductors connected to form a loop near the dipole antenna array of the DUT.

27. The test arrangement according to claim 25 or 26, wherein the test arrangement is configured to position the two conductors connected to form a loop near the center of the dipole antenna array of the DUT.

28. The test arrangement according to claim 25, wherein the test arrangement is configured to position the two conductors connected to form a loop in the electrically symmetric plane of the dipole antenna array of the DUT.

29. The test arrangement according to claim 25, wherein the test arrangement is configured to position the two conductors connected to form a loop to detect the magnetic field of the dipole antenna array of the DUT.

30. The test arrangement according to claim 25, wherein the orientation of the closed loop or the shorted ends of the two conductors of the probe is defined by a plane that is perpendicular to the direction of the magnetic field of the dipole antenna array near the shorted ends of the two-conductor line within a tolerance of + / - 10 degrees or + / - 20 degrees, the plane being defined by the two-conductor line and its shorted ends.

31. The test arrangement according to claim 30, wherein the direction of the two-conductor line away from its shorted ends lies within a plane formed by the loop of the magnetic field of the dipole antenna array near the shorted ends of the two-conductor line within a tolerance of + / - 10 degrees or + / - 20 degrees.

32. The test arrangement according to claim 1, wherein the probe is integrated into the DUT socket.

33. The test arrangement according to claim 1, wherein the probe is integrated into a probe head that includes one or more contacts for making electrical contact with the DUT.

34. The test arrangement according to claim 1, wherein the test arrangement includes absorbers (740, 1140, 1290, 1360, 1470, 1760, 1960, 2260, 2360).

35. A method for characterizing and calibrating a probe and its feed network for subsequent measurement of a DUT at a signal frequency using the test arrangement according to any one of claims 1 to 34, wherein at the antenna array position of the DUT in a previous measurement, the DUT is replaced by a conductive plane surface or a conductive plane surface with a thin dielectric overlay, thereby allowing measurement of the reflection of the signal incident on the feed side of the probe and its feed network.

36. An automated test equipment ATE (510, 800, 1200) having single-site or multi-site test capabilities, including the test arrangement according to any one of claims 1 to 34 and a DUT placed in a test fixture of the test arrangement.

37. The ATE according to claim 36, wherein the antenna array of the DUT includes a planar antenna array and / or a patch antenna array and / or a slot antenna array and / or a dipole antenna array at high frequency and / or microwave frequency and / or millimeter-wave frequency.

38. The ATE according to claim 36, wherein the test arrangement includes one or more probes for each antenna array.

39. A method for testing a DUT including an antenna array in an ATE according to one of claims 36 to 38, wherein the antenna array includes a plurality of antenna elements, and the method includes positioning a probe including two conductors in a region of the reactive near field of the plurality of antenna elements of the DUT.

40. A method for testing a DUT including an antenna array in an ATE according to one of claims 36 to 38, wherein the antenna array includes a plurality of antenna elements, and the method includes: Analyzing a signal provided by the probe to obtain a test result, wherein the signal provided by the probe is based on a signal transmitted by the antenna array of the DUT; and / or feeding a signal to the probe to excite the DUT to obtain a test result.

41. A method for testing a DUT including an antenna array in an ATE according to one of claims 36 to 38, wherein the antenna array includes a plurality of antenna elements, and the method is performed using a test arrangement according to one of claims 1 to 34.

Citation Information

Patent Citations

  • Methods and Apparatus for Testing Electronic Devices with Antenna Arrays

    US20140370821A1