Computer liquid cooling system

Abstract

The present invention discloses a computer liquid cooling system, which includes a radiator with a built-in fluid groove, at least one heat exchange pump and a plurality of fluid conduits. The radiator includes at least one first flow port and at least one second flow port to which the fluid conduit is attached, so as to effectively drive a cooling fluid to flow into and out of the heat exchange pump. The heat generated by the heat generating device is transferred to the cooling fluid flowing through the heat exchange pump, and then output to the radiator. The heated cooling fluid flows through the radiator with a built-in fluid groove and is cooled along a plurality of heat dissipation fins. The cooling fluid flows to the heat exchange pump to start the cooling cycle again.

Description

Technical Field

[0001] The invention relates to the field of heat transfer, in particular to a computer liquid cooling system. Background Art

[0002] During the operation of a computer, server or electronic system, the heat generated by the processor must be dissipated quickly and efficiently to maintain the operating temperature within the manufacturer's recommended range. As the functionality and applicability of electronic systems increase, the operating speed of the processors they use also increases. With the increase in operating speed and the number of processors used, the power demand of the electronic system also increases, thereby increasing the need for heat dissipation.

[0003] Several techniques have been developed to extract heat from processors in electronic systems. One technique is an air cooling system, in which a heat sink is in thermal contact with the processor and transfers heat from the processor, and a fan is mounted on top of the heat sink to remove heat from the heat sink by blowing air through various parts of the heat sink. Such air cooling systems should be adequate for daily use, however, they can be noisy and become less efficient and more cumbersome as processor speeds increase, the number of processors used increases, and more heat is output. Another technique is to use a cooling fluid to cool the processor, which is driven by a pump unit to circulate the cooling fluid in a closed system, wherein the closed system may also have a reservoir, a heat sink in which the cooling fluid circulates, and a water cooling head. The water cooling head is usually where the cooling fluid is in thermal contact with the heat generating processor.

[0004] Generally speaking, liquid heat exchange systems can have lower noise and better efficiency than air cooling systems. However, conventional liquid heat exchange systems are designed to consist of many components, which increases the total installation time, the risk of leakage and the problem of component placement. Therefore, in some applications, one or more components (such as a liquid reservoir) must be placed outside the electronic device housing, thereby requiring at least one hose to connect from the liquid reservoir on the outside to the electronic device housing and an attachment mechanism on the housing or on a separate component. Summary of the invention

[0005] The present invention provides a computer liquid cooling system to solve the problems of long total installation time, high leakage risk and component placement of the traditional liquid heat exchange system in the prior art.

[0006] A computer liquid cooling system disclosed in one embodiment of the present invention comprises a radiator, at least one heat exchange pump and a plurality of fluid conduits. The radiator has a built-in fluid tank and the radiator comprises a first cavity, a second cavity and a plurality of longitudinal fluid channels connected between the first cavity and the second cavity. The fluid conduit is coupled to the heat exchange pump and the first cavity and the second cavity to form a cooling circuit for a cooling fluid to circulate. The built-in fluid tank is connected to the second cavity through a tank conduit fluid, and the built-in fluid tank has a chamber for storing the cooling fluid. The built-in fluid tank is arranged between the first cavity and the second cavity or arranged on a side of the second cavity away from the first cavity.

[0007] According to the computer liquid cooling system disclosed in the above embodiment, it includes a radiator with a built-in fluid tank, at least one heat exchange pump and a plurality of fluid conduits. The heat generated by the heat generating device is transferred to the cooling fluid flowing through the heat exchange pump, and then output to the radiator. The heated cooling fluid flows through the radiator with a built-in fluid tank and is cooled along a plurality of heat sink fins. The cooling fluid flows to the heat exchange pump to start the cooling cycle again. In addition to solving the fluid loss caused by penetration over time, the built-in fluid tank also reduces bubbles, thereby gradually replacing bubbles during the fluid circulation process to improve efficiency. In addition, the built-in fluid tank eliminates the need for a separate storage tank assembly. Therefore, it is no longer necessary to allocate storage tank locations in a computer case or electronic system, thereby reducing the total installation time, the risk of leakage and component placement issues.

[0008] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Unless otherwise specified, the drawings illustrate various aspects of the innovative subject matter described herein. Referring to the drawings, in which similar reference numerals represent similar parts in several drawings, and examples of several heat sink fins incorporating various aspects of the principles of the present invention are shown by way of example, and are not intended to limit the present invention.

[0010] Figure 1A It is a three-dimensional schematic diagram of a computer liquid cooling system according to an embodiment of the present invention.

[0011] Figure 1B for Figure 1A Schematic diagram of the computer liquid cooling system.

[0012] Figure 2A for Figure 1A Schematic diagram of the heat sink.

[0013] Figure 2B for Figure 2A Exploded diagram of the heat sink.

[0014] Figure 2C According to an embodiment of the present invention, Figure 2A inside the second end of the heat sink.

[0015] Figure 2D Show Figure 2A inside the first end of the heat sink.

[0016] Figure 3A FIG. 4 is a schematic diagram of another heat sink according to an embodiment of the present invention.

[0017] Figure 3B for Figure 3A Exploded diagram of the heat sink.

[0018] Figure 3C According to an embodiment of the present invention, Figure 3A inside the second end of the heat sink.

[0019] Figure 3D Show Figure 3A inside the first end of the heat sink.

[0020] Figure 4A FIG. 4 is a schematic diagram of yet another heat sink according to an embodiment of the present invention.

[0021] Figure 4B for Figure 4A Exploded diagram of the heat sink.

[0022] Figure 4C According to an embodiment of the present invention, Figure 4A inside the second end of the heat sink.

[0023] Figure 4D Show Figure 4A inside the first end of the heat sink.

[0024] Figure 5A FIG. 4 is a schematic diagram of yet another heat sink according to an embodiment of the present invention.

[0025] Figure 5B for Figure 5A Exploded diagram of the heat sink.

[0026] Figure 5C According to an embodiment of the present invention, Figure 5A inside the second end of the heat sink.

[0027] Figure 5D Show Figure 5A inside the first end of the heat sink.

[0028] Description of reference numerals:

[0029] 100 Computer Liquid Cooling System

[0030] 110 Heat exchange pump

[0031] 120 Fluid conduit

[0032] 124, 224, 324, 424 First flow port

[0033] 126, 226, 326, 426 Second flow port

[0034] 130, 230, 330, 430 built-in fluid tank

[0035] 132, 232, 332, 432 tank outlet port

[0036] 135, 335, 435 slot guide tube

[0037] 138, 238, 338, 438 Flow ports

[0038] 150, 250, 350, 450 First cavity

[0039] 155, 255, 355, 455 chamber dividers

[0040] 170, 270, 370, 470 Second cavity

[0041] 180, 280, 380, 480 Radiator

[0042] 191, 291, 391, 491 bottom shell

[0043] 194, 294, 394, 494 Longitudinal fluid channel

[0044] 196, 296, 396, 496 heat sink

[0045] 199, 299, 399, 499 Top housing DETAILED DESCRIPTION

[0046] Various principles related to heat exchange systems are described below by reference to specific examples of pump units, reservoirs, radiators, water cooling heads, and computer liquid cooling systems, including configurations and examples of pump units, reservoirs, radiators, and water cooling heads that embody innovative concepts. More specifically, but not exclusively, the innovative principles are described by selected examples of pump units, reservoirs, radiators, water cooling heads, and computer liquid cooling systems, and for the sake of brevity and clarity, well-known functions or structures are not described in detail. However, one or more of the disclosed principles can be combined with various other embodiments of pump units, reservoirs, radiators, water cooling heads, and computer liquid cooling systems to achieve any of a variety of desired results, characteristics, and / or performance criteria.

[0047] Therefore, pump units, reservoirs, radiators, water cooling heads, and computer liquid cooling systems having characteristics different from the specific examples described herein may embody one or more of the innovative principles of the present invention and may be used in a variety of applications not described in detail herein. Therefore, as those skilled in the art will understand after reviewing the present invention, embodiments of pump units, reservoirs, radiators, water cooling heads, and computer liquid cooling systems not described in detail herein also fall within the scope of the present invention.

[0048] Embodiments disclosed herein are directed to a computer liquid cooling system. The computer liquid cooling system absorbs heat generated by one or more heat generating devices in a computer or a server system. The heat generating devices include, but are not limited to, one or more central processing units (CPUs), CPU chipsets, one or more graphics processing units (GPUs), and / or one or more physical processing units (PPUs) installed on a motherboard and / or an expansion card.

[0049] A computer liquid cooling system is used to be configured in a computer case, or to be used as a part of an electronic system that includes a heat generating device that needs to be cooled. The computer liquid cooling system includes at least one liquid-based cooling circuit and may include one or more fans. The one or more fans can be coupled to a rear end of a radiator of the computer liquid cooling system through a fixing member (such as a bolt, screw, adhesive material, etc.) at a structural portion of a radiator to draw air through the radiator to an air chamber of the computer case or electronic system or to an exterior of the computer case or electronic system. Those skilled in the art can easily understand that the type and size of the fan can be changed as long as the air can be drawn through the radiator to an air chamber of the computer case or electronic system or to an exterior of the computer case or electronic system.

[0050] In some embodiments, the one or more fans may be high pressure (e.g., high airflow) fans. In some embodiments, the one or more fans may have reinforced blades. In some embodiments, the design of the blades and / or other elements (e.g., bearings, etc.) may minimize the noise generated during operation. In some embodiments, the fan may be constructed using fixings (e.g., anti-vibration rivets, washers, etc.), wherein the fixings may be used to minimize vibration during operation.

[0051] Each cooling circuit includes a fluid-to-air heat exchanger or a radiator with a built-in fluid tank and at least one heat exchange pump. The built-in fluid tank solves the fluid loss caused by permeation over time. The elements on the cooling circuit are coupled via multiple fluid conduits. The radiator includes at least one first flow port and at least one second flow port to which these fluid conduits are attached to effectively drive a cooling fluid into and out of at least one heat exchange pump. The heat generated by the heat generating device is transferred to the cooling fluid flowing through the at least one heat exchange pump. The heated cooling fluid is output from the heat exchange pump and input into the radiator. The heated cooling fluid flows into and passes through the radiator with a built-in fluid tank and multiple heat dissipation fins. The cooling fluid flows from the radiator to the heat exchange pump to start the cooling cycle again. Although the cooling circuit includes a heat exchange pump, more than one heat exchange pump can be coupled to the radiator. In this way, multiple heat generating devices can be cooled and / or a larger heat generating area can be cooled. The individual heat exchange pumps may be arranged adjacently in multiple rows or in different configurations, allowing for design flexibility to achieve a configuration for a particular application.

[0052] Figure 1A It is a three-dimensional schematic diagram of a computer liquid cooling system according to an embodiment of the present invention. Figure 1B for Figure 1A Schematic diagram of the computer liquid cooling system. Figure 1A and Figure 1B , a computer liquid cooling system 100 includes a radiator 180 having a built-in fluid tank 130, at least one heat exchange pump 110 positioned on one side of the radiator 180, and a plurality of fluid conduits 120 coupled to the heat exchange pump 110 and the radiator 180. Heat generated by a heat generating device is transferred to a cooling fluid flowing through the heat exchange pump 110 and output to the radiator 180. The heated cooling fluid flows to and through the radiator 180. The cooling fluid flows from the radiator 180 to the heat exchange pump 110 to start the cooling cycle again. The built-in fluid tank 130 solves the fluid loss caused by permeation over time.

[0053] In one embodiment, the number of the at least one heat exchange pump 110 is four, but the present invention is not limited thereto. In other embodiments, the number of the heat exchange pumps may be one or more than four. Those skilled in the art can easily understand that the number of the at least one heat exchange pump 110 is changeable, as long as the heat generated by the heat generating device can be transferred to the cooling fluid flowing through the heat exchange pump 110, and then the cooling fluid can flow to the radiator 180 and be received by the heat exchange pump 110 again to start the cooling cycle again.

[0054] In one embodiment, the heat exchange pump 110 pumps cooling fluid from an inlet pump connector attached thereto, through a second distal pump and a first proximal pump of a guide groove, and through heat sink fins in a second-level indented water block area (Second-Level Indented Water Block Area) on a second surface of a water block in thermal contact with the heat generating device, to an outlet pump connector attached thereto.

[0055] The heat exchange pump 110 and the fluid conduit 120, which may be made of plastic materials, may be "metalized" to minimize diffusion of the fluid or evaporation of the fluid. The metal may be a thin coating of metal applied to either or both of the inside or outside of the plastic part. Generally, the entire cooling circuit (e.g., including the radiator) uses the same metal material, such as copper. The fluid conduit 120 may be a flexible plastic material and / or a rigid metal material.

[0056] The cooling fluid of the computer liquid cooling system can be any type of cooling fluid, such as water, water containing additives such as mildew inhibitors, water containing additives for improving thermal conductivity, or other cooling fluids with special ingredients, such as non-conductive liquids or liquids containing lubricant additives or anti-corrosion additives.

[0057] The control of the heat exchange pump 110 driven by an AC or DC electric motor is preferably performed by an operating system or similar means of a computer or electronic system itself, wherein the computer or electronic system includes a device for measuring the load and / or temperature of one or more processors. The use of measurements performed by the operating system or a similar system eliminates the need for special devices for operating the pump. The communication between the operating system or a similar system and a processor for operating the pump can be performed along established communication lines in the computer system, such as USB connection lines. Thus, instant communication between the cooling system and the computer liquid cooling system can be provided without any special devices for establishing communication.

[0058] A further control strategy using the operating system of the computer system or a similar system may include balancing the speed of the heat exchange pump 110 according to the required cooling capacity. If a lower cooling capacity is required, the speed of the heat exchange pump 110 can be limited, thereby limiting the noise generated by the motor driving the heat exchange pump 110.

[0059] Figure 2A for Figure 1A Schematic diagram of the heat sink. Figure 2B for Figure 2A Exploded diagram of the heat sink. Figure 2C According to an embodiment of the present invention, Figure 2A inside the second end of the heat sink. Figure 2D Show Figure 2A The interior of the first end of the heat sink. FIG. 2A to FIG. 2D And reference Figure 1A and Figure 1B , the heat sink 180 with built-in fluid grooves 130 also includes a top shell 199, a bottom shell 191, and a plurality of longitudinal fluid channels 194 arranged in multiple rows and columns therebetween. It can be easily understood by those skilled in the art that the top shell 199 and the bottom shell 191 may include one or more intermediate shells located between the top shell 199, the bottom shell 191, and the longitudinal fluid channels 194, and the top shell 199 and the bottom shell 191 may include a fixing device to the longitudinal fluid channels 194, but the present invention is not limited thereto. It can also be easily understood by those skilled in the art that the total number, number of rows, and number of columns of the longitudinal fluid channels 194 can be changed, depending on the degree of heat absorption required, performance characteristics, and the number of heat exchange pumps 110 and the available space in the computer case or electronic system for installing the computer liquid cooling system 100, as long as the heat generated by the heat generating device can be transferred to the cooling fluid flowing through the heat exchange pump 110, and then the cooling fluid can flow through the longitudinal fluid channels 194 and be received again by the heat exchange pump 110 to start the cooling cycle again. In some embodiments, the total number of longitudinal fluid channels 194 of the heat sink 180 is 45, and these longitudinal fluid channels 194 are arranged in 15 rows and 3 columns. In one embodiment, the longitudinal fluid channels 194 are separated from each other by intervals. The intervals between rows are greater than the intervals between columns.

[0060] In one embodiment, a plurality of fins 196 are disposed transversely across adjacent spaces between rows of longitudinal fluid channels 194 and across each of the three rows. In some embodiments, each fin 196 is disposed at an angle relative to each adjacent row of longitudinal fluid channels 194, but the invention is not limited thereto. It will be readily appreciated by those skilled in the art that each fin 196 may not be disposed at an angle, that it may be variable, or any combination thereof, depending on the degree of heat extraction desired, as long as each fin 196 substantially spans adjacent spaces between rows of longitudinal fluid channels 194 and across each of the three rows, such that air may pass through the heat sink 180 and through the surfaces of the fins 196 and the longitudinal fluid channels 194 to transfer heat away from the heat sink 180 by convection.

[0061] In one embodiment, the heat sink 180 with built-in fluid tank 130 further includes a first cavity 150 with at least one first flow port 124 and a second cavity 170 opposite to the first cavity 150 and having at least one second flow port 126. The top shell 199, the bottom shell 191, the longitudinal fluid channel 194 and the heat sink 196 are disposed between the first cavity 150 and the second cavity 170, and each longitudinal fluid channel 194 allows the first cavity 150 and the second cavity 170 to be in fluid communication with each other. In some embodiments, a threaded joint may be attached to the first flow port 124 and the second flow port 126 to conveniently couple the fluid conduit 120 thereto for the flow of cooling fluid in the cooling circuit. In some embodiments, the number of the first flow ports 124 is four, which is the same as the number of the heat exchange pumps 110, and all of the first flow ports 124 are cooling fluid flow inlets, and the number of the second flow ports 126 is four, which is the same as the number of the heat exchange pumps 110, and all of the second flow ports 126 are cooling fluid flow outlets, but the present invention is not limited thereto. It can be easily understood by those skilled in the art that the positions of the first cavity 150 and the second cavity 170 can be interchanged, and the number of the first flow ports 124 and the number of the second flow ports 126 can be changed according to the number of the heat exchange pumps 110, as long as the heat generated by the heat generating device can be transferred to the cooling fluid flowing through the heat exchange pumps 110, and then the cooling fluid can flow to the radiator 180 and be received by the heat exchange pumps 110 again to start the cooling cycle again. In some embodiments, each first flow port 124 opposite to the second flow port 126 is arranged along the same plane relative to the bottom shell 191, and is evenly spaced from the bottom shell 191 to the top shell 199. In some embodiments, the first flow port 124 and the second flow port 126 closest to the bottom housing 191 are spaced the same as or smaller than the first flow port 124 and the second flow port 126 closest to the top housing 199 .

[0062] In one embodiment, the first chamber 150 further includes at least one chamber partition 155, which separates the cooling fluid and each first flow port 124 and communicates with the longitudinal fluid channel 194 through a waterproof seal to achieve a more efficient flow of the cooling fluid. In some embodiments, the number of the first flow ports 124 is four, the first flow ports 124 are cooling fluid flow inlets, and the number of the chamber partitions 155 is three. Three of the four first flow ports 124 are disposed near the bottom housing 191, and each row of the first flow ports 124 includes three rows of longitudinal flow channels 194. The first flow port 124 closest to the top housing 199 includes three rows of longitudinal fluid channels 194. Those skilled in the art can easily understand that when the number of heat exchange pumps 110 changes, the number of required fluid flow inlets and outlets also changes, and the number of chamber partitions 155 used to separate the cooling fluid and each first flow port 124 and connected to the longitudinal fluid channel 194 also changes, as long as the cooling fluid flowing from each first flow port 124 is separated by a waterproof seal to achieve a more efficient flow of the cooling fluid, and the distance between the first flow port 124 and the second flow port 126 closest to the bottom shell 191 and the bottom shell 191 is equal to or less than the distance between the first flow port 124 and the second flow port 126 closest to the top shell 199 and the top shell 199.

[0063] In some embodiments, the built-in fluid tank 130 includes a tank outlet port 132, and the second cavity 170 further includes a tank flow port 138. The tank outlet port 132 defines a passage for cooling fluid to flow between the built-in fluid tank 130 and the second cavity 170 through a tank conduit 135. In some embodiments, a fill cap is removably disposed with the tank outlet port 132, and the tank conduit 135 can be coupled thereto. The fill cap is disposed adjacent to a portion of the second cavity 170 to add cooling fluid to or remove cooling fluid from the built-in fluid tank 130.

[0064] The built-in fluid tank 130 has a chamber to store cooling fluid. During the operation of the computer liquid cooling system 100, the amount of cooling fluid can be maintained in the built-in fluid tank 130. In some embodiments, the visible portion of the cooling fluid in the built-in fluid tank 130 through the transparent material allows the user to visually observe the amount of cooling fluid in the cooling loop and determine when additional cooling fluid may need to be added to the computer liquid cooling system 100. There is no need to configure additional space for the built-in fluid tank 130, fluid loss due to penetration over time can be reduced, and bubbles can be gradually replaced during the circulation of the fluid, increasing the efficiency of the cooling loop of the computer liquid cooling system 100.

[0065] In some embodiments, the computer liquid cooling system 100 is configured so that the heat sink 180 is located in a vertical plane. In other embodiments, the computer liquid cooling system 100 can be positioned in a horizontal plane or in an angled plane.

[0066] In one embodiment, the flow direction of the cooling fluid through each longitudinal fluid channel 194 of the heat sink 180 is the same. Generally speaking, when the rotor of the heat exchange pump 110 rotates and forces the heated cooling fluid through an outlet pump connection, the heated cooling fluid flows through the fluid conduit 120 to each first flow port 124 of the first chamber 150 and the sub-chamber defined by the chamber divider 155, which separates the heated cooling fluid flowing from each first flow port 124 and connects the longitudinal fluid channels 194. As the heated cooling fluid flows through each longitudinal fluid channel 194, air passes through the heat sink 180 and through the surfaces of the cooling fins 196 and the longitudinal fluid channels 194 to convect away heat from the heat sink 180. The cooled cooling fluid (e.g., 5 degrees, 10 degrees, 15 degrees, etc. lower than the heated cooling fluid entering the first chamber 150) flows through the second chamber 170 and the second flow port 126, through the fluid conduit 120, and returns to an inlet pump connection of the heat exchange pump 110 to start the cooling cycle again. In some embodiments, heat sink 180 can have a heat exchange capacity of at least 350 watts, in a range of about 350 watts to about 500 watts, less than or equal to about 500 watts, and the like.

[0067] In one embodiment, the built-in fluid groove 130 of the heat sink 180 is disposed at a bottom corner of the heat sink 180 adjacent to a portion of the bottom housing 191 and a portion of the second cavity 170. In some embodiments, the height of the built-in fluid groove 130 is equal to the height of three adjacent longitudinal fluid channels 194 and four adjacent intervals thereof, and the width spans the width of three rows of longitudinal fluid channels 194 and the heat sink 180. However, the present invention is not limited thereto.

[0068] Figure 3A FIG. 4 is a schematic diagram of another heat sink according to an embodiment of the present invention. Figure 3B for Figure 3A Exploded diagram of the heat sink. Figure 3C According to an embodiment of the present invention, Figure 3A inside the second end of the heat sink. Figure 3D Show Figure 3A The interior of the first end of the heat sink. FIG. 3A to FIG. 3D And refer to Figures 1A to 2DIn another embodiment, a heat sink 280 with a built-in fluid groove 230 includes a first chamber 250 with at least one first flow port 224, a second chamber 270 opposite to the first chamber 250 and having at least one second flow port 226, a top shell 299, a bottom shell 291, and a plurality of longitudinal fluid channels 294 arranged in multiple rows and columns therebetween. The first chamber 250 includes at least one chamber partition 255, which separates the cooling fluid and each first flow port 224 and communicates with the longitudinal fluid channel 294 through a waterproof seal to achieve more efficient flow of the cooling fluid. A plurality of heat sinks 296 are transversely arranged across adjacent intervals between each row of the longitudinal fluid channels 294 and across each of the three rows and columns. The built-in fluid groove 230 of the heat sink 280 is disposed in a range of the heat sink 280 that is substantially equal to the length of one longitudinal fluid channel 294, the height of one longitudinal fluid channel 294 and its two adjacent intervals, and the width that spans three rows of longitudinal fluid channels 294 and the width of the heat sink 280. The built-in fluid groove 230 is disposed above the first flow port 224 and the second flow port 226 that are closest to the top housing 299.

[0069] In some embodiments, the built-in fluid tank 230 includes a tank outlet port 232 in fluid communication with the second cavity 270, and the second cavity 270 further includes a tank flow port 238. The tank outlet port 232 defines a passage for cooling fluid to flow between the built-in fluid tank 230 and the second cavity 270. In some embodiments, a fill cap is removably disposed on an exterior of the built-in fluid tank 230 to add cooling fluid to or remove cooling fluid from the built-in fluid tank 230.

[0070] The built-in fluid tank 230 has a chamber to store cooling fluid. During operation of the computer liquid cooling system, the amount of cooling fluid can be maintained in the built-in fluid tank 230. In some embodiments, the visible portion of the cooling fluid in the built-in fluid tank 230 through the transparent material allows the user to visually observe the amount of cooling fluid in the cooling loop and determine when additional cooling fluid may need to be added to the computer liquid cooling system. There is no need to configure additional space for the built-in fluid tank 230, fluid loss due to penetration over time can be reduced, and bubbles can be gradually replaced during the circulation of the fluid, increasing the efficiency of the cooling loop of the computer liquid cooling system.

[0071] Figure 4A FIG. 4 is a schematic diagram of yet another heat sink according to an embodiment of the present invention. Figure 4B for Figure 4A Exploded diagram of the heat sink. Figure 4C According to an embodiment of the present invention, Figure 4A inside the second end of the heat sink. Figure 4D Show Figure 4A The interior of the first end of the heat sink. 4A to 4D And refer to Figures 1A to 3D In yet another embodiment, a heat sink 380 having a built-in fluid groove 330 includes a first chamber 350 having at least one first flow port 324, a second chamber 370 opposite to the first chamber 350 and having at least one second flow port 326, a top shell 399, a bottom shell 391, and a plurality of longitudinal fluid channels 394 disposed therebetween in a plurality of rows and columns. The first chamber 350 includes at least one chamber divider 355, which separates the cooling fluid and each first flow port 324 and communicates with the longitudinal fluid channels 394 through a waterproof seal to achieve a more efficient flow of the cooling fluid. The built-in fluid groove 330 of the heat sink 380 is disposed on a side of the heat sink 380 adjacent to the second chamber 370 and opposite to the longitudinal fluid channels 394 and the heat sink 396. In some embodiments, the height and width of the built-in fluid groove 330 are equal to the height and width of the heat sink 380 and its capacity is greater than the capacity of the second chamber 370.

[0072] In some embodiments, the built-in fluid tank 330 includes a tank outlet port 332 and the second cavity 370 further includes a tank flow port 338. The tank outlet port 332 defines a passage for cooling fluid to flow between the built-in fluid tank 330 and the second cavity 370 through a tank conduit 335. In some embodiments, a fill cap is removably disposed with the tank outlet port 332, and the tank conduit 335 can be coupled thereto. The fill cap is disposed adjacent to a portion of the second cavity 370 to add cooling fluid to or remove cooling fluid from the built-in fluid tank 330.

[0073] The built-in fluid tank 330 has a chamber to store cooling fluid. During operation of the computer liquid cooling system, the amount of cooling fluid can be maintained in the built-in fluid tank 330. In some embodiments, the visible portion of the cooling fluid in the built-in fluid tank 330 through the transparent material allows the user to visually observe the amount of cooling fluid in the cooling loop and determine when additional cooling fluid may need to be added to the computer liquid cooling system. With the built-in fluid tank 330, fluid loss due to osmosis over time can be reduced, and bubbles can be gradually replaced during the fluid circulation process, increasing the efficiency of the cooling loop of the computer liquid cooling system.

[0074] Figure 5A FIG. 4 is a schematic diagram of yet another heat sink according to an embodiment of the present invention. Figure 5B for Figure 5A Exploded diagram of the heat sink. Figure 5C According to an embodiment of the present invention, Figure 5Ainside the second end of the heat sink. Figure 5D Show Figure 5A The interior of the first end of the heat sink. FIG. 5A to FIG. 5D And refer to Figures 1A to 4D In yet another embodiment, a heat sink 480 having a built-in fluid groove 430 includes a first cavity 450 having at least one first flow port 424, a second cavity 470 opposite to the first cavity 450 and having at least one second flow port 426, a top shell 499, a bottom shell 491, and a plurality of longitudinal fluid channels 494 disposed therebetween in a plurality of rows and columns. The first cavity 450 includes at least one chamber divider 455, the chamber divider 455 separates the cooling fluid and each first flow port 424 and communicates with the longitudinal fluid channels 494 through a waterproof seal to achieve a more efficient flow of the cooling fluid. The built-in fluid groove 430 of the heat sink 480 is disposed on a long side of the heat sink 480 perpendicular to the second cavity 470 and longitudinal to the longitudinal fluid channels 494 and the heat sink 496. In some embodiments, the capacity of the built-in fluid groove 430 is greater than the capacity of the second cavity 470.

[0075] In some embodiments, the built-in fluid tank 430 includes a tank outlet port 432 and the second cavity 470 is also connected to a tank flow port 438. The tank outlet port 432 defines a passage for cooling fluid to flow between the built-in fluid tank 430 and the second cavity 470 through a tank conduit 435. In some embodiments, a fill cap is removably disposed with the tank outlet port 432, and the tank conduit 435 can be coupled thereto. The fill cap is disposed adjacent to a portion of the second cavity 470 to add cooling fluid to or remove cooling fluid from the built-in fluid tank 430.

[0076] The built-in fluid tank 430 has a chamber to store cooling fluid. During operation of the computer liquid cooling system, the amount of cooling fluid can be maintained in the built-in fluid tank 430. In some embodiments, the visible portion of the cooling fluid in the built-in fluid tank 430 through the transparent material allows the user to visually observe the amount of cooling fluid in the cooling loop and determine when additional cooling fluid may need to be added to the computer liquid cooling system. With the built-in fluid tank 430, fluid loss due to osmosis over time can be reduced, and bubbles can be gradually replaced during the fluid circulation process, increasing the efficiency of the cooling loop of the computer liquid cooling system.

[0077] In some embodiments, the heat sink may be made of a single piece of conductive material such as copper, but the invention is not limited thereto. A person skilled in the art will readily appreciate that in other embodiments, other conductive materials may be used depending on the application, size, and available space.

[0078] In some embodiments, the heat exchange pump 110 can be fixed to a heat generating device by any suitable fixing method (such as soldering, brazing, or thermally conductive adhesive combined with glue). Alternatively, other fixing methods such as removable coupling methods can be used to ensure direct thermal contact between the free surface of the heat generating device and the computer liquid cooling system.

[0079] In some embodiments, the computer liquid cooling system is used to cool various heat generating devices contained in a computer case or electronic system. In other embodiments, the computer liquid cooling system is used to cool only selected heat generating devices, or only to cool one heat generating device, while other heat generating devices are cooled by other or supplementary devices.

[0080] In various embodiments, a computer liquid cooling system is provided, which includes a radiator with a built-in fluid tank, at least one heat exchange pump and a plurality of fluid conduits. The heat generated by the heat generating device is transferred to the cooling fluid flowing through the heat exchange pump, and then output to the radiator. The heated cooling fluid flows through the radiator with a built-in fluid tank and is cooled along a plurality of heat sink fins. The cooling fluid flows to the heat exchange pump to start the cooling cycle again. In addition to solving the problem of fluid loss due to penetration over time, the built-in fluid tank also reduces bubbles, thereby gradually replacing bubbles during the fluid circulation process to improve efficiency. In addition, the built-in fluid tank eliminates the need for a separate storage tank assembly. Therefore, it is no longer necessary to allocate storage tank locations in the computer case or electronic system, thereby reducing the overall installation time, the risk of leakage and component placement issues.

[0081] The inventive concept disclosed at present is not intended to be limited to the embodiments shown herein, but is consistent with the full scope of these embodiments, which is consistent with the principle on which the concept disclosed herein is based. The direction and reference of the element, such as "up", "down", "top", "bottom", "horizontal", "vertical", "left", "right", etc., do not represent an absolute relationship, position and / or direction. The terms of the element (such as "first" and "second") are not literal, but are distinguishing terms. As used herein, the term "comprising" covers the concepts of "including" and "having", and indicates the existence of elements, operations and / or groups or their combinations, and does not mean to exclude the existence or add one or more other elements, operations and / or groups or their combinations. Unless otherwise specified, the order of operations does not mean an absolute order. Unless otherwise stated, the elements mentioned in the singular (such as by using the article "one" or "one") are not used to represent "one and only one", but "one or more". As used herein, "and / or" refers to "and" or "or" and "and" and "or". As used herein, ranges and subranges refer to all ranges including the entire and / or partial values ​​therein, and terms that define or modify ranges and subranges, such as "at least", "greater than", "less than", "not greater than", etc., represent subranges and / or upper or lower limits. All structural and functional equivalents of the elements of the various embodiments described throughout the present invention, as known or will be known to those skilled in the art, are intended to be covered by the features described and claimed herein. Furthermore, none of the contents disclosed herein are intended to be dedicated to the public, regardless of whether this disclosure may ultimately be explicitly described in the scope of the patent application. Unless an element or concept explicitly uses terms such as "device for..." or "step for...", the elements or concepts proposed here or below shall not be interpreted in terms of functional means.

[0082] In view of the many possible embodiments to which the disclosed principles may be applied, we reserve the right to claim any and all combinations of the features and acts described herein, including all rights within the scope and spirit of the foregoing description and any claims issued at any time during the prosecution of this application or in any application claiming the benefit of or priority to this application and combinations recited both literally and by equivalents.

Claims

1. A computer liquid cooling system, characterized in that: Include: A heat sink having a built-in fluid tank, the heat sink comprising a first cavity, a second cavity and a plurality of longitudinal fluid channels connected between the first cavity and the second cavity; at least one heat exchange pump; as well as A plurality of fluid conduits are coupled to the at least one heat exchange pump and the first cavity and the second cavity to form a cooling circuit for circulating a cooling fluid; The built-in fluid tank is connected to the second cavity through a tank conduit fluid, the built-in fluid tank has a chamber to store the cooling fluid, and the built-in fluid tank is arranged between the first cavity and the second cavity or arranged on a side of the second cavity away from the first cavity; wherein, The built-in fluid tank comprises a tank outlet port, which is the only through hole of the built-in fluid tank. The tank conduit connects the tank outlet port and a tank flow port of the second cavity so that the built-in fluid tank fluid is connected to the second cavity.

2. The computer liquid cooling system according to claim 1, characterized in that: The radiator also includes a top shell and a bottom shell, the top shell and the bottom shell are arranged between the first cavity and the second cavity, the longitudinal fluid channels are arranged in multiple rows and columns between the top shell and the bottom shell, the built-in fluid groove is arranged between the first cavity and the second cavity, and the built-in fluid groove is located at a bottom corner adjacent to a portion of the bottom shell and a portion of the second cavity.

3. The computer liquid cooling system as claimed in claim 2, characterized in that: The total number of the longitudinal fluid channels is forty-five, and the longitudinal fluid channels are arranged in fifteen rows and three columns. The height of the built-in fluid groove is equal to the height of three adjacent longitudinal fluid channels and their four adjacent intervals, and the width of the built-in fluid groove spans across three columns of the longitudinal fluid channels.

4. The computer liquid cooling system according to claim 1, characterized in that: The radiator also includes a top shell and a bottom shell, the top shell and the bottom shell are arranged between the first cavity and the second cavity, the longitudinal fluid channels are arranged in multiple rows and columns between the top shell and the bottom shell, the built-in fluid groove is arranged between the first cavity and the second cavity, and the built-in fluid groove is arranged between the longitudinal fluid channels and extends from the first cavity to the second cavity.

5. The computer liquid cooling system as claimed in claim 4, characterized in that: The built-in fluid groove is disposed in the heat sink within a range substantially equal to the length of one of the longitudinal fluid channels, the height of one of the longitudinal fluid channels and two adjacent intervals thereof, and the width across three rows of the longitudinal fluid channels.

6. The computer liquid cooling system as claimed in claim 5, characterized in that: The first cavity also has at least one first flow port, the second cavity also has at least one second flow port, and the fluid conduits are attached to the at least one first flow port and the at least one second flow port to connect the at least one heat exchange pump and the first cavity and the second cavity, and the built-in fluid tank is arranged above the at least one first flow port and the at least one second flow port.

7. The computer liquid cooling system according to claim 1, characterized in that: The built-in fluid groove is arranged on a side of the second cavity away from the first cavity, the built-in fluid groove is adjacent to the second cavity, and the height and width of the built-in fluid groove are equal to the height and width of the radiator.

8. The computer liquid cooling system according to claim 1, characterized in that: The radiator also includes a top shell and a bottom shell, the top shell and the bottom shell are arranged between the first cavity and the second cavity, the longitudinal fluid channels are arranged in multiple rows and columns between the top shell and the bottom shell, the built-in fluid groove is arranged between the first cavity and the second cavity, and the built-in fluid groove is arranged on one side of the longitudinal fluid channels.

9. The computer liquid cooling system as claimed in claim 8, characterized in that: The built-in fluid groove is arranged on a long side of the heat sink, and the built-in fluid groove is perpendicular to the second cavity and parallel to the longitudinal fluid channels.

10. The computer liquid cooling system according to claim 7 or claim 8, characterized in that: The capacity of the built-in fluid tank is greater than that of the second cavity.

11. The computer liquid cooling system according to claim 1, characterized in that: The fluid conduits are made of flexible plastic material and / or rigid metal material.

12. The computer liquid cooling system according to claim 1, characterized in that: A thin metal coating is disposed on either or both of the inner and outer sides of the fluid conduits.

13. The computer liquid cooling system according to claim 12, characterized in that: The material of the thin metal coating is copper.

14. The computer liquid cooling system according to claim 1, characterized in that: The total number of the longitudinal fluid channels is forty-five, and the longitudinal fluid channels are arranged in fifteen rows and three columns.

15. The computer liquid cooling system according to claim 1, characterized in that: The heat sink also includes a plurality of heat sinks, which are disposed between the first cavity and the second cavity, and are transversely disposed across adjacent intervals between rows of the longitudinal fluid channels.

16. The computer liquid cooling system according to claim 1, characterized in that: The longitudinal fluid channels are separated from each other by intervals, and the intervals between rows are greater than the intervals between columns.

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