The third generation semiconductor mask operation method

Abstract

The present invention relates to the field of semiconductor technology, and discloses a third-generation semiconductor mask operation method, which includes production line detection process mask confirmation, storage area detection process mask confirmation, and lithography machine detection process mask confirmation. Only when the mask encoding information of the mask is consistent can it enter the next application process, and the multi-layer monitoring controls the transportation of the mask. After multi-level mask inspection, it is ensured that the mask used in actual production is the set mask, avoiding the problem of using the wrong mask due to the transportation error of the mask, and ensuring that the chip production uses the correct mask in the lithography step. The present invention also files all the masks in the factory and records the mask history, updates the status of the mask in real time, and digitizes the status of the mask, so as to visualize the situation of the mask in the wafer factory.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a third generation semiconductor photomask operation method. Background Art

[0002] With the development and evolution of science and technology, human life has become more colorful and convenient due to the changes in technology, and electronic products play an extremely important role in it. In order to pursue high performance and portability, today's electronic products are evolving towards light, thin, and short sizes, so the various electronic components of electronic products are also miniaturized to nanometer sizes. In the manufacturing process of IC chips (microelectronic devices), photomasks are indispensable. In chip manufacturing, a photolithography machine is used to allow light (such as ultraviolet light) to pass through the mask, and then a lens is used to reduce the image and project it onto the surface of the silicon wafer, manufacturing hundreds of individual chips on a silicon wafer.

[0003] A photomask, also called a photomask, is made of quartz material. It is the template we use to print integrated circuits on silicon wafers and is the blueprint for billions of transistors on the chip. When manufacturing multi-layer chips, multiple masks may be required. For example, to make many layers of Intel's 14nm chip, more than 50 masks are required. These masks have upper and lower layers, and each layer has its own tasks. Therefore, in order for the chips to operate normally, the correct use of masks must be ensured during the manufacturing process. However, in the IC chip production process, it is easy to make mistakes in the transportation of masks, resulting in the use of the wrong masks in the production products, which leads to errors in IC chip production, serious production accidents, and waste of production materials. Summary of the invention

[0004] The main purpose of the present invention is to solve the problem of wrong mask transport and wrong mask used in product production.

[0005] The present invention provides a third-generation semiconductor photomask operation method, the third-generation semiconductor photomask operation method comprising:

[0006] Production line inspection process: Obtain the mask coding information of all masks on the production line and compare the mask coding information of each mask on the production line; if the comparison is inconsistent, send a mask replacement instruction, and after the manufacturing execution system replaces the correct mask, compare the mask coding information of each mask on the production line again; if the comparison is consistent, send a transmission confirmation instruction to transfer each mask on the production line to the mask storage area;

[0007] Storage area detection process: obtain the mask coding information of all masks in the mask storage area and compare the mask coding information of each mask in the mask storage area; if the comparison is inconsistent, send a mask replacement instruction, and after the manufacturing execution system checks and replaces the correct mask, compare the mask coding information of each mask in the mask storage area again; if the comparison is consistent, it is confirmed that the mask storage in the mask storage area is normal;

[0008] Lithography machine inspection process: The lithography machine takes out the required masks from the mask storage area according to the set program and loads them into the mask temporary storage area of ​​the lithography machine, obtains the mask coding information of all masks in the mask temporary storage area of ​​the lithography machine, and compares the mask coding information of each mask in the mask temporary storage area of ​​the lithography machine; if the comparison is inconsistent, a mask replacement instruction is sent, and the lithography machine replaces the mask in the mask temporary storage area of ​​the lithography machine and then compares the mask coding information of each mask in the mask temporary storage area of ​​the lithography machine again; if the comparison is consistent, a mask loading normal instruction is sent, and the lithography machine operates normally.

[0009] Optionally, in a second implementation of the first aspect of the present invention, before the production line detection process, the third-generation semiconductor mask operation method further includes:

[0010] Warehousing process: After the masks enter the factory and are inspected and qualified, each newly stored mask will be placed in the cleaning equipment for cleaning, and placed in the mask box after cleaning; the mask coding information of all newly stored masks after this cleaning is obtained and recorded, and all newly stored masks after cleaning are filed.

[0011] Optionally, in a second implementation of the first aspect of the present invention, before the production line detection process, the third-generation semiconductor mask operation method further includes:

[0012] Resume building process: Create a history record for each stored mask, which includes usage time, application status and mask status.

[0013] Optionally, in a second implementation of the first aspect of the present invention, after the lithography machine detection process, the third-generation semiconductor mask operation method further includes:

[0014] Cleaning process: When the production line switches products or continuous production reaches a preset quantity, the lithography machine unloads the mask, obtains the mask code of each mask to be cleaned, and updates the mask status to to be cleaned; after cleaning each unloaded mask, the clean mask is placed in the mask box, and the mask coding information of each mask after this cleaning is obtained and recorded, and the mask status is updated to standby.

[0015] Optionally, in a second implementation of the first aspect of the present invention, after the cleaning process, the third-generation semiconductor photomask operation method further includes:

[0016] Damage detection process: During the mask operation process, after the manufacturing execution system detects mask damage, it obtains the mask coding information of the damaged mask and updates the application status of the damaged mask to abnormal to prevent the damaged mask from being misused.

[0017] Optionally, in a second implementation of the first aspect of the present invention, after the damage detection process, the third-generation semiconductor mask operation method further includes:

[0018] Damage analysis process: The manufacturing execution system determines the damage condition of the mask and chooses to clean the mask, send it to the factory for repair, or scrap it according to the damage condition.

[0019] Optionally, in a second implementation of the first aspect of the present invention, after the damage analysis process, the third-generation semiconductor mask operation method further includes:

[0020] Damage handling process: obtain the mask coding information of the mask to be cleaned and update the mask status of the mask to be cleaned to to be cleaned; issue a cleaning instruction and send the mask to be cleaned into the mask cleaning process; obtain the mask coding information of the mask sent to the factory for repair and update the application status of the mask sent to the factory for repair to sent to the factory for repair; obtain the mask coding information of the scrapped mask and update the application status of the scrapped mask to scrapped.

[0021] Optionally, in a second implementation of the first aspect of the present invention, after the damage processing process, the third-generation semiconductor mask operation method further includes:

[0022] Return inspection process: The manufacturing execution system inspects the masks that are sent to the factory for repair and then returned to the factory. After passing the inspection, the mask information code of the mask that has passed the repair is obtained, and the application status of the mask that has passed the repair is updated to normal.

[0023] Optionally, in a second implementation of the first aspect of the present invention, after the damage analysis process, the third-generation semiconductor mask operation method further includes:

[0024] Scrap processing process: The manufacturing execution system will scrap the masks with scrapped application status and seal the history records of the scrapped masks.

[0025] Optionally, in a second implementation of the first aspect of the present invention, the third-generation semiconductor photomask operation method further includes:

[0026] Transfer process: obtain inter-factory transfer instructions for masks, query mask history records, send inter-factory transfer instructions for masks, record mask coding information for inter-factory transferred masks, and update the application status of the transferred masks to inter-factory transfer.

[0027] In the technical solution provided by the present invention, the third-generation semiconductor mask operation method obtains the mask coding information of the masks transported during the production process, the masks in the storage area, and the masks captured by the lithography machine, and compares the mask coding information in each process respectively. Only when the mask coding information comparison of the masks is consistent can it enter the next application process. After multi-level mask inspection, it is ensured that the mask used in actual production is the set mask, avoiding the problem of using the wrong mask due to incorrect mask transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of a first embodiment of a third generation semiconductor photomask operation method according to an embodiment of the present invention;

[0029] Figure 2 Schematic diagram of a second embodiment of the third generation semiconductor mask operation method in an embodiment of the present invention. DETAILED DESCRIPTION

[0030] An embodiment of the present invention provides a third generation semiconductor mask operation method. The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" or "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0031] For ease of understanding, the specific process of the embodiment of the present invention is described below. Figure 1 The third generation semiconductor photomask operation method in the embodiment of the present invention includes:

[0032] Production line inspection process: Obtain the mask coding information of all masks on the production line and compare the mask coding information of each mask on the production line; if the comparison is inconsistent, send a mask replacement instruction, and after the manufacturing execution system replaces the correct mask, compare the mask coding information of each mask on the production line again; if the comparison is consistent, send a transmission confirmation instruction to transfer each mask on the production line to the mask storage area;

[0033] Storage area detection process: obtain the mask coding information of all masks in the mask storage area and compare the mask coding information of each mask in the mask storage area; if the comparison is inconsistent, send a mask replacement instruction, and after the manufacturing execution system checks and replaces the correct mask, compare the mask coding information of each mask in the mask storage area again; if the comparison is consistent, it is confirmed that the mask storage in the mask storage area is normal;

[0034] Lithography machine inspection process: The lithography machine takes out the required masks from the mask storage area according to the set program and loads them into the mask temporary storage area of ​​the lithography machine, obtains the mask coding information of all masks in the mask temporary storage area of ​​the lithography machine, and compares the mask coding information of each mask in the mask temporary storage area of ​​the lithography machine; if the comparison is inconsistent, a mask replacement instruction is sent, and the lithography machine replaces the mask in the mask temporary storage area of ​​the lithography machine and then compares the mask coding information of each mask in the mask temporary storage area of ​​the lithography machine again; if the comparison is consistent, a mask loading normal instruction is sent, and the lithography machine operates normally.

[0035] The mask is the blueprint for semiconductor production and is designed and produced according to the needs of the semiconductor chips produced. The circuit on the mask has been carefully calculated and designed. Any change in the circuit line and / or intersection on the mask may cause the change in the circuit function of the semiconductor chip prepared by the mask, resulting in the semiconductor chip not being able to work properly. In the preparation of multi-layer semiconductor chips, multiple masks are divided into upper and lower layers, each layer has its own task, and different masks must be used in a set order. Therefore, in the production of semiconductor chip products for specific purposes, it is necessary to ensure that the masks used in production are the masks required by the design. Once the mask is used incorrectly, the produced chip cannot achieve the designed function, resulting in production errors, waste of production capacity, product delivery delays and other consequences. Each mask entering the factory has a unique mask code, and the mask code can be recognized by the instrument. The present invention uses the uniqueness and recognizability of the mask code, and uses the mask code as the identity information of each mask, so as to achieve the purpose of confirming the mask.

[0036] The factory will conduct trial production before formal production. During the trial production, the factory will adjust various aspects of the semiconductor chip production line to make the final production plan more comprehensive. The factory also completes the confirmation of the masks used in production during the trial production. Therefore, during the trial production stage, the method will obtain the mask information used for comparison in the production line inspection process, storage area inspection process, and lithography machine inspection process. In the wafer factory, there are multiple production lines for different chips, and different chips will use different masks. Therefore, there will be errors in the application of masks due to errors in the transportation of masks. Therefore, in the production line inspection process, it is confirmed that all masks on the production line are the masks required for this production line; after the production line inspection process, each mask needed for production will be transported to the mask storage area. A production line will have multiple mask storage areas. Therefore, the masks in the mask storage area must also be consistent with the mask type during trial production in each mask storage area, so that the lithography machine can grab the correct mask. The storage area inspection process confirms that the mask in the mask storage area is the mask required by the mask storage area; after the storage area inspection process, the lithography machine takes the required mask out of the mask storage area and loads it into the mask temporary storage area of ​​the lithography machine. The lithography machine has multiple mask temporary storage areas. When producing different products, according to different needs, the lithography machine works according to the program settings. Therefore, the masks in each mask temporary storage area must be the masks required by the program settings. The lithography machine inspection process confirms that the masks in each mask temporary storage area are consistent with the mask type set by the program during trial production to ensure that the masks used for production are correct. The present invention confirms the mask coding information of the multi-process mask and checks each level, thereby reducing the use errors of the mask in production as much as possible.

[0037] refer to Figure 2 In a second embodiment of the present invention, before the production line detection process described in the first embodiment, the third generation semiconductor mask operation method further includes:

[0038] Warehousing process: After the masks enter the factory and pass the inspection, each newly stored mask is placed in the cleaning equipment for cleaning, and placed in the mask box after cleaning; the mask coding information of all newly stored masks after this cleaning is obtained and recorded, and all newly stored masks after cleaning are filed. This step files and retains the mask codes of all masks entering the factory, fully grasps the situation of masks retained in the wafer factory, and facilitates production arrangements.

[0039] Resume construction process: Create a resume record for each stored mask, which includes the usage time, application status and mask status. The mask history record will record the length of time each mask has been used in production from the time of viewing; the mask history record will record the mask status of each mask at the recording node, such as whether the mask is in the production line process, on standby in the mask storage area, in use or in other states; the mask history record will record whether the application status of the mask is normal or other situations. The specific situation of each mask in the wafer fab can be intuitively obtained from the mask history file, which is conducive to the prediction of mask usage in wafer production, and provides real-time specific parameters about the mask to the prevention and correction modules of the manufacturing execution system, so that the manufacturing execution system can prepare for the purchase, repair, deployment, scrapping, etc. of the mask in advance.

[0040] Cleaning process: When the production line switches products or the continuous production reaches a preset number, the lithography machine unloads the mask, obtains the mask code of each mask to be cleaned, and updates the mask status to be cleaned; after cleaning each unloaded mask, the clean mask is placed in the mask box, the mask code information of each mask after this cleaning is obtained and recorded, and the mask status is updated to standby. Due to the very fine circuits on the mask and the characteristics of photolithography, the substrate of the mask will be contaminated after continuous production, causing the chips prepared with the contaminated mask to have common defects in the mask, affecting the chip performance, so the preset number of masks produced continuously needs to be cleaned; similarly, when the production line switches products, the mask used for production will enter the standby state. In order to ensure that the mask can be used normally in the next production and prevent the contaminants on the mask from being uncleaned for a long time and causing damage to the mask, the mask needs to be cleaned.

[0041] Damage detection process: During the mask operation process, after the manufacturing execution system detects mask damage, it obtains the mask coding information of the damaged mask and updates the application status of the damaged mask to abnormal to prevent the damaged mask from being misused.

[0042] Damage analysis process: The manufacturing execution system determines the damage condition of the mask and chooses to clean the mask, send it to the factory for repair, or scrap it according to the damage condition.

[0043] Damage handling process: obtain the mask coding information of the mask to be cleaned and update the mask status of the mask to be cleaned to to be cleaned; issue a cleaning instruction and send the mask to be cleaned into the mask cleaning process; obtain the mask coding information of the mask sent to the factory for repair and update the application status of the mask sent to the factory for repair to sent to the factory for repair; obtain the mask coding information of the scrapped mask and update the application status of the scrapped mask to scrapped.

[0044] That is, in the production of chips, the masks stored in the mask box and the masks on the production line may be damaged, and the damaged masks will be detected by the manufacturing execution system. The present invention obtains the mask coding information of the damaged mask and updates the application status of the damaged mask to abnormal, so as to prevent the damaged mask from being misused and producing unqualified chips. The manufacturing execution system performs a status check on the damaged mask, determines the damage type of the mask, and updates the judgment result to the corresponding mask history record.

[0045] If the mask damage is caused by contamination, the mask coding information of the mask to be cleaned is obtained and the mask state of the mask to be cleaned is updated to be to be cleaned, and then a cleaning instruction is issued, and the mask to be cleaned is sent to the mask cleaning process to clean the damaged mask.

[0046] If the damage to the damaged mask is caused by the damage to the mask itself, the damaged mask will be checked to determine whether it can be repaired. The damaged mask that can be repaired will be sent to the factory for repair and the application status of the mask sent to the factory for repair will be updated to sent to the factory for repair; the damaged mask that cannot be repaired after inspection will be scrapped and the mask status of the scrapped mask will be updated to scrapped.

[0047] Return inspection process: The manufacturing execution system inspects the masks that are sent to the factory for repair and return to the factory. After passing the inspection, it obtains the mask information code of the repaired masks and updates the application status of the repaired masks to normal. The masks sent to the factory for repair are repaired in the mask factory, and the repaired masks are returned to the wafer factory. The repaired masks need to be inspected for quality by the manufacturing execution system. After passing the inspection, the application status of the masks that have passed the inspection is updated to normal in a timely manner to facilitate subsequent production use and the mastery of the mask status.

[0048] Scrap processing process: The manufacturing execution system will scrap the scrapped masks in a unified manner and seal the scrapped masks' records. The unified scrapping of scrapped masks can save manpower and time, standardize the process, and handle scrapped materials. Sealing the scrapped masks' records can reduce the number of records so that more resources can be used to pay attention to the status of the available masks in real time, and seal the masks' records to keep the audit trail of scrapped masks without causing confusion in the records.

[0049] Transfer process: Get inter-factory transfer instructions for masks, query mask history records, send inter-factory transfer instructions for masks, record mask coding information for inter-factory transferred masks, and update the application status of transferred masks to inter-factory transfer. Since each wafer fab has limited production capacity and production lines, some masks are idle at different times. In order to make full use of production materials, masks can be transferred between multiple wafer fabs. Masks that are transferred between factories need to keep a record of their application status.

[0050] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" or "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0051] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A third generation semiconductor mask operation method, characterized in that: The third generation semiconductor mask operation method comprises: Production line inspection process: Obtain the mask coding information of all masks on the production line and compare the mask coding information of each mask on the production line; if the comparison is inconsistent, send a mask replacement instruction, and after the manufacturing execution system replaces the correct mask, compare the mask coding information of each mask on the production line again; if the comparison is consistent, send a transmission confirmation instruction to transfer each mask on the production line to the mask storage area; Storage area detection process: obtain the mask coding information of all masks in the mask storage area and compare the mask coding information of each mask in the mask storage area; if the comparison is inconsistent, send a mask replacement instruction, and after the manufacturing execution system checks and replaces the correct mask, compare the mask coding information of each mask in the mask storage area again; if the comparison is consistent, it is confirmed that the mask storage in the mask storage area is normal; Lithography machine inspection process: The lithography machine takes out the required masks from the mask storage area according to the set program and loads them into the mask temporary storage area of ​​the lithography machine, obtains the mask coding information of all masks in the mask temporary storage area of ​​the lithography machine, and compares the mask coding information of each mask in the mask temporary storage area of ​​the lithography machine; if the comparison is inconsistent, a mask replacement instruction is sent, and the lithography machine replaces the mask in the mask temporary storage area of ​​the lithography machine and then compares the mask coding information of each mask in the mask temporary storage area of ​​the lithography machine again; if the comparison is consistent, a mask loading normal instruction is sent, and the lithography machine operates normally.

2. The third generation semiconductor mask operation method according to claim 1, characterized in that: Before the production line detection process, the third generation semiconductor mask operation method further includes: Warehousing process: After the masks enter the factory and are inspected and qualified, each newly stored mask will be placed in the cleaning equipment for cleaning, and placed in the mask box after cleaning; the mask coding information of all newly stored masks after this cleaning is obtained and recorded, and all newly stored masks after cleaning are filed.

3. The third generation semiconductor mask operation method according to claim 2, characterized in that: Before the production line detection process, the third generation semiconductor mask operation method further includes: Resume building process: Create a history record for each stored mask, which includes usage time, application status and mask status.

4. The third generation semiconductor mask operation method according to any one of claims 1 to 3, characterized in that: After the lithography machine detection process, the third generation semiconductor mask operation method further includes: Cleaning process: When the production line switches products or continuous production reaches a preset quantity, the lithography machine unloads the mask, obtains the mask code of each mask to be cleaned, and updates the mask status to to be cleaned; after cleaning each unloaded mask, the clean mask is placed in the mask box, and the mask coding information of each mask after this cleaning is obtained and recorded, and the mask status is updated to standby.

5. The third generation semiconductor mask operation method according to claim 4, characterized in that: After the cleaning process, the third generation semiconductor photomask operation method further includes: Damage detection process: During the mask operation process, after the manufacturing execution system detects mask damage, it obtains the mask coding information of the damaged mask and updates the application status of the damaged mask to abnormal to prevent the damaged mask from being misused.

6. The third generation semiconductor mask operation method according to claim 5, characterized in that: After the damage detection process, the third generation semiconductor mask operation method further includes: Damage analysis process: The manufacturing execution system determines the damage condition of the mask and chooses to clean the mask, send it to the factory for repair, or scrap it according to the damage condition.

7. The third generation semiconductor mask operation method according to claim 6, characterized in that: After the damage analysis process, the third generation semiconductor mask operation method further includes: Damage handling process: obtain the mask coding information of the mask to be cleaned and update the mask status of the mask to be cleaned to to be cleaned; issue a cleaning instruction and send the mask to be cleaned into the mask cleaning process; obtain the mask coding information of the mask sent to the factory for repair and update the application status of the mask sent to the factory for repair to sent to the factory for repair; obtain the mask coding information of the scrapped mask and update the application status of the scrapped mask to scrapped.

8. The third generation semiconductor mask operation method according to claim 7, characterized in that: After the damage treatment process, the third generation semiconductor mask operation method further includes: Return inspection process: The manufacturing execution system inspects the masks that are sent to the factory for repair and then returned to the factory. After passing the inspection, the mask coding information of the masks that have passed the repair is obtained, and the application status of the masks that have passed the repair is updated to normal.

9. The third generation semiconductor mask operation method according to claim 7, characterized in that: After the damage analysis process, the third generation semiconductor mask operation method further includes: Scrap processing process: The manufacturing execution system will scrap the masks with scrapped application status and seal the history records of the scrapped masks.

10. The third generation semiconductor mask operation method according to claim 3 or 8, characterized in that: The third generation semiconductor mask operation method further comprises: Transfer process: obtain inter-factory transfer instructions for masks, query mask history records, send inter-factory transfer instructions for masks, record mask coding information for inter-factory transferred masks, and update the application status of the transferred masks to inter-factory transfer.

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