A v-shaped vent structure for preventing soldering bubbles of LGA components

Abstract

The application discloses a V-shaped exhaust structure for preventing LGA component welding bubbles, and belongs to the technical field of LGA component packaging, which comprises a PCB board, LGA components and a plurality of positioning pieces, a plurality of LGA component connecting holes and a plurality of positioning holes are arranged on the PCB board, a plurality of solder balls are arranged at the bottom of the LGA components, the positioning piece comprises a plurality of connecting bodies and a plurality of positioning bodies, the plurality of positioning bodies are correspondingly clamped in the plurality of positioning holes, the plurality of connecting bodies form a positioning groove by surrounding and blocking, the LGA components are located in the positioning groove, and the plurality of solder balls are correspondingly welded in the plurality of LGA component connecting holes. The double V-shaped structure with the two sides wide and the middle narrow is designed for the LGA component connecting holes, the solder balls at the bottom of the LGA components are exhausted, the problem of LGA component welding bubbles is improved, meanwhile, the LGA components are positioned through the positioning piece, and the displacement of the LGA components during welding of the LGA components is avoided, so that the packaging quality is seriously affected.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of LGA component packaging, and particularly relates to a V-shaped exhaust structure for preventing welding bubbles of LGA components. BACKGROUND

[0002] LGA has been widely used as a stable power output chip in printed circuit boards for military and aerospace at home and abroad. LGA is easier to design and control than other integrated power supplies and discrete power supplies due to its small size and small ripple power output characteristics. However, due to the special packaging form of LGA, it has always been a technical difficulty to obtain good quality and reliability in electrical installation. At present, domestic LGA devices are mainly installed by printing tin paste on the printed board and then reflowing in the ordinary welding mode. However, most of the welding holes on the existing PCB are straight circular holes, which makes it easy to produce bubbles when LGA devices are welded.

[0003] At the same time, the tweezers are often used to manually hold the LGA device on both sides during welding, and the welding balls at the bottom of the LGA device are aligned on the welding hole on the PCB. Then, the LGA device is heated and blown by a hot air gun, so that the welding balls at the bottom of the LGA device are melted and welded in the welding hole. However, manually holding the tweezers to fix the LGA device during welding is easy to cause displacement of the LGA device, so that the LGA device cannot be welded in place, and the packaging of the LGA device cannot be completed. It needs to be disassembled and packaged again, which not only seriously affects the packaging efficiency of the LGA device, but also produces some rust, oil and moisture on the PCB, which is more likely to cause bubbles in the welded LGA device and affect the packaging quality. SUMMARY

[0004] The present application aims to solve the problem of the existing LGA device in the welding packaging process, which is easy to produce bubbles and affect the packaging effect of the LGA device due to the manual use of tweezers to clamp the LGA component for packaging and welding in the straight cylinder welding hole.

[0005] In order to achieve the above purpose, the present application adopts the following technical scheme: a V-shaped exhaust structure for preventing welding bubbles of LGA components, comprising a PCB, LGA components and a plurality of positioning members, the PCB is provided with a plurality of LGA component connection holes and a plurality of positioning holes, the bottom of the LGA component is provided with a plurality of welding balls, the positioning member comprises a plurality of connecting bodies and a plurality of positioning bodies, a plurality of positioning bodies are correspondingly clamped in a plurality of positioning holes, a plurality of connecting bodies form a positioning groove, the LGA component is located in the positioning groove, and a plurality of welding balls are correspondingly welded in a plurality of LGA component connection holes.

[0006] As a further description of the above technical solutions:

[0007] The LGA component connecting hole section is a double-V-shaped hole with both ends wide and the middle narrow.

[0008] As a further description of the above technical solutions:

[0009] A plurality of positioning holes are arranged on both sides of the LGA component connecting hole.

[0010] As a further description of the above technical solutions:

[0011] The connecting body is provided with a limiting plate, and the bottom of the limiting plate abuts against the surface of the LGA component.

[0012] As a further description of the above technical solutions:

[0013] The positioning member is U-shaped.

[0014] As a further description of the above technical solutions:

[0015] The connecting body is L-shaped.

[0016] As a further description of the above technical solutions:

[0017] The number of the positioning members is two.

[0018] As a further description of the above technical solutions:

[0019] The number of the connecting bodies is two, and a spring member is arranged between the two connecting bodies.

[0020] As a further description of the above technical solutions, the beneficial effects of the present application are:

[0021] 1、In the present application, the LGA component connecting hole on the PCB is designed as a double-V-shaped hole with both ends wide and the middle narrow, so that when the LGA component is welded, the solder balls at the bottom of the LGA component can be welded in the inner hole of the LGA component connecting hole through the expanded V-shaped hole for exhaust, avoiding the occurrence of bubbles during packaging of the LGA component, which seriously affects the packaging quality of the LGA component.

[0022] 2、In the present application, the U-shaped positioning member is designed, the positioning member is composed of two connecting bodies, the connecting bodies are elastically connected together, the PCB is provided with a positioning hole, the positioning body on the positioning member is positioned in the positioning hole, the two ends of the LGA component are limited by the two positioning members, then the LGA component is blown by a hot air gun, so that the LGA component can be accurately welded in the LGA component connecting hole, avoiding displacement of the LGA component during welding, improving the packaging quality of the LGA component and the welding efficiency of the LGA component. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A top view of a PCB board in a V-shaped venting structure to prevent air bubbles during LGA component soldering.

[0025] Figure 2 A bottom view of an LGA component in a V-shaped venting structure for preventing welding bubbles in LGA components.

[0026] Figure 3 A top view of an LGA component in a V-shaped venting structure for preventing welding bubbles in LGA components.

[0027] Figure 4 A side view of an LGA component in a V-shaped venting structure for preventing welding bubbles in LGA components.

[0028] Figure 5 A cross-sectional view of a PCB board in a V-shaped venting structure to prevent air bubbles during LGA component soldering.

[0029] Figure 6 A front view of a positioning element in a V-shaped venting structure for preventing welding bubbles in LGA components.

[0030] Figure 7 A top view of a positioning element in a V-shaped venting structure for preventing welding bubbles in LGA components.

[0031] Legend:

[0032] 1-PCB board; 2-LGA component; 3-Positioning component; 31-Connector; 32-Positioning component; 4-LGA component connection hole; 5-Positioning hole; 6-Solder ball; 7-Positioning groove; 8-Limiting plate; 9-Spring component. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some but not all of the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0036] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0037] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship indicated by the terms "upper", "inner" and the like is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0038] In the description of the present application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0039] Please refer to Figures 1-7 The present application provides a technical solution: a V-shaped exhaust structure for preventing LGA component welding bubbles, comprising a PCB board 1, an LGA component 2 and a plurality of positioning pieces 3, a plurality of LGA component connecting holes 4 and a plurality of positioning holes 5 are arranged on the PCB board 1, a plurality of solder balls 6 are arranged at the bottom of the LGA component 2, the positioning piece 3 comprises a plurality of connecting bodies 31 and a plurality of positioning bodies 32, a plurality of positioning bodies 32 are correspondingly clamped in a plurality of positioning holes 5, a plurality of connecting bodies 31 form a positioning groove 7 by surrounding and blocking, the LGA component 2 is located in the positioning groove 7, and a plurality of solder balls 6 are correspondingly welded in a plurality of LGA component connecting holes 4.

[0040] The LGA component connecting hole 4 is a double-V-shaped hole with the two ends wide and the middle narrow.

[0041] A plurality of positioning holes 5 are arranged on both sides of the LGA component connecting hole 4.

[0042] The connecting body 31 is provided with a limiting plate 8, and the bottom of the limiting plate 8 abuts against the surface of the LGA component 2.

[0043] The positioning member 3 is U-shaped.

[0044] The connecting body 31 is L-shaped.

[0045] The number of the positioning member 3 is two.

[0046] The number of the connecting body 31 is two, and a spring member 9 is arranged between the two connecting bodies 31.

[0047] Working principle: the solder paste is applied on the bottom of the LGA component, the LGA component connecting hole on the PCB is designed as a double-V-shaped hole with the two sides wide and the middle narrow, the solder balls on the bottom of the LGA component are aligned with the LGA component connecting hole on the PCB, the two ends of the LGA component are limited by the two positioning members, the hot air gun is used to blow the LGA component, so that the LGA component can be accurately welded in the LGA component connecting hole, the problem of air bubbles generated in the welding of the LGA component is improved, and the LGA component packaging quality and the welding efficiency of the LGA component are improved.

[0048] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this, any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A V-shaped exhaust structure for preventing LGA component soldering bubbles, comprising a PCB board (1), an LGA component (2) and a plurality of positioning members (3), the PCB board (1) is provided with a plurality of LGA component connecting holes (4) and a plurality of positioning holes (5), the bottom of the LGA component (2) is provided with a plurality of soldering balls (6), the positioning member (3) comprises a plurality of connecting bodies (31) and a plurality of positioning bodies (32), the plurality of positioning bodies (32) are correspondingly clamped in the plurality of positioning holes (5), the plurality of connecting bodies (31) surround to form a positioning groove (7), the LGA component (2) is located in the positioning groove (7), and the plurality of soldering balls (6) are correspondingly soldered in the plurality of LGA component connecting holes (4). The LGA component connecting hole (4) is a double-V-shaped hole with wide ends and narrow middle. The connecting body (31) is provided with a limiting plate (8), and the bottom of the limiting plate (8) abuts against the surface of the LGA component (2). The number of the connecting body (31) is 2, and a spring member (9) is arranged between the two connecting bodies (31).

2. The V-shaped vent structure for preventing soldering bubbles of an LGA component according to claim 1, wherein The plurality of positioning holes (5) are correspondingly arranged on both sides of the LGA component connecting hole (4).

3. The V-shaped vent structure for preventing soldering bubbles of an LGA component according to claim 1, wherein The positioning member (3) is U-shaped.

4. The V-shaped vent structure for preventing soldering bubbles of an LGA component according to claim 1, wherein The connecting body (31) is L-shaped.

5. The V-shaped vent structure for preventing soldering bubbles of an LGA component according to claim 1, wherein The number of the positioning member (3) is 2.

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