Photoresist baking equipment

Abstract

The embodiment of the present disclosure provides a photoresist baking device. The photoresist baking device includes a baking chamber, a baking tray, an exhaust pipe and a cover plate. The baking chamber has an exhaust port on its side wall. The baking tray is arranged in the baking chamber and is configured to support a wafer and heat the photoresist material above the wafer. The exhaust pipe is connected to the exhaust port and is configured to exhaust the gas inside the baking chamber. The cover plate is arranged above the baking tray and between the baking tray and the exhaust port. The cover plate has a plurality of exhaust holes to allow air to flow through. Among them, the size of the exhaust hole farther away from the exhaust port is larger than the size of the exhaust hole closer to the exhaust port.

Description

Technical Field

[0001] An embodiment of the present invention relates to a photoresist baking device, and in particular to a photoresist baking device having a cover plate capable of improving the air flow field distribution of a baking chamber. Background Art

[0002] Semiconductor devices are used in a variety of electronic applications, such as personal computers, mobile phones, digital cameras, and other electronic devices. Generally speaking, semiconductor devices are manufactured by sequentially depositing insulating or dielectric layers, conductive layers, and semiconductor layers of materials on a semiconductor substrate (such as a wafer), and patterning the various material layers using photolithography processes to form circuit components and elements thereon.

[0003] Photolithography is a process that uses light-sensitive photoresist materials and produces circuit patterns on the surface of a wafer under controlled light exposure. Applying and developing the photoresist involves several heating steps performed in a closed chamber of a wafer track system. The wafer is heated on a hotplate and air flows through the chamber to ensure film uniformity on the wafer and to blow away evaporated solvent from the photoresist.

[0004] While existing photoresist baking equipment has generally been adequate for their intended purpose, they are not completely satisfactory in all respects. Summary of the invention

[0005] The purpose of the embodiments of the present disclosure is to provide a photoresist baking device to solve at least one of the above problems.

[0006] Some embodiments of the present disclosure provide a photoresist baking device, including a baking chamber, a baking tray, an exhaust duct and a cover plate. The baking chamber has an exhaust port on its side wall. The baking tray is arranged in the baking chamber and is configured to support a wafer and heat the photoresist material above the wafer. The exhaust duct is connected to the exhaust port and is configured to exhaust the gas inside the baking chamber. The cover plate is arranged above the baking tray and between the baking tray and the exhaust port. The cover plate has a plurality of exhaust holes to allow air to flow through. The size of the exhaust hole farther away from the exhaust port is larger than the size of the exhaust hole closer to the exhaust port.

[0007] Some embodiments of the present disclosure provide a photoresist baking device, including a baking chamber, a baking tray, an exhaust duct and a cover plate. The baking chamber has an exhaust port on its side wall. The baking tray is arranged in the baking chamber and is configured to support a wafer and heat the photoresist material above the wafer. The exhaust duct is connected to the exhaust port and is configured to exhaust the gas inside the baking chamber. The cover plate is arranged above the baking tray and between the baking tray and the exhaust port. The cover plate has a plurality of exhaust holes to allow air to flow through. The exhaust holes include a group of first exhaust holes located in a first area of ​​the cover plate and a group of second exhaust holes located in a second area of ​​the cover plate. The first area is farther away from the exhaust port than the second area. The first exhaust holes each have a first size, and the second exhaust holes each have a second size, and the second size is smaller than the first size.

[0008] Some embodiments of the present disclosure provide a photoresist baking device, including a baking chamber, a baking tray, an exhaust duct and a cover plate. The baking chamber has an exhaust port on its side wall. The baking tray is arranged in the baking chamber and is configured to support a wafer and heat the photoresist material above the wafer. The exhaust duct is connected to the exhaust port and is configured to exhaust the gas inside the baking chamber along an exhaust direction. The cover plate is arranged above the baking tray and between the baking tray and the exhaust port. The cover plate has a plurality of exhaust holes to allow air to flow through. The exhaust holes include a group of first exhaust holes in a first area of ​​the cover plate and a group of second exhaust holes in a second area of ​​the cover plate. The first area and the second area are arranged along a first direction parallel to the exhaust direction. The first area is farther away from the exhaust port than the second area. The first exhaust holes each have a first size, and the second exhaust holes each have a second size, and the second size is smaller than the first size. The exhaust holes also include a group of third exhaust holes in a third area of ​​the cover plate and a group of fourth exhaust holes in a fourth area of ​​the cover plate. The third area and the fourth area are arranged along a second direction perpendicular to the exhaust direction. The third area is farther away from the exhaust port than the fourth area. The third exhaust holes each have a third size, and the fourth exhaust holes each have a fourth size, the fourth size being smaller than the third size.

[0009] The beneficial effect of the embodiment of the present disclosure is that the embodiment of the present disclosure provides a photoresist baking device including an improved cover plate, wherein the cover plate is placed in a baking chamber and between a baking tray and an exhaust port so that air flows evenly through the entire baking chamber, thereby providing a uniform film morphology on the wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1A is a schematic cross-sectional view of a photoresist baking apparatus according to some embodiments, wherein the photoresist baking apparatus is in a state where a baking chamber is opened.

[0011] Figure 1Bis a schematic cross-sectional view of a photoresist baking device according to some embodiments, wherein the photoresist baking device is in a state where a baking chamber is closed.

[0012] Figure 2 Schematically illustrates the uneven wind speed distribution of the exhaust flow of a cover plate with uniform exhaust hole distribution when the exhaust port is located near one side of the cover plate.

[0013] Figure 3 is a schematic top view of a cover plate having an uneven vent hole distribution according to some embodiments.

[0014] Figure 4 is a schematic top view of a cover plate having an uneven vent hole distribution according to some embodiments.

[0015] The reference numerals are as follows:

[0016] 10: Photoresist baking equipment

[0017] 11: Lower chamber part

[0018] 12: Upper chamber part

[0019] 13: Baking tray

[0020] 14,24,34: Cover

[0021] 100: Direction

[0022] 101:Solvent

[0023] 121: Exhaust port

[0024] 122: Exhaust pipe

[0025] 131: protrusion

[0026] 141,241,341,441: Exhaust hole

[0027] 341A: (First) Exhaust Hole

[0028] 341B: (Second) exhaust hole

[0029] 341C: (Third) Exhaust Hole

[0030] 341D: (Fourth) Exhaust Hole

[0031] 341E: (Fifth) Exhaust Hole

[0032] 341F: (Sixth) Exhaust Hole

[0033] 341G: (Seventh) Exhaust Hole

[0034] 341H: (eighth) exhaust hole

[0035] 341I: (9th) Exhaust hole

[0036] 341J: (10th) Exhaust hole

[0037] 341K: (11th) Exhaust hole

[0038] A,B,C,D,E,F,G,H,I,J,K: Area

[0039] L: Centerline

[0040] W:Whip

[0041] P: Arrow / exhaust direction

[0042] BC: Baking room

[0043] S1,S1',S2,S2',S3,S3',S4,S5,S6,S7,S7',S8,S9,S9',S10,S10',S11: (hole) spacing

[0044] D1: First direction

[0045] D2: Second direction

[0046] D3: Diagonal direction DETAILED DESCRIPTION

[0047] The following disclosure provides many different embodiments or examples to implement the different features of the present invention. The following describes embodiments of specific components and their arrangements to illustrate the present disclosure. Of course, these embodiments are merely examples and should not be used to limit the scope of the present disclosure. For example, the specification describes a first feature formed on or above a second feature, which may include an embodiment in which the first feature and the second feature are in direct contact, and may also include an embodiment in which an additional feature is formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. In addition, repeated reference symbols and / or marks may be used in different examples of the present disclosure. This repetition is for the purpose of simplicity and clarity, and is not used to limit the specific relationship between the various embodiments and / or structures discussed.

[0048] Furthermore, spatially relative terms, such as "below," "beneath," "lower," "above," "upper," and the like, are used to facilitate describing the relationship of one element or feature to another element or feature in the drawings. These spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the drawings. The device may be oriented in different orientations (rotated 90 degrees or at other orientations), and the spatially relative terms used herein should be interpreted accordingly.

[0049] In the specification, terms such as "substantially parallel" or "substantially perpendicular" should be interpreted as not excluding minor deviations from a specific arrangement, and may include, for example, deviations of up to 10°. The term "substantially" does not exclude "completely", for example, a composition "substantially free" of Y may be completely free of Y.

[0050] Terms such as "about" used in conjunction with a specific distance or size should be interpreted as not excluding minor deviations from the specific distance or size and may include deviations of up to 10%, for example. The term "about" used for a numerical value X may mean X ± 5 or 10%.

[0051] In addition, although the following detailed description may use the terms first, second, third, fourth, etc. to describe various elements, regions or parts, these elements, regions or parts should not be limited by these terms. These terms are only used to distinguish one element, region or part from another element, region or part. Therefore, without departing from the teachings of the present invention, the first element, region or part discussed below may also be referred to as the second element, region or part.

[0052] Figure 1A 1 is a schematic cross-sectional view of a photoresist baking device 10 (also referred to as an oven) for semiconductor manufacturing according to some embodiments. Some variations of the embodiments will be described below. It should be understood that the materials, geometries, structures and processes described herein are only exemplary and are not intended to nor should be interpreted as limiting the present disclosure. It is obvious to those skilled in the art that many substitutions and modifications will be known through the present disclosure.

[0053] See also Figure 1A , the photoresist baking apparatus 10 includes a baking chamber BC, which includes a lower chamber portion 11 and an upper chamber portion 12. In some embodiments, the upper chamber portion 12 can be vertically moved along a direction 100 to open and close the baking chamber BC in which a photoresist baking process (to be described later) can be performed. Figure 1B As shown, in operation, the upper chamber portion 12 will move vertically downward toward the lower chamber portion 11 until the baking chamber BC is closed. Although not shown, a drive mechanism will be connected to the upper chamber portion 12 to allow it to move vertically. Alternatively, in some other embodiments, the upper chamber portion 12 may be hinged to the lower chamber portion 11 to allow the baking chamber BC to be opened and closed. The shape and size of the baking chamber BC can vary according to actual needs (e.g., the shape or size of the workpiece to be processed), for example, the baking chamber BC can be a hollow cylinder or a cuboid with a certain capacity to accommodate 100mm, 150mm, 200mm, 300mm, 450mm or even larger wafers.

[0054] See also Figure 1A , a baking tray 13 is disposed in the baking chamber BC. The lower chamber portion 11 can accommodate or support the baking tray 13. The baking tray 13 can be used for heat treating the wafer W during multiple processing steps of semiconductor manufacturing. In some embodiments, the wafer W is a semiconductor wafer made of silicon or other semiconductor materials. Alternatively or additionally, the wafer W may include other semiconductor materials such as germanium (Ge). In some embodiments, the wafer W may be made of compound semiconductors such as silicon carbide (SiC), gallium arsenide (GaAs), indium arsenide (InAs), indium phosphide (InP), etc. In some other embodiments, the wafer W may be made of alloy semiconductors such as silicon germanium (SiGe), silicon germanium carbide (SiGeC), gallium arsenide phosphide (GaAsP), gallium indium phosphide (GaInP), etc. In some other embodiments, the wafer W is a silicon-on-insulator (SOI) or a germanium-on-insulator (GOI) substrate.

[0055] In addition, the wafer W may have various device elements. Examples of device elements formed in the wafer W include transistors (e.g., metal oxide semiconductor field effect transistors (MOSFET), complementary metal oxide semiconductor (CMOS) transistors, bipolar junction transistors (BJT), high voltage transistors, high frequency transistors, P-channel and / or N-channel field effect transistors (PFETs / NFETs), etc.), diodes and / or other suitable elements. Various processes may be performed to form the device elements, such as deposition, etching, implantation, photolithography, annealing and / or other suitable processes.

[0056] In some embodiments, the wafer W includes a photoresist material or a bottom antireflective coating (BARC) film applied to the surface of the wafer W by, for example, spin coating. In some embodiments, after the photoresist or BARC film is applied to the wafer surface, a pre-bake (also referred to as a soft bake) process can be performed on the wafer W using a baking tray 13. Performing a pre-bake process can evaporate most of the solvent in the photoresist material or the BARC film. Alternatively, the baking tray 13 can also be used to perform other thermal treatments on the wafer W, such as post exposure bake (PEB), post developer bake (PDB), top antireflective coating (TARC) treatment, immersion top coating (ITC) or soaking (SOAK) treatment, HMDS adhesion primer treatment (HMDS adhesion priming treatment) or any other treatment known in the art.

[0057] In operation, the wafer W may be placed on the plurality of protrusions 131 on the surface of the baking tray 13 and held in place by a vacuum (not shown). In some other embodiments, the protrusions 131 may be omitted and the wafer W may be placed directly on and in contact with the surface of the baking tray 13. The baking tray 13 may be heated to a target temperature, which depends on the type of film material being heat treated.

[0058] For example, for photoresist materials, the target temperature of the baking tray 13 is between about 90 and 130 degrees Celsius (° C.), and for BARC films, the target temperature of the baking tray 13 is between about 205 and 215 degrees Celsius (° C.). The heat generated by the baking tray 13 is conducted to the photoresist or BARC film on the surface of the wafer W by contacting the back side of the wafer W. As described above, pre-baking can evaporate the solvent of the photoresist or BARC film. When the photoresist or BARC film reaches its glass transition temperature (Tg), the solvent molecules become easier to move and diffuse upward and accumulate on the surface of the film. As the temperature of the film continues to rise, the solvent 101 molecules begin to evaporate and move toward the exhaust port 121 of the baking chamber BC.

[0059] Alternatively, the target temperature of the baking tray 13 for post-exposure baking (PEB) is between about 90 and 115° C., the target temperature for post-development baking (PDB) is between about 90 and 115° C., the target temperature for top anti-reflective coating (TARC) treatment is between about 90 and 115° C., the target temperature for immersion top coating (ITC) or soaking (SOAK) treatment is between about 90 and 115° C., and the target temperature for HMDS adhesion primer treatment is between about 100 and 120° C. It should be understood that the target temperature of the baking tray 13 described herein is only exemplary and is not intended and should not be interpreted as limiting the present disclosure. Other values ​​may also be used in different embodiments.

[0060] In some embodiments, Figure 1B As shown, the exhaust port 121 is located on a side wall of the upper chamber portion 12 and above the baking tray 13. The upper chamber portion 12 further includes an exhaust pipe 122 connected to the exhaust port 121. The exhaust pipe 122 can be configured to draw out or exhaust the gas (i.e., hot air) inside the baking chamber BC by connecting a pump (not shown). Figure 1B As shown by the arrow P in FIG. 1 ). In this way, the exhaust line 122 allows the evaporated solvent 101 to be exhausted from the baking chamber BC and ensures a pollution-free environment of the baking chamber BC.

[0061] The pumping pressure of the exhaust line 122 can vary according to actual needs (e.g., the amount of hot air generated during the photoresist baking process). In general, the greater the amount of hot air generated, the higher the pumping pressure of the exhaust line 122. In some embodiments, the pumping pressure of the exhaust line 122 is about 1.4 kPa. In some embodiments, the pumping pressure of the exhaust line 122 is in the range of about 1.4 to 1.7 kPa. In some embodiments, the pumping pressure of the exhaust line 122 is in the range of about 1.7 to 4.2 kPa. However, other values ​​may also be used in different embodiments.

[0062] In some embodiments, Figure 1B As shown, the photoresist baking apparatus 10 further includes a cover plate 14 disposed in the baking chamber BC. The cover plate 14 is substantially a plate-like structure having a plurality of exhaust holes 141 distributed throughout the plate to allow air to flow through. In some cases, the thickness of the cover plate 14 is about 2 mm, but the present disclosure is not limited thereto. In some embodiments, as shown in FIG. Figure 1BAs shown, the cover plate 14 is positioned above the baking tray 13 and between the baking tray 13 and the exhaust port 121 (which is located near one side of the cover plate 14). The cover plate 14 can be removably fixed to the inner wall of the upper chamber portion 12 by a plurality of fasteners (e.g., screws). In some embodiments, the shape of the cover plate 14 corresponds to the shape of the baking chamber BC. For example, when the baking chamber BC is a hollow cuboid, the cover plate 14 can be a rectangular plate (when viewed in a direction perpendicular to its top surface) accordingly. However, the embodiments of the present disclosure are not limited to these shapes, and other shapes can also be used.

[0063] The cover plate 14 may include or be made of one or more metal materials that can withstand the heat generated during the above-mentioned photoresist baking process. The metal material may include iron, aluminum, copper, titanium, silver, platinum, one or more other suitable metal materials, alloys thereof, or combinations thereof. The exhaust hole 141 may be formed using a laser beam drilling process, a mechanical drilling process, one or more other suitable processes, or combinations thereof.

[0064] The cover plate 14 is used in conjunction with the exhaust line 122 to allow air to flow evenly through the entire baking chamber BC, which provides a uniform film morphology on the surface of the wafer W. However, it has been observed that the photoresist volatiles (i.e., evaporated solvent 101) are prone to condensation at certain locations of the cover plate 14 and block some exhaust holes 141 away from the exhaust port 121. In addition, during processing, the photoresist volatiles may also fall back onto the wafer W, which may cause wafer defects. Therefore, it is necessary to regularly clean the cover plate 14, thereby wasting manpower and reducing productivity.

[0065] Applicants have discovered that the exhaust port 121 located near one side of the cover plate 14 will result in an uneven exhaust flow field distribution of the cover plate 14. For example, see Figure 2 , which schematically shows that when the exhaust port 121 is located near one side of the cover plate 24 with uniform exhaust holes 241 distribution (i.e., the exhaust holes 241 on the entire cover plate 24 have the same size and consistent hole spacing), the exhaust flow of the cover plate 24 will have an uneven wind speed distribution (e.g., distributed in a parabolic form). This is because the exhaust holes 241 closer to the exhaust port 121 will be subject to a larger suction force, while the exhaust holes 241 farther from the exhaust port 121 will be subject to a smaller suction force. As a result, the photoresist volatiles cannot be smoothly carried away by the airflow, and will block some of the exhaust holes 241, which are farther from the exhaust port 121 and therefore subject to a smaller suction force.

[0066] Figure 3 FIG. 1 is a schematic top view of a cover plate 34 for promoting a more uniform exhaust flow field distribution according to some embodiments. Figure 1BThe cover plate 14 shown is arranged in the baking chamber BC of the photoresist baking device 10 in a similar manner. In addition, the structure, material and forming method of the cover plate 34 can also be the same as those of the embodiment of the present invention. Figure 1B The structure, material and forming method of the cover plate 14 are the same or similar. The cover plate 34 improves the uniformity of the wind speed of the exhaust holes 341 by the uneven distribution of the exhaust holes as described below.

[0067] like Figure 3 As shown, the cover plate 34 is a rectangular plate (when viewed in a direction perpendicular to its top surface) and has an exhaust direction P parallel to the exhaust pipe 122 (and Figure 3 In some embodiments, the center line L of the first direction D1) is Figure 3 As shown, the position of the exhaust port 121 is aligned with the center line L of the cover plate 34 (when viewed from a direction perpendicular to the top surface of the cover plate 34), and the exhaust holes 341 on the entire cover plate 34 are arranged symmetrically relative to the center line L.

[0068] In some embodiments, the exhaust holes 341 on the cover plate 34 are arranged in a matrix. For example, the exhaust holes 341 are arranged in orthogonal rows and columns, wherein the exhaust holes 341 in each column are arranged along the same Figure 3 The exhaust holes 341 of each row are arranged in a direction parallel to the first direction D1 shown in FIG. Figure 3 In some embodiments, the exhaust holes 341 in the first direction D1 (parallel to the exhaust direction P) or the second direction D2 (perpendicular to the exhaust direction P) may have different sizes (e.g., diameters) and / or hole spacings (e.g., distances between hole centers of adjacent exhaust holes) according to the distances from the exhaust port 121.

[0069] Since the exhaust holes 341 are arranged symmetrically with respect to the center line L, for the sake of convenience, the following description only involves the exhaust holes 341 on one side of the center line L of the cover plate 34 .

[0070] In some embodiments, Figure 3 As shown, the exhaust holes 341 include a group of first exhaust holes 341A having the same size located in region A of the cover plate 34, a group of second exhaust holes 341B having the same size located in region B of the cover plate 34, and a group of third exhaust holes 341C having the same size located in region C of the cover plate 34. The (three) regions A, B, and C are arranged along the first direction D1 and are close to the center line L of the cover plate 34. In addition, the regions A, B, and C are arranged sequentially in a direction away from the exhaust port 121.

[0071] In some embodiments, Figure 3As shown, the size of each third exhaust hole 341C in region C is larger than the size of each second exhaust hole 341B in region B, and the size of each second exhaust hole 341B in region B is larger than the size of each first exhaust hole 341A in region A.

[0072] For example, in some cases where the pumping pressure of the exhaust line 122 is about 1.4 kPa, the size of each third exhaust hole 341C may be about 9 mm, the size of each second exhaust hole 341B may be about 6 mm, and the size of each first exhaust hole 341A may be about 3 mm. Alternatively, in some cases where the pumping pressure of the exhaust line 122 is in the range of about 1.4 to 1.7 kPa, the size of each third exhaust hole 341C may be about 11 mm, the size of each second exhaust hole 341B may be about 7.2 mm, and the size of each first exhaust hole 341A may be about 3.5 mm. Alternatively, in some cases where the pumping pressure of the exhaust line 122 is in the range of about 1.7 to 4.2 kPa, the size of each third exhaust hole 341C may be about 15.3 mm, the size of each second exhaust hole 341B may be about 10.2 mm, and the size of each first exhaust hole 341A may be about 5 mm.

[0073] In some embodiments, Figure 3 As shown, the first exhaust holes 341A in region A have a uniform (hole) spacing S1 between adjacent first exhaust holes 341A in the first direction D1, the second exhaust holes 341B in region B have a uniform (hole) spacing S2 between adjacent second exhaust holes 341B in the first direction D1, and the third exhaust holes 341C in region C have a uniform (hole) spacing S3 between adjacent third exhaust holes 341C in the first direction D1. The spacing S1 is smaller than the spacing S2, and the spacing S2 is smaller than the spacing S3. For example, in some cases, the spacing S1 may be approximately 12 mm, the spacing S2 may be approximately 24 mm, and the spacing S3 may be approximately 36 mm.

[0074] In some embodiments, Figure 3As shown, the exhaust holes 341 further include a group of fourth exhaust holes 341D having the same size in region D of the cover plate 34, a group of fifth exhaust holes 341E having the same size in region E of the cover plate 34, a group of sixth exhaust holes 341F having the same size in region F of the cover plate 34, a group of seventh exhaust holes 341G having the same size in region G of the cover plate 34, and a group of eighth exhaust holes 341H having the same size in region H of the cover plate 34. The (five) regions D, E, F, G, and H are arranged along the first direction D1 and are close to the edge X of the cover plate 34. In addition, the regions D, E, F, G, and H are arranged in sequence in a direction away from the exhaust port 121.

[0075] In some embodiments, Figure 3 As shown, the size of each eighth exhaust hole 341H in region H is larger than the size of each seventh exhaust hole 341G in region G, and the size of each seventh exhaust hole 341G in region G is larger than the size of each sixth exhaust hole 341F in region F, and the size of each sixth exhaust hole 341F in region F is larger than the size of each fifth exhaust hole 341E in region E, and the size of each fifth exhaust hole 341E in region E is larger than the size of each fourth exhaust hole 341D in region D.

[0076] For example, in some cases where the pumping pressure of the exhaust line 122 is about 1.4 kPa, the size of each eighth exhaust hole 341H may be about 13 mm, the size of each seventh exhaust hole 341G may be about 11 mm, the size of each sixth exhaust hole 341F may be about 10 mm, the size of each fifth exhaust hole 341E may be about 9 mm, and the size of each fourth exhaust hole 341D may be about 7 mm. Alternatively, in some cases where the pumping pressure of the exhaust line 122 is in the range of about 1.4 to 1.7 kPa, the size of each eighth exhaust hole 341H may be about 16 mm, the size of each seventh exhaust hole 341G may be about 13 mm, the size of each sixth exhaust hole 341F may be about 12 mm, the size of each fifth exhaust hole 341E may be about 11 mm, and the size of each fourth exhaust hole 341D may be about 8.4 mm. Alternatively, in some cases where the pumping pressure of the exhaust line 122 is in the range of approximately 1.7 to 4.2 kPa, the size of each eighth exhaust hole 341H may be approximately 20 mm, the size of each seventh exhaust hole 341G may be approximately 18.7 mm, the size of each sixth exhaust hole 341F may be approximately 17 mm, the size of each fifth exhaust hole 341E may be approximately 14.5 mm, and the size of each fourth exhaust hole 341D may be approximately 11.2 mm.

[0077] In some embodiments, Figure 3 As shown, the fourth exhaust holes 341D in region D have a uniform (hole) spacing S4 between adjacent fourth exhaust holes 341D in the first direction D1, the fifth exhaust holes 341E in region E have a uniform (hole) spacing S5 between adjacent fifth exhaust holes 341E in the first direction D1, the sixth exhaust holes 341F in region F have a uniform (hole) spacing S6 between adjacent sixth exhaust holes 341F in the first direction D1, the seventh exhaust holes 341G in region G have a uniform (hole) spacing S7 between adjacent seventh exhaust holes 341G in the first direction D1, and the eighth exhaust holes 341H in region H have a uniform (hole) spacing S8 between adjacent eighth exhaust holes 341H in the first direction D1. The spacing S4 is smaller than the spacing S5, and the spacing S5 is smaller than the spacing S6, and the spacing S6 is smaller than the spacing S7, and the spacing S7 is smaller than the spacing S8. For example, in some cases, the spacing S4 may be approximately 12 mm, the spacing S5 may be approximately 14 mm, the spacing S6 may be approximately 24 mm, the spacing S7 may be approximately 26 mm, and the spacing S8 may be approximately 36 mm.

[0078] In some embodiments, Figure 3 As shown, the exhaust holes 341 also include a group of ninth exhaust holes 341I with the same size located in region I of the cover plate 34, a group of tenth exhaust holes 341J with the same size located in region J of the cover plate 34, and a group of eleventh exhaust holes 341K with the same size located in region K of the cover plate 34. The (three) regions I, J, and K are arranged along the first direction D1 and are arranged sequentially in a direction away from the exhaust port 121. In addition, in the second direction, region I is located between region A and region D, region J is located between region B and region F, and region K is located between region C and region G.

[0079] In some embodiments, Figure 3 As shown, the size of each eleventh exhaust hole 341K in region K is larger than the size of each tenth exhaust hole 341J in region J, and the size of each tenth exhaust hole 341J in region J is larger than the size of each ninth exhaust hole 341I in region I.

[0080] For example, in some cases where the pumping pressure of the exhaust line 122 is about 1.4 kPa, the size of each eleventh exhaust hole 341K may be about 10 mm, the size of each tenth exhaust hole 341J may be about 8 mm, and the size of each ninth exhaust hole 341I may be about 5 mm. Alternatively, in some cases where the pumping pressure of the exhaust line 122 is in the range of about 1.4 to 1.7 kPa, the size of each eleventh exhaust hole 341K may be about 12 mm, the size of each tenth exhaust hole 341J may be about 8.5 mm, and the size of each ninth exhaust hole 341I may be about 6.2 mm. Alternatively, in some cases where the pumping pressure of the exhaust line 122 is in the range of about 1.7 to 4.2 kPa, the size of each eleventh exhaust hole 341K may be about 17 mm, the size of each tenth exhaust hole 341J may be about 12 mm, and the size of each ninth exhaust hole 341I may be about 8 mm.

[0081] In some embodiments, Figure 3 As shown, the ninth exhaust hole 341I in region I has a uniform (hole) spacing S9 between adjacent ninth exhaust holes 341I in the first direction D1, the tenth exhaust hole 341J in region J has a uniform (hole) spacing S10 between adjacent tenth exhaust holes 341J in the first direction D1, and the eleventh exhaust hole 341K in region K has a uniform (hole) spacing S11 between adjacent eleventh exhaust holes 341K in the first direction D1. The spacing S9 is smaller than the spacing S10, and the spacing S10 is smaller than the spacing S11. For example, in some cases, the spacing S9 may be approximately 12 mm, the spacing S10 may be approximately 24 mm, and the spacing S11 may be approximately 36 mm.

[0082] In some embodiments, Figure 3 As shown, region A, region I, and region D are arranged along the second direction D2, and are sequentially arranged in a direction away from the exhaust port 121. In some embodiments, the size of each fourth exhaust hole 341D in region D is larger than the size of each ninth exhaust hole 341I in region I, and the size of each ninth exhaust hole 341I in region I is larger than the size of each first exhaust hole 341A in region A. Examples of the sizes of the exhaust holes 341A, 341D, and 341I have been discussed above, so they will not be repeated here.

[0083] In some embodiments, Figure 3As shown, the first exhaust holes 341A in region A have a uniform (hole) spacing S1' between adjacent first exhaust holes 341A in the second direction D2, and the ninth exhaust holes 341I in region I have a uniform (hole) spacing S9' between adjacent ninth exhaust holes 341I in the second direction D2. The spacing S1' is smaller than the spacing S9'. For example, in some cases, the spacing S1' may be about 12 mm, and the spacing S9' may be about 24 mm.

[0084] In some embodiments, Figure 3 As shown, region B, region J, and region F are arranged along the second direction D2, and are sequentially arranged in a direction away from the exhaust port 121. In some embodiments, the size of each sixth exhaust hole 341F in region F is larger than the size of each tenth exhaust hole 341J in region J, and the size of each tenth exhaust hole 341J in region J is larger than the size of each second exhaust hole 341B in region N. Examples of the sizes of the exhaust holes 341B, 341F, and 341J have been discussed above, so they will not be repeated here.

[0085] In some embodiments, Figure 3 As shown, the second exhaust holes 341B in region B have a uniform (hole) spacing S2' between adjacent second exhaust holes 341B in the second direction D2, and the tenth exhaust holes 341J in region J have a uniform (hole) spacing S10' between adjacent tenth exhaust holes 341J in the second direction D2. The spacing S2' is smaller than the spacing S10'. For example, in some cases, the spacing S2' may be about 12 mm, and the spacing S10' may be about 24 mm.

[0086] In some embodiments, Figure 3 As shown, region C, region K, region G, and region H are arranged along the second direction D2, and are sequentially arranged in a direction away from the exhaust port 121. In some embodiments, the size of each eighth exhaust hole 341H in region H is larger than the size of each seventh exhaust hole 341G in region G, and the size of each seventh exhaust hole 341G in region G is larger than the size of each eleventh exhaust hole 341K in region K, and the size of each eleventh exhaust hole 341K in region K is larger than the size of each third exhaust hole 341C in region C. Examples of the sizes of the exhaust holes 341C, 341K, 341G, and 341H have been discussed above, so they will not be repeated here.

[0087] In some embodiments, Figure 3As shown, the third exhaust holes 341C in the region C have a uniform (hole) spacing S3' between adjacent third exhaust holes 341C in the second direction D2, and the seventh exhaust holes 341G in the region G have a uniform (hole) spacing S7' between adjacent seventh exhaust holes 341G in the second direction D2. The spacing S3' is smaller than the spacing S7'. For example, in some cases, the spacing S3' may be about 12 mm, and the spacing S7' may be about 24 mm.

[0088] In some embodiments, Figure 3 As shown, region A, region J, region G, and region H are arranged along a diagonal direction D3 (substantially from the position of the cover plate 34 near the exhaust port 121 toward the corner of the cover plate 34 near region H), and are arranged sequentially in a direction away from the exhaust port 121. In some embodiments, the size of each eighth exhaust hole 341H in region H is larger than the size of each seventh exhaust hole 341G in region G, and the size of each seventh exhaust hole 341G in region G is larger than the size of each tenth exhaust hole 341J in region J, and the size of each tenth exhaust hole 341J in region J is larger than the size of each first exhaust hole 341A in region A. Examples of the sizes of the exhaust holes 341A, 341J, 341G, and 341H have been discussed above, so they are not repeated here.

[0089] It should be understood that the geometric shapes described herein are exemplary only and are not intended to, and should not be interpreted as, limiting the present disclosure. Those skilled in the art will appreciate that many alternatives and modifications are apparent from the present disclosure. For example, in different embodiments, the shape, arrangement, and / or pattern of the vents 341 above the cover plate 34 may also be varied.

[0090] In the above embodiment, the size of the exhaust hole 341 farther from the exhaust port 121 is larger than the size of the exhaust hole 341 closer to the exhaust port 121, so the wind speed of the exhaust hole 341 farther from the exhaust port 121 can be increased. In addition, because the larger exhaust hole 341 also has a larger hole spacing, the mutual interference of the airflows from these exhaust holes can be reduced or prevented. Therefore, using the above cover plate 34 can obtain a more uniform exhaust flow field distribution, and the photoresist volatiles can be smoothly taken away by the airflow and the chance of adhering to the cover plate 34 is reduced. As a result, the frequency of cleaning the cover plate 34 can be reduced, and the risk of wafer defects can also be reduced.

[0091] Figure 4 FIG. 4 is a schematic top view of a cover plate 44 for promoting a more uniform exhaust flow field distribution according to some other embodiments. Figure 1BThe cover plate 14 shown is arranged in the baking chamber BC of the photoresist baking device 10 in a similar manner. In addition, the structure, material and forming method of the cover plate 44 can also be the same as those of the embodiment of the present invention. Figure 1B The structure, material and forming method of the cover plate 14 are the same or similar. Figure 4 As shown, different from Figure 3 In the cover plate 34, since the exhaust port 121 is offset from the center line L of the cover plate 44 in this embodiment, the exhaust holes 441 on the cover plate 44 are arranged asymmetrically with respect to the center line L. Similar to the cover plate 34, the cover plate 44 also improves the uniformity of the wind speed of the exhaust holes 441 by, for example, uneven exhaust hole distribution, for example, by making the exhaust holes 441 farther away from the exhaust port 121 larger than the exhaust holes 441 closer to the exhaust port 121 and / or by making the larger exhaust holes 441 have a larger hole spacing.

[0092] The disclosed embodiment provides a photoresist baking device including an improved cover plate. The cover plate is placed in the baking chamber and between the baking tray and the exhaust port so that air flows evenly through the entire baking chamber, thereby providing a uniform film morphology on the surface of the wafer. In some embodiments, based on the side of the exhaust port close to the cover plate, the exhaust holes on the cover plate are designed so that the exhaust holes farther away from the exhaust port are larger than the exhaust holes closer to the exhaust port and / or the larger exhaust holes have a larger hole spacing to improve the uniformity of the wind speed of the exhaust holes. In this way, the chance of photoresist volatiles adhering to the cover plate is reduced, so the frequency of cleaning the cover plate can be reduced, and the risk of wafer defects can also be reduced.

[0093] According to some embodiments of the present disclosure, a photoresist baking device is provided, comprising a baking chamber, a baking tray, an exhaust duct and a cover plate. The baking chamber has an exhaust port on its side wall. The baking tray is disposed in the baking chamber and is configured to support a wafer and heat the photoresist material above the wafer. The exhaust duct is connected to the exhaust port and is configured to exhaust the gas inside the baking chamber. The cover plate is disposed above the baking tray and between the baking tray and the exhaust port. The cover plate has a plurality of exhaust holes to allow air to flow through. The size of the exhaust hole farther away from the exhaust port is larger than the size of the exhaust hole closer to the exhaust port. In some embodiments, the exhaust duct is configured to exhaust the gas inside the baking chamber along an exhaust direction through the exhaust port, wherein the exhaust holes include a first exhaust hole and a second exhaust hole arranged along a first direction parallel to the exhaust direction. The first exhaust hole is farther away from the exhaust port than the second exhaust hole, and the size of the first exhaust hole is larger than the size of the second exhaust hole. In some embodiments, the exhaust holes also include a third exhaust hole arranged in the first direction and located between the first exhaust hole and the second exhaust hole, wherein the size of the third exhaust hole is larger than the size of the second exhaust hole and smaller than the size of the first exhaust hole. In some embodiments, the exhaust holes arranged in the first direction have two or more different spacings. In some embodiments, the exhaust holes further include a fourth exhaust hole and a fifth exhaust hole arranged in a second direction perpendicular to the exhaust direction. The fourth exhaust hole is farther away from the exhaust port than the fifth exhaust hole, and the size of the fourth exhaust hole is larger than the size of the fifth exhaust hole. In some embodiments, the exhaust holes further include a sixth exhaust hole arranged in the second direction and located between the fourth exhaust hole and the fifth exhaust hole, wherein the size of the sixth exhaust hole is larger than the size of the fifth exhaust hole and smaller than the size of the fourth exhaust hole. In some embodiments, the exhaust holes arranged in the second direction have two or more different spacings. In some embodiments, the exhaust holes are arranged in a matrix. In some embodiments, when viewed in a direction perpendicular to the top surface of the cover plate, the exhaust port is aligned with the center line of the cover plate, and the exhaust holes are arranged symmetrically relative to the center line. In some embodiments, when viewed in a direction perpendicular to the top surface of the cover plate, the exhaust port deviates from the center line of the cover plate, and the exhaust holes are arranged asymmetrically relative to the center line.

[0094] According to some embodiments of the present disclosure, a photoresist baking device is provided, comprising a baking chamber, a baking tray, an exhaust duct and a cover plate. The baking chamber has an exhaust port on its side wall. The baking tray is arranged in the baking chamber and is configured to support a wafer and heat the photoresist material above the wafer. The exhaust duct is connected to the exhaust port and is configured to exhaust the gas inside the baking chamber. The cover plate is arranged above the baking tray and between the baking tray and the exhaust port. The cover plate has a plurality of exhaust holes to allow air to flow through. The exhaust holes include a group of first exhaust holes in a first area of ​​the cover plate and a group of second exhaust holes in a second area of ​​the cover plate. The first area is farther away from the exhaust port than the second area. The first exhaust holes each have a first size, and the second exhaust holes each have a second size, which is smaller than the first size. In some embodiments, the first exhaust holes have a first spacing, and the second exhaust holes have a second spacing, which is smaller than the first spacing. In some embodiments, the exhaust duct is configured to exhaust the gas inside the baking chamber along an exhaust direction through the exhaust port, wherein the first area and the second area are arranged along a first direction parallel to the exhaust direction. In some embodiments, the exhaust holes further include a group of third exhaust holes located in a third area of ​​the cover plate, wherein the third area is arranged in the first direction and between the first area and the second area, and each of the third exhaust holes has a third size, the third size is larger than the second size and smaller than the first size. In some embodiments, the gas pipeline is configured to exhaust the gas inside the baking chamber along an exhaust direction through the exhaust port, and the first area and the second area are arranged along a second direction perpendicular to the exhaust direction. In some embodiments, the exhaust holes further include a group of third exhaust holes located in a third area of ​​the cover plate, wherein the third area is arranged in the second direction and between the first area and the second area, and each of the third exhaust holes has a third size, the third size is larger than the second size and smaller than the first size. In some embodiments, the exhaust holes are arranged in a matrix. In some embodiments, when viewed in a direction perpendicular to the top surface of the cover plate, the exhaust port is aligned with the center line of the cover plate, and the exhaust holes are arranged symmetrically relative to the center line.

[0095] According to some embodiments of the present disclosure, a photoresist baking device is provided, comprising a baking chamber, a baking tray, an exhaust duct and a cover plate. The baking chamber has an exhaust port on its side wall. The baking tray is arranged in the baking chamber and configured to support a wafer and heat the photoresist material above the wafer. The exhaust duct is connected to the exhaust port and configured to exhaust the gas inside the baking chamber along an exhaust direction. The cover plate is arranged above the baking tray and between the baking tray and the exhaust port. The cover plate has a plurality of exhaust holes to allow air to flow through. The exhaust holes include a group of first exhaust holes in a first area of ​​the cover plate and a group of second exhaust holes in a second area of ​​the cover plate. The first area and the second area are arranged along a first direction parallel to the exhaust direction. The first area is farther away from the exhaust port than the second area. The first exhaust holes each have a first size, and the second exhaust holes each have a second size, and the second size is smaller than the first size. The exhaust holes also include a group of third exhaust holes in a third area of ​​the cover plate and a group of fourth exhaust holes in a fourth area of ​​the cover plate. The third area and the fourth area are arranged along a second direction perpendicular to the exhaust direction. The third region is further away from the exhaust port than the fourth region. The third exhaust holes each have a third size, and the fourth exhaust holes each have a fourth size, the fourth size is smaller than the third size. In some embodiments, the first exhaust holes have a first spacing, and the second exhaust holes have a second spacing that is smaller than the first spacing, and the third exhaust holes have a third spacing, and the fourth exhaust holes have a fourth spacing that is smaller than the third spacing.

[0096] The foregoing text summarizes the features of many embodiments so that those skilled in the art can better understand the present disclosure from various aspects. Those skilled in the art should understand and can easily design or modify other processes and structures based on the present disclosure to achieve the same purpose and / or achieve the same advantages as the embodiments introduced herein. Those skilled in the art should also understand that these equivalent structures do not depart from the spirit and scope of the invention of the present disclosure. Various changes, substitutions or modifications may be made to the present disclosure without departing from the spirit and scope of the invention of the present disclosure.

Claims

1. A photoresist baking device, comprising: A baking chamber, with an exhaust port on one side wall of the baking chamber; A baking tray, disposed in the baking chamber, configured to support a wafer and heat a photoresist material above the wafer; an exhaust pipe connected to the exhaust port and configured to exhaust a gas inside the baking chamber; and A cover plate is arranged above the baking tray and between the baking tray and the exhaust port, wherein the cover plate has a plurality of exhaust holes to allow air to flow through, wherein a size of one of the plurality of exhaust holes farther from the exhaust port is larger than a size of one of the plurality of exhaust holes closer to the exhaust port, and the plurality of exhaust holes with larger sizes also have a larger spacing, wherein as the distance between the plurality of exhaust holes and the exhaust port gradually increases, the spacing between the plurality of exhaust holes gradually increases.

2. The photoresist baking device according to claim 1, wherein the exhaust pipeline is configured to exhaust the gas in the baking chamber along an exhaust direction through the exhaust port, wherein the plurality of exhaust holes include a first exhaust hole, a second exhaust hole and a third exhaust hole arranged along a first direction parallel to the exhaust direction, wherein: The second exhaust hole is close to a first edge of the cover plate close to the exhaust port, the first exhaust hole is close to a second edge of the cover plate opposite to the first edge, and the third exhaust hole is located between the first exhaust hole and the second exhaust hole, wherein a size of the third exhaust hole is larger than a size of the second exhaust hole and smaller than a size of the first exhaust hole.

3. The photoresist baking device as claimed in claim 2, wherein the plurality of exhaust holes further comprises a fourth exhaust hole and a fifth exhaust hole arranged along a second direction perpendicular to the exhaust direction, wherein: The fourth exhaust hole is farther away from the exhaust port than the fifth exhaust hole, and a size of the fourth exhaust hole is larger than a size of the fifth exhaust hole.

4. The photoresist baking device as claimed in claim 3, wherein the plurality of exhaust holes further comprises a sixth exhaust hole arranged in the second direction and located between the fourth exhaust hole and the fifth exhaust hole, wherein: The size of the sixth exhaust hole is larger than that of the fifth exhaust hole and smaller than that of the fourth exhaust hole. 5 . The photoresist baking apparatus as claimed in claim 3 , wherein the plurality of exhaust holes arranged in the second direction have two or more different pitches.

6. The photoresist baking apparatus as claimed in claim 1, wherein a plurality of the exhaust holes are arranged in a matrix.

7. The photoresist baking device as claimed in claim 1, wherein when viewed along a direction perpendicular to a top surface of the cover plate, the exhaust port is aligned with a center line of the cover plate, and the plurality of exhaust holes are arranged symmetrically relative to the center line.

8. The photoresist baking device as claimed in claim 1, wherein when viewed along a direction perpendicular to a top surface of the cover plate, the exhaust port deviates from a center line of the cover plate, and the plurality of exhaust holes are arranged asymmetrically relative to the center line.

9. A photoresist baking device, comprising: A baking chamber, with an exhaust port on one side wall of the baking chamber; A baking tray, disposed in the baking chamber, configured to support a wafer and heat a photoresist material above the wafer; an exhaust pipe connected to the exhaust port and configured to exhaust a gas inside the baking chamber; and a cover plate disposed above the baking tray and between the baking tray and the exhaust port, wherein the cover plate has a plurality of exhaust holes to allow air to flow through, The exhaust pipeline is configured to exhaust the gas inside the baking chamber through the exhaust port along an exhaust direction, wherein the plurality of exhaust holes include a group of first exhaust holes located in a first area of ​​the cover plate, a group of second exhaust holes located in a second area of ​​the cover plate, and a group of third exhaust holes located in a third area of ​​the cover plate, the first area, the second area, and the third area are arranged along a first direction parallel to the exhaust direction, wherein the second area is close to a first edge of the cover plate close to the exhaust port, the first area is close to a second edge of the cover plate opposite to the first edge, and the third area is located between the first area and the second area, wherein the plurality of first exhaust holes each have a first size, and the plurality of second exhaust holes each have a second size smaller than the first size, and the plurality of third exhaust holes each have a third size, the third size being larger than the second size and smaller than the first size, wherein the plurality of exhaust holes with larger sizes also have larger spacings, wherein as the distances between the plurality of exhaust holes and the exhaust port gradually increase, the spacings between the plurality of exhaust holes gradually increase.

10. The photoresist baking device as described in claim 9, wherein the plurality of the first exhaust holes have a first spacing, the plurality of the second exhaust holes have a second spacing, and the plurality of the third exhaust holes have a third spacing, the third spacing is larger than the second spacing and smaller than the first spacing.

11. The photoresist baking device as claimed in claim 9, wherein the plurality of exhaust holes further comprises a group of fourth exhaust holes located in a fourth area of ​​the cover plate and a group of fifth exhaust holes located in a fifth area of ​​the cover plate, wherein: The fourth region and the fifth region are arranged in a second direction perpendicular to the exhaust direction, wherein the fourth region is farther away from the exhaust port than the fifth region, the plurality of fourth exhaust holes each have a fourth size, and the plurality of fifth exhaust holes each have a fifth size smaller than the fourth size.

12. The photoresist baking apparatus as claimed in claim 9, wherein a plurality of the exhaust holes are arranged in a matrix.

13. The photoresist baking apparatus as claimed in claim 9, wherein when viewed along a direction perpendicular to a top surface of the cover plate, the exhaust port is aligned with a center line of the cover plate, and the plurality of exhaust holes are arranged symmetrically with respect to the center line.

14. A photoresist baking device, comprising: A baking chamber, with an exhaust port on one side wall of the baking chamber; A baking tray, disposed in the baking chamber, configured to support a wafer and heat a photoresist material above the wafer; an exhaust pipe connected to the exhaust port and configured to exhaust a gas inside the baking chamber along an exhaust direction; and a cover plate disposed above the baking tray and between the baking tray and the exhaust port, wherein the cover plate has a plurality of exhaust holes to allow air to flow through, wherein the plurality of exhaust holes include a group of first exhaust holes located in a first area of ​​the cover plate, a group of second exhaust holes located in a second area of ​​the cover plate, and a group of third exhaust holes located in a third area of ​​the cover plate, wherein the first area, the second area, and the third area are arranged along a first direction parallel to the exhaust direction, wherein the second area is close to a first edge of the cover plate close to the exhaust port, the first area is close to a second edge of the cover plate opposite to the first edge, and the third area is located between the first area and the second area, wherein each of the plurality of first exhaust holes has a first size, each of the plurality of second exhaust holes has a second size smaller than the first size, and each of the plurality of third exhaust holes has a third size, the third size is larger than the second size and smaller than the first size, The plurality of exhaust holes further include a group of fourth exhaust holes located in a fourth area of ​​the cover plate and a group of fifth exhaust holes located in a fifth area of ​​the cover plate, wherein the second area, the fourth area and the fifth area are arranged along a second direction perpendicular to the exhaust direction, the fourth area is farther away from the exhaust port than the fifth area, and the fifth area is farther away from the exhaust port than the second area, wherein the plurality of fourth exhaust holes each have a fourth size, the plurality of fifth exhaust holes each have a fifth size, and the fifth size is larger than the second size and smaller than the fourth size, The plurality of exhaust holes with larger sizes also have larger spacings, and as the distances between the plurality of exhaust holes and the exhaust port in the first direction or the second direction gradually increase, the spacings between the plurality of exhaust holes gradually increase.

15. The photoresist baking device as described in claim 14, wherein the plurality of the first exhaust holes have a first spacing, the plurality of the second exhaust holes have a second spacing smaller than the first spacing, and the plurality of the third exhaust holes have a third spacing larger than the second spacing and smaller than the first spacing, wherein the plurality of the fourth exhaust holes have a fourth spacing, the plurality of the fifth exhaust holes have a fifth spacing, and the fifth spacing is larger than the second spacing and smaller than the fourth spacing.

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