Semiconductor devices

Abstract

The invention aims to provide a semiconductor device capable of suppressing bending of a control terminal when an external connector is inserted into the control terminal. The semiconductor device (100) comprises: a housing (1) having an opening (1a); a semiconductor element (7) built into the housing (1); a control substrate (10) disposed above the semiconductor element (7) in the housing (1) and having a control circuit (11) for controlling the semiconductor element (7); a cover (2) covering the opening (1a) of the housing (1); and a control terminal (4) having one end connected to the control circuit (11) disposed on the control substrate (10) and the other end protruding to the outside of the housing (1). The control terminal (4) has a bent portion (13) bent in the housing (1), and a support portion (14) capable of supporting the bent portion (13) is provided on a side surface of the housing (1) or the cover (2).

Description

Technical Field

[0001] The present invention relates to semiconductor devices. Background Art

[0002] Generally, power semiconductor devices represented by IGBT (Insulated Gate Bipolar Transistor) modules and IPM (Intelligent Power Module) have main terminals for processing large currents and high voltages and control terminals for processing ON / OFF. The control terminals are connected to external connectors to control the on / off of the power semiconductor devices through external signals.

[0003] The external connector is usually connected by inserting into the control terminal. The control terminal is usually formed in a straight line relative to the insertion direction of the external connector, or embedded in the housing or cover of the semiconductor device. In this way, the control terminal is not easily bent due to the stress when the external connector is inserted into the control terminal.

[0004] In particular, in the case of IPM, a control substrate for control and protection functions is provided in the module. Generally, the control terminal is formed in a straight line in a direction perpendicular to the substrate surface from the control substrate, and one end of the control terminal protrudes to the outside of the module.

[0005] However, in the case of an IPM having multiple built-in power semiconductor elements, the position of the control terminal connected to the control circuit on the control substrate is limited because priority is given to ensuring the insulation distance between phases. Therefore, the position of the control terminal protruding outside the module is also limited. In order to make the control terminal protrude from any position, it is conceivable to bend the control terminal.

[0006] For example, a control terminal having a bent portion is disclosed in Patent Document 1. By further providing a protrusion on the side of the control terminal and making the protrusion contact with a protrusion receiving portion provided on the cover of the module, stress transmitted to the insulating substrate through the control terminal when the external connector is inserted into the control terminal is relieved.

[0007] Patent Document 1: International Publication No. 2012 / 066833

[0008] However, in the technology described in Patent Document 1, when an external connector is inserted into the control terminal and a stress greater than expected is applied, there is a concern that the protrusion provided on the control terminal cannot withstand the stress and the control terminal is pressed into the module. When the control terminal is pressed into the module, there is a concern that the protrusion is caught by the cover and the control terminal does not return to its original position, and the control terminal is bent. Summary of the invention

[0009] Therefore, an object of the present invention is to provide a semiconductor device capable of suppressing bending of a control terminal when an external connector is inserted into the control terminal.

[0010] The semiconductor device involved in the present invention comprises: a shell having an opening; a semiconductor element built into the shell; a control substrate arranged above the semiconductor element in the shell, and a control circuit for controlling the semiconductor element is arranged on the control substrate; a cover covering the opening of the shell; and a control terminal, one end of which is connected to the control circuit arranged on the control substrate and the other end protrudes to the outside of the shell, the control terminal having a bent portion bent in the shell, and a support portion capable of supporting the bent portion is provided on the side portion of the shell or the cover.

[0011] Effects of the Invention

[0012] According to the present invention, when the external connector is inserted into the control terminal, even if the control terminal is pressed into the housing due to stress applied to the control terminal, the support portion can support the control terminal, thereby preventing the control terminal from being bent. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a top view of the semiconductor device according to the first embodiment.

[0014] Figure 2 yes Figure 1 AA line section view.

[0015] Figure 3 This is an enlarged cross-sectional view of the control terminal and its surroundings.

[0016] Figure 4 This is a cross-sectional view for explaining stress when an external connector of an external substrate is inserted into a control terminal in the semiconductor device according to the first embodiment.

[0017] Figure 5 yes Figure 4 Magnified view of area B.

[0018] Figure 6 This is a perspective view of the control terminal and the support portion in the second embodiment.

[0019] Figure 7 This is a perspective view showing a state in which the control terminal is accommodated in the groove in the second embodiment.

[0020] Figure 8 It is a perspective view showing a state where the control terminal is accommodated in the groove in a modified example of the second embodiment.

[0021] Fig. 9 This is a cross-sectional view showing a state in which a support portion is removed from a side surface portion of a housing in the third embodiment.

[0022] Fig.10 This is a cross-sectional view of a semiconductor device according to a fourth embodiment. DETAILED DESCRIPTION

[0023] <Implementation Method 1>

[0024] Embodiment 1 will be described below using the drawings. Figure 1 1 is a plan view of the semiconductor device 100 according to the first embodiment. Figure 2 yes Figure 1 AA line section view. Figure 3 It is an enlarged cross-sectional view of the control terminal 4 and its surroundings.

[0025] like Figure 1 and Figure 2 As shown, the semiconductor device 100 is, for example, an IPM, and includes a base plate 5, an insulating substrate 6, a housing 1, a sealing resin 12, a cover 2, a control substrate 10, a plurality of semiconductor elements 7, a plurality of main terminals 3, a plurality of control terminals 4, and a plurality of relay terminals 9. In addition, the semiconductor device 100 may also be a module other than an IPM.

[0026] The base plate 5 is made of metal such as copper and has a rectangular shape when viewed from above. The insulating substrate 6 is provided on the upper surface of the base plate 5 except for the outer peripheral portion. The housing 1 is formed into a rectangular frame shape when viewed from above and is joined to the outer peripheral portion of the base plate 5. In addition, the housing 1 is made of resin and has insulating properties. A support portion 14 protruding to the inside is provided on the upper portion of the side portion of the housing 1. The details of the support portion 14 will be described later.

[0027] A plurality of semiconductor elements 7 are mounted on the upper surface of the insulating substrate 6. Although not shown in the figure, the insulating substrate 6 is composed of the following parts: an insulating layer such as ceramic, a circuit layer made of metal such as copper bonded to one main surface of the insulating layer and bonded to the semiconductor element 7 or the wire 8 on the surface, and a metal layer made of metal such as copper bonded to the other main surface of the insulating layer. The plurality of semiconductor elements 7 are connected via the wire 8. In addition, the plurality of semiconductor elements 7 are also connected to the insulating substrate 6, the main terminal 3, and the relay terminal 9 via the wire 8.

[0028] Although in Figure 2 Although not shown in detail, a collector electrode and an emitter electrode of the semiconductor element 7 are connected to the main terminal 3 via a wire 8 , respectively. In particular, the emitter sense electrode is connected to the control substrate 10 via a relay terminal 9 .

[0029] A plurality of relay terminals 9 are vertically arranged on the inner side of the lower part of the side surface of the housing 1. The plurality of main terminals 3 are U-shaped when viewed in cross section and are embedded in the housing 1. The lower ends of the plurality of main terminals 3 are exposed from the inner periphery of the housing 1 and are connected to the insulating substrate 6 via the wires 8. The upper ends of the plurality of main terminals 3 are bent from the upper end of the housing 1 to the opposite side of the housing 1 and are respectively mounted in the plurality of screw holes 2b formed in the cover 2.

[0030] The control substrate 10 is arranged above the semiconductor element 7 in the housing 1. A plurality of control circuits 11 for controlling the plurality of semiconductor elements 7 are arranged on the upper surface of the control substrate 10. A plurality of through holes (not shown) are formed in the control substrate 10, and the upper end portions of the relay terminals 9 are inserted through the plurality of through holes.

[0031] The sealing resin 12 is, for example, epoxy resin, and is filled between the base plate 5 and the control board 10 in the housing 1 .

[0032] The cover 2 is attached above the control board 10 of the housing 1 so as to cover the opening 1a of the housing 1. The cover 2 is formed with a plurality of screw holes 2b and a hole portion 2a which is a through hole.

[0033] Next, the control terminal 4 will be described. Figure 2 and Figure 3 As shown, the control terminal 4 is connected to the external connector 111 (refer to Figure 4 An ON signal for turning the semiconductor element 7 on or an OFF signal for turning the semiconductor element 7 off is input to the control terminal 4 via the external connector 111 .

[0034] The control terminal 4 includes a vertical portion 4a as a first portion, a horizontal extension portion 4b as a second portion, and a lead-out portion 4c as a third portion. The vertical portion 4a extends upward (vertically) from the control circuit 11. The horizontal extension portion 4b extends laterally (horizontally) from the end of the vertical portion 4a on the opposite side to the control circuit 11. The lead-out portion 4c extends upward (vertically) from the end of the horizontal extension portion 4b on the opposite side to the vertical portion 4a, and protrudes from the hole 2a formed in the cover 2.

[0035] Furthermore, the control terminal 4 has a bent portion 13 bent in the housing 1. The bent portion 13 is a portion bent between the horizontally extending portion 4b and the lead-out portion 4c.

[0036] Next, the support portion 14 provided on the side surface of the housing 1 will be described. Figure 2 and Figure 3As shown, the support portion 14 protrudes inward from the side portion of the housing 1 so that the bent portion 13 of the control terminal 4 can be supported from the lower side. In particular, since the horizontal extension portion 4b of the bent portion 13 is partially supported, the bending of the horizontal extension portion 4b of the control terminal 4 is suppressed. The support portion 14 is a tapered shape that becomes thinner as it moves toward the front end side. Specifically, the upper surface of the support portion 14 is a horizontal plane, and the lower surface of the support portion 14 is an inclined surface with the front end side located above the tail end side.

[0037] like Figure 3 As shown in FIG. 1 , the length D of the support portion 14 is such that the diameter d of the lead-out portion 4c is entirely located above the support portion 14. In addition, a gap s is formed between the horizontal extension portion 4b and the support portion 14. The purpose of the gap s is to Figure 2 When the control terminal 4 is pressed from the outside in the direction of the arrow P shown in the figure and stress is applied to the control terminal 4, there is a press-in margin of the height of the gap s. In addition, the height of the gap s is set to a height at which the angle formed by the lower end of the horizontal extension portion 4b and the upper surface of the support portion 14 is greater than or equal to 5° and less than or equal to about 10° when stress is applied in the direction of the arrow P.

[0038] Next, use Figure 4 and Figure 5 , the functions and effects of the semiconductor device 100 according to the first embodiment are described. Figure 4 This is a cross-sectional view for explaining stress when the external connector 111 of the external substrate 110 is inserted into the control terminal 4 in the semiconductor device 100 according to the first embodiment. Figure 5 yes Figure 4 Magnified view of area B.

[0039] like Figure 4 As shown, when the external connector 111 is inserted into the control terminal 4, stress is applied in the direction of arrow P. When the support portion 14 is not provided, the control terminal 4 is pressed downward by the stress, thereby bending the horizontal extension portion 4b of the control terminal 4.

[0040] like Figure 4 and Figure 5 As shown, the semiconductor device 100 according to the first embodiment includes: a housing 1 having an opening 1a; a semiconductor element 7 built into the housing 1; a control substrate 10 disposed above the semiconductor element 7 in the housing 1 and provided with a control circuit 11 for controlling the semiconductor element 7; a cover 2 covering the opening 1a of the housing 1; and a control terminal 4, one end of which is connected to the control circuit 11 disposed on the control substrate 10 and the other end of which protrudes to the outside of the housing 1. The control terminal 4 includes a bent portion 13 bent in the housing 1, and a support portion 14 capable of supporting the bent portion 13 is provided on a side surface of the housing 1.

[0041] Therefore, when the external connector 111 is inserted into the control terminal 4, even when the control terminal 4 is pressed into the housing 1 due to the stress applied to the control terminal 4, the support portion 14 can support the control terminal 4. Thus, bending of the control terminal 4 can be suppressed. Thus, the semiconductor device 100 can be used for a long time.

[0042] In addition, the control terminal 4 has: a vertical portion 4a, which extends upward from the control circuit 11; a horizontal extension portion 4b, which extends laterally from the end of the vertical portion 4a on the opposite side of the control circuit 11; and an output portion 4c, which extends upward from the end of the horizontal extension portion 4b on the opposite side of the vertical portion 4a and protrudes from the hole portion 2a formed in the cover 2, the bent portion 13 is a portion bent between the horizontal extension portion 4b and the output portion 4c, and the support portion 14 is configured to protrude inward from the side portion of the shell 1, and can support the bent portion 13 from the bottom.

[0043] Therefore, since the portion of the horizontally extending portion 4 b of the bent portion 13 is supported, bending of the horizontally extending portion 4 b of the control terminal 4 can be suppressed.

[0044] Furthermore, the support portion 14 supports the bent portion 13 from below, thereby facilitating insertion of the external connector 111 into the control terminal 4 .

[0045] In particular, if Figure 3 As shown, since a gap s is formed between the horizontal extension portion 4b and the support portion 14, when excessive stress is applied to the control terminal 4 due to the insertion of the external connector 111, the stress applied to the horizontal extension portion 4b can be alleviated, and excessive pressing caused by the external connector 111 can be suppressed.

[0046] <Implementation Method 2>

[0047] Next, a semiconductor device 100 according to a second embodiment will be described. Figure 6 It is a perspective view of the control terminal 4 and the support portion 14 in the second embodiment. Figure 7 This is a perspective view showing a state in which the control terminal 4 is accommodated in the groove 14a in the second embodiment. Figure 8 1 is a perspective view showing a state in which the control terminal 4 is accommodated in the groove 14a in a modification of the second embodiment. Figure 6 to Figure 8 In , the bidirectional arrow Y indicates the Y-axis direction. In the second embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

[0048] like Figure 6 and Figure 7As shown, in the second embodiment, a plurality of grooves 14a capable of accommodating the bent portions 13 are formed in the portions of the support portion 14 that are opposite to the bent portions 13 of the plurality of control terminals 4. More specifically, the plurality of grooves 14a are formed to be arranged in the Y-axis direction, and each groove 14a is formed in the portion of the support portion 14 that is opposite to the portion on the lead-out portion 4c side of the horizontal extension portion 4b. Each groove 14a is formed to be wider than the diameter of the horizontal extension portion 4b and deeper than the diameter of the horizontal extension portion 4b. Thus, each groove 14a can accommodate the portion on the lead-out portion 4c side of the horizontal extension portion 4b including the bent portions 13 of each control terminal 4.

[0049] As described above, in the semiconductor device 100 according to the second embodiment, the groove 14a capable of accommodating the bent portion 13 of the control terminal 4 is formed in the portion of the support portion 14 that faces the bent portion 13 of the control terminal 4. Therefore, when the external connector 111 is inserted into the control terminal 4, the bent portion 13 of the control terminal 4 is accommodated when the control terminal 4 is pressed into the housing 1 by the stress applied to the control terminal 4, so that the lateral sliding of the control terminal 4 in the Y-axis direction can be suppressed. As a result, it is possible to suppress the adjacent control terminals 4 from contacting each other.

[0050] In addition, you can also Figure 8 As shown, the support portion 14 has a Figure 6 and Figure 7 The case of thick thickness, forming a Figure 6 and Figure 7 In this way, the stability associated with the insertion of the external connector 111 can be improved.

[0051] <Implementation Method 3>

[0052] Next, a semiconductor device 100 according to a third embodiment will be described. Fig. 9 This is a cross-sectional view showing a state where the support portion 14 is removed from the side surface of the housing 1 in the third embodiment. In the third embodiment, the same components as those described in the first and second embodiments are denoted by the same reference numerals and their description is omitted.

[0053] like Fig. 9 As shown, in the third embodiment, the support portion 14 is detachable from the side surface of the housing 1 .

[0054] The upper part of the side surface of the housing 1 is provided with a fitting hole 1b for fitting with the tail end portion 14b of the support portion 14. The fitting hole 1b is a through hole, and the tail end portion 14b of the support portion 14 is inserted through the fitting hole 1b for fitting. Therefore, the support portion 14 will not fall off. In addition, since the fitting hole 1b is slightly larger than the tail end portion 14b, the support portion 14 can be detached from the fitting hole 1b.

[0055] As described above, in the semiconductor device 100 according to the third embodiment, the fitting hole 1 b into which the tail end portion 14 b of the support portion 14 fits is formed in the side surface of the case 1 , and the support portion 14 is detachable from the fitting hole 1 b .

[0056] Therefore, when assembling the semiconductor device 100 , the support portion 14 does not interfere with the wire bonding process, the resin encapsulation process, the control substrate mounting process, and the like. This can improve the yield of the semiconductor device 100 .

[0057] In addition, the groove described in the second embodiment can also be formed in the support portion 14 of the third embodiment. In this case, the same effect as that of the second embodiment can be obtained.

[0058] <Implementation Method 4>

[0059] Next, a semiconductor device 100A according to a fourth embodiment will be described. Fig.10 It is a cross-sectional view of a semiconductor device 100A according to Embodiment 4. In Embodiment 4, the same components as those described in Embodiments 1 to 3 are denoted by the same reference numerals, and description thereof is omitted.

[0060] like Fig.10 As shown, in the fourth embodiment, the semiconductor device 100A is, for example, an IPM, and has a support portion 15 provided on the cover 2 instead of the support portion 14. Furthermore, the semiconductor device 100A has a control terminal 24 instead of the control terminal 4. The semiconductor device 100A may be a module other than the IPM.

[0061] The control terminal 24 has a vertical portion 24a as a first portion and a horizontal extension portion 24b as a second portion. The vertical portion 24a extends upward (vertically) from the control circuit 11. The horizontal extension portion 24b extends laterally (horizontally) from the end of the vertical portion 24a on the opposite side of the control circuit 11 and protrudes from the hole portion 1c, which is a through hole formed on the side surface of the housing 1.

[0062] In addition, the control terminal 24 has a bent portion 13 bent in the housing 1. The bent portion 13 is a portion bent between the vertical portion 24a and the horizontally extending portion 24b.

[0063] The support portion 15 protrudes downward from the lower surface of the cover 2 so that the curved portion 13 can be supported from the side of the side portion opposite to the hole portion 1c via the vertical portion 24a. In particular, since the vertical portion 24a of the curved portion 13 is supported, the bending of the vertical portion 24a is suppressed. The support portion 15 is tapered so that the thickness becomes thinner toward the front end side. Specifically, the surface of the support portion 15 opposite to the vertical portion 24a is a horizontal surface, and the surface on the opposite side is an inclined surface whose front end side is located on the vertical portion 24a side compared to the rear end side.

[0064] The relationship between the length of the support portion 15 and the diameter of the horizontally extending portion 24b is the same as the relationship between the length of the support portion 14 and the lead-out portion 4c described in Embodiment 1. Also, a gap s is formed between the vertical portion 24a and the support portion 15 as in Embodiment 1.

[0065] As described above, the semiconductor device 100A according to the fourth embodiment includes: a housing 1 having an opening 1a; a semiconductor element 7 built into the housing 1; a control substrate 10 disposed above the semiconductor element 7 in the housing 1 and provided with a control circuit 11 for controlling the semiconductor element 7; a cover 2 covering the opening 1a of the housing 1; and a control terminal 24 having one end connected to the control circuit 11 disposed on the control substrate 10 and the other end protruding to the outside of the housing 1. The control terminal 24 has a bent portion 13 bent in the housing 1, and the cover 2 is provided with a support portion 15 capable of supporting the bent portion 13.

[0066] Therefore, when the external connector is inserted into the control terminal 24, even if the control terminal 24 is pressed into the housing 1 due to stress applied to the control terminal 24, the support portion 15 can support the control terminal 24. Thus, bending of the control terminal 24 can be suppressed.

[0067] In addition, the control terminal 24 has: a vertical portion 24a, which extends upward from the control circuit 11; and a horizontal extension portion 24b, which extends laterally from the end of the vertical portion 24a on the opposite side of the control circuit 11 and protrudes from the hole portion 1c formed in the side portion of the shell 1, the bent portion 13 is a portion bent between the vertical portion 24a and the horizontal extension portion 24b, and the support portion 15 is configured to protrude downward from the lower surface of the cover 2, and can support the bent portion 13 from the side of the side portion opposite to the hole portion 1c via the vertical portion 24a.

[0068] Therefore, in order to be able to Fig.10The stress applied in the direction of arrow Q is relieved, and the protruding position of the control terminal 24 is not limited to the upper side of the semiconductor device 100A, and the control terminal 24 can be protruded from the side of the semiconductor device 100A. As a result, the freedom of the protruding position of the control terminal 24 is improved.

[0069] In addition, the groove described in Embodiment 2 may be formed in the support portion 15. In this case, as in Embodiment 2, the lateral sliding of the plurality of control terminals 24 in the arrangement direction can be suppressed. Thus, the contact between the adjacent control terminals 24 can be suppressed. Figure 6 and Figure 7 In the case of a groove with a deeper depth, it is possible to improve the stability associated with the insertion of the external connector.

[0070] Furthermore, the various embodiments may be freely combined, and the various embodiments may be appropriately modified or omitted.

[0071] Description of the label

[0072] 1 housing, 1a opening, 1b fitting hole, 1c hole portion, 2 cover, 2a hole portion, 4 control terminal, 4a vertical portion, 4b horizontal extension portion, 4c lead-out portion, 7 semiconductor element, 10 control substrate, 11 control circuit, 13 bent portion, 14, 15 supporting portion, 14a groove, 14b tail end portion, 24 control terminal, 24a vertical portion, 24b horizontal extension portion, 100, 100A semiconductor device.

Claims

1. A semiconductor device comprising: a housing having an opening; A semiconductor element, which is built into the housing; a control substrate, which is arranged directly above the semiconductor element in the housing when viewed from above, and on which a control circuit for controlling the semiconductor element is arranged; a cover covering the opening of the housing; as well as a control terminal, one end of which is connected to the control circuit disposed on the control substrate, and the other end of which protrudes to the outside of the housing, The control terminal has a bent portion that is bent inside the housing, A support portion capable of supporting the bent portion is provided on a side surface portion of the housing or the cover.

2. The semiconductor device according to claim 1, wherein The control terminal comprises: a first portion extending upward from the control circuit; and a second portion extending laterally from an end of the first portion on the opposite side to the control circuit. and a third portion extending upward from an end portion of the second portion on the opposite side to the first portion and protruding from a hole formed in the cover, The bent portion is a portion bent between the second portion and the third portion, The support portion is provided to protrude inward from the side surface portion of the housing, and can support the bent portion from a lower side.

3. The semiconductor device according to claim 2, wherein: A fitting hole is formed on the side surface of the housing to fit with the rear end of the support portion. The support portion is detachable from the fitting hole.

4. The semiconductor device according to claim 1, wherein The control terminal comprises: a first portion extending upward from the control circuit; and a second portion extending laterally from an end of the first portion on the opposite side of the control circuit and protruding from a hole formed on the side surface of the housing. The bent portion is a portion bent between the first portion and the second portion. The support portion is provided to protrude downward from the lower surface of the cover, and can support the curved portion from the side of the side portion opposite to the hole portion via the first portion.

5. The semiconductor device according to any one of claims 2 to 4, wherein: A groove capable of accommodating the bent portion is formed in a portion of the support portion that faces the bent portion of the control terminal.

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