Power Module and Home Appliance

Abstract

The present invention discloses a power module and a household electrical appliance. The power module includes a support substrate, a first conductive layer, a second conductive layer, a chip, and a pin assembly. The first conductive layer and the second conductive layer are both disposed on the support substrate, the chip is disposed on the first conductive layer and / or the second conductive layer. The pin assembly may include a plurality of pins, and the plurality of pins are arranged in parallel with each other. The pin assembly may be disposed on the first conductive layer and / or the second conductive layer, and is electrically connected to the chip. Thus, the power module in this embodiment can reduce the circuit parasitic inductance, improve the current-carrying capacity of the pins, simplify the production process, improve the product yield, and reduce the cost.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit process design, and particularly to a power module and a household electrical appliance device. Background Art

[0002] In a power circuit, a power semiconductor controls the flow of electric energy by conducting and turning off. In some conversion circuits based on IGBT (Insulated Gate Bipolar Transistor), switching means that current flows back and forth between the IGBT and the freewheeling diode. In an ideal circuit, the IGBT controls the voltage and current waveforms, and there are no voltage spikes or oscillations. Only the reverse recovery current of the diode and the tail current of the IGBT cause differences from the ideal waveform, and this kind of switching can be called a clean switch.

[0003] An actual power circuit contains two main parasitic parameters, inductance and capacitance, which will cause the waveform to deviate severely from the clean switch. For example: the voltage drop caused by the rising current when the IGBT is turned on; the voltage spike generated on the diode when the reverse recovery current drops; the voltage spike caused by the dropping current when the IGBT is turned off; the parasitic inductance and parasitic capacitance form a resonant circuit, resulting in damped oscillations after each switching conversion.

[0004] When the parasitic parameters are too large, it will cause unnecessary power consumption in the circuit, thus affecting the operation of the circuit. Therefore, how to reduce the parasitic parameters in the circuit is a very important issue. In related technologies, generally, the pin terminals of the power module are set as flat strips to improve the current-carrying capacity and reduce the parasitic inductance at the same time. However, in order to install such flat terminals, additional solder paste pasting processes and reflow processes are required, that is, after the chip is pasted onto the substrate and fixed by reflow, the flat terminals are then pasted onto the substrate, and reflow is performed again at a lower temperature to complete the terminal pasting. But this method increases the cost and reduces the process yield. Moreover, the welding reliability of such terminals on a traditional PCB (Printed Circuit Board) is poor, and generally, a more troublesome crimping method is used. Summary of the Invention

[0005] The present invention aims to solve at least one of the technical problems in the related technologies to some extent. For this reason, an object of the present invention is to provide a power module that can reduce the parasitic inductance of the circuit, improve the current-carrying capacity of the pins, simplify the production process, improve the product yield, and reduce the cost.

[0006] A second object of the present invention is to provide a household electrical appliance device.

[0007] To achieve the above object, an embodiment of the first aspect of the present invention provides a power module, which includes: a support substrate; a first conductive layer and a second conductive layer, both the first conductive layer and the second conductive layer are disposed on the support substrate; a chip, the chip is disposed on the first conductive layer and / or the second conductive layer; a pin assembly, the first conductive layer and / or the second conductive layer are provided with the pin assembly, and the pin assembly is electrically connected to the chip, wherein the pin assembly includes a plurality of pins, and the plurality of pins are parallel to each other.

[0008] The power module of the embodiment of the present invention includes a support substrate, a first conductive layer, a second conductive layer, a chip and a pin assembly. Among them, the first conductive layer and the second conductive layer are both arranged on the support substrate, the chip is arranged on the first conductive layer and / or the second conductive layer, the pin assembly may include a plurality of pins, and the plurality of pins are arranged parallel to each other. The pin assembly may be arranged on the first conductive layer and / or the second conductive layer, and is electrically connected to the chip. Thus, the power module in this embodiment can reduce the circuit parasitic inductance, improve the current-carrying capacity of the pins, simplify the production process, improve the product yield, and reduce the cost.

[0009] In some embodiments of the present invention, the power module further includes a plurality of bonding wires. One of the first conductive layer and the second conductive layer is provided with the chip, and the plurality of bonding wires are connected between the chip and the conductive layer without the chip.

[0010] In some embodiments of the present invention, the power module further includes a plurality of bonding wires. Both the first conductive layer and the second conductive layer are provided with the chip, and the plurality of bonding wires are connected between the chip on the first conductive layer and the chip on the second conductive layer.

[0011] In some embodiments of the present invention, the plurality of pins are sequentially arranged in a first direction of the support substrate.

[0012] In some embodiments of the present invention, at least two adjacent pins among the plurality of pins are sequentially spaced apart in the first direction.

[0013] In some embodiments of the present invention, in the first direction, the pin assembly has a first center point, and in the first direction, the projection of the plurality of bonding wires in the thickness direction of the support substrate has a second center point. The included angle between the connection line of the first center point and the second center point and the second direction is β, which satisfies the relational expression: β < 9°.

[0014] In some embodiments of the present invention, in the first direction, the distance between the first center point and the second center point is H1, and the width of the pin assembly is H2, which satisfies the relational expression: H1 < 50%H2.

[0015] In some embodiments of the present invention, the plurality of bonding wires are parallel to each other and are sequentially spaced apart in a first direction of the support substrate.

[0016] In some embodiments of the present invention, the plurality of bonding wires correspond one-to-one with the plurality of pins in a second direction of the support substrate.

[0017] In some embodiments of the present invention, the pin and its corresponding bonding wire are located in the same plane.

[0018] In some embodiments of the present invention, the plurality of pins are all perpendicular to the support substrate and extend in the thickness direction of the support substrate.

[0019] To achieve the above object, an embodiment of the second aspect of the present invention provides a household electrical appliance, which includes the power module described in the above embodiment.

[0020] The household electrical appliance according to the embodiment of the present invention includes the power module in the above embodiment. Through this power module, the household electrical appliance in this embodiment can reduce the circuit parasitic inductance, improve the current-carrying capacity of the pins, simplify the production process, improve the product yield, and reduce the cost.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. Description of the Drawings

[0022] Figure 1 is a schematic structural diagram of a power module according to an embodiment of the present invention;

[0023] Figure 2 is a schematic structural diagram of a power module according to an embodiment of the present invention;

[0024] Figure 3 is a schematic structural diagram of a power module according to an embodiment of the present invention;

[0025] Figure 4 is a schematic structural diagram of a power module according to an embodiment of the present invention;

[0026] Figure 5 is a schematic diagram of a double-pulse waveform of a single-pin diode according to the related art;

[0027] Figure 6 is a schematic diagram of a double-pulse waveform of a two-pin diode according to a specific embodiment of the present invention;

[0028] Figure 7Schematic diagram of the EMC test results of a household electrical appliance device using a single-pin power module in the related art;

[0029] Figure 8 Schematic diagram of the EMC test results of a household electrical appliance device using a two-pin power module according to a specific embodiment of the present invention;

[0030] Figure 9 Block diagram of the structure of a household electrical appliance device according to an embodiment of the present invention. Specific embodiments

[0031] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0032] The power module and the household electrical appliance device according to the embodiments of the present invention will be described below with reference to the accompanying drawings.

[0033] Figure 1 Schematic diagram of the structure of a power module according to an embodiment of the present invention.

[0034] As Figure 1 shown, an embodiment of the first aspect of the present invention provides a power module 10, which includes a support substrate 101, a first conductive layer 102, a second conductive layer 103, a chip 104, and a pin assembly 105.

[0035] Among them, the first conductive layer 102 is disposed on the support substrate 101, and the second conductive layer 103 is also disposed on the support substrate 101. The chip 104 can be disposed on the first conductive layer 102 or on the conductive layer 103. In this embodiment, the chip 104 is disposed on the second conductive layer 103. The pin assembly 105 can be disposed on the first conductive layer 102 or on the second conductive layer 103. In this embodiment, the pin assembly 105 is disposed on the first conductive layer 102, and the pin assembly 105 can be connected to the chip 104. The pin assembly 105 can include a plurality of pins, and the plurality of pins can be parallel to each other.

[0036] Specifically, as Figure 1As shown, the support substrate 101 in this embodiment may be a ceramic plate or a metal plate covered with an insulating material. Both the first conductive layer 102 and the second conductive layer 103 may be conductive metal layers, and the conductive metal layers may cover the support substrate 101 in a certain pattern. It can be understood that the specific pattern in which the first conductive layer 102 and the second conductive layer 103 cover the support substrate 101 may be adaptively changed according to the specific design of the power module circuit, and the shape of the conductive layer is not specifically limited herein. The first conductive layer 102 and the second conductive layer 103 in this embodiment may be fixedly arranged on the support substrate 101, and it can be understood that the first conductive layer 102 and the second conductive layer 103 may be electrically connected. In this embodiment, the electrical connection manner between the first conductive layer 102 and the second conductive layer 103 is not limited.

[0037] The chip 104 in this embodiment may be a diode chip, IGBT, MOSFET (Metal - Oxide - Semiconductor Field - Effect Transistor), etc. The chip 104 may be arranged on the first conductive layer 102 or the second conductive layer 103. It should be noted that when the chip 104 is arranged on the conductive layer, it can be electrically connected to the conductive layer. As Figure 1 shown, the pin assembly 105 in this embodiment may include 3 pins, and each pin is arranged in parallel with each other on the first conductive layer 102 or the second conductive layer 103. Figure 1 In the example shown, the pin assembly 105 is arranged on the first conductive layer 102, and the first conductive layer 102 may be connected to the chip so that the pin assembly 105 can be connected to the chip. The connection manner is not limited in this example.

[0038] It should be noted that the pin assembly 105 in this embodiment may include multiple pins, and the number thereof may be selected according to actual applications. Moreover, the number of pins included in different pin assemblies 105 in the circuit board may be the same or different.

[0039] In this embodiment, the power module 10 sets the pin assembly 105 with multiple pins as a connection terminal. Therefore, compared with the case of a single pin, taking multiple pins as the pin assembly 15 in this embodiment can be equivalent to a flat plate, and the loop inductance of a plate - shaped pin with the same length is smaller than that of a wire - shaped pin. The specific loop inductance of the wire - shaped conductor Among them, Length is the length of the linear pin wire, r is the radius of the pin wire, a is the distance between parallel wires, and μ0 is the permeability of free space. Thus, it can be known that when Length = 20mm, r = 5mm, and a = 30mm, the loop inductance L = 18nH. In this application, multiple pins are used and the multiple pins are arranged in parallel. Therefore, the multiple pins can be equivalent to a flat plate. In the flat-plate pins, the loop inductance Among them, d is the distance between two flat plates, w is the width of the flat plate (perpendicular to the current direction), Length is the length of the flat plate (parallel to the current direction), and μ0 is the permeability of free space. Thus, it can be known that when d = 1mm, w = 70mm, and Length = 1m, the loop inductance L = 18nH. That is to say, the parasitic inductance of a 1-meter-long flat-plate conductor is equivalent to that of a 0.02-meter-long wire. Obviously, in the case of the same length, the parasitic inductance of the flat-plate conductor is much smaller than that of the wire.

[0040] That is to say, in this embodiment, the single pin is set as a pin component containing multiple pins. Compared with the single pin, the pin component can act as a flat-plate-shaped pin, greatly reducing the parasitic inductance. Moreover, the base of the pin component used in this embodiment only needs to be soldered to the chip in the same reflow process. Therefore, compared with the flat ribbon terminal, the pin component in this embodiment can simplify the production process to facilitate the installation of the pin on the PCB.

[0041] It can be seen from the above description that the power module in this embodiment can reduce the circuit parasitic inductance, improve the current-carrying capacity of the pins, simplify the production process, improve the product yield, and reduce the cost.

[0042] In this embodiment, as Figure 1 shown, the power module 10 further includes a plurality of bonding wires 106, and the plurality of bonding wires 106 are used to connect the conductive layer provided with the chip 104 and the conductive layer not provided with the chip 104.

[0043] Specifically, as Figure 1 shown, the chip 104 is disposed on the second conductive layer 103, and the first wire layer 102 is not provided with a conductive layer. In this embodiment, a plurality of bonding wires 106 are provided to connect the chip 104 and the first conductive layer 102. Since the pin component 105 is disposed on the first conductive layer 102, the pin component 105 can be connected to the chip 104 to ensure that the chip 104 can receive electrical signals, communication signals, etc. flowing in from the pin component 105, thereby ensuring the normal operation of the chip 104.

[0044] In some embodiments, as Figure 2As shown, both the first conductive layer 102 and the second conductive layer 103 are provided with chips 104. A plurality of bonding wires 106 can be arranged on the chips 104 on the first conductive layer 102 and the chips 104 on the second conductive wire 103, for connecting the chips 104 on the two conductive layers.

[0045] That is to say, as Figure 1 and 2 shown, in this embodiment, a plurality of bonding wires 106 can connect the chips on one conductive layer to those on another conductive layer, or connect the chips on one conductive layer to the chips on another conductive layer, for ensuring that the chips can be connected to various external signals through the pin assembly.

[0046] In this embodiment, as Figure 1 or Figure 2 shown, a plurality of bonding wires 106 can be parallel to each other and spaced apart in a first direction on the support substrate 101.

[0047] Specifically, taking Figure 2 as an example for illustration, among them, the power module 10 includes 3 bonding wires 106. Each pair of bonding wires 106 is sequentially spaced apart, and the spacing direction is along the first direction, that is, along the Y direction for spacing arrangement.

[0048] Furthermore, a plurality of bonding wires 106 also correspond to a plurality of pins 105 one by one in a second direction of the support substrate 101.

[0049] Specifically, as Figure 2 shown, the power module 10 includes 3 bonding wires 106 and 3 pins 105. Among them, the 3 bonding wires 106 and the 3 pins 105 are arranged in one-to-one correspondence, and are arranged in one-to-one correspondence in the second direction, where the second direction is the X direction. It should be noted that the number of the plurality of bonding wires 106 and the pin assembly 105 in this embodiment can be different or the same. When the numbers of both are the same, each bonding wire 106 and each pin 105 can be arranged in one-to-one correspondence in the X-axis direction; when the numbers of both are different, equal-spacing arrangement can be carried out. For example, in the case of 2 pins 105 and 3 bonding wires 106, the 3 bonding wires 106 can trisect the distance between the 2 pins 105, and then the bonding wires 106 are arranged in the X-axis direction corresponding to each equal division point.

[0050] In this embodiment, in order to be arranged corresponding to a plurality of bonding wires 106, a plurality of pins 105 in this embodiment are sequentially arranged in the first direction of the support substrate 101.

[0051] Specifically, in this embodiment, as Figure 2As shown, the number of bonding wires in this embodiment is the same as the number of pins, and they can be set in one-to-one correspondence. A plurality of pins 105 are sequentially arranged in the X-axis direction. It should be noted that the direction of this spaced arrangement is also the direction in which the plurality of bonding wires 106 are spaced, so that the plurality of bonding wires 106 and the plurality of pins 105 can be set in one-to-one correspondence.

[0052] In this embodiment, at least two adjacent pins among the plurality of pins 105 can be sequentially spaced apart in the first direction (i.e., the X-axis direction).

[0053] Specifically, in this embodiment, at least two adjacent pins can be selected from the plurality of pins 105 for spaced arrangement. For example, as Figure 2 shown, among the plurality of pins 105, there are three pins, namely the first pin, the second pin, and the third pin. Then, in this embodiment, the first pin and the second pin can be spaced apart, while the second pin and the third pin are relatively close. Of course, it can also be that the first pin and the second pin are relatively close, while the second pin and the third pin are spaced apart. In this embodiment, the plurality of pins are not evenly spaced, and the above-mentioned technical problems can still be solved. Moreover, compared with spacing each pin component, the compatibility of the pin component can be improved, making it adaptable to more application scenarios.

[0054] In some embodiments of the present invention, as Figure 3 shown, the pin 105 and its corresponding bonding wire 106 can be in the same plane.

[0055] Specifically, referring to Figure 3 , in the direction parallel to the plane XOZ, there is a plane A, and both the pin 105 and the bonding wire 106 can be arranged in this plane. As Figure 3 shown, among them, the pin 105 can be perpendicular to the support substrate 101 and extend in the thickness direction of the support substrate 101, that is, extend in the Z-axis direction. And the bonding wire 106 extends in the X-axis direction and is also in the plane A. It can be understood that other corresponding pins and bonding wires can also be located in other planes, and these other planes are also parallel to the plane A.

[0056] It should be noted that, in an ideal situation, the plane where the pin and its corresponding bonding wire are located is a plane parallel to the plane XOZ. However, in actual situations, due to the existence of errors, there is a certain error between the plane where the pin 105 and the bonding wire 106 are located and the plane XOZ.

[0057] In some embodiments of the present invention, there is a first center point P1 in the pin assembly 105 in the first direction, and there is a second center point P2 in the projection of multiple bonding wires 106 in the first direction. Wherein, the included angle between the line connecting the first center point P1 and the second center point P2 in the second direction is β, and this included angle β satisfies β < 9°. Moreover, the projection of the multiple bonding wires 106 is the projection in the thickness direction of the support substrate 101.

[0058] Specifically, as Figure 4 shown, in an ideal situation, the line segment P1P2 between the first center point P1 and the second center point P2 should coincide with the straight line in the second direction. However, in the actual application process, due to manufacturing errors, welding errors, etc., the line segment P1P2 often cannot completely coincide with the straight line in the second direction, there is a certain error. In this embodiment, the included angle generated by this error is defined as β, and it is limited that the deviation of this included angle β should be less than 10% of the complete deviation. It should be noted that the complete deviation means that the line segment P1P2 is perpendicular to the straight line in the second direction, that is, the line segment P1P2 is parallel to the straight line in the first direction. Therefore, when it is completely deviated, the deviation angle is 90°. Limiting the deviation angle β within 10% means that it is necessary to limit the included angle β to be less than 9°. Limiting the included angle β can improve the speed of the current passing through the pins 105 and the bonding wires 106, and at the same time, it can also improve the convenience of power module packaging.

[0059] In this embodiment, as Figure 4 shown, the distance between the first center point P1 and the second center point P2 in the first direction is H1, and the width between the pin assemblies 105 is H2. Among them, the relationship H1 < 50%H2 needs to be satisfied between H1 and H2.

[0060] Specifically, in the first direction, that is, the Y direction, the distance between the first center point P1 and the second center point P2 can be as Figure 4 shown as H1 in. In order to ensure the current passing speed and effect between the pins and the bonding wires, this embodiment also limits the distance H1. Specifically, it is limited that the distance of H1 is less than half of the distance of H2, where H2 is the width between the pin assemblies 105. It should be noted that in an ideal situation, the distance between the first center point P1 and the second center point P2 in the Y-axis direction is zero. However, due to the existence of errors, there are more or less some distances between the first center point P1 and the second center point P2 in the Y-axis direction. In this embodiment, this distance is limited in combination with the width between the pin assemblies.

[0061] Referring to Figures 5 - 8 shown, for the power module of a specific embodiment of the present invention, specifically, taking the diode with two pins in the pin assembly as an example for experimental testing. Among them, byFigure 5 It can be seen that when there is only a single pin at the positive terminal of the diode, and the bus voltage is 300 V and the current is 15 A, the turn-off voltage spike of the voltage is 402 V; when there are two pins at the positive terminal of the diode, with the same bus voltage of 300 V and current of 15 A, the turn-off voltage spike of the voltage drops to 378 V at this time. It should be noted that the turn-off voltage spike is a direct manifestation of the parasitic inductance of the circuit. Therefore, it can be clearly seen from the experimental data that by setting two or more pins, the parasitic inductance of the circuit can be sufficiently reduced. In the experiment, the electromagnetic interference resistance of the power module in this embodiment was also tested through EMC (Electro Magnetic Compatibility). During the experiment, the power module can be installed in household appliances, such as air conditioners, for conducted emission testing. It can be Figure 7 seen that in the case of a single pin, the conducted emission margin is approximately -5.3 dB, while in the case of double pins, as Figure 8 shown, the conducted emission margin is approximately -10.38 dB. Obviously, the household appliances equipped with the double-pin power module have lower electromagnetic interference.

[0062] In summary, the power module of the embodiment of the present invention can reduce the parasitic inductance of the circuit, improve the current-carrying capacity of the pins, simplify the production process, improve the product yield, and reduce the cost.

[0063] Figure 9 is a structural block diagram of a household appliance according to an embodiment of the present invention.

[0064] Furthermore, as Figure 9 shown, the present invention proposes a household appliance 20, which includes the power module 10 in the above embodiment.

[0065] The household appliance in the embodiment of the present invention includes the power module in the above embodiment. Through the power module in the above embodiment, the household appliance in this embodiment can reduce the parasitic inductance of the circuit, improve the current-carrying capacity of the pins, simplify the production process, improve the product yield, and reduce the cost.

[0066] In addition, the other compositions and functions of the household appliance in the embodiment of the present invention are known to those skilled in the art. To reduce redundancy, they will not be described in detail here.

[0067] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc., mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0068] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0069] In addition, the terms "first", "second", etc. used in the embodiments of the present invention are only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the technical features indicated in this embodiment. Thus, the features defined with terms such as "first", "second", etc. in the embodiments of the present invention can explicitly or implicitly indicate that at least one such feature is included in this embodiment. In the description of the present invention, the meaning of the word "plurality" is at least two or more than two, such as two, three, four, etc., unless otherwise specifically defined in the embodiments.

[0070] In the present invention, unless otherwise clearly specified or limited in the embodiments, the terms "mounted", "connected", "coupled", and "fixed", etc. appearing in the embodiments should be understood in a broad sense. For example, the connection can be a fixed connection, a detachable connection, or integrated. It can be understood that it can also be a mechanical connection, an electrical connection, etc.; of course, it can also be directly connected, or indirectly connected through an intermediate medium, or it can be the communication inside two elements, or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific implementation circumstances.

[0071] In the present invention, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are indirectly in contact via an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher level height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower level height than the second feature.

[0072] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A power module, characterized in that, Comprising: A support substrate; A first conductive layer and a second conductive layer, both the first conductive layer and the second conductive layer are disposed on the support substrate; A chip, the chip is disposed on the first conductive layer and / or the second conductive layer; A pin assembly, the first conductive layer and / or the second conductive layer is provided with the pin assembly, and the pin assembly is electrically connected to the chip. Wherein, the pin assembly includes a plurality of pins, the plurality of pins are parallel to each other, and the plurality of pins are sequentially arranged in a first direction of the support substrate, and the first direction is the width direction of the support substrate; A plurality of bonding wires, the plurality of bonding wires are connected between the first conductive layer and the second conductive layer, and the number of the plurality of bonding wires is the same as the number of the pins; In the first direction, the pin assembly has a first center point, and in the first direction, the projection of the plurality of bonding wires in the thickness direction of the support substrate has a second center point. The included angle between the connection line of the first center point and the second center point and a second direction is β, satisfying the relationship: β < 9°, and the second direction is the length direction of the support substrate.

2. The power module according to claim 1, wherein Further comprising: One of the first conductive layer and the second conductive layer is provided with the chip, and the plurality of bonding wires are connected between the chip and the conductive layer without the chip.

3. The power module according to claim 1, characterized in that Further comprising: Both the first conductive layer and the second conductive layer are provided with the chip, and the plurality of bonding wires are connected between the chip on the first conductive layer and the chip on the second conductive layer.

4. The power module according to claim 1, characterized in that At least two adjacent pins among the plurality of pins are sequentially spaced apart in the first direction.

5. The power module according to claim 1, characterized in that, In the first direction, the spacing distance between the first center point and the second center point is H1, and the width of the pin assembly is H2, satisfying the relationship: H1 < 50%H2.

6. The power module according to claim 2 or 3, characterized in that, The plurality of bonding wires are parallel to each other and are sequentially spaced apart in the first direction of the support substrate.

7. The power module according to claim 2 or 3, characterized in that, The plurality of bonding wires correspond to the plurality of pins one by one in the second direction of the support substrate.

8. The power module according to claim 7, characterized in that, The pin and its corresponding bonding wire are located in the same plane.

9. The power module according to claim 1, characterized in that, The plurality of pins are all perpendicular to the support substrate and extend in the thickness direction of the support substrate.

10. A household electrical appliance, characterized in that, Comprising the power module according to any one of claims 1-9.

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