Directional coupler and electronic device having the same

Abstract

A directional coupler and an electronic device having the directional coupler according to various embodiments are provided. The directional coupler includes: a first layer, the first layer having at least one conductive portion; a second layer, the second layer being disposed adjacent to the first layer in a first direction and having at least one conductive plate corresponding to the conductive portion of the first layer; a third layer, the third layer being disposed adjacent to the second layer in the first direction and including an RF signal transmission line; a fourth layer, the fourth layer being disposed adjacent to the third layer in the first direction and having a conductive wire wound at least once; and at least one conductive path, the at least one conductive path electrically connecting the at least one conductive plate of the second layer and the conductive wire wound at least once of the fourth layer.

Description

Technical Field

[0001] The present disclosure relates to a directional coupler and an electronic device having the directional coupler. Background Art

[0002] The electronic device can perform communication with the base station, thereby providing a wireless communication network via the communication components included in the electronic device. In recent years, the electronic device has been manufactured to be smaller and thinner, and / or has been integrated, and the frequency band frequency utilized by the communication components included in the electronic device has been gradually manufactured to be higher and narrower.

[0003] Among the communication components included in the electronic device, the directional coupler is used to divide the transmitted signal at a fixed ratio. For example, the directional coupler samples a fixed amount of signal from the output transmitted from the amplifier of the transmitting end of the wireless communication circuit, and sends the sampled signal to the automatic output regulator, thereby always enabling the output with a fixed amplitude to be transmitted to the outside via the antenna. Summary of the invention

[0004] Technical issues

[0005] A conventional directional coupler is generally mounted on the surface of a board included in an electronic device. For example, a plurality of electronic components may be mounted on the board of the electronic device, and the directional coupler may also be mounted on the surface of the board. When the directional coupler is mounted on the surface of the board, the directional coupler occupies the internal space of the electronic device in proportion to its volume. In order to protect the directional coupler from electromagnetic influences of external electronic components, the electronic device may additionally include a shielding can covering the directional coupler. The sampling accuracy using the directional coupler may be increased, but the internal space of the electronic device may be further reduced.

[0006] The directional coupler may include a passive element such as a capacitor or an inductor. When the capacitor or the inductor is mounted on a board, the capacitor or the inductor occupies a considerable internal space of the electronic device, and thus it may be difficult to make the electronic device smaller, thinner, and / or integrated.

[0007] In addition, the directional coupler outputs a signal coupled with a signal input through an input terminal of the communication circuit. If isolation is not sufficiently ensured in this process, this may have an adverse effect on communication performance. The isolation of the directional coupler can be determined based on a structural aspect according to the arrangement between the conductor and the dielectric constituting the directional coupler, and thus the arrangement of the components included in the directional coupler can become an important factor in determining performance.

[0008] Solution to the problem

[0009] The present disclosure is directed to address at least the above-mentioned disadvantages and to provide at least the advantages described below.

[0010] According to one aspect of the present disclosure, a directional coupler is provided. The directional coupler includes: a first layer, the first layer is configured to include at least one conductive portion; a second layer, the second layer is disposed adjacent to the first layer in a first direction and is configured to include at least one conductive plate overlapping the at least one conductive portion of the first layer; a third layer, the third layer is disposed adjacent to the second layer in the first direction and is configured to include at least one RF signal transmission line; a fourth layer, the fourth layer is disposed adjacent to the third layer in the first direction and is configured to include a conductive wire wound at least once; and at least one conductive path, the at least one conductive path is configured to electrically connect the at least one conductive plate of the second layer and the conductive wire wound at least once of the fourth layer. The first layer, the second layer, the third layer and the fourth layer are configured to form at least a portion of a printed circuit board.

[0011] According to one aspect of the present disclosure, an electronic device is provided. The electronic device includes: at least one board; at least one antenna; a transceiver; a directional coupler configured to extract at least some of the signals output from the at least one antenna and send a coupled signal to the transceiver; a processor; and a memory, the memory being operably connected to the processor. The directional coupler includes: a first layer, the first layer including at least one conductive portion; a second layer, the second layer being disposed adjacent to the first layer in a first direction and including at least one conductive plate at least partially overlapping the at least one conductive portion of the first layer; a third layer, the third layer being disposed adjacent to the second layer in the first direction and including at least one RF signal transmission line; a fourth layer, the fourth layer being disposed adjacent to the third layer in the first direction and including a conductive wire wound at least once; and at least one conductive path, the at least one conductive path being configured to electrically connect the at least one conductive plate of the second layer and the conductive wire wound at least once of the fourth layer. The first layer, the second layer, the third layer, and the fourth layer are configured to form at least a portion of at least one board.

[0012] According to one aspect of the present disclosure, a printed circuit board is provided. The printed circuit board includes: a first layer, the first layer is configured to include at least one conductive portion; a second layer, the second layer is disposed adjacent to the first layer in a first direction and is configured to include at least one conductive plate at least partially overlapping the at least one conductive portion of the first layer; a third layer, the third layer is disposed adjacent to the second layer in the first direction and is configured to include at least one RF signal transmission line; a fourth layer, the fourth layer is disposed adjacent to the third layer in the first direction and is configured to include a conductive wire wound at least once; and at least one conductive path, the at least one conductive path being configured to electrically connect the at least one conductive plate of the second layer and the conductive wire wound at least once of the fourth layer.

[0013] Advantageous Effects of the Invention

[0014] According to various embodiments of the present disclosure, passive elements such as capacitors and inductors are formed on the board, thereby reducing the space occupied by the passive elements when they are mounted on the board to increase space efficiency. As another effect produced by arranging the passive elements on the board, an effect can be produced that can ensure the durability of the product so as not to apply an impact to the electronic device from the outside or to damage the components in the event of dropping and assembly / disassembly.

[0015] According to various embodiments of the present invention, a directional coupler having a new structure that has excellent insertion loss characteristics and excellent isolation characteristics and can support a wide band, and a printed circuit board implementing the directional coupler can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0017] Figure 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment;

[0018] Figure 2 is a block diagram of an antenna, a wireless communication circuit and its periphery included in an electronic device according to an embodiment;

[0019] Figure 3 is a diagram of a circuit of a directional coupler according to an embodiment;

[0020] Figure 4 is a top view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment;

[0021] Figure 5 is an exploded perspective view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment;

[0022] Figure 6 is a cross-sectional view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment;

[0023] Figure 7 is a top view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment;

[0024] Figure 8 is an exploded perspective view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment;

[0025] Fig. 9 is a cross-sectional view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment;

[0026] Fig.10 is a top view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment;

[0027] Fig.11 is a cross-sectional view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment;

[0028] Fig.12 is a top view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment;

[0029] Fig.13 is a cross-sectional view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment;

[0030] Fig.14 is a diagram of a directional coupler to which an external matching element is additionally coupled according to an embodiment;

[0031] Fig.15 is a graph showing isolation performance of a directional coupler before adding external matching elements according to an embodiment;

[0032] Fig.16 is a graph showing isolation characteristics of a directional coupler to which an external matching element is added according to an embodiment; and

[0033] Fig.17 is a graph showing isolation characteristics of a directional coupler to which an external matching element is added according to an embodiment. DETAILED DESCRIPTION

[0034] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment.

[0035] Reference Figure 1, the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit.For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0036] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0037] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123.

[0038] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0039] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0040] The input device 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0041] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as a part of the speaker.

[0042] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0043] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0044] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0045] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0046] The connection end 178 may include a connector via which the electronic device 101 may be physically connected to an external electronic device (e.g., the electronic device 102). According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0048] The camera module 180 may capture still images or moving images. According to embodiments, the camera module 180 may include one or more lenses, image sensors, ISPs, or flashes.

[0049] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module #88 may be implemented as at least a part of a power management integrated circuit (PMIC), for example.

[0050] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0051] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more CPs that can operate independently with the processor 120 (e.g., AP) and support direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0052] The antenna module 197 may transmit a signal or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive a signal or power from the outside of the sub-device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element, and the radiating element is formed of a conductive material or a conductive pattern formed in a substrate (e.g., a PCB) or formed on a substrate. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas, for example, by the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as a part of the antenna module 197.

[0053] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and transmit signals (e.g., commands or data) therebetween.

[0054] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing, distributed computing, or client-server computing bases may be used.

[0055] Figure 2 is a block diagram of an antenna, a wireless communication circuit, and its periphery included in an electronic device according to an embodiment.

[0056] Reference Figure 2 , the electronic device 200 may include, for example Figure 1 All or some components of the electronic device 101 shown in FIG.

[0057] The electronic device 200 may include at least one antenna 210, a wireless communication circuit 220 (eg, Figure 1 communication module 190), directional coupler 230, processor 240 (eg, Figure 1 processor 120) and / or memory 250 (e.g., Figure 1 The wireless communication circuit 220 may include a transceiver 221, a power amplifier module 222 and / or a front-end module 223.

[0058] The transceiver 221 may convert the data received from the processor 240 into an RF signal (e.g., a transmitter (Tx) signal) and output it to the front-end module 223 through the power amplifier module 222 (e.g., a power amplifier (PAM)). In addition, the transceiver 221 may convert the RF signal (e.g., a receiver (Rx) signal) received from the front-end module 223 into decodable digital data and transmit it to the processor 240.

[0059] The power amplifier module 222 may include a power amplifier 222a or a low noise amplifier 222b. The power amplifier 222a may amplify an RF signal (e.g., a Tx signal) received from the transceiver 221 and send it to the front end module 223. The low noise amplifier 222b may amplify an RF signal (e.g., an Rx signal) received from at least one antenna 210 through the front end module 223 while minimizing noise and send it to the transceiver 221. The amplification factor of the power amplifier 222a or the low noise amplifier 222b may be determined by the amplitude of its energy source (e.g., voltage or current). The processor 240 adjusts the amplitude of the power supply (voltage or current), thereby changing the amplification factor.

[0060] The front-end module 223 may perform power division. The front-end module 223 may be used to divide power between at least two or more antennas. The front-end module 223 may perform signal division. The front-end module 223 may divide and output the transmitted / received signal. The front-end module 223 may output the RF signal (e.g., Tx signal) received from the transceiver 221 to at least one antenna 210, and output the RF signal (e.g., Rx signal) received from the at least one antenna 210 to the transceiver 221.

[0061] The directional coupler 230 may perform power extraction. The directional coupler 230 may extract a forward coupling signal T1 having the same waveform and a power lower than the power of the RF signal (e.g., -30 dBm in the case where the RF signal power is 0 dBm) from the RF signal output from the at least one antenna 210, and transmit it to the transceiver 221. Meanwhile, due to the impedance difference between the at least one antenna 210 and the front-end module 223, the RF signal may not be radiated through the at least one antenna 210 without change (without power loss), and experience a return loss between the at least one antenna 210 and the front-end module 223. If the RF signal is output from the front-end module 223 to the at least one antenna 210, a reflected signal may be generated due to the impedance difference between the at least one antenna 210 and the front-end module 223, and the reflected signal may be transmitted to the front-end module 223.

[0062] The directional coupler 230 may extract a reverse coupling signal T2 having the same waveform and a power lower than that of the reflected signal (e.g., -30 dBm when the reflected signal power is 0 dBm) from the reflected signal, and transmit it to the transceiver 221. The directional coupler 230 may transmit the signal received through the at least one antenna 210 together with the signal not output and reflected by the at least one antenna 210 to the transceiver 221 through the reverse coupling signal T2. The transceiver 221 may output values ​​(e.g., power values ​​and voltage values) corresponding to the forward coupling signal T1 and the reverse coupling signal T2 to the processor 240.

[0063] The directional coupler 230 may include a first port 231 and a second port 232. The first port 231 and the second port 232 may correspond to an RF input port and an RF output port, respectively, or may correspond to an RF output port and an RF input port, respectively. When the directional coupler 230 receives an RF signal from at least one antenna 210, the first port 231 may be an RF input port, and the second port 232 may be an RF output port. When the directional coupler 230 receives an RF signal from the front-end module 223, the second port 232 may be an RF input port, and the first port 231 may be an RF output port.

[0064] The load impedance between at least one antenna 210 and the directional coupler 230 may have a prescribed difference from the characteristic impedance of the directional coupler 230. Although not shown, an impedance tuning circuit (impedance matching circuit) that adjusts the load impedance to be as close as possible to the characteristic impedance may be additionally provided.

[0065] The processor 240 may include one or more of a CPU, an AP, or a CP. The processor 240 may be, for example, a device that performs operations or data processing related to control and / or communication of at least one or more other components of the electronic device 200. The processor 240 may be electrically connected to other components (e.g., the transceiver 221, the power amplifier module 222, and / or the directional coupler 230), may control the other components, and may perform various data processing and operations.

[0066] The memory 250 may be operably connected to the processor 240. When executed, the memory 250 may store instructions that cause the processor to control other components electrically connected to the processor (e.g., the transceiver 221, the power amplifier module 222, and / or the directional coupler 230) and perform various data processing and operations. The memory 250 may store compensation values ​​for adjusting the load impedance to be as close to the characteristic impedance as possible.

[0067] The processor 230 may calculate the reflection coefficient of the antenna 210 using the values ​​corresponding to the forward coupling signal T1 and the reverse coupling signal T2 and received from the transceiver 221, and obtain a phase value. The processor 240 may compare the obtained phase value with a reference value (reference phase information) recorded in a lookup table of the memory 250, for example, and obtain a phase difference (e.g., a phase difference with a reference group). The phase difference (e.g., a RF performance deviation relative to a reference group) may be compensated by various embodiments.

[0068] Figure 3 is a diagram of a circuit of a directional coupler according to an embodiment.

[0069] Directional coupler 300 (eg, Figure 2 The directional coupler 230) can be configured to utilize coupling, a phenomenon in which AC signal energy is electromagnetically transmitted between independent spaces or lines.

[0070] like Figure 2 As mentioned in , the directional coupler 230 performs power extraction, and the front-end module 223 is used to perform power division. However, including Figure 3 Directional couplers 300 , 400 , 500 , 600 , 700 , and 800 to be described below of the embodiments shown in may include directional couplers that may be used to perform power extraction and power division.

[0071] The directional coupler 300 may include a unidirectional coupler or a bidirectional coupler according to an embodiment.

[0072] Reference Figure 3 The directional coupler 300 may include an RF input / output line 310 . The directional coupler 300 may be configured to be coupled to the RF input / output line 310 , and may include a first directional coupler 320 and a second directional coupler 330 .

[0073] The unidirectional coupler may include one selected from the first directional coupler 320 or the second directional coupler 330 .

[0074] In contrast, the bidirectional coupler may include a first directional coupler 320 and a second directional coupler 330. The first directional coupler 320 and the second directional coupler 330 may share a single RF input / output line 310.

[0075] The RF input / output line 310 may include an RF input port P1 and an RF output port P4, and may include at least one passive element (e.g., inductors 311 and 312) between the RF input port P1 and the RF output port P4. The first directional coupler 320 may include a capacitor 321 between the RF input / output line 310 and the first coupling port P2, and an inductor 322 between the first coupling port P2 and the first terminal port P3. The capacitor 321 and the inductor 322 included in the first directional coupler 320 may be electromagnetically connected to the RF signal transmitted along the RF input / output line 310, and generate a coupling signal (e.g., a forward coupling signal T1 and / or a reverse coupling signal T2).

[0076] The second directional coupler 330 may include a capacitor 331 between the RF input / output line 310 and the second coupling port P5 and an inductor 332 between the second coupling port P5 and the second terminal port P6. The capacitor 331 and the inductor 332 included in the second directional coupler 330 may be electromagnetically connected to the RF signal transmitted along the RF input / output line 310 and generate a coupled signal. Hereinafter, for convenience, a bidirectional coupler sharing a single RF input / output line 310 will be used for description, such as Figure 3 However, it is noted that the scope of the present disclosure is not necessarily limited thereto.

[0077] Can be made public Figure 3 The directional coupler 300 shown in FIG. 1 includes components included in the structure of the directional coupler embedded in a board.

[0078] Figure 4 is a top view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment. Figure 5 is an exploded perspective view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment. Figure 6 is a cross-sectional view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment.

[0079] Reference Figures 4 to 6 , the directional coupler 400 may have a form in which it is embedded in a multilayer board. Embedding the directional coupler 400 in a multilayer board may include another example in which the elements included in the directional coupler 400 form at least a portion of a printed circuit board (PCB). Embedding the directional coupler 400 in a multilayer board may include another example in which the PCB has the function of the directional coupler 400.

[0080] Reference Figure 4 The board in which the directional coupler 400 is embedded may be a multi-layer board, for example, a board including a first layer 410 , a second layer 420 , a third layer 440 , and a fourth layer 450 .

[0081] The first layer 410 may include at least one conductive portion. The second layer 420 may be disposed in a first direction (eg, Figure 5 The third layer 440 may be disposed adjacent to the second layer 420 in the first direction and include at least one of the RF signal transmission lines 444 and / or 446. The fourth layer 450 may be disposed adjacent to the third layer 440 in the first direction and include conductive lines each wound at least one turn.

[0082] The first layer 410 may include a first plate portion 411 formed of, for example, a conductor. The first layer 410 may include at least one conductive portion (eg, a first conductive portion 411a and / or a second conductive portion 411b). The conductive portion may correspond to a portion of an area included in the first plate portion 411. Figure 4 As shown in FIG. 4 , when viewed in the first direction, the first conductive portion 411a and / or the second conductive portion 411b may correspond to a specific partial area of ​​the first plate portion 411 overlapping the conductive plates 424 and 426 of the second layer 420. The first conductive portion 411a and / or the second conductive portion 411b may correspond to the first conductive plate 424 and / or the second conductive plate 426 of the second layer 420 to be described below, and operate as a capacitor.

[0083] At least one conductive path 412' for electrical connection with another adjacent layer (eg, second layer 420) may be formed in first plate portion 411. At least one opening 413 (or a cut-and-fill portion) may be provided in first layer 410. At least one opening 413 may be filled with an insulator.

[0084] The second layer 420 may include a second plate portion 421 formed of a conductor, for example, and at least one of conductive paths 422 and 422 ′ for electrical connection with other adjacent layers (eg, the first layer 410 and / or the third layer 440 ) may be formed in the second plate portion 421 .

[0085] An opening 423 may be formed in the second layer 420. The second plate portion 421 may be formed around the opening 423 to at least partially surround the opening 423, and the opening 423 is provided so that the conductive plates 424 and 426 may be electrically disconnected from the second plate portion 421. The opening 423 may be divided into a first opening region 423a in which the conductive paths 425 and 427 are located and a second opening region 423b in which the conductive plates 424 and 426 are located.

[0086] The conductive plates 424 and 426 included in the second layer 420 may refer to conductor plates included in a capacitor. The conductive plates 424 and 426 included in the second layer 420 may include a metal plate and are arranged in a first direction (eg, parallel to Figure 5 The conductive plates 424 and 426 included in the second layer 420 may have a specific area for realizing a capacitor.

[0087] When the first layer 410 and the second layer 420 overlap each other, the first and second conductive portions 411 a and 411 b of the first layer 410 may be formed to be spaced apart from the conductive plates 424 and 426 disposed on the second layer 420 by a prescribed distance.

[0088] when Figure 4 When the directional coupler 400 shown in FIG. 4 is a bidirectional coupler, the second layer 420 may include a first conductive plate 424 and a second conductive plate 426. The first conductive plate 424 may include a first conductive plate portion 424a, a first capacitor terminal portion 424b, and / or a first extension portion 424c extending to one side of the first conductive plate portion 424a. The second conductive plate 426 may include a second conductive plate portion 426a, a second capacitor terminal portion 426b, and / or a second extension portion 426c extending to one side of the second conductive plate portion 426a. The first capacitor terminal portion 424b and the second capacitor terminal portion 426b may be formed with Figure 3 The first extension portion 424c and the second extension portion 426c may be connected to conductive paths 425 and 427, which are configured so that the first conductive plate 424 and the second conductive plate 426 may be electrically connected to conductive wires of the fourth layer 450 (described below) each wound at least once.

[0089] Reference Figure 4 , in the second layer 420, the first conductive plate 424 and the second conductive plate 426 and / or the conductive paths 425 and 427 may be separated from the second plate portion 421 and formed like an island structure. The first elongated portion 424c of the first conductive plate 424 included in the second layer 420 is connected to the conductive path 425, and the second elongated portion 426c of the second conductive plate 426 is connected to the conductive path 427. These components may be set in a state where they are separated from the second plate portion 421.

[0090] The opening 423 may be filled with an insulator to at least partially surround the first conductive plate 424 and the second conductive plate 426 and / or the conductive paths 425 and 427. The insulator may support the first conductive plate 424 and the second conductive plate 426 and / or the conductive paths 425 and 427. By forming a structure in which the first conductive plate 424 and the second conductive plate 426 may be electrically disconnected from the second plate portion 421 using the insulator, isolation of the directional coupler 400 may be ensured.

[0091] An insulator may be provided between the first layer 410 and the second layer 420. The directional coupler 400 may have a high-k film provided adjacent to the first conductive plate 424 and the second conductive plate 426. Additionally or alternatively, a high-k film is provided on the first conductive plate portion 424a and / or the second conductive plate portion 426a, whereby a specific capacitance may be easily ensured.

[0092] When a capacitor is implemented together with the first layer 410 and the second layer 420, the opening 413 formed in the first layer 410 may be provided to change the isolation characteristics. Compared with the embodiment without the opening 413, providing the opening 413 in the first layer 410 may facilitate isolation adjustment.

[0093] The third layer 440 may include a third plate portion 441 formed of, for example, a conductor, and at least one conductive path 442 for electrical connection with other adjacent layers (eg, the second layer 420 and / or the fourth layer 450 ) may be formed in the third plate portion 441 .

[0094] An opening 443 (or a cut-and-fill portion) may be formed in the third layer 440. A third plate portion 441 may be formed around the opening 443 to at least partially surround the opening 443. The opening 443 may be divided into a third opening region 443a in which the conductive paths 445 and 447 of the third layer 440 are located and a fourth opening region 443b in which the RF signal transmission lines 444 and 446 are disposed.

[0095] The RF signal transmission lines 444 and 446 included in the third layer 440 may be Figure 3 The RF input / output line 310 corresponds to the part. Figure 4 , for convenience of description, the RF signal transmission lines 444 and 446 included in the third layer 440 are given two reference numerals, but may be substantially one signal transmission line.

[0096] like Figure 4As shown in FIG. 4 , the RF signal transmission lines 444 and 446 included in the third layer 440 may include bent portions 444a and 446a and terminal portions 444b and 446b. The bent portions 444a and 446a may be formed at positions corresponding to the conductive plates (e.g., the first conductive plate 424 and / or the second conductive plate 426) disposed on the second layer 420 in the opening 443 (e.g., the fourth opening region 443b).

[0097] Portions of the RF signal transmission lines 444 and 446 may overlap at least portions of the conductive plates 424 and 426 of the second layer 420. Portions of the RF signal transmission lines 444 and 446 (e.g., at least portions of the bent portions 444a and 446a) may be formed to overlap with conductive plates (e.g., the first conductive plate 424 and / or the second conductive plate 426) disposed on the second layer 420 when viewed in the first direction. The terminal portions 444b and 446b are formed to overlap with the conductive plates 424 and 426 disposed on the second layer 420. Figure 3 The RF signal transmission lines 444 and 446 are located in the third layer 440 to be separated from the conductive paths 445 and 447. When the bidirectional coupler 400 is applied, the RF signal transmission lines 444 and 446 may have a form in which they extend to pass through the space between the two conductive paths 445 and 447.

[0098] The conductive paths 445 and 447 formed in the third layer 440 may be portions from which the conductive paths 425 and 427 of the second layer 420 are extended.

[0099] The conductive paths 445 and 447 formed in the third layer 440 are formed to be separated from the RF signal transmission lines 444 and 446 by a prescribed distance, thereby making it possible to improve isolation.

[0100] The RF signal transmission lines 444 and 446 are formed in the third layer 440 to have a minimum length for coupling with the directional coupler 400, which can minimize the attenuation of the RF signal. Forming the RF signal transmission lines 444 and 446 to have a minimum length for coupling with the directional coupler 400 may mean that the RF signal transmission lines 444 and 446 are formed as short as possible in the third layer 440. Forming the RF signal transmission lines 444 and 446 to have a minimum length for coupling with the directional coupler 400 may mean that, as shown in FIG. Figure 4 As shown in FIG, RF signal transmission lines 444 and 446 extend linearly in the space between two conductive paths 445 and 447. The fourth layer 450 may include a fourth board portion 451 formed of a conductor, and at least one of conductive paths 452 and 452' for electrical connection with another adjacent layer (e.g., the third layer 440) may be formed in the fourth board portion 451.

[0101] The opening 453 (or the cut-and-fill portion) may be formed in the fourth layer 450. The fourth plate portion 451 may be formed around the opening 453 to at least partially surround the opening 453, and the opening 453 is provided so that the fifth plate portion 451 provided on the fourth layer 450 and the conductive line may be electrically disconnected from each other. The opening 453 may be divided into a fifth opening region 453a in which the conductive paths 455 and 457 are located and a sixth opening region 453b in which the conductive line is located.

[0102] At least one conductive wire included in the fourth layer 450 may be intended to implement an inductor. The conductive wire may be wound at least one turn (or a specific number of turns) to implement the inductor and form a coil.

[0103] when Figure 4 When the directional coupler 400 shown in FIG. 4 is a bidirectional coupler, the fourth layer 450 may form two inductors (e.g., a first inductor portion 454 and a second inductor portion 456) using conductive wires. The first inductor portion 454 may include a first winding portion 454a wound at least once, a first inductor terminal portion 454b, a second inductor terminal portion 454c, and / or a third extension portion 454d extending to one side of the first winding portion 454a. The second inductor portion 456 may include a second winding portion 456a wound at least once, a first inductor terminal portion 456b, a second inductor terminal portion 456c, and / or a fourth extension portion 456d extending to one side of the second winding portion 456a.

[0104] When viewed in the first direction, at least portions of the first inductor portion 454 and / or the second inductor portion 456 may be formed to overlap with the first conductive plate 424 and / or the second conductive plate 426 of the second layer 420 .

[0105] The first inductor terminal portion 454b or the second inductor terminal portion 456b may be Figure 3 The first inductor terminal portion 454c or the second inductor terminal portion 456c may be a portion corresponding to the port P2 or the port P5 described above. Figure 3 The first inductor terminal portion 454b or the first inductor terminal portion 456b may be a portion corresponding to the port P3 or the port P6 described above. Figure 3 The portion corresponding to the port P3 or the port P6 described above, and the second inductor terminal portion 454c or the second inductor terminal portion 456c may be Figure 3 The portion corresponding to the aforementioned port P2 or port P5.

[0106] The third and fourth elongated portions 454c and 456c may be connected to conductive pathways 455 and 457 provided so that the first and second inductor portions 454 and 456 may be electrically connected to the first and second conductive plates 424 and 426 of the aforementioned second layer 420, respectively.

[0107] Reference Figure 4 , in the fourth layer 450, the first inductor portion 454 and the second inductor portion 456 and / or the conductive paths 455 and 457 may be separated from the fourth plate portion 451 and formed as an island structure. The third elongated portion 454d of the first inductor portion 454 of the fourth layer 450 may be connected to the conductive path 455, and the fourth elongated portion 456d of the second inductor portion 456 may be connected to the conductive path 457. By forming a structure in which the first inductor portion 454 and the second inductor portion 456 may be electrically disconnected from the fourth plate portion 451, isolation of the directional coupler 400 may be ensured.

[0108] The layer forming the capacitor and the layer forming the inductor may be formed nearby, and the layer on which the RF signal transmission line is formed may be arranged outside these layers. The layer forming the inductor may be arranged between the layer forming the capacitor and the RF signal transmission line. In this case, since the inductor is located between the RF signal transmission line and the capacitor, a specific coupling efficiency cannot be easily ensured.

[0109] The directional coupler 400 may include a first layer 410 and a second layer 420 forming a capacitor and a fourth layer 450 forming an inductor, and a third layer 440 having an RF signal transmission line may be disposed between the layer forming the capacitor and the fourth layer 450. If a layer (e.g., the third layer 440) on which the RF signal transmission line is formed is disposed between a layer (e.g., the first layer 410 and the second layer 420) forming a capacitor and a layer (e.g., the fourth layer 450) forming an inductor, the capacitor and the inductor are disposed on both sides based on the RF signal transmission line, and thus a directional coupler 400 capable of ensuring better coupling efficiency may be provided.

[0110] A spacer layer 430 having at least one opening 433 may also be disposed between the second layer 420 and the third layer 440 .

[0111] The spacer layer 430 may include a spacer plate portion 431 formed of a conductor, and at least one conductive via 432 for electrical connection with other adjacent layers (eg, the second layer 420 and / or the third layer 440 ) may be formed in the spacer plate portion 431 .

[0112] An opening 433 (or a cut-and-fill portion) may be formed in the spacer layer 430. A spacer plate portion 431 may be formed around the opening 433 to at least partially surround the opening 433. The spacer layer 430 may serve as a component disposed between the second layer 420 and the third layer 440, and may be a component for ensuring isolation of the directional coupler 400. The opening 433 formed in the spacer layer 430 may be divided into a seventh opening region 433a and an eighth opening region 433b, in which the conductive paths 435 and 437 are located, and in which the eighth opening region 433b is located at a portion corresponding to the conductive plates 424 and 426 of the second layer 420 (or a portion corresponding to the RF signal transmission line of the fourth layer 440).

[0113] The eighth opening region 433b of the spacer layer 430 may be formed at a position corresponding to at least one of the conductive plates 424 and 426 of the second layer 420. Figure 4 As shown in FIG. 4 , the eighth opening region 433 b is formed only at a position corresponding to the second conductive plate 426. This is merely a design based on giving priority to a coupling signal in one direction (e.g., a forward coupling signal T1 or a reverse coupling signal T2) in the bidirectional coupler 400, and does not particularly limit the claims of various embodiments of the present disclosure.

[0114] The conductive paths 435 and 437 may be disposed in the seventh opening region 433a of the spacer layer 430. The conductive paths 435 and 437 disposed in the seventh opening region 433a may be portions formed to extend from (or be integrated with) the conductive paths 425 and 427 of the second layer 420. The spacing distance between the conductive paths 435 and 437 and the spacer plate portion 431 and / or the size of the seventh opening region 433a is appropriately adjusted, thereby ensuring the isolation desired by the user.

[0115] exist Figure 4 4 shows that the seventh opening region 433a is provided at two places on the spacer plate portion 431, and the eighth opening region 433b is provided at one place on the spacer plate portion 431, but the present disclosure is not necessarily limited thereto. The number of the seventh opening region 433a and the eighth opening region 433b, their sizes and / or their positions may be configured differently according to the specifications of the directional coupler 400.

[0116] When an RF signal is applied to the RF signal transmission lines 444 and 446, coupling based on electromagnetic induction or resonance is generated at the capacitors and / or inductors, and the RF signal transmission line may be attenuated due to the capacitance component of the adjacent capacitors and / or the inductance component of the adjacent inductors. Compared with the inductance component related to the change of current over time, the capacitance component related to the change of voltage over time has a greater impact on the attenuation of the RF signal transmission line. Therefore, the spacer layer 430 is provided between one of the layers (the second layer 420) and the third layer 440 that implement the capacitor, thereby effectively preventing the attenuation of the RF signal.

[0117] Refer to Figure 5 and Figure 6 , showing that the first layer 410, the second layer 420, the spacer layer 430, the third layer 440 and / or the fourth layer 450 are arranged side by side in a first direction (e.g., a direction parallel to the -Z axis). When actually embedded in a PCB, the first layer 410, the second layer 420, the spacer layer 430, the third layer 440 and / or the fourth layer 450 may be formed as part of a multilayer board (e.g., a daughter board) included in the PCB.

[0118] The second layer 420, the spacer layer 430, the third layer 440, and / or the fourth layer 450 include a conductive path 402 connecting the second plate portion 421, the spacer plate portion 431, the third plate portion 441, and / or the fourth plate portion 451, and may also include conductive paths 405 and 407 separated from the conductive path 402. The conductive plates 424 and 426 and the inductor portions 454 and 456 disposed in different layers from each other may be electrically connected through the conductive paths 405 and 407.

[0119] Reference Figure 6 , showing that the first layer 410, the second layer 420, the spacer layer 430, the third layer 440 and / or the fourth layer 450 are laminated nearby. The directional coupler 400 may include Figure 4 The various exemplary vias shown in the figure serve as members connecting multiple layers, and may also include another connecting member or interlayer member (eg, an insulator) not shown in the figure as a supplement or replacement thereof.

[0120] Refer to Figures 4 to 6, when the directional coupler 400 is formed as a bidirectional coupler, it can be confirmed that the components included in the bidirectional coupler 400 are formed in a mirror type inside the multilayer board. The components included in the directional coupler 400 (e.g., the conductive plates 424 and 426, the RF signal transmission lines 444 and 446, and / or the inductor parts 454 and 456) can be formed symmetrically with respect to a virtual line drawn on some layers inside the board (or PCB) in one direction. The first conductive plate 424 and the second conductive plate 426 included in the second layer 420 of the directional coupler 400 can have a symmetrical shape on both sides (e.g., the left side and the right side) with respect to a virtual line drawn on the second layer 420 in one direction (e.g., a virtual line connecting the conductive path 425 and the conductive path 427).

[0121] Passive elements such as capacitors or inductors are embedded in the board, thereby increasing space efficiency. In addition, a directional coupler having good isolation characteristics even in a state of being embedded in the board can be provided.

[0122] Figure 7 is a top view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment. Figure 8 is an exploded perspective view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment. Fig. 9 is a cross-sectional view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment.

[0123] Disclosed based on Figures 4 to 6 Here, the board in which the directional coupler 500 is embedded may be a multilayer board, and may be, for example, a board including a first layer 510, a second layer 520, a third layer 540, and a fourth layer 550, and in addition to them, at least one other layer (e.g., a fifth layer 560).

[0124] The first layer 510 (e.g., Figure 4 The first layer 410) may include at least one conductive portion. The second layer 520 (eg, Figure 4 The second layer 420) can be arranged in a first direction (eg, parallel to Figure 8 The conductive plates 524 and 526 are disposed adjacent to the first layer 510 in the -Z direction of the first direction and may include conductive plates 524 and 526 (eg, conductive plates 524 and 526) at least partially overlapping the conductive portions of the first layer 510 when viewed in the first direction. Figure 4 The spacer layer 530 (e.g., Figure 4 The spacer layer 430 may be disposed adjacent to the second layer 520 in the first direction and may include at least one opening 533 (eg, Figure 4 The third layer 540 (e.g., Figure 4 The third layer 440 of the embodiment may be disposed adjacent to the spacer layer 530 in the first direction and may include RF signal transmission lines 544 and 546 (eg, Figure 4 The fourth layer 550 (e.g., Figure 4 The fourth layer 450 of the embodiment may be disposed adjacent to the third layer 540 in the first direction and may include conductive wires (eg, Figure 4 Hereinafter, the Figures 4 to 6 The description of the embodiment is repeated.

[0125] The directional coupler 500 may further include a fifth layer 560 disposed adjacent to the fourth layer 550 and including a conductive wire electrically connected to the conductive wire included in the fourth layer 550 and each wound at least one turn.

[0126] The fifth layer 560 may include a sixth plate portion 561 formed of, for example, a conductor. According to one embodiment, at least one conductive via 562' may be formed in the sixth plate portion 561 for electrical connection with another adjacent layer (for example, the fourth layer 550).

[0127] An opening 563 (or a cut-and-fill portion) may be formed in the fifth layer 560. Inductor portions 564 and 566 formed of a conductive line may be disposed in the opening 563. The sixth plate portion 561 may be formed around the opening 563 to at least partially surround the opening 563, and the opening 563 may be disposed so that the inductor portions 564 and 566 and the sixth plate portion 561 may be electrically disconnected from each other. The opening 563 may be divided into an opening region 563a formed to correspond to a region in which the conductive paths 555 and 557 of the fourth layer 550 are located, and an opening region 563b in which the inductor portions 564 and 566 are located.

[0128] The opening 563 formed in the fifth layer 560 may be provided to change the isolation characteristics of the directional coupler 500. In the fifth layer 560, providing the opening region 563b formed to correspond to the region in which the conductive path of the fourth layer 550 is located may facilitate isolation adjustment compared to an embodiment in which the opening region 563b is not provided.

[0129] when Figure 7 When the directional coupler 500 shown in FIG. 5 is a bidirectional coupler, the fifth layer 560 may include two inductor portions (eg, a first elongated inductor portion 564 and a second elongated inductor portion 566 ) electrically connected to the two inductor portions 454 and 456 formed in the fourth layer 550 .

[0130] The first elongated inductor portion 564 may include a first elongated wire 564a, a third inductor terminal portion 564b, and a via 564c for electrical connection with a conductive wire formed on the fourth layer 550. The first elongated wire 564a may be wound at least one turn.

[0131] The second elongated inductor portion 566 may include a second elongated wire 566a, a fourth inductor terminal portion 566b, and a via 566c for electrical connection with a conductive wire formed on the fourth layer 550. Although not shown in the drawings, the second elongated wire 566a may be wound at least one turn.

[0132] The directional coupler 500 may further include a fifth layer 560 , whereby the isolation of the terminal ports (eg, the first terminal port P3 and the second terminal port P6 ) may be more finely adjusted.

[0133] Since the fifth layer 560 may be additionally provided, the fourth layer 550 may be different from Figures 4 to 6 The fourth layer 450 in the embodiment shown in FIG. Figures 4 to 6 In the embodiment shown in , the first inductor portion 454 of the fourth layer 450 may include a first winding portion 454a, a first inductor terminal portion 454b, a second inductor terminal portion 454c and / or an extension portion 454d, and the second inductor portion 456 may include a second winding portion 456a, a first inductor terminal portion 456b, a second inductor terminal portion 456c and / or an extension portion 456d. Figures 4 to 6 In the embodiment shown in FIG. 4 , in the fourth layer 450 of the directional coupler 400 , the coupling port and the terminal port of the directional coupler 400 may be implemented together.

[0134] In contrast, Figures 7 to 9 In the embodiment shown in , the first inductor portion 554 of the fourth layer 550 may include a first winding portion 554a, a first inductor terminal portion 554b, a passage 554c and / or an extension portion 554d, and the second inductor portion 556 may include a second winding portion 556a, a second inductor terminal portion 556b, a passage 556c and / or an extension portion 556d.

[0135] Directional coupler 500 may further include fifth layer 560. First elongated inductor portion 564 of fifth layer 560 may include third winding portion 564a, third inductor terminal portion 564b and / or via 564c, and second elongated inductor portion 566 may include fourth winding portion 566a, fourth inductor terminal portion 566b and / or via 566c.

[0136] Reference Figures 7 to 9In the embodiment shown in FIG. 5 , the directional coupler 500 can be implemented by distinguishing the coupling port (or terminal port) formed in the fourth layer 550 and the terminal port (or coupling port) formed in the fifth layer 560. When the directional coupler 500 includes Figures 7 to 9 When an additional layer (e.g., the fifth layer 560) is added as in the embodiment of the present invention, the conductive line acting as an inductor can be substantially extended. Therefore, a directional coupler 500 capable of increasing the degree of design freedom, providing excellent isolation, and supporting a wide bandwidth can be provided.

[0137] Fig.10 is a top view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment. Fig.11 is a cross-sectional view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment.

[0138] The board in which the directional coupler 600 is embedded may be a multi-layer board and may include, for example, a first layer 610, a second layer 620, a spacer layer 630, a third layer 640, a fourth layer 650, or a fifth layer 660, and in addition to them, at least one of other layers (e.g., a first ground layer 670 and / or a second ground layer 680). Figure 10 to Figure 11 , as an example, an embodiment in which a directional coupler 600 having a first layer 610, a second layer 620, a spacer layer 630, a third layer 640, a fourth layer 650 and a fifth layer 660 are formed and additionally includes a first ground layer 670 and / or a second ground layer 680 is shown.

[0139] The first layer 610 (e.g., Figure 4 The first layer 410 of the embodiment may include at least one conductive portion. The second layer 620 (eg, Figure 4 The second layer 420 of the present invention may be disposed adjacent to the first layer 610 in the first direction (e.g., a direction parallel to the -Z axis), and may include at least one of the conductive plates 524 and 426 that at least partially overlaps the conductive portion of the first layer 610 when viewed in the first direction. The spacer layer 630 (e.g., Figure 4 The spacer layer 430 may be disposed adjacent to the second layer 620 in the first direction and may include at least one opening 633 (eg, Figure 4 In addition, the third layer 640 (e.g., Figure 4 The third layer 440 of the embodiment may be disposed adjacent to the spacer layer 630 in the first direction and may include RF signal transmission lines 644 and 646 (eg, Figure 4 The fourth layer 650 (e.g., Figure 4The fourth layer 450) may be disposed adjacent to the third layer 640 in the first direction and may include conductive wires each wound at least one turn.

[0140] The directional coupler 600 may further include a fifth layer 660 disposed adjacent to the fourth layer 650 and including a conductive wire electrically connected to the conductive wire included in the fourth layer 650 and each wound at least one turn.

[0141] In the following, the Figures 4 to 9 The description of the embodiment is repeated.

[0142] The directional coupler 600 may further include a first ground layer 670 disposed adjacent to the first layer 610 in a second direction (a direction parallel to the Z axis) opposite to the first direction (a direction parallel to the −Z axis).

[0143] The first ground layer 670 may be included in the PCB. For example, the first ground layer 670 may include a seventh board portion 671 formed of a conductor, and at least one conductive path 672' may be formed in the seventh board portion 671 for electrical connection with another adjacent layer (eg, the first layer 610).

[0144] The directional coupler 600 may further include a second ground layer 680 disposed adjacent to the fifth layer 660 in the first direction (a direction parallel to the −Z axis).

[0145] The second ground layer 680 may be included in the PCB. The second ground layer 680 may include an eighth board portion 681 formed of a conductor, and at least one conductive path 682' may be formed in the eighth board portion 681 for electrical connection with another adjacent layer (eg, the fifth layer 660).

[0146] The directional coupler 600 further includes a first ground layer 670 and / or a second ground layer 680, thereby providing grounding on the RF signal transmission line included in the third layer 640 and interrupting electromagnetic waves introduced from the outside.

[0147] The RF signal transmission lines 644 and 646 disposed on the third layer 640 may have various forms according to the specifications required for the directional coupler 600. Fig.10 As shown in , a transmission line can be formed in which a portion (e.g., 646) of the RF signal transmission line has a longer length and more curved portions than another portion (e.g., 644).

[0148] Reference Fig.11, showing that the first ground layer 670, the first layer 610, the second layer 620, the spacer layer 630, the third layer 640, the fourth layer 650, the fifth layer 660 or the second ground layer 680 are laminated. The directional coupler 600 may include Fig.11 The vias shown in the figure serve as members connecting multiple layers, and in addition to the vias, another connecting member or interlayer member (e.g., an insulator) not shown in the figure may be included additionally or alternatively. Vias 605 or 607 as various exemplary vias may be vias for electrically connecting components for implementing capacitors and inductors. Vias 602 and 602' may be vias for electrically connecting conductive portions of each layer or adjusting a ground level. Fig.11 , an example in which various through holes are provided between a plurality of plate structures is shown, but the present disclosure is not necessarily limited thereto.

[0149] Fig.12 is a top view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment. Fig.13 is a cross-sectional view of the structure of each layer of a directional coupler embedded in a multilayer board according to an embodiment.

[0150] The board in which the directional coupler 700 is embedded may be a multi-layer board, and may be a board including the first layer 710, the second layer 720, the spacer layer 730, the third layer 740, or the fourth layer 750, and at least one other layer in addition to them. Figure 12 to Figure 13 In the figure, a second layer 720, a spacer layer 730, a third layer 740 and a fourth layer 750, a fifth layer 760, a first ground layer 770 or a second ground layer 780 are formed, and the spacer layer 730 is shown as an example to be arranged as a plurality of layers 730a, 730b and 730c.

[0151] The first layer 710 (e.g., Figure 4 The first layer 410 of the embodiment may include at least one conductive portion. The second layer 720 (eg, Figure 4 The second layer 420 of the embodiment may be disposed adjacent to the first layer 710 in the first direction (a direction parallel to the -Z axis), and may include a conductive plate (e.g., Figure 4 The spacer layer 730 (e.g., Figure 4 The spacer layer 430) may be disposed adjacent to the second layer 720 in the first direction and may include at least one opening (eg, Figure 4 In addition, the third layer 740 (e.g., Figure 4The fourth layer 750 (e.g., the fourth layer 440) may be disposed adjacent to the spacer layer 730 in the first direction and may include at least one of the RF signal transmission lines 444 and 446. Figure 4 The fourth layer 450 of the second layer 720 may be disposed adjacent to the fourth layer 740 in the first direction and may include conductive wires (e.g., conductive wires) that at least partially overlap and are each wound at least one turn with the conductive plates 424 and 426 of the second layer 720 when viewed in the first direction. Figure 4 conductive thread).

[0152] The directional coupler 700 may further include a fifth layer 760 disposed adjacent to the fourth layer 750 and including a conductive wire electrically connected to the conductive wire included in the fourth layer 750 and each wound at least one turn.

[0153] The directional coupler 700 may also include a first ground layer 770, which is arranged adjacent to the first layer 710 in a second direction (a direction parallel to the Z axis) opposite to the first direction (a direction parallel to the -Z axis), and a second ground layer 780 is arranged adjacent to the sixth layer 760 in the first direction.

[0154] In the following, the Figures 4 to 11 The description of the embodiment is repeated.

[0155] Reference Fig.12 and Fig.13 , the directional coupler 700 may include a plurality of spacer layers 730. A plurality of spacer layers 730a, 730b, and 730c may be located between the second layer 720 in which the conductive plates 424 and 426 are formed and the third layer 740 in which the RF signal transmission lines 444 and 446 are formed, and may separate the second layer 720 from the third layer 740 by a specific distance. Thus, the capacitance of the directional coupler 700 may be changed. The embedding loss characteristic and / or the isolation characteristic may be changed in response to a specific design value by changing the capacitance. The attenuation of the RF signal may be caused by the conductive plates of the second layer 720. To prevent this, a plurality of spacer layers 730a, 730b, and 730c may be disposed between the second layer 720 and the RF signal transmission line, and the embedding loss characteristic may be changed. A plurality of spacer layers 730a, 730b, and 730c may be disposed between the second layer 720 and the RF signal transmission line, and the isolation characteristic may be changed.

[0156] The number of the plurality of layers included in the spacer layer 730 is not limited to the number shown in the drawing. The spacer layer 730 may be provided in a number less or more than the number shown in the drawing.

[0157] The opening 733 formed in the spacer layer 730 may be divided into a seventh opening region 733a in which the conductive paths 435 and 437 are located and an eighth opening region 733b located at a portion corresponding to at least a portion of the conductive plates 424 and 426 of the second layer 720 or at a portion corresponding to the RF signal transmission line of the third layer 740. Here, the size, position, shape, and number of the eighth opening region 733b may be variously set in consideration of various factors including the coupling efficiency or dielectric constant of the directional coupler.

[0158] Reference Fig.13 , showing that a first ground layer 770, a first layer 710, a second layer 720, a plurality of spacer layers 730, a third layer 740, a fourth layer 750, a fifth layer 760 or a second ground layer 780 are laminated. The directional coupler 700 may include Fig.13 The various exemplary vias 705 (or 706), 702 and 702' shown in FIG. 7 serve as members connecting multiple layers, and in addition to the vias, another connecting member or interlayer member (eg, an insulator) may be included additionally or alternatively. Fig.11 The description of the embodiment is repeated.

[0159] The directional coupler 230, 300, 400, 500, 600, or 700 may be embedded on (or in) a board. In this case, each layer included in the directional coupler 230, 300, 400, 500, 600, or 700 may form at least a portion of a sub-board. Figure 3 , Figure 6 , Fig. 9 , Fig.11 and Fig.13 As shown in , in the directional coupler 300, 400, 500, 600, or 700, layers may be disposed adjacent to each other, directly grounded, and separated by a prescribed distance therebetween, and various insulators (or dielectrics) may be disposed in the spaces between the layers.

[0160] Regarding the number of layers constituting the board, the directional couplers 230, 300, 400, 500, 600, and 700 of the present disclosure are not limited to Figures 3 to 13 The embodiment shown in FIG. 1 and may be specified to have various numbers in consideration of various specifications or dielectric constants of PCBs and the available space inside electronic devices. Fig.12 and Fig.13 Increasing the number of plates can help improve the performance of the directional coupler.

[0161] In consideration of the insertion loss in the state of being embedded in the board, a directional coupler of a new structure having excellent coupling (coupling efficiency), isolation and directivity can also be provided. In addition, the space occupied by the directional coupler according to the related art can be reduced in the electronic device, thereby making it possible to more freely design the elements (e.g., conductive plates, RF signal transmission lines, and conductive lines) included in the board and replacing the existing passive elements. Thus, a directional coupler capable of covering a wide band can be provided.

[0162] Fig.14 is a diagram of a directional coupler to which an external matching element is additionally coupled according to an embodiment.

[0163] The directional coupler 800 may further include external matching elements in the first and second coupler ports P2 and P5 and / or the first and second terminal ports P3 and P6. The external matching elements may include passive elements such as resistors, inductors, or capacitors.

[0164] Reference Fig.14 , a first external matching element 810 including, for example, a resistor as a 1-1st external matching element 811 and a capacitor as a 1-2nd external matching element 812 may be connected to the first coupler port P2 of the directional coupler 800. In addition, a second external matching element 820 including a resistor as a first external matching element 821 and a capacitor as a first external matching element 822 may be connected to the second coupler port P5 of the directional coupler 800. In addition, according to one embodiment, a third external matching element 830 and a fourth external matching element 840 each provided with a resistor may be connected to the first terminal port P3 and the second terminal port P6 of the directional coupler 800.

[0165] Fig.15 is a graph of the isolation performance of a directional coupler before adding external matching elements according to an embodiment.

[0166] As one method of measuring the performance of a directional coupler, by sampling an RF signal, the isolation of the directional coupler may be ensured over a range of frequencies (eg, 0 to 6000 MHz).

[0167] Reference Fig.15 , in external matching components (e.g., Fig.14 In a state where the external matching elements 810, 820, 830 and 840 of the directional coupler are not connected, the directional coupler passes through the RF input port (e.g., Figure 3 RF input port P1) and RF output port (e.g., Figure 3 The RF signal at the RF output port P4) can be indicated by curve A1. Figure 3 RF input port P1) and a first coupling port (eg, Figure 3 The coupled signal extracted between the first coupling port P2 of the RF input port (e.g., Figure 3 RF input port P1) and a first terminal port (eg, Figure 3 The coupled signal extracted between the first terminal port P3) can be indicated by curve A3.

[0168] Fig.16 is a graph showing the isolation characteristics of a directional coupler with external matching elements added according to various embodiments.

[0169] The two passive components (eg, first external matching component 811 and second external matching component 812) constituting the external matching component 810 are connected to a directional coupler (eg, Fig.14 The first coupling port (eg, Figure 3 After the first coupling port P2), the isolation characteristics can be confirmed.

[0170] In the graph, a series 1.2 nH as a first external matching element 811 and a shunt 1.8 pF as a second external matching element 812 are connected to a directional coupler (eg, Fig.14 The first coupling port (eg, Figure 3 After the first coupling port P2), the isolation performance can be shown at Fig.16 In various frequency ranges, the RF input port (e.g., Figure 3 RF input port P1) and RF output port (e.g., Figure 3 The RF signal at the RF output port P4) can be indicated by curve B1. Figure 3 RF input port P1) and a first coupling port (eg, Figure 3 The coupled signal extracted between the first coupling port P2 of the RF input port (e.g., Figure 3 RF input port P1) and a first terminal port (eg, Figure 3 The coupled signal extracted between the first terminal port P3) can be indicated by curve B3.

[0171] Reference Fig.15 and Fig.16 , adding an external matching element 810 to the directional coupler (e.g., Fig.14 The first coupling port (eg, Figure 3 An embodiment of the first coupling port P2) (for example, Fig.16 ) and the embodiment without adding external matching element 810 (e.g., Fig.15 ) can have a lower isolation value in a wider frequency range. It can be confirmed that Fig.15 The directional coupler shown in has only about -45dB of isolation in the frequency band around 0MHz, while Fig.16 The directional coupler shown in can have an isolation of approximately -45 dB in a frequency band around 0 MHz and additionally ensures an isolation of approximately -50 dB in a frequency band around 2000 MHz.

[0172] Summarizing the above, it can be confirmed that the external matching element 810 is additionally connected to the first coupling port (eg, Figure 3 The first coupling port P2) of the device is connected to the optical fiber, thereby changing the isolation.

[0173] Fig.17 is a graph of isolation characteristics of a directional coupler with an external matching element added according to an embodiment.

[0174] The external matching element 830 is connected to a directional coupler (e.g., Fig.14 The first terminal port of the directional coupler 800 (eg, Figure 3 After the first terminal port P3), the isolation characteristics can be confirmed.

[0175] In the graph, for example, in the series connection of 47nH as the third external matching element 830 to the directional coupler (eg, Fig.14 The first terminal port of the directional coupler 800 (eg, Figure 3 After the first terminal port P3), the isolation performance can be shown at Fig.17 In various frequency ranges, the RF input port (e.g., Figure 3 RF input port P1) and RF output port (e.g., Figure 3 The RF signal at the RF output port P4) can be indicated by the curve C1. Figure 3 RF input port P1) and a first coupling port (eg, Figure 3 The coupled signal extracted between the first coupling port P2 of the RF input port (e.g., Figure 3 RF input port P1) and a second coupling port (eg, Figure 3 The coupled signal extracted between the first coupling port P5 of the RF input port (e.g., Figure 3RF input port P1) and a first terminal port (eg, Figure 3 The coupled signal extracted between the first terminal port P3) can be indicated by curve C4. Fig.17 , it can be confirmed that even when an external matching element 830 is added to the directional coupler (e.g. Fig.14 The terminal port of the directional coupler 800) (for example, Figure 3 In the case of an embodiment where the first terminal port P3 is used, compared with an embodiment where an external matching element is added to the coupling port (e.g., Fig.16 The directional coupler can also have lower isolation values ​​over a wider frequency range than in the embodiment shown in FIG. Fig.17 The directional coupler 800 of the embodiment shown in FIG. 8 may have an isolation of approximately −55 dB in a frequency band around 0 MHz and an isolation of approximately −75 dB in a frequency band around 2000 MHz.

[0176] It can be confirmed that the external matching element 810 is additionally connected to the first coupling port P2, thereby improving isolation.

[0177] External matching components (e.g. Fig.14 External matching elements 810 , 820 , 830 , and 840 ) are additionally included in the directional coupler 800 , which can improve the coupling and isolation of the directional coupler 800 .

[0178] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those described above.

[0179] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalents or alternative forms for corresponding embodiments. Regarding the description of the accompanying drawings, similar reference numerals can be used to refer to similar or related elements. It will be understood that the noun in the singular form corresponding to the item can include one or more things, unless the relevant context clearly indicates otherwise. As used herein, phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" can be included in any one or all possible combinations of the items listed together with the corresponding one in the phrase. As used herein, terms such as "1st" and "2nd" or "first" and "second" can be used to simply distinguish the corresponding component from another component, and the component is not limited in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected to another element (e.g., the second element)”, or “connected to another element (e.g., the second element)”, with or without the term “operably” or “communicatively”, this means that the element can be combined with the other elements directly (e.g., wired), wirelessly, or via a third element.

[0180] As used herein, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "component / portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0181] Various embodiments as described herein may be implemented as software (e.g., program 140) that includes one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0182] The methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., PlayStore). TM ) The computer program product may be distributed (e.g., downloaded or uploaded) online, or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If distributed online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a relay server).

[0183] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0184] Directional couplers (e.g. Figure 4 The directional coupler 400 may include: a first layer (eg, Figure 4 The first layer 410 includes at least one conductive portion (eg, Figure 4 conductive portions 411a and 411b); a second layer (eg, Figure 4 A second layer 420 is provided adjacent to the first layer in a first direction and includes at least one conductive plate (eg, Figure 4 conductive plates 424 and 426); a third layer (eg, Figure 4 The third layer 440 is disposed adjacent to the second layer in the first direction and includes at least one RF signal transmission line (eg, Figure 4 RF signal transmission lines 444 and 446); a fourth layer (eg, Figure 4 The fourth layer 450 is disposed adjacent to the third layer in the first direction and includes conductive wires (eg, Figure 4 conductive lines); and conductive paths (e.g., Figure 4 The conductive paths 425 and 427 electrically connect at least one conductive plate of the second layer and the conductive wires of the fourth layer each wound at least once, wherein the first layer, the second layer, the third layer and the fourth layer can form at least a portion of a printed circuit board.

[0185] The directional coupler may also include a spacer layer (e.g., Figure 4 The spacer layer 430 is disposed between the second layer and the third layer and includes at least one opening (eg, Figure 4 opening 433).

[0186] The at least one opening may be configured to couple at least a portion between the conductive plate and the RF signal transmission line.

[0187] The directional coupler may include multiple spacer layers (e.g., Fig.12 Multiple spacer layers 730a, 730b and 730c).

[0188] The directional coupler may include a fifth layer (e.g., Figure 7 A fifth layer 560) is disposed adjacent to the fourth layer and has conductive wires electrically connected to the conductive wires that are each wound at least one turn.

[0189] The directional coupler may also include a first ground plane (eg, Fig.10 A first ground layer 670) is provided adjacent to the first layer in a second direction opposite to the first direction.

[0190] The directional coupler may also include a second ground plane (eg, Fig.10 A second ground layer 680 is provided adjacent to the fifth layer in the first direction.

[0191] A conductive path of the directional coupler may be formed to pass through the second layer, the third layer, and the fourth layer and be electrically disconnected from the RF signal transmission line of the third layer.

[0192] In the second layer, the third layer, and the fourth layer of the directional coupler, the opening may include a first opening region through which the conductive path passes (eg, in the case of the second layer, Figure 4 The first opening region 423a of the second layer) and the second opening region formed at a position corresponding to at least a portion of the conductive plate (for example, in the case of the second layer, Figure 4 The second opening region 423b of the second layer.

[0193] In the directional coupler, the conductive plate of the second layer may be formed as a conductive plate having a specific area to implement a capacitor, and the conductive wire of the fourth layer may be wound a specific number of times to implement an inductor.

[0194] When the directional coupler corresponds to a bidirectional coupler, at least some components included in the bidirectional coupler may be formed symmetrically with respect to an imaginary line drawn in one direction in some layers.

[0195] When the directional coupler corresponds to a bidirectional coupler, the conductive plate of the second layer may include a first conductive plate having a specific area to realize a first capacitor and a second conductive plate having a specific area to realize a second capacitor, and the conductive wire of the fourth layer may include a first inductor portion wound a specific number of times to realize a first inductor and a second inductor portion wound a specific number of times to realize a second inductor.

[0196] In the directional coupler, the end of an RF signal transmission line of the third layer can form an RF input port (e.g., Figure 3 The RF input port P1 of the third layer may be formed, and the end of another RF signal transmission line of the third layer may form an RF output port (eg, Figure 3 At least one end of the conductive line of the fourth layer may form at least one terminal port (e.g., Figure 3 terminal ports P3 and / or P6) or at least one coupling port (e.g., Figure 3 at least one of the coupling ports P2 and / or P5).

[0197] In a directional coupler, external matching components (e.g. Fig.14 An external matching element 810, 820, 830 or 840) may be additionally connected to at least one of the at least one terminal port and the at least one coupling port.

[0198] Electronic devices (e.g. Figure 1 The electronic device 101 may include: at least one board; at least one antenna (eg, Figure 1 antenna module 197); a transceiver (e.g., Figure 2 transceiver 221); directional coupler (eg, Figure 2 Directional coupler 230 or Figure 4 directional coupler 400), extracting at least some of the signals output from at least one antenna and sending the coupled signals to the transceiver; a processor (e.g., Figure 4 processor 240); and memory (e.g., Figure 4 Memory 250), operably connected to the processor, wherein the directional coupler may include: a first layer (eg, Figure 4 The first layer 410 includes at least one conductive portion (eg, Figure 4 conductive portions 411a and 411b); a second layer (eg, Figure 4 A second layer 420 is disposed adjacent to the first layer in a first direction and includes at least one conductive plate (eg, Figure 4 conductive plates 424 and 426); a third layer (eg, Figure 4 The third layer 440 is disposed adjacent to the second layer in the first direction and includes at least one RF signal transmission line (eg, Figure 4 RF signal transmission lines 444 and 446); a fourth layer (eg, Figure 4 The fourth layer 450 is disposed adjacent to the third layer in the first direction and includes conductive wires (eg, Figure 4and at least one conductive path electrically connecting at least one conductive plate of the second layer and the conductive wires of the fourth layer each wound at least one turn, and wherein the first layer, the second layer, the third layer and the fourth layer can be embedded in at least one plate.

[0199] The electronic device may also include a spacer layer (e.g., Figure 4 A spacer layer 430) is provided between the second layer and the third layer and includes at least one opening.

[0200] At least some of the second layer, the third layer, and the fourth layer may be formed symmetrically with respect to an imaginary line drawn in one direction.

[0201] The conductive plate of the second layer may be formed as a conductive plate having a pre-specified area to implement a capacitor, and the conductive wire of the fourth layer may be wound a specific number of times to implement an inductor.

[0202] The conductive plate of the second layer may include a first conductive plate having a specific area to implement a first capacitor and a second conductive plate having a specific area to implement a second capacitor, and the conductive wire of the fourth layer may include a first inductor portion wound a specific number of times to implement a first inductor and a second inductor portion wound a specific number of times to implement a second inductor.

[0203] In the directional coupler, the end of an RF signal transmission line of the third layer can form an RF input port (e.g., Figure 3 The RF input port P1 of the third layer may be formed, and the end of another RF signal transmission line of the third layer may form an RF output port (eg, Figure 3 At least one end of the conductive line of the fourth layer may form at least one terminal port (e.g., Figure 3 terminal ports P3 and / or P6) or at least one coupling port (e.g., Figure 3 An external matching element may be additionally connected to at least one of the at least one terminal port and the at least one coupling port.

[0204] According to various embodiments disclosed herein, a printed circuit board may include: a first layer (eg, Figure 4 The first layer 410 includes at least one conductive portion (eg, Figure 4 conductive portions 411a and 411b); a second layer (eg, Figure 4 A second layer 420 is provided adjacent to the first layer in a first direction and includes at least one conductive plate (eg, Figure 4 conductive plates 424 and 426); a third layer (eg, Figure 4The third layer 430 is disposed adjacent to the second layer in the first direction and includes at least one RF signal transmission line (eg, Figure 4 RF signal transmission lines 444 and 446); a fourth layer (eg, Figure 4 The fourth layer 450 is disposed adjacent to the third layer in the first direction and includes conductive wires (eg, Figure 4 and at least one conductive path, the at least one conductive path electrically connecting the at least one conductive plate of the second layer and the conductive wire of the fourth layer, which are each wound at least one turn.

[0205] The printed circuit board may further include a spacer layer disposed between the second layer and the third layer and including at least one opening.

[0206] Although the present disclosure has been shown and described with reference to certain embodiments of the present disclosure, it will be appreciated by those skilled in the art that various changes in form and detail may be made therein without departing from the scope of the present disclosure. Therefore, the scope of the present disclosure should not be construed as being limited to the embodiments, but should be defined by the appended claims and their equivalents.

Claims

1. An electronic device, comprising: Multilayer board; as well as a directional coupler embedded in the multilayer board and comprising a capacitor and an inductor, Wherein, the multilayer board comprises: a first layer configured to include at least one conductive portion; a second layer disposed adjacent to the first layer in a first direction and configured to include at least one conductive plate overlapping the at least one conductive portion of the first layer, wherein the at least one conductive portion of the first layer and the at least one conductive plate of the second layer are configured to form the capacitor of the directional coupler; a third layer, the third layer being disposed adjacent to the second layer in the first direction, wherein an RF signal transmission line is disposed at the third layer, and the capacitor and the inductor of the directional coupler are coupled to the RF signal transmission line; a fourth layer, the fourth layer being disposed adjacent to the third layer in the first direction and being configured to include a conductive wire wound at least once, wherein the conductive wire is configured to form the inductor of the directional coupler; and At least one conductive path is configured to electrically connect the at least one conductive plate of the second layer and the conductive wire of the fourth layer that is wound at least once.

2. The electronic device according to claim 1, wherein: The multilayer board further includes a spacer layer disposed between the second layer and the third layer and configured to include at least one opening.

3. The electronic device according to claim 2, wherein: A plurality of spacer layers including the spacer layer are disposed between the second layer and the third layer. 4 . The electronic device of claim 1 , the directional coupler further comprising a first ground layer disposed adjacent to the first layer in a second direction opposite to the first direction and electrically connected to the first layer.

5. The electronic device according to claim 1, wherein: The multilayer board further includes a fifth layer configured to have a conductive line electrically connected to the conductive line formed at the fourth layer.

6. The electronic device according to claim 5, wherein: The multilayer board further includes a second ground layer disposed adjacent to the fifth layer in the first direction and electrically connected to the fifth layer.

7. The electronic device according to claim 1, wherein: The conductive path is formed to pass through the second layer, the third layer, and the fourth layer, and is electrically disconnected from the RF signal transmission line of the third layer.

8. The electronic device according to claim 1, wherein: The second layer, the third layer, and the fourth layer each include an opening; and The opening of each of the second layer, the third layer, and the fourth layer includes a first opening region through which the conductive path passes and a second opening region formed at a position corresponding to at least a portion of the conductive plate.

9. The electronic device according to claim 1, wherein: The conductive plate of the second layer is formed as a conductive plate having a specific area to implement the capacitor, and the conductive wire of the fourth layer is wound a specific number of times to implement the inductor.

10. The electronic device according to claim 1, wherein: When the directional coupler corresponds to a bidirectional coupler, at least some components included in the bidirectional coupler can be formed symmetrically with respect to an imaginary line drawn in one direction on some of the layers.

11. The electronic device according to claim 1, wherein: The conductive plate of the second layer includes a first conductive plate having a specific area to implement a first capacitor and a second conductive plate having a specific area to implement a second capacitor; and The conductive line of the fourth layer includes a first inductor portion wound a specific number of times and a second inductor portion wound a specific number of times.

12. The electronic device according to claim 1, wherein: A first end of the RF signal transmission line of the third layer forms an RF input port, and a second end of the RF signal transmission line of the third layer forms an RF output port; and At least one end of the conductive line of the fourth layer forms at least one of at least one terminal port or at least one coupling port.

13. The electronic device according to claim 12, wherein: At least one passive element is additionally connected to at least one of the at least one terminal port and the at least one coupling port.

14. The electronic device according to claim 1, further comprising: processor; as well as A memory is operably connected to the processor.

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