Endoscope insertion part heat dissipation structure

By adopting a combined structure of a heat transfer tube, a heat conduction sheet and a heat transfer bracket in the endoscope insertion part, the heat concentration problem of the insertion part is solved, uniform heat dissipation is achieved, and the working environment of the electronic device is improved and the cost is reduced.

CN113712486BActive Publication Date: 2025-08-22JOYMEDICARE (SHANGHAI) MEDICAL ELECTRONIC TECH CO LTD
View PDF 3 Cites 0 Cited by

Patent Information

Application Number
CN202010451100.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-05-25
Publication Date
2025-08-22
Estimated Expiration
2040-05-25

AI Technical Summary

Technical Problem

The concentration of heat in the endoscope insertion part causes the shortening of the life of the electronic device and causing harm to the human body. The existing heat dissipation design is incomplete, and most of them ensure the temperature of the equipment by sacrificing image performance or reducing power consumption.

Method used

The combined structure of a heat transfer tube, a heat conduction sheet, a heat conduction sheet pressing block and a heat transfer bracket is adopted. The heat generated by the heat source is transmitted to the heat transfer bracket through the heat transfer tube and finally distributed to the rear end of the insertion part through the heat transfer tube, combining the insulation material to the heat transfer between the heat source and the outer tube.

Benefits of technology

It realizes timely heat dissipation of the front end temperature of the insertion part and heat distribution of the entire insertion part, improving the working environment of the electronic device, and has a simple structure, low cost and easy loading and unloading.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN113712486B_ABST
    Figure CN113712486B_ABST
Patent Text Reader

Abstract

The present invention discloses a heat dissipation structure of an endoscope insertion part, comprising a heat transfer tube extending from the front end to the rear end of the insertion part, and a heat source, a heat conductive sheet, a heat conductive sheet pressing block and a heat transfer bracket located at the front end of the insertion part; the heat conductive sheet pressing block presses the front end of the heat conductive sheet against the back end of the heat source through a pressing surface, and the rear end of the heat conductive sheet passes around the heat conductive sheet pressing block and extends to the heat absorbing surface of the heat transfer bracket and is fixed in place, and the heat transfer bracket is fixed in place to the heat transfer tube, and the heat generated by the heat source passes through the heat conductive sheet with high heat conduction efficiency, the heat transfer bracket and the heat transfer tube in sequence and is evenly distributed to the entire insertion part. This structure can dissipate the temperature of the front end of the insertion part to the rear end in a timely manner, avoids heat concentration at the front end, and can achieve uniform heat distribution throughout the insertion part, thereby improving the working environment of electronic devices, and is easy to manufacture and assemble and disassemble, with low cost.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention belongs to the field of endoscopes, and in particular relates to a heat dissipation structure of an endoscope insertion part. Background Art

[0002] Endoscopes are small electronic medical devices that typically house various electronic components within their insertion area. These components create heat sources, and the limited internal space can easily lead to heat concentration, which not only shortens the lifespan of the components but can also cause harm to the human body. Currently, most endoscopes have incomplete internal heat dissipation designs, lacking heat conduction or only conducting heat within a small area. Most endoscopes maintain operating temperatures by sacrificing image performance and reducing power consumption. Summary of the Invention

[0003] The purpose of the present invention is to provide a heat dissipation structure for the insertion part of an endoscope, which can dissipate the temperature of the front end of the insertion part to the rear end in a timely manner, avoiding heat concentration at the front end, and can achieve uniform heat distribution throughout the insertion part, thereby improving the working environment of electronic devices, being easy to manufacture and assemble and unassemble, and having low cost.

[0004] The technical solution adopted in the present invention is:

[0005] A heat dissipation structure for an endoscope insertion portion includes a heat transfer tube extending from the front end to the rear end of the insertion portion, and a heat source, a heat conductive sheet, a heat conductive sheet pressing block, and a heat transfer bracket located at the front end of the insertion portion; the heat conductive sheet pressing block presses the front end of the heat conductive sheet against the back end of the heat source through a pressing surface, and the rear end of the heat conductive sheet passes around the heat conductive sheet pressing block and extends to the heat absorbing surface of the heat transfer bracket and is fixed in place; the heat transfer bracket is fixed in place to the heat transfer tube, and the heat generated by the heat source passes through the heat conductive sheet with high heat conduction efficiency, the heat transfer bracket, and the heat transfer tube in sequence and is evenly distributed to the entire insertion portion.

[0006] Preferably, it also includes a heat-insulating material located at the front end of the insertion part, and the heat-insulating material is used to isolate the heat source and the heat transfer between the heat transfer bracket and the outer tube of the insertion part.

[0007] Furthermore, the heat-insulating material is a plastic material.

[0008] Preferably, the front end of the heat transfer bracket cooperates with the mounting hole on the heat conducting plate pressing block through the mounting shaft.

[0009] Furthermore, the mounting hole and the pressing surface on the heat conducting plate pressing block are connected by cantilever structures on both sides, and the heat conducting plate passes between the cantilever structures on both sides. The cantilever structures are used to bear the main pressure of the heat conducting plate pressing block.

[0010] Preferably, the rear end of the heat transfer bracket is interference-fitted with the heat transfer tube via a connecting surface.

[0011] Preferably, the heat absorbing surface is located outside the heat transfer bracket, and the front side, or the front and rear sides, of the heat absorbing surface on the heat transfer bracket are provided with an inclined surface for natural transition of the heat conducting sheet.

[0012] Preferably, the heat conducting sheet is made of a thin sheet-shaped flexible heat conducting material with adhesive on one side, and the heat transfer bracket and the heat transfer tube are made of a high-strength metal or non-metal heat conducting material.

[0013] Preferably, the outer surface of the heat transfer tube is covered with a heat conducting sheet for assisting heat dissipation.

[0014] The beneficial effects of the present invention are:

[0015] This structure can dissipate the temperature of the front end of the insertion part to the rear end in time, avoiding heat concentration at the front end, and can achieve uniform heat distribution throughout the insertion part, improving the working environment of the electronic device; the structure is relatively simple, easy to manufacture and assemble and disassemble, and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a longitudinal sectional view of an embodiment of the present invention.

[0017] Figure 2 for Figure 1 A partial enlarged view of .

[0018] Figure 3 for Figure 1 Schematic diagram of the structure of the middle heat conducting plate pressing block.

[0019] Figure 4 for Figure 1 Schematic diagram of the structure of the heat transfer bracket.

[0020] In the figure: 1-heat transfer tube; 2-heat transfer bracket; 21-mounting axis; 22-inclined surface; 23-heat absorbing surface; 24-connecting surface; 3-heat conducting plate; 4-heat conducting plate pressing block; 41-mounting hole; 42-cantilever structure; 43-pressing surface; 5-heat source; 6-insulating material; 7-outer tube of the insertion part. DETAILED DESCRIPTION

[0021] The present invention will be further described below with reference to the accompanying drawings and examples.

[0022] like Figures 1 to 4As shown, a heat dissipation structure for an endoscope insertion portion includes a heat transfer tube 1 extending from the front end to the rear end of the insertion portion, and a heat source 5, a heat conductive sheet 3, a heat conductive sheet pressing block 4, and a heat transfer bracket 2 located at the front end of the insertion portion. The heat conductive sheet pressing block 4 presses the front end of the heat conductive sheet 3 against the back end of the heat source 5 via a pressing surface 43. The rear end of the heat conductive sheet 3 passes around the heat conductive sheet pressing block 4 and extends to the heat absorption surface 23 of the heat transfer bracket 2 and is fixed thereto. The heat transfer bracket 2 is fixed thereto and fixed to the heat transfer tube 1. The heat generated by the heat source 5 passes through the heat conductive sheet 3 with high thermal conductivity, the heat transfer bracket 2, and the heat transfer tube 1 in sequence and is evenly distributed throughout the insertion portion. This structure can dissipate the temperature of the front end of the insertion portion to the rear end in a timely manner, avoiding heat concentration at the front end. It can also achieve uniform heat distribution throughout the insertion portion, thereby improving the working environment of the electronic components. The structure is relatively simple, easy to manufacture and assemble and disassemble, and low in cost.

[0023] like Figure 1 and Figure 2 As shown, in this embodiment, the structure also includes an insulation material 6 located at the front end of the insertion part. The insulation material 6 is used to isolate the heat source 5 and the heat transfer bracket 2 from the outer tube 7 of the insertion part, further avoiding excessive temperature at the front end; the insulation material 6 is preferably a plastic material.

[0024] like Figure 1 and Figure 2 As shown, in this embodiment, the rear end of the heat transfer bracket 2 is interference-fitted with the heat transfer tube 1 through the connecting surface 24, leaving no gap, thereby improving the heat conduction efficiency.

[0025] like Figure 1 and Figure 2 As shown, in this embodiment, the outer surface of the heat transfer tube 1 is covered with a heat conducting sheet 3 for assisting heat dissipation.

[0026] like Figures 1 to 4 As shown, in this embodiment, the front end of the heat transfer bracket 2 cooperates with the mounting hole 41 on the heat conducting plate pressing block 4 through the mounting shaft 21, which plays a positioning role and ensures the installation accuracy of the heat conducting plate 3.

[0027] like Figure 3 As shown, in this embodiment, the mounting hole 41 and the pressing surface 43 on the thermal conductive plate pressing block 4 are connected by cantilever structures 42 on both sides, and the thermal conductive plate 3 passes through between the cantilever structures 42 on both sides. The cantilever structures 42 are used to bear the main pressure of the thermal conductive plate pressing block 4.

[0028] like Figure 1 、 Figure 2 and Figure 4 As shown, in this embodiment, the heat absorbing surface 23 is located on the outside of the heat transfer bracket 2, and the front side, or the front and rear sides of the heat absorbing surface 23 on the heat transfer bracket 2 are provided with an inclined surface 22 for a natural transition of the heat conducting plate 3 to prevent the heat conducting plate 3 from being bent and damaged.

[0029] In this embodiment, the heat conducting sheet 3 is preferably made of a thin sheet of flexible heat conducting material with adhesive on one side, and the heat transfer bracket 2 and the heat transfer tube 1 are preferably made of a high-strength metal or non-metal heat conducting material.

[0030] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present invention, ordinary technicians in this field can make many improved forms without departing from the scope of protection of the present invention and the claims, all of which are protected by the present invention.

Claims

1. A heat dissipation structure for an endoscope insertion portion, characterized in that: The heat transfer device comprises a heat transfer tube extending from the front end to the rear end of the insertion portion, and a heat source, a heat conducting sheet, a heat conducting sheet pressing block, and a heat transfer bracket located at the front end of the insertion portion. The heat conducting sheet pressing block presses the front end of the heat conducting sheet against the back end of the heat source through a pressing surface, and the rear end of the heat conducting sheet passes around the heat conducting sheet pressing block and extends to the heat absorbing surface of the heat conducting bracket and is fixed thereto. The heat conducting bracket is fixed thereto and the heat transfer tube. The heat generated by the heat source passes through the heat conducting sheet with high thermal conductivity, the heat conducting bracket, and the heat transfer tube in sequence and is evenly distributed throughout the insertion portion. The front end of the heat transfer bracket cooperates with the mounting hole on the heat conducting plate pressing block through the mounting shaft. The mounting hole on the heat conducting plate pressing block and the pressing surface are connected by cantilever structures on both sides. The heat conducting plate passes through between the cantilever structures on both sides. The cantilever structure is used to bear the main pressure of the heat conducting plate pressing block; it also includes a thermal insulation material located at the front end of the insertion part, and the thermal insulation material is used to isolate the heat source and the heat transfer between the heat transfer bracket and the outer tube of the insertion part.

2. The heat dissipation structure of the endoscope insertion portion according to claim 1, wherein: The insulation material is plastic material.

3. The heat dissipation structure of the endoscope insertion portion according to claim 1, wherein: The rear end of the heat transfer bracket is interference-fitted with the heat transfer tube through the connecting surface.

4. The heat dissipation structure of the endoscope insertion portion according to claim 1, wherein: The heat absorbing surface is located outside the heat transfer bracket. The front side, or the front and rear sides of the heat absorbing surface on the heat transfer bracket are provided with an inclined surface for natural transition of the heat conducting sheet.

5. The heat dissipation structure of the endoscope insertion portion according to claim 1, wherein: The heat conducting sheet is made of a thin sheet of flexible heat conducting material with a single-sided adhesive backing, and the heat transfer bracket and heat transfer tube are made of a high-strength metal or non-metal heat conducting material.

6. The heat dissipation structure of the endoscope insertion portion according to claim 1, wherein: The outer surface of the heat transfer tube is covered with a heat conducting sheet for assisting heat dissipation.

Citation Information

Patent Citations

  • Endoscope device

    CN103476319A

  • Electronic endoscope with good heat treatment

    CN109124548A

  • Endoscope insertion part heat dissipation structure

    CN212546878U