Liquid ejection head and liquid ejection device

Abstract

The present invention provides a liquid ejection head and a liquid ejection device capable of suppressing the generation of cracks in the wall surface of a nozzle flow channel caused by a load when connecting to a wiring substrate. The liquid ejection head comprises: a pressure chamber; a piezoelectric element that generates energy for applying pressure to ink in the pressure chamber; a nozzle flow channel that extends in the X-axis direction and is connected to a nozzle that ejects ink; a communication flow channel that connects the pressure chamber and the nozzle flow channel and is used to supply ink to the nozzle flow channel; a communication flow channel that is connected to the nozzle flow channel and is used to discharge ink from the nozzle flow channel; a wiring substrate that is electrically connected to a drive circuit that drives the piezoelectric element; and a wiring portion that electrically connects the wiring substrate and the piezoelectric element, the wiring portion being arranged at a position overlapping the nozzle flow channel when viewed in the Z-axis direction orthogonal to the X-axis direction and extending in ±Q directions that are different from the X-axis direction.

Description

Technical Field

[0001] The present invention relates to a liquid ejecting head and a liquid ejecting device. Background Art

[0002] Conventionally, there are known liquid ejection heads that apply pressure to a pressure chamber by driving a piezoelectric element or the like, thereby ejecting liquid from the pressure chamber through a nozzle. Patent Document 1 describes a head in which multiple piezoelectric elements are arranged in two rows, with a COF (Chip On Film) substrate positioned between the rows for supplying drive signals to the piezoelectric elements. This head has multiple lead electrodes formed in the COF substrate for connection, each extending from one row toward the other.

[0003] However, in heads designed to circulate liquid internally, a flow channel for distributing liquid may be formed below the location where the COF substrate is connected, along the direction in which the lead electrodes extend. In such a structure, if a large downward load is applied when the COF substrate is connected, the wall surface forming the flow channel may flex, causing cracks.

[0004] Patent Document 1: Japanese Patent Application Laid-Open No. 2012-183772 Summary of the Invention

[0005] The liquid ejection head is characterized in that it has: a first pressure chamber; a first energy generating element, which generates energy for applying pressure to the liquid in the first pressure chamber; a nozzle flow channel, which extends in a first direction and is connected to a nozzle that ejects liquid; a supply connecting flow channel, which connects the first pressure chamber and the nozzle flow channel and is used to supply liquid to the nozzle flow channel; a discharge connecting flow channel, which is connected to the nozzle flow channel and is used to discharge liquid from the nozzle flow channel; a wiring substrate, which is electrically connected to a drive circuit that drives the first energy generating element; a first wiring portion, which electrically connects the wiring substrate and the first energy generating element, and the first wiring portion is arranged at a position overlapping with the nozzle flow channel when viewed in a second direction orthogonal to the first direction, and extends in a third direction different from the first direction.

[0006] The liquid ejection device is characterized by comprising: the above-mentioned liquid ejection head; and a control device that controls the ejection operation of the liquid ejection head. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 It is an explanatory diagram showing the structure of the liquid ejecting device according to the first embodiment.

[0008] Figure 2This is an exploded perspective view of the liquid ejection head.

[0009] Figure 3 for Figure 2 Cross-sectional view along line AA.

[0010] Figure 4 This is an enlarged cross-sectional view of the vicinity of the piezoelectric element.

[0011] Figure 5 This is an enlarged cross-sectional view of the vicinity of the piezoelectric element.

[0012] Figure 6 It is a plan view of the peripheral structure of the wiring substrate when viewed from the Z-axis direction.

[0013] Figure 7 for Figure 3 Cross-sectional view of line BB in.

[0014] Figure 8 It is a plan view of the structure around the wiring substrate of the liquid ejecting head according to the second embodiment as viewed from the Z-axis direction.

[0015] Figure 9 This is an exploded perspective view of a liquid ejecting head according to a third embodiment.

[0016] Figure 10 It is a plan view of the liquid ejecting head according to the third embodiment as viewed from the Z-axis direction.

[0017] Figure 11 This is a cross-sectional view of the liquid ejection head taken parallel to the XZ plane.

[0018] Figure 12 This is a cross-sectional view of the liquid ejection head taken parallel to the XZ plane.

[0019] Figure 13 It is a plan view of the structure around the wiring substrate of the liquid ejecting head according to the third embodiment as viewed from the Z-axis direction.

[0020] Figure 14 for Figure 11 Cross-sectional view of line CC in.

[0021] Figure 15 It is an explanatory diagram showing the structure of a liquid ejecting device according to a fourth embodiment. DETAILED DESCRIPTION

[0022] The following describes embodiments of the present invention with reference to the accompanying drawings. However, the dimensions and scales of the various components in the drawings may differ from those in actual practice. Furthermore, while the embodiments described below are preferred examples and include various technically preferred limitations, the scope of the present invention is not limited to these embodiments unless otherwise specified in the following description.

[0023] 1. First Implementation

[0024] Below, in reference Figure 1 At the same time, the liquid ejection device 100 according to the first embodiment will be described.

[0025] Figure 1 2 is an explanatory diagram showing the structure of a liquid ejecting device 100 according to this embodiment.

[0026] The liquid ejection device 100 of this embodiment is an inkjet printing device that ejects liquid ink onto a medium PP. Although the medium PP is typically printing paper, any printing target such as resin film or cloth can be used as the medium PP.

[0027] like Figure 1 As shown, the liquid ejecting device 100 includes a liquid container 93 for storing ink. The liquid container 93 may be, for example, a cartridge that is detachably attached to the liquid ejecting device 100, a bag-shaped ink bag formed of a flexible film, or an ink tank that can be refilled with ink. The liquid container 93 stores a plurality of inks of different colors.

[0028] The liquid ejection device 100 includes a control device 90 , a moving mechanism 91 , a conveying mechanism 92 , and a circulation mechanism 94 .

[0029] The control device 90 includes a processing circuit such as a CPU or FPGA, and a storage circuit such as a semiconductor memory, and controls various elements of the liquid ejection device 100. Here, the term "CPU" stands for "Central Processing Unit," and the term "FPGA" stands for "Field Programmable Gate Array."

[0030] The moving mechanism 91 conveys the medium PP in the +Y direction under the control of the control device 90. In the following, the +Y direction and the -Y direction opposite to the +Y direction are collectively referred to as the Y-axis direction.

[0031] The conveying mechanism 92, under the control of the control device 90, causes the multiple liquid ejection heads 1 to reciprocate in the +X direction and the direction opposite to the +X direction, that is, the -X direction. In addition, hereinafter, the +X direction and the -X direction are collectively referred to as the X-axis direction. Here, the X-axis direction refers to the direction intersecting the Y-axis direction. Typically, the so-called X-axis direction is the direction orthogonal to the Y-axis direction. The conveying mechanism 92 includes a storage housing 921 and an endless belt 922 to which the storage housing 921 is fixed. In the storage housing 921, multiple liquid ejection heads 1 are stored side by side in the X-axis direction with the Y-axis direction as the longitudinal direction. In addition, the liquid container 93 can also be stored in the storage housing 921 together with the liquid ejection heads 1.

[0032] The circulation mechanism 94 supplies the ink stored in the liquid container 93 to the supply flow path RB1 provided in the liquid ejection head 1 (see FIG. 1 ). Figure 3 ). Furthermore, the circulation mechanism 94, under the control of the control device 90, circulates the liquid stored in the discharge flow path RB2 (refer to Figure 3 ) and the recovered ink is returned to the supply flow channel RB1.

[0033] The control device 90 controls the ejection operation of the liquid ejection head 1. Specifically, the liquid ejection head 1 is supplied with a drive signal COM for driving the liquid ejection head 1 and a control signal SI for controlling the liquid ejection head 1 from the control device 90. The liquid ejection head 1 is driven by the drive signal COM under the control of the control signal SI, and ejects ink from the M nozzles N (see FIG. 1 ) provided in the liquid ejection head 1. Figure 2 as well as Figure 3 ) is ejected in the +Z direction from part or all of the +Z direction. Here, the value M is a natural number greater than 1. In addition, the +Z direction is a direction that intersects the X-axis direction and the Y-axis direction. Typically, the +Z direction is a direction that is orthogonal to the X-axis direction and the Y-axis direction. hereinafter, the +Z direction and the -Z direction, which is the direction opposite to the +Z direction, are sometimes collectively referred to as the Z-axis direction.

[0034] The liquid ejection head 1 ejects ink from part or all of the M nozzles N in a manner linked to the transportation of the medium PP implemented by the moving mechanism 91 and the reciprocating movement of the liquid ejection head 1 implemented by the conveying mechanism 92, and forms a desired image on the surface of the medium PP by causing the ejected ink to fall on the surface of the medium PP.

[0035] Below, in reference Figure 2 as well as Figure 3 At the same time, the outline of the liquid ejecting head 1 will be described.

[0036] Figure 2 This is an exploded perspective view of the liquid ejection head 1. Figure 3 for Figure 2 Cross-sectional view along line AA.

[0037] like Figure 2 as well as Figure 3 As shown, the liquid ejection head 1 includes a nozzle substrate 60, plastic thin plates 61 and 62, a connecting plate 2, a pressure chamber substrate 3, a vibration plate 4, a storage chamber forming substrate 5, and a wiring substrate 8. The liquid ejection head 1 has a generally rectangular shape with its long side in the Y-axis direction when viewed from above in the Z-axis direction (from the Z-axis direction).

[0038] The nozzle substrate 60 is a plate-shaped component that is long in the Y-axis direction and extends approximately parallel to the XY plane, and has M nozzles N formed thereon. Here, the term "approximately parallel" refers to a concept that includes not only completely parallel situations but also situations that can be considered parallel if errors are taken into account. The nozzle substrate 60 is manufactured, for example, by processing a single crystal silicon substrate using semiconductor manufacturing techniques such as etching. However, in the manufacture of the nozzle substrate 60, any known materials and manufacturing methods can be used. The nozzle N is a through hole provided in the nozzle substrate 60. In this embodiment, as an example, it is assumed that M nozzles N are provided in the nozzle substrate 60 in a manner that forms a nozzle column Ln extending in the Y-axis direction.

[0039] A communication plate 2 is provided on the -Z side of the nozzle substrate 60. The communication plate 2 is a plate-shaped member that is elongated in the Y-axis direction and extends substantially parallel to the XY plane, and has an ink flow path formed therein.

[0040] Specifically, the connecting plate 2 is formed with a supply flow channel RA1 and a discharge flow channel RA2. The supply flow channel RA1 is arranged to communicate with the supply flow channel RB1 (described later) and to extend in the Y-axis direction. Furthermore, the discharge flow channel RA2 is arranged to communicate with the discharge flow channel RB2 (described later) and to extend in the Y-axis direction on the -X side when viewed from the supply flow channel RA1.

[0041] Furthermore, in the connecting plate 2, M connecting flow channels RK1, M connecting flow channels RK2, M connecting flow channels RR1, M connecting flow channels RR2, M connecting flow channels RR1, M connecting flow channels RR2, and M nozzle flow channels RN are formed along the Y-axis direction, corresponding one-to-one with the M nozzles N. The connecting flow channel RK1 is arranged to communicate with the supply flow channel RA1 and to extend in the Z-axis direction on the -X side when viewed from the supply flow channel RA1. Furthermore, the connecting flow channel RR1 is arranged to extend in the Z-axis direction on the -X side when viewed from the connecting flow channel RK1. Furthermore, the connecting flow channel RK2 is arranged to communicate with the discharge flow channel RA2 and to extend in the Z-axis direction on the +X side when viewed from the discharge flow channel RA2. Furthermore, the communication flow channel RR2 is provided so as to extend in the Z-axis direction on the +X side when viewed from the connection flow channel RK2 and on the -X side when viewed from the communication flow channel RR1. Furthermore, the nozzle flow channel RN is provided so as to connect the communication flow channels RR1 and RR2 and to extend in the X-axis direction on the -X side when viewed from the communication flow channel RR1 and on the +X side when viewed from the communication flow channel RR2. The nozzle flow channel RN is connected to the nozzle N corresponding to the nozzle flow channel RN.

[0042] In this embodiment, the nozzle N is positioned approximately at the center of the nozzle flow channel RN in the X-axis direction when viewed from the Z-axis direction. For example, the distance from the nozzle N to the connecting flow channel RR1 in the X-axis direction is approximately the same as the distance from the nozzle N to the connecting flow channel RR2 in the X-axis direction. The term "approximately the center" here encompasses not only situations in which they are strictly identical but also situations that can be considered as the center after accounting for errors.

[0043] The communicating plate 2 is manufactured by processing a single crystal silicon substrate using semiconductor manufacturing technology, for example. However, any known material or manufacturing method can be used to manufacture the communicating plate 2.

[0044] A pressure chamber substrate 3 is provided on the -Z side of the communication plate 2. The pressure chamber substrate 3 is a plate-shaped member that is elongated in the Y-axis direction and extends substantially parallel to the XY plane, and has an ink flow path formed therein.

[0045] Specifically, the pressure chamber substrate 3 is provided with M pressure chambers CB1, corresponding one-to-one to the M nozzles N, and M pressure chambers CB2, corresponding one-to-one to the M nozzles N, along the Y-axis direction. Pressure chamber CB1 is an example of a first pressure chamber, and pressure chamber CB2 is an example of a second pressure chamber. Pressure chamber CB1 is configured to connect the connecting channel RK1 and the communicating channel RR1, and, when viewed from the Z-axis direction, connects the +X-side end of the connecting channel RK1 to the -X-side end of the communicating channel RR1, extending in the X-axis direction. Furthermore, pressure chamber CB2 is configured to connect the connecting channel RK2 and the communicating channel RR2, and, when viewed from the Z-axis direction, connects the -X-side end of the connecting channel RK2 to the +X-side end of the communicating channel RR2, extending in the X-axis direction.

[0046] The pressure chamber substrate 3 is manufactured by processing a single crystal silicon substrate using semiconductor manufacturing technology, for example. However, any known material or manufacturing method can be used to manufacture the pressure chamber substrate 3 .

[0047] Hereinafter, the ink flow channel connecting the supply channel RA1 and the discharge channel RA2 will be referred to as a circulation channel RJ. Specifically, the supply channel RA1 and the discharge channel RA2 are connected via M circulation channels RJ, each corresponding to M nozzles N. As described above, each circulation channel RJ includes a connecting channel RK1 connected to the supply channel RA1, a pressure chamber CB1 connected to the connecting channel RK1, a connecting channel RR1 connected to the pressure chamber CB1, a nozzle channel RN connected to the connecting channel RR1, a connecting channel RR2 connected to the nozzle channel RN, a pressure chamber CB2 connected to the connecting channel RR2, and a connecting channel RK2 connecting the pressure chamber CB2 and the discharge channel RA2. Here, the connecting channel RR1 is an example of a supply connecting channel, connecting the pressure chamber CB1 and the nozzle channel RN, and supplying ink to the nozzle channel RN. Furthermore, the communication flow path RR2 is an example of a discharge communication flow path, and connects the nozzle flow path RN and the pressure chamber CB2 , and discharges ink from the nozzle flow path RN to the pressure chamber CB2 .

[0048] A vibration plate 4 is provided on the -Z side of the pressure chamber substrate 3. The vibration plate 4 is a plate-shaped member that is elongated in the Y-axis direction and extends substantially parallel to the XY plane, and is a member that can vibrate elastically.

[0049] On the -Z side of the vibration plate 4, M piezoelectric elements PZ1, corresponding one-to-one to the M pressure chambers CB1, and M piezoelectric elements PZ2, corresponding one-to-one to the M pressure chambers CB2, are arranged along the Y-axis. Piezoelectric elements PZ1 and PZ2 are passive elements that deform in response to changes in the potential of the drive signal COM. In other words, piezoelectric elements PZ1 and PZ2 are examples of energy-generating elements that convert the electrical energy of the drive signal COM into kinetic energy, thereby generating energy for applying pressure to the ink within the pressure chambers CB1 and CB2. Piezoelectric element PZ1 is an example of a first energy-generating element, and piezoelectric element PZ2 is an example of a second energy-generating element.

[0050] Figure 4 This is an enlarged cross-sectional view of the vicinity of the piezoelectric element PZ1. Figure 5 It is a cross-sectional view in which the vicinity of the piezoelectric element PZ2 is enlarged.

[0051] like Figure 4 As illustrated, the piezoelectric element PZ1 is a laminated structure in which a piezoelectric body ZM1 is interposed between a lower electrode ZD1, which is supplied with a predetermined reference potential, and an upper electrode ZU1, which is supplied with a drive signal COM. These electrodes are stacked in the Z-axis direction. The piezoelectric element PZ1 is the portion where the lower electrode ZD1, upper electrode ZU1, and piezoelectric body ZM1 overlap when viewed in the Z-axis direction. Furthermore, a pressure chamber CB1 is provided in the +Z direction of the piezoelectric element PZ1.

[0052] In addition, if Figure 5 As shown, piezoelectric element PZ2 has the same structure as piezoelectric element PZ1, except that it is symmetrical with respect to the YZ plane. Specifically, piezoelectric element PZ2 is a laminated structure with a piezoelectric body ZM2 interposed between a lower electrode ZD2, supplied with the aforementioned reference potential, and an upper electrode ZU2, supplied with a drive signal COM. These electrodes are stacked sideways in the Z-axis direction. When viewed in the Z-axis direction, piezoelectric element PZ2 is defined by the overlapping portion of lower electrode ZD2, upper electrode ZU2, and piezoelectric body ZM2. Furthermore, pressure chamber CB2 is provided in the +Z direction of piezoelectric element PZ2.

[0053] As described above, piezoelectric elements PZ1 and PZ2 are driven by changes in the potential of the drive signal COM, causing them to deform. The vibration plate 4 vibrates in conjunction with the deformation of the piezoelectric elements PZ1 and PZ2. As the vibration plate 4 vibrates, the pressure within the pressure chambers CB1 and CB2 fluctuates. This pressure fluctuation causes the ink contained within the pressure chambers CB1 and CB2 to be ejected from the nozzle N via the communicating flow passages RR1 and RR2 and the nozzle flow passage RN.

[0054] In this embodiment, the lower electrodes ZD1 and ZD2 serve as a common electrode for the plurality of piezoelectric elements PZ1 and PZ2, while the upper electrodes ZU1 and ZU2 serve as independent electrodes independently provided for the plurality of piezoelectric elements PZ1 and PZ2. However, a configuration may also be employed in which the lower electrodes ZD1 and ZD2 serve as independent electrodes and the upper electrodes ZU1 and ZU2 serve as a common electrode.

[0055] like Figure 2 as well as Figure 3 As shown in the example, a wiring substrate 8 is mounted on the surface of the -Z side of the vibration plate 4. The wiring substrate 8 is a component for electrically connecting the control device 90 and the liquid ejection head 1. As the wiring substrate 8, for example, a flexible wiring substrate such as FPC or FFC can be preferably used. Here, the so-called FPC is the abbreviation of Flexible Printed Circuit, and the so-called FFC is the abbreviation of Flexible Flat Cable. On the wiring substrate 8, a driving circuit 81 for driving the piezoelectric elements PZ1 and PZ2 is electrically connected. The driving circuit 81 is a circuit that switches whether to supply the driving signal COM to the piezoelectric elements PZ1 and PZ2 under the control of the control signal SI. As Figure 4 as well as Figure 5 As illustrated, the drive circuit 81 supplies the drive signal COM to the upper electrodes ZU1 and ZU2 of the piezoelectric elements PZ1 and PZ2 via the wiring portions W1 and W2 formed on the vibration plate 4 .

[0056] In addition, although in this embodiment, when the ink is ejected from the nozzle N, it is envisioned that the waveform of the drive signal COM supplied by the drive circuit 81 to the piezoelectric element PZ1 corresponding to the nozzle N and the waveform of the drive signal COM supplied by the drive circuit 81 to the piezoelectric element PZ2 corresponding to the nozzle N are approximately the same, it can also be set to supply different waveforms respectively.

[0057] Wiring substrate 8 includes a main body 82 on which drive circuit 81 is mounted, and a connection end portion 83 that is bent approximately 90 degrees relative to main body 82 and connected to vibration plate 4. Specifically, when wiring substrate 8 is mounted on vibration plate 4, connection end portion 83 is approximately parallel to vibration plate 4, while main body 82 is approximately perpendicular to vibration plate 4.

[0058] A plurality of wirings (not shown) for electrically connecting to a plurality of wiring portions W1 and W2 formed on the vibration plate 4 are formed on one surface of the connection end portion 83 facing the vibration plate 4 .

[0059] A storage chamber forming substrate 5 is provided on the -Z side of the communication plate 2. The storage chamber forming substrate 5 is a member elongated in the Y-axis direction, and has an ink flow path formed therein.

[0060] Specifically, the reservoir forming substrate 5 includes a supply flow channel RB1 and a discharge flow channel RB2. Supply flow channel RB1 is arranged to communicate with supply flow channel RA1 and to extend in the Y-axis direction on the -Z side when viewed from supply flow channel RA1. Discharge flow channel RB2 is arranged to communicate with discharge flow channel RA2 and to extend in the Y-axis direction on the -Z side when viewed from discharge flow channel RA2 and on the -X side when viewed from supply flow channel RB1.

[0061] The reservoir forming substrate 5 is provided with an inlet 51 communicating with the supply flow path RB1 and a discharge port 52 communicating with the discharge flow path RB2. Ink is supplied from the liquid container 93 to the supply flow path RB1 via the inlet 51. Furthermore, ink stored in the discharge flow path RB2 is recovered via the discharge port 52. The ink recovered from the discharge port 52 is returned to the liquid container 93 storing the ink, thereby enabling the ink to circulate.

[0062] Furthermore, an opening 50 is provided in the reservoir forming substrate 5. Inside the opening 50, the pressure chamber substrate 3, the vibration plate 4, and the wiring substrate 8 are provided.

[0063] The reservoir forming substrate 5 is formed by injection molding of a resin material, for example. However, any known material or manufacturing method can be used to manufacture the reservoir forming substrate 5 .

[0064] In this embodiment, ink supplied from the liquid container 93 to the inlet 51 flows through the supply channel RB1 into the supply channel RA1. A portion of the ink flowing into the supply channel RA1 then flows into the pressure chamber CB1 via the connecting channel RK1. Furthermore, a portion of the ink flowing into the pressure chamber CB1 flows through the connecting channel RR1, the nozzle channel RN, and the connecting channel RR2 into the pressure chamber CB2. A portion of the ink flowing into the pressure chamber CB2 then flows through the connecting channel RK2, the discharge channel RA2, and the discharge channel RB2 and is discharged from the discharge port 52. Furthermore, when the piezoelectric element PZ1 is driven by the drive signal COM, a portion of the ink filling the pressure chamber CB1 is ejected from the nozzle N via the connecting channel RR1 and the nozzle channel RN. Furthermore, when the piezoelectric element PZ2 is driven by the drive signal COM, a portion of the ink filling the pressure chamber CB2 is ejected from the nozzle N via the connecting channel RR2 and the nozzle channel RN.

[0065] A thin plastic plate 61 is provided on the +Z side of the connecting plate 2 to seal the supply channel RA1 and the connecting channel RK1. The thin plastic plate 61 is formed of an elastic material and absorbs pressure fluctuations of the ink within the supply channel RA1 and the connecting channel RK1. Furthermore, a thin plastic plate 62 is provided on the +Z side of the connecting plate 2 to seal the discharge channel RA2 and the connecting channel RK2. The thin plastic plate 62 is formed of an elastic material and absorbs pressure fluctuations of the ink within the discharge channel RA2 and the connecting channel RK2.

[0066] As described above, the liquid ejection head 1 according to this embodiment circulates ink from the supply flow channel RA1 through the circulation flow channel RJ to the discharge flow channel RA2. Therefore, in this embodiment, even when there are periods when ink within the pressure chambers CB1 and CB2 is not ejected from the nozzles N, it is possible to prevent the ink from continuously stagnating within the pressure chambers CB1 and CB2 and in the nozzle flow channel RN. This prevents the ink from thickening within the pressure chambers CB1 and CB2, and prevents the occurrence of ejection anomalies such as ink thickening preventing the ejection of ink from the nozzles N.

[0067] Furthermore, the liquid ejection head 1 according to the present embodiment can eject both the ink filled in the pressure chamber CB1 and the ink filled in the pressure chamber CB2 from the nozzles N. Therefore, in the liquid ejection head 1 according to the present embodiment, the amount of ink ejected from the nozzles N can be increased compared to, for example, a method in which only the ink filled in one pressure chamber is ejected from the nozzles N.

[0068] Figure 6 1 is a top view of the structure around the wiring substrate 8 as viewed from the Z-axis direction, showing the wiring substrate 8 with dotted lines and showing, in perspective, the piezoelectric elements PZ1 and PZ2, wiring portions W1 and W2, pressure chambers CB1 and CB2, the nozzle flow channel RN, and the nozzle N with solid lines. Here, the wiring portion W1 is an example of a first wiring portion, and the wiring portion W2 is an example of a second wiring portion.

[0069] like Figure 6 As shown, the connection end 83 of the wiring substrate 8 is elongated in the Y-axis direction and is positioned approximately in the center of a row of multiple pressure chambers CB1 and a row of multiple pressure chambers CB2, both arranged along the Y-axis. Specifically, the wiring substrate 8 is positioned on the -Z side of the nozzle N, which is positioned approximately in the center of the nozzle flow channel RN extending in the X-axis direction.

[0070] The wiring portion W1 connected to the upper electrode ZU1 of the piezoelectric element PZ1 extends to a connection position where the wiring substrate 8 is located and is electrically connected to the wiring substrate 8. This connection position is a position that overlaps with the nozzle flow channel RN when viewed from the Z-axis direction. The wiring portion W1 bends between the position of the piezoelectric element PZ1 and the connection position. Specifically, the wiring portion W1 extends from the upper electrode ZU1 of the piezoelectric element PZ1 by a predetermined length in a direction inclined at an angle α rotated counterclockwise relative to the -X direction, that is, in the +P direction having a -X direction component and a +Y direction component. There, it bends and extends in a direction inclined at an angle β rotated clockwise relative to the -X direction, that is, in the +Q direction having a -X direction component and a -Y direction component, until it reaches the connection position with the wiring substrate 8. In other words, at the connection position with the wiring substrate 8, the wiring portion W1 extends in the ±Q directions, which are different from the X-axis direction. Furthermore, although both angles α and β are acute angles, and angle α is preferably, for example, not less than 45° and not more than 75°, and angle β is preferably, for example, not less than 5° and not more than 40°, they may be outside these ranges.

[0071] Similarly, the wiring portion W2 connected to the upper electrode ZU2 of the piezoelectric element PZ2 extends to a position overlapping with the nozzle flow channel RN, i.e., a connection position, when viewed from the Z-axis direction, and is then connected to the wiring substrate 8. Similar to the wiring portion W1, the wiring portion W2 bends between the position of the piezoelectric element PZ2 and the connection position. Specifically, the wiring portion W2 extends from the upper electrode ZU2 of the piezoelectric element PZ2 by a predetermined length in a direction tilted counterclockwise by an angle α relative to the +X direction, i.e., in the -P direction having a +X component and a -Y component. There, it bends and extends in a direction tilted clockwise by an angle β relative to the +X direction, i.e., in the -Q direction having a +X component and a +Y component, until it reaches the connection position with the wiring substrate 8. In other words, at the connection position with the wiring substrate 8, the wiring portion W2 extends in the ±Q directions, which are different from the X-axis direction.

[0072] Multiple wiring sections W1 and multiple wiring sections W2 are alternately arranged at the connection location with the wiring substrate 8, and are arranged in a row along the Y-axis direction in a parallel posture, each tilted in the ±Q directions. Furthermore, although not shown, at the connection end 83 of the wiring substrate 8, multiple wirings connected to the wiring sections W1 and W2, respectively, are arranged in a row, and these are also tilted in a manner corresponding to the wiring sections W1 and W2. When connecting the wiring substrate 8 to the vibration plate 4, after the wiring at the connection end 83 is aligned so that it faces the wiring sections W1 and W2 on the vibration plate 4, the wiring substrate 8 is electrically connected by thermocompression bonding using a conductive or non-conductive paste (not shown).

[0073] The ±P and ±Q directions are directions included in the XY plane and are perpendicular to the Z-axis direction. That is, the Z-axis direction is perpendicular to all of the X-axis direction, the Y-axis direction, the ±P directions, and the ±Q directions.

[0074] Furthermore, although the directions in which the wiring portion W1 and the wiring portion W2 extend at the connection point with the wiring substrate 8 are both ±Q directions and parallel to each other, they do not necessarily need to be parallel. However, if these extending directions are parallel, the wiring portions W1 and W2 can be efficiently arranged.

[0075] Figure 7 for, Figure 3 Cross-sectional view of line BB in.

[0076] like Figure 7 As shown, the cross-section of the nozzle flow channel RN viewed from the X-axis direction is composed of two wall surfaces HRN1 and HRN2 parallel to the Z-axis, two wall surfaces CRN1 and BRN1 parallel to the Y-axis, and two inclined wall surfaces HD1 and HD2. Here, wall surface BRN1 is an example of a first wall surface, wall surface CRN1 is an example of a second wall surface, walls HRN1 and HRN2 are examples of third and fourth wall surfaces, and walls HD1 and HD2 are examples of inclined surfaces. Wall surface BRN1 is the surface on the -Z side of the nozzle substrate 60, that is, the surface on the connecting plate 2 side. The other wall surfaces HRN1, HRN2, CRN1, HD1, and HD2 are formed on the connecting plate 2. Of the walls CRN1 and BRN1 parallel to the Y-axis, the wall CRN1 on the -Z side closest to the wiring substrate 8 and the two walls HRN1 and HRN2 parallel to the Z-axis are not directly connected but are connected via the inclined walls HD1 and HD2.

[0077] As described above, the liquid ejection head 1 involved in the present embodiment is characterized in that it has: a pressure chamber CB1, a piezoelectric element PZ1 that generates energy for applying pressure to the ink in the pressure chamber CB1, a nozzle flow channel RN extending in the X-axis direction and connected to the nozzle N that ejects ink, a connecting flow channel RR1 for connecting the pressure chamber CB1 and the nozzle flow channel RN and supplying ink to the nozzle flow channel RN, a connecting flow channel RR2 for connecting with the nozzle flow channel RN and discharging ink from the nozzle flow channel RN, a wiring substrate 8 electrically connected to the driving circuit 81 that drives the piezoelectric element PZ1, and a wiring portion W1 that electrically connects the wiring substrate 8 and the piezoelectric element PZ1, and the wiring portion W1 is arranged at a position overlapping with the nozzle flow channel RN when viewed from the Z-axis direction orthogonal to the X-axis direction, and extends in ±Q directions different from the X-axis direction.

[0078] According to this embodiment, since the wiring portion W1 for connecting the piezoelectric element PZ1 and the wiring substrate 8 extends in a direction different from the X-axis direction in which the nozzle flow channel RN extends, the deflection generated on the wall surface of the nozzle flow channel RN due to the load in the +Z direction when the wiring substrate 8 is connected can be suppressed, and the generation of cracks in the wall surface of the nozzle flow channel RN can be suppressed.

[0079] In addition, the liquid ejection head 1 involved in this embodiment is characterized in that it has: a pressure chamber CB2, a piezoelectric element PZ2 that generates energy for applying pressure to the ink in the pressure chamber CB2, a wiring portion W2 that electrically connects the wiring substrate 8 and the piezoelectric element PZ2, and a connecting flow channel RR2 that connects the pressure chamber CB2 and the nozzle flow channel RN. When viewed from the Z-axis direction, the wiring portion W2 is arranged at a position overlapping with the nozzle flow channel RN and extends in the ±Q direction different from the X-axis direction.

[0080] According to this embodiment, since the wiring portion W2 for connecting the piezoelectric element PZ2 and the wiring substrate 8 also extends in a direction different from the X-axis direction in which the nozzle channel RN extends, the deflection generated on the wall surface of the nozzle channel RN due to the load in the +Z direction when the wiring substrate 8 is connected can be suppressed, and the generation of cracks in the wall surface of the nozzle channel RN can be suppressed.

[0081] Furthermore, in the liquid ejection head 1 according to this embodiment, both the wiring portion W1 and the wiring portion W2 extend in the ±Q directions at the connection position with the wiring substrate 8. That is, since the direction in which the wiring portion W1 extends is parallel to the direction in which the wiring portion W2 extends, the wiring portion W1 and the wiring portion W2 can be arranged without interfering with each other.

[0082] Furthermore, in the liquid ejection head 1 according to this embodiment, the wiring substrate 8 is located approximately midway between the piezoelectric element PZ1 and the piezoelectric element PZ2, that is, approximately at the center of the nozzle flow channel RN in the X-axis direction. Consequently, since the path length from the piezoelectric element PZ1 to the wiring portion W1 at the connection location and the path length from the piezoelectric element PZ2 to the wiring portion W2 at the connection location are approximately equal, forming the wiring portions W1 and W2 with uniform width or thickness allows their respective resistances to be approximately equal. As a result, variations in the voltage applied to the piezoelectric element PZ1 and the voltage applied to the piezoelectric element PZ2 are suppressed, thereby achieving a substantially uniform amount of ink ejected and the ink ejection velocity.

[0083] Furthermore, in the liquid ejection head 1 according to this embodiment, the wiring portions W1 and W2 are bent midway and have portions extending in the ±Q directions, which differ from the X-axis direction, and portions extending in the ±P directions, which differ from both the X-axis and ±Q directions. Consequently, the distance in the Y-axis direction between the ends of the wiring portions W1 and W2 on the connection side and the positions of the piezoelectric elements PZ1 and PZ2 can be shortened. This reduces the area occupied by the wiring portions W1 and W2 in the Y-axis direction, thereby miniaturizing the liquid ejection head 1.

[0084] Furthermore, in the liquid ejection head 1 according to this embodiment, the cross-section of the nozzle flow channel RN, as viewed from the X-axis direction, includes wall surfaces CRN1 and BRN1 parallel to the Y-axis direction, and wall surfaces HRN1 and HRN2 parallel to the Z-axis direction. Of the wall surfaces CRN1 and BRN1, the wall surface CRN1 that is closest to the wiring substrate 8 is connected to the wall surfaces HRN1 and HRN2 via wall surfaces HD1 and HD2 that are inclined with respect to both the Y-axis and Z-axis directions. Therefore, deflection of the wall surface of the nozzle flow channel RN due to a load in the +Z direction when connecting to the wiring substrate 8 can be suppressed, thereby suppressing the occurrence of cracks in the wall surface of the nozzle flow channel RN.

[0085] In addition, in this embodiment, the X-axis direction is an example of the first direction, the Z-axis direction is an example of the second direction, the ±Q directions are an example of the third direction and the fourth direction, the ±P directions are an example of the fifth direction, and the Y-axis direction is an example of the sixth direction.

[0086] 2. Second Implementation

[0087] Hereinafter, a liquid ejecting head 1A according to a second embodiment will be described.

[0088] The liquid ejection head 1A of this embodiment differs from the first embodiment in that, at the connection point with the wiring substrate 8, the directions in which the wiring portions W1 and W2 extend are not the same for all piezoelectric elements PZ1 and PZ2, but rather vary depending on their position in the Y-axis direction. Other than this, the structure is the same as that of the first embodiment. Therefore, the same reference numerals as in the first embodiment will be used for the same structures as in the first embodiment, and detailed description will be omitted.

[0089] Figure 8 It is a top view of the structure around the wiring substrate 8 of the liquid ejection head 1A involved in the second embodiment when observing it from the Z-axis direction, and the wiring substrate 8 is shown by dotted lines, and the piezoelectric elements PZ1, PZ2, wiring parts W1, W2, pressure chambers CB1, CB2, nozzle flow channel RN and nozzle N are shown by solid lines in a perspective manner.

[0090] like Figure 8 As shown in the example, the wiring portions W1 and W2 of the piezoelectric elements PZ1 and PZ2 located at the -Y end of the plurality of piezoelectric elements PZ1 and PZ2 arranged along the Y-axis extend in the ±Q directions at their connection points with the wiring substrate 8, similar to the first embodiment. Furthermore, the wiring portions W1 and W2 of the piezoelectric elements PZ1 and PZ2 located at the +Y end have a shape symmetrical with respect to the X-axis with respect to the wiring portions W1 and W2 at the -Y end. In other words, the wiring portions W1 and W2 of the piezoelectric elements PZ1 and PZ2 located at both ends of the Y-axis extend in a direction different from the X-axis direction, in which the nozzle flow channel RN extends, at their connection points with the wiring substrate 8. In contrast, the wiring portions W1 and W2 of the piezoelectric elements PZ1 and PZ2 located in the center of the Y-axis extend in the X-axis direction, roughly aligning with the direction in which the nozzle flow channel RN extends.

[0091] According to the liquid ejection head 1A involved in this embodiment, at the ends on the +Y side and -Y side, the wiring portions W1 and W2 for connecting the wiring substrate 8 extend in a direction different from the X-axis direction, in which the nozzle flow channel RN extends. When a jig or the like is used to uniformly connect the wiring substrate 8, which is elongated along the Y axis, to multiple wiring portions W1 and W2 arranged along the Y axis, the slight tilt of the jig or the like can easily cause the load to concentrate on either end in the Y axis direction. However, according to this embodiment, since the wiring portions W1 and W2 extend in a direction different from the X-axis direction at the ends in the Y axis direction, it is possible to suppress deflection in the wall surface of the nozzle flow channel RN caused by the +Z-direction load when connecting the wiring substrate 8, thereby suppressing the occurrence of cracks in the wall surface of the nozzle flow channel RN. Furthermore, since the wiring portions W1 and W2 extend in substantially the same direction as the nozzle flow channel RN at the center portion in the Y-axis direction, the lengths of the wiring portions W1 and W2 can be shortened, thereby suppressing a voltage drop due to resistance.

[0092] Alternatively, at the connection position with the wiring substrate 8 , the inclination of the wiring portions W1 and W2 relative to each other may be gradually increased from the center portion to the end portion in the Y-axis direction.

[0093] 3. Third Implementation

[0094] Hereinafter, a liquid ejecting head 1B according to a third embodiment will be described.

[0095] Although the first and second embodiments illustrate an embodiment in which two piezoelectric elements PZ1 and PZ2 are provided for each nozzle N, the present invention is not limited to this embodiment. For example, in the liquid ejection head 1B of this embodiment, one piezoelectric element is provided for each nozzle.

[0096] Figure 9 1 is an exploded perspective view of the liquid ejecting head 1B according to the present embodiment.

[0097] like Figure 9 As shown, the liquid ejection head 1B involved in this embodiment is different from the liquid ejection head 1 involved in the first and second embodiments in that it includes a nozzle substrate 60B instead of the nozzle substrate 60, a connecting plate 2B instead of the connecting plate 2, a pressure chamber substrate 3B instead of the pressure chamber substrate 3, and a vibration plate 4B instead of the vibration plate 4.

[0098] The nozzle substrate 60B differs from the nozzle substrate 60 of the first and second embodiments in that two nozzle rows, Ln1 and Ln2, are provided instead of a single nozzle row Ln. Here, nozzle row Ln1 is a collection of M1 nozzles N arranged so as to extend in the Y-axis direction. Furthermore, nozzle row Ln2 is a collection of M2 nozzles N arranged on the -X side of nozzle row Ln1 and extending in the Y-axis direction. Here, the values ​​M1 and M2 are natural numbers greater than or equal to 1, satisfying M1 + M2 = M. In this embodiment, the value M is assumed to be a natural number greater than or equal to 2. Hereinafter, the nozzles N constituting nozzle row Ln1 may be referred to as nozzles N1, and the nozzles N constituting nozzle row Ln2 may be referred to as nozzles N2.

[0099] Furthermore, the connecting plate 2B differs from the connecting plate 2 according to the first and second embodiments in that, instead of the M connecting flow channels RK1, M connecting flow channels RK2, M communicating flow channels RR1, and M communicating flow channels RR2, the connecting plate 2B includes M1 connecting flow channels RK1 corresponding one-to-one with the M1 nozzles N1, M2 connecting flow channels RK2 corresponding one-to-one with the M2 nozzles N2, M1 communicating flow channels RR1 corresponding one-to-one with the M1 nozzles N1, and M2 communicating flow channels RR2 corresponding one-to-one with the M2 nozzles N2. Furthermore, similarly to the connecting plate 2, the connecting plate 2B includes a supply flow channel RA1 extending in the Y-axis direction and a discharge flow channel RA2 extending in the Y-axis direction on the −X side when viewed from the supply flow channel RA1.

[0100] In addition, the pressure chamber substrate 3B differs from the pressure chamber substrate 3 involved in the first and second embodiments in that, instead of M pressure chambers CB1 and M pressure chambers CB2, M1 pressure chambers CB1 corresponding one-to-one to M1 nozzles N1 and M2 pressure chambers CB2 corresponding one-to-one to M2 nozzles N2 are formed.

[0101] In addition, the vibration plate 4B differs from the vibration plate 4 involved in the first and second embodiments in that, instead of M piezoelectric elements PZ1 and M piezoelectric elements PZ2, M1 piezoelectric elements PZ1 corresponding one-to-one to M1 nozzles N1 and M2 piezoelectric elements PZ2 corresponding one-to-one to M2 nozzles N2 are formed.

[0102] Figure 10 2 is a plan view of the liquid ejecting head 1B as viewed from the Z-axis direction.

[0103] In this embodiment, the liquid ejection head 1B has M circulation channels RJ that correspond one-to-one to the M nozzles N provided on the nozzle substrate 60B. Hereinafter, the circulation channel RJ corresponding to nozzle N1 will sometimes be referred to as circulation channel RJ1, and the circulation channel RJ corresponding to nozzle N2 will sometimes be referred to as circulation channel RJ2. That is, in this embodiment, the supply channel RA1 and the discharge channel RA2 are connected via M1 circulation channels RJ1 and M2 circulation channels RJ2.

[0104] Furthermore, in this embodiment, the circulation channels RJ1 and the circulation channels RJ2 are alternately arranged in the Y-axis direction. Furthermore, in this embodiment, M1 circulation channels RJ1 and M2 circulation channels RJ2 are arranged such that the interval between adjacent circulation channels RJ1 and circulation channels RJ2 in the Y-axis direction is dY.

[0105] The circulation channel RJ1 includes a pressure chamber CB1, and the circulation channel RJ2 includes a pressure chamber CB2. Figure 10 As shown, pressure chamber CB1 is located on the +X side relative to nozzle N1, and pressure chamber CB2 is located on the -X side relative to nozzle N2. Furthermore, nozzle row Ln1, to which nozzle N1 belongs, is located on the +X side relative to nozzle row Ln2, to which nozzle N2 belongs. Therefore, pressure chamber CB1 is located on the +X side relative to pressure chamber CB2.

[0106] Furthermore, the circulation channel RJ is configured such that the width of the pressure chambers CB1 and CB2 in the Y-axis direction is dCY, and the width of the portion excluding the pressure chambers CB1 and CB2 is dRY. Furthermore, in this embodiment, a case where the width dRY and the width dCY satisfy dRY < dCY is assumed. Furthermore, as an example, in this embodiment, a case where M1 circulation channels RJ1 and M2 circulation channels RJ2 are provided such that the interval dY and the width dCY satisfy dCY > dY is assumed.

[0107] In this way, in this embodiment, since the position of the pressure chamber CB1 in the X-axis direction and the position of the pressure chamber CB2 in the X-axis direction are different, the interval dY of the circulation channel RJ can be narrowed compared to the method in which the pressure chamber CB1 and the pressure chamber CB2 are set at the same position in the X-axis direction.

[0108] Figure 11 , which is a cross-sectional view of the liquid ejection head 1B cut parallel to the XZ plane in a manner passing through the circulation flow path RJ1. Figure 12 2 is a cross-sectional view of the liquid ejection head 1B cut parallel to the XZ plane so as to pass through the circulation flow path RJ2.

[0109] like Figure 11 as well as Figure 12 As shown, in this embodiment, the connecting plate 2B includes a substrate 21 located on the +Z side and a substrate 22 located on the -Z side. Substrates 21 and 22 are manufactured, for example, by processing a single crystal silicon substrate using semiconductor manufacturing techniques such as etching. However, any known materials and manufacturing methods can be used to manufacture substrates 21 and 22.

[0110] like Figure 11As shown, the circulation channel RJ1 has: a connecting channel RK1 connected to the supply channel RA1 and formed in the substrate 21 and the substrate 22, a pressure chamber CB1 connected to the connecting channel RK1 and formed in the pressure chamber substrate 3B, a connecting channel RR1 connected to the pressure chamber CB1 and formed in the substrate 21 and the substrate 22, a nozzle channel RN1 connected to the connecting channel RR1 and the nozzle N11 and formed in the substrate 21, a channel R11 connected to the nozzle channel RN1 and formed in the substrate 22, a channel R12 connected to the channel R11 and formed in the substrate 21, a channel R13 connected to the channel R12 and formed in the nozzle substrate 60B, a channel R14 connected to the channel R13 and formed in the substrate 21, and a channel R15 connected to the channel R14 and the exhaust channel RA2 and formed in the substrate 22. In the circulation flow passage RJ1 , the communication flow passage RR1 is an example of a supply communication flow passage, and the flow passages R11 to R15 are an example of a discharge communication flow passage.

[0111] In addition, if Figure 12 As shown, the circulation channel RJ2 has: a connecting channel RK2 connected to the discharge channel RA2 and formed in the substrate 21 and the substrate 22, a pressure chamber CB2 connected to the connecting channel RK2 and formed in the pressure chamber substrate 3B, a connecting channel RR2 connected to the pressure chamber CB2 and formed in the substrate 21 and the substrate 22, a nozzle channel RN2 connected to the connecting channel RR2 and the nozzle N2 and formed in the substrate 21, a channel R21 connected to the nozzle channel RN2 and formed in the substrate 22, a channel R22 connected to the channel R21 and formed in the substrate 21, a channel R23 connected to the channel R22 and formed in the nozzle substrate 60B, a channel R24 connected to the channel R23 and formed in the substrate 21, and a channel R25 connected to the channel R24 and the supply channel RA1 and formed in the substrate 22. In the circulation flow passage RJ2 , the flow passages R21 to R25 are examples of supply communication flow passages, and the communication flow passage RR2 is an example of a discharge communication flow passage.

[0112] Figure 13 It is a top view of the structure around the wiring substrate 8 of the liquid ejection head 1B involved in the third embodiment when observing it from the Z-axis direction, and the wiring substrate 8 is shown by dotted lines, and the piezoelectric elements PZ1, PZ2, wiring parts W1, W2, pressure chambers CB1, CB2, nozzle flow channels RN1, RN2 and nozzles N1, N2 are shown by solid lines in a perspective manner.

[0113] like Figure 13 As illustrated, the connection end portion 83 of the wiring board 8 is elongated in the Y-axis direction and is arranged substantially in the center of the column of the plurality of pressure chambers CB1 and the column of the plurality of pressure chambers CB2 arranged in the Y-axis direction.

[0114] Similar to the first embodiment, the wiring portion W1 connected to the upper electrode ZU1 of the piezoelectric element PZ1 extends to a connection position where the wiring substrate 8 is located and is electrically connected to the wiring substrate 8. This connection position overlaps with the nozzle flow channel RN1 when viewed from the Z-axis direction. Furthermore, the wiring portion W2 connected to the upper electrode ZU2 of the piezoelectric element PZ2 also extends to a connection position, overlapping with the nozzle flow channel RN2, when viewed from the Z-axis direction, and is connected to the wiring substrate 8. Regarding the shapes of the wiring portions W1 and W2, similar to the first embodiment, the wiring portions W1 and W2 bend between the positions of the piezoelectric elements PZ1 and PZ2 and the connection position. Specifically, the wiring portions W1 and W2 extend from the upper electrodes ZU1 and ZU2 of the piezoelectric elements PZ1 and PZ2 along the ±P directions for a predetermined length, bend there, and extend along the ±Q directions to reach the connection position with the wiring substrate 8. That is, at the connection position with the wiring substrate 8 , the wiring portions W1 and W2 extend in the ±Q directions that are different from the X-axis direction.

[0115] Figure 14 for, Figure 11 Cross-sectional view of line CC in.

[0116] like Figure 14 As shown in the example, the cross-section of the nozzle flow channel RN1 when viewed from the X-axis direction is configured to include two wall surfaces HRN1B and HRN2B parallel to the Z-axis, two wall surfaces CRN1B and BRN1B parallel to the Y-axis, and two inclined wall surfaces HD1B and HD2B. Here, wall surface BRN1B is an example of a first wall surface, wall surface CRN1B is an example of a second wall surface, walls HRN1B and HRN2B are examples of third and fourth walls, and walls HD1B and HD2B are examples of inclined surfaces.

[0117] Of these, wall surface BRN1B is the -Z-side surface of nozzle substrate 60B, i.e., the surface on the communicating plate 2B side. Furthermore, wall surface CRN1B is the +Z-side surface of substrate 22 constituting communicating plate 2B, i.e., the surface on substrate 21 side. The other wall surfaces HRN1B, HRN2B, HD1B, and HD2B are formed on substrate 21 of communicating plate 2B. Of the walls CRN1B and BRN1B parallel to the Y axis, the -Z-side wall CRN1B closest to wiring substrate 8 and the two walls HRN1B and HRN2B parallel to the Z axis are not directly connected but are connected via the inclined walls HD1B and HD2B.

[0118] Although not shown in the drawings, the nozzle flow channel RN2 also has the same cross-sectional shape as that of the nozzle flow channel RN1.

[0119] According to the liquid ejection head 1B of this embodiment, the same effects as those of the first embodiment can be obtained.

[0120] Furthermore, in the liquid ejection head 1B of the present embodiment, similarly to the second embodiment, the directions in which the wiring portions W1 and W2 extend may be varied at the connection locations with the wiring substrate 8, depending on the positions of the plurality of piezoelectric elements PZ1 and PZ2 in the Y-axis direction. Specifically, the wiring portions W1 and W2 of the plurality of piezoelectric elements PZ1 and PZ2 located at the ends on the +Y and -Y sides of the plurality of piezoelectric elements PZ1 and PZ2 arranged along the Y-axis direction may be made to extend in a direction different from the X-axis direction at the connection locations with the wiring substrate 8, while the wiring portions W1 and W2 of the piezoelectric elements PZ1 and PZ2 located at the center in the Y-axis direction may be made to extend in the X-axis direction.

[0121] 4. Fourth embodiment

[0122] Hereinafter, a liquid ejection device 100C according to a fourth embodiment will be described.

[0123] Although the first to third embodiments described above illustrate a serial-type liquid ejection device 100 in which the liquid ejection heads 1, 1A, and 1B reciprocate across the width of the medium PP, the present invention is not limited to this configuration. The liquid ejection device 100C of this embodiment is a line-type liquid ejection device in which a plurality of nozzles N are distributed across the entire width of the medium PP.

[0124] Figure 15 2 is an explanatory diagram showing the structure of a liquid ejection device 100C according to this embodiment.

[0125] The liquid ejection device 100C differs from the liquid ejection devices 100 according to the first to third embodiments in that it includes a control device 90C in place of the control device 90, a storage housing 921C in place of the storage housing 921, and lacks an endless belt 922. The control device 90C differs from the control device 90 in that it does not output a signal for controlling the endless belt 922. In the storage housing 921C, a plurality of liquid ejection heads 1 are arranged so as to extend across the entire width of the medium PP, with the Y-axis direction, the direction in which the nozzles N are arranged, being the longitudinal direction. In this embodiment, the medium PP is transported in the +X direction, which is perpendicular to the Y-axis direction. Alternatively, the storage housing 921C may include a liquid ejection head 1A or a liquid ejection head 1B in place of the liquid ejection head 1.

[0126] The liquid ejection device 100C of this embodiment can also obtain the same effects as those of the first to third embodiments.

[0127] Furthermore, each of the above-mentioned embodiments may be modified as follows.

[0128] While the energy generating elements that apply pressure to the interiors of pressure chambers CB1 and CB2 in the first through fourth embodiments described above use piezoelectric elements PZ1 and PZ2 that convert electrical energy into kinetic energy, the present invention is not limited to this embodiment. For example, a heating element that converts electrical energy into thermal energy and generates bubbles within the pressure chambers CB1 and CB2 through heating, thereby causing the pressure within the pressure chambers CB1 and CB2 to fluctuate, may also be used as the energy generating element that applies pressure to the interiors of pressure chambers CB1 and CB2. For example, the heating element may be an element that generates heat when supplied with a drive signal COM.

[0129] Furthermore, while the liquid ejection heads 1, 1A, and 1B illustrated in the first through fourth embodiments can be used in various devices, including facsimile machines and copiers, in addition to dedicated printing equipment, their applications are not limited to printing. For example, a liquid ejection head configured to eject a solution of a color material instead of ink can be used as a device for manufacturing color filters for liquid crystal displays. Furthermore, a liquid ejection head configured to eject a solution of a conductive material can be used as a device for manufacturing wiring and electrodes for wiring boards.

[0130] Explanation of symbols

[0131] 1, 1A, 1B…liquid ejection head; 2, 2B…connecting plate; 3, 3B…pressure chamber substrate; 4, 4B…vibration plate; 5…reservoir forming substrate; 8…wiring substrate; 21, 22…substrate; 50…opening; 51…inlet; 52…exhaust outlet; 60, 60B…nozzle substrate; 61; 62…plastic thin plate; 81…driving circuit; 82…main body; 83…connecting end; 90, 90C…control device; 91…moving mechanism; 92…conveying mechanism; 93…liquid container; 94…circulation mechanism; 100, 100C…liquid ejection device; 921, 921C…storage housing; 922…endless belt; CRN1, BRN1, HRN1, HRN2, HD1, HD2, CRN1B, BRN1B, HRN1B, HRN2B, HD1B, HD2B …wall; CB1, CB2…pressure chamber; COM…drive signal; Ln, Ln1, Ln2…nozzle array; M, M1, M2…value; N, N1, N2…nozzle; PP…medium; PZ1, PZ2…piezoelectric element; R11, R12, R13, R14, R15, R21, R22, R23, R24, R25…flow channel; RA1, RB1…supply flow channel; RA2, RB2…discharge flow channel; RJ, RJ1, RJ2…circulation flow channel; RK1, RK2…connecting flow channel; RN, RN1, RN2…nozzle flow channel; RR1, RR2…connecting flow channel; SI…control signal; W1, W2…wiring section; ZD1, ZD2…lower electrode; ZM1, ZM2…piezoelectric body; ZU1, ZU2…upper electrode; dCY, dRY…width, dY…interval.

Claims

1. A liquid ejection head, characterized in that: have: First pressure chamber; a first energy generating element that generates energy for applying pressure to the liquid in the first pressure chamber; a nozzle flow channel extending in a first direction and communicating with a nozzle for spraying liquid; a supply communication channel, which connects the first pressure chamber and the nozzle channel and is used to supply liquid to the nozzle channel; a discharge communication channel, which is in communication with the nozzle channel and is used to discharge liquid from the nozzle channel; a wiring substrate electrically connected to a drive circuit that drives the first energy generating element; a first wiring portion electrically connecting the wiring substrate and the first energy generating element; a second pressure chamber; a second energy generating element that generates energy for applying pressure to the liquid in the second pressure chamber; a second wiring portion that electrically connects the wiring substrate and the second energy generating element; The first wiring portion is provided at a position overlapping with the nozzle flow path when viewed in a second direction orthogonal to the first direction, and extends in a third direction different from the first direction. The discharge communication channel connects the second pressure chamber and the nozzle channel. The second wiring portion is provided at a position overlapping with the nozzle flow channel when viewed in the second direction, and extends in a fourth direction different from the first direction.

2. The liquid ejection head according to claim 1, wherein The third direction is parallel to the fourth direction.

3. The liquid ejection head according to claim 1 or 2, wherein: The first wiring portion and the second wiring portion have substantially the same path length.

4. The liquid ejection head according to claim 1, wherein The wiring substrate is located substantially at the center of the nozzle flow path in the first direction when viewed in the second direction.

5. The liquid ejection head according to claim 1, wherein The second direction is orthogonal to both the first direction and the third direction.

6. The liquid ejection head according to claim 1, wherein The first pressure chamber extends in the first direction, The supply communication flow path extends in the second direction.

7. The liquid ejection head according to claim 1, wherein The first energy generating element includes a piezoelectric body, a common electrode provided in common to the plurality of first energy generating elements, and an independent electrode provided independently to the plurality of first energy generating elements, stacked in the second direction. The first wiring portion electrically connects the wiring substrate and the individual electrodes of the first energy generating element.

8. The liquid ejection head according to claim 1, wherein The first wiring portion includes a portion extending in the third direction and a portion extending in a fifth direction different from both the first direction and the third direction.

9. The liquid ejection head according to claim 1, wherein The first pressure chamber, the first energy generating element, the first wiring portion, the nozzle flow channel, the supply communication flow channel, and the discharge communication flow channel are provided in plurality along a sixth direction orthogonal to both the first direction and the second direction. At an end portion in the sixth direction, the first wiring portion extends in a direction different from the first direction, The first wiring portion extends in the first direction at a center portion in the sixth direction.

10. The liquid ejection head according to claim 1, wherein A cross section of the nozzle flow channel viewed from the first direction includes a first wall surface and a second wall surface parallel to a sixth direction, and a third wall surface and a fourth wall surface parallel to the second direction, wherein the sixth direction is orthogonal to both the first direction and the second direction. Of the first wall surface and the second wall surface, the wall surface close to the wiring substrate is connected to the third wall surface and the fourth wall surface via an inclined surface inclined with respect to both the sixth direction and the second direction.

11. A liquid ejection device, characterized in that: have: The liquid ejection head according to any one of claims 1 to 10; A control device controls the ejection operation of the liquid ejection head.

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