Display device manufacturing method and manufacturing device

Abstract

The present invention provides a method and device for manufacturing a display device, which can prevent losses caused by defects that may occur in the manufacturing process. The method comprises: a step of arranging a substrate having a mark on a first surface in a manner overlapping with an electrostatic suction cup; a step of adsorbing the second surface of the substrate to the electrostatic suction cup; and a step of checking whether the adsorption of the substrate is poor, wherein the step of checking whether the adsorption is poor comprises: a step of acquiring a first captured image of the mark; searching for a mark area where the mark exists in the first captured image; calculating a first characteristic value for the mark area; and a step of comparing the first characteristic value with a pre-set first critical value to determine whether the adsorption is poor.

Description

Technical Field

[0001] Embodiments of the present invention relate to a method and an apparatus for manufacturing a display device, and more particularly, to a method and an apparatus for manufacturing a display device that can prevent losses caused by defects that may occur in a manufacturing process. Background Art

[0002] As the display field that visually expresses various electrical signal information is rapidly developing, various display devices with excellent characteristics such as thinness, lightness, and low power consumption are being introduced. Generally, a display device includes a plurality of pixels, each of which includes a display element and a pixel circuit for controlling the display element.

[0003] On the other hand, in the process of manufacturing a display device, by fixing the substrate using an electrostatic chuck, the reliability and accuracy of the process can be improved. Specifically, by processing the corresponding substrate with one side of the substrate adsorbed on the electrostatic chuck, the substrate can be firmly fixed during the process. Summary of the invention

[0004] However, in such conventional display device manufacturing methods and manufacturing devices, there is a problem that poor adsorption or poor desorption occurs during the process of chucking the substrate onto the electrostatic chuck or dechucking the substrate from the electrostatic chuck, thereby inducing a loss in the manufacturing process.

[0005] The present invention is used to solve various problems including the above-mentioned problems, and its purpose is to provide a display device manufacturing method and manufacturing device that can prevent losses caused by defects that may occur in the manufacturing process. However, this subject is exemplary and the scope of the present invention is not limited thereto.

[0006] According to one aspect of the present invention, there is provided a method for manufacturing a display device, comprising: a step of configuring a substrate having a mark on a first surface so as to overlap with an electrostatic suction cup; a step of adsorbing the second surface of the substrate to the electrostatic suction cup; and a step of checking whether the adsorption of the substrate is poor, the step of checking whether the adsorption is poor comprising: a step of acquiring a first captured image of the mark; searching the first captured image for a mark area where the mark exists; calculating a first eigenvalue for the mark area; and a step of comparing the first eigenvalue with a pre-set first critical value to determine whether the adsorption is poor.

[0007] According to this embodiment, the first feature value may be a matching score, and the step of calculating the first feature value is a step of comparing pixel values ​​of pixels of the marked area with pixel values ​​of pixels of a pre-stored template image to calculate the matching score based on consistency.

[0008] According to this embodiment, the size of the marked area may be the same as the size of the template image, and the step of searching for the marked area is to move the template image on the first captured image, and compare the pixel values ​​of the pixels of the area overlapping with the template image on the first captured image with the pixel values ​​of the pixels of the template image to search for the marked area.

[0009] According to this embodiment, the matching score may be proportional to the degree of consistency between pixel values ​​of pixels in the mark area and pixel values ​​of pixels in the template image, and may be greater than or equal to 0 and less than or equal to 1.

[0010] According to this embodiment, the display device manufacturing method may also include: performing a pre-processing step of standardizing the pixel values ​​of the pixels of the first captured image or the pixel values ​​of the pixels of the template image, and calculating the matching score based on the pre-processed first captured image or the pre-processed template image.

[0011] According to this embodiment, the pixel value of the pixel of the first captured image or the pixel value of the pixel of the template image may be greater than 0 and less than 255, and the pre-processing standardizes the pixel value of the pixel of the first captured image or the pixel value of the pixel of the template image to be greater than 0 and less than 1.

[0012] According to this embodiment, the step of searching for the mark area may include: moving a row-column filter on the first captured image, and detecting pixels where the edge of the mark exists based on a gradient of pixel values ​​of pixels overlapping the row-column filter.

[0013] According to this embodiment, the step of searching for the marked area may further include: differentially adjusting pixel values ​​of pixels where the marked edge exists and pixels where the marked edge does not exist.

[0014] It may be that the first feature value is an average pixel value of pixel values ​​of pixels in the marking area after the pixel value adjustment is performed.

[0015] According to this embodiment, the step of comparing the first characteristic value with a pre-set first critical value to determine whether the adsorption is poor or not may be a step of determining that the adsorption is poor when the first characteristic value is below the first critical value, and determining that the adsorption is normal when the first characteristic value exceeds the first critical value.

[0016] According to this embodiment, the display device manufacturing method may further include: a step of desorbing the substrate from the electrostatic suction cup; and a step of checking whether the desorption of the substrate is poor or not, the step of checking whether the desorption is poor or not includes: a step of acquiring a second captured image for the mark; a step of searching the second captured image for a mark area where the mark exists; a step of calculating a second eigenvalue for the mark area; and a step of comparing the second eigenvalue with a pre-set second critical value to determine whether the desorption is poor or not.

[0017] According to this embodiment, the step of comparing the second characteristic value with a preset second critical value to determine whether desorption is poor or not may be a step of determining that desorption is poor when the second characteristic value is above the second critical value, and determining that desorption is normal when the second characteristic value is less than the second critical value.

[0018] According to this embodiment, the display device manufacturing method may further include: a step of providing an adsorption poor alarm when the mark is located on the vertex area of ​​the first surface of the substrate and a first captured image of the mark located in more than one vertex area of ​​the vertex area of ​​the first surface is judged to be poor adsorption; and a step of providing a desorption poor alarm when a second captured image of the mark located in more than one vertex area of ​​the vertex area of ​​the first surface is judged to be poor desorption.

[0019] According to this embodiment, the display device manufacturing method may further include a step of checking whether the substrate is poorly configured, the step of checking whether the configuration is poorly configured is a step of judging that the configuration is poorly configured when the sensing unit does not sense the substrate when the sensing unit is adsorbed on the electrostatic suction cup, and judging that the configuration is normal when the sensing unit senses the substrate, and the step of checking whether the adsorption is poorly configured is a step of checking whether the adsorption is poorly configured on a normally configured substrate.

[0020] According to this embodiment, the display device manufacturing method may further include a step of checking whether the substrate is poorly separated or not, the step of checking whether the separation is poor or not is a step of judging that the separation is poor when the substrate is sensed by the sensing unit when the substrate is desorbed from the electrostatic suction cup, and judging that the separation is normal when the substrate is not sensed by the sensing unit, and the step of checking whether the desorption is poor or not is a step of checking whether the desorption is poor or not on a normally separated substrate.

[0021] According to this embodiment, the sensing unit may sense the vertex areas of the first surface of the substrate respectively, and provide a poor configuration alarm when more than one vertex area of ​​the vertex area of ​​the first surface is judged to be poorly configured, and provide a poor separation alarm when more than one vertex area of ​​the vertex area of ​​the first surface is judged to be poorly separated.

[0022] According to this embodiment, the display device manufacturing method may further include a step of forming a patterned layer having a preset pattern on the first surface of the substrate, and the mark is located on the same layer as the patterned layer.

[0023] According to another aspect of the present invention, there is provided a display device manufacturing apparatus, comprising: a chamber; a workbench located in the chamber; an electrostatic suction cup combined with the workbench in an overlapping manner; a photographing unit, which obtains first photographed image data of a mark located on a first surface of the substrate when the second surface of the substrate is adsorbed on the electrostatic suction cup; and a poor adsorption inspection unit, which searches for a mark area where the mark exists in a first photographed image from the first photographed image data, calculates a first eigenvalue for the mark area, and compares the first eigenvalue with a predetermined first critical value to determine whether adsorption is poor or not.

[0024] According to this embodiment, the photographing unit may also obtain a second photographed image for the mark when desorbing the substrate from the electrostatic suction cup, and the display device manufacturing device may also include: a desorption defect inspection unit, which searches for a mark area where the mark exists in the second photographed image, calculates a second eigenvalue for the mark area, and compares the second eigenvalue with a pre-set second critical value to determine whether desorption is defective or not.

[0025] According to the present embodiment, the display device manufacturing apparatus may further include: a sensing unit, which is located at the vertex area of ​​the workbench and senses the substrate when the substrate is adsorbed on the electrostatic suction cup or when the substrate is desorbed from the electrostatic suction cup; a configuration failure inspection unit, which, when the substrate is adsorbed on the electrostatic suction cup, determines that the configuration is poor when the sensing unit does not sense the substrate, and determines that the configuration is normal when the sensing unit senses the substrate; and a separation failure inspection unit, which, when the substrate is desorbed from the electrostatic suction cup, determines that the separation is poor when the sensing unit senses the substrate, and determines that the separation is normal when the sensing unit does not sense the substrate.

[0026] Other aspects, features, and advantages besides the foregoing will become apparent from the following detailed description for carrying out the invention, the claims, and the accompanying drawings.

[0027] The general and specific aspects can be implemented using a system, a method, a computer program, or a combination of a system, a method, and a computer program.

[0028] (Effects of the Invention)

[0029] According to one embodiment of the present invention configured as described above, a display device manufacturing method and manufacturing device that can prevent losses caused by defects that may occur in the manufacturing process can be realized. Of course, the scope of the present invention is not limited to this effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 FIG. 1 is a block diagram schematically showing a part of a display device manufacturing apparatus according to an embodiment of the present invention.

[0031] Figure 2 It is a summary Figure 1 A cross-sectional view of a portion of a display device manufacturing apparatus.

[0032] Figure 3 It is a summary Figure 1 A perspective view of a portion of a display device manufacturing apparatus.

[0033] Figure 4 It is a summary Figure 1 A block diagram of a portion of a photographing unit included in a display device manufacturing apparatus.

[0034] Figure 5 is a cross-sectional view schematically showing a part of a display device manufacturing apparatus according to another embodiment of the present invention.

[0035] Figure 6 It is a summary Figure 5 A three-dimensional view of a workbench and a portion of an electrostatic chuck of a display device manufacturing apparatus.

[0036] Figure 7 is a flowchart schematically showing a part of a method for manufacturing a display device according to still another embodiment of the present invention.

[0037] Figure 8 It is a summary Figure 7 A flowchart of a part of a step of inspecting whether adsorption is defective included in a method for manufacturing a display device.

[0038] Fig. 9 This is an example of an image captured when adsorption is poor.

[0039] Fig.10 This is an example of an image captured during normal adsorption.

[0040] Fig.11 It is a summary Figure 7A flowchart of a part of a step of inspecting whether desorption is defective included in a method for manufacturing a display device.

[0041] Fig.12 This is an example of an image captured when desorption is poor.

[0042] Fig.13 This is an example of an image captured during normal desorption.

[0043] Fig.14 This is a diagram showing an example of how characteristic values ​​appear when desorption is poor.

[0044] Fig.15 This is a diagram that provides an example of what the characteristic values ​​look like during normal desorption.

[0045] Fig.16 This is a diagram that visually provides an example of the appearance of the characteristic values ​​calculated in the desorption failure inspection step.

[0046] Fig.17 is a flowchart schematically showing a part of a method for manufacturing a display device according to still another embodiment of the present invention.

[0047] Fig.18 FIG. 1 is a sequence diagram schematically showing a part of a method for manufacturing a display device according to still another embodiment of the present invention.

[0048] (Explanation of Reference Numerals)

[0049] 1: Display device manufacturing equipment

[0050] 10: Substrate

[0051] 11: Marking

[0052] 100: Chamber

[0053] 110: Observation window

[0054] 200: Workbench

[0055] 210: Sensor

[0056] 220-1: First desorption auxiliary unit

[0057] 220-2: Second desorption auxiliary unit

[0058] 300: Electrostatic chuck

[0059] 400: Photography Department

[0060] 500: Inspection Department

[0061] 510: Adsorption failure inspection department

[0062] 520: Desorption failure inspection department

[0063] 530: Configuration failure inspection department

[0064] 540: Separation failure inspection department DETAILED DESCRIPTION

[0065] The present invention can be subjected to various modifications and can have various embodiments. Specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects, features and methods of achieving the effects, features and methods of achieving the effects of the present invention can be referred to in the attached drawings. Figure 1 This will become clear from the following detailed embodiments. However, the present invention is not limited to the embodiments disclosed below, and can be implemented in various forms.

[0066] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, the same or corresponding components will be given the same reference numerals and repeated description thereof will be omitted.

[0067] In the following embodiments, the terms "first" and "second" are used for the purpose of distinguishing one constituent element from another constituent element and are not intended to be limiting.

[0068] In the following embodiments, a singular expression includes a plural expression unless it is clearly indicated as having a different meaning in the context.

[0069] In the following embodiments, the terms including or having refer to the existence of features or constituent elements recorded in the specification, and do not preclude the possibility of the addition of one or more other features or constituent elements.

[0070] In the following embodiments, when a film, region, constituent element, etc. is expressed as being on or above another part, it includes not only the case where it is directly on the other part, but also the case where other films, regions, constituent elements, etc. are interposed therebetween.

[0071] In the drawings, the dimensions of the components may be enlarged or reduced for the convenience of explanation. For example, the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation, and therefore the present invention is not necessarily limited to the drawings.

[0072] When a certain embodiment can be implemented differently, a specific process sequence can also be performed differently from the described sequence. For example, two processes described successively can be performed substantially simultaneously, or in a sequence opposite to the described sequence.

[0073] In this specification, "A and / or B" means A, or B, or A and B. In addition, "at least one of A and B" means A, or B, or A and B.

[0074] In the following embodiments, when a film, region, component, etc. is referred to as being connected, it includes the case where the film, region, component, etc. is directly connected, and / or the case where the film, region, component, etc. is indirectly connected with another film, region, component, etc. in the middle. For example, when a film, region, component, etc. is referred to as being electrically connected in this specification, it means the case where the film, region, component, etc. is directly electrically connected, and / or the case where the film, region, component, etc. is indirectly electrically connected with another film, region, component, etc. in the middle.

[0075] The x-axis, y-axis, and z-axis are not limited to the three axes on the rectangular coordinate system, but can be interpreted as having a broad meaning including them. For example, the x-axis, y-axis, and z-axis can be orthogonal to each other, but can also refer to different directions that are not orthogonal to each other.

[0076] In this specification, "pixel value" means a value obtained by digitizing pixel information. For example, a pixel value may be a value obtained by digitizing grayscale value, brightness, saturation, color, luminance, hue, etc., but is not limited to the above examples.

[0077] In this specification, a “feature value” is a value calculated by quantifying the sharpness of the mark 11 in the captured image of the mark 11 .

[0078] In this specification, the “critical value” means a value that serves as a reference for determining whether the substrate 10 has adsorption failure, desorption failure, arrangement failure, or separation failure based on the calculated characteristic value.

[0079] In this specification, a "vertex region" means a region which is adjacent to a vertex and has an area of ​​a certain size.

[0080] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0081] Figure 1 FIG. 1 is a block diagram schematically showing a part of a display device manufacturing apparatus according to an embodiment of the present invention.

[0082] like Figure 1 As shown, the display device manufacturing apparatus 1 according to an embodiment of the present invention may include a chamber 100, a workbench 200, an electrostatic chuck 300, a photographing unit 400, and an inspection unit 500. In addition, the inspection unit 500 may include at least one of an adsorption failure inspection unit 510, a desorption failure inspection unit 520, a configuration failure inspection unit 530, and a separation failure inspection unit 540.

[0083] The chamber 100 provides a space for performing a part of the process of manufacturing the display device. The internal space of the chamber 100 may contain the components required for the process. For example, in order to perform the evaporation process, the chamber 100 may have an evaporation source unit (not shown) that sprays the evaporation source, a substrate 10 as an evaporation object, a mask (not shown) that is closely attached to one side of the substrate 10, an electrostatic chuck 300 for fixing the substrate 10, and a workbench 200 combined with the electrostatic chuck 300. In addition, the internal space of the chamber 100 can provide the environmental conditions required for the process. For example, the internal space of the chamber 100 can be set to meet the conditions of temperature, pressure, humidity, vacuum state, etc. suitable for the evaporation process.

[0084] The workbench 200 may be located in the inner space of the chamber 100 and combined with the electrostatic chuck 300. The workbench 200 may be designed to be fixed at a specific position or to be movable in the upward, downward, left, right, etc. directions. Thus, the workbench 200 is combined with the electrostatic chuck 300 so that the electrostatic chuck 300 is fixed at a specific position or to be movable in the upward, downward, left, right, etc. directions.

[0085] The electrostatic chuck 300 plays the role of fixing the adsorbed object by using electrostatic force. The electrostatic chuck can be a monopolar type, a bipolar type, a coulomb type, a Johnson-Rahbek type, etc., and its form is not limited. As a specific example, one side of the electrostatic chuck 300 can be overlapped and combined with the workbench 200, and the process object substrate 10 is arranged on the other side.

[0086] At this time, the substrate 10 may include a glass material, a metal material, a ceramic material, or a material having a flexible or bendable property. When the substrate 10 has a flexible or bendable property, the substrate 10 may include, for example, a polymer resin such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. The substrate 10 may have a single-layer or multi-layer structure composed of the above-mentioned materials. In the case of a multi-layer structure, it may also have a multi-layer structure including two layers including a polymer resin and a barrier layer including an inorganic substance (such as silicon oxide, silicon nitride, silicon oxynitride, etc.) between these layers, and various deformations may be performed.

[0087] In addition, a display element and a pixel circuit electrically connected to the display element may exist on one side of the substrate 10. Such a display element and the pixel circuit may be formed into a multi-layer structure, and may include a patterned layer having a predetermined pattern.

[0088] As an example, a mark 11 may exist in the same layer as a pattern layer formed on one side of the substrate 10. For example, the mark 11 may be formed of the same material in the same layer as a pattern layer (eg, a semiconductor layer) initially formed on the substrate 10.

[0089] The mark 11 is formed to have a predetermined shape in a predetermined area on the substrate 10. As a specific example, the mark 11 may be located in an area (hereinafter, vertex area) adjacent to a vertex on the substrate 10 and having a specific area. In addition, the shape of the mark 11 may be a polygonal shape such as a triangle, a quadrilateral, a pentagon, a circular shape, an elliptical shape, a "+" shape, a "-" shape, etc., but may have any shape without being limited to the above examples. In addition, a plurality of marks 11 having the same or different shapes may exist on the substrate 10.

[0090] In the display device manufacturing method and manufacturing device according to an embodiment of the present invention, the mark 11 can be used for mask alignment, or for judging whether the substrate 10 is poorly configured, poorly adsorbed, poorly separated, or poorly desorbed when adsorbed or desorbed on the electrostatic suction cup 300. A detailed description of this will be given later.

[0091] As an embodiment, the electrostatic chuck 300 may include a main body and an electrode sheet. It may be that the electrode sheet exists on one side of the main body of the electrostatic chuck 300, and the electrode sheet adsorbs the substrate 10. Specifically, when the substrate 10 is arranged on the electrode sheet of the electrostatic chuck 300 in an overlapping manner, if power is supplied to the electrode sheet, the substrate 10 is adsorbed on the electrostatic chuck 300, and if power is cut off to the electrode sheet, the substrate 10 is detached from the electrostatic chuck 300. At this time, supplying power to the electrode sheet can be understood as supplying power to the electrode layer having the electrode sheet.

[0092] The main body of the electrostatic chuck 300 may include metal or ceramic. For example, the main body may be formed of one or more metals selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu) as a single layer or multiple layers, and may include a metal selected from silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) and zinc oxide (ZnO 2 ) of the group, but is not limited to the above examples.

[0093] The electrode sheet of the electrostatic chuck 300 may have a stacked structure in which a first insulating layer, a first electrode layer, an inter-electrode insulating layer, a second electrode layer, and a second insulating layer are sequentially stacked.

[0094] The first electrode layer and the second electrode layer of the electrode sheet of the electrostatic suction cup 300 can be formed into a single layer or a multilayer by one or more metals selected from aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), and copper (Cu), but are not limited to the above examples.

[0095] The first insulating layer, the inter-electrode insulating layer, and the second insulating layer of the electrode sheet of the electrostatic chuck 300 may include a layer selected from a group consisting of silicon oxide (SiO 2 ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), Tantalum Oxide (Ta 2 O 5 ), hafnium oxide (HfO 2 ) and zinc oxide (ZnO 2 ) of the group, but is not limited to the above examples.

[0096] The electrostatic chuck 300 may not be limited to the above-mentioned examples but may be configured to include various configurations and structures.

[0097] During the alignment process of the substrate 10 with respect to the electrostatic chuck 300, the photographing unit 400 can photograph the mark 11 on the substrate 10 and obtain photographed image data of the mark 11. As a specific example, the photographing unit 400 can obtain first photographed image data of the mark 11 on the other side of the substrate 10 at the time when one side of the substrate 10 is attached to the electrostatic chuck 300, or obtain second photographed image data of the mark 11 on the substrate 10 at the time when the substrate 10 is detached from the electrostatic chuck 300.

[0098] The captured image data (e.g., first captured image data or second captured image data) acquired from the capturing unit 400 may include a captured image (e.g., first captured image or second captured image) of the mark 11, and the captured image may be used by the inspection unit 500 to inspect whether the substrate 10 has poor adsorption or desorption. A detailed description of this will be given later.

[0099] The photographing unit 400 may be a digital camera that can convert light entering through a lens into an electrical image signal. For example, the photographing unit 400 may include a camera having an image sensor (e.g., a CCD image sensor, a CMOS image sensor, etc.), an area scan camera, a line scan camera, etc., but is not limited thereto. The detailed structure of the photographing unit 400 will be described in detail in detail. Figure 4 To be discussed later.

[0100] As an embodiment, the photographing unit 400 may include a plurality of cameras corresponding to the marking areas where the marking 11 exists on the substrate 10. As a specific example, when the substrate 10 is a quadrilateral with 4 vertices, and the marking 11 is located in the 4 vertex areas on the substrate 10, the plurality of cameras may exist in a manner that the marking 11 located in the 4 vertex areas may be respectively photographed. In this case, the substrate 10 may be a polygon such as a triangle, a quadrilateral, a pentagon, etc., and the photographing unit 400 may include a plurality of cameras configured corresponding to the number of vertices of the substrate 10.

[0101] The inspection unit 500 is used to inspect whether the substrate 10 has poor adsorption, poor desorption, poor configuration, or poor separation. To this end, the inspection unit 500 may include one or more of a poor adsorption inspection unit 510, a poor desorption inspection unit 520, a poor configuration inspection unit 530, and a poor separation inspection unit 540. At this time, the poor adsorption inspection unit 510, the poor desorption inspection unit 520, the poor configuration inspection unit 530, and the poor separation inspection unit 540 may be provided separately, or part or all of them may be provided integrally.

[0102] The inspection unit 500 may be built into the display device manufacturing apparatus 1 or integrally provided, but is not limited thereto, and may also be provided in an external device connected to the display device manufacturing apparatus 1 or provided in the form of a server. In addition, the inspection unit 500 may be provided in the form of a central processing unit (Central Processing Unit) that can perform storage, analysis, calculation, and control functions.

[0103] As an embodiment, the inspection unit 500 can search for a mark area where the mark 11 exists in the captured image from the captured image data obtained by the imaging unit 400, calculate a feature value for the searched mark area, and compare the calculated feature value with a preset critical value to determine whether the adsorption is poor or the desorption is poor. As another embodiment, the inspection unit 500 can be based on the detection of the mark 11 by the sensing unit 210 (refer to Figure 5 ) whether the substrate 10 is sensed to check whether the arrangement or separation of the substrate 10 is defective. Detailed description of each embodiment will be described later.

[0104] Figure 2 It is a summary Figure 1 A cross-sectional view of a portion of a display device manufacturing apparatus, Figure 3 It is a summary Figure 1 A perspective view of a portion of a display device manufacturing apparatus. Figure 2 Compare, in Figure 3 The chamber 100 is omitted and shown.

[0105] like Figure 2As shown, a workbench 200 may be present in the internal space of the chamber 100. On the workbench 200, one side of the electrostatic chuck 300 may overlap and combine with the workbench 200, and on the other side of the electrostatic chuck 300, the substrate 10 may overlap and be arranged with the electrostatic chuck 300. At this time, the substrate 10 is arranged so that the mark 11 is located on the surface opposite to the surface facing the electrostatic chuck 300.

[0106] On the other hand, Figure 2 as well as Figure 3 The figure shows a situation in which the electrostatic chuck 300 is combined with the bottom of the workbench 200 and the substrate 10 is arranged below the electrostatic chuck 300 (in the -z-axis direction). However, it can also be the opposite that the electrostatic chuck 300 is combined with the top of the workbench 200 (in the +z-axis direction) and the substrate 10 is arranged above the electrostatic chuck 300. Of course, the contents described below can be applied to each situation in the same way.

[0107] As an embodiment, the imaging unit 400 may be disposed below the surface of the substrate 10 where the mark 11 exists and corresponding to the mark area. For example, the imaging unit 400 may be disposed vertically apart from the mark 11.

[0108] As another embodiment, the photographing unit 400 may be located outside the chamber 100. In this case, the chamber 100 may have one or more openings on a portion of the outer side surface, so that the photographing unit 400 located outside the chamber 100 can photograph the mark 11 on the substrate 10 located inside the chamber 100. An observation window 110 through which light can pass may be present in the opening of the chamber 100. The observation window 110, as a transparent resin portion, may include a polymer material such as polycarbonate. Thus, the light irradiated from the photographing unit 400 can be irradiated onto the substrate 10, and the light can be used in an alignment process of the substrate 10 with respect to the electrostatic chuck 300 or an alignment process of a mask (not shown) on the substrate 10.

[0109] Reference Figure 3 , the substrate 10 arranged in a manner overlapping with the electrostatic chuck 300 can be adsorbed to one side of the electrostatic chuck 300 by the electrostatic force generated by the electrostatic chuck 300. Specifically, after the substrate 10 and the electrostatic chuck 300 are arranged overlapping, if power is supplied to the electrostatic chuck 300, the substrate 10 is pulled and adsorbed and fixed to the electrostatic chuck 300 by the electrostatic force generated by the electrostatic chuck 300. On the other hand, if the power of the electrostatic chuck 300 is cut off while the substrate 10 is adsorbed on the electrostatic chuck 300, the substrate 10 can be detached and separated from the electrostatic chuck 300.

[0110] Figure 4 It is a summary Figure 1 A block diagram of a portion of a photographing unit 400 included in a display device manufacturing apparatus.

[0111] The overall operation of the imaging unit 400 can be managed by the CPU. In addition, the imaging unit 400 can have an operation unit including a key that generates an electrical signal from the user. The electrical signal from the operation unit is transmitted to the CPU, so that the CPU can control the imaging unit 400 according to the electrical signal. On the other hand, the CPU of the imaging unit 400 can of course be integrally formed with the CPU of the inspection unit 500.

[0112] When the electrical signal from the user is applied to the CPU, the CPU controls the lens driving unit 411, the aperture driving unit 421, and the imaging element control unit 431 by grasping the signal, thereby controlling the position of each lens 410, the opening degree of the aperture 420, and the sensitivity of the imaging element 430. The imaging element 430 may generate captured image data from the input light, and the analog / digital conversion unit 440 may convert the analog data output from the imaging element 430 into digital data. Of course, depending on the characteristics of the imaging element 430, the analog / digital conversion unit 440 may not be required.

[0113] The data from the imaging element 430 may be input to the digital signal processing unit 450 via the memory 460 or may be input to the digital signal processing unit 450 without passing through the memory 460, or may be input to the CPU as needed. Here, the memory 460 may be understood as a concept including ROM or RAM, etc. The digital signal processing unit 450 may perform digital signal processing such as gamma correction and white balance adjustment as needed.

[0114] The captured image data output from the digital signal processing unit 450 may be transmitted to the display control unit 481 through the memory 460 or directly. The display control unit 481 controls the display unit 480 to display the captured image on the display unit 480. Then, the captured image data output from the digital signal processing unit 450 may be input to the storage / reading control unit 471 through the memory 460 or directly, and the storage / reading control unit 471 may store the captured image data in the storage medium 470 according to a signal from the user or automatically. Of course, the storage / reading control unit 471 may also read the captured image data from the captured image file stored in the storage medium 470, and input it to the display control unit 481 through the memory 460 or through other means, so that the image is displayed on the display unit 480. The storage medium 470 may be provided in a form of being permanently installed in the shooting unit 400, or may be configured to be detachable from the shooting unit 400.

[0115] Figure 5 is a cross-sectional view schematically showing a portion of a display device manufacturing apparatus according to another embodiment of the present invention, Figure 6 It is a summary Figure 5A three-dimensional view of a portion of a workbench 200 and an electrostatic chuck 300 of a display device manufacturing apparatus.

[0116] like Figure 5 As shown, the display device manufacturing apparatus 1 according to another embodiment of the present invention may further include a sensing unit 210 .

[0117] The sensing unit 210 may sense the substrate 10 when the substrate 10 is adsorbed on the electrostatic chuck 300 or when the substrate 10 is detached from the electrostatic chuck 300 .

[0118] The sensing unit 210 may include a photoelectric sensor, an electrostatic capacity proximity sensor, an inductive proximity sensor, a magnetic proximity sensor, etc., but is not limited to the above examples and may include any position sensing sensor. For example, the sensing unit 210 may include a photoelectric sensor having a light-transmitting portion that emits light and a light-receiving portion that receives light. At this time, the photoelectric sensor included in the sensing unit 210 can determine whether the substrate 10 is located in the sensing area of ​​the sensing unit 210 by detecting the change in the amount of light that is transmitted from the light-transmitting portion and is reflected by the substrate 10 and reaches the light-receiving portion. Through this, the sensing unit 210 can sense whether the substrate 10 is configured in an appropriate position when the substrate 10 is adsorbed on the electrostatic chuck 300, or sense whether the substrate 10 is properly separated from the electrostatic chuck 300 when the substrate 10 is detached from the electrostatic chuck 300.

[0119] As an example, Figure 6 As shown, the sensing unit 210 may include a sensor located on the workbench 200 and existing in a manner overlapping with the area where the vertex area of ​​the substrate 10 exists when the substrate 10 is adsorbed on the electrostatic chuck 300. To this end, the electrostatic chuck 300 may have a portion (depressed portion) that is recessed in the vertex area. Such a recessed portion of the electrostatic chuck 300 may correspond to the sensing unit 210 on the workbench 200 when the electrostatic chuck 300 is combined with the workbench 200 (overlapping when viewed in a direction perpendicular to the workbench 200), and exist in a manner corresponding to the vertex area of ​​the substrate 10 when the substrate 10 is adsorbed on the electrostatic chuck 300 (overlapping when viewed in a direction perpendicular to the substrate 10).

[0120] As another example, Figure 6As shown, the workbench 200 may include a desorption auxiliary part 220, and the desorption auxiliary part 220 may include a first desorption auxiliary part 220-1 and a second desorption auxiliary part 220-2. The first desorption auxiliary part 220-1 and the second desorption auxiliary part 220-2 may play a role in assisting the substrate 10 to be desorbed from the electrostatic chuck 300. For example, the first desorption auxiliary part 220-1 may be located in a recessed part of the edge of the electrostatic chuck 300 when the electrostatic chuck 300 is combined with the workbench 200, and the second desorption auxiliary part 220-2 may exist in a manner of protruding outward from the recessed part of the edge of the workbench 200. When the second desorption auxiliary part 220-2 is pressed toward the inside of the workbench 200 by an external force, the first desorption auxiliary part 220-1 pushes the substrate 10 adsorbed on the electrostatic chuck 300 away from the electrostatic chuck 300, thereby assisting the substrate 10 to be desorbed from the electrostatic chuck 300.

[0121] Figure 7 is a flowchart schematically showing a part of a method for manufacturing a display device according to still another embodiment of the present invention.

[0122] like Figure 7 As shown, a method for manufacturing a display device according to an embodiment of the present invention may include: a step of configuring a substrate (S10); a step of adsorbing the substrate onto an electrostatic chuck (S20); a step of checking whether adsorption is poor (S40); a step of desorbing the substrate from the electrostatic chuck (S60); a step of checking whether desorption is poor (S80); and a step of removing the substrate (S90).

[0123] The step of arranging the substrate (S10) is a step of arranging the substrate 10 having the mark 11 on the first surface so as to overlap with the electrostatic chuck 300. That is, the substrate 10 is inserted into the internal space of the chamber 100 and arranged so that the substrate 10 overlaps with the electrostatic chuck 300 located in the internal space of the chamber 100. To this end, the display device manufacturing apparatus 1 may further include a transport unit (not shown) that loads and inserts the substrate 10 into the chamber 100 or discharges it from the chamber 100 to the outside.

[0124] The step of sucking the substrate onto the electrostatic chuck ( S20 ) is a step of sucking the second surface (the surface opposite to the first surface) of the substrate 10 onto the electrostatic chuck 300 using electrostatic force generated by supplying power to the electrostatic chuck 300 .

[0125] The step of checking whether the adsorption is poor (S40) is a step in which the adsorption poor inspection unit 510 checks whether the substrate 10 is normally adsorbed on the electrostatic chuck 300. For a detailed description of this, please refer to Figures 8 to 10 To be discussed later.

[0126] The step of desorbing the substrate from the electrostatic chuck (S60) is a step of cutting off the power supplied to the electrostatic chuck 300 to desorb the substrate 10 from the electrostatic chuck 300. As an example, the desorbed substrate 10 may be loaded on a transport unit (not shown).

[0127] The step of inspecting whether the desorption is poor (S80) is a step in which the desorption poor inspection unit 520 inspects whether the substrate 10 is normally desorbed from the electrostatic chuck 300. For a detailed description of this, please refer to Figures 11 to 13 To be discussed later.

[0128] The substrate removal step (S90) is a step of discharging the substrate 10 detached from the electrostatic chuck 300 to the outside of the chamber 100. For example, the detached substrate 10 may be removed by being loaded on a transport unit (not shown) and transported to the outside of the chamber 100.

[0129] Figure 8 It is a summary Figure 7 A flowchart of a portion of a defective adsorption inspection step (S40) included in a display device manufacturing method.

[0130] like Figure 8 As shown, the step of checking whether adsorption is poor or not (S40) may include: a step of acquiring a first captured image (S41); a step of searching for a marked area in the first captured image (S43); a step of calculating a first eigenvalue for the marked area (S45); and a step of comparing the first eigenvalue with a pre-set first critical value to determine whether adsorption is poor or not (S47).

[0131] The step of acquiring the first captured image (S41) is a step in which the imaging unit 400 acquires the first captured image of the mark 11 located on the first surface of the substrate 10. Specifically, the imaging unit 400 acquires the first captured image data of the mark 11 located on the first surface of the substrate 10 at the time when the second surface (the surface on the opposite side of the first surface) of the substrate 10 is adsorbed on the electrostatic chuck 300, and acquires the first captured image from the acquired first captured image data. That is, the first captured image is an image of the mark 11 captured at the time when the substrate 10 is adsorbed on the electrostatic chuck 300.

[0132] The step of searching the first captured image for the marker region ( S43 ) is a step of searching the first captured image for the marker region, which is a region where the marker 11 exists.

[0133] As one embodiment, the inspection unit 500 can search for the marked area using a template matching algorithm. The "template matching algorithm" is an algorithm that uses pixel values ​​to search for a position corresponding to a pre-stored template image in a captured image acquired by the shooting unit 400. At this time, the "pixel value" is a value that digitizes pixel information. For example, the pixel value can be a value that digitizes grayscale values, brightness, saturation, color, brightness, hue, etc., but is not limited to the above examples. In addition, the "template image" is an image that includes a reference image for the shape of the mark 11. For example, the template image may include a diagram of the shape of the mark 11 or an image that captures the marked area in a captured image of the mark 11.

[0134] Specifically, the template matching algorithm moves the template image vertically or horizontally on the first captured image, and compares the pixel values ​​of the pixels of the area overlapping the template image on the first captured image with the pixel values ​​of the pixels of the template image, thereby searching for the marked area. At this time, the size of the marked area can be set to be the same as the size of the template image.

[0135] On the other hand, the display device manufacturing device 1 according to an embodiment of the present invention may further include a pre-processing unit (not shown). In order to improve the accuracy and processing speed of the marker region search and feature value calculation, the pre-processing unit may perform pre-processing on the first captured image and / or the template image. That is, the inspection unit 500 may search for the marker region or calculate the first feature value based on the pre-processed first captured image and / or the pre-processed template image.

[0136] As a specific example, the pre-processing unit may perform pre-processing of normalizing the pre-processing object pixel value (the pixel value of the pixel of the first captured image and / or the pixel value of the pixel of the template image). For example, when the pre-processing object pixel value is an integer having a value greater than 0 and less than 255, the pre-processing unit may convert the pre-processing object pixel value to a value greater than 0 and less than 1. As a normalization (conversion) method, a method of dividing the pre-processing object pixel value by 255, a method of subtracting the minimum value of the pixel values ​​from the pixel value of the normalization object pixel by a value of subtracting the minimum value of the pixel values ​​from the maximum value of the pixel values, a method of subtracting the average value of the pixel values ​​from the pixel value of the normalization object pixel by a standard deviation of the pixel values, etc. may be applied, but are not limited to the above examples.

[0137] As another embodiment, the inspection unit 500 may use an edge detection algorithm to search for the marker area. The "edge detection algorithm" is an algorithm that uses a row-column filter to detect the edge of the marker 11. The edge detection algorithm moves the row-column filter on the first captured image, and detects the pixels where the edge of the marker 11 exists based on the gradient of the pixel values ​​of the pixels overlapping the row-column filter. The edge detection algorithm can compare the row-column value of the current position, the row-column value of the previous position, and the row-column value of the next position based on the moving direction of the row-column filter, and detect the pixel value that changes with the edge as the boundary based on the change of the row-column value, thereby searching for the marker area. At this time, the row-column filter can be a Roberts operator, a Prewitt operator, a Sobel operator, etc. used for first differential edge detection, or a Gaussian Laplacian operator (LOG, Laplacian of Gaussian) used for second differential edge detection, but is not limited thereto. On the other hand, the row-column filter can be a row-column filter of size 3×3, 5×5, 7×7, etc., and its size is not limited. However, the row and column filter preferably meets the following conditions: the size is an odd number with the same length and width, it is symmetrical up and down and left and right with the center as the reference, the number at the center is a positive number greater than 0, and the sum of all numbers in the row and column filter should be 0.

[0138] As a specific example, the edge detection algorithm can use a Sobel operator based on a first differential to detect the edge of the mark 11. In this case, the row-column filter can include a horizontal row-column filter and a vertical row-column filter, and as needed, can also include a lower right diagonal row-column filter and an upper right diagonal row-column filter. Each row-column filter moves in a predetermined direction and detects the edge of the mark 11. For example, the horizontal row-column filter moves in the horizontal direction (y-axis direction) and calculates the row-column value, and the vertical row-column filter moves in the vertical direction (z-axis direction) and calculates the row-column value, thereby detecting the edge of the mark 11.

[0139] In addition, the edge detection algorithm can perform pixel value adjustment differently for pixels existing at the edge of the mark 11 and pixels not existing at the edge of the mark 11. For example, in the mark area searched by the edge detection algorithm, pixel values ​​corresponding to white are applied to pixels existing at the edge of the mark 11, and pixel values ​​corresponding to black are applied to pixels not existing at the edge of the mark 11. That is, high grayscale values ​​are applied to pixels existing at the edge, and low grayscale values ​​are applied to pixels not existing at the edge. By this, in the mark area, the edge portion of the mark 11 is more prominent in contrast to the other areas, and meaningless pixel values ​​are removed, which can improve the accuracy of the first eigenvalue calculation.

[0140] The step of calculating the first characteristic value for the mark area (S45) is a step of calculating the first characteristic value for the searched mark area for determining the clarity of the mark 11. The "first characteristic value" is a value quantified for determining the clarity of the mark 11 in the captured image of the mark 11 captured at the time when the substrate 10 is adsorbed on the electrostatic chuck 300. For example, the clarity of the mark 11 in the captured image can be understood to be proportional to the consistency between the marks 11 in the pre-stored template image.

[0141] As an embodiment, the first feature value may be a matching score. The matching score is a value calculated based on the degree of consistency by comparing the pixel values ​​of the pixels of the marked area searched by the template matching algorithm with the pixel values ​​of the pixels of the pre-stored template image.

[0142] The matching score can be calculated using various matching methods (e.g., square sum of difference matching, cross correlation matching, cross correlation coefficient matching, etc.). For example, the matching score can be calculated using the correlation matching method as shown in [Formula 1].

[0143] [Mathematical formula 1]

[0144]

[0145] In Mathematical Formula 1, R(x, y) means the matching score calculated for the pixel located at the (x, y) coordinates of the captured image. T(x', y') means the pixel value of the pixel located at the (x', y') coordinates of the template image. I(x+x', y+y') is the pixel value of the pixel located at the (x+x', y+y') coordinates of the captured image, which means the pixel value of the area overlapping with the template image in the captured image. Therefore, according to the correlation matching method, the product of the pixel value of the captured image and the pixel value of the template image can be squared and all added for the area overlapping with the template image in the captured image while the template image is moved on the captured image, thereby calculating the matching score. In this case, the matching score can be proportional to the degree of consistency between the pixel value of the pixel of the marked area and the pixel value of the pixel of the template image. That is, the more consistent the pixel value of the pixel of the marked area and the pixel value of the pixel of the template image (the higher the degree of consistency), the larger the matching score becomes, and the less consistent (the lower the degree of consistency), the smaller the matching score becomes. In addition, the matching score has a value of 0 or more and 1 or less, and when there is no match (when the degree of match is 0%), the matching score is 0, and when there is a perfect match (when the degree of match is 100%), the matching score is calculated as 1. Such a tendency may differ depending on the matching method applied to calculate the matching score.

[0146] As another embodiment, the first characteristic value may be the average pixel value of the pixel values ​​of the pixels in the marked area, that is, the average pixel value. At this time, as described above, the first characteristic value may be the average pixel value of the pixel values ​​of the pixels in the marked area after the pixel value adjustment is performed by the edge detection algorithm. For example, when the pixel value is a grayscale value, the first characteristic value may be the average grayscale value of the grayscale values ​​of the pixels in the marked area, that is, the average grayscale value. That is, the inspection unit 500 may calculate the average grayscale value of the pixels included in the searched marked area as the first characteristic value, and compare the calculated average grayscale value with a pre-set first critical value to determine whether the adsorption is poor or not.

[0147] The step of comparing the first characteristic value with a preset first critical value to determine whether the adsorption is poor or not (S47) is a step of determining that the adsorption is poor when the first characteristic value is below the first critical value, and determining that the adsorption is normal when the first characteristic value exceeds the first critical value. That is, the normal adsorption of the substrate 10 is determined based on the first characteristic value calculated from the first captured image obtained at the adsorption time point of the substrate 10 and the preset first critical value. At this time, the first critical value is set to a value that is determined to be a normal adsorption of the substrate 10 only when the mark 11 in the first captured image meets a specific level of clarity.

[0148] Fig. 9 This is an example of an image taken when adsorption is poor. Fig.10 This is an example of an image captured during normal adsorption.

[0149] The situation where the substrate 10 is normally adsorbed on the electrostatic chuck 300 is a situation where no defect such as floating occurs. Therefore, the mark 11 located in the area where the substrate 10 is normally adsorbed on the electrostatic chuck 300 will be clearly visible in the first captured image, and the mark 11 located in the area where the substrate 10 is not normally adsorbed on the electrostatic chuck 300 will not be clearly visible in the first captured image. At this time, the clarity of the mark 11 can be determined by comparing the aforementioned digitized first characteristic value with the first critical value.

[0150] exist Fig. 9 as well as Fig.10 , respectively, show images of the mark 11 captured by the first to fourth cameras included in the imaging unit 400 at the time of the substrate 10 adsorption when the substrate 10 is poorly adsorbed and when the substrate 10 is normally adsorbed. At this time, the first to fourth cameras respectively capture the mark 11 located in the first vertex region to the fourth vertex region of the substrate 10 to obtain the captured images. This is exemplary, and the number and configuration of the cameras included in the imaging unit 400 are not limited thereto.

[0151] Reference Fig. 9 It can be confirmed that the images captured by the first camera, the third camera, and the fourth camera include a clear mark 11, and the image captured by the second camera includes a relatively unclear mark 11. From this, it can be confirmed that poor adsorption such as floating of the substrate 10 occurs in the vertex area corresponding to the second camera.

[0152] Reference Fig.10 It can be confirmed that the images captured by the first to fourth cameras all include clear marks 11. From this, it can be confirmed that since the first to fourth vertex regions of the substrate 10 are all in close contact with the electrostatic chuck 300, there is no floating phenomenon of the substrate 10 and other adsorption failures, and the adsorption is normal.

[0153] Fig.11 It is a summary Figure 7 A flowchart of a part of a desorption defect inspection step (S80) included in a display device manufacturing method.

[0154] like Fig.11 As shown, the step of checking whether desorption is poor or not (S80) may include: a step of acquiring a second captured image (S81); a step of searching for a marked area in the second captured image (S83); a step of calculating a second eigenvalue for the marked area (S85); and a step of comparing the second eigenvalue with a pre-set second critical value to determine whether desorption is poor or not (S87).

[0155] The contents described in the aforementioned poor adsorption inspection step (S40) can be applied in the same manner to the poor desorption inspection step (S80). That is, the contents described in the step (S41) of acquiring the first captured image can be applied in the same manner to the step (S81) of acquiring the second captured image, the contents described in the step (S43) of searching the marked area in the second captured image can be applied in the same manner to the step (S83) of searching the marked area in the first captured image, the contents described in the step (S45) of calculating the first eigenvalue for the marked area can be applied in the same manner to the step (S85) of calculating the second eigenvalue for the marked area, and the contents described in the step (S47) of comparing the first eigenvalue with the pre-set first critical value to determine whether the adsorption is poor can be applied in the same manner to the step (S87) of comparing the second eigenvalue with the pre-set second critical value to determine whether the desorption is poor. The repeated contents are omitted below.

[0156] The step of acquiring the second captured image (S81) is a step in which the imaging unit 400 acquires the second captured image of the mark 11 located on the first surface of the substrate 10. Specifically, the imaging unit 400 acquires the second captured image data of the mark 11 located on the first surface of the substrate 10 at the time when the second surface (the surface on the opposite side of the first surface) of the substrate 10 is detached from the electrostatic chuck 300, and acquires the second captured image from the acquired second captured image data. That is, the second captured image is an image of the mark 11 captured at the time when the substrate 10 is detached from the electrostatic chuck 300.

[0157] The step of searching the second captured image for the marker region ( S83 ) is a step of searching the second captured image for the marker region, which is a region where the marker 11 exists.

[0158] On the other hand, as described above, the inspection unit 500 may use a template matching algorithm as one embodiment, or an edge detection algorithm as another embodiment, and of course the same contents may also be applied to the pre-processing unit (not shown).

[0159] The step of calculating the second characteristic value for the mark area (S85) is a step of calculating the second characteristic value for the searched mark area for determining the clarity of the mark 11. The "second characteristic value" is a value digitized to determine the clarity of the mark 11 in the captured image of the mark 11 captured at the time when the substrate 10 is detached from the electrostatic chuck 300. For example, the clarity of the mark 11 in the captured image can be understood to be proportional to the consistency between the marks 11 in the pre-stored template image.

[0160] On the other hand, as mentioned above, the second characteristic value may be a matching score as one embodiment, or an average pixel value as another embodiment, and of course the same content for adjusting the pixel value may also be applied.

[0161] The step (S87) of comparing the second characteristic value with a preset second critical value to determine whether the desorption is poor or not is a step of determining that the desorption is poor when the second characteristic value is greater than the second critical value, and determining that the desorption is normal when the second characteristic value is less than the second critical value. That is, whether the desorption of the substrate 10 is normal or not is determined based on the second characteristic value calculated from the second captured image acquired at the desorption time point of the substrate 10 and the preset second critical value. At this time, the second critical value is set to a value that is determined to be a normal desorption of the substrate 10 when the mark 11 in the second captured image does not meet a specific level of clarity.

[0162] Fig.12 This is an example of an image taken when desorption is poor. Fig.13 This is an example of an image captured during normal desorption.

[0163] The case where the substrate 10 is normally detached from the electrostatic chuck 300 is a case where no defect due to residual static electricity occurs. Therefore, the mark 11 located in the area where the substrate 10 is normally detached from the electrostatic chuck 300 is not clearly visible in the second captured image, and the mark 11 located in the area where the substrate 10 is not normally detached from the electrostatic chuck 300 is clearly visible in the second captured image. At this time, the clarity of the mark 11 can be determined by comparing the aforementioned digitized second characteristic value with the second critical value.

[0164] exist Fig.12 as well as Fig.13 , respectively, show the images of the mark 11 captured by the first to fourth cameras included in the photographing unit 400 at the desorption time point of the substrate 10 when the desorption of the substrate 10 is poor and when the desorption is normal. At this time, the first to fourth cameras respectively capture the marks 11 located in the first to fourth vertex regions of the substrate 10 to obtain the captured images. This is exemplary, and the number and configuration of the cameras included in the photographing unit 400 are not limited thereto.

[0165] Reference Fig.12 It can be confirmed that the images captured by the first camera, the second camera, and the fourth camera include a clear mark 11, and the images captured by the third camera include a relatively unclear mark 11. Through this, it can be confirmed that the substrate 10 is normally desorbed only in the third vertex area corresponding to the third camera, and the substrate 10 fails to be normally desorbed from the electrostatic chuck 300 due to residual static electricity in the first vertex area, the second vertex area, and the fourth vertex area.

[0166] Reference Fig.13 It can be confirmed that the images captured by the first to fourth cameras all include unclear marks 11. Thus, it can be confirmed that the first to fourth vertex regions of the substrate 10 are all desorbed normally from the electrostatic chuck 300 without desorption failure.

[0167] Fig.14 This is an example diagram that provides a visual representation of the characteristic values ​​when desorption is poor. Fig.15 This is a diagram that provides an example of what the characteristic values ​​look like during normal desorption.

[0168] like Fig.14 as well as Fig.15 As shown, the display device manufacturing apparatus 1 according to an embodiment of the present invention can visually provide a captured image (a first captured image or a second captured image) and even a feature value calculated therefrom.

[0169] As one embodiment, when the second characteristic value is a matching score, the matching score is proportional to the degree of consistency between the mark 11 in the second captured image and the mark 11 in the pre-stored template image. Therefore, the inspection unit 500 may judge that detachment is poor if the matching score is above the second critical value, and judge that detachment is normal if the matching score is less than the second critical value.

[0170] Reference Fig.14 , it can be confirmed that the matching score of the captured image acquired by the first camera is 1, and the matching scores of the captured images acquired by the second camera to the fourth camera are 0. Therefore, it can be intuitively confirmed that poor desorption occurs in the vertex area corresponding to the first camera.

[0171] Reference Fig.15 It can be confirmed that the matching scores of all the captured images acquired by the first camera to the fourth camera are 0. Therefore, it can be intuitively confirmed that the entire vertex region of the substrate 10 is normally detached from the electrostatic chuck 300 .

[0172] Fig.16 This is a diagram that visually provides an example of the appearance of the characteristic values ​​calculated in the desorption failure inspection step.

[0173] like Fig.16 As shown, the display device manufacturing apparatus 1 according to an embodiment of the present invention can provide the calculated characteristic value (first characteristic value or second characteristic value) in the form of a chart. Fig.16 The matching score chart is information that is differentiated by the inspection target substrate, and can visually provide information related to the feature values ​​calculated from the captured images of the marked area of ​​each inspection substrate. Through this, the user can inspect multiple substrates and confirm at a glance which substrate and which marked area has a defect.

[0174] exist Figures 14 to 16 For the sake of convenience, only the case of poor desorption inspection is shown, but of course the same can also be applied to poor adsorption inspection, poor configuration inspection and poor separation inspection.

[0175] Fig.17 FIG. 1 is a flowchart schematically showing a part of a method for manufacturing a display device according to another embodiment of the present invention. Figure 7 The additional steps for comparison are highlighted.

[0176] Reference Fig.17 According to another embodiment of the present invention, the method for manufacturing a display device may further include a configuration defect inspection step (S30) and a separation defect inspection step (S70).

[0177] The step of inspecting whether or not there is a misalignment ( S30 ) is a step in which the misalignment inspecting unit 530 inspects whether or not the substrate 10 is normally arranged to overlap with the electrostatic chuck 300 .

[0178] When the substrate 10 and the electrostatic chuck 300 are overlapped and adsorbed on the electrostatic chuck 300, the bad configuration inspection unit 530 determines that the configuration is bad if the sensing unit 210 does not sense the substrate 10, and determines that the configuration is normal if the sensing unit 210 senses the substrate 10. In addition, the step of inspecting whether the adsorption is bad (S40) may be a step of inspecting whether the substrate 10 that is normally arranged in the step of inspecting whether the configuration is bad (S30) is bad.

[0179] As an embodiment, the sensing unit 210 may include a sensor, and the sensor exists in a manner corresponding to the mark area of ​​the substrate 10 when the substrate 10 is adsorbed on the electrostatic suction cup 300 (overlapping when viewed in a direction perpendicular to the substrate 10). Thus, the sensor determines whether the substrate 10 is sensed by the sensing area of ​​the sensor when the substrate 10 is adsorbed. For example, the substrate 10 has a mark 11 in the first vertex area to the fourth vertex area, and the sensing unit 210 may include a first sensor to a fourth sensor corresponding to the first vertex area to the fourth vertex area of ​​the substrate 10. The first sensor to the fourth sensor respectively determine whether the first vertex area to the fourth vertex area of ​​the substrate 10 adsorbed on the electrostatic suction cup 300 are sensed. If any of the first sensor to the fourth sensor does not sense the substrate 10, the misconfiguration inspection unit 530 can determine that the substrate 10 is not normally configured (or aligned) and a misconfiguration has occurred.

[0180] The step of inspecting whether or not separation is defective ( S70 ) is a step in which the defective separation inspecting unit 540 inspects whether or not the substrate 10 is normally separated from the electrostatic chuck 300 .

[0181] When the substrate 10 is desorbed from the electrostatic chuck 300, the separation failure inspection unit 540 determines that the separation is failed when the sensing unit 210 senses the substrate 10, and determines that the separation is normal when the sensing unit 210 does not sense the substrate 10. In addition, the step of inspecting whether the desorption is failed (S80) may be a step of inspecting whether the desorption is failed for the substrate 10 that was normally separated in the step of inspecting whether the separation is failed (S70).

[0182] For example, the substrate 10 may have the mark 11 in the first to fourth vertex regions, and the sensing unit 210 may include the first to fourth sensors corresponding to the first to fourth vertex regions of the substrate 10. The first to fourth sensors respectively determine whether the first to fourth vertex regions of the substrate 10 adsorbed on the electrostatic chuck 300 are sensed. As long as any one of the first to fourth sensors senses the substrate 10, the separation failure inspection unit 540 may determine that the substrate 10 is not properly configured (or aligned) and separation failure occurs.

[0183] Fig.18 FIG. 1 is a flowchart schematically showing a part of a method for manufacturing a display device according to another embodiment of the present invention. Fig.17 The additional steps for comparison are highlighted.

[0184] The display device manufacturing device 1 according to one embodiment of the present invention may further include an alarm unit (not shown). The alarm unit may provide a bad alarm when a bad condition occurs. The alarm unit may include one or more of a bad configuration alarm unit that provides a bad configuration alarm, a bad adsorption alarm unit that provides a bad adsorption alarm, a bad separation alarm unit that provides a bad separation alarm, and a bad desorption alarm unit that provides a bad desorption alarm. In addition, the bad configuration alarm unit, the bad adsorption alarm unit, the bad separation alarm unit, and the bad desorption alarm unit may be provided separately, or partly or entirely provided as one.

[0185] The alarm provided by the alarm unit may include visual information (eg, a warning indicator light, etc.) or auditory information (eg, a warning sound, etc.), but is not limited thereto.

[0186] like Fig.18As shown, in the substrate adsorption step (S20), when the inspection result of the bad configuration inspection step (S30) is bad configuration, a bad configuration alarm (S35) can be provided by the alarm unit and the process can be interrupted. Different from this, when the inspection result of the bad configuration inspection step (S30) is normal configuration, the bad adsorption inspection step (S40) can be performed as the next process. When the inspection result of the bad adsorption inspection step (S40) is bad adsorption, a bad adsorption alarm (S45) can be provided by the alarm unit and the process can be interrupted. Different from this, when the inspection result of the bad adsorption inspection step (S40) is normal adsorption, the next process can be performed.

[0187] Similarly, in the substrate desorption step (S60), when the inspection result of the poor separation inspection step (S70) is poor separation, a poor separation alarm (S75) may be provided by the alarm unit and the process may be interrupted. Different from this, when the inspection result of the poor separation inspection step (S70) is normal separation, the poor desorption inspection step (S80) may be performed as the next process. When the inspection result of the poor desorption inspection step (S80) is poor desorption, a poor desorption alarm (S85) may be provided by the alarm unit and the process may be interrupted. Different from this, when the inspection result of the poor desorption inspection step (S80) is normal desorption, the next process may be performed.

[0188] This allows the user to immediately recognize and handle a defect when it occurs, thereby minimizing process losses.

[0189] So far, only the display device manufacturing method and manufacturing device have been mainly described, but the present invention is not limited thereto. For example, a display device manufactured by such a display device manufacturing method and manufacturing device is also claimed to belong to the scope of the present invention.

[0190] In addition, although the present invention is described with reference to the embodiments shown in the accompanying drawings, this is only exemplary, and a person with ordinary knowledge in the technical field should understand that various modifications and other equivalent embodiments can be made therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical concept of the attached claims.

Claims

1. A method for manufacturing a display device, comprising: a step of arranging the substrate having a mark on the first surface so as to overlap the electrostatic chuck; The step of adsorbing the second surface of the substrate onto the electrostatic chuck; as well as The step of checking whether the substrate has poor adsorption or not, The steps of checking whether the adsorption is poor or not include: A step of acquiring a first captured image of the mark; Searching the first captured image for a marked area where the mark exists; Calculating a first feature value for the marked area; and The step of comparing the first characteristic value with a preset first critical value to determine whether the adsorption is poor or not, The first feature value is a value calculated based on consistency by comparing the pixel values ​​of the pixels of the marked area searched using the template matching algorithm with the pixel values ​​of the pixels of the pre-stored template image, or an average pixel value of the pixel values ​​of the pixels of the marked area after pixel value adjustment is performed using an edge detection algorithm.

2. The method for manufacturing a display device according to claim 1, wherein: The first feature value is a matching score, The step of calculating the first feature value is a step of comparing the pixel values ​​of the pixels of the mark area with the pixel values ​​of the pixels of the pre-stored template image to calculate the matching score based on the degree of consistency.

3. The method for manufacturing a display device according to claim 2, wherein: The size of the marked area is the same as the size of the template image, The step of searching for the marker area is a step of moving the template image on the first captured image and searching for the marker area by comparing pixel values ​​of pixels of an area overlapping the template image on the first captured image with pixel values ​​of pixels of the template image.

4. The method for manufacturing a display device according to claim 3, wherein: The matching score is proportional to the degree of coincidence between pixel values ​​of pixels in the mark area and pixel values ​​of pixels in the template image, and is greater than or equal to 0 and less than or equal to 1.

5. The method for manufacturing a display device according to claim 2, wherein: The display device manufacturing method further includes: performing a pre-processing step of normalizing the pixel values ​​of the pixels of the first captured image or the pixel values ​​of the pixels of the template image, The step of calculating the matching score is a step of calculating the matching score based on the pre-processed first captured image or the pre-processed template image.

6. The method for manufacturing a display device according to claim 5, wherein: The pixel value of the pixel of the first captured image or the pixel value of the pixel of the template image is greater than or equal to 0 and less than or equal to 255. The pre-processing normalizes pixel values ​​of pixels of the first captured image or pixel values ​​of pixels of the template image to be greater than or equal to 0 and less than or equal to 1.

7. The method for manufacturing a display device according to claim 1, wherein: The step of searching the marked area comprises: A step of moving a row-column filter on the first captured image and detecting pixels where the edge of the marker exists based on a gradient of pixel values ​​of pixels overlapping the row-column filter.

8. A display device manufacturing device, comprising: Chamber; a workbench, located in the chamber; an electrostatic chuck combined with the workbench in an overlapping manner; a photographing unit, which acquires first photographed image data of a mark located on a first surface of the substrate when the second surface of the substrate is adsorbed on the electrostatic chuck; as well as The poor adsorption inspection unit searches for a mark area where the mark exists in the first captured image from the first captured image data, calculates a first characteristic value for the mark area, and compares the first characteristic value with a preset first critical value to determine whether the adsorption is poor or not. The first feature value is a value calculated based on consistency by comparing the pixel values ​​of the pixels of the marked area searched using the template matching algorithm with the pixel values ​​of the pixels of the pre-stored template image, or an average pixel value of the pixel values ​​of the pixels of the marked area after pixel value adjustment is performed using an edge detection algorithm.

9. The display device manufacturing apparatus according to claim 8, wherein: The imaging unit further acquires a second image of the mark when the substrate is detached from the electrostatic chuck, The display device manufacturing device further comprises: The desorption failure inspection unit searches for a mark region where the mark exists in the second captured image, calculates a second feature value for the mark region, and compares the second feature value with a preset second critical value to determine whether the desorption is failed or not.

10. The display device manufacturing apparatus according to claim 8, wherein: The display device manufacturing device further comprises: a sensing portion, located at a vertex region of the workbench, and sensing the substrate when the substrate is adsorbed on the electrostatic chuck or when the substrate is desorbed from the electrostatic chuck; a configuration failure inspection unit for determining that the configuration is faulty when the substrate is adsorbed on the electrostatic chuck if the sensing unit does not sense the substrate, and that the configuration is normal when the sensing unit senses the substrate; as well as The separation failure inspection unit determines that the separation is failed when the substrate is detached from the electrostatic chuck if the sensing unit senses the substrate, and determines that the separation is normal when the sensing unit does not sense the substrate.

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