Deposition processing equipment

Abstract

A deposition processing apparatus is provided. The deposition processing apparatus includes a first chamber equipped with a substrate holding device, a second chamber defining a deposition processing space in which a deposition process is performed, and a third chamber including a transfer module for transferring the substrate holding device from the first chamber to the second chamber. The substrate holding device includes a first support and a second support, the first support supporting at least one substrate, the second support connected to the first support, contacting the first surface and the second surface of the at least one substrate in a first direction, and vertically holding the at least one substrate so that the third surface faces the normal direction of the first support. The second support defines a deposition surface in the at least one substrate including a third surface, a portion of the first surface adjacent to the third surface, and a portion of the second surface adjacent to the third surface, and exposes the defined deposition surface to the deposition processing space.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2020-0065834, filed on June 1, 2020, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to a substrate holding device capable of improving mass productivity of three-sided deposition, a deposition processing apparatus including the substrate holding device, and a deposition processing method using the deposition processing apparatus. Background Art

[0004] Various types of substrates are used in the manufacturing process of display substrates, and in recent years, deposition equipment that performs various organic and / or inorganic deposition on various substrates has also been diversified. Accordingly, the demand for cost-effective deposition processing equipment that can perform multi-sided deposition as well as single-sided deposition and can process multiple substrates at a time is increasing. Summary of the Invention

[0005] The present disclosure provides a substrate holding apparatus implemented to perform three-sided deposition on multiple substrates.

[0006] The present disclosure provides a deposition processing apparatus including a substrate holding device implemented to perform three-sided deposition on a plurality of substrates and improve batch productivity through a plurality of chambers.

[0007] The present disclosure provides a deposition processing method using a deposition processing apparatus.

[0008] Embodiments of the present inventive concepts provide a deposition processing apparatus, which may include a first chamber loaded with a substrate holding device, wherein at least one substrate is loaded on the substrate holding device and includes a first surface, a second surface opposite the first surface, and a third surface serving as a side surface between the first and second surfaces. The deposition processing apparatus may include a second chamber and a third chamber, the second chamber defining a deposition processing space in which a deposition process is performed on the at least one substrate loaded on the substrate holding device, and the third chamber including a transfer module for transferring the substrate holding device from the first chamber to the second chamber. The substrate holding device may include a first support and a second support, the first support supporting the at least one substrate, the second support connected to the first support, contacting the first and second surfaces of the at least one substrate in a first direction, and vertically holding the at least one substrate such that the third surface faces a normal direction to the first support. The second support may define a deposition surface in the at least one substrate and expose the defined deposition surface to the deposition processing space. The deposition surface may include the third surface, a portion of the first surface adjacent to the third surface, and a portion of the second surface adjacent to the third surface.

[0009] The second chamber may include a deposition source that emits a deposition material to be deposited on the at least one substrate, and the deposition source may be arranged to face the third surface.

[0010] The second chamber may include a fixing module that moves the deposition source in a direction approaching or away from the at least one substrate.

[0011] The first support may include a base member, a first support member disposed on the base member, defining a space into which the transfer module is inserted with the base member, and supporting at least one substrate, and a connecting member connecting the base member, the first support member, and the second support.

[0012] The second support may be connected to the connection member to move in a direction approaching or moving away from the first support.

[0013] An area of ​​the deposition surface in a case where the second support moves in a direction away from the first support may be smaller than an area of ​​the deposition surface in a case where the second support moves in a direction approaching the first support.

[0014] The second support may include a fixing member in contact with the first and second surfaces of the at least one substrate, and a second supporting member connecting the fixing members to each other and to the first support.

[0015] The fixing member may not overlap with a portion of the first surface in the first direction, and may not overlap with a portion of the second surface in the first direction.

[0016] The plurality of fixing members may be connected to the second supporting member such that the plurality of fixing members move in directions approaching to or away from each other.

[0017] The substrate holding device may further include a buffer member disposed on the first support to support the at least one substrate.

[0018] Embodiments of the present inventive concept provide a substrate holding device that may include a first support and a second support. The first support supports at least one substrate including a first surface, a second surface opposite the first surface, and a third surface serving as a side surface between the first and second surfaces. The second support is connected to the first support, contacts the first and second surfaces of the at least one substrate in a first direction, and vertically holds the at least one substrate such that the third surface faces a normal direction to the first support. The second support may define a deposition surface and may expose the defined deposition surface to a deposition processing space. The deposition surface may include the third surface, a portion of the first surface adjacent to the third surface, and a portion of the second surface adjacent to the third surface.

[0019] The second support may include a fixing member in contact with the first surface and the second surface of the at least one substrate.The fixing member may not overlap with the portion of the first surface in the first direction and not overlap with the portion of the second surface in the first direction.

[0020] The second support may be connected to the first support so as to move in a direction approaching or moving away from the first support.

[0021] Embodiments of the present inventive concept provide a deposition processing method. The method may include: preparing at least one substrate including a first surface, a second surface opposite to the first surface, and a third surface serving as a side surface between the first and second surfaces; loading the at least one substrate into a substrate fixing device including a first support member supporting the at least one substrate and a second support member connected to the first support member and vertically fixing the at least one substrate; loading the substrate fixing device loaded with the at least one substrate into a first chamber of a deposition processing device from the outside; using a transfer module arranged in the third chamber to transfer the substrate fixing device to a second chamber defining a deposition processing space; and performing a deposition process on the at least one substrate in the second chamber. The execution of the deposition process may include: allowing the second support member to define a deposition surface in the at least one substrate, the deposition surface including the third surface, a portion of the first surface adjacent to the third surface, and a portion of the second surface adjacent to the third surface, and exposing the defined deposition surface to the deposition processing space.

[0022] The deposition process may be performed by sputtering the deposition material using a deposition source that moves in a direction toward or away from the at least one substrate.

[0023] The first support may include a base member, a first support member disposed on the base member, defining a space into which the transfer module is inserted with the base member, and supporting at least one substrate, and a connecting member connecting the base member, the first support member, and the second support.

[0024] The second support member is movable in a direction approaching or moving away from the first support member.

[0025] The second support may include a plurality of fixing members in contact with the first and second surfaces of the at least one substrate and a second supporting member connecting the plurality of fixing members to each other and to the first support.

[0026] The fixing member may not overlap with the portion of the first surface in the first direction and may not overlap with the portion of the second surface in the first direction.

[0027] The plurality of fixing members may be connected to the second supporting member such that the plurality of fixing members move in directions approaching to or away from each other.

[0028] Based on the above, a specially manufactured substrate holding device can be used to load a large number of substrates at once, and multiple chambers can be used to reduce processing time. It is possible to perform deposition on three sides of a substrate at once, thereby reducing material costs. Accordingly, the deposition processing equipment and deposition processing method can improve mass production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and other advantages of the present disclosure will become readily apparent by referring to the following detailed description when considered in conjunction with the accompanying drawings, in which:

[0030] Figure 1A and Figure 1B is a schematic view showing a deposition processing apparatus according to an embodiment of the present disclosure;

[0031] Figure 2 is a schematic view showing a second chamber according to an embodiment of the present disclosure;

[0032] Figure 3 is a schematic view showing a substrate holding device according to an embodiment of the present disclosure;

[0033] Figure 4A and Figure 4B is a schematic view showing a substrate holding device according to an embodiment of the present disclosure;

[0034] Figure 5 is a schematic view showing a second support according to an embodiment of the present disclosure; and

[0035] Figure 6A and Figure 6B is a schematic view illustrating a deposition processing method according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0036] In this disclosure, it will be understood that when an element or layer is referred to as being “on,” “connected to” or “coupled to” another element or layer, it can be directly on, directly connected to or directly coupled to the other element or layer, or intervening elements or layers may be present.

[0037] Throughout the specification, like reference numerals refer to like elements. In the drawings, for the effective description of technical contents, the thickness, proportion and size of components may be exaggerated.

[0038] As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, "A and / or B" may be understood to mean "A, B, or A and B." The terms "and" and "or" may be used in conjunction or separately and may be understood to be equivalent to "and / or."

[0039] It will be understood that although the terms first, second, etc. can be used to describe various elements, components, areas, layers and / or sections in this article, these elements, components, areas, layers and / or sections should not be limited by these terms. These terms are only used to distinguish an element, component, area, layer or section from another element, component, area, layer or section. Therefore, the first element, component, area, layer or section discussed below can be referred to as the second element, component, area, layer or section without departing from the teachings of the present disclosure. Unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" as used herein are also intended to include plural forms.

[0040] Spatially relative terms, such as “beneath,” “below,” “lower,” “above,” and “upper,” etc., may be used herein for descriptive convenience to describe the relationship of one element or feature to another element or feature as shown in the figures.

[0041] It will also be understood that terms such as “comprise,” “comprising,” “include,” “including,” “have,” “having,” “contain,” and / or “containing,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0042] Unless otherwise defined or implied herein, all terms (including technical and scientific terms) used have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. It will also be understood that, unless clearly defined in the specification, terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and should not be interpreted in an idealized or overly formal sense.

[0043] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0044] Figure 1A and Figure 1B is a schematic view illustrating a deposition processing apparatus 1000 according to an embodiment of the present disclosure.

[0045] Figure 1AA deposition processing apparatus 1000 including a second chamber 200 according to an embodiment of the present disclosure is shown. Figure 1B Deposition processing apparatus 1000 is shown.

[0046] Reference Figure 1A The deposition process apparatus 1000 may include a first chamber 100, a second chamber 200, and a third chamber 300. The second chamber 200 of the deposition process apparatus 1000 may be provided in plurality. Four second chambers 200 are shown in the figure. However, the number of second chambers 200 should not be limited thereto or thereby. The number of second chambers 200 included in the deposition process apparatus 1000 may be greater than or less than four. Depending on the embodiment, the first chamber 100 of the deposition process apparatus 1000 may be provided in plurality.

[0047] The first chamber 100 can load at least one substrate into the deposition processing apparatus 1000 from the outside, and after the deposition process is completed, the at least one substrate can be unloaded to the outside. The first chamber 100 can load or unload at least one substrate. The first chamber 100 can load or unload at least one substrate per substrate fixture, which may include multiple substrates. Multiple first chambers 100 can be provided to allow substrates to be loaded from the outside into the vacuum apparatus. Although not shown in the figure, loading and unloading substrates in the first chamber 100 can be performed by a dedicated robot.

[0048] The second chamber 200 may define a space for performing deposition processing operations required for the substrate under a vacuum state. A plurality of second chambers 200 may be provided. Accordingly, various types of layers can be deposited on a substrate in a single deposition processing apparatus 1000, and processing time can be reduced. The deposition processing apparatus 1000 according to an embodiment may be provided as a multi-type system including a plurality of second chambers 200. Accordingly, the plurality of chambers can be managed separately from one another, process management can be facilitated, and process reliability can be improved.

[0049] The third chamber 300 can transfer a substrate holding device including at least one substrate loaded from the first chamber 100 to the second chamber 200 defining a deposition processing space. The third chamber 300 may include a transfer module 310 corresponding to a robot for transferring the substrate holding device. The transfer module 310 can not only transfer the substrate holding device from the first chamber 100 to the second chamber 200, but also transfer a substrate processed in the second chamber 200 to another second chamber 200 or the first chamber 100.

[0050] The third chamber 300 including the transfer module 310 may be disposed at the center in the deposition process apparatus 1000 according to an embodiment, and the first chamber 100 and the second chamber 200 may be arranged in a cluster type at positions corresponding to edges of a circular shape.

[0051] exist Figure 1BIn the embodiment, the substrate fixing device 210 loaded into the first chamber 100 may be transferred to the second chamber 200 by the transfer module 310 of the third chamber 300 . Figure 1B The deposition processing apparatus 1000 includes a substrate fixing device 210 disposed in the second chamber 200. The substrate fixing device 210 transferred to one second chamber 200 among the plurality of second chambers 200 may provide at least one substrate loaded thereon to the deposition processing space in the second chamber 200.

[0052] Figure 2 is a schematic view illustrating the second chamber 200 according to an embodiment of the present disclosure. Figure 2 A second chamber 200 including a substrate holding device 210 is shown.

[0053] Reference Figure 2 , the second chamber 200 may include a substrate fixing device 210, a deposition source 220, and a fixing module 230. Figure 2 A deposition processing space 250 may be defined in the second chamber 200. The deposition processing space 250 may correspond to a space or region in which a deposition material emitted from the deposition source 220 is deposited on the substrate SUB fixed to the substrate fixing device 210.

[0054] The substrate fixing device 210 may include at least one substrate SUB, a first support 10, and a second support 20. The first support 10 and the second support 20 may allow the at least one substrate SUB to be vertically placed in the substrate fixing device 210. The at least one substrate SUB may be arranged on the first support 10 and may be vertically fixed by the second support 20.

[0055] The at least one substrate SUB may include a first surface 1S, a second surface 2S, and a third surface 3S. The first surface 1S and the second surface 2S may be defined as surfaces facing each other, and the third surface 3S may be defined as a side surface connecting the first surface 1S and the second surface 2S. The at least one substrate SUB may be placed vertically so that the third surface 3S faces the normal direction of the first support 10.

[0056] According to an embodiment, the substrate fixing device 210 may include a buffer member 50 disposed on the first support 10 to support at least one substrate SUB. The buffer member 50 may be disposed under the at least one substrate SUB and may protect the at least one substrate SUB from impact.

[0057] The deposition source 220 can emit deposition material required by at least one substrate SUB. The deposition source 220 can be arranged to face the at least one substrate SUB. The deposition source 220 can include a target 31 and a deposition module 33. The target 31 can be a plate containing deposition material. One surface of the target 31 can face the third surface 3S of the at least one substrate SUB. The target 31 can include deposition material required for the type of deposition process performed in the second chamber 200. The other surface of the target 31 can be in contact with the deposition module 33. The deposition module 33 can sputter the deposition material from the contacted target 31 onto the at least one substrate SUB.

[0058] The fixing module 230 can fix the deposition source 220 to the second chamber 200. The fixing module 230 can be a robot with a variably adjustable length. The fixing module 230 can move the deposition source 220 in a direction closer to or farther from at least one substrate SUB. For example, when the length of the fixing module 230 increases, the deposition source 220 becomes closer to the at least one substrate SUB being deposited, and when the length of the fixing module 230 decreases, the deposition source 220 becomes farther away from the at least one substrate SUB. Accordingly, the size and length restrictions of the at least one substrate SUB loaded into the second chamber 200 in the second direction DR2 can be reduced.

[0059] Figure 3 is a schematic view illustrating a substrate holding device 210 according to an embodiment of the present disclosure. Figure 4A and Figure 4B is a schematic view illustrating a substrate holding device 210 according to an embodiment of the present disclosure.

[0060] Reference Figure 3 、 Figure 4A and Figure 4B The substrate fixing device 210 may include a first support member 10 and a second support member 20. The first support member 10 may include a base member 11, a first support member 13, and a connecting member 15. The second support member 20 may include a second support member 21 and a fixing member 23.

[0061] The first support 10 may support at least one substrate SUB. The second support 20 may vertically fix at least one substrate SUB. The first support 10 may support a third surface 3S (refer to FIG. 3 ) of the at least one substrate SUB. Figure 2 The second support 20 may be connected to the first support 10 and may support the first surface 1S and the second surface 2S of at least one substrate SUB in the first direction DR1, and thus may fix the at least one substrate SUB so that the third surface 3S faces the second direction DR2.

[0062] The second support 20 may define a deposition surface CS on at least one substrate SUB. Figure 2 , the deposition surface CS may include three surfaces, such as the third surface 3S, a portion 1SP of the first surface 1S adjacent to the third surface 3S, and a portion 2SP of the second surface 2S adjacent to the third surface 3S. For example, the fixing member 23 may not overlap with the portion 1SP of the first surface 1S in the first direction DR1, and the fixing member 23 may not overlap with the portion 2SP of the second surface 2S in the first direction DR1. The deposition surface CS may be defined in a side surface portion of at least one substrate SUB. The deposition surface CS defined by the second support 20 may be exposed to the deposition processing space 250 (refer to Figure 2 The deposition surface CS may be a surface of the at least one substrate SUB that is exposed to the deposition processing space 250 and is not covered by the second support 20 .

[0063] The base member 11 of the first support member 10 may be placed on the second chamber 200. The first support member 13 may be arranged above the base member 11. The first support member 13 and the base member 11 may define a space therebetween, and the transfer module 310 may be inserted into the space. The first support member 13 may support at least one substrate SUB. The connecting member 15 may connect the base member 11 and the first support member 13. The connecting member 15 may extend in the second direction DR2 and may be coupled to the side surfaces of the base member 11 and the first support member 13, each of which extends in the first direction DR1. The connecting member 15 may connect the first support member 10 to the second support member 20. The connecting member 15 extending in the second direction DR2 may be coupled to the side surface of the second support member 21.

[0064] The fixing members 23 may be coupled to the second support member 21. The plurality of fixing members 23 may extend in the second direction DR2 and may be arranged along the first direction DR1 in which the second support member 21 extends. At least one substrate SUB may be disposed between the plurality of fixing members 23. The fixing members 23 may contact the first surface 1S and the second surface 2S of the at least one substrate SUB. The fixing members 23 may not contact the deposition surface CS of the at least one substrate SUB. The fixing members 23 may contact another portion of the first surface 1S and another portion of the second surface 2S of the at least one substrate SUB other than the third surface 3S, a portion 1SP of the first surface 1S adjacent to the third surface 3S, and a portion 2SP of the second surface 2S adjacent to the third surface 3S, and thus may vertically fix the at least one substrate SUB in the second direction DR2.

[0065] Figure 4A shows a state where the second support 20 moves in a direction away from the first support 10, and Figure 4B A state in which the second support member 20 moves in a direction approaching the first support member 10 is shown.

[0066] exist Figure 4A and Figure 4B In the embodiment, the second support 20 may be coupled to the connecting member 15 so as to be movable in a direction away from or toward the first support 10. The second support member 21 may be movable in a second direction DR2. The fixing member 23 coupled to the second support member 21 may move as the second support member 21 moves. The plurality of fixing members 23 may define a deposition surface CS on at least one substrate SUB in contact with each fixing member 23. If the fixing member 23 moves in a direction toward the first support 10, the area of ​​the deposition surface CS may gradually increase. If the fixing member 23 moves in a direction away from the first support 10, the area of ​​the deposition surface CS may gradually decrease. Figure 4A The area WD1 of the deposition surface CS can be smaller than Figure 4B The area WD2 of the deposition surface CS.

[0067] Figure 5 is a schematic view showing the second support 20 according to an embodiment of the present disclosure.

[0068] Reference Figure 5 , the second support 20 may include two second support members 21 and a fixing member 23 .

[0069] The fixing member 23 may be coupled to the second support members 21 disposed on opposite sides of the fixing member 23. The fixing member 23 may be coupled to the two second support members 21 on its opposite sides so as to be movable via the two second support members 21. For example, the fixing members 23 may be movable in a direction toward or away from each other. Accordingly, when the fixing members 23 are away from each other, the width between the fixing members 23 may have a width WD3, and when the fixing members 23 are close to each other, the width between the fixing members 23 may have a width WD4. Therefore, the second support 20 can fix substrates of various thicknesses or sizes, regardless of the thickness of at least one substrate SUB.

[0070] Figure 6A and Figure 6B is a schematic view illustrating a deposition processing method according to an embodiment of the present disclosure.

[0071] Figure 6A shows a deposition material PC sputtered from the deposition source 220 onto the deposition surface CS of at least one substrate SUB loaded into the substrate holding device 210, and Figure 6B A deposition material PC is shown deposited on a deposition surface CS of at least one substrate SUB.

[0072] Reference Figure 6A and Figure 6BThe deposition process may include: preparing at least one substrate SUB; loading at least one substrate SUB on a substrate fixing device 210; loading the substrate fixing device 210 loaded with the at least one substrate SUB into the first chamber 100 from the outside; transferring the substrate fixing device 210 to the second chamber 200; and performing a deposition process.

[0073] In the preparation of the substrate SUB, a first surface 1S (refer to Figure 2 ), the second surface 2S opposite to the first surface 1S (refer to Figure 2 ) and a third surface 3S located between the first surface 1S and the second surface 2S (refer to Figure 2 ) at least one substrate SUB.

[0074] In loading the substrate SUB, at least one substrate SUB can be loaded on a substrate fixing device 210 including a first support 10 supporting the at least one substrate SUB and a second support 20 connected to the first support 10, thereby contacting the first surface 1S and the second surface 2S of the at least one substrate SUB in the first direction DR1, and the at least one substrate SUB is vertically loaded so that the third surface 3S faces the normal direction of the first support 10.

[0075] In the loading operation, the substrate holding device 210 may be loaded into the first chamber 100 .

[0076] In the transfer operation, the substrate fixing device 210 loaded into the first chamber 100 may be transferred to the second chamber 200 through the transfer module 310 of the third chamber 300 .

[0077] In performing the deposition process, the deposition process may be performed on at least one substrate SUB in the deposition processing space 250 defined in the second chamber 200 .

[0078] In an embodiment, performing a deposition process may include exposing a deposition surface CS defined in at least one substrate SUB to the deposition processing space 250 via the substrate holding device 210. The deposition surface CS may be defined by the second support 20 of the substrate holding device 210. The fixing member 23 of the second support 20 may contact the first surface 1S and the second surface 2S of the at least one substrate SUB to cover the contact portions, and a portion 1SP of the first surface 1S, a portion 2SP of the second surface 2S, and a third surface 3S of the at least one substrate SUB that may not contact the fixing member 23 may be exposed to the deposition processing space 250. Accordingly, the surface that is not in contact with the fixing member 23 and is exposed to the deposition processing space 250 may be defined as the deposition surface CS.

[0079] In an embodiment, the deposition process may include sputtering a deposition material PC from a deposition source 220 to an exposed deposition surface CS. The deposition material PC sputtered from the deposition source 220 may be deposited on the deposition surface CS of at least one substrate SUB. Hereinafter, when describing the deposition process method, the details related to the deposition process will be omitted. Figures 1A to 5 Details of the same elements in the deposition processing apparatus 1000.

[0080] The substrate holding device according to an embodiment of the present disclosure can be designed to accommodate the simultaneous loading of a large number of substrates and three-sided deposition. Thus, three sides, including the side surface of at least one substrate, can be exposed to the deposition processing space. Deposition processing methods performed using a deposition processing apparatus including the substrate holding device can reduce processing time. Consequently, material costs can be reduced, and thus, mass production efficiency can be improved.

[0081] Although embodiments of the present disclosure have been described, it should be understood that the present disclosure should not be limited to these embodiments, but rather that those skilled in the art can make various changes and modifications within the spirit and scope of the present disclosure as required by the appended claims. Therefore, the disclosed subject matter should not be limited to any single embodiment described herein, and the scope of the inventive concept should be determined based on the appended claims.

Claims

1. A deposition processing apparatus comprising: a first chamber into which a substrate holding device is loaded, wherein at least one substrate is loaded on the substrate holding device and comprising: a first surface; a second surface opposite to the first surface; and a third surface serving as a side surface between the first surface and the second surface; a second chamber defining a deposition process space in which a deposition process is performed on the at least one substrate loaded on the substrate holding device; and A third chamber, the third chamber comprising a transfer module for transferring the substrate holding device from the first chamber to the second chamber, the substrate holding device comprising: a first support supporting the at least one substrate; and a second support member connected to the first support member, contacting the first surface and the second surface of the at least one substrate in a first direction, and vertically fixing the at least one substrate so that the third surface faces a normal direction of the first support member, wherein the second support defines a deposition surface in the at least one substrate and exposes the defined deposition surface to the deposition processing space, and The deposition surface includes the third surface, a portion of the first surface adjacent to the third surface, and a portion of the second surface adjacent to the third surface; Wherein, the first supporting member comprises: Basic components; a first supporting member disposed on the base member, defining with the base member a space into which the transfer module is inserted, and supporting the at least one substrate; and A connecting member connects the base member, the first support member, and the second support member to one another.

2. The deposition processing apparatus according to claim 1, wherein: The second chamber includes a deposition source that emits a deposition material to be deposited on the at least one substrate, and the deposition source is arranged to face the third surface.

3. The deposition processing apparatus according to claim 2, wherein: The second chamber includes a fixing module that moves the deposition source in a direction approaching or away from the at least one substrate.

4. The deposition processing apparatus according to claim 3, wherein: The second support is connected to the connection member to move in a direction approaching or moving away from the first support.

5. The deposition processing apparatus according to claim 4, wherein: The area of ​​the deposition surface in a case where the second support moves in the direction away from the first support is smaller than the area of ​​the deposition surface in a case where the second support moves in the direction approaching the first support.

6. The deposition processing apparatus according to claim 1, wherein: The second support member comprises: a plurality of fixing members in contact with the first surface and the second surface of the at least one substrate; and A second supporting member connects the plurality of fixing members to each other and to the first support.

7. The deposition processing apparatus according to claim 6, wherein: The plurality of fixing members do not overlap with the portion of the first surface in the first direction, and do not overlap with the portion of the second surface in the first direction.

8. The deposition processing apparatus according to claim 6, wherein: The plurality of fixing members are connected to the second supporting member so that the plurality of fixing members move in directions approaching to or away from each other.

9. The deposition processing apparatus according to claim 1, wherein: The substrate fixing device further comprises: A buffer member is disposed on the first support to support the at least one substrate.

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