Particle removal device and method

Abstract

The present disclosure describes a particle removal device, and a method of using the device. The device includes a handheld module having a body. The body has one or more first channels and one or more second channels formed therein. The body includes a nozzle, and the handheld module is used to provide suction through the nozzle and inject an ionized liquid stream through the nozzle. The body further includes a handle attached to the nozzle.

Description

Technical Field

[0001] The present disclosure relates to particle removal devices and methods. Background Art

[0002] The semiconductor integrated circuit (IC) industry has experienced exponential growth. Technological advances in IC materials and design have produced generations of ICs, each with smaller and more complex circuits than the previous generation. In the course of IC development, functional density (i.e., the number of interconnected devices per chip area) has generally increased, while geometry size (i.e., the smallest component (or wiring) that can be produced using a manufacturing process) has decreased. This scaling down process generally provides benefits by increasing production efficiency and reducing associated costs. This scaling down also increases the complexity of processing and manufacturing ICs.

[0003] For example, there is an increasing need to perform lithography processes at higher resolutions. One lithography technique is extreme ultraviolet lithography (EUVL). The scanner used by EUVL uses light in the extreme ultraviolet (EUV) region with a wavelength of about 1 to 100 nanometers (nm). One type of EUV light source is laser-produced plasma (LPP). LPP technology produces EUV light by focusing a high-power laser beam onto a small target droplet of fuel to form a highly ionized plasma that emits EUV radiation with a maximum emission peak of 13.5nm. The EUV light is then collected by a collector and reflected by an optical device toward a lithography exposure object, such as a substrate, such as a wafer.

[0004] The number of particles on the wafer is an important indicator for EUV scanner performance. Therefore, a solution is needed to reduce particles on EUVL tool components along the wafer path. Summary of the invention

[0005] One embodiment of the present disclosure is a particle removal device. The device includes a handheld module having a body. One or more first channels and one or more second channels are formed in the body. The body includes a nozzle, and the handheld module is used to provide suction through the nozzle and inject an ionized liquid flow through the nozzle. The body further includes a handle attached to the nozzle.

[0006] Another embodiment of the present disclosure is a particle removal device. The device includes a handheld module, the handheld module includes a body, and one or more first channels and one or more second channels are formed in the body. The device further includes a first tube attached to the handheld module, and the first tube is connected to the one or more first channels. The device further includes an ion generator connected to the first tube, a second tube attached to the handheld module, and a suction module connected to the second tube. The second tube is connected to the one or more second channels.

[0007] Another embodiment of the present disclosure is a method for particle removal. The method includes the following steps: placing a handheld module of a particle removal device above a component; providing suction through a nozzle of the handheld module, opening a first switch to remove particles from the component; and opening a second switch on the handheld module by injecting an ionized liquid flow from the nozzle of the handheld module to prevent static charge from accumulating on the component. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The various aspects of the present disclosure can be best understood from the following detailed description in conjunction with the accompanying drawings. Note that, in accordance with standard practice in the industry, various features are not drawn to scale. In fact, the dimensions of various features may be arbitrarily increased or reduced for clarity of discussion.

[0009] Figure 1 is a schematic diagram of a lithography system according to some embodiments;

[0010] FIG. 2A to FIG. 2C is a schematic diagram of a particle removal device according to some embodiments;

[0011] FIG. 3A to FIG. 3C According to some embodiments Figure 2A and Figure 2B A schematic diagram of an end portion of a nozzle of a particle removal device;

[0012] Figure 4A and Figure 4B According to some embodiments Figure 2A and Figure 2B A schematic diagram of an end portion of a cup of a particle removal device;

[0013] Figure 5 schematically illustrates a particle removal device for removing particles from a system component according to some embodiments;

[0014] FIG. 6A to FIG. 6C A method of removing particles from a component using a particle removal device according to some embodiments is shown;

[0015] Figure 7 A method for manufacturing a substrate according to some embodiments is shown.

[0016]

Explanation of symbols

[0017] 10: Lithography System

[0018] 12: Radiation Source

[0019] 14:Illuminator

[0020] 16: Curtain station

[0021] 18: veil

[0022] 20: Projection Optical Box (POB)

[0023] 22: Pupil Phase Modulator

[0024] 24: Projection pupil plane

[0025] 26:Substrate

[0026] 28:Substrate table

[0027] 100: Particle removal device

[0028] 102:Handheld module

[0029] 104:Ion Generator

[0030] 106: Fluid Generator

[0031] 107:Ion Blower

[0032] 108: Suction module

[0033] 110: Main body

[0034] 112: Nozzle

[0035] 114: Handle

[0036] 116: Channel

[0037] 118: Channel

[0038] 119: First tube

[0039] 120: Second tube

[0040] 121: The third tube

[0041] 122: Mobile Device

[0042] 124: Antistatic suction module

[0043] 126: Shell

[0044] 128: Injection switch

[0045] 130: Suction switch

[0046] 132: cup

[0047] 134:End

[0048] 500: Components

[0049] 600: Method

[0050] 602,604,606,608: Operation

[0051] 610: Method

[0052] 612,614,616,618,620,622: Operation

[0053] 630: Method

[0054] 632,634,636: Operation

[0055] 700: Method

[0056] 702,704,706,708: Operation

[0057] D1,D2,D3,D4,D5,D6: diameter

[0058] L1, L2, L3: Length

[0059] W: Width DETAILED DESCRIPTION

[0060] The following disclosure provides many different embodiments or examples for realizing the different features of the subject matter provided. The following describes specific examples of components and arrangements to simplify the disclosure. Of course, these are only examples and are not intended to be limiting. For example, forming a first feature above or on a second feature in the following description may include an embodiment in which the first and second features are directly contacted to form, and may also include an embodiment in which additional features are formed between the first and second features so that the first and second features may not be in direct contact. In addition, the disclosure may repeat component symbols or letters in each example. This repetition is for the purpose of simplicity and clarity, and does not itself specify the relationship between the various embodiments or configurations discussed.

[0061] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "below," "above," "above," "top," and "on" may be used herein to describe the relationship of one element or feature to another element or feature as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0062] Figure 1 is a schematic diagram of a lithography system 10 according to some embodiments. The lithography system 10 may also be generally referred to as a scanner, which is operable to perform a lithography exposure process using a corresponding radiation source and exposure mode. In the present embodiment, the lithography system 10 is an EUV lithography system designed to expose a resist layer by extreme ultraviolet (EUV) light. The resist layer is a material that is sensitive to EUV light. The EUV lithography system 10 uses a radiation source 12 to generate EUV light, such as EUV light with a wavelength in a range between about 1 nm and about 100 nm. In a specific example, the radiation source 12 generates EUV light, the wavelength of which is centered at about 13.5 nm. Therefore, the radiation source 12 is also referred to as an EUV radiation source 12.

[0063] The lithography system 10 also employs an illuminator 14. In various embodiments, the illuminator 14 includes various refractive optical elements, such as a single lens or a lens system having multiple lenses (zone plates), or (for EUV lithography systems) reflective optical devices, such as a single mirror or a mirror system having multiple mirrors, to direct light from the radiation source 12 onto the mask stage 16, and more particularly onto the mask 18 fixed to the mask stage 16. In the present embodiment where the radiation source 12 generates light in the EUV wavelength range, the illuminator 14 employs reflective optical devices. In some embodiments, the illuminator 14 includes a dipole illumination element.

[0064] In some embodiments, the illuminator 14 is operable to set a reflector to provide appropriate illumination to the mask 18. In one example, the reflector of the illuminator 14 is switchable to reflect EUV light to different illumination positions. In some embodiments, the platform before the illuminator 14 may further include other switchable reflectors, which can be controlled to guide EUV light to different illumination positions together with the reflector of the illuminator 14. In some embodiments, the illuminator 14 is used to provide on-axis illumination (ONI) to the mask 18. In an example, a disk illuminator 14 with a partial coherence σ of at most 0.3 is used. In some other embodiments, the illuminator 14 is used to provide off-axis illumination (OAI) to the mask 18. In an example, the illuminator 14 is a dipole illuminator. In some embodiments, the dipole illuminator has a partial coherence σ of at most 0.3.

[0065] The lithography system 10 also includes a mask stage 16 for holding a mask 18. In some embodiments, the mask stage 16 includes an electrostatic chuck (e-chuck) for holding the mask 18. This is because gas molecules absorb EUV light, and the lithography system for EUV lithography patterning is maintained in a vacuum environment to avoid EUV intensity loss. In the present disclosure, the terms mask, photomask, and reticle are used interchangeably to refer to the same item.

[0066] In the present embodiment, the lithography system 10 is an EUV lithography system, and the mask 18 is a reflective mask. An exemplary structure of the mask 18 is provided for illustration. The mask 18 includes a substrate having a suitable material, such as a low thermal expansion material (LTEM) or fused silica. In various examples, the LTEM includes TiO2, doped SiO2, or other suitable materials with low thermal expansion.

[0067] The lithography system 10 also includes a projection optics module (or projection optics box (POB)) 20 for imaging the pattern of the mask 18 onto a semiconductor substrate 26, which is fixed on a substrate stage 28 of the lithography system 10. In various embodiments, the POB 20 has refractive optics (such as for UV lithography systems) or reflective optics (such as for EUV lithography systems). Light directed from the mask 18 carries an image of the pattern defined on the mask 18 and is collected by the POB 20. The illuminator 14 and the POB 20 are collectively referred to as an optical module of the lithography system 10.

[0068] The lithography system 10 also includes a pupil phase modulator 22 for modulating the optical phase of light directed from the mask 18 so that the light has a phase distribution on a projection pupil plane 24. In the optical module, there is a plane with a field distribution corresponding to the Fourier transform of the object (in the present case, the mask 18). This plane is called the projection pupil plane. The pupil phase modulator 22 provides a mechanism for modulating the optical phase of the light on the projection pupil plane 24. In some embodiments, the pupil phase modulator 22 includes a mechanism for tuning the mirrors of the POB 20 for phase modulation. For example, the mirrors of the POB 20 are switchable and controlled to reflect EUV light, thereby modulating the phase of the light transmitted through the POB 20.

[0069] In some embodiments, pupil phase modulator 22 utilizes a pupil filter placed on the projection pupil plane. The pupil filter filters out specific spatial frequency components of EUV light from mask 18. In particular, the pupil filter is a phase pupil filter, the function of which is to modulate the phase distribution of light guided through POB 20. However, since all materials absorb EUV light, the use of a phase pupil filter may be limited in some lithography systems (such as EUV lithography systems).

[0070] As described above, the lithography system 10 also includes a substrate stage 28 for fixing a target semiconductor substrate 26 to be patterned. In the present embodiment, the semiconductor substrate is a semiconductor wafer, such as a silicon wafer or other types of wafers. In the present embodiment, a resist layer sensitive to a radiation beam (such as EUV light) is coated on the target semiconductor substrate 26. Various elements including those described above are integrated together and are operable to perform a lithography exposure process. The lithography system 10 may further include other modules, or be integrated (or coupled) with other modules.

[0071] The lithography system 10 can be cleaned after being used for a predetermined period of time. Cleaning of the lithography system 10 can include removing particles from the path of the semiconductor substrate 26. For example, a vacuum cleaner can be used to clean the substrate stage 28. The vacuum cleaner has a brush made of plastic. The substrate stage 28 can include metal and non-metal parts. Therefore, when the substrate stage 28 is cleaned with a vacuum cleaner, static electricity may accumulate on and / or inside the substrate stage 28 due to the use of the plastic brush of the vacuum cleaner to clean the non-metallic part of the substrate stage 28. The statically charged substrate stage 28 can easily attract particles from the surrounding environment. In order to improve the cleaning process of the lithography system 10 and reduce particles on the substrate path, a particle removal device 100 is used.

[0072] FIG. 2A to FIG. 2C FIG. 1 is a schematic diagram of a particle removal device 100 according to some embodiments. Figure 2A As shown, the particle removal device 100 includes a handheld module 102, an ion generator 104, a fluid generator 106, and a suction module 108. The handheld module 102 may include a body 110, which has a nozzle 112 at one end and a handle 114 at the other end. Figure 2AAs shown, the handle 114 may be angled relative to the longitudinal axis of the nozzle 112. In some embodiments, the handle 114 may be positioned along the longitudinal axis of the nozzle 112. The handheld module 102 may have a size suitable for the operator's hand. In some embodiments, the handheld module 102 has a length L1 in the range of about 140 mm to about 160 mm and a width W in the range of about 150 mm to about 250 mm. One or more first channels 116 and one or more second channels 118 are disposed in the body 110 of the handheld module 102. The one or more first channels 116 are not in fluid communication with the one or more second channels 118. The one or more first channels 116 are connected to the ion generator 104, which is connected to the fluid generator 106. The ion generator 104 and the fluid generator 106 are used to inject ionized molecules (such as ionized air molecules) into the handheld module 102 and out of the nozzle 112.

[0073] In some embodiments, the ion generator 104 may be an ionizer, such as an AC ionizer, a pulsed DC ionizer, a steady-state DC ionizer or other suitable ion generating device. The ion generator 104 can generate positive ions, negative ions, both positive ions and negative ions at the same time, or alternately generate positive ions and negative ions. The fluid generator 106 is used to provide a liquid flow to the ion generator 104, and the ion generator 104 ionizes the molecules in the liquid flow. The fluid generator 106 may include a filter to remove any particles in the liquid flow. The fluid generator 106 can be used to control the humidity of the liquid flow. In some embodiments, the fluid generator 106 is used to provide a filtered liquid flow at a pressure greater than about 30 pounds per square inch (psi), such as about 30psi to about 60psi. In some embodiments, the fluid generator 106 is an air generator, such as a fan, a blower or a compressor. For example, the air molecules in the air flow generated by the fluid generator 106 are ionized by the ion generator 104 and then carried to the handheld module 102 by the air flow. In some embodiments, the ion generator 104 and the fluid generator 106 are integrated into a single device, such as an ion blower 107. Figure 2B The combination of the fluid generator 106 and the ion generator 104 or the ion blower 107 can be used to provide the filtered liquid flow at a pressure greater than about 30 psi (such as about 30 psi to about 60 psi).

[0074] like Figure 2A and Figure 2BAs shown, one or more first channels 116 in the handheld module 102 can be connected to the ion generator 104 or the ion blower 107 through the first tube 119, and the ion generator 104 can be connected to the fluid generator 106 through the second tube 120. The first tube 119 can be in fluid communication with one or more first channels 116. The first tube 119 can be made of a flexible material such as plastic. In some embodiments, the first tube 119 is made of flexible polyvinyl chloride (PVC), vinyl, polyurethane, polyethylene, nylon or other suitable materials. In some embodiments, the first tube 119 is a flexible hose. The size of the first tube 119 can be selected so that the liquid flow flowing through the first tube 119 has a pressure of about 30psi to about 60psi. In some embodiments, the inner diameter of the first tube 119 is in the range of about 1 / 8 inch to about 5 / 8 inch. The second tube 120 can be made of the same material as the first tube 119 and can have the same size as the first tube 119.

[0075] like Figure 2A and Figure 2B As shown, one or more second channels 118 in the handheld module 102 are connected to the suction module 108. The suction module 108 can be any device that can generate suction, such as a vacuum cleaner. The suction module 108 can generate a suction force that is greater than the injection force generated by the fluid generator 106. In other words, the volume flow rate of the fluid sucked into the handheld module 102 is substantially greater than the volume flow rate of the ionized liquid flow injected by the handheld module 102. In some embodiments, the suction module 108 is used to generate a suction greater than about 60psi. In some embodiments, the suction module 108 and the ion blower 107 (or the ion generator 104 and the fluid generator 106) are all in an open state during operation, and the suction force is greater than the injection force to ensure that the particles are sucked into the handheld module 102. Therefore, the handheld module 102 is used to inject or blow out the ionized fluid into the nozzle 112, and the particles are pumped or sucked into the nozzle 112. In some embodiments, the handheld module 102 is an ionized fluid blower / suction gun, such as an ionized air blower / suction gun. Figure 2A and Figure 2B As shown, the suction module 108 is separated from the ion generator 104 and the fluid generator 106 (or the ion blower 107). Figure 2C As shown, the suction module 108 and the ion blower 107 are integrated into a single device, such as an anti-static suction module 124.

[0076] In some embodiments, Figure 2AAs shown, the fluid generator 106 and the suction module 108 can be fixed, and the handheld module 102 is connected to the suction module 108 by a third tube 121. The third tube 121 can be connected to one or more second channels 118 and is in fluid communication with the one or more second channels 118. The third tube 121 can be made of the same material as the first tube 119. The size of the third tube 121 can be selected so that the suction generated by the suction module 108 at the nozzle 112 of the handheld module 102 is greater than about 60psi. In some embodiments, the inner diameter of the third tube 121 is in the range of about 9.5mm to about 10.5mm. The third tube 121 is removably attached to the handheld module 102 and the suction module 108, and the length of the second tube 120 can be determined by the distance between the fixed suction module 108 and the element to be cleaned (such as, the element of the lithography system 10). The ion generator 104 can be mobile or fixed. In some embodiments, the ion generator 104 is movable, and the length of the first tube 119 is substantially less than the length of the second tube 120. In other words, the ion generator 104 is closer to the handheld module 102 than the fluid generator 106. In some embodiments, the ion generator 104 is fixed, and the length of the first tube 119 is substantially greater than the length of the second tube 120. The lengths of the first tube 119 and the second tube 120 can be determined by the distance between the fixed fluid generator 106 and the element to be cleaned. In some embodiments, the ion generator 104 is attached to the fluid generator 106 with or without the second tube 120.

[0077] like Figure 2B As shown, in some embodiments, the ion blower 107 and the suction module 108 are movable. For example, the ion blower 107 and the suction module 108 may each include one or more mobile devices 122, such as one or more wheels. The one or more mobile devices 122 may be passive or electric. In some embodiments, the one or more mobile devices 122 are passive, and the ion blower 107 and the suction module 108 are moved by the operator pulling the first tube 119 and the third tube 121. In some embodiments, the one or more mobile devices 122 are electric, and the operator can use a remote control to control the speed and direction of the ion blower 107 and the suction module 108. In some embodiments, the ion blower 107 and the suction module 108 each include one or more cameras and / or sensors to autonomously follow the operator. In some embodiments, the ion blower 107 and the suction module 108 are fixed. The first tube 119 is removably attached to the handheld module 102 and the ion blower 107 , and the third tube 121 is removably attached to the handheld module 102 and the suction module 108 .

[0078] like Figure 2CAs shown, the antistatic suction module 124 is movable. For example, the antistatic suction module 124 may include one or more mobile devices 122. The first tube 119 and the third tube 121 are removably attached to the handheld module 102 and the antistatic suction module 124. The first tube 119 and the third tube 121 can be covered by a shell 126. The shell 126 can be made of a flexible material such as plastic. In some embodiments, the shell 126 is a corrugated tube. The shell 126 is also removably attached to the handheld module 102 and the antistatic suction module 124. In some embodiments, the antistatic suction module 124 is fixed, and the lengths of the first tube 119, the third tube 121 and the shell 126 can be determined by the distance between the fixed antistatic suction module 124 and the element to be cleaned.

[0079] like FIG. 2A to FIG. 2C As shown, the handheld module 102 may include an injection switch 128 and a suction switch 130. In some embodiments, the injection switch 128 can be used to control the ionized liquid flow generated by the ion generator 104 and the fluid generator 106 (or the ion blower 107), and the suction switch 130 can be used to control the suction generated by the suction module 108. In some embodiments, the suction switch 130 for controlling the suction generated by the suction module 108 may not exist on the handheld module 102, and the switch located on the suction module 108 is used to turn on and off the suction module 108 and control the suction through the handheld module 102. The injection switch 128 and the suction switch 130 can each be any suitable switch, such as a trigger, a button, or a flip-flop. In some embodiments, as FIG. 2A to FIG. 2C As shown, the injection switch 128 and the suction switch 130 can be different. For example, the injection switch 128 is a trigger and the suction switch 130 is a button. In some embodiments, the injection switch 128 and the suction switch 130 may include the same type of switch. In some embodiments, the injection switch 128 and the suction switch 130 may be buttons or triggers. The handheld module 102 may further include a cup 132 attached to the nozzle 112, such as FIG. 2A to FIG. 2C As shown. The cup 132 is removably attached to the nozzle 112. The cup 132 can be used to limit the cleaning area. The cup 132 can have a length L2 of about 90 mm to about 110 mm. The cup 132 can be made of an antistatic material, such as nitrile rubber or nitrile butadiene rubber.

[0080] FIG. 3A to FIG. 3C According to some embodiments FIG. 2A to FIG. 2C Schematic diagram of the end of the nozzle 112 of the particle removal device 100. In some embodiments, as Figure 3AAs shown, the nozzle 112 may have a circular cross-section, and the diameter D1 may be in the range of about 30 mm to about 35 mm. The cross-sectional shape of the nozzle 112 may be any suitable shape other than a circle. One or more first channels 116 and one or more second channels 118 are formed in the handheld module 102. Figure 3A As shown, the one or more first channels 116 include four channels 116, and the one or more second channels 118 include one channel 118. The four channels 116 may be arranged around the channel 118, and the four channels 116 may be equidistant from each other. In some embodiments, each channel 116 has a circular cross-section, and the diameter D2 is in the range of about 1 mm to about 10 mm, and each channel 118 has a circular cross-section, and the diameter D3 is in the range of about 5 mm to about 15 mm. As described above, in some embodiments, the suction force at the nozzle 112 is greater than the injection force at the nozzle 112. Therefore, in some embodiments, the nozzle 112 is connected to the suction module 108 ( FIG. 2A to FIG. 2C ) has a total cross-sectional area greater than that of the one or more second channels 118 connected to the fluid generator 106 ( FIG. 2A to FIG. 2C ) of the total cross-sectional area of ​​one or more first channels 116. For example, the total cross-sectional area of ​​the four channels 116 is smaller than the cross-sectional area of ​​the channel 118, such as Figure 3A The cross-sectional shape of the one or more first channels 116 and the one or more second channels 118 may be any suitable shape other than a circle.

[0081] In some embodiments, Figure 3B As shown, the one or more first channels 116 include one channel 116, and the one or more second channels 118 include four channels 118. The four channels 118 may be arranged around the channel 116, and the four channels 118 may be spaced equidistant from each other. In some embodiments, each channel 118 has a circular cross-section, and a diameter D4 is in the range of about 5 mm to about 10 mm, and each channel 118 has a circular cross-section, and a diameter D5 is in the range of about 5 mm to about 15 mm. In some embodiments, the total cross-sectional area of ​​the four channels 118 is greater than the cross-sectional area of ​​the channel 116, such as Figure 3B In some embodiments, Figure 3C As shown, the one or more first channels 116 include a channel 116. The one or more second channels 118 may include one or more channels 118, each having an annular shape. The annular channel 118 may surround the channel 116, and the annular channel 118 and the channel 116 may be concentric. The size of the annular channel 118 may be determined so that the total cross-sectional area of ​​the one or more second channels 118 is greater than the cross-sectional area of ​​the channel 116, such as Figure 3C shown.

[0082] Figure 4A and Figure 4B According to some embodiments FIG. 2A to FIG. 2C Schematic diagram of the end 134 of the cup 132 of the particle removal device 100. Figure 4A As shown, the cup 132 includes an end 134 having a circular cross-section. The end 134 may have a diameter D6 in the range of about 140 mm to about 160 mm. The end 134 may have other suitable cross-sectional shapes. In some embodiments, the end 134 has a square cross-section, such as Figure 4B As shown. The square end 134 of the cup 132 may have a length L3 in the range of about 140 mm to about 160 mm. The cup 132 of the handheld module 102 may be used to limit the cleaning area. Therefore, if the cross-sectional area of ​​the end 134 of the cup 132 is too large, the particles under the cup 132 may not be sucked or pumped out by the handheld module 102. On the other hand, if the cross-sectional area of ​​the end 134 of the cup 132 is too small, the cleaning of the component may be ineffective.

[0083] Figure 5 A handheld module 102 of a particle removal device 100 for removing particles from an element 500 of a tool is schematically shown according to some embodiments. In some embodiments, the element 500 may be a substrate stage 28 of a lithography system 10. The element 500 includes a non-metallic portion. The element 500 may be any suitable element on which particles may accumulate. In some embodiments, the element 500 may be a substrate support in a semiconductor processing chamber, such as a chemical vapor deposition (CVD) chamber, a physical vapor deposition (PVD) chamber, an atomic layer deposition (ALD) chamber, or an etching chamber. In some embodiments, the element 500 is an electrostatic chuck. During cleaning, an operator may hold the handheld module 102 over the element 500 to inject or blow an ionized fluid onto the element 500 and remove particles from the element 500 by sucking the particles into the handheld module 102, such as Figure 5 . The ion implantation and suction by the handheld module 102 can be performed simultaneously or alternately. The particles are sucked out by the handheld module 102, and the ion implantation can prevent and / or eliminate static electricity on the element 500. If there is no static electricity on the element 500, the particles near the element 500 may not be attracted by the element 500. In some embodiments, the suction is stopped after the ion implantation is stopped to ensure that the particles are removed from the element 500. In some embodiments, the suction module 108 is always in the on state, and the operator uses the injection switch 128 to control the injection ionization liquid flow.

[0084] FIG. 6A to FIG. 6CA method of removing particles from a component 500 using the particle removal apparatus 100 is shown in accordance with some embodiments. Fig. 6A As shown, method 600 begins at operation 602, which is to turn on a first switch of a particle removal device to remove particles from an element, while turning off a second switch of the particle removal device. The first switch may be a suction switch 130 located on the handheld module 102. In some embodiments, the first switch is located on the suction module 108. The second switch may be an injection switch 128 located on the handheld module 102. The particle removal device may be the particle removal device 100, and the element may be the element 500. For example, an operator turns on a first switch (such as the suction switch 130 or a switch on the suction module 108), and then places the handheld module 102 on the element to remove particles from the element by providing suction via the nozzle 112. A second switch located on the handheld module 102 for controlling ion injection may be turned off.

[0085] Next, at operation 604, a second switch is opened to prevent static charge from accumulating on the component while the first switch is opened. For example, the operator opens the second switch (which may be the injection switch 128) to inject the ionized liquid flow from the nozzle 112 into the component while the handheld module 102 continues to provide suction through the nozzle 112. The ionized liquid flow (such as ionized air) can prevent and / or eliminate static charge from accumulating on the component. Next, at operation 606, the second switch is closed while the first switch is open. For example, the operator closes the second switch to stop injecting the ionized liquid flow into the component while the handheld module 102 continues to provide suction through the nozzle 112. Next, at operation 608, the first switch is closed while the second switch is closed. For example, the operator closes the first switch to stop the suction provided by the nozzle 112.

[0086] Figure 6BA method 610 according to an alternative embodiment is shown. The method 610 begins at operation 612, which may be the same as operation 602. Next, at operation 614, the first switch is closed while the second switch is closed. For example, when the second switch is closed, the operator closes the first switch to stop the suction provided by the nozzle 112 of the handheld module 102 of the particle removal device 100. Next, at operation 616, the second switch is opened to prevent static charge from accumulating on the component while the first switch is closed. For example, the operator opens the second switch (which may be the injection switch 128) to inject the ionized liquid flow from the nozzle 112 into the component without providing suction through the nozzle 112. Next, at operation 618, the second switch is closed while the first switch is closed. For example, the operator closes the second switch to stop injecting the ionized liquid flow into the component when the suction is turned off. Next, at operation 620, the first switch is opened while the second switch is closed. For example, the operator opens the first switch to provide suction through the nozzle 112 without injecting the ionized liquid flow into the component. Next, at operation 622, the first switch is closed while the second switch is closed. For example, the operator closes the first switch to stop the suction provided by the nozzle 112 without injecting the ionized liquid flow into the component.

[0087] Figure 6C A method 630 according to an alternative embodiment is shown. The method 630 begins at operation 632, which may be the same as operation 602. Next, at operation 634, the second switch is opened to prevent static charge from accumulating on the component while the first switch is opened. For example, the operator opens the second switch (which may be the injection switch 128) to inject the ionized liquid stream from the nozzle 112 into the component while the nozzle 112 continues to provide suction. Next, at operation 636, the first switch and the second switch are closed. For example, the operator closes the first switch and the second switch simultaneously to stop injecting the ionized liquid stream into the component and stop suction. In some embodiments, the first switch and the second switch may be closed at the same time. In some embodiments, the first switch is closed immediately after the second switch is closed.

[0088] Methods 600, 610, 630 describe how to use the particle removal apparatus 100 to remove particles from a component of a lithography system without generating static charges. In some embodiments, a particle counting process is performed before and after each method 600, 610, 630. For example, before performing the methods 600, 610, 630, a first particle count on a component may be determined using any suitable particle counting apparatus or method. After performing the methods 600, 610, 630, a second particle count on a component may be determined using any suitable particle counting apparatus or method. The second count is substantially less than the first count.

[0089] Figure 7A method 700 for manufacturing a substrate according to some embodiments is shown. Note that the operations of method 700, including any description given with reference to the accompanying drawings, are exemplary only and are not intended to limit the scope beyond what is specifically described in the appended claims. Additional operations may be performed before, during, and after method 700, and some operations may be replaced or eliminated according to various embodiments of method 700.

[0090] At operation 702, particles are removed from components of the EUVL system. The particle removal process may be FIG. 6A to FIG. 6C When discussing EUVL systems, it is contemplated that the particle removal process may be performed in any system capable of performing advanced lithography processes such as DUV lithography, electron beam lithography, or X-ray lithography. The element may be a substrate stage in an EUVL system, such as Figure 1 The substrate stage 28 is shown.

[0091] At operation 704, after particles are removed from components of the EUVL system, the substrate is placed in the EUVL system. Figure 1 A substrate 26 is shown. The substrate may include a resist layer formed thereon.

[0092] At operation 706, the resist layer is exposed to a self-radiation source (such as Figure 1 The radiation source 12 shown in FIG. 1 is patterned radiation emitted by the resist layer. Exposure can make the resist layer more soluble in the developer, thereby producing a positive image pattern. Conversely, the resist layer can become less soluble when exposed, resulting in a negative image pattern.

[0093] At operation 708, the substrate is removed from the EUVL system. Other processes may be performed on the substrate to form a patterned resist layer, such as a post-exposure bake process and a development process. In some embodiments, after the substrate is removed from the EUVL process, method 700 may be repeated at operation 702.

[0094] The present disclosure in various embodiments provides a particle removal device 100. The particle removal device 100 includes a handheld module 102 for providing suction and injecting an ionized liquid flow. Some embodiments can achieve advantages. For example, the particle removal device 100 can be used to remove particles from the substrate stage 28 of the lithography system 10. The handheld module 102 of the particle removal device 100 can inject an ionized liquid flow on the substrate stage 28 to prevent static charge from accumulating on the substrate stage 28 and provide suction to remove particles from the substrate stage 28. In the absence of static charge on the substrate stage 28, particles near the substrate stage 28 will not be attracted to the substrate stage 28. Therefore, particles are removed from the substrate stage 28 more effectively.

[0095] One embodiment is a particle removal device. The device includes a handheld module having a body. One or more first channels and one or more second channels are formed in the body. The body includes a nozzle, and the handheld module is used to provide suction through the nozzle and inject an ionized liquid flow through the nozzle. The body further includes a handle attached to the nozzle. In some embodiments, the handle is angled relative to the longitudinal axis of the nozzle. In some embodiments, the one or more first channels include four channels, and the one or more second channels include one channel. In some embodiments, the one or more first channels are arranged around the one or more second channels. In some embodiments, each of the one or more first channels has a circular cross-section, and each of the one or more second channels has a circular cross-section. In some embodiments, each of the one or more first channels has a circular cross-section, and each of the one or more second channels has an annular cross-section. In some embodiments, the one or more first channels surround the one or more second channels. In some embodiments, the handheld module further includes a cup attached to the nozzle, a first switch, and a second switch.

[0096] Another embodiment is a particle removal device. The device includes a handheld module, which includes a main body, and one or more first channels and one or more second channels are formed in the main body. The device further includes a first tube attached to the handheld module, and the first tube is connected to the one or more first channels. The device further includes an ion generator connected to the first tube, a second tube attached to the handheld module, and a suction module connected to the second tube. The second tube is connected to the one or more second channels. In some embodiments, the particle removal device further includes a third tube and a fluid generator. The third tube is connected to the ion generator. The fluid generator is connected to the third tube. In some embodiments, the particle removal device further includes an ion blower. The ion blower includes an ion generator and a fluid generator. In some embodiments, the ion blower is movable. In some embodiments, the particle removal device further includes an antistatic suction module. The antistatic suction module includes an ion blower and a suction module. In some embodiments, the antistatic suction module is movable. In some embodiments, the suction module is a vacuum cleaner.

[0097] Yet another embodiment is a method for particle removal. The method includes the following steps: placing a handheld module of a particle removal device over an element; providing suction through a nozzle of the handheld module, opening a first switch to remove particles from the element; and opening a second switch located on the handheld module by injecting an ionized liquid flow from the nozzle of the handheld module to prevent static charge from accumulating on the element. In some embodiments, the method for particle removal further includes the following steps: closing the first switch before opening the second switch; closing the second switch; and closing the first switch. In some embodiments, the method for particle removal further includes the following steps: determining a first particle count on the element before placing the handheld module on the element; and determining a second particle count on the element after closing the first switch. In some embodiments, the method for particle removal further includes the following steps: placing a substrate on the element after opening the second switch, wherein the element is a substrate stage of an extreme ultraviolet lithography system; exposing a resist layer disposed on the substrate to radiation; and removing the substrate from the extreme ultraviolet lithography system. In some embodiments, the method of particle removal further comprises the steps of placing a substrate on an element, wherein the element is a substrate stage of an EUV lithography system; exposing a resist layer disposed on the substrate to radiation; and removing the substrate from the EUV lithography system before placing a handheld module of a particle removal device over the element.

[0098] The features of several embodiments are summarized above so that those skilled in the art can better understand the various aspects of the present disclosure. Those skilled in the art should understand that the present disclosure can be easily used as a basis for designing or modifying other processes and structures to achieve the same purpose and / or achieve the same advantages as the embodiments introduced herein. Those skilled in the art should also recognize that these equivalent constructions do not depart from the spirit and scope of the present disclosure, and these equivalent constructions can be variously changed, substituted and modified without departing from the spirit and scope of the present disclosure.

Claims

1. A particle removal device, characterized in that: Include: A handheld module, including: A body, wherein a plurality of first channels and a second channel are formed in the body, the first channels are arranged around the second channel, and a total cross-sectional area of ​​the first channels is greater than a cross-sectional area of ​​the second channel, wherein the body comprises: a nozzle, wherein the handheld module is configured to provide suction through the nozzle and inject an ionized liquid stream through the nozzle, and wherein the suction is provided through the first channels and the injection of the ionized liquid stream is provided through the second channel; as well as a handle attached to the nozzle; and A cup extends from the body, wherein the cup comprises a nitrile-based material and the cup has an end with a diameter in the range of 140 mm to 160 mm.

2. The particle removal device according to claim 1, characterized in that: The handle is angled relative to a longitudinal axis of the nozzle.

3. The particle removal device according to claim 1, characterized in that: The first channels include four channels.

4. The particle removal device according to claim 1, characterized in that: The first channels are equidistant from each other.

5. The particle removal device according to claim 1, characterized in that: Each of the first channels has a circular cross-section, and the second channel has a circular cross-section.

6. The particle removal device according to claim 1, characterized in that: Each of the first channels has an annular cross-section, and the second channel has a circular cross-section.

7. The particle removal device according to claim 6, characterized in that: The first channels are concentric with the second channel.

8. The particle removal device according to claim 1, characterized in that: The handheld module further comprises: a first switch; and A second switch.

9. A particle removal device, characterized in that: Include: A handheld module, including: A body, wherein one or more first channels and one or more second channels are formed in the body, the one or more first channels are arranged around the one or more second channels, a total cross-sectional area of ​​the one or more first channels is greater than a total cross-sectional area of ​​the one or more second channels, wherein the body comprises: a nozzle, wherein the handheld module is configured to provide suction through the nozzle and inject an ionized liquid stream through the nozzle, and wherein the suction is provided through the one or more first channels and the injection of the ionized liquid stream is provided through the one or more second channels; and a handle attached to the nozzle; a cup extending from the body, wherein the cup comprises a nitrile-based material and the cup has an end with a diameter in the range of 140 mm to 160 mm; a first tube attached to the handheld module, wherein a first end of the first tube is connected to the one or more second channels; an ion blower connected to a second end of the first tube opposite to the first end of the first tube, wherein the ion blower is movable and includes an ion generator and a fluid generator; a second tube attached to the handheld module, wherein a first end of the second tube is connected to the one or more first channels; and A suction module is connected to a second end of the second tube opposite to the first end of the second tube.

10. The particle removal device according to claim 9, characterized in that: Further including: A third tube is connected to the ion generator, wherein the fluid generator is connected to the third tube.

11. The particle removal device according to claim 9, characterized in that: Each of the one or more first channels and the one or more second channels has a circular cross-section.

12. The particle removal device according to claim 9, characterized in that Each of the one or more second channels has a circular cross-section, and each of the one or more first channels has an annular cross-section.

13. The particle removal device according to claim 9, characterized in that: It further comprises an anti-static suction module, wherein the anti-static suction module comprises the ion blower and the suction module.

14. The particle removal device according to claim 13, characterized in that The antistatic suction module is movable.

15. The particle removal device according to claim 9, characterized in that The suction module is a vacuum cleaner.

16. A method for removing particles, characterized in that: The following steps are involved: A handheld module of a particle removal device is placed on a component, wherein the handheld module comprises: A body, wherein a plurality of first channels and a second channel are formed in the body, the first channels are arranged around the second channel, and a total cross-sectional area of ​​the first channels is greater than a cross-sectional area of ​​the second channel, wherein the body comprises: a nozzle, wherein the handheld module is configured to provide suction through the nozzle and inject an ionized liquid stream through the nozzle, and wherein the suction is provided through the first channels and the injection of the ionized liquid stream is provided through the second channel; as well as a handle attached to the nozzle; and a cup extending from the body, wherein the cup comprises a nitrile-based material and the cup has an end with a diameter in the range of 140 mm to 160 mm; providing suction through the nozzle of the handheld module, and opening a first switch on the handheld module to remove a plurality of particles from the component; as well as By injecting the ionized liquid flow from the nozzle of the handheld module, a second switch located on the handheld module is opened to prevent static charge from accumulating on the component.

17. The method according to claim 16, characterized in that Further including: closing the first switch before opening the second switch; Turning off the second switch; and Close the first switch.

18. The method according to claim 17, characterized in that Further including: Before placing the handheld module on the component, measuring a first particle count on the component; and After the first switch is closed, a second particle count on the component is measured.

19. The method according to claim 16, characterized in that Further including: After the second switch is turned on, a substrate is placed on the component, wherein the component is a substrate stage of an extreme ultraviolet lithography system; exposing a resist layer disposed on the substrate to radiation; as well as The substrate is removed from the EUV lithography system.

20. The method according to claim 16, characterized in that Further including: placing a substrate on the component, wherein the component is a substrate stage of an EUV lithography system; exposing a resist layer disposed on the substrate to radiation; as well as The substrate is removed from the EUV lithography system prior to placing the handheld module of the particle removal device over the component.

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