Flexible wire harness assembly for surface mount devices

Abstract

Embodiments of this disclosure relate to a wire harness assembly including a substrate having a plurality of through-holes and traces formed on the top of the substrate, the traces extending between each of the plurality of through-holes. The wire harness assembly may further include a surface mount device disposed within one of the plurality of through-holes.

Description

Technical Field

[0001] This disclosure generally relates to surface mount devices (SMDs), and more specifically to a flexible wire harness assembly for SMDs. Background Technology

[0002] Surface mount devices (SMDs) and sensors (such as negative / positive temperature coefficient sensors, reed switches, anisotropic magnetoresistive (AMR) giant magnetoresistive (GMR) sensors, tunnel magnetoresistive (TMR) sensors, and / or fuses, or combinations thereof) need to be connected to control circuitry. A conventional assembly method involves placing the sensor on a printed circuit board (PCB) and then connecting the sensor with wires. In some cases, wire harnesses are also used for connection. However, wire harnesses can be expensive. Therefore, how to configure wiring for one or more devices (such as SMDs or sensors) without using traditional wire harnesses is a key problem that needs to be solved. Summary of the Invention

[0003] This invention is provided to introduce some concepts in a simplified form, which will be further described in the detailed description below. The purpose of this invention is not to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.

[0004] In summary, what is needed is a universal flexible harness for connecting SMDs and / or sensors via traces.

[0005] In one method, the wire harness assembly may include a substrate having a plurality of through-holes, and traces formed on the top of the substrate extending between each of the plurality of through-holes. The wire harness assembly may also include a surface mount device disposed within one of the plurality of through-holes.

[0006] In another approach, the component may include a substrate having a plurality of through-holes and traces formed on the top of the substrate, the traces extending between each of the plurality of through-holes. The component may also include a surface mount device disposed within one of the plurality of through-holes, the surface mount device being electrically connected to the traces.

[0007] In another method, a method for forming a wire harness assembly may include providing a plurality of through-holes through a substrate and forming traces on top of the substrate that extend between each of the plurality of through-holes. The method also includes positioning a surface mount device within one of the through-holes. Attached Figure Description

[0008] The accompanying drawings illustrate methods based on disclosed embodiments designed to practically apply their principles to date, wherein:

[0009] Figure 1 This is a top view of the harness assembly according to the disclosed method;

[0010] Figure 2 It is based on the publicly available method. Figure 1 A sectional view of the device along tangent 2-2;

[0011] Figure 3 It is based on the publicly available method. Figure 2 A side sectional view of an opening in the device;

[0012] Figures 4A-4C Various trace connections according to the disclosed method are depicted; and

[0013] Figure 5 One method based on the disclosed method is described.

[0014] These figures are not necessarily drawn to scale. These figures are merely representative and not intended to describe specific parameters of this disclosure. The figures are intended to depict typical embodiments of this disclosure and should therefore not be considered as limiting the scope. In the figures, similar numbers denote similar elements.

[0015] Furthermore, for clarity, certain elements in some of the accompanying figures may be omitted or shown off-scale. Additionally, for clarity, some figure labels may be omitted in some of the accompanying figures. Detailed Implementation

[0016] Embodiments according to this disclosure will be described more fully below with reference to the accompanying drawings. The components and methods of this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make this disclosure exhaustive and complete, and to fully convey the scope of the systems and methods to those skilled in the art.

[0017] The embodiments described herein provide an economical solution for low-current applications using trace connections to flexible electronic wires deposited on a substrate. In some embodiments, the flexible substrate may have pre-defined tabs or through-holes in which SMDs (such as sensors or fuses) can be attached. An advantage of this design is that the long leads sometimes required for sensors can be easily attached manually in a reflow oven or via automated line attachment. The flatness and robustness of this design allow sensors to be placed in compact locations where the cross-section of the device placement is limited. Furthermore, in some embodiments, the leads can be overprinted with electromagnetic interference (EMI) ink or polymer film to prevent signal interference from the power supply. This design can be particularly robust where vibration could affect the robustness of the connection, as the flexible wires have a much lower Young's modulus than electrical wires. While not limiting, some possible uses of this design include NTC leads to controllers, or reed connections for feedback in electrical appliances, automotive designs, or securities. Additionally, since the material with low thermal conductivity can be magnetic, the design can act as a flux concentrator.

[0018] Turn now Figure 1-2 The illustration shows an embodiment of a wire harness device or assembly 100 according to the present disclosure. As shown, the assembly 100 may include a substrate 102 including a plurality of through-holes 104A-104E formed therein. The substrate may include a first main side 106 opposite to a second main side 108, a first end 110 opposite to a second end 112, and a first side 114 opposite to a second side 116. In some embodiments, the substrate 102 may be a flexible printed circuit board (PCB), such as a flexible polymer substrate with stable dimensions that causes a PTC change at a given temperature. For example, for ethylene vinyl acetate (EVA), it may be a polypropylene PTC or polyethylene terephthalate (PET) substrate with perfluoroalkoxy (PFA), or a PTC substrate with polyvinylidene fluoride (PVDF) and polyimide.

[0019] The component 100 may further include a trace 120 formed along the substrate 102, for example, on top of the first main side 106. The trace 120 extends between two or more of the plurality of vias 104A-104E. While not limiting, but as shown, the trace 120 may have multiple paths or branches that terminate at conductive protrusions 122A-122B. In some embodiments, the trace 120 is a fine conductive wire made of silver or copper, or a low thermal conductivity alloy (e.g., Alloy 52). In some embodiments, a barrier layer 128, such as electromagnetic interference (EMI) ink or a polymer film, may be formed on the first main side 106 of the substrate 102, including on top of the trace 120. The barrier layer 128 can prevent signal interference from various nearby power sources (not shown).

[0020] The component 100 may further include one or more SMDs 125 disposed in a plurality of vias 104A-104E. In various embodiments, the SMDs 125 may be protection components and / or sensors, including but not limited to fuses, PTCs, NTCs, ICs, reed sensors, MOSFETs, resistors, and capacitors. Among these protection components, ICs and sensors are considered active protection components, while PTCs, NTCs, and fuses are considered passive protection components. However, it will be understood that this arrangement is not limiting, and the number and configuration of SMDs may vary depending on the application. The SMDs 125 may be connected by traces 120.

[0021] Turn now Figure 3 The via 104C according to embodiments of the present disclosure will be described in more detail below. As shown, the via 104C may be recessed into a first main side 106 of the substrate 102. In various embodiments, the via 104C may extend partially or entirely through the substrate 102. The via 104C may include an adhesive layer 130 deposited / formed along its inner surface 133. In some embodiments, the adhesive layer 130 may be a polymer adhesive operable to secure the SMD within the via 104C. In other embodiments, the via 104C may be lined with a thermally conductive material (such as copper). It should be understood that the via 104C provides a conductive path between the trace 120 and the SMD.

[0022] Figures 4A-4C Different trace arrangements according to various embodiments of this disclosure are shown. For example... Figure 4A As shown, the first trace 120A includes a lead 132 connected to a first set of fingers 134, 135. Similarly, the second trace 120B includes a lead 138 connected to a second set of fingers 140, 142. The first set of fingers 134, 135 and the second set of fingers 140, 142 may be interleaved and connected via a conductive pad (not shown). In some embodiments, the leads 132, 138 may be made of a highly conductive material, such as silver or copper, while the first set of fingers 134, 135 and the second set of fingers 140, 142 may be made of a low-expansion, low-thermal-conductivity material, such as alloy 52.

[0023] like Figure 4BAs shown, the first trace 220A includes a lead 232 connected to a first set of fingers 234, 235, and 236. Similarly, the second trace 220B includes a lead 238 connected to a second set of fingers 240, 241, and 242. The first set of fingers 234-236 and the second set of fingers 240-242 may cross each other and be connected via a conductive pad (not shown). Likewise, leads 232 and 238 may be highly conductive materials, such as silver or copper, while the first set of fingers 234-236 and the second set of fingers 240-242 may be low-expansion, low-thermal-conductivity materials, such as alloy 52.

[0024] like Figure 4C As shown, the first trace 320A includes a lead 332 connected to a first set of fingers 334, 335. In this embodiment, the fingers 334, 335 extend perpendicular to the lead 332. Similarly, the second trace 320B includes a lead 338 connected to a second set of fingers 340, 341, wherein the lead 338 extends perpendicular to the second set of fingers 340, 341. As shown, the first set of fingers 334, 335 and the second set of fingers 340, 341 do not interweave or cross each other. Instead, the first set of fingers 334, 335 and the second set of fingers 334, 341 generally extend parallel to each other.

[0025] Turn now Figure 5 The present disclosure will describe a method 400 for forming a wire harness assembly according to embodiments thereof. In block 401, method 400 may include providing a plurality of through-holes through a substrate. In some embodiments, the substrate may be a flexible PCB made of PET or PI.

[0026] In block 402, method 400 may further include forming a trace on top of the substrate, the trace extending between each of the plurality of vias. In some embodiments, the trace includes leads connected to a set of fingers. In some embodiments, the leads are made of silver or copper, and the set of fingers is made of alloy 52. ​​In some embodiments, a barrier layer may then be formed on the trace and the substrate, wherein the barrier layer is an electromagnetic interference ink or a polymer film.

[0027] In block 403, method 400 further includes positioning a surface-mount device within one of a plurality of vias. In some embodiments, a polymer adhesive layer is formed along the inner surface of one or more vias. In some embodiments, the surface-mount device may include protective components and / or sensors, including but not limited to fuses, PTCs, NTCs, ICs, reed sensors, MOSFETs, resistors, and capacitors.

[0028] Although the illustrative method 400 has been described above as a series of actions or events, this disclosure is not limited to the order in which such actions or events are described unless otherwise stated. For example, according to this disclosure, some actions may occur in a different order, and / or simultaneously with other actions or events other than the order in which they are described and / or illustrated herein. Furthermore, not all described actions or events require the implementation of the method described in this disclosure. Additionally, method 400 may be implemented in conjunction with the formation and / or processing of structures described and illustrated herein, as well as with other structures not described herein.

[0029] As used herein, elements or operations described in the singular and beginning with the words “a” or “an” should be understood to include plural elements or operations until such exclusion is explicitly stated. Furthermore, references to “one embodiment” in this disclosure are not intended to be limiting. Additional embodiments may also incorporate the described features.

[0030] Furthermore, the terms "substantial" or "truly" and "approximately" may be used interchangeably in some embodiments and may be described using any relative measure acceptable to those skilled in the art. For example, these terms may be used as comparisons with reference parameters to indicate deviations from the intended functionality. While not limiting, deviations from reference parameters may, for example, be in amounts less than 1%, less than 3%, less than 5%, less than 10%, less than 15%, less than 20%, etc.

[0031] Furthermore, those skilled in the art will understand that when an element (such as a layer, region, or substrate) is referred to as being formed, deposited, or placed “on,” “above,” or “on top” another element, the element may be directly on the other element or there may be intermediate elements present. Conversely, when an element is referred to as being “directly on,” “directly above,” or “directly on top of” another element, there are no intermediate elements present.

[0032] In various embodiments, design tools can be provided and configured to create datasets for layer patterning of the grating materials and diffractive optical elements described herein. For example, datasets can be created to generate photomasks used during photolithography operations to pattern the layers of the structures described herein. Such design tools may comprise a collection of one or more modules and may consist of hardware, software, or a combination thereof. Thus, for example, a tool may be a collection of one or more software modules, hardware modules, software / hardware modules, or any combination or arrangement thereof. As another example, a tool may be a computing device or other means running software, or it may be implemented in hardware.

[0033] This disclosure is not limited to the specific embodiments described herein. In fact, various other embodiments and modifications of this disclosure, besides those described herein, will be apparent to those skilled in the art based on the foregoing description and drawings. Therefore, these other embodiments and modifications are intended to fall within the scope of this disclosure. Furthermore, this disclosure has been described in the context of specific implementations for specific purposes in specific environments. Those skilled in the art will recognize that its use is not limited thereto, and that this disclosure can be advantageously practiced in any number of environments for any number of purposes. Therefore, the claims are to be interpreted in accordance with the breadth and spirit of this disclosure as set forth herein.

Claims

1. A wire harness assembly, comprising: A substrate including multiple through holes; A trace formed only along the upper surface of the substrate, the trace extending between each of the plurality of vias, wherein the trace includes a lead connected to a set of fingers, wherein the lead has a first conductivity, and the set of fingers has a second conductivity lower than the first conductivity; and A surface mounting device, wherein the surface mounting device is disposed within one of the plurality of through holes.

2. The wire harness assembly of claim 1, wherein, The leads are made of silver or copper, and the set of fingers are made of alloy 52.

3. The wire harness assembly of claim 1, wherein, The surface-mount device is a positive temperature coefficient material sensor, a negative temperature coefficient material sensor, a magnetoresistive sensor, or a reed switch.

4. The wiring harness assembly of claim 1, further comprising a blocking layer formed on the trace.

5. The wire harness assembly of claim 4, wherein, The barrier layer is an electromagnetic interference ink or a polymer film.

6. The wire harness assembly according to claim 1, wherein, The substrate is a printed circuit board.

7. The wire harness assembly according to claim 1, further comprising an adhesive layer within the through hole.

8. A component comprising: A substrate including multiple through holes; A trace formed only along the upper surface of the substrate, the trace extending between each of the plurality of vias, wherein the trace includes a lead connected to a set of fingers, wherein the lead has a first conductivity, and the set of fingers has a second conductivity lower than the first conductivity; and A surface mount device, wherein the surface mount device is disposed within one of the plurality of through holes, and the surface mount device is connected to the trace.

9. The component according to claim 8, wherein, The leads are made of silver or copper, and the set of fingers are made of alloy 52.

10. The component of claim 8, wherein, The surface-mount device is a positive temperature coefficient material sensor, a negative temperature coefficient material sensor, a magnetoresistive sensor, or a reed switch.

11. The component of claim 8, further comprising a blocking layer formed on the trace, wherein the blocking layer is an electromagnetic interference ink or a polymer film.

12. The component of claim 8, further comprising an adhesive layer along the inner surface of the through hole.

13. A method for forming a wire harness assembly, the method comprising: Provide multiple through-holes through the substrate; Traces are formed only along the upper surface of the substrate, and the traces extend between each of the plurality of through holes; The trace leads are coupled to a set of fingers, wherein the leads have a first conductivity and the set of fingers have a second conductivity lower than the first conductivity; and Position the surface mount device within one of the plurality of through holes.

14. The method of claim 13, further comprising forming a blocking layer on the trace, wherein the blocking layer is an electromagnetic interference ink or a polymer film.

15. The method of claim 13, further comprising providing an adhesive layer along the inner surface of the through hole.

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