Circuit assembly comprising metal strips

Abstract

A circuit assembly includes a first substrate including a first outer surface, a first capacitor disposed on the first outer surface, and a first metal strip. The first capacitor has a first capacitor thickness in a first direction orthogonal to the first outer surface. The first metal strip has a first strip thickness in the first direction, the first strip thickness being greater than the first capacitor thickness. An electrical load is optionally disposed on a second outer surface of the first substrate, above the first metal strip in the first direction. The electrical load can be electrically coupled to the first metal strip.

Description

Background Technology

[0001] Circuit assemblies are widely used in electronic devices. A circuit assembly includes a substrate such as a printed circuit board (PCB), and components such as integrated circuits and passive parts attached to one or more outer surfaces of the substrate. The substrate typically includes metallic conductors, sometimes called "traces," which are used to electrically connect the components on the substrate. An example of a circuit assembly is the "motherboard" of an information technology device, which includes a processor and support components attached to the substrate. Summary of the Invention

[0002] In a first aspect, a circuit assembly includes: (1) a first substrate including a first outer surface, (2) a first component disposed on the first outer surface, and (3) a first metal strip disposed on the first outer surface, the first metal strip being thicker than the first component.

[0003] In an embodiment of the first aspect, the first component has a first component thickness in a first direction orthogonal to the first outer surface, the first metal strip has a first strip thickness in the first direction, and the first strip thickness is greater than the first component thickness.

[0004] In another embodiment of the first aspect, the circuit assembly further includes a second metal strip disposed on the first outer surface, the second metal strip being separated from the first metal strip in a second direction orthogonal to the first direction, wherein the first component is disposed between the first metal strip and the second metal strip in the second direction.

[0005] In another embodiment of the first aspect, the first component includes a first terminal and a second terminal, the first terminal being electrically coupled to the first metal strip and the second terminal being electrically coupled to the second metal strip.

[0006] In another embodiment of the first aspect, each of the first metal strip and the second metal strip is an extension of a corresponding winding of an inductor.

[0007] In another embodiment of the first aspect, the circuit assembly further includes a pressure plate, and each of the first metal strip, the second metal strip, and the first component is disposed between the first substrate and the pressure plate in the first direction. The pressure plate is optionally formed of metal, and the circuit assembly optionally further includes an insulating layer disposed in the first direction between (1) the pressure plate, and (2) the first metal strip, the second metal strip, and the first component.

[0008] In another embodiment of the first aspect, the circuit assembly further includes molding material disposed above the first metal strip, the second metal strip, and the first component.

[0009] In another embodiment of the first aspect, the circuit assembly further includes a third metal strip disposed on the first outer surface, the third metal strip being spaced apart from each of the first and second metal strips in the second direction. Each of the first, second, and third metal strips may optionally be part of different corresponding electrical nodes of the circuit assembly.

[0010] In another embodiment of the first aspect, the first substrate includes a second outer surface opposite to the first outer surface in the first direction, and the circuit system assembly further includes an electrical load disposed on the second outer surface, the electrical load being electrically coupled to each of the first metal strip and the first component.

[0011] In another embodiment of the first aspect, the electrical load includes an integrated circuit disposed on a second outer surface, the integrated circuit being positioned above the first metal strip in the first direction.

[0012] In another embodiment of the first aspect, the circuit assembly further includes at least one row of a plurality of inductors disposed on the second outer surface, each of the plurality of inductors in each row being electrically coupled to the first metal strip.

[0013] In another embodiment of the first aspect, the circuit assembly further includes a second substrate disposed above the first substrate in the first direction.

[0014] In another embodiment of the first aspect, the circuit assembly further includes an electrical load disposed on the second substrate, the electrical load being electrically coupled to each of the first metal strip and the first component.

[0015] In another embodiment of the first aspect, the electrical load includes an integrated circuit disposed on the second substrate, the integrated circuit being positioned above the first metal strip in a first direction.

[0016] In another embodiment of the first aspect, the circuit assembly further includes at least one inductor disposed on the second substrate, the at least one inductor being electrically coupled to the first metal strip.

[0017] In another embodiment of the first aspect, the circuit assembly further includes: (1) a second substrate disposed above each of the first metal strip and the second metal strip in the first direction, such that each of the first metal strip and the second metal strip is disposed between the first substrate and the second metal strip in the first direction, and (2) a third metal strip disposed on the outer surface of the second substrate.

[0018] In another embodiment of the first aspect, the first component is a capacitor.

[0019] In a second aspect, a circuit assembly includes: (1) a printed circuit board (PCB) including a plurality of metal layers separated from each other by a plurality of isolation layers in a first direction, the PCB including opposing first and second outer surfaces separated from each other in the first direction, (2) an integrated circuit disposed on the second outer surface, (3) a plurality of capacitors disposed on the first outer surface, the plurality of capacitors being located below the integrated circuit in the first direction, each of the plurality of capacitors being electrically coupled to the integrated circuit, and (4) a plurality of metal strips disposed on the first outer surface, the plurality of metal strips being located below the integrated circuit in the first direction, each of the plurality of metal strips being electrically coupled to the integrated circuit.

[0020] In a second aspect embodiment, the plurality of capacitors are arranged as a multi-row capacitor, wherein adjacent rows of the multi-row capacitors are separated from each other by corresponding metal strips of the plurality of metal strips in a second direction orthogonal to the first direction.

[0021] In another embodiment of the second aspect, each of the plurality of capacitors has a corresponding capacitor thickness in the first direction, each of the plurality of metal strips has a corresponding strip thickness in the first direction, and each strip thickness is greater than each capacitor thickness.

[0022] In another embodiment of the second aspect, the circuit assembly further includes a pressure plate, and each of the plurality of capacitors and each of the plurality of metal strips are disposed between the pressure plate and the PCB in the first direction.

[0023] In another embodiment of the second aspect, the pressure plate is formed of metal, and the circuit assembly further includes an isolation layer disposed in the first direction between (1) the pressure plate, and (2) each of the plurality of capacitors and each of the plurality of metal strips.

[0024] In another embodiment of the second aspect, the circuit assembly further includes molding material disposed on each of the plurality of capacitors and on each of the plurality of metal strips.

[0025] In another embodiment of the second aspect, the circuit assembly further includes at least one row of a plurality of inductors disposed on the second outer surface, each of the plurality of inductors in each row being electrically coupled to one or more of the plurality of metal strips.

[0026] In a third aspect, a circuit assembly includes: (1) a first substrate including a first outer surface, (2) a first metal strip disposed on the first outer surface, (3) a second metal strip disposed on the first outer surface, the second metal strip being separated from the first metal strip in a first direction, and (4) a first component disposed in the first direction between the first metal strip and the second metal strip, the first component including a first terminal and a second terminal, the first terminal being electrically coupled to the first metal strip and the second terminal being electrically coupled to the second metal strip.

[0027] In a third embodiment, the first component includes a capacitor.

[0028] In another embodiment of the third aspect, the first substrate includes a second outer surface opposite to the first outer surface in a second direction orthogonal to the first direction, and the circuit system assembly further includes an electrical load disposed on the second outer surface, the electrical load being electrically coupled to each of the first metal strip and the first component.

[0029] In another embodiment of the third aspect, the electrical load includes an integrated circuit disposed on the second outer surface, the integrated circuit being positioned above the first metal strip in the second direction.

[0030] In another embodiment of the third aspect, the first component has a component thickness in the second direction, each of the first metal strip and the second metal strip has a corresponding strip thickness in the second direction, and each strip thickness is greater than the component thickness. Attached Figure Description

[0031] Figure 1 This is a top plan view of the circuit assembly according to an embodiment.

[0032] Figure 2 yes Figure 1 A cross-sectional view of the circuit components.

[0033] Figure 3 yes Figure 1 A bottom view of the circuit components.

[0034] Figure 4 yes Figure 1 An electrical schematic diagram of one embodiment of the circuit components.

[0035] Figure 5 yes Figure 1 An electrical schematic diagram of another embodiment of the circuit components.

[0036] Figure 6 yes Figure 1 A bottom plan view of an alternative embodiment of the circuit components.

[0037] Figure 7 yes Figure 1 A bottom plan view of another alternative embodiment of the circuit components.

[0038] Figure 8 yes Figure 1 A bottom plan view of another alternative embodiment of the circuit components.

[0039] Figure 9 This is a bottom plan view of a circuit assembly including a pressure plate according to an embodiment.

[0040] Figure 10 yes Figure 9 A cross-sectional view of the circuit components.

[0041] Figure 11 This is a bottom plan view of a circuit assembly including molding material according to an embodiment.

[0042] Figure 12 yes Figure 11 A cross-sectional view of the circuit components.

[0043] Figure 13 This is a top plan view of a circuit assembly including two substrates according to an embodiment.

[0044] Figure 14 yes Figure 13 A cross-sectional view of the circuit components.

[0045] Figure 15 yes Figure 13 A bottom view of the circuit components.

[0046] Figure 16 This is a bottom plan view of a circuit assembly including three substrates according to an embodiment.

[0047] Figure 17 yes Figure 16 A cross-sectional view of the circuit components.

[0048] Figure 18 This is a top plan view of a circuit assembly including two layers of metal strips according to an embodiment.

[0049] Figure 19 yes Figure 18 A cross-sectional view of the circuit components.

[0050] Figure 20 yes Figure 18 A bottom view of the circuit components.

[0051] Figure 21 This is a cross-sectional view of a circuit assembly including multiple integrated circuits and inductors according to an embodiment.

[0052] Figure 22This is a cross-sectional view of another circuit assembly including multiple integrated circuits and inductors according to an embodiment.

[0053] Figure 23 This is a top plan view of another circuit component including multiple rows of inductors and integrated circuits according to an embodiment.

[0054] Figure 24 yes Figure 23 A cross-sectional view of the circuit components.

[0055] Figure 25 yes Figure 23 A bottom view of the circuit components.

[0056] Figure 26 This is a bottom plan view of a circuit assembly according to an embodiment, including a metal strip that extends as an inductor winding.

[0057] Figure 27 yes Figure 26 A cross-sectional view of the circuit components.

[0058] Figure 28 yes Figure 1 A bottom plan view of another alternative embodiment of the circuit components.

[0059] Figure 29 yes Figure 1 A bottom plan view of another alternative embodiment of the circuit components.

[0060] Figure 30 yes Figure 21 A cross-sectional view of an alternative embodiment of the circuit components. Detailed Implementation

[0061] Circuit board substrates typically must carry considerable current. For example, modern integrated circuits may draw 1,000 amps or more from power rails, and therefore, even relatively small substrate resistances can lead to significant power losses. Furthermore, integrated circuits often have very tight voltage regulation requirements, which can be difficult to maintain due to the interaction between the large supply current magnitude and the substrate's parasitic impedance. Therefore, low impedance in the substrate's power paths is crucial. However, achieving sufficiently low impedance is often challenging due to substrate manufacturing and cost constraints. This difficulty is often exacerbated by the presence of signal traces and vias on the substrate, as these limit the usable surface area of ​​the power conductors on the substrate.

[0062] The impedance of a power supply conductor decreases as the conductor length decreases. Therefore, by positioning the power supply circuit system (such as a DC-DC converter) as close as possible to its load, the impedance of the power supply conductor can be minimized. For example, suppose a DC-DC converter powers an integrated circuit located on the top outer surface of a substrate. By positioning the DC-DC converter on the bottom outer surface of the substrate, so that the DC-DC converter is directly below the integrated circuit, the length of the power supply conductor between the DC-DC converter and the integrated circuit can be minimized. However, this positioning method of the DC-DC converter has significant drawbacks that may make it impractical.

[0063] For example, there are often strict limitations on component height on the bottom outer surface of the substrate, which can make it difficult to design a suitable DC-DC converter, especially when high power conversion efficiency is required. Additionally, DC-DC converters may need to handle significant mechanical stresses applied to the circuit components to balance the stresses applied to the heatsink located above the top surface of the substrate (as described below), which can further complicate the design. Furthermore, power bypass capacitors typically need to be positioned below the integrated circuit for optimal performance, which may leave very little surface area for the DC-DC converter components. Moreover, positioning the DC-DC converter below the integrated circuit can lead to difficulties in circuit component manufacturing.

[0064] Another challenge in designing circuit components is removing heat from the integrated circuit (IC) and other components attached to the substrate. Modern ICs can dissipate significant amounts of power, necessitating the use of heat sinks to remove heat from the IC. The heat sink must be tightly attached to the thermal interface of the IC to effectively absorb heat from it. Therefore, a large pressure per unit area must be applied to both the heat sink and the IC to ensure sufficiently low thermal resistance between the two devices. Such pressure can cause substrate bending and associated damage, and can also damage the IC itself. Therefore, counter-pressure is typically applied to the opposite side of the substrate from the IC to prevent substrate bending and associated damage. However, this counter-pressure complicates the reliable placement of components on the opposite side of the substrate from the IC. For example, counter-pressure applied to components such as capacitors on the bottom outer surface of the substrate can damage the components.

[0065] This document discloses circuit components that can at least partially overcome one or more of the aforementioned difficulties associated with conventional circuit components. The novel circuit components include one or more conductive structures (e.g., conductive strips or metal strips). These conductive structures will be referred to hereinafter as metal strips. The metal strip may be disposed on a first outer surface of a substrate, such as beneath an integrated circuit disposed on an opposite second outer surface of the substrate. As discussed further below, the metal strip can achieve significant advantages. For example, in some embodiments, the metal strip is thicker than other components (such as capacitors) disposed on the first outer surface. Therefore, the metal strip receives pressure applied to the circuit component, such as pressure applied to a heat sink located above the second outer surface, thereby protecting the component from mechanical stress. As another example, in some embodiments, the metal strip serves as a power conductor, thereby helping to achieve low impedance between the power circuit system and the electrical load powered by the power circuit system, even if the distance between the power circuit system and the power source is large. Additionally, in some embodiments, the metal strip is part of the same electrical node as other components positioned on the first outer surface, allowing the metal strip to be placed near these components without the risk of harmful electrical short circuits between these components and the metal strip.

[0066] Figure 1 This is a top plan view of circuit assembly 100, which is an embodiment of a novel circuit assembly including metal strips. Figure 2 It is the edge of circuit component 100 Figure 1 The cross-sectional view taken by line 2A-2A, and Figure 3 This is a bottom plan view of the circuit assembly 100. The circuit assembly 100 includes a substrate 102, an electrical load 104, a plurality of capacitors 106, and metal strips 108 to 116.

[0067] The substrate 102 includes an outer surface 118 and an opposite outer surface 120 spaced apart from each other in a direction 122, wherein the direction 122 is orthogonal to the outer surfaces 118 and 120. The substrate 102 is a PCB, which includes a plurality of metal layers 124 or a plurality of layers formed of another conductive material spaced apart from each other in the direction 122 by a plurality of insulating layers 126. Figure 2 To make things clear, Figure 2 Only one metal layer 124 and one isolation layer 126 are shown. The metal layer 124 is formed, for example, of copper, gold, silver, or aluminum, while the isolation layer 126 is formed, for example, of glass fiber reinforced epoxy resin or paper reinforced phenolic resin. The number of metal layers 124 and the number of isolation layers 126 can vary without departing from the scope of this document. Details of the metal layer 124 are not shown, but one or more metal layers 124 can be patterned to form multiple electrical conductors, such as signal traces. Additionally, one or more metal layers 124 can form a power plane or a ground plane.

[0068] The substrate 102 further includes vias 128 electrically connecting two or more different metal layers 124 in direction 122. Figure 2 For clarity, only one through-hole 128 is labeled. Although the through-hole 128 is shown extending through the entire substrate 102 in direction 122, alternatively, one or more through-holes 128 may extend only a portion of the substrate 102 in direction 122. The number of through-holes 128 may vary without departing from the scope of this document. Additionally, the size of the substrate 102 may be related to... Figures 1 to 3 The differences shown in the diagram. For example, substrate 102 can be compared to... Figures 1 to 3 The substrate 102 is larger than that shown in the diagram, for example, to accommodate additional components. Furthermore, the substrate 102 can alternatively be a circuit board other than a PCB board, as long as the substrate 102 includes an outer surface for mounting components and a configuration for electrically connecting components.

[0069] An electrical load 104 is disposed on the outer surface 120 of the substrate 102. Although the electrical load 104 is shown as an integrated circuit connected to the substrate 102 via solder balls 130 (only one of which is labeled), the electrical load 104 may take other forms without departing from the scope of this document. For example, the electrical load 104 may be one or more discrete electrical components in place of the integrated circuit. One or more heat sinks (not shown) may optionally be attached to the electrical load 104. Metal strips 108 to 116 are disposed on the outer surface 118, and in some embodiments, the electrical load 104 is disposed over at least a portion of one or more of the metal strips 108 to 116 in direction 122. The electrical load 104 may optionally be electrically coupled to one or more metal strips 108 to 116. The metal strips 108 to 116 are spaced apart from each other in direction 132. Figure 3 ), wherein direction 132 is orthogonal to direction 122. Each metal strip 108 to 116 has a strip thickness 134 in direction 122. Figure 2 The thickness 134 of the strip does not need to be uniform across all instances of metal strips 106 to 116. In some embodiments, metal strips 108 to 116 are formed of copper, gold, silver, aluminum, steel, or a metal alloy.

[0070] Capacitor 106 is also disposed on outer surface 118. Figure 2 and Figure 3Each capacitor 106 has a corresponding first terminal 136 and a corresponding second terminal 138, which are used to provide an electrical interface to the capacitor. For clarity, only one example of a capacitor 106 and its corresponding terminals 136, 138 are shown. The capacitors 106 are arranged in rows 140 to 146, wherein each row is spaced apart from each other in direction 132, and each row is defined in direction 132 by a corresponding pair of metal strips 108 to 116. The capacitors 106 in the given rows 140 to 146 are spaced apart from each other in direction 148, which is orthogonal to each of directions 122 and 132. Each capacitor 106 has a capacitor thickness 150 mm in direction 122. Figure 2 The capacitor thickness of 150 mm is not necessarily uniform across all 106 capacitor instances.

[0071] In some embodiments, the strip thickness 134 is greater than the capacitor thickness 150, such as... Figure 2 As shown, this configuration advantageously helps protect capacitor 106 from mechanical damage. For example, consider... Figure 2 The scene depicted in the diagram shows opposing mechanical forces 152 and 154 applied to the circuit assembly 100 in direction 122. For example, mechanical force 152 is applied to ensure that a heat sink (not shown) is securely attached to the electrical load 104, and opposing mechanical force 154 is applied to counteract mechanical force 152. The relatively large thickness 134 of the metal strips 106 to 116 ensures that it is the metal strip, rather than the capacitor 106, that receives the mechanical force 154, thereby protecting the capacitor 106 from damage by the mechanical force 154.

[0072] In some embodiments, one or more of the metal strips 108 to 116 are used as power conductors, such as to supply power to the electrical load 104. For example, Figure 4 This is an electrical schematic diagram 400 of one embodiment of circuit assembly 100, in which metal strips 108 to 116 serve as power conductors. In this embodiment, metal strips 108, 112, and 116 are electrically coupled to electrical node 402, and metal strips 110 and 114 are electrically coupled to electrical node 404. An electrical load 104 is electrically coupled between electrical nodes 402 and 404. Electrical node 402 is, for example, a power node, and electrical node 404 is, for example, a reference node, such that metal strips 108 to 116 are alternately connected to the power node and the reference node. Even though the power circuit system is far from the electrical load 104, the potentially large strip thickness 134 of metal strips 108 to 116 advantageously allows the metal strips to provide a low-impedance electrical path between the power circuit system (not shown) and the electrical load 104.

[0073] Additionally, in an embodiment where the circuit assembly 100 has the topology shown in schematic 400, each capacitor 106 is electrically coupled between nodes 402 and 404. For example, in row 140, capacitor terminal 136 is electrically coupled to metal strip 108, and capacitor terminal 138 is electrically coupled to metal strip 110, such that each capacitor 106 in row 140 is electrically coupled between electrical nodes 402 and 404. This configuration advantageously allows the capacitors 106 to be placed physically close to metal strips 108 to 116 without the risk of harmful electrical short circuits between the capacitors 106 and metal strips 108 to 116. For example, refer again... Figure 3 Assume that terminals 136 and 138 of the labeled instance of capacitor 106 are electrically coupled to metal strips 108 and 110, respectively. The separation distance 302 between terminal 136 and metal strip 108 can be very small, without any risk of harmful electrical short circuit between terminal 136 and metal strip 108, since the terminal and metal strip are already short-circuited, i.e., they are part of a common electrical node. Similarly, the separation distance 304 between terminal 138 and metal strip 110 can be very small, without any risk of harmful electrical short circuit between terminal 138 and metal strip 110, since the terminal and metal strip are already short-circuited, i.e., they are part of a common electrical node. Therefore, capacitor 106 and metal strips 108 to 116 can be placed close together in direction 132 without any risk of harmful electrical short circuit, which facilitates dense component placement on the outer surface 118. Furthermore, capacitors 106 in rows 140, 142, 144, or 146 can be placed close together in direction 148 without the risk of harmful electrical short circuits, since all capacitors in the row are electrically coupled to the same electrical node, which further facilitates dense component placement on the outer surface 118.

[0074] In some embodiments, one or more of the metal strips 108 to 116 are used as power conductors for two or more power rails, such as to provide two or more different power supply voltages to the electrical load 104. For example, Figure 5This is an electrical schematic diagram 500 of one embodiment of circuit assembly 100, wherein metal strips serve as power conductors for two different power rails. Specifically, metal strips 108 and 112 are electrically coupled to electrical node 502, metal strip 116 is electrically coupled to electrical node 504, and metal strips 110 and 114 are electrically coupled to electrical node 506. A first portion of the electrical load 104, symbolically shown by resistor 104(a), is electrically coupled between electrical nodes 502 and 506. A second portion of the electrical load 104, symbolically shown by resistor 104(b), is electrically coupled between electrical nodes 504 and 506. For example, the first and second portions of the electrical load 104 require different power supply voltages and are therefore powered by power nodes 502 and 504, respectively. Electrical node 506 is, for example, a reference node. Capacitors 106 in row 146 are electrically coupled between metal strips 114 and 116, and thus these capacitors are electrically coupled between electrical nodes 504 and 506. Capacitor 106 in row 140 is electrically coupled between metal strips 108 and 110, capacitor 106 in row 142 is electrically coupled between metal strips 110 and 112, and capacitor 106 in row 144 is electrically coupled between metal strips 112 and 114. Therefore, capacitor 106 in rows 140, 142, and 144 is electrically coupled between electrical nodes 502 and 506.

[0075] Without departing from the scope of this document, the number, arrangement, and size of the capacitors on the outer surface 118, as well as the number, size, and arrangement of the metal strips on the outer surface 118, may be changed. For example, Figure 6 This is a bottom plan view of circuit assembly 600, an alternative embodiment of circuit assembly 100, comprising eight metal strips 602 to 620 replacing metal strips 108 to 116. Circuit assembly 600 also includes 40 capacitors 106 replacing the 48 capacitors 106 of circuit assembly 100. Metal strips 602 to 610 are arranged in a first column 622, wherein adjacent metal strips in the first column 622 are spaced apart from each other in direction 132. Metal strips 612 to 620 are arranged in a second column 624, wherein adjacent metal strips in the second column 624 are spaced apart from each other in direction 132. The first column 622 and the second column 624 are spaced apart from each other in direction 148. Capacitors 106 are arranged in rows 626 to 632, wherein each row is spaced apart from each other in direction 132.

[0076] Figure 7This is a bottom plan view of circuit assembly 700, which is an alternative embodiment of circuit assembly 100. Circuit assembly 700 includes 12 metal strips 702 to 724 in place of metal strips 108 to 116. Metal strips 702 to 724 and capacitor 106 are arranged in the following four quadrants on the outer surface 104: (a) quadrant 726, including 12 instances of metal strips 702 to 706 and capacitor 106; (b) quadrant 728, including 12 instances of metal strips 708 to 712 and capacitor 106; (c) quadrant 730, including 12 instances of metal strips 714 to 718 and capacitor 106; and (d) quadrant 732, including 12 instances of metal strips 720 to 724 and capacitor 106. The slender axes of the metal strips in quadrants 726 and 732 extend along direction 148, and the slender axes of the metal strips in quadrants 728 and 730 extend along direction 132.

[0077] Figure 8 This is a bottom plan view of circuit assembly 800, which is an alternative embodiment of circuit assembly 100. Circuit assembly 800 includes 20 metal strips 802 to 840 replacing metal strips 108 to 116. Circuit assembly 800 also includes 68 capacitors 106 replacing the 48 capacitors 106 of circuit assembly 100. In circuit assembly 800, the capacitors 106 and metal strips 802 to 840 are arranged in a star pattern on the outer surface 118.

[0078] Figure 28 This is a bottom plan view of circuit assembly 2800, which is another alternative embodiment of circuit assembly 100. Circuit assembly 2800 includes: (a) 12 additional instances of capacitor 106 replacing metal strip 110 and (b) 12 additional instances of capacitor 106 replacing metal strip 114. Thus, in circuit assembly 2800, there are three rows of capacitors 106 between adjacent metal strips.

[0079] Figure 29 This is a bottom plan view of circuit assembly 2900, which is another alternative embodiment of circuit assembly 100. Circuit assembly 2900 includes 12 additional instances of capacitor 106 replacing each of the metal strips 108, 110, 114 and 116, such that there is only one metal strip (112) on the outer surface 118.

[0080] Refer again Figures 1 to 3Some or all of capacitors 106 can be replaced with other components. For example, one or more of capacitors 106 can be replaced with resistors or diodes that include corresponding first and second terminals similar to first terminal 136 and second terminal 138. As another example, one or more capacitors 106 can be replaced with transistors or other components that include three or more terminals. Furthermore, circuit assembly 100 may and typically includes, in addition to Figures 1 to 3 Components other than those shown. The following discussion... Figures 9 to 25 Some examples of embodiments of the circuit assembly 100 including additional components are shown. However, it will be understood that the circuit assembly 100 may have other configurations without departing from the scope of this document.

[0081] Figure 9 This is a bottom view of circuit component 900, and Figure 10 It is the edge of circuit component 900 Figure 9 The image shows a cross-sectional view taken along lines 10A-10A. Circuit assembly 900 is a further embodiment of circuit assembly 100 including a pressure plate 902 and an insulating layer 904. The insulating layer 904 is disposed in direction 122 between the pressure plate 902 and metal strips 108 to 116. The pressure plate 902 is disposed in direction 122 above the metal strips 108 to 116 and the capacitor 106, such that the metal strips 108 to 116, the capacitor 106, and the insulating layer 904 are disposed in direction 122 between the substrate 102 and the pressure plate 902. For example, the pressure plate 902 receives mechanical force 154, and the metal strips 108 to 116 advantageously transmit the mechanical force 154 from the pressure plate 902 to the substrate 102, thereby preventing the capacitor 106 from experiencing the mechanical force 154. The insulating layer 904 electrically isolates the metal strips 108 to 116 from the pressure plate 902. For example, the pressure plate 902 is formed of metal.

[0082] Figure 11 This is a bottom view of circuit component 1100, and Figure 12 It is the edge of circuit component 1100 Figure 11 The image shows a cross-sectional view taken along lines 12A-12A. Circuit assembly 1100 is an embodiment that further includes a molding material 1102 disposed above metal strips 108-116 and capacitor 106. In some embodiments, molding material 1102 is a dielectric material, and in some embodiments, molding material 1102 is thermally conductive. Molding material 1102 is formed, for example, from an epoxy resin material. For example, molding material 1102 receives and transmits mechanical force 154 to metal strips 108-116 and substrate 102, such that capacitor 106 is largely protected from the influence of receiving mechanical force 154.

[0083] Figure 13This is a top plan view of circuit assembly 1300, which is an embodiment of circuit assembly 100 that further includes an additional substrate 1302. Figure 14 It is the edge of circuit component 1300 Figure 13 The cross-sectional view taken from line 14A-14A, and Figure 15 This is a bottom plan view of circuit assembly 1300. Substrate 1302 includes outer surfaces 1304 and 1306 spaced apart from each other in direction 122. Substrate 102 is disposed above substrate 1302 in direction 122 such that outer surface 1306 of substrate 1302 faces outer surface 118 of substrate 102. Metal strips 108 to 116 and capacitor 106 are disposed on outer surface 1304 of substrate 1302. Substrate 1302 may optionally include one or more through-holes (not shown) and electrical conductors (not shown) for electrically coupling metal strips 108 to 116 and capacitor to substrate 102.

[0084] Figure 16 This is a bottom plan view of circuit assembly 1600, which is a further embodiment of circuit assembly 100 including additional substrates 1602 and 1604. Additionally, the circuit assembly includes metal strips 1606 to 1624 replacing metal strips 108 to 116, and 40 instances of capacitor 106 replacing 48 instances of capacitor 106. Figure 17 It is the edge of circuit component 1600 Figure 16 A cross-sectional view taken along lines 17A to 17A. Substrate 1602 includes outer surfaces 1626 and 1628 spaced apart from each other in direction 122, and substrate 1604 includes outer surfaces 1630 and 1632 spaced apart from each other in direction 122. Substrate 102 is disposed above each of substrates 1602 and 1604 in direction 122 such that (1) outer surface 1628 of substrate 1602 faces outer surface 118 of substrate 102, and (2) outer surface 1632 of substrate 1602 faces outer surface 118 of substrate 102. Twenty instances of metal strips 1606 to 1614 and capacitor 106 are disposed on outer surface 1626 of substrate 1602, and another twenty instances of metal strips 1616 to 1624 and capacitor 106 are disposed on outer surface 1630 of substrate 1602.

[0085] Figure 18 This is a top plan view of circuit assembly 1800, which is a further embodiment of circuit assembly 100 including two layers of metal strips. Figure 19 It is the edge of circuit component 1800 Figure 18 The cross-sectional view taken from line 19A-19A, and Figure 20This is a bottom plan view of circuit assembly 1800. In addition to the components of circuit assembly 100, circuit assembly 1800 includes the following components: (1) substrate 1802, (2) metal strips 1804 to 1822, and (3) 32 additional examples of capacitors 106. Substrate 1802 includes opposing outer surfaces 1824 and 1826 spaced apart from each other in direction 122. Substrate 1802 is disposed above metal strips 108 to 116, wherein outer surface 1826 faces outer surface 118 of substrate 102, such that metal strips 108 to 116 are disposed between substrates 102 and 1802 in direction 122. Metal strips 1804 to 1822 and 32 examples of capacitors 106 are disposed on outer surface 1824 of substrate 1802.

[0086] Figure 21 This is a cross-sectional view of circuit assembly 2100, an embodiment of circuit assembly 100 that includes additional components on the outer surface 118 of substrate 102. Specifically, circuit assembly 2100 includes inductors 2102 and 2104 and integrated circuits 2106 and 2108 disposed on the outer surface 118. One or more of inductors 2102 and 2104 are electrically coupled, for example, to one or more of metal strips 108 to 116. In some embodiments, inductors 2102, 2104, integrated circuits 2106 and 2108 form at least a portion of a power converter (e.g., a DC-DC converter) for supplying power to an electrical load 104.

[0087] Figure 30 This is a cross-sectional view of circuit assembly 3000, which is Figure 21 An alternative embodiment of circuit assembly 21 further includes an additional substrate 3002 disposed on the outer surface 118 of substrate 102. Substrate 3002 includes opposing outer surfaces 3004 and 3006 spaced apart from each other in direction 122. Outer surface 3004 faces the outer surface 118 of substrate 102, and outer surface 3006 is provided with capacitor 106, metal strips 108 to 116, inductors 2102 and 2104, and integrated circuits 2106 and 2108. Substrate 3002 optionally includes one or more of through-holes (not shown) and electrical conductors (not shown) for electrically coupling components thereon. In some embodiments, substrate 3002 and components mounted thereon form a power converter module mounted on the outer surface 118 of substrate. The power converter module is optionally manufactured separately from the remainder of circuit assembly 2100. In some other embodiments, one or more of inductors 2102, 2104, integrated circuit 2106, and integrated circuit 2108 are positioned on substrate 102 rather than substrate 3002, such that components on each of substrates 102 and 3002 collectively form a power converter.

[0088] Figure 22 This is a cross-sectional view of circuit assembly 2200, an embodiment of circuit assembly 100 that includes additional components on the outer surface 120 of substrate 102. Specifically, the circuit assembly includes inductors 2202 and 2204 and integrated circuits 2206 and 2208 disposed on the outer surface 120. One or more of inductors 2202 and 2204 are electrically coupled, for example, to one or more of metal strips 108 to 116. In some embodiments, inductors 2202, 2204, integrated circuits 2206 and 2208 form at least a portion of a power converter (e.g., a DC-DC converter) for supplying power to an electrical load 104.

[0089] Figure 23 This is a top plan view of circuit assembly 2300, which is similar to... Figures 1 to 3 The circuit assembly 100 further includes multiple rows of inductors and integrated circuits on the outer surface of the substrate. Figure 24 It is the edge of circuit component 2300 Figure 23 The cross-sectional view taken from line 24A-24A, and Figure 25 This is a bottom plan view of circuit assembly 2300. Circuit assembly 2300 includes a substrate 2302, an electrical load 2304, a plurality of capacitors 106, and metal strips 2308 to 2316.

[0090] Substrate 2302 is similar to Figures 1 to 3 The substrate 102 is different in size. The substrate 2302 includes an outer surface 2318 spaced apart from each other in direction 122 and an opposite outer surface 2320. The substrate 2302 is a PCB, which includes multiple metal layers 2324 spaced apart from each other in direction 122 by multiple insulating layers 2326. Figure 24 For clarity, only one metal layer 2324 and one insulating layer 2326 are labeled. The substrate 2302 further includes vias 2328 electrically connecting two or more different metal layers 2324 in direction 122. Figure 24 For clarity, only one through hole, 2328, is marked.

[0091] An electrical load 2304 is disposed on the outer surface 2320 of the substrate 2302. The electrical load 2304 is an integrated circuit connected to the substrate 2302 via solder balls 2330 (only one is labeled). The electrical load 2304 includes... Figure 23The power interface portion 2305, roughly indicated by dashed lines, is configured to receive power from a power source. For example, the power interface portion 2305 may include multiple terminals for connection to one or more power nodes and a reference node. One or more heat sinks (not shown) may optionally be attached to the electrical load 2304. An area of ​​the outer surface 2320 (referred to as the keep-out area 2307) is reserved for, for example, a heat sink.

[0092] Metal strips 2308 to 2316 are disposed on the outer surface 2318, and in some embodiments, an electrical load 2304 is disposed in direction 122 above at least a portion of one or more metal strips 2308 to 2316. The metal strips 2308 to 2316 are spaced apart from each other in direction 132. Figure 25 Capacitor 106 is also disposed on the outer surface 2318. Figure 24 and Figure 25 To clarify, in Figures 23 to 25 Each figure in the diagram labels an example of capacitor 106. Capacitors 106 are arranged in rows 2340 to 2346, wherein each row is spaced apart from each other in direction 132, and wherein each row is defined in direction 132 by a corresponding pair of metal strips 2308 to 2316. The capacitors 106 within the given rows 2340 to 2346 are spaced apart from each other in direction 148.

[0093] Circuit assembly 2300 further includes a plurality of inductors 2352 disposed in two rows of 2354 and 2356 on outer surface 2320. For clarity, Figure 23 An example of inductor 2352 is shown. Inductors 2352 in each column 2354, 2356 are separated from each other in direction 132, and columns 2354, 2356 are separated from each other in direction 148. The columns of integrated circuit 2360 define each column 2354 and 2356 of inductors 2352 in direction 148. For clarity, Figure 23 Only one integrated circuit 2360 is labeled, and each integrated circuit 2360 need not have the same configuration. In some embodiments, inductors 2352 and integrated circuits 2360 form at least a portion of a power converter (e.g., a DC-DC converter) for supplying power to an electrical load 2304. Thus, in some embodiments, inductors 2352 and / or integrated circuits 2360 are electrically coupled to at least one of metal strips 2308 to 2316, which in turn are electrically coupled to a power interface portion 2305 of integrated circuit 2304. Without departing from the scope of this document, the number of inductors 2352 in each column 2354 and 2356, the number of columns of inductors 2352, and the number of integrated circuits 2360 may be varied.

[0094] It should be noted that, due to the presence of the blocking region 2307, the inductor 2352 is separated from the electrical load 2304 by a large separation distance 2358 in the direction 148. However, the relatively low impedance of the metal strips 2308 to 2316 helps to mitigate the parasitic impedance associated with the separation distance 2358, thus helping to maintain a low power path impedance to the integrated circuit 2304 even with a large separation distance 2358.

[0095] Refer again Figure 2 and Figure 3 In circuit assembly 100, metal strips 108 to 116 are discrete components, which advantageously allows them to have a relatively large strip thickness 134, for example, greater than the capacitor thickness 150. However, without departing from the scope of this document, metal strips 108 to 116 can be replaced by a metal strip that is part of another component, such as an inductor. For example, Figure 26 This is a bottom plan view of circuit assembly 2600, which is an alternative embodiment of circuit assembly 100, wherein metal strips 108 to 116 are replaced by metal strips 2608 to 2616 as extensions of inductor windings. Figure 27 It is the edge of circuit component 2600 Figure 26 A cross-sectional view taken along lines 27A-27A. Circuit assembly 2600 includes a coupled inductor 2652, a coupled inductor 2654, and a discrete inductor 2656 disposed on the outer surface 118 of a substrate. The windings of coupled inductor 2652 extend to form metal strips 2608 and 2610, and the windings of coupled inductor 2654 extend to form metal strips 2612 and 2614. The windings of discrete inductor 2656 extend to form metal strip 2616. Metal strips 2608 to 2616 are spaced apart from each other in direction 132, and adjacent metal strips are separated in direction 132 by a row of capacitors 106.

[0096] Metal strips 2608 to 2616 have a strip thickness of 2634 in direction 122. Figure 27 Furthermore, the strip thickness of 2634 does not necessarily need to be uniform across the metal strip instances. For example... Figure 27 As shown, due to the thickness limitation of the inductor winding, the strip thickness 2634 is less than the capacitor thickness 150. Therefore, the metal strips 2608 to 2616 will not protect the capacitor 106 from the mechanical force applied in direction 122 toward the outer surface 118 of the substrate. The metal strips 2608 to 2616 are electrically coupled to the electrical load 104, for example. Figure 26 (not shown in the image), and the electrical load 104 is at least partially disposed above one or more of the metal strips 2608 to 2616 in the direction 122.

[0097] Modifications to the above methods, devices, and systems may be made without departing from the scope of the invention. Therefore, it should be noted that the subject matter contained in the above specification and illustrated in the drawings should be interpreted illustratively rather than restrictively. The following claims are intended to cover the general and specific features described herein, and all statements regarding the scope of the methods and systems may be said to fall within them.

Claims

1. A circuit component, comprising: A first substrate, the first substrate including a first outer surface; A first component is disposed on the first outer surface, the first component having a first component thickness in a first direction orthogonal to the first outer surface; A first metal strip is disposed on the first outer surface, the first metal strip having a first thickness in the first direction, wherein the first thickness is greater than the thickness of the first component so that the first metal strip is thicker than the first component; as well as A second metal strip is disposed on the first outer surface, the second metal strip being separated from the first metal strip in a second direction orthogonal to the first direction, wherein the first component is disposed between the first metal strip and the second metal strip in the second direction, the first component including a first terminal and a second terminal, the first terminal being electrically coupled to the first metal strip, and the second terminal being electrically coupled to the second metal strip; The first component is placed closely together with the first metal strip and the second metal strip in the second direction.

2. The circuit assembly as claimed in claim 1, wherein, Each of the first and second metal strips is an extension of the corresponding winding of the inductor.

3. The circuit assembly of claim 1, further comprising a pressure plate, wherein each of the first metal strip, the second metal strip, and the first component is disposed between the first substrate and the pressure plate in the first direction.

4. The circuit assembly of claim 1, further comprising a third metal strip disposed on the first outer surface, the third metal strip being separated from each of the first metal strip and the second metal strip in a second direction.

5. The circuit assembly of claim 1, wherein: The first substrate further includes a second outer surface opposite to the first outer surface in the first direction; and The circuit system assembly further includes an electrical load disposed on the second outer surface, the electrical load being electrically coupled to each of the first metal strip and the first component.

6. The circuit assembly of claim 5, wherein, The electrical load includes an integrated circuit disposed on the second outer surface, which is located above the first metal strip in the first direction.

7. The circuit assembly of claim 6, further comprising at least one row of a plurality of inductors disposed on the second outer surface, each of the plurality of inductors in each row being electrically coupled to the first metal strip.

8. The circuit assembly of claim 1, wherein, The first component is a capacitor.

9. A circuit component, comprising: A printed circuit board (PCB) includes a plurality of metal layers separated from each other by a plurality of isolation layers in a first direction, and the PCB includes a first outer surface and a second outer surface separated from each other in the first direction. Integrated circuit disposed on the second outer surface; A plurality of capacitors are disposed on the first outer surface, the plurality of capacitors are located below the integrated circuit in the first direction, each of the plurality of capacitors is electrically coupled to the integrated circuit, and each of the plurality of capacitors has a corresponding capacitor thickness in the first direction; A first metal strip is disposed on the first outer surface, the first metal strip is located below the integrated circuit in the first direction, the first metal strip is electrically coupled to the integrated circuit, and the first metal strip has a first thickness in the first direction, wherein the first thickness is greater than the thickness of each capacitor so that the first metal strip is thicker than each of the plurality of capacitors; as well as A second metal strip is disposed on the first outer surface, and the second metal strip is separated from the first metal strip in a second direction orthogonal to the first direction. At least one capacitor, one of a plurality of capacitors, is disposed between the first and second metal strips in the second direction. The at least one capacitor includes a first terminal and a second terminal, the first terminal being electrically coupled to the first metal strip, and the second terminal being electrically coupled to the second metal strip. Each of the plurality of capacitors is placed closely together with the first metal strip and the second metal strip in the second direction.

10. The circuit assembly of claim 9, further comprising a pressure plate, each of the plurality of capacitors, the first metal strip, and the second metal strip disposed between the pressure plate and the PCB in the first direction.

11. A circuit assembly, comprising: A first substrate, the first substrate including a first outer surface; A first metal strip is disposed on the first outer surface, the first metal strip having a first thickness in a first direction orthogonal to the first outer surface; A second metal strip is disposed on the first outer surface, the second metal strip being separated from the first metal strip in a second direction orthogonal to the first direction; as well as A first component is disposed between the first metal strip and the second metal strip in the first direction. The first component includes a first terminal and a second terminal. The first terminal is electrically coupled to the first metal strip, and the second terminal is electrically coupled to the second metal strip. The first component has a first component thickness in the first direction, which is less than the thickness of the first metal strip, such that the first metal strip is thicker than the first component. The first component is placed closely together with the first metal strip and the second metal strip in the second direction.

12. The circuit assembly of claim 11, wherein, The first component includes a first capacitor.

13. The circuit assembly of claim 11, wherein: The first substrate includes a second outer surface that is opposite to the first outer surface in the first direction; and The circuit system assembly further includes an electrical load disposed on the second outer surface, the electrical load being electrically coupled to at least each of the first metal strip and the first component.

14. The circuit assembly of claim 13, wherein, The electrical load includes an integrated circuit disposed on the second outer surface, which is located above the first metal strip in the first direction.

15. The circuit assembly of claim 11, wherein: The second metal strip has a second thickness in the first direction; and The thickness of the second component is greater than that of the first component.

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