Gold finger laser cutting system and cutting method

Abstract

The present invention discloses a gold finger laser cutting system, including an optical path processing device, a cutting jig device and an ion wind dust removal device. The cutting jig device includes an adsorption system and a special cutting jig. The special cutting jig includes an adsorption plane and a cutting groove recessed in the adsorption plane. The adsorption plane and the bottom of the cutting groove are evenly provided with airflow holes. When the special cutting jig carries the gold finger, the cutting part is suspended above the cutting groove. Under the action of the adsorption system, the gold finger is adsorbed on the adsorption plane through the airflow holes; the optical path processing device includes a light source module and a control processing module. The control processing module is used to control the ultrafast flat-top laser beam generated by the light source module to move along the axial direction of the cutting groove to cut the gold finger. The carbonized dust generated during the cutting process is removed by the ion wind dust removal device. The present invention not only ensures the appearance and effect of the processing, but also realizes efficient carbonization-free cutting. The present invention also discloses a gold finger laser cutting method.

Description

Technical Field

[0001] The invention relates to the technical field of gold finger processing, and in particular to a laser carbonization-free cutting system and a cutting method for gold fingers of an FPC board. Background Art

[0002] In the flexible circuit (FPC) board industry, laser processing is usually used to achieve efficient and high-quality cutting of gold fingers. However, due to the extremely short spacing of gold fingers (usually 35-100um), high density, and the easy ablation of insulating materials between fingers to form carbonized substances, laser cutting of gold fingers is prone to produce carbonization, dust and other substances, which can easily form circuit paths around the gold fingers, resulting in micro-short fingers.

[0003] In order to solve the short circuit problem caused by laser processing of gold fingers, the industry is constantly researching and improving. For example, in the laser cutting method disclosed in Chinese invention patent CN102211255A, the workpiece material is quickly vaporized and removed by blowing oxygen into the cutting part of the workpiece, and the oxides and vaporized products are taken away. However, this method will directly destroy the anti-oxidation protective layer on the gold finger surface and may produce more carbonized substances. In the laser cutting method of gold fingers on circuit boards disclosed in Chinese invention patent CN10994028A, a low peak power density laser is used to cut the inter-finger insulation layer, and a high peak power density laser is used to cut the gold fingers to achieve laser carbonization-free cutting of the gold fingers. However, this method will also destroy the anti-oxidation protective layer on the surface of the gold fingers, and will expose the gold fingers and affect the appearance. At the same time, the processing procedure of this method is complicated. Another Chinese invention patent CN102179632A discloses a method for cutting gold fingers of flexible circuit boards with ultraviolet laser. The PI film surface is cut by ultraviolet laser with high repetition rate and low energy density, and the gold finger surface is cut by ultraviolet laser with low repetition rate and high energy density, so as to achieve laser carbonization-free cutting of gold fingers. However, this method requires secondary processing of the surface and high-precision repeated positioning, which also leads to complicated processing procedures and low processing efficiency.

[0004] Therefore, it is necessary to provide a laser carbonization-free cutting system and cutting method with high processing efficiency and guaranteed processing appearance and effect to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a gold finger laser cutting system which has high processing efficiency, can ensure the processing appearance and effect, and realizes carbonization-free cutting.

[0006] Another object of the present invention is to provide a gold finger laser cutting method which has high processing efficiency, can ensure the processing appearance and effect, and realizes carbonization-free cutting.

[0007] To achieve the above-mentioned purpose, the technical solution of the present invention is as follows: a gold finger laser cutting system is provided, which includes an optical path processing device, a cutting jig device and an ion wind dust removal device; wherein the cutting jig device includes a special cutting jig and an adsorption system, the special cutting jig includes an adsorption plane and a cutting groove recessed in the adsorption plane, the adsorption plane and the bottom of the cutting groove are evenly provided with air flow holes, the special cutting jig is used to carry the gold finger, and the cutting part of the gold finger is suspended above the cutting groove, and at the same time, under the action of the adsorption system, the gold finger is adsorbed on the adsorption plane through the air flow holes; the optical path processing device includes a light source module and A control processing module, wherein the light source module is used to generate an ultrafast flat-top laser beam with an extremely short pulse width, an appropriate spot diameter, and a uniform distribution of spot energy. The control processing module is used to control the energy of the ultrafast flat-top laser beam and move the ultrafast flat-top laser beam along the axial direction of the cutting groove to cut the gold finger; an ion wind dust removal device is arranged above the cutting fixture device and includes a special dust removal cover and an ion wind system, wherein the special dust removal cover has a blowing hole, and the blowing hole is connected to the ion wind system, and the ion wind system is used to generate the ion wind required for dust removal, and the special dust removal cover removes the carbonized dust generated during the cutting process under the action of the ion wind system.

[0008] Preferably, the light source module includes an ultrafast laser, a variable power beam expander and a beam shaper, the ultrafast laser is used to emit an ultrafast laser beam with an extremely short pulse width, the variable power beam expander is arranged at the output end of the ultrafast laser, and is used to amplify the spot diameter of the ultrafast laser beam emitted by the ultrafast laser, and the beam shaper is arranged at the output end of the variable power beam expander, and is used to shape the ultrafast laser beam emitted after the spot diameter is amplified by the variable power beam expander to obtain the ultrafast flat-top laser beam.

[0009] Preferably, the ultrafast laser has a wavelength range from green light to ultraviolet light, a pulse width from picoseconds to femtoseconds, and the variable-magnification beam expander has a magnification of 2 to 10 times.

[0010] Preferably, the control processing module includes a laser control system and a high-speed scanning galvanometer. The high-speed scanning galvanometer is arranged at the output end of the light source module, and is used to control the ultrafast flat-top laser beam to scan and cut the gold finger along the axial direction of the cutting groove. The laser control system is used to control the output energy of the ultrafast flat-top laser beam.

[0011] Preferably, the optical path processing device also includes a plurality of reflectors and a telecentric field mirror. The reflector is arranged between the output end of the light source module and the input end of the high-speed scanning galvanometer, and is used to change the transmission path of the light beam. The telecentric field mirror is arranged at the output end of the high-speed scanning galvanometer, and is used to focus the ultrafast flat-top laser beam emitted by the high-speed scanning galvanometer and make the laser focus located on the same focal plane.

[0012] Preferably, the dedicated dust removal cover also has an air suction hole arranged relative to the air blowing hole, the air suction hole is connected to the adsorption system, and the adsorption system and the ion wind system work together to form an ion wind airflow, thereby removing the carbonized dust generated on the sample surface during the processing.

[0013] Preferably, the dedicated dust removal hood also includes a blowing hood and an suction hood which are arranged relatively to each other, a dust removal groove is formed between the blowing hood and the suction hood, a plurality of blowing holes are evenly opened on the blowing hood, and a plurality of suction holes are evenly opened on the suction hood, the ion wind generated by the ion wind system is blown from the blowing holes into the dust removal groove, thereby converting the carbonized dust in the dust removal groove into ion dust, and the adsorption system generates adsorption force on the suction holes, thereby sucking the ion dust in the dust removal groove away from the suction holes.

[0014] Preferably, the high-speed scanning galvanometer is used to control the ultrafast flat-top laser beam to perform single-line cutting or multi-line cutting on the gold finger, and during multi-line cutting, each cutting line is located in the cutting groove.

[0015] Correspondingly, the present invention also provides a gold finger laser cutting method using the gold finger laser cutting system as described above, which comprises the following steps:

[0016] (1) operating a light source module of an optical path processing device to generate an ultrafast flat-top laser beam;

[0017] (2) Place the gold finger on a special cutting jig with the gold finger facing upward, and make the cutting part of the gold finger hang above the cutting groove, so that the cutting direction of the gold finger is consistent with the axial direction of the cutting groove;

[0018] (3) operating the adsorption system to provide adsorption force, thereby adsorbing the gold finger onto the adsorption plane of the cutting jig through the air flow holes;

[0019] (4) operating the control processing module of the optical path processing device to control the ultrafast flat-top laser beam to move along the axial direction of the cutting groove to cut the gold finger;

[0020] (5) The ion wind system of the ion wind dust removal device is operated, and the ion wind generated by the ion wind system is blown into the dedicated dust removal cover from the blowing hole, so that the carbonized dust generated during the cutting process is transformed into ion dust, and the ion dust is removed by the dedicated dust removal cover.

[0021] Preferably, in the gold finger laser cutting method of the present invention, the step (1) specifically includes the following steps:

[0022] (11) adjusting the ultrafast laser to emit an ultrafast laser beam;

[0023] (12) adjusting a variable-power beam expander to enlarge the spot diameter of the ultrafast laser beam emitted by the ultrafast laser;

[0024] (13) The ultrafast laser beam emitted after the spot diameter is enlarged by the variable-power beam expander is shaped by a beam shaper to obtain the ultrafast flat-top laser beam.

[0025] Preferably, in the gold finger laser cutting method of the present invention, the step (4) is single-line cutting or multi-line cutting, and in the case of multi-line cutting, each cutting line is located in the cutting groove.

[0026] Preferably, in the gold finger laser cutting method of the present invention, the step (5) further includes the following steps:

[0027] (6) The adsorption system generates an adsorption force on the air intake hole of the special dust removal cover, and the adsorption system and the ion wind system work together to form an ion wind airflow, thereby sucking the ion dust away from the air intake hole.

[0028] Compared with the prior art, the gold finger laser cutting system of the present invention has the following advantages: firstly, the special cutting jig of the cutting jig device includes an adsorption plane and a cutting groove recessed in the adsorption plane, and the bottoms of the adsorption plane and the cutting groove are evenly provided with air flow holes, the special cutting jig is used to carry the gold finger and make the cutting part hang above the cutting groove, and the gold finger is adsorbed on the adsorption plane through the air flow holes under the action of the adsorption system; secondly, the optical path processing device is used to generate an ultrafast laser beam with an extremely short pulse width, and after adjustment, an ultrafast flat-top laser beam with a suitable spot diameter and uniform spot energy distribution is obtained, and the control The ultrafast flat-top laser beam moves along the axial direction of the cutting groove to cut the gold finger. During the cutting process, the gold finger can be stably adsorbed on the special cutting tool without shaking due to the adsorption of strong airflow, thereby ensuring the consistency of the cutting effect. At the same time, the cutting part of the gold finger is suspended above the cutting groove and is not contaminated by the cutting dust on the special cutting tool; furthermore, the ion wind dust removal device can timely and effectively remove a large amount of carbonized dust generated during the processing, reduce the carbonization pollution of the carbonized dust to the product, and greatly reduce the situation of short fingers; in addition, the optical path processing device of the present invention can ensure the efficiency of cutting.

[0029] Correspondingly, the gold finger laser cutting method using the gold finger laser cutting system of the present invention also has the same technical effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a structural schematic diagram of the gold finger laser cutting system of the present invention.

[0031] Figure 2 It is a structural schematic diagram of the special cutting tool in the present invention.

[0032] Figure 3 It is a structural schematic diagram of the special dust removal cover in the present invention.

[0033] Figure 4 It is a schematic diagram of the cutting state of the gold finger in the present invention. DETAILED DESCRIPTION

[0034] Embodiments of the present invention will now be described with reference to the accompanying drawings, wherein like reference numerals represent like elements throughout the several views.

[0035] Let's combine Figure 1-Figure 4As shown, the gold finger laser cutting system 1 of the present invention includes an optical path processing device 100, a cutting fixture device and an ion wind dust removal device. Among them, the cutting fixture device includes a special cutting fixture 200 and an adsorption system (not shown in the figure). The special cutting fixture 200 is used to carry the gold finger 400, and the cutting part 400a of the gold finger 400 is suspended on the cutting groove 220. At the same time, under the action of the adsorption system, the gold finger 400 is adsorbed on the special cutting fixture 200 through the air flow hole 230, and the airflow size of the adsorption system can be adjusted. The ion wind dust removal device is arranged above the cutting fixture device, and the ion wind dust removal device includes a special dust removal cover 300 and an ion wind system (not shown in the figure), wherein the special dust removal cover 300 is compactly arranged above the special cutting fixture 200, and the specific position of the special dust removal cover 300 can be adjusted. The ion wind system is used to generate the ion wind required for dust removal, and the airflow size of the ion wind system can be adjusted according to the processing effect. The optical path processing device 100 includes a light source module 110 and a control processing module 130. The light source module 110 is used to generate an ultrafast laser beam with an extremely short pulse width, and adjust the ultrafast laser beam to obtain an ultrafast flat-top laser beam with an appropriate spot diameter and uniform spot energy distribution. The control processing module 130 is used to control the energy of the ultrafast flat-top laser beam and use it to cut the gold finger 400. During the cutting process, an ion wind dust removal device is used to absorb the carbonized dust generated during the cutting process to reduce the carbonization pollution of the gold finger 400.

[0036] It should be noted that the adsorption system and the ion wind system involved in the present invention are conventional settings in the field, so the structures and specific working principles of the two are not described in detail.

[0037] The following is combined with Figure 1-4 As shown, the specific structures of the optical path processing device 100, the special cutting jig 200, and the special dust removal cover 300 in the present invention are mainly described.

[0038] Combine first Figure 1-2 , Figure 4As shown, in a specific embodiment of the present invention, a special cutting jig 200 includes an adsorption plane 210 and a cutting groove 220 recessed in the adsorption plane 210, and the bottoms of the adsorption plane 210 and the cutting groove 220 are provided with air circulation holes 230. Under the action of the adsorption system, the gold finger 400 can be adsorbed on the adsorption plane 210 of the special cutting jig 200 through the air circulation holes 230. At the same time, the cutting part 400a of the gold finger 400 is suspended above the cutting groove 220. Specifically, the cutting direction of the gold finger 400 is consistent with the axial direction of the cutting groove 220, so that the cutting part 400a of the gold finger 400 is suspended above the cutting groove 220, and the optical path processing device 100 cuts the gold finger 400 along the axial direction of the cutting groove 220. In this embodiment, by setting the cutting groove 220 and the air flow hole 230, the cutting part 400a of the gold finger 400 can be ensured not to be contaminated by the cutting dust on the special cutting jig 200, but also to avoid the influence of shaking caused by the adsorption of strong airflow, thereby ensuring cleanliness and stability, thereby ensuring the consistency of the cutting effect.

[0039] More specifically, since FPC sheets are usually thin and highly flexible, the cutting jig 200 of the present invention has a plurality of air flow holes 230 evenly disposed on its adsorption plane 210. At the same time, a plurality of air flow holes 230 are also evenly disposed on the bottom of the cutting groove 220. When the cutting jig 200 adsorbs the gold finger 400 through the air flow holes 230 under the action of the adsorption system, the gold finger 400 can be ensured to remain stable during the cutting process and will not be affected by the strong airflow and shake.

[0040] Recombination Figure 2 , Figure 4 As shown, in the present invention, the length of the cutting groove 220 of the special cutting tool 200 is h1, and the width of the cutting groove 220 is d. Figure 2 In addition, the depth of the cutting groove 220 should generally be no less than 2 mm, and the specific depth can be flexibly set according to needs and is not limited here. Figure 4 As shown, the cutting length of the gold finger 400 in the cutting direction is h2, and the length h1 of the cutting groove 220 of the special cutting jig 200 needs to be greater than or equal to the cutting length h2 of the gold finger 400. In this specific embodiment, the length h1 of the cutting groove 220 is preferably equal to the cutting length h2 of the gold finger 400. At the same time, the width d of the cutting groove 220 needs to ensure that all cutting lines of the gold finger 400 are within the cutting groove 220, that is, the width d of the cutting groove 220 needs to be greater than the width of the cutting part 400a of the gold finger 400. Therefore, when the gold finger 400 is cut in multiple lines, all cutting lines of the gold finger 400 are guaranteed to be located in the cutting groove 220.

[0041] Specific reference Figure 4 As shown, in single-line cutting, cutting can be performed along the cutting line P1; when multi-line cutting is performed, the gold finger 400 is first cut along the cutting line P2 to obtain a finished product area 400b and a waste area 400c, and then the finished product area 400b is retracted a certain distance to perform a laser cleaning process, but the cutting lines of the gold finger 400 are cut twice at its cutting portion 400a and the corresponding cutting groove 220.

[0042] See below Figure 1 As shown, a specific setting method of the optical path processing device 100 of the present invention is described. In this specific method, the light source module 110 includes an ultrafast laser 111, a variable-power beam expander 112, and a beam shaper 113. Among them, the ultrafast laser 111 is used to emit an ultrafast laser beam with an extremely short pulse width; the variable-power beam expander 112 is arranged at the output end of the ultrafast laser 111, and is used to flexibly amplify the spot diameter of the ultrafast laser beam emitted by the ultrafast laser 111 according to actual needs; the beam shaper 113 is arranged between the output end of the variable-power beam expander 112 and the input end of the high-speed scanning galvanometer 132, and is used to shape the ultrafast laser beam emitted after the spot diameter is enlarged by the variable-power beam expander 112 into an ultrafast flat-top laser beam with uniform spot energy distribution, and emit the ultrafast flat-top laser beam to the control processing module 130.

[0043] Continue to view Figure 1 As shown, the wavelength band of the ultrafast laser 111 in the present invention is from green light to ultraviolet light, wherein the green light band is preferably 532nm, the ultraviolet light band is preferably 355nm, and the pulse width is from picoseconds to femtoseconds. Therefore, it can provide a pulsed laser with short pulse width and high peak power, providing the necessary technical basis for laser cold processing.

[0044] More specifically, the ultrafast laser beam output by the ultrafast laser 111 is a Gaussian beam with a Gaussian distribution of spot energy. Since the irradiation cross section of the Gaussian beam decreases symmetrically with the increase of the distance from the center, that is, the irradiation intensity of the Gaussian beam is strong in the center area and weak in the edge area, this optical power distribution characteristic of the Gaussian beam may cause excess processing energy in the center area and too low processing energy in the edge area when performing precision laser processing on the material, thereby reducing the precision processing effect of the material and the energy utilization efficiency. In contrast, the flat-top beam can maintain a constant irradiance value throughout the irradiation cross section, which enables the energy of the flat-top beam to be more clearly contained in a given area, so that higher processing accuracy can be obtained and damage to the surrounding area can be reduced. Therefore, in the present invention, a beam shaper 113 is provided at the output end of the variable magnification beam expander 112 to shape the Gaussian beam (i.e., the aforementioned ultrafast laser beam) emitted by the ultrafast laser 111, as described later.

[0045] Continue to view Figure 1As shown, in the present invention, the variable magnification beam expander 112 is used to amplify the spot diameter of the ultrafast laser beam emitted by the ultrafast laser 111, and preferably can achieve a magnification change of 2 to 10, and the specific magnification can be flexibly adjusted according to actual needs. More specifically, since a smaller focused spot can improve the energy density of the spot on the one hand, and obtain a fine cutting path on the other hand, and reduce the processing heating area, therefore, in a specific embodiment of the present invention, after the variable magnification beam expander 112 appropriately amplifies the spot diameter of the ultrafast laser beam emitted by the ultrafast laser 111, it can be focused under the telecentric field mirror 140 (see below for details) to obtain a focused spot with a diameter of 20um, ensuring the effect of laser cold processing. Of course, the magnification of the variable magnification beam expander 112 and the diameter of the focused spot finally obtained are not limited to those in this specific embodiment, and can be flexibly selected according to needs.

[0046] See again Figure 1 As shown, in the present invention, a beam shaper 113 is provided at the output end of the variable power beam expander 112, and the ultrafast laser beam after the spot diameter is enlarged by the variable power beam expander 112 is shaped by the beam shaper 113 to obtain an ultrafast flat-top laser beam with uniform spot energy distribution, thereby effectively utilizing the processing energy and optimizing the processing effect.

[0047] See again below Figure 1 As shown, the control processing module 130 includes a laser control system 131 and a high-speed scanning galvanometer 132, wherein the high-speed scanning galvanometer 132 is arranged at the output end of the beam shaper 113, and the high-speed scanning galvanometer 132 controls the ultrafast flat-top laser beam generated and adjusted by the light source module 110 to perform high-speed cutting on the gold finger 400 at a higher scanning speed, thereby improving the cutting efficiency and the cutting quality. During the cutting process, the output energy of the ultrafast flat-top laser beam is controlled by the laser control system 131.

[0048] Continue to view Figure 1 As shown, the optical path processing device 100 also includes a plurality of reflectors 120 and a telecentric field mirror 140. The reflector 120 is disposed between the output end of the beam shaper 113 and the input end of the high-speed scanning galvanometer 132, and is used to change the transmission path of the light beam. The number of reflectors 120 is not specifically limited here, and can be set according to the needs of the specific light beam transmission path. The telecentric field mirror 140 is disposed at the output end of the high-speed scanning galvanometer 132, and the telecentric field mirror 140 is used to focus the ultrafast flat-top laser beam transmitted from the high-speed scanning galvanometer 132 on the special cutting jig 200, and make the laser focus in its processing range located on the same focal plane, and the main light of the focused beam is perpendicular to the same focal plane under any field of view angle.

[0049] See below Figure 3As shown, in the present invention, the dedicated dust removal hood 300 includes a blowing hood 310 and an air suction hood 320 that are arranged opposite to each other, a plurality of blowing holes 311 are evenly opened on the blowing hood 310, and a plurality of air suction holes 321 are evenly opened on the air suction hood 320, and a dust removal groove 330 is formed between the blowing hood 310 and the air suction hood 320. In addition, the blowing hood 310 is connected to the ion wind system, and the air suction hood 320 is connected to the adsorption system, and the ion wind system can work together with the adsorption system to form an ion wind airflow, such as Figure 3 As shown in the direction of the arrow, the carbonized dust generated on the sample surface during the processing is removed. In the present invention, the suction hood 320 and the above-mentioned special cutting tool 200 share an adsorption system, which can simplify the equipment, but is not limited to this.

[0050] More specifically, the ion wind system blows the ion wind it generates into the dust removal tank 330 through the blowing holes 311 on the blowing hood 310, so that the carbonized dust in the dust removal tank 330 is transformed into ion dust; at the same time, the adsorption system absorbs the ion dust in the dust removal tank 330 through the suction holes 321 on the suction hood 320. Therefore, the ion wind system and the adsorption system operate together to form an ion wind flow, thereby removing the carbonized dust generated on the surface of the sample during the processing. In this way, when the gold finger 400 is cut, the ion wind blown by the ion wind system is blown into the cutting processing area under the dust removal tank 330 through the blowing holes 311, and the carbonized dust of the cut sample product is transformed into ion dust. At the same time, the adsorption system absorbs the ion dust formed in the cutting processing area under the dust removal tank 330 through the suction holes 321. Figure 3 As shown in the direction of the arrow, a large amount of carbonized dust generated during the processing can be removed timely and effectively, reducing the thermal impact of the laser on the product.

[0051] Combine again below Figure 1-4 As shown, the working principle and process of the gold finger laser cutting system 1 of the present invention are explained.

[0052] First, the power of the ultrafast laser beam emitted by the ultrafast laser 111 is adjusted to obtain suitable processing energy. Specifically, when the processing energy is too high, more carbon powder particles and vaporized particles will be generated, thereby greatly increasing the risk of micro-short, and when the processing energy is too low, the number of cutting times will increase, resulting in the accumulation of carbon powder particles and vaporized particles. Therefore, the power of the ultrafast laser beam emitted by the ultrafast laser 111 is adjusted to obtain suitable processing energy to perform laser cutting on the gold finger 400.

[0053] Secondly, the beam is expanded. Specifically, the spot diameter of the ultrafast laser beam emitted by the ultrafast laser 111 is enlarged by the variable magnification beam expander 112, and the specific magnification is adjusted according to the size of the focused spot under the telecentric field lens 140. In a specific embodiment of the present invention, according to the processing effect, the final adjusted magnification can obtain a focused spot with a diameter of about 20um.

[0054] Next, beam shaping is performed. Specifically, since the ultrafast laser beam emitted by the ultrafast laser 111 is a Gaussian beam with Gaussian energy distribution, in order to effectively utilize the processing energy and optimize the processing effect, a beam shaper 113 is set after the variable power beam expander 112 to perform flat-top beam profile shaping, thereby obtaining a flat-top laser beam with uniform spot energy distribution. After being reflected by several reflectors 140, the flat-top laser beam enters the high-speed scanning galvanometer 132, and is emitted from the high-speed scanning galvanometer 132 to the telecentric field mirror 140 and focused on the special cutting jig 200 to wait for cutting the gold finger 400.

[0055] Then, the gold finger 400 is placed on the special cutting jig 200 with the gold finger facing upward. Specifically, the gold finger 400 with the gold finger facing upward is placed on the adsorption plane 210 of the special cutting jig 200, and the cutting part 400a of the gold finger 400 is suspended above the cutting groove 220. Then, under the action of the adsorption system, the gold finger 400 is stably adsorbed on the adsorption plane 210 through the air flow hole 230.

[0056] Finally, the high-speed scanning galvanometer 132 is activated to cut the gold finger 400. Figure 4 As shown, the cutting method can be single-line cutting or multi-line cutting; wherein, single-line cutting is a process of directly cutting along the cutting line P1; multi-line cutting is a process of first cutting the gold finger 400 along the cutting line P2 at the cutting part 400a to obtain the finished product area 400b and the waste area 400c, and then shrinking a certain distance into the finished product area 400b for laser cleaning. In this cutting process, by increasing the scanning processing speed of the high-speed scanning galvanometer 132 and selecting the focus processing, heat accumulation can be reduced to better exert the characteristics of ultrafast laser cold processing.

[0057] In addition, a large amount of carbonized dust will be generated during the above-mentioned cutting process. If the carbonized dust is not removed in time, the risk of micro-shorting will be greatly increased and even directly cause the micro-shorting of the gold finger 400. In the present invention, the ion wind dust removal device is turned on during the laser cutting process. The ion wind system blows ion wind into the dust removal tank 330 through the blowing holes 311 on the blowing hood 310, so that the carbonized dust generated in the cutting process forms ion dust. At the same time, the adsorption system uses the suction holes 321 on the suction hood 320 to clean up the ion dust formed in the cutting processing area under the dust removal tank 330, thereby effectively reducing the micro-shorting effect of the carbonized dust on the product.

[0058] Combine again below Figure 1-4 As shown, the present invention also provides a gold finger laser cutting method, which uses the gold finger laser cutting system 1 as described above, and the method specifically includes the following steps:

[0059] (1) operating the light source module 110 of the optical path processing device 100 to generate an ultrafast flat-top laser beam;

[0060] Specific reference Figure 1 As shown, during the laser processing, if the processing energy is too high, more carbon powder particles and vaporized particles will be generated, thereby greatly increasing the risk of micro-short. If the processing energy is too low, the number of cutting times will increase, resulting in the accumulation of carbon powder particles and vaporized particles. Therefore, in the cutting method of the present invention, firstly, through the operation of the light source module 110, the power adjustment, beam expansion, and beam shaping of the ultrafast laser beam generated by it are sequentially realized, thereby obtaining an ultrafast flat-top laser beam with extremely short pulse width, appropriate spot diameter, and uniform spot energy distribution.

[0061] (2) placing the gold finger 400 on the cutting jig 200 with the gold finger facing upward, and making the cutting portion 400a of the gold finger 400 hang above the cutting groove 220, while making the cutting direction of the gold finger 400 consistent with the axial direction of the cutting groove 220;

[0062] Specific reference Figure 4As shown, the gold finger 400 has a substrate 410 formed of an insulating material and a plurality of conductive contacts 420 formed thereon. During the laser processing of the gold finger 400, since the laser processing threshold of copper is much higher than the laser processing threshold of insulating materials such as polyimide (PI), polyethylene (PE), and glue, the insulating material is usually excessively ablated by the laser to form a carbonized substance, and the conductive contacts 420 of the gold finger 400 of the FPC board have a short spacing and a high density. In order to prevent the vaporized particles generated during the laser processing of the gold finger 400 from adhering to the periphery of the gold finger 400, the present invention performs laser processing on the gold finger 400 from the gold finger surface. Therefore, in the method of the present invention, the gold finger 400 is placed on the adsorption plane 210 of the cutting jig 200 with the gold finger surface facing upward. At the same time, in order to prevent the gold finger 400 from being damaged by the cutting jig 200 for the second time, the cutting portion 400a of the gold finger 400 is located directly above the cutting groove 220, that is, the cutting portion 400a of the gold finger 400 is suspended.

[0063] Furthermore, the cutting length of the gold finger 400 in the cutting direction is h2, and the cutting length h2 of the gold finger 400 is less than or equal to the length h1 of the cutting groove 220 of the special cutting jig 200; and the width of the cutting portion 400a of the gold finger 400 is less than the width d of the cutting groove 220, see Figure 2 , Figure 4 Therefore, it can be ensured that all cutting lines of the gold finger 400 are located in the cutting groove 220 .

[0064] (3) operating the adsorption system to provide adsorption force, so as to adsorb the gold finger 400 onto the adsorption plane 210 through the air flow holes 230 on the cutting jig 200;

[0065] See also Figure 4 As shown, since the FPC board is usually thin and flexible, the present invention evenly opens a plurality of air flow holes 230 on the adsorption plane 210 of the special cutting jig 200 and the bottom of the cutting groove 220. By cooperating with the adsorption system and the special cutting jig 200, the adsorption force provided by the adsorption system is used to adsorb the gold finger 400 of the FPC board to the adsorption plane 210, which can ensure that the gold finger 400 remains stable during the cutting process and will not be affected by the strong adsorption airflow and shake.

[0066] (4) operating the control processing module 130 of the optical path processing device 100 to control the ultrafast flat-top laser beam to move along the axial direction of the cutting groove 220 to cut the gold finger 400;

[0067] Specific combination Figure 1 , Figure 4As shown, first, the high-speed scanning galvanometer 132 of the control processing module 130 is operated. The high-speed scanning galvanometer 132 receives the aforementioned ultrafast flat-top laser beam and then emits it to the telecentric field mirror 140 and focuses it on the special cutting jig 200 to cut the gold finger 400.

[0068] Continue to view Figure 4 As shown, in the cutting method of the present invention, the cutting in this step can be single-line cutting or multi-line cutting, and in the case of multi-line cutting, each cutting line is located in the cutting groove 220. More specifically, single-line cutting is a process of directly cutting along the cutting line P1, that is, a process of directly cutting along the cutting line P1 in the cutting part 400a; multi-line cutting is a process of first cutting the gold finger 400 along the cutting line P2 at the cutting part 400a to obtain the finished product area 400b and the waste area 400c, and then shrinking a certain distance into the finished product area 400b for laser cleaning.

[0069] In the above-mentioned cutting process, by increasing the high-speed scanning galvanometer 132 to perform high-speed cutting on the gold finger 400 at a higher scanning speed, the cutting efficiency and cutting quality can be improved. At the same time, selecting the focus processing can reduce heat accumulation to better exert the characteristics of ultrafast laser cold processing; and, the output energy of the ultrafast flat-top laser beam is controlled by the laser control system 131.

[0070] (5) The ion wind system of the ion wind dust removal device is operated. The ion wind generated by the ion wind system is blown into the dedicated dust removal cover 300 through the blowing hole 311, so that the carbonized dust generated during the cutting process is transformed into ion dust. The dedicated dust removal cover 300 is used to remove the ion dust.

[0071] Specific combination Figure 1 , Figure 3 As shown, since a large amount of dust is generated during the laser cutting process of the above step (4), if the dust is not removed in time, the risk of micro-shorting will be greatly increased and even directly cause the micro-shorting of the gold finger 400. Therefore, in the laser cutting method of the present invention, the ion wind system blows ion wind into the special dust removal cover 300. In a specific embodiment, the ion wind system blows ion wind into the dust removal groove 330 through the blowing holes 311 on the blowing cover 310 of the special dust removal cover 300, so that the carbonized dust generated during the cutting process forms ion dust, and the ion dust generated during the cutting process is removed by the special dust removal cover 300.

[0072] In order to better remove carbonized dust, in a more preferred embodiment of the gold finger laser cutting method of the present invention, the following steps are further included after the above step (5):

[0073] (6) The adsorption system generates an adsorption force on the air intake hole 321 of the dedicated dust removal cover 300 , and the adsorption system and the ion wind system work together to form an ion wind airflow, thereby sucking the ion dust away from the air intake hole 321 .

[0074] Continue to view Figure 3 As shown, since the special dust removal hood 300 of the present invention is also provided with an air suction hood 320, the air suction hood 320 is arranged opposite to and spaced from the air blowing hood 310, and a plurality of air suction holes 321 are evenly opened on the air suction hood 320, and the air blowing hood 310 is connected to the ion wind system, and the air suction hood 320 is connected to the adsorption system, the ion wind system can work together with the adsorption system to form an ion wind airflow. Therefore, in the cutting method of the present invention, while blowing air in the dust removal slot 330 of the ion wind system, the adsorption system is operated to generate adsorption force on the air suction holes 321, so that the adsorption system and the ion wind system are operated simultaneously to form an ion wind airflow flowing from the air blowing hood 310 to the air suction hood 320, as shown in FIG. Figure 3 As shown in the direction of the middle arrow, the ion dust in the dust removal groove 330 is sucked away from the suction hole 321, ensuring that the dust removal suction force is large enough to timely and effectively remove a large amount of carbonized dust generated during the processing process, reduce the carbonization pollution effect of carbonized dust on the product, and effectively reduce the occurrence of micro-shorts.

[0075] See again Figure 1 As shown, in the gold finger laser cutting method of the present invention, the step (1) specifically includes the following steps:

[0076] (11) adjusting the power of the ultrafast laser 111 so that it emits an ultrafast laser beam;

[0077] Specifically, since too high processing energy will produce more carbon powder particles and vaporized particles, thereby greatly increasing the risk of micro-short, and too low processing energy will lead to an increase in the number of cutting times, thereby causing the accumulation of carbon powder particles and vaporized particles. Therefore, the power of the ultrafast laser 111 is adjusted to obtain appropriate energy to perform laser cutting on the gold finger 400. After the adjustment is completed, the ultrafast laser 111 emits an ultrafast laser beam with an ultrashort pulse spot energy showing a Gaussian distribution.

[0078] (12) adjusting the variable magnification beam expander 112 to enlarge the spot diameter of the ultrafast laser beam emitted by the ultrafast laser 111;

[0079] Specifically, the spot diameter of the ultrafast laser beam emitted by the ultrafast laser 111 is amplified by the variable magnification beam expander 112, and the specific magnification is adjusted according to the size of the focused spot under the telecentric field mirror 140. In a specific embodiment of the present invention, according to the processing effect, the final adjusted magnification can obtain a focused spot with a diameter of approximately 20um.

[0080] (13) The ultrafast laser beam emitted after the spot diameter is enlarged by the variable-power beam expander 112 is shaped by the beam shaper 113 to obtain the ultrafast flat-top laser beam.

[0081] Specifically, since the ultrafast laser beam emitted by the ultrafast laser 111 is a Gaussian beam with Gaussian energy distribution, in order to effectively utilize the processing energy and optimize the processing effect, a beam shaper 113 is arranged after the variable power beam expander 112 to perform flat-top beam profile shaping, thereby obtaining an ultrafast flat-top laser beam with uniform spot energy distribution.

[0082] In summary, the gold finger laser cutting system 1 of the present invention, firstly, its special cutting jig 200 includes an adsorption plane 210 and a cutting groove 220 recessed in the adsorption plane 210, and the bottoms of the adsorption plane 210 and the cutting groove 220 are evenly provided with air flow holes 230, the special cutting jig 200 is used to carry the gold finger 400 and make its cutting part 400a suspended above the cutting groove 220, and then the gold finger 400 is adsorbed on the adsorption plane 210 through the air flow holes 230 under the action of the adsorption system; secondly, the optical path processing device 100 is used to generate an ultrafast flat-top laser beam with extremely short pulse width, suitable spot diameter and uniform spot energy distribution, and control The flat-top laser beam moves along the axial direction of the cutting groove 220 to cut the gold finger 400. During the cutting process, the gold finger 400 can be stably adsorbed on the special cutting jig 200 without shaking due to the adsorption of strong airflow, thereby ensuring the consistency of the cutting effect. At the same time, the cutting part 400a of the gold finger 400 is suspended above the cutting groove 220 and is not contaminated by the cutting dust on the special cutting jig 200; furthermore, the ion wind dust removal device can timely and effectively remove a large amount of carbonized dust generated during the processing, making it difficult to produce carbonization during the cutting process, greatly reducing the situation of short fingers; in addition, the optical path processing device 100 of the present invention can ensure cutting efficiency.

[0083] Correspondingly, the gold finger laser cutting method using the gold finger laser cutting system 1 of the present invention also has the same technical effect.

[0084] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.

Claims

1. A gold finger laser cutting system, characterized in that: include: A cutting jig device, comprising a special cutting jig and an adsorption system, wherein the special cutting jig comprises an adsorption plane and a cutting groove recessed in the adsorption plane, and the adsorption plane and the bottom of the cutting groove are evenly provided with air flow holes, the special cutting jig is used to carry the gold finger and make the cutting part hang above the cutting groove, and the gold finger is adsorbed to the adsorption plane through the air flow holes under the action of the adsorption system; An optical path processing device, comprising a light source module and a control processing module, wherein the light source module is used to generate an ultrafast flat-top laser beam, and the control processing module is used to control the energy of the ultrafast flat-top laser beam and move the ultrafast flat-top laser beam along the axial direction of the cutting groove to cut the gold finger; An ion wind dust removal device, which is arranged above the cutting jig device and includes a special dust removal cover and an ion wind system, wherein the special dust removal cover has an air blowing hole and an air suction hole arranged relative to the air blowing hole, the air blowing hole is connected to the ion wind system, the air suction hole is connected to the adsorption system, and the adsorption system and the ion wind system work together to form an ion wind airflow; The dedicated dust removal hood also includes a blowing hood and an air suction hood which are arranged opposite to each other, a dust removal groove is formed between the blowing hood and the air suction hood, a plurality of blowing holes are evenly opened on the blowing hood, and a plurality of air suction holes are evenly opened on the air suction hood, the ion wind generated by the ion wind system is blown into the dust removal groove from the blowing holes, so that the carbonized dust in the dust removal groove is formed into ion dust, and the adsorption system generates adsorption force on the air suction holes, so that the ion dust in the dust removal groove is sucked away from the air suction holes, so that the carbonized dust generated on the surface of the sample during the processing is cleaned up; The light source module includes an ultrafast laser, a variable-power beam expander and a beam shaper. The ultrafast laser is used to emit an ultrafast laser beam. The wavelength of the ultrafast laser is from green light to ultraviolet light, and the pulse width is from picoseconds to femtoseconds. The variable-power beam expander is arranged at the output end of the ultrafast laser, and is used to amplify the spot diameter of the ultrafast laser beam emitted by the ultrafast laser. The magnification of the variable-power beam expander is 2 to 10 times. The beam shaper is arranged at the output end of the variable-power beam expander, and is used to shape the ultrafast laser beam emitted after the spot diameter is amplified by the variable-power beam expander to obtain the ultrafast flat-top laser beam.

2. The gold finger laser cutting system according to claim 1, characterized in that: The control processing module includes a laser control system and a high-speed scanning galvanometer. The high-speed scanning galvanometer is arranged at the output end of the light source module, and is used to control the ultrafast flat-top laser beam to scan and cut the gold finger along the axial direction of the cutting groove. The laser control system is used to control the output energy of the ultrafast flat-top laser beam.

3. The gold finger laser cutting system as claimed in claim 2, characterized in that: The optical path processing device also includes a plurality of reflectors and a telecentric field mirror. The reflector is arranged between the output end of the light source module and the input end of the high-speed scanning galvanometer, and is used to change the transmission path of the laser light beam. The telecentric field mirror is arranged at the output end of the high-speed scanning galvanometer, and is used to focus the ultrafast flat-top laser beam emitted by the high-speed scanning galvanometer and make the laser focus located on the same focal plane.

4. The gold finger laser cutting system as claimed in claim 2, characterized in that: The high-speed scanning galvanometer is used to control the ultrafast flat-top laser beam to perform single-line cutting or multi-line cutting on the gold finger, and during multi-line cutting, each cutting line is located in the cutting groove.

5. A gold finger laser cutting method using the gold finger laser cutting system according to any one of claims 1 to 4, characterized in that: The steps include: (1) operating a light source module of an optical path processing device to generate an ultrafast flat-top laser beam; (2) Place the gold finger on a special cutting jig with the gold finger facing upward, and make the cutting part of the gold finger hang above the cutting groove, so that the cutting direction of the gold finger is consistent with the axial direction of the cutting groove; (3) operating the adsorption system to provide adsorption force, thereby adsorbing the gold finger onto the adsorption plane of the special cutting tool through the air flow holes; (4) operating the control processing module of the optical path processing device to control the ultrafast flat-top laser beam to move along the axial direction of the cutting groove to cut the gold finger; (5) operating the ion wind system of the ion wind dust removal device, blowing the ion wind generated by the ion wind system into the dedicated dust removal cover through the blowing hole, so that the carbonized dust generated during the cutting process is transformed into ion dust, and the ion dust is removed by using the dedicated dust removal cover; (6) The adsorption system generates an adsorption force on the air suction hole of the special dust removal cover, and the adsorption system and the ion wind system work together to form an ion wind airflow, thereby sucking the ion dust away from the air suction hole; Wherein, the step (1) specifically comprises the following steps: (11) adjusting an ultrafast laser to emit an ultrafast laser beam; the ultrafast laser has a wavelength from green light to ultraviolet light and a pulse width from picoseconds to femtoseconds; (12) adjusting a variable-power beam expander to amplify the spot diameter of the ultrafast laser beam emitted by the ultrafast laser, wherein the magnification of the variable-power beam expander is 2 to 10 times; (13) The ultrafast laser beam emitted after the spot diameter is enlarged by the variable-power beam expander is shaped by a beam shaper to obtain the ultrafast flat-top laser beam.

6. The gold finger laser cutting method according to claim 5, characterized in that: The step (4) is single-line cutting or multi-line cutting, and in the case of multi-line cutting, each cutting line is located in the cutting groove.

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