A chip-type polymer laminated solid capacitor

Abstract

The present invention provides a patch-type polymer laminated solid capacitor, comprising a lead assembly, a laminated wafer formed by stacking multilayer capacitor wafers, and a plastic package. By arranging the positive electrode sheet and the negative electrode sheet of the lead assembly outside the plastic package, the positive electrode sheet can be isolated from the laminated wafer located inside the plastic package, and the structure is safer and more reliable. The first mounting portion of the lead assembly is designed in the form of a positive electrode clamping arm and a pressure head, and the positive terminal can be firmly mounted in combination with a conductive adhesive. At the same time, the second mounting portion of the lead assembly is designed to have a preset spacing distance between the negative electrode clamping arm and the negative terminal. The preset spacing distance is filled by conductive adhesive, such as silver paste, to achieve the connection between the negative terminal and the second mounting portion. The connection is more firmly, stably, light, and the conductive performance is significantly optimized and improved. In addition, by adopting the form of a plastic package, a higher strength protection is provided for the solid capacitor.

Description

Technical Field

[0001] The present invention relates to the technical field of capacitors, and in particular to a chip-type polymer laminated solid capacitor. Background Art

[0002] Capacitors are an indispensable and important component in the power supply circuit of a computer system. Various boards and chipsets on the motherboard require power supplies of various voltages. To ensure the stable operation of the motherboard and boards, capacitors are needed to filter the power supply and ensure voltage stability. Compared with ordinary liquid aluminum electrolytic capacitors, solid capacitors use conductive polymers as dielectric materials. This material will not react with aluminum oxide and will not explode after power is turned on. At the same time, it is a solid product and will not burst due to thermal expansion. Solid capacitors have superior characteristics such as environmental protection, low impedance, high and low temperature stability, high ripple resistance and high reliability. They are currently the most advanced products among electrolytic capacitor products.

[0003] The connection between the capacitor chip and the lead frame of the current solid-state capacitor is not strong enough and the conductivity is average. At the same time, solid-state capacitors generally use aluminum casings, which are easily damaged in various harsh environments such as high temperature, low temperature, high pressure or ozone. In addition, the entire capacitor is heavy and its safety performance needs to be improved.

[0004] In view of this, it is necessary to propose a surface-mount polymer laminated solid capacitor to solve or at least alleviate the above defects. Summary of the invention

[0005] The main purpose of the present invention is to provide a surface-mount polymer laminated solid capacitor to solve the problems of the current solid-state capacitor, such as the connection between the capacitor chip and the lead frame is not firm enough, the conductivity is average, the aluminum shell is easily damaged in various harsh environments such as high temperature, low temperature, high pressure or ozone, and the weight of the entire capacitor is large and the safety performance needs to be improved.

[0006] To achieve the above-mentioned purpose, the present invention provides a patch-type polymer laminated solid capacitor, comprising: a lead assembly, a laminated chip formed by stacking multiple layers of capacitor chips, and a plastic package; wherein:

[0007] Each of the capacitor chips comprises a positive terminal and a negative terminal which are arranged opposite to each other, and a conductive glue is coated between two adjacent capacitor chips;

[0008] The lead assembly comprises a positive lead and a negative lead arranged opposite to each other, the positive lead comprises a positive electrode sheet exposed and arranged below the laminated wafer and the plastic package, a first mounting portion for fixing the positive terminal, and at least one first connecting portion connecting the positive electrode sheet and the first mounting portion, the positive terminal is electrically connected to the first mounting portion and the first connecting portion through a conductive adhesive; wherein the first mounting portion comprises a first bottom plate and positive electrode holding arms extending from opposite sides of the first bottom plate, a pressure head is arranged at a free end of the positive electrode holding arm, the first bottom plate is held against the bottom surface of the laminated wafer, the two positive electrode holding arms are held against the sides of the laminated wafer, and the pressure heads of the positive electrode holding arms are pressed against the top of the laminated wafer;

[0009] The negative electrode lead includes a negative electrode sheet exposed and arranged below the laminated wafer and the plastic package, a second mounting portion for fixing the negative terminal, and at least one second connecting portion connecting the negative electrode sheet and the second mounting portion; wherein the negative terminal is electrically connected to the second mounting portion and the second connecting portion through a conductive adhesive;

[0010] The plastic package is made of resin material, and the plastic package wraps the laminated wafer and the lead assembly by injection molding, and the positive electrode sheet and the negative electrode sheet are exposed outside the bottom surface of the plastic package.

[0011] Preferably, the positive electrode sheet is L-shaped, including a first side plate and a positive electrode sheet bottom plate parallel to the laminated chip; the number of the first connecting parts is two, and the two first connecting parts are spaced apart along the width direction of the first side plate, and each first connecting part is in an inverted L-shape, including a first connecting top plate and a first connecting side plate, and the end of the first connecting top plate is fixedly connected to the top of the first side plate; wherein the back side of the first connecting side plate is fixedly connected to the side of the first bottom plate, and there is a first preset spacing distance between the first bottom plate and the positive electrode sheet bottom plate.

[0012] Preferably, the negative electrode sheet is L-shaped, including a second side plate and a negative electrode sheet bottom plate parallel to the laminated chip; the number of the second connecting parts is two, and the two second connecting parts are spaced apart along the width direction of the second side plate, and each second connecting part is in an inverted L-shape, including a second connecting top plate and a second connecting side plate, and the end of the second connecting top plate is fixedly connected to the top of the second side plate; the second mounting part includes a second bottom plate and negative electrode holding arms extending from opposite sides of the second bottom plate, and the second bottom plate is supported against the bottom surface of the laminated chip; wherein the back side of the second connecting side plate is fixedly connected to the side of the second bottom plate, and there is a second preset spacing distance between the side of the negative terminal and the negative electrode holding arm, and between the end face of the negative terminal and the back side of the second connecting side plate, and there is a third preset spacing distance between the second bottom plate and the negative electrode sheet bottom plate.

[0013] Preferably, the capacitor wafer has four layers, and the length and width of each capacitor wafer are consistent.

[0014] Preferably, the first preset spacing distance is consistent with the third preset spacing distance, and the first preset spacing distance and the third preset spacing distance are set between 0.3 and 0.5 mm; the second preset spacing distance is set between 0.03 and 0.08 mm.

[0015] Preferably, the length of the positive electrode bottom plate is consistent with the length of the negative electrode bottom plate and is set between 1.0 and 1.6 mm.

[0016] Preferably, the positive electrode sheet bottom plate and the negative electrode sheet bottom plate are located on the same horizontal plane, and are both parallel to the bottom surface of the laminated wafer.

[0017] Preferably, a positive electrode mark is formed on the first side plate, and a negative electrode mark is formed on the second side plate.

[0018] Preferably, the positive electrode sheet bottom plate, the first side plate, the first connecting top plate, the first connecting side plate, the first bottom plate, the positive electrode holding arm and the pressure head are integrally formed; the negative electrode sheet bottom plate, the second side plate, the second connecting top plate, the second connecting side plate, the second bottom plate, and the negative electrode holding arm are integrally formed.

[0019] Preferably, the resin material includes one or more of alkyd resin, polyester resin, phenolic resin, amino resin, epoxy resin, and polyurethane resin.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present invention provides a patch-type polymer laminated solid capacitor, including a lead assembly, a laminated chip formed by stacking multiple layers of capacitor chips, and a plastic package. By arranging the positive electrode sheet and the negative electrode sheet of the lead assembly outside the plastic package, the positive electrode sheet can be isolated from the laminated chip located inside the plastic package, and the structure is safer and more reliable. The first mounting part of the lead assembly is used to install the positive terminal, and the second mounting part is used to install the negative terminal; wherein the first mounting part is designed in the form of a positive electrode holding arm and a pressure head, and the positive terminal can be firmly installed at the first mounting part in combination with conductive glue. At the same time, the second mounting part of the lead assembly is designed to have a preset spacing distance between the negative electrode holding arm and the negative terminal, and the preset spacing distance is filled by conductive glue, such as silver paste, to achieve the connection between the negative terminal and the second mounting part. In this way, the connection is more firm, stable, lightweight, and the conductive performance is significantly optimized and improved. In addition, by adopting the form of plastic packaging, higher strength protection is provided for the solid-state capacitor, ensuring that the solid-state capacitor works normally under different harsh conditions, extending the service life of the capacitor, and at the same time avoiding the problems of poor comprehensive performance and high production cost of solid-state capacitors using metal casings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0023] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present invention;

[0024] Figure 2 An exploded schematic diagram of the overall structure of an embodiment of the present invention;

[0025] Figure 3 is an exploded schematic diagram of the overall structure of one embodiment of the present invention from another viewing angle;

[0026] Figure 4 is a schematic structural diagram of a stacked wafer in one embodiment of the present invention;

[0027] Figure 5 is a schematic structural diagram of a lead assembly in one embodiment of the present invention;

[0028] Figure 6 Schematic diagram of the structure of the lead assembly from another perspective in one embodiment of the present invention.

[0029] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments.

[0030] Description of Figure Numbers:

[0031] Lead assembly 10; positive lead 100; positive electrode sheet 110; first side plate 111; positive electrode sheet bottom plate 112; first mounting portion 120; first bottom plate 121; positive electrode holding arm 122; pressing head 123; first connecting portion 130; first connecting top plate 131; first connecting side plate 132;

[0032] Negative electrode lead 200; negative electrode sheet 210; second side plate 211; negative electrode sheet bottom plate 212; second mounting portion 220; second bottom plate 221; negative electrode holding arm 222; second connecting portion 230; second connecting top plate 231; second connecting side plate 232;

[0033] Laminated chip 30; capacitor chip 310; positive terminal 311; negative terminal 312;

[0034] Plastic package body 40. DETAILED DESCRIPTION

[0035] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0038] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0039] Please see attached Figure 1-6 In one embodiment of the present invention, a surface-mount polymer laminated solid capacitor includes a lead assembly 10, a laminated chip 30 formed by stacking multi-layer capacitor chips 310, and a plastic package 40; wherein,

[0040] Each of the capacitor chips 310 includes a positive terminal 311 and a negative terminal 312 that are relatively arranged, and a conductive glue (not shown in the figure) is coated between two adjacent capacitor chips 310; specifically, the conductive glue includes but is not limited to copper glue or silver glue, both of which have good conductivity. In a preferred embodiment, the conductive glue is copper glue, which has better compatibility than silver glue and is lower in cost.

[0041] The lead assembly 10 includes a positive lead 100 and a negative lead 200 that are arranged opposite to each other. The positive lead 100 includes a positive electrode sheet 110 that is exposed and arranged below the laminated wafer 30 and the plastic package 40, a first mounting portion 120 for fixing the positive terminal 311, and at least one first connecting portion 130 connecting the positive electrode sheet 110 and the first mounting portion 120. The positive terminal 311 is connected to the first mounting portion 120 and the first connecting portion 130 through a conductive adhesive. 30 is electrically connected; wherein the first mounting portion 120 includes a first bottom plate 121 and positive electrode holding arms 122 extending from opposite sides of the first bottom plate 121, respectively, and a pressure head 123 is provided at the free end of the positive electrode holding arm 122, the first bottom plate 121 is held against the bottom surface of the laminated wafer 30, the two positive electrode holding arms 122 are held on the sides of the laminated wafer 30, and the pressure head 123 of the positive electrode holding arm 122 is pressed against the top of the laminated wafer 30;

[0042] The negative electrode lead 200 includes a negative electrode sheet 210 exposed and disposed below the laminated wafer 30 and the plastic package 40, a second mounting portion 220 for fixing the negative terminal 312, and at least one second connecting portion 230 connecting the negative electrode sheet 210 and the second mounting portion 220; wherein the negative terminal 312 is electrically connected to the second mounting portion 220 and the second connecting portion 230 through a conductive adhesive;

[0043] It is worth noting that the positive electrode sheet 110 and the negative electrode sheet 210 are arranged outside the plastic package 40, which can isolate the positive electrode sheet 110 from the laminated wafer 30 located inside the plastic package 40, and the structure is safer and more reliable. The first mounting portion 120 is used to mount the positive terminal 311, and the second mounting portion 220 is used to mount the negative terminal 312; wherein, the first mounting portion is designed in the form of a positive electrode holding arm 122 and a pressure head 123, and can be combined with conductive glue to firmly mount the positive terminal 311 at the first mounting portion 120, and at the same time, the second mounting portion 220 is designed to have a preset spacing distance between the negative electrode holding arm 222 and the negative terminal 312, and the preset spacing distance is filled by conductive glue, such as silver paste, to achieve the connection between the negative terminal 312 and the second mounting portion 220, so that the connection is more firm and stable, and the conductive performance is significantly optimized and improved.

[0044] The plastic package 40 is made of resin material, and the plastic package 40 wraps the laminated wafer 30 and the lead assembly 10 by injection molding, and the positive electrode sheet 110 and the negative electrode sheet 210 are exposed outside the bottom surface of the plastic package 40. By adopting the setting of the plastic package 40, a higher strength protection is provided for the solid-state capacitor, ensuring that the solid-state capacitor works normally under different harsh conditions, extending the service life of the capacitor, and avoiding the problems of poor comprehensive performance and high production cost of the solid-state capacitor using a metal shell.

[0045] As a preferred embodiment of the present invention, the positive electrode sheet 110 is L-shaped, including a first side plate 111 and a positive electrode sheet bottom plate 112 parallel to the stacked wafer 30; the number of the first connecting parts 130 is two, and the two first connecting parts 130 are arranged at intervals along the width direction of the first side plate 111, and each first connecting part 130 is in an inverted L-shape, including a first connecting top plate 131 and a first connecting side plate 132, and the end of the first connecting top plate 131 is fixedly connected to the top of the first side plate 111; wherein the back of the first connecting side plate 132 is fixedly connected to the side of the first bottom plate 121, and there is a first preset spacing distance between the first bottom plate 121 and the positive electrode sheet bottom plate 112. It should be noted that the number of the first connecting parts 130 can be set according to actual needs, and the plurality of first connecting parts 130 are arranged at intervals along the width direction of the first side plate 111.

[0046] As a preferred embodiment of the present invention, the negative electrode sheet 210 is L-shaped, including a second side plate 211 and a negative electrode sheet bottom plate 212 parallel to the laminated wafer 30; the number of the second connecting parts 230 is two, and the two second connecting parts 230 are arranged at intervals along the width direction of the second side plate 211, and each second connecting part 230 is in an inverted L shape, including a second connecting top plate 231 and a second connecting side plate 232, and the end of the second connecting top plate 231 is fixedly connected to the top of the second side plate 211; the second mounting part 220 includes a second bottom plate 231 and a second connecting side plate 232; The second bottom plate 221 and the negative electrode holding arms 222 respectively extend from the opposite sides of the second bottom plate 221, and the second bottom plate 221 is supported on the bottom surface of the laminated chip 30; wherein the back surface of the second connecting side plate 232 is fixedly connected to the side surface of the second bottom plate 221, and there is a second preset spacing distance between the side surface of the negative terminal 312 and the negative electrode holding arms 222, and between the end surface of the negative terminal 312 and the back surface of the second connecting side plate 232, and there is a third preset spacing distance between the second bottom plate 221 and the negative electrode sheet bottom plate 212.

[0047] In a specific embodiment, the first preset spacing distance is consistent with the third preset spacing distance, and the first preset spacing distance and the third preset spacing distance are set between 0.3 and 0.5 mm; the second preset spacing distance is set between 0.03 and 0.08 mm. It can be understood that the first preset spacing distance, the second preset spacing distance and the third preset spacing distance can all be set according to actual needs and should be controlled within a reasonable range.

[0048] As a specific embodiment of the present invention, the capacitor wafer 310 has four layers, and the length and width of each capacitor wafer 310 are consistent. It should be understood by those skilled in the art that the number of layers of the capacitor wafer 310 and the size of each layer of the capacitor wafer 310 can be set according to actual needs, and can be two layers or multiple layers. The number of layers of the capacitor wafer 310 in this embodiment is four layers, and the four layers of capacitor wafers 310 are stacked in sequence to form a stacked wafer 30.

[0049] Furthermore, the length of the positive electrode bottom plate 112 is consistent with the length of the negative electrode bottom plate 212, and is set between 1.0 and 1.6 mm. It should be noted that the length of the positive electrode bottom plate 112 and the length of the negative electrode bottom plate 212 should not be too large or too small. Preferably, in this embodiment, the length of the positive electrode bottom plate 112 and the length of the negative electrode bottom plate 212 are both set to 1.3 mm.

[0050] Further, the positive electrode sheet bottom plate 112 and the negative electrode sheet bottom plate 212 are located on the same horizontal plane, and are parallel to the bottom surface of the laminated wafer 30. It can be understood that the positive electrode sheet bottom plate 112 and the negative electrode sheet bottom plate 212 can be located on the same plane or on different planes. In this embodiment, the shape of the plastic package 40 is a rectangular parallelepiped. After the injection molding is completed, the positive electrode sheet bottom plate 112 and the negative electrode sheet bottom plate 212 are both attached to the bottom of the plastic package 40. By arranging the positive electrode sheet bottom plate 112 and the negative electrode sheet bottom plate 212 on the same horizontal plane, the horizontality and performance of the entire surface-mount polymer laminated solid capacitor can be ensured.

[0051] Furthermore, a positive pole mark (not shown) is formed on the first side plate 111, and a negative pole mark (not shown) is formed on the second side plate 211. The positive pole mark and the negative pole mark are formed on the first side plate 111 and the second side plate 211, respectively, which is more helpful for identification operation.

[0052] As a preferred embodiment of the present invention, the positive electrode bottom plate 112, the first side plate 111, the first connection top plate 131, the first connection side plate 132, the first bottom plate 121, the positive electrode holding arm 122 and the pressure head 123 are integrally formed; the negative electrode bottom plate 212, the second side plate 211, the second connection top plate 231, the second connection side plate 232, the second bottom plate 221, and the negative electrode holding arm 222 are integrally formed. It can be understood that in other embodiments, it can also be a detachable connection, which can be set according to actual needs.

[0053] Furthermore, the resin material includes but is not limited to one or more of alkyd resin, polyester resin, phenolic resin, amino resin, epoxy resin, and polyurethane resin. Alkyd resin, polyester resin, phenolic resin, amino resin, epoxy resin, and polyurethane resin all have good wear resistance, corrosion resistance, and insulation, and the above materials are common plastic raw materials and are easy to obtain during the production process.

[0054] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A chip-type polymer laminated solid capacitor, characterized in that: include: Lead assembly, laminated wafer formed by stacking multi-layer capacitor wafers, and plastic package; wherein, Each of the capacitor chips comprises a positive terminal and a negative terminal which are arranged opposite to each other, and a conductive glue is coated between two adjacent capacitor chips; The lead assembly comprises a positive lead and a negative lead arranged opposite to each other, the positive lead comprises a positive electrode sheet exposed and arranged below the laminated wafer and the plastic package, a first mounting portion for fixing the positive terminal, and at least one first connecting portion connecting the positive electrode sheet and the first mounting portion, the positive terminal is electrically connected to the first mounting portion and the first connecting portion through a conductive adhesive; wherein the first mounting portion comprises a first bottom plate and positive electrode holding arms extending from opposite sides of the first bottom plate, a pressure head is arranged at a free end of the positive electrode holding arm, the first bottom plate is held against the bottom surface of the laminated wafer, the two positive electrode holding arms are held against the sides of the laminated wafer, and the pressure heads of the positive electrode holding arms are pressed against the top of the laminated wafer; The negative electrode lead includes a negative electrode sheet exposed and arranged below the laminated wafer and the plastic package, a second mounting portion for fixing the negative terminal, and at least one second connecting portion connecting the negative electrode sheet and the second mounting portion; wherein the negative terminal is electrically connected to the second mounting portion and the second connecting portion through a conductive adhesive; The plastic package is made of resin material, and the plastic package wraps the laminated wafer and the lead assembly by injection molding, and the positive electrode sheet and the negative electrode sheet are exposed outside the bottom surface of the plastic package; The positive electrode sheet is L-shaped, including a first side plate and a positive electrode sheet bottom plate parallel to the stacked wafer; the number of the first connecting parts is two, and the two first connecting parts are arranged at intervals along the width direction of the first side plate, and each first connecting part is in an inverted L shape, including a first connecting top plate and a first connecting side plate, and the end of the first connecting top plate is fixedly connected to the top of the first side plate; wherein the back side of the first connecting side plate is fixedly connected to the side of the first bottom plate, and there is a first preset spacing distance between the first bottom plate and the positive electrode sheet bottom plate; The negative electrode sheet is L-shaped, including a second side plate and a negative electrode sheet bottom plate parallel to the stacked wafer; the number of the second connecting parts is two, and the two second connecting parts are arranged at intervals along the width direction of the second side plate, and each second connecting part is in an inverted L shape, including a second connecting top plate and a second connecting side plate, and the end of the second connecting top plate is fixedly connected to the top of the second side plate; the second mounting part includes a second bottom plate and negative electrode holding arms extending from opposite sides of the second bottom plate, respectively, and the second bottom plate is abutted against the bottom surface of the stacked wafer; wherein the back side of the second connecting side plate is fixedly connected to the side surface of the second bottom plate, and the side surface of the negative terminal and the negative electrode holding arm, as well as the end surface of the negative terminal and the back surface of the second connecting side plate are all provided with a second preset spacing distance, and the second bottom plate and the negative electrode sheet bottom plate are provided with a third preset spacing distance; The first preset spacing distance is consistent with the third preset spacing distance, and the first preset spacing distance and the third preset spacing distance are set between 0.3 and 0.5 mm; the second preset spacing distance is set between 0.03 and 0.08 mm; Among them, the conductive glue adopts copper glue.

2. The chip-type polymer laminated solid capacitor according to claim 1, characterized in that: The capacitor chip has four layers, and the length and width of each capacitor chip are consistent.

3. The surface-mount polymer laminated solid capacitor according to claim 2, characterized in that: The length of the positive electrode bottom plate is consistent with the length of the negative electrode bottom plate and is set between 1.0 and 1.6 mm.

4. The surface-mount polymer laminated solid capacitor according to claim 3, characterized in that: The positive electrode bottom plate and the negative electrode bottom plate are located on the same horizontal plane and are parallel to the bottom surface of the laminated wafer.

5. The surface-mount polymer laminated solid capacitor according to claim 2, characterized in that: A positive electrode mark is formed on the first side plate, and a negative electrode mark is formed on the second side plate.

6. The chip-type polymer laminated solid capacitor according to claim 2, characterized in that: The positive electrode sheet bottom plate, the first side plate, the first connecting top plate, the first connecting side plate, the first bottom plate, the positive electrode holding arm and the pressure head are integrally formed; the negative electrode sheet bottom plate, the second side plate, the second connecting top plate, the second connecting side plate, the second bottom plate, and the negative electrode holding arm are integrally formed.

7. The surface-mount polymer laminated solid capacitor according to any one of claims 1 to 6, characterized in that: The resin material includes one or more of alkyd resin, polyester resin, phenolic resin, amino resin, epoxy resin, and polyurethane resin.

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