A chip-based self-sensing temperature control system

Abstract

The present invention discloses a self-sensing temperature control system for a chip, belonging to the field of heat dissipation technology for microelectronic device chips. The hot-end ceramic plate of the thermoelectric cooling plate of the present invention has multiple grooves filled with a low-melting-point alloy. Within one groove, the low-melting-point alloy contacts the thermoelectric arm via a copper block. The cold-end ceramic plate absorbs heat from the local hot spot of the chip to be dissipated and transfers it to the hot-end ceramic plate. When the temperature rises to the melting point of the low-melting-point alloy, the low-melting-point alloy melts, expands, and contacts the bottom of the heat dissipation fins. The heat dissipates and is dissipated through forced convection by the cooling fan. Simultaneously, electrical conduction through the copper block causes the thermoelectric cooling plate to start operating, effectively cooling the local hot spot of the chip to be dissipated, achieving precise temperature control. When the chip to be dissipated drops to a certain temperature, the low-melting-point alloy begins to solidify and contract, disconnecting the circuit and causing the thermoelectric cooling plate to stop operating, achieving "self-sensing temperature control," effectively reducing energy consumption and preventing overcooling.

Description

Technical Field

[0001] The present invention relates to a self-sensing temperature control system for a chip, and in particular to a chip self-sensing precise temperature control and refrigeration system based on thermoelectric refrigeration, belonging to the technical field of heat dissipation of chips of microelectronic equipment. Background Art

[0002] As electronic components continue to shrink in size and their speed and performance increase, the energy consumption and heat flux density of chip-level electronic devices are increasing. Excessive temperatures can subject components to excessive thermal expansion stress, leading to structural damage and failure. Consequently, the heat generated by individual chips also increases significantly, and chip temperatures, especially localized temperatures, rise rapidly. The heat flux density at hotspots can reach five to ten times the chip's average heat flux density. The emergence of hotspots can cause localized high temperatures and thermal stress within the chip of an electronic device. The increase in chip temperature and temperature gradients exponentially shortens the product's mean time between failures and the lifecycle of the electronic device. This requires the chip's thermal management system to not only cope with background heat but also quickly remove heat from hotspots, reducing the temperature of these hotspots while maintaining the overall chip temperature.

[0003] However, traditional thermal management technologies are rapidly approaching their limits. Cooling methods such as air cooling and water cooling still exist in many cooling applications, but they are passive cooling methods that cannot achieve precise temperature control and cannot meet the cooling requirements of electronic chips with high heat flux density. The water cooling system has a complex structure, large size, and high noise, which is not conducive to the miniaturization and integration of electronic equipment, and water leakage can easily cause short circuit problems. Currently, air cooling is widely used to dissipate heat from electronic components, but with the continuous increase in the heat flux density of electronic components, this cooling method has reached the limit of its heat dissipation capacity. Microchannel liquid cooling radiators have better heat transfer performance due to their larger surface area and coolant with good thermal properties, but the channel cross-sectional area is small, and the single-phase flow of liquid through the microchannel is accompanied by a large temperature rise, which can cause serious problems such as excessive thermal stress or chip thermoelectric mismatch. Micro-heat pipe cooling uses a working area at each end of the device and an insulating end in the middle. Cooling is achieved by absorbing heat through a constant-temperature phase change in the medium. However, the relative position of the evaporator and condenser affects cooling performance. Furthermore, the heat sink has a complex structure, requires high sealing, and requires a large volume, which limits its miniaturization. Micro-jet cooling uses high-speed droplets or airflow ejected from a nozzle. This offers a high heat transfer coefficient and exceptionally high heat transfer efficiency. However, when miniaturized, the nozzle size is reduced, and the required driving pressure increases, which increases power consumption. Furthermore, the micro-jet only sprays into the stagnation zone, resulting in a small cooling area and uneven chip temperature distribution. Micro-thermoacoustic cooling utilizes the thermoacoustic effect to convert acoustic energy into thermal energy. However, this cooling method is inefficient and cannot meet the requirements for dissipating heat from high-heat-flux electronic chips.

[0004] Thermoelectric cooling, also known as semiconductor cooling, is an emerging cooling technology that utilizes the Peltier effect of semiconductor materials. This technology actively dissipates heat from chips by connecting a micro-thermoelectric chip to a power source and placing its cold end in contact with the chip surface. Requiring no refrigerant and lacking mechanical moving parts, the technology offers advantages such as active energy transfer, ease of adjustment and miniaturization, rapid and precise cooling, ultra-quiet operation, and a long lifespan. It is widely used in aviation, instrumentation, and industrial and commercial applications. Summary of the Invention

[0005] The present invention discloses a self-sensing temperature control system for a chip, which achieves precise temperature control by absorbing heat from local hot spots in the chip through thermoelectric cooling. It also uses low-melting-point alloys as thermal switches and electrical switches for the thermoelectric cooling plate to achieve "self-sensing temperature control."

[0006] The purpose of the present invention is achieved through the following technical solutions:

[0007] The present invention provides a self-sensing temperature control system for a chip, which absorbs heat from local hot spots in the chip based on thermoelectric cooling to achieve precise temperature control; low-melting-point alloys are used as thermal switches and electrical switches for the thermoelectric cooling plate to achieve "self-sensing temperature control."

[0008] The low-melting-point alloy is used as a thermal switch and an electric switch of the thermoelectric cooling plate to achieve "self-sensing temperature control". The melting point range of the alloy is determined according to the thermal switch, the electric switch and the economic requirements of the thermoelectric cooling plate.

[0009] A self-sensing temperature control system for a chip of the present invention comprises a heat-conducting copper sheet, a thermoelectric cooling sheet, a low-melting-point alloy, a copper block, heat-dissipating fins, and a heat-dissipating fan.

[0010] Furthermore, the thermoelectric cooling plate includes a hot-end ceramic plate, a cold-end ceramic plate and a thermoelectric arm.

[0011] The lower surface of the thermally conductive copper sheet is in contact with the chip to be dissipated, the upper surface of the thermally conductive copper sheet is in contact with the lower end of the heat dissipation fin, the heat dissipation fan is fixedly installed on the upper end of the heat dissipation fin, and the thermoelectric cooling sheet is fixedly placed in the center of the thermally conductive copper sheet.

[0012] Furthermore, the cold-end ceramic sheet is in contact with the chip to be cooled, and the hot-end ceramic sheet has a plurality of grooves, in which the low-melting-point alloy is contained.

[0013] Furthermore, one of the grooves of the hot end ceramic sheet is selected as a channel for the low melting point alloy to contact the thermoelectric arm, and the copper block is installed between the low melting point alloy and the thermoelectric arm for electrical and thermal conductivity.

[0014] Furthermore, the power line of the thermoelectric cooling plate passes through the insulating microchannel between the top of the thermoelectric cooling plate and the bottom of the heat dissipation fin.

[0015] Furthermore, the interface material with good thermal conductivity is filled between the contact planes of the chip to be cooled, the thermally conductive copper sheet, the thermoelectric cooling sheet and the heat dissipation fins to reduce the contact thermal resistance, and insulating material is filled around the power line of the thermoelectric cooling sheet.

[0016] The working method of a self-sensing temperature control system of a chip disclosed in the present invention is as follows: the cold-end ceramic sheet absorbs the heat of the local hot spot of the chip to be dissipated and transfers it to the hot-end ceramic sheet; when the temperature of the hot-end ceramic sheet rises to the melting point of the low-melting-point alloy, the low-melting-point alloy melts and expands, contacts the bottom of the heat dissipation fin, transfers the heat upward, and the heat dissipation fin diffuses the heat to a larger heat exchange surface, and dissipates the heat through the forced convection of the heat dissipation fan; at the same time, the copper block conducts electricity to form a path, and the thermoelectric cooling sheet starts to work, realizing precise temperature control, and effectively cooling the local hot spot of the chip to be dissipated; when the temperature of the chip to be dissipated drops to a certain temperature, the low-melting-point alloy begins to solidify and shrink, the circuit is disconnected, and the thermoelectric cooling sheet stops working, realizing "self-sensing temperature control", effectively reducing energy consumption, and avoiding overcooling.

[0017] Beneficial effects:

[0018] 1. The present invention provides a self-sensing temperature control system for a chip. When the chip is running at high load, its surface temperature rises rapidly, and the heat generation increases sharply. When the power is increased to ensure that the chip is at a normal operating temperature, the thermoelectric cooling plate has the lowest energy consumption and higher heat dissipation efficiency compared with other heat dissipation methods.

[0019] 2. The present invention provides a self-sensing temperature control system for a chip. A low-melting-point alloy is used in the hot-end ceramic plate of the thermoelectric cooling plate to form an electric switch and a heat channel. When the chip temperature rises to a certain level, the thermoelectric cooling plate starts to be powered on, which can effectively save electricity and avoid overcooling.

[0020] 3. The present invention provides a self-sensing temperature control system for a chip. The thermoelectric cooling plate has a compact structure and can achieve precise temperature control of the local hot spots of the chip. In addition to using the thermoelectric cooling plate to absorb heat in the local hot spots of the chip, the remaining temperature is different and the heat is transferred to the radiator by using the thermal conductive copper plate for dissipation. This can not only achieve overall heat dissipation of the chip, but also avoid the problem of overcooling.

[0021] 4. The self-sensing temperature control system of a chip of the present invention utilizes heat dissipation fins to conduct and disperse the heat of the chip with high heat flux density, thereby reducing the heat flux density, effectively controlling the temperature rise of the chip with high heat flux density, and improving the stability of equipment operation.

[0022] 5. The self-sensing temperature control system of a chip of the present invention has a compact structure and a small size, which is conducive to the heat dissipation of electronic components with complex appearance and structure, high integration and high heat flux density. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is an overall schematic diagram of a self-sensing temperature control system for a chip of the present invention;

[0024] Among them, 1-chip to be cooled, 2-thermoelectric cooling sheet, 3-thermal copper sheet, 4-heat dissipation fin, 5-cooling fan;

[0025] Figure 2 It is a partial schematic diagram of the thermoelectric cooling chip portion of the self-sensing temperature control system of a chip of the present invention;

[0026] Among them, 201-hot end ceramic sheet, 202-thermoelectric arm, 203-cold end ceramic sheet, 6-low melting point alloy, 7-copper block;

[0027] Figure 3 is a schematic diagram of the chip to be cooled;

[0028] Figure 4 It is a schematic diagram of the thermal conductive copper sheet;

[0029] Figure 5 is a schematic diagram of the heat sink;

[0030] Figure 6 This is a schematic diagram of the cooling fan;

[0031] Figure 7 This is a schematic diagram of a thermoelectric cooling chip that is not conducting;

[0032] Figure 8 It is a schematic diagram of the conduction of the thermoelectric cooling chip. DETAILED DESCRIPTION

[0033] In order to better illustrate the purpose and advantages of the present invention, the invention is further described below with reference to the accompanying drawings and examples.

[0034] Example 1:

[0035] As attached Figure 1 As shown, a self-sensing temperature control system of a chip of the present invention includes a heat-conducting copper sheet 3, a thermoelectric cooling sheet 2, a heat dissipation fin 4, and a heat dissipation fan 5.

[0036] As attached Figure 2 As shown, the thermoelectric cooling plate 2 includes a hot-end ceramic plate 201 , a cold-end ceramic plate 203 and a thermoelectric arm 202 , and the hot-end ceramic plate 201 has a plurality of grooves, in which the low-melting-point alloy 6 is filled.

[0037] A groove of any hot end ceramic sheet 201 is selected as a channel for the low melting point alloy 6 to contact the thermoelectric arm 202. A copper block 7 is installed between the low melting point alloy 6 and the thermoelectric arm 202 for electrical and thermal conductivity.

[0038] The lower surface of the thermally conductive copper sheet 3 is in contact with and connected to the chip 1 to be dissipated heat, the upper surface of the thermally conductive copper sheet 3 is in contact with and connected to the lower end of the heat dissipation fin 4, the heat dissipation fan 5 is fixedly installed on the upper end of the heat dissipation fin 4, the thermoelectric cooling sheet 2 is fixedly placed in the center of the thermally conductive copper sheet 3, the cold end ceramic sheet 203 is in contact with the chip 1 to be dissipated heat, the power line of the thermoelectric cooling sheet 2 passes through the insulating microchannel between the top of the thermoelectric cooling sheet 2 and the bottom of the heat dissipation fin 4, the interface material with good thermal conductivity is filled between the contact planes of the chip 1 to be dissipated heat, the thermally conductive copper sheet 3, the thermoelectric cooling sheet 2 and the heat dissipation fin 4 to reduce the contact thermal resistance, and insulating material is filled around the power line of the thermoelectric cooling sheet 2.

[0039] The working method of the self-sensing temperature control system of a chip in this embodiment is as follows: the cold-end ceramic sheet 203 absorbs the heat of the local hot spot of the chip 1 to be dissipated and transfers it to the hot-end ceramic sheet 201. When the temperature of the hot-end ceramic sheet 201 rises to the melting point of the low-melting-point alloy 6, the low-melting-point alloy 6 melts and expands, contacts the bottom of the heat dissipation fins 4, and transfers the heat upward. The heat dissipation fins 4 diffuse the heat to a larger heat exchange surface, and the heat is dissipated through forced convection of the heat dissipation fan 5; at the same time, the copper block 7 conducts electricity to form a path, and the thermoelectric cooling sheet 2 starts to work, achieving precise temperature control and effectively cooling the local hot spot of the chip 1 to be dissipated; when the temperature of the chip 1 to be dissipated drops to a certain temperature, the low-melting-point alloy 6 begins to solidify and contract, the circuit is disconnected, and the thermoelectric cooling sheet 2 stops working, achieving "self-sensing temperature control", effectively reducing energy consumption and avoiding overcooling.

[0040] The above specific description further illustrates the purpose, technical solutions and beneficial effects of the invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A chip self-sensing temperature control system, characterized by: It comprises a heat-conducting copper sheet (3), a thermoelectric cooling sheet (2), a low-melting-point alloy (6), a copper block (7), a heat dissipation fin (4), and a heat dissipation fan (5); The thermoelectric cooling plate (2) comprises a hot-end ceramic plate (201), a cold-end ceramic plate (203) and a thermoelectric arm (202); The lower surface of the heat-conducting copper sheet (3) is in contact with and connected to the chip (1) to be cooled, the upper surface of the heat-conducting copper sheet (3) is in contact with and connected to the lower end of the heat-dissipating fin (4), the heat-dissipating fan (5) is fixedly mounted on the upper end of the heat-dissipating fin (4), and the thermoelectric cooling sheet (2) is fixedly placed at the center of the heat-conducting copper sheet (3); The cold-end ceramic sheet (203) contacts the chip (1) to be cooled, and the hot-end ceramic sheet (201) has a plurality of grooves, in which a low-melting-point alloy (6) is placed. A groove of any hot end ceramic sheet (201) is selected as a channel for the low melting point alloy (6) to contact the thermoelectric arm (202), and a copper block (7) is installed between the low melting point alloy (6) and the thermoelectric arm (202) for conducting electricity and heat; The power line of the thermoelectric cooling plate (2) passes through the insulating microchannel between the top of the thermoelectric cooling plate (2) and the bottom of the heat dissipation fin (4).

2. A chip self-sensing temperature control system according to claim 1, characterized in that: Interface material with good thermal conductivity is filled between contact planes of the chip (1) to be cooled, the heat-conducting copper sheet (3), the thermoelectric cooling sheet (2), and the heat dissipation fins (4) to reduce contact thermal resistance, and insulating material is filled around the power line of the thermoelectric cooling sheet (2).

3. A chip self-sensing temperature control system according to claim 1 or 2, characterized in that: The working method is as follows: the cold-end ceramic sheet (203) absorbs the heat of the local hot spot of the chip (1) to be dissipated and transfers it to the hot-end ceramic sheet (201); when the temperature of the hot-end ceramic sheet (201) rises to the melting point of the low-melting-point alloy (6), the low-melting-point alloy (6) melts and expands, contacts the bottom of the heat dissipation fin (4), transfers the heat upward, and the heat dissipation fin (4) diffuses the heat to a larger heat exchange surface, and dissipates the heat through the forced convection of the heat dissipation fan (5); at the same time, the copper block (7) conducts electricity to form a path, and the thermoelectric cooling sheet (2) starts to work, realizing precise temperature control, and effectively cooling the local hot spot of the chip (1) to be dissipated; when the temperature of the chip (1) to be dissipated drops to a certain temperature, the low-melting-point alloy (6) begins to solidify and shrink, the circuit is disconnected, and the thermoelectric cooling sheet (2) stops working, realizing "self-sensing temperature control", effectively reducing energy consumption, and avoiding overcooling.

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