Heat transfer methods, systems and fluids

Abstract

The present invention provides a heat transfer fluid, which contains 1-trifluoromethyl-1,2,2-trifluorocyclobutane (TFMCB) and is used for high temperature heat transfer applications and environmental requirements and safety requirements. The heat transfer fluid is non-flammable (and has a flash point of not less than 100°F), has low toxicity, an ODP of less than 0.01 and a GWP of 44, and the heat transfer fluid is dielectric and electrically stable.

Description

Technical Field

[0001] The present invention relates to methods and systems for removing heat from and / or adding heat to operating electronic devices and systems, thermal management of such operating electronic devices and systems, and other high temperature heat transfer applications such as secondary loop systems, organic Rankine cycle ("ORC") applications, and high temperature heat pumps. Background Art

[0002] Heat dissipation is becoming an increasingly challenging issue in many applications. For example, in portable and handheld electronic devices, the desire to achieve miniaturization while increasing functionality has increased the thermal power density of the device during operation, making the cooling of electronic components (including batteries) within the device more challenging. As computing power increases within desktop computers, data centers, and telecommunications centers, heat output also increases, which again makes thermal management of such electronic devices increasingly important. The acceleration of mobile electrification has also brought new challenges for thermal management (e.g., cabins, batteries in electric vehicles). In electric vehicles, thermal management functions are particularly important for several reasons, including the criticality of cooling the battery in a reliable, efficient and safe manner over a relatively narrow temperature range. As the demand for battery-powered vehicles with greater range and faster charging increases, the challenge of providing effective thermal battery management becomes greater.

[0003] The efficiency and effectiveness of batteries, especially those providing electrical power in electric vehicles, is a function of the operating temperature at which they operate. Therefore, a thermal management system must frequently be able to do more than simply remove heat from the battery during operation and / or charging, and it must be able to achieve cooling over a relatively narrow temperature range using equipment that is as low cost and as light as possible. This results in the need for heat transfer fluids in such systems that have a combination of physical and performance characteristics that are difficult to achieve. Additionally, in some important applications, the thermal management system must be able to add heat to the battery, especially when the vehicle is started in cold weather, which further increases the difficulty of selecting a heat transfer fluid for use in such systems.

[0004] One system commonly used for thermal management of electric vehicle batteries involves immersing the battery in a fluid for thermal management. Such systems impose an additional constraint in that the fluid used in such systems must be electronically compatible by virtue of being in close contact with the battery or other electronic device when the battery or device is operating. Generally speaking, this means that the fluid must not only be non-flammable, but must also have low conductivity and a high level of stability when in contact with the battery or other electronic components when the components are operating and at the relatively high temperatures that exist during operation. Applicants have recognized that such properties are desirable even in indirect cooling of operating electronic devices and batteries, as leakage of any such fluid could result in contact with operating electronic components.

[0005] The thermal management fluid commonly used for battery cooling (including immersion cooling) is a water / glycol combination, but other classes of materials including chlorofluorocarbons, fluorocarbons, chlorinated hydrocarbons, and hydrofluoroethers have been mentioned as being useful. See, for example, US 2018 / 0191038.

[0006] While many fluids containing compounds of the above classes, including fluorocarbons, have been used or suggested for use as refrigerants in general, those skilled in the art of thermal management of operating electronic devices will appreciate that many, if not most, of the fluorocarbons will not fully meet the desired properties for effective cooling of operating electronic systems, particularly for immersion cooling techniques. For example, US 5,026,499 discloses an azeotropic composition comprising a fluid containing 21 to 27 weight percent 1-trifluoromethyl-1,2,2-trifluorocyclobutane (TFMCB), 64 to 72 weight percent trans-dichloroethylene, and 5 to 11 weight percent methanol, and indicates that such fluids are generally used for solvents, aerosols, blowing agents, and refrigerants. However, the disclosure in US 5,026,499 does not mention or suggest the use of such azeotropic compositions in the specialized methods and systems according to the present invention, as described in detail below.

[0007] Thus, Applicants have recognized a need for thermal management methods and systems using heat transfer fluids that are environmentally acceptable, non-flammable, have low or no toxicity, have excellent thermal insulation properties, and have thermal properties that provide effective cooling and / or heating of operating electronic components over a relatively narrow temperature range using low-cost, reliable, and lightweight equipment. Thus, for example, Applicants have discovered that fluids having relatively low boiling points (e.g., less than 50° C.) are undesirable in many applications because the use of such fluids would tend to increase the cost and / or weight of cooling equipment used in many battery and / or electronic cooling applications, and may also reduce reliability, as explained below.

[0008] The Rankine cycle is a standard thermodynamic cycle generally used to generate electricity. The basic elements of a Rankine cycle system are: 1) a boiler that changes liquid to steam at high pressure; 2) a turbine that expands the steam to obtain mechanical energy; 3) a condenser that changes the low-pressure exhaust steam from the turbine to a low-pressure liquid; and 4) a pump that moves the condensate back to the boiler at high pressure.

[0009] Various working fluids have been proposed for use as working fluids in the Rankine cycle, including HFC-245fa. However, the industry would like to provide a working fluid that is environmentally acceptable, has excellent thermodynamic properties, and can operate effectively over a wide range of heat source temperatures, including, for example, at least about 200°C, such as about 200°C to about 400°C.

[0010] It would also be desirable to provide a heat transfer fluid (eg, a refrigerant) that is environmentally acceptable, has excellent thermodynamic properties, and is non-flammable. Summary of the invention

[0011] The present invention includes a method for removing heat from an article, device or fluid, the method comprising:

[0012] (a) providing a high temperature heat source; and

[0013] (b) removing heat from the high temperature heat source by evaporating a heat transfer fluid at a temperature greater than about 50°C, greater than about 55°C, or greater than about 60°C, the heat transfer fluid comprising, consisting essentially of, or consisting of 1-trifluoromethyl-1,2,2-trifluorocyclobutane (TFMCB).

[0014] The present invention includes a method for removing heat from an article, device or fluid, the method comprising:

[0015] (a) providing a high temperature heat source; and

[0016] (b) removing heat from the high temperature heat source by evaporating a heat transfer fluid comprising at least about 50 weight percent TFMCB.

[0017] The present invention includes a method for removing heat from an article, device or fluid, the method comprising:

[0018] (a) providing a high temperature heat source; and

[0019] (b) removing heat from the high temperature heat source by evaporating a heat transfer fluid comprising at least about 50 wt. % TFMCB at a temperature greater than about 50°C, greater than about 55°C, or greater than about 60°C.

[0020] The present invention includes a method for removing heat from an article, device or fluid, the method comprising:

[0021] (a) providing a high temperature heat source; and

[0022] (b) removing heat from the high temperature heat source by evaporating a heat transfer fluid consisting essentially of TFMCB at a temperature greater than about 50°C, greater than about 55°C, or greater than about 60°C.

[0023] The present invention includes a method for removing heat from an article, device or fluid, the method comprising:

[0024] (a) providing a high temperature heat source; and

[0025] (b) removing heat from the high temperature heat source by evaporating a heat transfer fluid comprised of TFMCB at a temperature greater than about 50°C, greater than about 55°C, or greater than about 60°C.

[0026] The present invention includes a method for removing heat from an article, device or fluid, the method comprising:

[0027] (a) providing a high temperature heat source; and

[0028] (b) removing heat from the high temperature heat source by adding sensible heat to a heat transfer fluid at a temperature above about 50°C, above about 55°C, or above about 60°C, wherein the heat transfer fluid comprises, consists essentially of, or consists of 1-trifluoromethyl-1,2,2-trifluorocyclobutane (TFMCB).

[0029] The present invention includes a method for removing heat from an article, device or fluid, the method comprising:

[0030] (a) providing a high temperature heat source; and

[0031] (b) removing heat from the high temperature heat source by adding sensible heat to a heat transfer liquid comprising at least about 50 weight percent 1-trifluoromethyl-1,2,2-trifluorocyclobutane (TFMCB).

[0032] The present invention includes a method for removing heat from an article, device or fluid, the method comprising:

[0033] (a) providing a high temperature heat source; and

[0034] (b) removing heat from the high temperature heat source by evaporating a heat transfer fluid comprising at least about 50 weight percent 1-trifluoromethyl-1,2,2-trifluorocyclobutane (TFMCB) at a temperature greater than about 50°C, greater than about 55°C, or greater than about 60°C.

[0035] The present invention includes a method for removing heat from an article, device or fluid, the method comprising:

[0036] (a) providing a high temperature heat source; and

[0037] (b) removing heat from the high temperature heat source by adding sensible heat to a heat transfer fluid at a temperature above about 50°C, above about 55°C, or above about 60°C, the heat transfer fluid consisting essentially of 1-trifluoromethyl-1,2,2-trifluorocyclobutane (TFMCB).

[0038] The present invention includes a method for removing heat from an article, device or fluid, the method comprising:

[0039] (a) providing a high temperature heat source; and

[0040] (b) by transferring heat to the

[0041] A heat transfer liquid adds sensible heat to remove heat from the high temperature heat source, the heat transfer liquid being non-flammable and consisting essentially of 1-trifluoromethyl-1,2,2-trifluorocyclobutane (TFMCB) and having a dielectric constant of less than 30 (<30) and a conductivity of less than 15 nS / cm (<15 nS / cm).

[0042] The present invention includes a method for removing heat from an article, device or fluid, the method comprising:

[0043] (a) providing a high temperature heat source; and

[0044] (b) removing heat from the high temperature heat source by evaporating a non-flammable heat transfer fluid at a temperature greater than about 50°C, greater than about 55°C, or greater than about 60°C, the heat transfer fluid consisting essentially of TFMCB and having a dielectric constant less than 30 (<30) and an electrical conductivity less than 15 nS / cm (<15 nS / cm).

[0045] The present invention also includes a method for removing heat from and optionally adding heat to an operating electronic device (especially including a battery), the method comprising:

[0046] (a) generating heat by operating the electronic device; and

[0047] (b) removing at least a portion of said generated heat of operation by transferring said heat to a heat transfer fluid comprising, consisting essentially of, or consisting of TFMCB.

[0048] As used herein, the term "operating electronic device" and related word forms refer to a device or component of a device that is in the process of performing its intended function by receiving and / or transmitting and / or generating electrical energy and / or electronic signals. Thus, as used herein, the term "operating electronic device" includes, for example, a battery that is in the process of providing a source of electrical energy to another component, as well as a battery that is being charged or recharged.

[0049] The present invention also includes a method for removing heat from, and optionally adding heat to, an operating electronic device, the method comprising:

[0050] (a) generating heat by operating the electronic device; and

[0051] (b) maintaining the operating electronic device immersed in a heat transfer fluid comprising, consisting essentially of, or consisting of TFMCB.

[0052] The present invention also includes a method for thermally regulating the temperature of a battery, the method comprising:

[0053] (a) providing a cell in thermal contact with a heat transfer fluid comprising, consisting essentially of, or consisting of a TFMCB;

[0054] (b) providing a secondary fluid or an article other than the battery for removing heat from the heat transfer fluid; and

[0055] (c) providing a secondary fluid or article other than the battery for adding heat to the heat transfer fluid, wherein the secondary fluid or article of step (b) may be the same as or different from the secondary fluid or article of step (c).

[0056] The present invention also includes a thermal regulation battery, the thermal regulation battery comprising:

[0057] (a) a surface of the battery that will contain at least a portion of the heat generated by the battery during operation;

[0058] (b) a heat transfer fluid in thermal contact with the surface, the heat transfer fluid comprising, consisting essentially of, or consisting of TFMCB.

[0059] As used herein, the term "thermal contact" and its related forms include direct contact with a surface as well as indirect contact through another body or fluid that facilitates the flow of heat between the surface and the fluid.

[0060] Applicants have unexpectedly discovered that TFMCBs not only meet the challenging performance requirements for high temperature heat transfer applications and for electronic cooling, but also meet stringent environmental and safety requirements. Specifically, Applicants have discovered that TFMCBs are non-flammable (and do not have a flash point below 100°F), have low toxicity, an ODP of <0.01, and a GWP of 44, and are dielectrically and electrically stable. Specifically, Applicants have determined that TFMCBs have a measured dielectric constant of 20 at 22°C as determined by ASTM D2477-07, and have a measured conductivity of less than 10 nS / cm at 22°C as determined by ASTM D 2624.

[0061] The present invention also includes heat transfer compositions comprising, and consisting essentially of, at least about 50 weight percent TFMCB and at least one co-heat transfer fluid component, wherein the at least one co-heat transfer fluid component does not reduce the boiling point to below about 50°C, below about 55°C, or below about 60°C.

[0062] The present invention also includes heat transfer compositions comprising, or consisting essentially of, at least about 50 weight percent TFMCB and at least one co-heat transfer fluid component, wherein the at least one co-heat transfer fluid component does not reduce the boiling point to below about 50°C, below about 55°C, or below about 60°C, and does not increase the electrical conductivity of the heat transfer composition to above 15 nS / cm at 22°C.

[0063] The present invention also includes heat transfer compositions comprising, or consisting essentially of, at least about 50 weight percent TFMCB and at least one co-heat transfer fluid component, wherein the at least one co-heat transfer fluid component does not reduce the boiling point to below about 50°C, below about 55°C, or below about 60°C, and does not cause the dielectric constant of the heat transfer composition to be less than about 30.

[0064] The present invention also includes heat transfer compositions comprising or consisting essentially of at least about 50 weight percent TFMCB and at least one co-heat transfer fluid component that does not render the heat transfer composition flammable.

[0065] The present invention also includes heat transfer compositions comprising or consisting essentially of at least about 50 weight percent TFMCB and at least one co-heat transfer fluid component that does not render the heat transfer composition toxic.

[0066] The present invention also includes heat transfer compositions comprising or consisting essentially of at least about 50 weight percent TFMCB and at least one co-heat transfer fluid component, provided that the at least one co-heat transfer component is of one type and is present in an amount that does not: (i) reduce the boiling point of the heat transfer fluid to below about 50°C, below about 55°C, or below about 60°C; or (ii) cause the dielectric constant of the heat transfer composition to be below about 30; or (iii) render the heat transfer composition flammable; or (iv) render the heat transfer composition toxic. Applicants believe that the selection of co-heat transfer fluids and amounts thereof can be made by one skilled in the art without undue experimentation, based on the teachings contained herein.

[0067] For example, the heat transfer fluid of the present invention may further comprise at least one co-heat transfer component selected from HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, methanol, ethanol, perfluoro(2-methyl-3-pentanone), cis-HFO-1336mzz, trans-HFO-1336mzz, HF-1234yf, HFO-1234ze(E), HFO-1233zd(E) and HFO-1233zd(Z).

[0068] The heat transfer may have a global warming potential (GWP) of no greater than about 1000.

[0069] The heat transfer fluid may be a Class 1 refrigerant, a Class A refrigerant, or a Class A1 refrigerant.

[0070] The heat transfer fluid may have a flash point greater than about 100°F (37.8°C).

[0071] The present invention also discloses a heat transfer composition comprising a heat transfer fluid and a lubricant. The lubricant can be present in an amount of about 5% by weight to about 30% by weight of the heat transfer fluid. The lubricant can include at least one lubricant selected from polyol esters (POE), polyalkylene glycols (PAG), polyalkylene glycol oils, polyvinyl ethers (PVE) and poly (alpha-olefins) (PAO). The lubricant can include at least one polyol ester (POE).

[0072] The electronic device may include a heat transfer fluid, and the method of heating or cooling may use the heat transfer fluid. The heat transfer system may include the heat transfer fluid, wherein the heat transfer system may be a vapor compression system including an evaporator, a condenser, and a compressor in fluid communication.

[0073] In another form thereof, the present invention provides a method for converting thermal energy into mechanical energy in a Rankine cycle, the method comprising the steps of: i) evaporating a heat transfer fluid with a heat source and expanding the resulting vapor; and ii) cooling the heat transfer fluid with a heat sink to condense the vapor. The heat source temperature may be from about 90°C to about 800°C, or the heat source temperature may be from about 90°C to about 1000°C.

[0074] The "Global Warming Potential" (hereinafter "GWP") was established to allow comparison of the global warming impact of different gases. It is a measure of how much energy one ton of a gas emitted in a given time period will absorb relative to one ton of carbon dioxide emitted. The greater the GWP, the warmer the earth will be made by a given gas compared to CO2 in that time period. The time period commonly used for GWP is 100 years. GWP provides a common measure - allowing analysts to add up emission estimates for different gases. See the 2014 Intergovernmental Panel on Climate Change (IPCC) Fifth Assessment Report (AR5). TFMCB has a GWP of 44 calculated from atmospheric lifetime and radiative efficiency (procedure reference: "Global Warming Potentials and Radiative Efficiencies of Halocarbons and Related Compounds: A Comprehensive Review" by Hodnebrog, Etminan, Fuglestvedt, Marston, Myhre, Nielsen, Shine, Wallington, 2013, reviews of Geophysics, vol. 51. DOI: 8755-1209 / 13 / 10.1002 / rog.20013).

[0075] LC 50 It is a measure of the acute toxicity of a compound. The acute inhalation toxicity of a compound can be assessed using the method described in the following guideline: OECD Guideline for Testing of Chemicals No. 403 "Acute Inhalation Toxicity" (2009), Method B.2. (Inhalation) Commission Regulation (EC) No. 440 / 2008. TFMCB has an LC of >19.15 mg / L 50 .

[0076] The flash point of a thermal management fluid is the lowest temperature at which the vapor of the liquid will remain burning after the ignition source is removed, as determined according to ASTM D3828. Thermal management fluids with a flash point of 100°F (37.8°C) or higher are classified as "non-flammable" according to NFPA 30: Specification for Combustible and Flammable Liquids.

[0077] In the context of thermal management compositions or fluids, "nonflammable" means a compound or composition that is determined to be nonflammable. The flash point of a thermal management composition or fluid refers to the lowest temperature at which the vapor of the composition will remain ignited after the ignition source is removed, as determined in accordance with ASTM D3828. Thermal management compositions or fluids having a flash point of not less than 100°F (37.8°C) are classified as "nonflammable" in accordance with NFPA 30: Specification for Combustible and Flammable Liquids.

[0078] In the context of refrigerant compositions, the phrase "non-toxic or low-toxic" is classified as "A" according to ASHRAE Standard 34-2016, Nomenclature and Safety Classification of Refrigerants, and is described in Annex B1 of ASHRAE Standard 34-2016.

[0079] In the context of refrigerant compositions, a compound or composition that is non-flammable and has low or no toxicity would be classified as "A1" according to ASHRAE Standard 34-2016, Nomenclature and Safety Classification of Refrigerants and is described in Annex B1 of ASHRAE Standard 34-2016.

[0080] "Capacity" is the amount of cooling (in BTU / hour) provided by the refrigerant in a refrigeration system. This is determined experimentally by multiplying the enthalpy change (in BTU / lb) of the refrigerant as it passes through the evaporator by the mass flow rate of the refrigerant. The enthalpy can be determined by measurements of the pressure and temperature of the refrigerant. The capacity of a refrigeration system relates to the ability to keep an area cooled at a specific temperature. The capacity of a refrigerant represents the amount of cooling or heating it provides, and provides some measure of the ability of the compressor to pump heat for a given volume flow of refrigerant. In other words, given a specific compressor, a refrigerant with a higher capacity will deliver more cooling or heating power.

[0081] "Coefficient of performance" (hereinafter referred to as "COP") is a measure of generally accepted refrigerant performance, and is particularly useful for representing the relative thermodynamic efficiency of a refrigerant in a specific heating or cooling cycle involving refrigerant evaporation or condensation. In refrigeration engineering, the term represents the ratio of available refrigeration or cooling capacity to the energy applied by the compressor when compressing vapor, and therefore represents the ability of a given compressor to pump heat for a given volume flow of heat transfer fluid such as a refrigerant. In other words, given a specific compressor, a refrigerant with a higher COP will deliver more cooling or heating power. A method for estimating the COP of a refrigerant under specific operating conditions is to estimate from the thermodynamic properties of the refrigerant using standard refrigeration cycle analysis techniques (see, for example, RC Downing, Fluorocarbon Refrigerants Handbook, Chapter 3, Prentice-Hall, 1988, which is incorporated herein by reference in its entirety).

[0082] "Thermal efficiency" is a measure of how efficiently energy from a heat source can be converted to work. This property is generally used to characterize the performance of an organic Rankine cycle system, very similar to the COP used to measure the efficiency of a vapor compression system. One method for estimating the COP of a refrigerant under specific operating conditions is to estimate it from the thermodynamic properties of the refrigerant using standard refrigeration cycle analysis techniques (see, e.g., Engineering and Chemical Thermodynamics, Milo D. Koretsky. Wiley 2004, p. 138). BRIEF DESCRIPTION OF THE DRAWINGS

[0083] Figure 1 Schematic diagram of the thermal management system of the present invention.

[0084] Figure 2A is a schematic diagram of an immersion cooling system according to the present invention.

[0085] Figure 2B FIG. 4 is a schematic diagram of another immersion cooling system according to the present invention.

[0086] Figure 3 is a graph of the data reported in Example 9.

[0087] Figure 4 FIG. 1 is a schematic diagram of a battery thermal management system according to an embodiment of the present invention.

[0088] Figure 5 is a schematic diagram of an exemplary organic Rankine cycle.

[0089] Figure 6 is a schematic diagram of an exemplary heat pump.

[0090] Figure 7 is a schematic diagram of an exemplary secondary loop system.

[0091] Figure 8 is an exemplary immersion cooling system according to Example 10. DETAILED DESCRIPTION

[0092] The heat transfer fluid may be a refrigerant or a thermal management fluid.

[0093] The compound 1-trifluoromethyl-1,2,2-trifluorocyclobutane ("TFMCB") has the following chemical structure:

[0094]

[0095] 1-Trifluoromethyl-1,2,2-trifluorocyclobutane ("TFMCB") may also be referred to by alternative names including 1,2,2-trifluoro-1-trifluoromethylcyclobutane, 1,2,2-trifluoro-1-trifluoromethylcyclobutane, 1,1,2-trifluoro-2-trifluoromethyl-cyclobutane, or hexafluoropropylene / ethylene cyclic dimer.

[0096] TFMCB may be made by any suitable method. Suitable methods include those listed in US-A-9856193 and US-A-10005705, which are incorporated herein by reference in their entirety.

[0097] Heat transfer fluid

[0098] The present invention provides various methods, processes and uses using heat transfer fluids comprising TFMCBs.

[0099] When a heat transfer fluid is used for thermal management (e.g., for electronics cooling), it is called a thermal management fluid. When a heat transfer fluid is used in a heat transfer system (e.g., a vapor compression heat transfer system), it is called a refrigerant. When a heat transfer fluid is used in an organic Rankine cycle, it is called a working fluid.

[0100] In addition to the non-heat transfer component, the heat transfer fluid may contain TFMCB in an amount of at least about 50 wt%, or at least about 70 wt%, or at least about 90 wt%, or at least about 95 wt%, or at least about 99 wt%, or the heat transfer fluid may consist essentially of or consist of TFMCB.

[0101] When the heat transfer fluid is used as a working fluid in an organic Rankine cycle, the working fluid preferably comprises at least about 50 wt % TFMCB based on the weight of the heat transfer components. Preferably, the working fluid comprises at least about 70 wt % TFMCB based on the weight of the heat transfer components, more preferably at least about 80 wt % TFMCB, more preferably at least about 90 wt % TFMCB.

[0102] In a particularly preferred feature of the invention, when the heat transfer fluid is used as a working fluid in an organic Rankine cycle, the working fluid consists essentially of TFMCB. More preferably, when the heat transfer fluid is used as a working fluid in an organic Rankine cycle, the working fluid consists of TFMCB.

[0103] Alternatively, when the heat transfer fluid is used as a working fluid in an organic Rankine cycle, the working fluid preferably comprises TFMCB, provided that the working fluid is not an azeotrope of a blend of about 21 wt % to 27 wt % TFMCB, 64 wt % to 72 wt % trans-1,2-dichloroethylene, and about 5 wt % to 11 wt % methanol, and the working fluid is not an azeotropic composition of a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % methanol or a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % ethanol.

[0104] More preferably, when the heat transfer fluid is used as a working fluid in an organic Rankine cycle, the working fluid preferably comprises at least about 50 wt % TFMCB, based on the weight of the heat transfer component, and provided that the working fluid is not an azeotropic composition of a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % methanol or a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % ethanol.

[0105] Preferably, the working fluid preferably comprises at least about 70 wt % TFMCB based on the weight of the heat transfer components, provided that the working fluid is not an azeotropic composition of a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % methanol or a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % ethanol. More preferably, the working fluid comprises at least about 80 wt % TFMCB, provided that the working fluid is not an azeotropic composition of a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % methanol or a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % ethanol.

[0106] When the heat transfer fluid is used as a refrigerant in a high temperature heat pump, the refrigerant preferably comprises TFMCB, provided that the refrigerant is not an azeotrope of a blend of about 21 wt % to 27 wt % TFMCB, 64 wt % to 72 wt % trans-1,2-dichloroethylene, and about 5 wt % to 11 wt % methanol, and the refrigerant is not an azeotropic composition of a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % methanol or a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % ethanol.

[0107] Preferably, the refrigerant comprises, excluding non-refrigerant components such as lubricants, at least about 50 wt % TFMCB, preferably at least about 70 wt % TFMCB, more preferably at least about 80 wt % TFMCB, more preferably at least about 90 wt % TFMCB, based on the weight of the refrigerant components.

[0108] In a particularly preferred feature of the invention, when the heat transfer fluid comprises a refrigerant for use in a high temperature heat pump, the refrigerant consists essentially of TFMCB. More preferably, when the heat transfer fluid is used as a refrigerant in a high temperature heat pump, the refrigerant consists of TFMCB.

[0109] More preferably, when the heat transfer fluid is used as a refrigerant in a high temperature heat pump, the refrigerant preferably comprises at least about 50 wt % TFMCB, based on the weight of the refrigerant components, and provided that the refrigerant is not an azeotropic composition of a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % methanol or a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % ethanol.

[0110] Preferably, the refrigerant preferably comprises at least about 70 wt % TFMCB based on the weight of the refrigerant components, provided that the refrigerant is not an azeotropic composition of a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % methanol or a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % ethanol. More preferably, the refrigerant preferably comprises at least about 80 wt % TFMCB, provided that the refrigerant is not an azeotropic composition of a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % methanol or a blend of about 82 wt % to 92 wt % TFMCB and about 8 wt % to 18 wt % ethanol.

[0111] The heat transfer fluid may include one or more co-fluids. For example, the heat transfer fluid may include TFMCB and one or more co-fluids selected from HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, trans-HFO-1336mzz, HF-1234yf, HFO-1234ze(E), HFO-1233zd(E), and HFO-1233zd(Z).

[0112] When the heat transfer fluid is used as the thermal management fluid, the co-fluid is preferably HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, methanol, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, HFO-1233zd(E), HFO-1233zd(Z).

[0113] When the heat transfer fluid is used as a refrigerant, the co-fluid is preferably n-pentane, cyclopentane, cis-HFO-1336mzz, trans-HFO-1336mzz, HFO-1233zd(E), HFO-1233zd(Z), HFO-1234yf, HFO-1234ze(E).

[0114] When the heat transfer fluid comprises TFMCB and a co-fluid, the heat transfer fluid may comprise TFMCB in an amount of at least about 5 wt%, or at least about 15 wt%, or at least about 50 wt%, or at least about 70 wt%, or at least about 90 wt%, or at least 95 wt%, or at least 99 wt%. One or more co-fluids may be present in an amount of at least about 5 wt% or at least about 10 wt% of the heat transfer fluid.

[0115] The heat transfer fluid may consist essentially of TFMCB and one or more co-fluids.The heat transfer fluid may consist essentially of TFMCB and one or more co-fluids.

[0116] It should be appreciated that the heat transfer fluid may consist essentially of TFMCB.It should also be appreciated that the heat transfer fluid may consist of TFMCB.

[0117] It was surprisingly found that TFMCB is non-flammable (and has no flash point) and has a GWP of about 44. This is particularly surprising because GWP and flammability are generally negatively correlated.

[0118] Thus, the present invention includes heat transfer fluids that are preferably non-flammable.

[0119] When the heat transfer fluid is a refrigerant, it will be appreciated that the refrigerant is preferably a Class 1 refrigerant.

[0120] When the heat transfer fluid is a thermal management fluid, it will be appreciated that the thermal management fluid preferably has no flash point or has a flash point above about 100°F (37.8°C).

[0121] It was also surprisingly found that TFMCB exhibited low levels of toxicity.

[0122] Therefore, the heat transfer fluid is preferably a heat transfer fluid with low or no toxicity.

[0123] When the heat transfer fluid is a refrigerant, it will be appreciated that the refrigerant is preferably a Class A refrigerant.

[0124] It is also preferred that the heat transfer fluid is non-flammable and is a low or non-toxic heat transfer fluid.

[0125] When the heat transfer fluid is a refrigerant, it will be appreciated that the refrigerant is preferably a Class A1 refrigerant and is of low or non-toxicity.

[0126] Preferably, the heat transfer fluid (and thus the thermal management fluid, working fluid, or refrigerant) has a low GWP. For example, the heat transfer fluid may have a GWP of no greater than about 1000, or no greater than about 700, or no greater than about 500, or no greater than about 300, or no greater than about 150. Preferably, the heat transfer fluid (and thus the thermal management fluid or refrigerant) has a GWP of no greater than about 150.

[0127] It will be appreciated that a heat transfer fluid (and thus a thermal management fluid, working fluid, or refrigerant) may have a combination of one or more of the above-described properties.

[0128] Heat transfer compositions

[0129] The present invention also provides heat transfer compositions comprising the heat transfer fluids of the present invention.

[0130] The heat transfer composition can include at least about 50 wt %, or at least about 70 wt %, or at least about 90 wt % of the heat transfer fluid.

[0131] The heat transfer composition may contain other components for the purpose of enhancing or providing specific functionality to the composition.

[0132] Preferably, the heat transfer composition comprises a lubricant. The lubricant lubricates a refrigeration compressor that uses a refrigerant. The lubricant can be present in the heat transfer composition in an amount of about 5% to about 30% by weight of the heat transfer composition. Lubricants such as polyol esters (POE), polyalkylene glycols (PAG), PAG oils, polyvinyl ethers (PVE) and poly(alpha-olefins) (PAO) and combinations thereof can be used in the heat transfer composition of the present invention.

[0133] Preferred lubricants include POE and PVE, more preferably POE. Of course, different mixtures of different types of lubricants can be used. For example, if the refrigerant is used in a mobile air conditioning application, the lubricant may be PAG.

[0134] Thus, the heat transfer composition comprises the refrigerant of the present invention and a lubricant selected from POE, PAG or PVE.

[0135] The heat transfer compositions of the present invention may consist essentially of, or consist of, the heat transfer fluids and lubricants described herein.

[0136] Commercially available mineral oils include Witco LP 250 (registered trademark) from Witco, Zerol 300 (registered trademark) from Shrieve Chemical, Sunisco 3GS from Witco, and Calumet R015 from Calumet. Commercially available alkylbenzene lubricants include Zerol 150 (registered trademark). Commercially available esters include neopentyl glycol dipelargonate obtained as Emery 2917 (registered trademark) and Hatcol 2370 (registered trademark). Other available esters include phosphates, dibasic acid esters, and fluoroesters.

[0137] The heat transfer composition may include a compatibilizer to aid in compatibility and / or solubility of the lubricant. Suitable compatibilizers may include propane, butane, pentane and / or hexane. When present, the compatibilizer is preferably present in an amount of about 0.5% to about 5% by weight of the heat transfer composition. Combinations of surfactants and solubilizers may also be added to the compositions of the present invention to aid in oil solubility, as disclosed in U.S. Pat. No. 6,516,837, the disclosure of which is incorporated by reference.

[0138] Purpose, method and system

[0139] The present invention includes methods for transferring heat as described herein, including methods as described in detail above and below.

[0140] The present invention also includes devices and systems for transferring heat as described herein, including devices and systems as described in detail above and below.

[0141] The heat transfer fluids, thermal management fluids, refrigerants, working fluids, and heat transfer compositions of the present invention are provided for use in heating and / or cooling, as described below.

[0142] Thus, the present invention describes methods of heating or cooling a fluid or body using the heat transfer fluids, thermal management fluids, refrigerants, working fluids, or heat transfer compositions of the present invention.

[0143] Thermal management method, device, system and use .

[0144] In nearly every modern application of electronic devices, heat dissipation is an important consideration. For example, in portable and handheld devices, the desire to achieve miniaturization while increasing functionality has increased thermal power density, making the cooling of electronic components within the device more challenging. As computing power increases within desktop computers, data centers, and telecommunication centers, heat output also increases. Power electronics such as plug-in electric or hybrid vehicles, wind turbines, train engines, generators, and traction inverters in various industrial processes utilize transistors that operate at increasingly higher currents and heat fluxes.

[0145] As described above, when a heat transfer fluid as described above is used in a method or device or system for cooling and / or heating an electronic device, it is sometimes referred to herein as a thermal management fluid. Therefore, the thermal management fluid corresponds to the heat transfer fluid discussed in this patent application. All preferred features of the heat transfer fluid described apply to the thermal insulation fluid as described herein.

[0146] Now combine Figure 1 A preferred embodiment of the thermal management method of the present invention is described, in which an operating electronic device is schematically shown as 10, which has source electrical energy and / or signals 20 flowing into and / or out of the device 10, and generates heat due to its operation based on the electrical energy and / or signals 20. The thermal management fluid of the present invention is arranged in thermal contact with the operating device 20 so that it removes heat as represented by the outflow arrow 30. Heat is removed from the operating electronic device by adding sensible heat to the liquid thermal management fluid of the present invention (i.e., increasing the temperature of the liquid), or by causing a phase change of the thermal management liquid (i.e., evaporating the liquid), or a combination of these. In a preferred embodiment, the method provides a supply of heat transfer fluid to the device 10 so that the heat flow from the device 10 through the heat transfer fluid 30 of the present invention maintains the operating electronic device at or within a preferred operating temperature range. In a preferred embodiment, the preferred operating temperature range of the electronic device is from about 70°C to about 150°C, and even more preferably from about 70°C to about 120°C, and the heat flow 30 of the energy from the device 10 flowing through the heat transfer fluid of the present invention maintains the operating electronic device at or within such preferred temperature range. Preferably, the heat transfer fluid 30 of the present invention that has absorbed heat from the device is in thermal contact with a heat sink (schematically represented as 40) at a temperature lower than the temperature of the heat transfer fluid 30, thereby transferring the heat generated by the device 10 to the heat sink 40. In this way, the heat-depleted heat transfer fluid 50 of the present invention can be returned to the electronic device 10 to repeat the cooling cycle.

[0147] In a preferred embodiment of the method of the present invention, the step of removing heat by means of the heat transfer composition of the present invention comprises evaporating the heat transfer fluid of the present invention using heat generated by the operation of the electronic device, and the step of transferring heat from the heat transfer composition to the heat sink comprises condensing the heat transfer fluid by rejecting the heat to the heat sink. In such methods, the temperature of the heat transfer fluid during the evaporation step is above 50°C, or preferably above about 55°C, or preferably in the range of about 55°C to about 85°C, or preferably about 65°C to about 75°C. Applicants have found that the heat transfer fluids of the present invention provide excellent performance in such methods, while at the same time allowing the use of relatively low-cost, lightweight and reliable equipment to provide the necessary cooling, as will be described in conjunction with the following Figure 2A The specific embodiments are further described.

[0148] In another preferred embodiment of the method of the present invention, the step of removing heat by means of the heat transfer composition of the present invention comprises the step of adding sensible heat to the liquid heat transfer composition of the present invention by using the heat generated by the operation of the electronic device (e.g., raising the temperature of the liquid to a maximum of about 70°C or less at about atmospheric pressure, i.e., wherein the fluid is not required to be in a high pressure container or vessel), and transferring the heat from the heat transfer composition to a heat sink thereby reducing the temperature of the liquid by rejecting the heat to the heat sink. The cooled liquid is then returned to thermal contact with the electronic device, wherein the cycle restarts. In a preferred embodiment, the temperature of the heat transfer liquid whose heat is transferred to the heat sink is above 50°C, or preferably above about 55°C, or preferably in the range of about 45°C to about 70°C, or preferably in the range of about 45°C to about 65°C, and is preferably at a pressure of about atmospheric pressure. Applicants have found that the heat transfer fluids of the present invention provide excellent performance in such methods, while at the same time allowing the use of relatively low cost, lightweight and reliable equipment to provide the necessary cooling, as will be described in conjunction with the following. Figure 2B The specific embodiments are further described.

[0149] It will be appreciated by those skilled in the art that the present invention includes systems and methods that utilize both sensible heat transfer and phase change heat transfer as described above.

[0150] Now combine Figure 2A and Figure 2BA specific method according to the present invention is described wherein an electronic device 10 is contained in a suitable container 12, and preferably in a sealed container, and is in direct contact with, and preferably completely immersed in, a liquid heat transfer composition 11A of the present invention (schematically shown by gray shading). The operating electronic device 10 has a source of electrical energy and / or signals 20 flowing into and / or out of the container 12 and into and / or out of the device 10, which generates heat due to its operation based on the electrical energy and / or signals 20. Those skilled in the art will appreciate that discovering a heat transfer fluid that can operate effectively in such applications is a significant challenge, as the fluid must not only provide all of the other properties described above, but must also be able to do so while in close contact with the operating electronic device (i.e., the electronic device involving the flow of electrical current / signals). It should be understood that many fluids that might otherwise be viable in such applications will not be usable because they will short the device, degrade when exposed to conditions created by the operation of the electronic device, or have some other property that is detrimental to operation when in contact with the operating electronic device.

[0151] In contrast, the method of the present invention produces superior results by bringing the thermal management fluid of the present invention into direct thermal and physical contact with the device 10 while it is operating. This operating heat is safely and efficiently transferred to the thermal management fluid 11A by: (a) evaporating the liquid phase of the fluid and forming vapor 11B; or (b) raising the temperature of the liquid thermal management fluid 11A; or (c) a combination of (a) and (b).

[0152] With respect to the phase change heat transfer system of the present invention, reference is made herein to Figure 2A . In such operation, heat is removed from the device 10 as the liquid evaporates and the vapor rises through the remaining thermal management liquid in the container 12. The thermal management fluid vapor 11B then discharges the heat it has absorbed to the heat sink 40, which can be a closed heat sink 40A and / or an external heat sink 40B. An example of a heat sink inside the container 12 is the condenser coils 30A and 30B, which have a circulating liquid, such as water, at a temperature below the condensation temperature of the thermal management fluid vapor. An example of a heat sink outside the container 12 would be to pass relatively cool ambient air over the container 12 (in which case preferably including fins or the like), which would serve to condense the heat transfer vapor 11B on the inner surface of the container. As a result of this condensation, the liquid thermal management fluid returns to the pool of liquid fluid 11A, in which the device 10 remains immersed during operation.

[0153] With respect to the sensible heat transfer system of the present invention, reference is made herein to Figure 2B. In such operation, as the temperature of the liquid increases as it receives heat generated by the equipment, heat is removed from the equipment, which is immersed, and preferably substantially completely immersed, in the thermal management fluid 11A of the present invention. The higher temperature thermal management fluid liquid 11A then discharges the heat it has absorbed to a radiator 40, which may be a closed radiator 40A and / or an external radiator 40B. An example of a radiator inside the container 12 is cooling coils 30A and 30B, which have a circulating liquid, such as water, at a temperature lower than the temperature of the heated liquid. An example of a radiator external to the container 12 would remove the heated liquid 11A from the container via conduit 45, in which the heated liquid is in thermal contact with a cooling fluid, such as may be provided by relatively cool ambient air or a refrigerant, which would serve to reduce the temperature of the liquid. The cooled liquid is then returned via conduit 46.

[0154] Optionally but preferably, in certain embodiments involving thermal management of batteries for electric vehicles, the thermal management system includes a heating element capable of heating a thermal management fluid, such as, for example, an electric heating element 60 also immersed in the thermal management fluid. Those skilled in the art will appreciate that the battery in an electric vehicle (which will correspond to Figure 2A and Figure 2B The electronic device 10 in operation in many geographic locations may reach relatively low temperatures when parked outside of the winter months, and in many cases such low temperature conditions are undesirable for battery operation. Therefore, the thermal management system of the present invention may include a sensor and control module (not shown) that turns on the heating element when the battery temperature is below a predetermined level. In this case, the heater 60 will be activated, the thermal management fluid 11A will be heated, and the heat will then be transferred to the electronic device 10 until a minimum temperature is reached. Thereafter, during operation, the thermal management fluid of the present invention will perform the cooling function as described above.

[0155] For purposes of the present invention, the thermal management fluid may be in direct contact with the heat generating component or in indirect contact with the heat generating component.

[0156] When the thermal management fluid is in indirect contact with a heat generating component, the thermal management fluid may be used in a closed system in an electronic device, which closed system may include at least two heat exchangers. When the thermal management fluid is used to cool a heat generating component, heat may be transferred from the component to the thermal management fluid, typically through a heat exchanger in contact with at least a portion of the component, or the heat may be transferred to circulating air, which may conduct the heat to a heat exchanger in thermal contact with the thermal management fluid.

[0157] In a particularly preferred feature of the present invention, the thermal management fluid is in direct contact with the heat generating component. Specifically, the heat generating component is fully or partially immersed in the thermal management fluid. Preferably, the heat generating component is fully immersed in the thermal management fluid. The thermal management fluid as a warm fluid or as a vapor can then be circulated to a heat exchanger, which obtains heat from the fluid or vapor and transfers the heat to the external environment. After this heat transfer, the cooled thermal management fluid (either cooled or condensed) is recirculated back into the system to cool the heat generating component.

[0158] When the thermal management fluid is a single-phase liquid, it will remain a liquid when heated by the heat generating component. Thus, the thermal management fluid can be brought into contact with the heat generating component, resulting in the removal of heat from the heat generating component and the production of a thermal management fluid having a higher temperature. The thermal management fluid is then delivered to a secondary cooling loop, such as a radiator or another refrigeration system. An example of such a system is shown in FIG2 , where the thermal management fluid enters a battery pack housing housing a plurality of battery cells and exits the housing, thereby absorbing heat from the battery pack.

[0159] When the thermal management fluid has two phases, the heat generating component is in thermal contact with the thermal management fluid and transfers heat to the thermal management fluid, causing the thermal management fluid to boil. The thermal management fluid then condenses. An example of such a system is one in which the heat generating component is immersed in the thermal management fluid and an external cooling circuit condenses the boiling fluid into a liquid state.

[0160] The electrical conductivity of the thermal management fluid becomes important if the fluid is in direct contact with electronic components of the electronic device (such as with direct immersion cooling), or if the thermal management fluid leaks from a cooling loop or spills during maintenance and comes into contact with the circuitry. Therefore, the thermal management fluid is preferably an electrically insulating thermal management fluid.

[0161] The thermal management fluid may be recirculated in the device either passively or actively, for example by using mechanical means such as a pump. In a preferred feature of the invention, the thermal management fluid is passively recirculated in the device.

[0162] The passive recirculation system works by transferring heat from the heat generating component to the thermal management fluid until it is typically vaporized, thereby allowing the heated vapor to travel to the heat exchange surface where it transfers its heat to the heat exchanger surface and condenses back into a liquid. It should be understood that the heat exchange surface may be part of a separate heat exchange unit and / or may be integral to the container, as described above, for example, in conjunction with Figure 2. The condensed liquid is then preferably returned to the thermal management fluid in contact with the heat generating component entirely passively by gravity. Therefore, in a preferred feature of the invention, the step of transferring heat from the heat generating component to the thermal management fluid causes the thermal management fluid to evaporate.

[0163] Examples of passive recirculation systems include heat pipes or thermosyphons. Such systems utilize gravity to passively recirculate the thermal management fluid. In such systems, the thermal management fluid is heated by the heat generating components, thereby producing a heated thermal management fluid with a lower density and greater buoyancy. The thermal management fluid travels to a storage container, such as a tank, where the thermal management fluid is cooled and condensed. The cooled thermal management fluid then flows back to the heat source.

[0164] The electronic device includes a heat generating component. The heat generating component can be any component including an electronic element that generates heat as part of its operation. For the purposes of the present invention, the heat generating component can be selected from semiconductor integrated circuits (ICs), electrochemical cells, power transistors, resistors and electroluminescent elements, such as microprocessors, wafers for manufacturing semiconductor devices, power control semiconductors, distribution switchgear, power transformers, circuit boards, multi-chip modules, packaged or unpackaged semiconductor devices, semiconductor integrated circuits, fuel cells, lasers (conventional or laser diodes), light emitting diodes (LEDs) and electrochemical cells such as for high power applications such as hybrid vehicles or electric vehicles.

[0165] For the purposes of the present invention, the electronic device may be selected from a personal computer, a microprocessor, a server, a mobile phone, a tablet computer, a digital home appliance (e.g. a television, a media player, a game console, etc.), a personal digital assistant, a data center, a battery in a stationary battery and a vehicle, a hybrid vehicle or an electric vehicle, a wind turbine, a train engine or a generator. Preferably, the electronic device is a hybrid vehicle or an electric vehicle.

[0166] The invention also relates to an electronic device comprising the thermal management fluid of the invention.For the purpose of the invention, a thermal management fluid for cooling and / or heating an electronic device is provided.

[0167] The invention also relates to an electronic device comprising a heat generating component and the thermal management fluid of the invention.For the purposes of the invention, the electronic device may also comprise a heat exchanger, in particular if the heat exchanger is in contact with at least a portion of the heat generating component.

[0168] The invention also relates to an electronic device comprising a heat generating component, a heat exchanger, a pump and the thermal management fluid of the invention.

[0169] For the purposes of the present invention, heat generating components may be selected from semiconductor integrated circuits (ICs), electrochemical cells, power transistors, resistors and electroluminescent elements, such as microprocessors, wafers for manufacturing semiconductor devices, power control semiconductors, distribution switchgear, power transformers, circuit boards, multi-chip modules, packaged or unpackaged semiconductor devices, semiconductor integrated circuits, fuel cells, lasers (conventional or laser diodes), light emitting diodes (LEDs) and electrochemical cells, for example, for high power applications such as, for example, hybrid vehicles or electric vehicles.

[0170] For the purposes of the present invention, the electronic device can be selected from personal computers, microprocessors, servers, mobile phones, tablet computers, digital home appliances (such as televisions, media players, game consoles, etc.), personal digital assistants, data centers, hybrid vehicles or electric vehicles, stationary batteries and batteries in vehicles, wind turbines, train engines or generators, preferably wherein the electronic device is a hybrid vehicle or an electric vehicle.

[0171] The present invention also relates to the use of the thermal management fluid of the present invention for cooling electronic devices. For the purposes of the present invention, the electronic device may be selected from personal computers, microprocessors, servers, mobile phones, tablet computers, digital home appliances (e.g. televisions, media players, game consoles, etc.), personal digital assistants, data centers, hybrid or electric vehicles, stationary batteries and batteries in vehicles, wind turbines, train engines or generators, preferably wherein the electronic device is a hybrid or electric vehicle.

[0172] Uses of refrigerants and heat transfer compositions

[0173] The present invention also provides a heat transfer system comprising the refrigerant or heat transfer composition of the present invention.It should be understood that the heat transfer system described herein may be a vapor compression system having an evaporator, a condenser and a compressor in fluid communication.

[0174] The refrigerant or heat transfer composition of the present invention may be used as a secondary fluid.

[0175] It will be appreciated that the refrigerant or heat transfer compositions of the present invention may be used in a variety of different heat transfer applications.

[0176] Organic Rankine Cycle

[0177] As mentioned above, when a heat transfer fluid as described above is used in an organic Rankine cycle, it is referred to as a working fluid. Thus, the working fluid corresponds to the heat transfer fluid discussed in this patent application. All preferred features of the heat transfer fluid apply to the working fluid as described herein.

[0178] It is known that the Rankine cycle system is a simple and robust device for converting thermal energy into mechanical shaft energy. In industrial environments, flammable working fluids (such as toluene and pentane) may be used, especially when the industrial environment already has a large amount of combustibles on site in the process or storage. However, in situations where the risks associated with the use of flammable and / or toxic working fluids are unacceptable, such as power generation in populated areas or near buildings, non-flammable and / or non-toxic refrigerants must be used as working fluids. There is also a drive in industry to make these materials environmentally acceptable in terms of GWP.

[0179] The method for recovering waste heat in an organic Rankine cycle involves pumping a liquid-phase working fluid through a boiler, where an external (waste) heat source (such as a process stream) heats the working fluid, causing it to evaporate into a saturated or superheated vapor. This vapor is expanded through a turbine, where the waste heat energy is converted into mechanical energy. Subsequently, the gas-phase working fluid is condensed into a liquid and pumped back into the boiler to repeat the regeneration cycle.

[0180] See also Figure 6 In the exemplary organic Rankine cycle system 70, the working fluid circulates between an evaporator device 71 and a condenser 75, wherein a pump device 72 and an expansion device 74 are functionally disposed therebetween. In the illustrated embodiment, an external fluid flow is directed to the evaporator 71 via an external warm conduit 76. The external warm conduit 76 may carry a fluid from a warm heat source, such as a waste heat source from an industrial process (e.g., power generation), flue gas, exhaust gas, geothermal source, etc.

[0181] The evaporator 71 is configured as a heat exchanger, which may include, for example, a series of thermally connected but fluidically isolated tubes that carry fluid from the warm conduit 76 and fluid from the working fluid conduit 77B, respectively. Thus, the evaporator 71 facilitates the transfer of heat Q to the working fluid conduit 77B. IN Transfer is made from the warm fluid arriving from the external warm conduit 76 to the relatively cooler (eg, “cold”) working fluid arriving from the expansion device 74 .

[0182] The working fluid discharged from the evaporator 71 has thus absorbed heat Q IN The working fluid is heated and then travels through working fluid conduit 78A to pump 72. Pump 72 pressurizes the working fluid, thereby further warming the fluid through external energy input (e.g., electricity). The resulting "hot" fluid is transferred to the input of condenser 75 via conduit 78B, optionally via regenerator 73 as described below.

[0183] Condenser 75 is constructed as a heat exchanger similar to evaporator 71 and may include, for example, a series of thermally connected but fluidically isolated tubes that carry fluid from cooling conduit 79 and fluid from working fluid conduit 78B, respectively. Condenser 75 facilitates transferring heat Q to working fluid conduit 78B. OUT Transfer from the cooling fluid arriving from the external cooling conduit 79 to the relatively warm (eg, “hot”) working fluid arriving from the pump 72 .

[0184] The working fluid discharged from the condenser 75 has therefore been lost through heat Q OUT The evaporator 71 is cooled and then travels through the working fluid conduit 77A to the expansion device 74. The expansion device 74 allows the working fluid to expand, thereby further cooling the fluid. At this stage, the fluid can perform work, such as by driving a turbine. The resulting "cold" fluid is passed to the input of the evaporator 71 via conduit 77B, optionally via the regenerator 73 described below, and the cycle begins again.

[0185] Thus, working fluid conduits 77A, 77B, 78A, and 78B define a closed loop such that the working fluid contained therein may be reused indefinitely, or until routine maintenance is required.

[0186] In the illustrated embodiment, the regenerator 73 may be functionally disposed between the evaporator 71 and the condenser 75. The regenerator 73 allows the "hot" working fluid discharged from the pump 72 to exchange some heat with the "cold" working fluid discharged from the expansion device 74, and there may be a time lag between the heat deposition from the hot working fluid and the release of the heat to the cold working fluid. In some applications, this can increase the overall thermal efficiency of the Rankine cycle system 70.

[0187] Thus, the present invention relates to an organic Rankine cycle comprising the working fluid of the present invention.

[0188] The invention also relates to the use of the working fluid of the invention in an organic Rankine cycle.

[0189] The present invention also provides a method for converting thermal energy into mechanical energy in a Rankine cycle, the method comprising the steps of: i) evaporating a working fluid of the present invention using a heat source and expanding the resulting vapor; and then ii) cooling the working fluid using a heat sink to condense the vapor, wherein the working fluid is a refrigerant or heat transfer composition of the present invention.

[0190] The mechanical work may be transferred to an electrical device such as a generator to produce electricity.

[0191] The heat source can be provided by a thermal energy source selected from industrial waste heat, solar energy, geothermal hot water, low-pressure steam, distributed power generation equipment using fuel cells, prime movers or internal combustion engines. Low-pressure steam is low-pressure geothermal steam or provided by a power plant powered by fossil fuels.

[0192] The heat source is preferably provided by a thermal energy source selected from industrial waste heat or an internal combustion engine.

[0193] It should be appreciated that heat source temperatures may vary widely, such as from about 90°C to >800°C, and may depend on many factors for certain combustion gases and some fuel cells, including geographic location, time of year, etc.

[0194] The source temperature of systems based on sources such as wastewater or low pressure steam (from, for example, plastic manufacturing plants and / or from chemical or other industrial plants, refineries) and related word forms, as well as geothermal sources, can be equal to or below about 175° C. or equal to or below about 100° C., and in some cases as low as about 90° C. or even as low as about 80° C. The source temperature of gaseous heat sources (such as exhaust gases from combustion processes or from any heat source where subsequent treatment for removal of particulates and / or corrosive materials results in low temperatures) can also be equal to or below 200° C., equal to or below about 175° C., equal to or below about 130° C., equal to or below about 120° C., equal to or below about 100° C., equal to or below about 100° C., and in some cases as low as about 90° C. or even as low as about 80° C.

[0195] However, it is preferred that the heat source has a temperature of at least about 200°C, such as about 200°C to about 400°C.

[0196] In an alternative preferred embodiment, the heat source has a temperature of 400°C to 800°C, more preferably 400°C to 600°C.

[0197] Heat Pump

[0198] As mentioned above, when a heat transfer fluid as described above is used in a heat pump, it is called a refrigerant. Therefore, the refrigerant corresponds to the heat transfer fluid discussed in this patent application. All preferred features of the heat transfer fluid described apply to the refrigerant as described here.

[0199] The refrigerant or heat transfer composition of the present invention may be used in a high temperature heat pump system.

[0200] See also Figure 6 In an exemplary heat pump system, a compressor 80 (such as a rotary compressor, a piston compressor, a screw compressor, or a scroll compressor) compresses the refrigerant delivered to a condenser 82 to transfer heat Q OUT The refrigerant is then released to the first location and then passes through the expansion device 84 to reduce the refrigerant pressure, and then passes through the evaporator 86 to absorb heat Q from the second location. IN The refrigerant is then sent back to the compressor 80 for compression.

[0201] The present invention provides a method for heating a fluid or a body using a high temperature heat pump, the method comprising the steps of: (a) condensing the refrigerant composition of the present invention in the vicinity of the fluid or body to be heated; and (b) evaporating the refrigerant.

[0202] Examples of high temperature heat pumps include heat pump tumble dryers or industrial heat pumps. It should be understood that the heat pump may include a suction line / liquid line heat exchanger (SL-LL HX). By "high temperature heat pump" is meant a heat pump capable of generating a temperature of at least about 80°C, preferably at least about 90°C, preferably at least about 100°C, more preferably at least about 110°C.

[0203] Secondary circuit system

[0204] As mentioned above, when a heat transfer fluid as described above is used in a secondary circuit system, it is called a refrigerant. Therefore, the refrigerant corresponds to the heat transfer fluid discussed in this patent application. All preferred features of the heat transfer fluid as described in Section 1 apply to the refrigerant as described here.

[0205] The refrigerant of the present invention may be used as a secondary refrigerant fluid in a secondary loop system.

[0206] The secondary loop system includes a primary vapor compression system loop that uses a primary refrigerant and whose evaporator cools a secondary loop fluid. The secondary refrigerant fluid then provides the necessary cooling for the application. The secondary refrigerant fluid must be non-flammable and have low toxicity because the fluid in such a loop is potentially exposed to humans near the cooled space. In other words, the refrigerant or heat transfer composition of the present invention can be used as a "secondary refrigerant fluid" in a secondary loop system.

[0207] See also Figure 7 An exemplary secondary circuit system includes a primary circuit 90 and a secondary circuit 92. In the primary circuit 90, a compressor 94 (such as a rotary compressor, a piston compressor, a screw compressor, or a scroll compressor) compresses a primary refrigerant, which is sent to a condenser 96 to transfer heat Q OUT The primary refrigerant is then released to the first position and then passes through the expansion device 98 to reduce the refrigerant pressure and then passes through the refrigerant / secondary fluid heat exchanger 100 to exchange heat Q with the secondary fluid. IN , wherein the secondary fluid is pumped through the secondary loop 92 via pump 102 to the secondary loop heat exchanger 104 to exchange heat with another location, such as absorbing heat Q IN-S To provide cooling to another location.

[0208] The primary fluid used in the primary loop (vapor compression cycle, external / outdoor part of the loop) can be selected from but not limited to HFO-1234ze(E), HFO-1234yf, propane, R455A, R32, R466A, R44B, R290, R717, R452B, R448A and R449A, preferably HFO-1234ze(E), HFO-1234yf or propane.

[0209] Secondary circuit systems can be used in refrigeration or air conditioning applications, i.e.

[0210] The secondary loop system may be a secondary loop refrigeration system or a secondary loop air conditioning system.

[0211] Examples of refrigeration systems that may include secondary loop refrigeration systems include:

[0212] Low temperature refrigeration system,

[0213] Medium temperature refrigeration system,

[0214] Commercial refrigerators,

[0215] Commercial freezers,

[0216] Industrial freezers,

[0217] Industrial refrigeration and

[0218] Cooler.

[0219] Examples of air conditioning systems that may include a secondary loop air conditioning system include mobile air conditioning systems or stationary air conditioning systems. Mobile air conditioning systems include air conditioning for road vehicles such as cars, trucks and buses, as well as air conditioning for boats and trains, for example, where the vehicle includes a battery or power source.

[0220] Examples of stationary air conditioning systems include:

[0221] a cooler, in particular a positive displacement cooler, more particularly an air-cooled or water-cooled direct expansion cooler, the cooler being modular or conventionally individually packaged,

[0222] Residential air conditioning systems, especially ducted split or ductless split air conditioning systems,

[0223] Residential heat pumps,

[0224] Residential air-to-water heat pump / hydronic heating systems,

[0225] Industrial air conditioning systems,

[0226] Commercial air conditioning systems, particularly packaged rooftop units and variable refrigerant flow (VRF) systems,

[0227] Commercial air source, water source or ground source heat pump system.

[0228] According to the present invention, a particularly preferred heat transfer system is a motor vehicle air conditioning system comprising a vapor compression system (primary loop) and a secondary loop air conditioning system, wherein the primary loop comprises HFO-1234yf as a refrigerant and the secondary loop comprises a refrigerant or a heat transfer composition according to the present invention. In particular, the secondary loop can be used to cool components in a car engine, such as a battery.

[0229] It should be appreciated that a secondary loop air conditioning or refrigeration system may include a suction line / liquid line heat exchanger (SL-LLHX).

[0230] method

[0231] The heat transfer fluids or heat transfer compositions of the present invention may be used as replacements for existing fluids.

[0232] The present invention provides a method of replacing an existing heat transfer fluid in a heat transfer system, the method comprising the steps of: (a) removing at least a portion of the existing heat transfer fluid from the system; and then (b) introducing the heat transfer fluid of the present invention into the system.

[0233] Step (a) may involve removing at least about 5 weight percent, at least about 10 weight percent, at least about 15 weight percent, at least about 50 weight percent, at least about 70 weight percent, at least about 90 weight percent, at least about 95 weight percent, at least about 99 weight percent, or at least about 99.5 weight percent, or substantially all, of the existing heat transfer fluid from the system prior to step (b).

[0234] The method may optionally include the step of flushing the system with a solvent after performing step (a) and before performing step (b).

[0235] For purposes of the present invention, heat transfer fluids may be used to replace existing fluids in electronic devices, in organic Rankine cycles, in high temperature heat pumps, or in secondary loops.

[0236] For example, the thermal management fluids of the present invention can be used as replacements for existing fluids such as HFC-4310mee, HFE-7100, and HFE-7200. Alternatively, the thermal management fluids can be used to replace water and glycols. The replacement can be done in an existing system, or in a new system designed to work with an existing fluid. Alternatively, the thermal management fluids can be used in applications that previously used existing refrigerants.

[0237] For example, the refrigerant of the present invention can be used as a substitute for existing refrigerants such as HFC-245fa, HFC-134a, HFC-404A and HFC-410A. The refrigerant can be used in applications that previously used existing refrigerants. Alternatively, the refrigerant can be used to improve existing refrigerants in existing systems. Alternatively, the refrigerant can be used in new systems designed to use existing refrigerants.

[0238] The present invention provides a method for replacing an existing refrigerant in a heat transfer system, the method comprising the steps of: (a) removing at least a portion of the existing refrigerant from the system; and then (b) introducing the refrigerant of the present invention into the system. The existing refrigerant may be selected from HFC-245fa, HFC-134a, HFC-404A and HFC-410A.

[0239] Step (a) may involve removing at least about 5 weight percent, at least about 10 weight percent, at least about 15 weight percent, at least about 50 weight percent, at least about 70 weight percent, at least about 90 weight percent, at least about 95 weight percent, at least about 99 weight percent, or at least about 99.5 weight percent of the existing refrigerant from the system prior to step (b).

[0240] The method may optionally include the step of flushing the system with a solvent after performing step (a) and before performing step (b).

[0241] Example

[0242] Example 1

[0243] Organic Rankine Cycle

[0244] This example illustrates that a TFMCB may be used as a working fluid in an organic Rankine cycle based on a comparison of estimated thermal efficiencies of various working fluids in the organic Rankine cycle.

[0245] The ORC system was assumed to contain a condenser, a pump, a boiler, and a turbine. The thermal efficiency was evaluated using the properties of each working fluid under the specified conditions for each unit operation as defined in Table 1. The results are shown in Table 1 below.

[0246] Table 1

[0247]

[0248] Condition 1 compares the thermal efficiency of TFMCB, HFC-245fa, and HFCO-1233zd(E) at the same boiler temperature of 144°C. Testing at Condition 1 shows that TFMCB has comparable thermal efficiency to HFC-245fa and HFCO-1233zd(E) at this temperature. At higher boiler temperature conditions (Condition 2), the results show that TFMCB is a more efficient working fluid than HFC-245fa and HFCO-1233zd(E).

[0249] Example 2

[0250] Heat transfer and pressure drop of TFMCB and 3M Novec 7200 in heat exchanger

[0251] The batteries of electric vehicles generate heat during operation when charging and discharging. The typical design of vehicle batteries varies between three types: cylindrical cells, pouch cells, and prismatic cells. All three types have different considerations in terms of heat transfer due to their shape. Prismatic cells and pouch cells are often used with cooling plates due to their straight outer surfaces. Cylindrical cells employ cooling straps that are in thermal contact with the outer casing of the cell. The generation of large amounts of heat during the charging and discharging of the battery can cause the temperature to rise, which can lead to reduced performance and shortened battery life.

[0252] The battery cooling plate arrangement can be used to provide active cooling to the battery and remove heat (eg, remove heat from the battery of an electric vehicle).In this example, the performance of two fluids, 3M Novec 7200 and TFMCB, was analyzed for their ability to provide cooling in a single phase heat transfer.

[0253] It will be appreciated that convective heat transfer may occur through direct contact (ie, when the battery is immersed in a fluid that may be pumped through the battery housing) or indirectly (ie, through the use of a cooling plate with a combination of convective and conductive heat transfer).

[0254] This example uses a round tube with an inner diameter of 0.55 inches to provide a cooling load of 10246 BTU / hour (3kW). The length of the tube is 30 feet (9.14m) and a pressure drop of 2.9PSI (20kPa) is assumed. The fluid temperature is 7.2°C (45°F). The internal heat transfer coefficient of the turbulent flow is determined. The mass flow rates required for the two fluids to remove the cooling load are determined. The comparative results are shown in Table 2. From the results, it can be seen that the necessary mass flow rate for the TFMCB to remove the generated heat is lower than that of the 3M Novec 7200. This indicates that the input for removing heat from the heat exchanger device is reduced. The available output (i.e., heat transfer coefficient) of the TFMCB is 7% higher than that of the 3M Novec 7200.

[0255] Table 2

[0256] Heat transfer and pressure drop in heat exchanger units

[0257] Mass flow rate Prandtl number Internal heat transfer coefficient lb / s [-] <![CDATA[BTU / (h-ft 2 -F)]]> TFMCB 0.94 9.6 324.7 3M Novec 7200 0.98 10.4 303.4 TFMCB vs. 3M Novec 7200 96％ 93％ 107％

[0258] Example 3

[0259] Thermodynamic Performance of Secondary AC Systems

[0260] The efficiency of a secondary loop air conditioning system determined by estimating the coefficient of performance (COP) was evaluated using TFMCB as the secondary refrigerant and R1234ze(E), R1234yf and propane as primary refrigerant options. The system consists of a vapor compression primary loop and a pumped two-phase secondary loop thermally connected through an internal heat exchanger. The internal heat exchanger serves as the evaporator of the primary loop and the condenser of the secondary loop. The COP was evaluated relative to the performance of R410A in the air conditioning system under the specified conditions of each unit operation using the thermodynamic properties of the primary and secondary refrigerants, as defined in Table 3A.

[0261] Table 3A - Operating Conditions

[0262]

[0263] Nomenclature: T = temperature, SC = subcooling, SH = superheating, IHX = intermediate heat exchanger, Sat = saturated

[0264] Table 3B Performance of secondary AC cycle

[0265]

[0266] • Table 3B shows the thermodynamic performance of a secondary AC system with different primary refrigerants and using TFMCB as the secondary refrigerant.

[0267] In all cases, the capacity of the secondary AC system was matched to the R410A system.

[0268] Table 3C Condensing temperature required to match the efficiency of R410A

[0269]

[0270] • To match efficiency (COP), heat transfer area can be added to the condenser, which can lower the condensing temperature and thereby improve efficiency.

[0271] • The size of the condenser is inversely proportional to the condensing temperature required for matching efficiency, so it is desirable to have a higher condensing temperature.

[0272] Table 3C shows the condensing temperatures required for matching efficiency when using different refrigerants.

[0273] Table 3D Efficiency under different environmental conditions

[0274]

[0275] • Table 3D shows the performance of secondary AC systems with different refrigerants at elevated ambient temperatures compared to 35°C ambient temperature.

[0276] As the ambient temperature increases from 35°C to 55°C, all refrigerants show a lower efficiency degradation compared to R410A.

[0277] Example 4

[0278] High temperature heat pump applications using TFMCB

[0279] High temperature heat pumps can utilize waste heat and provide high radiator temperatures. TFMCB provides efficiency benefits over R245fa at all condensing temperatures tested.

[0280] Operating conditions:

[0281] Condensation temperature varies between 90℃, 100℃ and 110℃

[0282] Supercooling: 10℃

[0283] Evaporator temperature: 25℃

[0284] Evaporator overheat: 15℃

[0285] Isentropic efficiency: 65%

[0286] Table 4

[0287] Relative heating COP at different condensing temperatures

[0288]

[0289] Example 5

[0290] Thermodynamic performance of secondary loop medium temperature refrigeration system

[0291] The efficiency of a secondary loop medium temperature refrigeration system determined by estimating the coefficient of performance (COP) was evaluated using TFMCB as the secondary refrigerant and R1234ze(E), R1234yf and propane as primary refrigerant options. The system consists of a vapor compression primary loop and a pumped two-phase secondary loop thermally connected through an internal heat exchanger. The internal heat exchanger serves as the evaporator of the primary loop and the condenser of the secondary loop. The COP was evaluated relative to the performance of R134a in the air conditioning system under the specified conditions of each unit operation using the thermodynamic properties of the primary and secondary refrigerants, as defined in Table 5A.

[0292] Therefore, a secondary medium temperature refrigeration system using the composition of the present invention can match the efficiency of R134a with system design changes while using a commercially available ultra-low GWP non-flammable refrigerant.

[0293] Table 5A - Operating Conditions

[0294]

[0295] Nomenclature: T = temperature, SC = subcooling, SH = superheating, IHX = intermediate heat exchanger, Sat = saturated

[0296] Table 5B Performance of the secondary refrigeration cycle

[0297]

[0298] Table 5B shows the thermodynamic performance of the secondary refrigeration system with different primary refrigerants and using TFMCB as the secondary refrigerant.

[0299] In all cases, the capacity of the secondary refrigeration system is matched to the R134a system.

[0300] Table 5C Condensing temperature required to match the efficiency of R134a

[0301]

[0302] • To match efficiency (COP), heat transfer area can be added to the condenser, which can lower the condensing temperature and thereby improve efficiency.

[0303] • The size of the condenser is inversely proportional to the condensing temperature required for matching efficiency, so it is desirable to have a higher condensing temperature.

[0304] Table 5C shows the condensing temperatures required for matching efficiency when using different refrigerants.

[0305] Table 5D Efficiency under different environmental conditions

[0306]

[0307] • Table 5D shows the performance of secondary refrigeration systems using different refrigerants at elevated ambient temperatures compared to 35°C ambient temperature.

[0308] As the ambient temperature increases from 35°C to 55°C, all refrigerants show similar efficiency degradation compared to R134a.

[0309] Example 6

[0310] Miscibility of TFMCB

[0311] The miscibility of TFMCB with various refrigeration lubricants was tested. The lubricants tested were polyol ester oils (Mobil EAL22cc and Solest 120) and polyalkylene glycol (PAG) oils (Toyota ND-oil 8). For each refrigerant / oil combination, three compositions were tested, namely, 5 wt%, 20 wt% and 50 wt% of the lubricant, the balance of each being the compound of the present invention to be tested.

[0312] The lubricant composition is placed in a thick-walled glass tube. The tube is evacuated, the refrigerant compound according to the present invention is added, and the tube is then sealed. The tube is then placed in an air bath environmental chamber, the temperature of which is varied between about -50°C and 70°C. The contents of the tube are visually observed at intervals of about 10°C for the presence of one or more liquid phases. In the event that more than one liquid phase is observed, the mixture is reported to be immiscible. In the event that only one liquid phase is observed, the mixture is reported to be miscible. In those cases where two liquid phases are observed but one of the liquid phases occupies only a very small volume, the mixture is reported to be partially miscible.

[0313] The polyalkylene glycol and ester oil lubricants were judged to be miscible in all proportions tested over the entire temperature range.

[0314] Example 7

[0315] Compatibility of TFMCB

[0316] The compatibility of the refrigerant compounds and compositions of the present invention with PAG lubricating oils in contact with metals used in refrigeration and air conditioning systems was determined at 350°F, which represents conditions more severe than those found in many refrigeration and air conditioning applications.

[0317] Aluminum, copper, and steel coupons were added to thick-walled glass tubes. Two grams of oil were added to the tubes. The tubes were then evacuated and one gram of refrigerant was added. The tubes were placed in an oven at 350°F for one week and visually observed. At the end of the exposure period, the tubes were removed.

[0318] This process was performed on the following combinations of oils and compounds of the invention:

[0319] a.TFMCB and Toyota ND-oil 8

[0320] b.TFFMCB and Mobil EAL 22cc

[0321] c.TFFMCB and Solest 120.

[0322] In all cases, there was minimal change in the appearance of the contents of the tube. This indicates that the compounds and compositions of the present invention are stable in contact with the types of aluminum, steel, and copper present in refrigeration and air conditioning systems, as well as lubricating oils that may be contained in or used with such compositions in these types of systems.

[0323] Example 8

[0324] Compatibility of TFMCB

[0325] The TFMCB and elastomer samples were placed in a 40 cm3 stainless steel cylinder which was heated in an oven at 80°C for a period of 14 days.

[0326]

[0327] Conclusion: The appearance of the material samples did not change overall. TFMCB showed good compatibility with plastics and elastomers.

[0328] Example 9

[0329] Sensible Heat Immersion Cooling Applications Using TFMCB

[0330] The batteries of electric vehicles generate heat during operation when charging and discharging. The typical design of vehicle batteries varies between three types: cylindrical cells, pouch cells, and prismatic cells. All three types have different considerations in terms of heat transfer due to their shape. Generating large amounts of heat during the charging and discharging of the battery can cause the temperature to rise, which can lead to reduced performance and shortened battery life.

[0331] It should be appreciated that the TFMCB is a dielectric and non-flammable fluid that allows for direct cooling of the battery cells immersed in the fluid.

[0332] This example considers a battery module consisting of 1792 18650-type cylindrical battery cells. In one case, the battery module is cooled by a 50 / 50 mixture of water / glycol in a flat tube heat exchanger in contact with the battery cells. In the other case, the battery cells are immersed in the TFMCB, i.e., in direct contact with the fluid. The waste heat of the battery module is 8750 W, which is evenly distributed over the entire number of battery cells. The assumptions and operating conditions are listed in Table 6.

[0333] From the minimum and maximum battery cell temperatures listed in Table 7 and Figure 1 As can be seen from the results visualized in Figure 3, immersion cooling using TFMCB provides lower maximum cell temperatures compared to heat exchangers using water / glycol. This has a beneficial effect on cell performance and lifetime.

[0334] Table 6

[0335] Assumptions for battery module design and operating conditions

[0336]

[0337] Table 7

[0338] The minimum and maximum battery cell temperatures in the battery module

[0339]

[0340] Example 10

[0341] Two-phase immersion cooling application using TFMCB in data centers

[0342] An example of data center cooling is provided with reference to FIG9 . A data center (generally represented as 200 ) includes a plurality of electronic subsystems 220 housed in one or more electronic racks 210 . At least one of the electronic subsystems 220 and preferably a plurality of and preferably all of the electronic subsystems are associated with a cooling station 240 , which (in one embodiment) includes a vertically extending liquid-to-gas heat exchanger 243 and a supply conduit 241 and a return conduit 242 for directing a cooling gas flow 244 across the liquid-to-gas heat exchanger 243 . A cooling subsystem 219 is associated with at least one of the plurality of electronic subsystems 220 and preferably a plurality of and preferably all of the electronic subsystems 220 . In a preferred embodiment, as shown in FIG9 , all of the subsystems 220 are associated with a cooling station 240 and a cooling subsystem 219 . Each cooling subsystem 219 (in this embodiment) includes a housing 221 (which is preferably a low pressure housing) that encloses a respective electronic subsystem 220 including a plurality of electronic components 223 . The electronic components operate as part of the data center and are produced as a result of performing their functions in the data center . By way of example, the components include printed circuit boards, microprocessor modules, and memory devices. Each electronic subsystem has a heat generating component immersed in the thermal management fluid 224 of the present invention when it is in operation. The fluid 224 boils in typical operation, producing a dielectric vapor 225 according to the present invention. In the illustrated embodiment, the electronic subsystem 220 is angled by providing an upwardly inclined support rail 222 in the electronic support 210 to accommodate the electronic subsystem 220 at an angle. The angling of the electronic subsystem as shown in the figure facilitates the buoyancy-driven circulation of the vapor 225 between the cooling subsystem 219 and the liquid-gas heat exchanger 243 of the associated local cooling station 240. However, when such an angle is not used, the excellent results according to the present invention and this embodiment are rarely obtained. Multiple coolant loops 226 connect the liquid-cooled electronic subsystem and the corresponding parts of the liquid-gas heat exchanger 243 in a fluid contact and thermal contact manner. Specifically, a plurality of tube segments 300 pass through a liquid-to-gas heat exchanger 243, which in this embodiment includes a plurality of air-cooled fins 310. Vapor 225 is driven by buoyancy from the housing 221 to a corresponding tube segment 300 of the liquid-to-gas heat exchanger 243, where the vapor condenses and is subsequently returned as liquid to the associated liquid-cooled electronic subsystem. A cooling airflow 244 is provided in parallel to supply ducts 241 to a plurality of local cooling stations 240 of the data center 200, and the heated airflow is exhausted via a return duct 242. An apparatus as described herein but without the fluid of the present invention is disclosed in US 2013 / 0019614, which is incorporated herein by reference.

[0343] The system as described above operates using a thermal management fluid consisting of a TFMCB and ambient air as a heat sink for the condenser, and the system operates to effectively, efficiently, safely and reliably maintain electronic components within a most desired operating temperature range while the system performs its function in an operating data center.

[0344] aspect

[0345] The invention will now be described by reference to the following numbered embodiments. The subject matter of the numbered embodiments may additionally be combined with subject matter from the description or one or more claims.

[0346] Numbered Embodiment 1: A heat transfer composition comprising: (a) a refrigerant component comprising at least about 50 weight percent, based on the weight of the refrigerant component, of 1-trifluoromethyl-1,2,2-trifluorocyclobutane (TFMCB).

[0347] Numbered Embodiment 2: The heat transfer composition of Numbered Embodiment 1, wherein the refrigerant component comprises TFMCB in an amount of at least about 50 wt %, based on the weight of the refrigerant component.

[0348] Numbered Embodiment 3: The heat transfer composition of Numbered Embodiment 1 or 2, wherein the refrigerant component comprises TFMCB in an amount of at least about 70 wt %, based on the weight of the refrigerant component.

[0349] Numbered Embodiment 4: The heat transfer composition of Numbered Embodiments 1 to 3, wherein the refrigerant component comprises TFMCB in an amount of at least about 90 weight percent based on the weight of the refrigerant component.

[0350] Numbered Embodiment 5: The heat transfer composition of Numbered Embodiments 1 to 4, wherein the refrigerant component comprises TFMCB in an amount of at least about 95 weight percent based on the weight of the refrigerant component.

[0351] Numbered Embodiment 6: The heat transfer composition of Numbered Embodiments 1 to 5, wherein the refrigerant component comprises TFMCB in an amount of at least about 99 weight percent based on the weight of the refrigerant component.

[0352] Numbered Embodiment 7: The heat transfer composition of Numbered Embodiments 1 through 6, wherein the refrigerant component consists essentially of TFMCB.

[0353] Numbered Embodiment 8: The heat transfer composition of numbered embodiments 1 to 7, wherein the refrigerant component consists of TFMCB.

[0354] Numbered Embodiment 9: The heat transfer composition of numbered embodiments 1 to 8, wherein the heat transfer composition further comprises a lubricant.

[0355] Numbered Embodiment 10: The heat transfer composition of Numbered Embodiment 9, wherein the lubricant is present in the heat transfer composition in an amount from about 5% to about 30% by weight of the heat transfer composition.

[0356] Numbered embodiment 11: A heat transfer composition according to numbered embodiment 9 or 10, wherein the lubricant is selected from polyol esters (POE), polyalkylene glycols (PAG), PAG oils, polyethylene ethers (PVE) and poly-alpha-olefins (PAO) and combinations thereof.

[0357] Numbered embodiment 12: The heat transfer composition of numbered embodiment 11, wherein the lubricant is POE or PVE.

[0358] Numbered embodiment 13: The heat transfer composition of numbered embodiment 11, wherein the lubricant is POE.

[0359] Numbered Embodiment 14: The heat transfer composition of Numbered Embodiment 11, wherein the lubricant is PVE.

[0360] Numbered Embodiment 15: A heat transfer composition according to any of numbered embodiments 1 to 14, wherein the heat transfer fluid further comprises one or more co-fluids selected from HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, trans-HFO-1336mzz, HF-1234yf, HFO-1234ze(E), HFO-1233zd(E) and HFO-1233zd(Z).

[0361] Numbered Embodiment 16: A heat transfer composition according to any of numbered embodiments 1 to 14, wherein the heat transfer fluid further comprises one or more co-fluids selected from HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, methanol, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, HFO-1233zd(E), HFO-1233zd(Z).

[0362] Numbered Embodiment 17: The heat transfer composition of Numbered Embodiments 15-16, wherein the one or more co-fluids are present in the heat transfer fluid in an amount of at least about 5% by weight of the heat transfer composition.

[0363] Numbered Embodiment 18: The heat transfer composition of Numbered Embodiments 15-16, wherein the one or more co-fluids are present in the heat transfer fluid in an amount of at least about 10% by weight of the heat transfer composition.

[0364] Numbered embodiment 19: The heat transfer composition according to numbered embodiments 15 to 18,

[0365] wherein the heat transfer composition consists essentially of the TFMCB and one or more co-fluids.

[0366] Numbered embodiment 20: The heat transfer composition according to numbered embodiments 15 to 18,

[0367] The heat transfer composition consists of a TFMCB and one or more co-fluids.

[0368] Numbered Embodiment 21: The heat transfer composition of any one of Numbered Embodiments 1-20, wherein the heat transfer composition is a Class 1 heat transfer fluid.

[0369] Numbered Embodiment 22: The heat transfer composition of any one of Numbered Embodiments 1 to 21, wherein the heat transfer composition is a Class A refrigerant.

[0370] Numbered Embodiment 23: The heat transfer composition of any one of Numbered Embodiments 1 to 22, wherein the heat transfer composition is a Class A1 refrigerant.

[0371] Numbered Embodiment 24: The heat transfer composition of any of Numbered Embodiments 1-22, wherein the heat transfer composition has a global warming potential (GWP) of no greater than about 1000.

[0372] Numbered Embodiment 25: The heat transfer composition of any of Numbered Embodiments 1-23, wherein the heat transfer composition has a global warming potential (GWP) of no greater than about 700.

[0373] Numbered Embodiment 26: The heat transfer composition of any of Numbered Embodiments 1-23, wherein the heat transfer composition has a global warming potential (GWP) of no greater than about 500.

[0374] Numbered Embodiment 27: The heat transfer composition of any of Numbered Embodiments 1-23, wherein the heat transfer composition has a global warming potential (GWP) of no greater than about 300.

[0375] Numbered Embodiment 28: The heat transfer composition of any one of Numbered Embodiments 1-23, wherein the heat transfer composition has a global warming potential (GWP) of no greater than about 150.

[0376] Numbered implementation scheme 29: A method for cooling heat-generating components in an operating electronic device, the electronic device comprising a thermal management fluid, the thermal management fluid containing a TFMCB in thermal contact therewith, the method comprising transferring heat generated by the electronic device during operation to the thermal management fluid by evaporating the thermal management fluid.

[0377] Numbered embodiment 30: The method of numbered embodiment 29, wherein the thermal management fluid comprises TFMCB in an amount of at least about 5% by weight of the thermal management fluid.

[0378] Numbered Embodiment 31: The method of Numbered Embodiment 29, wherein the thermal-management fluid comprises TFMCB in an amount of at least about 15% by weight of the thermal-management fluid.

[0379] Numbered Embodiment 32: The method of Numbered Embodiment 29, wherein the thermal management fluid comprises TFMCB in an amount of at least about 50% by weight of the thermal management fluid.

[0380] Numbered Embodiment 33: The method of Numbered Embodiment 29, wherein the thermal management fluid comprises TFMCB in an amount of at least about 70% by weight of the thermal management fluid.

[0381] Numbered Embodiment 34: The method of Numbered Embodiment 29, wherein the thermal management fluid comprises TFMCB in an amount of at least about 90% by weight of the thermal management fluid.

[0382] Numbered Embodiment 35: The method of Numbered Embodiment 29, wherein the thermal management fluid comprises TFMCB in an amount of at least about 95% by weight of the thermal management fluid.

[0383] Numbered Embodiment 36: The method of Numbered Embodiment 29, wherein the thermal management fluid comprises TFMCB in an amount of at least about 99 weight percent of the thermal management fluid.

[0384] Numbered embodiment 37: The method of numbered embodiment 29, wherein the thermal management fluid consists essentially of TFMCB.

[0385] Numbered embodiment 38: A method according to numbered embodiment 29, wherein the thermal management fluid consists of TFMCB.

[0386] Numbered Embodiment 39: A method according to any one of numbered embodiments 29 to 36, wherein the thermal management fluid further comprises one or more co-fluids selected from HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, trans-HFO-1336mzz, HF-1234yf, HFO-1234ze(E), HFO-1233zd(E) and HFO-1233zd(Z).

[0387] Numbered embodiment 40: A method according to any one of numbered embodiments 29 to 36, wherein the thermal management fluid further comprises one or more co-fluids selected from HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, methanol, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, HFO-1233zd(E), HFO-1233zd(Z).

[0388] Numbered Embodiment 41: The method of any of Numbered Embodiments 39 to 40, wherein the one or more co-fluids are present in an amount of at least about 5 weight percent of the thermal management fluid.

[0389] Numbered Embodiment 42: The method of any of Numbered Embodiments 39 to 40, wherein the one or more co-fluids are present in an amount of at least about 10% by weight of the thermal management fluid.

[0390] Numbered Embodiment 43: The method of any of Numbered Embodiments 39 to 42, wherein the thermal management fluid consists essentially of the TFMCB and one or more co-fluids.

[0391] Numbered Embodiment 44: The method of any one of Numbered Embodiments 39 to 42, wherein the thermal management fluid consists of a TFMCB and one or more co-fluids.

[0392] Numbered Embodiment 45: The method of any one of Numbered Embodiments 29 to 44, wherein the thermal management fluid is a Class 1 refrigerant.

[0393] Numbered Embodiment 46: The method of any one of Numbered Embodiments 29 to 45, wherein the thermal management fluid is a Class A refrigerant.

[0394] Numbered Embodiment 47: The method of any one of Numbered Embodiments 29 to 46, wherein the thermal management fluid is a Class A1 refrigerant.

[0395] Numbered Embodiment 48: The method of any one of Numbered Embodiments 29 to 47, wherein the thermal management fluid does not have a flash point.

[0396] Numbered Embodiment 49: The method of any of Numbered Embodiments 29-48, wherein the thermal management fluid has a flash point greater than about 100°F (37.8°C).

[0397] Numbered embodiment 50: A method according to any one of numbered embodiments 29 to 49, wherein the thermal management fluid is an electrically insulating thermal management fluid.

[0398] Numbered Embodiment 51: The method of any of Numbered Embodiments 29-50, wherein the thermal management fluid has a global warming potential (GWP) of no greater than about 1000.

[0399] Numbered Embodiment 52: The method of any one of Numbered Embodiments 29-50, wherein the thermal management fluid has a global warming potential (GWP) of no greater than about 700.

[0400] Numbered Embodiment 53: The method of any one of Numbered Embodiments 29-50, wherein the thermal management fluid has a global warming potential (GWP) of no greater than about 500.

[0401] Numbered Embodiment 54: The method of any one of Numbered Embodiments 29-50, wherein the thermal management fluid has a global warming potential (GWP) of no greater than about 300.

[0402] Numbered Embodiment 55: The method of any one of Numbered Embodiments 29-50, wherein the thermal management fluid has a global warming potential (GWP) of no greater than about 150.

[0403] Numbered embodiment 56: A method according to any one of numbered embodiments 29 to 55, wherein

[0404] The thermal management fluid is in direct contact with heat generating components.

[0405] Numbered embodiment 57: The method of any one of numbered embodiments 29 to 56, wherein the heat generating component is immersed in a thermal management fluid.

[0406] Numbered Embodiment 58: The method of any one of Numbered Embodiments 29 to 57, wherein the step of transferring heat from the heat generating component to the thermal management fluid causes the thermal management fluid to evaporate.

[0407] Numbered embodiment 59: The method of any one of numbered embodiments 29 to 58, wherein the thermal management fluid is passively circulated in the device.

[0408] Numbered embodiment 60: The method of any one of numbered embodiments 29 to 58, wherein the thermal management fluid is actively circulated in the device, for example by using a mechanical device such as a pump.

[0409] Numbered embodiment 61: A method according to any one of numbered embodiments 29 to 60, wherein the heat generating component is selected from semiconductor integrated circuits (ICs), electrochemical cells, power transistors, resistors and electroluminescent elements, such as microprocessors, wafers for manufacturing semiconductor devices, power control semiconductors, distribution switchgear, power transformers, circuit boards, multi-chip modules, packaged or unpackaged semiconductor devices, semiconductor integrated circuits, fuel cells, lasers (conventional or laser diodes), light emitting diodes (LEDs) and electrochemical cells for high power applications such as hybrid vehicles or electric vehicles.

[0410] Embodiment 62: A method according to any one of Embodiments 29 to 61, wherein the electronic device is selected from a personal computer, a microprocessor, a server, a mobile phone, a tablet computer, a digital home appliance (such as a television, a media player, a game console, etc.), a personal digital assistant, a data center, a hybrid vehicle or an electric vehicle, a stationary battery and a battery in a vehicle, a wind turbine, a train engine or a generator, and preferably the electronic device is a hybrid vehicle or an electric vehicle.

[0411] Numbered embodiment 63: An electronic device comprising the thermal management fluid according to any one of numbered embodiments 29 to 55.

[0412] Numbered implementation scheme 64: An electronic device according to numbered implementation scheme 63, which includes a heat-generating component.

[0413] Numbered embodiment 65: An electronic device according to numbered embodiment 64, wherein the heat generating components are selected from semiconductor integrated circuits (ICs), electrochemical cells, power transistors, resistors and electroluminescent elements, such as microprocessors, chips for manufacturing semiconductor devices, power control semiconductors, distribution switchgear, power transformers, circuit boards, multi-chip modules, packaged or unpackaged semiconductor devices, semiconductor integrated circuits, fuel cells, lasers (conventional or laser diodes), light emitting diodes (LEDs) and electrochemical batteries for high power applications such as hybrid vehicles or electric vehicles.

[0414] Numbered embodiment 66: An electronic device according to any one of numbered embodiments 63 to 65, comprising at least one heat exchanger.

[0415] Numbered embodiment 67: An electronic device according to any one of numbered embodiments 63 to 66, comprising a device for actively circulating a thermal management fluid, such as a pump.

[0416] Embodiment 68: An electronic device according to any one of Embodiments 63 to 67, wherein the electronic device is selected from a personal computer, a microprocessor, a server, a mobile phone, a tablet computer, a digital home appliance (such as a television, a media player, a game console, etc.), a personal digital assistant, a data center, a hybrid vehicle or an electric vehicle, a stationary battery and a battery in a vehicle, a wind turbine, a train engine or a generator, and preferably the electronic device is a hybrid vehicle or an electric vehicle.

[0417] Numbered embodiment 69: Use of the thermal management fluid according to any one of numbered embodiments 29 to 55 for cooling a heat generating component in an electronic device according to any one of numbered embodiments 56 to 62.

[0418] Numbered embodiment 70: A method for converting thermal energy into mechanical energy in a Rankine cycle, the method comprising the steps of: i) evaporating a working fluid with a heat source and expanding the resulting vapor; and then ii) cooling the working fluid with a radiator to condense the vapor, wherein the working fluid is a heat transfer composition according to numbered embodiments 1 to 28.

[0419] Numbered embodiment 71: A method for converting thermal energy into mechanical energy in a Rankine cycle, the method comprising the steps of: i) evaporating a working fluid with a heat source and expanding the resulting vapor; and then ii) cooling the working fluid with a radiator to condense the vapor, wherein the working fluid comprises at least about 50 weight percent TFMCB.

[0420] Numbered embodiment 72: A method for converting thermal energy into mechanical energy in a Rankine cycle, the method comprising the steps of: i) evaporating a working fluid with a heat source and expanding the resulting vapor; and then ii) cooling the working fluid with a radiator to condense the vapor, wherein the working fluid comprises TFMCB, with the proviso that the working fluid is not an azeotrope of a blend of about 21 wt% to 27 wt% TFMCB, 64 wt% to 72 wt% trans-1,2-dichloroethylene, and about 5 wt% to 11 wt% methanol, and the working fluid is not an azeotropic composition of a blend of about 82 wt% to 92 wt% TFMCB and about 8 wt% to 18 wt% methanol or a blend of about 82 wt% to 92 wt% TFMCB and about 8 wt% to 18 wt% ethanol.

[0421] Numbered embodiment 73: The method of numbered embodiment 72, wherein the working fluid comprises at least about 50% by weight TFMCB.

[0422] Numbered embodiment 74: The method of numbered embodiment 72, wherein the working fluid comprises at least about 70% by weight TFMCB.

[0423] Numbered embodiment 75: The method of numbered embodiment 72, wherein the working fluid comprises at least about 80% by weight TFMCB.

[0424] Numbered embodiment 76: The method of numbered embodiment 72, wherein the working fluid comprises at least about 90% by weight TFMCB.

[0425] Numbered embodiment 77: A method according to numbered embodiment 72, wherein the working fluid consists essentially of TFMCB.

[0426] Numbered embodiment 78: A method according to numbered embodiment 72, wherein the working fluid consists of TFMCB.

[0427] Numbered embodiment 79: A method according to any one of numbered embodiments 1 to 8, wherein the working fluid further comprises one or more co-fluids selected from HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, trans-HFO-1336mzz, HF-1234yf, HFO-1234ze(E), HFO-1233zd(E) and HFO-1233zd(Z).

[0428] Numbered embodiment 80: A method according to any one of numbered embodiments 1 to 8, wherein the working fluid further comprises one or more co-fluids selected from HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, methanol, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, HFO-1233zd(E), HFO-1233zd(Z).

[0429] Numbered Embodiment 81: The method of numbered embodiments 79 to 80, wherein the one or more co-fluids are present in the working fluid in an amount of at least about 5% by weight of the working fluid.

[0430] Numbered Embodiment 82: The method of numbered embodiments 79 to 80, wherein the one or more co-fluids are present in the working fluid in an amount of at least about 10% by weight of the working fluid.

[0431] Numbered embodiment 83: The method according to numbered embodiments 79 to 82,

[0432] The working fluid is essentially composed of TFMCB and one or more co-fluids.

[0433] Numbered embodiment 84: A method according to numbered embodiments 79 to 82, wherein the working fluid consists of TFMCB and one or more co-fluids.

[0434] Numbered Embodiment 85: The method of any one of Numbered Embodiments 79 to 84, wherein the working fluid is a Class 1 refrigerant.

[0435] Numbered Embodiment 86: The method of any one of Numbered Embodiments 79 to 85, wherein the working fluid is a Class A refrigerant.

[0436] Numbered embodiment 87: The method according to any one of numbered embodiments 71 to 86, wherein the working fluid is a Class A1 refrigerant.

[0437] Numbered embodiment 88: The method of any one of numbered embodiments 71 to 87, wherein the working fluid has a global warming potential (GWP) of no greater than about 1000.

[0438] Numbered embodiment 89: The method of any one of numbered embodiments 71 to 87, wherein the working fluid has a global warming potential (GWP) of no greater than about 700.

[0439] Numbered embodiment 90: The method of any one of numbered embodiments 71 to 87, wherein the working fluid has a global warming potential (GWP) of no greater than about 500.

[0440] Numbered Embodiment 91: The method of any one of Numbered Embodiments 71 to 87, wherein the working fluid has a global warming potential (GWP) of no greater than about 300.

[0441] Numbered Embodiment 92: The method of any one of Numbered Embodiments 71 to 87, wherein the working fluid has a global warming potential (GWP) of no greater than about 150.

[0442] Numbered embodiment 93: A method according to numbered embodiments 71 to 92, wherein the mechanical work is transmitted to an electronic device such as a generator to generate electricity.

[0443] Numbered embodiment 94: A method according to numbered embodiments 71 to 93, wherein the heat source is provided by a thermal energy source selected from industrial waste heat, solar energy, geothermal hot water, low-pressure steam, distributed power generation equipment using fuel cells, prime movers or internal combustion engines.

[0444] Numbered embodiment 95: A method according to numbered embodiments 71 to 94, wherein the temperature of the heat source is about 90°C to >800°C.

[0445] Numbered embodiment 96: A method according to numbered embodiments 71 to 95, wherein the temperature of the heat source is about 400°C to 800°C.

[0446] Numbered embodiment 97: A method according to numbered embodiments 71 to 96, wherein the temperature of the heat source is about 400°C to 600°C.

[0447] Numbered embodiment 98: A method according to numbered embodiments 79 to 97, wherein the temperature of the heat source is at least about 200°C, such as about 200°C to about 400°C.

[0448] Numbered embodiment 99: An organic Rankine cycle comprising a working fluid according to numbered embodiments 71 to 92, or a heat transfer composition according to aspects 1 to 28.

[0449] Numbered embodiment 100: A high temperature heat pump comprising the heat transfer composition of aspects 1 to 28.

[0450] Numbered embodiment 101: A high temperature heat pump comprising a refrigerant, wherein the refrigerant comprises TFMCB, provided that the refrigerant is not an azeotrope of a blend of about 21 wt% to 27 wt% TFMCB, 64 wt% to 72 wt% trans-1,2-dichloroethylene, and about 5 wt% to 11 wt% methanol, and the refrigerant is not an azeotropic composition of a blend of about 82 wt% to 92 wt% TFMCB and about 8 wt% to 18 wt% methanol or a blend of about 82 wt% to 92 wt% TFMCB and about 8 wt% to 18 wt% ethanol.

[0451] Numbered Embodiment 102: A high temperature heat pump according to numbered embodiment 101, wherein the refrigerant comprises at least about 50 wt% TFMCB.

[0452] Numbered Embodiment 103: A high temperature heat pump according to numbered embodiment 101, wherein the refrigerant comprises at least about 70 wt% TFMCB.

[0453] Numbered Embodiment 104: A high temperature heat pump according to numbered embodiment 101, wherein the refrigerant comprises at least about 80 wt% TFMCB.

[0454] Numbered Embodiment 105: A high temperature heat pump according to numbered Embodiment 101, wherein the refrigerant comprises at least about 90 wt% TFMCB.

[0455] Numbered embodiment 106: A high temperature heat pump according to numbered embodiment 101, wherein the refrigerant consists essentially of TFMCB.

[0456] Numbered embodiment 107: A high temperature heat pump according to numbered embodiment 101, wherein the refrigerant consists of TFMCB.

[0457] Numbered embodiment 108: A high temperature heat pump according to any one of numbered embodiments 101 to 107, wherein the refrigerant further comprises one or more co-fluids selected from HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, trans-HFO-1336mzz, HF-1234yf, HFO-1234ze(E), HFO-1233zd(E) and HFO-1233zd(Z).

[0458] Numbered embodiment 109: A high temperature heat pump according to any one of numbered embodiments 101 to 107, wherein the refrigerant further comprises one or more co-fluids selected from n-pentane, cyclopentane, cis-HFO-1336mzz, trans-HFO-1336mzz, HFO-1233zd(E), HFO-1233zd(Z), HFO-1234yf, and HFO-1234ze(E).

[0459] Numbered Embodiment 110: A high temperature heat pump according to numbered embodiments 108-109, wherein the one or more co-fluids are present in the refrigerant in an amount of at least about 5% by weight of the refrigerant.

[0460] Numbered Embodiment 111: A high temperature heat pump according to numbered embodiments 108-109, wherein the one or more co-fluids are present in the refrigerant in an amount of at least about 10% by weight of the refrigerant.

[0461] Numbered Embodiment 112: A high temperature heat pump according to numbered embodiments 108 to 111, wherein the refrigerant consists essentially of TFMCB and one or more co-fluids.

[0462] Numbered embodiment 113: A high temperature heat pump according to numbered embodiments 108 to 111,

[0463] The refrigerant consists of TFMCB and one or more co-fluids.

[0464] Numbered embodiment 114: A high temperature heat pump according to any one of numbered embodiments 101 to 113, wherein the refrigerant is a Class 1 refrigerant.

[0465] Numbered embodiment 115: A high temperature heat pump according to numbered embodiments 101 to 114, wherein the refrigerant is a Class A refrigerant.

[0466] Numbered embodiment 116: A high temperature heat pump according to any one of numbered embodiments 101 to 115, wherein the refrigerant is a Class A1 refrigerant.

[0467] Numbered Embodiment 117: The high temperature heat pump of any of Numbered Embodiments 101 to 116, wherein the refrigerant has a global warming potential (GWP) of no greater than about 1000.

[0468] Numbered Embodiment 118: The high temperature heat pump of any of Numbered Embodiments 101 to 116, wherein the refrigerant has a global warming potential (GWP) of no greater than about 700.

[0469] Numbered Embodiment 119: A high temperature heat pump according to any one of numbered embodiments 101 to 116, wherein the refrigerant has a global warming potential (GWP) of no greater than about 500.

[0470] Numbered Embodiment 120: The high temperature heat pump of any one of Numbered Embodiments 101 to 116, wherein the refrigerant has a global warming potential (GWP) of no greater than about 300.

[0471] Numbered Embodiment 121: A high temperature heat pump according to any one of numbered embodiments 101 to 116, wherein the refrigerant has a global warming potential (GWP) of no greater than about 150.

[0472] Numbered embodiment 122: A method for heating a fluid or a body using a high temperature heat pump, the method comprising the steps of: (a) condensing the refrigerant according to numbered embodiments 101 to 120 in the vicinity of the fluid or body to be heated; and (b) evaporating the refrigerant.

[0473] Numbered embodiment 123: A heat pump according to numbered embodiments 100 to 121 or a method according to numbered embodiment 122, wherein the heat pump is selected from a heat pump tumble dryer, an industrial heat pump, a reversible heat pump, an air-to-air heat pump, a heat pump water heater or a high temperature water heater.

[0474] Numbered Embodiment 124: A secondary loop system comprising the heat transfer composition of any one of Numbered Embodiments 1-28.

[0475] Numbered Embodiment 125: A secondary loop system comprising a primary refrigerant and a secondary refrigerant, wherein the secondary refrigerant is a heat transfer composition according to numbered embodiments 1 to 28.

[0476] Numbered Embodiment 126: The secondary loop system of Numbered Embodiment 125, wherein the secondary refrigerant comprises TFMCB in an amount of at least about 5% by weight of the refrigerant.

[0477] Numbered Embodiment 127: The secondary loop system of Numbered Embodiment 125, wherein the secondary refrigerant comprises TFMCB in an amount of at least about 15% by weight of the refrigerant.

[0478] Numbered Embodiment 128: The secondary loop system of Numbered Embodiment 125, wherein the secondary refrigerant comprises TFMCB in an amount of at least about 50% by weight of the refrigerant.

[0479] Numbered Embodiment 129: The secondary loop system of Numbered Embodiment 125, wherein the secondary refrigerant comprises TFMCB in an amount of at least about 70 weight percent of the refrigerant.

[0480] Numbered Embodiment 130: The secondary loop system of numbered Embodiment 125, wherein the secondary refrigerant comprises TFMCB in an amount of at least about 90 weight percent of the refrigerant.

[0481] Numbered Embodiment 131: The secondary loop system of numbered Embodiment 125, wherein the secondary refrigerant comprises TFMCB in an amount of at least about 95 weight percent of the refrigerant.

[0482] Numbered Embodiment 132: The secondary loop system of numbered Embodiment 125, wherein the secondary refrigerant comprises TFMCB in an amount of at least about 99 weight percent of the refrigerant.

[0483] Numbered embodiment 133: A secondary loop system according to numbered embodiment 125, wherein the secondary refrigerant consists essentially of TFMCB.

[0484] Numbered embodiment 134: A secondary loop system according to numbered embodiment 125, wherein the secondary refrigerant consists of TFMCB.

[0485] Numbered embodiment 135: A secondary loop system according to any one of numbered embodiments 125 to 134, wherein the secondary refrigerant further comprises one or more co-fluids selected from HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, trans-HFO-1336mzz, HF-1234yf, HFO-1234ze(E), HFO-1233zd(E) and HFO-1233zd(Z).

[0486] Numbered embodiment 136: A secondary loop system according to any one of numbered embodiments 125 to 134, wherein the secondary refrigerant further comprises one or more co-fluids selected from n-pentane, cyclopentane, cis-HFO-1336mzz, trans-HFO-1336mzz, HFO-1233zd(E), HFO-1233zd(Z), HFO-1234yf, and HFO-1234ze(E).

[0487] Numbered Embodiment 137: The secondary loop system of Numbered Embodiment 135 or 136, wherein the one or more co-fluids are present in an amount of at least about 5% by weight of the refrigerant.

[0488] Numbered Embodiment 138: The secondary loop system of Numbered Embodiment 135 or 136, wherein the one or more co-fluids are present in an amount of at least about 10% by weight of the refrigerant.

[0489] Numbered Embodiment 139: The secondary loop system of numbered embodiments 135 through 138, wherein the secondary refrigerant consists essentially of TFMCB and one or more co-fluids.

[0490] Numbered embodiment 140: The secondary loop system of numbered embodiments 135 to 138, wherein the secondary refrigerant consists of TFMCB and one or more co-fluids.

[0491] Numbered embodiment 141: The secondary circuit system of any one of numbered embodiments 125 to 140, wherein the secondary refrigerant is a Class 1 refrigerant.

[0492] Numbered embodiment 142: The secondary circuit system of any one of numbered embodiments 125 to 141, wherein the secondary refrigerant is a Class A refrigerant.

[0493] Numbered embodiment 143: The secondary circuit system of any one of numbered embodiments 125 to 142, wherein the secondary refrigerant is a Class A1 refrigerant.

[0494] Numbered Embodiment 144: The secondary loop system of any one of Numbered Embodiments 125-143, wherein the secondary refrigerant has a global warming potential (GWP) of no greater than about 1000.

[0495] Numbered Embodiment 145: The secondary loop system of any one of Numbered Embodiments 125-143, wherein the secondary refrigerant has a global warming potential (GWP) of no greater than about 700.

[0496] Numbered Embodiment 146: The method of any one of Numbered Embodiments 125-143, wherein the secondary refrigerant has a global warming potential (GWP) of no greater than about 500.

[0497] Numbered Embodiment 147: The secondary loop system of any one of Numbered Embodiments 125-143, wherein the secondary refrigerant has a global warming potential (GWP) of no greater than about 300.

[0498] Numbered Embodiment 148: The method of any one of Numbered Embodiments 125-143, wherein the secondary refrigerant has a global warming potential (GWP) of no greater than about 150.

[0499] Numbered embodiment 149: A secondary loop system according to numbered embodiments 124 to 148, wherein the system includes a primary vapor compression system loop using a primary refrigerant, and the evaporator of the primary vapor compression system loop cools a secondary loop fluid, wherein the refrigerant according to numbered embodiments 125 to 148 or the heat transfer composition according to numbered embodiment 124 is used as the secondary loop fluid.

[0500] Embodiment 150: A secondary loop system according to embodiment 149, wherein the primary refrigerant is selected from HFO-1234ze(E), HFO-1234yf, propane, R455A, R32, R466A, R44B, R290, R717, R452B, R448A and R449A, preferably HFO-1234ze(E), HFO-1234yf or propane.

[0501] Numbered embodiment 151: A secondary loop system according to numbered embodiments 124 to 150, wherein the system is a secondary refrigeration loop system.

[0502] Numbered embodiment 152: A secondary loop system according to numbered embodiments 124 to 150, wherein the system is a secondary air conditioning loop system.

[0503] Numbered implementation scheme 153: A secondary loop system according to numbered implementation scheme 151, wherein the secondary refrigeration loop system is selected from a low-temperature refrigeration system, a medium-temperature refrigeration system, a commercial refrigerator, a commercial freezer, an industrial freezer, an industrial refrigerator and a cooler.

[0504] Numbered implementation scheme 154: A secondary loop system according to numbered implementation scheme 152, wherein the secondary air-conditioning loop system is selected from a mobile air-conditioning system or a fixed air-conditioning system.

[0505] Numbered implementation scheme 155: A secondary loop system according to numbered implementation scheme 154, wherein the fixed air conditioning system is selected from modular or conventional individually packaged chillers, specifically positive displacement chillers, more specifically air-cooled or water-cooled direct expansion chillers, residential air conditioning systems, specifically ducted split or ductless split air conditioning systems, residential heat pumps, residential air-water heat pumps / hot water systems, industrial air conditioning systems, commercial air conditioning systems, specifically packaged rooftop units and variable refrigerant flow (VRF) systems; and commercial air source, water source or ground source heat pump systems.

[0506] Numbered embodiment 156: A motor vehicle air conditioning system comprising a vapor compression system (primary loop) and a secondary loop air conditioning system, wherein the primary loop comprises HFO-1234yf as a refrigerant and the secondary loop comprises the refrigerant described in numbered embodiments 125 to 148 or the heat transfer composition described in numbered embodiments 1 to 28.

[0507] Numbered embodiment 157: A motor vehicle air conditioning system according to numbered embodiment 156, wherein the secondary circuit is used to cool components in the automobile engine.

[0508] Numbered embodiment 158: A motor vehicle air conditioning system according to numbered embodiment 156 or 157, wherein the secondary circuit is used to cool the battery.

[0509] Numbered embodiment 159: A method for replacing an existing heat transfer fluid in a heat transfer system, the method comprising the steps of: (a) removing at least a portion of the existing heat transfer fluid from the system; and subsequently (b) introducing a heat transfer fluid comprising TFMCB into the system in an amount of at least about 5 weight % of the heat transfer fluid.

[0510] Numbered Embodiment 160: The method of numbered embodiment 159, wherein the heat transfer fluid comprises TFMCB in an amount of at least about 15% by weight of the heat transfer fluid.

[0511] Numbered Embodiment 161: The method of numbered embodiment 159, wherein the heat transfer fluid comprises TFMCB in an amount of at least about 50% by weight of the heat transfer fluid.

[0512] Numbered Embodiment 162: The method of numbered embodiment 159, wherein the heat transfer fluid comprises TFMCB in an amount of at least about 70% by weight of the heat transfer fluid.

[0513] Numbered Embodiment 163: The method of numbered embodiment 159, wherein the heat transfer fluid comprises TFMCB in an amount of at least about 90 weight percent of the heat transfer fluid.

[0514] Numbered Embodiment 164: The method of numbered embodiment 159, wherein the heat transfer fluid comprises TFMCB in an amount of at least about 95% by weight of the heat transfer fluid.

[0515] Numbered Embodiment 165: The method of numbered embodiment 159, wherein the heat transfer fluid comprises TFMCB in an amount of at least about 99 weight percent of the heat transfer fluid.

[0516] Numbered embodiment 166. The method of numbered embodiment 159, wherein the heat transfer fluid consists essentially of TFMCB.

[0517] Numbered embodiment 167: A method according to numbered embodiment 159, wherein the heat transfer fluid consists of TFMCB.

[0518] Numbered Embodiment 168: The method of any one of Numbered Embodiments 159 to 167, wherein the heat transfer fluid is a Class 1 refrigerant.

[0519] Numbered Embodiment 169: The method of any one of Numbered Embodiments 159 to 168, wherein the heat transfer fluid is a Class A refrigerant.

[0520] Numbered embodiment 170: The method of any one of numbered embodiments 159 to 169, wherein the secondary refrigerant is a Class A1 refrigerant.

[0521] Numbered Embodiment 171: The method of any one of numbered embodiments 159-170, wherein the secondary refrigerant has a global warming potential (GWP) of no greater than about 1000.

[0522] Numbered Embodiment 172: The method of any one of Numbered Embodiments 159-170, wherein the secondary refrigerant has a global warming potential (GWP) of no greater than about 700.

[0523] Numbered Embodiment 173: The method of any one of numbered embodiments 159-170, wherein the secondary refrigerant has a global warming potential (GWP) of no greater than about 500.

[0524] Numbered Embodiment 174: The method of any one of numbered embodiments 159-170, wherein the secondary refrigerant has a global warming potential (GWP) of no greater than about 300.

[0525] Numbered Embodiment 175: The method of any one of numbered embodiments 159-170, wherein the secondary refrigerant has a global warming potential (GWP) of no greater than about 150.

[0526] Numbered embodiment 176: The method of any one of numbered embodiments 159 to 175, wherein step (a) involves removing at least 5 weight percent of the existing heat transfer fluid from the system prior to step (b).

[0527] Numbered Embodiment 177: The method of any one of numbered embodiments 159 to 175, wherein step (a) involves removing at least 10 weight percent of the existing heat transfer fluid from the system prior to step (b).

[0528] Numbered Embodiment 178: The method of any one of numbered embodiments 159 to 175, wherein step (a) involves removing at least 15 weight percent of the existing heat transfer fluid from the system prior to step (b).

[0529] Numbered Embodiment 179: The method of any one of numbered embodiments 159 to 175, wherein step (a) involves removing at least 50 weight percent of the existing heat transfer fluid from the system prior to step (b).

[0530] Numbered embodiment 180: The method of any one of numbered embodiments 159 to 175, wherein step (a) involves removing at least 70 weight percent of the existing heat transfer fluid from the system prior to step (b).

[0531] Numbered Embodiment 181: The method of any one of numbered embodiments 159 to 175, wherein step (a) involves removing at least 90 weight percent of the existing heat transfer fluid from the system prior to step (b).

[0532] Numbered Embodiment 182: The method of any one of numbered embodiments 159 to 175, wherein step (a) involves removing at least 95 weight percent of the existing heat transfer fluid from the system prior to step (b).

[0533] Numbered Embodiment 183: The method of any one of numbered embodiments 159 to 175, wherein step (a) involves removing at least 99 weight percent of the existing heat transfer fluid from the system prior to step (b).

[0534] Numbered Embodiment 184: The method of any one of numbered embodiments 159 to 175, wherein step (a) involves removing at least 99.5 weight percent of the existing heat transfer fluid from the system prior to step (b).

[0535] Numbered embodiment 185: The method of any one of numbered embodiments 159 to 175, wherein step (a) involves removing substantially all of the existing heat transfer fluid from the system prior to step (b).

[0536] Numbered embodiment 186: The method of any one of numbered embodiments 159 to 185, wherein the method includes the step of flushing the system with a solvent after performing step (a) and before performing step (b).

[0537] Numbered embodiment 187: A method according to any of numbered embodiments 159 to 186, wherein the heat transfer fluid replaces existing fluid in the electronic device.

[0538] Numbered embodiment 188: The method of any one of numbered embodiments 159 to 186, wherein the heat transfer fluid replaces an existing fluid in the organic Rankine cycle.

[0539] Numbered Embodiment 189: The method of any one of Numbered Embodiments 159 to 186, wherein the heat transfer fluid replaces an existing fluid in the high temperature heat pump.

[0540] Numbered embodiment 190: The method of any of numbered embodiments 159 to 186, wherein the heat transfer fluid replaces existing fluid in the secondary loop.

Claims

1. A method for cooling a heat generating component operating in an electronic device, the method comprising: (a) operating the electronic device; (b) providing a thermal management fluid comprising 1-trifluoromethyl-1,2,2-trifluorocyclobutane TFMCB in thermal contact with the heat generating component of the operating electronic device; as well as (c) transferring heat from the operating heat generating component to the thermal management fluid through thermal contact with the TFMCB.

2. The method of claim 1, wherein the thermal management fluid is in direct contact with the heat generating component, and wherein the step of transferring heat comprises evaporating the TFMCB or adding sensible heat to the TFMCB, or a combination thereof.

3. The method of claim 1 or claim 2, wherein the thermal management fluid consists essentially of TFMCB.

4. The method of claim 1, wherein the thermal management fluid comprises at least 50% by weight TFMCB.

5. The method of claim 1, wherein the thermal management fluid comprises at least 70% by weight TFMCB.

6. The method of claim 1, wherein the thermal management fluid comprises at least 90% by weight TFMCB.

7. The method of claim 1, wherein the thermal management fluid consists of TFMCB.

8. The method of claim 1 or 2, wherein the thermal management fluid further comprises one or more co-fluids selected from the group consisting of HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, trans-HFO-1336mzz, HF-1234yf, HFO-1234ze(E), HFO-1233zd(E), and HFO-1233zd(Z).

9. The method of claim 1, wherein the TFMCB is at a temperature greater than 55°C during the transferring step (c).

10. The method of claim 1, wherein the thermal management fluid has a dielectric constant of less than 30 and a conductivity of less than 15 nS / cm.

11. The method according to claim 1, wherein the heat generating component is selected from semiconductor integrated circuits IC, electrochemical cells, power transistors, resistors and electroluminescent elements, wafers for manufacturing semiconductor devices, power control semiconductors, distribution switchgear, power transformers, circuit boards, multi-chip modules, packaged or unpackaged semiconductor devices, semiconductor integrated circuits, fuel cells, lasers, light emitting diodes LED and electrochemical cells.

12. The method of claim 11, wherein the electroluminescent element comprises a microprocessor, a laser or a laser diode, and the electrochemical cell is used for high power applications.

13. The method according to claim 12, wherein: The electrochemical cell is used in a hybrid vehicle or an electric vehicle.

14. The method of claim 1, wherein the electronic device is selected from a personal computer, a microprocessor, a server, a mobile phone, a tablet computer, a digital home appliance, a personal digital assistant, a data center, a stationary battery and a battery in a vehicle, a hybrid vehicle or an electric vehicle, a wind turbine, a train engine or a generator.

15. The method according to claim 14, wherein: The digital home appliances include televisions, media players and game consoles.

16. The method of claim 15, wherein the electronic device is a hybrid vehicle or an electric vehicle.

17. A method for converting thermal energy into mechanical energy in a Rankine cycle, the method comprising the steps of: i) evaporating a working fluid with a heat source and expanding the resulting vapor; and then ii) cooling the working fluid with a heat sink to condense the vapor, wherein the working fluid comprises at least 50% by weight TFMCB.

18. The method of claim 17, wherein the working fluid comprises at least 70% by weight TFMCB.

19. The method of claim 17, wherein the working fluid comprises at least 90% by weight TFMCB.

20. The method of claim 17, wherein the working fluid consists essentially of TFMCB.

21. The method of claim 17, wherein the working fluid consists of TFMCB.

22. A high temperature heat pump comprising a heat transfer fluid, wherein the heat transfer fluid comprises TFMCB, provided that the heat transfer fluid is not an azeotrope of a blend of 21% to 27% TFMCB, 64% to 72% trans-1,2-dichloroethylene, and 5% to 11% methanol by weight, and the heat transfer fluid is not an azeotropic composition of a blend of 82% to 92% TFMCB and 8% to 18% methanol or a blend of 82% to 92% TFMCB and 8% to 18% ethanol by weight.

23. The high temperature heat pump of claim 22, wherein the heat transfer fluid comprises at least 50% by weight TFMCB.

24. The high temperature heat pump of claim 22, wherein the heat transfer fluid comprises at least 70% by weight TFMCB.

25. The high temperature heat pump of claim 22, wherein the heat transfer fluid comprises at least 90% by weight TFMCB.

26. The high temperature heat pump of claim 22, wherein the heat transfer fluid consists essentially of TFMCB.

27. The high temperature heat pump of claim 22, wherein the heat transfer fluid consists of TFMCB.

28. A high temperature heat pump according to any one of claims 22 to 27, wherein the heat transfer fluid further comprises one or more co-fluids selected from the group consisting of HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, trans-HFO-1336mzz, HF-1234yf, HFO-1234ze(E), HFO-1233zd(E) and HFO-1233zd(Z).

29. A secondary loop system comprising a refrigerant, the refrigerant comprising TFMCB.

30. The secondary loop system of claim 29, wherein the system is a secondary air conditioning loop system or a secondary refrigeration loop system.

31. The secondary loop system of claim 30, wherein the secondary air conditioning loop system is selected from a mobile air conditioning system or a stationary air conditioning system.

32. The secondary loop system of claim 30, wherein the secondary refrigeration loop system is selected from the group consisting of a low temperature refrigeration system, a medium temperature refrigeration system, a commercial refrigerator, a commercial freezer, an industrial freezer, an industrial refrigerator, and a chiller.

33. A secondary loop system according to claim 31, wherein the fixed air conditioning system is selected from modular or conventional individually packaged chillers, specifically positive displacement chillers, more specifically air-cooled or water-cooled direct expansion chillers; residential air conditioning systems, specifically ducted split or ductless split air conditioning systems; residential heat pumps; ducted split or ductless split air conditioning systems; industrial air conditioning systems; commercial air conditioning systems, specifically packaged rooftop units and variable refrigerant flow (VRF) systems; and commercial air source, water source or ground source heat pump systems.

34. A heat transfer composition comprising a heat transfer fluid and a lubricant, wherein the heat transfer fluid comprises TFMCB.

35. The heat transfer composition of claim 34, wherein the heat transfer fluid comprises TFMCB in an amount of at least 50 weight percent based on the weight of the refrigerant component.

36. The heat transfer composition of claim 34, wherein the heat transfer fluid comprises TFMCB in an amount of at least 70 weight percent based on the weight of the refrigerant component.

37. The heat transfer composition of claim 34, wherein the heat transfer fluid comprises TFMCB in an amount of at least 90 weight percent based on the weight of the refrigerant component.

38. The heat transfer composition of claim 34, wherein the heat transfer fluid consists essentially of TFMCB.

39. The heat transfer composition of claim 34, wherein the heat transfer fluid consists of TFMCB.

40. The heat transfer composition of claim 34, wherein the lubricant comprises at least one of a polyol ester (POE), a polyvinyl ether (PVE), and a polyalkylene glycol (PAG).

41. The heat transfer composition of claim 40, wherein the lubricant is a polyol ester (POE) or a polyvinyl ether (PVE).

42. The heat transfer composition of claim 40, wherein the lubricant is a polyol ester (POE).

43. The heat transfer composition of claim 40, wherein the lubricant is a polyethylene ether (PVE).

44. The heat transfer composition of any one of claims 34 to 43, wherein the lubricant is present in the heat transfer composition in an amount of 5% to 30% by weight of the heat transfer composition.

45. The heat transfer composition of any one of claims 34 to 43, wherein the heat transfer fluid further comprises one or more co-fluids selected from the group consisting of HFE-7000, HFE-7200, HFE-7100, HFE-7300, HFE-7500, HFE-7600, trans-1,2-dichloroethylene, n-pentane, cyclopentane, ethanol, perfluoro(2-methyl-3-pentanone) (Novec 1230), cis-HFO-1336mzz, trans-HFO-1336mzz, HF-1234yf, HFO-1234ze(E), HFO-1233zd(E), and HFO-1233zd(Z).

46. ​​A method of replacing an existing refrigerant in a heat transfer system, the method comprising the steps of: (a) removing at least a portion of the existing refrigerant from the system, and thereafter; (b) introducing a refrigerant comprising a TFMCB into the system.

47. A method for removing heat from an article, device or fluid, the method comprising: (a) providing a high temperature heat source, the high temperature heat source generating heat at a temperature above 70° C.; as well as (b) removing heat from the high temperature heat source by thermal contact with a TFMCB liquid, wherein the temperature of the TFMCB liquid is greater than 55°C.

48. The method of claim 47, wherein the TFMCB liquid comprises at least 50% by weight TFMCB.

49. A method according to claim 47 or claim 48, wherein the TFMCB liquid comprises at least 50% by weight TFMCB.

50. The method of any one of claims 47 to 48, wherein the TFMCB liquid is a non-flammable heat transfer fluid consisting essentially of TFMCB and having a dielectric constant less than 30 and a conductivity less than 15 nS / cm.

51. The method of any one of claims 47 to 48, wherein the step of removing heat comprises evaporating the TFMCB or adding sensible heat to the TFMCB or a combination of these.

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