Double-sided covering film laminating machine

Abstract

The present invention relates to a double-sided covering film laminating machine, comprising a circuit board loading and unloading module, two covering film feeding modules and two laminating modules, wherein the two covering film feeding modules are used to supply sheet covering films to the two laminating modules respectively. The laminating module comprises: a laminating flipping platform, used to adsorb and fix the circuit board; a flipping driving mechanism, used to drive the laminating flipping platform to flip between a horizontal state and a vertical state; a mounting head assembly, used to absorb the sheet covering film from the covering film feeding module and to attach the sheet covering film to the circuit board; a laminating driving mechanism, used to drive the mounting head assembly to perform horizontal and lifting movements; wherein, when the laminating flipping platforms of the two laminating modules are in a vertical state, the circuit board can be adsorbed and transferred from the laminating flipping platform of the first laminating module to the laminating flipping platform of the second laminating module. The present invention can not only efficiently realize the double-sided laminating of the circuit board, but also has the advantages of small equipment size and high laminating quality.

Description

Technical Field

[0001] The invention relates to a double-sided covering film laminating machine. Background Art

[0002] In the production process of circuit boards, especially flexible circuit boards, it is often necessary to adhere covering films on both surfaces. The covering films can be various films such as developer dry films, solder resist dry films, etc., which are temporarily or permanently adhered to the surface of semi-finished or finished circuit boards.

[0003] The existing double-sided covering film laminating equipment for sheet circuit boards usually has a flip mechanism between two laminating mechanisms. The first laminating mechanism first laminates the covering film on the first surface of the circuit board, then the flip mechanism turns the circuit board over, and then the second laminating mechanism laminates the covering film on the second surface of the circuit board. The double-sided covering film laminating machine of the prior art has a complex structure and a large volume, and the laminating efficiency is low, because a flip mechanism needs to be set between the laminating mechanisms, and thus it needs to be improved. Summary of the invention

[0004] The main purpose of the present invention is to provide a double-sided cover film laminating machine which can efficiently implement double-sided film laminating of circuit boards.

[0005] In order to achieve the above main purpose, the present invention provides a double-sided cover film laminating machine, including a circuit board loading and unloading module, two cover film feeding modules and two laminating modules, the two cover film feeding modules are used to supply sheet cover films to the two laminating modules respectively; wherein the laminating module includes:

[0006] Laminating flip platform, used for adsorbing and fixing circuit boards;

[0007] A flipping driving mechanism, used for driving the laminating flipping platform to flip between a horizontal state and a vertical state;

[0008] A mounting head assembly, used for sucking a sheet of cover film from a cover film feeding module and attaching the sheet of cover film to a circuit board;

[0009] The mounting drive mechanism is used to drive the mounting head assembly to perform horizontal and vertical movements;

[0010] The laminating and flipping platforms of the two laminating modules are face-to-face close to or in contact in a vertical state, so that the circuit board can be adsorbed and transferred from the laminating and flipping platform of the first laminating module to the laminating and flipping platform of the second laminating module.

[0011] It can be seen from the above technical scheme that the present invention realizes the direct transfer and flipping of the circuit board between the two bonding modules by flipping the bonding flipping platform itself between the horizontal and vertical states in the two bonding modules. There is no need to set up a flipping mechanism outside the bonding mechanism as in the prior art, which can not only improve the bonding efficiency, but also help to simplify the equipment structure and reduce the size of the equipment; further, the circuit board is directly transferred between the two bonding modules, and the problem of dust and other debris being easily contaminated on the surface of the circuit board when the flipping mechanism is used to flip it in the prior art can be avoided, thereby improving product quality.

[0012] According to a specific embodiment of the present invention, the flip driving mechanism includes a mounting base, a driving gear and a driven gear meshing with each other, a first supporting link and a second supporting link; wherein the first ends of the first supporting link and the second supporting link are hinged to each other, the second end of the first supporting link is hinged to the fitting flip platform, and the second end of the second supporting link is hinged to the mounting base; the driving gear is mounted on the mounting base, and the driven gear is mounted on the rotating shaft of the fitting flip platform, and when the driving gear rotates, it drives the fitting flip platform to flip around its rotating shaft. wherein the flip driving mechanism adopts gear transmission, and has the advantage of a smooth flipping process of the fitting flip platform.

[0013] According to another specific embodiment of the present invention, the bonding flip platform has a rotating shaft; the flip driving mechanism includes a mounting base, a first connecting rod, a second connecting rod and a lifting member, the first ends of the first connecting rod and the second connecting rod are hinged to each other, the second end of the first connecting rod is hinged to the bonding flip platform, the second end of the second connecting rod is hinged to the mounting base, and the lifting member is hinged to the middle part of the second connecting rod; when the lifting member moves upward, the bonding flip platform can be driven to flip around the rotating shaft through the second connecting rod and the first connecting rod.

[0014] In the above technical solution, the flipping drive mechanism adopts a connecting rod structure, so that the flipping of the fitting flipping platform between the horizontal state and the vertical state can be achieved under the condition that the stroke of the jacking component is small, which is conducive to the miniaturization of the equipment.

[0015] Furthermore, a force-bearing portion is provided at the first end of the first connecting rod, and when the lifting member starts to drive the second connecting rod to rotate upward, the first end of the second connecting rod pushes upward against the force-bearing portion, so that the second end of the first connecting rod rotates upward. The force-bearing portion is provided at the first end of the first connecting rod to ensure that when the first end of the second connecting rod starts to rotate upward, the second end of the first connecting rod will also rotate upward, thereby avoiding the possible jamming of the connecting rod mechanism.

[0016] According to a specific embodiment of the present invention, the bonding drive mechanism includes a translation bracket, and a translation module and a lifting module arranged on the translation bracket; the translation bracket is slidably arranged on the frame along a first horizontal direction, and the translation module is used to drive the lifting module to move along a second horizontal direction perpendicular to the first horizontal direction; the placement head assembly is connected to the lifting module, and performs lifting movement under the drive of the lifting module.

[0017] In the above technical solution, the bonding drive mechanism is constructed to drive the mounting head assembly to move to any position in the horizontal plane, which is conducive to ensuring the position accuracy of the covering film bonding.

[0018] Preferably, the mounting head assemblies of the two bonding modules are respectively arranged on two different translation brackets so as to be able to operate relatively independently. Among them, a detection camera can be arranged on the translation bracket, and the detection camera can be used to detect the position of the circuit board, realize the precise alignment of the cover film and the circuit board, and can also be used to check the bonding quality of the cover film, for example, check for bubbles that may appear after bonding. Among them, in the first horizontal direction, the detection camera and the mounting head assembly are preferably located on opposite sides of the translation bracket so as not to affect the movement of the mounting head assembly.

[0019] According to a specific embodiment of the present invention, the covering film feeding module includes an unwinding mechanism, a peeling mechanism, a cutting mechanism, a winding mechanism and a covering film feeding platform; wherein the unwinding mechanism is used to supply a film including a covering film and a release film, the peeling mechanism is used to peel off the covering film and the release film, the cutting mechanism is used to cut the covering film after peeling off the release film into a predetermined length, and the covering film feeding platform is used to absorb the cut sheet covering film.

[0020] In the above technical solution, the cutting mechanism cuts the covering film after it is peeled off from the release film, which is conducive to ensuring the cutting quality of the covering film, and the motion control accuracy requirements of the cutting mechanism are relatively low. In contrast, in the prior art, the covering film is usually cut (half-cut) before peeling off the covering film and the release film, which requires extremely high motion accuracy control of the cutting mechanism, and is prone to problems such as incomplete cutting of the covering film or cutting off the release film.

[0021] Furthermore, the unwinding mechanism includes a discharge wheel for installing the film roll, a first guide roller, a second guide roller and a self-adjusting roller; on the film conveying path, the self-adjusting roller is arranged between the first guide roller and the second guide roller, and can move freely up and down during the unwinding process.

[0022] In the above technical solution, the unwinding mechanism includes a self-adjusting roller that can perform free lifting and lowering movements. While cutting the covering film, the discharge wheel maintains a stable discharge state. As the discharge wheel continuously discharges material, the self-adjusting roller moves downward under the action of gravity. When the film is fed to the cutting mechanism, since enough film has been buffered between the first guide roller and the second guide roller, the film can be fed to the cutting mechanism at a feeding speed faster than the linear speed of the discharge wheel (at this time the self-adjusting roller will move upward), thereby improving the cutting efficiency.

[0023] Furthermore, the covering film feeding module also includes a covering film clamping and transferring mechanism, which is used to clamp the front end of the covering film and pull the covering film to be cut forward. The provision of the covering film clamping and transferring mechanism can improve the flatness and cutting accuracy of the covering film during cutting, and is also conducive to accurately adsorbing the cut sheet of covering film on the covering film feeding platform.

[0024] According to a specific embodiment of the present invention, the circuit board loading and unloading module includes a loading and unloading robot and at least two circuit board stacking assemblies; wherein the circuit board stacking assemblies include:

[0025] Pull-out tray;

[0026] A material box is removably arranged on the pull-out tray and is used to accommodate the circuit board; a lifting plate for carrying the circuit board is arranged in the material box;

[0027] A lifting mechanism, comprising a driving module and a lifting block connected to the driving module;

[0028] The bottom of the pull-out tray and the material box are provided with avoidance holes for the top block to pass through, and the driving module drives the top block to pass through the avoidance holes and then press against the lifting carrier plate.

[0029] In the above technical solution, the placement and removal of the stacked circuit boards can be realized through the installation / removal operation of the material box, which is not only conducive to improving the placement and removal efficiency of the circuit boards, but also can avoid damage to the circuit boards during the placement and removal process. Furthermore, the material box is arranged on the pull-out tray and can be moved out of the laminating machine with the pull-out tray, so as to facilitate the installation / removal operation of the material box.

[0030] According to a specific embodiment of the present invention, two laminating modules are arranged side by side along the second horizontal direction; wherein, in the first horizontal direction perpendicular to the second horizontal direction, the two circuit board stacking assemblies of the circuit board loading and unloading module are respectively arranged on the first side of the two laminating modules, and the two covering film feeding modules are respectively arranged on the second side of the two laminating modules. Such an arrangement can make the overall layout of the equipment more compact and reasonable, and the modules can form an efficient cooperation.

[0031] In order to more clearly illustrate the purpose, technical solutions and advantages of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a front view of an embodiment of a double-sided covering film laminating machine of the present invention;

[0033] Figure 2 is a three-dimensional diagram of an embodiment of a double-sided covering film laminating machine of the present invention;

[0034] Figure 3 is a top view of an embodiment of a double-sided covering film laminating machine of the present invention;

[0035] Figure 4 is a first stereoscopic view of the laminating and flipping platform and flipping driving mechanism embodiment 1 in the embodiment, wherein the laminating and flipping platform is in a horizontal state;

[0036] Figure 5 is a second stereoscopic view of the laminating and flipping platform and flipping driving mechanism embodiment 1 in the embodiment, wherein the laminating and flipping platform is in a vertical state;

[0037] Figure 6 1 is a front view of the laminating and flipping platform and flipping driving mechanism embodiment 1 in the embodiment, wherein the laminating and flipping platform is in a vertical state;

[0038] Figure 7 is a first stereoscopic view of a laminating and flipping platform and a flipping driving mechanism in an embodiment, wherein the laminating and flipping platform is in a horizontal state;

[0039] Figure 8 is a second stereoscopic view of the laminating and flipping platform and flipping driving mechanism embodiment 2 in the embodiment, wherein the laminating and flipping platform is in a vertical state;

[0040] Fig. 9 2 is a front view of the laminating and flipping platform and flipping driving mechanism embodiment 2 in the embodiment, wherein the laminating and flipping platform is in a vertical state;

[0041] Fig.10 is a three-dimensional diagram of a mounting head assembly and a mounting drive mechanism in an embodiment;

[0042] Fig.11 is a front view of a covering film feeding module according to an embodiment of the present invention;

[0043] Fig.12 is a three-dimensional diagram of a covering film feeding module according to an embodiment of the present invention;

[0044] Fig.13 is a three-dimensional diagram of a peeling mechanism portion of an embodiment of a covering film feeding module;

[0045] Fig.14 is a three-dimensional diagram of a release film clamping and transferring mechanism in an embodiment of a covering film feeding module;

[0046] Fig.15 is a first structural exploded view of an embodiment of a circuit board stack assembly;

[0047] Fig.16 is a second structural exploded view of an embodiment of a circuit board stack assembly. DETAILED DESCRIPTION

[0048] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other variations or replacements made on this basis. Therefore, other possible implementation methods that may be known to those skilled in the art based on the embodiments described in this application all belong to the protection scope of the present invention.

[0049] like Figures 1 to 3 As shown, the double-sided covering film laminating machine of the embodiment of the present invention includes two laminating modules 100, two covering film feeding modules 200, a circuit board loading and unloading module 300 and a frame 400. The two covering film feeding modules 200 are used to supply sheet covering films to the two laminating modules 100 respectively; the circuit board loading and unloading module 300 includes a loading and unloading robot 310 and two circuit board stacking assemblies 320. The loading and unloading robot 310 is used to supply the circuit boards to be laminated stacked on one of the circuit board stacking assemblies 320 to one of the laminating modules 100, and stack the circuit boards that have completed double-sided lamination from the other laminating module 100 onto the other circuit board stacking assembly 320.

[0050] Specifically, Figure 3 As shown, the two laminating modules 100 are respectively the first laminating module 100a and the second laminating module 100b, and the two covering film feeding modules 200 are respectively the first covering film feeding module 200a and the second covering film feeding module 200b. The first laminating module 100a and the second laminating module 100b are arranged side by side in the second horizontal direction Y; in the first horizontal direction X perpendicular to the second horizontal direction Y, the two circuit board stacking assemblies 320 are respectively arranged on the first side of the first laminating module 100a and the second laminating module 100b, and the first covering film feeding module 200a and the second covering film feeding module 200b are respectively arranged on the second side of the first laminating module 100a and the second laminating module 100b, so that the overall equipment forms a compact and reasonable layout, and each module forms an efficient coordination.

[0051] The bonding module 100 includes a bonding flipping platform 110, a flipping driving mechanism 120, a mounting head assembly 130 and a bonding driving mechanism 140. The bonding flipping platform 110 has an array of negative pressure adsorption holes on its adsorption surface, so that the circuit board can be adsorbed and fixed; preferably, the bonding flipping platforms 110 of the two bonding modules 100 are connected to two independent negative pressure generating systems, so as to control the adsorption state of the two bonding flipping platforms 110.

[0052] The flip driving mechanism 120 drives the laminating flip platform 110 to move in a Figure 4 The horizontal state shown and Figure 5 When the laminating flipping platform 110 is in a horizontal state, the mounting head assembly 130 can attach the sucked sheet-shaped cover film to the circuit board. When the laminating flipping platforms 110 of the two laminating modules 100 are both flipped to a vertical state, as shown in FIG. Figure 5 and 6 As shown, the two laminating and flipping platforms 110 are face-to-face close to or in contact, so that the circuit board can be transferred from the laminating and flipping platform of the first laminating module to the laminating and flipping platform of the second laminating module by adsorption. For example, when both laminating and flipping platforms 110 are in a vertical state, the negative pressure adsorption of the first laminating and flipping platform 110a is controlled to be closed, and the negative pressure adsorption of the second laminating and flipping platform 110b is turned on, so that the circuit board can be directly transferred from the first laminating and flipping platform 110a to the second laminating and flipping platform 110b; conversely, the circuit board can be transferred from the second laminating and flipping platform 110b to the first laminating and flipping platform 110a by adsorption.

[0053] In the present invention, the two bonding flipping platforms 110 themselves are flipped between the horizontal and vertical states to achieve direct transfer and flipping of the circuit board between the two bonding modules 100. There is no need to provide a flipping mechanism outside the bonding mechanism as in the prior art, which not only improves the bonding efficiency but also helps to simplify the equipment structure and reduce the size of the equipment. Furthermore, the circuit board is directly transferred between the two bonding modules 100, which can also avoid the problem of dust and other debris easily sticking to the surface of the circuit board when the flipping mechanism is used to flip the circuit board in the prior art, thereby improving product quality.

[0054] In an optional embodiment, if Figures 4 to 6As shown, a connection part 401 is installed on the frame 400, and the fitting flip platform 110 has a rotating shaft 111 rotatably connected to the connection part 401. The flip driving mechanism 120 includes a mounting base 121, a first connecting rod 122, a second connecting rod 123, a lifting member 124 and a lifting cylinder 125. The first ends of the first connecting rod 122 and the second connecting rod 123 are hinged to each other, the second end of the first connecting rod 122 is hinged to the fitting flip platform 110, the second end of the second connecting rod 123 is hinged to the mounting base 121, and the lifting member 124 is hinged to the middle part (the position between the two end hinge points) of the second connecting rod 123. Among them, the lifting member 124 can be connected to the piston rod of the lifting cylinder 125 or formed as a part of the piston rod, and the cylinder body of the lifting cylinder 125 can be installed below the mounting base 121, and the piston rod passes through the mounting base 121 upward.

[0055] When the lifting cylinder 125 drives the lifting member 124 to move upward, the second connecting rod 123 and the first connecting rod 122 drive the laminating and flipping platform 110 to flip from a horizontal state to a vertical state around the rotating shaft 111. Conversely, when the lifting cylinder 125 drives the lifting member 124 to move downward, the second connecting rod 123 and the first connecting rod 122 drive the laminating and flipping platform 110 to flip from a vertical state to a horizontal state around the rotating shaft 111.

[0056] Preferably, Figure 5 As shown, the first end of the first connecting rod 122 is provided with a force-bearing portion 1221. When the lifting member 124 starts to drive the second connecting rod 123 to rotate upward, the first end of the second connecting rod 123 pushes against the force-bearing portion 1221 upward, so that the second end of the first connecting rod 122 rotates upward, avoiding the connecting rod mechanism from getting stuck, thereby ensuring that the laminating and flipping platform 110 flips upward around the rotating shaft 111. Furthermore, a limiting portion 1222 can be provided at the first end of the first connecting rod 122. When the laminating and flipping platform 110 flips to a vertical state, the limiting portion 1222 abuts against the second connecting rod 123 from below, thereby stably maintaining the laminating and flipping platform 110 in a vertical state.

[0057] In other embodiments of the present invention, other driving sources other than the cylinder may be used to drive the lifting member 124 to move up and down, and the present invention is not limited to this. Further, each laminating and flipping platform 110 may be provided with one or more flipping driving mechanisms, such as Figure 4-6 In the illustrated embodiment, each laminating and flipping platform 110 is provided with two flipping drive mechanisms 120, so that the flipping process thereof is more stable.

[0058] In other embodiments of the present invention, one or more flip driving mechanisms may also be used to simultaneously drive the two laminating flip platforms 110 to flip. Figures 4 to 6In the illustrated embodiment, the lifting components 124 of the two laminating and flipping driving mechanisms are connected to the same lifting driving source, thereby forming an integrated flipping driving mechanism to drive the two laminating and flipping platforms 110 to flip simultaneously.

[0059] In the above-mentioned embodiment, the flip driving mechanism 120 adopts a connecting rod structure, so that the laminating flip platform 100 can be flipped between a horizontal state and a vertical state under the condition that the stroke of the lifting member 124 is small, which is conducive to the miniaturization of the device. It is easy to understand that the flip driving mechanism can also adopt other driving mechanisms that can realize the flipping of the laminating flip platform 100, and the present invention is not limited to this.

[0060] Figures 7 to 9 That is, it shows the flip driving mechanism 1120 in another embodiment of the present invention. Figures 7 to 9 As shown, the flip driving mechanism 1120 includes a mounting base 1121, a driving gear 1122 and a driven gear 1123 that mesh with each other; wherein the driving gear 1122 is mounted on the mounting base 1121, and the driven gear 1123 is mounted on the rotating shaft 111 of the fitting flip platform 110, and the rotating shaft 111 can be rotatably connected with the mounting base 1121, and when the driving gear 1122 rotates, the fitting flip platform 110 is driven to rotate around the rotating shaft 111 as shown in FIG. Figure 7 The horizontal state shown and Figure 8 In this embodiment, the flip driving mechanism 1120 adopts gear transmission, which has the advantage of smooth flipping process of the flip platform 110.

[0061] In an optional embodiment, a lifting cylinder 1124 is provided below the mounting base 1121, and a rack 1128 meshing with the driving gear 1122 is connected to the piston rod of the lifting cylinder 1124, and the lifting cylinder 1124 drives the rack 1128 to move up and down, thereby driving the driving gear 1122 to rotate. In other embodiments, other driving devices / mechanisms such as motors may also be used to drive the driving gear 1122 to rotate, and the present invention is not limited to this; in addition, each laminating and flipping platform 110 may have one or more (for example, two) flipping driving mechanisms 1120.

[0062] Preferably, the flip driving mechanism 1120 further includes a first supporting link 1125 and a second supporting link 1126. The first ends of the first supporting link 1125 and the second supporting link 1126 are hinged to each other, the second end of the first supporting link 1125 is hinged to the laminating flip platform 110, and the second end of the second supporting link 1126 is hinged to the mounting base 1121, so as to provide reliable support for the laminating flip platform 110 during the flipping process. Furthermore, a limiting portion 1127 may be provided at the first end of the first supporting link 1125, and when the laminating flip platform 110 flips to a vertical state, the limiting portion 1127 abuts against the second supporting link 1126 from below, so that the laminating flip platform 110 can be stably maintained in a vertical state.

[0063] The bonding drive mechanism 140 is used to drive the mounting head assembly 130 to perform horizontal and lifting movements, so that the mounting head assembly 130 can absorb the sheet-shaped covering film from the covering film feeding module 200 and bond the sheet-shaped covering film to the circuit board. Specifically, the mounting head assembly 130 of the first bonding module 100a absorbs the sheet-shaped covering film from the first covering film feeding module 200a, and the mounting head assembly 130 of the second bonding module 100b absorbs the sheet-shaped covering film from the second covering film feeding module 200b.

[0064] In an optional embodiment, if Figure 1-3 As shown in FIG. 10 , the laminating driving mechanism 140 includes a translation bracket 141, and a translation module 142 and a lifting module 143 arranged on the translation bracket 141; wherein the translation bracket 141 is arranged on the slide rail 402 of the frame 400, and can be driven to slide along the first horizontal direction X, and the translation module 142 is used to drive the lifting module 143 to move along the second horizontal direction Y; the mounting head assembly 130 is connected to the lifting module 143, and performs lifting movement under the drive of the lifting module 143. In this way, the mounting head assembly 130 can move to any position in the horizontal plane, which is conducive to ensuring the position accuracy of the covering film lamination.

[0065] In some embodiments of the present invention, Figure 2 and 3 As shown, the mounting head assemblies 130 of the two mounting modules 100 are respectively arranged on two different translation brackets 141. In other embodiments of the present invention, the mounting head assemblies 130 of the two mounting modules 100 may also be arranged on the same translation bracket, in which case only two translation modules and two lifting modules need to be arranged on the translation bracket.

[0066] In the embodiment of the present invention, the structures of the translation module 142 and the lifting module 143 can be the same as those in the prior art, for example, both can adopt a ball screw mechanism, which will not be described in detail here. The mounting head assembly 130 includes a mounting head 131 and a negative pressure control cylinder 132. The mounting head 131 has a negative pressure adsorption surface and a heating mechanism is provided thereon, so that the sheet-like covering film can be attached to the circuit board in a heated and flat pressing manner; the negative pressure control cylinder 132 is used to control the negative pressure adsorption of the mounting head 131 to be turned on or off.

[0067] Furthermore, if Fig.10 As shown, a detection camera 150 is provided on the translation bracket 141, and the detection camera 150 can be a line scanning camera. The detection camera 150 can be used to detect the position of the circuit board to achieve accurate alignment of the cover film and the circuit board, and can also be used to check the quality of the cover film lamination, such as checking bubbles that may appear after lamination. In the first horizontal direction X, the detection camera 150 and the mounting head assembly 130 are preferably located on opposite sides of the translation bracket 141, so as not to affect the movement of the mounting head assembly 130.

[0068] Fig.11 and 12 The structure of the covering film feeding module 200 in the embodiment is shown. Specifically, the covering film feeding module 200 includes an unwinding mechanism 210, a peeling mechanism 220, a cutting mechanism 230, a rewinding mechanism 240 and a covering film feeding platform 250; wherein the unwinding mechanism 210 is used to supply a film including a covering film and a release film, the covering film and the release film output from the unwinding mechanism 210 and bonded together are peeled off by the peeling mechanism 220, the peeled release film is rewound by the rewinding mechanism 240, and the covering film is cut into a predetermined length by the cutting mechanism 230, and the cut sheet-shaped covering film is negatively pressured by the covering film feeding platform 250.

[0069] In the above embodiment, the cutting mechanism 230 cuts the covering film after it is peeled off from the release film, which is conducive to ensuring the cutting quality of the covering film, and the motion control accuracy requirement of the cutting mechanism 230 is relatively low. In contrast, in the prior art, the covering film is usually cut (half-cut) before peeling off the covering film and the release film, which requires extremely high motion accuracy control of the cutting mechanism, and it is easy to cause the problem of incomplete cutting of the covering film or cutting off the release film.

[0070] In an optional embodiment, the unwinding mechanism 210 includes a discharge wheel 211 for mounting the film roll, a spacer paper receiving wheel 218 for receiving and rewinding the spacer paper in the film roll, a first guide roller 212, a second guide roller 213 and a self-adjusting roller 214; on the film conveying path, the self-adjusting roller 214 is arranged between the first guide roller 212 and the second guide roller 213, and can freely rise and fall during the unwinding process.

[0071] Specifically, Fig.11 As shown, both ends of the self-adjusting roller 214 are provided with a lifting connection seat 215 rotatably connected thereto, and the lifting connection seat 215 is slidably arranged on the lifting guide rod 216. If necessary, a gravity block can also be arranged on the lifting connection seat 215. Fig.12 As shown, a sensor 217 is provided at a position corresponding to the lower dead point of the self-adjusting roller 214. When the sensor 217 detects that the self-adjusting roller 214 moves to the lower dead point, the discharge motor (not shown in the figure) connected to the discharge wheel 214 stops working, causing the discharge wheel 211 to stop discharging materials.

[0072] Since the self-adjusting roller 214 can freely rise and fall during the unwinding process, the discharge wheel 211 maintains a stable discharge state while cutting the covering film. As the discharge wheel 211 continuously discharges material, the self-adjusting roller 214 moves downward under the action of gravity. When the film is fed to the cutting mechanism 230, since enough film has been buffered between the first guide roller 212 and the second guide roller 213, the film can be fed to the cutting mechanism 230 at a feeding speed faster than the linear speed of the discharge wheel 211 (at this time, the self-adjusting roller 211 will move upward), thereby improving the cutting efficiency.

[0073] In an optional embodiment, if Fig.13 As shown, the stripping mechanism 220 includes a stripping platform 221, and a stripping edge 222 for stripping the cover film and the release film is formed at the front end of the stripping platform 221. A movable pressure bar 223 is provided above the stripping platform 221, and the movable pressure bar 223 is connected to a lifting cylinder 224. When cutting the cover film, the lifting cylinder 224 drives the movable pressure bar 223 to descend and press the film onto the stripping platform 221. Preferably, an elastic pad can be provided on the lower surface of the movable pressure bar 223 to increase the friction between the movable pressure bar 223 and the film and prevent the formation of an indentation on the cover film.

[0074] Furthermore, the covering film feeding module 200 may also include a covering film clamping and conveying mechanism 260. The covering film after being peeled off from the release film is clamped by the covering film clamping and conveying mechanism 260 and conveyed forward along the first horizontal direction X, and then cut into sheets by the cutting mechanism 230, and then adsorbed by the negative pressure of the covering film feeding platform 250. Preferably, the covering film feeding platform 250 is configured to move along the first horizontal direction X to adjust the discharge position of the sheet covering film, so as to facilitate the placement head assembly 130 to absorb the sheet covering film from the covering film feeding platform 250.

[0075] like Fig.12As shown, the covering film clamping and transferring mechanism 260 includes a covering film clamping assembly 261 and a movable base 262 connected to both ends of the covering film clamping assembly 261. The movable base 262 is provided with a clamping cylinder 263, and the clamping cylinder 263 is used to drive the covering film clamping assembly 261 to clamp the front end of the covering film. The movable base 262 is slidably arranged on the horizontal guide rod 264 and connected to a translation module. The translation module may include a transmission belt, which is connected to the movable base 262, and drives the movable base 262 to slide on the horizontal guide rod 263, so that the covering film clamping assembly 261 moves along the first horizontal direction X and pulls the covering film forward. During cutting, the movable pressure strip 223 presses the film against the peeling platform 221, and the covering film clamping assembly 261 tightens the covering film, thereby ensuring the flatness of the covering film.

[0076] In other embodiments of the present invention, the covering film feeding module may not have a cutting structure, but directly use the cut covering film, such as a covering film roll that has been half-cut. The typical structure of this covering film feeding module can refer to the film feeding feeder commonly used in the prior art.

[0077] In an optional embodiment, if Fig.11 As shown, the winding mechanism 240 includes a winding wheel 241, a third guide roller 242, and a fourth guide roller 243. The release film peeled off from the cover film is wound around the third guide roller 242 and the fourth guide roller 243 by the winding wheel 241. Furthermore, a release film clamping and conveying mechanism 270 may be provided between the third guide roller 242 and the fourth guide roller 243.

[0078] like Fig.14 As shown, the release film clamping and conveying mechanism 270 includes an upper clamping bar 272 disposed above the release film, a lower clamping bar 271 disposed below the release film, and a clamping cylinder 273 installed at the end of the lower clamping bar 271; wherein the upper clamping bar 272 is connected to the clamping cylinder 273, and the clamping cylinder 273 can drive the upper clamping bar 272 to move downward to clamp the release film. The lower clamping bar 271 is connected to a translation module, which can drive the release film clamping and conveying mechanism 270 to move along the first horizontal direction X, thereby achieving the clamping and conveying of the release film.

[0079] Fig.15 and 16 The structure of the circuit board stack assembly 320 is shown. Fig.15 and 16As shown, the circuit board stacking assembly 320 includes a track assembly 321, a pull-out tray 322, a material box 323, and a lifting mechanism 324. The pull-out tray 322 is slidably arranged on the track assembly 321, and the material box 323 is removably arranged on the pull-out tray 322, and can be moved out of the laminating machine with the pull-out tray 322, so as to facilitate the installation / removal operation of the material box 323. Through the installation / removal operation of the material box 323, the overall placement and removal of the stacked circuit boards can be realized, which is not only conducive to improving the placement and removal efficiency of the circuit boards, but also can avoid damage to the circuit boards caused by the placement and removal process.

[0080] Specifically, Fig.15 As shown, the track assembly 321 includes a track bottom plate 3211 and two slide rails 3212 arranged side by side, and the slide rails 3212 are installed above the track bottom plate 3211 through support columns 3213. The pull-out tray 322 includes a tray bottom plate 3221, tray side plates 3222 connected to the left and right sides of the tray bottom plate 3221, and a pull-out plate 3223 connected to the rear end of the tray bottom plate 3221, and the tray bottom plate 3221 is slidably connected to the slide rails 3212. When in use, the operator can push / pull the pull-out tray 322 into / out of the laminating machine by pushing / pulling the pull-out plate 3223.

[0081] The material box 323 is used to accommodate circuit boards. A lifting plate 3235 is provided in the material box 323, and the circuit boards are stacked and carried on the lifting plate 3235. In an optional embodiment, the material box 323 includes a material box bottom plate 3231 and material box side plates 3232 connected to the left and right sides of the material box bottom plate 3231; the front ends of the two material box side plates 3232 are connected by a front baffle 3233, and the rear ends are connected by a rear baffle 3234.

[0082] like Fig.16 As shown, the rear end of the pull-out tray 322 has an inclined guide plate 3224, which is used to guide the material box 323 to move forward to a predetermined position on the pull-out tray 322. The front end of the tray bottom plate 3221 has a limiting slot 3225, and the front end of the material box bottom plate 3231 has a limited portion 3236. After the material box 323 moves forward to a predetermined position on the pull-out tray 322, the limited portion 3236 is inserted into the limiting slot 3225 to limit the position of the material box 323 on the pull-out tray 322.

[0083] Further, the tray bottom plate 3221 includes a first plate body, and the left and right sides of the first plate body are both provided with a first bent portion 3226 that is concave downward to enhance the structural strength of the pull-out tray 322; wherein the first bent portion 3226 is slidably connected to the slide rail 3212. The material box bottom plate 3231 includes a second plate body, and the left and right sides of the second plate body are both provided with a second bent portion 3237 that is concave downward to enhance the structural strength of the material box 323. After the material box 323 is installed on the pull-out tray 322, the second bent portion 3237 is arranged in the first bent portion 3226 and is carried by the first bent portion 3226. Preferably, the first plate body and the second plate body are arranged at intervals to reduce the contact area and friction between the material box bottom plate 3231 and the tray bottom plate 3221 when the material box 323 is installed / removed, so that the installation / removal operation of the material box 323 is more convenient.

[0084] The lifting mechanism 324 is used to adjust the height of the lifting plate 3235 set in the material box 323, so that the lifting plate 3235 rises / falls to a position that is convenient for the upper and lower manipulators 310 to take / place the circuit board. The lifting mechanism 324 includes a driving module 3242 and a top block 3241 connected to the driving module 3242, and the tray bottom plate 3221 and the material box bottom plate 3231 have avoidance holes (for example, Fig.15 The driving module 3242 drives the top block 3241 to pass through the avoidance hole and then abut against the lifting plate 3235. The number of the top block 3241 can be one or more, for example Fig.15 and 16 The two shown are used to improve the lifting stability of the lifting carrier 3235.

[0085] Furthermore, the circuit board stacking assembly 320 may be equipped with a through-beam photoelectric sensor 3251 for detecting the stacking height of the circuit boards. Fig.15 As shown, there is a detection support plate 3252 on each of the left and right sides of the track assembly 321, and the detection support plate 3252 is vertically installed on the track base plate 3211. The transmitting end and the receiving end of the opposing photoelectric sensor 3251 are relatively arranged at the upper ends of the two detection support plates 3252, and the middle part of the upper end of the material box side plate 3232 may have a detection port 3238 for the detection light to pass through.

[0086] In the embodiment of the present invention, one of the two circuit board stacking assemblies 320 is used as a feeding device for stacking circuit boards to be laminated, and the other is used as a receiving device for stacking circuit boards that have been laminated on both sides. When used as a feeding device, the lifting mechanism 324 drives the lifting plate 3235 to gradually rise, so as to lift the circuit boards to be laminated stacked on the lifting plate 3235 to a height that is convenient for the loading and unloading manipulator 310 to pick up the materials; when used as a receiving device, the lifting plate 3235 is first lifted to a height suitable for the upper and lower manipulators 310 to stack the laminated circuit boards thereon, and then gradually descends, so as to facilitate the sequential stacking of the laminated circuit boards.

[0087] like Figure 2-3 As shown, the loading and unloading manipulator 310 is slidably arranged on the slide rail 402 of the frame 400, and is used to adsorb and supply the circuit boards to be laminated stacked on one of the circuit board stacking assemblies 320 to one of the laminating and flipping platforms 110 (circuit board loading), and stack the circuit boards that have completed double-sided lamination from the other laminating and flipping platform 110 to the other circuit board stacking assembly 320 (circuit board unloading). Among them, using the same manipulator to realize the circuit board loading and unloading operation is conducive to simplifying the equipment structure.

[0088] It is easy to understand that the double-sided covering film laminating machine of the present invention can also use circuit board loading and unloading modules of other structures. For example, the loading and unloading operations of the circuit board can also be performed by two manipulators respectively, and the present invention is not limited to this.

[0089] Although the present invention is described above through embodiments, it should be understood that any equivalent changes made by a person skilled in the art without departing from the scope of the present invention should be covered by the protection scope of the present invention.

Claims

1. A double-sided covering film laminating machine, comprising a circuit board loading and unloading module, two covering film feeding modules and two laminating modules, wherein the two covering film feeding modules are used to supply sheet covering films to the two laminating modules respectively; wherein: The bonding module comprises: Laminating flip platform, used for adsorbing and fixing circuit boards; A flipping driving mechanism, used for driving the laminating flipping platform to flip between a horizontal state and a vertical state; A mounting head assembly, used for sucking the sheet-shaped covering film from the covering film feeding module and attaching the sheet-shaped covering film to the circuit board; A mounting drive mechanism, used to drive the mounting head assembly to perform horizontal and vertical movements; The laminating and flipping platforms of the two laminating modules are face-to-face close to or in contact in a vertical state, so that the circuit board can be adsorbed and transferred from the laminating and flipping platform of the first laminating module to the laminating and flipping platform of the second laminating module, thereby realizing direct transfer and flipping of the circuit board between the two laminating modules; Wherein, the laminating driving mechanism comprises a translation support, and a translation module and a lifting module arranged on the translation support; the translation support is slidably arranged on the frame along a first horizontal direction, and the translation module is used to drive the lifting module to move along a second horizontal direction perpendicular to the first horizontal direction; the placement head assembly is connected to the lifting module and performs lifting movement under the drive of the lifting module; the placement head assembly is arranged on a side of the translation support close to the covering film feeding module in the first horizontal direction; The two bonding modules are arranged side by side along the second horizontal direction; the circuit board loading and unloading module includes a loading and unloading robot and two circuit board stacking assemblies. In the first horizontal direction, the two circuit board stacking assemblies of the circuit board loading and unloading module are respectively arranged on the first side of the two bonding modules, and the two covering film feeding modules are respectively arranged on the second side of the two bonding modules.

2. The double-sided covering film laminating machine according to claim 1, wherein: The flip driving mechanism includes a mounting base, a driving gear and a driven gear that mesh with each other, a first supporting link and a second supporting link; the first ends of the first supporting link and the second supporting link are hinged to each other, the second end of the first supporting link is hinged to the bonding flip platform, and the second end of the second supporting link is hinged to the mounting base; the driving gear is mounted on the mounting base, and the driven gear is mounted on the rotating shaft of the bonding flip platform, and the driving gear drives the bonding flip platform to flip around the rotating shaft when it rotates; a limiting portion is provided at the first end of the first supporting link, and when the bonding flip platform is flipped to a vertical state, the limiting portion abuts against the second supporting link from below.

3. The double-sided covering film laminating machine according to claim 1, wherein: The bonding flip platform has a rotating shaft; the flip driving mechanism includes a mounting base, a first connecting rod, a second connecting rod and a lifting member, the first ends of the first connecting rod and the second connecting rod are hinged to each other, the second end of the first connecting rod is hinged to the bonding flip platform, the second end of the second connecting rod is hinged to the mounting base, and the lifting member is hinged to the middle part of the second connecting rod; when the lifting member moves upward, the bonding flip platform can be driven to flip around the rotating shaft through the second connecting rod and the first connecting rod.

4. The double-sided covering film laminating machine according to claim 1, wherein: The mounting head assemblies of the two bonding modules are respectively arranged on two different translation brackets; each translation bracket is provided with an inspection camera, and in the first horizontal direction, the inspection camera and the mounting head assembly are located on opposite sides of the translation bracket.

5. The double-sided covering film laminating machine according to claim 1, wherein: The covering film feeding module includes an unwinding mechanism, a peeling mechanism, a cutting mechanism, a winding mechanism and a covering film feeding platform; the unwinding mechanism is used to supply a film including a covering film and a release film, the peeling mechanism is used to peel the covering film and the release film, the cutting mechanism is used to cut the covering film after peeling off the release film into a predetermined length, and the covering film feeding platform is used to absorb the cut sheet-like covering film.

6. The double-sided covering film laminating machine according to claim 5, wherein: The unwinding mechanism includes a discharge wheel for mounting a film roll, a first guide roller, a second guide roller and a self-adjusting roller; on the film conveying path, the self-adjusting roller is arranged between the first guide roller and the second guide roller, and can freely rise and fall during the unwinding process.

7. The double-sided covering film laminating machine according to claim 5, wherein: The covering film feeding module also includes a covering film clamping and transferring mechanism, which is used to clamp the front end of the covering film and pull the covering film to be cut forward.

8. The double-sided covering film laminating machine according to claim 1, wherein: The circuit board stack assembly comprises: Pull-out tray; A material box is removably arranged on the pull-out tray and is used to accommodate a circuit board; a lifting plate for carrying the circuit board is provided in the material box; A lifting mechanism, comprising a driving module and a lifting block connected to the driving module; The bottoms of the pull-out tray and the material box are provided with avoidance holes for the top block to pass through, and the driving module drives the top block to pass through the avoidance holes and then abut against the lifting carrier plate.

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