A stage assembly and a laser debonding device

Abstract

The present invention provides a stage assembly and a laser debonding device. The stage assembly includes a stage, a suction cup, and a lifting assembly. The stage fixes the first layer structure. The suction cup has an adsorption end face and a connection end face. The adsorption end face is divided into at least three adsorption zones, which include a circular adsorption zone located at the center of the suction cup and at least two circular ring adsorption zones arranged in sequence outward from the circular adsorption zone. The lifting assembly is at least three groups, and each group of the lifting assembly is used to lift the corresponding adsorption zone upward after the bonding layer at the position of the corresponding adsorption zone is heated by laser and undergoes a phase change, so that the first layer structure and the second layer structure are separated at the position of the corresponding adsorption zone. After the bonding layer area of the laser scanning part, the corresponding adsorption zone of the suction cup can be immediately lifted, so that the two layer structures at the position of the adsorption zone are separated, preventing the bonding layer in a molten state due to being heated by laser in this part from condensing and bonding again, reducing the peeling difficulty, shortening the peeling time, and improving the peeling efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular, to a stage assembly and a laser debonding device. Background Art

[0002] In the process of chip manufacturing, a large number of microelectronic devices are usually processed on a wafer by means of etching, deposition, polishing, etc. A wafer is a thin slice cut from a single crystal silicon ingot, and its thickness is usually between 0.3 mm and 0.9 mm, so it can be seen that the thickness is very thin. Since the wafer is relatively thin, and when various circuits are processed on the wafer, multiple etching, polishing, cleaning, etc. are required. Usually, before processing, the wafer is temporarily bonded to a substrate. Then, processes such as deposition and etching are performed on the wafer surface to manufacture various microelectronic devices on the wafer surface. After the wafer processing is completed, the wafer and the substrate need to be debonded so that the wafer and the substrate can be separated before the subsequent process of dicing the wafer can be carried out.

[0003] In the prior art, during the process of debonding a wafer and a substrate, a laser debonding method is usually adopted. The laser beam is focused on the bonding layer between the wafer and the substrate and scanned on the bonding layer to heat the bonding layer to make the bonding layer in a molten state. Then, a chuck is used to adsorb the surface of the substrate, and the center position of the chuck is pulled by a pull rod to drive the substrate to move upward, thereby separating the substrate and the wafer. However, since only one pull rod is connected to the chuck, when separating the substrate and the wafer, only the entire chuck can be pulled, resulting in that the chuck cannot be pulled until the entire bonding layer is scanned by the laser. When the areas of the wafer and the substrate are large, the time required to scan the entire bonding layer is long, so that the bonding layer that has been scanned and heated to a molten state at the beginning is condensed again, thereby bonding the wafer and the substrate again. Therefore, the bonding layer needs to be scanned back and forth by the laser multiple times before the entire chuck can be pulled by the pull rod to separate the substrate and the wafer, which not only increases the pulling force applied by the pull rod on the chuck, but also increases the debonding time and debonding difficulty of the wafer and the substrate. Summary of the Invention

[0004] The present invention provides a stage assembly and a laser debonding device, which can prevent the bonding layer that has been heated by the laser to a molten state from being condensed and bonded again, without applying a large pulling force to the chuck, reducing the debonding difficulty; and without scanning the bonding layer multiple times, thereby reducing the debonding time and improving the debonding efficiency.

[0005] In a first aspect, the present invention provides a stage assembly, which is applied to the laser debonding process of a to-be-debonded component. The to-be-debonded component includes a first layer structure and a second layer structure bonded by a bonding layer, and the shapes of both the first layer structure and the second layer structure are disc-shaped. The stage assembly includes a stage, a suction cup, and a lifting assembly. Among them, the stage is used to fix the first layer structure. The suction cup is disc-shaped, and the suction cup has an opposite adsorption end face and a connection end face. The adsorption end face is used to adsorb on the surface of the second layer structure. The adsorption end face is divided into at least three adsorption zones. The three adsorption zones include a circular adsorption zone located at the center of the suction cup and at least two annular adsorption zones arranged in sequence outward from the circular adsorption zone. The number of groups of the lifting assembly is at least three, and the at least three groups of the lifting assembly correspond to the at least three adsorption zones one by one. Each group of the lifting assembly is used to lift the corresponding adsorption zone upward after the bonding layer at the position of the corresponding adsorption zone is laser-heated and undergoes a phase change, so that the first layer structure and the second layer structure are separated at the position of the corresponding adsorption zone.

[0006] In the above solution, by dividing the adsorption end face of the suction cup into at least three adsorption zones, and setting a group of lifting assemblies corresponding to each adsorption zone, it is possible to apply a pulling force to a certain adsorption zone of the suction cup alone. During the laser debonding process, after the bonding layer area of the laser scanning part, the corresponding adsorption zone of the suction cup can be immediately lifted, so that the two layer structures at the position of the adsorption zone are separated, thus eliminating the need to apply a pulling force to the suction cup after the entire bonding layer is laser-scanned. This shortens the time from scanning a part of the bonding layer area to separating the two layer structures in this part of the area, preventing the bonding layer in a molten state due to being laser-heated in this part of the area from condensing and bonding again, thus eliminating the need to apply a large pulling force to the suction cup, reducing the peeling difficulty; and there is no need to scan the bonding layer multiple times, thus reducing the peeling time and improving the peeling efficiency.

[0007] In a specific embodiment, the stage assembly further includes at least three vacuum pumps, and the at least three vacuum pumps correspond to the at least three adsorption zones one by one. Each vacuum pump is used to adjust the suction force of the corresponding adsorption zone, and the suction forces of the at least three adsorption zones increase from the outer ring to the inner ring of the adsorption end face. This prevents the suction force between the adsorption zone and the second layer structure from being too small when the adsorption zone located in the inner ring of the suction cup is lifted by the corresponding lifting assembly, resulting in the separation of the suction cup and the second layer structure.

[0008] In a specific embodiment, each set of lifting components in at least two sets of lifting components corresponding to at least two circular adsorption areas includes at least three tie rods and a lifting mechanism. Wherein, each tie rod is connected to the connecting end face of the suction cup, and the connection points of all the tie rods in the same set of lifting components with the connecting end face are circumferentially and evenly distributed around the center of the suction cup. The lifting mechanism is used to lift at least three tie rods along the axial direction of the suction cup, so as to uniformly apply a pulling force to each circular adsorption area and prevent the second-layer structure from deforming inconsistently in the circumferential direction of each circular adsorption area.

[0009] In a specific embodiment, the connection points between at least three tie rods in each set of lifting components and the connecting end face are located in the circular adsorption area corresponding to this set of lifting components, so that the connection points of all the tie rods in a set of lifting components with the connecting end face are relatively close to the circular adsorption area corresponding to this set of lifting components, improving the lifting efficiency and effect.

[0010] In a specific embodiment, a set of lifting components corresponding to the circular adsorption area includes a central tie rod and a lifting mechanism. The connection point between the central tie rod and the suction cup is located at the center of the connecting end face, and the lifting mechanism is used to lift the central tie rod along the axial direction of the suction cup. By arranging a central tie rod in the center to stretch the suction cup from the center of the circular adsorption area, the defect that the second-layer structure deforms inconsistently in the circumferential direction of the circular adsorption area is overcome.

[0011] In a specific embodiment, the materials of the suction cup, the second-layer structure, the tie rods and the central tie rod are the same, so that the laser can pass through the suction cup and the second-layer structure to perform laser debonding on the bonding layer. At the same time, the tie rods or the central tie rod do not affect the laser penetration efficiency, preventing the tie rods from affecting the uneven scanning of the bonding layer.

[0012] In a specific embodiment, the materials of the suction cup, the second-layer structure, the tie rods and the central tie rod are all quartz materials to prevent the suction cup and the second-layer structure from affecting the laser transmittance.

[0013] In a specific embodiment, among at least three sets of lifting components, the step of the connection points between the tie rods and the connecting end face in any two adjacent sets of lifting components in the radial direction of the suction cup gradually decreases from the edge of the suction cup to the center of the suction cup, so as to offset the influence that it is more difficult for the inner ring of the second-layer structure to deform relative to the outer ring, and make the lifting height of each set of lifting components for the corresponding adsorption area relatively consistent.

[0014] In a specific embodiment, each of at least two sets of lifting components corresponding to at least two circular adsorption zones further includes a bracket, which includes at least three support arms, and the at least three support arms correspond to at least three pull rods in the corresponding set of lifting components one by one. Among them, each support arm is connected to the corresponding pull rod, and the axial direction of each pull rod is parallel to the axial direction of the suction cup, so as to apply a relatively consistent pulling force to all the pull rods in the same set of lifting components.

[0015] In a specific embodiment, the lifting mechanism is a rack and pinion lifter. The rack of the rack and pinion lifter is fixedly connected to the support arm or the central pull rod, and the transmission direction of the rack coincides with the axial direction of the suction cup, so as to simplify the structure of the lifting mechanism.

[0016] In a second aspect, the present invention further provides a laser debonding device, which includes any one of the above-mentioned stage assemblies. By dividing the adsorption end face of the suction cup into at least three adsorption zones, and each adsorption zone is correspondingly provided with a set of lifting components, it is possible to apply a pulling force to a certain adsorption zone of the suction cup alone. During the laser debonding process, after the bonding layer area of the laser scanning part, the corresponding adsorption zone of the suction cup can be immediately lifted, so that the two layer structures at the position of the adsorption zone are separated. Therefore, it is not necessary to wait until the entire bonding layer is laser scanned and then apply a pulling force to the suction cup, which shortens the time from scanning the bonding layer of a partial area to separating the two layer structures of this partial area, prevents the bonding layer in a molten state due to being heated by the laser in this partial area from condensing and bonding again, so it is not necessary to apply a large pulling force to the suction cup, reducing the peeling difficulty; and it is not necessary to scan the bonding layer multiple times, thus reducing the peeling time and improving the peeling efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of a stage assembly provided by an embodiment of the present invention;

[0018] Figure 2 It is a schematic structural diagram of a suction cup and a lifting component provided by an embodiment of the present invention;

[0019] Figure 3 It is a schematic structural diagram of a pull rod and a suction cup provided by an embodiment of the present invention;

[0020] Figure 4 It is a schematic structural diagram of the adsorption end face of a suction cup provided by an embodiment of the present invention;

[0021] Figure 5 It is a schematic structural diagram of an adsorption channel on an adsorption end face provided by an embodiment of the present invention;

[0022] Figure 6 It is a schematic side view structure diagram of a suction cup provided by an embodiment of the present invention;

[0023] Figure 7 The structural schematic diagram of a lifting component provided by an embodiment of the present invention;

[0024] Figure 8 The structural schematic diagram of a laser debonding device provided by an embodiment of the present invention.

[0025] Reference numerals:

[0026] 10 - stage 11 - first - layer structure 12 - second - layer structure 13 - bonding layer

[0027] 21 - laser 22 - focusing lens 23 - galvanometer system

[0028] 30 - suction cup 31 - adsorption end face 32 - adsorption channel 33 - connection end face

[0029] 34 - adsorption area 35 - vacuum pump

[0030] 40 - lifting component 41 - pull rod 42 - bracket 43 - support arm 44 - lifting mechanism Detailed implementation manners

[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0032] To facilitate the understanding of the stage assembly provided by the embodiments of the present invention, the application scenario of the stage assembly provided by the embodiments of the present invention will be described first. As the support and separation device in the laser debonding device, the stage assembly is applied to the laser debonding process of the workpiece to be debonded. Among them, referring to Figure 1 , the workpiece to be debonded includes a first - layer structure 11 and a second - layer structure 12 bonded through a bonding layer 13, and the shapes of both the first - layer structure 11 and the second - layer structure 12 are disc - shaped. The stage 10 assembly will be described in detail below with reference to the accompanying drawings.

[0033] Referring to Figure 1 and Figure 2, the stage 10 assembly provided by the embodiment of the present invention includes a stage 10, a suction cup 30, and a lifting assembly 40. Among them, the stage 10 is used to fix the first layer structure 11. The suction cup 30 is in a disc shape, and the suction cup 30 has an opposite adsorption end face 31 and a connection end face 33. The adsorption end face 31 is used to adsorb on the surface of the second layer structure 12. The adsorption end face 31 is divided into at least three adsorption zones 34. The three adsorption zones 34 include a circular adsorption zone 34 located at the center of the suction cup 30, and at least two annular adsorption zones 34 arranged in sequence outward from the circular adsorption zone 34. The number of groups of the lifting assembly 40 is at least three groups. The at least three groups of the lifting assembly 40 correspond to the at least three adsorption zones 34 one by one. Each group of the lifting assembly 40 is used to lift the corresponding adsorption zone 34 upward after the bonding layer 13 at the position of the corresponding adsorption zone 34 is laser-heated and undergoes a phase change, so that the first layer structure 11 and the second layer structure 12 are separated at the position of the corresponding adsorption zone 34.

[0034] In the above solution, by dividing the adsorption end face 31 of the suction cup 30 into at least three adsorption zones 34, and arranging a group of lifting assemblies 40 corresponding to each adsorption zone 34, a pulling force can be applied to a certain adsorption zone 34 of the suction cup 30 alone. During the laser debonding process, after the bonding layer 13 area of the laser scanning part, the corresponding adsorption zone 34 of the suction cup 30 can be immediately lifted, so that the two layer structures at the position of the adsorption zone 34 are separated. Therefore, it is not necessary to apply a pulling force to the suction cup 30 after the entire bonding layer 13 is laser-scanned, which shortens the time from scanning a part of the bonding layer 13 to separating the two layer structures in this part of the area, preventing the bonding layer 13 in the molten state heated by the laser in this part of the area from condensing and bonding again. Therefore, it is not necessary to apply a large pulling force to the suction cup 30, reducing the peeling difficulty; and it is not necessary to scan the bonding layer 13 multiple times, thus reducing the peeling time and improving the peeling efficiency. The following will introduce the above various structures in detail with reference to the drawings.

[0035] As Figure 1 shown, the stage 10 serves as a support structure for holding the workpiece to be debonded thereon. When setting, a stage body with a support end face can be set as the stage 10. The shape of the support end face can be set as a circle to facilitate placing the disc-shaped workpiece to be debonded thereon. And a plurality of suction holes can also be provided on the support end face of the stage 10. The plurality of suction holes adsorb on the surface of the first layer structure 11 in the workpiece to be debonded to fix the first layer structure 11 on the stage 10. Of course, other fixing methods that can hold the first layer structure 11 thereon can also be adopted.

[0036] When setting the suction cup 30, refer to Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6, the suction cup 30 is disc-shaped to facilitate the adsorption of the disc-shaped bonding part to be released. The suction cup 30 has opposite adsorption end faces 31 and connection end faces 33. As Figure 2 shown, the upper surface of the suction cup 30 is the connection end face 33, and the lower surface of the suction cup 30 is the adsorption end face 31. Among them, the adsorption end face 31 is used to adsorb on the surface of the second layer structure 12, and the connection end face 33 is used to connect the lifting component 40 to lift a part of the suction cup 30 upward. As Figure 2 , Figure 3 , Figure 4 and Figure 5 shown, the adsorption end face 31 of the suction cup 30 is divided into at least three adsorption zones 34. These three adsorption zones 34 include a circular adsorption zone 34 located at the center of the suction cup 30, and at least two annular adsorption zones 34 arranged in sequence outward from the circular adsorption zone 34. That is, there are at least three adsorption zones 34 on the end face of the suction cup 30. These at least three adsorption zones 34 include a circular adsorption zone 34 located at the center of the suction cup 30, and also include at least two annular adsorption zones 34. And these at least two annular adsorption zones 34 are arranged in sequence from the inside to the outside by the circular adsorption zone 34 at the central position. Thus, when the end face of the suction cup 30 adsorbs on the surface of the second layer structure 12, it is adsorbed on the surface of the second layer structure 12 by at least three adsorption zones 34 on the adsorption end face 31. When determining the number of adsorption zones 34, as Figure 2 shown, the number of adsorption zones 34 is 4, including a circular adsorption zone 34 located at the central position, and also including 3 annular adsorption zones 34 arranged in sequence from the inside to the outside. It should be understood that the number of divisions of the adsorption zones 34 on the adsorption end face 31 is not limited to the setting method of 4 as Figure 2 shown. In addition, the number of adsorption zones 34 on the adsorption end face 31 can also be any value not less than 3, such as 3, 5, 6, 8, 12, 18, etc.

[0037] In addition, when determining the suction force of each adsorption zone 34 for adsorbing the corresponding position of the second layer structure 12, referring to Figure 6 , at least three vacuum pumps 35 can be set. These at least three vacuum pumps 35 correspond one-to-one to at least three adsorption zones 34, and each vacuum pump 35 is used to adjust the suction force of the corresponding adsorption zone 34. As Figure 6As shown in the figure, four evacuators 35 are provided, and each evacuator 35 corresponds to an adsorption area 34. That is, one evacuator 35 is provided for each adsorption area 34 to separately adjust the suction force of the corresponding adsorption area 34, so that the suction forces generated by different adsorption areas 34 are different. When a lifting component 40 lifts the suction cup 30 at the position of the corresponding adsorption area 34, the suction force of the adsorption area 34 can be increased or decreased according to the difficulty of lifting the suction cup 30 at the position of the adsorption area 34. For example, the suction forces of at least three adsorption areas 34 can be increased from the outer circle to the inner circle of the adsorption end face 31, so that the suction force generated by the adsorption area 34 near the center position is larger, and the suction force generated by the adsorption area 34 near the edge position is smaller. When the lifting component 40 lifts the suction cup 30 of the adsorption area 34 near the edge position, the area of the adsorption area 34 at the edge position is larger, and the lever of the suction force is also larger, so that the lifting difficulty is smaller. The area of the adsorption area 34 near the center position is smaller, and the lever of the suction force is also smaller, so that the lifting difficulty is larger. By setting the suction force of the adsorption area 34 near the center position to be larger and the suction force of the adsorption area 34 near the edge position to be smaller, it can be prevented that when the suction cup 30 in the adsorption area 34 located in the inner circle is lifted by the corresponding lifting component 40, the suction force between the adsorption area 34 and the second layer structure 12 is too small, resulting in the separation of the suction cup 30 and the second layer structure 12.

[0038] In addition, referring to Figure 5 , a plurality of adsorption channels 32 distributed in a concentric circle shape can be provided on the adsorption end face 31. That is, each circle of adsorption channels 32 is in the shape of a ring, and there is a convex end face between two adjacent circles of adsorption channels 32 to be attached to the surface of the second layer structure 12. The number of circles of adsorption channels 32 in each adsorption area 34 can be 1 circle, 2 circles, 3 circles, 5 circles, 10 circles, etc. Through the negative pressure generated in each circle of adsorption channels 32, the suction cup 30 adsorbs a partial annular area of the second layer structure 12, and then the lifting component 40 drives the suction cup 30 to move upward slightly, so that a gap is generated and separated in the partial annular area where the two layer structures have just been debonded, so as to apply the same magnitude of suction force to the surface of the second layer structure 12 in the same annular area.

[0039] Referring to Figure 1 and Figure 2 , a lifting component 40 is also provided to lift the suction cups 30 in different adsorption areas 34, so that the two layer structures at different suction cup areas are separated. Specifically, the number of groups of the lifting component 40 is at least three groups, and the at least three groups of lifting components 40 correspond to at least three adsorption areas 34 one by one. Each group of lifting components 40 is used to lift the corresponding adsorption area 34 upward after the bonding layer 13 at the position of the corresponding adsorption area 34 is laser-heated and undergoes a phase change, so that the first layer structure 11 and the second layer structure 12 are separated at the position of the corresponding adsorption area 34. AsFigure 1 and Figure 2 As shown in Figure 2 , the number of sets of the lifting assemblies 40 is 4 sets. The 4 sets of lifting assemblies 40 respectively correspond to 4 adsorption areas 34 on the adsorption end face 31. Each adsorption area 34 corresponds to a set of lifting assemblies 40. Each set of lifting assemblies 40 is used to lift the suction cup 30 at the position of the corresponding adsorption area 34, so that the two layer structures are separated at the position of this adsorption area 34. Among them, the two layer structures at the position of each adsorption area 34 refer to the part of the second layer structure 12 adsorbed by each adsorption area 34 and the part of the first layer structure 11 that is vertically opposite to the part of the second layer structure 12. By dividing the adsorption end face 31 of the suction cup 30 into at least three adsorption areas 34, and setting a set of lifting assemblies 40 corresponding to each adsorption area 34, the suction cup 30 can be pulled separately at a certain adsorption area 34. During the laser debonding process, after the bonding layer 13 area of the laser scanning part, the corresponding adsorption area 34 of the suction cup 30 can be immediately lifted, so that the two layer structures at the position of this adsorption area 34 are separated, thus eliminating the need to apply a pulling force to the suction cup 30 after the entire bonding layer 13 is laser scanned. The time from scanning the bonding layer 13 in a partial area to separating the two layer structures in this partial area is shortened, preventing the bonding layer 13 in the molten state due to being heated by the laser in this partial area from condensing and bonding again. Therefore, there is no need to apply a large pulling force to the suction cup 30, reducing the peeling difficulty; and there is no need to scan the bonding layer 13 multiple times, thus reducing the peeling time and improving the peeling efficiency.

[0040] In addition, when setting each lifting assembly 40, referring to Figure 3 , the lifting assemblies 40 corresponding to the circular adsorption areas 34 located at the central position and the lifting assemblies 40 corresponding to the circular ring-shaped adsorption areas 34 located at non-central positions can be set to different structures. Specifically, each set of the at least two sets of lifting assemblies 40 corresponding to the at least two circular ring-shaped adsorption areas 34 can include at least three pull rods 41 and a lifting mechanism 44. That is, each set of lifting assemblies 40 corresponding to each circular ring-shaped adsorption area 34 includes at least three pull rods 41, and each of the three pull rods 41 is connected to the connection end face 33 of the suction cup 30. As shown in Figure 3 , each set of lifting assemblies 40 corresponding to each circular ring-shaped adsorption area 34 contains 3 pull rods 41. It should be noted that the number of pull rods 41 in each set of lifting assemblies 40 corresponding to each circular ring-shaped adsorption area 34 is not limited to Figure 3 the setting method of the 3 pull rods 41 shown in Figure 3The equal setting method shown can also make the number of tie rods 41 in the lifting components 40 corresponding to different annular adsorption areas 34 different. Specifically, the number of tie rods 41 in the lifting components 40 located at the edge can be made more, and the number of tie rods 41 in the lifting components 40 near the center position can be made less. Or the number of tie rods 41 in the lifting components 40 located at the edge can be made less, and the number of tie rods 41 in the lifting components 40 near the center position can be made more. Refer to Figure 3 , the connection points of all the tie rods 41 in the same set of lifting components 40 with the connection end face 33 are circumferentially uniformly distributed around the center of the suction cup 30, that is, the connection points of all the tie rods 41 in the lifting components 40 corresponding to each annular adsorption area 34 with the adsorption end face 31 are circumferentially uniformly distributed around the center of the suction cup 30, so as to evenly pull the suction cups 30 at each annular adsorption area 34. The lifting mechanism 44 therein is used to lift at least three tie rods 41 along the axial direction of the suction cup 30, that is, the pulling force applied to each tie rod 41 is parallel to the axial direction of the suction cup 30, so that the tensile direction of the tie rod 41 is parallel to the separation direction when the two-layer structures are separated at this adsorption area 34, thereby simplifying the difficulty of separating the two-layer structures at each adsorption area 34. It is convenient to evenly apply a pulling force to each annular adsorption area 34 to prevent the second-layer structure 12 from deforming inconsistently in the circumferential direction of each annular adsorption area 34.

[0041] Continue to refer to Figure 3 , the connection points between at least three tie rods 41 in each set of lifting components 40 and the connection end face 33 can be located in the annular adsorption area 34 corresponding to this set of lifting components 40, that is, the connection points between all the tie rods 41 in the lifting components 40 corresponding to each adsorption area 34 and the connection end face 33 are located at the position of the corresponding adsorption area 34, so that the connection points of all the tie rods 41 in a set of lifting components 40 with the connection end face 33 are relatively close to the annular adsorption area 34 corresponding to this set of lifting components 40, improving the lifting efficiency and effect. Of course, it is not limited to the above setting method, as long as it is beneficial to the separation of the two-layer structures at each adsorption area 34, it is within the protection scope of this patent.

[0042] Such as Figure 3As shown, when setting the lifting assembly 40 corresponding to the circular adsorption area 34 at the central position, a set of lifting assemblies 40 corresponding to the circular adsorption area 34 includes a central pull rod 41 and a lifting mechanism 44. The connection point between the central pull rod 41 and the suction cup 30 is located at the central position of the connection end face 33, and the lifting mechanism 44 is used to lift the central pull rod 41 along the axial direction of the suction cup 30. That is, in the circular adsorption area 34, a central pull rod 41 is set as a tensile connecting piece, and a central pull rod 41 is set in the center to stretch the suction cup 30 from the center of the circular adsorption area 34, so as to overcome the defect that the deformation of the second-layer structure 12 is inconsistent in the circumferential direction of the circular adsorption area 34. It should be noted that the setting method of the lifting assembly 40 corresponding to the circular adsorption area 34 is not limited to the setting method of one central pull rod 41 shown above. In addition, other setting methods can also be adopted. For example, the setting method of the lifting assembly 40 corresponding to the circular adsorption area 34 at the central position can be the same as the setting method of the lifting assembly 40 corresponding to the above-mentioned circular ring adsorption area 34. That is, there are also at least three pull rods 41 in the lifting assembly 40 corresponding to the circular adsorption area 34, and the at least three pull rods 41 are evenly distributed circumferentially around the center of the suction cup 30.

[0043] In addition, referring to Figure 3 , it can be made that among at least three groups of lifting assemblies 40, the step of the connection point between the pull rod 41 and the connection end face 33 in the radial direction of the suction cup 30 between any two adjacent groups of lifting assemblies 40 gradually decreases from the edge of the suction cup 30 to the center of the suction cup 30. It should be explained that the step of the connection point between the pull rod 41 and the connection end face 33 in the radial direction of the suction cup 30 between two adjacent groups of lifting assemblies 40 refers to the distance between the connection points between the pull rod 41 and the connection end face 33 in the radial direction of the suction cup 30 between two adjacent groups of lifting assemblies 40. The larger the distance, the larger the step, indicating that the distance between the connection points between the pull rod 41 and the connection end face 33 in the radial direction of the suction cup 30 between two adjacent groups of lifting assemblies 40 is larger; on the contrary, the smaller the distance, the smaller the step, indicating that the distance between the connection points between the pull rod 41 and the connection end face 33 in the radial direction of the suction cup 30 between two adjacent groups of lifting assemblies 40 is smaller. And the step of the connection point between the pull rod 41 and the connection end face 33 in the radial direction of the suction cup 30 between any two adjacent groups of lifting assemblies 40 gradually decreases from the edge of the suction cup 30 to the center of the suction cup 30, which means that the step of the connection point between the pull rod 41 and the connection end face 33 in the radial direction of the suction cup 30 between two adjacent groups of lifting assemblies 40 near the edge is larger, and the step of the connection point between the pull rod 41 and the connection end face 33 in the radial direction of the suction cup 30 between two adjacent groups of lifting assemblies 40 near the central position is smaller, so as to offset the influence that the inner ring of the second-layer structure 12 is more difficult to deform than the outer ring, and make the lifting height of each group of lifting assemblies 40 corresponding to the adsorption area 34 relatively consistent.

[0044] Referring to Figure 7, each set of the at least two sets of lifting components 40 corresponding to the at least two circular adsorption areas 34 may further include a bracket 42. The bracket 42 includes at least three support arms 43, and the at least three support arms 43 correspond one by one to at least three pull rods 41 in the corresponding set of lifting components 40. Each support arm 43 is connected to the corresponding pull rod 41, and the axial direction of each pull rod 41 is parallel to the axial direction of the suction cup 30. That is, a bracket 42 is further provided in the lifting component 40 corresponding to each circular adsorption area 34 to connect all the pull rods 41 in the lifting component 40 into an integral structure. When specifically connecting, all the pull rods 41 in the lifting component 40 are connected to the support arms 43 on the bracket 42, and the lifting mechanism 44 lifts the bracket 42 to lift all the pull rods 41 in the lifting component 40, so as to apply a relatively consistent pulling force to all the pull rods 41 in the same set of lifting components 40.

[0045] Of course, when there is only one central pull rod 41 in the lifting component 40 corresponding to the circular adsorption area 34 located at the central position, the bracket 42 may not be provided, and the lifting mechanism 44 can directly lift the one central pull rod 41. When the same setting method as that of the lifting component 40 of the circular adsorption area 34 is adopted in the lifting component 40 corresponding to the circular adsorption area 34 and there are also at least three pull rods 41, the above-mentioned bracket 42 can be adopted to connect the multiple pull rods 41 into an integral structure, so that the lifting mechanism 44 can lift the multiple pull rods 41 together and apply a relatively consistent pulling force to all the pull rods 41 in the same set of lifting components 40.

[0046] When setting the lifting mechanism 44, continue to refer to Figure 7 , the lifting mechanism 44 can be a gear-rack lifter. The rack of the gear-rack lifter is fixedly connected to the support arm 43 or the central pull rod 41, and the transmission direction of the rack coincides with the axial direction of the suction cup 30. This simplifies the structure of the lifting mechanism 44. It should be understood that the lifting mechanism 44 is not limited to the setting method of the gear-rack lifter. In addition, other setting methods can also be adopted. For example, a screw lifter can be used as the lifting mechanism 44, and the screw of the screw lifter is connected to the bracket 42 or the central pull rod 41, and the lifting of the pull rod 41 and the suction cup 30 can also be realized.

[0047] In specific applications, the laser debonding device not only includes the above-mentioned stage 10 assembly, refer to Figure 8 , but also includes a laser system for generating a laser beam, refer to Figure 8, after the laser beam passes through the suction cup 30 and the second-layer structure 12 from top to bottom in sequence, it is focused on the bonding layer 13 of the component to be bonded, so as to heat the bonding layer 13, thereby converting the material of the bonding layer 13 from a bonded solid state to a molten state, gas state, plasma state, etc. with less or no bonding force, so as to achieve debonding between the first-layer structure 11 and the second-layer structure 12. When setting up the laser system, refer to Figure 8 , this laser system includes a laser 21, and the laser 21 is used to generate a laser beam. A focusing lens 22 is also arranged at the downstream position of the light beam of the laser 21, and the focusing lens 22 is used to receive the laser beam and focus the laser beam on the bonding layer 13. When specifically setting the focusing lens 22, a plano-convex lens or a cylindrical lens can be used as the focusing lens 22. In addition, as Figure 8 shown, a galvanometer system 23 can also be arranged, and the galvanometer system 23 is used to control the focus of the laser beam to scan on the bonding layer 13, so as to be able to heat and debond the entire bonding layer 13. By arranging the galvanometer system 23, it is convenient to control the focus of the laser beam to scan on the bonding layer 13. When specifically setting the galvanometer system 23, it can be a two-axis galvanometer system 23 or a three-axis galvanometer system 23. It should be explained that the galvanometer system 23 is not a device that must be adopted, and other implementation methods that can control the focus of the laser beam to scan on the bonding layer 13 can also be adopted. For example, a stage 10 that can move in a two-dimensional plane can be adopted as the implementation method for the focus of the laser beam to scan on the bonding layer 13.

[0048] Continue to refer to Figure 8 , during the laser debonding process, the suction cup 30 can be adsorbed on the surface of the second-layer structure 12, so that after the laser debonds a partial area of the bonding layer 13, by pulling up the suction cup 30, a gap is generated at the position where the first-layer structure 11 and the second-layer structure 12 coincide with this partial area, so that the two are separated locally. Specifically, the laser beam generated by the laser system needs to pass through the suction cup 30 and the second-layer structure 12 in sequence before it can be focused on the bonding layer 13, that is, the laser beam needs to pass through not only the second-layer structure 12 but also the suction cup 30. When controlling the focus of the laser beam to scan on the bonding layer 13, the suction cup 30 is always adsorbed on the surface of the second-layer structure 12.

[0049] For example, refer to Figure 2 、 Figure 3 and Figure 4, when the laser beam scans the bonding layer 13 area at the position of one of the adsorption areas 34, the suction cup 30 at the position of the adsorption area 34 can be lifted by the lifting component 40 corresponding to the adsorption area 34, so that a gap is generated between the first layer structure 11 and the second layer structure 12 at the position of the adsorption area 34, thereby realizing local separation. This can prevent the bonding layer 13 area that has been heated and debonded at the position of this adsorption area 34 from condensing and bonding again when the subsequent laser beam scans the bonding layer 13 at the positions of other adsorption areas 34, and can separate the two layer structures at the adsorption area 34 immediately after the laser scans one adsorption area 34. Subsequently, after the laser beam scans the bonding layer 13 area at the position of the next adsorption area 34, the lifting component 40 corresponding to the next adsorption area 34 lifts the suction cup 30 at this adsorption area 34, so that the two layer structures at the position of this adsorption area 34 are separated. Subsequently, the bonding layer 13 areas at the positions of all adsorption areas 34 are scanned by the laser beam for debonding → the corresponding lifting component 40 lifts the suction cup 30 at the adsorption area 34, so that the two layer structures are separated at the position of the adsorption area 34. Thus, the entire bonding layer 13 is debonded, and the entire bonding layer 13 area of the two layer structures is lifted and separated to completely debond and peel the two layer structures.

[0050] In addition, when controlling the focus of the laser beam to scan the bonding layer 13, the scanning can start from the bonding layer 13 area at the position of the outermost adsorption area 34, and the corresponding lifting component 40 is started for lifting and separating. All the bonding layer 13 areas at the positions of the adsorption areas 34 are scanned in sequence from the outer circle to the inner circle, so as to realize the scanning of the entire bonding layer 13 area. Since when debonding the inner circle, the outer circle has been debonded to form molten, gaseous or plasma substances, the bonding materials such as molten, gaseous or plasma generated during the debonding process of the inner circle can overflow outward.

[0051] It can be set that the materials of the suction cup 30, the second layer structure 12, the pull rod 41 and the central pull rod 41 are the same, so as to facilitate the selection of the laser wavelength, enable the laser to penetrate through the suction cup 30 and the second layer structure 12 to perform laser debonding on the bonding layer 13, and at the same time, the pull rod 41 or the central pull rod 41 does not affect the laser penetration efficiency, preventing the pull rod 41 from affecting the uneven scanning of the bonding layer 13. Specifically, the materials of the suction cup 30, the second layer structure 12, the pull rod 41 and the central pull rod 41 can all be quartz materials to prevent the suction cup 30 and the second layer structure 12 from affecting the laser transmittance. In addition, the first layer structure 11 can be a wafer, and the second layer structure 12 can be a substrate, that is, the wafer is fixed on the stage 10, and the laser beam penetrates through the substrate. This can reduce the difficulty of peeling the wafer and the substrate during the laser debonding process. At the same time, by preventing the laser beam from passing through the wafer, it can prevent the laser beam from affecting the electrical performance of the microelectronic devices on the wafer.

[0052] By dividing the adsorption end face 31 of the suction cup 30 into at least three adsorption areas 34, and correspondingly arranging a set of lifting components 40 for each adsorption area 34, it is possible to apply a pulling force to a certain adsorption area 34 of the suction cup 30 separately. During the laser debonding process, after the bonding layer 13 area of the laser scanning part, the corresponding adsorption area 34 of the suction cup 30 can be immediately lifted, so that the two layer structures at the position of this adsorption area 34 are separated. Thus, it is not necessary to wait until the entire bonding layer 13 is laser scanned and then apply a pulling force to the suction cup 30, shortening the time from scanning a part of the bonding layer 13 area to separating the two layer structures in this part of the area, preventing the bonding layer 13 in a molten state due to being heated by the laser in this part of the area from condensing and bonding again. Therefore, it is not necessary to apply a large pulling force to the suction cup 30, reducing the peeling difficulty; and it is not necessary to scan the bonding layer 13 multiple times, thereby reducing the peeling time and improving the peeling efficiency.

[0053] In addition, referring to Figure 8 , the embodiment of the present invention also provides a laser debonding device, and this laser debonding device includes any one of the above-mentioned stage 10 components. By dividing the adsorption end face 31 of the suction cup 30 into at least three adsorption areas 34, and correspondingly arranging a set of lifting components 40 for each adsorption area 34, it is possible to apply a pulling force to a certain adsorption area 34 of the suction cup 30 separately. During the laser debonding process, after the bonding layer 13 area of the laser scanning part, the corresponding adsorption area 34 of the suction cup 30 can be immediately lifted, so that the two layer structures at the position of this adsorption area 34 are separated. Thus, it is not necessary to wait until the entire bonding layer 13 is laser scanned and then apply a pulling force to the suction cup 30, shortening the time from scanning a part of the bonding layer 13 area to separating the two layer structures in this part of the area, preventing the bonding layer 13 in a molten state due to being heated by the laser in this part of the area from condensing and bonding again. Therefore, it is not necessary to apply a large pulling force to the suction cup 30, reducing the peeling difficulty; and it is not necessary to scan the bonding layer 13 multiple times, thereby reducing the peeling time and improving the peeling efficiency.

[0054] The above are only the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present invention should be covered by the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A stage assembly is applied during the laser debonding process of the to-be-debonded component. Among them, The bonding part to be released includes a first layer structure and a second layer structure bonded through a bonding layer. The shapes of both the first layer structure and the second layer structure are disc-shaped. It is characterized in that the carrier table assembly includes: A carrier table for fixing the first layer structure; A disc-shaped suction cup having opposite adsorption end faces and a connection end face. The adsorption end face is used for adsorbing on the surface of the second layer structure. The adsorption end face is divided into at least three adsorption areas, and the three adsorption areas include a circular adsorption area located at the center of the suction cup and at least two annular adsorption areas arranged in sequence outward from the circular adsorption area; At least three groups of lifting components corresponding one-to-one to the at least three adsorption areas. Each group of lifting components is used to lift the corresponding adsorption area upward after the bonding layer at the position of the corresponding adsorption area undergoes a phase change when heated by a laser, so that the first layer structure and the second layer structure are separated at the position of the corresponding adsorption area; Among them, during the laser debonding process, the suction cup is adsorbed on the surface of the second layer structure, and the laser beam sequentially passes through the suction cup and the second layer structure and then is focused on the bonding layer. When controlling the focus of the laser beam to scan the bonding layer, the bonding layer at all the adsorption area positions is scanned from the outer circle to the inner circle in sequence, and after the scanning of the bonding layer at the corresponding position of each adsorption area is completed, the adsorption area is lifted to separate the corresponding positions of the first layer structure and the second layer structure.

2. The stage assembly according to claim 1, wherein It further includes at least three vacuum pumps; The at least three vacuum pumps correspond one-to-one to the at least three adsorption areas. Each vacuum pump is used to adjust the suction force of the corresponding adsorption area, and the suction forces of the at least three adsorption areas increase from the outer circle to the inner circle of the adsorption end face.

3. The stage assembly according to claim 1, wherein Each group of the at least two groups of lifting components corresponding to the annular adsorption areas includes: At least three edge tie rods, each edge tie rod is connected to the connection end face of the suction cup, and the connection points of all the edge tie rods in the same group of lifting components with the connection end face are circumferentially and uniformly distributed around the center of the suction cup; A lifting mechanism for lifting the at least three edge tie rods along the axial direction of the suction cup.

4. The stage assembly according to claim 3, wherein, The connection points between the at least three edge tie rods in each group of lifting components and the connection end face are located within the annular adsorption area corresponding to this group of lifting components.

5. The stage assembly according to claim 3, wherein, The group of lifting components corresponding to the circular adsorption area includes: A central tie rod, and the connection point between the central tie rod and the suction cup is located at the center position of the connection end face; A lifting mechanism for lifting the central tie rod along the axial direction of the suction cup.

6. The stage assembly according to claim 5, wherein, The materials of the suction cup, the second layer structure, the edge tie rods and the central tie rod are the same.

7. The stage assembly according to claim 5, characterized in that, Among the at least three groups of lifting components, the step of the connection points between the tie rods and the connection end face in the radial direction of the suction cup between any two adjacent groups of lifting components gradually decreases from the edge of the suction cup to the center of the suction cup.

8. The stage assembly according to claim 5, wherein, Each group of the at least two groups of lifting components corresponding to the annular adsorption areas further includes a bracket having at least three arms; The three support arms correspond one by one to at least three edge tie rods in the corresponding set of lifting components; each support arm is connected to the corresponding edge tie rod, and the axial direction of each edge tie rod is parallel to the axial direction of the suction cup.

9. The stage assembly according to claim 8, characterized in that, The lifting mechanism is a rack and pinion lifter. Among them, the rack of the rack and pinion lifter is fixedly connected to the bracket or the central tie rod, and the transmission direction of the rack coincides with the axial direction of the suction cup.

10. A laser debonding device, characterized in that, It includes the load platform assembly according to any one of claims 1 to 9.

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