Use an actuating air to cool an air-actuated valve

Abstract

A valve, which includes a valve body. The actuating housing of the valve body surrounds an actuating chamber. The actuating housing includes a first port configured to admit actuating air and a second port configured to discharge the actuating air. A lift head is configured to move within the valve body and includes a baffle located within the actuating chamber. The lift head is actuated to an open position using the actuating air entering the first port. When the lift head is in the open position, the actuating air flowing between the first port and the second port cools the rod.

Description

Technical Field

[0001] This embodiment relates to a valve for controlling fluid flow. In particular, the valve includes an actuating housing configured to actuate a lift head using actuating air. The valve is configured for cooling such that when the lift head is in an open and / or closed position, actuating the air flowing between a first port and a second port cools the rod. Background Art

[0002] Many modern semiconductor manufacturing processes are carried out in plasma process modules, where substrates are held on substrate holders while being exposed to plasma. Deposition of thin films is one of the key processes in semiconductor manufacturing. A typical wafer undergoes deposition of several thin films, some of which may be fully or partially retained in the final electronic device, while others may only be temporarily retained on the wafer and serve some intermediate processing needs. For example, an ashing-hardened mask film can be used as an etching hard mask layer. Such a film is first deposited on the wafer and then partially removed to define a circuit line pattern. Then some underlying dielectric is removed using an etchant, thereby forming trenches and vias for future circuit lines. Finally, all remaining ashing-hardened mask film is removed from the wafer. Various deposition processes are used to deposit thin films. For example, chemical vapor deposition (CVD) or more specifically plasma-enhanced chemical vapor deposition (PECVD) processes can be used to deposit the ashing-hardened mask film.

[0003] As a result of almost any deposition process, film material is deposited not only on the wafer but also on the inner surfaces of the deposition chamber, thereby forming residues. Over time, these residues accumulate and dissolve, separate, or otherwise disperse in the deposition chamber, thus causing contamination. The accumulated residues are periodically removed to avoid such contamination. A remote plasma cleaning (RPC) process can be performed to deliver plasma-activated species contained in a cleaning reagent mixture to the deposition chamber. The cleaning mixture is generated in a remote plasma generator separated from the deposition chamber and is delivered through an RPC delivery system. After delivery, the plasma-activated species in the deposition chamber etch the deposited residues for removal.

[0004] However, the activated species may recombine as they flow into the deposition chamber. Recombination generates excessive heat within the RPC delivery system, which may cause the system to malfunction. For example, the heat may reduce the service life of seals within the RPC delivery system, where the seals can be configured to isolate the RPC delivery system from the deposition chamber during processing operations (e.g., deposition). Failure of the seals may allow process gases to escape from the deposition chamber and pass through the RPC delivery system, thereby disabling the benefits of the isolation valve and having an adverse impact on process conditions.

[0005] The background description provided here is for the purpose of presenting the background of the present disclosure generally. The operations of the currently named inventors are neither expressly nor impliedly admitted to be prior art to the present disclosure to the extent that they are described in this background art section and in various aspects of the specification that could not be determined to be prior art at the time of filing the application.

[0006] Embodiments of the present disclosure arise in this context. Summary of the Invention

[0007] This embodiment relates to solving one or more problems found in the related art and specifically includes a valve for controlling fluid flow, wherein the valve in the open and / or closed position is configured to actuated an internal flow of air to cool internal components of the valve. Several creative embodiments of the present disclosure are described below.

[0008] Embodiments of the present disclosure include a valve. The valve includes an actuating housing of the valve body and surrounding an actuating chamber, the actuating housing including a first port configured to admit actuating air and a second port configured to discharge the actuating air. A lift head is configured to move within the valve body and includes a baffle located within the actuating chamber, and the actuating air entering the first port is used to actuate the lift head to the open position. When the lift head is in the open position, the actuating air flowing between the first port and the second port cools the rod.

[0009] Other embodiments of the present disclosure include a method for operating a valve. The method includes providing actuating air to a first port of an actuating housing of the valve body. The actuating housing surrounds an actuating chamber. A lift head is configured to move within the valve body and includes a baffle located within the actuating chamber. The method includes using the actuating air entering the first port to actuate the lift head to the open position. The method includes discharging the actuating air entering from the first port through a second port of the actuating housing to the atmosphere when the lift head is in the open position. The method includes using the actuating air flowing between the first port and the second port of the actuating housing to cool the rod.

[0010] Other embodiments of the present disclosure include valves suitable for use with a processing chamber. The valve includes a valve body configured to control the flow of plasma from a remote source (e.g., a remote plasma cleaning (RPC) source) to the processing chamber. The valve includes a sealing chamber of the valve body surrounding a sealing cavity. The sealing housing includes an inlet port configured for plasma entry and an outlet port configured to provide a passage from the sealing cavity to the processing chamber. The valve includes an actuator housing surrounding an actuator cavity. The actuator housing includes a common wall separating the sealing cavity from the actuator cavity, a first port configured for actuator air entry, and a second port configured for discharging actuator air. The valve includes a lift head configured to move within the valve body. The lift head includes a rod that connects a sealing plunger located within the sealing cavity to a baffle located within the actuator cavity through a first opening in the common wall. The lift head is actuated to an open position using actuator air entering the first port.

[0011] Other embodiments of the present disclosure include a method for cleaning a processing chamber. The method includes actuating a valve to an open position using actuator air. The method includes providing plasma from a remote source (e.g., a remote plasma cleaning source, i.e., an RPC source) to a valve configured to control the flow of plasma to the processing chamber. The method includes discharging actuator air from the valve to the atmosphere to cool the valve when the valve is in the open position.

[0012] Other embodiments of the present disclosure include a cleaning system for cleaning a processing chamber configured to deposit a film on a wafer. The cleaning system includes a plasma processing chamber that further includes a pedestal configured to support the wafer. The cleaning system includes a showerhead configured to direct a process gas toward the wafer. The cleaning system includes a remote source (e.g., a remote plasma cleaning source, i.e., an RPC source) for generating plasma. The cleaning system includes a valve for controlling the flow of plasma to the processing chamber. The valve includes a valve body configured to control the flow of plasma to the processing chamber. The valve includes a sealing housing surrounding a sealing cavity. The sealing housing includes an inlet port configured for plasma entry and an outlet port configured to provide a passage from the sealing cavity to the processing chamber. The valve includes an actuator housing of the valve body and surrounding an actuator cavity. The actuator housing includes a common wall separating the sealing cavity from the actuator cavity, a first port configured for actuator air entry, and a second port configured for discharging actuator air. The valve includes a lift head configured to move within the valve body. The lift head includes a rod that passes through a first opening in the common wall to connect a sealing plunger located within the sealing cavity to a baffle located within the actuator cavity. The lift head is actuated to an open position using actuator air entering the first port.

[0013] Those skilled in the art will appreciate these and other advantages by reading the entire specification and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] These embodiments can be best understood by reference to the following description in conjunction with the accompanying drawings.

[0015] Figure 1A Illustrated is an overall system including a processing chamber adapted to deposit a film on a wafer and / or substrate and a cleaning device configured to remove residues from the inner surface of the reactor system.

[0016] Figure 1B is a top view of a multi-station processing tool according to an embodiment of the present disclosure, wherein each processing tool includes a cleaning device configured to remove residues from the inner surface of the corresponding processing station and / or processing chamber.

[0017] Figure 2A is a diagram of a valve system configured to control fluid flow according to an embodiment of the present disclosure, wherein the valve is in an open position and wherein an actuating air flow cools the valve.

[0018] Figure 2B is a diagram of a valve system configured to control fluid flow according to an embodiment of the present disclosure, wherein the valve is in a closed position and wherein an actuating air flow cools the valve.

[0019] Figures 3A - 3C is a diagram of a valve that controls fluid flow when the valve moves to the open position as Figure 2A described.

[0020] Figure 4 is a diagram of a valve system configured to control fluid flow according to an embodiment of the present disclosure, wherein the valve is in a closed position.

[0021] Figure 5A , 5B , 5C-1 and 5C-2 are diagrams of valves that control fluid flow when the valve moves to the closed position as Figure 2B described.

[0022] Figure 6 is a cross-sectional view of the top of a first configuration of a valve configured to control fluid flow according to an embodiment of the present invention, wherein in the open or closed position, an actuating air flow cools the interior of the valve.

[0023] Figure 7 is a flow chart showing a method for cooling a valve configured to control fluid flow using actuating air according to an embodiment of the present disclosure. Detailed Description

[0024] Although, for purposes of illustration, the following detailed description contains many specific details, those of ordinary skill in the art will understand that many variations and changes to the following details are within the scope of the present disclosure. Accordingly, aspects of the present disclosure described below are set forth without loss of generality of the claims that follow this specification and without imposing limitations thereon.

[0025] Generally, various embodiments of the present disclosure describe systems and methods for using an actuated air-cooled valve. In particular, a piston valve actuated using actuated air (e.g., compressed dry air - CDA) uses the actuated air for cooling to cool the internal components of the valve, thereby extending the service life of the valve when exposed to high temperatures. Specifically, the actuated air is used to cool the valve in direct contact with the housing of one or more seals. In this manner, embodiments of the present disclosure provide local cooling of the rod, which enables all seals mounted on or near the rod to operate at a lower temperature. Additionally, using the actuated air to cool the rod of the valve is sufficient to cool the components of the valve. Thus, no additional coolant or system is required to cool the valve. Moreover, embodiments of the present disclosure provide tight control over the cooling time during valve cooling.

[0026] With the above general understanding of the various embodiments, exemplary details of the embodiments will now be described with reference to the various figures. Elements and / or components with like numbers in one or more of the figures generally mean having the same configuration and / or function. Additionally, the figures may not be drawn to scale and are intended to illustrate and emphasize novel concepts. Clearly, the present embodiments can be practiced without some or all of these specific details. In other instances, well-known process operations have not been described in detail so as not to unnecessarily obscure the presented embodiments.

[0027] Figure 1A A plasma processing system 100 is shown, which includes a processing chamber 102 suitable for performing one or more plasma processing operations (e.g., depositing a film on a wafer and / or substrate, atomic layer deposition (ALD) etching, cleaning, etc.), and an RPC cleaning system configured to remove residues from the inner surface of the processing chamber 102. In one embodiment, for the purpose of isolating the RPC path, a valve 120 actuated using actuated air can be implemented within the reactor system 100.

[0028] Figure 1A It is shown only to illustrate one use case of the valve 120 (e.g., wafer fabrication in a plasma processing module), where actuated air can be used to cool one or more components of the valve 120 during operation (e.g., a cleaning process). In other embodiments, the valve 120 can be implemented within any system that exposes the valve 120 to high temperatures, such that the actuated air can be used to cool the valve 120 at high temperatures to reduce the operating temperature of the valve 120 and extend the life of the valve 120.

[0029] More specifically, Figure 1A a plasma processing system 100 is described that is used to process a wafer 101. For example, the plasma processing module can be used in a plasma etching chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a bevel etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, a plasma enhanced chemical vapor deposition (PECVD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, an orbit chamber or module, and any other semiconductor processing system that can be associated with or used in the manufacture and / or preparation of semiconductor wafers to include processes such as electroplating, electroetching, electropolishing, electrochemical mechanical polishing, deposition, wet deposition, and through-silicon via (TSV) processes.

[0030] In Figure 1A an embodiment, the term "substrate" as used herein refers to a semiconductor wafer in the embodiments of the present disclosure. However, it should be understood that in other embodiments, the term substrate can refer to a substrate formed of sapphire, GaN, GaAs, or SiC, or other substrate materials, and can include glass panels / substrates, metal foils, metal sheets, polymer materials, and the like.

[0031] The processing chamber 102 includes a susceptor 140. The semiconductor substrate 101 is shown disposed above the susceptor 140. A showerhead 150 is used to supply process gases for generating and creating a plasma in the chamber 102. During plasma processing (e.g., deposition, etching, etc.), one or more gases are supplied to the processing chamber 102, depending on the process recipe being executed. A controller 110 is used to provide instructions to the various components of the reactor system 100, including facilities for gas supply 114, pressure control, temperature control, and other processing parameters. A sensor 115 can be configured to sense various control parameters of the plasma processing system for process control (e.g., deposition, cleaning, etc.).

[0032] For example, the controller 110 may execute process input and control 108 to include a process recipe, such as power levels, timing parameters, process gases, mechanical movement of the wafer 101, etc., for example, to deposit or form a film on the wafer 101. Depending on the process being executed, the control module 110 controls the delivery of the process gas. The selected gas then flows into the showerhead 150 and is distributed in the volume of space defined between the face of the showerhead 150 facing the wafer 101 and the wafer 101 placed on the pedestal 140. Appropriate valve control and mass flow control mechanisms may be employed to ensure the delivery of the correct gas during the deposition and plasma processing stages of the process. The process gas exits the chamber through the outlet. The vacuum pump 185 evacuates the process gas through a closed-loop controlled flow restriction device (such as a throttle valve or a swing valve) and maintains an appropriate low pressure inside the reactor.

[0033] The substrate processing system 100 may be configured to cool the valve 120 (e.g., an isolation valve configured to control the flow of RPC plasma into the processing chamber). For example, the controller 110 may control the actuation of the valve 120 to isolate the valve 120 from the chamber 102 during plasma processing, or to introduce a cleaning reagent into the chamber 102 during a cleaning operation, and / or to use actuation air to cool the valve 120 during a cleaning operation. As Figure 1A shown, the actuation air (e.g., CDA) piston-actuated valve uses actuation air cooling to protect the seals configured to isolate the chamber of the valve from the processing chamber from high-temperature conditions, thereby extending the life of the valve 120. The exposure of the valve 120 to high temperatures may be partially due to plasma (e.g., from an RPC source) recombination in the chamber of the valve 120, and / or heat generated in the processing chamber during a cleaning operation or any other plasma processing operation.

[0034] Generally, in one embodiment, actuation air (e.g., CDA) is used to cool the stem of the valve 120 that is in direct contact with the housing of one or more seals. In this way, the embodiments of the present disclosure provide local cooling of the stem, which enables all the seals mounted on or near the stem to operate at a lower temperature. Additionally, using actuation air (e.g., CDA) to cool the stem of the valve 120 is effective for cooling the components of the valve 120. For example, using actuation air provides effective cooling such that Figure 1A the substrate processing system 100 does not require any additional coolant or system to cool the valve 120, such as during a cleaning operation. Additionally, the embodiments of the present disclosure provide tight control over the cooling time while the valve 120 is being cooled, as will be described below.

[0035] A remote plasma cleaning (RPC) cleaning system can be configured to remove residues from the inner surface of the processing chamber 102. The valve system 200 can be controlled using the control module 110 or in combination with another controller to control the process conditions during the cleaning operation. For example, the cleaning reagent 111 and an optional inert gas are introduced into the processing chamber 102 via the RCP unit 112 (e.g., an RPC generator), which reacts with the residues (e.g., formed during deposition) and forms volatile products, and the volatile products are pumped out of the chamber 102 using the exhaust pump 185.

[0036] To accelerate the cleaning process, the cleaning reagent 111 is activated in the remote plasma cleaning (RPC) unit 112 to form cleaning reagent free radicals, ions, and energetic atoms and molecules, resulting in a cleaning mixture that is more reactive (e.g., more reactive with the residues) than the more stable cleaning reagent 111.

[0037] The RPC unit 112 can include a high-power radio frequency (RF) generator that provides energy to dissociate the cleaning reagent into free radicals in the RPC unit 112, and the free radicals then form reactive atoms and ions, which are then used to etch the residues. For example, a fluorine-containing cleaning reagent can be introduced into the RPC unit 112 that is remote from or external to the processing chamber 102 to generate a plasma (e.g., a cleaning mixture) that includes the cleaning reagent with activated species for cleaning the processing chamber 102. The RPC unit 112 can be a stand-alone device that uses the cleaning reagent 111 to generate a weakly ionized plasma.

[0038] After passing through the RPC unit 112, the plasma or cleaning mixture is introduced into the processing chamber 102 for cleaning, which can involve flowing the plasma through a distribution path connecting the RPC unit 112 and the processing chamber 102, where the plasma can be introduced into the processing chamber 102 through the showerhead 150. The distribution path includes a valve 120 (e.g., an isolation valve) that is configured to control the flow of the plasma to the processing chamber 102 and, more specifically, to isolate the RPC unit 112 from the processing chamber 102. In one embodiment, the actuation air is compressed dry air (CDA), where the source 113 is a CDA source. The plasma (cleaning mixture) reacts with the residues inside the processing chamber 102 to form volatile compounds. The remaining unreacted mixture, inert gas, and volatile compounds are then exhausted from the chamber 102, for example, using the exhaust pump 185.

[0039] The RPC unit 112 provides highly activated cleaning reagent 111, but many of these activated species can return to their neutral state before reaching the processing chamber 102. For example, the activated cleaning reagent can recombine while flowing towards the processing chamber, such as in valve 120. In particular, the activated cleaning reagent can include neutral fluorine radicals, some of which can recombine into a non-reactive form along the distribution path leading to the processing chamber 102. Heat can be generated during recombination. Recombination within valve 120 generates excessive heat, and the untreated heat may overly increase the operating temperature of valve 120, leading to premature damage of valve 120, including one or more seals configured to isolate the plasma and / or gas within the processing chamber 102 from the actuation air source 113. For example, the seals (e.g., O-rings) can be formed of perfluoroelastomer (FFKM) that decomposes at extreme temperatures. Additionally, the heat may damage other components, such as an optional optical sensor (not shown) configured to sense the position and / or state of valve 120.

[0040] For illustrative purposes, the range of the cleaning process cycle can be between 5 and 15 minutes. One to three consecutive cleaning process cycles can be performed, where the entire time period of the cleaning process (e.g., one or more cleaning process cycles) can be between 5 and 30 minutes in one implementation, between 5 and 20 minutes in another implementation, such as 5 to 15 minutes. For illustrative purposes, in some implementations, the operating temperature of valve 120 (e.g., within the seal cavity 250) and / or the processing chamber during the cleaning process (e.g., one or more cleaning process cycles) can be about 50 - 300 degrees Celsius. In other implementations, the operating temperature of valve 120 and / or the processing chamber during the cleaning process can be about 100 - 250 degrees Celsius. In other implementations, the operating temperature of valve 120 and / or the processing chamber during the cleaning process can be about 100 - 200 degrees Celsius. In another implementation, the operating temperature of valve 120 and / or the processing chamber during the cleaning process can be about 200 degrees Celsius. Higher temperatures may be introduced in the isolation region of the isolation valve.

[0041] Figure 1BA top view of a multi-station processing tool according to an embodiment of the present disclosure, where each processing station may include a corresponding RPC cleaning system configured to remove residues from the inner surfaces of the corresponding processing station and / or processing chamber. Some components of each RPC cleaning system may be shared between stations. For example, the RPC unit 112 may support one or more processing chambers 102. In one embodiment, the RPC unit 112 may support one or more (e.g., four) plasma processing systems and / or stations. As shown, each plasma processing system includes a corresponding valve 120 (e.g., an isolation valve) connected to the RPC unit 112, where the isolation valve is configured to control the flow of plasma (cleaning mixture) to the corresponding processing chamber 102. For example, the RPC unit 112 delivers plasma to the processing chamber 102A via the valve 120A of the first station, delivers plasma to the processing chamber 102B via the valve 120B of the second station, delivers plasma to the processing chamber 102C via the valve 120C of the third station, and delivers plasma to the processing chamber 102D via the valve 120D of the fourth station.

[0042] Figure 2A A diagram of a valve system 200 configured to control (e.g., isolate) the flow of fluid 221 according to an embodiment of the present disclosure. The valve system 200 includes a valve 120 configured to control the flow of fluid 221. As Figure 2A shown, actuation air 215 from an air source 210 is used to actuate the valve 120 to the open position. In one embodiment, the actuation air is compressed dry air (CDA). According to an embodiment of the present disclosure, when the valve 120 is in the open position, the actuation air continues to flow and cools the valve 120 during the cleaning operation.

[0043] The valve includes a valve body 127 configured to control the flow of fluid 221. The valve body 127 includes a top cover 122 and a bottom cover 123. A receiving wall 121 connects the top cover 122 and the bottom cover 123.

[0044] The valve 120 includes a sealed housing 127b of the valve body 127, which is configured to surround a sealing cavity 250 located at the bottom of the valve. The sealed housing 127b includes a fluid inlet port 126 and a fluid outlet port 125. The fluid inlet port 126 of the sealed housing 127b is located in the receiving wall 121 and is configured for fluid 221 to enter from the fluid source 225. As previously described, the fluid 221 is generated by the fluid source 225 for distribution controlled by the valve 120. The fluid outlet port 125 of the sealed housing 127b of the valve body 127 is located in the bottom cover 123. The fluid outlet port 125 is configured to deliver the fluid 221 to a predetermined target via the sealing cavity 250. When the valve is in the open position, the fluid 221 enters the sealing cavity 250 through the fluid inlet port 126 and flows out through the fluid outlet port 125 located in the bottom cover 123 for delivery to the target.

[0045] The valve body 127 includes an actuating housing 127a surrounding an actuating cavity 255. The actuating housing 127a includes a common wall 124 separating the sealing cavity 250 from the actuating cavity 255. The actuating housing 127a includes an opening (e.g., a first opening) 265 in the common wall 124, which is configured to provide a passage between the sealing cavity 250 and the actuating cavity 255. In addition, the actuating housing 127a includes another opening (e.g., a second opening) 264, which is configured within the top cover 122. In one embodiment, for example, during the movement of the rod 241, the rod 241 can extend from the baffle 242 through the opening 264. In one embodiment, the second opening 264 is aligned with the first opening 265 for the rod 241 to travel through the openings 264 and 265.

[0046] Moreover, the actuating housing 127a includes a first port 261 configured for actuating air to enter and a second port 263 configured for discharging the actuating air. The first port is configured within the receiving wall 121 and is configured for the actuating air 215 delivered from the air source 210 to enter, where the actuating air 215 is used to move the valve 120 to the open position. In one embodiment, the actuating air is CDA. The second port 263 (e.g., the discharge port) is located within the receiving wall 121 and is configured to allow the actuating air 215 to be discharged from the actuating cavity 255 as a gas discharge 275.

[0047] The valve includes a lift head 240 configured to move within the valve body 127. In particular, the lift head 240 includes a rod 241 configured to connect the sealing plunger 243 to the baffle 242. The rod 241 connects the sealing plunger 243 located within the sealing cavity 250 to the baffle 242 located within the actuating cavity 255 through the first opening 265 in the common wall 124. The lift head 240 is actuated to the open position using the actuating air 215 entering the first port 261.

[0048] Specifically, the lift head 240 is configured to move linearly within the valve body 127, actuated by the actuating air 215 provided by the air source 210. In Figure 2A , the valve 120 is moved to the open position by the actuating air 215, and the actuating air 215 is conveyed to the first port 261 through a regulating pipe / conveying system for upward actuation. In particular, the baffle 242 is configured to move linearly within the actuating chamber 255, actuated by the actuating air 215. The linear movement of the baffle 242 is converted into the linear movement of the sealing plunger 243 within the sealing chamber 250 by the rod 241, where the rod 241 is configured to travel through the first opening 265.

[0049] As Figure 2A shown, when the valve 120 is in the open position, the baffle 242 is pushed towards and / or moves linearly towards the top cover 122 by the actuating air 215, as will be described further with reference to Figures 3A - 3C . In this way, the sealing plunger 243 moves linearly to rest against the common wall 121. In one embodiment, the state of the valve 120 is maintained without a continuous flow of actuating air. For example, the state of the lift head 240 within the valve body 127 (e.g., open or closed position) (e.g., by friction) remains stationary. Thus, when the baffle 242 is similarly in the open position, the sealing plunger 243 is positioned to seal the first opening 265 of the sealing chamber 250 and allows the fluid 221 to flow from the fluid inlet port 126 through the sealing chamber 250 to the fluid outlet port 125. More specifically, when the baffle 242 is similarly in the open position, the actuating air 215 continues to flow through the actuating chamber 255 between the first port 261 and the second port 263 (e.g., discharge port). In one embodiment, the cooling flow 270 of the actuating air within the actuating chamber 255 cools the rod 241. To achieve optimal cooling, the cooling flow 270 can be controlled, such as the duration of the cooling flow 270, the pressure of the cooling flow 270, the start time of the cooling flow 270, and the end time of the cooling flow 270. The cooling of the rod 241 reduces the operating temperature of the lift head 240, and more specifically, reduces the temperature of the rod and the components in contact with the rod 241, such as the sealing O-ring.

[0050] In one embodiment, the first port 261 and the second port 263 (e.g., the discharge port) are configured such that the valve 120 is fully actuated to the open position before the actuation air is completely discharged as the air discharge 275 through the second port 263. If additional actuation air 215 is required to fully actuate the lift head 240 and / or the valve 120 to the open position, the timer 230 and the discharge logic 220 are configured to control the discharge of the actuation air 215 as the air discharge 275 to the atmosphere. In particular, the discharge logic 220 may be configured as an AND logic, where the first input is the actuation air 215 from the air source 210 and the second input is the air discharge 275 from the second port 263 (e.g., the discharge port). When the discharge logic 220 receives both inputs as true (i.e., receives both the actuation air 215 and the air discharge 275), the discharge logic 220 opens to allow the air discharge 275 to be discharged to the atmosphere. On the other hand, when the discharge logic 220 receives only one input as true, the discharge logic 220 remains closed and prevents the air discharge 275 from being discharged to the atmosphere.

[0051] In one embodiment, the timer 230 (optional) controls the delivery of the actuation air 215 from the air source 210 to the discharge logic 220. That is, the timer 230 is configured to control the cooling (e.g., the start and end of cooling, the cooling period, etc.) and does not interfere with the actuation. The timer 230 controls the time during which the actuation air 215 is prevented from being received as an input to the discharge logic 220. In one implementation, as long as the timer is actuated and has not expired, the actuation air 215 is blocked from flowing as an input to the discharge logic 220. In some implementations, even when the second port 263 is exposed to the actuation chamber 255 below the baffle 242 such that the actuation air 215 can be discharged, when the discharge logic 220 is closed to prevent the air discharge 275 from flowing to the atmosphere (e.g., the passage leading to the atmosphere is blocked), the pressure below the baffle 242 in the chamber 255 remains at the pressure of the actuation air supplied to the discharge logic 220. For example, it may be necessary to allow the actuation air 215 to actuate the lift head 240 to the fully open position for a longer time. Additionally, it may be necessary to delay the cooling of the rod 241 by preventing the actuation air 215 from being discharged to the atmosphere through the discharge logic 220 (e.g., kept closed by the operation of the timer 230). Once the discharge logic 220 opens, the actuation air 215 flows through the actuation chamber as the cooling flow 270 to cool the rod 241, leaves as the air discharge 275, and reaches the atmosphere through the discharge logic 220. In another embodiment, the timer 230 controls the delivery of the air discharge 275 from the discharge port 263 rather than controlling the actuation air 215 as an input to the discharge logic 220.

[0052] Figure 2BFIG. is a diagram of a valve system 200' configured to control fluid flow according to an embodiment of the present disclosure, where the valve is in a closed position and where an actuating air flow cools the valve. Figure 2B The illustrated valve system 200' is the same as Figure 4 the illustrated valve system 200, having the same components; however, Figure 2B the valve in enables the actuating air used to close the valve to be discharged to the atmosphere, thereby enabling the valve to cool, as opposed to Figure 4 the case in which the actuating air is prevented from being discharged to the atmosphere.

[0053] In particular, Figure 2B the valve system 200' of includes a valve 120 configured to control the flow of fluid 221. As shown, the valve 120 is actuated to the closed position using actuating air 215 from an air source 210. In one embodiment, the actuating air is compressed dry air (CDA). As Figure 2B shown, when the valve 120 is in the closed position, even though the fluid 221 is blocked from leaving the valve 120, the actuating air 215 continues to flow and cools the valve 120. More specifically, when the baffle 242 is similarly moved to the closed position, the actuating air 215 continues to flow through the actuating chamber 255 between the third port 262 and the second port 263 (e.g., the discharge port) and leaves the actuating chamber 255 as an air discharge 275'. In one embodiment, the cooling flow 272 of the actuating air within the actuating chamber 255 cools the rod 241. To achieve optimal cooling, the cooling flow 272 can be controlled, such as the duration of the cooling flow 272, the pressure of the cooling flow 272, the start time of the cooling flow 272, the end time of the cooling flow 272, the temperature of the cooling flow 272, etc. The cooling of the rod 241 reduces the operating temperature of the valve 120, and more specifically, reduces the temperature of the rod of the lift head 240 and the components in contact with the rod 241, such as the temperature of the sealing O-ring, the sealing housing 127b, the actuating housing 127a, etc.

[0054] In Figure 2BIn the configuration, timer 230 controls the actuation air 215 to be delivered from air source 210 to discharge logic 220. As previously described, discharge logic 220 can be configured as AND logic, where the first input is the actuation air 215 from air source 210 and the second input is the air discharge 275' from the second port 263 (e.g., the discharge port). For example, if additional actuation air 215 is required to fully actuate the lift head 240 and the corresponding valve 120 to the closed position, timer 230 (optional) and discharge logic 220 are configured to control the actuation air 215 to be discharged as air discharge 275' to the atmosphere. Timer 230 is configured to control the cooling of valve 120 (e.g., start and end of cooling, cooling cycle, etc.) when moving to and in the closed position, and does not interfere with actuation. Timer 230 controls the time when actuation air 215 is prevented from being received as an input to discharge logic 220. In one implementation, when valve 120 moves to the closed position, as long as the timer is actuated and has not expired, actuation air 215 is prevented from flowing as an input to discharge logic 220. Thus, even if the second port 263 is exposed to the actuation chamber 255 above the baffle 242, allowing actuation air 215 to be discharged, air discharge 275' is still prevented from flowing into the atmosphere (e.g., the passage to the atmosphere is blocked) when discharge logic 220 is closed. Since discharge logic 220 remains closed, actuation air 215 continues to fill actuation chamber 255 and is used to push baffle 242 towards the common wall 124, thereby moving lift head 240 to the closed position. That is, the pressure of gas discharge 275' and actuation air 215 continues to actuate lift head 240 to the closed position. For example, it may be necessary to allow more time for actuation air 215 to actuate lift head 240 to the fully closed position. Additionally, it may be desirable to delay the cooling of rod 241 (e.g., keep closed through the operation of timer 230) by preventing actuation air 215 from being discharged as air discharge 275' through discharge logic 220. Once discharge logic 220 opens, actuation air 215 flows through actuation chamber 255 as cooling flow 272 to cool rod 241, exits as air discharge 275', and reaches the atmosphere through discharge logic 220. In another embodiment, timer 230 controls the delivery of air discharge 275' from discharge port 263, rather than controlling actuation air 215 as an input to discharge logic 220.

[0055] Figures 3A - 3C is according to an embodiment of the present disclosure Figure 2A is an illustration of valve 120 shown in when the valve moves from the closed position to the open position, where valve 120 controls the flow of fluid 221. In Figure 3AIn [the situation], the lift head 240 is in the closed position, causing the rod 241 to linearly move towards the bottom cover 123. In this way, the sealing plunger 243 rests against the bottom cover 123, and more specifically, the O-ring 371 is in contact with both the bottom cover 123 and the sealing plunger 243 to isolate the sealing cavity 250 from the exterior of the valve 120. To move the lift head 240 (and the valve 120) to the open position, the actuating air 215 is introduced through the first port 261 into the actuating cavity 255. When the actuating air 215 fills the space below the baffle 242 in the actuating cavity 255, the pressure causes the baffle 242 to linearly move towards the top cover 122. In one embodiment, the actuating air 215 is CDA. In this implementation, when the actuating air fills the space below the baffle 242 in the actuating cavity 255, the baffle 242 linearly moves towards the top cover 122. In one embodiment, in the closed position, the actuating air 215 does not discharge from the actuating cavity 255 because the second port 263 (e.g., the discharge port) is blocked from entry by the position of the baffle 242.

[0056] In one implementation, the estimated time to open the valve 120 from the closed position is about 0.2 to 45 seconds. In another implementation, the estimated time to open the valve ranges between about 1 to 30 seconds. In another implementation, the estimated time to open the valve ranges between about 0.2 to 30 seconds. In another implementation, the estimated time to open the valve ranges between about 0.2 to 10 seconds. In other implementations, the estimated time to open the valve ranges between about 0.2 to 5 seconds. In another implementation, the estimated time to open the valve ranges between about 0.5 to 3 seconds. In one implementation, the estimated time to open the valve is about 2 seconds.

[0057] In Figure 3B [the situation], the lift head 240 has moved to an intermediate position between the closed position and the open position. Specifically, the baffle 242 linearly moves away from the common wall 124. The residual air remaining in the space of the actuating cavity 255 above the baffle 242 can be discharged through the third port 262. In addition, the sealing plunger 243 linearly moves away from the bottom cover 123. Thus, some fluid flow 221 can flow from the fluid inlet port 126 through the sealing cavity 250 and out from the fluid outlet port 125. As shown, the actuating air 215 still has not discharged from the actuating cavity 255 because the second port 263 (e.g., the discharge port) continues to be blocked from entry by the position of the baffle 242. In one embodiment, the first port 261 and the second discharge port 263 are configured such that the valve 120 can be fully actuated to the open position before the actuating air 215 is completely discharged as the air discharge 275 through the second port 263.

[0058] In Figure 3CIn [the situation], the lift head 240 has moved to the fully open position, for example when the valve 120 is actuated upward. In particular, the baffle 242 has moved linearly away from the common wall 124. In addition, the seal plunger 243 has moved linearly away from the bottom cover 123 and abuts against the common wall 124. Specifically, the O-ring 372 contacts both the seal plunger 243 and the common wall 124, such that the seal chamber 250 is now isolated from the actuation chamber 255. That is, when the lift head 240 is in the open position, the O-ring 372 seals the opening 265 of the seal chamber 250. The O-ring 372 can be disposed on the upper surface of the seal plunger 243. In this way, fluid 221 is prevented from entering the actuation chamber 255 when the lift head and the valve are in the open position. Therefore, when the valve 120 is in the fully open position, the fluid 221 flows through the seal chamber 250 from the fluid inlet port 126 and out of the fluid outlet port 125 without restriction.

[0059] In addition, since the second port 263 (e.g., the discharge port) is now accessible and is located below the baffle 242, the actuation air 215 is now discharging from the actuation chamber 255. That is, the space in the actuation chamber 255 below the baffle 242 is accessible through the second port 263. As previously described, the full actuation of the valve 120 is performed before the actuation air is fully discharged as the air discharge 275 through the second port 263. As shown, the air discharge 275 exits the discharge port 263. In one embodiment, when the valve 120 is in the open position, the actuation air 215 continues to flow into the actuation chamber 255. Since the actuation air 215 can be discharged as the air discharge 275 through the second port 263 (e.g., the discharge port), a cooling flow 270 is generated and can be used to cool the rod 241. In particular, the rod 241 of the lift head 240 serves as a radiator. The surface area of the rod enables heat dissipation, where heat is transferred from the rod 241 to the cooling flow 270 (e.g., by convection). In this way, the temperature of the rod 241 can be controlled by controlling the flow of the actuation air 215 in the cooling flow 270. The flow of the actuation air 215 can be controlled by controlling the discharge pressure of the air. In addition, the cooling cycle can be controlled by controlling the delivery of the actuation air 215 during and / or after the actuation of the valve 120, for example using a timer 230.

[0060] In one embodiment, actuation air 215, which is CDA, flows into the actuation chamber 255 and expands. Cooling of the actuated CDA may occur during expansion. Generally, and for purposes of simplicity and clarity, when the actuated CDA enters the actuation chamber 255 from the first port 261, the expansion of the actuated CDA reduces its temperature. As the now-expanded actuated CDA flows past the rod 241 (e.g., acting as a heat sink), convection is used to transfer heat between the rod 241 and the cooling flow 270 of the actuated air or actuated CDA before the actuated air or actuated CDA is discharged from the actuation chamber 255 as air emissions 275 to the atmosphere. In this way, the temperature of the rod 241 can be controlled by controlling the flow of the actuated air or actuated CDA in the cooling flow 270, as described above. For example, the flow rate of the actuated air or actuated CDA can be controlled by controlling the exhaust pressure of the actuated air or actuated CDA, or by controlling the cooling time with a timer 230.

[0061] In one embodiment, cooling of the rod 241 also results in additional cooling of additional components in contact with the rod. For example, the operating temperature of the O-ring 372 decreases as it cools via the cooling of the rod 241. As shown, the cooling of the rod 241 results in local cooling of the seal plunger 243 and the O-rings 372 and 371. Additionally, the operating temperatures of the actuation housing 127a surrounding the actuation chamber 255 and / or the seal housing 127b surrounding the seal chamber 250 are also cooled by the cooling of the rod 241, resulting in lower operating temperatures.

[0062] Figure 4 is a diagram of a valve system 200 configured to control fluid flow according to an embodiment of the present disclosure, where the valve 120 is configured in a closed position. Figure 4 The illustrated valve system 200 is the same as Figure 2A the illustrated valve system 200 and has the same components. Thus, a complete discussion of the components of the valve system 200 can be found with respect to Figure 2A and Figure 2A The difference between the valve system 200 in 4 and Figure 2A is the state of the valve, where the valve 120 is shown in the open position in Figure 4 while the valve in

[0063] is shown in the closed position. Figure 4 Specifically, the valve system 200 includes a valve 120 configured to control the flow of fluid 221. As Figure 4As shown, in the closed position, the actuating air 215 is prevented from discharging from the actuating chamber 127a and is thus not used to cool the valve 120, and more specifically the stem 241.

[0064] As previously described, the valve includes a valve body 127 configured to control the flow of fluid 221. The sealed housing 127b of the valve body 127 is configured to surround the sealed chamber 250 and includes a fluid inlet port 126 configured for the entry of fluid 221 and a fluid outlet port 125 configured to allow fluid to discharge from the sealed chamber 250.

[0065] The valve body 127 includes an actuating housing 127a surrounding the actuating chamber 255. As previously described, the actuating housing 127a includes a common wall 124 separating the sealed chamber 250 from the actuating chamber 255, with an opening 265 located in the common wall 124. An opening 264 is configured within the top cover 122 and is aligned with the opening 265 in the common wall 124 to facilitate the passage of the stem 241 of the lift head 240 through the openings 264 and 265. The actuating housing 127a includes a third port 262 configured for the entry of the actuating air 215 used to move the lift head 240 to the closed position. As shown, the third port 262 is configured within the receiving wall 121 and is configured for the entry of the actuating air 215 delivered from the air source 210. In one embodiment, the actuating air is CDA. A second port 263 (e.g., a discharge port) is located within the receiving wall 121 and is configured to allow the actuating air 215 to discharge from the actuating chamber 255 as air emissions 275'.

[0066] The valve includes a lift head 240 configured to move within the valve body 127. The lift head 240 is actuated to the closed position using the actuating air 215 entering the third port 262, which is delivered via an adjustment duct / delivery system for downward actuation. In particular, when the valve 120 is in the closed position, the baffle 242 is pushed towards the bottom cover 123 and / or moves linearly towards the bottom cover 123 by the actuating air 215, as will be described with respect to Figures 5A - 5BAs further described with respect to 5C-1. In one embodiment, the state of the valve 120 is maintained without a continuous stream of actuating air. For example, the state (e.g., open or closed position) of the lift head 240 within the valve body 127 is held stationary (e.g., by friction). Thus, when the baffle 242 moves to the closed position, the sealing plunger 243 moves linearly against the bottom cover 123 such that the sealing plunger is positioned and configured to seal the fluid outlet port 125 of the sealing chamber 250 and prevent fluid 221 from flowing out of the fluid outlet port 125 through the sealing chamber 250. An O-ring 371 is configured on the lower surface of the sealing plunger 243, where the O-ring 371 is configured to seal the outlet port of the sealing chamber RPC when the baffle is actuated to the closed position. That is, when the baffle 242 moves to the closed position, the O-ring 371 contacts both the bottom cover 123 and the sealing plunger 243, and the positioning of the O-ring 371 is such that the fluid outlet port 125 of the sealing chamber 250 is sealed, thereby preventing fluid 221 from flowing through the valve.

[0067] In one embodiment, the actuating air 215 is prevented from being discharged to the atmosphere, and thus, the actuating air 215 is not used to cool the rod 241 and / or the valve 120. In one embodiment, the third port 262 and the second port 263 (e.g., discharge ports) are configured such that the valve 120 can be fully actuated to the closed position. If additional actuating air 215 is required to fully actuate the lift head 240 and the corresponding valve 120 to the closed position, the timer 230 (optional) and the discharge logic 220 are configured to control the actuating air 215 to be discharged to the atmosphere as air discharge 275'. In particular, the discharge logic 220 can be configured as an AND logic, where the first input is the actuating air 215 from the air source 210 and the second input is the air discharge 275' from the second port 263 (e.g., discharge port). As Figure 4 shown, the first input of the timer 230 is blocked, thereby preventing the discharge logic 220 from opening and preventing the air discharge 275' from escaping to the atmosphere. That is, providing the actuating air 215 for downward actuation as an input to the discharge logic 220 is ineffective and thus blocks the air discharge 275' from passing through the discharge logic 220. Even when the timer 230 is running, in the Figure 4 configuration, when the lift head 240 moves to the closed position and remains in the closed position, no input of actuating air 215 is provided to the discharge logic 220. When the discharge logic 220 receives both inputs as true (i.e., receives both the actuating air 215 and the air discharge 275'), then the discharge logic 220 opens to allow the air discharge 275' to enter the atmosphere. Since the discharge logic 220 remains closed, the actuating air 215 continues to fill the actuating chamber 255 and is used to push the baffle 242 against the common wall 124, thereby moving the lift head 240 to the closed position.

[0068] Figures 5A - 5B , 5C-1 and 5C-2 are according to an embodiment of the present disclosure. When Figure 2B and Figure 4 the valve 120 shown therein moves from the open position to the closed position, an illustration of the valve 120, where the valve 120 controls the flow of fluid 221.

[0069] In one implementation, the estimated time to close the valve from the closed position is about 0.2 to 45 seconds. In another implementation, the estimated time to close the valve ranges between about 1 to 30 seconds. In another implementation, the estimated time to close the valve ranges from about 0.2 to 30 seconds. In another implementation, the estimated time to close the valve ranges from about 0.2 to 10 seconds. In other implementations, the estimated time to close the valve ranges from about 0.2 to 5 seconds. In another implementation, the estimated time to close the valve ranges from about 0.5 to 3 seconds. In one implementation, the estimated time to close the valve is about 2 seconds.

[0070] In Figure 5A , the lift head 240 is in the open position such that the rod 241 moves linearly towards the top cover 122. In this way, the sealing plunger 243 abuts against the common wall 124, and more specifically, the O-ring 372 is in contact with both the common wall 124 and the sealing plunger 243 to isolate the sealing chamber 250 from the actuating chamber 255. In this way, the fluid 221 is prevented from entering the actuating chamber 255. When the valve 120 is in the fully open position, the fluid 221 flows from the fluid inlet port 126 through the sealing chamber 250 and out of the fluid outlet port 125 without restriction. To move the lift head 240 (and the valve 120) to the closed position, the actuating air 215 is introduced into the actuating chamber 255 through the third port 262. When the actuating air 215 fills the space above the baffle 242 in the actuating chamber 255, the pressure causes the baffle 242 to move linearly towards the common wall 124. In one embodiment, the actuating air 215 is CDA. In this implementation, when the actuating air fills the space above the baffle 242 in the actuating chamber 255, the baffle 242 moves linearly towards the common wall 124. In one embodiment, in the open position, the actuating air 215 entering from the third port 262 does not discharge from the actuating chamber 255 because the second port 263 (e.g., the discharge port) is blocked by the position of the baffle 242 from entry.

[0071] In Figure 5BIn the middle position between the closed position and the open position, the lift head 240 has been moved. In particular, the baffle 242 is linearly moving towards the common wall 124. The residual air remaining in the space of the actuation chamber 255 below the baffle 242 can be discharged through the first port 261. In addition, the sealing plunger 243 is linearly moving towards the bottom cover 123. Therefore, some of the fluid flow 221 can flow from the fluid inlet port 126 through the sealing chamber 250 and out of the fluid outlet port 125. As shown in the figure, the actuation air 215 entering from the third port 262 has not been discharged from the actuation chamber 255 because the second port 263 (e.g., the discharge port) continues to be blocked by the position of the baffle 242 from entry. In one embodiment, the first port 261 and the second exhaust port 263 are configured such that the valve 120 can be fully actuated to the closed position before the actuation air 215, which is the air discharge 275', is completely discharged through the second port 263. In other embodiments, a timer 230 (optional) is used to control the actuation of the valve 120 to the closed position, and / or the cooling of the valve 120 is controlled using the actuation air 215.

[0072] In Figure 5C - 1 and 5C-2 for example, when the valve 120 is actuated downward, the lift head 240 has been moved to the fully closed position. In particular, the baffle 242 has linearly moved towards the common wall 124. In addition, the sealing plunger 243 abuts against the bottom cover 123. Specifically, the O-ring 371 contacts both the sealing plunger 243 and the bottom cover 123 such that the sealing chamber 250 is now isolated from the fluid outlet port 125. Thus, when the valve 120 is in the fully closed position, the fluid 221 is prevented from flowing out of the fluid outlet port 125.

[0073] In Figure 5C - 1 even after the valve 120 is fully actuated to the closed position, the actuation air 215 is prevented from being discharged to the atmosphere. Figure 5C - 1 Corresponding to Figure 4 . For example, the discharge logic 220 remains closed as previously described. Since the actuation air 215 is blocked from being discharged, no cooling flow is generated.

[0074] In Figure 5C - 2In this case, even after the valve 120 is fully actuated to the closed position, the actuation air 215 is discharged into the atmosphere. For example, as previously described, the discharge logic 220 is now open. Since the actuation air 215 is discharged, a cooling flow is generated. In particular, the actuation air 215 entering from the third port 262 now discharges from the actuation chamber 255 because the second port 263 (e.g., the discharge port) is now accessible and is located above the baffle 242. That is, the space of the actuation chamber 255 above the baffle 242 can be accessed by the second port 263. As shown, the air discharge 275' leaves the discharge port 263. In one embodiment, when the valve 120 is in the closed position, the actuation air 215 continues to flow into the actuation chamber 255. Since the actuation air 215 can be discharged as the air discharge 275' through the second port 263 (e.g., the discharge port), a cooling flow 272 is generated and it can be used to cool the rod 241. In particular, heat is transferred from the rod 241 to the cooling flow 272. Therefore, the temperature of the rod 241 can be controlled by controlling the flow of the actuation air 215 in the cooling flow 272. The flow of the actuation air 215 can be controlled by controlling the discharge pressure of the air. In addition, the cooling cycle can be controlled by controlling the delivery of the actuation air 215 during the actuation of the valve 120 and / or after full actuation, for example, using the timer 230. In one embodiment, the actuation air 215 is CDA, which, as previously described, cools when expanding into the actuation chamber 255. When the now-expanded actuation air flows through the rod 241 (which acts as a heat sink), convection acts to transfer heat between the rod 241 and the cooling flow 270 of the actuation CDA before the actuation CDA is discharged as the air discharge 275 from the actuation chamber 255 into the atmosphere.

[0075] In one embodiment, the cooling of the rod 241 also results in additional cooling of additional components in contact with the rod. For example, the operating temperature of the O-ring 372 decreases as it cools through the cooling of the rod 241. As shown, the cooling of the rod 241 results in local cooling of the seal plunger 243 and the O-ring 372 as well as the O-ring 371. In addition, the operating temperature of the actuation housing 127a surrounding the actuation chamber 255 and / or the seal housing 127b surrounding the seal chamber 250 also cools through the cooling of the rod 241, resulting in a lower operating temperature.

[0076] Figure 6 is a top cross-sectional view of a first configuration of a valve 120 configured to control fluid flow according to an embodiment of the present disclosure, wherein at the open and / or closed position of the valve 120, the actuation air discharged through the second port 263 (e.g., the discharge port) cools the interior of the valve 120. For example, the cooling flow 270 transfers heat from the rod 241 of the valve's lift head 240 to the actuation air 215, which then discharges from the actuation chamber 255 as the air discharge 275 through the second port 263. AsFigure 6 As shown, in one embodiment, the shape of the receiving wall 121 of the valve body 127 is cylindrical (e.g., circular).

[0077] Figure 7 FIG. 700 is a flowchart showing a method for operating a valve for controlling fluid flow according to an embodiment of the present disclosure. In particular, the method may include using actuating air to cool the valve. The method of flowchart 700 may be applied by Figure 1A the plasma processing module 100 as well as Figures 2A - 2B the systems described in FIGS. 3 and 4.

[0078] At 710, the method includes providing actuating air to a first port of an actuating housing of the valve body. The valve body includes an actuating housing surrounding an actuating chamber. The lift head is configured to move within the valve body and includes a baffle located within the actuating chamber.

[0079] At 720, the method includes using the actuating air entering the first port to actuate the lift head and accordingly actuating the valve to an open position. For example, the baffle of the lift head is actuated by actuating air to the open position, where the actuating air enters from the first port in the valve body. The baffle is configured to linearly move within the actuating chamber.

[0080] At 730, the method includes discharging the actuating air entering from the first port to the atmosphere through a second port of the actuating housing when the lift head is in the open position.

[0081] At 740, the method includes using the actuating air flowing between the first port and the second port of the actuating housing to cool the rod. In particular, when the actuating air is discharged, a cooling flow is generated within the actuating chamber, and this cooling flow serves to cool the lift head rod. That is, when the valve is in the open position, the rod is cooled by causing the actuating air to flow through the actuating chamber between the first port and the second port of the actuating housing.

[0082] In one embodiment, the method includes providing fluid to an inlet port of a sealed housing of a valve body, the sealed housing surrounding a sealed cavity. The valve body is configured to control the flow of fluid. The inlet port is configured to admit fluid into the sealed housing. In one embodiment, the fluid is RPC, such as a cleaning mixture. The sealed housing further includes an outlet port configured to discharge fluid from the sealed cavity. A common wall of the sealed housing and the actuator housing separates the sealed cavity from the actuator cavity. Additionally, a rod of a lift head connects a seal plunger located within the sealed cavity to a baffle located within the actuator cavity through a first opening in the common wall. When actuated, the linear movement of the baffle of the lift head is converted into the linear movement of the seal plunger within the sealed cavity by the rod configured to travel through the first opening. When the lift head and the corresponding valve are in the open position, the method includes positioning the seal plunger to seal a first opening of the sealed cavity and enabling fluid to flow from the inlet port to the outlet port through the sealed cavity.

[0083] In one embodiment, the cooling of the rod is delayed. For example, the cooling is delayed to ensure that the baffle of the lift head and the corresponding valve are fully actuated to the open position. In another embodiment, control of the cooling process is performed by controlling the discharge of actuating air from the actuator cavity to the atmosphere. Thus, the cooling may be further delayed for the time required even when the valve is fully actuated to the open position.

[0084] In one embodiment, the cooling of the rod occurs when the valve is in the closed position. That is, when fluid is blocked from leaving the valve, additional cooling of the valve is performed. In particular, the method includes using actuating air to actuate the baffle of the lift head to the closed position. The actuating air enters through a third port of the valve body. The baffle is configured to linearly move within the actuator cavity, wherein the linear movement of the baffle is converted into the linear movement of the seal plunger within the sealed cavity by the rod configured to travel through the first opening. Thus, when the valve is in the closed position, the method includes positioning the seal plunger to seal an outlet port of the sealed cavity and preventing fluid from flowing through the sealed cavity to the outlet port. The method includes discharging the actuating air entering through the third port to the atmosphere through a second port of the actuator housing when the lift head is in the closed position. The method includes cooling the rod by causing the actuating air to flow through the actuator cavity between the third port and the second port of the actuator housing when the valve is in the closed position. That is, the valve can be configured to cool the rod in the open and / or closed position as needed.

[0085] The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. The individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but are interchangeable and can be used in selected embodiments, even if not specifically shown or described. They can also be varied in many ways. Such variations should not be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

[0086] Although some detailed descriptions of the foregoing embodiments have been given for purposes of clear understanding, it is obvious that certain changes and modifications can be practiced within the scope of the appended claims. Therefore, the presented embodiments are considered illustrative rather than restrictive, and the embodiments are not limited to the details given herein, but can be modified within their scope and equivalents of the claims.

Claims

1. A valve, comprising: An actuating housing of the valve body and surrounding the actuating chamber, the actuating housing including a first port configured for actuating air to enter and a second port configured for discharging the actuating air; And A lift head configured to move within the valve body and including a rod and a baffle located within the actuating chamber, actuating the lift head to an open position using the actuating air entering the first port, Wherein, when the lift head is in the open position, the actuating air flowing between the first port and the second port cools the rod, Further including a third port of the actuating housing configured for the actuating air to enter, Wherein, the lift head is configured to be actuated to a closed position by the actuating air, and the actuating air enters the actuating chamber from the third port, Wherein when the lift head is in the closed position, the actuating air flowing between the third port and the second port directly cools the rod.

2. The valve according to claim 1, further comprising: A sealing housing of the valve body surrounding the sealing chamber, the valve body being configured to control the flow of fluid, the sealing housing including an inlet port configured for the fluid to enter the sealing housing and an outlet port configured for the fluid to exit the sealing chamber, Wherein a common wall of the actuating housing and the sealing housing separates the sealing chamber from the actuating chamber, Wherein, the rod of the lift head is configured to connect a sealing plunger located within the sealing chamber to the baffle through a first opening in the common wall.

3. The valve according to claim 2, wherein the baffle is configured to linearly move in the actuation cavity when actuated by the actuation air, and the linear movement of the baffle is converted into the linear movement of the sealing plunger in the sealing cavity by the rod configured to travel through the first opening.

4. The valve according to claim 2, wherein when the lift head is in the open position, the sealing plunger is positioned to seal the first opening of the sealing cavity and allow the fluid to flow from the inlet port to the outlet port through the sealing cavity.

5. The valve according to claim 2, further comprising: An O-ring configured on the upper surface of the sealing plunger, wherein the O-ring is configured to seal the first opening of the sealing chamber when the lift head is actuated to the open position.

6. The valve according to claim 1, wherein the actuation air is compressed dry air (CDA).

7. The valve according to claim 2, wherein the fluid includes plasma from a remote source.

8. The valve according to claim 7, wherein, When the baffle is in the closed position, the sealing plunger is positioned and configured to seal the outlet port of the sealing chamber and prevent the plasma from flowing through the sealing chamber to the processing chamber.

9. The valve according to claim 8, further comprising: An O-ring configured on the lower surface of the sealing plunger, wherein the O-ring is configured to seal the outlet port of the sealing chamber when the baffle is actuated to the closed position.

10. A method for operating a valve, comprising: Supply actuating air to the first port of the actuating housing of the valve body, the actuating housing surrounding the actuating chamber, wherein the lift head is configured to move within the valve body and includes a rod and a baffle located within the actuating chamber; And Actuate the lift head to an open position using the actuating air entering the first port; When the lift head is in the open position, discharge the actuating air entering from the first port to the atmosphere through the second port of the actuating housing; And Use the actuating air flowing between the first port and the second port of the actuating housing to cool the rod, Actuate the baffle of the lift head to a closed position using the actuating air entering the third port of the actuating housing, When the lift head is in the closed position, discharge the actuating air entering from the third port to the atmosphere through the second port of the actuating housing; Directly cool the rod using the actuation air flowing between the third port and the second port of the actuation housing.

11. The method for operating a valve according to claim 10, further comprising: Provide fluid to an inlet port of a seal housing of the valve body, the seal housing surrounding a seal cavity, the valve body being configured to control the flow of the fluid, the inlet port being configured for the fluid to enter the seal housing, wherein the seal housing includes an outlet port configured to discharge the fluid from the seal cavity, wherein a common wall of the actuation housing and the seal housing separates the seal cavity from the actuation cavity. The rod of the lift head is configured to connect a seal plunger located within the seal cavity to the baffle located within the actuation cavity through a first opening in the wall.

12. The method for operating a valve according to claim 11, wherein the fluid comprises plasma from a remote source.

13. The method for operating a valve according to claim 11, further comprising: Actuate the baffle to the open position using the actuation air. The baffle is configured to move linearly within the actuation cavity. The linear movement of the baffle is converted into a linear movement of the seal plunger within the seal cavity by the rod configured to travel through the first opening.

14. The method for operating a valve according to claim 13, further comprising: Position the seal plunger to seal the first opening of the seal cavity and enable the fluid to flow from the inlet port to the outlet port through the seal cavity when the baffle of the lift head is in the open position.

15. The method for operating a valve according to claim 14, further comprising: Delay the cooling of the rod to ensure the baffle is fully actuated to the open position.

16. The method for operating a valve according to claim 10, wherein the actuating air is compressed dry air.

17. The method for operating a valve according to claim 11, wherein the baffle is configured to move linearly within the actuating chamber, and wherein the linear movement of the baffle is translated into linear movement of the sealing plunger within the sealing chamber by a rod configured to travel through the first opening; and positioning the sealing plunger to seal the outlet port of the sealing chamber and prevent the fluid from flowing through the sealing chamber to the outlet port when the baffle is in the closed position.

18. The method for operating a valve according to claim 10, further comprising: Delay the cooling of the rod to ensure the baffle is fully actuated to the closed position.

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