Testing fixtures, testing methods, terminals and storage media

Abstract

The present disclosure provides a detection fixture, method, terminal and storage medium, wherein the detection fixture comprises: a first fixture plate; a second fixture plate, which is separated from the first fixture plate and has a test position for accommodating a module under test formed between the second fixture plate and the first fixture plate; a first probe, the root of which is located on the first fixture plate; the end of which contacts the first connection terminal of the first component of the module under test located on the test position; a second probe, the root of which is located on the second fixture plate; the end of which contacts the second connection terminal of the second component of the module under test; the end of the second probe faces the end of the first probe; a detection path is formed based on the first probe, the first connection terminal, the second connection terminal and the second probe. The embodiments of the present disclosure can improve the accuracy of detecting the impedance of the detection path and reduce the hardware cost.

Description

Technical Field

[0001] The present disclosure relates to the field of detection technology, and in particular to a detection fixture, a detection method, a terminal and a storage medium. Background Art

[0002] In the related art, when the display screen is bonding the flexible printed circuit (PFC), there may be something that causes the connection terminals to fail to form an electrical connection after bonding, or uneven bonding pressure may cause some areas to be poorly bonded, resulting in a virtual connection. Alternatively, the display screen is normal when it leaves the factory, but as the display screen is used for a longer time, the device ages, causing defects. This often causes poor bonding such as vertically lit screens or black screens.

[0003] Currently, the detection of poor bonding usually uses automated optical inspection (AOI). However, the detection results based on the AOI are often inaccurate; and the detection method requires the purchase of AOI detection equipment, which leads to high hardware costs for the detection. Summary of the invention

[0004] The present disclosure provides a detection fixture, a detection method, a terminal and a storage medium.

[0005] According to a first aspect of an embodiment of the present disclosure, a detection jig is provided, the detection jig comprising:

[0006] First jig plate;

[0007] A second fixture plate is disposed separately from the first fixture plate and a test position for accommodating a module under test is formed between the second fixture plate and the first fixture plate;

[0008] A first probe, the root of which is located on the first fixture board; the end of which is used to contact a first connection terminal of a first component of the module under test located at the test position;

[0009] a second probe, wherein the root of the second probe is located on the second fixture plate; and the end of the second probe is used to contact the second connection terminal of the second component of the module under test;

[0010] an end of the second probe facing an end of the first probe;

[0011] A detection path is formed based on the first probe, the first connection terminal, the second connection terminal, and the second probe.

[0012] In the above scheme, the number of the first probes is N, and the number of the second probes is N; wherein N is an integer greater than or equal to 1;

[0013] The distribution mode of the N first probes on the first fixture plate is the same as the distribution mode of the first connecting terminals on the first component;

[0014] The distribution mode of the N second probes on the second fixture plate is the same as the distribution mode of the second connection terminals on the second component.

[0015] In the above scheme, the i-th first probe is used to contact the i-th first connection terminal, and the i-th second probe is used to contact the i-th second connection terminal; the i-th first connection terminal is fixed to the i-th second connection terminal by a conductive adhesive; wherein i is an integer greater than or equal to 1 and less than or equal to N;

[0016] The root of the jth first probe is electrically connected to the root of the j+1th second probe, and the root of the N-1th first probe is electrically connected to the root of the Nth first probe; wherein j is an integer greater than or equal to 1 and less than i-1.

[0017] In the above solution, a third jig plate is provided at one end of the first jig plate, and the third jig plate is connected to the second jig plate;

[0018] The first fixture plate, the third fixture plate and the third fixture plate are surrounded by the test position;

[0019] The electrical connection between the root of the first probe and the root of the second probe is provided along the first jig plate, the third jig plate and the second jig plate.

[0020] In the above scheme, the i-th first probe is used to contact the i-th first connection terminal, and the i-th second probe is used to contact the i-th second connection terminal; the i-th first connection terminal is fixed to the i-th second connection terminal by a conductive adhesive; wherein i is an integer greater than or equal to 1 and less than or equal to N;

[0021] The root of the jth first probe is electrically connected to the root of the j-1th first probe, and the root of the jth second probe is electrically connected to the root of the j+1th second probe; wherein j is an even number in i.

[0022] In the above scheme, the i-th first probe is used to contact the i-th first connection terminal, and the i-th second probe is used to contact the i-th second connection terminal; the i-th first connection terminal is fixed to the i-th second connection terminal by a conductive adhesive; wherein i is an integer greater than or equal to 1 and less than or equal to N;

[0023] The root of the i-th first probe is electrically connected to the root of the i-th second probe.

[0024] According to a second aspect of an embodiment of the present disclosure, a detection method is provided, which is applied to a detection fixture, and the method includes:

[0025] When an end of a first probe on the detection fixture contacts a first connection terminal on a first component of the module under test, and an end of a second probe on the detection fixture contacts a second connection terminal on a second component of the module under test, detecting the impedance of the detection path;

[0026] If the impedance of the detection path is within a predetermined impedance threshold range, it is determined that the conductivity of the first connection terminal and the second connection terminal meets a preset requirement.

[0027] In the above scheme, the number of the first probes is N, and the number of the second probes is N; wherein N is an integer greater than or equal to 1;

[0028] The detecting the impedance of the detection path includes:

[0029] Detecting a first test point in contact with the root of the first second probe and a second test point in contact with the root of the Nth second probe to obtain an impedance of the detection path;

[0030] or,

[0031] Detecting a first test point in contact with the root of the i-th first probe and a second test point in contact with the root of the i-th second probe to obtain the impedance of the i-th first connection terminal and the second connection terminal; wherein i is an integer greater than or equal to 1 and less than or equal to N;

[0032] The impedance of the detection path is obtained based on the impedance of the first connection terminal and the second connection terminal.

[0033] In the above scheme, the method further includes:

[0034] Determining the impedance threshold range according to the impedance of a predetermined number of sample modules of the module under test;

[0035] The impedance threshold range includes an upper limit value and a lower limit value; wherein the upper limit value is determined based on a maximum impedance in a predetermined number of sample modules, and the lower limit value is determined based on a minimum impedance in a predetermined number of sample modules.

[0036] According to a third aspect of an embodiment of the present disclosure, a terminal is provided, the terminal including:

[0037] processor;

[0038] a memory for storing processor-executable instructions;

[0039] Wherein, the processor is configured to: implement the detection method described in any embodiment of the present disclosure when executing the executable instructions.

[0040] According to a fourth aspect of an embodiment of the present disclosure, a computer-readable storage medium is provided, wherein the computer-readable storage medium stores an executable program, wherein the executable program, when executed by a processor, implements the detection method described in any embodiment of the present disclosure.

[0041] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0042] The disclosed embodiment discloses a detection jig, which can be used to detect the impedance of the detection path, so as to determine the conductivity between the first connection terminal and the second connection terminal; for example, when the impedance of the detection path is greater than a certain threshold or the impedance of the detection path cannot be detected, it is determined that the first connection terminal and the second connection terminal are disconnected, that is, the conductivity of the first connection terminal and the second connection terminal is extremely weak or cannot be conductive; for another example, when the impedance of the detection path is less than a certain threshold, the first connection terminal and the second connection terminal are conductive, that is, the first connection terminal and the second connection terminal can be conductive. In this way, compared with determining the conductivity of the first connection terminal and the second connection terminal by detecting the conductive particles present after the first connection terminal and the second connection terminal are bonded, it is possible to reduce the omission of foreign matter and reduce the occurrence of mistaking unpressed conductive particles for pressed conductive particles, thereby greatly improving the accuracy of conductivity detection.

[0043] Furthermore, since the embodiments of the present disclosure can improve the accuracy of conductivity detection, it can also reduce manual retesting to a certain extent, thereby improving detection efficiency.

[0044] Furthermore, the disclosed embodiment does not require an AOI inspection device specifically for inspecting the conductive particles between the first connection terminal and the second connection terminal, but only requires an inspection fixture with a relatively simple structure such as a fixture plate and a probe, thereby greatly reducing the hardware cost required for the inspection device. Furthermore, since the inspection fixture only needs to measure the resistance of the inspection path, no complex algorithm is required, thereby simplifying the inspection process.

[0045] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0047] Figure 1 is a schematic diagram showing a connection terminal according to an exemplary embodiment.

[0048] Figure 2 It is a schematic diagram of a detection fixture according to an exemplary embodiment.

[0049] Figure 3 is a schematic diagram showing an electrical connection method according to an exemplary embodiment.

[0050] Figure 4 is a schematic diagram showing an electrical connection method according to an exemplary embodiment.

[0051] Figure 5 is a schematic diagram showing an electrical connection method according to an exemplary embodiment.

[0052] Figure 6 It is a schematic diagram of a detection fixture according to an exemplary embodiment.

[0053] Figure 7 is a schematic diagram showing an electrical connection method according to an exemplary embodiment.

[0054] Figure 8 The figure is a flow chart of a detection method according to an exemplary embodiment.

[0055] Fig. 9 The figure is a flow chart of a detection method according to an exemplary embodiment.

[0056] Fig.10 is a block diagram showing a terminal including a detection jig according to an exemplary embodiment. DETAILED DESCRIPTION

[0057] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Instead, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims.

[0058] In the related art, when the display panel body of the device is bonded to the flexible printed circuit board (FPC) in the display panel, the first connecting terminal (bonding pin) of the display panel is bonded to the second connecting terminal of the FPC to form a connecting terminal; that is, the connecting terminal includes the first connecting terminal on the display panel and the second connecting terminal on the flexible printed circuit board. Here, one bonding method is to fix the first connecting terminal and the second connecting terminal using conductive glue.

[0059] Here, an automatic optical inspection method is provided to inspect the connection terminals; the AOI method uses an AOI inspection device to take pictures, and the camera of the AOI inspection device can automatically locate the conductive particles in the connection terminals, and determine whether the connection terminals are good products according to the number of conductive particles in each connection terminal. Figure 1 The circle shown in the figure is a conductive particle. In this AOI method, the conductive particles can be identified based on their size and the color difference between the conductive particles and other parts. For example, if the number of conductive particles in each connection terminal is greater than 5, it is a good product.

[0060] However, this AOI method is not accurate for the detection of connection terminals. For example, if the color of the conductive particles is lighter, it means that the connection terminal is not pressed well (the pressing is actually broken), and the AOI detection will also consider the connection terminal to be good. For another example, if there is a foreign object in the connection terminal, due to the different shapes of the foreign object, this detection method cannot identify every foreign object, so there is a situation where the adhesion foreign object is missed.

[0061] Furthermore, the AOI method requires the purchase of AOI inspection equipment, and requires the AOI to perform maintenance and algorithm upgrades, which results in high costs for inspecting the connection terminals using the AOI method.

[0062] like Figure 2 and Figure 3 As shown, an embodiment of the present disclosure provides a detection fixture, the detection fixture comprising:

[0063] First jig plate;

[0064] A second fixture plate is disposed separately from the first fixture plate and a test position for accommodating a module under test is formed between the second fixture plate and the first fixture plate;

[0065] A first probe, the root of which is located on the first fixture board; the end of which is used to contact a first connection terminal of a first component of the module under test located at the test position;

[0066] a second probe, wherein the root of the second probe is located on the second fixture plate; and the end of the second probe is used to contact the second connection terminal of the second component of the module under test;

[0067] an end of the second probe facing an end of the first probe;

[0068] A detection path is formed based on the first probe, the first connection terminal, the second connection terminal, and the second probe.

[0069] The detection fixture described in the embodiment of the present disclosure can be used to detect the module under test. The module under test can be a display screen FOG module, a display screen COG module, etc. Here, the display screen FOG module includes: a display screen body and a display screen flexible circuit board; the display screen COG module includes a display screen body and a display screen driver chip (DDCI).

[0070] Here, the display screen body and the display screen flexible circuit board are bonded or bonded to form the display screen FOG module. Here, the display screen body and the display driver chip are bonded or bonded to form the display screen COG module.

[0071] For example, Figure 4 As shown, the first component of the module under test is a display screen, and the second component is a flexible circuit board; there are a first number of first connecting terminals on the first component, and a first number of second connecting terminals on the second component. Here, the first connecting terminal and the second connecting terminal are partially bonded to form a first part, a second part and a third part; the first part is a part that only includes the first connecting terminal, the second part is a part that partially overlaps the first connecting terminal and the second connecting terminal, and the third part is a part that only includes the second connecting terminal. The partial bonding here means that the first connecting terminal and the second connecting terminal are fixed by conductive glue or the like. The first number here is a value of hundreds, thousands, etc. For example, the first number can be 500, or 5000, etc.

[0072] In one embodiment, the end of the second probe is opposite to the root of the second probe; and the end of the first probe is opposite to the root of the first probe.

[0073] Here, the detection jig is used to determine the conductivity between the first connection terminal and the second connection terminal by detecting the impedance of the detection path.

[0074] For example, when the detection fixture detects the module under test, the first probe is inserted into the first part, and the second probe is inserted into the third part; in this way, a detection path can be formed by the first probe, the second probe, the first connecting terminal and the second connecting terminal; thereby, the impedance of the detection path can be detected; and based on the impedance of the detection path, the conductivity between the first connecting terminal and the second connecting terminal is determined.

[0075] If the impedance of the detection path is greater than a certain threshold or the impedance of the detection path cannot be detected, it is determined that the first connection terminal and the second connection terminal are disconnected, that is, the conductivity of the first connection terminal and the second connection terminal is extremely weak or cannot be conductive; if the impedance of the detection path is less than a certain threshold, the first connection terminal and the second connection terminal are conductive, that is, the first connection terminal and the second connection terminal can be conductive.

[0076] When the first connection terminal and the second connection terminal are bonded, the conductive particles in the first connection terminal and the second connection terminal are crushed. Figure 1 The conductive particles shown in the figure are crushed; if the number of crushed conductive particles between the first connection terminal and the second connection terminal exceeds a predetermined number, the first connection terminal and the second connection terminal will be connected through the conductive particles; if the number of crushed conductive particles between the first connection terminal and the second connection terminal is less than a predetermined number, the first connection terminal and the second connection terminal will not be conductive, forming an open circuit. The impedance between the disconnected first connection terminal and the second connection terminal is different from the impedance between the conductive first connection terminal and the second connection terminal.

[0077] In the embodiment of the present disclosure, the root of the first probe is connected to the conductive wire, and the root of the second probe is connected to the conductive wire.

[0078] The connection here refers to an electrical connection. The conductive wire here can be a metal wire, or any other wire with conductive properties.

[0079] Here, the root of the first probe is connected to the conductive wire, and the root of the second probe is connected to the conductive wire, which can be:

[0080] The roots of two adjacent first probes are connected to the root of the second probe by a conductive wire; or,

[0081] The roots of two adjacent first probes are connected by a conductive line, or the roots of two adjacent second probes and the root of the second probe are connected by a conductive line.

[0082] In the embodiment of the present disclosure, the impedance of the detection path can be detected by the detection fixture to determine the conductivity between the first connection terminal and the second connection terminal. In this way, the example of the present disclosure can directly detect the impedance of the detection path, thereby determining the conductivity between the first connection terminal and the second connection terminal. Compared with determining the conductivity of the first connection terminal and the second connection terminal by detecting the conductive particles present after the first connection terminal and the second connection terminal are bonded, it can reduce the omission of foreign matter and reduce the occurrence of mistaking unpressed conductive particles for pressed conductive particles, thereby greatly improving the accuracy of conductivity detection.

[0083] Furthermore, since the embodiments of the present disclosure can improve the accuracy of conductivity detection, it can also reduce manual retesting to a certain extent, thereby improving detection efficiency.

[0084] Furthermore, the disclosed embodiment does not require an AOI inspection device specifically for inspecting the conductive particles between the first connection terminal and the second connection terminal, but only requires an inspection fixture with a relatively simple structure such as a fixture plate and a probe, thereby greatly reducing the hardware cost required for the inspection device. Furthermore, since the inspection fixture only needs to measure the resistance of the inspection path, no complex algorithm is required, thereby simplifying the inspection process.

[0085] Please see again Figure 3 In some embodiments, the number of the first probes is N, and the number of the second probes is N; wherein N is an integer greater than or equal to 1;

[0086] The distribution mode of the N first probes on the first fixture plate is the same as the distribution mode of the first connecting terminals on the first component;

[0087] The distribution mode of the N second probes on the second fixture plate is the same as the distribution mode of the second connection terminals on the second component.

[0088] The distribution mode of the N first probes on the first fixture plate is the same as the distribution mode of the first connecting terminals on the first component, in that distribution parameters indicating the distribution conditions, such as distribution direction and / or distribution spacing, are the same.

[0089] For example, if N first probes are arranged in a horizontal row on the first fixture board, the first connection terminals are also arranged in a horizontal row on the first component; if N first probes are arranged in a vertical row on the first fixture board, the first connection terminals are also arranged in a vertical row on the first component; if N first probes are in a matrix form on the first fixture board, the first connection terminals are also in a matrix form on the first component; and the spacing between each two first probes is the same as the spacing between the corresponding two first connection terminals. For example, the distance between the 3rd and 4th first probes is the same as the spacing between the 3rd and 5th first connection terminals; for another example, the distance between the 3rd and 6th first probes is the same as the spacing between the 3rd and 6th first connection terminals.

[0090] The distribution mode of the N second probes on the second fixture plate is the same as the distribution mode of the second connection terminals on the second component, in that distribution parameters indicating the distribution conditions, such as distribution direction and / or distribution spacing, are the same.

[0091] For example, if N second probes are arranged in a horizontal row on the second fixture board, the second connection terminals are also arranged in a horizontal row on the second component; if N second probes are arranged in a vertical row on the second fixture board, the second connection terminals are also arranged in a vertical row on the second component; if N second probes are arranged in a matrix on the second fixture board, the second connection terminals are also arranged in a matrix on the second component; and the spacing between each two second probes is the same as the spacing between the corresponding two second connection terminals. For example, the distance between the 3rd and 4th second probes is the same as the spacing between the 3rd and 5th second connection terminals; for another example, the distance between the 3rd and 6th second probes is the same as the spacing between the 3rd and 6th second connection terminals.

[0092] In one embodiment, the heights of the N first probes are equal; the heights of the N second probes are equal. In this way, the N first probes can contact the N first connection terminals at the same level, and the N second probes can contact the N second connection terminals at the same level, thereby ensuring successful contact between the first probes and the first connection terminals, and between the second probes and the second connection terminals.

[0093] Here, the N first probes are arranged in sequence on the first fixture board; the distribution of the N first probes on the first fixture board is the same as the distribution of the first connection terminal on the first component. In this way, when the detection fixture detects the detection path, it is beneficial for the end of the i-th first probe to just contact the first connection terminal of the first component of the module under test.

[0094] Here, the N second probes are arranged in sequence on the second fixture board; the distribution of the N second probes on the second fixture board is the same as the distribution of the second connection terminals on the second component. In this way, when the detection fixture detects the detection path, it is beneficial for the end of the i-th second probe to just contact the second connection terminal of the second component of the module under test.

[0095] Of course, in other embodiments, the number of the first probes may be N, and the number of the second probes may be M; the number N is different from the number M, the number N is an integer greater than or equal to 1, and the number M is an integer greater than or equal to 1. Here, N and M only need to satisfy that the minimum value of the number N and the number M is greater than the maximum value of the number of the first connection terminal and the second connection terminal.

[0096] Please see again Figure 3 In some examples, the i-th first probe is used to contact the i-th first connection terminal, and the i-th second probe is used to contact the i-th second connection terminal; the i-th first connection terminal is fixed to the i-th second connection terminal by a conductive adhesive; wherein i is an integer greater than or equal to 1 and less than or equal to N;

[0097] The root of the jth first probe is electrically connected to the root of the j+1th second probe, and the root of the N-1th first probe is electrically connected to the root of the Nth first probe; wherein j is an integer greater than or equal to 1 and less than i-1.

[0098] Here, the root of the jth first probe is connected to the root of the j+1th second probe by a conductive line; and the root of the N-1th first probe is connected to the root of the Nth first probe by a conductive line. In this way, the root of the jth first probe is electrically connected to the root of the j+1th second probe, and the root of the N-1th first probe is electrically connected to the root of the Nth first probe.

[0099] For example, Figure 3 As shown, the first first probe contacts the first first connection terminal, the first second probe contacts the second second connection terminal; the second first probe contacts the second first connection terminal, the second second probe contacts the second second connection terminal; and so on; the Nth first probe contacts the Nth first connection terminal, and the Nth second probe contacts the Nth second connection terminal.

[0100] The first first connection terminal is fixed to the first second connection terminal via conductive glue; the second first connection terminal is fixed to the second second connection terminal via conductive glue; and so on; the Nth first connection terminal is connected to the Nth second connection terminal via conductive glue.

[0101] The root of the first first probe is electrically connected to the root of the second second probe; the root of the second first probe is electrically connected to the root of the third second probe; and so on, the root of the N-2th first probe is electrically connected to the root of the N-1th second probe; and the root of the N-1th first probe is electrically connected to the root of the Nth second probe.

[0102] Thus, through this connection mode, the N first probes, the second probes, the first connection terminal and the second connection terminal are connected to form a complete detection path. Thus, by detecting the impedance in the detection path, the conductivity between the N first connection terminals and the second connection terminals can be known.

[0103] In the above example, a test point may be set on the second component or the first detection fixture board to detect the impedance of the detection path. Figure 5 As shown, a test point is connected to the root of the first second probe and the root of the Nth second probe respectively; by using a multimeter to detect the two test points, the impedance of the entire detection path can be tested.

[0104] Here, if one of the N first connection terminals and the second connection terminals is disconnected, that is, its conductive particles are not pressed well, the impedance of the entire detection path cannot be detected, or the impedance is very large.

[0105] Thus, in the embodiment of the present disclosure, the conductivity between the N first connection terminals and the second connection terminals can be determined by detecting the impedance of the complete detection path, and then whether the module under test is a valid module can be determined. Moreover, in the embodiment of the present disclosure, this electrical connection method can detect the conductivity between all the first connection terminals and the second connection terminals in the module under test by detecting only one detection path, thereby simplifying the detection process.

[0106] like Figure 6 As shown, in some embodiments, a third jig plate is provided at one end of the first jig plate, and the third jig plate is connected to the second jig plate;

[0107] The first fixture plate, the third fixture plate and the third fixture plate are surrounded by the test position;

[0108] The electrical connection between the root of the first probe and the root of the second probe is provided along the first jig plate, the third jig plate and the second jig plate.

[0109] The third fixture plate here is used to connect the first fixture plate and the second fixture plate; and the third fixture plate is also used for the electrical connection.

[0110] In the disclosed embodiment, since the third jig plate connects the first jig plate and the second jig plate, it is possible to connect the electrical connection on the first jig plate to the second jig through the third jig plate, or the electrical connection on the second jig plate to the first jig plate through the third jig plate. In this way, it is possible to facilitate the wiring of the electrical connection between the first probe and the second probe without setting up a cable that is separated from the jig plate; it is also convenient for the storage of the jig, reducing the problem of cable damage caused by pulling the jig that is separated from the cable during transportation, and reducing the failure rate of the jig.

[0111] In some embodiments, Figure 5 As shown, the i-th first probe is used to contact the i-th first connection terminal, and the i-th second probe is used to contact the i-th second connection terminal; the i-th first connection terminal is fixed to the i-th second connection terminal by a conductive adhesive; wherein i is an integer greater than or equal to 1 and less than or equal to N;

[0112] The root of the jth first probe is electrically connected to the root of the j-1th first probe, and the root of the jth second probe is electrically connected to the root of the j+1th second probe; wherein j is an even number in i.

[0113] Here, the root of the jth first probe is connected to the root of the j-1th first probe by a conductive line; and the root of the jth second probe is connected to the root of the j+1th second probe by a conductive line. In this way, the root of the jth first probe can be electrically connected to the root of the j-1th first probe, and the root of the jth second probe can be electrically connected to the root of the j+1th second probe.

[0114] For example, Figure 5 As shown, the first first probe contacts the first first connection terminal, the first second probe contacts the second second connection terminal; the second first probe contacts the second first connection terminal, the second second probe contacts the second second connection terminal; and so on; the Nth first probe contacts the Nth first connection terminal, and the Nth second probe contacts the Nth second connection terminal.

[0115] The first first connection terminal is fixed to the first second connection terminal via conductive glue; the second first connection terminal is fixed to the second second connection terminal via conductive glue; and so on; the Nth first connection terminal is connected to the Nth second connection terminal via conductive glue.

[0116] The root of the first first probe is electrically connected to the root of the second first probe, the root of the second second probe is electrically connected to the root of the third first probe; the root of the third first probe is electrically connected to the root of the fourth first probe, the root of the fourth second probe is electrically connected to the root of the fifth second probe; and so on, the root of the N-2th first probe is electrically connected to the root of the N-1th first probe; and the root of the N-1th second probe is electrically connected to the root of the Nth second probe.

[0117] Thus, through this connection mode, the N first probes, the second probes, the first connection terminal and the second connection terminal are connected to form a complete detection path. Thus, by detecting the impedance in the detection path, the conductivity between the N first connection terminals and the second connection terminals can be known.

[0118] In the above example, a test point may be set on the second component or the first detection fixture board to detect the impedance of the detection path. Figure 5 As shown, a test point is connected to the root of the first second probe and the root of the Nth second probe respectively; by using a multimeter to detect the two test points, the impedance of the entire detection path can be tested.

[0119] Here, if one of the N first connection terminals and the second connection terminals is disconnected, that is, its conductive particles are not pressed well, the impedance of the entire detection path cannot be detected, or the impedance is very large.

[0120] Thus, in the embodiment of the present disclosure, the conductivity of the N first connection terminals and the second connection terminals can be determined by detecting the impedance of the complete detection path, and then whether the module under test is a valid module can be determined. Moreover, in the embodiment of the present disclosure, this electrical connection method can detect the conductivity between all the first connection terminals and the second connection terminals in the module under test by detecting only one detection path, thereby simplifying the detection process.

[0121] Moreover, in the embodiment of the present disclosure, this electrical connection method, since the first probe is connected to the first probe and the second probe is connected to the second probe, it is unnecessary to use a third fixture plate to connect the first probe and the second probe; thereby, the structure of the detection fixture can be simpler and the wiring of the electrical connection can be simpler.

[0122] like Figure 7 As shown, in some embodiments, the i-th first probe is used to contact the i-th first connection terminal, and the i-th second probe is used to contact the i-th second connection terminal; the i-th first connection terminal is fixed to the i-th second connection terminal by a conductive adhesive; wherein i is an integer greater than or equal to 1 and less than or equal to N;

[0123] The root of the i-th first probe is electrically connected to the root of the i-th second probe.

[0124] Here, the root of the i-th first probe and the root of the i-th second probe are connected via a conductive wire, so that the root of the i-th first probe and the root of the i-th second probe can be electrically connected.

[0125] For example, Figure 7 As shown, the first first probe contacts the first first connection terminal, the first second probe contacts the second second connection terminal; the second first probe contacts the second first connection terminal, the second second probe contacts the second second connection terminal; and so on; the Nth first probe contacts the Nth first connection terminal, and the Nth second probe contacts the Nth second connection terminal.

[0126] The first first connection terminal is fixed to the first second connection terminal via conductive glue; the second first connection terminal is fixed to the second second connection terminal via conductive glue; and so on; the Nth first connection terminal is connected to the Nth second connection terminal via conductive glue.

[0127] The root of the first first probe is electrically connected to the root of the first first probe; the root of the second first probe is electrically connected to the root of the second second probe; the root of the third first probe is electrically connected to the root of the third second probe; and so on, the root of the Nth first probe is electrically connected to the root of the Nth second probe.

[0128] Thus, through this connection mode, a single first probe, a second probe, a first connection terminal and a second connection terminal are connected to form a single detection path, and N first probes, second probes, first connection terminals and second connection terminals are connected to form N separate detection paths. Thus, by detecting the impedance in each detection path, the conductivity between each first connection terminal and the second connection terminal can be known.

[0129] In the above example, a test point may be set on the second component or the first detection fixture board to detect the impedance of the detection path. Figure 7 As shown, a test point is connected to the root of the first first probe and the root of the first second probe respectively to detect the impedance between the first first connection terminal and the second connection terminal. Of course, a test point can be connected to the root of the i-th first probe and the root of the i-th second probe respectively to detect the impedance between the i-th first connection terminal and the second connection terminal.

[0130] Here, the test point connected to the root of the first probe can be set on the first fixture board. The test point connected to the root of the second probe can be set on the second fixture board or on the second component. In this way, the impact on the first component in the tested module can be greatly reduced. For example, if the first component is a display screen and the second component is a flexible circuit board. In this way, the test point can be set only on the fixture board or on the flexible circuit board, thereby reducing the impact on the display screen.

[0131] Here, if the i-th first connection terminal and the i-th second connection among the N first connection terminals and the second connection terminals are disconnected, that is, the conductive particles are not pressed well, the impedance of the corresponding i-th detection path cannot be detected, or the impedance is very large.

[0132] Thus, in the disclosed embodiment, the conductivity of the entire detection path can be determined by detecting the impedance of each independent detection path, thereby determining whether the module under test is a valid module. Since the conductivity between each first connection terminal and the second connection terminal can be detected, the accuracy of the detection can be improved; at the same time, the disconnected first connection terminal and the second connection terminal can also be located, that is, the first connection terminal and the second connection terminal that are not pressed well can be located for subsequent maintenance operations, etc.

[0133] like Figure 8 As shown, a detection method is provided, which is applied to a detection fixture, and the method includes:

[0134] Step S31: When the end of the first probe on the detection fixture contacts the first connection terminal on the first component of the module under test, and the end of the second probe on the detection fixture contacts the second connection terminal on the second component of the module under test, detecting the impedance of the detection path;

[0135] Step S32: if the impedance of the detection path is within a predetermined impedance threshold range, determining that the conductivity of the first connection terminal and the second connection terminal meets a preset requirement.

[0136] Here, when the end of the first probe on the detection fixture contacts the first connection terminal on the first component of the module under test, and the end of the second probe on the detection fixture contacts the second connection terminal on the second component of the module under test, a detection path is formed. Here, the first connection terminal and the second connection terminal are fixed by conductive glue.

[0137] Here, the impedance threshold range includes an upper limit value and a lower limit value.

[0138] If the impedance of the detection path is within the impedance threshold range, the conductivity of the first connection terminal and the second connection terminal meets the preset requirements; if the impedance of the detection path is outside the impedance threshold range, the conductivity of the first connection terminal and the second connection terminal does not meet the preset requirements.

[0139] Here, if the conductivity between the first connection terminal and the second connection terminal meets the preset requirements, the module under test is determined to be a valid module; if the conductivity between the first connection terminal and the second connection terminal does not meet the preset requirements, the module under test is determined to be not a valid module.

[0140] In this way, the embodiment of the present disclosure can determine the conductivity between the first connection terminal and the second connection terminal by detecting the impedance of the detection path. For example, if the impedance of the detection path exceeds the impedance threshold range, the first connection terminal and the second connection terminal are disconnected and cannot conduct electricity or the conductivity is extremely weak. For another example, if the impedance of the detection path is within the impedance threshold range, the first connection terminal and the second connection terminal are conductive. In this way, compared with detecting the conductive particles between the first connection terminal and the second connection terminal to determine the conductivity between the first connection terminal and the second connection terminal, it can reduce the number of falsely detected conductive particles or the occurrence of missed detection of foreign objects, thereby greatly improving the accuracy of conductivity detection.

[0141] Furthermore, since the embodiments of the present disclosure can improve the accuracy of conductivity detection, it can also reduce manual retesting to a certain extent, thereby improving detection efficiency.

[0142] Furthermore, the disclosed embodiment does not require an AOI inspection device specifically for inspecting the conductive particles between the first connection terminal and the second connection terminal, but only requires an inspection fixture with a relatively simple structure such as a fixture plate and a probe, thereby greatly reducing the hardware cost required for the inspection device. Furthermore, since the inspection fixture only needs to measure the resistance of the inspection path, no complex algorithm is required, thereby simplifying the inspection process.

[0143] In some embodiments, the method further comprises:

[0144] If the impedance of the detection path is outside the impedance threshold range, it is determined that the conductivity of the first connection terminal and the second connection terminal does not meet a preset requirement.

[0145] In some embodiments, the number of the first probes is N, and the number of the second probes is N; wherein N is an integer greater than or equal to 1;

[0146] The detecting the impedance of the detection path includes:

[0147] Detecting a first test point in contact with the root of the first second probe and a second test point in contact with the root of the Nth second probe to obtain an impedance of the detection path;

[0148] or,

[0149] Detecting a first test point in contact with the root of the i-th first probe and a second test point in contact with the root of the i-th second probe to obtain the impedance of the i-th first connection terminal and the second connection terminal; wherein i is an integer greater than or equal to 1 and less than or equal to N;

[0150] The impedance of the detection path is obtained based on the impedance of the first connection terminal and the second connection terminal.

[0151] For example, Figure 3 or Figure 5 As shown, by detecting the first test point at the root of the first second probe and the second test point at the root of the Nth second probe, a test loop formed by connecting the N first connection terminals and the second connection terminals is obtained.

[0152] For example, Figure 7 As shown, by respectively detecting the first test point at the root of the i-th first probe and the second test point at the root of the i-th second probe, a detection loop formed by connecting the i-th first connection terminal and the second connection terminal is obtained. Here, i is an integer greater than or equal to 1 and less than or equal to N.

[0153] Thus, in the embodiment of the present disclosure, the impedance of the detection path can be obtained by detecting the entire detection path formed by N first connection terminals and the second connection terminals, thereby determining whether the conductivity of the first connection terminal and the second connection terminal meets the preset requirements.

[0154] Alternatively, the impedance of the entire detection path may be obtained by respectively detecting the i-th separate detection path formed by the i-th first connection terminal and the second connection terminal, thereby determining whether the conductivity of the first connection terminal and the second connection terminal meets the preset requirements.

[0155] In one embodiment, detecting the impedance of the detection path includes:

[0156] The first test point and the second test point are detected by using a multimeter to obtain the impedance of the detection path.

[0157] like Fig. 9 As shown, in one embodiment, the method further includes:

[0158] Step S30: determining the impedance threshold range according to the impedance of a predetermined number of sample modules of the module under test;

[0159] The impedance threshold range includes an upper limit value and a lower limit value; wherein the upper limit value is determined based on a maximum impedance in a predetermined number of sample modules, and the lower limit value is determined based on a minimum impedance in a predetermined number of sample modules.

[0160] Here, since each type of the tested module is different, the impedance threshold range can be determined based on sample modules of the same type as the tested module. For example, 100 valid sample modules are selected; the maximum impedance among the 100 sample modules is determined as the upper limit of the impedance threshold range, and the minimum impedance among the 100 sample modules is determined as the lower limit of the impedance threshold range.

[0161] Thus, in the embodiment of the present disclosure, the total impedance of all the first connection terminals and the second connection terminals can be detected, and based on the total impedance, it can be determined whether the module under test is a valid module.

[0162] Regarding the method in the above embodiment, the specific manner of performing the operation in each step has been described in detail in the embodiment of the device, and will not be elaborated here.

[0163] The present disclosure also provides a terminal, including:

[0164] processor;

[0165] a memory for storing processor-executable instructions;

[0166] The processor is configured to: implement the detection method described in any of the above embodiments when running a computer service.

[0167] The memory may include various types of storage media, which are non-transitory computer storage media that can continue to remember information stored thereon after the communication device loses power.

[0168] Here, the terminal is a terminal including a detection fixture.

[0169] The processor can be connected to a memory such as a bus to read an executable program stored in the memory, for example Figure 8 , Fig. 9 At least one of the methods shown.

[0170] The present disclosure also provides a non-transitory computer-readable storage medium, wherein the non-transitory computer-readable storage medium stores an executable program, wherein the executable program, when executed by a processor, implements the detection method described in any of the above embodiments. Figure 8 , Fig. 9 At least one of the methods shown.

[0171] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0172] Fig.10 8 is a block diagram of a terminal 800 for detecting a fixture according to an exemplary embodiment. For example, the terminal 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0173] Reference Fig.10 The terminal 800 may include one or more of the following components: a processing component 802 , a memory 804 , a power component 806 , a multimedia component 808 , an audio component 810 , an input / output (I / O) interface 812 , a sensor component 814 , and a communication component 816 .

[0174] The processing component 802 generally controls the overall operation of the terminal 800, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the above-mentioned method. In addition, the processing component 802 may include one or more modules to facilitate the interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate the interaction between the multimedia component 808 and the processing component 802.

[0175] The memory 804 is configured to store various types of data to support operations on the device 800. Examples of such data include instructions for any application or method operating on the terminal 800, contact data, phone book data, messages, pictures, videos, etc. The memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0176] Power component 806 provides power to various components of terminal 800. Power component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to terminal 800.

[0177] The multimedia component 808 includes a screen that provides an output interface between the terminal 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the device 800 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera may receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

[0178] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC), and when the terminal 800 is in an operation mode, such as a call mode, a recording mode, and a speech recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 804 or sent via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0179] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: home button, volume button, start button, and lock button.

[0180] The sensor assembly 814 includes one or more sensors for providing various aspects of status assessment for the terminal 800. For example, the sensor assembly 814 can detect the open / closed state of the device 800, the relative positioning of the components, such as the display and keypad of the terminal 800, and the sensor assembly 814 can also detect the position change of the terminal 800 or a component of the terminal 800, the presence or absence of contact between the user and the terminal 800, the orientation or acceleration / deceleration of the terminal 800 and the temperature change of the terminal 800. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor or a temperature sensor.

[0181] The communication component 816 is configured to facilitate wired or wireless communication between the terminal 800 and other devices. The terminal 800 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0182] In an exemplary embodiment, terminal 800 can be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors or other electronic components to perform the above methods.

[0183] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 804 including instructions, and the instructions can be executed by a processor 820 of the terminal 800 to perform the above method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0184] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not disclosed in this disclosure. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.

[0185] It should be understood that the present invention is not limited to the exact construction that has been described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

Claims

1. A detection fixture, characterized in that: The detection fixture comprises: First jig plate; A second fixture plate is disposed separately from the first fixture plate and a test position for accommodating a module under test is formed between the second fixture plate and the first fixture plate; A first probe, the root of which is located on the first fixture board; the end of which is used to contact the first connection terminal of the first component of the module under test located at the test position; wherein the number of the first probes is N, and N is an integer greater than or equal to 1; a second probe, wherein the root of the second probe is located on the second fixture plate; the end of the second probe is used to contact the second connection terminal of the second component of the module under test; the number of the second probes is N; an end of the second probe facing an end of the first probe; forming a detection path based on the first probe, the first connection terminal, the second connection terminal and the second probe; wherein the i-th first probe is used to contact the i-th first connection terminal, and the i-th second probe is used to contact the i-th second connection terminal; the i-th first connection terminal is fixed to the i-th second connection terminal by a conductive adhesive; wherein i is an integer greater than or equal to 1 and less than or equal to N; there is an electrical connection between the root of the j-th first probe and the root of the j+1-th second probe, and there is an electrical connection between the root of the N-1-th first probe and the root of the N-th first probe; wherein j is an integer greater than or equal to 1 and less than i-1; or, The i-th first probe is used to contact the i-th first connection terminal, and the i-th second probe is used to contact the i-th second connection terminal; the i-th first connection terminal is fixed to the i-th second connection terminal by a conductive adhesive; wherein i is an integer greater than or equal to 1 and less than or equal to N; there is an electrical connection between the root of the j-th first probe and the root of the j-1-th first probe, and there is an electrical connection between the root of the j-th second probe and the j+1-th second probe; wherein j is an even number in i.

2. The detection fixture according to claim 1, characterized in that: The distribution mode of the N first probes on the first fixture plate is the same as the distribution mode of the first connecting terminals on the first component; The distribution mode of the N second probes on the second fixture plate is the same as the distribution mode of the second connection terminals on the second component.

3. The detection fixture according to claim 1, characterized in that: A third fixture plate is provided at one end of the first fixture plate, and the third fixture plate is connected to the second fixture plate; The first fixture plate, the second fixture plate and the third fixture plate are surrounded by the test position; The electrical connection between the root of the first probe and the root of the second probe is provided along the first jig plate, the third jig plate and the second jig plate.

4. A detection method, characterized in that: Applied to the detection fixture of any one of claims 1 to 3, the method comprises: When the end of the first probe on the detection fixture contacts the first connection terminal on the first component of the module under test, and the end of the second probe on the detection fixture contacts the second connection terminal on the second component of the module under test, the impedance of the detection path is detected; the first probes are N, and the second probes are N, wherein N is an integer greater than or equal to 1; wherein the impedance of the detection path is detected, including: detecting a first test point in contact with the root of the first second probe and a second test point in contact with the root of the Nth second probe to obtain the impedance of the detection path; or detecting a first test point in contact with the root of the i-th first probe and a second test point in contact with the root of the i-th second probe to obtain the impedance of the i-th first connection terminal and the second connection terminal; wherein i is an integer greater than or equal to 1 and less than or equal to N; based on the impedance of the first connection terminal and the second connection terminal, the impedance of the detection path is obtained; If the impedance of the detection path is within a predetermined impedance threshold range, it is determined that the conductivity of the first connection terminal and the second connection terminal meets a preset requirement.

5. The method according to claim 4, characterized in that The method further comprises: Determining the impedance threshold range according to the impedance of a predetermined number of sample modules of the module under test; The impedance threshold range includes an upper limit value and a lower limit value; wherein the upper limit value is determined based on a maximum impedance in a predetermined number of sample modules, and the lower limit value is determined based on a minimum impedance in a predetermined number of sample modules.

6. A terminal, characterized in that: The terminal comprises: processor; a memory for storing processor-executable instructions; Wherein, the processor is configured to: implement the detection method described in any one of claims 4-5 when executing the executable instructions.

7. A computer-readable storage medium, characterized in that: The readable storage medium stores an executable program, wherein the executable program, when executed by a processor, implements the detection method described in any one of claims 4 to 5.

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