Positioning Device, Integrated Module and Positioning Method for Electronic Components

Abstract

The present disclosure provides a positioning device, an integrated module and a positioning method for electronic components. The positioning device may include: a first positioning member and a second positioning member. The first positioning member has a top portion, the top portion being perpendicular to the thickness direction of the first positioning member, and the first positioning member includes at least one positioning portion. At least one positioning portion penetrates the top portion of the first positioning member in the thickness direction to allow the pins of at least one first electronic component to extend beyond the top portion of the first positioning member. The second positioning member has a cavity communicating with the outside for accommodating at least one first electronic component, and the first positioning member is used to be assembled onto the second positioning member along its thickness direction. The positioning device provided by the present disclosure can reduce the flying wire connection of electronic components and reduce the possibility of misinstallation and missing installation of electronic components.

Description

Technical Field

[0001] The present invention relates to the electrical connection of electronic components, and particularly to the positioning, assembly, and integration of electronic components. Background Art

[0002] Currently, the new energy vehicle market is developing rapidly, and on-vehicle chargers, as key components of new energy vehicles, are also developing rapidly. There are many electronic components inside an on-vehicle charger, including semiconductor devices and magnetic devices, etc.

[0003] Inside an on-vehicle charger, many electronic components need to be assembled and connected to a circuit board. During the assembly and connection process, due to the large number of semiconductor devices, and most magnetic devices such as transformers and voltage regulators use flying wires for connection, this easily leads to the phenomena of missing installation and misinstallation.

[0004] In addition, since these electronic components generate heat during operation, which in turn affects the performance of the on-vehicle charger, it is necessary to dissipate heat from the on-vehicle charger. Currently, the assembly method adopted in the on-vehicle charger for heat dissipation is usually to first solder semiconductor devices such as diodes onto the circuit board, and then use clip pieces to fix the diodes to a cold plate with a water-cooled radiator to dissipate the heat generated by the diodes during operation. However, this assembly method will cause a large amount of stress on the solder joints of the semiconductor devices, resulting in the disconnection of the semiconductor devices from the circuit board, thereby reducing the service life of the on-vehicle charger.

[0005] Therefore, it is necessary to improve the on-vehicle charger to reduce the missing installation and misinstallation of electronic components and / or provide a more suitable assembly method. Summary of the Invention

[0006] The technical solution proposed by the present invention aims to solve the problems of missing installation and misinstallation of electronic components in the prior art and / or eliminate the potential hazards brought by the assembly method in the prior art.

[0007] In one aspect of the present invention, there is provided a positioning device for electronic components, the positioning device comprising: a first positioning member, the first positioning member having a top, the top being perpendicular to the thickness direction of the first positioning member, and the first positioning member including at least one positioning portion, the at least one positioning portion penetrating the top of the first positioning member in the thickness direction to allow the pins of at least one first electronic component to extend beyond the top of the first positioning member.

[0008] In at least one embodiment of one aspect of the present invention, the positioning device further includes a second positioning member, the second positioning member having a lumen communicating with the outside for accommodating the at least one first electronic component, and the first positioning member is configured to be assembled onto the second positioning member along its thickness direction.

[0009] In at least one embodiment of one aspect of the present invention, the first positioning member has an opening area at the top for exposing at least a portion of the at least one first electronic component, and each of the at least one positioning portion includes at least one of a positioning through-hole and a positioning snap, wherein the positioning snap extends into the opening area for holding the pins of the at least one first electronic component.

[0010] In at least one embodiment of one aspect of the present invention, the positioning device further includes a second positioning member, the second positioning member having a lumen communicating with the outside for accommodating the at least one first electronic component, the first positioning member having a side wall along the thickness direction, the outer periphery of the second positioning member having a step, and the bottom of the side wall of the first positioning member being configured to be placed on the step of the second positioning member, wherein the inner surface of the side wall of the first positioning member is in shape fit with the outer surface of the side wall of the second positioning member, and the side wall of the first positioning member has at least one side window for accommodating at least a portion of the main body of at least one second electronic component and allowing the pins of the at least one second electronic component to extend above the top of the first positioning member.

[0011] In at least one embodiment of one aspect of the present invention, the positioning device further includes a third positioning member for holding the main body of the at least one second electronic component within the corresponding side window on the first positioning member.

[0012] In at least one embodiment of one aspect of the present invention, the third positioning member includes at least one elastic clip, each of the at least one elastic clips having a fixing portion and at least one pressing portion, wherein the fixing portion is fixed to the second positioning member, and the at least one pressing portion is configured to press the at least one second electronic component located within the corresponding side window against the outer surface of the side wall of the second positioning member.

[0013] In at least one embodiment of one aspect of the present invention, the at least one pressing portion includes a plurality of the pressing portions, the pressing portion being zigzag or S-shaped, the fixing portion and the plurality of pressing portions being configured to be interdigitated, and each of the plurality of pressing portions presses the second electronic component located within the corresponding side window against the outer surface of the side wall of the second positioning member.

[0014] In at least one embodiment of one aspect of the present invention, the third positioning member includes at least one elastic clip, each of the at least one elastic clips having a fixing portion and a plurality of pressing portions, wherein the pressing portions are zigzag or S-shaped, the fixing portion and the plurality of pressing portions are configured to be serially connected, the fixing portion is fixed to the first positioning member, and each of the plurality of pressing portions abuts the outer surface of the side wall of the second positioning member against the second electronic component located in the corresponding side window.

[0015] In at least one embodiment of one aspect of the present invention, the second positioning member is made of a heat-conducting material.

[0016] In another aspect of the present invention, there is provided an integrated module for an electronic component, the integrated module including: a positioning device as described in any one of the preceding paragraphs, the positioning device further including: a second positioning member having a lumen communicating with the outside, the first positioning member being assembled to the second positioning member in its thickness direction; and at least one first electronic component located in the lumen of the second positioning member.

[0017] In at least one embodiment of another aspect of the present invention, the integrated module includes: a positioning device as described in any one of the preceding paragraphs; at least one first electronic component located in the lumen of the second positioning member; and at least one second electronic component, at least a part of the main body portion of each of the at least one second electronic components being located in the corresponding side window on the side wall of the first positioning member.

[0018] In at least one embodiment of another aspect of the present invention, the at least one first electronic component includes a magnetic device, the pins of the magnetic device being formed by tinning the leads of the magnetic device; and the at least one second electronic component includes a semiconductor device.

[0019] In at least one embodiment of another aspect of the present invention, the second positioning member is made of a heat-conducting material.

[0020] In yet another aspect of the present invention, there is provided a method for connecting an electronic component to a circuit board, the method including: providing a positioning device as described in any one of the preceding paragraphs; passing the pins of the at least one first electronic component through the at least one positioning portion and extending beyond the top of the first positioning member; and soldering the pins of the at least one first electronic component to a predetermined position on the circuit board.

[0021] In at least one embodiment of another aspect of the present invention, the provided positioning device includes: providing a second positioning member having an inner cavity communicating with the outside; placing the at least one first electronic component in the inner cavity of the second positioning member; and assembling the first positioning member onto the second positioning member along its thickness direction.

[0022] In at least one embodiment of another aspect of the present invention, the provided positioning device further includes: potting the at least one first electronic component in the inner cavity of the second positioning member with a thermally conductive potting adhesive.

[0023] In at least one embodiment of another aspect of the present invention, assembling the first positioning member onto the second positioning member includes: mating and installing at least one first connecting portion of the first positioning member with at least one second connecting portion of the second positioning member.

[0024] In at least one embodiment of another aspect of the present invention, the first connecting portion and the second connecting portion are hollow structures, and assembling the first positioning member onto the second positioning member includes: placing at least a part of the second connecting portion within the hollow structure of the first connecting portion.

[0025] In at least one embodiment of another aspect of the present invention, the first positioning member has a side wall along the thickness direction, and the side wall has at least one side window. The method further includes: placing at least a part of the main body portion of at least one second electronic component in the corresponding side window among the at least one side window; using a third positioning member as described in any of the preceding paragraphs to abut the main body portion of the at least one second electronic component against the outer surface of the side wall of the second positioning member; and soldering the pins of the at least one second electronic component to other predetermined positions on the circuit board.

[0026] In at least one embodiment of another aspect of the present invention, the at least one first electronic component includes a magnetic device, the at least one second electronic component includes a semiconductor device, and the method further includes: tinning the leads of the magnetic device to form the pins.

[0027] In at least one embodiment of another aspect of the present invention, the outer periphery of the second positioning member has a step, and assembling the first positioning member onto the second positioning member includes: placing the bottom of the side wall of the first positioning member on the step of the second positioning member, wherein the inner surface of the side wall of the first positioning member is in shape fit with the outer surface of the side wall of the second positioning member.

[0028] In at least one embodiment of another aspect of the present invention, the second positioning member is made of a thermally conductive material.

[0029] The technical solution proposed by the present invention may have one or more of the following advantages compared with the prior art:

[0030] (1) The leads of the magnetic devices are formed into pins first, positioned and then soldered to the circuit board, reducing the flying wire connections and the possibility of missing or misplacing electronic components;

[0031] (2) The semiconductor devices are pre-positioned on the first positioning member, reducing the possibility of missing or misplacing the semiconductor devices;

[0032] (3) The heat-generating electronic components are in good contact with the second positioning member made of a heat-conducting material, enabling effective heat dissipation;

[0033] (4) The semiconductor devices are first positioned on the second positioning member made of a heat-conducting material and then wave soldered to the circuit board, reducing the pin stress generated during the subsequent assembly to the cold plate and extending the service life;

[0034] (5) The first positioning member is an integral part for positioning and assembling multiple electronic components, reducing the assembly errors caused by the assembly between multiple positioning parts;

[0035] (6) The electronic components that can only be individually installed in the external housing in the prior art are first concentrated together to form an integrated module, and then the integrated module is installed in the external housing. The integrated module is simple to assemble, operable in terms of process, and has no risk of misassembly or missing installation. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] To further clarify the above and other advantages and features of the embodiments of the present invention, a more specific description of the embodiments of the present invention will be presented with reference to the accompanying drawings. It should be understood that these drawings only depict typical embodiments of the present invention and thus will not be considered as limiting the scope of the present invention claimed.

[0037] Figure 1 An exploded view of an integrated module for electronic components according to an embodiment of the present invention is shown.

[0038] Figure 2 A top view of the first positioning member in the integrated module according to an embodiment of the present invention is shown.

[0039] Figure 3 A schematic diagram of the assembled integrated module according to an embodiment of the present invention is shown.

[0040] Figure 4 A schematic diagram of the integrated module assembled with the circuit board according to an embodiment of the present invention is shown.

[0041] Figure 5The flowchart of a method for connecting electronic components to a circuit board according to an embodiment of the present invention is shown. Detailed implementation mode

[0042] The present invention will be further described below in conjunction with specific embodiments and the accompanying drawings. More details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention is clearly capable of being implemented in many other ways different from this description. Those skilled in the art can make similar generalizations and deductions according to the actual application situation without departing from the connotation of the present invention. Therefore, the protection scope of the present invention should not be limited by the content of this specific embodiment.

[0043] This application uses specific terms to describe the embodiments of this application. Such as "one embodiment", "other embodiments", and / or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that the "one embodiment" or "other embodiments" or "some embodiments" mentioned twice or more at different positions in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be appropriately combined.

[0044] It should be noted that, in order to simplify the expression of the disclosure of this application and thus help the understanding of one or more embodiments, in the previous description of the embodiments of this application, sometimes multiple features are merged into one embodiment, drawing, or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than those mentioned in the claims. In fact, the features of the embodiment are less than all the features of the single embodiment disclosed above.

[0045] Refer to Figure 1 , Figure 1 shows an exploded view of an integrated module 100 for electronic components according to an embodiment of the present invention. As Figure 1 shown, the integrated module 100 may include a first positioning member 110, a second positioning member 120, a third positioning member 130, a plurality of first electronic components 140, and a plurality of second electronic components 150. Among them, the first positioning member 110 can be used to position the plurality of first electronic components 140 and the plurality of second electronic components 150. The second positioning member 120 can be used to accommodate the plurality of first electronic components 140 and / or dissipate the heat generated by the first electronic components 140 and the second electronic components 150 during operation. The third positioning member 130 can be used to fix the plurality of second electronic components 150 and make the plurality of second electronic components 150 closely adhere to the second positioning member 120 for heat dissipation. The first electronic components 140 can be magnetic devices such as transformers and inductors, and the second electronic components 150 can be semiconductor devices such as diodes and triodes.

[0046] Referring to Figure 1 , the first positioning member 110 has a certain thickness and may have a top and side walls. The top has a border and is perpendicular to the thickness direction of the first positioning member 110, and the side walls extend downward from the top along the thickness direction. Figure 1 It is illustrated that the border of the top is a straight border, but in other embodiments, the border can be a curved border or a mixed type of straight and curved. At least one side window may be provided on the side wall, and each side window is for placing a second electronic component 150. When placing semiconductor devices such as diodes and triodes, a part of the tube body thereof can be accommodated in the side window, and the rest is exposed outside the side window. Although Figure 1 the shape of the side window shown in is rectangular, but in other embodiments, the shape of the side window can vary according to the shape of the second electronic component 150. In some embodiments, the first positioning member 110 may not have side walls.

[0047] Continuing to refer to Figure 1 , one or more first connection portions 112 may be provided near the corner positions of the first positioning member 110. The first connection portions 112 may be hollow structures, and the hollow portions in the hollow structures may extend upward to the top of the first positioning member 110 and downward to the bottom of the first positioning member 110, that is, completely penetrate. In other embodiments, the first connection portions 112 may be located at a certain distance from the corner positions of the first positioning member 110, such as at any position on the border between two adjacent corner positions. As described below with reference to Figure 2 , the first positioning member 110 may further include positioning through holes or positioning snaps for the pins of the first electronic component 140 to extend outside the top of the first positioning member 110 while fixing these pins in corresponding positions.

[0048] Continuing to refer to Figure 1 , the second positioning member 120 may have a cavity 121 communicating with the outside for accommodating at least one first electronic component 140. In some embodiments, the first electronic component 140 may be a magnetic device, such as a transformer, an inductor, etc. As Figure 1 shown, the second positioning member 120 may further have one or more second connection portions 122, and the second connection portions 122 are installed in cooperation with the first connection portions 112 of the first positioning member 110. In one embodiment, the second connection portions 122 may be hollow structures, and the hollow portions in the hollow structures may extend upward to the top of the second connection portions 122 and downward to the bottom of the second connection portions 122, that is, completely penetrate. As Figure 1 shown, the outer wall shape of the second connection portions 122 may be matched with the inner wall shape of the first connection portions 112 to facilitate the installation of the first connection portions 112 and the second connection portions 122 in cooperation with each other. Also as Figure 1As shown, the outer surface of the side wall of the second positioning member 120 can be configured to match the shape of the inner surface of the side wall of the first positioning member 110, so that the first positioning member 110 can be assembled onto the second positioning member 120 along its thickness direction. In Figure 1 the illustrated embodiment, the outer periphery of the second positioning member 120 may further have a step 123 for the bottom of the side wall of the first positioning member 110 to be placed thereon. In other embodiments, the outer periphery of the second positioning member 120 may not have a step, and the bottom of the first positioning member 110 may be above, flush with, or below the bottom of the second positioning member 120.

[0049] Continuing to refer to Figure 1 , the third positioning member 130 may have a fixing portion 131 and at least one pressing portion 132 for holding the main body portion of at least one second electronic component 150, such as the body of a semiconductor device, in the corresponding side window 111 on the first positioning member 110. In Figure 1 the illustrated embodiment, the third positioning member 130 is an elastic clip, and each elastic clip may have a plurality of juxtaposed pressing portions 132, and the plurality of juxtaposed pressing portions 132 are integrally formed with the fixing portion 131 and are configured in a finger-like shape. In some embodiments, the fixing portion 131 can be fixed to the second positioning member 120 by connection means such as bolt connection, welding, riveting, adhesive connection, etc. For example, the fixing portion 131 can be fixed to the side wall below the step 123, and each pressing portion 132 can be configured in a zigzag or S shape to elastically abut the second electronic component 150 located in the corresponding side window 111 against the outer surface of the side wall of the second positioning member 120. In other embodiments, the fixing portion 131 can be fixed to the first positioning member 110, such as below the side window of the first positioning member 110. In still other embodiments, the fixing portion 131 and the pressing portion 132 can be configured in a serial connection, and the fixing portion 131 can be fixed to the first positioning member 110 by connection means such as bolt connection, welding, riveting, adhesive connection, etc. For example, the fixing portion 131 can be fixed to the side of the side window 111. The pressing portion 132 can be a plurality of continuous zigzags or S shapes to elastically abut the second electronic component 150 located in the corresponding side window 111 against the outer surface of the side wall of the second positioning member 120. Although in Figure 1Three elastic clips are shown. The three elastic clips are all in a finger-like structure, and the number of pressing portions 132 in each elastic clip is 4 or 2. However, in other embodiments, elastic clips with a serial connection structure can be used, or there can be both elastic clips with a finger-like structure and elastic clips with a serial connection structure, and the number of elastic clips and the number of pressing portions 132 in each elastic clip can be set according to the distribution of the second electronic component 150. For example, the number of elastic clips can be 1, 2, 4, 5 or other numbers, and the number of pressing portions 132 in each elastic clip can be 1, 3, 5 or other numbers.

[0050] Specifically refer to the following Figure 2 for description. Figure 2 shows Figure 1 a top view of the first positioning member 110 in the integrated module 100.

[0051] As Figure 2 shown, the first positioning member 110 may have at least one positioning portion and at least one opening area 113 at the top. The opening area 113 aligns with and exposes the first electronic component 140 placed in the inner cavity 121 of the second positioning member 120. The opening area 113 helps with the heat dissipation of the first electronic component 140. As Figure 2 shown, the positioning portion may penetrate the top of the first positioning member 110 in the thickness direction of the first positioning member 110, and can be a positioning through hole 114 or a positioning buckle 115. In the Figure 2 embodiment shown, the positioning buckle 115 extends into the opening area 113 through the arm 116 to hold the pins of at least one first electronic component 140 in a snap-fit manner. In other embodiments, the positioning buckle 115 can be provided on the periphery of the opening area 113 and communicate with the opening area 113. In the Figure 2 embodiment shown, the positioning through hole 114 is located at a position around the top opening area 113. However, in other embodiments, the positioning through hole 114 can also extend into the opening area 113 through the arm 116. In another embodiment, the positioning through hole 114 and the positioning buckle 115 extend into the opening area 113 through the same arm 116, so that one positioning portion can have both the positioning through hole 114 and the positioning buckle 115 at the same time.

[0052] Figure 3 shows a schematic diagram of the assembled integrated module 100. As Figure 3As shown, the first electronic component 140 is located in the inner cavity 121 of the second positioning member 120. In some embodiments, the first electronic component 140 is potted in the inner cavity of the second positioning member 120 with thermally conductive potting adhesive. The second positioning member 120 can be an aluminum die casting or made of other thermally conductive materials, which enables the heat generated by the first electronic component 140 during operation to be conducted out well. The use of the thermally conductive potting adhesive can also firmly fix the first electronic component 140 in the inner cavity of the second positioning member 120, thereby providing effective shock resistance and vibration resistance.

[0053] Continuing to refer to Figure 3 , the pins of the first electronic component 140 extend outside the top through the positioning through holes 114 or positioning clips 115 of the first positioning member 110, so that the first electronic component 140 can be soldered to the circuit board through these pins, and at least a part of the first electronic component 140 is exposed through the opening area 113, so that the heat generated by the first electronic component 140 during operation can be dissipated through the opening area 113. In one embodiment, the pins of the first electronic component 140 are formed by tinning the leads of the first electronic component 140.

[0054] Continuing to refer to Figure 3 , the bottom of the side wall of the first positioning member 110 is placed on the step 123 of the second positioning member 120, at least a part of the second connecting portion 122 of the second positioning member 120 is placed in the hollow structure of the first connecting portion 112 of the first positioning member 110, the main body portion of the second electronic component 150 is located in the side window 111 of the first positioning member 110, and at least a part of the pins of the second electronic component 150 extends above the top of the first positioning member 110, so that the second electronic component 150 can be soldered to the circuit board through these pins. In Figure 3 the embodiment shown, the second electronic component 150 is held in the corresponding side window 111 of the first positioning member 110 by the third positioning member 130. The fixing portion 131 of the third positioning member 130 is fixed to the side wall below the step 124 of the second positioning member 120 by bolt connection. The pressing portion 132 of the third positioning member 130 applies pressure to the second electronic component 150 in the side window 111 through elastic force, so that the second electronic component 150 abuts against the outer surface of the side wall of the second positioning member 120. On the one hand, this can enable the second electronic component 150 to be stably positioned in the corresponding side window 111 of the first positioning member 110; on the other hand, it can enable the second electronic component 150 to closely adhere to the outer surface of the side wall of the second positioning member 120, so that the heat generated by the second electronic component 150 during operation can be better conducted out through the second positioning member 120 made of thermally conductive material.

[0055] In some embodiments, the first positioning member 110 may be a plastic integral part, such that a plurality of electronic components can be positioned by the same first positioning member, which reduces the assembly error caused by the assembly between a plurality of positioning parts.

[0056] As described above in connection with Figures 1-3 the integrated module 100 may include a first positioning member 110, a second positioning member 120, a third positioning member 130, a first electronic component 140, and a second electronic component 150. However, in other embodiments, the integrated module may include a first positioning member 110, a second positioning member 120, and a first electronic component 140, but not include the second electronic component 150. Correspondingly, the first positioning member 110 may not have sidewalls or side windows 111. In still other embodiments, the integrated module may include a first positioning member 110, a second positioning member 120, and a second electronic component 150, but not include the first electronic component 140. Correspondingly, the first positioning member 110 may not have sidewalls, and a part of the main body of the second electronic component 150 and the third positioning member 130 may be selectively disposed on the inner sidewall or the outer sidewall of the second positioning member 120.

[0057] In some embodiments, as Figure 4 shown, the integrated module 100 assembled as a whole can be assembled onto a circuit board. For example, the pins of the first electronic component 140 and the second electronic component in the integrated module 100 are respectively passed through preset positions on the circuit board, and then the pins of the first electronic component 140 and / or the second electronic component 150 are soldered using wave soldering. Further, in one embodiment, before soldering, the integrated module 100 can be further connected to an external housing through the second connecting portion 122 of the second positioning member 120. In the embodiments of the present invention, the electronic components that can only be individually installed in the external housing in the prior art are first concentrated together to form the integrated module 100, and then the integrated module 100 is installed in the external housing. The integrated module 100 is simple to assemble, operable in terms of process, and has no risk of misassembly and missing installation.

[0058] The various examples of the first positioning member 110 and the second positioning member 120 described above for the integrated module 100 can be formed into a positioning device individually or in combination. In some embodiments, the first positioning member 110 can be provided alone as a positioning device for positioning the pins of electronic components. In other embodiments, the first positioning member 110 and the second positioning member 120 can be provided together as a positioning device for positioning the pins of electronic components. By tinning the leads of the magnetic device to form pins and positioning the pins of the magnetic device with the first positioning member 110, the magnetic device can be allowed to be soldered to a predetermined position on the circuit board through the pins, reducing flying wire connections, thereby reducing the possibility of misassembly and missing installation.

[0059] The following will refer to Figure 5 describe a method 500 for connecting electronic components to a circuit board. Figure 5 A flowchart of a method 500 for connecting electronic components to a circuit board according to an embodiment of the present invention is shown.

[0060] At step 502, a first electronic component is placed within a second positioning member. In some embodiments, a plurality of first electronic components 140 may be placed in the inner cavity 121 of the second positioning member 120 as described above in connection with Figure 1 As described. In one embodiment, the first electronic component 140 may be potted in the inner cavity 121 of the second positioning member 120 by a thermally conductive potting adhesive. The second positioning member 120 may be made of a thermally conductive material, for example, an aluminum die casting.

[0061] At step 504, the pins of the first electronic component are positioned by a first positioning member. In some embodiments, after the first electronic component 140 is placed within the second positioning member 120, the first positioning member 110 may be assembled onto the second positioning member 120 along its thickness direction, and the pins of the first electronic component 140 may pass through the positioning portions of the first positioning member 110, such as positioning through holes 114 or positioning snaps 115, and extend beyond the top of the first positioning member 110. For example, the pins to pass through the positioning portions may be selected as needed so that each pin of the first electronic component 140 can be soldered to a predetermined position on the circuit board after being positioned. In one embodiment, the first electronic component 140 may be a magnetic device such as a transformer or an inductor, and the leads of the magnetic device may be tinned to form the pins. As described above in connection with Figures 1-3 describe various possible configurations of the first positioning member 110 and the second positioning member 120. For example, the first positioning member 110 has a first connecting portion and the second positioning member 120 has a second connecting portion, the first positioning member 110 has side walls or no side walls, the second positioning member 120 has a step 123 or no step 123, etc. The first positioning member 110 may be assembled onto the second positioning member 120 according to the different configurations of the first positioning member 110 and the second positioning member 120, which will not be elaborated here.

[0062] Step 506, position the second electronic component. In some embodiments, as described above in connection with Figure 1As described, the first positioning member 110 may have side walls along its thickness direction, and the side walls may have at least one side window 111. The positioning of the plurality of second electronic components 150 can be achieved by placing at least a part of the main body portions of the second electronic components 150 in the corresponding side windows 111. For example, the second electronic components 150 to be received in the side windows 111 can be selected as needed, so that after each second electronic component 150 is positioned, the pins extending above the top of the first positioning member 110 can be soldered to a predetermined position on the circuit board. In one embodiment, the second electronic components 150 can be semiconductor devices such as diodes and triodes, and the main body portion can be the body of the semiconductor device. By pre-positioning the semiconductor devices on the first positioning member 110, the possibility of misplacement and missing installation of the semiconductor devices is reduced.

[0063] Step 508, fix the second electronic components. In some embodiments, the third positioning member 130 as described above in combination with Figure 1 can be further used to abut the main body portions of the plurality of second electronic components 150 against the outer surface of the side wall of the second positioning member 120. In one embodiment, the second positioning member 120 can be made of a heat-conducting material, for example, an aluminum die-casting. By pressing the second electronic components 150 tightly against the outer surface of the side wall of the second positioning member 120 made of a heat-conducting material through the third positioning member 130, the contact thermal resistance can be reduced and the heat dissipation efficiency can be improved. In addition, since the second electronic components 150 are positioned and fixed to the second positioning member 120 made of a heat-conducting material before their pins are soldered to the circuit board, compared with the prior art, the stress generated at the pins when the pins are assembled to the cold plate after being positioned and soldered will be greatly reduced, thus extending the service life.

[0064] Step 510, solder the pins to the circuit board. In one embodiment, the pins of the first electronic component 140 and the second electronic components 150 can be soldered to predetermined positions on the circuit board. For example, after the pins of the first electronic component 140 and the second electronic components 150 are installed on the printed circuit board, wave soldering is performed on these pins.

[0065] The above steps are all exemplary and are not intended to be limiting. Those skilled in the art can add one or more steps according to their needs, or delete one or more of the above steps, or combine or replace one or more of the above steps, or adjust the order of one or more of the above steps. For example, in some embodiments, steps 506 and 508 can be omitted, that is, only the first electronic component 140 is located and soldered to the circuit board. In other embodiments, steps 502, 506 and 508 can be omitted, that is, only the pins of the first electronic component 140 are located and soldered to the circuit board. In still other embodiments, steps 502 and 504 can be omitted, that is, only the second electronic component 150 is located and its pins are soldered to the circuit board.

[0066] The preferred embodiments of the present invention have been described in detail above. However, it should be understood that various embodiments and variations can be adopted without departing from the broad spirit and scope of the present invention. Those of ordinary skill in the art can make many modifications and changes based on the concept of the present invention without creative labor. Therefore, all technical solutions that can be obtained by those skilled in the art through logical analysis, reasoning or limited experiments based on the concept of the present invention on the basis of the prior art should fall within the protection scope determined by the claims of the present invention.

[0067] The terms and expressions used herein are used in a descriptive rather than a restrictive sense, and when using such terms and expressions, it is not intended to exclude any equivalents of the features shown and described (or some parts thereof). It should be recognized that various modifications are possible within the scope of the claims. Accordingly, the claims are intended to cover all such equivalents.

Claims

1. A positioning device for electronic components, characterized in that, the positioning device includes: A first positioning member, the first positioning member has a top, the top is perpendicular to the thickness direction of the first positioning member, the first positioning member includes at least one positioning portion, and the at least one positioning portion penetrates the top of the first positioning member in the thickness direction to allow the pins of at least one first electronic component to extend beyond the top of the first positioning member. The first positioning member has a side wall in the thickness direction, and the side wall has at least one side window for accommodating at least a part of the main body of at least one second electronic component and allowing the pins of the at least one second electronic component to extend above the top of the first positioning member; A second positioning member, the second positioning member has a cavity communicating with the outside for accommodating the at least one first electronic component, and the first positioning member is used to be assembled onto the second positioning member along its thickness direction; A third positioning member, the third positioning member is used to hold the main body of the at least one second electronic component in the corresponding side window on the first positioning member.

2. The positioning device according to claim 1, characterized in that, the first positioning member has an opening area at the top for exposing at least a part of the at least one first electronic component, each of the at least one positioning portions includes at least one of a positioning through hole and a positioning buckle, wherein the positioning buckle extends into the opening area for holding the pins of the at least one first electronic component.

3. The positioning device according to claim 2, characterized in that, the outer periphery of the second positioning member has a step, the bottom of the side wall of the first positioning member is used to be placed on the step of the second positioning member, wherein the inner surface of the side wall of the first positioning member is in shape fit with the outer surface of the side wall of the second positioning member.

4. The positioning device according to any one of claims 1-3, characterized in that, the third positioning member includes at least one elastic clip, each of the at least one elastic clips has a fixing portion and at least one pressing portion, wherein the fixing portion is fixed on the second positioning member, and the at least one pressing portion is configured to make the at least one second electronic component located in the corresponding side window abut against the outer surface of the side wall of the second positioning member.

5. The positioning device according to claim 4, characterized in that, the at least one pressing portion includes a plurality of the pressing portions, the pressing portions are zigzag or S-shaped, the fixing portion and the plurality of pressing portions are configured to be interdigitated, and each of the plurality of pressing portions makes the second electronic component located in the corresponding side window abut against the outer surface of the side wall of the second positioning member.

6. The positioning device according to any one of claims 1-3, characterized in that, The third positioning member includes at least one elastic clip, each of the at least one elastic clip having a fixing portion and a plurality of pressing portions, wherein the pressing portions are zigzag or S-shaped, the fixing portion and the plurality of pressing portions are configured to be serially connected, the fixing portion is fixed to the first positioning member, and each of the plurality of pressing portions abuts the outer surface of the side wall of the second positioning member of the second electronic component located in the corresponding side window.

7. The positioning device according to any one of claims 1-3, wherein, the second positioning member is made of a heat-conducting material.

8. An integrated module of electronic components, wherein, the integrated module includes: the positioning device according to any one of claims 1-7; at least one first electronic component, the at least one first electronic component being located in the inner cavity of the second positioning member of the positioning device; and at least one second electronic component, at least a part of the main body of each of the at least one second electronic component being located in the corresponding side window on the side wall of the first positioning member of the positioning device.

9. The integrated module according to claim 8, wherein, the at least one first electronic component includes a magnetic device, and the pins of the magnetic device are formed by tinning the leads of the magnetic device; and the at least one second electronic component includes a semiconductor device.

10. The integrated module according to claim 8, wherein, the second positioning member is made of a heat-conducting material.

11. A method for connecting an electronic component to a circuit board, wherein, the method includes: providing the positioning device according to claim 1; placing at least one first electronic component in the inner cavity of the second positioning member of the positioning device; assembling the first positioning member of the positioning device to the second positioning member along its thickness direction; passing the pins of the at least one first electronic component through at least one positioning portion of the first positioning member and extending beyond the top of the first positioning member; placing at least a part of the main body of at least one second electronic component in the corresponding side window of at least one side window of the first positioning member; using the third positioning member of the positioning device to abut the main body of the at least one second electronic component against the outer surface of the side wall of the second positioning member; soldering the pins of the at least one first electronic component to a predetermined position on the circuit board.

12. The method according to claim 11, wherein, the method further includes: potting the at least one first electronic component in the inner cavity of the second positioning member with a heat-conducting potting adhesive.

13. The method according to claim 12, wherein, assembling the first positioning member to the second positioning member includes: mating and installing at least one first connecting portion of the first positioning member with at least one second connecting portion of the second positioning member.

14. In the method according to claim 13, the first connecting portion and the second connecting portion are hollow structures, and assembling the first positioning member to the second positioning member includes: Place at least a part of the second connecting portion within the hollow structure of the first connecting portion.

15. The method according to any one of claims 11-14, wherein, the method further comprises: soldering the pins of the at least one second electronic component to other predetermined positions on the circuit board.

16. The method according to claim 15, wherein, the at least one first electronic component includes a magnetic device, the at least one second electronic component includes a semiconductor device, and the method further comprises: tinning the leads of the magnetic device to form the pins.

17. The method according to claim 15, wherein, the outer periphery of the second positioning member has a step, assembling the first positioning member onto the second positioning member includes: placing the bottom of the side wall of the first positioning member on the step of the second positioning member, wherein the inner surface of the side wall of the first positioning member is in shape fit with the outer surface of the side wall of the second positioning member.

18. The method according to claim 15, wherein, the second positioning member is made of a heat-conductive material.

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