Resin molding device and method for manufacturing resin molded product

Abstract

The present invention provides a resin molding device and a method for manufacturing a resin molded product that can easily change the supply mode of a resin material. The resin molding device (D) comprises: a resin supply mechanism (21) that supplies resin material to a supply object (F); a molding die (M) that includes an upper die and a lower die (LM) that is opposite to the upper die; a clamping mechanism that clamps the molding die (M) in a state where the supply object (F) is arranged between the upper die and the lower die (LM); a display unit (6) that graphically displays the supply state of the resin material based on input of the supply of the resin material to the supply object (F); and a control unit (5) that controls the operation of the resin supply mechanism (21) and the display unit (6).

Description

Technical Field

[0001] The present invention relates to a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] Substrates with semiconductor chips mounted thereon are usually used as electronic parts by resin sealing. Conventionally, as resin molding devices for resin sealing substrates, there are known devices having the following mechanisms: a resin supply mechanism for supplying resin material to the substrate as a supply object; and a mold clamping mechanism for clamping a molding die in a state where the substrate supplied with the resin material is arranged between an upper die and a lower die (for example, refer to Patent Document 1).

[0003] The resin molding device of Patent Document 1 calculates the amount of resin discharged by the resin supply mechanism based on the weight of the substrate measured by the measuring unit, thereby adjusting the amount of resin supplied to the substrate according to the number of defective semiconductor chips.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2003-165133 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, the resin molding device described in Patent Document 1 can increase the amount of resin supplied to the substrate to meet the volume of the defective semiconductor chip, but it is not optimized to supply the resin material. In other words, it is not possible to easily change the supply mode of the resin material according to the type and shape of the substrate.

[0009] Therefore, a resin molding apparatus and a method for producing a resin molded product that can easily change the supply pattern of the resin material are desired.

[0010] Solutions for solving problems

[0011] The characteristic structure of the resin molding device of the present invention is as follows, the resin molding device comprises: a resin supply mechanism for supplying resin material to a supply object; a molding die including an upper die and a lower die opposite to the upper die; a clamping mechanism for clamping the molding die in a state where the supply object is arranged between the upper die and the lower die; a display unit for graphically displaying the supply status of the resin material based on an input of supplying the resin material to the supply object; and a control unit for controlling at least the operation of the resin supply mechanism and the display unit.

[0012] The manufacturing method of the resin molded product of the present invention is characterized in the following aspects, the manufacturing method of the resin molded product includes: a display step, based on the input of supplying the resin material to the supply object, graphically displaying the supply status of the resin material; a resin supply step, based on the supply status, supplying the resin material to the supply object; and a resin molding step, using the resin material supplied in the resin supply step to perform resin molding.

[0013] Effects of the Invention

[0014] According to the present invention, it is possible to provide a resin molding apparatus and a method for manufacturing a resin molded product, which are capable of easily changing a supply pattern of a resin material. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram showing a resin molding device.

[0016] Figure 2 It is a schematic diagram showing the mold clamping mechanism.

[0017] Figure 3 It is a diagram showing the entire display unit.

[0018] Figure 4 A diagram showing a part of a display unit.

[0019] Figure 5 A diagram showing a part of a display unit.

[0020] Figure 6 This is a flow chart of a resin material supply method.

[0021] Description of Reference Numerals

[0022] 2: Resin supply module; 3: Compression molding module; 4: Conveying module; 5: Control unit; 6: Display unit; 21: Resin supply mechanism; 23b: Nozzle; 35: Mold clamping mechanism; D: Resin molding device; F: Release film (supply object); LM: Lower mold; M: Molding mold; UM: Upper mold. DETAILED DESCRIPTION

[0023] Hereinafter, embodiments of the resin molding device and the method for manufacturing a resin molded product of the present invention will be described based on the accompanying drawings. Figure 1 As shown in FIG. 1 , a resin molding device D including a resin supply module 2 will be described. However, the present invention is not limited to the following embodiments, and various modifications can be made without departing from the gist of the invention.

[0024] [Device configuration]

[0025] Substrates mounted with semiconductor chips and the like are used as electronic parts by resin sealing. As technologies for resin sealing a molding object, a compression method (compression molding), a transfer method, and the like can be cited. As one of the compression methods, there can be cited a resin sealing method in which, after supplying a liquid or powdery resin to a release film, a release film is placed on a lower mold of a molding mold, and the molding object is immersed in the resin on the release film to perform resin molding. The resin molding device D in this embodiment adopts a compression method, and the resin supply module 2 is a device that supplies liquid resin (an example of a resin material) to a molding mold, a substrate (an example of a supply object), or a release film F (an example of a supply object). Below,

[0026] The supply object of the resin material composed of liquid resin is set as a release film F, and the substrate S carrying a semiconductor chip (hereinafter, sometimes referred to as a "chip") is set as an example of the molding object, and the gravity direction is set as the bottom, and the direction opposite to the gravity direction is set as the top. It should be noted that Figure 1 The Z direction shown is the up-down direction.

[0027] exist Figure 1 , a schematic diagram of a resin molding device D is shown. The resin molding device D in this embodiment includes: a resin supply module 2, a plurality of (three in this embodiment) compression molding modules 3, a conveying module 4, a control unit 5, and a display unit 6. The resin supply module 2, the plurality of compression molding modules 3, and the conveying module 4 can be independently attached or detached. It should be noted that the compression molding module 3 in this embodiment is composed of three, but it can also be composed of one or more than two.

[0028] The resin supply module 2 includes a resin supply mechanism 21 for supplying liquid resin for resin molding in the resin supply area on the release film F. Here, liquid resin refers to not only resins that are liquid at normal temperature (room temperature), but also molten resins that are solid resins that melt into liquid due to heating. The liquid resin that becomes liquid at normal temperature can be a thermoplastic resin or a thermosetting resin. Thermosetting resins are liquid resins at normal temperature. If heated, the viscosity decreases. If further heated, they will polymerize and solidify to become a cured resin. The liquid resin in this embodiment is preferably a thermosetting resin with a relatively high viscosity that does not flow rapidly at normal temperature.

[0029] The resin supply mechanism 21 includes: a workbench 21A on which a release film F is placed, a discharge mechanism 21B for discharging liquid resin, and a weight sensor 25. The workbench 21A is provided with a release film supply mechanism 22 for delivering the release film F wound on a reel (not shown) and for cutting and separating the release film F. The separated release film F is adsorbed and held on the upper surface of the workbench 21A by a suction mechanism (not shown). A frame-shaped member (not shown) is placed on the upper surface of the release film F. A space corresponding to the lower mold cavity MC described later is formed in the frame-shaped member.

[0030] The discharge mechanism 21B includes a glue dispenser unit 24 equipped with a nozzle unit 23. The glue dispenser unit 24 includes a pressing member (not shown) for squeezing out the liquid resin in a box 23a containing a liquid resin to be described later, and quantitatively supplies the liquid resin to the release film F via the nozzle unit 23 by moving the pressing member in a downward direction. The glue dispenser unit 24 equipped with the nozzle unit 23 is configured to be able to move arbitrarily on the XY plane (horizontal direction) which serves as the loading surface of the release film F. It should be noted that the workbench 21A can also be configured to be able to move arbitrarily on the XY plane in addition to the glue dispenser unit 24 or instead of the glue dispenser unit 24. In addition, the glue dispenser unit 24 is configured to be able to move in the Z direction (up and down direction).

[0031] The nozzle unit 23 includes a box 23a for containing liquid resin and a nozzle 23b for discharging the liquid resin. A plurality of nozzle units 23 (six in this embodiment) are pre-contained in the resin containing portion 11. The dispensing unit 24 is configured to automatically replace the nozzle unit 23 with a different nozzle unit 23 when the liquid resin filled in the nozzle unit 23 is exhausted.

[0032] The weight sensor 25 measures the weight of the liquid resin supplied onto the release film F. The weight sensor 25 is a known load sensor that measures the supplied liquid resin based on the difference between the weight of the table 21A or the release film F after the resin is supplied and the weight of the table 21A or the release film F before the resin is supplied.

[0033] The resin loader 12 is configured to be movable on rails between the resin supply module 2 and the compression molding module 3 . The resin loader 12 can hold the release film F supplied with liquid resin by the resin supply mechanism 21 and transfer it to the compression molding module 3 .

[0034] The compression molding module 3 includes at least a molding die M and a mold clamping mechanism 35 for clamping the molding die M. The compression molding module 3 will be described in detail later.

[0035] The conveying module 4 conveys the pre-resin-sealed substrate Sa (pre-molding substrate) on which the chip before resin sealing is mounted, and conveys the substrate Sb (resin molded product) after resin sealing. The conveying module 4 includes: a substrate loader 41; a first accommodating portion 43 for storing the pre-resin-sealed substrate Sa; a second accommodating portion 44 for storing the substrate Sb after resin sealing; and a substrate handover portion 45. The substrate handover portion 45 can move in the Y direction within the conveying module 4 and hand over the pre-resin-sealed substrate Sa to the substrate loader 41. In addition, the substrate handover portion 45 can receive the resin-sealed substrate Sb conveyed from the substrate loader 41. The substrate loader 41 moves in the X direction and the Y direction within the conveying module 4 and each compression molding module 3.

[0036] The conveying module 4 also includes an inspection mechanism (not shown). The inspection mechanism inspects the chip existence area in the substrate S, which is the molding object in the compression molding module 3. The inspection mechanism checks whether the chip actually exists in the chip existence area scheduled for inspection by scanning with a laser displacement meter, and stores the places where the chip exists and the places where the chip does not exist. It should be noted that the inspection mechanism can also use a visible light camera to photograph the substrate S, and inspect the chip existence area in the substrate S based on the photographed image.

[0037] The control unit 5 is a software for controlling the operation of the resin molding device D, which is composed of a program stored in hardware such as a HDD (Hard Disk Drive) and a memory, and is executed by a CPU of a computer. In this embodiment, as an example of a control method of the control unit 5, the operation of the resin supply mechanism 21 and the display unit 6 will be described later.

[0038] The display unit 6 is composed of a known liquid crystal display fixed to the housing of the conveying module 4 in a state that can be visually confirmed from the outside, and is displayed and controlled by the control unit 5. The display unit 6 is composed of a touch panel that can be operated by pressing the display on the screen with a finger. The display unit 6 in this embodiment is provided on the front surface of the conveying module 4, but it can also be provided on the front surface of the resin supply module 2 or the compression molding module 3. The display method of the display unit 6 will be described later.

[0039] It should be noted that the display unit 6 may be formed by a display of a desktop personal computer, a notebook personal computer, or a tablet terminal, and the operation screen may be displayed by a web browser started via a network line with HTML (Hyper Text Markup Language), CSS (Cascading Style Sheets), etc. In this case, the display unit 6 is configured to be able to communicate wirelessly with the control unit 5 via a predetermined wireless access point, or to be able to communicate by wire through a wired electrical connection. In addition, the display unit 6 may be configured to be able to be operated by operating a mouse, a keyboard, etc.

[0040] like Figure 2 As shown, the compression molding module 3 in this embodiment is composed of a press frame (Press frame) formed by integrating a lower fixed platen 31 and an upper fixed platen 33 through a plate-like member 32. A movable platen 34 is provided between the lower fixed platen 31 and the upper fixed platen 33. The movable platen 34 can move up and down along the plate-like member 32. On the lower fixed platen 31, there is provided: a mold clamping mechanism 35, which is composed of a pair of ball screws and the like as a device for moving the movable platen 34 up and down. The mold clamping mechanism 35 can close the molding mold M by moving the movable platen 34 upward, and open the molding mold M by moving the movable platen 34 downward. The driving source of the mold clamping mechanism 35 is not particularly limited, and for example, an electric motor such as a servo motor can be used.

[0041] The upper mold UM and the lower mold LM as the molding mold M are arranged opposite to each other, and both are composed of molds and the like. An upper heater 37 is arranged on the lower surface of the upper fixed plate 33, and the upper mold UM is installed below the upper heater 37. An upper mold substrate setting portion (not shown) for configuring the substrate S is provided in the upper mold UM, and a substrate S with chips and the like mounted thereon is installed on the lower surface of the upper mold UM. A lower heater 36 is arranged on the upper surface of the movable platen 34, and a lower mold LM is provided above the lower heater 36. The resin supply mechanism 21 supplies the liquid resin applied on the mold release film F to the lower mold cavity MC by holding the mold release film F sucked by the suction mechanism (not shown) in the lower mold cavity MC. The molding mold M is clamped by the clamping mechanism 35, and the lower mold LM is heated by the lower heater 36, so that the liquid resin in the lower mold cavity MC is solidified. That is, in a state where the resin-sealed substrate Sa and the release film F as the supply object are arranged between the upper mold UM and the lower mold LM, the molding mold M is clamped by the clamping mechanism 35. Thus, the chip and the like mounted on the resin-sealed substrate Sa (pre-molding substrate) are resin-sealed in the lower mold cavity MC to form a resin-sealed substrate Sb (resin molded product).

[0042] exist Figure 3In the figure, an example of a display screen of the display unit 6 is shown. The display unit 6 has: a coating line adjustment unit 60, a supply status display unit 61, a calculation result display unit 62, a parameter display unit 63 and an input switching unit 64. The input switching unit 64 has: a resin supply input mode 64a, an adjustment point input mode 64b and a liquid cut-off point input mode 64c. In the rectangular area of ​​the supply status display unit 61, the outer shape of the resin-sealed front substrate Sa observed in the Z direction is displayed. When the resin supply input mode 64a is selected, the supply status display unit 61 becomes a state in which the supply position of the liquid resin to the release film F (resin-sealed front substrate Sa) can be input. The supply position of the liquid resin to the release film F is the supply position of the liquid resin to the resin-sealed front substrate Sa when the molding mold M is clamped. That is, the resin supply mechanism 21 supplies liquid resin to the release film F which is the supply object, and supplies the liquid resin on the release film F to the resin-sealed front substrate Sa. Therefore, the resin supply mechanism 21 indirectly supplies liquid resin to the resin-sealed front substrate Sa, and the outer shape of the resin-sealed front substrate Sa observed in the Z direction is displayed in the rectangular area of ​​the supply status display unit 61.

[0043] Arrows in multiple directions (eight directions in this embodiment) are displayed in the coating line adjustment unit 60, and the length (length on the release film F of the liquid resin) and direction of the line segment drawn by inputting the start point and the end point by touching the supply state display unit 61 with a finger can be corrected by cursor operation (pressing the arrow). This line segment is an input for supplying the liquid resin to the release film F as the supply object, and is the coating line of the liquid resin.

[0044] The supply status display unit 61 graphically displays the supply status of the liquid resin to the release film F (resin-sealed front substrate Sa) based on the input of the position where the liquid resin is supplied to the release film F (an example of the input of the supplied resin material). Figure 3 In the example of FIG. 1 , as input of the supply position of the liquid resin to the release film F, after a plurality of points that become the start point and the end point are input by touch in the supply state display unit 61, the line number ( Figure 3 Then, by repeating this input, multiple lines (in the "Line" column shown in the parameter display section 63) are drawn. Figure 3 The line segments (5 in the figure) (coating lines) are depicted as the supply state of the liquid resin to the release film F (resin-sealed front substrate Sa). Each of these multiple line segments or their combination is a graphic of the coating area of ​​the liquid resin to the release film F (resin-sealed front substrate Sa). It should be noted that as an input for supplying resin material, graphic data such as downloaded CAD data can also be input to the control unit 5, and the control unit 5 causes the display unit 6 to display the supply state of the liquid resin. In addition, it is also possible to input XY coordinates ( Figure 3The control unit 5 automatically draws the line segment in the "X-axis" and "Y-axis" columns shown in the parameter display unit 63. In addition, it can also be a structure that can freely connect each point by touching and inputting multiple points that become the starting point and the end point in the supply status display unit 61.

[0045] The control unit 5 selects the XY coordinates that become the starting points and end points of each of the plurality of line segments based on the graph displayed by the supply status display unit 61, and calculates the weight of the liquid resin in the coating area of ​​the release film F and the length on the release film F. The control unit 5 calculates the weight (g) and length (mm) of the liquid resin in consideration of the discharge amount (g / s) of the liquid resin discharged per unit time from the nozzle unit 23 of the resin supply mechanism 21 and the moving speed (mm / s) of the dispenser unit 24 equipped with the nozzle unit 23. The discharge amount of the liquid resin discharged per unit time from the nozzle unit 23 is set based on the diameter of the nozzle 23b, the specific gravity of the liquid resin, and the like. In addition, the moving speed of the dispenser unit 24 is set to be consistent with the discharge speed of the liquid resin discharged from the nozzle unit 23. The moving speed of the dispenser unit 24 is calculated by dividing the discharge weight of the nozzle 23b per unit time by the specific gravity of the liquid resin by the discharge cross-sectional area of ​​the nozzle 23b. In this way, the control unit 5 calculates the supply state of the liquid resin to the release film F (resin-sealed front substrate Sa) based on the physical properties of the liquid resin and the specifications of the resin supply mechanism 21 .

[0046] In addition, the control unit 5 calculates the maximum weight of the liquid resin in the coating area of ​​the release film F and the maximum length on the release film F based on at least the size of the substrate S as the molding object and the existence area of ​​the chip in the substrate S. In this calculation, the physical properties of the liquid resin and the specifications of the resin supply mechanism 21 can also be considered. Specifically, based on the size of the substrate S and the existence area of ​​the chip, the volume of the substrate S sealed with resin is calculated, and the maximum weight of the liquid resin in the coating area of ​​the release film F is calculated by multiplying the volume by the specific gravity of the liquid resin, and the maximum length of the liquid resin in the coating area of ​​the release film F is calculated by dividing the volume by the discharge cross-sectional area of ​​the nozzle 23b. It should be noted that the size of the substrate S, the existence area of ​​the chip, etc. in the substrate S, and the diameter of the nozzle unit 23 can be manually input and set in advance, and the size of the substrate S and the existence area of ​​the chip, etc. in the substrate S stored in the above-mentioned inspection mechanism can be read in real time.

[0047] like Figure 4 As shown in the figure below, the calculation result display unit 62 displays the weight and length of the liquid resin related to the supply status displayed by the supply status display unit 61 ( Figure 4 ) Figure 4In the example of , the maximum weight and maximum length of the liquid resin in the coating area of ​​the release film F are displayed on the upper line, and the weight and length of the liquid resin related to the supply status displayed by the supply status display unit 61 are displayed on the lower line.

[0048] In this way, based on the input of the supply position of the liquid resin, the supply state of the liquid resin to the release film F (resin-sealed front substrate Sa) is graphically displayed, so that the supply state of the liquid resin can be visually grasped. That is, by only inputting the planar position of the liquid resin supplied to the release film F, the supply state of the liquid resin can be intuitively grasped, and the ideal supply mode of the liquid resin can be set in a manner that achieves a reasonable supply amount and a reasonable supply position. As a result, during the molding of the clamping mechanism 35, the undesirable condition of the liquid resin overflowing from the lower mold cavity MC can be eliminated, and the liquid resin can be focused on the parts where the liquid resin is likely to be insufficient according to the type of substrate S. Moreover, if the weight and length of the liquid resin are displayed in the calculation result display unit 62, the supply mode of the liquid resin can be easily changed in a manner that achieves a reasonable supply amount and a reasonable supply position.

[0049] When the adjustment point input mode 64b of the input switching unit 64 is selected, the supply state display unit 61 is in a state where the position (adjustment point) of the liquid resin that is insufficient after the resin supply is completed can be input into the supply state display unit 61. The adjustment point is set, for example, at the center ( Figure 4 The "ADJ" in the figure above indicates that there is no such undesirable situation that insufficient liquid resin overflows from the lower mold cavity MC during molding of the mold clamping mechanism 35. In this way, after the resin supply mechanism 21 completes the supply of liquid resin to the release film F, the position of the insufficient liquid resin is displayed in the supply state display unit 61, so by adjusting this position, the resin material can be supplied in a reasonable supply amount and reasonable supply position.

[0050] like Figure 5 As shown, the parameter display unit 63 may also display a correction value ( Figure 5The "Offset" column shown in the figure). If the moving speed of the dispensing unit 24 equipped with the nozzle unit 23 (hereinafter referred to as the moving speed of the nozzle unit 23) is inconsistent with the discharge speed of the liquid resin discharged from the nozzle unit 23, the coating line will fluctuate, and it is impossible to draw the coating line as set. Therefore, as a correction value for correcting the working speed of the resin supply mechanism 21, the correction ratio (ratio, 1 is the standard value) of the moving speed of the nozzle unit 23 is input into the parameter display unit 63, and the control unit 5 preferably changes the moving speed of the nozzle unit 23 according to the correction ratio. In this way, the fluctuation of the coating line of the liquid resin on the release film F can be eliminated, and the supply pattern of the liquid resin can be set in a manner to achieve a reasonable supply amount and a reasonable supply position. It should be noted that the moving speed of the nozzle unit 23 can be changed for each coating line, or it can be changed uniformly as a whole.

[0051] In addition, as the operation content when one round of supply in the resin supply mechanism 21 is finished, the parameter display unit 63 may also display the number of times ( Figure 5 The "Drain" column shown in the figure). After the supply of liquid resin to a coating line is completed and the drive of the glue dispenser unit 24 is temporarily stopped, even if the nozzle 23b is blocked, the higher the viscosity of the liquid resin, the longer the wire drawing state of the liquid resin is maintained in the nozzle 23b. Therefore, the drive of the glue dispenser unit 24 is not stopped until the wire drawing state is eliminated, which reduces productivity. Therefore, it is preferred that the number of times the nozzle unit 23 is moved up and down is input to the parameter display unit 63, and the control unit 5 uses the specified liquid cut-off point to move the nozzle unit 23 up and down. By adjusting the number of times the nozzle unit 23 is moved up and down, the wire drawing state can be eliminated earlier.

[0052] When the liquid cutoff point input mode 64c of the input switching unit 64 is selected, the position (liquid cutoff point) at which the nozzle 23b is moved up and down after the resin supply mechanism 21 temporarily stops supplying the liquid resin to the release film F can be input to the supply state display unit 61. The liquid cutoff point can be set, for example, at the center of each coating line, so that the liquid resin can be uniformly supplied to the release film F. In this way, if the position at which the nozzle 23b is moved up and down after the resin supply mechanism 21 temporarily stops supplying the liquid resin to the release film F is displayed, the resin material can be uniformly supplied by adjusting the position.

[0053] It should be noted that, as the work content when one round of supply in the resin supply mechanism 21 is finished, the parameter display unit 63 may also display the time (predetermined time described later) for reciprocating the nozzle unit 23 along the coating line. In this case, it is preferred that the time for reciprocating the nozzle unit 23 is input to the parameter display unit 63, and the control unit 5 reciprocates the nozzle unit 23 along the coating line according to the time. Thus, after temporarily stopping the drive of the dispenser unit 24, the residual liquid discharged from the nozzle 23b is evenly applied to the coating line until the pressure in the box 23a is released, thereby preventing the resin from accumulating.

[0054] In addition, the parameter display unit 63 may also display the length and weight (in Chinese) of the liquid resin of each coating line related to the supply status displayed by the supply status display unit 61. Figure 5 In this way, if the supply status of the liquid resin for each coating line is understood based on the input of the supply position of the liquid resin in the supply status display unit 61, the supply mode of the liquid resin can be changed in such a way that the supply length and supply amount are equal between the coating lines.

[0055] [Resin material supply method]

[0056] Main Use Figure 6 The resin material supply method will be described.

[0057] The control unit 5 calculates the maximum weight and maximum length of the liquid resin in the coating area of ​​the release film F in advance based on at least the size of the substrate S as the molding object and the area where the chips, etc., are present in the substrate S. Next, after the start point and the end point are input by touching the supply status display unit 61 with a finger, a plurality of (for example, N=5) coating lines are drawn by inputting the line number to the parameter display unit 63, and the resin supply position (#61) is input. Specifically, in response to the touch input of the start point and the end point, Figure 3 The supply status display unit 61 shown in the figure displays the point number, and the parameter display unit 63 displays the line number ( Figure 3 In this case, as required, it is also possible to draw multiple line segments by Figure 3 The coating line adjustment unit 60 shown here adjusts the length of each coating line by performing a cursor operation.

[0058] As a result, if Figure 4As shown in the above figure, in the supply status display unit 61, the supply status of the liquid resin to the release film F (resin sealing front substrate Sa) is graphically displayed (#62, display step). Then, based on the graph displayed by the supply status display unit 61, the control unit 5 selects the XY coordinates that become the starting point and end point of each of the multiple line segments, and calculates the weight and length of the liquid resin in the coating area of ​​the release film F (calculation step). As a result, Figure 4 As shown in the figure below, in the calculation result display unit 62, the maximum weight and maximum length of the liquid resin in the coating area of ​​the release film F and the weight and length of the liquid resin related to the supply status displayed by the supply status display unit 61 are displayed in the upper and lower rows in sequence.

[0059] Next, the control unit 5 determines whether the weight and length of the liquid resin related to the supply status displayed by the supply status display unit 61 are less than the maximum weight and maximum length of the liquid resin in the coating area of ​​the release film F, that is, determines whether the supply status (supply amount and supply position) is reasonable (#63). When the weight or length of the liquid resin related to the supply status displayed by the supply status display unit 61 is not less than the maximum weight or maximum length, the control unit 5, for example, colors the numbers in the calculation result display unit 62 in red to display a warning. In this way, it is possible to visually determine whether the supply status is reasonable. When the result of the judgment in #63 is that the supply status is unreasonable (the judgment in #63 is no), the input of the resin supply position in #61 is corrected again. When the correction input is made, if Figure 5 As shown in the parameter display section 63, the weight and length of the liquid resin of each coating line are displayed, so that fine corrections can be made to each coating line.

[0060] When the result of the determination in #63 is that the supply state is reasonable (determination in #63 is yes), the control unit 5 sets the nozzle 23b of the nozzle unit 23 to be located above the starting point of the N=1th (#64) coating line ( Figure 4 The dispensing machine unit 24 equipped with the nozzle unit 23 of the resin supply mechanism 21 is moved in the manner of moving toward the point number "00" shown in the above figure) to supply liquid resin along the coating line toward the point number "01" (#65, supply step). At this time, if the correction ratio of the moving speed of the nozzle unit 23 is input to the parameter display unit 63, the control unit 5 corrects the moving speed of the nozzle unit 23 that discharges the liquid resin (correction step). As a result, the moving speed of the nozzle unit 23 can be made consistent with the discharge speed of the liquid resin discharged from the nozzle unit 23, thereby eliminating the fluctuation of the coating line. Next, the control unit 5 determines whether the nozzle unit 23 has reached the upper part of the end point of the N=1th coating line ( Figure 4If the result of the determination in #66 is that the nozzle unit 23 has not reached the upper end of the N=1th coating line (No in #66), liquid resin is then supplied to the N=1th coating line.

[0061] If the result of the judgment of #66 is that the nozzle unit 23 reaches the upper end of the N=1 coating line (#66 is judged as yes), the control unit 5 judges that one round of resin supply is completed and temporarily stops the drive of the dispenser unit 24. Then, the nozzle unit 23 is reciprocated along the N=1 coating line (horizontally parallel to the release film F) (#67, reciprocating step). Next, as the time for reciprocating the nozzle unit 23 input to the parameter display unit 63, it is determined whether the prescribed time for releasing the residual pressure of the nozzle unit 23 has passed (#68). If the result of the judgment of #68 is that the prescribed time has not passed (#68 is judged as no), the control unit 5 continues to reciprocate the nozzle unit 23. If the prescribed time has passed (#68 is judged as yes), N is added by 1 (#69). Before this addition operation, in order to reliably realize the liquid cut-off of the nozzle unit 23, the control unit 5 uses the prescribed liquid cut-off point to move the nozzle unit 23 up and down the number of times input to the parameter display unit 63. Next, the control unit 5 determines whether N exceeds the number of buses (N=5). If N is within the number of buses (No determination in #70), the control of #65 to #68 is repeated.

[0062] On the other hand, if N exceeds the number of bus lines (N=5) (#70 is determined as YES), the control unit 5 determines whether the amount of liquid resin supplied by the resin supply mechanism 21 measured by the weight sensor 25 is within the tolerance range relative to the target amount (#71). If the amount of liquid resin supplied by the resin supply mechanism 21 exceeds the tolerance range and is insufficient relative to the target amount (#71 is determined as NO), the control unit 5 moves the nozzle unit 23 to the adjustment point ( Figure 4 The process ends when the insufficient amount of liquid resin is supplied to the adjustment point (#72). The adjustment point may be the central part of the release film F (resin-sealed front substrate Sa), a coating line with a relatively small amount of resin between multiple coating lines, or an area where no chips or the like are detected by an inspection mechanism. On the other hand, if the result of the determination in #71 is that the amount of liquid resin supplied by the resin supply mechanism 21 is within the tolerance range relative to the target amount (#71 is determined to be yes), the process ends.

[0063] [Method for producing resin molded article]

[0064] Next, a method for producing a resin molded product including the above-mentioned resin material supply method will be described.

[0065] First, if Figure 1 As shown, the pre-resin-sealed substrate Sa delivered from the first receiving portion 43 through the substrate delivery portion 45 is placed on the substrate loader 41. At this time, the inspection mechanism inspects the area where chips and the like exist in the substrate S (pre-resin-sealed substrate Sa) as the molding object in advance. In addition, the above-mentioned resin material supply method is executed to supply liquid resin to the release film F.

[0066] Next, the resin loader 12 transfers the release film F to the lower mold LM, and uses the suction mechanism to suck the release film F into the lower mold cavity MC and hold it. In addition, the substrate loader 41 transfers the resin-sealed substrate Sa to the upper mold UM and delivers it to the upper mold UM. Next, while the mold clamping mechanism 35 is used to perform the mold clamping of the molding mold M, the lower mold LM is heated by the lower heater 36, thereby causing the liquid resin on the release film F to flow on the chip mounting surface of the resin-sealed substrate Sa. Then, the lower mold LM is further heated by the lower heater 36, and the liquid resin in the lower mold cavity MC is solidified, and the resin-sealed substrate Sa is resin-sealed to form a resin-sealed substrate Sb (resin molding step). Next, the mold M is opened by moving the movable platen 34 downward, and the substrate Sb after resin sealing from which the release film F has been peeled off is transported to the transport module 4 by the substrate loader 41. The substrate delivery section 45 receives the substrate Sb after resin sealing from the substrate loader 41 and accommodates it in the second accommodation section 44 (see Figure 1 ).

[0067] [Another embodiment]

[0068] In the following, for easy understanding, the same terms and reference numerals are used for the same components as those in the above-mentioned embodiment.

[0069] <1>

[0070] The supply state of the liquid resin to the release film F (resin-sealed front substrate Sa) as the supply object is not limited to Figure 4 The graphical multiple coating lines shown in the above figure can be formed by multiple parallel straight lines or by a group of points. In this case, each point becomes a "graph". In addition, the coating line is not limited to a straight line, and can also be formed by a curve or a combination of a straight line and a curve.

[0071] <2>

[0072] The resin supply mechanism 21 may also be constituted by a device that supplies a powdery or granular resin (an example of a resin material) to the release film F. In this case, a container filled with the powdery or granular resin is transferred to the resin supply mechanism 21 by the resin loader 12 described above. Then, the powdery or granular resin is supplied to the release film F via a vibration groove connected to the bottom opening of the container.

[0073] <3>

[0074] In the above-mentioned embodiment, the nozzle unit 23 is filled with liquid resin in advance, but a resin filling unit may be provided separately. In this case, in the resin filling unit, a predetermined amount of liquid resin is filled into the interior of the container. Then, the resin loader 12 transfers the container filled with liquid resin to the resin supply mechanism 21, and the dispenser unit 24 sucks the liquid resin from the container and supplies the liquid resin on the release film F from the nozzle 23b.

[0075] <4>

[0076] Generally, a plurality of semiconductor chips are evenly spaced in almost the entire region of the substrate S, but semiconductor chips may not exist in a part of the substrate S. Therefore, the part without semiconductor chips may be set as a liquid cutoff point or an adjustment point.

[0077] <5>

[0078] In the above embodiment, the resin material is supplied onto the release film F in the resin supply module 2. However, the resin supply module 2 may be configured as two modules by separating the release film supply mechanism 22 as a release film supply module from the resin supply module 2.

[0079] <6>

[0080] The substrate S in the above-described embodiment may be in any shape such as a circular shape or a rectangular shape.

[0081] <7>

[0082] The correction value for correcting the operating speed of the resin supply mechanism 21 in the above-described embodiment may be configured such that one coating line is divided into a plurality of lines and the correction value can be set for each divided line.

[0083] <8>

[0084] In the above-mentioned embodiment, the die-down compression method is described, but the die-up compression method may be used, and the molding object such as the substrate may be set as the supply object to which the resin is supplied in the resin supply mechanism 21. In addition, the mold release film F may be omitted and the molding mold M may be set as the supply object to which the resin is supplied in the resin supply mechanism 21.

[0085] [Overview of the above embodiment]

[0086] Hereinafter, the outline of the resin molding device D, the method for manufacturing a resin molded product, and the method for supplying a resin material described in the above-mentioned embodiment will be described.

[0087] (1) The characteristic structure of the resin molding device D is as follows, wherein the resin molding device D comprises: a resin supply mechanism 21 for supplying resin material to a supply object (release film F); a molding mold M including an upper mold UM and a lower mold LM opposite to the upper mold UM; a clamping mechanism 35 for clamping the molding mold M in a state where the supply object is arranged between the upper mold UM and the lower mold LM; a display unit 6 for graphically displaying the supply status of the resin material based on an input of supplying the resin material to the supply object; and a control unit 5 for controlling at least the operation of the resin supply mechanism 21 and the display unit 6.

[0088] In this configuration, the supply state of the resin material is graphically displayed based on the input of the resin material supplied to the supply object, so that the supply state of the resin material can be visually grasped. That is, by only inputting the plane position of the resin material supplied to the supply object, etc., the supply state of the resin material can be intuitively grasped, and the ideal supply mode of the resin material can be set in a manner that achieves a reasonable supply amount and a reasonable supply position. As a result, when the molding mold M is molded in a mold-clamping state using the mold clamping mechanism 35, the undesirable condition of the resin material overflowing from the lower mold cavity MC is eliminated, and the resin material can be focused on the part where the resin material is likely to be insufficient according to the type of the molding object. In this way, a resin molding device D that can easily change the supply mode of the resin material can be provided.

[0089] (2) The display unit 6 may display the weight and length of the resin material in relation to the supply state of the resin material.

[0090] By displaying the weight and length of the resin material as in this configuration, the supply pattern of the resin material can be easily changed so as to achieve an appropriate supply amount and an appropriate supply position.

[0091] (3) The display unit 6 may display a correction value for correcting the operating speed of the resin supply mechanism 21 .

[0092] If the moving speed of the nozzle unit 23 does not match the discharge speed of the resin material, the coating line cannot be drawn as set. If the correction value for correcting the operating speed of the resin supply mechanism 21 is displayed as in this configuration, the coating line can be drawn as set.

[0093] (4) The resin supply mechanism 21 may include the nozzle 23b for discharging the resin material, and the display unit 6 may display the number of times the nozzle 23b is moved up and down after the resin supply mechanism 21 temporarily stops supplying the resin material to the supply target object.

[0094] The higher the viscosity of the resin material, the longer the stringy state of the nozzle 23b is maintained after the resin supply in the resin supply mechanism 21 is temporarily stopped. Therefore, the drive of the glue dispenser unit 24 is not stopped until the stringy state is eliminated, which reduces productivity. If the number of times the nozzle 23b is moved up and down after the resin supply mechanism 21 temporarily stops supplying the resin material to the supply object is displayed as in this configuration, the stringy state can be eliminated earlier by adjusting the number of times.

[0095] (5) The display unit 6 may display the position where the nozzle 23b is moved up and down.

[0096] As shown in this configuration, the resin material can be uniformly supplied by adjusting the position at which the nozzle 23 b is moved up and down after the resin supply mechanism 21 temporarily stops supplying the resin material to the supply target object.

[0097] (6) The display unit 6 may display a position where the resin material that is insufficient is supplied again after the resin supply mechanism 21 has completed supplying the resin material to the supply target object.

[0098] By displaying the position where the resin supply mechanism 21 supplies the insufficient resin material again after completing supply of the resin material to the supply target object as in this configuration, the resin material can be supplied at an appropriate supply amount and at an appropriate supply position by adjusting the position.

[0099] (7) The control unit 5 may calculate the weight and length of the resin material related to the supply state of the resin material based on the physical properties of the resin material and the specifications of the resin supply mechanism 21 .

[0100] The supply state of the resin material changes depending on the specific gravity of the resin material, the nozzle diameter, etc. Therefore, if the weight and length of the resin material related to the supply state are calculated based on the physical properties of the resin material and the specifications of the resin supply mechanism 21 as in this configuration, the resin material can be supplied in a manner that achieves a reasonable supply amount and a reasonable supply position.

[0101] (8) The method for manufacturing a resin molded product is characterized in that the method for manufacturing a resin molded product includes: a display step, in which a supply status of the resin material is graphically displayed based on an input of the resin material supplied to a supply object (release film F); a resin supply step, in which the resin material is supplied to the supply object based on the supply status; and a resin molding step, in which resin molding is performed using the resin material supplied in the resin supply step.

[0102] In this method, the supply state of the resin material is graphically displayed based on the input of the resin material supplied to the supply object, so that the supply state of the resin material can be visually grasped. That is, by only inputting the plane position of the resin material supplied to the supply object, the supply state of the resin material can be grasped, and the ideal supply mode of the resin material can be set in a manner that achieves a reasonable supply amount and a reasonable supply position. As a result, the resin material can be focused on the part where the resin material is likely to be insufficient according to the type of molding object. In this way, a method for manufacturing a resin molded product that can easily change the supply mode of the resin material can be provided.

[0103] (9) The resin material supply method is characterized in that the resin material supply method includes: a display step, based on the input of supplying the resin material to the supply object (release film F), graphically displaying the supply status of the resin material; and a resin supply step, based on the supply status, supplying the resin material to the supply object.

[0104] In this method, the supply state of the resin material is graphically displayed based on the input of the resin material supplied to the supply object, so that the supply state of the resin material can be visually grasped. That is, by only inputting the plane position of the resin material supplied to the supply object, etc., the supply state of the resin material can be grasped, and the ideal supply mode of the resin material can be set in a manner that achieves a reasonable supply amount and a reasonable supply position. As a result, the resin material can be focused on the part where the resin material is likely to be insufficient according to the type of molding object. In this way, a resin material supply method that can easily change the supply mode of the resin material can be provided.

[0105] (10) The resin material supply method may further include: a calculation step of calculating the weight and length of the resin material related to the supply state of the resin material.

[0106] By calculating the weight and length of the resin material as in this method, the supply pattern of the resin material can be easily changed so as to achieve an appropriate supply amount and an appropriate supply position.

[0107] (11) The resin material supply method may further include a correction step of correcting a moving speed of the nozzle unit 23 that discharges the resin material in the resin supply step.

[0108] If the moving speed of the nozzle unit 23 and the discharge speed of the resin material do not match, the coating line cannot be drawn as set. If the moving speed of the nozzle unit 23 that discharges the resin material is corrected as in this method, the coating line can be drawn as set.

[0109] (12) The resin material supply method may further include a reciprocating step of reciprocating the nozzle unit 23 for discharging the resin material in a horizontal direction parallel to the supply object after temporarily stopping the supply of the resin material to the supply object in the resin supply step.

[0110] After the resin supply in the resin supply step is temporarily stopped, there is a fear that the resin may be accumulated due to the residual liquid discharged from the nozzle 23b until the residual pressure of the nozzle unit 23 is released. If, as in the present method, after the supply of the resin material to the supply object is temporarily stopped, the nozzle unit 23 that discharges the resin material is reciprocated in a horizontal direction parallel to the supply object, the resin accumulation can be prevented.

[0111] It should be noted that the configuration disclosed in the above-mentioned embodiment (including another embodiment, the same below) can be combined with the configuration disclosed in other embodiments for application as long as no contradiction occurs. In addition, the embodiments disclosed in this specification are illustrative, and the embodiments of the present invention are not limited thereto, and can be appropriately changed within the scope of the purpose of the present invention.

[0112] Industrial Applicability

[0113] The present invention can be used for a resin molding device and a method for manufacturing a resin molded product.

Claims

1. A resin molding device, wherein: have: A resin supply mechanism supplies liquid resin material to a supply object; A molding die, comprising an upper die and a lower die opposite to the upper die; A mold clamping mechanism for clamping the molding die in a state where the supply object is arranged between the upper die and the lower die; a display unit for graphically displaying a supply state of the resin material based on an input of supplying the resin material to the supply object; as well as a control unit that controls at least the operation of the resin supply mechanism and the display unit, The resin supply mechanism includes a nozzle that discharges the resin material. The display unit displays the number of times the nozzle is moved up and down at the liquid cutoff point after the resin supply mechanism temporarily stops supplying the resin material to the supply object. The liquid cut-off point can be input.

2. The resin molding device according to claim 1, wherein: The display section displays the weight and length of the resin material in relation to the supply status.

3. The resin molding device according to claim 1, wherein: The display unit displays a correction value for correcting an operating speed of the resin supply mechanism.

4. The resin molding device according to claim 1, wherein: The display unit displays the liquid cutoff point.

5. The resin molding device according to any one of claims 1 to 4, wherein: The display unit displays a position where the resin material that is insufficient is resupplied after the resin supply mechanism has completed supplying the resin material to the supply target object.

6. The resin molding device according to any one of claims 1 to 4, wherein: The control unit calculates the weight and length of the resin material related to the supply state based on the physical properties of the resin material and the specifications of the resin supply mechanism.

7. A method for producing a resin molded product, wherein: include: A display step of graphically displaying a supply state of the resin material based on an input of supplying the resin material to the supply object; a resin supplying step of supplying the resin material from a nozzle to the supply object based on the supply state; as well as a resin molding step of performing resin molding using the resin material supplied in the resin supplying step, In the display step, the number of times the nozzle that temporarily stops supplying the resin material to the supply object moves up and down at the liquid cutoff point is displayed, The liquid cut-off point can be input.

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