A highly adaptable heat transfer test device

Abstract

The present invention discloses a highly adaptable heat transfer test device, including a body, a heating element, and a fixed element. The body includes a controllable temperature module, a cold bridge structure, and a cold input module from top to bottom. The upper surface of the controllable temperature module is provided with a plurality of slots for placing test elements, and the lower surface is connected to the cold bridge structure. The upper surface of the cold input module is connected to the cold bridge structure; the heating element is attached to the upper surface of the controllable temperature module, and the fixed element is connected to the upper surface of the controllable temperature module by a thread for fixing the test element. By adjusting the fixed element, batch replacement of the test element can be achieved. The heat transfer device provided by the present invention forms a limited heat conduction path, so that the input of cold is more accurately controllable. The temperature of the measured temperature element can be kept within the target temperature range for a long time by coordinating and controlling the power of the heating element. It can be applied to test scenarios of heat transfer elements with different external dimensions, heat transfer temperatures, condensation section lengths, and quantities.

Description

Technical Field

[0001] The invention relates to the technical field of heat transfer element testing, and in particular to a highly adaptable heat transfer testing device. Background Art

[0002] In the fields of spacecraft thermal control, electronic equipment heat dissipation, etc., various heat pipes, temperature equalizers and other heat transfer components are widely used. With the rapid development of science and technology, more stringent heat dissipation scenarios have led to the requirements of various industries for thermal control components to adapt to higher temperature ranges, higher heat transfer, smaller volume and weight, etc. Due to the diversity of the appearance and functional requirements of thermal control components, the current thermal control component heat transfer test device field mostly adopts a one-to-one design of thermal control components and experimental tooling. It is necessary to separately demonstrate the feasibility of the test device, separately put into production a dedicated heat transfer test tooling and configure the corresponding auxiliary materials. The multiple and complex test tools have caused a waste of time and money.

[0003] In the field of thermal performance testing of heat transfer components, the most widely used identification standard is the limit of the heat power that the component can transfer under a given component temperature, a given condensation section area, and a given test posture. In order to achieve this test requirement and take into account economic efficiency, a heat transfer test device that can stably maintain a given interface temperature and is universally suitable for different component shapes and different heat transfer requirements and has a certain batch testing capability is urgently needed. Summary of the invention

[0004] In view of this, the present invention provides a highly adaptable thermal control element heat transfer test device to solve the deficiencies in the prior art.

[0005] To achieve the above object, the present invention is implemented by the following technical solutions:

[0006] A highly adaptable heat transfer test device comprises a main body, a heating element, and a fixing element. The main body comprises a controllable temperature module, a cold bridge structure, and a cold input module from top to bottom. The upper surface of the controllable temperature module is provided with a slot for placing the test element, and the lower surface is connected to the cold bridge structure. The upper surface of the cold input module is connected to the cold bridge structure; the heating element is attached to the upper surface of the controllable temperature module, and the fixing element is used to fix the test element and is connected to the upper surface of the controllable temperature module through a thread.

[0007] Furthermore, the slot width and the test element width satisfy the relationship: slot width - test element width ≥ 0.1 mm; the slot height and the test element height satisfy the relationship: 0 ≤ test element height - slot height ≤ 0.5 mm.

[0008] Furthermore, the total area of ​​the heating element satisfies the condition:

[0009]

[0010] The total area of ​​the heating element and the area of ​​the card slot refer to the area of ​​the heating element and the card slot projected onto the upper surface of the controllable temperature module.

[0011] Furthermore, the contact area S1 between the controllable temperature module and the cold bridge structure, and the lower surface area S2 of the controllable temperature module satisfy the relationship: 1≤S2:S1≤20; the contact area S3 between the cold input module and the cold bridge structure, and the upper surface area S4 of the cold input module satisfy the relationship: 1≤S4:S3≤20.

[0012] Furthermore, the controllable temperature range of the controllable temperature module is: ambient temperature ±30°C, the temperature control accuracy is ±1°C, and the number of single controllable elements is ≥1.

[0013] Furthermore, the body is made of any one of aluminum, aluminum alloy, copper and copper alloy.

[0014] Furthermore, the heating element is composed of a built-in resistance wire with a fixed resistance and an external packaging material; the packaging material is selected from any one of polyimide films or ceramics.

[0015] Furthermore, the heating element is attached to the surface of the controllable temperature module by means of a double-sided pressure-sensitive tape or silicone rubber.

[0016] Furthermore, the fixing element is made of a heat-insulating material with a thermal conductivity of less than 10W / M·K.

[0017] Furthermore, the fixing element is made of any one of glass fiber reinforced plastics, titanium alloy, and polymer plastic.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] The highly adaptable heat transfer test device provided by the present invention has an integrated main body structure, which can make the input of cold capacity more accurate and controllable. The multiple slot structures on the surface of the controllable temperature module can provide a heat dissipation surface for multiple samples that are arbitrarily smaller than its width. At the same time, the length of the sample condensation section can also be adjusted according to the different lengths of the contact area during installation. While meeting the requirements of the thermal performance test of the heat transfer element, the adaptability of the test device is greatly improved. In addition, by coordinating and controlling the power of the heating element, the temperature of the measured temperature element can be kept within the target temperature range for a long time. By adjusting the fixed element, batch replacement of the test element can be achieved. The heat transfer device provided by the present invention is applicable to test scenarios of heat transfer elements with different external dimensions, heat transfer temperatures, condensation section lengths, and quantities. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of a test device according to a preferred embodiment of the present invention;

[0021] Figure 2 It is a simulated temperature field distribution diagram of a test device according to another preferred embodiment of the present invention. DETAILED DESCRIPTION

[0022] The following describes several preferred embodiments of the present invention with reference to the drawings in the specification, so that the technical content is clearer and easier to understand. The present invention can be embodied in many different forms of embodiments, and the protection scope of the present invention is not limited to the embodiments mentioned in the text.

[0023] In the drawings, components with the same structure are indicated by the same numerical reference numerals, and components with similar structures or functions are indicated by similar numerical reference numerals. The size and thickness of each component shown in the drawings are arbitrarily shown, and the present invention does not limit the size and thickness of each component. In order to make the illustration clearer, the thickness of the components is appropriately exaggerated in some places in the drawings.

[0024] like Figure 1 As shown, a schematic diagram of a highly adaptable heat transfer test device of a preferred embodiment of the present invention includes a body 1, a heating element 2 and a fixing element 3. The body 1 includes a controllable temperature module 101, a cold bridge structure 103, and a cold input module 102 from top to bottom. Preferably, the body 1 is an integrated structure. The upper surface of the controllable temperature module 101 is provided with a plurality of slots 104 for placing the test element 4, and the lower surface is connected to the cold bridge structure 103. The upper surface of the cold input module 102 is connected to the cold bridge structure 103 to form a limited heat conduction path; the heating element 2 is attached to the upper surface of the controllable temperature module 101 by double-sided pressure-sensitive tape or silicone rubber, and avoids the slot area; the fixing element 3 is connected to the upper surface of the controllable temperature module 101 by a thread to fix the test element 4. The body 1 is made of any one of aluminum, aluminum alloy, copper, and copper alloy; the heating element 2 is composed of a built-in resistance wire with a fixed resistance and an external packaging material, and the packaging material is selected from any one of polyimide film or ceramic. The fixing element 3 is made of insulating material with a thermal conductivity of less than 10W / M·K, and can be made of any material selected from glass fiber reinforced plastics, titanium alloy, and polymer plastic. The number of the slots 104 can be adjusted according to the number of the test elements 4, and the number of the fixing elements 3 is determined according to the number of the test elements 4 to be fixed.

[0025] Preferably, the plurality of slots 104 on the surface of the controllable temperature module 101 are parallel to each other, which can avoid problems such as interference during installation of adjacent components, irregular setting of temperature control components, irregular setting of fixed components, and inconsistent temperature distribution of the condensation section in the length direction.

[0026] In order to better fix the test element 4, the width and height of the slot 104 and the width and height of the test element 4 must satisfy a certain relationship: slot 104 width - test element 4 width ≥ 0.1mm; 0 ≤ test element 4 height - slot 104 height ≤ 0.5mm.

[0027] In order to achieve a better heat transfer and heat control effect, the total area of ​​the heating element 2 must meet the following requirements: the sum of the areas of the heating element 2 accounts for no less than 15% of the area of ​​the upper surface of the controllable temperature module 101 excluding the slot. The contact area S1 between the controllable temperature module 101 and the cold bridge structure 103 and the lower surface area S2 of the controllable temperature module 101 meet the following relationship: 1≤S2:S1≤20; the contact area S3 between the cold input module 102 and the cold bridge structure 103 and the upper surface area S4 of the cold input module 102 meet the following relationship: 1≤S4:S3≤20.

[0028] The controllable temperature range of the controllable temperature module 101 is: ambient temperature ±30°C, the temperature control accuracy is ±1°C, and the number of single controllable elements is ≥1.

[0029] When the device is used for heat transfer and temperature control, the test element 4 is placed in the slot 104 and in thermal contact with the bottom surface of the slot 104 , and is fixed by the fixing element 3 .

[0030] The cold input module 102 is brought into thermal contact with a stable cold source, and the cold is transferred to the test element 4 through the cold input module 102, the cold bridge structure 103, and the controllable temperature module 101 in sequence, forming a condensation section of a certain length. A temperature collection point is set on the cooled test element 4 as a temperature control point, and a temperature measuring element is attached to the temperature control point and connected to a data acquisition instrument to form a temperature measurement loop. The heating element 2 is connected to an external programmable power supply to form a heating loop, and a temperature target value is set. The difference between the temperature signal of the temperature measuring element and the temperature target value is analyzed in real time by a computer, and the output power of the heating element 2 is closed-loop controlled to finally achieve the temperature of the test element 4 maintained at the temperature target value. If the cold source input temperature of the device is set to be maintained at -30°C, combined with an ambient temperature of -40°C~50°C, the device can perform a heat transfer test of the heat transfer element under the working conditions of -30°C~60°C.

[0031] Figure 2This is the simulated temperature field distribution of another preferred embodiment of the present invention, wherein the body 1 is an integrated structure of aluminum alloy, the heating element 2 is a polyimide film heating sheet, the fixing element 3 is a glass fiber reinforced plastic material, and the two contact areas formed by the cold bridge structure 103 and the controllable temperature module 101 and the cold input module 102 are connected to the corresponding module connection surface area ratio of 16.7 and 13.3 respectively. The card slot 104 is provided with 8 channels, which are of the same size and parallel to each other. The depth of each card slot is 4mm and the width is 5.1mm, which can meet the requirements of testing 8 heat transfer elements with a height of 4~4.5mm and a width of less than 5mm at the same time. The film heating sheet 2 is attached to the surface of the controllable temperature module 101 by double-sided pressure-sensitive tape. It is made of a nickel-chromium heating wire with a resistance of 60Ω inside and a polyimide film material hot-pressed package outside. The size is 150mm*30mm, and the sum of the areas of the film heating sheet 2 accounts for 24.5% of the surface area of ​​the controllable temperature module 101 except the card slot. The test element 4 is a heat pipe. Set the cold source input temperature of the device to maintain at 20℃, the ambient temperature to maintain at 40℃, and set the temperature control target temperature to 53℃. Then the device can provide a stable condensing surface temperature of 53℃~54℃ for 8 heat pipes at the same time. Figure 2 The simulated temperature field distribution is shown in Figure 1. The length of the heat pipe condensation section is adjustable from 0 to 200 mm.

Claims

1. A highly adaptable heat transfer test device, comprising a body, a heating element, and a fixing element, characterized in that: The main body includes a controllable temperature module, a cold bridge structure, and a cold input module from top to bottom. The upper surface of the controllable temperature module is provided with a plurality of slots for placing test elements, and the lower surface is connected to the cold bridge structure. The upper surface of the cold input module is connected to the cold bridge structure; the heating element is attached to the upper surface of the controllable temperature module, and the fixing element is connected to the upper surface of the controllable temperature module through a thread for fixing the test element; the slot width and the test element width meet the relationship: slot width - test element width ≥ 0.1mm; the slot height and the test element height meet the relationship: 0 ≤ test element height - slot height ≤ 0.5mm; the total area of ​​the heating element meets the conditions: The total area of ​​the heating element and the area of ​​the card slot refer to the area of ​​the heating element and the card slot projected onto the upper surface of the controllable temperature module.

2. The highly adaptable heat transfer test device according to claim 1, characterized in that: The contact area S1 between the controllable temperature module and the cold bridge structure and the lower surface area S2 of the controllable temperature module satisfy the relationship: 1≤S2:S1≤20; the contact area S3 between the cold input module and the cold bridge structure and the upper surface area S4 of the cold input module satisfy the relationship: 1≤S4:S3≤20.

3. The highly adaptable heat transfer test device according to claim 1, characterized in that: The controllable temperature range of the controllable temperature module is: ambient temperature ±30°C, the temperature control accuracy is ±1°C, and the number of single controllable elements is ≥1.

4. The highly adaptable heat transfer test device according to claim 1, characterized in that: The main body is made of any one of aluminum, aluminum alloy, copper and copper alloy.

5. The highly adaptable heat transfer test device according to claim 1, characterized in that: The heating element is composed of a built-in resistance wire with a fixed resistance and an external packaging material; the packaging material is selected from any one of a polyimide film or a ceramic.

6. The highly adaptable heat transfer test device according to claim 1, characterized in that: The heating element is adhered to the surface of the controllable temperature module by double-sided pressure-sensitive adhesive tape or silicone rubber.

7. The highly adaptable heat transfer test device according to claim 1, characterized in that: The fixing element is made of heat-insulating material, and the heat conduction coefficient is less than 10W / M·K.

8. The highly adaptable heat transfer test device according to claim 7, characterized in that: The fixing element is made of any one of glass fiber reinforced plastics, titanium alloy and polymer plastic.

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