Electrode fixing structure, dimming film and dimming glass

Abstract

The present invention provides an electrode fixing structure, a dimming film and a dimming glass. The electrode fixing structure includes an electrode, a conductive substrate and a first fixed adhesive layer; the conductive substrate includes a conductive layer as its surface layer; the electrode forms a winding structure around the conductive substrate or part of the conductive substrate; the first fixed adhesive layer is arranged between the electrode and the conductive layer, and is used to bond the electrode and the conductive layer; the first fixed adhesive layer is a conductive adhesive layer. The dimming film is provided with an electrode area, and the electrode area uses the above-mentioned electrode fixing structure. The dimming glass includes a first light-transmitting glass, a second light-transmitting glass and the above-mentioned dimming film, and the dimming film is arranged between the first light-transmitting glass and the second light-transmitting glass. The technical solution provided by the present invention can effectively prevent the electrode from peeling off from the conductive layer.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic light-controlling materials, and in particular relates to an electrode fixing structure, a dimming film and a dimming glass. Background Art

[0002] A dimming film is a device that can adjust the transmittance of light passing through it. It is usually formed by setting a light control layer between two layers of conductive substrates. When the electric field is turned on, the arrangement or state of the material in the light control layer changes, thereby changing the light transmittance characteristics of the entire dimming film, such as from an opaque state to a transparent state, or from a transparent state to an opaque state. The conversion between the on-state and the off-state is achieved by the action of the electric field. According to the different light control mechanisms of the light control layer, the dimming film can be divided into suspended particle dimming film, polymer dispersed liquid crystal dimming film, electrochemical reaction dimming film, etc. The dimming film has the advantages of actively regulating light transmittance and energy saving, and can be used as smart windows and rearview mirrors, sunglasses, displays, etc. for spacecraft, high-speed railways, automobiles, buildings, etc.

[0003] The dimming film needs to be powered on to achieve the light-control layer's dark-state adjustment, so the conductive substrate of the dimming film needs to leave an electrode area. In the electrode area, the conductive layer needs to be connected to the electrode, that is, the conductive metal strip or conductive metal mesh, to achieve connectivity with the external power supply, thereby achieving electrochromic.

[0004] In the prior art, the connection between the conductive layer and the conductive metal strip or the conductive metal mesh is generally achieved through a conductive adhesive, which is generally a conductive silver paste. This conductive adhesive can bond the conductive metal strip or the conductive metal mesh to the conductive layer, and then connect the external power line to the conductive metal strip or the conductive metal mesh by soldering or other methods. However, this technology has obvious defects. Because the viscosity of the conductive adhesive is relatively low, the bonded conductive metal strip or conductive metal mesh is easy to peel off, especially in the later lamination process, welding process with the external power line, and transportation process. It is easy to cause the entire electrode and the conductive layer to peel off due to collision, pulling and other factors. Although the conductive adhesive has been improved for many years, its bonding ability has not been fundamentally improved due to the limitations of its connection structure. This has led to the difficulty in effectively improving the yield of electrodes in the preparation process of dimming films. Summary of the invention

[0005] The object of the present invention is to provide an electrode fixing structure which can effectively prevent the electrode from being peeled off from the conductive layer.

[0006] Another object of the present invention is to provide a dimming film, which can effectively prevent the electrode on the conductive layer from peeling off.

[0007] Another object of the present invention is to provide a dimming glass, which can effectively prevent the electrode from peeling off.

[0008] In order to achieve the above-mentioned object, on the one hand, the present invention provides an electrode fixing structure, which includes an electrode, a conductive substrate and a first fixing adhesive layer; wherein the conductive substrate includes a conductive layer, and the conductive layer serves as a surface layer of the conductive substrate;

[0009] The electrode forms a winding structure around the conductive substrate or part of the conductive substrate;

[0010] The first fixing adhesive layer is disposed between the electrode and the conductive layer, and is used to bond the electrode and the conductive layer so that the electrode is attached to the conductive layer of the conductive substrate; the first fixing adhesive layer is a conductive adhesive layer;

[0011] The winding structure is a closed winding structure or a non-closed winding structure.

[0012] The electrode fixing structure provided by the present invention cooperates with the first fixing adhesive layer and the winding structure, thereby greatly stabilizing the conductive layer and the electrode and preventing the electrode from peeling off from the conductive layer.

[0013] In the above electrode fixing structure, the winding structure is a closed winding structure or a non-closed winding structure, and can be a single-turn winding structure or a multi-turn winding structure, and preferably includes at least one surrounding turn.

[0014] In one embodiment, the electrode forms a winding structure around the conductive substrate;

[0015] In this embodiment, the winding structure can be formed by bending the two ends of the electrode from one side of the conductive substrate to the other side through the two side edges of the conductive substrate; the winding structure can be formed by repeatedly bending one end of the electrode from one side of the conductive substrate to the other side through the edge of one side of the conductive substrate.

[0016] In a specific embodiment, a first electrode fixing hole group is provided on the conductive substrate, wherein the first electrode fixing hole group is composed of through holes provided on the conductive substrate, and the electrode forms a winding structure around a portion between the first electrode fixing hole group on the conductive substrate and one side of the conductive substrate;

[0017] In this embodiment, the winding structure can be formed by passing one end of the electrode through the through hole in the first electrode fixing hole group and bending it from one side of the conductive substrate to the other side, and the other end passing through the edge of one side of the conductive substrate and bending it from one side of the conductive substrate to the other side; the winding structure can be formed by repeatedly passing one end of the electrode through the through hole in the first electrode fixing hole group and bending it from one side of the conductive substrate to the other side, and then passing through the edge of one side of the conductive substrate and bending it back to the original side of the conductive substrate.

[0018] In a specific embodiment, a second electrode fixing hole group and a third electrode fixing hole group are provided on the conductive substrate, wherein the second electrode fixing hole group is composed of through holes provided on the conductive substrate, and the third electrode fixing hole group is composed of through holes provided on the conductive substrate, and the electrode forms a winding structure around a portion between the second electrode fixing hole group and the third electrode fixing hole group on the conductive substrate;

[0019] In this embodiment, the winding structure can be formed by passing one end of the electrode through the through hole in the second electrode fixing hole group and bending it from one side of the conductive substrate to the other side, and passing the other end through the through hole in the third electrode fixing hole group and bending it from one side of the conductive substrate to the other side; the winding structure can be formed by repeatedly passing one end of the electrode through the through hole in the second electrode fixing hole group and bending it from one side of the conductive substrate to the other side, and then passing through the through hole in the third electrode fixing hole group and bending it back to the original side of the conductive substrate.

[0020] In the above electrode fixing structure, preferably, the winding structure is a closed winding structure (i.e., the head and tail ends of the electrode are connected);

[0021] More preferably, the winding structure is a single-loop closed winding structure.

[0022] In the above electrode fixing structure, preferably, the conductive adhesive layer is an adhesive layer containing conductive metal particles;

[0023] Wherein, the conductive metal particles in the adhesive layer containing conductive metal particles preferably include but are not limited to one or a combination of two or more of silver particles, gold particles and copper particles;

[0024] Wherein, the binder in the binder layer containing conductive metal particles preferably includes but is not limited to epoxy resin glue.

[0025] In the above-mentioned electrode fixing structure, preferably, the first fixing adhesive layer can achieve a peel strength between the electrode material and the conductive layer material greater than 3.5N / 1.27cm (that is, the peel strength between the electrode material with a width of 1.27cm and the conductive layer material is greater than 3.5N).

[0026] In one embodiment, the binder containing conductive metal particles is a commonly used conductive silver paste, such as DuPont conductive silver paste. PV145, DuPont conductive silver paste PVD1x, DuPont conductive silver paste PVD2x, conductive silver paste ZB2563 from Nanjing Zhongbei Electronics.

[0027] In the above electrode fixing structure, preferably, the electrode fixing structure further comprises a second fixing glue layer;

[0028] The second fixing adhesive layer is disposed between the electrode and another surface layer on the conductive substrate opposite to the conductive layer, and is used to bond the electrode to another surface layer on the conductive substrate opposite to the conductive layer; or; one side of the second fixing adhesive layer covers the electrode and another surface layer on the conductive substrate opposite to the conductive layer, and is used to achieve the bonding of the fixing electrode to another surface layer on the conductive substrate opposite to the conductive layer;

[0029] More preferably, the conductive substrate further comprises an insulating layer, and the insulating layer serves as another surface layer of the conductive substrate corresponding to the conductive layer;

[0030] The second fixing adhesive layer may be an insulating adhesive layer or a conductive adhesive layer; more preferably, the second fixing adhesive layer is an insulating adhesive layer;

[0031] Further preferably, the second fixing adhesive layer is an insulating adhesive layer or an insulating tape layer;

[0032] When the second fixing adhesive layer is disposed between the electrode and another surface layer on the conductive substrate opposite to the conductive layer and is used to bond the electrode to another surface layer on the conductive substrate opposite to the conductive layer, the second fixing adhesive layer is an insulating adhesive layer;

[0033] When one side of the second fixing adhesive layer covers the electrode and another surface layer on the conductive substrate opposite to the conductive layer, so as to achieve the bonding of the fixed electrode and another surface layer on the conductive substrate opposite to the conductive layer, the second fixing adhesive layer is an insulating tape layer;

[0034] Wherein, the insulating adhesive of the insulating adhesive layer preferably includes but is not limited to at least one of acrylic adhesive and epoxy adhesive;

[0035] Wherein, the insulating tape of the insulating tape layer preferably includes but is not limited to pressure-sensitive tape and / or silicone tape.

[0036] Since the bonding strength between the insulating adhesive layer or the insulating tape layer and the insulating layer is usually much greater than the bonding strength between the conductive layer and the conductive adhesive layer, in the above preferred method, by adding an insulating adhesive layer or an insulating tape layer to the insulating layer, the bonding strength of the electrode to the conductive substrate is improved, the conductive layer and the electrode are further stabilized, and the electrode is prevented from peeling off the conductive layer.

[0037] In a specific implementation manner, the insulating adhesive is 3M epoxy glue and / or 3M acrylic glue.

[0038] In the above electrode fixing structure, preferably, the second fixing adhesive layer can achieve a peel strength between the electrode material and another surface layer material on the conductive substrate corresponding to the conductive layer greater than 15N / 1.27cm (i.e., the peel strength between the material of the electrode with a width of 1.27cm and the material of another surface layer on the conductive substrate corresponding to the conductive layer is greater than 15N);

[0039] More preferably, the second fixing adhesive layer can achieve a peel strength between the electrode material and another surface material on the conductive substrate corresponding to the conductive layer that is greater than 20N / 1.27cm (i.e., the peel strength between the material of the electrode with a width of 1.27cm and another surface material on the conductive substrate corresponding to the conductive layer is greater than 20N).

[0040] In the above electrode fixing structure, preferably, the electrode includes but is not limited to at least one of a copper electrode and an aluminum electrode.

[0041] In the above electrode fixing structure, preferably, the material of the electrode includes but is not limited to a conductive metal strip or a conductive metal mesh;

[0042] The thickness of the conductive metal strip is preferably less than or equal to 0.2 mm, more preferably less than or equal to 0.1 mm, and further preferably 0.05 mm.

[0043] The thickness of the conductive metal mesh is preferably less than or equal to 0.2 mm, more preferably less than or equal to 0.1 mm, and further preferably 0.05 mm.

[0044] In this preferred embodiment, the electrodes are formed by bending conductive metal strips or conductive metal meshes.

[0045] In a second aspect, the present invention provides a dimming film, wherein the dimming film includes the above-mentioned electrode fixing structure.

[0046] In the above dimming film, preferably, the dimming film comprises a light control layer, a first conductive substrate and a second conductive substrate arranged on both sides of the light control layer; the first conductive substrate and the second conductive substrate are both provided with a light control area and an electrode area; the first conductive substrate and the second conductive substrate are both provided with a conductive layer inside; wherein,

[0047] The light control area of ​​the first conductive substrate is arranged opposite to the light control area of ​​the second conductive substrate, and two sides of the light control layer are in contact with the inner side of the light control area of ​​the first conductive substrate and the inner side of the light control area of ​​the second conductive substrate respectively;

[0048] The electrode area of ​​the first conductive substrate is fixed with a first electrode, and the electrode area of ​​the first conductive substrate fixed with the first electrode adopts the above-mentioned electrode fixing structure; and / or; the electrode area of ​​the second conductive substrate is fixed with a second electrode, and the electrode area of ​​the second conductive substrate fixed with the second electrode adopts the above-mentioned electrode fixing structure.

[0049] In the above dimming film, preferably, an insulating layer is disposed on the outer sides of the first conductive substrate and the second conductive substrate.

[0050] In the above dimming film, preferably, each conductive layer is a transparent conductive layer;

[0051] More preferably, each conductive layer is selected from one or a combination of two or more of ITO conductive layer, FZO conductive layer, IZO conductive layer, GZO conductive layer, AZO conductive layer, PEDOT conductive layer, nano-Ag wire conductive layer, graphene conductive layer and nano-Cu wire conductive layer.

[0052] In the above dimming film, preferably, each insulating layer is a transparent insulating layer;

[0053] More preferably, each insulating layer is a transparent plastic layer;

[0054] Further preferably, each insulating layer is a PET layer.

[0055] The above-mentioned dimming film is usually a suspended particle dimming film, a polymer dispersed liquid crystal dimming film or an electrochromic dimming film.

[0056] In a third aspect, the present invention further provides a dimming glass, which includes a first light-transmitting glass, a second light-transmitting glass and the above-mentioned dimming film, wherein the dimming film is arranged between the first light-transmitting glass and the second light-transmitting glass.

[0057] In the above-mentioned dimming glass, the first light-transmitting glass and the second light-transmitting glass can be transparent glass used for conventional dimming glass well known to those skilled in the art. Ordinary glass, such as inorganic glass or organic glass, can be used; functional glass, such as UV blocking glass, IR blocking glass, Low-E glass, tempered glass or antibacterial glass can also be used.

[0058] In the above-mentioned dimming glass, preferably, the dimming glass further includes a first interlayer, and the first interlayer is arranged between the first light-transmitting glass and the dimming film.

[0059] In the above-mentioned dimming glass, preferably, the dimming glass further includes a second interlayer, and the second interlayer is arranged between the second light-transmitting glass and the dimming film.

[0060] In the above-mentioned dimming glass, the first interlayer and the second interlayer can be conventional interlayers for dimming glass well known to those skilled in the art. Conventional adhesive films such as EVA films, TPU films or PVB films can be used; functional adhesive films such as UV-blocking EVA films, UV-blocking TPU films or UV-blocking PVB films can also be used.

[0061] The above-mentioned dimming glass can be prepared by using the conventional laminating method of dimming glass in the art, such as laminating in a laminating machine, or laminating in an autoclave or a laminating box / furnace.

[0062] Compared with the prior art, the technical solution provided by the present invention has the following advantages:

[0063] 1. The electrode fixing structure provided by the present invention can effectively stabilize the electrode and the conductive layer, and the electrode is not easily peeled off from the conductive layer.

[0064] 2. The dimming film provided by the present invention adopts the electrode fixing structure provided by the present invention, which is not easy to cause electrode peeling, and helps to improve the electrode yield rate in the preparation process of the dimming film.

[0065] 3. The dimming glass provided by the present invention adopts the dimming film provided by the present invention, and electrode peeling is not easy to occur, thereby reducing the probability of loss of dimming performance of the dimming glass due to electrode peeling. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 This is a schematic diagram of the dimming film provided in Example 1 of the present invention.

[0067] Figure 2 The cross section of the dimming film provided in Example 1 of the present invention (the position of the cross section line is as follows Figure 1 Schematic diagram shown). DETAILED DESCRIPTION

[0068] In order to make the purpose, technical solution and advantages of the embodiment of the present invention clearer, the technical solution in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is a part of the embodiment of the present invention, not all of the embodiments. Based on the embodiment of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work belong to the protection scope of the present invention.

[0069] like Figure 1-Figure 2As shown, an embodiment of the present invention provides a dimming film 10, which includes a light control layer 13 and a first conductive substrate 11 and a second conductive substrate 12 disposed on both sides of the light control layer 13; the first conductive substrate 11 is composed of a first conductive layer 111 and a first PET layer 112 disposed outside the first conductive layer 111; the second conductive substrate 12 is composed of a second conductive layer 121 and a second PET layer 122 disposed outside the second conductive layer 121;

[0070] The first conductive substrate 11 and the second conductive substrate 12 are both divided into a light control area and an electrode area.

[0071] The light control area of ​​the first conductive substrate 11 is arranged opposite to the light control area of ​​the second conductive substrate 12, and the two sides of the light control layer 13 are respectively in contact with the inner side of the first conductive layer 111 of the light control area of ​​the first conductive substrate 11 and the inner side of the second conductive layer 121 of the light control area of ​​the second conductive substrate 12;

[0072] The electrode region of the first conductive substrate 11 is fixed with a first electrode 14 to form an electrode fixing structure; specifically, the electrode region of the first conductive substrate 11 is provided with a first through hole 1101 and a second through hole 1102; one end of the first electrode 14 passes through the first through hole 1101 and is bent from the first PET layer 112 side of the electrode region of the first conductive substrate 11 to the first conductive layer 111 side, and the other end passes through the second through hole 1102 and is bent from the first PET layer 112 side of the electrode region of the first conductive substrate 11 to the first conductive layer 111 side, and the two ends are butted to form a closed ring, and the first electrode 14 surrounds the portion between the first through hole 1101 and the second through hole 1102 on the electrode region of the first conductive substrate 11 to form a single-loop closed winding structure (or, one end of the first electrode 14 passes through the first through hole 1101 and is bent from the first conductive layer 111 side of the electrode region of the first conductive substrate 11 to the first PET layer 11 2 side, and the other end passes through the second through hole 1102 and is bent from the first conductive layer 111 side of the electrode area of ​​the first conductive substrate 11 to the first PET layer 112 side, and the two ends are butted to form a closed ring, and the first electrode 14 forms a single-loop closed winding structure around the portion between the first through hole 1101 and the second through hole 1102 on the electrode area of ​​the first conductive substrate 11); wherein, a first conductive adhesive layer 16 is provided between the first electrode 14 and the first conductive layer 111 of the electrode area of ​​the first conductive substrate 11, which is used to bond the first electrode 14 to the first conductive layer 111 of the electrode area of ​​the first conductive substrate 11; a first insulating adhesive layer 17 is provided between the first electrode 14 and the first PET layer 112 of the electrode area of ​​the first conductive substrate 11, which is used to bond the first electrode 14 to the first PET layer 112 of the electrode area of ​​the first conductive substrate 11; the first electrode 14 is formed by bending a conductive metal strip or a conductive metal mesh;

[0073] The electrode region of the second conductive substrate 12 is fixed with a second electrode 15 to form an electrode fixing structure; specifically, the electrode region of the second conductive substrate 12 is provided with a third through hole 1201 and a fourth through hole 1202; one end of the second electrode 15 passes through the third through hole 1201 and is bent from the second PET layer 122 side of the electrode region of the second conductive substrate 12 to the second conductive layer 121 side, and the other end passes through the fourth through hole 1202 and is bent from the second PET layer 122 side of the electrode region of the second conductive substrate 12 to the second conductive layer 121 side, and the two ends are butted to form a closed ring, and the second electrode 15 surrounds the portion between the third through hole 1201 and the fourth through hole 1202 on the electrode region of the second conductive substrate 12 to form a single-loop closed winding structure (or, one end of the second electrode 15 passes through the third through hole 1201 and is bent from the second conductive layer 121 side of the electrode region of the second conductive substrate 12 to the second PET layer 12 2 side, and the other end passes through the fourth through hole 1202 and is bent from the second conductive layer 121 side of the electrode area of ​​the second conductive substrate 12 to the second PET layer 122 side, and the two ends are butted to form a closed ring, and the second electrode 15 surrounds the portion between the third through hole 1201 and the fourth through hole 1202 on the electrode area of ​​the second conductive substrate 12 to form a single-loop closed winding structure); wherein a second conductive adhesive layer 18 is provided between the second electrode 15 and the second conductive layer 121 of the electrode area of ​​the second conductive substrate 12, for bonding the second electrode 15 to the second conductive layer 121 of the electrode area of ​​the second conductive substrate 12; a second insulating adhesive layer 19 is provided between the second electrode 15 and the second PET layer 122 of the electrode area of ​​the second conductive substrate 12, for bonding the second electrode 15 to the second PET layer 122 of the electrode area of ​​the second conductive substrate 12; the second electrode 15 is formed by bending a conductive metal strip or a conductive metal mesh;

[0074] The dimming film 10 is provided with a first electrode external connector 20, which is made of a conductive metal strip or a conductive metal mesh. The first electrode external connector 20 is soldered to a portion of the first electrode 14 located on the first PET layer 112 side.

[0075] The dimming film 10 is provided with a second electrode external connector 21 , which is made of a conductive metal strip or a conductive metal mesh. The second electrode external connector 21 is connected to a portion of the second electrode 15 located on the second PET layer 122 side by soldering.

[0076] The first PET layer 112 and the second PET layer 122 are made of PET plastic films with a thickness of 50 microns to 200 microns.

[0077] Among them, the first conductive layer 111 and the second conductive layer 121 are transparent conductive layers, and are selected from one of ITO conductive layer, FZO conductive layer, IZO conductive layer, GZO conductive layer, AZO conductive layer, PEDOT conductive layer, nano-Ag wire conductive film layer, graphene conductive layer and nano-Cu wire conductive film layer.

[0078] The thickness of the light-controlling layer 13 is 20 micrometers to 150 micrometers.

[0079] The conductive adhesive used in the first conductive adhesive layer 16 and the second conductive adhesive layer 18 is a conductive silver paste, such as DuPont conductive silver paste. PV145, PVD1x, PVD2x; conductive silver paste ZB2563 from Nanjing Zhongbei Electronics.

[0080] Among them, the width of the conductive metal strip and the conductive metal mesh is 1.27 cm, and the conductive copper strip with adhesive on one side (thickness 0.1 mm), the conductive copper strip with adhesive on one side (thickness 0.05 mm), the conductive copper strip without adhesive (thickness 0.2 mm), the conductive aluminum strip with adhesive on one side (thickness 0.1 mm) or the conductive copper mesh (thickness 0.05 mm) are selected.

[0081] The first insulating adhesive layer 17 and the second insulating adhesive layer 19 are insulating adhesive layers; the adhesive used in the insulating adhesive layer is commercial or household adhesive such as 3M epoxy adhesive or 3M acrylic adhesive.

[0082] Another embodiment of the present invention provides a dimming film, the dimming film and Figure 1-Figure 2 The difference between the dimming films is that the first insulating adhesive layer and the second insulating adhesive layer are different:

[0083] In this embodiment, one side of the first insulating adhesive layer covers the first electrode and the first PET layer, so as to achieve the bonding and fixing of the first electrode and the first PET layer, and the first insulating adhesive layer is provided with an opening for the first electrode external connector to be soldered to the part of the first electrode located on the first PET layer side;

[0084] One side of the second insulating adhesive layer covers the second electrode and the second PET layer, so as to realize the bonding and fixing of the second electrode and the second PET layer, and the second insulating adhesive layer is provided with an opening for the second electrode external connection part to be soldered and connected with the part of the second electrode located on the second PET layer side;

[0085] The first insulating adhesive layer and the second insulating adhesive layer are insulating tape layers; the insulating tape used in the insulating tape layers is commercial or household adhesive tape such as pressure-sensitive tape or silicone tape.

[0086] Another embodiment of the present invention provides an electrode fixing structure, wherein the electrode fixing structure is Figure 1-Figure 2 The dimming film 10 includes an electrode fixing structure in which the electrode region of the first conductive substrate 11 is fixed with a first electrode 14 .

[0087] Another embodiment of the present invention provides an electrode fixing structure, wherein the electrode fixing structure is Figure 1-Figure 2 The dimming film 10 includes an electrode region of the second conductive substrate 12 having an electrode fixing structure formed by a second electrode 15 fixed thereto.

[0088] Another embodiment of the present invention provides a dimming glass, wherein the dimming glass includes a first light-transmitting glass, a second light-transmitting glass, Figure 1-Figure 2 The dimming film 10, the first interlayer and the second interlayer; the dimming film 10 is arranged between the first light-transmitting glass and the second light-transmitting glass, the first interlayer is arranged between the first light-transmitting glass and the dimming film 10, and the second interlayer is arranged between the second light-transmitting glass and the dimming film 10.

[0089] Among them, the first light-transmitting glass and the second light-transmitting glass can be transparent glass used for conventional dimming glass well known to technical personnel in the field; ordinary glass, such as inorganic glass or organic glass, can be used; functional glass, such as UV blocking glass, IR blocking glass, Low-E glass, tempered glass or antibacterial glass, etc. can also be used.

[0090] Among them, the first interlayer and the second interlayer can be conventional interlayers for dimming glass well known to those skilled in the art; conventional adhesive films such as EVA films, TPU films or PVB films can be used; functional adhesive films such as UV-blocking EVA films, UV-blocking TPU films or UV-blocking PVB films can also be used.

[0091] Example 1

[0092] This embodiment provides a dimming film 10, the structure of which is as follows Figure 1-Figure 2 As shown, it is prepared by the following method:

[0093] (1) According to Figure 1-Figure 2 The structure of the light-controlling layer 13, the first conductive substrate 11 and the second conductive substrate 12 in the dimming film 10 is used to prepare a dimming film semi-finished product having a light-controlling area of ​​30 cm×30 cm and without electrode fixing;

[0094] The first conductive layer 111 and the second conductive layer 121 are made of ITO conductive layers;

[0095] (2) Fixing the first electrode 14: Two cuts with a length of 1.5 cm and a width of 0.5 cm are respectively cut on the electrode region of the first conductive substrate 11 to form the first through hole 1101 and the second through hole 1102;

[0096] 3M epoxy glue is applied between the first through hole 1101 and the second through hole 1102 on the first PET layer 112 of the first conductive substrate 11; a 24 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive is attached to the surface of the 3M epoxy glue and left for 6-8 hours until the 3M epoxy glue is completely cured; the positions of the first through hole 1101 and the second through hole 1102 are confirmed, and a screen printing device is placed thereon to confirm that the printing length and width are 12 cm×1.27 cm, and the conductive silver paste is applied. PV145 is poured into the screen printing device, and after printing, a 12cm×1.27cm conductive silver paste strip is left between the first through hole 1101 and the second through hole 1102 on the first conductive layer 111 of the first conductive substrate 11; the two ends of the conductive copper strip attached to the surface of the 3M epoxy adhesive are respectively passed through the first through hole 1101 and the second through hole 1102 and bent to the side of the first conductive layer 111, and the conductive copper strip is gently pressed on the silver paste strip. At this time, the conductive silver paste is liquid, and the two ends of the conductive copper strip are connected; use a hair dryer to turn on the hot air mode to quickly dry the conductive silver paste, and blowing for 30 minutes can ensure that the conductive silver paste is completely cured; (or, confirm the position of the first through hole 1101 and the second through hole 1102, place the screen printing device on it, confirm that the printing length and width are 12cm×1.27cm, and the conductive silver paste PV145 is poured into the screen printing equipment, and after printing, a 12 cm×1.27 cm conductive silver paste strip is left between the first through hole 1101 and the second through hole 1102 on the first conductive layer 111 of the first conductive substrate 11; a 24 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive is attached to the surface of the conductive silver paste; a hair dryer is used to set to hot air mode to quickly dry the conductive silver paste, and blowing for 30 minutes can ensure that the conductive silver paste is completely cured; 3M epoxy glue is applied between the first through hole 1101 and the second through hole 1102 on the first PET layer 112 of the first conductive substrate 11; the two ends of the conductive copper strip attached to the surface of the conductive silver paste are respectively passed through the first through hole 1101 and the second through hole 1102, and bent to the first PET layer 112 side of the first conductive substrate 11, and the conductive copper strip is gently pressed on the 3M epoxy tape, and the two ends of the conductive copper strip are connected; it is left for 6-8 hours until the 3M epoxy glue is completely cured;)

[0097] Solder another 5 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive to the portion of the first electrode 14 located on the first PET layer 112 side;

[0098] (3) Fixing the second electrode 15: Two cuts with a length of 1.5 cm and a width of 0.5 cm are respectively cut on the electrode region of the second conductive substrate 12 as the third through hole 1201 and the fourth through hole 1202;

[0099] 3M epoxy glue is applied between the third through hole 1201 and the fourth through hole 1202 on the second PET layer 122 of the second conductive substrate 12; a 24 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive is attached to the surface of the 3M epoxy glue and left for 6-8 hours until the 3M epoxy glue is completely cured; the positions of the third through hole 1201 and the fourth through hole 1202 are confirmed, and the screen printing equipment is placed thereon to confirm that the printing length and width are 12 cm×1.27 cm, and the conductive silver paste is applied. PV145 is poured into the screen printing device, and after printing, a 12cm×1.27cm conductive silver paste strip is left between the third through hole 1201 and the fourth through hole 1202 on the second conductive layer 121 of the second conductive substrate 12; the two ends of the conductive copper strip attached to the surface of the 3M epoxy adhesive are respectively passed through the third through hole 1201 and the fourth through hole 1202 and bent to the side of the second conductive layer 121, and the conductive copper strip is gently pressed on the silver paste strip. At this time, the conductive silver paste is liquid, and the two ends of the conductive copper strip are connected; use a hair dryer to turn on the hot air mode to quickly dry the conductive silver paste, and blowing for 30 minutes can ensure that the conductive silver paste is completely cured; (or, confirm the position of the third through hole 1201 and the fourth through hole 1202, place the screen printing device on it, confirm that the printing length and width are 12cm×1.27cm, and the conductive silver paste PV145 is poured into the screen printing equipment, and after printing, a 12 cm×1.27 cm conductive silver paste strip is left between the third through hole 1201 and the fourth through hole 1202 on the second conductive layer 121 of the second conductive substrate 12; a 24 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive is attached to the surface of the conductive silver paste; a hair dryer is used to set to hot air mode to quickly dry the conductive silver paste, and blowing for 30 minutes can ensure that the conductive silver paste is completely cured; 3M epoxy glue is applied between the third through hole 1201 and the fourth through hole 1202 on the second PET layer 122 of the second conductive substrate 12; the two ends of the conductive copper strip attached to the surface of the conductive silver paste are respectively passed through the third through hole 1201 and the second through hole 1202, and bent to the second PET layer 122 side of the second conductive substrate 12, and the conductive copper strip is gently pressed on the 3M epoxy tape, and the two ends of the conductive copper strip are connected; it is left for 6-8 hours until the 3M epoxy glue is completely cured;)

[0100] Solder another 5 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive to the portion of the second electrode 15 located on the second PET layer 122 side;

[0101] The preparation of the dimming film is completed.

[0102] Example 2

[0103] This embodiment provides a dimming film

[0104] The dimming film provided in this embodiment is different from the dimming film provided in Example 1 only in the type of conductive silver paste used. The conductive silver paste used in this embodiment is PVD1x.

[0105] Example 3

[0106] This embodiment provides a dimming film

[0107] The dimming film provided in this embodiment is different from the dimming film provided in Example 1 only in the type of conductive silver paste used. The conductive silver paste used in this embodiment is PVD2x.

[0108] Example 4

[0109] This embodiment provides a dimming film

[0110] The only difference between the dimming film provided in this embodiment and the dimming film provided in Example 1 is the type of conductive silver paste used. This embodiment uses conductive silver paste ZB2563.

[0111] Example 5

[0112] This embodiment provides a dimming film

[0113] The dimming film provided in this embodiment is different from the dimming film provided in Embodiment 1 in that the conductive copper strip containing adhesive on one side (thickness 0.05 mm) is used to replace the conductive copper strip containing adhesive on one side (thickness 0.1 mm).

[0114] Example 6

[0115] This embodiment provides a dimming film

[0116] The only difference between the dimming film provided in this embodiment and the dimming film provided in embodiment 1 is that the conductive copper strip (thickness 0.2 mm) without adhesive is used to replace the conductive copper strip (thickness 0.1 mm) with adhesive on one side.

[0117] Example 7

[0118] This embodiment provides a dimming film

[0119] The dimming film provided in this embodiment is different from the dimming film provided in Embodiment 1 in that the conductive aluminum strip (thickness 0.1 mm) containing adhesive on one side is used to replace the conductive copper strip (thickness 0.1 mm) containing adhesive on one side.

[0120] Example 8

[0121] This embodiment provides a dimming film

[0122] The dimming film provided in this embodiment is different from the dimming film provided in Embodiment 1 in that a conductive copper mesh (thickness 0.05 mm) containing adhesive on one side is used to replace a conductive copper strip (thickness 0.1 mm) containing adhesive on one side.

[0123] Example 9

[0124] This embodiment provides a dimming film

[0125] The dimming film provided in this embodiment is different from the dimming film provided in Example 1 only in the type of insulating adhesive used. In this embodiment, 3M acrylic adhesive is used instead of 3M epoxy adhesive.

[0126] Example 10

[0127] This embodiment provides a dimming film

[0128] The structure of the dimming film provided in this embodiment is different from that of the dimming film provided in Embodiment 1 only in that the first insulating adhesive layer and the second insulating adhesive layer are different:

[0129] In this embodiment, one side of the first insulating adhesive layer covers the first electrode and the first PET layer, so as to achieve the bonding and fixing of the first electrode and the first PET layer, and the first insulating adhesive layer is provided with an opening for the first electrode external connector to be soldered to the part of the first electrode located on the first PET layer side;

[0130] One side of the second insulating adhesive layer covers the second electrode and the second PET layer, so as to realize the bonding and fixing of the second electrode and the second PET layer, and the second insulating adhesive layer is provided with an opening for the second electrode external connection part to be soldered and connected with the part of the second electrode located on the second PET layer side;

[0131] Wherein, the first insulating adhesive layer and the second insulating adhesive layer are made of pressure-sensitive adhesive tape.

[0132] Specifically prepared by the following method:

[0133] (1) preparing a dimming film semi-finished product having a 30 cm×30 cm light control area and without electrode fixing in the same manner as step 1 of Example 1;

[0134] (2) Fixing the first electrode:

[0135] Two cuts with a length of 1.5 cm and a width of 0.5 cm are respectively cut on the electrode region of the first conductive substrate as a first through hole and a second through hole;

[0136] A 24 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive is attached to the first PET layer of the first conductive substrate; a pressure-sensitive tape is used to cover the conductive copper strip, so that the pressure-sensitive tape is in close contact with the conductive copper strip and the first PET layer, so that the conductive copper strip and the first PET layer are attached and fixed; an opening for soldering is left in the middle of the pressure-sensitive tape; the positions of the first through hole and the second through hole are confirmed, and the screen printing equipment is placed on it, and the printing length and width are confirmed to be 12 cm × 1.27 cm, and the conductive silver paste is applied. PV145 is poured into the screen printing device. After printing, a 12cm×1.27cm conductive silver paste strip is left between the first through hole and the second through hole on the first conductive layer of the first conductive substrate; the two ends of the conductive copper strip attached to the surface of the first PET layer are respectively passed through the first through hole and the second through hole and bent to the side of the first conductive layer, and the conductive copper strip is gently pressed on the silver paste strip. At this time, the conductive silver paste is liquid and the two ends of the conductive copper strip are connected; use a hair dryer to turn on the hot air mode to quickly dry the conductive silver paste. Blowing for 30 minutes can ensure that the conductive silver paste is completely cured; (or, confirm the position of the first through hole and the second through hole, place the screen printing device on it, confirm that the printing length and width are 12cm×1.27cm, and place the conductive silver paste PV145 is poured into the screen printing equipment, and after printing, a 12 cm×1.27 cm conductive silver paste strip is left between the first through hole and the second through hole on the first conductive layer of the first conductive substrate; a 24 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive is attached to the surface of the conductive silver paste, and the conductive copper strip is gently pressed on the silver paste strip, at this time the conductive silver paste is liquid; a hair dryer is used to turn on the hot air mode to quickly dry the conductive silver paste, and blowing for 30 minutes can ensure that the conductive silver paste is completely cured; the two ends of the conductive copper strip attached to the surface of the conductive silver paste are respectively passed through the first through hole and the second through hole and bent to the first PET layer side of the first conductive substrate, and the two ends of the conductive copper strip are connected; a pressure-sensitive tape is used to cover the conductive copper strip, so that the pressure-sensitive tape is in close contact with the conductive copper strip and the first PET layer, so that the conductive copper strip and the first PET layer are attached and fixed; wherein, a soldering position opening is left in the middle of the pressure-sensitive tape;)

[0137] Solder another 5 cm long single-sided conductive copper strip (thickness 0.1 mm) with adhesive on the first electrode at the soldering position opening left in the middle of the pressure-sensitive tape;

[0138] (3) Fixing the second electrode: cutting two cuts with a length of 1.5 cm and a width of 0.5 cm on the electrode region of the second conductive substrate as the third through hole and the fourth through hole;

[0139] A 24 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive is attached to the second PET layer of the second conductive substrate; a pressure-sensitive tape is used to cover the conductive copper strip, so that the pressure-sensitive tape is in close contact with the conductive copper strip and the second PET layer, so that the conductive copper strip and the second PET layer are attached and fixed; an opening for soldering is left in the middle of the pressure-sensitive tape; the positions of the third through hole and the fourth through hole are confirmed, and the screen printing equipment is placed on it, and the printing length and width are confirmed to be 12 cm × 1.27 cm, and the conductive silver paste is applied. PV145 is poured into the screen printing device. After printing, a 12cm×1.27cm conductive silver paste strip is left between the third through hole and the fourth through hole on the second conductive layer of the second conductive substrate. The two ends of the conductive copper strip attached to the surface of the second PET layer are respectively passed through the third through hole and the fourth through hole and bent to the side of the second conductive layer, and the conductive copper strip is gently pressed on the silver paste strip. At this time, the conductive silver paste is liquid and the two ends of the conductive copper strip are connected. Use a hair dryer to turn on the hot air mode to quickly dry the conductive silver paste. Blowing for 30 minutes can ensure that the conductive silver paste is completely cured. (Or, confirm the position of the third through hole and the fourth through hole, place the screen printing device on it, confirm that the printing length and width are 12cm×1.27cm, and place the conductive silver paste PV145 is poured into the screen printing equipment, and after printing, a 12 cm×1.27 cm conductive silver paste strip is left between the third through hole and the fourth through hole on the second conductive layer of the second conductive substrate; a 24 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive is attached to the surface of the conductive silver paste, and the conductive copper strip is gently pressed on the silver paste strip, at this time the conductive silver paste is liquid; a hair dryer is used to turn on the hot air mode to quickly dry the conductive silver paste, and blowing for 30 minutes can ensure that the conductive silver paste is completely cured; the two ends of the conductive copper strip attached to the surface of the conductive silver paste are respectively passed through the third through hole and the fourth through hole and bent to the second PET layer side of the second conductive substrate, and the two ends of the conductive copper strip are connected; a pressure-sensitive tape is used to cover the conductive copper strip, so that the pressure-sensitive tape is tightly attached to the conductive copper strip and the second PET layer, so that the conductive copper strip and the second PET layer are attached and fixed; wherein, a soldering position opening is left in the middle of the pressure-sensitive tape;)

[0140] Solder another 5 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive to the soldering position opening of the second electrode in the middle of the pressure-sensitive tape;

[0141] The preparation of the dimming film is completed.

[0142] Embodiment 11

[0143] This embodiment provides a dimming film

[0144] The dimming film provided in this embodiment is different from the dimming film provided in Embodiment 10 only in that the insulating adhesive layer used is different. In this embodiment, silicone adhesive tape is used instead of pressure-sensitive adhesive tape.

[0145] Example 12

[0146] This embodiment provides a dimming film

[0147] The structure of the dimming film provided in this embodiment is different from the dimming film provided in Embodiment 1 only in that the first conductive substrate is not provided with the first through hole and the second through hole; one end of the first electrode passes through one side edge of the electrode area of ​​the first conductive substrate and is bent from the first PET layer side of the electrode area of ​​the first conductive substrate to the first conductive layer side, and the other end passes through the other side edge of the electrode area of ​​the first conductive substrate and is bent from the first PET layer side of the electrode area of ​​the first conductive substrate to the first conductive layer side; the second conductive substrate is not provided with the third through hole and the fourth through hole; one end of the second electrode passes through one side edge of the electrode area of ​​the second conductive substrate and is bent from the second PET layer side of the electrode area of ​​the second conductive substrate to the second conductive layer side, and the other end passes through the other side edge of the electrode area of ​​the second conductive substrate and is bent from the second PET layer side of the electrode area of ​​the second conductive substrate to the second conductive layer side.

[0148] Specifically prepared by the following method:

[0149] (1) preparing a dimming film semi-finished product having a 30 cm×30 cm light control area and without electrode fixing in the same manner as step 1 of Example 1;

[0150] (2) Fixing the first electrode:

[0151] 3M epoxy glue was applied on the first PET layer of the electrode area of ​​the first conductive substrate; a 28 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive was attached to the surface of the 3M epoxy glue and left for 6-8 hours until the 3M epoxy glue was completely cured; a screen printing device was placed on it and the printing length and width were confirmed to be 14 cm × 1.27 cm, and the conductive silver paste was applied. PV145 is poured into the screen printing device. After printing, a 14cm×1.27cm conductive silver paste strip is left on the first conductive layer of the electrode area of ​​the first conductive substrate. The two ends of the conductive copper strip attached to the surface of the 3M epoxy adhesive are bent to the first conductive layer through the two side edges of the electrode area of ​​the first conductive substrate, and the conductive copper strip is gently pressed on the silver paste strip. At this time, the conductive silver paste is liquid and the two ends of the conductive copper strip are connected. Use a hair dryer to turn on the hot air mode to quickly dry the conductive silver paste. Blowing for 30 minutes can ensure that the conductive silver paste is completely cured. (Alternatively, place the screen printing device on the first conductive substrate, confirm that the printing length and width are 14cm×1.27cm, and place the conductive silver paste. PV145 is poured into the screen printing equipment, and after printing, a 14cm×1.27cm conductive silver paste strip is left on the first conductive layer of the electrode area of ​​the first conductive substrate; a 28cm long single-sided conductive copper strip (thickness 0.1mm) containing adhesive is attached to the surface of the conductive silver paste; a hair dryer is used to set to hot air mode to quickly dry the conductive silver paste, and blowing for 30 minutes can ensure that the conductive silver paste is completely cured; 3M epoxy glue is applied on the first PET layer of the electrode area of ​​the first conductive substrate; the two ends of the conductive copper strip attached to the surface of the conductive silver paste are respectively bent through the two side edges of the electrode area of ​​the first conductive substrate to the first PET layer side of the first conductive substrate, and the conductive copper strip is gently pressed on the 3M epoxy tape, and the two ends of the conductive copper strip are connected; it is left for 6-8 hours until the 3M epoxy glue is completely cured;)

[0152] Solder another 5 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive to the portion of the first electrode located on the first PET layer side;

[0153] (3) Fixing the second electrode:

[0154] 3M epoxy glue was applied on the second PET layer of the electrode area of ​​the second conductive substrate; a 28 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive was attached to the surface of the 3M epoxy glue and left for 6-8 hours until the 3M epoxy glue was completely cured; a screen printing device was placed on it and the printing length and width were confirmed to be 14 cm × 1.27 cm, and the conductive silver paste was applied. PV145 is poured into the screen printing device. After printing, a 14cm×1.27cm conductive silver paste strip is left on the second conductive layer of the electrode area of ​​the second conductive substrate. The two ends of the conductive copper strip attached to the surface of the 3M epoxy adhesive are bent to the second conductive layer through the two side edges of the electrode area of ​​the second conductive substrate, and the conductive copper strip is gently pressed on the silver paste strip. At this time, the conductive silver paste is liquid and the two ends of the conductive copper strip are connected. Use a hair dryer to turn on the hot air mode to quickly dry the conductive silver paste. Blowing for 30 minutes can ensure that the conductive silver paste is completely cured. (Alternatively, place the screen printing device on the second conductive substrate, confirm that the printing length and width are 14cm×1.27cm, and place the conductive silver paste. PV145 is poured into the screen printing equipment, and after printing, a 14cm×1.27cm conductive silver paste strip is left on the second conductive layer of the electrode area of ​​the second conductive substrate; a 28cm long single-sided conductive copper strip (thickness 0.1mm) containing adhesive is attached to the surface of the conductive silver paste; a hair dryer is used to set to hot air mode to quickly dry the conductive silver paste, and blowing for 30 minutes can ensure that the conductive silver paste is completely cured; 3M epoxy glue is applied to the second PET layer of the electrode area of ​​the second conductive substrate; the two ends of the conductive copper strip attached to the surface of the conductive silver paste are respectively bent through the two side edges of the electrode area of ​​the second conductive substrate to the second PET layer side of the second conductive substrate, and the conductive copper strip is gently pressed on the 3M epoxy tape, and the two ends of the conductive copper strip are connected; it is left for 6-8 hours until the 3M epoxy glue is completely cured;)

[0155] Solder another 5 cm long single-side conductive copper strip (thickness 0.1 mm) containing adhesive to the portion of the second electrode located on the second PET layer side;

[0156] The preparation of the dimming film is completed.

[0157] Comparative Example 1

[0158] This comparative example provides a dimming film

[0159] The structure of the dimming film provided in this comparative example differs from the dimming film provided in Example 1 only in that: no insulating adhesive layer is provided; the first conductive substrate is not provided with the first through hole and the second through hole; the first electrode is bonded and fixed to the first conductive layer in the electrode area of ​​the first conductive substrate by a conductive adhesive layer; the second conductive substrate is not provided with the third through hole and the fourth through hole; the second electrode is bonded and fixed to the second conductive layer in the electrode area of ​​the second conductive substrate by a conductive adhesive layer; the first electrode external connector is connected to the first electrode by soldering; and the second electrode external connector is connected to the second electrode by soldering.

[0160] Specifically prepared by the following method:

[0161] (1) preparing a dimming film semi-finished product having a 30 cm×30 cm light control area and without electrode fixing in the same manner as step 1 of Example 1;

[0162] (2) Fixing the first electrode:

[0163] Place the screen printing equipment on the first conductive substrate, confirm that the printing length and width are 12cm×1.27cm, and apply the conductive silver paste PV145 was poured into the screen printing equipment. After printing, a 12 cm × 1.27 cm conductive silver paste strip was left on the first conductive layer of the electrode area of ​​the first conductive substrate. A 12 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive was gently pressed on the silver paste strip. At this time, the conductive silver paste was liquid. A hair dryer was turned to hot air mode to quickly dry the conductive silver paste. Blowing for 30 minutes can ensure that the conductive silver paste is completely cured.

[0164] Solder another 5 cm long single-side conductive copper strip (thickness 0.1 mm) with adhesive on the first electrode;

[0165] (3) Fixing the second electrode:

[0166] Place the screen printing equipment on the second conductive substrate, confirm that the printing length and width are 12cm×1.27cm, and apply the conductive silver paste PV145 was poured into the screen printing equipment. After printing, a 12 cm × 1.27 cm conductive silver paste strip was left on the second conductive layer of the electrode area of ​​the second conductive substrate. A 12 cm long single-sided conductive copper strip (thickness 0.1 mm) containing adhesive was gently pressed on the silver paste strip. At this time, the conductive silver paste was liquid. A hair dryer was used to set the hot air mode to quickly dry the conductive silver paste. Blowing for 30 minutes can ensure that the conductive silver paste is completely cured.

[0167] Solder another 5 cm long single-side conductive copper strip (thickness 0.1 mm) with adhesive on the second electrode;

[0168] The preparation of the dimming film is completed.

[0169] Comparative Example 2

[0170] This comparative example provides a dimming film

[0171] The dimming film provided in this comparative example is different from the dimming film provided in comparative example 1 in that a conductive copper mesh (thickness 0.05 mm) containing adhesive on one side is used to replace a conductive copper strip (thickness 0.1 mm) containing adhesive on one side.

[0172] In order to more accurately test the electrode structure provided by the present invention, a 90° peel strength tester (Nakano Seiko HTS-BLY2510) was used to test the peel strength of the conductive adhesive, insulating adhesive and insulating tape in the corresponding application scenarios, and the peel strength of the electrodes of Examples 1 to 12 and Comparative Examples 1 to 2 was also tested.

[0173] Test Example 1

[0174] The peel strength of the conductive adhesive, insulating adhesive and insulating tape used in Examples 1 to 12 and Comparative Examples 1 to 2 on the ITO conductive layer and PET insulating layer used in Examples 1 to 12 and Comparative Examples 1 to 2 was tested.

[0175] The test method for the peel strength of the conductive adhesive is as follows: a 12cm×1.27cm conductive adhesive strip is printed on the ITO conductive layer of the ITO / PET conductive substrate by screen printing, and a 12cm long conductive copper strip is attached thereto; a hair dryer is used to set to hot air mode to quickly dry the conductive adhesive, and blowing for 30 minutes can ensure that the conductive adhesive is completely cured. Then the peel strength is tested using a peel strength tester, specifically using a movable clamp to clamp one side of the conductive copper strip, and a fixed clamp to clamp the same side of the ITO / PET conductive substrate, and running the machine to obtain the force required for the movable clamp to peel off the sample at a preset speed. Because the width of the copper strips is 1.27cm, the unit of peel strength is N / 1.27cm.

[0176] The test method for the peel strength of insulating adhesive or tape is as follows: an insulating adhesive or tape is bonded to the PET insulating layer of the ITO / PET conductive substrate, and a 12cm long conductive copper strip is also attached thereto, and the insulating adhesive is cured or the tape is fixed; then the peel strength is tested using a peel strength tester, where a movable clamp clamps one side of the conductive copper strip, and a fixed clamp clamps the same side of the ITO / PET conductive substrate, and the machine is run to obtain the force required for the movable clamp to peel off the sample at a preset speed. Because the width of the copper strip is 1.27cm, the unit of peel strength is N / 1.27cm.

[0177] The results are shown in Table 1.

[0178] Table 1 Peel strength of conductive adhesive, insulating adhesive and tape

[0179]

[0180] Test Example 2

[0181] The electrode peeling strength test was performed on the dimming films provided in Examples 1 to 12 and Comparative Examples 1 and 2:

[0182] Use a peel strength tester, where the movable clamp clamps the conductive metal strip or conductive metal mesh connected to the sample to be tested and the external power supply, and the fixed clamp clamps the conductive substrate on the dimming film. Run the machine to obtain the force required for the movable clamp to peel off the sample at a preset speed. Because the width of the copper strip is 1.27cm, the peeling unit is N / 1.27cm.

[0183] The results are shown in Table 2.

[0184] Table 2 Peel strength of samples

[0185]

[0186]

[0187] It can be seen from Table 1 that the adhesion between the adhesive and the PET layer is much greater than the adhesion between the adhesive and the conductive layer. This is because the current transparent electrode conductive layer is generally metal or metal oxide, and the adhesion effect with the organic adhesive is significantly weaker than the adhesion between the PET material and the adhesive.

[0188] At the same time, for the electrodes made in Examples 1-12, due to the winding structure, even if the conductive metal strip or the conductive metal mesh is separated from the PET layer during the peeling test, the bonding between the electrode as a whole and the surface of the conductive layer is still firm, so the entire dimming film can still work normally. However, the electrodes in Comparative Example 1 and Comparative Example 2 are completely peeled off from the surface of the conductive layer after the peeling test, resulting in the dimming film not being able to work normally. At the same time, the peeling problem that occurs in actual applications is also difficult to repair. On the one hand, it can be seen that the winding structure in the electrode fixing structure of the present invention brings about an improvement in the electrode structure; on the other hand, it can also be seen that by extending the electrode from the PET layer side to the conductive layer side, the bonding effect between PET and the adhesive can be well utilized to further significantly improve the bonding reliability of the electrode.

[0189] Therefore, the dimming film with a strengthened electrode structure described in the present invention can effectively solve the problem of unnecessary damage to the dimming film during transportation and post-processing, can significantly improve the yield rate in the process of manufacturing laminated glass, and significantly reduce the cost of dimming glass.

Claims

1. An electrode fixing structure, characterized in that: The electrode fixing structure comprises an electrode, a conductive substrate and a first fixing adhesive layer; wherein the conductive substrate comprises a conductive layer and the conductive layer serves as a surface layer of the conductive substrate; The electrode forms a winding structure around the conductive substrate or part of the conductive substrate; The first fixing adhesive layer is disposed between the electrode and the conductive layer, and is used to bond the electrode and the conductive layer; wherein the first fixing adhesive layer is a conductive adhesive layer; The winding structure is a closed winding structure or a non-closed winding structure; The electrode wraps around the conductive substrate or part of the conductive substrate to form a winding structure, which is one of the following methods: Mode 1: The electrode is wound around the conductive substrate to form a winding structure; the winding structure is formed by bending the two ends of the electrode from one side of the conductive substrate to the other side through the two side edges of the conductive substrate, or by repeatedly bending one end of the electrode from one side of the conductive substrate to the other side through the one side edge of the conductive substrate; Mode 2: A first electrode fixing hole group is provided on the conductive substrate, wherein the first electrode fixing hole group is composed of through holes provided on the conductive substrate, and the electrode forms a winding structure around a portion between the first electrode fixing hole group and one side edge of the conductive substrate on the conductive substrate; the winding structure is formed by passing one end of the electrode through the through hole in the first electrode fixing hole group and bending from one side of the conductive substrate to the other side, and passing the other end through the edge of one side of the conductive substrate and bending from one side of the conductive substrate to the other side, or by repeatedly passing one end of the electrode through the through hole in the first electrode fixing hole group and bending from one side of the conductive substrate to the other side, and then passing through the edge of one side of the conductive substrate and bending back to the original side of the conductive substrate; Method three: A second electrode fixing hole group and a third electrode fixing hole group are provided on the conductive substrate, wherein the second electrode fixing hole group is composed of through holes provided on the conductive substrate, and the third electrode fixing hole group is composed of through holes provided on the conductive substrate, and the electrode forms a winding structure around a portion between the second electrode fixing hole group and the third electrode fixing hole group on the conductive substrate; the winding structure is formed by passing one end of the electrode through the through hole in the second electrode fixing hole group and bending from one side of the conductive substrate to the other side, and passing the other end through the through hole in the third electrode fixing hole group and bending from one side of the conductive substrate to the other side, or by repeatedly passing one end of the electrode through the through hole in the second electrode fixing hole group and bending from one side of the conductive substrate to the other side, and then passing through the through hole in the third electrode fixing hole group and bending back to the original side of the conductive substrate.

2. The electrode fixing structure according to claim 1, characterized in that: The winding structure is a closed winding structure.

3. The electrode fixing structure according to claim 2, characterized in that: The winding structure is a single-loop closed winding structure.

4. The electrode fixing structure according to claim 1, characterized in that: The conductive adhesive layer is an adhesive layer containing conductive metal particles.

5. The electrode fixing structure according to claim 4, characterized in that: The conductive metal particles in the adhesive layer containing conductive metal particles include one or a combination of two or more of silver particles, gold particles and copper particles.

6. The electrode fixing structure according to claim 1, characterized in that: The electrode fixing structure further includes a second fixing glue layer; The second fixed adhesive layer is arranged between the electrode and another surface layer on the conductive substrate opposite to the conductive layer, and is used to bond the electrode to the other surface layer on the conductive substrate opposite to the conductive layer; or; one side of the second fixed adhesive layer covers the electrode and the other surface layer on the conductive substrate opposite to the conductive layer, and is used to achieve the bonding of the fixed electrode to the other surface layer on the conductive substrate opposite to the conductive layer.

7. The electrode fixing structure according to claim 6, characterized in that: The conductive substrate further includes an insulating layer, and the insulating layer serves as another surface layer of the conductive substrate corresponding to the conductive layer.

8. The electrode fixing structure according to claim 6, characterized in that: The second fixing adhesive layer is an insulating adhesive layer.

9. The electrode fixing structure according to claim 1, characterized in that: The material of the electrode includes a conductive metal strip or a conductive metal mesh; the electrode is formed by bending the conductive metal strip or the conductive metal mesh.

10. The electrode fixing structure according to claim 9, characterized in that: The thickness of the conductive metal strip is less than or equal to 0.2 mm.

11. The electrode fixing structure according to claim 9, characterized in that: The thickness of the conductive metal strip is less than or equal to 0.1 mm.

12. The electrode fixing structure according to claim 9, characterized in that: The thickness of the conductive metal strip is 0.05 mm.

13. The electrode fixing structure according to claim 9, characterized in that: The thickness of the conductive metal mesh is less than or equal to 0.2 mm.

14. The electrode fixing structure according to claim 9, characterized in that: The thickness of the conductive metal mesh is less than or equal to 0.1 mm.

15. The electrode fixing structure according to claim 9, characterized in that: The thickness of the conductive metal mesh is 0.05 mm.

16. A dimming film, characterized in that: The dimming film comprises the electrode fixing structure according to any one of claims 1-15.

17. The light-adjusting film according to claim 16, characterized in that: The dimming film is a suspended particle dimming film, a polymer dispersed liquid crystal dimming film or an electrochromic dimming film.

18. The dimming film according to claim 16, characterized in that: The dimming film includes a light control layer, a first conductive substrate and a second conductive substrate disposed on both sides of the light control layer; the first conductive substrate and the second conductive substrate are both provided with a light control area and an electrode area; the first conductive substrate and the second conductive substrate are both provided with a conductive layer inside; wherein, The light control area of ​​the first conductive substrate is arranged opposite to the light control area of ​​the second conductive substrate, and two sides of the light control layer are in contact with the inner side of the light control area of ​​the first conductive substrate and the inner side of the light control area of ​​the second conductive substrate respectively; The electrode area of ​​the first conductive substrate is fixed with a first electrode, and the electrode area of ​​the first conductive substrate fixed with the first electrode adopts the electrode fixing structure described in any one of claims 1-15; and / or; the electrode area of ​​the second conductive substrate is fixed with a second electrode, and the electrode area of ​​the second conductive substrate fixed with the second electrode adopts the electrode fixing structure described in any one of claims 1-15.

19. The dimming film according to claim 16, characterized in that: Each conductive layer is selected from one or a combination of two or more of an ITO conductive layer, a FZO conductive layer, an IZO conductive layer, a GZO conductive layer, an AZO conductive layer, a PEDOT conductive layer, a nano-Ag wire conductive layer, a graphene conductive layer and a nano-Cu wire conductive layer; Each insulating layer is a transparent plastic layer; The electrode includes at least one of a copper electrode and an aluminum electrode.

20. The light-adjusting film according to claim 19, characterized in that: Each insulating layer is a PET layer.

21. A dimming glass, characterized in that: The dimming glass comprises a first light-transmitting glass, a second light-transmitting glass and the dimming film according to any one of claims 16 to 20, wherein the dimming film is arranged between the first light-transmitting glass and the second light-transmitting glass.

22. The switchable glass according to claim 21, characterized in that: The dimming glass further includes a first interlayer, and the first interlayer is arranged between the first light-transmitting glass and the dimming film.

23. The switchable glass according to claim 21, characterized in that: The dimming glass further includes a second interlayer, and the second interlayer is arranged between the second light-transmitting glass and the dimming film.

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