A cleaning and drying device

Abstract

The present invention provides a cleaning and drying device, which relates to the technical field of wafer processing. The device includes a base and a cleaning mechanism. The cleaning mechanism is arranged on the base, and a carrying structure is arranged on the base. The carrying structure is used for installing the wafer. The cleaning mechanism includes multiple liquid spraying pipelines for cleaning the wafer. The cleaning and drying device further includes a drying mechanism, and the drying mechanism includes a jetting unit and an adjusting structure. This application is a compatible cleaning and drying device. By using multiple liquid spraying pipelines, the cleaning process requirements of various cleaning liquid medicines for the wafer can be completed. Moreover, according to the differences in the shape and size of the wafer, the pressure of the drying gas can be freely adjusted, and both the jetting angle and the jetting position of the jetting unit can be adjusted to meet the drying process requirements of various wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and specifically to a cleaning and drying device. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. From the perspective of both technology and economic development, the importance of semiconductors is extremely great. The core units of most electronic products, such as computers, mobile phones or digital recorders, are extremely closely related to semiconductors.

[0003] With the continuous development of the semiconductor industry, the types of semiconductor materials are rich, and various wafers need to be processed. Especially in the cleaning and drying process of the back-end process, due to the different shapes, positions, postures, etc. of the wafers, and the current process treatment structure for silicon wafers has been fixed, it is impossible to well accommodate the cleaning treatment of various wafers. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the existing defects and provide a cleaning and drying device that can adapt to the cleaning process treatment of various types of wafers and can well accommodate the cleaning treatment of various wafers.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A cleaning and drying device for performing cleaning and drying process treatment on various wafers, including a base and a cleaning mechanism. The cleaning mechanism is arranged on the base, and the cleaning mechanism includes a plurality of liquid spraying pipelines for cleaning the wafers.

[0007] Furthermore, a carrying structure is arranged on the base, and the carrying structure is used for installing the wafers.

[0008] Furthermore, the carrying structure includes a carrier and a lifting member;

[0009] The carrier is connected to the base through the lifting member.

[0010] Furthermore, the lifting member includes a first connecting member and a second connecting member;

[0011] The first connecting member and the second connecting member are respectively connected to the base and the carrier, and the first connecting member is connected to the second connecting member;

[0012] Relative movement can occur between the first connecting member and the second connecting member to realize the lifting of the carrier.

[0013] Further, a first long slot is provided inside the first connecting member and / or the second connecting member, and a first bolt is arranged in the first long slot for connecting the first connecting member and the second connecting member.

[0014] Further, a drying mechanism is also included;

[0015] The drying mechanism includes a jetting unit and an adjusting structure;

[0016] The jetting unit is connected to the base through the adjusting structure.

[0017] Further, a slot is provided on the base, and the jetting unit is arranged in the slot.

[0018] Further, the adjusting structure includes an angle adjusting member;

[0019] The angle adjusting member is connected to the jetting unit through a second bolt.

[0020] Further, the adjusting structure further includes a position adjusting member, and the angle adjusting member is connected to the base through the position adjusting member.

[0021] Further, the position adjusting member includes a lateral adjusting member and a longitudinal adjusting member;

[0022] A second long slot is provided inside the longitudinal adjusting member, and a third bolt is arranged in the second long slot for connecting the longitudinal adjusting member and the base;

[0023] A third long slot is provided inside the lateral adjusting member, and a fourth bolt is arranged in the third long slot for connecting the longitudinal adjusting member and the lateral adjusting member.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0025] The present invention is a compatible cleaning and drying device, and multiple cleaning liquid pipelines can be used to meet the cleaning process requirements of wafers with various cleaning liquid medicines. Description of the Drawings

[0026] Figure 1 is the overall three-dimensional view of the present invention;

[0027] Figure 2 is the structural schematic diagram of the cleaning and drying device of the present invention;

[0028] Figure 3 is the partial cross-sectional view of the cleaning and drying device of the present invention;

[0029] Figure 4This is a partial structural diagram of the cleaning and drying device of the present invention.

[0030] In the figure:

[0031] 1 - Substrate; 2 - Base; 3 - Lifting member; 4 - Carrier; 5 - Connecting column; 6 - Support cylinder; 7 - Mounting plate; 9 - Liquid spraying pipeline; 10 - Liquid spraying nozzle; 11 - Liquid inlet pipe; 12 - Air jet nozzle; 13 - Air jet seat; 14 - Angle adjusting member; 15 - Longitudinal adjusting member; 16 - Adapter pipe; 17 - Transverse adjusting member; 18 - Third bolt; 19 - Fourth bolt; 20 - Second bolt; 21 - Wafer. Specific embodiments

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] In the description of the present invention, it should be understood that the terms "center", "vertical", "horizontal", "inner", "outer", "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0034] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0035] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can achieve it. When the combination of the technical solutions is contradictory or cannot be achieved, it should be considered that such a combination of technical solutions does not exist and is also within the protection scope required by the present application.

[0036] In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0037] Embodiment 1

[0038] Please refer to Figures 1 - 4 , Figure 1 which is the overall three-dimensional view of the present invention, Figure 2 and this is the structural schematic diagram of the cleaning and drying device of the present invention, Figure 3 and this is the partial cross-sectional view of the cleaning and drying device of the present invention, Figure 4 and this is the partial structural diagram of the cleaning and drying device of the present invention. The present invention provides a technical solution:

[0039] As Figures 1 - 2 shown: A cleaning and drying device is used for cleaning and drying various wafers 21. It includes a base 2 and a cleaning mechanism. The base 2 includes a substrate 1, a support cylinder 6 and a mounting plate 7. The cleaning mechanism is arranged on the substrate 1. The cleaning mechanism includes multiple liquid spraying pipelines 9 for cleaning the wafers 21. The mounting plate 7 is arranged in a circular shape and is fixed to the substrate 1 through the support cylinder 6. The mounting plate 7 is used for installing multiple liquid spraying pipelines 9. Multiple liquid spraying pipelines 9 can be arranged inside the mounting plate 7. The inlet end of the liquid spraying pipeline 9 is connected to one end of a liquid inlet pipe 11, and the other end of the liquid inlet pipe 11 is connected to a liquid supply pipeline (the liquid supply pipeline is not marked in the figure). The outlet end of the liquid spraying pipeline 9 is connected with a liquid spraying nozzle 10. The liquid spraying direction of the liquid spraying nozzle 10 corresponds to the wafer 21 on the carrier 4. By using multiple liquid spraying pipelines 9, the cleaning process requirements of various cleaning liquid medicines for the wafer 21 can be completed.

[0040] A carrying structure is also arranged on the substrate 1. The carrying structure is used for installing the wafer 21 and can lift the wafer 21 to adjust the wafer 21 to a suitable height.

[0041] The carrying structure includes a carrier 4 and a lifting member 3. The carrier 4 is used for installing the wafer 21, and the lifting member 3 is used to realize the lifting of the carrier 4.

[0042] The carrier 4 is connected to the base 2 through the lifting member 3.

[0043] The lifting member 3 includes a first connecting member and a second connecting member.

[0044] The first connecting member and the second connecting member are respectively connected to the base 2 and the carrier 4, and the first connecting member is connected to the second connecting member.

[0045] Relative movement can occur between the first connecting member and the second connecting member to realize the lifting of the carrier 4.

[0046] The interior of the first connecting member and / or the second connecting member is provided with a first elongated slot hole, and a first bolt is arranged in the first elongated slot hole. The first bolt is used to connect the first connecting member and the second connecting member, and by adjusting the first bolt, a relative displacement is generated between the first connecting member and the second connecting member to realize the lifting of the vehicle 4. The operation is relatively convenient, the structure is relatively simple, and the cost is relatively low.

[0047] As described above, three cases are included: The first case: The interiors of both the first connecting member and the second connecting member are provided with first elongated slot holes. In this case, the first bolt cooperates with a nut to realize the connection between the first connecting member and the second connecting member. By loosening or tightening the nut, the relative displacement between the first connecting member and the second connecting member can be adjusted. Moreover, in this case, the relative displacement amplitude between the first connecting member and the second connecting member can be made larger by adjusting the first bolt, and the maximum displacement amplitude is the sum of the lengths of the two first elongated slot holes.

[0048] The second case: The interior of the first connecting member is provided with a first elongated slot hole, and the interior of the second connecting member is provided with a corresponding threaded hole. The first bolt passes through the first elongated slot hole and is threadedly connected to this threaded hole to realize the connection between the first connecting member and the second connecting member. By adjusting the first bolt, the first connecting member moves along the first elongated slot hole. In this case, the relative displacement amplitude between the first connecting member and the second connecting member is the length of one first elongated slot hole.

[0049] The third case: The interior of the second connecting member is provided with a first elongated slot hole, and the interior of the first connecting member is provided with a corresponding threaded hole. The first bolt passes through the second elongated slot hole and is threadedly connected to this threaded hole to realize the connection between the first connecting member and the second connecting member. By adjusting the first bolt, the second connecting member moves along the first elongated slot hole. In this case, the relative displacement amplitude between the first connecting member and the second connecting member is the length of one first elongated slot hole.

[0050] It should be noted that: In the first case, the relative displacement amplitude between the first connecting member and the second connecting member is larger.

[0051] As Figure 3 shown: The cleaning liquid medicine enters the liquid inlet pipe 11 through the liquid supply pipeline (the liquid supply pipeline is not marked in the figure), and then enters the liquid spraying pipeline 9. The end of the liquid spraying pipeline 9 is connected to the liquid spraying nozzle 10, thereby completing the connection between the liquid inlet pipe 11, the liquid spraying pipeline 9 and the liquid spraying nozzle 10, and completing the liquid supply. Then the cleaning liquid medicine is sprayed out from the liquid spraying nozzle 10 and is used to clean the wafer 21 installed on the vehicle 4 to complete the cleaning. The number of the liquid spraying pipelines 9 and the liquid spraying nozzles 10 can be increased or decreased according to actual needs to ensure that the liquid spraying nozzles 10 completely cover the surface of the wafer 21 to achieve a comprehensive cleaning.

[0052] AsFigure 4 As shown: The cleaning and drying device further includes a drying mechanism.

[0053] The drying mechanism includes a jetting unit and an adjusting structure. The jetting unit is a prior art. The jetting unit includes a jetting seat 13. One end of the jetting seat 13 is communicated with an external air source through a rotary connecting pipe 16, and the other end of the jetting seat 13 is connected to a jetting nozzle 12. The jetting direction of the jetting nozzle 12 corresponds to the wafer 21 mounted on the vehicle 4. It should be noted that: The jetting pressure of the external air source can be freely adjusted according to the shape and size differences of various wafers 21.

[0054] The jetting unit is connected to the base 2 through the adjusting structure.

[0055] A slotted opening is formed on the base 2. A plurality of slotted openings are circumferentially arranged at the side edge of the mounting plate 7. The slotted opening is a rectangular opening. The jetting unit is arranged in the slotted opening, which can save the installation space.

[0056] The adjusting structure includes an angle adjusting member 14, and the angle adjusting member 14 is connected to the side surface of the jetting unit.

[0057] The angle adjusting member 14 is connected to the jetting unit through a second bolt 20. By adjusting the second bolt 20, the jetting angle of the jetting nozzle 12 in the jetting unit can be adjusted. The included angle between the jetting nozzle 12 and the surface of the wafer 21 can be freely adjusted according to the shape and size differences of various wafers 21.

[0058] The adjusting structure further includes a position adjusting member. The angle adjusting member 14 is connected to the base 2 through the position adjusting member.

[0059] The position adjusting member includes a transverse adjusting member 17 and a longitudinal adjusting member 15.

[0060] A second long slotted hole is arranged in the longitudinal adjusting member 15. A third bolt 18 is arranged in the second long slotted hole. The third bolt 18 is used to connect the longitudinal adjusting member 15 and the base 2. A third long slotted hole is arranged in the transverse adjusting member 17. A fourth bolt 19 is arranged in the third long slotted hole. The fourth bolt 19 is used to connect the longitudinal adjusting member 15 and the transverse adjusting member 17. By adjusting the third bolt 18, the longitudinal position of the jetting unit can be adjusted. By adjusting the fourth bolt 19, the transverse position of the jetting unit can be adjusted. Therefore, the position of the jetting unit can be freely adjusted according to the shape and size differences of various wafers 21.

[0061] Embodiment 2

[0062] Further, on the basis of Embodiment 1, please refer to Figures 1 - 2, the lifting member 3 provided in this embodiment includes a first connecting member, a second connecting member, and a connecting column 5. The first connecting member and the second connecting member are respectively connected to the base 2 and the carrier 4. The first connecting member is connected to the second connecting member. A first long slot hole is provided inside the first connecting member and / or the second connecting member. A first bolt is provided in the first long slot hole. The first bolt is used to connect the first connecting member and the second connecting member, and by adjusting the first bolt, a relative displacement is generated between the first connecting member and the second connecting member to realize the lifting of the carrier 4. The operation is relatively convenient, the structure is relatively simple, and the cost is relatively low.

[0063] A connecting column 5 is provided between the lifting member 3 and the carrier 4. The connecting column 5 is used to connect the lifting member 3 and the carrier 4, and the connecting 5 is used to further increase the height of the carrier 4.

[0064] The difference between this embodiment and Embodiment 1 is that: a connecting column 5 is added to the lifting member 3 in this embodiment, and its purpose is to be able to further increase the height of the carrier 4 and make the installation more aesthetic.

[0065] Embodiment 3

[0066] Furthermore, on the basis of Embodiment 1, the lifting member 3 provided in this embodiment is specifically a telescopic rod, and the lifting of the carrier 4 is realized by controlling the telescopic of the telescopic rod. Its purpose is also to be able to realize the lifting of the carrier 4, which has certain progress compared with the prior art.

[0067] Embodiment 4

[0068] Furthermore, on the basis of Embodiment 1, the adjustment structure in this embodiment only includes an angle adjustment member 14. The angle adjustment member 14 is connected to the jet unit through a second bolt 20. The angle adjustment member 14 is connected to the mounting plate 7. By adjusting the second bolt 20, the jet angle of the jet nozzle 12 in the jet unit can be adjusted.

[0069] This embodiment can freely adjust the included angle between the jet nozzle 12 and the surface of the wafer 21 according to the shape and size differences of various wafers 21, which also has a great improvement compared with the prior art.

[0070] Embodiment 5

[0071] Further, on the basis of Embodiment 1, the adjustment structure in this embodiment includes an angle adjustment member 14 and a position adjustment member. The position adjustment member only includes a lateral adjustment member 17. The angle adjustment member 14 is connected to the jetting unit through a second bolt 20. By adjusting the second bolt 20, the jetting angle of the jet nozzle 12 in the jetting unit can be adjusted. According to the shape and size differences of various wafers 21, the included angle between the jet nozzle 12 and the surface of the wafer 21 can be freely adjusted. The angle adjustment member 14 is connected to the mounting plate 7 through the lateral adjustment member 17. A third long slot is provided in the lateral adjustment member 17, and a fourth bolt 19 is provided in the third long slot. The fourth bolt 19 is used to connect the mounting plate 7 and the lateral adjustment member 17. Threaded holes are provided on the mounting plate 7. The fourth bolt 19 passes through the third long slot and is threadedly connected to the threaded hole. By loosening the fourth bolt 19, the angle adjustment member 14 and the jetting unit can move laterally along the third long slot. Therefore, according to the shape and size differences of various wafers 21, the position of the jetting unit can be adjusted laterally.

[0072] This embodiment can freely adjust the jetting direction of the jet nozzle 12 and the lateral position of the jetting unit, which has great progress compared with the prior art.

[0073] Embodiment 6

[0074] Further, on the basis of Embodiment 1, the adjustment structure in this embodiment includes an angle adjustment member 14 and a position adjustment member. The position adjustment member only includes a longitudinal adjustment member 15. The angle adjustment member 14 is connected to the jetting unit through a second bolt 20. By adjusting the second bolt 20, the jetting angle of the jet nozzle 12 in the jetting unit can be adjusted. The angle adjustment member 14 is connected to the mounting plate 7 through the longitudinal adjustment member 15. A second long slot is provided in the longitudinal adjustment member 15, and a third bolt 18 is provided in the second long slot. The third bolt 18 is used to connect the longitudinal adjustment member 15 and the mounting plate 7. Threaded holes are provided on the mounting plate 7. The third bolt 18 passes through the second long slot and is threadedly connected to the threaded hole. By loosening the third bolt 18, the angle adjustment member 14 and the jetting unit can move laterally along the third long slot. Therefore, according to the shape and size differences of various wafers 21, the position of the jetting unit can be adjusted longitudinally.

[0075] This embodiment can freely adjust the included angle between the jet nozzle 12 and the surface of the wafer 21 and the longitudinal position of the jetting unit, which has great progress compared with the prior art.

[0076] Embodiment 7

[0077] Further, on the basis of Embodiment 1, the adjustment structure provided in this embodiment only includes a position adjustment member, and the position adjustment member includes a longitudinal adjustment member 15 and / or a transverse adjustment member 17.

[0078] The difference between this embodiment and Embodiment 1 is that in this embodiment, the jet unit is directly connected to the mounting plate 7 through the position adjustment member. This embodiment includes three situations, as follows:

[0079] First: The position adjustment member only includes the longitudinal adjustment member 15. The jet unit is connected to the mounting plate 7 through the longitudinal adjustment member 15. A second long slot is provided in the longitudinal adjustment member 15, and a third bolt 18 is provided in the second long slot. The third bolt 18 is used to connect the longitudinal adjustment member 15 and the mounting plate 7. By adjusting the third bolt 18, the jet unit can move longitudinally along the second long slot. Therefore, according to the shape and size differences of various wafers 21, the position of the jet unit can be longitudinally adjusted.

[0080] Second: The position adjustment member only includes the transverse adjustment member 17. The jet unit is connected to the mounting plate 7 through the transverse adjustment member 17. A third long slot is provided in the transverse adjustment member 17, and a fourth bolt 19 is provided in the third long slot. The fourth bolt 19 is used to connect the base 2 and the transverse adjustment member 17. By adjusting the fourth bolt 19, the jet unit can move transversely along the third long slot. Therefore, according to the shape and size differences of various wafers 21, the position of the jet unit can be transversely adjusted.

[0081] Third: The position adjustment member includes a longitudinal adjustment member 15 and a transverse adjustment member 17. The jet unit is connected to the mounting plate 7 through the position adjustment member. A second long slot is provided in the longitudinal adjustment member 15, and a third bolt 18 is provided in the second long slot. The third bolt 18 is used to connect the longitudinal adjustment member 15 and the base 2. A third long slot is provided in the transverse adjustment member 17, and a fourth bolt 19 is provided in the third long slot. The fourth bolt 19 is used to connect the longitudinal adjustment member 15 and the transverse adjustment member 17. By adjusting the third bolt 18, the transverse adjustment member 17 and the jet unit can move longitudinally along the second long slot. By adjusting the fourth bolt 19, the jet unit can move transversely along the third long slot. Therefore, according to the shape and size differences of various wafers 21, the position of the jet unit can be freely adjusted.

[0082] The positions of the jet units can be adjusted in all three situations of this embodiment, which has significant progress compared with the prior art.

[0083] When in use:

[0084] First, determine the types of cleaning liquids required according to the required cleaning and drying process flow of the wafer 21. Connect multiple liquid spraying pipelines 9 to the liquid supply pipelines where these cleaning liquids are located respectively. Install the wafer 21 on the carrier 4, and adjust the first bolt as needed to make the carrier 4 and the wafer 21 at an appropriate height. By adjusting the third bolt 18, the longitudinal position of the air jet unit can be adjusted, and by adjusting the fourth bolt 19, the lateral position of the air jet unit can be adjusted. Therefore, according to the shape and size differences of various wafers 21, the position of the air jet unit can be freely adjusted, and the number of air jet units is set as needed. By adjusting the second bolt 20, the angle between the air jet nozzle 12 and the surface of the wafer 21 can be freely adjusted to make the jet direction of the air jet nozzle 12 correspond to the wafer 21. Thus, the installation of this device is completed. Then, use multiple liquid spraying pipelines 9 to perform the cleaning process on the wafer 21. After the cleaning is completed, an external air source starts to supply air to dry the surface of the wafer 21 through the air jet nozzle 12. Since the pressure of the drying gas can be freely adjusted, and both the jet angle and the jet position of the air jet unit can be adjusted, the drying process requirements of various wafers 21 can be met.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

[0086] In addition, those skilled in the art can understand that although some of the embodiments herein include some features included in other embodiments rather than other features, the combination of the features of different embodiments means that it is within the scope of the present invention and forms different embodiments. For example, in the above claims, any one of the claimed embodiments can be used in any combination. The information disclosed in this background art section is only intended to deepen the understanding of the overall background art of the present invention, and should not be regarded as an admission or any form of implication that this information constitutes the prior art known to those skilled in the art.

[0087] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A cleaning and drying device for performing cleaning and drying process treatments on various wafers (21), comprising a base (2) and a cleaning mechanism, the cleaning mechanism being arranged on the base (2). Characterized in that: The cleaning mechanism includes a plurality of liquid spraying pipelines (9) for cleaning the wafers (21). It further includes a drying mechanism. The drying mechanism includes a jetting unit and an adjusting structure. The jetting unit is connected to the base (2) through the adjusting structure. A slot is formed on the base (2), and the jetting unit is arranged in the slot. The adjusting structure includes an angle adjusting member (14). The angle adjusting member (14) is connected to the jetting unit through a second bolt (20). The adjusting structure further includes a position adjusting member, and the angle adjusting member (14) is connected to the base (2) through the position adjusting member. The position adjusting member includes a lateral adjusting member (17) and a longitudinal adjusting member (15). A second long slot hole is arranged inside the longitudinal adjusting member (15), and a third bolt (18) is arranged in the second long slot hole, and the third bolt (18) is used for connecting the longitudinal adjusting member (15) and the base (2). A third long slot hole is arranged inside the lateral adjusting member (17), and a fourth bolt (19) is arranged in the third long slot hole, and the fourth bolt (19) is used for connecting the longitudinal adjusting member (15) and the lateral adjusting member (17).

2. A cleaning and drying device according to claim 1, Characterized in that: A carrying structure is arranged on the base (2), and the carrying structure is used for installing the wafers (21).

3. A cleaning and drying device according to claim 2, Characterized in that: The carrying structure includes a carrier (4) and a lifting member (3). The carrier (4) is connected to the base (2) through the lifting member (3).

4. A cleaning and drying device according to claim 3, Characterized in that: The lifting member (3) includes a first connecting member and a second connecting member. The first connecting member and the second connecting member are respectively connected to the base (2) and the carrier (4), and the first connecting member is connected to the second connecting member. Relative movement can occur between the first connecting member and the second connecting member to realize the lifting of the carrier (4).

5. A cleaning and drying device according to claim 4, Characterized in that: A first long slot hole is arranged inside the first connecting member and / or the second connecting member, and a first bolt is arranged in the first long slot hole, and the first bolt is used for connecting the first connecting member and the second connecting member.

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