Substrate transfer method and device

Abstract

The present invention provides a substrate transfer method and device, which can solve the thickness problem caused by the wafer expansion iron ring group after the wafer expansion process. The substrate is transferred from one film to another film, and a thinner frame is used to replace the wafer expansion iron ring group used in the wafer expansion process, so as to facilitate the subsequent process after the wafer expansion.

Description

Technical Field

[0001] The present invention relates to a substrate transfer method and device, and in particular to a method and device comprising attaching an adhesive film on a substrate, transferring the substrate, and tearing off the adhesive film. Background Art

[0002] After the whole wafer is cut, it will form individual dies. The distance between each die is about less than 10μm, and even after invisible laser cutting, there is no obvious distance between each die. Under such a relative scale, when the cut die is transported or taken out, if there is a collision, the edge of the die will be broken.

[0003] In the conventional technology, in order to solve the problem of possible collision of bare crystals after cutting, a wafer expansion process is performed after the wafer cutting process. Before the wafer is cut, a stretchable expansion film is pre-attached to its bottom surface; after the wafer is cut and the bare crystals are separated, the expansion film is evenly stretched, which can evenly open the distance between each bare crystal. After the wafer expansion process, the distance between each bare crystal will be increased to 10-15μm, so as to ensure that each bare crystal will not collide or be damaged during transportation or retrieval.

[0004] In order to maintain the distance between each bare die, the expansion film must be kept in its extended state. In the wafer expansion process, after the expansion film is stretched, an expansion iron ring set will be used on the outside of the expansion film to maintain the expansion state of the expansion film. The expansion iron ring set is mainly composed of two upper and lower frames, which are used to clamp and fix the stretched expansion film to maintain the expansion state of the expansion film.

[0005] After cutting, the bare wafer, the expansion film, and the expansion iron ring group form a workpiece, ready to enter the next process. However, the thickness of the entire workpiece including the expansion iron ring group reaches about 9mm, and this thickness will affect the subsequent processes. Before the workpiece enters the next process, it will be placed on the wafer storage rack, and the storage spacing of each wafer storage rack is 10mm; even if the workpiece can be placed in the wafer storage rack, the robot arm on the machine cannot easily pick up and place the workpiece in the subsequent process. Therefore, it is necessary to prepare a non-standard wafer storage rack to store the workpiece. Or if the workpiece is not placed in the wafer storage rack and is directly sent to the next process machine, the thickness of the expansion iron ring group will also raise the bare wafer after expansion in a ring shape, causing all the bare wafers to be not on the same level, which will affect the subsequent process. For example, when the workpiece needs to pass through the Automated Optical Inspection (AOI) machine, it is necessary to design additional fixtures to support the uneven bare wafer level in the workpiece.

[0006] In order to solve the thickness problem caused by the wafer expansion iron ring set after the wafer expansion process, whether preparing a wafer storage rack or redesigning the relevant fixtures will be detrimental to production costs. In view of this, it is necessary to propose a method and device including attaching a film on a wafer or a bare die, transferring it, and tearing off the film; the present invention can transfer the wafer or the bare die to another carrier film to facilitate the subsequent process after the wafer expansion. Summary of the invention

[0007] In order to solve the problems of conventional technology after the wafer expansion process, the present invention provides a substrate transfer method, comprising the following steps: providing a first workpiece, the first workpiece comprising a substrate, a first adhesive film attached to a first surface of the substrate, and a first frame surrounding the substrate and combined with the first adhesive film; placing the first workpiece on a fixed platform and a lifting platform, the lifting platform is arranged around the fixed platform, the first adhesive film corresponding to a portion of the first surface of the substrate is located on the fixed platform, and the first frame is located on the lifting platform; operating the lifting platform to adjust a height difference between the lifting platform and the fixed platform, the first frame follows the lifting platform to rise and fall, so that the first workpiece A film is not warped; a portion of the first film corresponding to a gap between the fixed platform and the lifting platform is cut; the first frame including a portion of the first film is removed; a second frame is placed on the lifting platform; the lifting platform is operated to adjust the height difference between the lifting platform and the fixed platform, and the second frame is lifted and lowered with the lifting platform, so that the surface of the second frame relative to the lifting platform is coplanar with a second surface of the substrate relative to the first surface; and a second film is attached to the second surface of the substrate and the surface of the second frame relative to the lifting platform to form a second workpiece including the substrate, a portion of the first film, the second film, and the second frame.

[0008] The substrate transfer method further includes the following steps: placing the second workpiece on the fixed platform and the lifting platform, with the portion of the second film corresponding to the second surface of the substrate located on the fixed platform, and the portion of the second film corresponding to the second frame located on the lifting platform; tearing off the portion of the first film attached to the first surface of the substrate; cutting the portion of the second film corresponding to the gap between the fixed platform and the lifting platform; removing the second frame including the portion of the second film; placing a third frame on the lifting platform; operating the lifting platform to adjust the height difference between the lifting platform and the fixed platform, and the third frame follows the lifting of the lifting platform so that the surface of the third frame relative to the lifting platform is coplanar with the first surface of the substrate; and attaching a third film to the first surface of the substrate and the surface of the third frame relative to the lifting platform to form a third workpiece including the substrate, the portion of the second film, the third film, and the third frame.

[0009] The substrate transfer method further includes the following steps: placing the third workpiece on the fixed platform and the lifting platform, the portion of the third film corresponding to the first surface of the substrate is located on the fixed platform, and the portion of the third film corresponding to the third frame is located on the lifting platform; and tearing off the portion of the second film attached to the second surface of the substrate to form a fourth workpiece including the substrate, the third film, and the third frame.

[0010] In a preferred embodiment of the substrate transfer method, in the step of tearing off a portion of the first adhesive film attached to the first surface of the substrate, it further includes: operating the lifting platform to adjust the height difference between the lifting platform and the fixed platform, and the second frame follows the lifting platform to rise and fall, so that the surface of the second frame relative to the lifting platform is lower than the horizontal plane of the first surface of the substrate.

[0011] In a preferred embodiment of the substrate transfer method, the step of tearing off a portion of the first adhesive film attached to the first surface of the substrate further includes: using a peeling mechanism to tear off a portion of the first adhesive film attached to the first surface of the substrate.

[0012] In a preferred embodiment of the substrate transfer method, in the step of using the adhesive peeling mechanism to peel off a portion of the first adhesive film attached to the first surface of the substrate, it further includes: using a roller in the adhesive peeling mechanism to contact and roll on a portion of the first adhesive film on the first surface to roll up and peel off a portion of the first adhesive film attached to the first surface of the substrate.

[0013] In a preferred embodiment of the substrate transfer method, in the step of tearing off part of the second adhesive film attached to the second surface of the substrate, it further includes: operating the lifting platform to adjust the height difference between the lifting platform and the fixed platform, and the third frame follows the lifting platform to make the surface of the third frame relative to the lifting platform lower than the horizontal plane of the second surface of the substrate.

[0014] In a preferred embodiment of the substrate transfer method, the step of tearing off a portion of the second adhesive film attached to the second surface of the substrate further includes: using a peeling mechanism to tear off a portion of the second adhesive film attached to the second surface of the substrate.

[0015] In a preferred embodiment of the substrate transfer method, in the step of using the adhesive peeling mechanism to tear off the portion of the second adhesive film attached to the second surface of the substrate, it further includes: using a roller in the adhesive peeling mechanism to contact and roll on the portion of the second adhesive film on the second surface to roll up and tear off the portion of the second adhesive film attached to the second surface of the substrate.

[0016] In a preferred embodiment of the substrate transfer method, the substrate includes one of a wafer and a bare die.

[0017] In a preferred embodiment of the substrate transfer method, the first workpiece is a component of the substrate after undergoing a wafer expansion process.

[0018] The present invention also provides a substrate transfer device, comprising: a fixed platform for carrying a workpiece, the workpiece comprising the substrate, a first adhesive film attached to a first surface of the substrate, and a frame surrounding the substrate and combined with the first adhesive film; and a lifting platform for carrying the workpiece, the lifting platform being arranged around the fixed platform, and the lifting platform being adjustable to have a height difference with the fixed platform; wherein the fixed platform carries a portion of the first adhesive film corresponding to the substrate, and the lifting platform carries one of the frame and a portion of the first adhesive film corresponding to the frame.

[0019] In a preferred embodiment of the substrate transfer device, the fixed platform is a cylindrical platform, the lifting platform is a hollow cylindrical platform, and a central axis of the fixed platform is colinear with a central axis of the lifting platform.

[0020] In a preferred embodiment of the substrate transfer device, it further includes a cutting mechanism; wherein, when the height difference between the lifting platform and the fixed platform is adjusted, the frame follows the lifting platform to rise and fall so that the first adhesive film does not warp, a blade of the cutting mechanism cuts a portion of the first adhesive film corresponding to a gap between the fixed platform and the lifting platform.

[0021] In a preferred embodiment of the substrate transfer device, the cutting mechanism includes a rotating component having the blade, and a rotating axis of the rotating component is colinear with a central axis of the fixed platform and a central axis of the lifting platform.

[0022] In a preferred embodiment of the substrate transfer device, the cutting mechanism includes a cutting die having the cutting edge, and a peripheral edge shape of the cutting die conforms to the gap between the fixed platform and the lifting platform.

[0023] In a preferred embodiment of the substrate transfer device, it further includes a glue peeling mechanism; wherein the workpiece further includes a second glue film attached to a second surface of the substrate opposite to the first surface; and the glue peeling mechanism is used to tear off a portion of the second glue film attached to the second surface of the substrate.

[0024] In a preferred embodiment of the substrate transfer device, the adhesive peeling mechanism includes a roller; and the roller contacts and rolls on the second adhesive film on the second surface to roll up and peel off a portion of the second adhesive film attached to the second surface of the substrate.

[0025] In a preferred embodiment of the substrate transfer device, the substrate includes one of a wafer and a bare die.

[0026] In a preferred embodiment of the substrate transfer device, the workpiece is a component of the substrate after undergoing a wafer expansion process.

[0027] The substrate transfer method and the substrate transfer device of the present invention can solve the thickness problem caused by the wafer expansion iron ring set after the wafer expansion process. The substrate is transferred from one film to another film, and a thinner frame is used to replace the wafer expansion iron ring set used in the wafer expansion process, so as to facilitate the subsequent process after the wafer expansion. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a three-dimensional schematic diagram of the substrate transfer device of the present invention.

[0029] Figure 2 It is a first stereoscopic schematic diagram of the cutting mechanism in the substrate transfer device of the present invention.

[0030] Figure 3 It is a second stereoscopic schematic diagram of the cutting mechanism in the substrate transfer device of the present invention.

[0031] Figure 4 It is a three-dimensional schematic diagram of the adhesive peeling mechanism in the substrate transfer device of the present invention.

[0032] Figures 5 to 14 It is a schematic diagram of the process structure of the substrate transfer method of the present invention. DETAILED DESCRIPTION

[0033] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the preferred embodiments of the present invention will be specifically cited below and described in detail with reference to the accompanying drawings.

[0034] Please refer to Figure 1 , which is a three-dimensional schematic diagram of a substrate transfer device 500 of the present invention. The substrate transfer device 500 includes a fixed platform 510 and a lifting platform 520 disposed around the fixed platform 510. The lifting platform 520 can be adjusted to have a height difference with the fixed platform 510; in other words, the lifting platform 520 can be lifted up and down and can be located at a different level from the fixed platform 510.

[0035] The fixed platform 510 and the lifting platform 520 are used to carry workpieces. The workpiece may be a component after the wafer expansion process, and the first workpiece 100 is taken as an example here. The first workpiece includes a substrate 110, a first adhesive film 120 attached to the substrate 110, and a first frame 130 surrounding the substrate 110 and combined with the first adhesive film 120. The substrate 110 includes but is not limited to an uncut wafer or a cut bare wafer, which can be modified according to the actual process requirements.

[0036] The fixed platform 510 includes a first vacuum system (not shown), and the lifting platform 520 includes a second vacuum system (not shown). The first vacuum system and the second vacuum system are used to vacuum absorb the first workpiece 100. The first vacuum system absorbs the first adhesive film 120 corresponding to the substrate 110, and the second vacuum system absorbs the first frame 130. In this way, the first adhesive film 120 can be absorbed and fixed to the fixed platform 510, and the first frame 130 is also absorbed and fixed to the lifting platform 520, and rises and falls with the lifting platform 520.

[0037] Please refer to Figure 2 , which is a first stereoscopic schematic diagram of the cutting mechanism 600 in the substrate transfer device 500 of the present invention. Figure 2It can be seen that the fixed platform 510 is a cylindrical platform, the lifting platform 520 is a hollow cylindrical platform, and a central axis 511 of the fixed platform 510 is collinear with a central axis 521 of the lifting platform 520. At the same time, the substrate transfer device 500 also includes a cutting mechanism 600 for cutting the first adhesive film 120. The cutting mechanism 600 includes a rotating assembly 620 having a blade 610. A rotating axis 621 of the rotating assembly 620 is collinear with the central axis 511 of the fixed platform 510 and the central axis 521 of the lifting platform 520.

[0038] Please refer to Figures 5 to 14 , which is a schematic diagram of the process structure of the substrate transfer method of the present invention. Figure 5 The first workpiece 100 is shown. The first workpiece 100 includes the substrate 110, the first adhesive film 120 attached to a first surface 111 of the substrate 110, and the first frame 130 surrounding the substrate 110 and combined with the first adhesive film 120; at the same time, the substrate 110 also includes a second surface 112 relative to the first surface 111. Since the first workpiece 100 is a component after the wafer expansion process, the first adhesive film 120 is an expansion adhesive film, and the first frame 130 is an expansion iron ring group. The first frame also includes two sets of frames 131 and 132, and the two frames clamp and fix the stretched first adhesive film 120 up and down to maintain the stretched state of the first adhesive film 120.

[0039] exist Figure 6 In the embodiment of the present invention, the first workpiece 100 is placed on the substrate transfer device 500. When the first vacuum system and the second vacuum system are started, the fixed platform 510 absorbs the first adhesive film 120 corresponding to the first surface 111 of the substrate 110, and the lifting platform 520 absorbs the first frame 130. Then, the lifting platform 520 is operated, and the first frame 130 rises and falls with the lifting platform 520. By adjusting a height difference H between the lifting platform 520 and the fixed platform 510, the first adhesive film 120 is prevented from warping. This is to keep the first adhesive film 120 on a horizontal plane, so as to facilitate the subsequent process of cutting the first adhesive film 120.

[0040] Then, the blade 610 of the cutting mechanism 600 is used to cut a portion of the first adhesive film 120 corresponding to a gap 530 between the fixed platform 510 and the lifting platform 520. The cutting mechanism 600 specifically uses the rotating mechanism 620 to rotate the blade 610 to cut the first adhesive film 120 in an annular shape, thereby separating the first frame 130.

[0041] The present invention also includes another form of the cutting mechanism 600; please refer to Figure 3 , which is a second stereoscopic schematic diagram of the cutting mechanism 600 in the substrate transfer device 500 of the present invention. The cutting mechanism 600 includes a cutting die 630 having the blade 610, and the shape of the peripheral edge of the cutting die 630 conforms to the gap 530 between the fixed platform 510 and the lifting platform 520. In other words, the present invention can use the cutting die 630 to move up and down for cutting without using the rotating mechanism 620, so as to cut the first adhesive film 120 in an annular shape, thereby separating the first frame 130.

[0042] After the first adhesive film 120 is cut by the blade 610, the second vacuum system of the lifting platform 520 is turned off. In this way, the first frame 130 adsorbed on the lifting platform 520 can be removed.

[0043] Then, if Figure 7 As shown, a second frame 230 is placed on the lifting platform 520, and the second vacuum system is turned on so that the lifting platform 520 absorbs the second frame 230. At the same time, the lifting platform 520 is operated, and the second frame 230 follows the lifting platform 520 to rise and fall. By adjusting the height difference H between the lifting platform 520 and the fixed platform 510, the surface of the second frame 230 relative to the lifting platform 520 and the second surface 112 of the substrate 110 are made coplanar. This is to keep the surface of the second frame 230 relative to the lifting platform 520 and the second surface 112 of the substrate 110 on a horizontal plane, so as to facilitate the subsequent process of attaching the adhesive film again.

[0044] A second adhesive film 220 is attached to the second surface 112 of the substrate 110 and the surface of the second frame 230 opposite to the lifting platform 520. In this way, only a portion of the first adhesive film 120 remains on the first surface 111 of the substrate 110; and the second adhesive film 220 combined with the second frame 230 is attached to the second surface 112 of the substrate 110. Figure 8 The second workpiece 200 shown includes the substrate 110 , a portion of the first adhesive film 120 , the second adhesive film 220 , and the second frame 230 .

[0045] When the first vacuum system and the second vacuum system are closed, the second workpiece 200 can be removed from the substrate transfer device 500. The first adhesive film 120 without the supporting tension of the first frame 130 would shrink and return to its original shape due to its internal stress, but the second adhesive film 220 attached to the second surface 112 of the substrate 110 and the second frame 230 combined with the second adhesive film 220 can provide the supporting tension required for the substrate expansion again.

[0046] Next, the second workpiece 200 is placed on the substrate transfer device 500 with the second surface 112 of the substrate 110 facing the substrate transfer device 500. The first vacuum system and the second vacuum system are turned on, so that the substrate transfer device 500 adsorbs the second workpiece. The portion of the second adhesive film 220 corresponding to the second surface 112 of the substrate 110 is located on the fixed platform 510, and the portion of the second adhesive film 220 corresponding to the second frame 230 is located on the lifting platform 520. At this point, the portion of the first adhesive film 120 attached to the first surface 111 of the substrate 110 must be torn off to facilitate subsequent processes.

[0047] Please refer to Figure 4 , which is a three-dimensional schematic diagram of the adhesive peeling mechanism 700 in the substrate transfer device 500 of the present invention. The present invention uses the adhesive peeling mechanism 700 to peel off unnecessary adhesive films after cutting. The adhesive peeling mechanism 700 includes a roller 710, and the roller 710 is used to roll on a portion of the first adhesive film 120 on the first surface 111 to roll up and peel off a portion of the first adhesive film 120 attached to the first surface 111 of the substrate 110.

[0048] To ensure that the roller 710 of the adhesive peeling mechanism 700 can peel off part of the first adhesive film 120 smoothly, Fig. 9 As shown, the lifting platform 520 is operated, and the second frame 230 is lifted and lowered following the lifting platform 520. By adjusting the height difference H between the lifting platform 520 and the fixed platform 510, the surface of the second frame 230 relative to the lifting platform 520 is lower than the horizontal plane of the first surface 111 of the substrate 110.

[0049] Then perform another film cut. Fig.10 As shown, the lifting platform 520 is operated to reset. Then, the blade 610 of the cutting mechanism 600 is used to cut the portion of the second adhesive film 220 corresponding to the gap 530 between the fixed platform 510 and the lifting platform 520. The second adhesive film 220 is cut in an annular shape to separate the second frame 230.

[0050] After the second adhesive film 220 is cut by the blade 610, the second vacuum system of the lifting platform 520 is turned off. In this way, the second frame 230 adsorbed on the lifting platform 520 can be removed.

[0051] Then, if Fig.11 As shown, a third frame 330 is placed on the lifting platform 520, and the second vacuum system is turned on so that the lifting platform 520 absorbs the third frame 330. At the same time, the lifting platform 520 is operated, and the third frame 330 follows the lifting platform 520 to rise and fall. By adjusting the height difference H between the lifting platform 520 and the fixed platform 510, the surface of the third frame 330 relative to the lifting platform 520 is made coplanar with the first surface 111 of the substrate 110. This is to keep the surface of the third frame 330 relative to the lifting platform 520 and the first surface 111 of the substrate 110 on a horizontal plane, so as to facilitate the subsequent process of attaching the adhesive film again.

[0052] A third adhesive film 320 is attached to the first surface 111 of the substrate 110 and the surface of the third frame 330 opposite to the lifting platform 520. In this way, only a portion of the second adhesive film 220 remains on the second surface 112 of the substrate 110; and the third adhesive film 320 combined with the third frame 330 is attached to the first surface 111 of the substrate 110. Fig.12 The third workpiece 300 shown includes the substrate 110 , a portion of the second adhesive film 220 , the third adhesive film 320 , and the third frame 330 .

[0053] When the first vacuum system and the second vacuum system are turned off, the third workpiece 300 can be removed from the substrate transfer device 500 .

[0054] Next, the third workpiece 300 is placed on the substrate transfer device 500 with the first surface 111 of the substrate 110 facing the substrate transfer device 500. The first vacuum system and the second vacuum system are turned on, so that the substrate transfer device 500 adsorbs the third workpiece. The portion of the third adhesive film 320 corresponding to the first surface 111 of the substrate 110 is located on the fixed platform 510, and the portion of the third adhesive film 320 corresponding to the third frame 330 is located on the lifting platform 520. At this point, the portion of the second adhesive film 220 attached to the second surface 112 of the substrate 110 must be torn off to facilitate subsequent processes.

[0055] The peeling mechanism 700 is used again to peel off the unnecessary adhesive film after cutting. The roller 710 of the peeling mechanism 700 is used to contact and roll on the portion of the second adhesive film 220 on the second surface 112 to roll up and peel off the portion of the second adhesive film 220 attached to the second surface 112 of the substrate 110.

[0056] To ensure that the roller 710 of the adhesive peeling mechanism 700 can peel off part of the first adhesive film 120 smoothly, Fig.13 As shown, the lifting platform 520 is operated, and the third frame 330 follows the lifting platform 520 to rise and fall. By adjusting the height difference H between the lifting platform 520 and the fixed platform 510, the surface of the third frame 330 relative to the lifting platform 520 is lower than the horizontal plane of the second surface 112 of the substrate 110.

[0057] So formed as Fig.14 The fourth workpiece 400 shown includes the substrate 110, the third adhesive film 320, and the third frame 330. When the first vacuum system and the second vacuum system are turned off, the fourth workpiece 400 can be removed from the substrate transfer device 500 to complete the entire substrate transfer method.

[0058] The substrate transfer method and the substrate transfer device 500 of the present invention can solve the thickness problem caused by the first frame 130 after the wafer expansion process. The substrate 110 is transferred from the first adhesive film 120 to the third adhesive film 320, and the thinner third frame 330 is used to replace the first frame 130 used in the wafer expansion process, so as to facilitate the subsequent processes after the wafer expansion.

[0059] The above are only preferred embodiments of the present invention. It should be pointed out that technicians in the relevant field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be considered as the scope of protection of the present invention.

Claims

1. A substrate transfer method, characterized in that: The following steps are involved: Providing a first workpiece, the first workpiece comprising a substrate, a first adhesive film attached to a first surface of the substrate, and a first frame surrounding the substrate and combined with the first adhesive film; Placing the first workpiece on a fixed platform and a lifting platform, wherein the lifting platform is arranged around the fixed platform, a portion of the first adhesive film corresponding to the first surface of the substrate is located on the fixed platform, and the first frame is located on the lifting platform; The lifting platform is operated to adjust a height difference between the lifting platform and the fixed platform, and the first frame is lifted and lowered following the lifting platform, so that the first adhesive film does not warp; cutting a portion of the first adhesive film corresponding to a gap between the fixed platform and the lifting platform; removing the first frame including a portion of the first adhesive film; Placing a second frame on the lifting platform; Operating the lifting platform to adjust the height difference between the lifting platform and the fixed platform, the second frame follows the lifting platform to rise and fall, so that a surface of the second frame relative to the lifting platform and a second surface of the substrate relative to the first surface are coplanar; and Attaching a second adhesive film to the second surface of the substrate and the surface of the second frame opposite to the lifting platform to form a second workpiece including the substrate, a portion of the first adhesive film, the second adhesive film, and the second frame; Placing the second workpiece on the fixed platform and the lifting platform, wherein the portion of the second adhesive film corresponding to the second surface of the substrate is located on the fixed platform, and the portion of the second adhesive film corresponding to the second frame is located on the lifting platform; tearing off a portion of the first adhesive film attached to the first surface of the substrate; The portion of the second adhesive film corresponding to the gap between the fixed platform and the lifting platform is cut.

2. The substrate transfer method according to claim 1, wherein: Further comprising the steps of: removing the second frame including a portion of the second adhesive film; Placing a third frame on the lifting platform; Operating the lifting platform to adjust the height difference between the lifting platform and the fixed platform, the third frame follows the lifting platform to rise and fall, so that the surface of the third frame relative to the lifting platform is coplanar with the first surface of the substrate; and A third adhesive film is attached to the first surface of the substrate and the surface of the third frame opposite to the lifting platform to form a third workpiece including the substrate, a portion of the second adhesive film, the third adhesive film, and the third frame.

3. The substrate transfer method according to claim 2, wherein: Further comprising the steps of: Placing the third workpiece on the fixed platform and the lifting platform, wherein the portion of the third adhesive film corresponding to the first surface of the substrate is located on the fixed platform, and the portion of the third adhesive film corresponding to the third frame is located on the lifting platform; as well as A portion of the second adhesive film attached to the second surface of the substrate is removed to form a fourth workpiece including the substrate, the third adhesive film, and the third frame.

4. The substrate transfer method according to claim 2, wherein: The step of tearing off a portion of the first adhesive film attached to the first surface of the substrate further includes: The lifting platform is operated to adjust the height difference between the lifting platform and the fixed platform, and the second frame rises and falls with the lifting platform, so that the surface of the second frame relative to the lifting platform is lower than the horizontal plane of the first surface of the substrate.

5. The substrate transfer method according to claim 2 or 4, wherein: The step of tearing off a portion of the first adhesive film attached to the first surface of the substrate further includes: A peeling mechanism is used to peel off a portion of the first adhesive film attached to the first surface of the substrate.

6. The substrate transfer method according to claim 5, wherein: The step of using the adhesive peeling mechanism to peel off a portion of the first adhesive film attached to the first surface of the substrate further includes: A roller in the adhesive peeling mechanism is used to contact and roll on a portion of the first adhesive film on the first surface, so as to roll up and peel off a portion of the first adhesive film attached to the first surface of the substrate.

7. The substrate transfer method according to claim 3, wherein: The step of tearing off a portion of the second adhesive film attached to the second surface of the substrate further includes: The lifting platform is operated to adjust the height difference between the lifting platform and the fixed platform, and the third frame rises and falls with the lifting platform, so that the surface of the third frame relative to the lifting platform is lower than the horizontal plane of the second surface of the substrate.

8. The substrate transfer method according to claim 3 or 7, wherein: The step of tearing off a portion of the second adhesive film attached to the second surface of the substrate further includes: A peeling mechanism is used to peel off a portion of the second adhesive film attached to the second surface of the substrate.

9. The substrate transfer method according to claim 8, wherein: In the step of using the adhesive peeling mechanism to peel off a portion of the second adhesive film attached to the second surface of the substrate, the method further includes: A roller in the adhesive peeling mechanism is used to contact and roll on a portion of the second adhesive film on the second surface, so as to roll up and peel off a portion of the second adhesive film attached to the second surface of the substrate.

10. The substrate transfer method according to claim 1, wherein: The substrate includes one of a wafer and a bare die.

11. The substrate transfer method according to claim 1, wherein: The first workpiece is a component of the substrate after undergoing a wafer expansion process.

12. A substrate transfer device, characterized in that: include: A fixed platform for carrying a workpiece, the workpiece comprising a substrate, a first adhesive film attached to a first surface of the substrate, and a frame surrounding the substrate and combined with the first adhesive film; a lifting platform for carrying the workpiece, the lifting platform being arranged around the fixed platform, and the lifting platform being adjustable to form a height difference with the fixed platform; and a cutting mechanism, wherein when the height difference between the lifting platform and the fixed platform is adjusted and the frame follows the lifting platform to rise and fall so that the first adhesive film does not warp, a blade of the cutting mechanism cuts a portion of the first adhesive film corresponding to a gap between the fixed platform and the lifting platform; The fixed platform carries a portion of the first adhesive film corresponding to the substrate, and the lifting platform carries one of the frame and a portion of the first adhesive film corresponding to the frame.

13. The substrate transfer device according to claim 12, wherein: The fixed platform is a cylindrical platform, the lifting platform is a hollow cylindrical platform, and a central axis of the fixed platform is colinear with a central axis of the lifting platform.

14. The substrate transfer device according to claim 12, wherein: The cutting mechanism comprises a rotating assembly having the blade, wherein a rotating axis of the rotating assembly is colinear with a central axis of the fixed platform and a central axis of the lifting platform.

15. The substrate transfer device according to claim 12, wherein: The cutting mechanism comprises a cutting die having the cutting edge, and a peripheral edge shape of the cutting die conforms to the gap between the fixed platform and the lifting platform.

16. The substrate transfer device according to claim 12, wherein: Further comprising a glue peeling mechanism; Wherein, the workpiece further comprises a second adhesive film attached to a second surface of the substrate opposite to the first surface; and the adhesive peeling mechanism is used to peel off a portion of the second adhesive film attached to the second surface of the substrate.

17. The substrate transfer device according to claim 16, wherein: The adhesive peeling mechanism comprises a roller; and the roller contacts and rolls on the second adhesive film on the second surface to roll up and peel off a portion of the second adhesive film attached to the second surface of the substrate.

18. The substrate transfer device according to claim 12, wherein: The substrate includes one of a wafer and a bare die.

19. The substrate transfer device according to claim 12, wherein: The workpiece is a component of the substrate after the substrate has undergone a wafer expansion process.

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