Ink impact point correction device and substrate processing system having the same

Abstract

The present application provides an ink impact point correction device using a pattern on a substrate on which a coordinate system is displayed to automatically measure and correct an impact point of ink, and a substrate processing system having the same. The ink impact point correction device includes an identification section that obtains information about an impact point of ink from a plurality of positions on a substrate, and a correction section that corrects a position of an ink ejection position on the substrate based on the information about the impact point, wherein a coordinate pattern in the form of a coordinate system is formed at the plurality of positions.

Description

TECHNICAL FIELD

[0001] The present application relates to an ink impact point correction device and a substrate processing system having the same. In more detail, the present application relates to an ink impact point correction device for manufacturing a display device and a substrate processing system having the same. BACKGROUND

[0002] When performing a printing process (e.g., RGB patterning) on a transparent substrate to manufacture a display device such as an LCD panel, a PDP panel, an LED panel, etc., a printing apparatus having an inkjet head module can be used. SUMMARY

[0003] In order to accurately perform R / G / B patterning, a correction job for coping with mechanical defects of the printing apparatus must be performed to correct and reduce errors (e.g., translation errors, rotation errors, etc.) affecting impacts of each droplet on the substrate in a conveyance path system.

[0004] In order to improve mechanical errors, impact correction must be performed for each position of the glass. For this purpose, in the related art, a method of manually confirming ink impacts by a vision camera after performing ink impacts on a hydrophobically treated glass has been used.

[0005] However, the above-described method can incur costs due to the need for a hydrophobically treated glass. In addition, the above-described method can require a great deal of time to complete the correction job due to a very long job time, and can not be suitable for mass production of patterned products since recipe correction is performed manually.

[0006] The present application relates to an ink impact point correction device and a substrate processing system having the same. In more detail, the present application relates to an ink impact point correction device for manufacturing a display device and a substrate processing system having the same.

[0007] The technical problems of the present application are not limited to the above-mentioned technical problems, and other technical problems not mentioned can be clearly understood by those skilled in the art from the following description.

[0008] One aspect of the ink impact point correction device of the present application for achieving the above-described technical problem includes an identification part obtaining information about an impact point of ink from a plurality of positions on a substrate, and a correction part correcting a position of an ink ejection position on the substrate based on the information about the impact point, wherein a coordinate pattern in the form of a coordinate system is formed at the plurality of positions.

[0009] The recognition section can recognize coordinates of the ink droplets when the ink droplets are ejected to the coordinate pattern to obtain information about the impact point.

[0010] The correction section can calculate a slope based on the coordinates of the plurality of ink droplets when the coordinates of the plurality of ink droplets are obtained as the information about the impact point, and can correct the position of the ink ejection position based on the slope.

[0011] The correction section can correct the position of the ink ejection position so that coordinate values of at least one coordinate axis are all 0 among the coordinates of the plurality of ink droplets when the coordinates of the plurality of ink droplets are obtained as the information about the impact point.

[0012] The correction section can correct the position of the ink ejection position using either of a first mode and a second mode based on relationship information between two adjacent unit areas when a plurality of unit areas exist on the substrate.

[0013] The correction section can correct the position of the ink ejection position using the first mode when correcting a pattern recipe to be commonly applied to the two adjacent unit areas, and can correct the position of the ink ejection position using the second mode when correcting a pattern recipe to be separately applied to the two adjacent unit areas.

[0014] The recognition section can recognize the impact point from a plurality of positions located at peripheries of the two adjacent unit areas when the correction section corrects the position of the ink ejection position using the first mode, or can recognize the impact point from a plurality of positions located at peripheries of the two adjacent unit areas and at least one position between the two adjacent unit areas when the correction section corrects the position of the ink ejection position using the second mode.

[0015] The correction section can use at least one of information about whether to set an application having the same size in the two adjacent unit areas, information about whether to set an application in which thermal deformation occurs in the two adjacent unit areas, and information about whether there is an alignment change between the two adjacent unit areas as the relationship information.

[0016] The plurality of positions can be formed in a virtual area in which a unit area is not formed on the substrate.

[0017] The plurality of positions can be formed in the virtual region before the unit regions are formed on the substrate, or can be formed in the virtual region after the unit regions are formed on the substrate, and in the case of being formed in the virtual region before the unit regions are formed on the substrate, the plurality of positions can be formed in the virtual region based on an align mark formed on the substrate.

[0018] The identification section can identify the impact point from the plurality of positions arranged in a row in at least one direction on the substrate to obtain information about the impact point.

[0019] In the case of identifying the impact point from the plurality of positions arranged in a row in at least one direction on the substrate, the identification section can identify the impact point from two positions located at the periphery.

[0020] The plurality of positions can be selected by taking into account a moving direction of the substrate.

[0021] A position arranged in a direction different from a moving direction of the substrate can be selected as the plurality of positions.

[0022] The identification section can identify the impact point from the plurality of positions arranged in a row in at least two directions on the substrate, respectively, and the correction section can correct a pattern scheme of a unit region to be applied to the substrate in at least two directions.

[0023] The correction section can correct the position of the ink ejection position by controlling a time at which ink is ejected onto the substrate, or can correct the position of the ink ejection position by correcting a position or posture of an apparatus that ejects ink onto the substrate, or can correct the position of the ink ejection position by correcting a position or posture of the substrate.

[0024] The correction section can correct the position of the ink ejection position before performing RGB patterning on the substrate.

[0025] The ink impact point correction apparatus can further include a selection section that selects a position at which ink is to be ejected on the substrate.

[0026] Another aspect of the ink landing point correction apparatus of the present application for achieving the above-described technical problem includes an identification section that obtains information about a landing point of ink from a plurality of positions on a substrate, and a correction section that corrects a position of an ink ejection position on the substrate based on the information about the landing point, wherein, in a case where a plurality of cell regions exist on the substrate, the correction section corrects the position of the ink ejection position using either of a first mode and a second mode based on relationship information between two adjacent cell regions, wherein the correction section corrects the position of the ink ejection position using the first mode when correcting a pattern scheme to be commonly applied to the two adjacent cell regions, and corrects the position of the ink ejection position using the second mode when correcting a pattern scheme to be separately applied to the two adjacent cell regions.

[0027] One aspect of the substrate processing system of the present application for achieving the above-described technical problem includes a substrate support unit that supports a substrate, a gantry unit that is movably provided above the substrate, an inkjet head module that is provided on the gantry unit and that ejects ink onto the substrate, and an ink landing point correction apparatus that includes an identification section that obtains information about a landing point of ink from a plurality of positions on a substrate, and a correction section that corrects a position of an ink ejection position on the substrate based on the information about the landing point, wherein a coordinate pattern in the form of a coordinate system is formed at the plurality of positions.

[0028] Details of other embodiments are included in the detailed description and the drawings. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is a perspective view that schematically shows an internal structure of a substrate processing system.

[0030] Figure 2 is a plan view that schematically shows an internal structure of a substrate processing system.

[0031] Figure 3 is a conceptual view that schematically shows an internal configuration of an ink landing point correction apparatus according to one embodiment of the present application.

[0032] Figure 4 is a first example view for explaining an arrangement structure of a plurality of ink ejection positions formed on a substrate according to one embodiment of the present application.

[0033] Figure 5 is a second example view for explaining an arrangement structure of a plurality of ink ejection positions formed on a substrate according to one embodiment of the present application.

[0034] Figure 6is a first example diagram for explaining a forming method of a plurality of ink ejection positions formed on a substrate according to an embodiment of the present application.

[0035] Figure 7 is a second example diagram for explaining a forming method of a plurality of ink ejection positions formed on a substrate according to an embodiment of the present application.

[0036] Figure 8 is an example diagram of a coordinate pattern of a plurality of positions provided on a substrate according to an embodiment of the present application.

[0037] Figure 9 is a first example diagram for explaining a function of an identification section constituting an ink impact point correction device according to an embodiment of the present application.

[0038] Figure 10 is a second example diagram for explaining a function of an identification section constituting an ink impact point correction device according to an embodiment of the present application.

[0039] Figure 11 is a third example diagram for explaining a function of an identification section constituting an ink impact point correction device according to an embodiment of the present application.

[0040] Figure 12 is a fourth example diagram for explaining a function of an identification section constituting an ink impact point correction device according to an embodiment of the present application.

[0041] Figure 13 is a fifth example diagram for explaining a function of an identification section constituting an ink impact point correction device according to an embodiment of the present application.

[0042] Figure 14 is a sixth example diagram for explaining a function of an identification section constituting an ink impact point correction device according to an embodiment of the present application.

[0043] Figure 15 is a seventh example diagram for explaining a function of an identification section constituting an ink impact point correction device according to an embodiment of the present application.

[0044] Figure 16 is an eighth example diagram for explaining a function of an identification section constituting an ink impact point correction device according to an embodiment of the present application.

[0045] Figure 17 is a first example diagram for explaining a function of a correction section constituting an ink impact point correction device according to an embodiment of the present application.

[0046] Figure 18is a second example diagram for explaining the function of a correction section constituting an ink landing point correction device according to an embodiment of the present application.

[0047] Figure 19 is a third example diagram for explaining the function of a correction section constituting an ink landing point correction device according to an embodiment of the present application.

[0048] Figure 20 is an example diagram for explaining a common pattern of patterning applied to a unit area according to an embodiment of the present application.

[0049] Figure 21 is an example diagram for explaining a differentiated pattern of patterning applied to a unit area according to an embodiment of the present application.

[0050] Figure 22 is a fourth example diagram for explaining the function of a correction section constituting an ink landing point correction device according to an embodiment of the present application.

[0051] Figure 23 is a fifth example diagram for explaining the function of a correction section constituting an ink landing point correction device according to an embodiment of the present application.

[0052] Figure 24 is a conceptual diagram schematically showing the internal configuration of an ink landing point correction device according to another embodiment of the present application.

[0053] Explanation of Reference Signs

[0054] 100: printing apparatus 110: base

[0055] 130: gantry unit 150: inkjet head module

[0056] 300: ink landing point correction device 310: recognition section

[0057] 320: correction section 350: selection section

[0058] 411, 412: unit area 420: virtual area

[0059] 431 to 439: ink ejection position 440: alignment mark

[0060] 450: moving direction of substrate 510: coordinate pattern

[0061] 520: ink droplet S: substrate DETAILED DESCRIPTION

[0062] Hereinafter, a preferred embodiment of the present application will be described in detail with reference to the accompanying drawings. Advantages and features of the present application and a method of achieving the advantages and features will be apparent by referring to the embodiments below and the following drawings. In the drawings:Figure 1 The embodiments will be described in detail with reference to the drawings. However, the present application is not limited to the embodiments disclosed below, but can be implemented in various forms, and the embodiments are provided only to make the present application complete and to completely inform those skilled in the art to which the present application pertains of the scope of the application, and the present application is defined only by the scope of the claims. Throughout the specification, like reference numerals refer to like elements.

[0063] An element or layer referred to as "on" or "above" another element or layer includes not only an instance in which it is directly on the other element or layer, but also an instance in which other elements or layers are interposed therebetween. In contrast, an element referred to as "directly on" or "directly above" indicates an instance in which no other element or layer is interposed therebetween.

[0064] In order to easily describe a relative relationship of one element or constituent to another element or constituent as shown in the drawings, spatial relative terms "below", "beneath", "lower", "above", "upper" and the like can be used. It should be understood that the spatial relative terms are terms including directions of the elements with respect to each other when used or operated, in addition to the directions shown in the drawings. For example, when the elements shown in the drawings are reversed, an element described as "below" or "beneath" another element can be located "above" the other element. Thus, the exemplary term "below" can include both directions, below and above. The elements can also be oriented in another direction, and thus the spatial relative terms can be interpreted according to the orientation.

[0065] Although the terms "first", "second", and the like are used to describe various elements, constituent elements, and / or parts, the elements, constituent elements, and / or parts are obviously not limited by the terms. The terms are used only to distinguish one element, constituent element, and / or part from another element, constituent element, and / or part. Therefore, a first element, a first constituent element, or a first part mentioned below can obviously be a second element, a second constituent element, or a second part within the technical idea of the present application.

[0066] The terms used in the present specification are used to describe the embodiments, and are not intended to limit the present application. In the present specification, the singular forms are intended to include the plural forms unless the context clearly indicates otherwise. The use of "comprises" and / or "comprising," or "includes" and / or "including" in the specification is not intended to exclude the presence of one or more additional elements, steps, operations, and / or components.

[0067] If not otherwise defined, all terms (including technical and scientific terms) used in this specification can be interpreted as having a meaning that is consistent with the meaning in common usage by those of ordinary skill in the art to which this application belongs. Furthermore, unless explicitly stated otherwise, terms defined in commonly used dictionaries can not be idealized or overly construed.

[0068] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings. In describing the embodiments of the present application, the same or similar components are denoted by the same reference numerals, and repeated explanation thereof will be omitted.

[0069] In the prior art, in order to improve mechanical errors of a printing apparatus, after ink impingement on a hydrophobically treated glass, the distance between the ink and the actual pattern is manually measured by a vision camera, and the measured distance is manually reflected in a scheme compensation, and then a printing process is performed.

[0070] However, this method requires an additional hydrophobically treated glass, and the above process is repeated before performing the printing process, and thus the efficiency of product production can be reduced.

[0071] The present application relates to an ink impingement point correction device using a pattern on a substrate on which a coordinate system is displayed to automatically measure and correct an ink impingement point, and a substrate processing system having the same.

[0072] According to the ink impingement point correction device of the present application, a pattern on which X and Y coordinates are displayed in a virtual area of mass production glass can be used to measure and correct an ink impingement point in real time without an additional hydrophobically treated glass. According to the present application, the following effects can be obtained.

[0073] First, the operation time can be shortened from 4 hours per day to 5 minutes, and thus the productivity of the apparatus can be improved.

[0074] Second, the output of products can be improved by automatically correcting mechanical defects of a transfer system, and process defects can be prevented in advance by monitoring the impingement point in mass production.

[0075] Third, human errors can be eliminated by an Auto Tuning function, and thus the quality of the apparatus can be improved.

[0076] Hereinafter, the present application will be described in detail with reference to the accompanying drawings. First, a substrate processing system having an ink impingement point correction device will be described.

[0077] Figure 1 is a perspective view schematically showing the internal structure of the substrate processing system, and Figure 2is a plan view schematically showing an internal structure of a substrate processing system.

[0078] A substrate processing system is used to process a substrate. For example, such a substrate processing system can be implemented as a printing apparatus that ejects ink or the like onto a substrate using an inkjet head module. Hereinafter, a case where the substrate processing system is a printing apparatus will be described.

[0079] Referring to Figure 1 and Figure 2 , the printing apparatus 100 can be configured to include a base 110, a substrate support unit 120, a gantry unit 130, a gantry moving unit 140, an inkjet head module 150, a head moving unit 160, a droplet ejection amount measurement unit 170, and a nozzle inspection unit 180.

[0080] The base 110 is used to constitute a main body of the printing apparatus 100. The base 110 can be provided in a rectangular parallelepiped shape having a certain thickness. In addition, the substrate support unit 120 can be disposed on an upper surface of the base 110.

[0081] The substrate support unit 120 is used to support a substrate S. Such a substrate support unit 120 can have a support plate 121 on which the substrate S is placed.

[0082] The support plate 121 is used to mount the substrate S. Such a support plate 121 can be a flat plate in a quadrilateral shape. In addition, a rotary driving member 122 can be connected to a lower surface of the support plate 121.

[0083] The rotary driving member 122 is used to rotate the support plate 121. To this end, the rotary driving member 122 can be implemented as a rotary motor. The rotary driving member 122 can rotate the support plate 121 using a rotary center shaft formed in a direction perpendicular to the support plate 121.

[0084] When the support plate 121 is rotated by the rotary driving member 122, the substrate S can also be rotated along with the support plate 121. For example, when a long side direction of a cell formed on the substrate S on which droplets are to be applied is oriented toward the second direction 20, the rotary driving member 122 can rotate the substrate S so that the long side direction of the cell is oriented toward the first direction 10.

[0085] The linear driving member 123 is used to linearly move the support plate 121 and the rotary driving member 122. Such a linear driving member 123 can linearly move the support plate 121 and the rotary driving member 122 in the first direction 10.

[0086] The linear driving member 123 can include a slider 124 and a guide member 125. In this case, the rotary driving member 122 can be disposed on an upper surface of the slider 124.

[0087] The guide member 125 can extend in the first direction 10 as a length direction at a center portion of the upper surface of the base 110. A linear motor (not shown) can be embedded in the slide 124, and the slide 124 can be linearly moved along the first direction 10 by the linear motor along with the guide member 125.

[0088] A gantry unit 130 is used to support a plurality of inkjet head modules 150. Such a gantry unit 130 can be disposed above the moving path of the support plate 121.

[0089] The gantry unit 130 can be spaced upward from the upper surface of the base 110. In addition, the gantry unit 130 can be arranged such that its length direction is toward the second direction 20.

[0090] A gantry moving unit 140 is used to linearly move the gantry unit 130 along the first direction 10. Such a gantry moving unit 140 can include a first moving unit 141 and a second moving unit 142.

[0091] The first moving unit 141 can be disposed at one end of the gantry unit 130, and the second moving unit 142 can be disposed at the other end of the gantry unit 130. In this case, the first moving unit 141 can be slidably moved along the first guide rail 211 disposed at one side of the base 110, and the second moving unit 142 can be slidably moved along the second guide rail 212 disposed at the other side of the base 110 to linearly move the gantry unit 130 along the first direction 10.

[0092] An inkjet head module 150 is used to eject droplets such as ink onto a substrate S. Such an inkjet head module 150 can be disposed on a side surface of the gantry unit 130 to be supported by the gantry unit 130.

[0093] The inkjet head module 150 can be linearly moved along the length direction of the gantry unit 130, i.e., the second direction 20, by a head moving unit 160, and can also be linearly moved along the third direction 30. In addition, the inkjet head module 150 can also be rotated about an axis parallel to the third direction 30 with respect to the head moving unit 160.

[0094] A plurality of inkjet head modules 150 can be disposed on the gantry unit 130. For example, the inkjet head modules 150 can be disposed as three, i.e., a first head unit 151, a second head unit 152, and a third head unit 153. For example, the plurality of inkjet head modules 150 can be combined to the gantry unit 130 in a row side by side along the second direction 20.

[0095] The inkjet head module 150 can be configured to include a plurality of nozzles (not shown) that eject droplets, and a nozzle plate (not shown) in which the plurality of nozzles are formed. For example, 128 nozzles or 256 nozzles can be provided in the inkjet head module 150.

[0096] A piezoelectric element corresponding to the number of the plurality of nozzles can be provided in the inkjet head module 150. By controlling the voltage applied to the piezoelectric element, the amount of droplet ejection of the plurality of nozzles can be adjusted independently, respectively.

[0097] The head moving unit 160 serves to linearly move the inkjet head module 150. Such a head moving unit 160 can be provided inside the printing apparatus 100 corresponding to the number of the inkjet head modules 150. For example, when the inkjet head module 150 is provided as three of a first head unit 151, a second head unit 152, and a third head unit 153, the head moving unit 160 can also be provided as three.

[0098] In addition, the head moving unit 160 can also be provided as a single, and in this case, the inkjet head modules 150 can be moved together at the same time, rather than individually.

[0099] The droplet ejection amount measuring unit 170 serves to measure the amount of droplet ejection of the inkjet head module 150. Such a droplet ejection amount measuring unit 170 can be disposed on one side of the substrate support unit 120 on the base 110.

[0100] The droplet ejection amount measuring unit 170 can measure the amount of droplet ejection from all the nozzles for each inkjet head module 150. Through the measurement of the amount of droplet ejection of the inkjet head module 150, it can be macroscopically confirmed whether all the nozzles of the inkjet head module 150 are abnormal. That is, if the amount of droplet ejection of the inkjet head module 150 exceeds a reference value, it can be known that at least one of the inkjet head modules 150 is abnormal.

[0101] The inkjet head module 150 can be moved by the gantry moving unit 140 and the head moving unit 160 in the first direction 10 and the second direction 20 to be positioned above the droplet ejection amount measuring unit 170. The head moving unit 160 can move the inkjet head module 150 in the third direction 30 to adjust the distance in the up-down direction between the inkjet head module 150 and the droplet ejection amount measuring unit 170.

[0102] The nozzle inspection unit 180 serves to confirm whether a single nozzle provided in the inkjet head module 150 is abnormal. For example, such a nozzle inspection unit 180 can confirm whether a single nozzle is abnormal through optical inspection.

[0103] When the result of macroscopically confirming whether the nozzle has an abnormality in the droplet ejection measurement unit 170 is that a non-specific nozzle has an abnormality, the nozzle inspection unit 180 can inspect all the nozzles while confirming whether a single nozzle has an abnormality.

[0104] The nozzle inspection unit 180 can be disposed on one side of the substrate support unit 120 on the base 110. The inkjet head module 150 can be moved along the first direction 10 and the second direction 20 by the gantry moving unit 140 and the head moving unit 160 to be positioned at an upper portion of the nozzle inspection unit 180. The head moving unit 160 can move the inkjet head module 150 along the third direction 30 to adjust a distance in a vertical direction between the inkjet head module 150 and the nozzle inspection unit 180.

[0105] In addition, the printing apparatus 100 can further include a droplet supply device 190.

[0106] The droplet supply device 190 can be disposed at an upper portion and a side portion of the gantry unit 130. Such a droplet supply device 190 can include a droplet supply module 191 and a pressure adjustment module 192.

[0107] The droplet supply module 191 serves to supply a liquid such as ink to the inkjet head module 150. Such a droplet supply module 191 can supply the liquid to the inkjet head module 150 after receiving the liquid from a storage tank (not shown) that stores the liquid.

[0108] The pressure adjustment module 192 serves to adjust a pressure of the droplet supply module 191. Such a pressure adjustment module 192 can provide a positive pressure or a negative pressure to the droplet supply module 191 to adjust the pressure of the droplet supply module 191.

[0109] In addition, the droplet supply module 191 and the pressure adjustment module 192 can be combined to the gantry unit 130.

[0110] In order to improve mechanical errors (e.g., translational errors, rotational errors, etc.) of the printing apparatus 100, it is necessary to impact correct the substrate according to a position. For this, the substrate handling system can have an ink impact point correction device.

[0111] The ink impact point correction device can automatically measure and correct an impact point of ink to cope with mechanical defects of a printing apparatus. Ink impact errors can occur due to mechanical defects of a conveyance system (e.g., the gantry unit 130). In the present embodiment, although there are mechanical defects of the conveyance system, it is possible to improve printing accuracy of the substrate by correcting the above errors. The ink impact point correction device can be applied to correction for non-orthogonality mismatch in a coordinate system.

[0112] Hereinafter, the ink impact point correction device will be described.

[0113] Figure 3 is a conceptual diagram schematically showing an internal configuration of an ink impact point correction device according to an embodiment of the present application.

[0114] According to Figure 3 , the ink impact point correction device 300 can be configured to include an identification section 310, a correction section 320, and a control section 330. Such an ink impact point correction device 300 can be configured to further include a power supply section 340 and a selection section 350. In this regard, a description will be made later with reference to Figure 24 .

[0115] When ink is ejected by the inkjet head module 150 to a plurality of positions on a substrate S (for example, a glass substrate for manufacturing a display device), the identification section 310 performs a function of obtaining position information about an impact point of ink from each ink ejection position. To this end, the identification section 310 can identify the impact point of ink from each ink ejection position.

[0116] The identification section 310 can be implemented as a vision camera or the like having an identification function. At this time, the control section 330 can be implemented as a computer device (or software loaded in the computer device) that controls the operation of such an identification section 310. Further, the identification section 310 can also be understood as a concept including a vision camera and a computer device that controls the operation of the vision camera.

[0117] The plurality of positions formed on the substrate S are used to accurately perform RGB patterning on the substrate S. The inkjet head module 150 can eject ink to the plurality of positions.

[0118] The plurality of positions can be formed in a dummy area in which no cell is formed on the substrate S. For example, as Figure 4 shown, in a case where there are two cell areas 411, 412 on the substrate S, nine positions 431 to 439 can be formed in a dummy area 420 other than the two cell areas 411, 412. Here, the cell areas 411, 412 refer to areas in which RGB patterning is performed. Figure 4 is a first example diagram for explaining an arrangement structure of a plurality of ink ejection positions formed on a substrate according to an embodiment of the present application.

[0119] A part of the plurality of positions can be formed adjacent to an align mark 440. For example, as Figure 4 shown, a first position 431, a second position 432, a third position 433, a seventh position 437, an eighth position 438, a ninth position 439, and the like can be formed adjacent to the align mark 440, and a fourth position 434, a fifth position 435, a sixth position 436, and the like can be formed not adjacent to the align mark 440.

[0120] However, the present embodiment is not limited thereto. The plurality of positions can also be all formed adjacent to the alignment mark 440. For example, as shown in FIG. 4B, a first position 431, a second position 432, a third position 433, a fourth position 434, a fifth position 435, a sixth position 436, and the like can be formed adjacent to the alignment mark 440. Figure 5 Figure 5 is a second example diagram for explaining an arrangement structure of a plurality of ink ejection positions formed on a substrate according to one embodiment of the present application.

[0121] As shown in FIG. 4A, a plurality of positions can be formed on the substrate S before the unit regions 411, 412 are formed. In this case, the plurality of positions can be formed on a region adjacent to the alignment mark 440. The plurality of positions can also be formed by taking the alignment mark 440 into consideration. For example, the plurality of positions can be formed on the unit regions 411, 412 and a region adjacent to the alignment mark 440. Figure 6 Figure 6 is a first example diagram for explaining a formation method of a plurality of ink ejection positions formed on a substrate according to one embodiment of the present application.

[0122] However, the present embodiment is not limited thereto. As shown in FIG. 4B, the plurality of positions can also be formed on the substrate S before the unit regions 411, 412 are formed. In this case, the plurality of positions can be formed on a region adjacent to the alignment mark 440. Figure 7 Figure 7 is a second example diagram for explaining a formation method of a plurality of ink ejection positions formed on a substrate according to one embodiment of the present application.

[0123] Further, in the example of FIG. 4A, two unit regions 411, 412 are explained as being formed on the substrate S. However, the present embodiment is not limited thereto. One unit region can be formed on the substrate S, or three or more unit regions can also be formed. Figures 4 to 7 In order for the recognition part 310 to recognize the impact point of the ink from each ink ejection position, the ink ejection head module 150 needs to eject the ink to each position on the substrate S. In the present embodiment, the ink ejection head module 150 can eject the ink to a plurality of positions on the substrate S before performing the printing process on the two unit regions 411, 412. In the present embodiment, the effect of improving the printing accuracy of the substrate can be achieved by this method.

[0124] When recognizing the impact point of the ink from each ink ejection position, the recognition part 310 can use the coordinate pattern provided at each ink ejection position to recognize the impact point of the ink.

[0125]

[0126] ​​​​The coordinate pattern can be realized as a coordinate system constituted by an X-axis coordinate value and a Y-axis coordinate value. For example, as shown in Figure 8 the coordinate pattern can be realized as an orthogonal coordinate system. Figure 8 is an example diagram of a coordinate pattern provided at a plurality of positions on a substrate according to an embodiment of the present application.

[0127] The recognition section 310 can recognize the impact points of the ink at the ink ejection positions arranged in a column in the first direction 10 among the plurality of positions on the substrate S. At this time, the recognition section 310 can recognize the impact points of the ink at all of the positions arranged in a column in the first direction 10 as the ink ejection positions.

[0128] For example, as shown in Figure 9 the recognition section 310 can recognize the impact points of the ink at three positions (the first position 431 to the third position 433, or the fourth position 434 to the sixth position 436, or the seventh position 437 to the ninth position 439) arranged in a column in the first direction 10 as the ink ejection positions in a case where the first position 431 to the ninth position 439 are formed on the substrate S. Figure 9 is a first example diagram for explaining the function of the recognition section constituting the ink impact point correction device according to an embodiment of the present application.

[0129] However, the present embodiment is not limited thereto. The recognition section 310 can also recognize the impact points of the ink at a part of the positions arranged in a column in the first direction 10 as the ink ejection positions.

[0130] For example, as shown in Figure 10 the recognition section 310 can recognize the impact points of the ink at two positions (the first position 431 and the third position 433, or the fourth position 434 and the sixth position 436, or the seventh position 437 and the ninth position 439) located at the periphery among the three positions arranged in a column in the first direction 10 as the ink ejection positions. Figure 10 is a second example diagram for explaining the function of the recognition section constituting the ink impact point correction device according to an embodiment of the present application.

[0131] The recognition section 310 can also recognize the impact points of the ink at the ink ejection positions arranged in a column in the second direction 20 among the plurality of positions on the substrate S. In this case, the recognition section 310 can recognize the impact points of the ink at all of the positions arranged in a column in the second direction 20 as the ink ejection positions.

[0132] For example, as shown in Figure 11As shown, in a case where the first to ninth positions 431 to 439 are formed on the substrate S, the recognition section 310 can recognize the impact point of the ink as the ink ejection position from among the three positions (the first position 431 and the fourth position 434 and the seventh position 437, or the second position 432 and the fifth position 435 and the eighth position 438, or the third position 433 and the sixth position 436 and the ninth position 439) arranged in a column in the second direction 20. Figure 11 is a third example diagram for explaining the function of the recognition section constituting the ink impact point correction device according to an embodiment of the present application.

[0133] However, the present embodiment is not limited thereto. The recognition section 310 can also recognize the impact point of the ink as the ink ejection position from among a part of the positions arranged in a column in the second direction 20.

[0134] For example, as shown, the recognition section 310 can recognize the impact point of the ink as the ink ejection position from among the two positions (the first position 431 and the seventh position 437, or the second position 432 and the eighth position 438, or the third position 433 and the ninth position 439) arranged in a column in the second direction 20. Figure 12 Figure 12 is a fourth example diagram for explaining the function of the recognition section constituting the ink impact point correction device according to an embodiment of the present application.

[0135] The recognition section 310 can recognize the impact point of the ink at the predetermined number of ink ejection positions among the plurality of positions on the substrate S. In this case, the recognition section 310 can recognize the impact point of the ink from the ink ejection positions selected in consideration of the moving direction of the substrate S.

[0136] For example, as shown, in a case where the moving direction of the substrate S is the second direction 20, the recognition section 310 can recognize the impact point of the ink as the ink ejection position from among the plurality of positions arranged in a column in the first direction 10 perpendicular to the second direction 20. Figure 13

[0137] Further, the recognition section 310 can recognize the impact point of the ink as the ink ejection position from among the plurality of positions formed at the trailing end portion of the moving substrate S. That is, the recognition section 310 can recognize the impact point of the ink as the ink ejection position from among the three positions (i.e., the first to third positions 431 to 433) arranged in a column in the first direction 10 and formed at the trailing end portion of the substrate S. Figure 13 is a fifth example diagram for explaining the function of the recognition section constituting the ink impact point correction device according to an embodiment of the present application.

[0138] ​​As described above, the identification unit 310 can identify the ink impact point by using a portion of the multiple locations formed on the substrate S as ink ejection locations. However, this embodiment is not limited to this. The identification unit 310 can also identify the ink impact point by using all of the multiple locations formed on the substrate S as ink ejection locations.

[0139] When all of the multiple locations formed on the substrate S are identified as ink ejection locations, the identification unit 310 can consider the first direction 10 and the second direction 20 in the order of the first direction 10 and the second direction 20 to identify all of the multiple locations as ink ejection locations.

[0140] For example, such as Figure 14 As shown, when multiple positions are identified as ink ejection positions in the order of the first direction 10 and the second direction 20, the identification unit 310 can identify the three positions (first position 431 to third position 433) arranged in a row along the first direction 10 as ink ejection positions for the first time in sequence. Then, it moves along the second direction 20 to identify the other three positions (fourth position 434 to sixth position 436) arranged in a row along the first direction 10 as ink ejection positions for the second time in sequence. And it moves along the second direction 20 again to identify the other three positions (seventh position 437 to ninth position 439) arranged in a row along the first direction 10 as ink ejection positions in sequence for the last time.

[0141] In this embodiment, the identification unit 310 may also identify all the multiple positions as ink ejection positions in the order of the seventh position 437 to the ninth position 439, the fourth position 434 to the sixth position 436, and the first position 431 to the third position 433. Figure 14 This is a sixth example diagram illustrating the function of the identification section constituting an ink impact point correction device according to an embodiment of the present invention.

[0142] When all multiple locations formed on the substrate S are identified as ink ejection locations, the identification unit 310 can also consider the first direction 10 and the second direction 20 in the order of the second direction 20 and the first direction 10, so as to identify all multiple locations as ink ejection locations.

[0143] For example, such as Figure 15As shown, when multiple positions are identified as ink ejection positions in the order of the second direction 20 and the first direction 10, the identification unit 310 can identify the three positions (first position 431, fourth position 434 and seventh position 437) arranged in a row along the second direction 20 as ink ejection positions for the first time in sequence. Then, it moves along the first direction 10 to identify the other three positions (second position 432, fifth position 435 and eighth position 438) arranged in a row along the second direction 20 as ink ejection positions for the second time in sequence. And it moves along the first direction 10 again to finally identify the other three positions (third position 433, sixth position 436 and ninth position 439) arranged in a row along the second direction 20 as ink ejection positions in sequence.

[0144] In this embodiment, the identification unit 310 may also identify all the multiple positions as ink ejection positions in the order of the third position 433, the sixth position 436, the ninth position 439, the second position 432, the fifth position 435, the eighth position 438, the first position 431, the fourth position 434, and the seventh position 437. Figure 15 This is a seventh example diagram illustrating the function of the identification section constituting an ink impact point correction device according to an embodiment of the present invention.

[0145] Furthermore, when multiple locations formed on the substrate S are all used as ink ejection locations to identify ink impact points, the identification unit 310 can also randomly use multiple locations as ink ejection locations to identify ink impact points.

[0146] As described above, the identification unit 310 can move along at least one of the first direction 10 and the second direction 20 to identify multiple ink ejection positions. Hereinafter, the case in which the identification unit 310 moves along the first direction 10 to identify multiple ink ejection positions will be described as an example.

[0147] As described above, the recognition unit 310 can identify the ink impact point using coordinate patterns set at each ink ejection position. When the inkjet head module 150 ejects ink onto the coordinate pattern set at the ink ejection position, the recognition unit 310 can obtain the position information of the ink impact point based on the position information of the ink droplets on the coordinate pattern.

[0148] For example, such as Figure 16 As shown in the left-hand diagram, when ink droplets 520 are sprayed onto the coordinate pattern 510, as... Figure 16 As shown in the right-hand diagram, the recognition unit 310 can identify the ink impact point as having an X-axis coordinate value of 1 and a Y-axis coordinate value of 1. In this case, the recognition unit 310 can obtain the position information of (1, 1) as the ink impact point. Figure 16is a eighth example diagram for explaining a function of an identification section constituting an ink impact point correction device according to an embodiment of the present application.

[0149] Referring again to Figure 3 an explanation will be given.

[0150] When the position information about the impact points of the ink is obtained by the identification section 310, the correction section 320 performs a function of correcting the position of the ink ejection position based on this information. At this time, the correction section 320 can correct the position of the ink ejection position in real time and / or automatically based on the position information of the impact points of the ink.

[0151] For example, as Figure 17 shown, in a case where the ink droplets 521, 522, 523 are sequentially ejected on the coordinate patterns 511, 512, 513 of the first position 431, the second position 432, and the third position 433, the identification section 310 can obtain the position information of the first ink droplet 521, the position information of the second ink droplet 522, and the position information of the third ink droplet 523 as (0, 0), (1, 1), and (2, 2), respectively. Then, the correction section 320 can measure the slope by performing linear analysis on the data obtained by the identification section 310, and can correct the position of the ink ejection position by the automatic correction pattern scheme. Figure 17 is a first example diagram for explaining a function of a correction section constituting an ink impact point correction device according to an embodiment of the present application.

[0152] As Figure 17 shown, in a case where the slope of the line segment connecting the position information of the three ink droplets 521, 522, 523 on the coordinate patterns 511, 512, 513 is measured, when (0, 0), (1, 1), and (2, 2) are obtained as the position information of the first ink droplet 521, the position information of the second ink droplet 522, and the position information of the third ink droplet 523, respectively, as Figure 18 shown, the correction section 320 can measure the slope of the line segment connecting the position information of the three ink droplets 521, 522, 523 on the coordinate patterns 511, 512, 513. Figure 18 is a second example diagram for explaining a function of a correction section constituting an ink impact point correction device according to an embodiment of the present application.

[0153] Further, in a case where the position of the ink ejection position is corrected by the automatic correction pattern scheme, as Figure 18 shown, when the slope of the line segment connecting the position information of the three ink droplets 521, 522, 523 on the coordinate patterns 511, 512, 513 is measured, as Figure 19As shown, the correction section 320 can correct the positions of the ink ejection positions so that the slope of the line segment is obtained in which the position information of the three ink droplets 521, 522, 523 is (0, 0), (1, 0), and (2, 0), respectively. The correction section 320 can also correct the positions of the ink ejection positions so that the position information of the three ink droplets 521, 522, 523 is all (0, 0). Figure 19 is a third example diagram for explaining the function of the correction section constituting the ink impact point correction apparatus according to one embodiment of the present application.

[0154] The correction section 320 can be implemented as software (or a computer device executing such software) capable of determining the ejection time of the ink to correct the positions of the ink ejection positions. However, the present embodiment is not limited thereto. The correction section 320 can also be implemented as a device (e.g., a jetting drive) that ejects the ink at a determined ejection time according to the control of the computer device.

[0155] Further, the correction section 320 can also be implemented as a device (e.g., a shaft movement control section) that corrects the positions of the ink ejection positions by controlling the positions and postures of the members. In this case, the correction section 320 can correct the ink ejection positions by controlling the positions and postures of the gantry unit 130 or the inkjet head module 150. Further, the correction section 320 can also correct the positions of the ink ejection positions by controlling the positions and postures of the substrate S.

[0156] Further, in the case where the correction section 320 is implemented as a jetting drive, a shaft movement control section, or the like, the control section 330 can be implemented as software or a computer device executing such software. However, the present embodiment is not limited thereto, and the correction section 320 can include not only a jetting drive, a shaft movement control section, or the like, but also software (i.e., capable of determining the ejection time of the ink to correct the positions of the ink ejection positions) that controls the jetting drive, the shaft movement control section, or the like.

[0157] As described above, although one unit region can be formed on the substrate S, a plurality of unit regions can also be formed. Hereinafter, how the correction section 320 corrects the positions of the ink ejection positions will be described in the case where a plurality of unit regions are formed on the substrate S.

[0158] Hereinafter, a case where two unit regions, i.e., a first unit region 411 and a second unit region 412, are formed on the substrate S, and a first position 431, a second position 432, and a third position 433 are formed as ink ejection positions along the first direction 10 will be described as an example.

[0159] As described above, the first position 431 refers to the ink ejection position formed on the periphery of the second unit region 412, that is, between one boundary of the substrate S and the second unit region 412. Furthermore, the second position 432 refers to the ink ejection position formed between the first unit region 411 and the second unit region 412, and the third position 433 refers to the ink ejection position formed on the periphery of the first unit region 411, that is, between the other boundary of the substrate S and the first unit region 411.

[0160] The correction unit 320 can correct the position of the ink ejection location based on which of the common mode and the distinguishing mode applies to the two unit areas 411 and 412.

[0161] The common mode refers to the glass printing mode. When a first unit region 411 and a second unit region 412 are formed on the substrate S, and a common mode is applied to both unit regions 411 and 412, the first unit region 411 and the second unit region 412 can be patterned in RGB in the same manner. For example, as... Figure 20 As shown, a common pattern can be applied when panels of the same size are formed in the first unit region 411 and the second unit region 412. Figure 20 This is an example diagram illustrating a common pattern applicable to the patterning of unit regions according to an embodiment of the present invention.

[0162] The differentiation mode refers to the printing mode of the differentiation units. When a first unit region 411 and a second unit region 412 are formed on the substrate S, and a differentiation mode is applied to the two unit regions 411 and 412, the first unit region 411 and the second unit region 412 can be patterned in RGB in different ways. For example, as... Figure 21 As shown, a differentiation mode can be applied when panels of different sizes are formed in the first unit area 411 and the second unit area 412. Figure 21 This is an example diagram illustrating a patterned differentiation pattern applicable to a unit region according to an embodiment of the present invention.

[0163] like Figure 21 As shown in the example, a differentiation mode can be considered when a large-area application is applied in one cell region compared to either cell region. However, this embodiment is not limited to this. A differentiation mode can also be considered when an application with large deformation (e.g., an application with large thermal deformation) is applied in at least one of the two cell regions, or when there are some changes (e.g., alignment changes, etc.) between the two cell regions.

[0164] In a case where the common mode is applied to the two unit areas 411, 412, the correction section 320 can automatically and / or in real time correct the pattern scheme to be commonly applied to the two unit areas 411, 412 based on the position information of the ink droplets of the plurality of ink ejection positions formed at the periphery of the two unit areas 411, 412.

[0165] For example, in a case where the position information of the first ink droplet 521 that hits the first position 431 is (0, 0), the position information of the second ink droplet 522 that hits the second position 432 is (1, 1), and the position information of the third ink droplet 523 that hits the third position 433 is (2, 2), the correction section 320 can correct the positions of the respective ink ejection positions based on the position information of the first ink droplet 521 and the position information of the third ink droplet 523 to correct the pattern scheme to be commonly applied to the two unit areas 411, 412.

[0166] That is, as shown in FIG. 4B, the correction section 320 can correct the positions of the respective ink ejection positions so that the slope of the line segment in which the position information of the first ink droplet 521 and the position information of the third ink droplet 523 are (0, 0) and (2, 0), respectively, is obtained to correct the pattern scheme to be commonly applied to the two unit areas 411, 412. Figure 22 Figure 22 is a fourth exemplary diagram for explaining a function of the correction section constituting an ink hit point correction apparatus according to an embodiment of the present application.

[0167] In a case where the common mode is applied to the two unit areas 411, 412, the correction section 320 can automatically and / or in real time correct the pattern scheme to be commonly applied to the two unit areas 411, 412 based on the position information of the ink droplets of the plurality of ink ejection positions formed at the periphery of the two unit areas 411, 412.

[0168] For example, in a case where the position information of the first ink droplet 521 that hits the first position 431 is (0, 0), the position information of the second ink droplet 522 that hits the second position 432 is (1, 1), and the position information of the third ink droplet 523 that hits the third position 433 is (2, 1.5), the correction section 320 can correct the positions of the respective ink ejection positions based on the position information of the first ink droplet 521, the position information of the second ink droplet 522, and the position information of the third ink droplet 523 to correct the pattern scheme to be commonly applied to the two unit areas 411, 412.

[0169] That is, as shown in FIG. 4B, the correction section 320 can correct the positions of the respective ink ejection positions so that the slope of the line segment in which the position information of the first ink droplet 521 and the position information of the third ink droplet 523 are (0, 0) and (2, 0), respectively, is obtained to correct the pattern scheme to be commonly applied to the two unit areas 411, 412. Figure 23 ​As shown, the correction section 320 can correct the positions of the respective ink ejection positions so that the slope of the line segment in which the position information of the first ink droplet 521 and the second ink droplet 522 is (0, 0) and (1, 0), respectively, is obtained to correct the pattern scheme to be applied to the second cell region 412 for the first time, and can correct the positions of the respective ink ejection positions so that the slope of the line segment in which the position information of the second ink droplet 522 and the third ink droplet 523 is (1, 0) and (2, 0), respectively, is obtained to correct the pattern scheme to be applied to the first cell region 411 for the second time. Figure 23 is a fifth example diagram for explaining the function of the correction section constituting the ink impact point correction apparatus according to one embodiment of the present application.

[0170] If the correction section 320 corrects the positions of the ink ejection positions using either of the common mode and the differentiation mode, a Multi Model Glass (MMG) can be dealt with according to the change in application. Here, the MMG refers to a case where different sizes of panels (for example, a 65-inch panel and a 55-inch panel) are produced in the two cell regions 411, 412.

[0171] In the present embodiment, since the coordinate pattern can be used in the virtual region of the mass-produced glass, there is an advantage that the scheme correction can be performed at any time during mass production. For example, there is an advantage that such scheme inspection and correction can be performed on the first glass in units of a cassette (for example, 20 glasses).

[0172] The above explains how the correction section 320 corrects the positions of the ink ejection positions when two cell regions are formed on the substrate S. However, in the present embodiment, three or more cell regions can also be formed on the substrate S.

[0173] In this case, the correction section 320 can take two adjacent cell regions as the first cell region 411 and the second cell region 412 and take the ink ejection positions formed at the periphery of the two adjacent cell regions and between the two adjacent cell regions as the first position 431 to the third position 433 to correct the pattern scheme to be commonly applied to the two adjacent cell regions according to either of the common mode and the differentiation mode, or correct the pattern scheme to be differentially applied to the two adjacent cell regions.

[0174] The correction section 320 can correct the pattern scheme of the cell region formed on the substrate S in the X-axis direction based on information about a plurality of ink ejection positions arranged in a line along the first direction 10.

[0175] However, the present embodiment is not limited to this. The correction section 320 can also correct the pattern scheme of the unit region formed on the substrate S in the Y-axis direction based on information about the plurality of ink ejection positions arranged in a row in the second direction 20.

[0176] Further, the correction section 320 can correct the pattern scheme of the unit region formed on the substrate S in the X-axis direction based on not only the information about the plurality of ink ejection positions arranged in a row in the first direction 10 and the information about the plurality of ink ejection positions arranged in a row in the second direction 20, but also in the Y-axis direction and the θ-axis (slope) direction.

[0177] Reference will again be made to Figure 3 for explanation.

[0178] The control section 330 has a function of controlling all operations of the recognition section 310 and the correction section 320 constituting the ink impact point correction apparatus 300. Such a control section 330 can be realized as a computer apparatus (or software loaded in a computer apparatus).

[0179] In the present embodiment, the ink impact point correction apparatus 300 can also be realized as a computer apparatus. In this case, the recognition section 310 can be loaded as software capable of controlling the vision camera in the computer apparatus, and the correction section 320 can be loaded as software capable of controlling the ejection driver, the axis movement control section, etc. in the computer apparatus.

[0180] As shown in Figure 24 , the ink impact point correction apparatus 300 can be configured to further include a power section 340 and a selection section 350. Figure 24 is a conceptual diagram schematically showing an internal configuration of an ink impact point correction apparatus according to another embodiment of the present application.

[0181] The power section 340 performs a function of supplying power to each module constituting the ink impact point correction apparatus 300.

[0182] The selection section 350 performs a function of selecting an ink ejection position of ink ejection on the substrate S. When the ink ejection position is selected by the selection section 350, the gantry unit 130 can be moved on the base 110 so that the inkjet head module 150 is located at the selected position on the substrate S, and the inkjet head module 150 can eject ink to the corresponding position. Then, the recognition section 310 and the correction section 320 can perform the functions explained above with respect to the ink ejection position selected by the selection section 350.

[0183] The selection unit 350 can select multiple ink ejection positions on the substrate S. At this time, the inkjet head module 150 can eject ink to the corresponding position whenever it reaches each ink ejection position on the substrate S (i.e., the first position to the nth position (here, n is a natural number greater than 2)).

[0184] The selection unit 350 can be implemented as software loaded in a computer device. Alternatively, the selection unit 350 can be a computer device that executes the software.

[0185] Reference above Figures 3 to 24 Various embodiments of the ink impact point correction device 300 according to the present invention have been described. The ink impact point correction device 300 uses a pattern on a substrate displaying a coordinate system to measure and correct ink impact points in real time / automatically. This ink impact point correction device 300 is applicable to various pattern printing equipment, including inkjet equipment.

[0186] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art should understand that the present invention can be implemented in other specific forms without changing its technical concept or essential features. Therefore, the above embodiments should be understood as exemplary in all respects, and not restrictive.

Claims

1. An ink impact point correction device, comprising: The recognition unit obtains information related to the impact point of the ink from multiple locations on the substrate; as well as The correction unit corrects the position of the ink ejection point on the substrate based on information related to the impact point. Among them, a coordinate pattern in the form of a coordinate system is formed at the multiple locations; When there are multiple unit regions on the substrate, the correction unit corrects the position of the ink ejection location based on the relationship information between two adjacent unit regions. The correction unit uses at least one of the following information as the relationship information: information about whether an application of the same size is provided in the two adjacent unit regions, information about whether an application that undergoes thermal deformation is provided in the two adjacent unit regions, and information about whether there is an alignment change between the two adjacent unit regions.

2. The ink impact point correction device according to claim 1, wherein, When an ink droplet is sprayed onto the coordinate pattern, the recognition unit identifies the coordinates of the ink droplet to obtain information related to the impact point.

3. The ink impact point correction device according to claim 1, wherein, When the coordinates of multiple ink droplets are obtained as information related to the impact point, the correction unit calculates the slope based on the coordinates of the multiple ink droplets and corrects the position of the ink ejection location based on the slope.

4. The ink impact point correction device according to claim 1, wherein, When the coordinates of multiple ink droplets are obtained as information related to the impact point, the correction unit corrects the position of the ink ejection location so that the coordinate value of at least one coordinate axis in the coordinates of the multiple ink droplets is 0.

5. The ink impact point correction device according to claim 1, wherein, The correction unit corrects the position of the ink ejection location using either the first mode or the second mode, based on the relationship information between the two adjacent unit regions.

6. The ink impact point correction device according to claim 5, wherein, When the correction unit corrects a pattern scheme that is to be applied to the two adjacent unit areas, it uses the first mode to correct the position of the ink ejection location, or When the correction unit uses the first mode to correct the position of the ink ejection location, the recognition unit identifies the impact point from multiple locations located on the periphery of the two adjacent unit regions.

7. The ink impact point correction device according to claim 5, wherein, When correcting a pattern scheme applicable to two adjacent unit areas, the correction unit uses the second mode to correct the position of the ink ejection location, or When the correction unit uses the second mode to correct the position of the ink ejection location, the identification unit identifies the impact point from multiple locations located on the periphery of the two adjacent unit regions and at least one location located between the two adjacent unit regions.

8. The ink impact point correction device according to claim 1, wherein, The plurality of locations are formed in virtual regions on the substrate where no unit regions are formed.

9. The ink impact point correction device according to claim 8, wherein, The plurality of locations are formed in the virtual region before the unit region is formed on the substrate, or after the unit region is formed on the substrate, and in the virtual region. In the case where the unit region is formed in the virtual region before it is formed on the substrate, the plurality of positions are formed in the virtual region based on alignment marks formed on the substrate.

10. The ink impact point correction device according to claim 1, wherein, The identification unit identifies the impact point from the plurality of locations arranged in a row along at least one direction on the substrate to obtain information related to the impact point.

11. The ink impact point correction device according to claim 10, wherein, When the impact point is identified from the plurality of locations arranged in a row along at least one direction on the substrate, the identification unit identifies the impact point from two locations located on the periphery.

12. The ink impact point correction device according to claim 1, wherein, The plurality of positions are selected by taking into account the direction of movement of the substrate.

13. The ink impact point correction device according to claim 12, wherein, The positions arranged in a direction different from the direction of movement of the substrate are selected as the plurality of positions.

14. The ink impact point correction device according to claim 1, wherein, The identification unit identifies the impact point from the plurality of positions arranged in a row along at least two directions on the substrate, and The correction unit corrects the pattern scheme of the unit area to be applied to the substrate along at least two directions.

15. The ink impact point correction device according to claim 1, wherein, The correction unit corrects the position of the ink jetting position by controlling the time when the ink is jetted onto the substrate, or by correcting the position or posture of the device that jets the ink onto the substrate, or by correcting the position or posture of the substrate.

16. The ink impact point correction device according to claim 1, wherein, The correction unit corrects the position of the ink jetting location before performing RGB patterning on the substrate.

17. The ink impact point correction device according to claim 1, further comprising: The selection unit selects the position on the substrate where ink will be ejected.

18. An ink impact point correction device, comprising: The recognition unit obtains information related to the impact point of the ink from multiple locations on the substrate; as well as The correction unit corrects the position of the ink ejection point on the substrate based on information related to the impact point. In the case where multiple unit regions exist on the substrate, the correction unit corrects the position of the ink ejection location using either a first mode or a second mode based on the relationship information between two adjacent unit regions. Specifically, when correcting a pattern scheme that is to be applied to both adjacent unit areas, the correction unit uses the first mode to correct the position of the ink ejection location, and When correcting a pattern scheme applicable to two adjacent unit areas, the correction unit uses the second mode to correct the position of the ink ejection location; The correction unit uses at least one of the following information as the relational information: information about whether an application of the same size is set in the two adjacent unit regions, information about whether an application that undergoes thermal deformation is set in the two adjacent unit regions, and information about whether there is an alignment change between the two adjacent unit regions.

19. A substrate processing system, comprising: Substrate support unit, supporting the substrate; A gantry unit is movably mounted on the base plate; An inkjet head module is mounted on the gantry unit and sprays ink onto the substrate; as well as Ink impact point correction device, including: The recognition unit obtains information related to the ink impact points from multiple locations on the substrate; and The correction unit corrects the position of the ink ejection point on the substrate based on information related to the impact point. Among them, a coordinate pattern in the form of a coordinate system is formed at the multiple locations; When there are multiple unit regions on the substrate, the correction unit corrects the position of the ink ejection location based on the relationship information between two adjacent unit regions. The correction unit uses at least one of the following information as the relationship information: information about whether an application of the same size is provided in the two adjacent unit regions, information about whether an application that undergoes thermal deformation is provided in the two adjacent unit regions, and information about whether there is an alignment change between the two adjacent unit regions.

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