Apparatus for transporting substrates, and apparatus and methods for processing substrates

Abstract

The present disclosure provides an apparatus for transporting substrates, and an apparatus and method for processing substrates. The apparatus for processing substrates includes a first process chamber to perform a liquid treatment process on the substrate; a second process chamber to perform a drying treatment process on the substrate that was liquid treated in the first process chamber; a first hand to introduce the substrate into the first process chamber prior to performing the liquid treatment process; a second hand to extract the substrate from the first process chamber after performing the liquid treatment process and to introduce the substrate into the second process chamber; and a third hand to extract the substrate from the second process chamber after performing the drying treatment process.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2020-0084891, filed with the Korean Intellectual Property Office on July 9, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of this disclosure described herein relate to apparatus for transmitting substrates, and apparatus and methods for processing substrates. Background Technology

[0004] Typically, integrated circuit devices, such as semiconductor devices, can be manufactured by repeatedly performing a series of unit processes on a semiconductor substrate used as a substrate. For example, circuit patterns constituting integrated circuit devices can be formed on the substrate by performing unit processes such as deposition, photolithography, etching, cleaning, and drying.

[0005] In a single-unit process, etching or cleaning can be performed using a single-type apparatus for processing a single substrate and a batch-type apparatus for processing multiple substrates simultaneously. In particular, a single-type apparatus can process a substrate by supplying an etching solution, cleaning solution, rinsing solution, or drying gas to the substrate while it is rotating.

[0006] However, recently, as the linewidth of circuit patterns has decreased, it has become increasingly difficult to apply spin drying methods that involve rotating the substrate at high speeds. This is because the centrifugal force generated when rotating the substrate at high speeds can damage the delicate circuit patterns.

[0007] To address the aforementioned issues, supercritical fluids have recently been used as a drying method to replace high-speed rotating substrates. Specifically, the substrate is placed in a sealed pressure vessel, and a high-pressure supercritical fluid is injected into the pressure vessel, thereby drying the substrate by displacing the liquid on the substrate with the supercritical fluid.

[0008] When applying a drying method, the apparatus for processing the substrate may include a first module for performing an etching process or a cleaning process and a second module for drying the substrate. As the substrate moves from the first module to the second module, it is transferred in a state where a wetting solution is coated on the surface of the substrate, thereby preventing the substrate from drying out naturally.

[0009] However, the substrate transfer robot used for transferring substrates must use either a hand for transferring pre-processed substrates or a hand for transferring post-processed substrates to transfer the substrates from the first module to the second module. In this process, the hand may be contaminated by the wetting solution coated on the substrate surface. Summary of the Invention

[0010] The present disclosure provides an apparatus for transporting a substrate, and an apparatus and a method for processing a substrate, capable of preventing contamination of the substrate in a process of transporting the substrate to clean the substrate.

[0011] The objects to be achieved in the present disclosure are not limited to the above-mentioned objects, and other objects not mentioned will be clearly understood by those skilled in the art.

[0012] According to an embodiment, an apparatus for processing a substrate can be provided, the apparatus including: a first process chamber performing a liquid treatment process on a substrate; a second process chamber performing a drying treatment process on the substrate liquid-treated in the first process chamber; a first hand introducing the substrate into the first process chamber before performing the liquid treatment process; a second hand taking out the substrate from the first process chamber after performing the liquid treatment process and introducing the substrate into the second process chamber; and a third hand taking out the substrate from the second process chamber after performing the drying treatment process.

[0013] Further, the first hand, the second hand, and the third hand can be provided to a main body of one substrate transport apparatus.

[0014] Further, the second process chamber can be a high-pressure chamber to perform the drying treatment process on the substrate liquid-treated in the first process chamber by using a supercritical fluid.

[0015] Further, the second hand can transport the substrate having a surface coated with a wetting solution in the first process chamber to the second process chamber.

[0016] Further, the wetting solution can include a volatile organic solvent, pure water, or a mixture of a surfactant and pure water.

[0017] Further, a controller controlling the substrate transport apparatus is further included. The controller can control the second hand to transport the substrate at a lower speed than the speed at which the first hand or the third hand transports the substrate.

[0018] Further, the third hand, the first hand, and the second hand can be disposed at different heights in a vertical direction on the main body.

[0019] Further, the first hand can be disposed above the second hand.

[0020] Further, the third hand can be disposed above the first hand.

[0021] In addition, the first hand and the third hand can be disposed in a first substrate transport apparatus, and the second hand can be disposed in a second substrate transport apparatus.

[0022] According to another embodiment, an apparatus for transferring a substrate can be provided, the apparatus including a main body, a first hand disposed on the main body, a second hand disposed on the main body, a third hand disposed on the main body, and a controller for controlling the drive of the first hand to the third hand. The controller can control the first hand to transfer the substrate before performing a liquid processing process, control the third hand to transfer the substrate after performing a drying process, and control the second hand to transfer a substrate having a surface coated with a wetting solution.

[0023] In addition, the controller can control the second hand to transfer the substrate at a lower speed than the first or third hand.

[0024] Furthermore, the third hand, the first hand, and the second hand can be set at different heights on the main body in the vertical direction.

[0025] In addition, the first hand can be positioned above the second hand and below the third hand.

[0026] According to another embodiment, an apparatus for processing a substrate can be provided, the apparatus comprising a process unit for processing the substrate, and an indexing unit including a loading port and an indexing robot, a substrate transfer container placed on the loading port having a substrate contained therein, and the indexing robot transferring the substrate between the substrate transfer container and the process unit. The process unit includes a transfer chamber having a substrate transfer device for transferring the substrate, and the transfer chamber being disposed adjacent to the indexing unit; a first process chamber disposed on a side of the transfer chamber for performing a liquid processing process on the substrate; and a second process chamber for performing a drying process on the substrate using a supercritical fluid after performing the liquid processing process. The substrate transfer device may include a first hand that transfers the substrate to the first process chamber before performing the liquid processing process; a second hand that transfers the substrate coated with a wetting solution in the first process chamber to the second process chamber; and a third hand that transfers the dried substrate in the second process chamber.

[0027] In addition, the first hand can be positioned above the second hand and below the third hand.

[0028] In addition, a controller for controlling the substrate transfer device is included. The controller can control the second hand to transfer the substrate at a lower speed than the first or third hand.

[0029] According to another embodiment, a method for processing a substrate can be provided, the method comprising: introducing the substrate into a first process chamber using a first hand; applying a wetting solution to the substrate in the first process chamber; transferring the substrate coated with the wetting solution to a second process chamber for drying the substrate using a second hand; performing a drying process on the substrate coated with the wetting solution in the second process chamber; and removing the substrate after the drying process from the second process chamber using a third hand.

[0030] In addition, the substrate can be dried using a supercritical fluid during the drying process.

[0031] In addition, the wetting solution may include volatile organic solvents (e.g., isopropanol, aqueous isopropanol solution), pure water, or a mixture of surfactant and pure water.

[0032] In addition, the drying process uses supercritical fluid or isopropanol (IPA) to dry the substrate.

[0033] In addition, the wetting solution includes a mixture of volatile organic solvents, pure water, surfactants, and pure water.

[0034] Furthermore, transmission via the substrate using the second hand can be performed at a lower speed than the speed at which the substrate is transmitted via the first or third hand.

[0035] Furthermore, the first hand, the second hand, and the third hand can be mounted on the main body of a substrate transfer device.

[0036] As described above, according to the embodiments of this disclosure, a separate hand for transferring and wetting the substrate can be provided to prevent the substrate from being contaminated during the transfer process.

[0037] The effects of this disclosure are not limited to those described above, and any other effects not mentioned herein can be clearly understood by those skilled in the art from this specification and the accompanying drawings. Attached Figure Description

[0038] Referring to the accompanying drawings, the above and other objects and features of this disclosure will become apparent from the detailed description of embodiments thereof.

[0039] Figure 1 A view of an apparatus for processing a substrate according to an embodiment of the present disclosure is shown schematically;

[0040] Figure 2 To illustrate, according to one embodiment, Figure 1 A view of the first process chamber;

[0041] Figure 3 To illustrate, according to one embodiment,Figure 1 A view of the second process chamber;

[0042] Figure 4 To show Figure 1 A view of the apparatus for transmitting the substrate shown;

[0043] Figure 5 A flowchart illustrating a method for processing a substrate according to an embodiment of the present disclosure is provided.

[0044] Figure 6 To show Figure 5 A view of the path through which the substrate is transported in a method for processing a substrate.

[0045] Figure 7 for Figure 1 A side view of the process unit shown; and

[0046] Figure 8 This is a view of a substrate processing unit of an apparatus for processing a substrate according to another embodiment. Detailed Implementation

[0047] The embodiments of this disclosure will be described in more detail below with reference to the accompanying drawings. The embodiments of this disclosure can be modified in various ways, and the scope of this disclosure should not be construed as limited to the embodiments described below. The embodiments of this disclosure are provided to provide a more complete description of the disclosure to those skilled in the art. Therefore, the shapes of the components in the drawings are exaggerated to emphasize a clearer description.

[0048] In the following, an apparatus for processing a substrate (hereinafter referred to as the "substrate processing apparatus") will be described in accordance with this disclosure.

[0049] The substrate processing apparatus can use a cleaning solution to perform a substrate cleaning process and use a supercritical fluid (or isopropanol (IPA)) as a process fluid to perform a substrate drying process.

[0050] In this context, substrate is a broad concept, encompassing all semiconductor devices, flat panel displays, and substrates including thin films with circuit patterns used in the manufacture of articles. For example, substrate "W" includes silicon wafers, glass substrates, and organic substrates.

[0051] Figure 1 A schematic diagram of a substrate processing apparatus according to an embodiment of the present disclosure is shown.

[0052] Reference Figure 1 The substrate processing apparatus 1000 may include an indexing unit 10 and a process processing unit 20.

[0053] According to one embodiment, the indexing unit 10 and the process processing unit 20 can be arranged in one direction. Hereinafter, the direction in which the indexing unit 10 and the process processing unit 20 are arranged is referred to as the first direction 92, the direction perpendicular to the first direction 92 when viewed from above is referred to as the second direction 94, and the direction perpendicular to the first direction 92 and the second direction 94 is referred to as the third direction 96.

[0054] Indexing unit 10 transfers substrate "W" from container 80, in which substrate "W" is contained, to process unit 20, where substrate "W" is processed and then contained in container 80. The longitudinal direction of indexing unit 10 is positioned in second direction 94. Indexing unit 10 has loading port 12 and index frame 14. Based on index frame 14, loading port 12 is positioned on the opposite side of process unit 20. Container 80, in which substrate "W" is contained, is placed on loading port 12. Multiple loading ports 12 can be provided, and multiple loading ports 12 can be arranged in second direction 94.

[0055] Container 80 may include a container 10 for sealing, such as a front open unified pod (FOUP). Container 80 may be placed on loading port 12 by means of a transfer unit (not shown) such as for overhead transport, an overhead conveyor, an automated guided vehicle, or a worker.

[0056] An indexing robot 120 is disposed inside an indexing frame 14. A guide rail 140, having a length direction defined in a second direction 94, can be disposed within the indexing frame 14, and the indexing robot 120 can be configured to be movable on the guide rail 140. The indexing robot 120 may include a hand 122, in which a substrate “W” is positioned, and the hand 122 can be configured to be movable forward and backward, rotatable about a third direction 96, and movable in the third direction 96. A plurality of hands 122 are spaced apart from each other in the vertical direction and are individually movable forward and backward.

[0057] The process unit 20 includes a buffer chamber 200, a transfer chamber 300, a first process chamber 400, and a second process chamber 500.

[0058] Buffer chamber 200 provides space for temporarily holding substrates "W" transported between indexing unit 10 and process unit 20. Buffer slots can be provided in buffer chamber 200. Substrate "W" is placed in the buffer slot. For example, indexing robot 120 can remove substrate "W" from container "80" and place substrate "W" in the buffer slot. Substrate transfer robot 320 of transfer chamber 300 can remove substrate "W" from the buffer slot and can transfer substrate "W" to first process chamber 400 or second process chamber 500. Multiple buffer slots can be provided in buffer chamber 200 to hold multiple substrates "W".

[0059] The transfer chamber 300 transfers substrate "W" between any two of the buffer chamber 200, the first process chamber 400, and the second process chamber 500, which are arranged around the transfer chamber 300. The transfer chamber 300 includes a substrate transfer robot 320 and a transfer rail 310. The substrate transfer robot 320 moves on the transfer rail 310 and can transfer substrate "W".

[0060] The first process chamber 400 and the second process chamber 500 can perform a cleaning process using process fluids. The cleaning process can be performed sequentially in the first process chamber 400 and the second process chamber 500. For example, a cleaning process can be performed in the first process chamber 300, and a drying process can be performed in the second process chamber 500 using a supercritical fluid (or IPA).

[0061] The first process chamber 400 and the second process chamber 500 can be disposed on the side surface of the transmission chamber 300. For example, the first process chamber 400 and the second process chamber 500 can be disposed on opposite sides facing the transmission chamber 300. Multiple first process chambers 400 and multiple second process chambers 500 can be disposed. The multiple process chambers 400 and 500 can be linearly aligned on the side surface of the transmission chamber 300.

[0062] The alignment of the first process chamber 400 and the second process chamber 500 is not limited to the above embodiment, and can be changed to take into account the footprint or process efficiency of the substrate processing apparatus 1000. The substrate processing apparatus 1000 can be controlled by a controller.

[0063] The transfer chamber 300 is configured such that its length direction is aligned with a first direction 92. The transfer chamber 300 includes a substrate transfer robot 320. A guide rail 310, which is positioned in the longitudinal direction of the first direction 92, can be disposed in the transfer chamber 300, and the substrate transfer robot 320 can be configured to be movable on the guide rail 340.

[0064] The substrate transfer robot 320 may include a hand 322 in which the substrate "W" is positioned, and the hand 322 may be configured to be movable forward and backward, rotatable about a third direction 96, and movable in the third direction 96. Multiple hands 322 are spaced apart from each other in the vertical direction and are individually movable forward and backward.

[0065] Figure 2 To illustrate, according to one embodiment, Figure 1 A view of the first process chamber.

[0066] Reference Figure 2 The first process chamber 400 includes a housing 410, a cup 420, a support unit 440, a liquid supply unit 460, and a lifting unit 480.

[0067] The housing 410 is essentially rectangular parallelepiped in shape. The cup 420, the support unit 440, and the liquid supply unit 460 can be disposed within the housing 410.

[0068] The cup 420 has a processing space with an open upper portion, in which the substrate "W" is processed with liquid. A support unit 440 is disposed in the processing space to support the substrate "W". A liquid supply unit 460 supplies liquid to the substrate "W" supported by the support unit 440. Various types of liquids can be provided and sequentially supplied to the substrate "W". A lifting unit 480 can adjust the relative height between the cup 420 and the support unit 440.

[0069] According to one embodiment, the cup 420 has a plurality of recovery tubs 422, 424, and 426. Each of the recovery tubs 422, 424, and 426 has a recovery space for recovering liquid used to process the substrate. Each of the recovery tubs 422, 424, and 426 is configured in an annular shape surrounding the support unit 440. When the liquid processing process is performed, the pre-processed liquid scattered by the rotation of the substrate “W” is introduced into the recovery space through the inlets 422a, 424a, and 426a of the recovery tubs 422, 424, and 426. According to one embodiment, the cup 420 has a first recovery tub 422, a second recovery tub 424, and a third recovery tub 426. The first recovery tub 422 is configured to surround the support unit 440, the second recovery tub 424 is configured to surround the first recovery tub 422, and the third recovery tub 426 is configured to surround the second recovery tub 424. The second inlet 424a, which introduces liquid into the second recycling bin 424, is positioned above the first inlet 422a, which introduces liquid into the first recycling bin 422, and the third inlet 426a, which introduces liquid into the third recycling bin 426, can be positioned above the second inlet 424a.

[0070] The support unit 440 includes a support plate 442 and a drive shaft 444. The upper surface of the support plate 442 may be substantially disk-shaped and may have a diameter larger than that of the substrate "W". A support pin 442a is provided at the center of the support plate 442 to support the rear surface of the substrate "W", and the support pin 442a has an upper end protruding from the support plate 442, such that the substrate "W" is spaced apart from the support plate 442 by a specific distance. The support plate 442 has a chuck pin 442b provided at its edge. The chuck pin 442b is configured to protrude upward from the support plate 442 to support the side of the substrate "W", thereby preventing the substrate "W" from separating from the support unit 440 when the substrate "W" rotates. The drive shaft 444 is driven by a driver 446 and connected to the center of the bottom surface of the substrate "W" to rotate the support plate 442 about its central axis.

[0071] According to one embodiment, the liquid supply unit 460 may include a first nozzle 462, a second nozzle 464, and a third nozzle 466. The first nozzle 462 supplies a first liquid to the substrate "W". The first liquid may be a liquid that removes residual film or foreign matter on the substrate "W". The second nozzle 464 supplies a second liquid to the substrate "W". The second liquid may be a liquid that is highly soluble in the third liquid. For example, the second liquid may be a liquid that dissolves in the third liquid better than the first liquid. The second liquid may be a liquid that neutralizes the first liquid supplied to the substrate "W". Furthermore, the second liquid may be a liquid that neutralizes the first liquid and may dissolve better in the third liquid than the first liquid. According to one embodiment, the second liquid may be pure water (deionized water; DIW). The third nozzle 466 supplies a third liquid to the substrate "W". The third liquid may be a liquid that dissolves better in a supercritical fluid used in the second process chamber 500. According to one embodiment, the third liquid (wetting solution) may be a volatile organic solvent, pure water, or a mixture of surfactant and pure water. The organic solvent may be isopropanol (IPA). According to one embodiment, the supercritical fluid can be carbon dioxide. The substrate is removed from the first process chamber while coated with a third solution (wetted state) and loaded into the second process chamber.

[0072] The first nozzle 462, the second nozzle 464, and the third nozzle 466 are supported on different arms 461, and the arms 461 can move independently. Alternatively, the first nozzle 462, the second nozzle 464, and the third nozzle 466 can be mounted on the same arm and move.

[0073] The lifting unit 480 moves the cup 420 vertically. The relative height between the cup 420 and the substrate "W" changes due to the vertical movement of the cup 420. Therefore, since the recovery tanks 422, 424, and 426 for recovering the pretreated liquid change according to the type of liquid supplied to the substrate "W", the liquid can be separated and recovered. As described above, the cup 420 can be fixedly mounted, and the lifting unit 480 can move the support unit 440 vertically.

[0074] Figure 3 This is a schematic illustration of an implementation scheme. Figure 1 A view of the second process chamber.

[0075] According to one embodiment, the second process chamber 500 removes liquid from the matrix "W" using a supercritical fluid. The second process chamber 500 may include a body 520, a substrate support structure 530, and a fluid supply unit 600.

[0076] The main body 520 provides a processing space 502 for performing a cleaning process. The main body 520 has an upper body 522 and a lower body 524, which are coupled together to provide the aforementioned processing space 502. The upper body 522 is positioned above the lower body 524. The position of the upper body 522 is fixed, and the lower body 524 can move up and down via a drive member 590, such as a cylinder. When the lower body 524 is spaced apart from the upper body 522, the processing space 502 is open. In this case, the substrate "W" is introduced or removed. When a drying process is performed, the lower body 524 contacts the upper body 522 to seal the processing space 502 from the outside.

[0077] The second process chamber 500 may include a heater 570. According to one embodiment, the heater 570 may be disposed inside the wall of the main body 520. The heater 570 heats the processing space 502 of the main body 520, such that the fluid supplied to the interior space of the main body 520 remains in a supercritical state. The interior of the processing space 502 has an atmosphere formed by the supercritical fluid.

[0078] The substrate support structure 530 supports the substrate "W" in the internal space 502 of the main body 520.

[0079] The fluid supply unit 600 supplies cleaning fluid to the processing space 502 of the main body 520. According to one embodiment, the cleaning fluid may be supplied to the processing space 502 in a supercritical state. Alternatively, the cleaning fluid may be supplied to the processing space 502 in a gaseous state and may undergo a phase transition to a supercritical state in the processing space 502.

[0080] According to one embodiment, the fluid supply unit 600 includes a fluid supply port 690, a supply line 620, and a valve 660. The fluid supply port 690 supplies supercritical fluid directly to the top surface of the substrate "W". The fluid supply port 690 is configured to connect to the upper body 522. The fluid supply unit 600 may also include a lower fluid supply port (not shown) connected to the lower body 524. Supercritical fluid ejected from the fluid supply port 690 reaches the central region of the substrate "W" and diffuses to the edge regions, while being uniformly supplied to the entire area of ​​the substrate "W". The supply line 620 is connected to the fluid supply port 690. The supply line 620 receives supercritical fluid from a separately provided supercritical fluid storage unit 610 and supplies the supercritical fluid to the fluid supply port 690. For example, the supercritical fluid storage unit 610 stores supercritical fluid (carbon dioxide) and supplies the supercritical fluid to the supply line 620.

[0081] Valve 660 is installed to supply line 620. Valve 660 regulates the amount of supercritical fluid supplied to fluid supply port 690. Valve 660 can control the amount of fluid supplied to processing space 502 via a controller.

[0082] Discharge member 550 discharges supercritical fluid from the second process chamber 500. Discharge member 550 may be connected to discharge line 552 for discharging supercritical fluid. In this case, a valve (not shown) for regulating the amount of supercritical fluid discharged to discharge line 552 may be installed on discharge member 550. Supercritical fluid discharged through discharge line 552 may be released into the atmosphere or supplied to a supercritical fluid regeneration system (not shown). Discharge member 550 may be coupled to lower body 524.

[0083] Figure 4 It is shown Figure 1 A view of the apparatus for transmitting the substrate.

[0084] Reference Figure 4 The device 320 for transferring substrates (substrate transfer robot; substrate transfer device) includes a main body 330 and first arms 342 to third arms 346. First, in the figure, the first direction "X" refers to the movement direction of the first arms 342 to third arms 346 (i.e., forward and backward (horizontal) movement direction), the second direction "Z" refers to the stacking direction of the first arms 342 to third arms 346 (or vertical movement direction), and the third direction "Y" refers to the direction perpendicular to the first direction "X" and the second direction "Z" (i.e., left and right (horizontal direction)).

[0085] The first arm 342 to the third arm 346 can be stacked sequentially on the main body (i.e., in the second direction z) and can be driven individually. In this case, the first arm 342 to the third arm 346 respectively include hands 341, 343 and 345. The hands 341, 343 and 345 are mechanically connected to the arm drive unit (not shown) via arm bases 342a, 344a and 346a.

[0086] Hands 341, 343, and 345 are divided into a take-out hand (reference numeral 345; hereinafter referred to as the "third hand") for transferring the substrate after processing; an introduction hand (reference numeral 341; hereinafter referred to as the "first hand") for transferring the substrate before processing; and a transfer hand (reference numeral 343; hereinafter referred to as the "second hand") for transferring the wetted substrate for operation. According to an embodiment of this disclosure, the third hand 345 is positioned above the first hand 341 and the second hand 343, and the second hand 343 is positioned below the first hand 341. In other words, the second hand 343 is positioned at the lowest point to prevent the other hands from being contaminated by the wetting solution, because when the second hand 343 transfers the wetted substrate, the wetting solution may drip due to the fan filter unit (FFU; not shown) inside the device and gravity. Furthermore, since a contaminated substrate was introduced in the previous process, the second hand 343, which is used to transfer the substrate before the process, is placed in the middle position, and the third hand 345, which is in the cleanest state, is placed in the top position.

[0087] Therefore, the substrate transfer robot 320 can prevent the substrate from being contaminated by the wetting solution that wets the substrate during the process of transferring the substrate after the transfer process or during the process of the substrate before the transfer process.

[0088] Simultaneously, the first hand portion 341 to the third hand portion 345 can transfer the substrate while holding it in a vacuum. For this purpose, hand portions 341, 343, and 345 may include a vacuum pad (VP). The vacuum pad VP may be formed of a resin material with a high coefficient of surface friction and elasticity to seal the space between the vacuum pad and the substrate.

[0089] The substrate transfer robot 320 may include a controller 360 to control the drive of each of the first hand 341 to the third hand 345. The controller 360 controls the first hand 341 to transfer the substrate before performing the liquid handling process, controls the third hand 345 to transfer the dried substrate, and controls the second hand 343 to transfer the substrate having a surface coated with a wetting solution.

[0090] Furthermore, the controller 360 controls the second hand 343 to transfer the substrate at a lower speed than that of the first hand 341 or the third hand 345. Therefore, the second hand 343 can minimize the dripping of wetting solution coated on the substrate surface from the substrate during the substrate transfer process in a wetted state, thereby preventing contamination of the substrate transfer device.

[0091] Although the embodiments of this disclosure have been described as having a first hand portion 341 to a third hand portion 345 provided to a substrate transfer robot, this disclosure is not limited thereto. If desired, the three hand portions can be separated and provided to two substrate transfer devices. Furthermore, the first and third hand portions can be disposed in the first substrate transfer device, and the second hand portion can be disposed in the second substrate transfer device.

[0092] In the following, a method for processing a substrate using the substrate processing apparatus 1000 provided in the substrate processing apparatus 1000 described above will be described according to embodiments of the present disclosure.

[0093] Figure 5 A flowchart illustrating a method for processing a substrate according to an embodiment of the present disclosure is provided, and Figure 6 To show Figure 5 A view of the path through which the substrate is transported in a method for processing a substrate.

[0094] According to this disclosure, the method for processing a substrate involves cleaning and drying the substrate in a process unit.

[0095] The method for processing a substrate may include introducing the substrate (S110), cleaning the substrate (S120), transferring the substrate (S130), drying the substrate (S140), and removing the substrate (S150).

[0096] In other words, during substrate introduction (S110), the substrate is picked up by the first hand 341 and introduced into the first process chamber 400. During substrate cleaning (S120), the liquid-treated substrate is removed from the first process chamber 400 by the second hand 345 and introduced into the second process chamber 500. In this case, to prevent the substrate from moving between chambers and to allow the substrate surface to dry naturally, a wetting solution is applied to the substrate surface. The wetting solution can be applied before transferring the substrate. Therefore, during the transfer of the substrate from the first process chamber 400 to the second process chamber 500, or even after the transfer, the surface state of the substrate can be uniformly maintained in a wet state. For example, the wetting solution may include a volatile organic solvent (e.g., isopropanol, aqueous isopropanol solution), pure water, or a mixture of surfactant and pure water. Then, the substrate, dried using a supercritical fluid as the process fluid, is removed from the second process chamber 500 by the third hand 345 and transferred to a buffer chamber.

[0097] Figure 7 yes Figure 1 The side view of the process unit shown.

[0098] like Figure 7 As shown, the first process chamber 400 and the second process chamber 500 can be placed on the side surface of the transfer chamber 300. The substrate transfer robot 320 includes a main body 330 and first arms 342 to third arms 346. The first arms 342 to third arms 346 can be configured to move back and forth on the main body 330, and the main body 330 can be configured to be rotatable about a third direction 96 and movable in the third direction 96.

[0099] Figure 8 This is a view showing a substrate processing unit of a substrate processing apparatus according to another embodiment.

[0100] Reference Figure 8 In addition to the substrate transfer device 320-1 being disposed within the transfer chamber 300, the substrate processing unit 20a may also include a side substrate transfer device 320-2 disposed between the first process chamber 400 and the second process chamber 500. In this case, the substrate transfer device 320-1 may include a first hand portion 341 and a third hand portion 345, and the side substrate transfer device 320-2 may include a second hand portion 343. For example, a separate transfer space for the side substrate transfer device 320-2 may be located between the first process chamber 400 and the second process chamber 500.

[0101] Before performing the liquid processing process, the first hand 341 of the substrate transfer device 320-1 transfers the substrate to the first process chamber 40, and the third hand 345 transfers the dried substrate in the second process chamber 500. Furthermore, the second hand 343 of the side substrate transfer device 320-2 transfers the substrate having a surface coated with a wetting solution in the first process chamber 400 to the second transfer chamber 500.

[0102] The above description is for illustrative purposes. Furthermore, the foregoing describes embodiments of this disclosure, and this disclosure can be used in various other combinations, variations, and environments. That is, this disclosure can be modified and altered without departing from the scope of this disclosure as defined in the specification, its equivalents in the written disclosure, and / or the skill or knowledge of someone skilled in the art. The written embodiments describe the best state for realizing the technical spirit of this disclosure, and various necessary changes can be made in the specific field of application and purpose of this disclosure. Furthermore, it should be understood that the appended claims include other embodiments.

[0103] Although this disclosure has been described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various changes and modifications may be made to this disclosure without departing from the spirit and scope of the disclosure as set forth in the appended claims.

Claims

1. An apparatus for processing a substrate, the apparatus comprising: a first process chamber configured to perform a liquid treatment process on the substrate; a second process chamber configured to perform a drying treatment process on the substrate liquid-treated in the first process chamber; a first hand configured to introduce the substrate into the first process chamber before performing the liquid treatment process; a second hand configured to take out the substrate from the first process chamber after performing the liquid treatment process and introduce the substrate into the second process chamber; a third hand configured to take out the substrate from the second process chamber after performing the drying treatment process; and a controller configured to control the first hand, the second hand, and the third hand, wherein the controller is configured to: control the second hand to transport the substrate at a lower speed than a speed at which the substrate is transported by the first hand or the third hand, wherein the first hand, the second hand, and the third hand are provided to a main body of one substrate transport apparatus, the third hand, the first hand, and the second hand are disposed at different heights in a vertical direction on the main body, and the first hand is disposed above the second hand, and the third hand is disposed above the first hand. the second process chamber is a high-pressure chamber to perform the drying treatment process on the substrate liquid-treated in the first process chamber by using a supercritical fluid or isopropyl alcohol (IPA).

2. The apparatus of claim 1, wherein, the second hand transports the substrate having a surface coated with a wetting solution in the first process chamber to the second process chamber.

3. The apparatus of claim 1, wherein, the wetting solution includes a volatile organic solvent, pure water, a mixture of a surfactant, a volatile organic solvent, and pure water, or a mixture of a surfactant and pure water.

4. The apparatus of claim 3, wherein, the first hand and the third hand are provided in a first substrate transport apparatus, and 5. The apparatus of claim 1, wherein, wherein the second hand is provided in a second substrate transport apparatus.

6. An apparatus for transporting a substrate, the apparatus comprising: a main body; a first hand provided on the main body; a second hand provided on the main body; a third hand provided on the main body; and a controller configured to control driving of the first hand to the third hand, wherein the controller is configured to: control the first hand to transport the substrate before performing a liquid treatment process, control the third hand to transport the substrate dried, and control the second hand to transport the substrate having a surface coated with a wetting solution, wherein the controller is configured to: control the second hand to transport the substrate at a lower speed than a speed at which the substrate is transported by the first hand or the third hand, wherein the first hand, the second hand, and the third hand are disposed at different heights in a vertical direction on the main body, ​ ​ wherein the first hand is disposed above the second hand, and wherein the first hand is disposed below the third hand.

7. An apparatus for processing a substrate, the apparatus comprising: a process processing unit configured to process the substrate; and an indexing unit including a load port on which a container having the substrate is placed and an indexing robot that transfers the substrate between the container and the process processing unit, wherein the process processing unit comprises: a transfer chamber having a substrate transfer device to transfer a substrate, and the transfer chamber is disposed adjacent to the indexing unit; a first process chamber disposed at one side of the transfer chamber to perform a liquid treatment process on the substrate; a second process chamber disposed at one side of the transfer chamber to perform a drying treatment process on the substrate by using a supercritical fluid or isopropyl alcohol (IPA) after performing the liquid treatment process; and a controller configured to control the substrate transfer device, wherein the substrate transfer device comprises: a first hand that transfers the substrate to the first process chamber before performing the liquid treatment process; a second hand that transfers the substrate coated with a wetting solution in the first process chamber to the second process chamber; and a third hand that transfers the substrate dried in the second process chamber, and wherein the controller is configured to: control the second hand to transfer the substrate at a lower speed than a speed at which the substrate is transferred by the first hand or the third hand, wherein the first hand is disposed above the second hand, and the first hand is disposed below the third hand.

8. The apparatus of claim 7, wherein, At least two of the first process chamber and the second process chamber are stacked, and wherein the substrate transfer device has a main body that is movable in an X-axis direction, a Y-axis direction, or a Z-axis direction.

9. The apparatus of claim 7, wherein, The first process chamber and the second process chamber are disposed at opposite sides of the transfer chamber or are disposed at the same side of the transfer chamber.

10. A method for processing a substrate, the method comprising: introducing the substrate into a first process chamber by using a first hand; applying a wetting solution to the substrate in the first process chamber; transferring the substrate coated with the wetting solution to a second process chamber for drying the substrate by using a second hand; performing a drying treatment process on the substrate coated with the wetting solution in the second process chamber; and extracting the dried substrate from the second process chamber by using a third hand, wherein the transfer of the substrate by using the second hand is performed at a lower speed than a speed at which the substrate is transferred by the first hand or the third hand, wherein the first hand, the second hand, and the third hand are disposed to a main body of one substrate transfer device, ​ The first hand is disposed above the second hand, and the first hand is disposed below the third hand.

11. The method of claim 10, wherein, The drying process is performed by using supercritical fluid or isopropyl alcohol (IPA) to dry the substrate.

12. The method of claim 10, wherein, The wetting solution includes a volatile organic solvent, pure water, a mixture of a surfactant, a volatile organic solvent, and pure water, or a mixture of a surfactant and pure water.

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