Device and integrated circuit device for current and / or voltage overload protection

Abstract

The present disclosure provides a device for current and / or voltage overload protection, comprising: at least one protection component; the protection component including at least one fuse element and at least one PN junction element connected in series with the fuse element; wherein, when a current overload occurs, the fuse element can be fused to achieve current overload protection; when a voltage overload occurs, the PN junction element can be broken down to achieve voltage overload protection. The present disclosure also provides an integrated circuit device.

Description

Technical Field

[0001] The present disclosure belongs to the technical field of integrated circuits, and in particular relates to a device for current and / or voltage overload protection and an integrated circuit device. Background Art

[0002] For integrated circuit devices and electronic equipment, current overload protection and voltage overload protection are crucial, and are directly related to whether the integrated circuit devices and electronic equipment can operate normally and the reliability of the integrated circuit devices and electronic equipment.

[0003] When the current or voltage applied to electronic devices exceeds the specified value, the excessive heat (EOS) generated can damage the electronic devices. Electrostatic discharge (ESD) can also damage microchips. The ESD discharge voltage can reach tens of thousands of volts.

[0004] In the prior art, a melting fuse is often used for current overload protection. When an overcurrent flows through the melting fuse, the melting fuse melts, disconnecting the current source from the electronic device, and the electronic device stops working.

[0005] In the prior art, surge devices (such as diodes) are often used for voltage overload protection. When an overvoltage is applied to the surge device, the surge device is broken down, forming a short circuit, and the electronic equipment stops working.

[0006] When a melted fuse or a surge device is destroyed, the electronic equipment must replace the melted fuse or the surge device.

[0007] Although a meltable fuse and a surge device are combined as an overload protection device in the prior art, the structure thereof is not reasonable, and there are still problems such as poor protection effect and poor reliability of electronic equipment. Summary of the Invention

[0008] In order to solve one of the above technical problems, the present disclosure provides a device for current and / or voltage overload protection and an integrated circuit device.

[0009] According to one aspect of the present disclosure, there is provided a device for current and / or voltage overload protection, comprising:

[0010] at least one protective component;

[0011] The protection component includes at least one fuse element and at least one PN junction element connected in series with the fuse element;

[0012] When the current is overloaded, the fuse element can be fused to achieve current overload protection; when the voltage is overloaded, the PN junction element can be broken down to achieve voltage overload protection.

[0013] According to at least one embodiment of the present disclosure, a device for current and / or voltage overload protection has a first end connected to a signal receiving end of a protection target device, and a second end connected to a power supply end (VDD) or a ground end of the protection target device.

[0014] According to the apparatus for current and / or voltage overload protection of at least one embodiment of the present disclosure, the signal receiving end of the protection target device is used to receive an external input signal.

[0015] According to the apparatus for current and / or voltage overload protection of at least one embodiment of the present disclosure, the protection target device is an integrated circuit chip.

[0016] According to the device for current and / or voltage overload protection of at least one embodiment of the present disclosure, the external input signal is an external input power signal.

[0017] According to at least one embodiment of the present disclosure, in the device for current and / or voltage overload protection, the number of protection components is two or more than three, and the two or more protection components form a parallel structure between the signal receiving end of the protection target device and the power supply end (VDD) or the ground end of the protection target device.

[0018] According to the device for current and / or voltage overload protection of at least one embodiment of the present disclosure, the fuse element is formed of a metal material.

[0019] According to the device for current and / or voltage overload protection of at least one embodiment of the present disclosure, the PN junction element is preferably a diode, a transistor, a MOS transistor and / or a combination thereof.

[0020] According to at least one embodiment of the present disclosure, the device for current and / or voltage overload protection includes a protection component including two fuse elements and a PN junction element connected in series with the two fuse elements, wherein the PN junction element is disposed between the two fuse elements.

[0021] According to the device for current and / or voltage overload protection of at least one embodiment of the present disclosure, the fuse element is a resistor device.

[0022] According to the device for current and / or voltage overload protection of at least one embodiment of the present disclosure, the fuse element includes an isolation dielectric layer and a metal line, wherein the metal line is disposed within the isolation dielectric layer.

[0023] According to another aspect of the present disclosure, there is provided an integrated circuit device, comprising:

[0024] At least two devices for current and / or voltage overload protection according to any one of the above items; and

[0025] at least one integrated circuit chip;

[0026] In which, the device for current and / or voltage overload protection and the integrated circuit chip are formed on a common substrate, at least one of the devices for current and / or voltage overload protection is arranged between the power supply end of the integrated circuit chip and the signal receiving end of the integrated circuit chip, and at least another device for current and / or voltage overload protection is arranged between the ground end of the integrated circuit chip and the signal receiving end of the integrated circuit chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings illustrate exemplary embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0028] Figure 1 1 is a schematic structural diagram of a protection component of a device for current and / or voltage overload protection according to an embodiment of the present disclosure.

[0029] Figure 2 3 is a structural schematic diagram of a protection component of a device for current and / or voltage overload protection according to another embodiment of the present disclosure.

[0030] Figure 3 3 is a structural schematic diagram of a protection component of a device for current and / or voltage overload protection according to another embodiment of the present disclosure.

[0031] Figure 4 It is a structural schematic diagram of a device for current and / or voltage overload protection according to an embodiment of the present disclosure.

[0032] Figure 5 It is a structural schematic diagram of a device for current and / or voltage overload protection according to another embodiment of the present disclosure.

[0033] Figure 6 It is a structural schematic diagram of a device for current and / or voltage overload protection according to another embodiment of the present disclosure.

[0034] Figure 7 FIG2 is a schematic structural diagram of an integrated circuit device having a device for current and / or voltage overload protection according to an embodiment of the present disclosure.

[0035] Description of Reference Numerals

[0036] 100 Devices for current and / or voltage overload protection

[0037] 10 Protection components

[0038] 11 Fuse element

[0039] 12 containing PN junction elements

[0040] 200 integrated circuit chips

[0041] 201 chip internal circuit

[0042] 202 signal input terminal

[0043] 1000 integrated circuit devices. DETAILED DESCRIPTION

[0044] The present disclosure will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only intended to explain the relevant content and are not intended to limit the present disclosure. It should also be noted that, for ease of description, only the portions relevant to the present disclosure are shown in the accompanying drawings.

[0045] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in the present disclosure can be combined with each other. The technical solution of the present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0046] Unless otherwise stated, the exemplary embodiments / examples shown are to be understood as providing exemplary features of various details of some ways in which the technical concepts of the present disclosure can be implemented in practice. Therefore, unless otherwise stated, the features of the various embodiments / examples may be further combined, separated, interchanged, and / or rearranged without departing from the technical concepts of the present disclosure.

[0047] The use of cross hatching and / or shading in the accompanying drawings is generally used to make the boundaries between adjacent components clear. As such, unless otherwise indicated, the presence or absence of cross hatching or shading does not convey or indicate any preference or requirement for the specific materials, material properties, dimensions, proportions, commonalities between the components shown, and / or any other characteristics, attributes, properties, etc. of the components. In addition, in the accompanying drawings, the sizes and relative sizes of the components may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be implemented differently, the specific process sequence can be performed in a different order than described. For example, two successively described processes can be performed substantially simultaneously or in an order opposite to the order described. In addition, the same figure numbers represent the same components.

[0048] When a component is referred to as being “on,” “over,” “connected to,” or “coupled to” another component, the component may be directly on, directly connected to, or directly coupled to the other component, or intervening components may be present. However, when a component is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another component, there are no intervening components present. For this purpose, the term “connected” may refer to a physical connection, an electrical connection, etc., with or without intervening components.

[0049] For descriptive purposes, the present disclosure may use spatially relative terms such as "below," "beneath," "under," "down," "above," "upper," "above," "higher," and "side (e.g., as in "sidewall")," to describe the relationship of one component to another (other) component as shown in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the drawings is turned over, a component described as "below" or "beneath" another component or feature would then be positioned "above" the other component or feature. Thus, the exemplary term "below" can encompass both the "above" and "below" orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and as such, the spatially relative descriptors used herein should be interpreted accordingly.

[0050] The terms used herein are for the purpose of describing specific embodiments and are not intended to be restrictive. As used herein, unless the context clearly indicates otherwise, the singular forms "one (kind, person)" and "said (the)" are also intended to include plural forms. In addition, when the terms "comprise" and / or "include" and their variations are used in this specification, the features, integral bodies, steps, operations, parts, assemblies and / or their groups stated are explained, but the presence or addition of one or more other features, integral bodies, steps, operations, parts, assemblies and / or their groups is not excluded. It should also be noted that, as used herein, the terms "substantially", "approximately" and other similar terms are used as approximate terms and not as degree terms, so that they are used to explain the inherent deviations of the measured values, calculated values ​​and / or the values ​​provided that will be recognized by those of ordinary skill in the art.

[0051] According to one embodiment of the present disclosure, a device 100 for current and / or voltage overload protection includes: at least one protection component 10; the protection component 10 includes at least one fuse element 11 and at least one PN junction element 12 connected in series with the fuse element 11; wherein, when the current is overloaded, the fuse element 11 can be blown to achieve current overload protection, and when the voltage is overloaded, the PN junction element 12 can be broken down to achieve voltage overload protection.

[0052] Preferably, the protection assembly 10 includes two fuse elements 11 and a PN junction element 12 connected in series with the two fuse elements 11 . The PN junction element 12 is disposed between the two fuse elements 11 .

[0053] Figures 1 to 3 The structural schematic diagrams of the protection components 10 are shown as examples.

[0054] Figure 1 1 is a schematic structural diagram of a protection component 10 of a device 100 for current and / or voltage overload protection according to an embodiment of the present disclosure.

[0055] Figure 1 The protection component 10 includes a fuse element 11 and a PN junction element 12.

[0056] Figure 2 1 is a structural schematic diagram of a protection component 10 of a device 100 for current and / or voltage overload protection according to another embodiment of the present disclosure.

[0057] Figure 2 The protection component 10 includes two fuse elements 11 and a PN junction element 12 . The PN junction element 12 is arranged between the two fuse elements 11 .

[0058] Figure 3 1 is a structural schematic diagram of a protection component 10 of a device 100 for current and / or voltage overload protection according to another embodiment of the present disclosure.

[0059] Figure 3 The protection component 10 includes a fuse element 11 and a PN junction element 12. For example, the fuse element 11 is a metal wire and the PN junction element is a diode.

[0060] Figure 4 1 is a schematic structural diagram of a device 100 for current and / or voltage overload protection according to an embodiment of the present disclosure.

[0061] like Figure 4As shown, a device 100 for current and / or voltage overload protection includes: multiple protection components 10 (two or more than three); each protection component 10 includes two fuse elements 11 and a PN junction element 12 connected in series with the fuse element 11; wherein the PN junction element 12 is arranged between the two fuse elements 11.

[0062] When the current is overloaded, the overload current can be evenly distributed to multiple protection components 10, and the fuse element 11 of each protection component 10 can be blown to achieve current overload protection. When the voltage is overloaded, the PN junction element 12 can be broken down to achieve voltage overload protection.

[0063] Figure 5 1 is a structural diagram of a device 100 for current and / or voltage overload protection according to another embodiment of the present disclosure.

[0064] like Figure 5 As shown, the device 100 for current and / or voltage overload protection includes: multiple protection components 10 (two or more than three); each protection component 10 includes a fuse element 11 and a PN junction element 12 connected in series with the fuse element 11.

[0065] When the current is overloaded, the overload current can be evenly distributed to multiple protection components 10, and the fuse element 11 of each protection component 10 can be blown to achieve current overload protection. When the voltage is overloaded, the PN junction element 12 can be broken down to achieve voltage overload protection.

[0066] The fuse element 11 is a metal wire, and the PN junction element is a diode.

[0067] Figure 6 1 is a structural diagram of a device 100 for current and / or voltage overload protection according to another embodiment of the present disclosure.

[0068] like Figure 6 As shown, a device 100 for current and / or voltage overload protection includes: a plurality of protection components 10 (two or more); each protection component 10 includes two fuse elements 11 and a PN junction element 12 connected in series with the fuse element 11. The PN junction element 12 is disposed between the two fuse elements 11.

[0069] When the current is overloaded, the overload current can be evenly distributed to multiple protection components 10, and the fuse element 11 of each protection component 10 can be blown to achieve current overload protection. When the voltage is overloaded, the PN junction element 12 can be broken down to achieve voltage overload protection.

[0070] The fuse element 11 is a metal wire, and the PN junction element is a diode.

[0071] In the above-mentioned embodiments, the current and / or voltage overload protection device preferably comprises a PN junction element, a diode, a transistor, a MOS transistor, and / or a combination thereof. Those skilled in the art may also select other suitable types of PN junction elements.

[0072] In each of the above embodiments, preferably, the fuse element is formed of a metal material.

[0073] In each of the above embodiments, preferably, the fuse element is a resistor device.

[0074] In each of the above embodiments, preferably, the fuse element includes an isolation dielectric layer and a metal line, and the metal line is disposed within the isolation dielectric layer.

[0075] In each of the above embodiments, preferably, the first end ( Figures 4 to 6 The lower end of the device 100 is connected to the signal receiving end of the protection target device (such as an integrated circuit chip), and the second end ( Figures 4 to 6 The upper end of the protection circuit is connected to the power supply terminal (VDD) or the ground terminal of the protection target device (such as an integrated circuit chip).

[0076] Two or more protection components 10 of the apparatus 100 for current and / or voltage overload protection are connected in parallel between a signal receiving terminal of a target device (e.g., an integrated circuit chip) and a power supply terminal (VDD) or a ground terminal of the target device (e.g., an integrated circuit chip), thereby achieving current and / or voltage overload protection for the target device.

[0077] In the above embodiment, the signal receiving terminal of the protection target device is used to receive an external input signal, which may be an external input power signal.

[0078] An integrated circuit device according to one embodiment of the present disclosure includes: at least two devices 100 for current and / or voltage overload protection according to any one of the above-mentioned embodiments; and at least one integrated circuit chip 200; wherein, the devices 100 for current and / or voltage overload protection and the integrated circuit chip 200 are formed on a common substrate, at least one device 100 for current and / or voltage overload protection is arranged between the power supply end of the integrated circuit chip 200 and the signal receiving end of the integrated circuit chip, and at least another device 100 for current and / or voltage overload protection is arranged between the ground end of the integrated circuit chip 200 and the signal receiving end of the integrated circuit chip 200.

[0079] Figure 7FIG2 is a schematic structural diagram of an integrated circuit device having a device for current and / or voltage overload protection according to an embodiment of the present disclosure.

[0080] like Figure 7 As shown, the integrated circuit device 1000 includes: two devices 100 for current and / or voltage overload protection; and an integrated circuit chip 200; wherein the two devices 100 for current and / or voltage overload protection and the integrated circuit chip 200 can be formed on a common substrate, and the device 100 for current and / or voltage overload protection ( Figure 7 The device 100 for current and / or voltage overload protection in the upper middle portion is provided between the power supply terminal (VDD) of the integrated circuit chip 200 and the signal receiving terminal 202 (i.e., the chip pin) of the integrated circuit chip. Another device 100 for current and / or voltage overload protection ( Figure 7 The device 100 for current and / or voltage overload protection in the lower middle portion is disposed between the ground terminal of the integrated circuit chip 200 and the signal receiving terminal 202 of the integrated circuit chip 200 .

[0081] The structural design of the device for current and / or voltage overload protection disclosed in the present invention can achieve adaptive and uniform distribution of the discharge current, and due to the setting of the fuse element, no short circuit occurs when the PN junction element is broken down.

[0082] In the description of this specification, the description with reference to the terms "one embodiment / method", "some embodiments / methods", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment / method or example are included in at least one embodiment / method or example of the present application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment / method or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments / methods or examples. In addition, those skilled in the art may combine and combine different embodiments / methods or examples described in this specification and the features of different embodiments / methods or examples, unless they are contradictory.

[0083] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this application, "plurality" means at least two, such as two or three, unless otherwise specifically defined.

[0084] Those skilled in the art will appreciate that the above embodiments are merely intended to clearly illustrate the present disclosure and are not intended to limit the scope of the present disclosure. Other changes or modifications may be made based on the above disclosure, and such changes or modifications are still within the scope of the present disclosure.

Claims

1. An integrated circuit device, characterized in that include: at least two devices for current and / or voltage overload protection; as well as at least one integrated circuit chip; The device for current and / or voltage overload protection and the integrated circuit chip are formed on a common substrate, at least one of the devices for current and / or voltage overload protection is arranged between a power supply terminal of the integrated circuit chip and a signal receiving terminal of the integrated circuit chip, and at least another of the devices for current and / or voltage overload protection is arranged between a ground terminal of the integrated circuit chip and the signal receiving terminal of the integrated circuit chip; The device for current and / or voltage overload protection comprises at least one protection component; The protection component is composed of two fuse elements and a PN junction element connected in reverse series with the two fuse elements, and the PN junction element is arranged between the two fuse elements; The number of the protection components is two or more than three, and the two or more protection components form a parallel structure between the signal receiving end and the power supply end or the ground end; When the current is overloaded, the overload current can be evenly distributed to multiple protection components, and the fuse element of each protection component can be blown to achieve current overload protection. When the voltage is overloaded, the PN junction element can be broken down to achieve voltage overload protection.

2. The integrated circuit device according to claim 1, wherein: The signal receiving end is used to receive an external input signal.

3. The integrated circuit device according to claim 2, wherein: The external input signal is an external input power signal.

4. The integrated circuit device according to claim 1, wherein: The fuse element is formed of a metal material.

5. The integrated circuit device according to claim 1, wherein: The PN junction element is a diode, a transistor, a MOS transistor and / or a combination thereof.

6. The integrated circuit device according to any one of claims 1 to 5, characterized in that: The fuse element is a resistor device.

7. The integrated circuit device according to any one of claims 1 to 5, characterized in that: The fuse element includes an isolation dielectric layer and a metal line disposed within the isolation dielectric layer.

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