A cooling system based on automatic load power configuration

Abstract

This invention discloses a cooling system based on automatic load power configuration. The cooling system includes a load power configuration device, a control device, and a cooling device. The load power configuration device includes multiple sets of heating elements, each set of heating elements including multiple heating wires. The load power configuration device also includes multiple relays corresponding to each heating wire, and transistors corresponding to each set of heating elements. The control device includes a host computer, a slave computer, and a control board. The slave computer is electrically connected to the transistors, and both the slave computer and the control board are communicatively connected to the host computer. The control board is electrically connected to the coils of the relays. The host computer controls the connection and disconnection of the circuits containing the control board and the relay coils based on received external input signals, and controls the operating state of the cooling device. The cooling system based on automatic load power configuration provided by this invention can achieve automatic load power configuration, improve work efficiency, and eliminate safety hazards.

Description

Technical Field

[0001] The embodiments of the present invention relate to cooling technology, and more particularly to a cooling system based on automatic load power configuration. Background Technology

[0002] For products such as electrical equipment, a cooling system is typically needed to cool products with a positive temperature coefficient (PTC) during testing. If the cooling system is ineffective in cooling PTC products, the PTC product's temperature may become too high, potentially affecting normal testing. Therefore, the cooling system must be designed to ensure its effectiveness.

[0003] Currently, existing cooling systems typically only provide cooling and lack the ability to automatically configure load power. When testing a load, if the load power needs to be adjusted (e.g., decreasing or increasing the load power), manual adjustment is often required. This prevents the automatic configuration of high-voltage load power, affecting work efficiency and reducing safety. Furthermore, cooling is only achieved through the cooling path of the load, which also affects the cooling effect. Summary of the Invention

[0004] This invention provides a cooling system based on automatic load power configuration to achieve automatic load power configuration and improve cooling effect.

[0005] This invention provides a cooling system based on automatic load power configuration, comprising: a load power configuration device, a control device, and a cooling device; wherein the load power configuration device and the cooling device are both electrically connected to the control device.

[0006] The load power configuration device includes multiple sets of heating elements, each set of heating elements includes multiple heating wires, the load power configuration device also includes multiple relays corresponding to each heating wire, and transistors corresponding to each set of heating elements. The heating wires are electrically connected to the transistors through the normally open contacts of the corresponding relays.

[0007] The cooling device includes a cooler, a water pump, and a water tank. The water pump connects the cooler and the water tank. The cooling device is used to cool the heat-generating element. The connection includes a connection for cooling the heat-generating element and a connection for cooling the water tank.

[0008] The control device includes a host computer, a slave computer, and a control board. The slave computer is electrically connected to a transistor, and both the slave computer and the control board are communicatively connected to the host computer. The control board is electrically connected to the coil of a relay. The host computer is used to control the on / off state of the circuit between the control board and the relay coil according to the received external input signals, and to control the working state of the cooling device.

[0009] Optionally, the load power configuration device also includes a contactor corresponding to each group of heating elements. The contactor is electrically connected to the normally open contact of the relay through a heating wire. The contactor is used to connect the power supply when closed, so that the power supply supplies power to the heating element corresponding to the contactor.

[0010] Optionally, the transistor is an insulated-gate bipolar transistor, with the gate of the transistor electrically connected to the lower-level electromechanical device, the first terminal of the transistor electrically connected to the heating wire through the normally open contact of the relay, and the second terminal of the transistor electrically connected to the negative terminal of the power supply.

[0011] Optionally, the control device also includes a temperature sensor, a temperature controller, a liquid level sensor, and a liquid level controller. The temperature sensor is electrically connected to the temperature controller, and the liquid level sensor is electrically connected to the liquid level controller. Both the temperature controller and the liquid level controller are connected to a host computer for communication. The temperature sensor is used to collect the temperature of the water tank, and the liquid level sensor is used to collect the liquid level of the water tank.

[0012] Optionally, the host computer is also used to receive temperature signals transmitted by the temperature controller and liquid level signals transmitted by the liquid level controller, and to control each device to stop working and issue corresponding prompt information when abnormal temperature signals and / or liquid level signals are detected.

[0013] Optionally, the external input signals include the target power and the number of transistors. The host computer is also used to control the number of paths that are connected between the control board and the relay coil based on the target power and the number of transistors.

[0014] Optionally, the host computer includes a serial port, through which it communicates with the slave computer and the control board.

[0015] Optionally, the power of each heating wire in each group of heating elements is different, but the total power of each group of heating elements is the same.

[0016] Optionally, the cooling device also includes a flow switch and a flow meter, both of which are installed in the passage between the cooler and the water tank.

[0017] Optionally, each heating element is provided with a housing, with the heating element located inside the housing, which is located in the passage between the cooler and the water tank.

[0018] The cooling system based on automatic load power configuration provided in this embodiment of the invention includes a load power configuration device, a control device, and a cooling device. Both the load power configuration device and the cooling device are electrically connected to the control device. The load power configuration device includes multiple sets of heating elements, each set of heating elements including multiple heating wires. The load power configuration device also includes multiple relays corresponding to each heating wire, and transistors corresponding to each set of heating elements. The heating wires are electrically connected to the transistors through normally open contacts of the corresponding relays. The cooling device includes a cooler, a water pump, and a water tank. The water pump connects the cooler and the water tank. The cooling device is used to cool the heating elements, and the connection includes a cooling path for the heating elements and a cooling path for the water tank. The control device includes a host computer, a slave computer, and a control board. The slave computer is electrically connected to the transistors, and both the slave computer and the control board are communicatively connected to the host computer. The control board is electrically connected to the coils of the relays. The host computer controls the on / off state of the connection between the control board and the relay coils based on received external input signals, and controls the operating state of the cooling device. The cooling system based on automatic load power configuration provided in this embodiment of the invention controls the connection and disconnection of the control board and the coil of the relay via a host computer. When the host computer controls the control board and the coil of the relay to be connected according to the received external input signal, the normally open contact of the relay closes, and the heating wire connected to the normally open contact of the relay is connected. The power of the heating wire is the load power, thereby realizing automatic load power configuration. The host computer also controls the working state of the cooling device. The cooling device includes a path for cooling the heating element and a path for cooling the water tank. The host computer can control the cooler and water pump in the path for cooling the heating element to work. When the temperature is high, it can also control the cooler and water pump in the path for cooling the water tank to work to improve the cooling effect. Attached Figure Description

[0019] Figure 1 This is a structural block diagram of a cooling system based on automatic load power configuration provided in an embodiment of the present invention;

[0020] Figure 2 This is a circuit diagram of a portion of a cooling system based on automatic load power configuration, provided in an embodiment of the present invention.

[0021] Figure 3 This is a schematic diagram of a cooling device provided in an embodiment of the present invention. Detailed Implementation

[0022] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0023] For PTC products, the testing involves high voltage and high power, currently reaching a maximum voltage of 600VDC and a maximum power of 9KW, generating significant heat. Testing PTC products presents substantial safety hazards, requiring extremely high safety standards. Manually installing the load under these conditions is unacceptable. Furthermore, PTC products are diverse: there are many types of PTC products, with varying IGBTs driving the load, different driving voltages, different driving power, and different cooling methods (air-cooled vs. water-cooled), making standardization difficult. The load must be changed for each product tested. Given these characteristics of PTC products, manually changing the load for each test increases the risk of incorrect high-voltage wiring connections, leading to confusion due to the large number of wires and the lack of secure, exposed loads, posing significant safety risks. Due to the high heat generation of PTC products during testing, existing cooling systems are insufficient to meet the testing requirements. The high power of PTC products also prevents heat dissipation, causing the test control box temperature to reach high levels (over 50 degrees Celsius), severely impacting the testing environment and quality, and endangering the safety of operators.

[0024] Figure 1 This is a structural block diagram of a cooling system based on automatic load power configuration provided in an embodiment of the present invention. Figure 2 This is a circuit diagram of a portion of a cooling system based on automatic load power configuration, provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of a cooling device provided in an embodiment of the present invention. This embodiment can be applied to cooling products such as PTC products, etc. Figure 1 , Figure 2 and Figure 3 The cooling system includes a load power configuration device 10, a control device 20, and a cooling device 30; wherein the load power configuration device 10 and the cooling device 30 are both electrically connected to the control device 20.

[0025] The load power configuration device 10 includes multiple sets of heating elements 11, each set of heating elements 11 including multiple heating wires 12. The load power configuration device 10 also includes multiple relays KA corresponding to each heating wire 12, and transistors Q corresponding to each set of heating elements 11. The heating wires 12 are electrically connected to the transistors Q through the normally open contacts of the corresponding relays KA. The cooling device 30 includes a cooler 31, a water pump 32, and a water tank 33. The water pump 32 connects the cooler 31 and the water tank 33. The cooling device 30 is used to provide cooling for the heating elements. The heating element 11 is cooled, and the cooling path includes a cooling path for the heating element 11 and a cooling path for the water tank 33. The control device 20 includes a host computer 21, a slave computer 22, and a control board 23. The slave computer 22 is electrically connected to the transistor Q. Both the slave computer 22 and the control board 23 are communicatively connected to the host computer 21. The control board 23 is electrically connected to the coil of the relay KA. The host computer 21 is used to receive external input signals, control the on / off state of the path between the control board 23 and the coil of the relay KA, and control the working state of the cooling device 30.

[0026] Specifically, when a product to be tested, such as a PTC product, needs to be tested, the PTC product is cooled by a cooling system. The actual load power required by the PTC product and the number of transistors, such as IGBTs, can be pre-input to the host computer. The host computer 21 automatically selects the appropriate heating wire 12 from the heating element 11 corresponding to each IGBT based on the required power and the number of IGBTs. That is, the host computer 21 controls the on / off state of the circuit between the control board 23 and the coil of the corresponding relay KA based on the received actual load power required by the PTC product, in order to select the appropriate heating wire 12, ultimately achieving the purpose of automatically configuring the load power. (Reference) Figure 2 Taking a system with four heating elements 11 and each heating element 11 including three heating wires 12 (a total of 12 heating wires 101-112, corresponding to 12 relays KA1-KA12 respectively) as an example, the three heating wires 12 in each heating element 11 have different power ratings, such as 700W, 1200W, and 1500W respectively. Figure 2 As shown, pin VD of control board 23 can be connected to a power supply, and pins VD1-VD12 of control board 23 are electrically connected to different heating wires 12 respectively. The external signals received by host computer 21 may include load power signals and transistor count signals. Host computer 21 can automatically configure the load power according to the load power corresponding to the load power signal and the number of transistors corresponding to the transistor count signal.

[0027] The host computer 21 automatically configures the load power using the following method: the power of a single transistor is the total load power divided by the number of transistors. Three heating wires 12 with different power values ​​are arranged and combined to determine the combination whose power value is closest to that of a single transistor. For example, firstly, the power of a single heating wire 12 is compared with that of a single transistor; the number of heating wire combinations is C. 1 There are three types. For each combination of heating wire 12, the power is compared to the power of a single transistor, and the closest value is selected. Next, the power of each pair of heating wires 12 is compared to the power of a single transistor. The number of heating wire combinations is C. 2 There are three combinations. The power of each heating wire 12 combination is compared to the power of a single transistor, and the closest value is selected. Finally, the power of all three heating wires 12 combined is compared to the power of a single transistor. The number of heating wire combinations is C. 3 Three combinations are used. The power of each heating wire combination is compared with the power of a single transistor, and the closest value is selected. The comparison results are then compared again, and the combination closest to the power of a single transistor is selected, thereby achieving automatic load power configuration.

[0028] It should be noted that the number of heating elements and heating wires in the cooling system based on automatic load power configuration can be set according to actual needs, and no limit is imposed here.

[0029] For example, if the load power signal received by the host computer 21 corresponds to a load power of 1200W and the transistor count signal corresponds to a transistor count of 1, then the coil of the relay KA corresponding to the 1200W heating wire 12 in a group of heating elements 11 can be controlled to connect with the control board 23 and the corresponding circuit. The normally open contact of the relay KA closes, and the lower computer 22 controls the transistor to conduct. Then, the 1200W heating wire 12 and the normally open contact of the relay KA are connected, and the load power is 1200W, thereby realizing automatic configuration of the load power. At the same time, the host computer 21 can control the cooler 31 and the water pump 32 in the cooling circuit of the heating wire 12 to work, achieve the purpose of cooling, and ensure that the test temperature of the PTC product is within the reasonable temperature range required for testing. Furthermore, when the temperature is high, the host computer 21 can also control the cooler 31 and the water pump 32 in the cooling circuit of the water tank 33 to work, so as to improve the cooling effect.

[0030] In one implementation, if the load power signal received by the host computer 21 corresponds to a load power of 3800W and the transistor count signal corresponds to a transistor count of 2, then both sets of heating elements 11 can be controlled to operate. According to the host computer 21's automatic load power configuration method, each transistor receives 1900W of power. If the coil of the relay KA corresponding to the 700W and 1200W heating wires 12 in one set of heating elements 11 is connected to the control board 23 and its corresponding circuit, the normally open contact of the relay KA will close. The lower computer 22 controls the corresponding transistor to conduct, and the normally open contact of the 700W and 1200W heating wires 12 and the normally open contact of the relay KA will then be connected. When the circuit is open, the total power of the heating wires 12 in the heating element 11 is 1900W. The host computer 21 controls the coil of the relay KA corresponding to the heating wires 12 with power of 700W and 1200W in the other heating element 11 to be connected to the control board 23 and the circuit. The normally open contact of the relay KA is closed. The slave computer 22 controls the corresponding transistor to be turned on. Then the 700W and 1200W heating wires 12 are connected to the circuit where the normally open contact of the relay KA is located. The total power of the heating wires 12 in the heating element 11 is 1900W. The total power of the heating wires 12 in the two heating elements 11 is 3800W, thereby realizing the automatic configuration of the load power.

[0031] The cooling system based on automatic load power configuration provided in this embodiment controls the connection and disconnection of the circuit between the control board and the relay coil via a host computer. When the host computer controls the circuit between the control board and the relay coil to be connected according to the received external input signal, the normally open contact of the relay closes, and the circuit of the heating wire electrically connected to the normally open contact of the relay is connected. The power of the connected heating wire is the load power, thereby realizing automatic load power configuration. The host computer also controls the working state of the cooling device. The circuit in the cooling device includes a circuit for cooling the heating element and a circuit for cooling the water tank. The host computer can control the cooler and water pump in the circuit for cooling the heating element to work. When the temperature is high, it can also control the cooler and water pump in the circuit for cooling the water tank to work to improve the cooling effect.

[0032] refer to Figure 2 Optionally, the load power configuration device 10 also includes a contactor KM corresponding to each group of heating elements 11. The contactor KM is electrically connected to the normally open contact of the relay KA through the heating wire 12. The contactor KM is used to connect the power supply when closed, so that the power supply supplies power to the heating element 11 corresponding to the contactor KM.

[0033] Specifically, Figure 2The contactor KM includes three switches KM-1, KM-2, and KM-3. One end is connected to a power source (not shown in the figure), and the other end is electrically connected to the heating element 11. One end of switch KM-3 is electrically connected to two sets of heating elements 11. The coil of contactor KM can be electrically connected to the host computer 21. When the host computer 21 controls the coil of contactor KM to be energized, the switch of contactor KM closes, and the heating element 11 connected to the switch of contactor KM is connected to the power source, so that the power source supplies power to the heating element 11.

[0034] Optionally, transistor Q is an insulated gate bipolar transistor. The gate of transistor Q is electrically connected to the lower-level machine 22. The first terminal of transistor Q is electrically connected to the heating wire 12 through the normally open contact of relay KA. The second terminal of transistor Q is electrically connected to the negative terminal of the power supply.

[0035] For details, please refer to Figure 2 The transistor Q is an IGBT, comprising four transistors Q1-Q-4. Transistors Q1-Q-4 correspond to four sets of heating elements 11. For example, the first terminal of transistor Q1 is electrically connected to one end of the normally open contacts of three relays KA1-KA3, and the other end of the normally open contacts of the three relays KA1-KA3 is electrically connected to the corresponding three heating wires 12. The lower-level computer 22 can control the on / off state of transistor Q to control the on / off state of the path containing the heating element 11.

[0036] Optionally, the control device 20 also includes a temperature sensor, a temperature controller, a liquid level sensor, and a liquid level controller (not shown in the figure). The temperature sensor is electrically connected to the temperature controller, and the liquid level sensor is electrically connected to the liquid level controller. Both the temperature controller and the liquid level controller are communicatively connected to the host computer 21. The temperature sensor is used to collect the temperature of the water tank 33, and the liquid level sensor is used to collect the liquid level of the water tank 33.

[0037] Both the temperature sensor and the liquid level sensor can be installed on the side of the water tank 33. The temperature sensor can collect the temperature of the water tank 33 and send it to the temperature controller. The temperature controller can generate a temperature signal based on the received temperature and transmit the generated temperature signal to the host computer 21. The liquid level sensor can collect the liquid level of the water tank 33 and send it to the liquid level controller. The liquid level controller can generate a liquid level signal based on the received liquid level and transmit the generated liquid level signal to the host computer 21. When the cooling device is working normally, the host computer 21 can monitor the temperature and liquid level of the water tank 33 in real time based on the received temperature and liquid level signals. If the host computer 21 detects an abnormal temperature and / or liquid level in the water tank 33, it can control both the cooling device and the load power configuration device to stop working and issue corresponding prompt information to prevent damage to the components in the cooling device and / or load power configuration.

[0038] Optionally, the external input signals include the target power and the number of transistors. The host computer 21 is also used to control the number of paths that are connected between the control board 23 and the coil of the relay KA, based on the target power and the number of transistors.

[0039] For example, Figure 2 The three heating wires 12 in each group of heating elements 11 have different power ratings, such as 700W, 1200W, and 1500W respectively. Therefore, the maximum configurable load power is the sum of the power of all heating wires 12, which is 13.6KW. If the target power received by the host computer 21 is 2200W and the number of transistors is 1, then the coil of the relay KA corresponding to the 700W and 1500W heating wires 12 in a certain group of heating elements 11 can be controlled to connect with the control board 23 and its corresponding circuit. The normally open contact of the relay KA closes, and at this time, the circuit where the 700W and 1500W heating wires 12 and their corresponding normally open contacts of the relay KA are connected, resulting in a load power of 2200W. At this time, two circuits are connected between the control board 23 and the coil of the relay KA.

[0040] Optionally, the host computer 21 includes a serial port, through which the host computer 21 communicates with the slave computer 22 and the control board 23.

[0041] The communication between the host computer 21, the slave computer 22, and the control board 23 is serial communication. The host computer 21 only needs a few data lines to exchange information with the other slave computers 22 and the control board 23.

[0042] Optionally, the power of each heating wire 12 in each group of heating elements 11 is different, while the total power of each group of heating elements 11 is the same.

[0043] In each group of heating elements 11, the power of each heating wire 12 is different, which facilitates configuration to meet different load power requirements. The total power of each group of heating elements 11 is the same, which facilitates control of each group of heating elements 11 when configuring the load power of the cooling system. The power of each heating wire 12 mentioned above is only for illustrative purposes. The number and power of the heating wires 12 can be set according to the actual situation and are not limited here.

[0044] Optionally, the cooling device also includes a flow switch 34 and a flow meter 35, as well as a powerful fan 36. The flow switch 34 and the flow meter 35 are both located in the passageway between the cooler 31 and the water tank 33.

[0045] For details, please refer to Figure 3The water tank 33 stores coolant. Flow switch 34 and flow meter 35 are both located in the passage between the cooler 31 and the water tank 33. Both flow switch 34 and flow meter 35 can be electrically connected to the host computer 21. Flow meter 35 can collect the flow rate in its passage and transmit the collected flow rate to the host computer 21. When the cooler 31 is working, it dissipates the heat generated by the water tank 33 and the heating element 11, and then uses a powerful fan 36 to bring cool air into the cooling system and carry away the hot air from the cooling system. This continuous circulation lowers the temperature inside the water tank 33. The host computer 21 can detect the water flow in the passage based on the opening of flow switch 34. Flow switch 34 also functions as a flow sensor, generating a switch signal based on the water flow and transmitting it to the host computer 21. The host computer 21 can control and protect the cooling device based on the received switch signal.

[0046] Optionally, each heating element 11 is provided with a housing 13, the heating element 11 is located inside the housing 13, and the housing 13 is disposed in the passage between the cooler 31 and the water tank 33.

[0047] For details, please refer to Figure 3 Taking four sets of heating elements 11 as an example, the outer shell 13 of two sets of heating elements 11 is set in the same passage of the cooler 31 and the water tank 33, and the outer shell 13 of the other two sets of heating elements 11 is set in another passage of the cooler 31 and the water tank 33, so as to reduce the working pressure of the cooler 31 and the water pump 32.

[0048] The cooling system based on automatic load power configuration provided in this embodiment controls the connection and disconnection of the control board and the relay coil path via a host computer. When the host computer controls the control board and the relay coil path to conduct according to the received external input signal, the normally open contact of the relay closes, and the path of the heating wire electrically connected to the normally open contact of the relay is connected. The power of the heating wire is the load power, thereby realizing automatic load power configuration. The host computer also controls the working state of the cooling device. The cooling device includes a path for cooling the heating element and a path for cooling the water tank. The host computer can control the cooler and water pump in the path for cooling the heating element to work. When the temperature is high, it can also control the cooler and water pump in the path for cooling the water tank to work to improve the cooling effect.

[0049] Meanwhile, the system automatically configures the appropriate load power for testing PTC products, facilitating accurate PTC testing and eliminating the need for testers to manually install loads and connect high-voltage lines in high-voltage environments. This ensures the absolute safety of the testing system and allows for timely dissipation of heat generated by the PTC during testing, maintaining a testing environment that meets customer requirements.

[0050] The specific functions of the cooling system based on automatic load power configuration provided in this embodiment are as follows:

[0051] ① Universality: Since the voltage and power values ​​are different in different PTC products, and the number of transistors such as IGBTs is also different, in order to unify and take into account all products, the voltage and power of the products are maximized in terms of numerical value, and the number of IGBTs is maximized in terms of quantity. This can meet the testing requirements of all current PTC products, and is also applicable to the testing of air-cooled and water-cooled PTC products.

[0052] ② Heat Dissipation: PTC product testing generates a significant amount of heat. For normal testing to proceed, this heat must be dissipated promptly to ensure the testing environment temperature meets requirements. The cooling system provided in this embodiment effectively controls the temperature within the required testing range.

[0053] ③ Automatic load power configuration: Existing cooling systems require load replacement when cooling test products, and the exposed load poses a safety threat to the surrounding environment due to high voltage. The cooling system based on automatic load power configuration provided in this embodiment can automatically configure the load power, with a maximum power of 10KW. This avoids manual load replacement and ensures that operators can operate the equipment conveniently, safely, and reliably.

[0054] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A cooling system based on automatic load power configuration, characterized in that, include: A load power configuration device, a control device, and a cooling device; wherein the load power configuration device and the cooling device are both electrically connected to the control device; The load power configuration device includes multiple sets of heating elements, each set of heating elements includes multiple heating wires, the load power configuration device also includes multiple relays corresponding to each heating wire, and transistors corresponding to each set of heating elements, the heating wires being electrically connected to the transistors through the normally open contacts of the corresponding relays; The cooling device includes a cooler, a water pump, and a water tank. The water pump connects the cooler and the water tank. The cooling device is used to cool the heating element. The connection includes a cooling path for the heating element and a cooling path for the water tank. The control device includes a host computer, a slave computer, and a control board. The slave computer is electrically connected to the transistor, and both the slave computer and the control board are communicatively connected to the host computer. The control board is electrically connected to the coil of the relay. The host computer is used to control the connection and disconnection of the path between the control board and the coil of the relay according to the received external input signal, and to control the working state of the cooling device. The power of each heating wire in each group of heating elements is different, but the total power of each group of heating elements is the same.

2. The cooling system according to claim 1, characterized in that, The load power configuration device also includes a contactor corresponding to each of the heating elements. The contactor is electrically connected to the normally open contact of the relay through the heating wire. The contactor is used to connect the power supply when closed, so that the power supply supplies power to the heating element corresponding to the contactor.

3. The cooling system according to claim 1, characterized in that, The transistor is an insulated gate bipolar transistor. The gate of the transistor is electrically connected to the lower-level electromechanical device. The first terminal of the transistor is electrically connected to the heating wire through the normally open contact of the relay. The second terminal of the transistor is electrically connected to the negative terminal of the power supply.

4. The cooling system according to claim 1, characterized in that, The control device further includes a temperature sensor, a temperature controller, a liquid level sensor, and a liquid level controller. The temperature sensor is electrically connected to the temperature controller, and the liquid level sensor is electrically connected to the liquid level controller. Both the temperature controller and the liquid level controller are communicatively connected to the host computer. The temperature sensor is used to collect the temperature of the water tank, and the liquid level sensor is used to collect the liquid level of the water tank.

5. The cooling system according to claim 4, characterized in that, The host computer is also used to receive the temperature signal transmitted by the temperature controller and the liquid level signal transmitted by the liquid level controller, and when the temperature signal and / or the liquid level signal are detected to be abnormal, control each device to stop working and issue corresponding prompt information.

6. The cooling system according to claim 1, characterized in that, The external input signal includes the target power and the number of transistors. The host computer is also used to control the number of paths connected between the control board and the coil of the relay according to the target power and the number of transistors.

7. The cooling system according to claim 1, characterized in that, The host computer includes a serial port, through which it communicates with the slave computer and the control board.

8. The cooling system according to claim 1, characterized in that, The cooling device also includes a flow switch and a flow meter, both of which are located in the passage between the cooler and the water tank.

9. The cooling system according to claim 1, characterized in that, Each of the heating elements is provided with a housing, the heating element is located inside the housing, and the housing is disposed in the passage between the cooler and the water tank.

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